Cooling arrangement, control device and control device system

The cooling arrangement addresses the challenge of efficiently monitoring coolant system parameters by integrating a detection device within the cooling system, enhancing durability and functionality through continuous and robust parameter measurement.

DE102023208933A1Pending Publication Date: 2025-03-13AUMOVIO AUTONOMOUS MOBILITY GERMANY GMBH +1
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Patent Information

Application Number
DE102023208933
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-13
Filing Date
2023-09-14
Publication Date
2025-03-13

AI Technical Summary

Technical Problem

Existing cooling systems for control devices and sensors in vehicles face challenges in efficiently and cost-effectively monitoring the parameters of the coolant system, particularly in high-performance applications where sensitive components are thermally loaded.

Method used

A cooling arrangement that includes a circuit carrier, a component to be cooled, a fluid cooling system, and a detection device to record information about the fluid cooling system, allowing for continuous and robust measurement of cooling parameters.

Benefits of technology

This solution enables permanent and inexpensive monitoring of cooling system parameters, improving the durability and functionality of the cooling arrangement by allowing for effective heat management and detection of potential malfunctions.

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Abstract

The present invention relates to a cooling arrangement comprising a circuit carrier, at least one component to be cooled which is arranged on the circuit carrier, a fluid cooling system which is arranged on the component to be cooled in order to dissipate heat from the component to be cooled, and a sensing device for acquiring information from the fluid cooling system, wherein the sensing device is arranged on the circuit carrier and on a wall of the fluid cooling system in order to acquire the information from the fluid cooling system.
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Description

[0001] The present invention relates to a novel cooling arrangement, in particular for a sensor or a control device, as well as a corresponding sensor or a corresponding control device, which has a cooling arrangement according to the invention, and a control device system, comprising at least one cooling arrangement according to the invention or at least two control devices. Technological background

[0002] Modern means of transport such as motor vehicles, motorcycles, and aircraft are increasingly being equipped with control units or systems. For example, in motor vehicles, generic electronic control units (ECUs) or control systems are used to control actuators (brakes, engine, transmission, and the like) and / or sensors, as well as to calculate and control driving and assistance functions. Such control systems are, for example, part of driver assistance systems, which use sensors or sensor systems to detect the environment, recognize traffic situations, and assist the driver, e.g., by braking or steering intervention or by issuing a visual or acoustic warning. Radar sensors, lidar sensors, camera sensors, and similar sensors are regularly used as sensors or sensor systems for detecting the environment.The sensor data collected by the sensors can then be used to draw conclusions about the environment, allowing, for example, object and / or environment classification or the creation of an environment model. Furthermore, environmental detection is almost indispensable in the field of (semi-)autonomous driving, so there is particular interest in the further development and refinement of such systems.

[0003] An important aspect of electronic control units or control devices is heat dissipation or cooling. The heat to be dissipated from the electronic control unit can, for example, be led to the outside through a thermally well-conducting housing, e.g. a metal housing. On the surface or at least on one side of the housing or control device housing, with high power losses, the challenge is to dissipate the heat as effectively as possible so that the components inside the housing are protected from overheating. There are various forms of cooling systems or cooling, e.g. air cooling, possibly with cooling fins or cooling knobs, or a closed coolant circuit that can be connected to the control unit housing and flows coolant (or cooling medium or cooling fluid) over a housing wall or its surface. Coolant can flow through the coolant circuit, for example.a pump can be used to ensure the movement or flow of the coolant.

[0004] Generic electronic control units and control devices, which are increasingly being used in modern vehicles and in aviation, are increasingly becoming so-called high-performance computer systems (HPC). These systems generally have to function in ambient temperatures or with coolant temperatures of, for example, -40 to 60 °C or more. In contrast, however, some electronic components in the control devices, in particular data storage modules such as RAM (Random Access Memory) or Flash modules or EEPROMs (Electrically Erasable Programmable Read-Only Memory), are often subject to very limited upper permissible temperatures. Furthermore, due to ever increasing data transfer speeds, but also to the need to avoid voltage drops or oscillations, fast data storage modules should be located as close as possible to the microprocessors or processors that control them.High-performance processors (especially CPUs, GPUs, switches, ICs, or the like) are placed close to the high-performance processors, as this placement is usually what enables the required fast write and read speeds or communication speeds. These high-performance processors typically generate considerable waste heat, which in typical applications can significantly heat up much more heat-sensitive components in the immediate vicinity of the high-performance processors, and therefore the heat must be dissipated. With ever-increasing power dissipation, especially in high-performance processors, neighboring components are subjected to ever greater thermal stress, and the cooling systems must be increasingly complex to dissipate the resulting heat from the heat generators and the neighboring, sometimes more sensitive, components.

