Electron beam evaporation coating equipment and application method thereof

Abstract

The invention relates to electron beam evaporation coating equipment and an application method thereof. The electron beam evaporation coating equipment comprises an evaporation chamber, an electron gun system, a first vacuumizing system, a heating table mechanism, a sample table mechanism and an ion source system, the sample table mechanism is rotationally connected with the heating table mechanism, and the sample table mechanism comprises a substrate clamping part for clamping a substrate; the ion source system is connected with the top of the evaporation chamber and is used for cleaning the substrate; the first driving system is used for driving the first rotating shaft to rotate; the second driving system is used for driving the second rotating shaft to rotate; the second rotating shaft drives the heating table mechanism and the sample table mechanism to synchronously and integrally overturn; and when the sample table mechanism turns over to enable the substrate clamping part to be opposite to the ion source system, the substrate can be placed, cleaned and turned over. The device can be turned over to a specific angle, the interaction between film bases can be improved through special dip angle film coating, and the binding force is improved. The sample table mechanism can turn over to enable the substrate to directly face the ion source system.

Description

Technical Field

[0001] The invention relates to the technical field of thin film preparation, and in particular to an electron beam evaporation coating device and an application method thereof. Background Art

[0002] The working principle of electron beam evaporation coating is to bombard the evaporation material with a high-energy electron beam generated by an electron gun in a high vacuum environment, so that it evaporates under heat and deposits on the surface of the substrate to form a thin film. The electron emission cathode inside the electron gun emits electrons under the action of heating or other means. These electrons are accelerated to a very high speed under the action of the strong electric field formed by the accelerating anode, obtain high energy, and form an electron beam. At the same time, the electron beam is focused by the magnetic field generated by the focusing coil to become a high-energy electron beam with a certain energy density and beam spot size. The focused high-energy electron beam is guided into the crucible containing the evaporation material, and the electron beam interacts with the atoms or molecules of the evaporation material. The high energy of the electron beam is transferred to the evaporation material, so that its atoms or molecules obtain enough energy to begin to vibrate violently, thereby rapidly increasing the temperature of the material, melting after reaching the melting point, and continuing to heat it will evaporate it into gaseous atoms or molecules. Since the entire process is carried out in a high vacuum environment, the gaseous atoms or molecules of the evaporation material can move in a straight line with a high free path and will not collide with a large number of air molecules and scatter. The evaporated gaseous atoms or molecules move toward the substrate surface at a certain speed. When they reach the substrate surface, they will undergo processes such as adsorption, migration and condensation. On the substrate surface, the gaseous atoms or molecules gradually lose energy and begin to adsorb and stay at a specific position on the substrate surface. As more and more atoms or molecules reach the substrate surface, they will combine with each other and gradually form a continuous film. By controlling parameters such as coating time and evaporation rate, the thickness and quality of the film can be controlled.

[0003] Application publication number: CN117127152A, application date: 2023.08.25, the invention name is an electron beam evaporation coating device and an evaporation coating method, the invention body is an electron beam evaporation mechanism, an electron beam evaporation coating device and a method with the above evaporation mechanism, the electron beam evaporation mechanism includes an assembly base located at the bottom and symmetrically arranged, the assembly base is installed with a fixed structure of the entire electron beam evaporation mechanism, and two cooling water pipe interfaces are provided at the rear of the mechanism; a crucible is provided in the central part of the mechanism, and the evaporation coating material is placed in the crucible, and the electron gun motor is connected to the electron gun target gun head to evaporate the evaporation coating material. This invention improves the efficiency of the evaporation process and extends the service life of the equipment.

[0004] Although the above-mentioned prior art can clean the workpiece in the process chamber, the workpiece tray cannot be turned over and the workpiece cannot face the ion source, so the cleaning effect cannot be guaranteed, resulting in reduced purity of the film and affecting the optical, electrical and other properties of the film. Since the process chamber space is small and the workpiece table cannot be turned over, the workpiece is coated at a special angle.

[0005] In addition, when replenishing materials, a robot is required to take samples from the sample chamber and then transfer them to the electron beam coating process chamber, so an additional sample chamber needs to be designed and manufactured. The existence of two chambers makes the structure of the equipment more complicated, and the maintenance workload and difficulty increase accordingly. The sample chamber and connecting parts need to be regularly maintained, serviced and repaired, and parts that may fail need to be replaced, which will lead to an increase in maintenance costs. Summary of the invention

[0006] In view of the defects of the above-mentioned prior art that the workpiece cannot be flipped, the workpiece is not cleaned thoroughly, the special angle coating process cannot be performed, and a separate sampling chamber needs to be set up, which increases the complexity of the equipment, the purpose of the present invention is to provide an electron beam evaporation coating device and its application method that can flip the sample stage mechanism to fully clean the substrate, and at the same time, the sample stage mechanism can be flipped to perform a special angle coating process, and the evaporation material can be transferred without setting up a sampling chamber.

[0007] The technical solution provided by the present invention is:

[0008] An electron beam evaporation coating device, comprising:

[0009] An evaporation chamber, which provides a space for depositing a thin film on a substrate;

[0010] An electron gun system, the electron gun system is connected to the bottom of the evaporation chamber, the electron gun system is used to emit an electron beam, the electron beam is used to impact the material in the crucible and evaporate the material, the crucible is located in the evaporation chamber and below the substrate;

[0011] A first vacuum pumping system, which is connected to a flange on one side of the evaporation chamber and is used to provide the evaporation chamber with an ultra-vacuum environment;

[0012] It also includes a heating platform mechanism, which is located in the evaporation chamber and is used to heat the substrate;

[0013] A sample stage mechanism, which is rotatably connected to the heating stage mechanism and is located outside the heating stage mechanism, and includes a substrate clamping portion for clamping a substrate;

[0014] An ion source system, the ion source system is connected to the top flange of the evaporation chamber, and the ion source system is used for cleaning the substrate;

[0015] A first driving system, the first driving system is located outside the evaporation chamber and is used to drive the first rotating shaft to rotate, and the first rotating shaft drives the sample stage mechanism to rotate around the central axis of the substrate clamping portion;

[0016] A second driving system, which is located outside the evaporation chamber and is used to drive the second rotating shaft to rotate, and the second rotating shaft drives the heating stage mechanism and the sample stage mechanism to turn over synchronously as a whole;

[0017] When the sample stage mechanism is flipped so that the substrate clamping portion faces the ion source system, the substrate can be placed, cleaned and flipped.

[0018] Furthermore, the first rotating shaft is rotatably connected to the second rotating shaft, and the first rotating shaft is disposed inside the second rotating shaft;

[0019] The ends of the first rotating shaft and the second rotating shaft are both located in the evaporation chamber, and the end of the first rotating shaft extends out of the second rotating shaft.

[0020] Further, the positioning assembly is rotationally connected to the first rotating shaft;

[0021] One end of the positioning component is fixedly connected to the end of the second rotating shaft, and the other end is fixedly connected to the heating stage mechanism, and is also rotationally connected to the sample stage mechanism;

[0022] When the second rotating shaft rotates, the sample stage mechanism and the heating stage mechanism are synchronously turned over as a whole through the positioning assembly.

[0023] Further, one end of the second driving system is fixedly connected to the first flange on one side of the evaporation chamber, and the other end is connected to the rotating ring;

[0024] One end of the rotating ring is fixedly connected to the second rotating shaft, the second rotating shaft passes through the first flange and enters the interior of the evaporation chamber, and the second rotating shaft is rotatably connected to the first flange;

[0025] The other end of the rotating ring is connected to the adapter flange, and the adapter flange is fixedly connected to the first driving system;

[0026] The second driving system drives the rotating ring to rotate together with the second rotating shaft, driving the adapter flange to rotate synchronously with the first driving system.

