Display panel with organic light-emitting diodes and display device with organic light-emitting diodes provided therewith

Abstract

Organic light-emitting diode display panel comprising: a plurality of data lines (DL; 422, 424, 426, 428) arranged in a first direction; a plurality of gate lines (GL) arranged in a second direction to cross the data lines (DL), a plurality of pixel regions defined by the crossed data lines (DL; 422, 424, 426, 428) and gate lines (GL); at least one drive voltage line (DVL; 432, 434) arranged in the first direction; at least one reference voltage line (RVL; 440) arranged in the first direction; a plurality of data contact points (452, 454, 456, 458) each arranged at ends of corresponding data lines; a drive voltage contact point (462, 464) arranged at one end of the drive voltage line (432, 434); and a reference voltage contact point (470) arranged at one end of the reference voltage line (440, RVL); wherein a first distance (W1) is defined between the adjacent edges of the reference voltage pad (470) and an adjacent data pad (456), a second distance (W2) is defined between the adjacent edges of the adjacent data pads (456, 458), and a third distance (W3) is defined between the adjacent edges of the drive voltage pad (464) and an adjacent data pad (458), and wherein at least two of the first distance (W1), the second distance (W2) and the third distance (W3) are different from each other, and where each of the first and third distances (W1, W3) is greater than the second distance (W2).

Description

Background of the inventionField of the invention

[0001] The present invention relates to an organic light-emitting diode display panel and an organic light-emitting diode display device provided therewith. Description of the state of the art

[0002] Organic electroluminescent display devices have recently become the focus of attention. An organic electroluminescent display device uses an organic light-emitting diode (OLED), which emits light itself. Thus, an organic electroluminescent display device has a number of advantages, such as high response speed, high luminous efficiency, high luminance, a wide viewing angle, and the like.

[0003] An organic light-emitting diode display device comprises pixels—each of which contains at least one organic light-emitting diode—arranged in a matrix. The organic light-emitting diode display device controls the brightness of the pixels selected by a scanning signal according to the gradation of data. Each pixel of the organic light-emitting diode display device has a pixel structure in which an organic light-emitting diode, a drive transistor for driving the organic light-emitting diode, a storage capacitor, and the like are connected to various signal lines.

[0004] A prior art pixel structure requires a reference voltage line to initialize a source node (or drain node) of a drive transistor. Thus, the reference voltage line is formed for each pixel in a display panel and is directly connected to each data-driven integrated circuit.

[0005] A data-driven integrated circuit generates a data signal synchronized with a scan signal and supplies the generated data signal to a data line. For this purpose, the data-driven integrated circuit is electrically connected to a data pad portion via an anisotropic conductive film (ACF) medium according to an automatic foil bonding (TAB) scheme. Furthermore, a pad electrode of the data pad portion is connected to a terminal of the data-driven integrated circuit via a conductive ball in the ACF.

[0006] Currently, multiple signal lines connected to the data-driven integrated circuit and pad electrodes connected to the multiple signal lines are arranged at equal intervals. Thus, a line defect (LD) such as a short circuit and the like may be caused if conductive balls accumulate or a small amount of foreign substance enters the device.

[0007] Furthermore, it is impossible to inspect the elements for LDs in a non-compensated state, and it is difficult to detect the LDs, and the LDs become a factor leading to further sunk costs associated with additionally applied materials when manufacturing a complete product.

[0008] EP 2 418 637 A1 discloses a display device, such as a liquid crystal display device or an organic EL display device, containing active elements. The display device comprises an external circuit substrate; a first substrate on which a pixel circuit and a driving circuit for the pixel circuit are monolithically formed; and a second substrate provided so as to oppose the first substrate, wherein the external circuit substrate, the first substrate, and the second substrate are provided in this order so as to overlap each other, the second substrate having a plurality of input terminals on a second substrate surface opposite the first substrate.

