Substrate carrier, transport arrangement, vacuum arrangement and process

Abstract

Substrate carrier (502, 100a to 400), comprising: • a recording area (113); • a coating mask (104) which is designed to be applied to the receiving area (113) by means of a magnetic interaction; • a mask holder (106) which is configured to effect the magnetic interaction; and • a clamping structure (108) for clamping the substrate in the receiving area (113) so that it is pre-fixed when the coating mask (104) is applied; • wherein the clamping structure (108) has a weighting element (204) which is configured to exert a clamping force which is essentially the weight of the weighting element (204).

Description

[0001] The invention relates to a substrate carrier, a transport arrangement, a vacuum arrangement and a method.

[0002] In general, a substrate, such as a glass substrate, a metal substrate, and / or a polymer substrate, can be treated (processed) or coated so that the chemical and / or physical properties of the substrate can be modified. Various coating processes can be used to coat a substrate. For example, a vacuum coating system can be used to deposit and / or structure one or more layers on one or more substrates using different coating methods.In order to efficiently realize large-area deposition on correspondingly large-area substrates, a so-called in-line system can be used, in which a substrate is transported through the entire system, for example by means of rollers, whereby a coating process can be carried out in one or more areas of the in-line system during the transport of the substrate through the in-line system.

[0003] In general, one or more substrates, e.g., wafers or other plate-shaped substrates, can be held by a substrate carrier during the coating process (or other processes for treating substrates). The substrate carrier can be used, for example, to hold the substrate(s) in a predefined position in a coating chamber or to transport them through a coating chamber and / or to move them within the coating chamber.

[0004] To deposit a structured layer, a coating mask is conventionally incorporated into the substrate carrier, which shields the areas of the substrate that are not to be coated. In other words, the structure of the coating mask is imaged onto the coating. It may be necessary to position the substrate and the mask as precisely as possible relative to each other so that the areas of the substrate to be coated are not partially shielded. For further information, see EP 1 202 329 A2 and US 2012 / 0 178 190 0 A1.

[0005] Conventionally, the precision with which the patterned layer can be deposited is limited. This resulting problem is solved by the subject matter of the appended claims.

[0006] According to various embodiments, a substrate carrier, a transport arrangement, a vacuum arrangement and a method are provided which enable both sharp imaging and precise positioning of the coating.

[0007] According to various embodiments, it has been clearly recognized that the transfer of the mask structure to the coating structure becomes sharper (more true to image) the closer the coating mask is to the substrate, for example, when the two are brought into contact with each other. However, applying the coating mask to the substrate can lead to a displacement of the substrate, which in turn results in a mispositioned and / or offset coating. Therefore, either a blurred image or inaccurate positioning of the coating is conventionally accepted.

[0008] According to various embodiments, the substrate is clamped in the position to be coated, so that it remains stationary when the coating mask is applied. This allows the coating mask to be applied to the substrate without the substrate being displaced, thus providing both a sharp image and precise positioning of the coating on the substrate.

[0009] According to various embodiments, a substrate carrier is configured according to claim 1, comprising, inter alia, the following: a receiving region; a coating mask configured to be applied to the receiving region by means of a magnetic interaction; a mask holder configured to effect the magnetic interaction; and a clamping structure for clamping the substrate in the receiving region so that it is pre-fixed when the coating mask is applied.

[0010] According to various embodiments, the coating mask may comprise or be formed from a magnetizable or magnetized (e.g., ferromagnetic) material.

[0011] According to various embodiments, the mask holder may comprise or be formed from a magnetizable or magnetized (e.g., ferromagnetic) material.

[0012] According to various embodiments, the material of the mask holder (and / or the coating mask) can be hard magnetic and / or ceramic (e.g., comprising one or more permanent magnets). A hard magnetic material can clearly have a high coercive field strength. For example, the hard magnetic material can comprise or be formed from a magnetic material.

[0013] According to various embodiments, the material of the coating mask (or mask holder) may be soft magnetic and / or metallic (e.g., comprising an iron-based material). A soft magnetic material may clearly have a low coercive field strength.

[0014] According to various embodiments, the material of the mask holder and the coating mask may differ from each other, e.g., in their coercive field strength. For example, the material of the coating mask may have a lower coercive field strength than the material of the mask holder (or vice versa).

[0015] According to various embodiments, the mask holder and the coating mask can be arranged relative to one another such that, when arranged on opposite sides of the receiving area (or the substrate therein), they hold each other by means of the magnetic interaction. In other words, for example, the mask holder and the coating mask can be arranged on opposite sides of the receiving area (or the substrate therein). For example, they can press onto or toward the substrate.

[0016] According to various embodiments, the mask holder and the coating mask can be arranged relative to each other in such a way that they are arranged on opposite sides of the clamping structure and hold each other by means of the magnetic interaction.

[0017] According to various embodiments, the mask holder and the coating mask can be arranged relative to one another in such a way that a force caused by the magnetic interaction on the coating mask exceeds the weight of the coating mask (and optionally the lifting force of the coating mask due to thermal expansion) (i.e., is greater than the weight of the coating mask and optionally the lifting force due to thermal expansion).

[0018] The lifting force can clearly be a force resulting from the thermal expansion of the coating mask, which (like the weight of the coating mask, for example) is directed away from the receiving area, e.g., by bending and / or folding the coating mask. In other words, the magnetic interaction can compensate for and / or exceed the lifting force and / or reduce the resulting curvature of the coating mask.

[0019] According to various embodiments, the clamping structure may have a lower magnetic permeability than the coating mask. For example, the clamping structure may be substantially non-magnetic. This may reduce its influence on the magnetic interaction.

[0020] According to various embodiments, the clamping structure may comprise or be formed from aluminum.

[0021] According to various embodiments, the material of the mask holder or the coating mask may comprise or be formed from at least iron, e.g. an alloy (e.g. steel) comprising iron.

[0022] According to various embodiments, the clamping structure may have a substrate support surface which limits the receiving area in the direction of the coating mask.

[0023] According to various embodiments, the substrate support surface may have a larger coefficient of friction relative to the substrate than the coating mask and / or the weighting element (e.g., the weight plate). In other words, the substrate support surface may have a larger coefficient of friction relative to the substrate material than the coating mask and / or the weighting element (e.g., the weight plate), for example relative to the substrate, e.g., relative to a ceramic (such as silicon or glass) or a metal. The coefficient of friction may also be related to another reference material.

[0024] According to various embodiments, the substrate support surface can be provided by a polymer (e.g., an elastomer). For example, the substrate support surface can be provided by the surface of a polymer support of the clamping structure.

[0025] According to various embodiments, the clamping structure comprises a weighting element (if it comprises a plate or is formed therefrom, also referred to as a weight plate) which is configured to cause a force for clamping, which force can essentially be the weight force of the weighting element.

[0026] According to various embodiments, the weighting element may comprise or be formed from a plate. For example, the weighting element may be plate-shaped.

[0027] According to various embodiments, the substrate carrier may further comprise a connecting structure that connects the weighting element to the mask holder such that their distance from each other is limited by the connecting structure. In other words, the weighting element and the mask holder may be coupled to each other by means of the connecting structure.

[0028] According to various embodiments, the connecting structure may comprise a sliding joint which slidably connects the weighting element to the mask holder.

[0029] According to various embodiments, the sliding joint can have a limiter which limits a distance that can be moved by means of the sliding joint to the distance.

[0030] According to various embodiments, the substrate carrier may further comprise a coupling structure for coupling the mask holder in a fixed position relative to the receiving area. In other words, the coupling structure may provide the mask holder with a fixed position relative to the receiving area, to which it can be coupled or uncoupled.

[0031] According to various embodiments, the coupling structure may comprise a guide structure which provides the mask holder with exactly one translational degree of freedom, according to which the coupling and / or uncoupling of the mask holder is guided relative to the receiving area.

[0032] According to various embodiments, the substrate carrier may further comprise: a clamping structure by means of which the coating mask is mounted in a pre-tensioned manner.

[0033] According to various embodiments, the coating mask may have one or more coating regions in which the coating mask is open (e.g., by means of respective through-openings). The or each coating region may, for example, have or be formed from at least (ie, exactly or more than) one through-opening.

[0034] According to various embodiments, the substrate carrier may further comprise: a shielding structure, wherein the coating mask is arranged between the receiving region and the shielding structure, such that at least a part of the coating mask is shielded by means of the shielding structure.

[0035] According to various embodiments, the shielding structure may comprise a heat shield and / or through-openings aligned with the coating regions of the coating mask.

