Sensor device with at least one sensor element and method for manufacturing a sensor device

Abstract

The invention relates to a sensor device with at least one sensor element, with at least one data-conducting interface, with at least one power supply device and with at least one support structure, in which it is essential to the invention that the support structure forms at least two segments and that the segments are flexibly connected to each other. Furthermore, the invention relates to a method for manufacturing a sensor device according to the invention, wherein a support structure is provided, in which it is essential to the invention that segments are made from the support structure and that flexible connections are formed between the segments.

Description

[0001] The invention relates to a sensor device comprising at least one sensor element, at least one data-conducting interface, at least one power supply unit and at least one support structure.

[0002] Sensor devices of the aforementioned type can be used, for example, in the automotive sector. Such a sensor device could, for instance, be a device for detecting moisture on a road surface. A sensor device of this type is known, for example, from DE 102017 102 745 A1. This patent provides for a sensor device with a structure-borne sound sensor to be arranged in a wheel well of a vehicle in order to detect spray water kicked up by the tires.

[0003] The invention is based on the objective of proposing a sensor device of the type mentioned above, in which individual adaptability, in particular to curved surfaces, can be achieved in a simple manner.

[0004] This problem is solved using a sensor device with the features of claim 1.

[0005] Further training and advantageous configurations are specified in the subclaims.

[0006] In a sensor device with at least one sensor element, with at least one data-conducting interface, with at least one power supply unit and with at least one support structure, it is essential to the invention that the support structure forms at least two segments and that the segments are flexibly connected to each other.

[0007] Such a sensor device can be intended for use in the automotive sector. A sensor element can consist of a multitude of different sensor elements. For example, the sensor element could be a structure-borne sound sensor, a humidity sensor, a light sensor, or similar. The sensor device can also, in particular, have several sensor elements, even of different types. For powering the sensor elements, the sensor device can, for example, have a battery, a connection to the vehicle's onboard power supply, an energy harvesting device, or similar. The components of the sensor device are arranged on a support structure, such as a circuit carrier. In particular, the circuit carrier can be flexible, for example, made of a film.To ensure the sensor device can be adapted to the local conditions of the installation area, such as the vehicle's wheel arch, windshield, or other areas, the support structure comprises at least two segments, preferably several. A segment can be a substantially planar area for accommodating various components of the sensor device. The sensor device segments can, for example, be substantially rectangular or trapezoidal and arranged longitudinally one behind the other, resulting in a substantially elongated sensor device. Transition areas are formed between the segments, allowing for flexible connection between them. In the case of substantially rectangular planar segments, the transition areas can be located on the short sides of two adjacent segments.The flexible connection between two adjacent segments is preferably formed by a flexible support material, in particular by the support structure of the sensor device itself. Alternatively, specially designed hinge connections may be provided. Through the flexible connection of the two segments, they are flexibly connected to each other in such a way that the surfaces of the segments together can form an angle. In particular, the segments can each span an imaginary plane, and in an unbent state of the sensor device, the planes of both segments can be arranged in the same plane. The flexible connection allows the segments to be bent out of this common plane. By bending or pivoting the segments of the sensor device relative to each other, individual adaptation of the sensor device to local conditions, especially bends, is possible.Increasing the number of segments also allows for a larger bending radius, enabling the sensor device to be more flexibly adapted to the curvature of the substrate. The connection points between two segments can be formed by the exposed support structure, or preferably, they can be thinly coated with a protective material. This protective material could, for example, be a thermoset.

[0008] Preferably, the protective coating is thinner at the connection points than in the areas of the segments occupied by components. For example, the sensor device can be designed as a device for detecting moisture on a road surface and can thus be easily adapted to the inside of a wheel arch liner by bending the various segments towards each other so that the sensor device conforms to the radius or curvature of the wheel arch liner.

