Method and device for arranging optical elements on a substrate having a plurality of optoelectronic components

Abstract

Method for arranging optical elements (2) on a substrate (4) with a plurality of optoelectronic components (5), comprising the method steps: A Providing a positioning aid (1) with a plurality of suction openings (3), arranging the optical elements (2) at the suction openings (3) and generating a pressure difference at the suction openings (3) in order to hold the optical elements (2) at the suction openings (3); B Providing the substrate (4) which has a plurality of optoelectronic components (5), providing adhesion promoter (6) and arranging the optical elements (2) by means of the positioning aid (1) on the substrate (4) such that an optical element (2) is assigned to each of the plurality of optoelectronic components (5) and adhesion promoter (6) is arranged between each optoelectronic component (5) and the assigned optical element (2), wherein the pressure difference at the suction openings (3) is maintained; C At least partially curing the adhesion promoter (6) by means of a curing unit by applying electromagnetic radiation generated by the curing unit and / or heating by means of the curing unit and ending the pressure difference at the suction openings (3), wherein the pressure difference at the suction openings (3) is ended before the at least partial curing of the adhesion promoter (6) by means of the curing unit, wherein the position of the positioning aid (1) relative to the substrate (4) is not changed.

Description

[0001] The invention relates to a method and a device for arranging optical elements on a substrate having a plurality of optoelectronic components according to claims 1 and 10.

[0002] There is a general effort in the photovoltaics sector to reduce the costs of generating photovoltaic energy and thus provide a sustainable energy supply. One technological approach involves the use of concentrator photovoltaic modules.

[0003] The semiconductor material used in the solar cells accounts for a significant portion of the total cost of typical solar cells without a concentrator. Using concentrator photovoltaic modules, less semiconductor material is required.

[0004] For this purpose, the sunlight is concentrated using a cost-effective optical concentrator and the solar cell surface is positioned at the focus of the light beam, which efficiently converts the concentrated radiation into electrical energy.

[0005] A Fresnel lens, for example, is used as a concentrator lens, which focuses sunlight onto the solar cell surfaces. The disadvantage of a Fresnel lens is that it sometimes leads to inhomogeneous illumination of the solar cell, which reduces efficiency.

[0006] This effect can be counteracted by attaching a homogenizer as an optical element to the solar cell surfaces. In addition to homogenizing the light, light shaping and concentration can also be achieved.

[0007] These optical elements, called homogenizers, are also referred to as the second concentrator stage in the case of a concentrator photovoltaic module.

[0008] The positioning of the optical elements and their attachment to the solar cell surface using an adhesive bond requires complex assembly technology.

[0009] This requires precise alignment of the optical elements on the solar cells. Due to the dimensions of the solar cells and the optical elements, high assembly precision is required.

[0010] The solar cells, as well as the optical elements, are sensitive components that can easily be damaged during the assembly process.

[0011] Previously, assembly was carried out using gripping tools that individually loaded the solar cells with the optical elements. Such a method is described in EP 2457260 B1.

[0012] In addition, DE3532821A1 discloses a light-emitting diode with a spherical lens, which is attached to a semiconductor body by means of an adhesive to concentrate the radiation.

[0013] Furthermore, DE10053543A1 discloses a device for manufacturing optoelectronic components. The device comprises a movable holding tool with a receptacle in which a lens can be held by means of a vacuum.

[0014] DE102014223298A1 discloses an optical arrangement for efficient light coupling, which is used in optical devices and systems. It comprises a glass sphere or a glass hemisphere, a plane-parallel glass plate, and a semiconductor component. Optically transparent solid coupling media are arranged between the elements.

[0015] These gripping tools are usually designed as vacuum grippers and remove the optical elements individually from a magazine and position them on an adhesive surface attached to the solar cell. This process is familiar from printed circuit board production and is implemented using pick-and-place devices. These are also suitable for positioning electronic components, especially SMT (Surface Mount Technology) components.

[0016] However, such a single-unit placement process is time-consuming and costly. Therefore, there is a need to position the optical elements on the solar cells more quickly, yet with consistent precision.

[0017] In addition to the field of photovoltaics, in the production of optoelectronic assemblies, in particular light-emitting diodes with secondary optics, where the secondary optics in this case are used for beam shaping, there is also a need to position the optical elements quickly but with consistent precision on the optoelectronic elements.

[0018] The present invention is therefore based on the object of providing a method and a device which enable a less time-consuming and more cost-effective placement of optical elements on a substrate with high precision.

