Housing with a sensor system and / or quantum technology system and methods for its manufacture

Abstract

Housings (DE, WA, BO, LF1 to LF6) with a sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) and / or quantum technology system, which is hereinafter also referred to simply as a sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1), wherein the housing (DE, WA, BO, LF1 to LF6) has a cavity (CAV) and wherein the housing (DE, WA, BO, LF1 to LF6) comprises a premolded open-cavity housing (WA, BO, LF1 to LF6) and wherein the sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) comprises a paramagnetic center (NV1) in the material of a sensor element and / or quantum technology device element that is part of the sensor system and wherein the sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) includes a receiver (PD1) and wherein the sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) comprises an integrated circuit (IC) and an evaluation circuit (M1, TP, M2, G) for generating an output signal (out) and wherein the sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) comprises a source (PL1) for excitation radiation (LB, LB1a, LB1b), in particular an LED (PL1), and wherein the sensor element with the paramagnetic center (NV1) is located in the cavity (CAV) of the housing (DE, WA, BO, LF1 to LF6) and wherein the receiver (PD1) is located in the cavity (CAV) of the housing (DE, WA, BO, LF1 to LF6) and wherein the source (PL1) for excitation radiation (LB, LB1a, LB1b) is located in the cavity (CAV) of the housing (DE, WA, BO, LF1 to LF6) and wherein the circuit (IC) is located in the cavity (CAV) of the package (DE, WA, BO, LF1 to LF6) and wherein the excitation radiation (LB, LB1a, LB1b) of the source (PL1) for excitation radiation (LB, LB1a, LB1b) causes the paramagnetic center (NV1) to emit fluorescence radiation (FL) and wherein this emission of this modulated fluorescence radiation (FL) depends on the magnetic flux at the location of the paramagnetic center (NV1) in the material of the sensor element and on the modulation of the incoming excitation radiation (LB, LB1a, LB1b) and wherein the housing (DE, WA, BO, LF1 to LF6) includes means (RE), - which direct the excitation radiation (LB, LB1a, LB1b) of the source (PL1) onto the paramagnetic center (NV1) and thus couple the source (PL1) for excitation radiation (LB, LB1a, LB1b), in particular the LED (PL1), with the paramagnetic center (NV1) inside the housing (DE, WA, BO, LF1 to LF6) and wherein the housing (DE, WA, BO, LF1 to LF6) includes a first filter (F1) which is an optical filter, and wherein the first filter (F1) is transparent to the fluorescence radiation (FL) of the paramagnetic center (NV1) in the material of the sensor element and where the first filter (F1) is not transparent to the excitation light of the source (PL1) for excitation radiation (LB, LB1a, LB1b) and wherein the receiver (PD1) receives and processes fluorescence radiation (FL) from the paramagnetic center (NV1) and wherein the receiver (PD1) together with the first filter (F1) forms a receiver which is essentially sensitive only to the fluorescence radiation (FL) of the paramagnetic center (NV1) in the material of the sensor element and is essentially not sensitive to the excitation radiation (LB, LB1a, LB1b) of the LED (PL1), and wherein the receiver (PD1) converts the detected fluorescence radiation (FL) into a received signal (S0) and wherein the sensor system is configured to generate a reduced received signal (S1) from the received signal (S0) by subtracting a feedback signal (S6) from the received signal (S0) by means of electrical feedback, or to generate the reduced received signal (S1) by means of optical compensation by irradiating a compensation LED (PLK) into the receiver (PD1), wherein the operation of the compensation LED (PLK) depends on the feedback signal (S6), and wherein the circuit (IC) and the evaluation circuit (M1, TP, M2, G) form a filter output signal (S4) from the reduced received signal (S1) and wherein the sensor system is configured to generate the feedback signal (S6) from the filter output signal (S4) and the transmit signal (S5), and where the filter output signal (S4) is then a measure of the amplitude of the fluorescence radiation (FL) reaching the receiver (PD1) and where the filter output signal (S4) is the output signal (out).

Description

Field of invention

[0001] The invention relates to housings with a sensor system and / or quantum technology system, wherein the sensor system and / or quantum technology system comprises a paramagnetic center in the material of a sensor element and / or quantum technology device element that is part of the sensor system and / or quantum technology system. The paramagnetic center is preferably an NV center in a diamond crystal as the sensor element, and diamond as the material. General Introduction

[0002] Recently, many publications have been made on the use of NV centers as quantum dots for quantum sensing, quantum computing, and quantum cryptography.

[0003] It is known from the prior art that various physical quantities can be determined by measuring the fluorescence radiation from NV centers in diamond.

[0004] The following prior art documents can be cited as examples: A. Wickenbrock [et al.]: “Microwave-free magnetometry with nitrogen-vacancy centers in diamond”. in: Appl. Phys. Lett, 109, 2016, 053505, 02.08.2016 (Measurement of magnetic flux density with NV centers). G. Balasubramanian, IY Chan, R. Kolesov, M. Al-Hmoud, J. Tisler, C. Shin, C. Kim, A. Wojcik, PR Hemmer, A. Krueger, T. Hanke, A. Leitenstorfer, R. Bratschitsch, F. Jeletzko, J. Wrachtrup: “nanoscale imaging magnetometry with diamond spins under ambient conditions”. In: Nature, 455, 2008, 648 (Magnetic field measurement with NV centers). G. Kucsko, PC Maurer, NY Yao, M. Kubo, HJ Noh, PK Lo, H. Park, MD Lukin: “Nanometer-scale thermometry in a living cell”. In Nature, 500, 2013, 54-58 (thermometry with NV centers). F. Dole, H. Fedder, MW Doherty, T. Nöbauer, F. Rempp, G. Balasubramanian, T. Wolf, F. Reinhard, LCL Hollenberg, F. Jeletzko, J. Wrachtup: “Electric-field sensing using single diamond spins”. In: Nat. Phs., 7, 2011, 459-463 (Measurement of electric fields with NV centers). A. Albrecht, A. Retzker, M. Plenio: “Nanodiamond interferometry meets quantum gravity”, arXiv:1403.6038v1 [quant-ph] 24 Mar 2014 (measurement of gravitational fields with NV centers).

[0005] Typically, a lock-in amplifier is used for the measurements. The lock-in method suppresses 1 / f noise by transposing the desired signal to a higher frequency range with dominant white noise for amplification purposes. No reduction of the white noise occurs.

[0006] None of these publications solve the problem of high-volume series production required for the mass market; instead, they commendably describe only fundamental physical phenomena. Therefore, the structures described are not suitable for mass production. Furthermore, it remains entirely unclear how such designs could be tested in series production.

[0007] From US 2018 / 0203080A1, a microfluidic plate with NV centers is known which is read out using the usual apparatus consisting of a confocal microscope (reference 121 of US 2018 / 0203080A1), a dichroic mirror (reference 122 of US 2018 / 0203080A1) using a pulsed laser beam (reference 124 of US 2018 / 0203080A1) and using a laser (reference 123 of US 2018 / 0203080A1) and a photodetector (reference 126 of US 2018 / 0203080A1). A macroscopic microwave resonator (reference number 112 of US 2018 / 0 203 080 A1) enables the manipulation of the NV centers in conjunction with the pulse length of the laser beam pulses (reference number 124 of US 2018 / 0 203 080 A1). A measurement and control unit (reference number 110 of US 2018 / 0 203 080 A1) controls the laser pulses and the microwave resonator (reference number 112 of US 2018 / 0 203 080 A1).The device described in US 2018 / 0 203 080 A1 does not, according to the current state of knowledge, allow for the cost-effective integration of the microfluidic device elements into a CMOS circuit. The applicant of this document addresses this problem in his German patent application, registered with the German Patent and Trade Mark Office (DPMA) under number DE 10 2019 121 028.3, and its divisional applications with equal priority. The technical teaching of US 2018 / 0 203 080 A1 requires large, expensive components and provides no guidance on how cost-effective, high-volume production of sensor systems with a form factor similar to that of microelectronic circuits can be achieved. Fully automated assembly of systems like that described in US 2018 / 0 203 080 A1 onto printed circuit boards is not feasible.The design of the US 2018 / 0 203 080 A1 is suitable for larger machines or tabletop devices, but not for use in mobile devices or mobile phones, especially smartphones.