[0036] According to various embodiments, the heat shield can be multi-layered. For example, the layers of the heat shield can be spaced apart from one another. With multiple layers, the layer of the heat shield closest to the coating mask (e.g., directly adjacent) can optionally have larger through-openings (illustratively, an undercut to prevent particle abrasion during movement of the individual layers) than another layer of the heat shield (e.g., the correspondingly opposite layer).

[0037] According to various embodiments, the substrate carrier may further comprise: a frame which surrounds the receiving area and by means of which at least a part of the clamping structure (e.g. its support surface) and / or the coating mask is carried (e.g. fastened thereto).

[0038] According to various embodiments, the coupling structure may be part of the frame or be or become attached to it.

[0039] According to various embodiments, the tensioning structure can be part of the frame or can be or become attached to it.

[0040] According to various embodiments, a transport arrangement may comprise: a substrate carrier according to various embodiments, and a transport device for transporting the substrate carrier along a transport path.

[0041] According to various embodiments, the transport device can have several transport rollers.

[0042] According to various embodiments, the transport device can have at least one transport belt which is guided by means of the plurality of transport rollers.

[0043] According to various embodiments, the transport device may comprise or be formed from a belt conveyor transport device.

[0044] According to various embodiments, the transport arrangement may further comprise: a manipulator device which is configured to bring the substrate out of the receiving area or into it.

[0045] According to various embodiments, a manipulator device may be configured to cancel and / or establish (e.g., restore) the magnetic interaction.

[0046] According to various embodiments, a manipulator device can be configured to change a distance between the mask holder and the coating mask in order to cancel and / or establish (e.g., restore) a coupling between the coating mask and the mask holder effected by means of the magnetic interaction.

[0047] According to various embodiments, the manipulator device can be configured to displace the mask holder away from the receiving area in order to release the coupling (ie, to move it away from it, e.g., to remove it) and / or to approach it in order to establish (e.g., to restore) the coupling (ie, to move it towards it, e.g., to place it on it).

[0048] According to various embodiments, a vacuum arrangement may comprise: a transport arrangement according to various embodiments; and a vacuum chamber in which the transport path is arranged.

[0049] According to various embodiments, the vacuum arrangement may further comprise: a coating material source configured to emit a coating material in the direction of the transport path.

[0050] According to various embodiments, the coating material source may comprise or be formed from a thermal evaporator.

[0051] According to various embodiments, a method is configured according to the appended claim 11, comprising, inter alia, clamping a substrate in a receiving region of a substrate carrier such that the substrate is pre-fixed; and applying a coating mask to the clamped substrate by means of a magnetic interaction acting on the coating mask.

[0052] According to various embodiments, the method may further comprise pre-tensioning and / or post-tensioning the coating mask. Pre-tensioning and / or post-tensioning the coating mask may, for example, comprise tensioning the coating mask using a spring-elastic restoring force and / or stretching the coating mask using the spring-elastic restoring force.

[0053] Applying the coating mask and / or pre-tensioning and / or post-tensioning the coating mask can reduce curvature of the coating mask.

[0054] The method may further comprise coating the substrate through the coating mask (e.g., its through-openings). For example, a coating material may be emitted through the coating mask (e.g., its through-openings).

[0055] According to various embodiments, applying the coating mask may comprise bringing a magnetized and / or magnetizable material, e.g., comprising a magnetic field source (e.g., a mask holder), closer to the coating mask.

[0056] According to various embodiments, applying the coating mask may comprise coupling the coating mask to the mask holder by means of a magnetic interaction.

[0057] According to various embodiments, clamping may include placing a weighting element (e.g., a weight plate) on the substrate.

[0058] According to various embodiments, the magnetic interaction can impart a force (also referred to as an attractive force) between the mask holder and the coating mask, causing them to attract each other. If the attractive force exceeds a force separating the coating mask and the mask holder (also referred to as a separating force), they are coupled (e.g., connected) to each other by means of the magnetic interaction; otherwise, they are uncoupled (e.g., detached).

[0059] The separation force can be directed opposite to the attractive force (e.g., antiparallel) and can be defined by the position and / or orientation of the mask holder and the coating mask. In general, the substrate holder can be transported in any orientation, e.g., vertically standing or hanging, horizontally lying, and / or in an inclined orientation in between.

[0060] The attractive force can, for example, be defined by the distance between the mask holder and the coating mask, and can, for example, become smaller the greater their separation. For example, the mask holder and the coating mask can be coupled by bringing them closer together. Alternatively or additionally, the mask holder and the coating mask can be released by moving them away from each other (e.g., removing them).

[0061] For example, the separating force can be caused at least partially by gravity. The separating force can, for example, be a directional component of the weight force or a portion of the weight force that is antiparallel to the attractive force.

[0062] If the attractive force exceeds, for example, the weight of the coating mask (if this is arranged below the mask holder, for example) and / or the mask holder (if this is arranged below the coating mask, for example), which may be antiparallel to the attractive force, these are coupled to one another by means of the magnetic interaction. Optionally, part of the weight of the coating mask and / or the mask holder can also be absorbed in another way, e.g. by means of a bearing. For example, the coating mask can be or will be mounted by means of the bearing, e.g. preloaded, in such a way that the attractive force can be smaller than the weight of the coating mask (or at least a directional component of the weight that is parallel to the attractive force) in order to effect the coupling.For example, it may be sufficient to overcome a remaining part of the weight force of the coating mask and / or the mask holder (or at least a directional component of the remaining part which is parallel to the attractive force) by means of the attractive force.

[0063] For example, the separation force can be equal to or less than the weight force (e.g. approximately 50%, 25% or 10% of the weight force).

[0064] According to various embodiments, the release of the coupling between the mask holder and the coating mask can be understood as the magnetic interaction (e.g. the force of attraction) between the mask holder and the coating mask being weakened (i.e. reduced) to such an extent that they separate from each other, for example when the force of attraction between the mask holder and the coating mask mediated by the magnetic interaction is smaller than the separation force.

[0065] According to various embodiments, the establishment of the coupling between the mask holder and the coating mask can be understood as the magnetic interaction (e.g. the attractive force) between the mask holder and the coating mask being increased to such an extent that they couple to one another, for example when the attractive force mediated by the magnetic interaction between the mask holder and the coating mask of the coating mask is greater than the separating force.

[0066] Embodiments of the invention are illustrated in the figures and are explained in more detail below.

[0067] It shows Fig. 1A shows a substrate carrier in a schematic side view or cross-sectional view according to various embodiments; Fig. 1B shows a coating mask holding structure in a schematic side view or cross-sectional view according to various embodiments; Fig. 1C shows a coating mask in a schematic side view or cross-sectional view according to various embodiments; Fig. 2A shows a coating mask holding structure in a schematic side view or cross-sectional view according to various embodiments; Fig. 2B shows a clamping structure in a schematic side view or cross-sectional view according to various embodiments; Fig. 2C, Fig. 3A, Fig. 3B, Fig. 3C and Fig. 4 each show a substrate carrier in a schematic side view or cross-sectional view according to various embodiments; Fig. 5A, Fig. 5B, Fig. 5C, Fig. 6A and Fig. 6B each shows a transport arrangement in a schematic side view or cross-sectional view according to various embodiments; Fig. 7 shows a vacuum arrangement in a schematic side view or cross-sectional view according to various embodiments; Fig. 8A and Fig. 8B shows a substrate carrier in a schematic perspective view according to various embodiments; Fig. 9 and Fig. 10 shows a substrate carrier in various schematic perspective views according to various embodiments; and Fig. 11, Fig. 12, Fig. 13 and Fig. 14 a substrate carrier in a method according to various embodiments.

[0068] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top," "bottom," "front," "back," "fore," "rear," etc., will be used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology is for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention.It is understood that the features of the various exemplary embodiments described herein may be combined with one another unless specifically stated otherwise. The following detailed description is therefore not to be construed in a limiting sense, and the scope of the present invention is defined by the appended claims.

[0069] In this description, the terms "connected," "attached," and "coupled" are used to describe both a direct and an indirect connection (e.g., resistive and / or electrically conductive, e.g., an electrically conductive connection), a direct or indirect connection, and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals where appropriate.

[0070] According to various embodiments, the term "coupled" or "coupling" can be understood in the sense of a (e.g. mechanical, hydrostatic, thermal and / or electrical), e.g. direct or indirect, connection and / or interaction. Several elements can be coupled to one another, for example, along an interaction chain (e.g. a drive, such as a reciprocating piston, and the valve flap). According to various embodiments, "coupled" can be understood in the sense of a magnetic and / or mechanical (e.g. physical) coupling, e.g. by means of direct physical contact and / or by means of a magnetic interaction. A coupling can, for example, be configured to transmit a mechanical interaction (e.g. force, torque, etc.), e.g. by means of the magnetic interaction.