[0019] This object is achieved by a method according to claim 1 and a device according to claim 10. An advantageous embodiment can be found in the dependent subclaims. The method according to the invention is preferably designed for implementation using the device according to the invention, in particular a preferred embodiment thereof. The device according to the invention is preferably designed for implementation using the method according to the invention, in particular a preferred embodiment thereof.

[0020] The invention is based, in particular, on the finding that a positioning aid enables the placement of optical elements with high precision. The invention is further based on the finding that parallel placement of optical elements enables a shorter process time.

[0021] The method according to the invention for arranging optical elements on a substrate with a plurality of optoelectronic components comprises the method steps: A. Providing a positioning aid having a plurality of suction openings, arranging the optical elements at the suction openings and creating a pressure difference at the suction openings to hold the optical elements at the suction openings; B. Providing the substrate having a plurality of optoelectronic components, providing adhesion promoter and arranging the optical elements by means of the positioning aid on the substrate, so that each of the plurality of optoelectronic components is assigned an optical element and adhesion promoter is arranged between the optoelectronic component and the assigned optical element, wherein the pressure difference at the suction openings is maintained; C. At least partially curing the adhesion promoter by means of a curing unit by applying electromagnetic radiation generated by the curing unit and / or heating by means of the curing unit and ending the pressure difference at the suction openings, wherein the pressure difference at the suction openings ends before the at least partial curing of the adhesion promoter by means of the curing unit, wherein the position of the positioning aid relative to the substrate is not changed in method step C.

[0022] The method steps are carried out in the order listed above, whereby it is within the scope of the invention to insert further intermediate steps or to add method steps before or after method steps A and C.

[0023] In contrast to the previously known individual placement methods, the positioning aid, which is provided in method step A, has a plurality of suction openings which make it possible to hold a plurality of optical elements.

[0024] Furthermore, the method according to the invention enables the parallelization of the arrangement of the optical elements, which is carried out in method step B. It is essential in this method step that the pressure difference is maintained within the method step, thereby improving the positioning accuracy.

[0025] By at least partially curing the adhesion promoter in process step C, the optical elements are fixed so that the risk of a change in position relative to the optoelectronic components in possible further process steps is avoided or at least reduced.

[0026] In one example of a method, in method step C, the adhesion promoter is at least partially cured by means of the curing unit before the pressure difference at the suction openings is terminated.

[0027] Curing the bonding agent before the pressure differential at the intake port is removed offers the advantage of holding the optical elements in place while the bonding agent cures. This ensures that the optical elements are fixed and retain their position after the pressure differential is removed.

[0028] Maintaining the position of the positioning aid relative to the substrate ensures that when the pressure difference at the intake opening is terminated, the optical elements continue to be held in position by the positioning aid.

[0029] It is within the scope of the invention that, before arranging the optical elements on the substrate, an adhesion promoter is applied to the substrate using the positioning aid. This can be done over the entire surface; however, to save on adhesion promoter, the adhesion promoter is preferably applied only locally at the points on the substrate where an optical element is to be arranged.

[0030] In an advantageous embodiment, therefore, in method step B, the adhesion promoter is arranged at least on the optoelectronic components of the substrate before the optical elements are arranged on the substrate by means of the positioning aid, wherein preferably the adhesion promoter is one of the methods - screen printing, especially stencil printing; - Jetting; - Dispensing;is applied.

[0031] The advantage of these processes is that they allow for rapid application of the adhesion promoter.

[0032] In a further advantageous embodiment, in method step B, the optical elements are immersed into an adhesion promoter reservoir by means of the positioning aid in order to arrange adhesion promoter at least on the side of the optical elements facing away from the positioning aid.

[0033] This allows the adhesion promoter required for fixation to be applied to the optical elements in a simple manner. This eliminates the process step of directly applying the adhesion promoter to the substrate. Advantageously, in this embodiment, adhesion promoter is applied exclusively by immersing the optical elements in the adhesion promoter reservoir, thus saving process steps.

[0034] It is also within the scope of the invention that, in addition to immersing the optical elements in the adhesion promoter reservoir, the same adhesion promoter or a different adhesion promoter is arranged before arranging the optical elements on the substrate.

[0035] In a further advantageous embodiment, in process step C, at least partial hardening takes place by means of electromagnetic radiation.

[0036] The advantage of hardening using electromagnetic radiation is that, unlike thermal hardening, no significant thermal stresses are created on the components and the substrate. These thermal stresses can, on the one hand, damage the microstructures and, on the other hand, cause a shift in position relative to the assembly position during the cooling process due to the substrate's coefficient of expansion.