[0008] From DE 10 2015 015 390 A1 ( Fig. 2 of DE 10 2015 015 390 A1) a device for gesture recognition is known. The device also includes a lock-in amplifier (reference numeral M1). ij , S9 ij , F1 ij , S10d ij , V1 ij and S4 ij , DE 10 2015 015 390 A1) The device of Fig. 2 of DE 10 2015 015 390 A1 also features a compensation transmitter (reference mark K). j DE 10 2015 015 390 A1), which depends on the filter output signal (reference S4) ij DE 10 2015 015 390 A1) a to the transmit signal (reference sign S5 j DE 10 2015 015 390 A1) complementary compensation radiation signal via a second transmission path (reference sign I2)j DE 10 2015 015 390 A1) into the radiation receiver (reference mark D j DE 10 2015 015 390 A1) radiates. In the radiation receiver (reference mark D j (in DE 10 2015 015 390 A1) this compensation radiation signal is superimposed on the radiation signal of a transmitter (reference H) reflected and modified by an object (reference numeral O in DE 10 2015 015 390 A1). i DE 10 2015 015 390 A1), which is from the transmitting signal (reference sign S5 i(DE 10 2015 015 390 A1). This superposition can be considered summative to a first approximation. By appropriately choosing the sign of the feedback and by using high amplification, the system becomes immune to irradiation of the radiation receiver with interfering radiation, e.g., from sunlight. The applicant therefore markets this technology at the time of filing the present document under the name HALIOS, an acronym for (English) High Ambient Light Insensitive Optical System. The first transmission path (reference numeral I1) i DE 10 2015 015 390 A1) and the third transmission line (reference sign I3) j The lines (DE 10 2015 015 390 A1) run in the free space in front of the device and not in the device itself. Fig. Figure 4 of DE 10 2015 015 390 A1 shows the housing of such a device from the outside. The transmitters (reference numbers H1, H2, H3 of DE 10 2015 015 390 A1) radiate outwards. Fig. Figure 5 of DE 10 2015 015 390 A1 shows the position of the object (reference numeral O of DE 10 2015 015 390 A1) relative to the housing. It is obvious that the transmission lines (reference numeral I1) i DE 10 2015 015 390 A1 and reference number I3 j The path (DE 10 2015 015 390 A1) runs in the free space outside the device. This device is therefore far from being suitable for pick-and-place machines. Extensive reference is made to the patent literature on this topic cited in DE 10 2015 015 390 A1.

[0009] A magnetic detection system is known from US patent 2017 / 0 343 695 A1. According to the technical teaching of US patent 2017 / 0 343 695 A1, the magnetic detection system comprises a magneto-optical defect center material containing at least one magneto-optical defect center and emitting an optical signal when excited by an excitation light. According to the technical teaching of US 2017 / 0 343 695 A1, the system comprises a high-frequency excitation system configured to provide RF excitation for the magneto-optical defect center material of US 2017 / 0 343 695 A1, and an optical light source configured to direct the excitation light onto the magneto-optical defect center material.Furthermore, the system of US 2017 / 0 343 695 A1 includes an optical detector which, according to the technical teaching of US 2017 / 0 343 695 A1, is configured to receive the optical signal emitted by the magneto-optical defect center material. The distinctive feature of the technical teaching of US 2017 / 0 343 695 A1 is that it discloses a housing. This housing is very large and not suitable for microintegration and mass production in its current form.

[0010] From the publication by Armstrong, Seiji [et al.]: “NV-NV electron-electron spin and NV-NS electron-electron and electron-nuclear spin interaction in diamond”. In: Physics Procedia, Vol. 3, 2010, No. 4, pp. 1569-1575, a measurement setup for investigating the interactions between NV centers in diamond under varying an external magnetic field is disclosed. In particular, a change in fluorescence intensity depending on NV-NV and NV-NS cross-relaxation effects is revealed. In Section 2 (“Spin Polarization”), this text explains the attenuation of photoluminescence by an external magnetic field (attenuation of the so-called “dark decay” due to mixing of spin states). The evaluation is performed optically using macroscopic measuring instruments. A closed housing with a fully integrated LED, sensor, and evaluation circuitry for compact integration into CMOS-compatible technology is not disclosed.Methods for mass production and integration testing in open-cavity enclosures are also not described there. Task

[0011] The proposal is therefore based on the task of creating a solution that does not have the above disadvantages of the state of the art and offers further advantages. Solution to the task

[0012] This problem is solved by a device according to claim 1 and a manufacturing method according to claim 14.

[0013] This document describes a housing for a quantum technology device and a method for manufacturing and testing this housing, which can be used in fully automatic placement machines for mounting the final housing onto printed circuit boards.

[0014] An advantageous embodiment relates to a housing with a sensor system, wherein the sensor system comprises a paramagnetic center (NV1) in the material of a sensor element and / or quantum technology device element that is part of the sensor system and / or quantum technology system. The sensor system and / or quantum technology system comprises a source of excitation radiation (PL1). The excitation radiation causes the paramagnetic center (NV1) to emit fluorescence radiation (FL). The housing includes means, for example, a reflector (RE), that direct the excitation radiation onto the paramagnetic center (NV1) and thus couple the source of excitation radiation (PL1), for example, an LED, to the paramagnetic center (NV1). Preferably, the LED (PL1) is a green LED with green excitation radiation, while the fluorescence radiation (FL) is typically red.

[0015] Preferably, the sensor element and / or quantum technology device element is a diamond crystal. The paramagnetic center (NV1) is preferably an NV center in the diamond crystal. Such a sensor system is described in the as yet unpublished German patent application DE 10 2018 127 394 A1.

[0016] For the sake of simplicity, the term sensor element will be used in the following as a synonym for a sensor element and / or a quantum technology device element.

[0017] This document describes a method for manufacturing a sensor system that includes the following steps, even if they are in a different order: • Providing an open-cavity enclosure with connectors; • Introduction of a source of excitation radiation (PL1); • Insertion of an integrated circuit (IC) with a receiver (PD1); • Electrical connection of integrated circuit and terminals and source of excitation radiation (PL1); • Incorporating a sensor element with a paramagnetic center (NV1) into the material of the sensor element; • Attaching the sensor element using a fastening device (Ge); • Production of a means for directing the excitation and / or fluorescence radiation; • Closing the housing with a lid;

[0018] The excitation radiation source (PL1) is designed and capable of emitting excitation radiation (LB). When irradiated with this typically green excitation radiation (LB), the paramagnetic center (NV1) in the sensor element material emits fluorescence radiation (FL), which is typically red. The mounting material (Ge) is essentially transparent to both the excitation radiation and the fluorescence radiation (FL) and secures the sensor element to the integrated circuit within the housing.

[0019] A first procedure for testing a housing with a sensor system according to the above proposal is suggested, comprising the following steps: • Irradiating the open housing with excitation radiation; • Measurement of the fluorescence radiation emitted by the housing; • Evaluating the measured fluorescence radiation by comparing the measured value of the fluorescence radiation with a threshold value.

[0020] A second method for testing a housing with a sensor system according to the above proposal is suggested, comprising the following steps: • Operate source of excitation radiation (PL1); • Measurement of the excitation radiation emitted by the housing; • Evaluating the measured excitation radiation by comparing the measured value of the excitation radiation with a threshold value.

[0021] A third method for testing a housing with a sensor system according to the above proposal is suggested, comprising the following steps: • Method for testing a housing with a sensor system according to claim 1 comprising the steps • Operate source of excitation radiation (PL1); • Measurement of the fluorescence radiation emitted by the housing; • Evaluating the measured fluorescence radiation by comparing the measured value of the fluorescence radiation with a threshold value.

[0022] The first method, the second method, and the third method can be combined.