[0071] According to various embodiments, a magnetic material (also referred to as a magnetic material) can comprise a magnetized material (i.e., having a magnetization) and can be configured, for example, as at least one magnet (e.g., a permanent magnet and / or a hard magnet). The magnetic material (or the or each magnet) can comprise, for example, a hard magnetic (e.g., ferromagnetic) material, e.g., a chemical compound (e.g., an alloy) or a ferrite. Alternatively or additionally, the magnetic material (or the or each magnet) can, for example, have a coercive field strength greater than approximately 500 kiloamperes per meter (kA / m), e.g., greater than approximately 1000 kA / m.

[0072] The chemical compound of the magnetic material may comprise or be formed from a rare earth metal (such as neodymium, samarium, praseodymium, dysprosium, terbium and / or gadolinium), iron, cobalt and / or nickel. For example, the magnetic material (or the or each magnet) may comprise or be formed from at least neodymium, iron and / or boron, e.g. a chemical compound thereof. Alternatively or additionally, the magnetic material (or the or each magnet) may comprise or be formed from at least aluminum, nickel and / or cobalt, e.g. a chemical compound thereof. Alternatively or additionally, the magnetic material (or the or each magnet) may comprise or be formed from at least samarium and / or cobalt, e.g. a chemical compound thereof.

[0073] For example, the magnet material may comprise or be formed from a rare earth magnet material (such as neodymium-iron-boron (NdFeB) or samarium-cobalt (SmCo)), a ferrite magnet material (e.g., a hard ferrite magnet material), a Bismanol magnet material, and / or an aluminum-nickel-cobalt magnet material. For example, one or each magnet may comprise or be formed from a rare earth magnet (such as neodymium-iron-boron (NdFeB)) or samarium-cobalt (SmCo)), a ferrite magnet (e.g., a hard ferrite magnet), a Bismanol magnet, and / or an aluminum-nickel-cobalt magnet.

[0074] According to various embodiments, the substrate (e.g., a plate-shaped substrate) may comprise or be formed from at least one of the following: a ceramic, a glass, a semiconductor (e.g., an amorphous, polycrystalline, or single-crystalline semiconductor, e.g., silicon), a (e.g., non-magnetic) metal (e.g., aluminum, copper, platinum, gold, etc.), a polymer (e.g., plastic), and / or a mixture of different materials, such as a composite material (e.g., carbon fiber reinforced carbon or carbon fiber reinforced plastic). Alternatively or additionally, the substrate may comprise or be formed from a non-magnetic material.

[0075] In the context of this description, a metal (also referred to as a metallic material) can comprise (or be formed from) at least one metallic element (i.e., one or more metallic elements), e.g., at least one element from the following group of elements: copper (Cu), iron (Fe), titanium (Ti), nickel (Ni), silver (Ag), chromium (Cr), platinum (Pt), gold (Au), magnesium (Mg), aluminum (Al), zirconium (Zr), tantalum (Ta), molybdenum (Mo), tungsten (W), vanadium (V), barium (Ba), indium (In), calcium (Ca), hafnium (Hf), samarium (Sm), silver (Ag), and / or lithium (Li). Furthermore, a metal can comprise or be formed from a metallic compound (e.g., an intermetallic compound or an alloy), e.g., a compound of at least two metallic elements (e.g., from the group of elements), such as, e.g., bronze or brass, or e.g., a compound of at least one metallic element (e.g.,from the group of elements) and at least one non-metallic element (e.g. carbon), such as steel.

[0076] According to various embodiments, a simplified replacement of the mask in case of wear is provided.

[0077] According to various embodiments, a tensionable magnetic coating mask is provided for gap-free contact with the side to be coated (also referred to as coating surface) of the substrate.

[0078] According to various embodiments, a mechanical alignment of the substrate to an alignment structure (e.g., its contact surfaces) is provided.

[0079] According to various embodiments, protection against displacement of the substrate is provided when aligning and placing the weighting element (e.g. the weight plate).

[0080] According to various embodiments, a substrate carrier (also referred to as a carrier) is provided, which enables the precise coating of substrates via a pre-applied mask (also referred to as a coating mask). Several such carriers can be transported by means of a closed carrier return system, which provides for the coating of the substrate in a high vacuum and a return of the carriers under protective gas.

[0081] The substrate change can be carried out, for example, in high vacuum and / or under protective gas.

[0082] The carrier can have at least two assemblies, of which a first assembly has a frame with the mask and a second assembly has a mask holder (e.g. having or formed from a magnetic plate, ie a plate with several magnets) with a weighting element (e.g. a weight plate) suspended floatingly (also referred to as flying) underneath.

[0083] The frame can support the mask, which can be re-tensioned, for example, over two sides.

[0084] The mask holder (e.g. the magnetic plate) can be lifted from the frame (with the mask) in a pin guide for substrate change.

[0085] During separation, the mask holder (e.g., the magnetic plate) can first be lifted from the weighting element, and then the weighting element (e.g., the weight plate) suspended from it can be lifted (illustratively pulled) by the mask holder. The weighting element can remain on the substrate until the attractive force (also known as the magnetic force) between the mask and the mask holder is eliminated.

[0086] This prevents the mask from bending upwards and shifting the substrate.

[0087] For example, the distance between the mask holder and the coating mask, which is limited by the connecting structure, can be set such that at the distance the separation force is greater than the attraction force.

[0088] When separated, the substrate can be changed.

[0089] The substrate alignment can be carried out by means of a handler system (also called a manipulator device), which brings the substrate directly above the mask into contact with several (e.g. three) pins (i.e. aligns it therewith).

[0090] The substrate's displacement protection can be provided by rubber pads protruding above the mask. The rubber pads can be lowered and / or compressed when the substrate and weight plate are placed on the mask.

[0091] A shielding structure (e.g., comprising or formed from a heat protection mask) and optionally several profiles can be arranged beneath the coating mask. These reduce the heat load on the coating mask and / or the substrate.

[0092] According to various embodiments, a reduction of the thermal stress on the substrate is provided.

[0093] According to various embodiments, a cross-sectional area of ​​the substrate (e.g., a surface of the substrate to be coated), the receiving area, and / or the weighting element may be more than approximately 0.1 m 2 (square metres), e.g. more than approximately 0.2 m 2 , and / or less than 0.5 m 2. For example, the substrate, the weighting element and / or the receiving area may have a longitudinal extension of more than approximately 0.1 m (meters), e.g., more than approximately 0.2 m, e.g., more than approximately 0.3 m, e.g., more than or equal to approximately 0.4 m and / or less than 1 m.

[0094] According to various embodiments, the soft magnetic material (e.g., the coating mask(s)) may comprise or be formed from an alloy comprising iron, nickel, and / or cobalt, a powder material, and / or a soft ferrite (e.g., comprising nickel-tin and / or manganese-tin). Alternatively or additionally, the hard magnetic material (e.g., of the mask holder(s)) may comprise or be formed from cobalt-samarium, neodymium-iron-boron (NdFeB), an aluminum-nickel-cobalt alloy, a hard ferrite (e.g., comprising barium and / or strontium), a platinum-cobalt alloy, a copper-nickel-iron alloy, a copper-nickel-cobalt alloy, an iron-cobalt-chromium alloy, a martensitic steel, and / or a manganese-aluminum-carbon alloy.

[0095] A magnetic field source can be understood as an element, material, or body that generates a magnetic field and / or is configured to generate a magnetic field. The magnetic field source can, for example, comprise or be formed from a magnetized hard magnetic material. The hard magnetic material can, for example, provide one or more permanent magnets.

[0096] Fig. 1A illustrates a substrate carrier 100a in a schematic side view or cross-sectional view according to various embodiments, e.g., viewed along its longitudinal extent and / or width extent.

[0097] The substrate carrier 100a can have a (e.g., planar) receiving area 113 for receiving a substrate. Furthermore, the substrate carrier 100a can have a (multi-part) coating mask holding structure 104, 106, which has a coating mask 104 and a mask holder 106. The coating mask 104 and the mask holder 106 can be configured to be arranged on opposite sides of the receiving area 113.

[0098] Furthermore, the substrate carrier 100a can have a clamping structure 108 which is configured to transmit a clamping force to the substrate in the receiving area 113, so that the substrate is clamped in the receiving area 113 by means of the clamping force and is thereby pre-fixed.