[0027] Further, the first rotating shaft is connected to the sample stage mechanism via a transfer shaft;

[0028] The end of the first rotating shaft away from the first driving system is fixedly connected to a driving wheel; the end of the adapter shaft away from the sample stage mechanism is fixedly connected to a driven wheel;

[0029] One end of the adapter shaft close to the sample stage mechanism is fixedly connected with a driving bevel gear, and the sample stage mechanism is provided with a driven bevel gear;

[0030] The driving wheel is meshed with the driven wheel, and the driving bevel gear is meshed with the driven bevel gear. When the first rotating shaft rotates, the transfer shaft and the sample platform mechanism are driven to rotate.

[0031] Furthermore, the sample stage mechanism further comprises a sample rotating shaft, and the driven bevel gear is sleeved on the outer wall of the sample rotating shaft and fixedly connected to the sample rotating shaft;

[0032] The supporting platform is fixedly connected to the end of the sample rotation axis;

[0033] The substrate clamping portion is connected to the support platform via a support rod;

[0034] Wherein, the supporting platform is located between the substrate clamping portion and the driven bevel gear.

[0035] Further, the substrate clamping portion includes a pair of fixed pressing plates and a pair of movable pressing plates; wherein the movable pressing plates are located between the fixed pressing plates and the supporting platform;

[0036] The two ends of the support rod are respectively fixedly connected to the support platform and the fixed pressing plate;

[0037] The movable pressing plate is provided with a plurality of through holes for the support rods to pass through;

[0038] The elastic component is sleeved on the support rod, and one end of the elastic component is fixed on the support platform, and the other end is fixed on the movable pressing plate; the elastic component is used to make the movable pressing plate slide vertically along the support rod.

[0039] Furthermore, when the fixed pressing plate is in contact with the movable pressing plate, the elastic component is in a natural state or a compressed state;

[0040] When the fixed pressing plate is separated from the movable pressing plate, the elastic component is in a compressed state;

[0041] When the substrate clamping portion is opposite to the ion source system, the pressing mechanism is used to press down the movable pressing plate.

[0042] Furthermore, the pressing mechanism is connected to the top of the evaporation chamber through a top flange assembly, and the pressing mechanism includes a third driving system and a linear module fixedly connected to the third driving system; the linear module is fixed on the top flange assembly;

[0043] The pressing mechanism also includes a slider that moves vertically along the linear module; the third driving system is used to drive the slider to move vertically along the linear module.

[0044] Furthermore, the pressing mechanism also includes a platform fixedly connected to the slider, and a pair of movable rod assemblies are symmetrically arranged on both sides of the platform, and the movable rod assemblies pass through the top flange assembly and extend into the interior of the evaporation chamber.

[0045] Further, the movable rod assembly includes a moving rod and a transfer platform;

[0046] Wherein, the transfer platform is fixedly connected to an end of the moving rod away from the platform;

[0047] A pair of pressing hands are arranged on the transfer platform, and the pressing hands are used to press down the movable pressing plate.

[0048] Furthermore, the device also includes a material conveying system connected to a flange on one side of the evaporation chamber, the material conveying system includes a fourth drive system and a screw connected to the fourth drive system; the screw is threadedly connected to the translation assembly, and the translation assembly is magnetically coupled to the sample transfer rod assembly;

[0049] The fourth driving system drives the screw to rotate, and the screw drives the translation assembly and the sample transfer rod assembly to move horizontally along the guide shaft;

[0050] The guide shaft is hollow and parallel to the lead screw; the translation assembly is sleeved on the guide shaft, and the sample transfer rod assembly is inserted into the guide shaft;

[0051] When the sample transfer rod assembly extends into the evaporation chamber, it is used to replenish materials into the crucible.

[0052] Further, one end of the guide shaft away from the fourth driving system is fixedly connected to one side of the displacement platform, the other side of the displacement platform is fixedly connected to the adding chamber, one end of the adding chamber away from the displacement platform is connected to a gate valve, and the adding chamber is flange-connected to one side of the evaporation chamber through the gate valve;

[0053] The second vacuum system is arranged at the side of the adding chamber, and the quick-opening door is arranged at the top of the adding chamber, and the quick-opening door is used to open and close the inner cavity of the adding chamber;

[0054] Wherein, the displacement stage comprises an inner cavity for the sample transfer rod assembly to pass through, and the inner cavity of the displacement stage is connected with the addition chamber.

[0055] Furthermore, the sample transfer rod assembly includes a first shaft and a second shaft rotatably connected to the first shaft, wherein the second shaft is inserted into the first shaft and extends out of the end of the first shaft;

[0056] The end of the first shaft is connected to a material storage hopper, the material storage hopper is provided with a second bevel gear, and the second bevel gear is fixedly connected to a material baffle; the material baffle is used to open or cover the material storage hopper;

[0057] The first bevel gear is disposed at one end of the second shaft extending out of the first shaft; the first bevel gear is meshed with the second bevel gear;

[0058] The translation assembly is provided with a transmission mechanism rotatably connected thereto, the transmission mechanism is used to drive the second shaft rod together with the first bevel gear to rotate around the horizontal axis, the first bevel gear drives the second bevel gear to rotate around the vertical axis, and the second bevel gear drives the material baffle to swing in a fan shape in the horizontal plane.

[0059] An application method of an electron beam evaporation coating device comprises the following steps:

[0060] The first vacuum pumping system pumps the evaporation chamber to an ultra-vacuum environment;

[0061] The second driving system drives the second rotating shaft to rotate, driving the sample stage mechanism and the heating stage mechanism to turn over synchronously as a whole, so that the sample clamping part is opposite to the ion source system;

[0062] The pressing mechanism on the top of the evaporation chamber moves downward to separate the movable pressing plate of the sample clamping part from the fixed pressing plate. After the substrate is placed, the pressing mechanism retracts.

[0063] The ion source system cleans the substrate;

[0064] The second driving system drives the second rotating shaft to rotate in the opposite direction again, driving the sample stage and the heating stage mechanism to turn over synchronously as a whole, so that the sample clamping part is opposite to the electron gun system;

[0065] The first driving system drives the first rotating shaft to rotate, driving the sample stage mechanism to rotate around the central axis of the sample clamping part, and the substrate rotates synchronously; the electron gun system is turned on synchronously to evaporate and coat the substrate;

[0066] When the coating surface of the substrate needs to be adjusted, the first drive system is turned off and the second drive system is turned on to flip the sample stage mechanism and the heating stage mechanism as a whole; the pressing mechanism moves down to separate the movable pressing plate from the fixed pressing plate, flip the substrate, and complete the swap of the coating surface.

[0067] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0068] (1) The sample stage mechanism of the present invention can rotate relative to the heating stage mechanism, and the rotation of the sample stage mechanism can cause the position of each point on the substrate surface relative to the evaporated material to change continuously during the coating process, so that each position can receive the coating material more evenly, thereby improving the uniformity of the film thickness.

[0069] (2) The sample stage mechanism of the present invention can be flipped to a specific angle. When a thin film with special optical properties needs to be prepared, a special angle coating can be used to better diffuse and embed metal atoms on the substrate surface, increase the interaction between the film and the substrate, improve the bonding strength, and reduce the risk of the film falling off during use.

[0070] (3) The sample stage mechanism of the present invention can be flipped so that the substrate faces the ion source system. The ion source system is sealed and connected to the evaporation chamber. The substrate is cleaned in the evaporation chamber, so that the evaporation system has the function of cleaning the substrate.

