ORGANIC OPTOELECTRONIC COMPONENT

Abstract

Organic optoelectronic device (10), comprising a first electrode (20), an organic functional layer structure (22) on the first electrode (20); a second electrode (23) on the organic functional layer structure (22); an encapsulation layer (24) on the second electrode (23), wherein the encapsulation layer (24) encapsulates the first electrode (20), the organic functional layer structure (22) and the second electrode (23); an adhesive layer (44) on the encapsulation layer (24);and a cover body (38) on the side of the adhesive layer (44) facing away from the encapsulation layer (24), wherein the adhesive layer (44) has a radically crosslinking adhesive and provides a metallurgical bond between the encapsulation layer (24) and the cover body (38), and wherein the encapsulation layer (24) has recesses in which a first and a second contact area (32, 34) are exposed, whereby at least the second contact area (34) is free from the encapsulation layer (24).

Description

The invention relates to an organic optoelectronic component. Publication US 2012 / 0256534A1 describes an organic light-emitting diode display. Publication JP 2006-286412A describes a manufacturing process for a light-emitting plate. Publication US 2013 / 0249877A1 describes a flat-panel display device. Publication US 2014 / 0127480A1 describes a method for manufacturing a bonded body. Publication US 2007 / 0291215A1 describes a display device. Publication US 2011 / 0163339A1 describes a light-emitting element. An optoelectronic component can be either an electromagnetic radiation emitter or an electromagnetic radiation absorber. An example of an electromagnetic radiation absorber is a solar cell. Organic optoelectronic components, also known as organic optoelectronic components, are finding increasingly widespread application. For example, organic light-emitting diodes (OLEDs) are increasingly being used in general lighting, such as for area lighting. An organic optoelectronic device, such as an OLED, can have an anode and a cathode with an organic functional layer system between them. This organic functional layer system can include one or more emitter layers in which electromagnetic radiation is generated; a charge-generating layer (CGL) structure consisting of two or more CGLs for charge-generating technology; one or more hole-blocking layers (HTLs); and one or more electron-blocking layers (ETLs) to direct current flow. In the production of organic optoelectronic devices, these are manufactured on a common substrate and then singulated. As one of the final steps before singulation, a common back cover, in particular an aluminum back cover, which extends over several organic optoelectronic devices on the common substrate, is bonded to the previously formed layers of the organic optoelectronic devices. The back cover is then laser-cut so that a first section of the back cover is formed directly over each organic optoelectronic device, with second sections of the back cover, which are separated from the first sections during cutting, being formed between and / or laterally adjacent to the first sections.The second sections are then removed, leaving only the first sections, each covering one of the organic optoelectronic components. In some cases, the adhesive used to attach the back cover must then be removed from the contact and edge areas of the individual organic optoelectronic components. For example, an aluminum foil can be fully bonded to the backsheet using a foil-like PSA (Pressure Sensitive Adhesive). The stack of aluminum foil and PSA can then be laser-cut, and subsequently, both the aluminum foil and the PSA can be removed from the secondary sections and from the contact and edge areas. Removing the aluminum foil / PSA laminate is a manual process and therefore time-consuming and expensive. For example, this process can take up to 40 minutes per substrate with multiple organic optoelectronic devices. Furthermore, this manual process carries the risk of causing defects in the organic optoelectronic devices and thus represents a significant yield risk. In addition to the back cover, a hardcoat is regularly formed on the back of the organic optoelectronic components, which is applied over the entire back surface of the organic optoelectronic components and subsequently has to be restructured and / or removed in a complex process, especially from the electrical contact surfaces of the organic optoelectronic components. One object of the invention is to provide an organic optoelectronic component that is easy, inexpensive and / or quick to manufacture. The problem is solved by an organic optoelectronic device having the features of independent claim 1. Preferred embodiments are the subject of dependent claims. In a method for manufacturing an organic optoelectronic device, the following steps are taken: a first electrode is formed; an organic functional layer structure is formed on the first electrode; a second electrode is formed on the organic functional layer structure; an encapsulation layer is formed on the second electrode such that it encapsulates the first electrode, the organic functional layer structure, and the second electrode; an adhesive layer is applied to the encapsulation layer in a partial region; a cover body is arranged on the adhesive layer, wherein a first section of the cover body is arranged over the partial region and a second section of the cover body projects beyond the partial region of the encapsulation