[0009] In a further development of the invention, the support structure is designed to be flexible, and the flexible connection between the segments is formed by sections of the support structure. The support structure can be a flexible circuit carrier. This can, for example, be film-like or similar. For instance, the support structure can be an elongated strip of a flexible circuit carrier from which the various, for example, rectangular segments are formed. The support structure and the individual segments can also be circular. In particular, the segments can be arranged around a centrally located segment. The flexible design of the support structure thus simultaneously creates a flexible connection area between the segments.

[0010] In one embodiment of the sensor device, the support structure is elongated, and the segments and the flexible connections between the segments are formed from this elongated support structure. The support structure can be an elongated strip of flexible circuit material. The various rectangular segments can be formed from this strip and then arranged one behind the other.

[0011] The flexible connections between adjacent segments can be formed by narrower areas of the strip-shaped support structure, thus achieving a high degree of flexibility.

[0012] In one embodiment of the invention, at least one segment has a trapezoidal base. The segment surfaces can have a base shape that is, for example, rectangular, trapezoidal, or similar. Due to the trapezoidal shape of the segment surfaces, the bending points, i.e., the connection areas between the segments, are not aligned parallel to each other, thus enabling individual adaptation to the local conditions at the point of use of the sensor device.

[0013] In one embodiment of the invention, at least one segment surrounds at least one other segment, at least partially. The segments can be configured by the support structure such that at least one segment surrounds a central segment, at least partially. For example, the support structure and the segments can be circular, and the segments can be arranged concentrically around a central segment. Alternatively, a rectangular central segment surrounded by the other segments can be provided. Areas of the support structure are formed between the segments, through which the segments are flexibly connected to one another. These connection areas between the segments can, in particular, be free spaces on the support structure that are not occupied by components.

[0014] In one embodiment of the invention, at least one segment has a rounded shape. The segments can, for example, have a circular, oval, or similar shape. The segments can be arranged completely around a central, middle segment, for example, in the form of rings. It can also be provided that segments are arranged at least partially around a non-central, laterally displaced segment.

[0015] In one embodiment of the invention, the segments are essentially circular and arranged essentially concentrically. For example, a central segment can be circular. Further segments can be arranged around this segment, at least partially, in an annular shape. For example, a structure-borne sound sensor can be arranged on a central segment. Evaluation devices, power supplies, or similar components can be arranged on the other segments. Unoccupied, for example, annular areas of the support structure can be arranged between the segments, forming flexible connection areas between the also annular segments. This flexible connection of the segments allows for vibration decoupling of the segments, so that the central segment is not affected by the other segments.

[0016] In one embodiment of the invention, the flexible connection between two adjacent segments is formed by web-like sections of the support structure. Spaces can be arranged between the webs that connect the segments. These spaces can be formed by recesses in the support structure. The connection via the webs and the spaces arranged between them achieves a particularly high degree of flexibility between the segments.

[0017] In a further development of the invention, at least two adjacent segments are each surrounded by a protective body, and the minimum angle between the two segments is limited by the external shape of the respective protective bodies. At least one segment, preferably all segments of a sensor device, can each be surrounded by a protective body. For example, the protective body can be a type of housing. Preferably, the protective body is a coating with a protective medium, for example, an epoxy resin. The epoxy resin or the protective housings can have a shape such that the bending of two adjacent segments towards each other is limited by the shape, that is, the minimum angle between the two segments is predetermined. Two adjacent segments can therefore be bent towards each other until the protective bodies touch.In particular, the protective elements can have a greater thickness along the longitudinal extent of the support structure in the middle of the segments than in the transition areas to the adjacent segment. From one segment end to the next in the longitudinal direction, the thickness of the protective element relative to the support structure can initially increase, then remain constant, and then decrease again. The protective elements can be arranged on both sides, i.e., above and below the support structure. Different slopes of the protective elements can be provided on both sides of the support structure in a side view. Due to the increasing orDue to the sloping shape of the protective bodies of two adjacent segments, the two segments can be bent towards each other, so that, for example, the entire sensor device describes a radius, whereby the minimum angle between two segments is spatially limited by the design of the protective bodies. The connection areas between the segments can be surrounded by a different protective medium than the segments themselves.