[0071] (4) The material delivery system of the present invention is sealed and connected to one side of the evaporation chamber. When large-scale or long-term continuous coating operations are carried out, the coating material in the evaporation source will gradually decrease as the coating is carried out. Or when preparing some complex film systems, it is necessary to use a variety of different coating materials for sequential evaporation and deposition. If one of the key coating materials is exhausted during the evaporation process, and the subsequent film layer depends on the deposition of this material, then the evaporation source must be replenished in time to ensure the integrity and performance of the entire film system. The material delivery system provided in the present invention can complete its own vacuuming process and replenish the coating material in a vacuum environment in time according to the coating needs.

[0072] (5) The evaporation chamber integrates multiple functions, which can not only fully clean the substrate, but also perform multi-angle coating. The sampling chamber is eliminated, which simplifies the equipment and makes the transfer of evaporation materials fast and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] Figure 1 This is a schematic diagram of the overall structure of the evaporation chamber in one embodiment of the present application;

[0074] Figure 2 This is a schematic diagram of the positional relationship between the first vacuum system and the material conveying system in one embodiment of the present application;

[0075] Figure 3 This is a schematic diagram of the overall structure of a sample platform mechanism and a heating platform mechanism in one embodiment of the present application;

[0076] Figure 4 This is a schematic diagram of the structure in which the first rotating shaft drives the sample stage mechanism to rotate in one embodiment of the present application;

[0077] Figure 5 This is a schematic diagram of the structural details of the adapter shaft and the sample stage in one embodiment of the present application;

[0078] Figure 6 This is a schematic diagram of the structure of a substrate clamping portion in one embodiment of the present application;

[0079] Figure 7This is a schematic diagram of the rotational connection relationship between the driven bevel gear and the sample rotating shaft in one embodiment of the present application;

[0080] Figure 8 This is a schematic diagram of the rotational connection relationship between the first rotating shaft and the second rotating shaft in one embodiment of the present application;

[0081] Fig. 9 This is a schematic diagram of the overall flipping structure of the sample stage mechanism in one embodiment of the present application;

[0082] Fig.10 This is a schematic diagram of the substrate clamping portion and the top of the evaporation chamber relative to each other in one embodiment of the present application;

[0083] Fig.11 This is a schematic diagram of a pressing mechanism pressing down a movable pressing plate in one embodiment of the present application;

[0084] Fig.12 This is a schematic diagram of a pressing hand pressing down a movable pressing plate in one embodiment of the present application;

[0085] Fig.13 This is a schematic diagram of the structure of a movable pressing plate and a fixed pressing plate in one embodiment of the present application;

[0086] Fig.14 This is a schematic diagram of the overall structure of a pressing mechanism in one embodiment of the present application;

[0087] Fig.15 This is a schematic diagram of a slider driving a movable rod assembly to move vertically in one embodiment of the present application;

[0088] Fig.16 This is a schematic diagram of special angle coating in one embodiment of the present application;

[0089] Fig.17 This is a schematic diagram of the overall structure of a material conveying system in one embodiment of the present application;

[0090] Fig.18 This is a schematic diagram of the movement of the sample transfer rod assembly into the evaporation chamber in one embodiment of the present application;

[0091] Fig.19 This is a schematic diagram of the position relationship between the first shaft and the second shaft in one embodiment of the present application;

[0092] Fig. 20 This is a schematic diagram of the swing principle of a material baffle in one embodiment of the present application;

[0093] Fig.21 This is a schematic diagram of the retraction of the sample transfer rod assembly in one embodiment of the present application;

[0094] Fig. 22 This is a schematic diagram of the storage hopper retracting into the adding chamber in one embodiment of the present application.

[0095] Explanation of the symbols in the schematic diagram:

[0096] A first driving system 1, a first rotating shaft 11, a transfer shaft 12, a driving wheel 111, a driven wheel 121, and a driving bevel gear 122;

[0097] A second drive system 2, a second rotating shaft 21, a rotating ring 22, a first flange 23, an adapter flange 24, and a vacuum electrical feedthrough 25;

[0098] Substrate clamping part 31, driven bevel gear 32, sample rotating shaft 33, supporting platform 34, supporting rod 35, elastic component 36, substrate 37, fixed pressing plate 311, movable pressing plate 312, protrusion 3111, groove 3121;

[0099] A shaft 41 and a heating platform body 42;

[0100] Positioning assembly 5, vertical plate 51, first horizontal plate 52, bottom support plate 53, second horizontal plate 54, top support plate 55, first position limiting portion 56, second position limiting portion 57;

[0101] The third driving system 6, the top flange assembly 61, the slider 62, the platform 63, the movable rod assembly 64, the top flange assembly 65, the moving rod 641, the transfer platform 642, the pressing hand 643, and the bellows 644;

[0102] Fourth driving system 7, transmission mechanism 70, screw 71, translation assembly 72, guide shaft 74, displacement platform 75, adding chamber 76, gate valve 77, second vacuum system 78, quick-opening door 79, first shaft 731, second shaft 732, storage hopper 733, second bevel gear 734, material baffle 735, first bevel gear 736, moving part 751, flexible tube 752;

[0103] Detection crystal 8;

[0104] The ion source system 9 , the guide tube 91 , the first baffle driving mechanism 92 , the first baffle 93 , and the air guide portion 94 . DETAILED DESCRIPTION

[0105] In order to further understand the content of the present invention, the present invention is described in detail in conjunction with the accompanying drawings and embodiments.

[0106] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and so on quoted in this specification are only for the convenience of description, and are not used to limit the scope of implementation. The change or adjustment of their relative relationship should also be regarded as the scope of implementation of the present invention without substantially changing the technical content.

[0107] Electron beam evaporation coating equipment is mainly composed of electron gun, crucible, vacuum system and substrate. The electron gun is the key component for generating electron beam. In the electron gun, hot cathode is usually used to emit electrons. The hot cathode is heated to a sufficiently high temperature (usually tungsten filament and other materials are used as cathodes. After heating, the electrons obtain enough energy to overcome the work function of the material and are emitted). A high voltage (usually several thousand volts to several hundred thousand volts) is applied between the cathode and the anode to form a strong electric field. Under the action of this electric field, the emitted electrons are accelerated to form a high-speed electron beam.

[0108] After the high-speed electron beam is focused, it directly bombards the coating material placed in the crucible. When the energy of the electron beam is transferred to the coating material, the atoms on the surface of the material obtain enough energy to begin to overcome the interaction between atoms and evaporate. Since the electron beam can provide high energy density, it can quickly heat up the material in a local area to reach the evaporation temperature. For example, for some high melting point materials, such as titanium dioxide (TiO2), whose melting point is as high as 1800-1850℃, the high energy of the electron beam can make it evaporate quickly in a vacuum environment.

[0109] The evaporated atoms exist in the vacuum chamber in gaseous form. In a vacuum environment, these atoms can be transported from the evaporation source above the crucible to the substrate placed at a certain distance away with almost no collision interference. During the transportation process, the movement direction of the atoms is mainly from the evaporation source to the substrate, because other directions are restricted by the walls of the vacuum chamber, etc. When the atoms reach the surface of the substrate, due to the kinetic energy of the atoms themselves and the interaction between the substrate and the atoms (such as van der Waals forces, chemical bonding, etc.), the atoms will be deposited on the substrate and gradually form a thin film.

[0110] Initially, atoms are randomly deposited on the substrate surface. As the deposition process continues, atoms interact with each other, such as adsorption, diffusion, and condensation. Adsorption refers to the attachment of atoms to the substrate surface, diffusion refers to the movement of atoms on the substrate surface, and condensation refers to the combination of atoms to form aggregates. In this process, atoms will constantly adjust their positions, making the film gradually dense and flat. If the substrate can be heated, it can further promote the diffusion and condensation of atoms, which is conducive to the formation of high-quality films. For example, when preparing optical films, properly heating the substrate can make the deposited atoms better arranged and improve the optical properties of the film.