[0099] The clamping structure 108 can be configured to be adjusted (e.g., by adjusting the clamping structure 108) between at least two configurations (also referred to as "clamping the substrate" and "releasing the clamping"). In a first configuration (also referred to as the clamping configuration), the substrate is clamped, and in a second configuration (also referred to as the change configuration), the substrate is essentially force-free and / or displaceable. In the change configuration, for example, the substrate can be moved into and / or out of the receiving area 113, as will be described in more detail later.

[0100] The coating mask 104 and the mask holder 106 can be configured for magnetic interaction with one another such that the mask holder 106 can be applied to the receiving area 113 (e.g., deformed in the process) and held there by means of the magnetic interaction 115, e.g., against its weight. For example, the magnetic interaction 115 between the coating mask 104 and the mask holder 106 can be configured so strong that they can be coupled (e.g., connected) to one another and also uncoupled (e.g., released and / or separated) from one another again by means of the magnetic interaction 115.

[0101] In general, the magnetic interaction 115 can be provided in various ways, e.g., between a magnetic field source (also referred to as a magnet) and a magnetizable material, or between two magnetic field sources. For example, the coating mask 104 and / or the mask holder 106 can comprise a magnetic field source. Alternatively or additionally, the coating mask 104 or the mask holder 106 can comprise a magnetizable material. The magnetic field source can be provided, for example, by means of a magnetized material.

[0102] The magnetizable material and / or magnetized material can generally be a material whose magnetization (i.e., its magnetic order) follows an external magnetic field, such that the magnetic field (i.e., its flux density) is stronger inside than outside. The magnetizable material can be magnetized by an external magnetic field and / or by a current flow, such that the magnetic flux density inside increases compared to the outside, thereby exerting an attractive force that draws the magnetizable material in the direction of the higher field strength (illustratively, "into the magnetic field"), e.g., toward the magnetic field source.

[0103] The magnetic permeability of the magnetizable material and / or the magnetized material may, for example, be greater than approximately 10, e.g., greater than approximately 10 2 , e.g. larger than about 10 3 , e.g. larger than about 104 , e.g. larger than about 10 5 , e.g. larger than about 10 6 .

[0104] For example, the magnetizable material may comprise or be formed from a (e.g., soft magnetic) ferromagnetic material and / or a (e.g., soft magnetic) ferrimagnetic material, e.g., ferromagnetic steel. For example, the magnetized material may comprise or be formed from a (e.g., hard magnetic) ferromagnetic material and / or a (e.g., hard magnetic) ferrimagnetic material, e.g., a magnetic material.

[0105] For example, the material of the mask holder 106 and / or the coating mask 104 may comprise or be formed from at least iron, e.g., a (e.g., magnetizable) alloy (e.g., steel) comprising iron.

[0106] The magnetized material can be configured to generate a (e.g., permanent) magnetic field, i.e., provide a magnetic field source. The magnetizable material can indeed have residual magnetization and thus also generate a (significantly small) magnetic field itself. However, its magnetization can be modified by the magnetized material. Alternatively, the magnetizable material can also act as a magnetic field source, e.g., by being part of an electromagnet (in other words, the magnetic field source can be an electric magnetic field source).

[0107] According to various embodiments, the coating mask 104 and the mask holder 106 may comprise a different type of magnetic material, simplifying the construction. For example, the coating mask may comprise or be formed from the soft magnetic and / or magnetizable material, and the mask holder 106 may comprise or be formed from the hard magnetic and / or magnetized material (or vice versa).

[0108] Likewise, both the coating mask 104 and the mask holder 106 may comprise or be formed from the same type of magnetic material, e.g., the magnetized material or the magnetizable material.

[0109] By means of the magnetic interaction 115, the coating mask 104 can be pulled toward the receiving area 113. In other words, the magnetic attraction force acting on the coating mask 104 can act in the direction of the receiving area 113.

[0110] The clamping structure 108 may have a lower magnetic permeability than the mask holder 06 and / or than the coating mask 104, e.g., less than approximately 10, e.g., in a range of approximately 1 (e.g., greater than 0.9) to approximately 10 (also referred to as non-magnetic or amagnetic).

[0111] The clamping structure 108 may, for example, comprise or be formed from a paramagnetic material (such as aluminum) and / or a diamagnetic material (such as copper). Alternatively or additionally, the clamping structure 108 may comprise or be formed from stainless steel.

[0112] According to various embodiments, the attractive force (e.g., when the coating mask 104 and the mask holder 106 are coupled together) may be smaller than the clamping force (e.g., the weight of the weighting element).

[0113] Fig. 1B illustrates a coating mask holding structure 100b in a schematic side view or cross-sectional view according to various embodiments, e.g., its coating mask 104 or its mask holder 106.

[0114] According to various embodiments, the coating mask 104 and / or the mask holder 106 may include a plurality of magnets 124 comprising or formed from the hard magnetic material (e.g., the magnetic material). The plurality of magnets 124 may be held by a plate and / or embedded therein.

[0115] For example, only the mask holder 106 may include or be formed from the plurality of magnets 124. Then, the coating mask 104 may include or be formed from the soft magnetic material (e.g., magnetic steel). This simplifies the design.

[0116] The plurality of magnets 124 may, for example, have a coercive field strength greater than about 500 kiloamperes per meter (kA / m), e.g., greater than about 1000 kA / m, and / or a material comprising a rare earth metal (such as neodymium, samarium, praseodymium, dysprosium, terbium, and / or gadolinium), iron, cobalt, and / or nickel.

[0117] For example, each magnet of the plurality of magnets 124 may include or be formed from a rare earth magnet (such as neodymium-iron-boron (NdFeB)) or samarium-cobalt (SmCo)), a ferrite magnet (e.g., hard ferrite magnet), a Bismanol magnet, and / or an aluminum-nickel-cobalt magnet.

[0118] The substrate carrier 100a can be oriented generally horizontally or in a manner other than horizontal (e.g., vertically or obliquely), e.g., while the substrate is being coated. The coupled coating mask 104 and mask holder 106 can, for example, hold each other in any orientation of the substrate holder 100a, e.g., against their weight.

[0119] Fig. 1C illustrates a coating mask 104 in a schematic side view or cross-sectional view according to various embodiments.

[0120] According to various embodiments, the coating mask 104 may have a plurality of (e.g., linear) through-openings 104o. The through-openings 104o may be arranged in a pattern (e.g., equidistant from one another). A coating material, with which the substrate is coated (structured), can pass through the through-openings 104o to the substrate.

[0121] For example, the coating mask 104 may comprise or be formed from a shadow mask.

[0122] Fig. 2A illustrates a coating mask support structure 200a in a schematic side view or cross-sectional view according to various embodiments.

[0123] The receiving area 113 can be arranged between the mask holder 106 and the coating mask 104 when the mask holder 106 and the coating mask 104 are coupled to one another by means of the magnetic interaction 115 or for coupling them to one another. The attractive force Fa exerted on the coating mask by means of the magnetic interaction 115 can, for example, be greater than the weight force Fg of the coating mask 104 when the mask holder 106 and the coating mask 104 are coupled to one another by means of the magnetic interaction 115.

[0124] According to various embodiments, the mask holder 106 and the coating mask 104 may press toward the receiving area 113 (e.g., against the substrate therein) with the attractive force Fa.

[0125] The coating mask support structure 200a can be oriented generally horizontally or in a manner other than horizontal (e.g., vertically or obliquely), e.g., while the substrate is being coated. The coupled coating mask 104 and mask holder 106 can, for example, hold each other and / or the weighting element 204 in place in any orientation of the substrate holder 200c.

[0126] Fig. 2B illustrates a clamping structure 108 in a schematic side view or cross-sectional view according to various embodiments.

[0127] For example, the clamping structure 108 may be or become arranged between the mask holder 106 and the coating mask 104 when the mask holder 106 and the coating mask 104 are or are to be coupled together.

[0128] According to various embodiments, the clamping structure may include a substrate support surface 202 that delimits the receiving area 113 in the direction of the coating mask 104. The substrate arranged in the receiving area 113 may be in physical contact with the substrate support surface 202, e.g., resting thereon.

[0129] The substrate support surface 202 can be provided by means of a plurality of support segments 202a.

[0130] For example, the substrate support surface 202 (or the support segments 202a) may have a larger coefficient of friction with respect to the substrate than the coating mask 104. This may further inhibit displacement of the substrate when the coating mask 104 is applied.