[0009] US 2006 / 0 244 741 A1 relates to a semiconductor device having a connection terminal, in particular to a structure of a connection terminal of a display device having a pixel portion in which pixels are arranged in a matrix, and to a connection structure between an external terminal and a connection terminal of a display device. Summary of the invention

[0010] Accordingly, the present invention is directed to an organic light emitting diode display panel and an organic light emitting diode display device having the same that substantially obviates one or more of the problems due to limitations and disadvantages in the related art.

[0011] It is an object of the present invention to provide an organic light emitting diode display panel having a reduced occurrence of line defects.

[0012] Another object of the present invention is to provide an organic light emitting diode display panel in which line defects can be more easily detected during an inspection.

[0013] Another object of the present invention is to provide an organic light emitting diode display panel having improved yield and reduced cost.

[0014] Another object of the present invention is to provide a display device provided with such a display panel.

[0015] Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and the appended claims, as well as the appended drawings.

[0016] The object is achieved by the features of independent claims 1 and 7. Advantageous embodiments are specified in the subclaims.

[0017] To achieve these and other advantages, and in accordance with the purpose of the present invention, as embodied and broadly described, an organic light-emitting diode display panel comprises a plurality of data lines arranged in a first direction; a plurality of gate lines arranged in a second direction to cross the data lines; a plurality of pixel regions defined by the crossed data lines and gate lines; at least one drive voltage line arranged in the first direction; at least one reference voltage line arranged in the first direction; a plurality of data pads each arranged at ends of the corresponding data lines; a drive voltage pad arranged at one end of the drive voltage line; and a reference voltage pad arranged at one end of the reference voltage line.wherein a first distance is defined between the reference voltage pad and an adjacent data pad, a second distance is defined between adjacent data pads, and a third distance is defined between the drive voltage pad and an adjacent data pad, and wherein at least two of the first distance, the second distance, and the third distance are different from each other;

[0018] The first and third distances are larger than the second distance.

[0019] Preferably, the third distance is greater than the first distance, and the first distance is greater than the second distance.

[0020] Further preferably, each of the data pads, the drive voltage pad, and the reference voltage pad is arranged in a non-active region of the display panel adjacent to an edge of the display panel, wherein a fourth distance from the edge of the display panel to the data pads is different than a fifth distance from the edge of the display panel to the drive voltage pad, and wherein the fourth distance from the edge of the display panel to the data pads is different than a sixth distance from the edge of the display panel to the reference voltage pad.

[0021] Preferably, the fifth and sixth distances are substantially equal.

[0022] Preferably, a length of the data pad in the first direction is substantially equal to the length of the reference voltage pad in the first direction.

[0023] Preferably, a length of the drive voltage contact point in the first direction is greater than a length of the data contact point in the first direction.

[0024] Preferably, each of the first and third distances is greater than the second distance.

[0025] Preferably, the third distance is greater than the first distance, and the first distance is greater than the second distance.

[0026] Preferably, at least one conductive ball is present between each terminal and the one of the data pads, the drive voltage pad, and the reference voltage pad to which the terminal is connected.

[0027] Preferably, each of the first, second and third spacings is larger than a diameter of one of the at least one conductive sphere.

[0028] Preferably, the first distance is greater than the second distance by an amount substantially equal to a diameter of the conductive ball.

[0029] Preferably, at least one conductive ball is present between each terminal and the one of the data pads, the drive voltage pad, and the reference voltage pad to which the terminal is connected.

[0030] Preferably, the second and third distances are substantially equal.

[0031] Preferably, a length of the data pad in the first direction is substantially equal to a length of the reference voltage pad in the first direction.

[0032] Preferably, a length of the drive voltage contact point in the first direction is greater than a length of the data contact point in the first direction.