layer; the adhesive layer is cured and / or dried.and the second section of the cover body is removed, leaving the first section of the cover body on the portion of the adhesive layer. Since the adhesive layer is only applied to the area beneath the first section, the cover in the second section can be easily removed, and no adhesive layer needs to be removed outside this area. This contributes to the rapid, simple, and / or cost-effective manufacturing of the organic optoelectronic device. Because the adhesive in the second section does not need to be removed, an adhesive with very high hardness when dried and / or cured can be used. This eliminates the need for personal protective equipment (PPE) and allows the adhesive to act as protection against external mechanical forces. In particular, the adhesive layer in this area can be used as a so-called hardcoat. This can further contribute to the rapid, simple, and / or cost-effective manufacturing of the organic optoelectronic device.Furthermore, the removal of adhesive outside the affected area can be avoided, particularly by means of a manual process. This contributes to a faster, simpler, and / or more cost-effective procedure and / or prevents any potential damage to the organic optoelectronic device. The adhesive can be applied in a structured way in this section, for example using inkjet printing. After the cover is positioned and the adhesive has dried or hardened, the cover can be easily lifted off in the second sections, below which no adhesive has been printed and which do not adhere to the underlying layers of the organic optoelectronic device. According to a further training procedure, after the cover body is positioned on the adhesive layer and before the second section is removed, the first section is separated from the second section. This helps to ensure a clean separation line between the first and second sections and prevents damage to the first section of the cover body when the second section is lifted off. According to a training course, the first section is separated from the second section using laser cutting. This allows for the simple separation of the first section from the second section. According to a further development process, several organic optoelectronic devices are formed on a common substrate, i.e., on the plate plane, and the cover body extends over several of the organic optoelectronic devices before the corresponding second sections of the cover body are removed. After the second sections of the cover body are removed, the organic optoelectronic devices can be separated. According to a further development, the adhesive layer has a radically crosslinking adhesive which, after application to the partial area, is dried and / or cured on one side of the adhesive layer facing the encapsulation layer and forms a metallurgical bond with the encapsulation layer in that partial area. Due to the oxygen, the adhesive initially remains sticky on the side of the adhesive layer facing away from the encapsulation layer. Only after the covering body is applied to the adhesive layer and the oxygen is thereby displaced from the adhesive layer, is the adhesive dried and / or cured on the side of the adhesive layer facing the covering body, thus forming a metallurgical bond with the covering body. An acrylate-based adhesive, for example, can be used as a radical crosslinking adhesive. After application to the component area and before the placement of the cover, this adhesive undergoes a first crosslinking step under normal atmospheric conditions, i.e., in normal air. This first step involves drying and / or curing, in particular crosslinking, for example, by UV or thermal activation. The radical crosslinking reaction is oxygen-inhibited, so the half, side, and / or surface of the adhesive layer facing the air and away from the other layers of the organic optoelectronic device remains tacky, while only the half, side, or surface of the adhesive layer facing the layers of the organic optoelectronic device dries or cures. Subsequently, the cover, in particular the aluminum foil, is placed over the entire surface of the adhesive layer and / or laminated on top, for example, by vacuum lamination.The second crosslinking step follows, for example by means of UV or thermal activation, which takes place in the area under exclusion of oxygen due to the now-adhered cover material, in particular the laminated aluminum foil. This results in the complete crosslinking of the adhesive and the permanent adhesion of the cover material in the area. In a chemically bonded connection, a first body is fundamentally joined to a second body by means of atomic and / or molecular forces. A chemically bonded connection is a connection that cannot be dissolved, and in particular, cannot be dissolved without destruction. A method for manufacturing an optoelectronic device, wherein: the first electrode is formed; the organic functional layer structure is formed on the first electrode; the second electrode is formed on the organic functional layer structure; the encapsulation layer is formed on the second electrode such that it encapsulates the first electrode, the organic functional layer structure, and the second electrode; the adhesive layer is applied to the encapsulation layer in the subregion of the encapsulation layer, the adhesive layer comprising the radically crosslinking adhesive;The adhesive layer is dried and / or cured on the side of the adhesive layer facing the encapsulation layer