Sensor arrangement for arrangement on a measuring chamber, device for qualifying a mask and method for qualifying a mask

Abstract

Sensor arrangement (100; 200; 300; 500) for arrangement on a measuring chamber (540), wherein the sensor arrangement (100; 200; 300; 500) comprises a sensor (124; 224; 324; 524), an intake opening (131; 231; 331) and an outlet (132; 232; 332; 532), wherein the sensor arrangement (100; 200; 300; 500) comprises a fluid connection (133; 233; 333) between the intake opening (131; 231; 331) and the outlet (132; 232; 332; 532); - wherein the sensor arrangement (100; 200; 300; 500) has a first section (190; 290; 390) and a second section (110; 210; 310), wherein the first section (190; 290; 390) has the outlet (132; 232; 332; 532) and wherein the second section (110; 210; 310) has the intake opening (131; 231; 331) and the sensor (124; 224; 324; 524), wherein the fluid connection (133; 233; 333) connects the first section (190; 290; 390) to the second section (110; 210; 310); and - wherein the sensor arrangement (100; 200; 300; 500) comprises an electronics unit (120; 220; 320), wherein the first section (190; 290; 390) comprises the electronics unit (120; 220; 320).

Description

[0001] The present invention relates to a sensor arrangement for arrangement on a measuring chamber, a device for qualifying a mask and a method for qualifying a mask.

[0002] In known sensor arrangements for arrangement in a measuring chamber, in particular in a vacuum measuring chamber, an introduction of particles and / or gases can occur, in particular from the sensor arrangement into the measuring chamber, for example an outgassing of an adhesive into the measuring chamber.

[0003] Devices and methods for qualifying a mask for use in lithography are known from the prior art. By capturing optical images, a mask for use in lithography can be examined, for example, for defects and / or contamination in order to improve quality in a subsequent lithography process for producing semiconductor elements. A method for qualifying a mask can be carried out using a device comprising a sensor arrangement. In sensor arrangements known from the prior art, there is the possibility that particles or contamination from parts of the sensor arrangement and / or from the measuring chamber can become deposited on an optical sensor or on optical surfaces, for example on optical surfaces within the measuring chamber.As a result, unwanted deposits can form on optical components and / or on a sensor, in particular on an optical sensor, which impair the measurement result. The unwanted deposits can be organic substances, for example. In addition to contamination from the sensor arrangement, contamination that does not originate from the sensor arrangement can alternatively or additionally deposit on surfaces, in particular a sensor surface. As a result, for example, measurement results of a method for qualifying a mask for use in lithography can be impaired, in particular the mask or optical components can become contaminated. As a result, for example, the reliability of defect detection can be impaired, in particular increasing over time.Alternatively or additionally, the mask to be qualified may become contaminated by the known process, which would negatively impact the lithography result. Alternatively or additionally, the rate of false-positive defect detections may increase and / or existing defects may not be detected.

[0004] DE 10 2008 000 957 A1 discloses, among other things, a protection module in an EUV lithography device comprising a housing, wherein a sensor is arranged in the housing. To prevent contamination of this sensor, a gas supply and a gas discharge connected, for example, to a pump or a vacuum system are arranged on the housing in such a way that a gas flow prevents unwanted substances from reaching the sensor. Inert gases (including molecular nitrogen, argon, krypton, helium, neon, or xenon) can be introduced into the protection module via the gas supply.

[0005] DE 10 2010 063 337 A1 discloses, among other things, a method for mask inspection, wherein light from a light source enters an illumination system and directs an illumination beam onto a mask arranged in the object plane of a projection lens, and wherein the illuminated area of ​​the mask is imaged onto a sensor arrangement via an observation beam by means of the projection lens.

[0006] It is an object of the present invention to provide a sensor arrangement for arrangement on a measuring chamber, a device for qualifying a mask and a method for qualifying a mask, which reduce contamination of the measuring chamber and / or the mask.

[0007] Accordingly, a sensor arrangement for arrangement on a measuring chamber is proposed. The sensor arrangement has a sensor. The sensor can be an optical sensor, in particular an imaging sensor. The sensor can, for example, comprise a CCD (charge-coupled device) chip, a CMOS (complementary metal-oxide-semiconductor) chip and / or a photodiode. Particularly preferably, the sensor can comprise a TDI (time delay and integration) sensor. The sensor arrangement can, for example, be a camera system. The sensor arrangement has an intake opening and an outlet. The sensor arrangement has a fluid connection between the intake opening and the outlet. The intake opening can be configured to guide a fluid from the measuring chamber into the sensor arrangement, in particular into a cavity of the sensor arrangement. The fluid can be a gaseous and / or liquid medium, for example air.The intake opening can be completely or partially filled with a medium permeable to the fluid. The outlet can be configured to guide a fluid out of the sensor arrangement via at least part of the fluid connection. The outlet can be designed as an opening. The outlet can be completely or partially filled with a medium permeable to the fluid. The fluid connection is configured to guide the fluid through at least part of the sensor arrangement. The fluid connection can be configured to guide a fluid from the intake opening to the outlet. The fluid connection can be designed at least partially as a cavity. The fluid connection can be at least partially filled with a medium permeable to the fluid.