[0023] Furthermore, an integrated circuit is proposed for use with a paramagnetic center (NV1) in the material of a sensor element, comprising a driver for operating a source of excitation radiation (PL1), a receiver (PD1) for detecting fluorescence radiation from the paramagnetic center (NV1), and an evaluation circuit for generating an output signal (out) that depends on the fluorescence radiation (FL) of the paramagnetic center (NV1) in the material of a sensor element. The sensor element is preferably a diamond crystal. The paramagnetic center (NV1) is preferably an NV center within the diamond crystal. Advantage

[0024] Such a housing and the sensor mounted on it enable, at least in some implementations, a compact design and the combination of conventional circuit technology with quantum sensing. However, the advantages are not limited to this. List of characters Fig. Figure 1 shows the basic structure of a proposed system. Fig. Figure 2 shows a so-called open-cavity enclosure from above. Fig. Figure 3 shows the exemplary housing of the Fig. 2 in cross-section. Fig. Figures 4 to 14 describe an exemplary assembly process for the proposed sensor system in the proposed housing. Fig. Figure 15 shows a simple system for an exemplary sub-function of the integrated circuit (IC). Fig. 16 shows the system of Fig. 15 with optical compensation. Fig. Figure 17 shows the test of a proposed system. Fig. Figure 18 shows a basic procedure for manufacturing a sensor system. Fig. 19 corresponds to the Fig. 18, where a test is now being carried out. Fig. 20 shows the system of Fig. 15 with optical compensation via the transmitter. Fig. 21 shows the system of Fig. 15 with electrical compensation and measurement of the afterglow of the fluorescence radiation (FL), which makes it possible to do without the first filter (F1). Fig. 22 Shows the exemplary housing with the sensor system made of Fig. 14 without the first filter (F1); Description of the figures: Figure 1

[0025] Fig. Figure 1 shows the structure of a proposed system. It comprises an integrated circuit (IC) including a receiver (PD). A first filter (F1), preferably an optical filter, is arranged above the receiver. This first filter (F1) is preferably bonded to the surface of the integrated microelectronic circuit (IC). The bond is preferably transparent to the fluorescent light (FL) of a paramagnetic center (NV1) in the material of a sensor element, which is mounted on the side of the first filter (F1) facing away from the receiver (PD1). The integrated microelectronic circuit (IC) is preferably a single crystal. Preferably, the integrated microelectronic circuit (IC) is a CMOS circuit, a bipolar circuit, or a BiCMOS circuit. The material of the microelectronic circuit (IC) is preferably silicon.If a III / V material is used as the substrate for the integrated microelectronic circuit (IC), then co-integration of an LED (PL1) with the microelectronic circuit (IC) and with the receiver (PD) is conceivable. Instead of a vertical arrangement, a lateral arrangement is then more practical. In this case... Fig. For the sake of simplicity, we assume that the LED (PL1) is not co-integrated, but separate. In the example of the Fig. In the first instrument, a sensor element is mechanically connected to the first filter (F1) by means of a mounting material (Ge). Preferably, this material is solidified gelatin. The excitation radiation source (PL1), specifically the LED (PL1), irradiates the paramagnetic centers (NV1) in the sensor element material with excitation radiation. This excites the paramagnetic centers (NV1) in the sensor element material to emit fluorescence radiation (FL). The mounting material (Ge) is preferably transparent to the excitation radiation from the excitation radiation source (PL1), i.e., the LED (PL1), and transparent to the fluorescence radiation (FL) from the paramagnetic centers (NV1) in the sensor element material. The first filter (F1) is preferably transparent to the fluorescence radiation (FL) from the paramagnetic centers (NV1) in the sensor element material.The first filter (F1) is preferably opaque to the excitation light from the source (PL1) for excitation radiation (LB), i.e., the LED (PL1). Ultimately, the receiver (PD1), together with the first filter (F1), forms a receiver that is essentially sensitive only to the fluorescence radiation (FL) of the paramagnetic centers (NV1) in the sensor element material and essentially insensitive to the excitation radiation (LB) of the LED (PL1). The integrated circuit (IC) preferably modulates the excitation radiation (LB) from the source (PL1), i.e., the LED (PL1). This modulated excitation radiation (LB) strikes the paramagnetic centers (NV1) in the sensor element material. Depending on the magnetic flux at the location of the paramagnetic centers (NV1) in the sensor element material, these centers then emit modulated fluorescence radiation (FL), the modulation of which depends on the modulation of the incoming excitation radiation.

[0026] This modulation of the excitation radiation thus results in a correlated modulation of the fluorescence radiation (FL). Therefore, the received signal (S0) of the receiver (PD1) of the integrated circuit (IC), which is struck by the modulated fluorescence radiation (FL), is also modulated. Since the intensity of the fluorescence radiation (FL) depends on the magnetic flux at the location of the paramagnetic centers (NV1) in the sensor element material, the modulation of the received signal (S0) also depends on the magnetic flux at the location of the paramagnetic centers (NV1) in the sensor element material.

[0027] The integrated circuit can now evaluate the modulation of the received signal (S0) and, depending on this, actuate actuators or modify their operation. For example, the integrated circuit can supply a first coil (L1) with a different current, thus compensating for a change in the magnetic field that the integrated circuit has detected due to a change in the modulation of the received signal (S0). Preferably, this first coil (L1) is part of the integrated circuit. It can then be manufactured, for example, as a single-layer or multi-layer coil. However, the first coil (L1) can also be manufactured separately. Figure 2

[0028] Fig. Figure 2 shows a so-called open-cavity housing in a top view. It comprises a base (BO). This base (BO) is enclosed by a surrounding wall (WA), so that the base (BO) together with this wall (WA) forms an upwardly open cavity into which components can subsequently be mounted. In the example of the Fig. Figure 2 shows four exemplary contacts. The number of contacts and their shape can vary. Preferably, the final shape of the assembled housing corresponds to a standard housing, such as QFN, so that fully automated pick-and-place machines can be used to mount the final housing onto printed circuit boards. Preferably, the base (BO) and the wall are made of thermoset plastic, so that the housing with the components contained within can be used in a single soldering process. Mounting surfaces are preferably incorporated into the base of the housing. These are preferably made of metal. This metal is preferably coated to ensure better adhesion of the bond wires. Hereinafter, these mounting surfaces are referred to as the lead frame surface.

[0029] A third lead-frame surface (LF3) and a second lead-frame surface (LF2) are embedded in the floor (BO). However, their surfaces are exposed within the cavity (CAV). In the example of the Fig. 2. The contacts of the housing are designed as leadframe surfaces that penetrate the surrounding wall (WA), thus enabling electrical contact through the wall (WA). In the example of the Fig. 4. A first lead-frame surface (LF1) penetrates the surrounding wall. In the example of the Fig. In the example of the Fig. 4. A fifth lead-frame surface (LF5) penetrates the surrounding wall. In the example of the Fig. 4 A sixth lead frame surface (LF6) penetrates the surrounding wall.

[0030] The proposed package preferably has at least three connections: a positive supply voltage line (Vdd), a reference potential line (GND), hereinafter referred to as ground, and an input / output line (out). The integrated circuit (IC) is supplied with electrical power via the supply voltage line (Vdd) and the reference potential line. The input / output line can be digital and / or analog. In the example of the Fig. 15 and Fig. 16 is the analog output. Fig. 15 and Fig. However, 16 can also be implemented digitally. Preferably, the input / output is a bidirectional single-wire data bus. Well-known automotive data buses such as the LIN data bus, the DSI3 data bus, or the PSI5 data bus are particularly suitable. For example, in the case of the LIN data bus and / or the DSI-3 data bus, a fourth connection can be provided as an extension of the data bus. In this case, it is possible to determine the position of the housing with the sensor system in the data bus using a prior art auto-addressing method and thus determine a software address that allows each installed sensor system to be addressed with an individual sensor address predetermined by its physical position. The following publications are cited as examples of such auto-addressing methods: EP 1490 772 B1, DE 10 2017 122 365 B3.Their disclosure content, in combination with this disclosure, forms an integral part of this disclosure.