after application to the partial area, thereby creating a materially bond to the encapsulation layer in the partial area, whereby, due to the oxygen on the side of the adhesive layer facing away from the encapsulation layer, the side of the adhesive layer facing away from the encapsulation layer initially remains sticky;and the cover body is arranged on the side of the adhesive layer facing away from the encapsulation layer, wherein the cover body is designed and arranged in such a way that it is arranged exclusively over the partial area, and wherein the adhesive is dried and / or cured on the side of the adhesive layer facing the cover body only after the cover body has been applied to the adhesive layer and the oxygen has been displaced from the adhesive layer, thus creating a metallurgical bond with the cover body. According to further training, the cover body is a metal foil. This can easily contribute to ensuring that the organic optoelectronic device remains flexible despite the cover body, especially a flexible OLED. According to further research, the adhesive contains or is composed of acrylate. This allows the adhesive to be used as part of the coating, particularly as a hardcoat, of the organic optoelectronic device. According to a further training method, the adhesive is applied to the encapsulation layer using a printing process, particularly in the targeted area. This allows the adhesive to be applied to the encapsulation layer in a structured manner, meaning that it is not located in unwanted areas, i.e., outside the targeted area, and therefore does not need to be subsequently removed from these areas. According to further training, the adhesive layer is dried and / or cured on the side facing the encapsulation layer and / or on the side facing the cover body by means of ultraviolet radiation and / or heat. According to further training, the optoelectronic component is an organic light-emitting diode. One object of the invention is solved by an organic optoelectronic device comprising: a first electrode, an organic functional layer structure on the first electrode; a second electrode on the organic functional layer structure; an encapsulation layer on the second electrode, wherein the encapsulation layer encapsulates the first electrode, the organic functional layer structure and the second electrode; an adhesive layer on the encapsulation layer; and a cover body on the side of the adhesive layer facing away from the encapsulation layer, wherein the adhesive layer comprises a radically crosslinking adhesive and provides a metallurgical bond between the encapsulation layer and the cover body. The advantages and / or further developments of the processes for manufacturing the organic optoelectronic component explained above can readily be transferred to the organic optoelectronic component itself. According to further training, the cover body is a metal foil. According to further training, the adhesive contains acrylate or is composed of it. According to further training, the organic optoelectronic component is designed as an organic light-emitting diode. Exemplary embodiments of the invention are shown in the figures and are explained in more detail below. Figure 1 shows a side sectional view of an embodiment of an organic optoelectronic device; Figure 2 shows a top view of several organic optoelectronic devices in a first state during a conventional method for fabricating an organic optoelectronic device; Figure 3 shows a top view of several organic optoelectronic devices in a second state during the conventional method for fabricating an organic optoelectronic device; Figure 4 shows a top view of several organic optoelectronic devices in a third state during the conventional method for fabricating an organic optoelectronic device; Figure 5 shows a top view of several organic optoelectronic devices in a fourth state during the conventional method for fabricating an organic optoelectronic device; Figure 6 shows the following:6 a top view of several organic optoelectronic devices in a fifth state during the conventional method for fabricating an organic optoelectronic device; Fig. 7 a top view of several organic optoelectronic devices in a first state during an embodiment of a method for fabricating an organic optoelectronic device; Fig. 8 a top view of several organic optoelectronic devices in a second state during the embodiment of the method for fabricating an organic optoelectronic device; Fig. 9 a top view of several organic optoelectronic devices in a third state during the embodiment of the method for fabricating an organic optoelectronic device; Fig.10 a top view of several organic optoelectronic devices in a fourth state during an embodiment of a method for manufacturing an organic optoelectronic device. The following detailed description refers to the accompanying drawings, which form part of this description and in which specific embodiments are shown for illustration purposes, illustrating how the invention can be implemented. Since components of embodiments can be positioned in a number of different orientations, the directional terminology serves only for illustration and is in no way restrictive. It is understood that other embodiments may be used and structural or logical modifications may be made. It is understood that the features of the various embodiments described herein may be combined with one another, unless specifically stated otherwise. The invention is defined by the attached claims. In the