[0037] In particular, it is advantageous that in process step C the at least partial hardening is carried out by means of electromagnetic radiation, wherein the beam path of the electromagnetic radiation runs through the suction openings of the positioning aid to the optical elements.

[0038] The beam path of the electromagnetic radiation through the suction openings of the positioning aid also ensures that the adhesion promoter absorbs sufficient radiation for at least partial curing. Another advantage is that an additional radiation delivery device is dispensed with. Furthermore, such a design allows for precise radiation emission, so that the adhesion promoter applied away from the optoelectronic component or optical element is not cured.

[0039] In an advantageous embodiment, uncured adhesion promoter is therefore removed after process step C.

[0040] In a further advantageous embodiment, in process step C, the at least partial hardening takes place by means of electromagnetic radiation, which is supplied by means of optical fibers and / or windows between the suction openings of the positioning aid.

[0041] An advantage of this design is that, particularly with optical elements that are not transparent to at least some of the electromagnetic radiation used for curing, sufficient electromagnetic radiation can reach the adhesion promoter and at least partially cure it. Furthermore, a design with optical fibers is advantageous in that the source of the electromagnetic radiation does not have to be located directly near the suction opening of the positioning aid.

[0042] In a further advantageous embodiment, the partial curing is carried out by means of electromagnetic radiation, wherein the substrate is exposed to electromagnetic radiation from the side opposite the positioning aid.

[0043] In this embodiment, the substrate is only slightly absorbent for the electromagnetic radiation used for curing, in particular transparent. The substrate is preferably designed as a glass substrate, thus allowing a portion of the electromagnetic radiation to transmit through the substrate to at least partially cure the adhesion promoter. A particular advantage of this embodiment is that the source of the electromagnetic radiation does not have to be attached to the positioning aid or within the movement space of the positioning aid.

[0044] Typical optoelectronic components designed as photovoltaic cells use radiation in the wavelength range 400 nm to 1000 nm. Likewise, typical light-emitting optoelectronic components emit radiation in the wavelength range 400 nm to 1000 nm.

[0045] In a further advantageous embodiment, optical elements are therefore arranged at the suction openings of the positioning aid in method step A, which have an optical transparency at least in the wavelength range from 400 nm to 1000 nm.

[0046] In a further advantageous embodiment, in method step A, optical elements are arranged at the intake openings of the positioning aid. These optical elements have a rounded shape, in particular a convex shape, preferably a spherical shape. Advantageously, the optical elements are designed as an ellipsoid, in particular as a sphere.

[0047] Due to the rounded, convex shape of the optical elements, the suction openings of the positioning aid allow for easy centering of the optical elements. This allows for easy self-alignment of the optical elements within the suction openings of the positioning aid. Furthermore, ellipsoids, especially spheres, offer advantageous optical properties for a converging optical lens.

[0048] In a further advantageous embodiment, the optical element is designed as a simple conical reflector in the shape of a truncated cone. The advantage of designing the optical element in the shape of a truncated cone is its good homogenization properties.

[0049] In a further advantageous embodiment, the optical element has a lens shape. The advantage of the lens-shaped design is the good acceptance angle for module alignment.

[0050] In a further advantageous embodiment, the optical elements are designed as spherical lenses. The advantage of using spherical lenses as an optical element, especially as a second concentrator stage, is based on the strong sunlight concentration and homogenization, as well as on enabling a high acceptance angle for module alignment.

[0051] In a further advantageous embodiment, in process step B, a substrate with optoelectronic components is provided, which are designed as photovoltaic solar cells.

[0052] A particular advantage is that photovoltaic solar cells on a substrate have a consistently low build height, which means the height profile is similar across the entire surface of the substrate. This facilitates handling of the optical elements with the positioning aid and the application of the adhesion promoter. The process enables the cost-effective production of photovoltaic concentrator modules.

[0053] The object mentioned at the outset is further achieved by a device for arranging optical elements on a substrate having a plurality of optoelectronic components according to claim 10.

[0054] The device according to the invention for arranging optical elements on a substrate with a plurality of optoelectronic components comprises a positioning aid which has a plurality of suction openings, which is fluidically connected to a vacuum unit of the device, for sucking the optical elements at the suction openings and with a hardening unit which has a source for generating heat and / or electromagnetic radiation and is designed to cooperate with the positioning aid in such a way that, when optical elements are arranged at the suction openings, at least the side of the optical elements facing away from the suction openings can be subjected to heat and / or electromagnetic radiation from the hardening unit.