[0131] For example, the substrate support surface 202 (or the support segments 202a) can be provided using a polymer (e.g., an elastomer), e.g., a rubber or a silicone. For example, the support segments 202a (e.g., polymer support segments 202a) can comprise or be formed from the polymer.

[0132] Furthermore, the clamping structure 108 can include a (e.g., plate-shaped) weighting element 204 configured to transmit a force (also referred to as a clamping force) to the substrate for clamping the substrate. The clamping force can, for example, essentially be the weight of the weighting element 204. Alternatively or additionally, other force-generating mechanisms can be provided by means of the clamping structure 108, e.g., by means of a spring element or the like. The gravitationally acting weighting element 204 simplifies the mechanics of the clamping structure 108.

[0133] For example, the weighting element 204 can at least partially cover the receiving area 113.

[0134] For example, the weighting element 204 may comprise or be formed from a non-magnetic material, e.g., non-magnetic steel, aluminum, copper, and / or a plastic. Alternatively or additionally, the weighting element 204 may comprise a weight (or provide a weight force) that correlates to a weight force greater than the separation force, e.g., greater than 1.3 times the separation force, and / or greater than the weight of the mask holder 106.

[0135] For this purpose, the receiving area 113 can be or become horizontally oriented for clamping. If the coating mask 104 and the mask holder 106 are coupled together, the orientation can be changed. For example, the substrate can be or become transported and / or coated in the receiving area 113 in a horizontal orientation or in a different orientation (e.g., vertical or oblique).

[0136] Fig. 2C illustrates a substrate carrier 200c in a schematic side view or cross-sectional view according to various embodiments (e.g., viewed along its longitudinal extent and / or width extent), e.g., the previously described substrate carrier 100a.

[0137] The substrate carrier 200c can have a connecting structure 208 that connects the weighting element 204 to the mask holder 106 (e.g., mechanically), e.g., to form a coherent assembly. The connecting structure 208 can hold the weighting element 204 and the mask holder 106 movable relative to one another, meaning that their distance from one another can be changed without having to break the connection.

[0138] In a horizontal orientation of the receiving area 113 during clamping of the substrate (as described above), the weighting element 204 can be or can be suspended from the mask holder 106 by means of the connecting structure 208 (e.g., when the mask holder 106 is arranged below the connecting structure 208).

[0139] This makes it possible, in one process, to first displace only the mask holder 106 away from the receiving area 113 (e.g., to lift it if the substrate carrier 200c is aligned horizontally) and, as soon as the distance 208a is reached, to displace the weighting element 204 away from the receiving area 113 together with the mask holder 106 (e.g., to lift it). This allows the mechanics to be simplified even further. Illustratively, in a first step, in which the mask holder 106 is displaced away, the coating mask 104 is uncoupled from the mask holder 106, and in a second step, in which the weighting element 204 is displaced away, the receiving area 113 is exposed (e.g., to release the substrate).

[0140] The connecting structure 208 can limit the distance 208a between the weighting element 204 and the mask holder 106, e.g., in a form-fitting manner. For example, the connecting structure can be a joint, e.g., a sliding joint as shown in Fig. 2C, which connects the weighting element 204 to the mask holder 106. The sliding joint can have a limiter (e.g., a head) that limits a distance displaceable by means of the sliding joint to the distance 208a.

[0141] In general, other joints can also be used. The sliding joint simplifies the mechanics and / or manufacturing.

[0142] For example, the distance 208a can be in a range from approximately 0.5 cm (centimeters) to approximately 5 cm, e.g., in a range from approximately 1 cm to approximately 2 cm, e.g., less than or equal to 1.6 cm. The smaller the distance 208a, the easier it is to insert the substrate carrier 200c into a flat vacuum chamber.

[0143] Fig. 3A illustrates a substrate carrier 300a in a schematic side view or cross-sectional view according to various embodiments, e.g., one of the previously described substrate carriers 100a to 200c.

[0144] The substrate carrier 300a can have a coupling structure 302 for mechanically coupling the mask holder 106. The coupled mask holder 106 can be held in a fixed position relative to the receiving area 113 by means of the coupling structure 302. For example, the coupling structure 302 can have a plurality of engagement portions 302 (e.g., projections) configured to mesh with corresponding engagement portions 116 (e.g., recesses or through-openings) of the mask holder 106 to establish the mechanical coupling.

[0145] For example, the coupling structure 302 can have a guide structure (e.g., having one or more linear guides) that provides the mask holder with exactly one translational degree of freedom 311. By means of the coupling structure 302, the coupling and / or uncoupling of the mask holder 106 relative to the receiving area 113 can be guided along the translational degree of freedom 311.

[0146] The translational degree of freedom 311 can be transverse to the receiving area 113 (e.g. the support surface), e.g. to its longitudinal extent.

[0147] For example, the coupling structure 302 may have a plurality of pins 302 onto which the mask holder 106 may be or can be plugged.

[0148] The coupling structure 302 may, for example, be part of or attached to a frame, as will be described in more detail later.

[0149] By means of the coupling structure 302, transverse forces acting on the mask holder 106 can be absorbed, e.g., when the orientation of the substrate carrier 300a is changed, and / or a reversible and / or reproducible magnetic coupling of the coating mask 106 can be simplified.

[0150] Fig. 3B illustrates a substrate carrier 300b in a schematic side view or cross-sectional view according to various embodiments, e.g., one of the previously described substrate carriers 100a to 300a.

[0151] The substrate carrier 300b can have a clamping structure 304, by means of which the coating mask 104 is pre-tensioned. This can inhibit the formation of wrinkles when the coating mask 104 is applied to the receiving area (or to a substrate therein) and / or due to thermal expansion.

[0152] The clamping structure 304 can, for example, comprise one or more resilient clamping elements (e.g., springs, e.g., disc springs) that are deflected from their rest position against a restoring force. The restoring force provided by the clamping structure 304 can pre-tension the coating mask 104 (e.g., counteract its deflection).

[0153] The clamping structure 304 can, for example, be configured to accommodate a change (e.g., change in length) of the coating mask 104 caused by thermal expansion.

[0154] The tensioning structure 304 may, for example, be part of a frame 306 or be attached thereto, as will be described in more detail later.

[0155] The clamping structure 304 (e.g., its restoring force) can optionally be retensioned, e.g., by means of at least one actuator (e.g., at least one clamping bar). This allows the pretension of the coating mask 104 to be adjusted.

[0156] The clamping structure 304 can optionally transmit a first restoring force along a first direction to the coating mask 104 (e.g., by means of a first clamping element) and / or transmit a second restoring force along a second direction to the coating mask 104 (e.g., by means of a second clamping element). The first direction and the second direction can be transverse to each other (e.g., a biaxial clamping structure 304).

[0157] Fig. 3C illustrates a substrate carrier 300c in a schematic side view or cross-sectional view according to various embodiments, e.g., one of the previously described substrate carriers 100a to 300b.

[0158] The substrate carrier 300c may have a shielding structure 308. The coating mask 104 may be arranged between the receiving area 113 and the shielding structure 308.

[0159] The shielding structure 308 can, for example, be multi-layered. The multi-layered shielding structure 308 can have at least one (ie, exactly one or more than one) shielding layer 308a, 308b, e.g., a plurality of shielding layers 308a, 308b.

[0160] The at least one shielding layer 308a, 308b can, for example, be or become thermally insulated from the coating mask 104 (e.g., by means of a spacing therefrom and / or by means of a thermally insulating material). Alternatively or additionally, the plurality of shielding layers 308a, 308b can be thermally insulated from one another (e.g., by means of a spacing therefrom and / or by means of a thermally insulating material).

[0161] A heat shield can be provided by means of the at least one thermally insulated shielding layer 308a, 308b. A multi-stage heat shield can be provided by means of the plurality of thermally insulated shielding layers 308a, 308b. This enables better heat shielding of the coating mask 104 and / or the substrate.

[0162] For example, the (e.g. multi-layer) shielding structure 308 (e.g. each shielding layer 308a, 308b) may have a plurality of through-openings 308o which are aligned with the through-openings 104 of the coating mask 104 and / or at least partially expose them.

[0163] Optionally, the shielding structure 308 can be non-magnetic. Alternatively, the shielding structure 308 can also be magnetic.

[0164] Fig. 4 illustrates a substrate carrier 400 in a schematic plan view (viewed toward the receiving area 113, e.g., transverse to its longitudinal extent and its width extent) according to various embodiments, e.g., one of the previously described substrate carriers 100a to 300c.