[0008] The fluid connection can be configured to suck a medium out of the measuring chamber during operation of the sensor arrangement. The medium can preferably be the fluid. The medium can comprise a gas, in particular a gas mixture, and / or particles and / or contaminants.

[0009] The sensor arrangement can have an adhesive layer. The adhesive layer can be configured to connect two or more elements of the sensor arrangement to one another. The adhesive layer can form a barrier to contamination. The adhesive layer can be configured to prevent contaminants from migrating toward the measuring chamber. The fluid connection can be configured to divert, in particular to suction off, any outgassing from the adhesive layer during operation of the sensor arrangement. This can suppress the diffusion of the outgassing into the measuring chamber and / or can direct outgassing from the adhesive layer to the outlet via the suction opening and / or via the fluid connection.

[0010] The sensor arrangement has a first section and a second section. The first section has the outlet. The second section has the intake opening and the sensor. In addition, the second section can have the adhesive layer. The fluid connection connects the first section to the second section. The first section can be separated from the second section, for example, by a plane. If the sensor arrangement is arranged on the measuring chamber, the plane can be arranged on a wall of the measuring chamber. If the sensor arrangement is arranged on the measuring chamber, the first section of the sensor arrangement can be arranged substantially outside the measuring chamber. If the sensor arrangement is arranged on the measuring chamber, the second section of the sensor arrangement can protrude substantially into the measuring chamber.In the context of the present invention, expressions such as “first”, “second”, “third”, as in “first section”, serve as mere designations, in particular without reference to a sequence and without reference to the presence of another element of the type mentioned.

[0011] The sensor assembly comprises an electronics unit, wherein the first section comprises the electronics unit. The electronics unit may comprise electrical connections and / or a wiring harness and / or a control unit and / or an evaluation unit.

[0012] The first section can have a carrier plate. The second section can have a sensor carrier. The carrier plate can be configured to arrange the sensor arrangement on the measuring chamber. The carrier plate can, for example, be permanently or reversibly connectable to a wall of the measuring chamber. The sensor arrangement can, for example, have a sealing element, in particular a seal, for example an O-ring, and / or a fluid-tight adhesive layer and / or a fluid-tight coating. For sealing, a seal, in particular an O-ring, can be arranged between the carrier plate and a wall of the measuring chamber. The carrier plate can have an opening, for example a circular opening. At least part of the electronics unit can be accommodated in the opening. The carrier plate and / or the sensor carrier and / or the sensor can be arranged essentially parallel to one another.Essentially parallel can be understood here as an angle between two elements of less than 30°, in particular less than 10°, particularly preferably less than 1°. The adhesive layer can be arranged between the sensor carrier and the sensor. The adhesive layer can be configured to connect the sensor carrier to the sensor. The electronics unit can be connected, in particular electrically connected, to the sensor via the sensor carrier or an opening in the sensor carrier and / or via a passage through the adhesive layer. The electronics unit can, for example, be essentially cylindrical.

[0013] The second section can have the adhesive layer. The adhesive layer can be configured to prevent contamination from the first section, in particular from the electronics unit, from entering the measuring chamber. This eliminates the need for the electronics unit to be vacuum-capable. This can reduce costs. The adhesive layer can be used to reduce the volume of the sensor assembly, which must be vacuum-capable. The adhesive layer can shield elements of the sensor assembly that are not vacuum-capable.

[0014] The sensor arrangement can be configured to generate a decreasing pressure gradient from the first section to the second section, in particular such that outgassing from the second section, in particular from the adhesive layer, can be sucked away. The first section can have a first cavity. The second section can have a second cavity. A partial pressure in the first cavity can be lower than a partial pressure in the second cavity, in particular during operation of the sensor arrangement. Preferably, the sensor arrangement can be configured such that a partial pressure in the first cavity can be lower than a partial pressure in the second cavity, in particular during operation of the sensor arrangement. The first cavity can, for example, be part of the electronics unit. The second cavity can, for example, be a channel and / or the suction opening.The first cavity and / or the second cavity can be at least partially filled with a medium, for example, a porous medium. The second cavity can be arranged, for example, in the sensor carrier, in particular in a porous material of the sensor carrier and / or in a cable feedthrough of the sensor carrier.

[0015] The sensor arrangement can have a plurality of sensors, in particular a plurality of imaging sensors, particularly preferably a plurality of TDI sensors. The sensor arrangement can, for example, comprise a plurality of CCD (charge-coupled device) chips and / or a plurality of CMOS (complementary metal-oxide-semiconductor) chips and / or a plurality of photodiodes. The sensor arrangement can, for example, have 2 to 100 sensors, in particular 5 to 50, particularly preferably 10 to 30 sensors. The sensor arrangement can be designed such that the plurality of sensors are each configured to record a partial image, wherein the partial images can be added after a time offset. This can increase the field of view of the sensor arrangement when using small sensors and / or sensors can be replaced individually when worn. The sensor arrangement can have a plurality of TDI chips, wherein the TDI chips can be arranged in one plane, if possible without overlapping.