[0031] This is particularly desirable for biometric and / or medical applications with a large number of sensors, as it reduces costs. Figure 3

[0032] Fig. Figure 3 shows the exemplary housing of the Fig. 2 in cross-section. The cavity (CAV) is marked. Figures 4 to 14

[0033] The Fig. Figures 4 to 14 describe an exemplary assembly process for the proposed system. Figure 4

[0034] In Fig. 4. First, a third adhesive (GL3) is applied to the third lead frame surface (LF3) using a dispenser. Then, a second adhesive (GL2) is applied to the second lead frame surface (LF2) using a dispenser. Figure 5

[0035] In Fig. Step 5: The LED (PL1) is placed in the third adhesive (GL3) on the third lead frame surface (LF3) and thus attached to the third lead frame surface (LF3). Preferably, the third adhesive (GL3) is electrically conductive. In this case, an electrical connection is created between the LED (PL1) and the third lead frame surface (LF3). Figure 6

[0036] In Fig. 6. An integrated circuit (IC) is placed in the second adhesive (GL2) and thus attached to the second lead-frame surface (LF2). Preferably, the second adhesive (GL2) is electrically conductive. In this case, an electrical connection is created between the back of the integrated circuit (IC) and the wider lead-frame surface (LF2). In this example, the integrated circuit (IC) comprises the receiver (PD1) and the first coil (L1), which in this example is the Fig. 6 surrounds the receiver. Figure 7

[0037] In Fig. 7. A first adhesive (GL1) is applied to the surface of the integrated circuit (IC) in the receiver area (PD1). The first adhesive (GL1) is preferably essentially transparent to the fluorescence radiation (FL) of the paramagnetic centers (NV1) in the sensor element material. Of course, other functionally equivalent fastening methods can also be used instead of a first adhesive for the sensor element described below. Fig. The first filter (F1) described in section 8 can be used. Figure 8

[0038] In Fig. 8. The first filter (F1) is placed in the first adhesive. The first filter (F1) is preferably substantially transparent to the fluorescence radiation (FL) of the paramagnetic centers (NV1) in the sensor element material. The first filter (F1) is preferably substantially opaque to the excitation radiation (LB) of the LED (PL1). The first filter (F1) and the first adhesive (GL1) can be omitted if the receiver (PD1) is designed from the outset to be substantially sensitive to the fluorescence radiation of the paramagnetic centers (NV1) in the sensor element material and insensitive to the excitation radiation (LB) of the LED (PL1).Therefore, the combined functionality of receiver (PD1), first adhesive (GL1) and first filter can also be considered as a receiver (PD1) that is essentially sensitive to the fluorescence radiation of the paramagnetic centers (NV1) in the material of the sensor element and is not sensitive to the excitation radiation (LB) of the LED (PL1). Figure 9

[0039] In Fig. 9. The sensor element is placed on the first filter (F1). This step can also be combined with the following step of the Fig. 10 together. The sensor element comprises the paramagnetic centers (NV1) in the material of the sensor element. Figure 10

[0040] In Fig. 10. The fastening material (Ge) for attaching the sensor element with the paramagnetic centers (NV1) in the material of the sensor element to the first filter (F1) is introduced. Preferably, the fastening material is gelatin. Preferably, the gelatin is mixed with the sensor elements and applied together. In the disclosure presented here, explicit reference is made to the unpublished patent application DE 10 2019 114 032.3, which was published as an internal priority, for example, in patent applications DE 10 2019 009 145 A1, DE 10 2019 121 029 A1 and DE 10 2019 009 136 A1. Figure 11

[0041] In Fig. 11. Further electrical connections are made using bond wires. Here, the first bond wire (BD1), the second bond wire (BD2), and the third bond wire (BD3) are only examples. Figure 12

[0042] In Fig. 12. A fourth adhesive (GL4) is applied to the walls (WA). An equivalent bonding agent can also be used instead of a fourth adhesive (GL4). For example, if the walls (WA) are made of glass, the use of a glass solder is conceivable. Figure 13

[0043] In Fig. 13. The cover (DE), provided with a reflective material (RE) (for example, a coating of titanium oxide) as a reflector (RE), is placed on the wall. This is preferably done in a controlled atmosphere, for example, in a protective gas or noble gas and / or in a vacuum and / or in an atmosphere with reduced pressure. Figure 14

[0044] After the cover (DE) is attached, the reflector (RE) can direct the excitation radiation (LB1a) from the LED (PL1) as reflected excitation radiation (LB1b) into the sensor element. There, this reflected excitation radiation (LB1b) excites the paramagnetic centers (NV1) in the sensor element's material, causing them to emit fluorescence radiation (FL). This radiation is received and processed by the receiver (PD1) of the integrated circuit (IC). The reflector (RE) thus serves as an optical functional element of the housing, optically coupling the paramagnetic centers (NV1) in the sensor element's material to the LED (PL1). Figure 15

[0045] Fig. Figure 15 shows a simple system for an exemplary sub-function of the integrated circuit (IC). A signal generator (G) produces a transmit signal (S5). The LED (PL1) converts the transmit signal into a modulated excitation radiation (LB), which strikes the sensor element directly or indirectly, as previously described. There, this reflected excitation radiation (LB) excites the paramagnetic centers (NV1) in the sensor element's material to emit fluorescence radiation (FL). The first filter (F1) allows the fluorescence radiation (FL) to pass through, while blocking the modulated excitation radiation (LB). The fluorescence radiation (FL) is modulated in a manner correlated with the excitation radiation (LB). After passing through the first filter (F1), the modulated fluorescence radiation (FL) is received by the receiver (PD1) and converted into a modulated received signal (S0). The receiver (PD1) may include further amplifiers and filters.A first adder (A1) subtracts a feedback signal (S6) from the received signal (S0), resulting in the reduced received signal (S1). This reduced received signal (S1) is then processed in a synchronous demodulator. A first multiplier (M1) multiplies the reduced received signal (S1) by the transmitted signal (S5), forming the filter input signal (S3). The DC component of the filter input signal is passed through a low-pass filter (TP), resulting in the filter output signal (S4). Formally, the first multiplier (M1) and the low-pass filter (TP) calculate a scalar product of the reduced received signal (S1) and the transmitted signal (S5). The value of the filter output signal (S4) then indicates the proportion of the transmitted signal (S5) present in the reduced received signal (S1). This filter output signal (S4) can be compared to a Fourier coefficient in its function.A second multiplier (M2) multiplies the filter output signal (S4) by the transmit signal (S5), thus forming the feedback signal (S6). If the gain of the low-pass filter (TP) is very high, the reduced received signal (S1) typically contains no component of the transmitted signal, except for a control error when stability is achieved. The value of the filter output signal (S4) then serves as a measure of the amplitude of the fluorescence radiation (FL) reaching the receiver (PD1). This receiver output signal (S4) is then output as the sensor output signal (out) via one of the lead-frame surfaces using a bond wire. Figure 16

[0046] Fig. 16 shows the system of Fig. 15, with the difference that the feedback signal (S6) is now not fed back electrically via a first adder (A1), but via a compensation LED (PLK). For this purpose, the level and offset of the feedback signal (S6) are appropriately adjusted by an matching circuit (OF). This results in a compensation send signal (S7) as the output signal of the matching circuit (OF). The compensation LED (PLK) is operated with this compensation send signal (S7). The compensation LED (PLK) then emits light into the receiver (PD1). To reproduce the subtraction, the output of the low-pass filter (TP) is designed to be inverted. Therefore, it is not important at which point in the control loop this inversion occurs, but only that it takes place.Preferably, the device is provided with a first barrier (BA1) that prevents the compensation LED (PLK) from irradiating the paramagnetic centers (NV1) in the sensor element material and thus exciting them to emit fluorescence radiation (FL). It is therefore a barrier against electromagnetic radiation and / or light.

[0047] Preferably, the device is provided with a second barrier (BA2) that prevents the LED (PL1) from directly illuminating the receiver (PD1). This barrier also acts as a barrier against electromagnetic radiation and / or light. However, for control engineering reasons, a very small degree of direct irradiation may be desirable to improve the control system's detection range. Figure 17

[0048] Fig. Figure 17 shows the test of a proposed system. The test is preferably performed before closing the housing with the cover (DE). Preferably, the integrated circuit is activated by contacting the housing and applying suitable patterns. A first test LED (LED1) emits excitation radiation onto the paramagnetic centers (NV1) in the sensor element material. This excites the paramagnetic centers (NV1) in the sensor element material to emit fluorescence radiation (FL). This fluorescence radiation (FL) can be detected by a first test receiver (TD1), which is equipped with a test filter (TF1) that allows only the aforementioned fluorescence radiation (FL) to pass through and is therefore essentially sensitive only to this radiation. The fluorescence radiation (FL) is detected by the test receiver (TD1) and converted into a measured value. This measured value is compared with a target value by a test device (not shown).If the comparison yields a negative result, the system is faulty.

[0049] In another test step, the integrated circuit (IC) causes the LED (PL1) to emit excitation radiation (LB) based on a command from the external test device. This emitted excitation radiation (LB) partially strikes the paramagnetic centers (NV1) in the sensor element material. An external mirror (EMI) may be used for this purpose. This irradiation excites the paramagnetic centers (NV1) in the sensor element material, causing them to emit fluorescence radiation (FL). This fluorescence radiation (FL) can be detected by the first test receiver (TD1), which is equipped with a test filter (TF1) that allows only the aforementioned fluorescence radiation (FL) to pass through and is therefore essentially sensitive only to it. The fluorescence radiation (FL) is then detected by this test receiver (TD1) and converted into a measured value.This measured value is compared to a second target value using a test device (not shown). If the comparison is negative, the system is faulty.