[0055] In contrast to conventional single-element placement devices, the device according to the invention thus has a positioning aid with a plurality of suction openings. These suction openings make it possible to hold a plurality of optical elements. The advantage of using negative pressure to suction the optical elements is, on the one hand, that mechanical gripping of the optical elements, especially small ones, is difficult to implement, thus ensuring synchronous holding and release of all optical elements. The inventive interaction of the curing unit and positioning aid is advantageous because at least the areas in contact with the adhesion promoter are exposed to heat and / or electromagnetic radiation. Thus, the optical element can be easily fixed to the substrate, which is equipped with a plurality of optoelectronic components.

[0056] What is essential in the device is that the hardening unit is designed to generate electromagnetic radiation and the positioning aid has optical waveguides which are connected to the hardening unit and are arranged in the positioning aid in the region of the suction openings and / or between the suction openings.

[0057] The advantage of this design is that, thanks to the use of optical waveguides, the hardening unit for generating electromagnetic radiation does not need to be positioned directly in the area of the intake openings. This allows the hardening unit to be arranged entirely outside the positioning aid, for example.

[0058] A further advantageous embodiment of the device has a support for the substrate and the positioning aid and the hardening unit are arranged on opposite sides of the support, in particular the hardening unit is designed to expose the substrate to electromagnetic radiation.

[0059] The advantage of this embodiment is the reduced complexity of the positioning aid, since the curing unit is arranged on the opposite side of the support for the substrate.

[0060] In a further advantageous embodiment of the device, the suction openings of the positioning unit are tapered and, in particular, conical. In particular, the suction openings are preferably tapered, in particular conical, starting from the side facing the substrate.

[0061] The advantage of conical or tapered intake openings is that the optical elements align or center themselves within the intake openings during suction.

[0062] The adhesion promoter used is advantageously an adhesion promoter from the group of thermoplastics, epoxy resins, silicones, acrylates, cyanoacrylates, polycarbonates, polyacrylates, poly(meth)acrylates and mixtures thereof.

[0063] The adhesion promoter is preferably a thermally conductive material with electrically insulating properties. This prevents overheating of the optoelectronic element and also prevents short circuits. The adhesion promoter can also be used to encapsulate the electrical contacts of the optoelectronic elements.

[0064] Further advantageous features and embodiments are explained below using exemplary embodiments and the figures. Herein: Fig. 1 with the partial images a to d method steps of an example of a method by means of an embodiment of a device according to the invention; Fig. 2 a schematic sectional view of another exemplary device; Fig. 3 a schematic sectional view of another exemplary device; Fig. 4 a schematic sectional view of another exemplary device.

[0065] All figures are schematic representations, not to scale. Identical reference symbols in the figures indicate identical or identically functioning elements.

[0066] In Fig. 1 with partial images a to d, method steps of an example of a method are shown which is carried out by means of an embodiment of a device according to the invention.

[0067] The arrangement of optical elements 2 on a substrate 4 with a plurality of optoelectronic components 5 comprises the following method steps, which are shown in the partial figures 1a to 1d: In a method step A, a positioning aid 1 with a plurality of suction openings 3 is provided. In the present case, the positioning aid 1 is in Fig. 1a is designed with a suction template 8. The announcement openings 3 are formed over the openings of the template 8. Furthermore, method step A comprises arranging the optical elements 2 at the suction openings 3 and generating a pressure difference at the suction openings 3 in order to hold the optical elements 2 at the suction openings 3.

[0068] Present in Fig. 1a, the optical elements 2 are provided in recesses within a flat element 9. The positioning aid 1 is arranged over this area so that the suction openings 3 are arranged at a small distance above the optical elements 2. In this example, the pressure difference is generated by a vacuum unit (not shown), which is fluidically connected to the suction opening. The generated pressure difference results in the optical elements 2 being pushed towards the suction openings 3, and if the pressure difference persists, they remain in this position. Holding them at the suction openings 3 is Fig. 1b can be seen.

[0069] The method further comprises a method step B. This method step B comprises providing the substrate 4, to which a plurality of optoelectronic components 5 are applied. In this example, an adhesion promoter 6 has previously been applied to the optoelectronic components 5 and the substrate using a dispensing process. Silicone is used as the adhesion promoter.