[0111] Compared with resistance evaporation coating, electron beam evaporation coating has great advantages: resistance evaporation coating is generally used to evaporate low melting point materials, such as aluminum, gold, silver, zinc sulfide, etc.; while electron beam evaporation coating can evaporate high melting point metals or dielectric materials, such as tungsten, molybdenum, germanium, SiO2, Al2O3, etc., which greatly expands the types of materials that can be coated.

[0112] In the case of resistance evaporation coating, the material is easy to react with the crucible, which affects the purity of the film; while in electron beam evaporation coating, the evaporated material is placed in a water-cooled crucible, which can avoid the evaporation of the container material and the reaction between the container material and the evaporation material, and can significantly improve the purity of the coating. Electron beam evaporation coating has a high energy density, the heating temperature can reach more than 3000℃, and the evaporation speed is fast; in comparison, the evaporation rate of resistance evaporation coating is low.

[0113] Compared with induction heating evaporation coating, electron beam evaporation coating also has great advantages: electron beam evaporation coating directly adds heat to the surface of the evaporated material, with less loss of heat conduction and heat radiation and high thermal efficiency; while induction heating evaporation coating has a high evaporation rate, but its energy utilization efficiency is lower than that of electron beam evaporation coating.

[0114] The equipment for induction heating evaporation coating requires a high-frequency electromagnetic field generating device, etc. The equipment is complex and expensive; the electron beam evaporation coating equipment is relatively simple and the cost is relatively low.

[0115] Compared with magnetron sputtering coating, electron beam evaporation coating also has great advantages: magnetron sputtering coating has a high deposition rate and a large ion flow, which can effectively improve the deposition rate and sputtering rate of the coating process; while the deposition rate of electron beam evaporation coating is relatively slow, but for some application scenarios that do not require a particularly high deposition rate but have high requirements for film quality, electron beam evaporation coating has more advantages. The film formed by electron beam evaporation coating has strong adhesion, high density, and large particle kinetic energy. When deposited on the surface of the substrate, it can better combine with the substrate, and the formed film is of high quality; although magnetron sputtering coating can also produce films with better performance, in some aspects, such as film density and adhesion, electron beam evaporation coating is better.

[0116] In addition, electron beam evaporation coating can evaporate a wide variety of materials, including various metals, alloys, oxides, sulfides, etc.; magnetron sputtering coating is mainly suitable for the coating of metals and alloy materials. For some high-melting-point dielectric materials, electron beam evaporation coating has more advantages.

[0117] In the electron beam evaporation coating system, the primary function of the interconnection transmission module is to connect different chambers, such as the evaporation chamber, pretreatment chamber, analysis and detection chamber, etc., so that the entire coating process can be carried out continuously in an integrated system, avoiding the contamination that may be caused by the sample being exposed to the atmospheric environment when transferred between different equipment, and ensuring the purity and quality of the film.

[0118] The transmission module is responsible for accurately and smoothly transferring the samples to be coated between the various chambers, ensuring that the samples can enter different processing links in sequence according to the preset process flow, realizing automated and efficient production. For example, in large-scale integrated circuit manufacturing, a large number of silicon wafers need to be coated. The interconnection transmission module can quickly and accurately transfer silicon wafers from one chamber to another, improving production efficiency.

[0119] The electron beam evaporation coating equipment of the present application focuses on optimizing the design of the evaporation chamber. The thin film deposition process is completed in the evaporation chamber. The first vacuum pumping system is connected to the flange on one side of the evaporation chamber to obtain an ultra-vacuum environment in the evaporation chamber. The first vacuum pumping system includes a mechanical pump and a molecular pump. The mechanical pump is started to pump the vacuum degree in the evaporation chamber to 10 -1 Pa, and then start the molecular pump to pump the vacuum degree to 10 -8 Pa around.

[0120] The electron gun system is located at the bottom of the evaporation chamber and is used to emit an electron beam. The electron beam hits the material in the crucible to evaporate it, and the evaporated material is gradually deposited on the surface of the substrate 37. It should be noted that the crucible is arranged in the evaporation chamber and is located below the substrate 37.

[0121] like Figure 1 , Figure 2 As shown, ion source system 9 is used for cleaning substrate 37, and ion source system 9 is connected with evaporation chamber top by top flange assembly 65. More specifically, guide cylinder 91 is hollow, and it is sleeved in ion source system 9 middle and lower part and extends downwards, until stretching out the bottom of ion source system 9. Guide cylinder 91 is fixedly connected with ion source system 9, and guide cylinder 91 passes top flange assembly 65 and enters evaporation chamber interior, and guide cylinder 91 is fixedly connected with top flange assembly 65.

[0122] like Fig.14 , Fig.15As shown, the top flange assembly 65 is also provided with a first baffle driving mechanism 92 located outside the evaporation chamber and a first baffle 93 located inside the evaporation chamber. The first baffle 93 is fixedly connected to the first baffle driving mechanism 92. Under the drive of the first baffle driving mechanism 91, the first baffle 93 swings in a fan shape in the horizontal plane to cover or open the guide cylinder 91. When it is necessary to open the ion source system 9 to clean the substrate 37, the first baffle 93 swings horizontally so that the guide cylinder 91 faces the substrate 37; when the substrate 37 is cleaned, the first baffle 93 swings in the opposite direction to cover the guide cylinder 91.

[0123] like Figure 1 , Figure 2 As shown, a gas supply system is also provided on the top of the evaporation chamber, an opening is provided in the middle and lower part of the guide cylinder 91, one end of the gas guide portion 94 is connected to the gas supply system pipeline, and the other end is inserted into the opening of the guide cylinder 91. When the ion source system 9 is turned on to clean the substrate 37, the gas supply system is turned on synchronously, so that the plasma generated by the ion source system 9 reacts chemically with the gas injected by the gas guide portion 94, so that the chemical properties of the material surface are changed, thereby achieving a better cleaning effect or providing favorable conditions for subsequent surface modification and other treatments.

[0124] like Figure 3 to Figure 7 As shown, the heating stage mechanism is arranged inside the evaporation chamber for heating the substrate 37. The sample stage mechanism is rotatably connected with the heating stage mechanism and is located outside the heating stage mechanism, and the two are preferably connected by a bearing. The sample stage mechanism includes a substrate clamping portion 31 for clamping the substrate 37.

[0125] like Figure 8 As shown, the first driving system 1 is located outside the evaporation chamber and is used to drive the first rotating shaft 11 to rotate. The first rotating shaft 11 drives the sample stage mechanism to rotate around the central axis of the substrate clamping portion 31. It should be noted that during the rotation of the sample stage mechanism, the heating stage does not rotate.

[0126] like Figure 8 As shown, the second driving system 2 is located outside the evaporation chamber and is used to drive the second rotating shaft 21 to rotate. The second rotating shaft 21 drives the sample stage mechanism and the heating stage mechanism to turn over synchronously. After turning over, when the sample clamping part 31 is opposite to the ion source system 9, the substrate 37 can be placed on the substrate clamping part 31 to clean the substrate 37, or the substrate 37 can be turned over to adjust the thin film deposition surface of the substrate 37.

[0127] It should be noted that the placement and flipping of the substrate 37 requires the assistance of the manipulator. A long strip opening with an opening and closing function is provided on the side wall of one side of the evaporation chamber. When the manipulator needs to transfer the substrate 37 into the evaporation chamber or transfer the substrate 37 from the evaporation chamber to other chambers, the opening is in an open state. When the manipulator retracts to other chambers, the opening is closed. Since the interconnected transmission module connects different cavities, and different cavities maintain an ultra-vacuum environment, the movement of the manipulator will not destroy the ultra-vacuum environment of the evaporation chamber.