[0016] The sensor, in particular the sensor arrangement, can be configured to detect radiation in the EUV range. The radiation can have a wavelength between 1 nm and 250 nm, in particular between 10 nm and 100 nm, preferably between 13 nm and 14 nm.

[0017] The sensor assembly may include a first connecting element. The first connecting element may be connectable to a vacuum source. The first connecting element may be identical to the outlet.

[0018] The sensor arrangement can have a vacuum source. The vacuum source can be a pump. The vacuum source can be a vacuum system. The vacuum source can be configured to generate an ultra-high vacuum. Ultra-high vacuum can be understood to mean a partial pressure of less than 10 Pascal, preferably less than 5 Pascal. Particularly preferably, ultra-high vacuum can be understood to mean a partial pressure of less than 100 nanopascals. The sensor arrangement can, for example, have a plurality of pumps, in particular a backing pump and a main pump. The vacuum source can have one or more elements selected from a group comprising a blocking vane pump, a rotary vane pump, a jet pump, a molecular pump, a turbomolecular pump, a cryopump, and a sorption pump. The sensor arrangement can have a device for baking out.This can prevent contamination from entering a measuring chamber during operation.

[0019] The sensor assembly may include a second connecting element. The second connecting element may be connectable to the measuring chamber for operation under ultra-high vacuum. The second connecting element may be configured to permanently or reversibly connect the support plate to a wall of the measuring chamber. The connecting element may include an O-ring for sealing. The second connecting element may include, for example, a flange. The second connecting element may be configured to be screwed to the measuring chamber. The second connecting element may include one or more drilled holes.

[0020] The sensor arrangement can comprise a purging device for guiding a purging flow of a purging medium. The purging device can comprise one or more elements selected from the group comprising a purging medium source, a line for guiding the purging medium, and an outlet, in particular a nozzle, for supplying one of the sensors with purging medium. The purging medium can comprise one or more gases selected from the group comprising helium, hydrogen, nitrogen, neon, argon, krypton, xenon, and oxygen. The purging medium can be a pure gas. Alternatively, the gas can be a gas mixture. The purging medium can preferably be a gas mixture comprising helium and hydrogen. The purging device can be configured to generate a constant purging flow. The purging device can be configured to generate a laminar purging flow.Preferably, the flushing device can be configured to direct a flushing flow over at least part of the sensor, in particular over sensor edges of the sensor. The sensor can be cleaned by means of the flushing flow. Alternatively or additionally, heat can be dissipated by means of the flushing flow, for example from the sensor, in particular to the first section of the sensor arrangement. This can improve the function of the sensor. The intake opening can be configured to suck in the flushing medium. The fluid connection can be configured to direct the flushing flow from the intake opening to the outlet. The flushing flow can be configured to entrain contaminants and / or outgassing from the adhesive layer. The flushing device and / or the fluid connection can be configured to generate a negative pressure in parts of the sensor arrangement.This allows, for example, impurities and / or outgassing to be extracted, particularly towards the outlet.

[0021] The sensor arrangement can have a first housing. At least part of the sensor arrangement can be integrated into the first housing. For example, the electronics unit and / or the carrier plate can be at least partially arranged in the first housing and / or mechanically connected to the first housing. For example, the first housing of the sensor arrangement can have the outlet. For example, the sensor arrangement can have a second housing. The second housing can, for example, at least partially encompass the sensor carrier and / or the sensor and / or the flushing device. This can simplify the extraction of contaminants and / or outgassing, for example from the electronics unit and / or from an adhesive layer of the sensor arrangement.

[0022] The fluid connection can have one or more channels. The fluid connection can, for example, comprise an annular gap. The annular gap can have a constant gap width. The annular gap can, for example, have interruptions, in particular for elements for stabilizing the sensor arrangement and / or for electrical connections. The annular gap can be formed between the cylindrical electronics unit and the carrier plate, in particular by the electronics unit protruding into a circular opening in the carrier plate. The radius of the annular opening can be larger than the radius of the electronics unit, for example by 0.1 mm to 1 cm, preferably by 0.5 mm to 2 mm, particularly preferably by 1 mm.

[0023] The channel can have a cross-section of at least 0.1mm 2 , in particular at least 1mm 2 , particularly preferably at least 5mm 2The channel can, for example, be formed between the carrier plate and the electronics unit. Alternatively or additionally, the channel can be set up between a housing of the electronics unit and the carrier plate. The housing of the electronics unit and / or the electronics unit can, for example, be substantially tubular, can-shaped, or cylindrical. Alternatively, the housing of the electronics unit and / or the electronics unit can, for example, be substantially cuboid-shaped. The housing of the electronics unit can, for example, be connected to the sensor carrier by means of an adhesive layer. The housing of the electronics unit can, for example, be connected to the first housing of the sensor arrangement. The housing of the electronics unit can have openings for the supply of electrical lines.