[0005] Generic fluid or liquid cooling systems can have one or more cooling circuits. If a control unit is connected to a coolant circuit, which, for example, consists of several lines connected in series or in parallel, it may be necessary to detect errors in the cooling circuit at an early stage in order to provide enough time for a controlled shutdown or to implement appropriate countermeasures. Suitable countermeasures can include, for example, reducing the control unit's power loss, directly or indirectly influencing the fluid flow (e.g., by issuing appropriate control requests to the pump or valves in the coolant circuit), controlling the load shedding of other control units feeding power loss into the cooling circuit, starting a cooling unit, or similar.However, in order to initiate such countermeasures, information about the flow rate of the coolant, the temperature of the cooling medium, and possibly the thermal storage capacity is required, which can be acquired using sensors, for example. Such sensors for recording these properties or measured variables are generally expensive, especially if they have to be integrated into the cooling circuit, which increases installation effort. Electrochemical corrosion of the sensor and the resulting damage from the continuous coolant flow are a potential vulnerability, especially for long-term applications.As a result, there is increased interest in providing a generic cooling arrangement with which a permanent and robust measurement of parameters of the coolant system can be carried out inexpensively, with which in particular the cooling capacity and the change in the cooling capacity can be measured. Printed state of the art

[0006] DE 10 2021 102 178 A1 discloses a temperature detection device for detecting the temperature of a cooling medium-carrying component of a heating or cooling device for an automobile. The device comprises a support device for electronic components (or circuit board or printed circuit board), a temperature measuring point for a temperature sensor, and a connection point for a connecting element for connection to the cooling medium-carrying component. Various fluids can be provided as the cooling medium, such as water, coolant, air, or another gaseous medium, or a refrigerant or a mixture of various substances.Both the temperature measuring point and the connection point are arranged on the surface of the carrier device, wherein the temperature detection device comprises a heat-conducting element that thermally connects the temperature measuring point and the connection point, so that heat can be transported from the connection point to the temperature measuring point. The heat-conducting element is arranged within the carrier device, so that the carrier device encloses the heat-conducting element to electrically insulate it between the connection point and the temperature measuring point. Object of the present invention

[0007] The object of the present invention is to provide a generic cooling arrangement in which information or parameters of the cooling arrangement can be reliably recorded, whereby the functionality and durability of the cooling arrangement are improved. Solution to the task

[0008] The above object is achieved by the entire teaching of claim 1 and the subordinate claims. Advantageous embodiments of the invention are claimed in the subclaims.

[0009] The cooling arrangement according to the invention comprises a circuit carrier, at least one component to be cooled, which is arranged on the circuit carrier, a fluid cooling system arranged on the component to be cooled in order to dissipate heat from the component to be cooled, and a detection device for detecting information from the fluid cooling system. The detection device is arranged on the circuit carrier and on a wall of the fluid cooling system in order to detect the information from the fluid cooling system. According to a particular embodiment, the fluid cooling system can be a liquid cooling system, which has an output and an input via which the liquid cooling system can be connected to a coolant circuit.

[0010] The inventive design enables permanent and robust measurement of parameters of the cooling system or fluid cooling, which can also be carried out very inexpensively, whereby both the cooling performance and, in particular, any change in the cooling performance can be measured. The durability and functionality of the entire cooling arrangement are thereby significantly improved. The storage capacity and the flow rate of the cooling medium are not the only decisive factors, since a poorer heat capacity can, for example, be compensated for by a higher flow rate and vice versa. In addition, the flow rate of the medium flowing through or of the coolant can be evaluated right up to a standstill thanks to the simple design technology. Furthermore, changes due to contamination of the cooling medium or air bubbles in it can also be detected by determining an average value for the fluid flow based on the heat capacity.