[0033] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. Brief description of the drawings

[0034] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings: Fig. 1 is a view illustrating a schematic system configuration of an organic light-emitting diode display device according to example embodiments of the present invention; Fig. 2 is a view schematically illustrating a structure of an organic light-emitting diode display panel according to example embodiments of the present invention; Fig. 3 a view showing an example of a pixel structure of the Fig. 2; Fig. 4 is a view for explaining a bonding part of an integrated circuit according to a first example embodiment of the present invention; Fig. 5 is a view showing a structure of a cross section taken along the line II' of Fig. 4 represents; Fig. 6 is a view showing a state of attaching an integrated circuit to the Fig. 5 represents the bonding part of the integrated circuit; Fig. 7 is a view for explaining a bonding part of an integrated circuit according to a comparative example; Fig. 8 is a view showing a structure of a cross section taken along the line II-II' of Fig. 7 represents; Fig. 9 is a view showing a state of occurrence of an error in the Fig. 7 represents the bonding part of the integrated circuit; Fig. 10 is a view showing a state of attaching an integrated circuit to the Fig. 8 represents the bonding part of the integrated circuit; Fig. 11 is a view for explaining a bonding part of an integrated circuit according to a second example embodiment of the present invention; and Fig. 12 a view showing a state in which a foreign substance has entered the Fig. 11 shown bonding part of the integrated circuit. Detailed description of the illustrated embodiments

[0035] Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. When designating elements in the drawings by reference numerals, the same elements are denoted by the same reference numerals even though they are shown in different drawings. Furthermore, in the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted if it would tend to misunderstand the subject matter of the present invention.

[0036] Additionally, terms such as first, second, A, B, (a), (b), or the like may be used herein when describing components of the present invention. Each of these terms is not used to define a nature, order, or sequence of a corresponding component, but is merely used to distinguish the corresponding component from other components. In the case where it is described that a particular structural element is "connected to," "coupled to," or "in contact with" another structural element, this should be interpreted to mean that another structural element "may be connected to," "coupled to," or "in contact" with the structural elements, as well as that the particular structural element is directly connected to or in direct contact with another structural element.

[0037] Fig. 1 is a view illustrating a schematic system configuration of an organic light-emitting diode display device according to example embodiments of the present invention.

[0038] As in Fig. As shown in Figure 1, the organic light-emitting diode display device 100 may include a display panel 110, a data driver 120, a first gate driver 130, a second gate driver 140, a timing control unit 150, and a reference voltage supply 160. The display panel 110 has a plurality of data lines DL, a plurality of first gate lines GL1, and a plurality of second gate lines GL2 formed therein to define a plurality of pixels. The data driver 120 drives the plurality of data lines DL formed in one direction of the display panel 110. The first gate driver 130 supplies a scanning signal via the first gate lines GL1 arranged in a different direction to cross the data lines DL in the display panel 110. The second gate driver 140 supplies a scanning signal via the second gate lines GL2 arranged in parallel to the first gate lines GL1 in the display panel 110.The timing control unit 150 controls a driving time of each of the data driver 120, the first gate driver 130, and the second gate driver 140. The reference voltage supply 160 supplies different voltages, for example, a reference voltage Vref, which is a common voltage, to the respective pixels.

[0039] The organic light-emitting diode display panel 110 includes a plurality of signal lines and an integrated circuit bonding portion to which an integrated circuit connected to the plurality of signal lines for supplying a signal to the plurality of signal lines is bonded, as described below. In the present example, the integrated circuit bonding portion may include a plurality of lower pad electrodes connected to the plurality of signal lines; and a plurality of upper pad electrodes connected to the respective plurality of lower pad electrodes via contact holes, and arranged such that at least one of a pitch, a length, and a location on a same plane is applied differently.

[0040] In addition, the data driver 120 may include a plurality of integrated data drive circuits (also referred to as "integrated source drive circuits"). The plurality of integrated data drive circuits may be connected to a bonding portion of the display panel 110 according to a TAB scheme or a chip-on-glass (COG) scheme, or they may be implemented in a gate-in-display (GIP) type and may be formed directly in the display panel 110. Alternatively, the data driver 120 may be integrated into the display panel 110.

[0041] The first gate driver 130 and the second gate driver 140 may be implemented separately or, in some cases, may be included in one gate driver. The first gate lines GL1 and the second gate lines GL2 may share one gate line GL and may supply a sampling signal and a scanning signal via the one gate line GL.