figures, identical or similar elements are provided with identical reference numerals where appropriate. An organic optoelectronic device can be an organic electromagnetic radiation emitter or an organic electromagnetic radiation absorber. An organic electromagnetic radiation absorber can be, for example, an organic solar cell or an organic photodetector. An organic electromagnetic radiation emitter can, in various embodiments, be an organic electromagnetic radiation emitting semiconductor device and / or be configured as an organic electromagnetic radiation emitting diode or an organic electromagnetic radiation emitting transistor. The radiation can be, for example, visible light, ultraviolet light, and / or infrared light.In this context, the organic electromagnetic radiation-emitting device can be designed, for example, as an organic light-emitting diode (OLED) or as an organic light-emitting transistor. The organic light-emitting device can be part of an integrated circuit in various embodiments. Furthermore, multiple organic light-emitting devices can be provided, for example, housed in a common package. Fig. 1 shows a side sectional view of an embodiment of an organic optoelectronic device 10. The organic optoelectronic device 10 has a support 12. The support 12 can be translucent or transparent. The support 12 serves as a substrate for electronic elements or layers, for example, light-emitting elements. The support 12 can, for example, be made of or comprise a plastic, metal, glass, quartz, and / or a semiconductor material. Furthermore, the support 12 can be made of or comprise a plastic film or a laminate with one or more plastic films. The support 12 can be mechanically rigid or mechanically flexible. An optoelectronic layer structure is formed on the support 12. The optoelectronic layer structure has a first electrode layer 14, which includes a first contact section 16, a second contact section 18, and a first electrode 20. The support 12 with the first electrode layer 14 can also be referred to as the substrate. A first barrier layer (not shown), for example, a first barrier thin film, can be formed between the support 12 and the first electrode layer 14. The first electrode 20 is electrically isolated from the first contact section 16 by means of an electrical insulation barrier 21. The second contact section 18 is electrically coupled to the first electrode 20 of the optoelectronic layer structure. The first electrode 20 can be configured as an anode or as a cathode. The first electrode 20 can be translucent or transparent. The first electrode 20 comprises an electrically conductive material, for example, a metal and / or a transparent conductive oxide (TCO), or a stack of multiple layers comprising metals or TCOs. The first electrode 20 can, for example, comprise a stack of layers combining a layer of a metal on a layer of a TCO, or vice versa. An example is a silver layer deposited on an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO multilayers.The first electrode 20 can alternatively or additionally comprise: networks of metallic nanowires and particles, for example made of Ag, networks of carbon nanotubes, graphene particles and layers and / or networks of semiconducting nanowires. Above the first electrode 20, an optically functional layer structure, for example an organic functional layer structure 22, of the optoelectronic layer structure is formed. The organic functional layer structure 22 can, for example, have one, two, or more sublayers. For example, the organic functional layer structure 22 can have a hole injection layer, a hole transport layer, an emitter layer, an electron transport layer, and / or an electron injection layer. The hole injection layer serves to reduce the band gap between the first electrode and the hole transport layer. In the hole transport layer, the hole conductivity is greater than the electron conductivity. The hole transport layer serves to transport the holes. In the electron transport layer, the electron conductivity is greater than the hole conductivity. The electron transport layer serves to transport the electrons.The electron injection layer serves to reduce the band gap between the second electrode and the electron transport layer. Furthermore, the organic functional layer structure 22 can comprise one, two, or more functional layer structure units, each of which includes the aforementioned sublayers and / or further intermediate layers. A second electrode 23 of the optoelectronic layer structure is formed above the organic functional layer structure 22 and is electrically coupled to the first contact section 16. The second electrode 23 can be configured according to one of the embodiments of the first electrode 20, whereby the first electrode 20 and the second electrode 23 can be identical or different. The first electrode 20 serves, for example, as the anode or cathode of the optoelectronic layer structure. Correspondingly to the first electrode, the second electrode 23 serves as the cathode or anode of the optoelectronic layer structure. The optoelectronic layer structure has an electrically active region and an optically active region 40, which overlap. The electrically active region is the area of ​​the organic optoelectronic device 10 in which electric current flows to operate the organic optoelectronic device 10. The optically active region 40 is the area of ​​the organic optoelectronic device 10 in which electromagnetic radiation is generated or absorbed. The optically