[0011] The detection device can expediently comprise a (heat or temperature) sensor and at least one heating element, with which preferably the fluid temperature, the fluid flow, the heat or storage capacity of the fluid, the flow velocity of the fluid and / or the like can be detected and / or changes in these can be calculated and detected.

[0012] According to an advantageous embodiment of the invention, the information can be acquired continuously or in test cycles with a definable interval and length, depending on the design of the measuring technology and the mechanical structure chosen.

[0013] Preferably, a plurality of detection devices are provided which detect information at different locations of the fluid cooling system, preferably in a fluid inlet area and a fluid outlet area.

[0014] Furthermore, the wall of the fluid cooling system can have a projection or a region with a reduced wall thickness, with the detection device and / or the component to be cooled being arranged on the projection or the region with a reduced wall thickness. This allows the measurement or acquisition of the information to be carried out particularly quickly and reliably.

[0015] According to a preferred embodiment of the invention, a thermal interface material (TIM) or a TIM layer can be arranged between the detection device and the wall of the fluid cooling and / or the component to be cooled and the wall of the fluid cooling in order to compensate for structural tolerances and / or to particularly improve the heat transfer from the component to be cooled / detection device to the fluid cooling.

[0016] In a particular embodiment, the fluid cooling system expediently comprises an elastic bellows or a cooling pad, which is made at least partially of flexible material and is arranged such that the elastic bellows or the cooling pad conforms to the component to be cooled and / or the detection device and, if applicable, to the housing or other components of the control device. The flexible material is preferably metal foil, in particular aluminum foil or copper foil, and / or plastic foil and / or a laminate and / or a composite foil, which in particular comprises a metal foil and a plastic foil. Due to the flexible properties of the material, it conforms to the components to be cooled, particularly when expanding (e.g., when it is then filled with fluid).By using a composite foil or laminate as the flexible material, the durability and stability of the cooling arrangement can be easily improved. Furthermore, the heat sink can be adapted to the properties of the respective cooling medium or to the ambient conditions. Furthermore, the flexible material can also have a coating, particularly an aluminum coating, to improve its properties with regard to stability, impermeability, aging, and durability. Anoxal coatings (anoxal process = anodic polarization of the aluminum creates an aluminum oxide layer on the surface of the aluminum) or Eloxal coatings (eloxal process = electrolytic oxidation of aluminum, whereby an oxide protective layer is created on aluminum by anodic oxidation) are particularly suitable as coatings for aluminum foil.Furthermore, the cooling pad can be filled with a cooling medium or can have a cooling medium flowing through it, wherein a fluid, in particular water, glycol, a water-glycol mixture or the like, is provided as the cooling medium.

[0017] Preferably, the wall of the fluid cooling system has cooling structures, in particular cooling ribs and / or cooling knobs and / or cooling pins and / or cooling fins.

[0018] According to a particular embodiment of the invention, the fluid cooling system can comprise internal structures arranged in the fluid flow, in particular ribs and / or knobs and / or pins and / or fins, which are preferably arranged in the region of the detection device (i.e., for example, opposite one another in the fluid channel). These structures are advantageously located within the fluid channel of the fluid cooling system.

[0019] Furthermore, the fluid cooling or the fluid channel of the fluid cooling can have a tapered cross-section.

[0020] Conveniently, the fluid cooling system may comprise a fluid flow control device, in particular a pump or a controllable valve, and may acquire information from the fluid flow control device via data interfaces.

[0021] In a practical manner, a plausibility check can be carried out between the information of the fluid cooling and the information of the fluid flow control device, wherein a malfunction, in particular a malfunction of the cooling arrangement, is detected if the plausibility check reveals an inconsistency or a deviation (e.g., if the fluid flow measured or detected by the detection device does not correlate with the pump power provided by the pump).

[0022] Conveniently, the component to be cooled may be a microcontroller and / or a processor and / or a chip and / or an integrated circuit (IC) and / or a system-on-chip (SoC) and / or a semiconductor component and / or a battery and / or other electronic component parts or compositions thereof, which are arranged, for example, on the circuit carrier or printed circuit board and / or printed circuit board (PCB) and / or substrate.