[0128] like Figure 8 As shown, more specifically, the first rotating shaft 11 is rotatably connected to the second rotating shaft 21, and the two are preferably connected by bearings, and the first rotating shaft 11 is inserted into the second rotating shaft 21. The second driving system 2 is connected to one side of the evaporation chamber through the first flange 23, one end of the second driving system 2 is fixedly connected to the first flange 23, and the other end is connected to the rotating ring 22.

[0129] like Figure 8 As shown, one end of the rotating ring 22 is fixedly connected to the second rotating shaft 21, and the other end is fixedly connected to the adapter flange 24, and the adapter flange 24 is fixedly connected to the first drive system. The second rotating shaft 21 passes through the first flange 23 and enters the interior of the evaporation chamber, and the second rotating shaft 21 is rotatably connected to the first flange 23, and the rotatable connection is preferably a bearing connection. It is worth noting that the end of the first rotating shaft 11 extends out of the second rotating shaft 21, that is, the ends of the first rotating shaft 11 and the second rotating shaft 21 are both located in the evaporation chamber. The end here refers to the end away from the first drive system 1 and the second drive system 2.

[0130] The second driving system 2 is preferably a differential rotating motor, which drives the rotating ring 22 to rotate together with the second rotating shaft 21, and simultaneously drives the adapter flange 24 to rotate synchronously with the first driving system 1. During the rotation of the rotating ring 22, the differential rotating motor itself does not rotate.

[0131] like Figure 3 , Figure 4 , Figure 8 As shown, the adapter flange 24 is preferably a four-way flange, and its two ends are fixedly connected to the rotating ring 22 and the first drive system 1 respectively, and its two opposite sides are respectively connected to a vacuum electrical feedthrough 25, and the vacuum electrical feedthrough 25 is connected to the heating platform mechanism through a wire. The temperature sensor provided on the heating platform mechanism transmits the electrical signal to the vacuum electrical feedthrough 25, and the vacuum electrical feedthrough 25 transmits the electrical signal to the temperature control system. The vacuum electrical feedthrough 25 also transmits the external electrical signal to the heating platform mechanism in the vacuum chamber, thereby realizing the temperature control of the heating platform mechanism.

[0132] The driving shaft of the first driving system 1 itself is arranged inside the four-way flange, and the driving shaft of the first driving system 1 itself is connected to the first rotating shaft 11 through a coupling. When the first driving system 1 drives the first rotating shaft 11 to rotate, the second rotating shaft can remain relatively still.

[0133] In order to ensure the smooth rotation of the sample stage mechanism, the first rotating shaft 11 is connected to the sample stage mechanism through the adapter shaft 12, and the rotation direction is changed through the adapter shaft 12. A driving wheel 111 is fixedly connected to the end of the first rotating shaft 11, and a driven wheel 121 is provided at the end of the adapter shaft 12 away from the sample stage mechanism; a driving bevel gear 122 is provided at the end of the adapter shaft 12 close to the sample stage mechanism, and a driven bevel gear 32 is fixedly connected to the sample stage mechanism.

[0134] like Figures 4 to 7 As shown, the driving wheel 111 meshes with the driven wheel 121, and the driving bevel gear 122 meshes with the driven bevel gear 32, thereby completing the rotation transfer. When the first rotating shaft 11 rotates, it drives the adapter shaft 12 and the sample stage mechanism to rotate, and due to the characteristics of the bevel gear, the rotation of the first rotating shaft 11 around the horizontal axis is converted into the rotation of the sample stage mechanism around the vertical axis.

[0135] The adapter shaft 12 requires a support portion, and the positioning assembly 5 not only provides a fulcrum for the adapter shaft 12, but also can bear the weight of the sample stage mechanism and the heating stage mechanism. One end of the positioning assembly 5 is fixedly connected to the end of the second rotating shaft 21, and the other end is fixedly connected to the heating stage mechanism, and is also rotationally connected to the sample stage mechanism. When the second rotating shaft 21 rotates, the sample stage mechanism and the heating stage mechanism are synchronously turned over as a whole through the positioning assembly 5.

[0136] like Figure 5 , Figure 7 , Fig.12 , Fig.13 As shown, more specifically, the positioning assembly 5 includes a vertical plate 51 fixedly connected to the end of the second rotating shaft 21 and a first horizontal plate 52 perpendicular to the vertical plate 51, and the vertical plate 51 is fixedly connected to the first horizontal plate 52 through a pair of bottom support plates 53. The second horizontal plate 54 is fixedly connected to the first horizontal plate 52 through a pair of top support plates 55. Among them, the second horizontal plate 54 is located above the first horizontal plate 52, and the second horizontal plate 54 is fixedly connected to the heating stage mechanism, and the second horizontal plate 54 is also rotationally connected to the sample stage mechanism, and the rotational connection is preferably a bearing connection.

[0137] The middle of the first horizontal plate 52 is provided with an opening for accommodating the transfer shaft 12, and one end of the transfer shaft 12 meshing with the driving wheel 111 is rotatably connected to the first horizontal plate 52 to prevent the first horizontal plate 52 from interfering with the rotation of the transfer shaft 12. The middle of the first horizontal plate 52 is fixedly connected with a first limiter 56, which is sleeved on the middle of the transfer shaft 12, and the two are also rotatably connected. The side of the first horizontal plate 52 away from the vertical plate 51 is sleeved on the outer wall of the sample stage mechanism, and the first horizontal plate 52 is rotatably connected to the sample stage mechanism.

[0138] The second limiter 57 is fixedly connected to the lower surface of the first horizontal plate 52, and the lower surface is the surface close to the substrate clamping portion. It should be noted that the first rotating shaft 11 includes a driving wheel 111 passing through the vertical plate 51 and rotatably connected to the second limiter 57. The advantage of such a setting is that the support points of the first rotating shaft 11 are increased, so that the first rotating shaft 11 rotates more smoothly.

[0139] The sample stage mechanism includes a sample rotating shaft 33, a driven bevel gear 32 which is sleeved on the outer wall of the sample rotating shaft 33 and fixedly connected to the sample rotating shaft 33, the end of the sample rotating shaft 33 is fixedly connected to a support platform 34, the substrate clamping portion 31 is connected to the support platform 34 through a support rod 35, and the support platform 34 is located between the substrate clamping portion 31 and the driven bevel gear 32.

[0140] like Fig.12 , Fig.13 As shown, the substrate clamping portion 31 includes a pair of fixed pressing plates 311 and a pair of movable pressing plates 312, and the movable pressing plates 312 are located between the fixed pressing plates 311 and the support platform 34. There are preferably four support rods 35 on each side, and their two ends are fixedly connected to the support platform 34 and the fixed pressing plates 311 respectively.

[0141] The movable pressing plate 312 is provided with a plurality of through holes for the support plate 35 to pass through. The elastic component 36 is sleeved on the support rod 35, and one end of the elastic component 36 is fixed on the support platform 34, and the other end is fixed on the movable pressing plate 312. Preferably, two elastic components 36 are arranged on each side to enable the movable pressing plate 312 to slide vertically along the support rod 35.

[0142] The contact portion between the movable pressing plate 312 and the substrate 37 is provided with a groove 3121 , which is matched with the substrate 37 and used to limit the substrate 37 . The contact portion between the fixed pressing plate 311 and the substrate 37 is provided with a protrusion 3111 , which is matched with the groove 3121 .

[0143] It should be noted that when the fixed pressing plate 311 and the movable pressing plate 312 are in contact with each other, the elastic component 36 is in a natural state or a compressed state, and when the fixed pressing plate 311 and the movable pressing plate 312 are separated, the elastic component 36 is compressed by the pressing mechanism.