[0042] In addition, according to a driving type, the first gate driver 130 may be arranged on only one side of the display panel 110, as shown in Fig. 1, or the first gate driver 130 may be divided into two parts, and the two parts may be arranged on both sides of the display panel 110. The second gate driver 140 may be arranged as in the case of the first gate driver 130.

[0043] Furthermore, each of the first gate driver 130 and the second gate driver 140 may include a plurality of gate drive integrated circuits. The plurality of gate drive integrated circuits may be connected to a bonding portion of the display panel 110 according to the TAB scheme or the COG scheme, or they may be implemented in a gate-in-display (GIP) type and may be directly formed in the display panel 110. Alternatively, the first gate driver 130 and the second gate driver 140 may be integrated into the display panel. The reference voltage supply 160 may be connected to the data drive integrated circuits D-IC of the data driver 120 and may supply a reference voltage Vref to a reference voltage line RVL formed in the display panel 110 via the data drive integrated circuits D-IC.

[0044] The following is based on Fig. 2, a description is given of a structure of the display panel 110 of the organic light-emitting diode display device 100 according to an example embodiment of the present invention. Fig. 2 is a view schematically illustrating a structure of an organic light-emitting diode display panel according to example embodiments of the present invention.

[0045] The display panel 200 may include an active area 202 that displays an image and a non-active area 204 corresponding to a remaining area other than the active area 202. The active area 202 may include a plurality of first gate lines GL1 to GLm and a plurality of data lines DL1 to DLn formed to cross each other at predetermined intervals, and a plurality of pixels P each defined by intersections between the plurality of first gate lines GL1 to GLm and the plurality of data lines DL1 to DLn.

[0046] A pixel P includes a first transistor T1 connected to a first gate line GL1 and a data line DL. The pixel P displays an image corresponding to a data signal supplied from the data line DL via a second transistor T2. For example, the pixel P can become a light-emitting cell displaying an image, such that an OLED emits light according to a current corresponding to a data signal supplied from the data line DL via the second transistor T2.

[0047] The pixel P includes a third transistor T3 connected to a second gate line GL2 and a reference voltage line RVL. A reference voltage Vref supplied from the reference voltage line RVL is supplied to a source or drain of the second transistor T2 via the third transistor T3, whereby a characteristic value (e.g., a threshold voltage or mobility) of the second transistor T2 can be sensed via the reference voltage line RVL.

[0048] The non-active region 204 may include a bonding portion of the integrated circuit 220 to which an integrated drive circuit 210 is bonded for not only supplying a scan signal to the first gate lines GL1 to GLm, but also supplying a data signal synchronized with the scan signal to the data signal lines DL1 to DLn. The integrated drive circuit 210 may supply a scan signal and a data signal to display an image on the display panel 200 based on a drive power, a synchronization signal, and image data received from a flexible printed circuit board 230.

[0049] Fig. 3 is a view showing an example of a pixel structure of the Fig. 2 represents the scoreboard shown.

[0050] As in Fig. 3, the display panel 200 may include vertical signal lines including a plurality of data lines DL, a plurality of drive voltage lines DVL, and a reference voltage line RVL; and horizontal signal lines including first gate lines GL1 and second gate lines GL2.

[0051] In addition, the display panel 200 may be divided by the vertical signal lines and may include a pixel P1 connected to a (4n-3)th data line DL4n-3, a pixel P2 connected to a (4n-2)th data line DL4n-2, a pixel P3 connected to a (4n-1)th data line DL4n-1, and a pixel P4 connected to a 4nth data line DL4n.

[0052] In the present example, a reference voltage line RVL supplying a reference voltage Vref may be arranged to correspond to multiple columns of pixels for each column of pixels. For example, a reference voltage line RVL may be arranged to correspond to four pixels P1 to P4. Further, the (2n-1)th and 2nth drive voltage lines DVL2n-1 and DVL2n supplying a drive voltage VDD may be arranged on both sides of the four pixels P1 to P4.

[0053] The structure of the display panel 200 shown as an example in Fig. 3 may be a structure suitable for application to a display panel having pixels structured in red, green, blue, and white (RGBW). In particular, pixels P1 to P4 may be RGBW pixels, but are not limited thereto.