[0018] In one embodiment of the invention, the protective bodies have side regions facing the connection areas between two segments, and these side regions each form an angle with the support structure. In particular, the protective bodies of the segments can have a central region that is arranged substantially parallel to the support structure. The protective body can have its greatest thickness in this region. Side regions can be arranged on both sides of this central region, sloping down towards the support structure. The imaginary planes spanned by the side regions form an angle with the support structure. The angle between the side regions and the support structure determines the minimum angle between two adjacent segments.

[0019] In one embodiment of the invention, a first segment comprises sensor elements and a second segment comprises a power supply. The arrangement of the various components of the sensor device on different segments enables a modular design of the sensor device. For example, a fixed segment can be provided for a power supply, such as a battery or similar device, which can be combined with different segments containing different sensor elements. This allows for cost-effective production and adaptation of a sensor device to various requirements.

[0020] In one embodiment of the invention, a further segment has the data-conducting interface and / or at least one further segment has an evaluation unit. A data-conducting interface can be, for example, a connector for connecting to a wired data line of the vehicle, a radio transmitter such as a Bluetooth transmitter, or similar. The arrangement of the respective components on different segments enables modular adaptation of the sensor device to specific requirements. For example, prefabricated segments with data-conducting interfaces, evaluation units, and power supplies can be used in combination with various sensor elements. An evaluation unit can be, for example, a microcontroller or similar computing devices.

[0021] In one embodiment of the invention, the minimum angle between two adjacent segments is limited by the distance between the segments. For example, the protective bodies can also be essentially cuboid in shape. To allow for a flexible connection between two adjacent segments, the protective bodies of the adjacent segments can be spaced so far apart that the movement of the two segments is not restricted by the protective bodies. A greater distance between the protective bodies also allows for a longer flexible section of the support structure between the segments, thus ensuring greater mobility between the segments. With a sufficiently large distance, two segments can move virtually freely relative to each other.

[0022] In one embodiment of the invention, at least one segment has a mounting area for mounting the sensor device. Preferably, all segments have a mounting area through which the individual segments, and thus the entire sensor device, can be mounted at the desired location. For example, the sensor device can be mounted on the inside of a wheel arch liner via the mounting areas of the segments. A mounting area can, for example, be a designated volume—i.e., a reservoir—on one side of a protective housing in which adhesive can be received. This allows the individual segments to be bonded to the component to be monitored. Furthermore, projections or indentations can be provided in the protective bodies that correspond to corresponding clips and / or locking devices, which are provided, for example, at the mounting point, to create a snap-fit ​​or clip connection.

[0023] In a further development of the invention, at least one segment has a rigidly formed area for receiving components to be soldered. To enable the receiving and soldering of components to be soldered, areas of at least one segment can be rigidly formed, for example by a perforated plate or similar.

[0024] In one embodiment of the invention, a sensor element is formed by a piezoelectric element. The sensor device can, for example, be a sensor device for detecting structure-borne sound signals. These can be used, for instance, to detect moisture kicked up by the road surface. The piezoelectric element for detecting the structure-borne sound signals can be arranged on a segment of the sensor device and, for example, connected to the component to be monitored by means of an adhesive bond, thus establishing contact with the structure-borne sound signal, i.e., in vibration-transmitting contact.

[0025] In a further development of the invention, the segment containing a piezoelectric element has a lower mass than the other segments. To achieve the most direct, undisturbed, and unaffected vibration transmission possible from the object being monitored to the segment containing the structure-borne sound sensor, the segment has the lowest possible mass. This is also intended to prevent the wave propagating on the component being monitored from being significantly influenced by the sensor device.