[0050] The excitation radiation (LB) of the LED (PL1) can be detected by a second test receiver (TD2). This excitation radiation (LB) is recorded by this test receiver (TD2) and converted into a measured value. This measured value is compared to a third target value by a test device (not shown). If the comparison is negative, the system is faulty. Figure 18

[0051] Fig. Figure 18 shows a basic process flow for manufacturing a sensor system. The proposed manufacturing process comprises the following steps, although the order of the steps may vary slightly, additional steps may be performed, and steps may be combined. A first step is the provision (1) of a so-called premolded open-cavity housing with connections. This means that it is preferably a pre-formed housing that has a cavity (CAV) into which the components are mounted. The housing is in the Fig. 2 and Fig. Figure 3 illustrates this. The second step involves (2) introducing a source of excitation radiation (PL1), i.e., the LED (PL1). The third step involves (3) introducing an integrated circuit (IC) with a receiver (PD1), which is preferably wavelength-sensitive. This means it is preferably sensitive to the fluorescence radiation (FL) of a paramagnetic center (NV1) in the sensor element material and essentially insensitive to the excitation radiation (LB) of the LED (PL1), which causes the paramagnetic center (NV1) to emit the fluorescence radiation (FL). The next step involves (4) electrically connecting the integrated circuit (IC) and the terminals (LF1, LF2, LF4, LF5, LF6) to the source (PL1) of the excitation radiation (LB), i.e., the LED (PL1).Next, (5) a sensor element with a paramagnetic center (NV1) in the sensor element material is inserted, and (6) the sensor element is secured using a fastening element (Ge). These last two steps can also be performed simultaneously. As a further step, (7) a means for directing the excitation radiation (LB) and / or fluorescence radiation (FL) is produced. This is the reflector (RE). The reflector (RE) can also simply be the untreated side of the lid (DE9) facing the cavity (CAV). This lid side (DE) can be coated, provided with an optical functional element, microstructured, and have a curvature, which can be modulated, to optically couple the LED (PL1) with the paramagnetic center (NV1) in the sensor element material.Closing (8) the housing with said cover (DE) completes the process in its basic form. In the . Fig. Section 18a outlines the basic procedure, while in the Fig. 18b steps five and 6 are carried out together. Figure 19

[0052] In the Fig. 19a is the procedure of Fig. Figure 18a illustrates this again. Between the step of attaching (6) the sensor element using a fastening device (Ge) and the step of producing (7) a means for guiding the excitation radiation (LB) and / or fluorescence radiation (FL), a step for testing the system function (9) is inserted, in which a measured value is determined. This measured value is compared with a threshold value in a further step (10). If the comparison is positive (p), the known step of producing (7) a means for guiding the excitation radiation (LB) and / or fluorescence radiation (FL) follows. If the comparison is negative (n), the system is either rejected (11) or reworked.

[0053] In the Fig. 19a is the procedure of Fig. Figure 18a illustrates this again. Between the step of attaching (6) the sensor element using a fastener (Ge) and the step of manufacturing (7) a means for directing the excitation radiation (LB) and / or fluorescence radiation (FL), a step (12) for applying the first adhesive (GL1) to the integrated microelectronic circuit (IC) and a step (13) for placing the first filter (F1) in the first adhesive (GL1) are provided. These steps are necessary if the receiver is not substantially selective for the fluorescence radiation (FL) of the paramagnetic center of the sensor element material compared to the excitation radiation (LB) of the LED (PL1).

[0054] Further steps are possible. The steps can also be combined where appropriate. It is also possible to perform more than one test step (10).

[0055] For example, a test step (9) can check the emission of fluorescence radiation (FL) through the paramagnetic center (NV1) of the sensor element material by irradiation with excitation radiation.

[0056] In test step (9), for example, the emission of fluorescence radiation (FL) by the paramagnetic center (NV1) of the material of the sensor element can be tested by causing the LED (LED1) to emit excitation radiation (LB), and preferably the excitation radiation emitted by the LED (PL1) can also be tested.

[0057] In test step (9), for example, the emission of fluorescence radiation (FL) by the paramagnetic center (NV1) of the sensor element material can be tested by irradiation with excitation radiation as a function of an externally generated magnetic flux. This is particularly useful for calibration purposes. The calibration data obtained can then be stored in a memory of the microelectronic circuit (IC). Such a test and calibration are, of course, advisable after the cover (DE) has been placed on the housing. Figure 20

[0058] Fig. Figure 20 illustrates the process for optical compensation using a controlled compensation LED (PLK). The sensor system again includes a paramagnetic center (NV1) within the material of a sensor element, which is part of the sensor system. The method for operating the sensor system proceeds as follows: a compensation transmission signal (S7) triggers the modulated emission of modulated compensation radiation (KS) by the modulated compensation LED (PLK). Modulated fluorescence radiation (FL) is generated by modulated excitation radiation (LB) via a paramagnetic center (NV1) within the material of a sensor element. The origin of the excitation radiation (LB) will be described later. In the receiver (PD1), the modulated fluorescence radiation (FL) and the modulated compensation radiation (KS) are received superimposed, and a receive signal (S0) is generated.Once the control system described below has stabilized in the absence of interfering sources, the received signal (S0) preferably contains no modulation. A correlation of the received signal (S0) with the modulated compensation transmit signal (S7) is then performed, particularly with the aid of a synchronous demodulator, and an output signal (out) is generated to detect the modulated component in the received signal (S0) and then compensate for it using the transmit signal (S5). The proposed alternative method involves generating a transmit signal (S5) modulated by the compensation transmit signal (S7) using the output signal (out). The output signal (out) depends on the intensity of the correlation between the modulation of the fluorescence radiation (FL) and the compensation transmit signal (S8).

[0059] The correlation is preferably performed using the steps • Multiplication of the received signal (S0) with the compensation transmit signal (S7) to obtain the filter input signal (S3); • Filtering the filter input signal (S3) with a filter (TP) to the filter output signal (S4), where the filter output signal is multiplied by a factor of -1; • Multiplication of the filter output signal (S4) with the compensation transmit signal (S7) to obtain the transmit pre-signal (S8); • Formation of the transmit signal (S5) from the transmit pre-signal (S8); • Controlling a transmitter (PL1) with the transmit signal (S5); • Emitting an excitation radiation (LB) through the LED (PL1) depending on the transmit signal (S5); • Use of the filter output signal (S4) to form the output signal (out), where the output signal (out) for the purposes of this feature may be equal to the filter output signal (S4). Figure 21

[0060] Fig. 21 corresponds to an extended system of Fig. 15. Fig. 16 and Fig. 20 can be expanded in an analogous way. Also Fig. Figure 21 shows a simple system for an exemplary sub-function of the integrated circuit (IC). A signal generator (G) produces a transmit signal (S5) and a reference signal (S5') orthogonal to the transmit signal (S5) with respect to the scalar product, which is implemented here by way of example by the first multiplier (M1) and the filter (TP). For simplification, we assume that the transmit signal (S5) and the orthogonal reference signal (S5') are periodic. Preferably, the filter (TP) is then provided with an output buffer that samples the filter output value reached at each period end of the period of the transmit signal (S5) immediately before its output and outputs it until the next period end. This latch or sample-and-hold circuit is shown in the Fig. 15, Fig. 16, Fig. 20 and Fig. Figure 21 is omitted for simplification, but is very useful for precisely defining the time integration limits of the scalar product. This also applies to the additional filter (TP') and the additional first multiplier (M1'). For simplification, it is assumed here that the additional first multiplier (M1') has the same properties as the first multiplier (M1). Furthermore, it is assumed that the additional filter (TP') has the same properties as the filter (TP). The LED (PL1) converts the transmitted signal (S5) back into a modulated excitation radiation (LB), which strikes the sensor element directly or indirectly, as previously described. There, this reflected excitation radiation (LB) excites the paramagnetic centers (NV1) in the sensor element material to emit fluorescence radiation (FL). The first filter (F1) allows the fluorescence radiation (FL) to pass through, while it blocks the modulated excitation radiation (LB).The fluorescence radiation (FL) is correlated, but typically modulated with a defined phase shift relative to the excitation radiation (LB). This can now be exploited. After passing through the first filter (F1), the modulated fluorescence radiation (FL) is received by the receiver (PD1) and converted into a modulated receive signal (S0). The receiver (PD1) may include further amplifiers and filters. A first adder (A1) subtracts a complex feedback signal (S8) from the receive signal (S0), resulting in the reduced receive signal (S1). This reduced receive signal (S1) is then further processed by two synchronous demodulators. First synchronous demodulator