[0144] The pressing mechanism is connected to the top of the evaporation chamber through the top flange assembly 65, and the pressing mechanism includes a third driving system 6, a linear module 61 fixedly connected to the third driving system 6, and a slider 62 sliding along the linear module 61. The linear module 61 is fixed on the top flange assembly 61, and the third driving system is used to drive the slider 62 to move vertically along the linear module 61.

[0145] like Fig.14 , 15 As shown, the pressing mechanism also includes a platform 63 fixedly connected to the slider 62, and a pair of movable rod assemblies 64 are symmetrically arranged on both sides of the platform 63. The movable rod assembly 64 passes through the top flange assembly 65 and extends into the interior of the evaporation chamber. The slider 62 drives the platform 63 and the movable rod assembly 64 to move vertically.

[0146] The movable rod assembly 64 includes a movable rod 641 and a transfer platform 642. The transfer platform 642 is fixedly connected to one end of the movable rod 641 away from the platform 63. A pair of pressing hands 643 are provided on the transfer platform. The pressing hands 643 are used to press down the movable pressing plate 312. The ends of the pressing hands 643 are preferably set as smooth curved surfaces. By providing two pressing hands 643, the movable pressing plate 312 can always remain parallel to the fixed pressing plate 311 during the vertical movement. When the substrate 37 is subsequently placed or turned over, the substrate 37 will not fall due to tilting.

[0147] Taking the transfer of substrate 37 by the manipulator as an example (the sample platform is flipped so that the substrate clamping part 31 is opposite to the ion source system 9), the pressing hand 643 presses down the movable pressing plate 312 to separate the fixed pressing plate 311 from the movable pressing plate 312, and the manipulator transfers the substrate 37 to between a pair of substrate clamping parts 31, at which time the substrate 37 is located between the fixed pressing plate 311 and the movable pressing plate 312. The pressing hand 643 rises at a constant speed, and the movable pressing plate 312 contacts the substrate during the process of rising at a constant speed, and then rises synchronously with the substrate 37 until the pressing hand 643 no longer provides downward pressure, and the movable pressing plate 312 is in contact with the fixed pressing plate 311, completing the pressing of the substrate 37.

[0148] It should be noted that the outer wall of the moving rod 641 is provided with a bellows 644, which is arranged outside the evaporation chamber, and one end of the bellows 644 is fixedly connected to the upper part of the moving rod 641, and the other end is fixedly connected to the top flange assembly 65. When the moving rod 641 is vertically displaced, the bellows 644 is compressed or rebounded accordingly. The function of the bellows 644 is to ensure that the moving rod 641 always maintains a sealed connection with the evaporation chamber during the vertical movement process.

[0149] An electron beam evaporation coating device of the present application also includes a material delivery system connected to a flange on one side of the evaporation chamber, such as Fig.17 , Fig.18 As shown, the material conveying system includes a fourth driving system 7 and a screw 71 connected to the fourth driving system 7, the screw 71 is threadedly connected to the translation assembly 72, and the translation assembly 72 is magnetically coupled to the sample transfer rod assembly. The screw 71 is driven to rotate by the fourth driving system 7, and the screw 71 drives the translation assembly 72 and the sample transfer rod assembly to move horizontally along the guide shaft 74. When the sample transfer rod assembly extends into the evaporation chamber, it is used to replenish the material used by the electron gun system in the crucible.

[0150] More specifically, the guide shaft 74 is hollow and arranged parallel to the screw rod 71, the translation assembly 72 is sleeved on the guide shaft 74, and the sample transfer rod assembly is inserted into the guide shaft 74. One end of the guide shaft 74 away from the fourth driving system 7 is fixedly connected to one side of the displacement stage 75, and the other side of the displacement stage 75 is fixedly connected to the addition chamber 76, and one end of the addition chamber 76 away from the displacement stage 75 is connected to the gate valve 77, and the addition chamber 76 is flange-connected to one side of the evaporation chamber through the gate valve 77.

[0151] The second vacuum system 78 is disposed on the side of the addition chamber 76, and the quick-opening door 79 is disposed on the top of the addition chamber 76, and the quick-opening door 79 is used to open and close the inner cavity of the addition chamber 76. The displacement stage 75 has an inner cavity inside, and the inner cavity is used for the sample transfer rod assembly to pass through, and the inner cavity and the addition chamber 76 are mutually connected.

[0152] In order to ensure that the second vacuum system 78 extracts gas in a sealed space, the guide shaft 74 and the displacement platform 75 are preferably connected in a sealing manner via a flange, and the end of the guide shaft 74 away from the displacement platform 75 is closed.

[0153] like Fig.19 , Fig. 20 As shown, the sample transfer rod assembly includes a first shaft 731 and a second shaft 732. The second shaft 732 is located inside the first shaft 731 and extends out of the first shaft 731, and the two are rotatably connected. The end of the first shaft 731 is fixedly connected to a storage hopper 733, and the storage hopper 733 is provided with a second bevel gear 734. The second bevel gear 734 is fixedly connected to a material baffle 735, and the material baffle 735 is used to open or cover the storage hopper 733.

[0154] One end of the second shaft 732 extending from the first shaft 731 is fixedly connected to the first bevel gear 736, and the first bevel gear 736 is meshed with the second bevel gear 734. It should be noted that when the second shaft 732 rotates around its own axis together with the bevel gear 736, the first shaft 731 is relatively stationary. The second bevel gear 734 is rotationally connected to the storage hopper 733, that is, when the second bevel gear 734 rotates driven by the first bevel gear 736, the storage hopper 733 is relatively stationary.

[0155] like Fig.17 , Fig.21 , Fig. 22 As shown, the translation assembly 72 is provided with a transmission mechanism 70 rotatably connected thereto, and the transmission mechanism 70 is preferably a belt drive, wherein the driven pulley is sleeved on the guide shaft 74 but does not contact the guide shaft 74, and the driving pulley is driven to rotate by the fifth drive system, and the driving pulley and the driven pulley are driven by a transmission belt.

[0156] Specifically, the translation assembly 72 is magnetically coupled to the first shaft 731, and the transmission mechanism 70 is magnetically coupled to the second shaft 732. Through the magnetic coupling, the translation assembly 72 can drive the first shaft 731 to move horizontally, and the transmission mechanism 70 can drive the second shaft 732 to rotate around its own axis.

[0157] The displacement stage 75 includes a moving part 751 and a flexible tube 752. The flexible tube 752 provides the inner cavity mentioned above for the displacement stage 75. Along the extension direction of the central axis of the guide shaft 74, the specific connection method is: the end of the guide shaft 74 is sealed and connected to the moving part 751 through a flange, the moving part 751 is sealed and connected to the flexible tube 752, and the flexible tube 752 is flange-connected to the adding chamber 76.

[0158] The moving part 751 can move vertically under the drive of the sixth driving system. Since the flexible tube 752 can be deformed to a certain extent, the connection between the flexible tube 752 and the moving part 751 and the adding chamber 76 will not be affected. Under the vertical movement of the moving part 751, the guide shaft 74 together with the sample transfer rod assembly (including the translation assembly 72, the fourth driving system 7, and the screw 71) inside it will move vertically as a whole. Therefore, when the sample transfer rod assembly extends into the evaporation chamber and moves above the crucible, if the vertical distance between the crucible and the storage hopper 735 is large, the moving part 751 can be moved downward to move the storage hopper 735 closer to the crucible, and then the material baffle 735 can be opened to allow the material to fall into the crucible.