[0070] In method step B, the optical elements are arranged on the substrate 4 via the positioning aid 1, so that an optical element 2 is assigned to each of the plurality of optoelectronic components 5 and an adhesion promoter 6 is arranged between the optoelectronic components 5 and the assigned optical elements 2.

[0071] This sub-step of process step B is in Fig. 1c. In Fig. Figure 1c also shows how the optical elements 3 on the optoelectronic components 5, which are applied to the substrate 4, are connected to each other via the adhesion promoter 6. In this embodiment, the pressure difference at the exit openings 3 is maintained during curing, as described below.

[0072] The method further comprises a method step C. This method step comprises the at least partial curing of the adhesion promoter 6 by means of a curing unit. In this embodiment, the at least partial curing of the adhesion promoter 6 is achieved by electromagnetic radiation in the ultraviolet frequency range generated by the curing unit. For this purpose, a short flash of light in the ultraviolet wavelength range is generated.

[0073] For this purpose, the hardening unit is located outside the positioning aid 1. In this case, the electromagnetic rays are guided via waveguides 7 in the direction of the suction openings 3 via a vacuum channel of the positioning aid 1. For this purpose, the waveguide is guided into the vacuum channel via a Y-connector. This Y-connector has two openings on a first side and one opening on a second side. The first opening on the first side is used to connect a vacuum hose, which is directly connected to the vacuum unit. The second opening on the first side of the Y-connector is used to connect a waveguide, which is directly connected to the hardening unit.

[0074] Through the Y-connector, in addition to the fluid, the waveguide is also guided from the first side of the Y-connector to the second side of the connector, so that on the second side of the Y-connector the fluid flows through the opening there and the waveguide runs.

[0075] In this embodiment, the electromagnetic rays can pass through the transparent optical elements 2 and irradiate the adhesion promoter, which leads to an at least partial curing of the adhesion promoter 6. In this embodiment, after the at least partial curing of the adhesion promoter 6, the pressure difference at the suction openings 3 is terminated and the positioning aid 1 is removed upwards. This is shown in the Fig. 1d.

[0076] The Fig. 2 to 5 show further examples of a device.

[0077] In Fig. 2 shows a positioning aid in which, in contrast to the embodiment of the Fig. 1, no waveguides 7 extend through the intake openings. In this embodiment, the hardening unit is implemented by a plurality of LEDs 10 mounted at an angle of 45°, which emit electromagnetic radiation in the ultraviolet wavelength range (represented by arrows). These LEDs are arranged between the intake openings 3 of the positioning aid 1.

[0078] In this example, the positioning aid 1 can already be seen in process step C. The positioning aid 1 is located in the step after the arrangement of the optical elements 2 by means of the substrate 4. The advantage of this embodiment is that waveguide 7 can be omitted.

[0079] The Fig. 3 also shows how the Fig. 2 shows a further example, wherein in this embodiment, the substrate 4 is transparent to the electromagnetic radiation used for curing. For this purpose, the substrate 5 is transparent in an ultraviolet wavelength range, in this case as a glass substrate. In process step C, the partial curing of the adhesion promoter 6 is carried out by means of a curing unit by exposure to electromagnetic radiation. In this case, the device has a support 11 for the substrate 4. Within this support 11, a curing unit designed as a light source 10 is arranged, which emits ultraviolet radiation.

[0080] The substrate 4, which in this example is a glass substrate, allows some of the radiation to pass through due to the transparent properties of the glass. Thus, the radiation required for partial curing of the adhesion promoter 6 is guided through the glass substrate 4 to the adhesion promoter 6.

[0081] In Fig. Figure 4 shows another exemplary device, which has an element 12 above the positioning aid. This element 12 houses a light-emitting diode 10. This light-emitting diode emits electromagnetic radiation. The radiation reaches the adhesion promoter 6 indirectly via the channels and through the diffuse reflections caused by the environment.

[0082] In an alternative embodiment to that described in Fig. In the example shown in Figure 4, the template 8 is made of a material that is transparent to electromagnetic radiation in the wavelength range of at least 400 nm to 1000 nm. The transparent template 8 allows the rays to propagate to the optical elements 2 and to the adhesion promoter 6, thereby at least partially curing the latter.

[0083] In Fig.Figure 5 shows a further embodiment, in which the curing unit has waveguides 7. In contrast to embodiment 1, these waveguides 7 are not positioned in the intake openings and the vacuum channel, but rather outside the intake openings 3 and guided through the stencil in the direction of the optical elements 2. The waveguides 7, thus guided through the positioning aid 1, guide electromagnetic radiation emitted by the curing unit toward the adhesion promoter 6. This leads to partial curing of the adhesion promoter.