[0061] A first multiplier (M1) multiplies the reduced received signal (S1) by the transmitted signal (S5), thus forming the filter input signal (S3). The DC component of the filter input signal is passed through the low-pass filter (TP). This results in the filter output signal (S4), which is the output signal of the low-pass filter (TP). Formally, the first multiplier (M1) and the low-pass filter (TP) form a scalar product of the reduced received signal (S1) and the transmitted signal (S5). The value of the filter output signal (S4) then indicates the proportion of the transmitted signal (S5) present in the reduced received signal (S1). This filter output signal (S4) can be compared to a Fourier coefficient in its function. A second multiplier (M2) multiplies the filter output signal (S4) by the transmitted signal (S5), thus forming the feedback signal (S6).If the gain of the low-pass filter (TP) is very high, the reduced received signal (S1) typically contains no component of the transmitted signal (S5), except for a control error at stability. The value of the filter output signal (S4) is then a measure of the amplitude of the fluorescence radiation (FL) reaching the receiver (PD1). This receiver output signal (S4) is then output as the sensor output signal (out) via one of the lead-frame areas using a bond wire. Second synchronous demodulator

[0062] An additional first multiplier (M1') multiplies the reduced received signal (S1) by the orthogonal reference signal (S5'), thus forming the additional filter input signal (S3'). The DC component of the additional filter input signal (S3') is passed through the additional low-pass filter (TP'). This results in the additional filter output signal (S4'), which serves as the output signal of the additional low-pass filter (TP'). Formally, the additional first multiplier (M1') and the additional low-pass filter (TP') form a scalar product of the reduced received signal (S1) and the orthogonal reference signal (S5'). The value of the additional filter output signal (S4') then indicates the proportion of the orthogonal reference signal (S5') present in the reduced received signal (S1). This additional filter output signal (S4') can be compared in its function to another Fourier coefficient.An additional second multiplier (M2') multiplies the additional filter output signal (S4') by the orthogonal reference signal (S5') to form the additional feedback signal (S6'). If the gain of the additional low-pass filter (TP') is very high, the reduced received signal (S1) typically contains no component of the orthogonal reference signal (S5') except for a control error at stability. The value of the additional filter output signal (S4) is then a measure of the amplitude of the fluorescence radiation (FL) reaching the receiver (PD1) at times when no excitation radiation (LB) is emitted by the LED (PL1). This additional receiver output signal (S4') is then output as an additional sensor output signal (out') via one of the lead-frame surfaces using a bond wire. The advantage of this arrangement is that when measuring via the additional sensor output signal (out'), the filter (F1) (see . Fig. 1 and 4 to 14 and 17) as well as the corresponding first adhesive (GL1) can be omitted, which further significantly reduces the cost of the system.

[0063] Thus, this system implements a method for operating a sensor system and / or quantum technology system, wherein the sensor system and / or quantum technology system comprises a paramagnetic center (NV1) in the material of a sensor element and / or quantum technology device element, which is part of the sensor system and / or quantum technology system. A modulated excitation radiation (LB) is emitted by means of a transmission signal (S5), in particular by the excitation radiation source (PL1). A paramagnetic center (NV1) in the material of a sensor element and / or quantum technology device element generates modulated fluorescence radiation (FL) that depends on the modulated excitation radiation (LB). As already described, the paramagnetic center is preferably an NV center in a diamond as the sensor element.As also mentioned, the modulated fluorescence radiation (FL) is typically phase-shifted relative to the modulated excitation radiation (LB). The paramagnetic center (NV1) in the material of the sensor element and / or quantum technology device element therefore continues to emit modulated fluorescence radiation (FL) after excitation by the modulated excitation radiation (LB) and even when no further modulated excitation radiation (LB) is directed at the paramagnetic center (NV1) in the material of the sensor element and / or quantum technology device element. This afterglow is represented here by the additional sensor output signal (out'). Thus, the modulated fluorescence radiation (FL) is received and a receive signal (S0) is generated.To determine the afterglow, the intensity of the modulated fluorescence radiation (FL) of the paramagnetic center (NV1) in the sensor element material is measured at times when the modulated emission of the modulated excitation radiation (LB), particularly from the excitation radiation source (PL1), is not occurring. The corresponding measure is the value of the additional sensor output signal (out').

[0064] A second adder (A2) sums the feedback signal (S6) and the additional feedback signal (S6'9) to form the complex feedback signal (S8), thus closing the control loop. The signs and gains of the filters (TP and TP') are chosen to achieve stability in the control loop, so that the reduced received signal (S1) essentially contains no components of the complex feedback signal (S8) and the transmitted signal (S5) except for system noise and control errors. Figure 22

[0065] Fig. 22 shows a system without the first filter (F1) and without the first adhesive (GL1), for example, for operation with a system according to Fig. 21.