[0159] The specific way of adding materials in the material conveying system is as follows: the fourth drive system 7 drives the screw 71 to rotate, driving the translation assembly 72 and the sample transfer rod assembly to retract, so that the storage hopper 733 at the end of the sample transfer rod assembly is opposite to the quick opening door 79. At this time, the gate valve 77 is closed, and the material baffle 735 covers the storage hopper 733.

[0160] Open the quick-open door 79, add material to the storage hopper 733, close the quick-open door 79, start the second vacuum pumping system 78, and pump the adding chamber 76 to an ultra-vacuum environment. Open the gate valve 77, and the fourth drive system 7 drives the screw 71 to rotate in the opposite direction, driving the sample transfer rod assembly to move horizontally toward the evaporation chamber until the storage hopper 733 moves horizontally to the top of the crucible.

[0161] The sixth driving system drives the moving part 751 to move vertically toward the bottom of the evaporation chamber, so that the sample transfer rod assembly moves vertically synchronously, and the storage hopper 735 is close to the crucible. The material baffle 735 is opened to allow the material to fall into the crucible. The sample transfer rod assembly retracts and the gate valve 77 is closed.

[0162] The heating platform mechanism includes a shaft 41 rotatably connected to the sample rotating shaft 33 and a heating platform body 42. The shaft 41 is arranged inside 33 and passes through the support platform 34. One end of the shaft 41 is fixedly connected to the positioning assembly 5, and the other end is fixedly connected to the heating platform body 42. The heating platform body 42 is located between the support platform 34 and the sample clamping portion 31.

[0163] The device also includes a film thickness detection system, which includes a detection crystal 8 with one end extending into the evaporation chamber, and the end of the detection crystal 8 located outside the evaporation chamber is sealed and connected to the side wall of the evaporation chamber through a flange. The detection crystal 8 can monitor the thickness of the film being deposited in real time and accurately calculate the thickness of the film. This is like installing a "ruler" for the coating process, so that the growth of the film can be known at any time.

[0164] The film thickness detection system is connected to the external control system. When it detects that the film thickness reaches the preset value, it can send a signal to the control system to stop the electron gun system or adjust parameters such as the evaporation rate.

[0165] The application method of the device is as follows:

[0166] The first vacuum pumping system pumps the evaporation chamber to an ultra-vacuum environment;

[0167] The second driving system drives the second rotating shaft to rotate, driving the sample stage mechanism and the heating stage mechanism to turn over synchronously as a whole, so that the sample clamping part is opposite to the ion source system;

[0168] The pressing mechanism on the top of the evaporation chamber moves downward to separate the movable pressing plate of the sample clamping part from the fixed pressing plate. After the substrate is placed, the pressing mechanism retracts.

[0169] The ion source system cleans the substrate;

[0170] The second driving system drives the second rotating shaft to rotate in the opposite direction again, driving the sample stage and the heating stage mechanism to turn over synchronously as a whole, so that the sample clamping part is opposite to the electron gun system;

[0171] The first driving system drives the first rotating shaft to rotate, driving the sample stage mechanism to rotate around the central axis of the sample clamping part, and the substrate rotates synchronously; the electron gun system is turned on synchronously to evaporate and coat the substrate;

[0172] When the coating surface of the substrate needs to be adjusted, the first drive system is turned off and the second drive system is turned on to flip the sample stage mechanism and the heating stage mechanism as a whole; the pressing mechanism moves down to separate the movable pressing plate from the fixed pressing plate, flip the substrate, and complete the swap of the coating surface.

[0173] It should be noted that the present application provides a solution for substrate tilt angle coating, and special tilt angle coating is a special process. It means that during the coating process, the substrate is placed at a certain angle relative to the evaporation source, rather than the traditional vertical placement.

[0174] The distribution of evaporated atoms or molecules changes when they reach the substrate surface. In the case of vertical evaporation, the deposition rate of the substrate area directly above the evaporated material may be higher than that of the edge area, resulting in uneven film thickness. By tilting the substrate angle, the evaporated material can cover a wider area on the substrate and reduce the difference in deposition rate between the center and edge areas.

[0175] The second rotating axis is driven by a differential rotary motor to rotate, thereby driving the sample stage mechanism to flip to a specified angle as a whole, so as to achieve substrate coating at a special tilt angle. During the coating process, the substrate tilt angle can still be adjusted by a differential rotary motor to improve the electrical and mechanical properties of the film.

[0176] The present invention and its embodiments are described schematically above, and the description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. Therefore, if a person skilled in the art is inspired by it and designs a structural method and an embodiment similar to the technical solution without creativity without departing from the purpose of the invention, they shall all fall within the protection scope of the present invention.

Claims

1. An electron beam evaporation coating device, comprising: An evaporation chamber, which provides a space for depositing a thin film on a substrate (37); An electron gun system connected to the bottom of the evaporation chamber, the electron gun system is used to emit an electron beam, the electron beam is used to impact the material in the crucible and evaporate the material, the crucible is located in the evaporation chamber and below the substrate (37); A first vacuum pumping system, which is connected to a flange on one side of the evaporation chamber and is used to provide the evaporation chamber with an ultra-vacuum environment; Features: Also includes, A heating platform mechanism, the heating platform mechanism is located in the evaporation chamber, and the heating platform mechanism is used to heat the substrate (37); A sample stage mechanism, the sample stage mechanism is rotatably connected to the heating stage mechanism and is located outside the heating stage mechanism, the sample stage mechanism comprising a substrate clamping portion (31) for clamping a substrate (37); An ion source system (9), the ion source system (9) being connected to the top flange of the evaporation chamber, and the ion source system (9) being used for cleaning the substrate (37); A first driving system (1), the first driving system (1) being located outside the evaporation chamber and used for driving a first rotating shaft (11) to rotate, wherein the first rotating shaft (11) drives the sample stage mechanism to rotate around a central axis of the substrate clamping portion (31); A second driving system (2), the second driving system (2) being located outside the evaporation chamber and used for driving the second rotating shaft (21) to rotate, and the second rotating shaft (21) drives the heating stage mechanism and the sample stage mechanism to turn over synchronously as a whole; When the sample stage mechanism is flipped so that the substrate clamping portion (31) is opposite to the ion source system (9), the substrate (37) can be placed, cleaned and flipped.

2. The electron beam evaporation coating device according to claim 1, characterized in that: The first rotating shaft (11) is rotatably connected to the second rotating shaft (21), and the first rotating shaft (11) is inserted into the interior of the second rotating shaft (21); The ends of the first rotating shaft (11) and the second rotating shaft (21) are both located in the evaporation chamber, and the end of the first rotating shaft (11) extends out of the second rotating shaft (21).

3. The electron beam evaporation coating device according to claim 2, characterized in that: The positioning assembly (5) is rotationally connected to the first rotating shaft (11); One end of the positioning component (5) is fixedly connected to the end of the second rotating shaft (21), and the other end is fixedly connected to the heating stage mechanism and is also rotationally connected to the sample stage mechanism; When the second rotating shaft (21) rotates, the sample stage mechanism and the heating stage mechanism are synchronously turned over as a whole through the positioning assembly (5).

4. The electron beam evaporation coating device according to claim 3, characterized in that: One end of the second driving system (2) is fixedly connected to a first flange (23) on one side of the evaporation chamber, and the other end is connected to the rotating ring (22); One end of the rotating ring (22) is fixedly connected to the second rotating shaft (21); the second rotating shaft (21) passes through the first flange (23) and enters the interior of the evaporation chamber; the second rotating shaft (21) is rotatably connected to the first flange (23); The other end of the rotating ring (22) is connected to the adapter flange (24), and the adapter flange (24) is fixedly connected to the first driving system (1); The second driving system (2) drives the rotating ring (22) to rotate together with the second rotating shaft (21), thereby driving the adapter flange (24) to rotate synchronously with the first driving system (1).