[0024] The sensor arrangement can, for example, have a third section. The third section can comprise a third cavity. The third cavity can, for example, be integrated into the housing of the electronics unit. A partial pressure in the third cavity can be higher than in the first cavity and / or in the second cavity, in particular during operation of the sensor arrangement. The sensor arrangement can preferably be designed such that a partial pressure in the third cavity can be higher than in the first cavity and / or in the second cavity, in particular during operation of the sensor arrangement. A partial pressure in a cavity of the first section can preferably be higher than in a cavity of the second section. The third section can preferably comprise the electronics unit. The sensor arrangement can have a further adhesive layer, in particular between the housing of the electronics unit and the sensor carrier.The further adhesive layer can be designed in a ring shape, in particular such that a part of the electronics unit can be passed through the adhesive layer to the sensor carrier. The third section can be separated, in particular fluidically separated, from the first section and / or from the second section by a fluid-tight wall and / or by the housing of the electronics unit and / or by the further adhesive layer. This makes it unnecessary for the electronics unit to be designed to be vacuum-compatible. The sensor arrangement can be designed such that the partial pressure in the first cavity and / or the partial pressure in the second cavity can be adjusted in a controlled manner, for example by means of the electronics unit.Particularly preferably, the sensor arrangement can be designed such that the partial pressure in the first cavity and / or the partial pressure in the second cavity and / or the partial pressure in the third cavity can be adjusted in a controlled manner, for example by means of the electronics unit. For example, the negative pressure source can be configured to adjust and / or control partial pressures in cavities of the sensor arrangement. The negative pressure source can be configured to generate and / or control different partial pressures in the first cavity and / or in the second cavity. Preferably, the negative pressure source can be configured to generate and / or control different partial pressures in the first cavity and / or in the second cavity and / or in the third cavity.

[0025] The sensor arrangement can, for example, have a cooling device. The cooling device can comprise a Peltier element. The cooling device can be configured to cool the sensor. The fluid connection can be arranged such that a fluid flow and / or a purge flow passes over a warm side of the Peltier element, in particular such that the heat is transported away to the outlet. Alternatively or additionally, the fluid connection can be designed such that a fluid flow and / or a purge flow passes over a cold side of the Peltier element, in particular such that condensing moisture is transported away to the outlet. The fluid connection can, for example, be a gap between the sensor carrier and the cooling device, in particular the Peltier element. The fluid connection can be configured to conduct moisture from the cooling device, in particular condensate, to the outlet.The fluid connection, in particular the channels, can be arranged at least partially in the cooling device and / or in the sensor carrier. This allows heat and / or moisture and / or contamination to be specifically dissipated from the sensor.

[0026] For example, the sensor arrangement can be designed such that partial pressures in the sensor arrangement can be controlled such that the electronics unit can have a partial pressure that is lower than the partial pressure of the measuring chamber. This has the advantage that the sensor and / or the sensor carrier and / or the cooling device, in particular the Peltier element, bend less, particularly due to a smaller pressure difference between the measuring chamber and the electronics unit.

[0027] The fluid connection can have one or more valves. The valves can be configured to prevent a fluid flow from the first section to the second section. This can prevent contaminants from the sensor arrangement from entering the measuring chamber, for example when a vacuum source is switched off. The valve can be a check valve, for example. Alternatively or additionally, the outlet and / or the fluid connection can have a device configured to close the outlet and / or the fluid connection when needed, in particular in a fluid-tight manner, for example a fluid-tight slide valve. The fluid connection and / or the outlet can have a filter, for example, to filter sucked-off fluid. The fluid connection and / or the outlet can have a device for analyzing sucked-off fluid, for example a mass spectrometer.This allows a conclusion to be drawn about a source of contamination, in particular a source of outgassing. The sensor arrangement can comprise one or more pressure sensors. This allows a fluid flow through the sensor arrangement to be monitored and / or controlled.

[0028] In a further aspect, the invention may comprise a device for qualifying a mask for use in lithography. The device comprises a sensor arrangement according to the disclosure. The qualification of the mask may, for example, comprise a check of the mask. Alternatively or additionally, the qualification of the mask may comprise a pretreatment of the mask, for example, a correction.

[0029] The mask can be a photolithographic mask, particularly preferably a photolithographic mask for an EUV wavelength range. The mask can have multiple layers, in particular planar layers. The mask can have an absorber structure composed of absorbing pattern elements.

[0030] The device for qualifying a mask can comprise an evaluation and control device and a measuring chamber comprising an optical system. The evaluation and control device can comprise a separate evaluation device and a separate control device, wherein both can be connected to each other via an interface. Alternatively, the evaluation and control device can be configured as a single device. The evaluation and control device can preferably comprise a data processing device. The evaluation and control device can be operated by a person, for example, via an interface. This interface can be a keyboard or a touchpad.