[0054] Fig. 4 is a view for explaining a bonding part of an integrated circuit according to a first example embodiment of the present invention. Fig. 5 is a view showing a structure of a cross section taken along the line II' of Fig. 4 represents.

[0055] With reference to Fig. 4, the bonding portion 410 of the integrated circuit may have disposed therein a plurality of data lines 422, 424, 426, and 428, a plurality of drive voltage lines 432 and 434, and a reference voltage line 440 extending in one direction.

[0056] In the present example, the plurality of data lines 422, 424, 426, and 428 may be divided into the first to fourth data lines 422, 424, 426, and 428, which provide data signals for respective RGBW pixels. The first to fourth data lines 422, 424, 426, and 428 may correspond to the (4n-3)th data lines DL4n-3, the (4n-2)th data lines DL4n-2, the (4n-1)th data lines DL4n-1, and the 4nth data lines DL4n, respectively, as shown in Fig. 3 is shown.

[0057] The first data line 422 and the second data line 424 may be arranged between the first drive voltage line 432 and the reference voltage line 440. The first drive voltage line 432 may correspond to the (2n-1)th drive voltage line DVL2n-1, as shown in Fig. 3. The reference voltage line 440 may correspond to the reference voltage line RVL, as shown in Fig. 3 is shown.

[0058] The third data line 426 and the fourth data line 428 may be arranged between the second drive voltage line 434 and the reference voltage line 440. The second drive voltage line 434 may correspond to the 2nth drive voltage line DVL2n.

[0059] The bonding portion 410 of the integrated circuit includes a plurality of lower pad electrodes connected to a plurality of signal lines; and a plurality of upper pad electrodes connected to the respective lower pad electrodes via contact holes and arranged such that at least one of a pitch, a length, and a location on a same plane is applied differently. The plurality of upper pad electrodes includes a plurality of upper data pad electrodes, a plurality of upper drive voltage pad electrodes, and an upper reference voltage pad electrode connected to a plurality of data lines, a plurality of drive voltage lines, and a reference voltage line, respectively.

[0060] In particular, the bonding portion 410 of the integrated circuit may have disposed therein a plurality of data pad portions 452, 454, 456, and 458, a plurality of drive voltage pad portions 462 and 464, and a reference voltage pad portion 470 connected to the plurality of data lines 422, 424, 426, and 428, the plurality of drive voltage lines 432 and 434, and the reference voltage line 440, respectively.

[0061] In the present example, with reference to Fig. 5, the data pad portions 456 and 458 include lower data pad electrodes 532 and 533, data contact holes 534 and 535, and upper data pad electrodes 536 and 537 disposed on a buffer layer 520 and an insulating layer 530 on a substrate 510.

[0062] The lower data pad electrodes 532 and 533 may be electrically connected to data lines DL that supply data signals. The data contact holes 534 and 535 may be formed by removing portions of a passivation layer 540 covering the lower data pad electrodes 532 and 533 and may expose portions of the lower data pad electrodes 532 and 533. The upper data pad electrodes 536 and 537 are disposed on the passivation layer 540 and are connected to the lower data pad electrodes 532 and 533 via the data contact holes 534 and 535, respectively.

[0063] The drive voltage pad portion 464 may include a lower drive voltage pad electrode 552, a drive voltage contact hole 554, and an upper drive voltage pad electrode 556 disposed on the buffer layer 520 and the insulating layer 530 on the substrate 510.

[0064] The lower drive voltage pad electrode 552 may be electrically connected to a drive voltage line DVL that supplies a drive voltage. The drive voltage contact hole 554 may be formed by removing a portion of the passivation layer 540 covering the lower drive voltage pad electrode 552 and may expose a portion of the lower drive voltage pad electrode 552. The upper drive voltage pad electrode 556 is disposed on the passivation layer 540 and is connected to the lower drive voltage pad electrode 552 via the drive voltage contact hole 554.