active region 40 corresponds to a laterally extending overlap region in which the first electrode 20, the organic functional layer structure 22, and the second electrode 23 overlap. A getter structure (not shown) can be arranged on or above the active region. The getter layer can be translucent, transparent, or opaque.The getter layer may contain or be composed of a material that absorbs and binds substances that are harmful to the active area. An encapsulation layer 24 of the optoelectronic layer structure is formed over the second electrode 23 and partially over the first contact section 16 and partially over the second contact section 18. This encapsulation layer 24 encapsulates the optoelectronic layer structure. The encapsulation layer 24 can be configured as a second barrier layer, for example, as a second barrier thin film. The encapsulation layer 24 can also be referred to as thin-film encapsulation. The encapsulation layer 24 forms a barrier against chemical impurities and atmospheric substances, particularly water (moisture) and oxygen. The encapsulation layer 24 can be configured as a single layer, a stack of layers, or a layered structure.The encapsulation layer 24 can comprise or be formed from: aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, tantalum oxide, lanthanum oxide, silicon oxide, silicon nitride, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum-doped zinc oxide, poly(p-phenylene terephthalamide), nylon 66, as well as mixtures and alloys thereof. The first barrier layer on the support 12 is configured corresponding to a specific embodiment of the encapsulation layer 24. In the encapsulation layer 24, a first recess is formed above the first contact section 16, and a second recess is formed above the second contact section 18. A first contact area 32 is exposed in the first recess, and a second contact area 34 is exposed in the second recess. The first contact area 32 serves to electrically contact the first contact section 16, and the second contact area 34 serves to electrically contact the second contact section 18. An adhesive layer 36 is formed above the encapsulation layer 24. The adhesive layer 36 comprises, for example, an adhesive, such as a laminating adhesive, a lacquer, and / or a resin. The adhesive layer 36 may, for example, contain particles that scatter electromagnetic radiation, such as light-scattering particles. A cover body 38 is formed above the adhesive layer 36. The adhesive layer 36 serves to attach the cover body 38 to the encapsulation layer 24. The cover body 38 comprises, for example, plastic, glass, and / or metal. For example, the cover body 38 can be made primarily of glass and have a thin metal layer, such as a metal foil, and / or a graphite layer, such as a graphite laminate, on the glass body. The cover body 38 serves to protect the organic optoelectronic device 10, for example, from external mechanical forces. Furthermore, the cover body 38 can serve to distribute and / or dissipate heat generated in the organic optoelectronic device 10.For example, the glass of the cover body 38 can serve as protection against external influences and the metal layer of the cover body 38 can serve to distribute and / or dissipate the heat generated during the operation of the organic optoelectronic component 10. The cover body 38 and the adhesive layer 36 of the completed organic optoelectronic device 10 extend over a portion of the encapsulation layer 24. The portion of the encapsulation layer 24 that is covered by the cover body 38 and the adhesive layer 36 after completion of the organic optoelectronic device 10 is therefore referred to in this application as a portion of the encapsulation layer 24. This portion of the encapsulation layer 24 extends over the optically active region 40 and over a lateral boundary region that surrounds the optically active region 40 laterally, with the portion of the encapsulation layer 24 even forming part of the lateral boundary region of the active region 40.The elements and sections of the organic optoelectronic device 10, which lie in a lateral direction outside the cover body 38 and the adhesive layer 36 and thus outside the sub-area of ​​the encapsulation layer 24, for example the contact sections of the 32, 34, do not belong in this sense to the lateral boundary region of the active area 40. Fig. 2 shows a top view of several organic optoelectronic devices 10 in a first state during a conventional method for fabricating one of the organic optoelectronic devices 10. After their completion, the organic optoelectronic devices 10 can each, for example, substantially correspond to the organic optoelectronic device 10 shown in Fig. 1. In the first state shown in Fig. 2, the support 12 extends integrally over the conventional organic optoelectronic devices 10. The first electrode layer 14, in particular the first electrode 20, the organic functional layer structure 22, the second electrode 23, and the encapsulation layer 24 are already formed above the support 12. The encapsulation layer 24 is shown transparently in Fig. 2, which is why the optically active regions 40 of the organic optoelectronic devices 10 are visible. In reality, the encapsulation layer 24 can be transparent or opaque. There are essentially no layers formed on the substrate 12 between the optically active areas 40. This means, for example, that apart from the lateral edges of the individual organic optoelectronic components 10, in particular the lateral edge regions of the