[0026] In a further development of the invention, an acoustic impedance step is formed between at least two adjacent segments. To improve the sensitivity of the sensor device, in particular to improve the sensitivity of the segment comprising a structure-borne sound sensor, i.e., a piezoelectric element, an acoustic impedance step is created between the sensing segment and the adjacent segments. This can be achieved, for example, by changing the cross-sectional area of ​​the segments, such as by changing the thickness of the protective body or by changing the size of the segments. At the points of cross-sectional change, reflections of the propagating waves can occur, so that, for example, a vibration is not transmitted from one segment to the next. An impedance step can also be created at the transition from a segment to the connection area.For example, the flexible connection can be formed by a narrower section of the support structure, resulting in a change in cross-section. The greater the acoustic impedance step, the better the structure-borne sound transmission is dampened. A change in the adjacent segment therefore has less influence on the sensor element, i.e., on the signal chain.

[0027] A further aspect of the invention relates to a method for manufacturing a sensor device, in particular a sensor device according to the invention, wherein a carrier structure is provided, in which it is essential to the invention that segments are produced from the carrier structure and that flexible connections are formed between the segments. Preferably, the carrier structure is a flexible, for example, film-like circuit carrier, on which conductor tracks or other elements are or can be applied. The carrier structure is cut such that individual, interconnected segments are formed. These segments are flexibly connected to one another, the flexible connection being formed in particular by the flexible carrier structure. The segments can be provided with protective elements, the protective elements being made of a protective medium.For example, sensor elements, power supply elements, data line elements, or similar components can now be arranged in a cavity within a protective housing. An injection molding process can be used for manufacturing. Here, a tool with interchangeable inserts for the different sensor variants can be used. This allows for easy adaptation of the tool to the respective sensor devices being produced. The segmented structure of the sensor device enables a modular design. The individual segments of the sensor device can also be manufactured by applying protective housings to a carrier structure.

[0028] In a further development of the process, the flexible connection of the segments is formed by the support structure. Because the support structure is formed on a flexible material, the segments can be manufactured almost as a single piece from the support material, so that they are connected by sections of the support material. The flexible support material thus provides a flexible connection between the segments.

[0029] The invention will now be explained in more detail with reference to an embodiment illustrated in the drawing. Specifically, the schematic representations in: Fig. 1: a sensor device with two segments; Fig. 2: a sensor device with three segments; Fig. 3: a sensor device with four segments; Fig. 4: a sensor device with a communication segment; Fig. 5: a sensor device according to the invention in a wheel arch shell; Fig. 6: a segment with an adhesive reservoir; Fig. 7: a sensor device with a protective sheathed connection point between the segments; Fig. 8: a sensor device with a segment having a rigid area; Fig. 9: a sensor device with trapezoidal segments; Fig. 10: a sensor device with protective bodies; Fig. 11: a sensor device with segments in the unbent state; Fig. 12: a sensor device according to Fig. 11 in the bent state and Fig. 13: a sensor device with concentrically arranged round segments; Fig. 14: a sensor device with round segments; Fig. 15: a sensor device with round segments according to Fig. 13 in a perspective view and Fig. 16: a sensor device according to Fig. 13 mounted on a wheel arch shell.

[0030] In Fig. Figure 1 shows a sensor device 1 with a carrier structure 2 and segments 3 and 4. The carrier structure 2 is formed by a flexible circuit carrier, in particular a film-like circuit carrier. Segments 3 and 4 each have a protective body 5, which can be formed, for example, by a protective medium. Segment 3 has sensing elements, i.e., sensor elements 6. Segment 4 has an evaluation unit 7. Segment 4 also has an interface 8 in the form of a connector. The interface 8 can be used, for example, for data transmission or power supply. Depending on the requirements, the connector can be manufactured at different angles to the carrier structure 2, for example, at a 45° angle, a 60° angle, or a 90° angle.Segments 3 and 4 are flexibly connected to each other by a connection point 16 formed by the flexible support structure 2. The protective bodies 5 have inclined surfaces 25 at the connection point 16, which limit the minimum angle when bending between segments 3 and 4.