[0065] The reference voltage pad portion 470 may include a lower reference voltage pad electrode 562, a reference voltage contact hole 564, and an upper reference voltage pad electrode 566 disposed on the buffer layer 520 and the insulating layer 530 on the substrate 510. The lower reference voltage pad electrode 562 may be electrically connected to the reference voltage line RVL, which supplies a reference voltage Vref. The reference voltage contact hole 564 may be formed by removing a portion of the passivation layer 540 covering the lower reference voltage pad electrode 562 and may expose a portion of the lower reference voltage pad electrode 562. The upper reference voltage pad electrode 566 is disposed on the passivation layer 540 and is connected to the lower reference voltage pad electrode 562 via the reference voltage contact hole 564.

[0066] The bonding portion 410 of the integrated circuit may include the plurality of upper data pad electrodes 536 and 537, the upper drive voltage pad electrode 556, and the upper reference voltage pad electrode 566 arranged at different distances on a same plane.

[0067] Specifically, in the bonding portion 410 of the integrated circuit, the upper reference voltage pad electrode 466 and the upper data pad electrode 536 may be spaced apart by a first distance W1, the plurality of upper data pad electrodes 536 and 537 may be spaced apart by a second distance W2, and the upper data pad electrode 536 and the upper drive voltage pad electrode 556 may be spaced apart by a third distance W3. In the present example, the first distance W1 may be greater than the second distance W2. Furthermore, the third distance W3 may be greater than the first distance W1.

[0068] The first distance may be larger than the second distance by the size of at least one conductive ball. For example, the first distance W1 may be set to be approximately 4 µm larger than the second distance W2, which is the size of a conductive ball. In the present example, the first distance W1 may be set to be larger than the second distance W2 by the size of a conductive ball, and may prevent conductive balls accumulating on the upper reference voltage pad electrode 566 and conductive balls accumulating on the upper data pad electrodes 536 from contacting each other.

[0069] Fig. 6 is a view showing a state of attaching an integrated circuit 610 to the Fig. 5. Here, the integrated circuit portion 610 includes terminals 615 connected to the upper data pad electrodes 536 and 537, the upper drive voltage pad electrode 556, and the upper reference voltage pad electrode 566, respectively.

[0070] As in Fig. 6, in the integrated circuit bonding part 410, a distance between the upper reference voltage pad electrode 566 and the upper data pad electrode 536 is designed to be larger than a distance between the upper data pad electrodes 536 and 537, so that failures such as short circuits and the like can be prevented although conductive balls 620 accumulate when an integrated circuit 610 is mounted.

[0071] Fig. 7 is a view for explaining a bonding part of an integrated circuit according to a comparative example. Fig. Fig. 8 is a view showing a structure of a cross section taken along the line II-II' of Fig. 7 represents.

[0072] In the Fig. 7 and Fig. 8, a structure of the bonding part of the integrated circuit according to a comparative example may be the same as the structure of the bonding part of the integrated circuit according to an example embodiment of the present invention, as described above with reference to Fig. 4 to Fig. 6. Meanwhile, the bonding part of the integrated circuit according to a comparative example includes a plurality of upper data pad electrodes 812 and 813, an upper drive voltage pad electrode 822, and an upper reference voltage pad electrode 832 spaced from each other by equal distances W4 on a same plane.

[0073] For example, the bonding part of the integrated circuit according to a comparative example has the upper data pad electrodes 812 and 813, the upper drive voltage pad electrode 822, and the upper reference voltage pad electrode 832 spaced from each other by the same distances W4.

[0074] Fig. 9 is a view showing a state of occurrence of an error in the Fig. 7 represents the bonding part of the integrated circuit. Fig. 10 is a view showing a state of attaching an integrated circuit to the Fig. 8 represents the bonding part of the integrated circuit.

[0075] With reference to Fig. 9 and Fig. 10, in the bonding part of the integrated circuit according to a comparative example of the present invention, it can be confirmed that conductive balls 920 accumulate or a small amount of a foreign substance 930 penetrates, and thus a short circuit occurs between a reference voltage pad electrode 832 and a data pad electrode 812, so that a failure occurs.