[0031] The optical system can comprise an illumination unit and an imaging unit. The illumination unit can be configured to expose the mask to light, in particular to illumination light. The illumination unit can comprise an EUV light source. The imaging unit can be configured to image light reflected from the mask in an image plane.

[0032] The device for qualifying a mask can have at least one housing of the device for qualifying a mask. For example, the optical system can be arranged within the housing of the device for qualifying a mask, preferably completely within the housing of the device for qualifying a mask. The evaluation and control device can be arranged partially within the housing of the device for qualifying a mask. For example, the evaluation and control device can be arranged completely within the housing of the device for qualifying a mask. Alternatively, the evaluation and control device can be arranged completely outside the housing of the device for qualifying a mask. For example, the sensor arrangement can be arranged at least partially within the housing of the device for qualifying a mask.

[0033] The device can comprise a device for supporting the mask. The device for supporting the mask can be configured to expose the mask to at least one purge gas, in particular a purge gas as described above. Alternatively or in addition to the purge device of the sensor arrangement, the device for supporting the mask can also expose the sensor of the sensor arrangement to purge gas. By using the sensor arrangement according to the disclosure, the device can improve the detection of defects on the mask.

[0034] In a further aspect of the present invention, a method for qualifying a mask for use in lithography is proposed. The method comprises providing a device for qualifying a mask, wherein the device comprises a sensor arrangement according to the disclosure. The device can comprise an evaluation and control device and a measuring chamber. An optical system can be arranged in the measuring chamber. The sensor arrangement comprises a sensor, a suction opening, and an outlet. The sensor arrangement has a fluid connection between the suction opening and the outlet. The device can have a vacuum source. The method further comprises detecting at least one optical image of a part of the mask by means of the sensor. The method further comprises sucking a medium out of the measuring chamber via the fluid connection, in particular by means of the evaluation and control device.In a further step, one or more images generated by the sensor can be evaluated, in particular by means of the evaluation and control device. In a further step, defect detection can be performed, in particular by means of the evaluation and control device. For example, a defect and / or contamination on the mask can be detected. In a further step, the mask can be repaired.

[0035] The sensor arrangement according to the disclosure for arrangement in a measuring chamber, the device according to the disclosure for qualifying a mask, and the method according to the disclosure for qualifying a mask have various advantages, at least in exemplary embodiments. In particular, the reliability of a mask qualification can be increased, for example, by reducing outgassing of an adhesive layer into the measuring chamber and / or by suctioning off contaminants and / or moisture and / or by removing heat from the measuring chamber and / or from the sensor arrangement.

[0036] It is understood that the features mentioned above and those to be explained below can be used not only in the combination specified in each case, but also in other combinations or on their own, without departing from the scope of the present disclosure.

[0037] Embodiments of the disclosure are illustrated in the drawings and explained in more detail in the following description. They show: Fig. 1 a schematic representation of a first embodiment of a sensor arrangement according to the invention; Fig. 2 a schematic representation of a second embodiment of a sensor arrangement according to the invention; Fig. 3 a schematic representation of a third embodiment of a sensor arrangement according to the invention; Fig. 4 is a schematic representation of an embodiment of a device according to the invention for qualifying a mask; and Fig. 5 a schematic representation of a method according to the invention for qualifying a mask.

[0038] Fig. 1 shows a first exemplary embodiment of a sensor arrangement 100 according to the invention for arrangement in a measuring chamber. The sensor arrangement 100 has a sensor 124, an intake opening 131, and an outlet 132. The sensor arrangement 100 has a fluid connection 133 between the intake opening 131 and the outlet 132. The fluid connection 133 is configured to suck a medium out of the measuring chamber during operation of the sensor arrangement 100. The sensor 124 can be configured to detect radiation in the EUV range. The sensor arrangement 100 can have a plurality of sensors 124, in particular a plurality of imaging sensors 124, in particular a plurality of sensors 124 which can be configured to detect radiation in the EUV range.

[0039] The sensor assembly 100 has an adhesive layer 123. The fluid connection 133 can be configured to extract outgassing 126 from the adhesive layer 123 during operation of the sensor assembly 100.

[0040] The sensor arrangement 100 has a first section 190 and a second section 110. In the Fig. In the embodiment shown in Figure 1, the dashed line 141 marks a plane as the boundary between the first section 190 and the second section 110. The first section 190 includes the outlet 132. The second section 110 has the intake opening 131 and the sensor 124. The fluid connection 133 connects the first section 190 to the second section 110.

[0041] The sensor arrangement 100 comprises an electronics unit 120. The first section 190 comprises the electronics unit 120. The first section 190 further comprises a carrier plate 121. The second section 110 comprises a sensor carrier 122. The sensor arrangement 100 can be configured to generate a decreasing pressure gradient from the first section 190 to the second section 110.

[0042] The first section 190 has a first cavity 134. The first cavity 134 can, for example, be enclosed by the electronics unit 120. The second section 110 has a second cavity 135. The second cavity 135 can be the intake port 131. A partial pressure in the first cavity 134 can be lower than in the second cavity 135, particularly when the sensor arrangement 100 is operated in a measuring chamber under ultra-high vacuum.