optically active areas 40, no further layer structures are formed between the optically active areas 40. In other words, the support 12 between the optically active areas 40 is essentially exposed. In contrast, the first electrode layer 14, for example, can be formed on the support 12 between the optically active areas 40. In the conventional method for manufacturing the organic optoelectronic components 10, an adhesive layer is applied over the entire surface of the substrate 12 and the optically active areas 40 in the first state. The adhesive used for the adhesive layer can, for example, be a PSA adhesive. Fig. 3 shows a top view of the multiple organic optoelectronic devices 10 in a second state during the conventional method for fabricating the organic optoelectronic devices 10. In the second state, the cover body 38 is arranged directly on the adhesive layer over the support 12 and the optically active areas 40. The cover body 38 extends integrally over the multiple organic optoelectronic devices 10. The cover body 38 can, for example, be formed from an aluminum foil. Fig. 4 shows a top view of the multiple organic optoelectronic devices 10 in a third state during the conventional method for fabricating the organic optoelectronic devices 10. In the third state, cut lines 42 are formed along the lateral outer edges of the sub-regions of the encapsulation layer 24, physically separating first sections of the cover body 38, which lie over the sub-regions, from second sections of the cover body 38, which lie outside the sub-regions. The cut lines 42 can be formed, for example, by laser cutting, in particular by means of a laser beam. Fig. 5 shows a top view of the multiple organic optoelectronic devices 10 in a fourth state during the conventional method for manufacturing the organic optoelectronic devices 10. In the fourth state, the second section(s) of the cover body 38 are removed, for example by hand, in other words by means of a hand 44. Since the second sections of the cover body 38 adhere to the encapsulation layer 24 due to the adhesive layer, removing the second sections of the cover body 38 is a very complex and costly process in the conventional method for manufacturing the organic optoelectronic devices 10. Fig. 6 shows a top view of the organic optoelectronic devices 10 in a fifth state during the conventional method for manufacturing the organic optoelectronic devices 10. In the fifth state, the second sections of the cover body 38 have been completely removed, so that essentially only the active areas 40 and the lateral edge regions of the active areas 40 of the individual organic optoelectronic devices 10, i.e., the corresponding sub-regions of the encapsulation layer 24, are covered by the first sections of the cover body 38. Subsequently, the organic optoelectronic devices 10 can be separated. In particular, the carrier 12 can be cut and / or sawn accordingly. Fig. 7 shows a top view of several organic optoelectronic devices 10 in a first state during an embodiment of a method for fabricating an organic optoelectronic device 10. Upon completion, the organic optoelectronic devices 10 can largely correspond to the organic optoelectronic device 10 shown in Fig. 1. The first state of the embodiment of the method for fabricating the organic optoelectronic devices 10 shown in Fig. 7 is preceded by the first state of the conventional method for fabricating the organic optoelectronic devices 10 shown in Fig. 2. In particular, in the first state shown in Fig. 7, the one-piece carrier 12, which extends over several of the organic optoelectronic devices 10, is provided.The organic optoelectronic devices 10 each comprise the first electrode layer 14, in particular the first electrode 20, the organic functional layer structure 22, and the second electrode 23. Furthermore, the encapsulation layer 24 is configured such that it covers at least the electrically active regions and completely the optically active regions 40 of the organic optoelectronic devices 10. The encapsulation layer 24 is configured, in particular, such that it extends over the entire support 12 and the organic optoelectronic devices 10. Alternatively, the encapsulation layer 24 can be configured such that it extends only over the optically active regions 40, or that at least the contact regions 32, 34 remain free of the encapsulation layer 24. The encapsulation layer 24 can be transparent or opaque. An adhesive layer 44 is applied to each of the organic optoelectronic devices 10 such that it covers the corresponding sub-areas of the encapsulation layer 24, i.e., at least the optically active areas 40 and the lateral edge regions around the active areas 40. The areas above the support 12, which are located laterally between and beside the organic optoelectronic devices 10, and the areas of the encapsulation layer 24 outside the individual sub-areas of the encapsulation layer 24 remain free of adhesive layers 44. The adhesive layers 44 can be applied, for example, by a printing process, in particular by inkjet printing. Optionally, a radically crosslinking adhesive can be used. For example, an acrylate-based adhesive can be used. After the corresponding adhesive layers 44 are applied to the sub-areas, this adhesive is dried and / or cured in a first crosslinking step under normal atmosphere, i.e., in normal air, in particular crosslinked, for example by UV activation or thermal activation. The radical crosslinking reaction is oxygen-inhibited, so that the