[0076] Fig. 11 is a view for explaining a bonding part of an integrated circuit according to a second example embodiment of the present invention.

[0077] As in Fig. As shown in Figure 11, the bonding portion 1110 of the integrated circuit according to the second example embodiment of the present invention may have arranged therein a plurality of data lines 1122, 1124, 1126, and 1128, a plurality of drive voltage lines 1132, and 1134, and a reference voltage line 1140 extending in one direction. In the present example, the plurality of data lines 1122, 1124, 1126, and 1128 may be divided into the first to fourth data lines 1122, 1124, 1126, and 1128, which provide data signals for respective RGBW pixels. The first data line 1122 and the second data line 1124 may be arranged between the first drive voltage line 1132 and the reference voltage line 1140. The third data line 1126 and the fourth data line 1128 may be arranged between the second drive voltage line 1134 and the reference voltage line 1140.

[0078] In addition, the bonding portion 1110 of the integrated circuit may have disposed therein a plurality of data pad electrodes 1152, 1154, 1156, and 1158, a plurality of drive voltage pad electrodes 1162 and 1164, and a reference voltage pad electrode 1170 connected to the plurality of data lines 1122, 1124, 1126, and 1128, the plurality of drive voltage lines 1132 and 1134, and the reference voltage line 1140, respectively.

[0079] In the present example, the plurality of data pad electrodes 1152, 1154, 1156, and 1158, the plurality of drive voltage pad electrodes 1162 and 1164, and the reference voltage pad electrode 1170 may have respective pad electrodes formed therein with different lengths or arranged at different locations with a longitudinal direction as a reference. The plurality of data pad electrodes 1152, 1154, 1156, and 1158, the plurality of drive voltage pad electrodes 1162 and 1164, and the reference voltage pad electrode 1170 may have the respective pad electrodes arranged such that at least one of a length and a location is applied differently to the pad electrodes on a same plane, as described below.

[0080] The lengths of the drive voltage pad electrodes 1162 and 1164 may be different from one of the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and that of the reference voltage pad electrode 1170. For example, as shown in Fig. As shown in Figure 11, the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170 each have a first length L1, and the drive voltage pad electrodes 1162 and 1164 each have a second length L2. In the present example, the first length L1 may be shorter than the second length L2. Furthermore, the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170 may be arranged at different locations with the longitudinal direction as a reference.

[0081] In particular, the drive voltage pad electrodes 1162 and 1164 may be formed to be longer than the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170. For example, the drive voltage pad electrodes 1162 and 1164 may be formed to be twice as long as the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170. Here, the first and second drive voltage lines 1132 and 1134 may carry higher currents, and therefore the drive voltage pad electrodes 1162 and 1164 may be longer to provide better electrical connection and reduced heating.

[0082] Furthermore, the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170 may be formed to have the same length. In this regard, the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170 may be arranged at different locations with the longitudinal direction as a reference. For example, the reference voltage line 1140 may extend to be longer than the data lines 1122, 1124, 1126, and 1128, and the reference voltage pad electrode 1170 may be arranged at a location farther away than those of the plurality of data pad electrodes 1152, 1154, 1156, and 1158 with the longitudinal direction as a reference.

[0083] As another example, the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170 may be formed with different lengths. In this regard, the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170 may be arranged at different locations with the longitudinal direction as a reference.

[0084] Fig. 12 is a view showing a state in which a foreign substance enters the Fig. 11 shown bonding part of the integrated circuit.

[0085] With reference to Fig.12, in the bonding part 1110 of the integrated circuit, the plurality of data pad electrodes 1152, 1154, 1156, and 1158 may be formed to be shorter than the drive voltage pad electrodes 1162 and 1164, and may be arranged at a location different from that of the reference voltage pad electrode 1170. Accordingly, it is possible to ensure a sufficiently large space between the drive voltage pad electrodes 1162 and 1164 and the reference voltage pad electrode 1170; and a sufficiently large space between the second data pad electrode 1154 and the third data pad electrode 1156 adjacent to the reference voltage pad electrode 1170.