Claims

[1] Method for arranging optical elements (2) on a substrate (4) with a plurality of optoelectronic components (5), comprising the method steps: A Providing a positioning aid (1) with a plurality of suction openings (3), arranging the optical elements (2) at the suction openings (3) and generating a pressure difference at the suction openings (3) in order to hold the optical elements (2) at the suction openings (3); B Providing the substrate (4) which has a plurality of optoelectronic components (5), providing adhesion promoter (6) and arranging the optical elements (2) by means of the positioning aid (1) on the substrate (4) such that an optical element (2) is assigned to each of the plurality of optoelectronic components (5) and adhesion promoter (6) is arranged between each optoelectronic component (5) and the assigned optical element (2), wherein the pressure difference at the suction openings (3) is maintained; C At least partially curing the adhesion promoter (6) by means of a curing unit by applying electromagnetic radiation generated by the curing unit and / or heating by means of the curing unit and ending the pressure difference at the suction openings (3), wherein the pressure difference at the suction openings (3) is ended before the at least partial curing of the adhesion promoter (6) by means of the curing unit, wherein the position of the positioning aid (1) relative to the substrate (4) is not changed. [2] Method according to claim 1, characterized by that in method step B the adhesion promoter (6) is arranged at least on the optoelectronic components (5) of the substrate (4) before the optical elements (2) are arranged on the substrate (4) by means of the positioning aid (1), wherein preferably the adhesion promoter (6) is arranged by means of one of the methods - screen printing, especially stencil printing; - Jetting; - Dispensing; is applied. [3] Method according to one of the preceding claims, characterized by that in method step B the optical elements (2) are immersed in an adhesion promoter reservoir by means of the positioning aid (1) in order to arrange adhesion promoter (6) at least on the side of the optical elements (2) facing away from the positioning aid (1). [4] Method according to one of the preceding claims, characterized by that in process step C the at least partial hardening is carried out by means of electromagnetic radiation, wherein the beam path of the electromagnetic radiation runs through the suction openings (3) of the positioning aid (1) to the optical elements (2). [5] Method according to one of claims 1 to 3, characterized by that in process step C the at least partial hardening takes place by means of electromagnetic radiation which is supplied by means of optical fibers and / or windows between the suction openings (3) of the positioning aid (1). [6] Method according to one of claims 1 to 3, characterized by that in process step C the hardening is carried out by means of electromagnetic radiation, wherein the substrate (4) is exposed to electromagnetic radiation from the side opposite the positioning aid (1). [7] Method according to one of the preceding claims, characterized by that in method step A, optical elements (2) are arranged at the suction openings (3) of the positioning aid (1), which have an optical transparency at least in the wavelength range 400 nm to 1000 nm. [8] Method according to one of the preceding claims, characterized by that in method step A, optical elements (2) are arranged at the suction openings (3) of the positioning aid (1), which have a convex shape, preferably as an ellipsoid, in particular as a sphere. [9] Method according to one of the preceding claims, characterized bythat in process step B the substrate (4) is provided, wherein the optoelectronic components (5) are designed as a photovoltaic solar cell. [10] Device for arranging optical elements (2) on a substrate (4) with a plurality of optoelectronic components (5), with a positioning aid (1) which has a plurality of suction openings (3) which is fluidically connected to a vacuum unit of the device, for sucking the optical elements (2) at the suction openings (3) and with a hardening unit which has a source for generating heat and / or electromagnetic radiation and is designed to interact with the positioning aid (1) in such a way that, when optical elements (2) are arranged at the suction openings (3), at least the side of the optical elements (2) facing away from the suction openings (3) can be exposed to heat and / or electromagnetic radiation from the hardening unit and the hardening unit is designed to generate electromagnetic radiation and the positioning aid (1) has optical waveguides (7) which are connected to the hardening unit and are arranged in the positioning aid (1) in the region of the suction openings (3) and / or between the suction openings (3). [11] Device according to claim 10, characterized bythat the device has a support (11) for the substrate (4) and that the positioning aid (1) and the hardening unit are arranged on opposite sides of the support (11) for the substrate (4), in particular that the hardening unit is designed to subject the substrate (4) to electromagnetic radiation. [12] Device according to one of claims 10 and 11, characterized by that the suction openings (3) of the positioning aid (1) are tapered, in particular conical.

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