halves, sides, and / or surfaces of the adhesive layers 44 facing the air and away from the other layers of the organic optoelectronic components 10 remain sticky, and only the halves, sides, or surfaces of the adhesive layers 44 facing the layers of the organic optoelectronic components 10 dry or cure. Fig. 8 shows a top view of the organic optoelectronic components 10 in a second state during the embodiment of the method for manufacturing the organic optoelectronic components 10. In the second state, the cover body 38 is arranged over the carrier 12 such that it extends over all organic optoelectronic components 10 and is in direct physical contact with the adhesive layers 44. The cover body 38, for example, an aluminum foil, was applied over the entire surface of the adhesive layers 44 and / or laminated on, for example, by vacuum lamination. This is followed by a second crosslinking step, for example, by UV activation or thermal activation, which takes place in the partial areas of the encapsulation layer 24 under exclusion of oxygen due to the now-adhered cover body 38, in particular the laminated aluminum foil.This results in complete cross-linking of the adhesive and permanent adhesion of the cover body 38 to and within the partial areas of the encapsulation layer 24. Outside of these partial areas, the cover body 38 does not adhere to the encapsulation layer 24, as there is no adhesive present there. Fig. 9 shows a top view of the organic optoelectronic components 10 in a third state during the embodiment of the method for manufacturing the organic optoelectronic components 10. In the third state, cut lines 42 are formed along the lateral outer edges of the sub-regions of the encapsulation layer 24, physically separating first sections of the cover body 38, which lie over the sub-regions, from second sections of the cover body 38, which lie outside the sub-regions. The cut lines 42 can be formed, for example, by laser cutting, in particular by means of a laser beam. Fig. 10 shows a top view of the multiple organic optoelectronic components 10 in a fourth state during the exemplary embodiment of the method for manufacturing the organic optoelectronic components 10. In the fourth state, the second section(s) of the cover body 38 have been removed. Since the second sections of the cover body 38 do not adhere to the encapsulation layer 24, removing the second sections of the cover body 38 is very simple, quick, and precise in the exemplary embodiment of the method for manufacturing the organic optoelectronic components 10. Subsequently, the organic optoelectronic components 10 can be separated, for example, by cutting and / or sawing the carrier 12. As an alternative to the second step shown in Fig. 8 and the third step shown in Fig. 9, in which the cover body 38 is arranged over the carrier 12 extending over several of the organic optoelectronic components 10 and is subsequently cut to size, the individual cover bodies 38 can each be glued onto the adhesive layers 44 on the corresponding sub-areas of the encapsulation layer 24 in a pre-cut state, particularly if the radically damaging adhesive is used as the adhesive. REFERENCE MARK LIST 10 optoelectronic component 12 substrate 14 electrically conductive layer 16 first contact section 18 second contact section 20 first electrode 22 organic functional layer structure 23 second electrode 24 encapsulation layer 32 first contact area 34 second contact area 36 adhesive layer 38 cover body 40 optically active area 42 cut lines 44 adhesive layer

Claims

Organic optoelectronic device (10), comprising a first electrode (20), an organic functional layer structure (22) on the first electrode (20); a second electrode (23) on the organic functional layer structure (22); an encapsulation layer (24) on the second electrode (23), wherein the encapsulation layer (24) encapsulates the first electrode (20), the organic functional layer structure (22) and the second electrode (23); an adhesive layer (44) on the encapsulation layer (24);and a cover body (38) on the side of the adhesive layer (44) facing away from the encapsulation layer (24), wherein the adhesive layer (44) has a radically crosslinking adhesive and provides a metallurgical bond between the encapsulation layer (24) and the cover body (38), and wherein the encapsulation layer (24) has recesses in which a first and a second contact area (32, 34) are exposed, whereby at least the second contact area (34) is free from the encapsulation layer (24). Organic optoelectronic device (10) according to claim 1, wherein the cover body (38) is a metal foil. Organic optoelectronic device (10) according to one of claims 1 or 2, wherein the adhesive comprises or is formed from acrylate. Organic optoelectronic device (10) according to one of claims 1 to 3, wherein the organic optoelectronic device (10) is designed as an organic light-emitting diode. Organic optoelectronic device (10) according to one of claims 1 to 4, wherein the first and second contact areas (32, 34) are free from the encapsulation layer (24). Organic optoelectronic device (10) according to one of claims 1 to 5, wherein the first and second contact areas (32, 34) are free from the cover body (38). Organic optoelectronic device (10) according to one of claims 1 to 5, wherein the first electrode (20) is arranged above a first barrier layer and the first barrier layer is designed corresponding to an embodiment of the encapsulation layer (24).

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