[0043] The sensor arrangement 100 can have a first housing 143. The outlet 132 and / or the carrier plate 121 and / or the electronics unit 120 can be at least partially integrated into the first housing 143. Alternatively or additionally, the sensor arrangement 100 can have a second housing. The second housing can, for example, at least partially enclose the sensor carrier 122 and / or the sensor 124 and / or a purging device. This can simplify the extraction of contaminants and / or outgassing, for example from the electronics unit 120 and / or from an adhesive layer 123 of the sensor arrangement 100. For example, a cavity of the first housing 143 can be the first cavity. For example, a cavity of the second housing can be the second cavity.

[0044] The sensor arrangement 100 has a first connecting element 137. The first connecting element 137 can be connected to a vacuum source. Alternatively, the sensor arrangement 100 can have a vacuum source, for example a pump. The sensor arrangement 100 has a second connecting element 139. The second connecting element 139 is in the embodiment according to Fig. 1 the carrier plate 121. The second connecting element 139 can be connectable to the measuring chamber for operation under ultra-high vacuum.

[0045] The fluid connection 133 has a channel 141. The channel 141 according to Fig. 1 is essentially designed as an annular gap. The annular gap can, for example, have interruptions, in particular by elements for mechanically stabilizing the sensor arrangement 100 and / or by electrical connections. The channel 141 forms a gap between the electronics unit 120 and the carrier plate 121. The channel 141 can have a cross-section of at least 0.1 mm 2 , in particular at least 1mm 2 , particularly preferably at least 5mm 2 The fluid connection 133 may include one or more valves. The sensor arrangement 100 may include a cooling device.

[0046] The electronics unit 120 is essentially cylindrical. Alternatively, the electronics unit 120 can be essentially cuboid-shaped. The electronics unit 120 is accommodated in a circular opening of the carrier plate 121. The electronics unit 120 is connected to a sensor carrier 122, in particular by means of electrical connections. The sensor carrier 122 is connected to the sensor 124 by means of an adhesive layer 123. The sensor 124 can be a TDI sensor. For example, the sensor 124 can comprise multiple TDI sensors.When a pump is connected to the outlet 132, a negative pressure can be generated in the first section 190, which comprises the electronics unit 120, the outlet 132, and the carrier plate 121, as well as at least parts of the first housing 143 of the sensor arrangement 100. This negative pressure can generate a fluid flow from the second section 110, which comprises the sensor carrier 122, the adhesive layer 123, and the sensor 124, into the first section 190. This allows outgassing 126 from the adhesive layer 123 to be conducted from the second section 110 into the first section 190.

[0047] The embodiment of the sensor arrangement 200 according to Fig. 2 can essentially be like the embodiment according to Fig. 1. The embodiment according to Fig. 2 comprises a purging device 227 for guiding a purging stream 228 of a purging medium. The purging medium can comprise one or more gases selected from the group comprising helium, hydrogen, nitrogen, neon, argon, krypton, xenon, and oxygen. The purging device 227 can be configured, for example, as an annular nozzle arrangement. The purging device 227 can be configured to intensify the suction removal of outgassing 226 from the adhesive layer 223. The purging device 227 can be configured to direct the purging stream 228 onto edges of the sensor 224 and / or onto an edge zone of the adhesive layer 223. This can intensify the suction removal of outgassing 226 from the adhesive layer 223 and / or of contamination from the sensor 224.

[0048] The sensor assembly 200 may include a first housing 243. The outlet 232 and / or the support plate 221 and / or the electronics unit 220 may be at least partially integrated into the first housing 243.

[0049] The sensor arrangement 200 according to Fig. 2 comprises a second housing 244 of the sensor arrangement 200. The second housing 244 of the sensor arrangement 200 can, for example, at least partially enclose the sensor carrier 222 and / or the sensor 224 and / or the flushing device 227 and / or the adhesive layer 223. This can simplify the extraction of contaminants and / or outgassing 226, for example from the electronics unit 220 and / or from an adhesive layer 223 of the sensor arrangement 200. For example, a cavity of the first housing 243 can be the first cavity 234. For example, a cavity of the second housing 244 can be the second cavity 235. During operation of the sensor device 200, a partial pressure in the first cavity 234, in particular in the first housing 243, can be lower than in the second cavity 235, in particular in the second housing 244.

[0050] The embodiment of the sensor arrangement 300 according to Fig. 3 can essentially be like the sensor arrangements according to Fig. 1 and / or Fig. 2 and can, for example, also have components which are Fig. 3 are not shown. The first section 390 comprises the carrier plate 321. The second section 310 comprises the sensor 324, the sensor carrier 322, and the adhesive layer 323, which connects the sensor 324 to the sensor carrier 322.