[0031] In Fig. Figure 2 shows a sensor device 1 with segments 3, 4, and 9. In this embodiment, segment 3 includes sensor elements 6 and an evaluation unit (not shown). Segment 4 includes components 10 for voltage protection and transformation, while segment 9 has a connector 8. Segments 4 and 9 can be standard segments that can be used in a variety of sensor devices, while segment 3 with the sensor elements 6 is adapted to the specific application.

[0032] In Fig. Figure 3 shows a sensor device 1 with four segments 3, 4, 9, 11. In this embodiment, segment 3 has sensor elements 6, segment 4 has an evaluation unit 7, segment 9 has a voltage protection or voltage transformation 10, and segment 11 has the interface 8.

[0033] In Fig. Figure 4 shows a sensor device 1 with a multitude of segments 3. Increasing the number of segments also increases the bending radius, thus allowing the sensor device 1 to be adapted more flexibly to the curvature of the substrate. In addition to the number of segments, the distance between the segments can also be increased.

[0034] In Fig. Figure 5 shows a sensor device 1 in the wheel arch liner 12 of a vehicle. The flexible arrangement of the segments 3 allows the sensor device 1 to adapt to the curvature of the wheel arch liner 12.

[0035] In Fig. Figure 6 shows a segment 3 with a reservoir 13 for adhesives. The reservoir 13 can contain an adhesive through which the sensor device 1 can be mounted to a body 14 to be monitored.

[0036] In Fig. Figure 7 shows a sensor device 1 with segments 3 and 4, in which a connection area 16 is surrounded by a protective medium 15. The connection point 16 can be formed by a section of the flexible support structure 2.

[0037] In Fig. Figure 8 shows a sensor device 1 with segments 3, 4, and 9. Segment 4 has a rigid section 17 formed by a rigid circuit carrier. This allows electronic components 18 with wire connections 19 to be soldered to it.

[0038] In Fig. Figure 9 shows a sensor device 1 with a trapezoidal segment 20. The trapezoidal segment 20 enables the sensor device 1 to be shaped. In particular, a folding axis 21 can form an angle α with the longitudinal axis 22 of the support structure 2.

[0039] In Fig. 10 the segment 3 is rectangular and has a 90° angle of the folding axis 21 to the longitudinal axis 22.

[0040] In Fig. Figure 11 shows a sensor device 1 with segments 3 in a side view. Each segment 3 has a protective body 5. The side areas of the protective bodies 5 are designed to define the minimum folding angle between two adjacent segments. The connection areas 16 are formed by flexible sections of the support structure 2.

[0041] In Fig. 12 is a sensor device 1 according to Fig. 11 shown in the bent state.

[0042] In Fig. Figure 13 shows a sensor device 1 with a round support structure 32 comprising round segments 26, 27, and 28. Segments 27 and 28 surround the centrally located segment 26 and are arranged concentrically to it. Segments 26, 27, and 28 are connected to each other by flexible connections 16. The connection areas 16 are formed by sections of the support structure 2.

[0043] In Fig. Figure 14 shows a sensor device 1 with round segments 26, 27, 28. Segments 27 and 28 partially surround segment 26. Segments 26, 27, 28 are connected to each other by flexible connections, the connections being formed by web-like sections 29 of the support structure 32 and intervening free spaces 30.

[0044] In Fig. 15 is a sensor device 1 with round segments 26, 27, 28 according to Fig. 13 shown in a perspective view.