5. The electron beam evaporation coating device according to claim 1, characterized in that: The first rotating shaft (11) is connected to the sample stage mechanism via a transfer shaft (12); The end of the first rotating shaft (11) away from the first driving system (1) is fixedly connected to a driving wheel (111); the end of the adapter shaft (12) away from the sample stage mechanism is fixedly connected to a driven wheel (121); An end of the adapter shaft (12) close to the sample stage mechanism is fixedly connected with a driving bevel gear (122), and the sample stage mechanism is provided with a driven bevel gear (32); The driving wheel (111) meshes with the driven wheel (121), and the driving bevel gear (122) meshes with the driven bevel gear (32). When the first rotating shaft (11) rotates, the transfer shaft (12) and the sample table mechanism are driven to rotate.

6. The electron beam evaporation coating device according to claim 5, characterized in that: The sample stage mechanism also includes a sample rotating shaft (33), and the driven bevel gear (32) is sleeved on the outer wall of the sample rotating shaft (33) and is fixedly connected to the sample rotating shaft (33); The supporting platform (34) is fixedly connected to the end of the sample rotating shaft (33); The substrate clamping portion (31) is connected to the support platform (34) via a support rod (35); The supporting platform (34) is located between the substrate clamping portion (31) and the driven bevel gear (32).

7. The electron beam evaporation coating device according to claim 6, characterized in that: The substrate clamping portion (31) comprises a pair of fixed pressing plates (311) and a pair of movable pressing plates (312); wherein the movable pressing plates (312) are located between the fixed pressing plates (311) and the supporting platform (34); Both ends of the support rod (35) are fixedly connected to the support platform (34) and the fixed pressing plate (311) respectively; The movable pressing plate (312) is provided with a plurality of through holes for the support rods (35) to pass through; The elastic component (36) is sleeved on the support rod (35), and one end of the elastic component (36) is fixed on the support platform (34), and the other end is fixed on the movable pressing plate (312); the elastic component (36) is used to make the movable pressing plate (312) slide vertically along the support rod (35).

8. The electron beam evaporation coating device according to claim 7, characterized in that: When the fixed pressing plate (311) and the movable pressing plate (312) are in contact with each other, the elastic component (36) is in a natural state or a compressed state; When the fixed pressing plate (311) is separated from the movable pressing plate (312), the elastic component (36) is in a compressed state; When the substrate clamping portion (31) is opposite to the ion source system (9), the pressing mechanism is used to press down the movable pressing plate (312).

9. The electron beam evaporation coating device according to claim 8, characterized in that: The pressing mechanism is connected to the top of the evaporation chamber via a top flange assembly (65), and the pressing mechanism comprises a third drive system (6) and a linear module (61) fixedly connected to the third drive system (6); the linear module (61) is fixed on the top flange assembly (65); The pressing mechanism further comprises a slider (62) that moves vertically along the linear module (61); and the third driving system (6) is used to drive the slider (62) to move vertically along the linear module (61).

10. The electron beam evaporation coating device according to claim 9, characterized in that: The pressing mechanism also includes a platform (63) fixedly connected to the slider (62), and a pair of movable rod assemblies (64) are symmetrically arranged on both sides of the platform (63). The movable rod assemblies (64) pass through the top flange assembly (65) and extend into the interior of the evaporation chamber.

11. The electron beam evaporation coating device according to claim 10, characterized in that: The movable rod assembly (64) comprises a movable rod (641) and a transfer platform (642); Wherein, the transfer platform (642) is fixedly connected to an end of the moving rod (641) away from the platform (63); A pair of pressing hands (643) are provided on the transfer platform (642), and the pressing hands (643) are used to press down the movable pressing plate (312).

12. The electron beam evaporation coating device according to claim 1, characterized in that: The device also includes a material conveying system connected to a flange on one side of the evaporation chamber, the material conveying system including a fourth drive system (7) and a screw (71) connected to the fourth drive system (7); the screw (71) is threadedly connected to the translation assembly (72), and the translation assembly (72) is magnetically coupled to the sample transfer rod assembly; The fourth driving system (7) drives the screw (71) to rotate, and the screw (71) drives the translation assembly (72) together with the sample transfer rod assembly to move horizontally along the guide shaft (74); The guide shaft (74) is hollow and parallel to the screw rod (71); the translation assembly (72) is sleeved on the guide shaft (74), and the sample transfer rod assembly is inserted into the guide shaft (74); When the sample transfer rod assembly extends into the evaporation chamber, it is used to replenish materials into the crucible.

13. The electron beam evaporation coating device according to claim 12, characterized in that: One end of the guide shaft (74) away from the fourth drive system (7) is fixedly connected to one side of the displacement platform (75), and the other side of the displacement platform (75) is fixedly connected to the adding chamber (76). One end of the adding chamber (76) away from the displacement platform (75) is connected to a gate valve (77), and the adding chamber (76) is flange-connected to one side of the evaporation chamber via the gate valve (77); The second vacuum pumping system (78) is arranged on the side of the adding chamber (76), and the quick-opening door (79) is arranged on the top of the adding chamber (76), and the quick-opening door (79) is used to open and close the inner cavity of the adding chamber (76); The displacement platform (75) comprises an inner cavity for the sample transfer rod assembly to pass through, and the inner cavity of the displacement platform (75) is connected with the addition chamber (76).

14. The electron beam evaporation coating device according to claim 13, characterized in that: The sample transfer rod assembly comprises a first shaft (731) and a second shaft (732) rotatably connected to the first shaft (731), wherein the second shaft (732) is inserted into the first shaft (731) and extends out of the end of the first shaft (731); The end of the first shaft (731) is connected to a material storage hopper (733), and the material storage hopper (733) is provided with a second bevel gear (734), and the second bevel gear (734) is fixedly connected to a material baffle (735); the material baffle (735) is used to open or cover the material storage hopper (733); One end of the second shaft (732) extending from the first shaft (731) is provided with a first bevel gear (736); the first bevel gear (736) is meshed with the second bevel gear (734); The translation assembly (72) is provided with a transmission mechanism (78) rotatably connected thereto, and the transmission mechanism (78) is used to drive the second shaft (732) and the first bevel gear (736) to rotate around a horizontal axis, the first bevel gear (736) drives the second bevel gear (734) to rotate around a vertical axis, and the second bevel gear (734) drives the material baffle (735) to swing in a fan shape on a horizontal plane.

15. The application method of the electron beam evaporation coating equipment according to any one of claims 1 to 14, characterized in that: The following steps are involved: The first vacuum pumping system pumps the evaporation chamber to an ultra-vacuum environment; The second driving system drives the second rotating shaft to rotate, driving the sample stage mechanism and the heating stage mechanism to turn over synchronously as a whole, so that the sample clamping part is opposite to the ion source system; The pressing mechanism on the top of the evaporation chamber moves downward to separate the movable pressing plate of the sample clamping part from the fixed pressing plate. After the substrate is placed, the pressing mechanism retracts. The ion source system cleans the substrate; The second driving system drives the second rotating shaft to rotate in the opposite direction again, driving the sample stage and the heating stage mechanism to turn over synchronously as a whole, so that the sample clamping part is opposite to the electron gun system; The first driving system drives the first rotating shaft to rotate, driving the sample stage mechanism to rotate around the central axis of the sample clamping part, and the substrate rotates synchronously; the electron gun system is turned on synchronously to evaporate and coat the substrate; When the coating surface of the substrate needs to be adjusted, the first drive system is turned off and the second drive system is turned on to flip the sample stage mechanism and the heating stage mechanism as a whole; the pressing mechanism moves down to separate the movable pressing plate from the fixed pressing plate, flip the substrate, and complete the swap of the coating surface.

Images