[0051] The sensor arrangement 300 comprises a further adhesive layer 323a, which can be configured to fluidically seal a housing 321a of the electronics unit 320 from the first section 390 and the second section 310, in particular from the sensor carrier 322. The sensor arrangement 300 has a third section 340. The third section 340 comprises the electronics unit 320. The sensor arrangement 300 has a first cavity 334 in a first section 390 and a second cavity 335 in a second section 310. The third section 340 can have a third cavity 345, which, during operation of the sensor arrangement 300, has a higher partial pressure than the first section 390 and the second section 310. The third cavity 345 can have an atmospheric pressure, in particular during operation of the sensor arrangement 300. The sensor arrangement 300 comprises a cooling device 342.

[0052] The sensor arrangement 300 can have a first housing 343. The outlet 332 and / or the carrier plate 321 and / or the electronics unit 320 can be at least partially integrated into the first housing 343. Alternatively or additionally, the sensor arrangement 300 can have a second housing. The second housing can, for example, at least partially enclose the sensor carrier 322 and / or the sensor 324 and / or the purging device 327 and / or the adhesive layer 323. This can simplify the extraction of contaminants and / or outgassing, for example from the electronics unit 320 and / or from an adhesive layer 323 of the sensor arrangement 300. For example, a cavity of the first housing 343 can be the first cavity 334. For example, a cavity of the second housing can be the second cavity.During operation of the sensor device 300, a partial pressure in the first cavity 334, in particular in the first housing 343, may be lower than in the second cavity, in particular in the second housing.

[0053] Fig. 4 shows an embodiment of an apparatus 550 according to the invention for qualifying a mask 530 for use in lithography, wherein the apparatus 550 comprises a sensor arrangement 500 according to the invention. The sensor arrangement 500 can be configured like a sensor arrangement described above. In Fig. 4 shows a sensor arrangement 500, which in particular comprises a sensor 524 and an outlet 532. The sensor 524 can be configured to detect radiation in the EUV range 536. The outlet 532 is the first connecting element 537. The outlet 532 is connected to a vacuum source 538. The vacuum source 538 is integrated into the sensor arrangement 500, in particular into a first housing 543 of the sensor arrangement 500. The device 550 comprises an EUV source 510.

[0054] The device 550 comprises an evaluation and control device 543 and a measuring chamber 540 comprising an optical system 520. The evaluation and control device 543 can be connected via interfaces to the sensor arrangement 500 and / or to the EUV source 510 and / or to the optical system 520. The device 550 has a housing 590. The housing 590 can, for example, delimit the measuring chamber 540. The device 550 can be configured to carry out a method according to the invention for qualifying a mask 530.

[0055] Fig. Figure 5 shows an embodiment of the method according to the invention for qualifying a mask for use in lithography. The method comprises providing 1010 a device for qualifying a mask. The device can be, for example, a device as shown in Fig. 4. The device comprises in particular a sensor arrangement according to the invention, as for example in Fig. 1, Fig. 2, Fig. 3 or Fig.4. The device can have an evaluation and control device and a measuring chamber comprising an optical system. The sensor arrangement comprises a sensor, a suction opening and an outlet. The sensor arrangement comprises a fluid connection between the suction opening and the outlet. The device can have a vacuum source. In a further step 1020, at least one optical image of at least part of the mask is captured by means of the sensor. For example, multiple images can be captured. In a further step 1030, a medium is sucked out of the measuring chamber via the fluid connection by means of the evaluation and control device. In a further step, an evaluation can be carried out by means of the evaluation and control device, in particular a defect detection can be carried out in order to detect defects or contamination of the mask. List of reference symbols 100, 200, 300, 500 sensor arrangement 540 measuring chamber 124, 224, 324, 524 sensors 131, 231, 331 intake opening 132, 232, 332, 532 outlet 133, 233, 333 fluid connection 123, 223, 323 adhesive layer 126, 226, 326 outgassing 190, 290, 390 first section 110, 210, 310 second section 1010 Deploy 1020 Capture 1030 suction 120, 220, 320 electronic unit 121, 221, 321 carrier plate 122, 222, 322 sensor carrier 134, 234, 334, 534 first cavity 135, 235, 335, 535 second cavity 536 Radiation in the EUV range 137, 337, 537 first connecting element 538 Vacuum source 139, 239, 339 second connecting element 227, 327 Flushing device 228, 328 flushing current 141, 241, 341 channel 342 Cooling device 530 Mask 543 Evaluation and control device 520 optical system 550 Device for qualifying a mask 142, 242, 342 level 323a additional adhesive layer 321a Electronics unit housing 340 third section 510 EUV source 590 Housing of the device for qualifying the mask 143, 243, 343, 543 first housing of the sensor arrangement 244 second housing of the sensor arrangement 345 third cavity