[0165] The substrate carrier 400 may include a frame 306. The frame 306 may surround the receiving area 113. Optionally, the frame 306 may support at least part of the clamping structure (e.g., the support surface) and / or the coating mask 104.

[0166] For example, the clamping structure may be attached to the frame 306. Alternatively or additionally, the coupling structure may be attached to the frame 306.

[0167] Optionally, the frame 306 may include an alignment structure 902 in the receiving area 113. The alignment structure 902 may, for example, include at least (ie, exactly or more than) one alignment segment. By means of the alignment structure 902, a substrate, regardless of its size, may be aligned in the receiving area 113, e.g., by placing the substrate against the alignment structure 902 (e.g., by bringing it into physical contact with it).

[0168] Fig. 5A illustrates a transport assembly 500a in a schematic side view or cross-sectional view according to various embodiments.

[0169] The transport arrangement 500a may comprise a substrate carrier 502, e.g., one of the previously described substrate carriers 100a to 400, which is configured to transport a substrate therein. Furthermore, the transport arrangement 500a may comprise a transport device 504 for transporting the substrate carrier 502 along a transport path 111 (e.g., in a transport direction 111).

[0170] The transport device 504 can, for example, comprise or be formed from a horizontal transport device 504 which is configured to transport the substrate carrier 502 in a horizontal orientation (ie lying flat, wherein, for example, its weight force is substantially transverse to its longitudinal extent and its width extent).

[0171] The transport device 504 can, for example, have a plurality of rotatably mounted transport rollers 504t, of which, for example, at least one transport roller 504t is coupled to a drive.

[0172] For example, the transport device 504 may comprise or be formed from a belt conveyor transport device. The belt conveyor transport device may comprise at least one conveyor belt 504b, which is guided by means of the plurality of transport rollers 504t. The substrate carrier 502 may be or be transported lying on the conveyor belt 504b, as shown in Fig. 5A is illustrated.

[0173] Alternatively or additionally, the transport device 504 may comprise or be formed from a roller conveyor transport device (not shown). The roller conveyor transport device may comprise a plurality of transport rollers 504t on which the substrate carrier 502 rests during transport.

[0174] However, the transport device 504 can also comprise or be formed from a vertical transport device 504 which is configured to transport the substrate carrier 502 in a vertical orientation (ie upright or hanging, wherein, for example, its weight is substantially parallel to its longitudinal extent or to its width extent).

[0175] According to various embodiments, the transport device 504 can provide a self-contained transport path 111 along which the substrate carriers 502 are transported (also referred to as a carrier return system).

[0176] The self-contained transport path 111 can, for example, have a first section, along which the substrate carrier 502 carries a substrate and, for example, the substrate is coated. The self-contained transport path 111 can further have a second section, along which the substrate carrier 502 does not carry a substrate and / or is empty. A loading area can be or will be arranged downstream of the second section and upstream of the first section, in which a substrate can be or will be brought into the substrate carrier 502. A unloading area can be or will be arranged downstream of the first section and upstream of the second section, in which the substrate can be or will be brought out of the substrate carrier 502.

[0177] Fig. 5B and Fig. 5C each illustrate a transport arrangement 500b, 500c in a schematic side view or cross-sectional view according to various embodiments, e.g., the transport arrangement 500a.

[0178] The transport arrangement 500b, 500c can comprise a manipulator device 506, e.g., arranged in the loading area and / or the unloading area. The manipulator device 506 can be configured to move the substrate 102 out of the receiving area 113 and / or into it. For example, the manipulator device 506 can comprise a gripper arm 506a and a gripper 506g. Alternatively or in addition to the gripper arm 506a, the manipulator device 506 can comprise a lifting cylinder.

[0179] For example, the manipulator device 506 of the transport arrangement 500b may comprise or be formed from a mechanical gripper. Alternatively or additionally, the manipulator device 506 of the transport arrangement 500c may comprise a vacuum gripper.

[0180] In general, the manipulator device 506 may alternatively or additionally comprise another type of gripper, for example a rotary gripper, as will be described in more detail below.

[0181] For example, the manipulator device 506 of the transport arrangement 500b can additionally have a lifting device that lifts the substrate 102 out of the receiving area 113 through and / or past the coating mask. This simplifies gripping the substrate 102. Alternatively or additionally, the lifting device can be configured to adjust the clamping structure 108 and / or the coating mask holding structure 100b, e.g., in their configuration.

[0182] Fig. 6A and Fig. 6B each illustrate a transport arrangement 600a, 600b in a schematic side view or cross-sectional view according to various embodiments, e.g. one of the transport arrangements 500a to 500c.

[0183] According to various embodiments, the manipulator device 506 can be configured to cancel and / or establish (e.g., restore) the magnetic interaction by means of which the coating mask 104 is applied to the receiving area 113 (or the substrate 102 therein). For this purpose, the manipulator device 506 can, for example, be configured to adjust at least the coating mask holding structure 100b, e.g., in its configuration. Alternatively or additionally, the manipulator device 506 can optionally be configured to adjust the clamping structure 108, e.g., in its configuration.

[0184] For example, the manipulator device 506 can be configured to displace the mask holder 106 and / or the weighting element 204 (hereinafter also referred to as the element 106, 204 to be displaced). For this purpose, the gripper 506g of the manipulator device 506 can be configured to couple to the element 106, 204 to be displaced.

[0185] If the mask holder 106 and the weighting element 204 are connected to each other by means of the connecting structure 208 (compare Fig. 6B), these can be moved together. Alternatively, they can be moved individually and / or one after the other.

[0186] For example, the manipulator device 506 can have a rotary gripper 506g (e.g., having a rotatably mounted plate) configured to engage and / or encompass one or more tabs 506l of the element 106, 204 to be displaced, e.g., by rotating it into the tabs 506l. Alternatively or additionally, a different gripper type can be used, for example, one of the gripper types described above.

[0187] According to various embodiments, the manipulator device 506 can be configured to increase the distance between the mask holder 106 and the coating mask 104 to cancel the magnetic coupling between them (i.e., thereby reducing the attractive force between them) and / or to decrease it to establish the magnetic coupling between them (i.e., thereby increasing the attractive force between them). For example, the mask holder 106 and / or the weighting element 204 can be or be brought to the receiving area 113 (e.g., brought closer to it), e.g., placed on it, and / or be or be brought away from it (e.g., removed from it) by means of the manipulator device 506.

[0188] Alternatively, the mask holder 106 and / or the weighting element 204 can also be moved in a different way, e.g. by means of a device which reaches through or past the receiving area 113 from below.

[0189] Fig. 7 illustrates a vacuum assembly 700 in a schematic side view or cross-sectional view according to various embodiments.

[0190] The vacuum arrangement 700 can comprise a vacuum chamber 702 in which the transport path (e.g., its first section) is arranged. The vacuum chamber 702 can be provided by means of a chamber housing. For example, the chamber housing can comprise a plurality of vacuum chambers 702, e.g., arranged one behind the other along the transport path 111.

[0191] The loading area can be arranged, for example, in an additional vacuum chamber in which a vacuum is created. The unloading area can be arranged, for example, in an additional vacuum chamber in which a protective gas (e.g., an inert gas such as argon or nitrogen) is arranged. For example, the second section of the transport path can be arranged outside the vacuum chamber 702, e.g., in a return housing sealed off from the outside, in which the protective gas is arranged.

[0192] According to various embodiments, the chamber housing (also referred to as a vacuum chamber housing) can have one chamber (also referred to as a vacuum chamber) or multiple chambers. The chamber housing can, for example, be coupled to a pump arrangement, e.g., a vacuum pump arrangement, (e.g., gas-conducting), for providing a negative pressure or a vacuum (i.e., configured as a vacuum chamber housing), and can be configured so stably that it withstands the effects of air pressure in the pumped-out state. The pump arrangement (comprising at least one vacuum pump, e.g., a high-vacuum pump, e.g., a turbomolecular pump) can make it possible to pump out, i.e., remove, part of the gas from the interior of the processing chamber, e.g., from the vacuum region. Accordingly, one vacuum chamber or multiple vacuum chambers can be provided in one chamber housing. In other words, the chamber housing can be configured as a vacuum chamber housing.

[0193] According to various embodiments, a chamber housing, e.g. a vacuum chamber 702 provided therein, may be configured such that a pressure in a range of approximately 10 mbar to approximately 1 mbar (in other words, rough vacuum) may be provided therein, and / or a pressure in a range of approximately 1 mbar to approximately 10 -3 mbar (in other words fine vacuum), and / or a pressure in a range of approximately 10 -3 mbar to approximately 10 -7 mbar (in other words high vacuum) and / or a pressure less than high vacuum, e.g. less than approximately 10 -7 mbar.