[0086] Therefore, the bonding portion 1110 of the integrated circuit according to the second example embodiment of the present invention may include a plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170 arranged at different locations. Accordingly, even if conductive balls 1220 accumulate or a small amount of foreign substance 1230 penetrates the bonding portion 1110 of the integrated circuit, it is possible to prevent failures caused by a short circuit between the plurality of data pad electrodes 1152, 1154, 1156, and 1158 and the reference voltage pad electrode 1170.

Claims

[1] Organic light-emitting diode display panel comprising: a plurality of data lines (DL; 422, 424, 426, 428) arranged in a first direction; a plurality of gate lines (GL) arranged in a second direction to cross the data lines (DL), a plurality of pixel regions defined by the crossed data lines (DL; 422, 424, 426, 428) and gate lines (GL); at least one drive voltage line (DVL; 432, 434) arranged in the first direction; at least one reference voltage line (RVL; 440) arranged in the first direction; a plurality of data contact points (452, 454, 456, 458) each arranged at ends of corresponding data lines; a drive voltage contact point (462, 464) arranged at one end of the drive voltage line (432, 434); and a reference voltage contact point (470) arranged at one end of the reference voltage line (440, RVL); wherein a first distance (W1) is defined between the adjacent edges of the reference voltage pad (470) and an adjacent data pad (456), a second distance (W2) is defined between the adjacent edges of the adjacent data pads (456, 458), and a third distance (W3) is defined between the adjacent edges of the drive voltage pad (464) and an adjacent data pad (458), and wherein at least two of the first distance (W1), the second distance (W2) and the third distance (W3) are different from each other, and wherein each of the first and third distances (W1, W3) is greater than the second distance (W2). [2] An organic light-emitting diode display panel according to claim 1, wherein the third distance (W3) is greater than the first distance (W1) and the first distance (W1) is greater than the second distance (W2). [3] Display panel (200) with organic light-emitting diodes according to one of the preceding claims, wherein each of the data pads (1152, 1154, 1156, 1158), the drive voltage pad (1162, 1164) and the reference voltage pad (1170) is arranged in a non-active area of ​​the display panel (110) adjacent to an edge of the display panel (110), wherein a fourth distance from the edge of the display panel (110) to the data contact points (1152, 1154, 1156, 1158) is different than a fifth distance from the edge of the display panel (110) to the drive voltage contact point (1162, 1164), and wherein the fourth distance from the edge of the display panel (110) to the data pads (1152, 1154, 1156, 1158) is different than a sixth distance from the edge of the display panel (110) to the reference voltage pad (1170). [4] The organic light emitting diode display panel of claim 3, wherein the fifth and sixth pitches are substantially equal. [5] The organic light-emitting diode display panel of claim 3 or 4, wherein a length (L1) of the data pad (1152, 1154, 1156, 1158) in the first direction is substantially equal to a length (L1) of the reference voltage pad (1170) in the first direction. [6] The organic light-emitting diode display panel according to claim 3, 4 or 5, wherein a length (L2) of the drive voltage pad (1134, 1136) in the first direction is greater than a length (L1) of the data pad (1152, 1154, 1156, 1158) in the first direction. [7] An organic light-emitting diode display device comprising: a display panel (200) according to any one of the preceding claims, and further comprising: an integrated circuit (610) mounted on the display panel (200), the integrated circuit (610) having a plurality of terminals (615), each of which is connected to a respective one of the data pads (536, 537), the drive voltage pad (556), and the reference voltage pad (566). [8] An organic light-emitting diode display device according to claim 7, wherein at least one conductive ball (620) is provided between each terminal (615) and the one of the data pads (536, 537), the drive voltage pad (556) and the reference voltage pad (566) to which the terminal (615) is connected. [9] The organic light emitting diode display device of claim 8, wherein each of the first, second and third distances (W1, W2, W3) is larger than a diameter of one of the at least one conductive sphere (620). [10] The organic light emitting diode display device of claim 9, wherein the first distance (W1) is greater than the second distance (W2) by an amount substantially equal to a diameter of the conductive sphere (620).

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