Claims

[1] Sensor arrangement (100; 200; 300; 500) for arrangement on a measuring chamber (540), wherein the sensor arrangement (100; 200; 300; 500) comprises a sensor (124; 224; 324; 524), a suction opening (131; 231; 331) and an outlet (132; 232; 332; 532), wherein the sensor arrangement (100; 200; 300; 500) comprises a fluid connection (133; 233; 333) between the suction opening (131; 231; 331) and the outlet (132; 232; 332; 532); - wherein the sensor arrangement (100; 200; 300; 500) has a first section (190; 290; 390) and a second section (110; 210; 310), wherein the first section (190; 290; 390) has the outlet (132; 232; 332; 532) and wherein the second section (110; 210; 310) has the intake opening (131; 231; 331) and the sensor (124; 224; 324; 524), wherein the fluid connection (133; 233; 333) connects the first section (190; 290; 390) to the second section (110; 210; 310); and - wherein the sensor arrangement (100; 200; 300; 500) comprises an electronics unit (120; 220; 320), wherein the first section (190; 290; 390) comprises the electronics unit (120; 220; 320). [2] Sensor arrangement (100; 200; 300; 500) according to claim 1, wherein the fluid connection (133; 233; 333) is arranged to suck a medium out of the measuring chamber (540) during operation of the sensor arrangement (100; 200; 300; 500). [3] Sensor arrangement (100; 200; 300; 500) according to claim 1 or 2, wherein the sensor arrangement (100; 200; 300; 500) has an adhesive layer (123; 223; 323, 323a). [4] Sensor arrangement (100; 200; 300; 500) according to claim 3, wherein the fluid connection (133; 233; 333) is arranged to suck out gases (126; 226; 326) of the adhesive layer (123; 223; 323, 323a) during operation of the sensor arrangement (100; 200; 300; 500). [5] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the first section (190; 290; 390) comprises a carrier plate (121, 221, 321), wherein the second section (110; 210; 310) comprises a sensor carrier (122; 222; 322). [6] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) is arranged to generate a decreasing pressure gradient from the first section (190; 290; 390) to the second section (110; 210; 310). [7] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the first section (190; 290; 390) has a first cavity (134; 234; 334; 534), wherein the second section (110; 210; 310) has a second cavity (135; 235; 335; 535), wherein a partial pressure in the first cavity (134; 234; 334; 534) is lower than in the second cavity (135; 235; 335; 535). [8] Sensor arrangement (100; 200; 300; 500) according to claim 7, wherein the sensor arrangement (100; 200; 300; 500) comprises a third section (340), wherein the third section (340) has a third cavity (345), wherein a partial pressure in the third cavity (345) is higher than in the first cavity (134; 234; 334; 534) and in the second cavity (135; 235; 335; 535). [9] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a plurality of sensors (124; 224; 324; 524), in particular a plurality of imaging sensors (124; 224; 324; 524). [10] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor (124; 224; 324; 524) is configured to detect radiation in the EUV range (536). [11] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) has a first connecting element (137; 337; 537), wherein the first connecting element (137; 337; 537) is connectable to a vacuum source (538). [12] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a vacuum source (538). [13] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a second connecting element (139; 239; 339), wherein the second connecting element (139; 239; 339) is connectable to the measuring chamber (540) for operation under ultra-high vacuum. [14] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a flushing device (227; 327) for guiding a flushing flow (228; 328) of a flushing medium. [15] Sensor arrangement (100; 200; 300; 500) according to claim 14, wherein the purge medium comprises one or more gases selected from the group comprising helium, hydrogen, nitrogen, neon, argon, krypton, xenon and oxygen. [16] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the fluid connection (133; 233; 333) has one or more channels (141; 241; 341). [17] Sensor arrangement (100; 200; 300; 500) according to claim 16, wherein a channel (141; 241; 341) has a cross section of at least 0.1mm 2 , in particular at least 1mm 2 , particularly preferably at least 5mm 2 has. [18] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the fluid connection (133; 233; 333) comprises one or more valves. [19] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a cooling device (342). [20] Apparatus for qualifying a mask (530) for use in lithography, the apparatus comprising a sensor arrangement (100; 200; 300; 500) according to one of the preceding claims. [21] Device (550) for qualifying a mask (530) according to claim 20, wherein the device comprises an evaluation and control device (543) and a measuring chamber (540) comprising an optical system (520). [22] A method for qualifying a mask (530) for use in lithography, the method comprising the following steps: • Providing (1010) a device (550) for qualifying a mask (530), wherein the device comprises a sensor arrangement (100; 200; 300; 500) according to one of claims 1 to 19, wherein the device (550) has an evaluation and control device (543) and a measuring chamber (540) comprising an optical system (520), wherein the sensor arrangement (100; 200; 300; 500) has a sensor (124; 224; 324; 524), a suction opening (131; 231; 331) and an outlet (132; 232; 332; 532), wherein the sensor arrangement (100; 200; 300; 500) has a fluid connection (133; 233; 333) between the suction opening (131; 231; 331) and the outlet (132; 232; 332; 532), wherein the device (550) has a negative pressure source (538); • detecting (1020) at least one optical image of at least a part of the mask (530) by means of the sensor (124; 224; 324; 524); and • Suction (1030) of a medium from the measuring chamber (540) via the fluid connection (133; 233; 333) by means of the evaluation and control device (543).

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