[0194] The vacuum chamber 702 can be part of a vacuum system and / or coupled to the additional vacuum chambers to form a vacuum system. In the context of vacuum-generating or vacuum-maintaining vacuum components (e.g., a pump, a chamber, a line, a valve, etc.), the term "coupled" or "coupling" can be understood in the sense of a connection to a common vacuum system, for example, in the case of multiple vacuum chambers. The components of the vacuum system can be configured to exchange a gas with one another by means of the coupling, wherein the coupling can be interrupted or at least gas-separated from an exterior of the vacuum system and / or by means of a valve (e.g., a valve arrangement).

[0195] The vacuum arrangement 700 may further comprise a transport arrangement 704, e.g., one of the transport arrangements 500a to 600b. At least (ie, exactly or more than) one substrate may be transported in the substrate carrier 502 by means of the transport arrangement 704. For example, the substrate may comprise or be formed from a plate-shaped substrate, e.g., a glass pane, a wafer, or another plate-shaped substrate type.

[0196] Optionally, the vacuum arrangement may further comprise a coating material source 706, e.g., comprising a thermal evaporator. The coating material source 706 may be configured to emit 706e, e.g., to evaporate, a coating material in the direction of the transport path 111.

[0197] For example, the coating material may comprise or be formed from at least one of the following materials: a metal; a transition metal, an oxide (e.g., a metal oxide or a transition metal oxide); a dielectric; a polymer (e.g., a carbon-based polymer or a silicon-based polymer); an oxynitride; a nitride; a carbide; a ceramic; a semimetal (e.g., carbon); a perovskite; a glass or glass-like material (e.g., a sulfidic glass); a semiconductor; a semiconductor oxide; a semiorganic material, and / or an organic material. For example, the coating material may comprise or be formed from aluminum (Al), magnesium, titanium, tin (Zn), zinc, indium, silver, gold, and / or zirconium, or it may comprise or be formed from silicon (Si), boron, or germanium. Optionally, the coating material may comprise a dopant, e.g., Al.For example, a Zn coating material or Si coating material can be doped with Al.

[0198] According to various embodiments, the coating material source 706 can be configured to coat at least one substrate (i.e., exactly one substrate or more than one substrate), which is transported, for example, through the vacuum chamber 702 (e.g., a coating region therein). For example, the coating material source can be configured to provide a gaseous coating material (e.g., a material vapor) and / or liquid coating material, which can be deposited, for example, on the at least one substrate to form a layer. A coating material source can, for example, comprise at least one of the following: a sputtering device, a thermal evaporation device (e.g., a laser beam evaporator, an arc evaporator, an electron beam evaporator, and / or a thermal evaporator), a precursor gas source, and / or a liquid phase atomizer.A sputtering device can be configured to atomize the coating material using a plasma. A thermal evaporation device can be configured to convert the coating material into a gaseous state using thermal energy. Depending on the nature of the coating material, sublimation and / or evaporation of the coating material can occur. In other words, the thermal evaporation device can also sublimate the coating material. A liquid-phase atomizer can be configured to apply a coating material from the liquid phase, e.g., one containing or formed from a dye.

[0199] Fig. 8A and Fig. 8B illustrate a substrate carrier 502 in a schematic perspective view according to various embodiments in different configurations 502a, 502b of the coating mask holding structure 100b, between which it can be adjusted.

[0200] The coating mask 104 and the mask holder 106 may be configured to magnetically couple to each other by means of a magnetic interaction therebetween.

[0201] For example, the coating mask 104 and the mask holder 106 can be uncoupled (e.g., separated) from each other in a first configuration 502a (also referred to as uncoupled configuration 502a) of the coating mask holding structure and coupled (e.g., connected) to each other in a second configuration 502b (also referred to as coupled configuration 502b) of the coating mask holding structure. According to various embodiments, the substrate carrier 502 can be moved from the uncoupled configuration 502a to the coupled configuration 502b (or vice versa), e.g., by means of the manipulator device 506.

[0202] Optionally, in both the uncoupled configuration 502a and the coupled configuration 502b, the clamping structure 108 can be in a clamping configuration. In the clamping configuration, the clamping structure 108 can clamp the substrate, ie, transfer a clamping force to it.

[0203] To adjust 502v the substrate carrier 502 between the two configurations 502a, 502b, the mask holder 106 can be displaced, e.g. towards or away from the receiving area 113 (hidden in the illustration).

[0204] For example, in the uncoupled configuration 502a, the mask holder 106 can be arranged at a distance from the receiving area 113 and / or from the clamping structure 108 (e.g., its weighting element 204). Alternatively or additionally, in the uncoupled configuration 502a, a gap can be formed between the coating mask (hidden in the view) and the receiving area 113 (or the substrate arranged therein). For example, the coating mask can be bent (visually sagging) in the coupled configuration 502a, e.g., due to its weight.

[0205] For example, in the coupled configuration 502b, the mask holder 106 can be arranged adjacent to the receiving area 113 and / or in physical contact with the clamping structure 108 (e.g., its weighting element 204). Alternatively or additionally, in the coupled configuration 502b, the coating mask can be held against the receiving area (or the substrate arranged therein), e.g., against its weight and / or without a gap.

[0206] Optionally, the mask holder 106 can be connected to the clamping structure 108 (e.g., its weighting element 204), e.g., by means of the connecting structure 208. The connecting structure 208 makes it possible to adjust the clamping structure 108 by displacing the mask holder 106, e.g., between the clamping configuration and the changeable configuration.

[0207] If, for example, the mask holder 106 is moved further away from the receiving area 113 starting from the uncoupled configuration 502a (e.g. removed), the clamping structure 108 can be or will be brought from the clamping configuration into the change configuration.

[0208] Fig. 9 and Fig. 10 illustrate a substrate carrier 502 in various schematic perspective views (illustratively from above and from below) according to various embodiments.

[0209] According to various embodiments, the coating mask 104 can be prestressed along multiple directions by means of the tensioning structure 304. For example, the tensioning structure 304 can have at least one tensioning element (e.g., a tension spring) on ​​at least two adjacent sides of the coating mask 104, which couples the coating mask 104 to the frame 306.

[0210] According to various embodiments, the alignment structure 902 may include a plurality of pins (i.e., pins) in the receiving area 113.

[0211] According to various embodiments, the coupling structure 302 may have a plurality of pins protruding from the receiving area and / or directed away from the coating mask.

[0212] According to various embodiments, a plurality of support segments 202a (also referred to as displacement protection) can be or will be arranged in the receiving area 113.

[0213] Fig. 11 illustrates a substrate carrier 502 in a method 1100 according to various embodiments, e.g., one of the previously described substrate carriers 100a to 400.

[0214] According to various embodiments, the method 1100 may comprise, in 1101, clamping a substrate 102 in a receiving area 113 of the substrate carrier 502, such that the substrate is pre-fixed. Clamping may comprise transmitting a clamping force to the substrate 102, e.g., by means of the clamping structure 108. For example, the clamping force may be greater than the weight of the substrate and / or greater than the attractive force.

[0215] For example, clamping the substrate 102 may involve bringing a clamping structure 108 of the substrate carrier 502 into a clamping configuration. Alternatively or additionally, clamping the substrate 102 may involve pressing the substrate 102 against a substrate support surface 202 (e.g., against a plurality of support segments 202a) with the clamping force.

[0216] According to various embodiments, the method 1100 may include, in 1103, applying a coating mask 104 to the clamped substrate 102 by means of a magnetic interaction that is effected on the coating mask 104. The magnetic interaction may transfer a magnetic attractive force Fa to the coating mask 104, which is directed toward the receiving area 113 or the substrate 102 arranged therein. The application may include pressing the coating mask 104 against the substrate 102 by means of the attractive force Fa.

[0217] The method may optionally comprise, in 1105, coating the substrate 102 through the coating mask (e.g., its through-openings). The coating may comprise emitting 706e, e.g., evaporating, a coating material in the direction of the receiving region 113 or the substrate 102 arranged therein.

[0218] During coating, the coating mask 104 can be applied to the substrate 102, e.g., pressed against it. This allows for a sharper image transfer of the mask structure to the coating structure.

[0219] According to various embodiments, applying the coating mask may include bringing a mask holder closer to the coating mask.

[0220] Fig. 12 illustrates a substrate carrier 502 in a method 1200 according to various embodiments, e.g., one of the previously described substrate carriers 100a to 400.