[0045] In Fig. Figure 16 shows a sensor device 1 mounted in a wheel arch 31 of a vehicle, shown in cross-section. The sensor device 1 can be configured to detect liquid kicked up by the tires using structure-borne sound. The central segment 26 houses the structure-borne sound sensor. Segment 26 is vibration-damped by its flexible connection to the other segments. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 102017 102 745 A1

[0002]

Claims

[1] Sensor device with at least one sensor element (6), with at least one data-conducting interface (8), with at least one energy supply device and with at least one carrier structure, characterized by that the support structure (2, 32) forms at least two segments (3, 4, 9, 11, 26 - 28) and that the segments (3, 4, 9, 11, 26 - 28) are flexibly connected to one another. [2] Sensor device according to claim 1, characterized by that the support structure (2, 32) is flexible and that the flexible connection between the segments (3, 4, 9, 11, 26 - 28) is formed by sections of the support structure (2, 32). [3] Sensor device according to claim 1 or 2, characterized by that the support structure (2) is elongated and that the segments (3, 4, 9, 11) and the flexible connections between the segments (3, 4, 9, 11) are formed from the elongated support structure (2). [4] Sensor device according to claim 3, characterized by that at least one segment (3, 4, 9, 11) has a trapezoidal (20) base area. [5] Sensor device according to claim 1 or 2, characterized by that at least one segment (26 - 28) surrounds at least one further segment (26 - 28) at least in sections. [6] Sensor device according to claim 5, characterized by that at least one segment (26 - 28) has a rounding. [7] Sensor device according to claim 5 or 6, characterized by that the segments (26 - 28) are substantially circular and that the segments (26 - 28) are arranged substantially concentrically. [8] Sensor device according to claims 1 to 7, characterized by that the flexible connection between two adjacent segments (26 - 28) is formed by web-like sections (29) of the support structure (32). [9] Sensor device according to one of claims 1 to 8, characterized bythat at least two adjacent segments (3, 4, 9, 11) are each surrounded by a protective body (5) and that the minimum angle between the two segments (3, 4, 9, 11) is limited by the external shape of the respective protective body (5). [10] Sensor device according to claim 9, characterized by that the protective bodies (5) have side regions (25) facing the connecting regions (16) between two segments (3, 4, 9, 11) and that the side regions each form an angle with the support structure (2, 32). [11] Sensor device according to one of claims 1 to 10, characterized by that a first segment (3, 4, 9, 11, 26 - 28) has sensor elements (6) and that a second segment (3, 4, 9, 11, 26 - 28) has a power supply (10) [12] Sensor device according to claim 11, characterized bythat at least one further segment (3, 4, 9, 11, 26 - 28) has the data-conducting interface (8) and / or that at least one further segment (3, 4, 9, 11, 26 - 28) has an evaluation device (7). [13] Sensor device according to one of claims 1 to 12, characterized by that the minimum angle between two adjacent segments (3, 4, 9, 11, 26 - 28) is limited by the distance between the segments (3, 4, 9, 11, 26 - 28). [14] Sensor device according to one of claims 1 to 13, characterized by that at least one segment (3, 4, 9, 11, 26 - 28) has a mounting area (13) for mounting the sensor device (1). [15] Sensor device according to one of claims 1 to 14, characterized by that at least one segment (3, 4, 9, 11, 26 - 28) has at least one rigid region (17) for receiving components (18) to be soldered. [16] Sensor device according to one of claims 1 to 15, characterized bythat at least one sensor element (6) is formed by a piezoelectric element. [17] Sensor device according to claim 16, characterized by that the segment (3, 4, 9, 11, 26 - 28) having the piezoelectric element has a lower mass than the other segments (3, 4, 9, 11, 26 - 28). [18] Sensor device according to one of claims 16 or 17, characterized by that an acoustic impedance jump is formed between at least two segments (3, 4, 9, 11, 26 - 28). [19] Vehicle with a sensor device according to one of the preceding claims. [20] Method for producing a sensor device, in particular a sensor device according to one of claims 1 to 18, wherein a support structure is provided, characterized by , that segments (3, 4, 9, 11, 26 - 28) are produced from the support structure (2, 32), that flexible connections are formed between the segments (3, 4, 9, 11, 26 - 28). [21] A method for producing a sensor device according to claim 20, characterized by that the flexible connection of the segments (3, 4, 9, 11, 26 - 28) is formed by the support structure (2, 32).

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