[0066] In the system of Fig. 22. This is therefore a sensor system and / or quantum technology system, wherein the sensor system and / or quantum technology system comprises a paramagnetic center (NV1) in the material of a sensor element and / or quantum technology device element that is part of the sensor system and / or quantum technology system, and wherein the sensor system and / or quantum technology system comprises a source (PL1) for excitation radiation (LB), in particular an LED (PL1). The excitation radiation (LB) emitted by the LED (PL1) at first times causes the paramagnetic center (NV1) to emit fluorescence radiation (FL). This is phase-shifted with respect to the excitation radiation (LB). The sensor system and / or quantum technology system therefore comprises means (PD1, A1, M1, TP, M2, A2, G, M1', TP', M2'), for example, those of the Fig. 20, which detect the fluorescence radiation (FL) of the paramagnetic center (NV1) at second times, which differ from the first times. For example, the excitation radiation (LB) can be modulated by a PWM signal as the transmit signal (S5) with an exemplary duty cycle of 50%. The orthogonal reference signal (S5') is then, for example, also preferably a PWM signal with a 50% duty cycle, which is preferably phase-shifted by 90° relative to the transmit signal (S5) when the levels of the transmit signal (S5) and the orthogonal reference signal (S5') are applied symmetrically around 0, i.e., oscillating between 1 and -1. If the levels are applied at 1 and 0, the orthogonal reference signal (S5') is preferably shifted by 180° relative to the transmit signal (S5), i.e., inverted relative to the transmit signal (S5). Other orthogonality combinations (e.g., different frequencies) are conceivable.In the case of a level definition with 0 and 1, operating LEDs as transmitters (PL1) is particularly advantageous. For example, accordingly... Fig. The additional sensor output signal (out') generated in 21 then represents a value for the fluorescence radiation (FL) of the paramagnetic center s(NV1) at times when no excitation radiation (LB) is emitted. Since the temporal profile of the afterglow of the paramagnetic centers (NV1) is known, and thus the phase shift is predetermined, this value, represented by the additional sensor output signal (out'), depends on the fluorescence radiation (FL) of the paramagnetic center (NV1) and thus, for example, on the magnetic flux at the location of the paramagnetic center (NV1) that influences this fluorescence radiation (FL) of the paramagnetic center (NV1). The advantage is that in this way only three components need to be mounted in the housing. Reference symbol list A1 first adder; A2 second adder; BA1 first barrier; BA2 second barrier; BD1 first bond wire; BD2 second bond wire; BD3 third bond wire; BO bottom of the housing; CAV cavity, which is formed by the floor (BO) and surrounding wall (WA). DE lid; EMI external mirror; F1 first filter. The first filter is transparent to the fluorescence light (FL) of the paramagnetic centers (NV1) in the sensor element material. Preferably, this is the fluorescence radiation of an NV center, wherein the sensor element is preferably a nano-diamond with diamond as the material; FL Fluorescence light from the paramagnetic centers (NV1) in the sensor element material. Preferably, this is the fluorescence radiation of an NV center, wherein the sensor element is preferably a nano-diamond with diamond as the material; G Signal generator; A fastening means by which the sensor element with the paramagnetic centers (NV1) in the sensor element material is attached to the first filter (F1) and / or to the integrated circuit (IC). The fastening means is preferably transparent to fluorescence light from the paramagnetic centers (NV1) in the sensor element material. The fastening means is preferably transparent to the fluorescence radiation (FL) from the paramagnetic centers (NV1) in the sensor element material. The fastening means is preferably transparent to the excitation radiation of the LED (PL1). GL1 first adhesive for attaching the sensor element to the first filter (F1); GL2 is the second adhesive applied to the second lead frame surface (LF2); GL3 is the third adhesive applied to the third lead frame surface (LF3); GL4 fourth adhesive for attaching the lid (DE). IC integrated circuit; L1 first coil. The first coil is an optional element, preferably part of the integrated circuit (IC), that can generate a magnetic field. Preferably, the first coil is energized by the integrated circuit. LB excitation radiation; LB1a excitation radiation; LB1b reflected excitation radiation; LED1 first test LED; LF1 first lead frame surface; LF2 second lead frame surface; LF3 third lead frame surface; LF4 fourth lead frame surface; LF5 fifth lead frame surface; LF6 sixth lead frame surface; M1 first multiplier; M1' additional first multiplier; M2 second multiplier; M2' additional second multiplier; NV1 is a paramagnetic center in the sensor element material. When irradiated with excitation radiation from the LED (PL1), the paramagnetic centers emit fluorescent light (FL). This fluorescent emission from a parametric center typically depends on the magnetic flux density at the location of the respective paramagnetic center. The crystal orientation of the sensor element material can typically influence this emission and the dependence of this fluorescent light (FL) emission on the magnetic flux. The paramagnetic center is preferably an NV center. The material is preferably diamond. The sensor element is preferably a diamond crystal, and even more preferably a diamond nanocrystal. OF matching circuit; out sensor output signal; out' additional sensor output signal; PD1 Receiver. The receiver is sensitive to the fluorescence light (FL) emitted by the paramagnetic centers (NV1) in the sensor element material. Preferably, this is the fluorescence radiation (FL) of an NV center, and the sensor element is preferably a nanodiamond with diamond as the material. Preferably, the receiver is part of the integrated circuit (IC). Preferably, it is a photodiode. This can be, for example, an APD (avalanche photodiode) or a SPAD (single photoavalanche diode), etc. PL1 LED. The LED can also be a laser diode or another suitable light source. The LED emits excitation radiation that excites the paramagnetic centers (NV1) in the sensor element material to emit fluorescent light (FL). PLK compensation LED. The compensation LED can also be a laser diode or another suitable light source; RE reflector; S0 receive signal; S1 reduced received signal; S3 filter input signal; S3' additional filter input signal; S4 filter output signal; S4' additional filter output signal; S5 transmit signal; S5' orthogonal reference signal; S6 feedback signal; S6' additional feedback signal; S7 compensation transmission signal; S8 complex feedback signal; TP low-pass filter; TP' additional low-pass filter; WA surrounding wall of the housing; List of cited works DE 10 2017 122 365 B3, DE 10 2018 127 394 A1, DE 10 2019 114 032.3 or DE 10 2019 009 145 A1, DE 10 2019 121 029 A1 and DE 10 2019 009 136 A1, EP 1490 772 B1, US 2017 / 0 343 695 A1, A. Wickenbrock [et al.]: “Microwave-free magnetometry with nitrogen-vacancy centers in diamond”. In: Appl. Phys. Lett, 109, 2016, 053505, 02.08.2016 (Measurement of magnetic flux density with NV centers). G. Balasubramanian, IY Chan, R. Kolesov, M. Al-Hmoud, J. Tisler, C. Shin, C. Kim, A. Wojcik, PR Hemmer, A. Krueger, T. Hanke, A. Leitenstorfer, R. Bratschitsch, F. Jeletzko, J. Wrachtrup: “nanoscale imaging magnetometry with diamond spins under ambient conditions”. In: Nature, 455, 2008, 648 (Magnetic field measurement with NV centers). G. Kucsko, PC Maurer, NY Yao, M. Kubo, HJ Noh, PK Lo, H. Park, MD Lukin: “Nanometer-scale thermometry in a living cell”. In: Nature, 500, 2013, 54-58 (thermometry with NV centers). F. Dole, H. Fedder, MW Doherty, T. Nöbauer, F. Rempp, G. Balasubramanian, T. Wolf, F. Reinhard, LCL Hollenberg, F. Jeletzko, J. Wrachtup: "Electric-field sensing using single diamond spins". In: Nat. Phs., 7, 2011, 459-463 (Measuring electric fields with NV centers). A. Albrecht, A. Retzker, M. Plenio, “Nanodiamond interferometry meets quantum gravity”. arXiv:1403.6038v1 [quant-ph] 24 Mar 2014 (Measuring gravitational fields with NV centers) Armstrong, Seiji [et al.]: "NV–NV electron-electron spin and NV–NS electron–electron and electron-nuclear spin interaction in diamond". In: Physics Procedia, 3. Jg., 2010, No. 4, pp. 1569–1575.

[0067] None of these publications, however, reveals a cost-effective and efficient method for mass-producing and testing quantum optical microsystems that miniaturize such measurement techniques at a price suitable for the mass market. The methods presented therein are based on expensive, space-consuming measurement setups that are far from being ready for mass production.