[0221] According to various embodiments, the method in 1201, e.g., prior to clamping 1101, may include: bringing the substrate 102 into the receiving area 113. Bringing in 1201 may include placing the substrate 102 onto a substrate support surface 202 (e.g., onto a plurality of support segments 202a) and / or applying it to an alignment structure 902.

[0222] Alternatively or additionally, the method in 1201, e.g. after coating 1104, may comprise: removing the substrate 102 from the receiving area 113.

[0223] For insertion 1201 and / or removal 1201, clamping 1102 may be or become released, e.g., by releasing the clamping force transmitted to substrate 102. For example, releasing clamping 1102 may involve moving clamping structure 108 of substrate carrier 502 into a change configuration.

[0224] According to various embodiments, the method in 1203, e.g., applying the coating mask 104, may comprise: magnetically coupling the coating mask 104 by means of a magnetic interaction with a mask holder 106. The magnetic coupling of the coating mask 104 may comprise bringing the mask holder 106 closer to the coating mask 104, e.g., from a side of the receiving area 113 or the substrate 102 opposite the coating mask 104. For example, the mask holder 106 may be or become arranged on the side of the receiving area 113 or the substrate 102 opposite the coating mask 104.

[0225] Alternatively or additionally, the method in 1203, e.g., before removal 1201 and / or after coating 1105, may comprise: magnetically decoupling the coating mask 104 from the mask holder 106. The magnetically decoupling the coating mask 104 may comprise displacing the mask holder 106 away from the coating mask 104, e.g., away from the side of the receiving area 113 or the substrate 102 opposite the coating mask 104.

[0226] According to various embodiments, the method in 1205, eg, the clamping 1101, may comprise: placing a weighting element 204 (eg, a weight plate) on the substrate 102. The placing 1205 of the weighting element 204 may comprise effecting the clamping force at least partially (ie, partially or completely) by means of the weighting element 204, eg, by means of its weight force.

[0227] Alternatively or additionally, the method in 1205, e.g., after coating 1105 and / or after or together with decoupling 1203, may comprise: releasing the clamping (e.g., releasing the substrate 102). Releasing the clamping may comprise at least partially (ie, partially or completely) removing the clamping force, e.g., by displacing the weighting element away from the receiving region 113 or the substrate 102 therein.

[0228] Optionally, the method, e.g., in 1201, 1203, and / or 1205, may include pre-tensioning and / or post-tensioning of the coating mask. For example, the coating mask 104 may be tensioned for flatness and / or post-tensioned (e.g., automatically) for wrinkle-free compensation during thermal expansion (i.e., to compensate for thermal expansion). This can inhibit and / or prevent the coating mask 104 from lifting off the substrate.

[0229] Fig. 13 and Fig.14 illustrate a substrate carrier 502 in a method 1300 according to various embodiments, e.g., one of the previously described substrate carriers 100a to 400.

[0230] The method 1300 may comprise in 1301 to 1307: introducing a substrate into the substrate carrier.

[0231] The introduction of a substrate may comprise in 1301: providing the substrate carrier, which has a weighting plate 204.

[0232] The insertion may comprise in 1303: displacing a mask carrier 106 away from the weighting plate 204 (e.g., lifting it).

[0233] The insertion can comprise, in 1305, exposing a receiving area of ​​the substrate carrier. The exposing can comprise displacing (e.g., lifting) the weighting plate 204 away from the receiving area 113, e.g., by displacing (e.g., lifting) the mask carrier 106 together with the weighting plate 204 away from it. For example, the weighting plate 204 can be suspended from the mask carrier 106 by means of the connecting structure 208.

[0234] The insertion may comprise in 1307: arranging a substrate 102 in the receiving area 113, e.g. placing the substrate 102 in a frame 306 of the substrate carrier.

[0235] After arranging the substrate 102 in the receiving area 113, the clamping 1101 of the substrate and the application 1103 of the coating mask 104 can take place as described above.

[0236] Alternatively or in addition to the insertion, the method 1300 may comprise in 1301 to 1307: removing the substrate from the substrate carrier.

[0237] The method may include, in 1301, providing the substrate carrier, in which, for example, the substrate is arranged (hidden in view). The substrate may be clamped in the substrate carrier, for example, by means of a weighting plate 204.

[0238] The method may comprise in 1303 and 1305: exposing the substrate.

[0239] The method may include, in 1303, displacing a coating mask (hidden in view) away from the receiving area 113 or the substrate. Displacing may include releasing a magnetic coupling by means of which the coating mask is pressed against the substrate (e.g., in 1301). Releasing the magnetic coupling may include displacing (e.g., lifting) a mask carrier 106 away from the receiving area 113 or the substrate.

[0240] In 1303, the substrate may be clamped by means of one of the weighting plates 204.

[0241] The method may include, in 1305, releasing the clamping. For example, releasing the clamping may include bringing a clamping structure 108 of the substrate carrier 502 into a change configuration. Releasing may include, for example, displacing (e.g., lifting) the weighting plate 204 away from the substrate 102, e.g., by displacing the mask carrier 106 together with the weighting plate 204 (e.g., lifting it from the substrate). For example, the weighting plate 204 may be suspended from the mask carrier 106 by means of the connecting structure 208.

[0242] The method may include in 1307: displacing the substrate 102 from the substrate carrier.

[0243] According to various embodiments, the application of the coating mask can comprise: pulling the coating mask (e.g. comprising or formed from magnetic stainless steel) by means of a magnetic field of the mask holder 106 (e.g. comprising or formed from a magnetic plate 106) for the purpose of gap-free application of the coating mask 104 to the coating side of the substrate 102. According to various embodiments, a weight plate suspended underneath (i.e. weight plate 204 hanging below and on the mask holder 106) can be used for the purpose of precisely loading the substrate 102, so that when the magnetic forces are released by lifting the mask holder 106, displacement (e.g. due to movement) of the substrate 102 is inhibited, e.g. so that movement of the substrate 102 is prevented.

Claims

[1] Substrate carrier (502, 100a to 400), comprising: • a receiving area (113); • a coating mask (104) which is arranged to be applied to the receiving area (113) by means of a magnetic interaction; • a mask holder (106) which is arranged to effect the magnetic interaction; and • a clamping structure (108) for clamping the substrate in the receiving area (113) so that it is pre-fixed when the coating mask (104) is applied; • wherein the clamping structure (108) has a weighting element (204) which is configured to cause a force for clamping which is substantially the weight of the weighting element (204). [2] Substrate carrier (502, 100a to 400) according to claim 1, wherein the coating mask (104) comprises a magnetizable or magnetized material; and / or wherein the mask holder (106) comprises a magnetizable or magnetized material. [3] Substrate carrier (502, 100a to 400) according to claim 2, wherein the material is hard magnetic. [4] Substrate carrier (502, 100a to 400) according to one of claims 1 to 3, wherein the clamping structure (108) has a lower magnetic permeability than the coating mask (104). [5] Substrate carrier (502, 100a to 400) according to one of claims 1 to 4, wherein the clamping structure (108) has a substrate support surface (202) which delimits the receiving area (113) in the direction of the coating mask (104). [6] Substrate carrier (502, 100a to 400) according to claim 5, wherein the substrate support surface (202) has a greater coefficient of friction with respect to the substrate than the coating mask (104) and / or than the weighting element (204). [7] Substrate carrier (502, 100a to 400) according to one of claims 1 to 6, further comprising: a clamping structure (304) by means of which the coating mask is mounted in a pre-tensioned manner. [8] Substrate carrier (502, 100a to 400) according to claim 7, further comprising: a connecting structure (208) which connects the weighting element to the mask holder (106) in such a way that their distance from one another is limited by means of the connecting structure (208). [9] Transport arrangement (500a to 500c, 600a), comprising: • a substrate carrier (502, 100a to 400) according to one of claims 1 to 8, and • a transport device (504) for transporting the substrate carrier (502, 100a to 400) along a transport path (111). [10] Vacuum arrangement, comprising: • a transport arrangement (500a to 500c, 600a) according to claim 9; and • a vacuum chamber in which the transport path (111) is arranged. [11] Method (1100), comprising: • clamping (1101) a substrate (102) in a receiving area (113) of a substrate carrier (502, 100a to 400) by means of a weight force of a weighting element (204), so that the substrate (102) is pre-fixed; and • Applying (1103) a coating mask (104) to the clamped substrate (102) by means of a magnetic interaction which is effected on the coating mask (104). [12] The method (1100) of claim 11, further comprising: Pre-tensioning and / or post-tensioning of the coating mask (104).

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