Claims

[1] Housing (DE, WA, BO, LF1 to LF6) with a sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) and / or quantum technology system, which is hereinafter also referred to simply as a sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1), wherein the housing (DE, WA, BO, LF1 to LF6) has a cavity (CAV) and wherein the housing (DE, WA, BO, LF1 to LF6) comprises a premolded open-cavity housing (WA, BO, LF1 to LF6) and wherein the sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) comprises a paramagnetic center (NV1) in the material of a sensor element and / or quantum technology device element that is part of the sensor system and wherein the sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) includes a receiver (PD1) and wherein the sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) comprises an integrated circuit (IC) and an evaluation circuit (M1, TP, M2, G) for generating an output signal (out) and wherein the sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) comprises a source (PL1) for excitation radiation (LB, LB1a, LB1b), in particular an LED (PL1), and wherein the sensor element with the paramagnetic center (NV1) is located in the cavity (CAV) of the housing (DE, WA, BO, LF1 to LF6) and wherein the receiver (PD1) is located in the cavity (CAV) of the housing (DE, WA, BO, LF1 to LF6) and wherein the source (PL1) for excitation radiation (LB, LB1a, LB1b) is located in the cavity (CAV) of the housing (DE, WA, BO, LF1 to LF6) and wherein the circuit (IC) is located in the cavity (CAV) of the package (DE, WA, BO, LF1 to LF6) and wherein the excitation radiation (LB, LB1a, LB1b) of the source (PL1) for excitation radiation (LB, LB1a, LB1b) causes the paramagnetic center (NV1) to emit fluorescence radiation (FL) and wherein this emission of this modulated fluorescence radiation (FL) depends on the magnetic flux at the location of the paramagnetic center (NV1) in the material of the sensor element and on the modulation of the incoming excitation radiation (LB, LB1a, LB1b) and wherein the housing (DE, WA, BO, LF1 to LF6) includes means (RE), - which direct the excitation radiation (LB, LB1a, LB1b) of the source (PL1) onto the paramagnetic center (NV1) and thus couple the source (PL1) for excitation radiation (LB, LB1a, LB1b), in particular the LED (PL1), with the paramagnetic center (NV1) inside the housing (DE, WA, BO, LF1 to LF6) and wherein the housing (DE, WA, BO, LF1 to LF6) includes a first filter (F1) which is an optical filter, and wherein the first filter (F1) is transparent to the fluorescence radiation (FL) of the paramagnetic center (NV1) in the material of the sensor element and where the first filter (F1) is not transparent to the excitation light of the source (PL1) for excitation radiation (LB, LB1a, LB1b) and wherein the receiver (PD1) receives and processes fluorescence radiation (FL) from the paramagnetic center (NV1) and wherein the receiver (PD1) together with the first filter (F1) forms a receiver which is essentially sensitive only to the fluorescence radiation (FL) of the paramagnetic center (NV1) in the material of the sensor element and is essentially not sensitive to the excitation radiation (LB, LB1a, LB1b) of the LED (PL1), and wherein the receiver (PD1) converts the detected fluorescence radiation (FL) into a received signal (S0) and wherein the sensor system is configured to generate a reduced received signal (S1) from the received signal (S0) by subtracting a feedback signal (S6) from the received signal (S0) by means of electrical feedback, or to generate the reduced received signal (S1) by means of optical compensation by irradiating a compensation LED (PLK) into the receiver (PD1), wherein the operation of the compensation LED (PLK) depends on the feedback signal (S6), and wherein the circuit (IC) and the evaluation circuit (M1, TP, M2, G) form a filter output signal (S4) from the reduced received signal (S1) and wherein the sensor system is configured to generate the feedback signal (S6) from the filter output signal (S4) and the transmit signal (S5), and where the filter output signal (S4) is then a measure of the amplitude of the fluorescence radiation (FL) reaching the receiver (PD1) and where the filter output signal (S4) is the output signal (out). [2] Housing according to claim 1, wherein the sensor element and / or quantum technology device element is a diamond crystal. [3] Housing according to claim 2, where the paramagnetic center (NV1) is an NV center in the diamond crystal. [4] Housings (DE, WA, BO, LF1 to LF6) according to claim 1 or 2 or 3, wherein the housing (DE, WA, BO, LF1 to LF6) comprises a means (RE) that directs the fluorescence radiation (FL). [5] Housings (DE, WA, BO, LF1 to LF6) according to one or more of claims 1 to 4, wherein the housing (DE, WA, BO, LF1 to LF6) has exactly one first connection, exactly one second connection, and exactly one third connection and where the first terminal is the supply voltage terminal (Vdd) and where the second connection is the connection of the reference potential (GND) and where the third connection is the output line (out), which may temporarily be an input line. [6] Housing (DE, WA, BO, LF1 to LF6) according to claim 5, where the third connection is the connection of a bidirectional single-wire data bus line. [7] Housing (DE, WA, BO, LF1 to LF6) according to one or more of claims 1 to 4, where the housing (DE, WA, BO, LF1 to LF6) - via exactly one initial connection and - via exactly one second connection and - via exactly one third connection and - has exactly one fourth connection and where the first terminal is the supply voltage terminal (Vdd) and where the second connection is the connection of the reference potential (GND) and where the third connection is the connection of a bidirectional single-wire data bus line and where the fourth connection is the connection of a forwarding of the single-wire data bus. [8] Housings (DE, WA, BO, LF1 to LF6) according to one or more of claims 1 to 7, wherein the integrated circuit (IC) is designed and suitable to participate in a method for automatically assigning bus node addresses to the bus participants of a data bus with multiple bus participants and a bus master that assigns the bus node addresses. [9] Housings (DE, WA, BO, LF1 to LF6) according to one or more of claims 1 to 8, wherein the integrated circuit (IC) comprises a signal generator (G) and a synchronous demodulator (M1, TP). [10] Housings (DE, WA, BO, LF1 to LF6) according to one or more of claims 1 to 9, wherein the sensor system includes a compensation LED (PLK) and wherein the housing (DE, WA, BO, LF1 to LF6) has a first barrier (BA1) that prevents the compensation LED (PLK) from irradiating the paramagnetic center (NV1) in the material of a sensor element and / or quantum technology device element in a substantial way and where this first barrier (BA1) can also be a filter that is not transparent to the compensation radiation of the compensation LED (PLK). [11] Housings (DE, WA, BO, LF1 to LF6) according to one or more of claims 1 to 10, wherein the housing (DE, WA, BO, LF1 to LF6) has a second barrier (BA2) that prevents the source (PL1) for excitation radiation (LB1a, LB1b) from irradiating the receiver (PD1) in a substantial way and where this second barrier (BA2) can also be a filter that is not transparent to the excitation radiation (LB1a, LB1b) of the source (PL1) for excitation radiation (LB1a, LB1b), in particular not transparent to the excitation radiation (LB1a, LB1b) of the LED (PL1). [12] Housings (DE, WA, BO, LF1 to LF6) according to one or more of claims 1 to 11, the means (RE) that directs the excitation radiation (LB1a, LB1b) to the paramagnetic center (NV1) - to create a reflective surface and / or - around a curved reflective surface and / or - to create a photonic crystal and / or - to create a beam splitter and / or - to install an optical fiber and / or - to create a grid and / or - to create a metallized surface and / or - to use a dielectric mirror and / or - it is a different optical functional element. [13] Housing according to one or more of claims 1 to 12, the integrated circuit (IC) comprises: - a driver for operating a source (PL1) for excitation radiation (LB) and - the receiver (F1, PD1);, and - the evaluation circuit (M1, TP, M2, G) [14] Method for manufacturing a sensor system and / or quantum technology system comprising the steps Providing (1) a premolded open-cavity enclosure (WA, BO, LF1 to LF6) with connectors (LF1 to LF6) and (2) introducing a source of excitation radiation (PL1) into the premolded open-cavity housing (WA, BO, LF1 to LF6) and Inserting (3) an integrated circuit (IC) with a receiver (PD1) into the premolded open-cavity package (WA, BO, LF1 to LF6) and Electrical connection (4) of the integrated circuit (IC) and the terminals (LF1 to LF6) and the excitation radiation source (PL1) and Insertion (5) of a sensor element and / or quantum technology device element with a paramagnetic center (NV1) in the material of the sensor element and / or quantum technology device element into the premolded open-cavity housing (WA, BO, LF1 to LF6) and Fastening (6) the sensor element and / or quantum technology device element by means of a fastening device (Ge) and Closing (8) the premolded open-cavity housing (WA, BO, LF1 to LF6) with a cover (DE), where the excitation radiation source (PL1) is designed to emit excitation radiation (LB) and wherein the paramagnetic center (NV1) in the material of the sensor element and / or quantum technology device element emits fluorescence radiation (FL) when irradiated with this excitation radiation (LB, LB1a, LB1b) and wherein the fastening material (Ge) is essentially transparent to the excitation radiation (LB, LB1a, LB1b) and to the fluorescence radiation (FL) and wherein the integrated circuit (IC) comprises an evaluation circuit (M1, TP, M2, G) designed to generate an output signal (out) which depends on the fluorescence radiation (FL) of the paramagnetic center (NV1) in the material of the sensor element, wherein the housing (DE, WA, BO, LF1 to LF6) comprises a first filter (F1) which is an optical filter, and wherein the first filter (F1) is transparent to the fluorescence radiation (FL) of the paramagnetic center (NV1) in the material of the sensor element and Production (7) of a means (RE) for directing the excitation radiation (LB1a, LB1b) and / or fluorescence radiation (FL), wherein the housing (DE, WA, BO, LF1 to LF6) comprises means (RE) that direct the excitation radiation (LB, LB1a, LB1b) of the source (PL1) to the paramagnetic center (NV1) and thus couple the source (PL1) of excitation radiation (LB, LB1a, LB1b), in particular the LED (PL1), with the paramagnetic center (NV1) inside the housing (DE, WA, BO, LF1 to LF6) [15] Method according to claim 14, wherein the sensor element and / or the quantum technology device element is a diamond crystal. [16] Method according to claim 15, where the paramagnetic center (NV1) is an NV center in the diamond crystal. [17] Method according to one or more of claims 14 to 16 with steps for testing the housing (DE, WA, BO, LF1 to LF6) with the steps Irradiation of the still open premolded open-cavity housing (WA, BO, LF1 to LF6) with excitation radiation (TLB); Measurement (9) of the emitted fluorescence radiation (FL) emitted by the sensor system (IC, PL, PD1, BD1 to BD3, NV1, F1) of the premolded open-cavity package (WA, BO, LF1 to LF6) and / or the quantum technology system of the premolded open-cavity package (WA, BO, LF1 to LF6); Evaluate (10) the measured fluorescence radiation (FL) by comparing (10) the measured value of the fluorescence radiation (FL) with a threshold value. [18] Method according to one or more of claims 14 to 17 with steps for testing the housing (DE, WA, BO, LF1 to LF6) with the steps operating the source (PL1) for excitation radiation (FL); Measurement (9) of the excitation radiation (LB) emitted from the still open premolded open-cavity housing (WA, BO, LF1 to LF6); Evaluate (10) the measured excitation radiation (LB) by comparing (10) the measured value of the excitation radiation (LB) with a threshold value. [19] Method according to one or more of claims 14 to 18 with steps for testing a housing (DE, WA, BO, LF1 to LF6) with the steps operating the source (PL1) for excitation radiation (LB); Measurement (9) of the fluorescence radiation (FL) emitted from the still open premolded open-cavity housing (WA, BO, LF1 to LF6); Evaluate (10) the measured fluorescence radiation (FL) by comparing (10) the measured value of the fluorescence radiation (FL) with a threshold value.

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