[0023] Furthermore, the present invention encompasses a control device or a sensor comprising a housing (control device housing or sensor housing) and a cooling arrangement according to the invention. The housing, in which the component to be cooled is arranged, for example, on a circuit carrier (e.g., circuit board, substrate, or printed circuit board), is preferably made of metal or plastic. The sensor can be, for example, a radar sensor, a lidar sensor, a camera sensor, an ultrasonic sensor, or the like, which comprises a cooling arrangement according to the invention.

[0024] According to an advantageous embodiment of the present invention, the fluid cooling system can be at least partially part of the housing, in particular the control device housing or the sensor housing. In practice, the fluid cooling system or a part of the fluid cooling system can be an integral component of the housing. For example, the fluid cooling system can be a side wall of the housing, a cover, a base, or the like of the housing.

[0025] Furthermore, information from the detection device or the fluid cooling and information from the fluid flow control device can be used to generate control data for the fluid flow control device (or control data for the pump control and / or valve control and / or power loss generation), which are intended to cause a shutdown or a delayed shutdown or a non-shutdown of the control device.

[0026] In a secondary or subordinate manner, the present invention also claims a control device system comprising at least one cooling arrangement according to the invention or a plurality of control devices according to the invention. The control devices can expediently be arranged side by side in a rack or stack and have a common fluid cooling system or cooling device (e.g., a fluid cooling system arranged between the control devices or a cooling pad or elastic cooling element arranged between the control devices and adapted to conform to their control device housings or structural components). Advantageously, one fluid cooling system or cooling pad serves two or more control devices, enabling particularly effective and material-saving cooling.Conveniently, the control devices can each have a control device housing and the control device housings can be mechanically connected to one another, in particular glued, welded, screwed, riveted or the like. Description of the invention based on exemplary embodiments

[0027] The invention is explained in more detail below using practical examples. They show: Fig. 1: a simplified schematic representation of an embodiment of a vehicle with a control device according to the invention; Fig. 2: a simplified sectional view of an embodiment of a control device according to the invention with a projection on the fluid channel; Fig. 3: a simplified sectional view of a further embodiment of a control device according to the invention with a step in the fluid channel and material tapers in the area of ​​the measuring device in the inner housing wall; Fig. 4: a simplified sectional view of a further embodiment of a control device according to the invention with a step and internal knobs and material tapers in the area of ​​the measuring device in the inner housing wall; Fig. 5: a simplified sectional view of a further embodiment of a control device according to the invention with two detection devices and internal fins and material tapers in the area of ​​the measuring device in the inner housing wall; Fig. 6A-E: a simplified sectional view of configurations of cross sections of a fluid channel; Fig. 7: a simplified sectional view of a further embodiment of a control device according to the invention with a flexible cooling pad; Fig. 8: a simplified sectional view of an embodiment of a control device system according to the invention with two control devices, and Fig. 9: a simplified schematic representation of an embodiment of a control device according to the invention, which is connected to a coolant circuit.

[0028] Reference number 1 in Fig. 1 denotes a vehicle with various actuators (steering 3, engine 4, brake 5), which has a control device 2 according to the invention (ECU, Electronic Control Unit or ADCU, Assisted and Automated Driving Control Unit), by means of which a (partially) automated control of the vehicle 1 can take place, e.g. by the control device 2 being able to access the actuators of the vehicle 1. In addition, the control device 2 has a memory unit, for example to store an algorithm, control instructions or patterns. Furthermore, the vehicle 1 has sensors for detecting the environment: a radar sensor 6, a lidar sensor 7 and a front camera 8 as well as several ultrasonic sensors 9a-9d, the sensor data from which are used for environment and object detection, so that various assistance functions, such as emergency braking assistant (EBA, Electronic Brake Assist), distance control (ACC, Adaptive Cruise Control), lane keeping control orA lane keeping assistant (LKA), parking assistant, or the like, can be implemented. The assistance functions are executed, for example, via the control device 2 or the algorithm stored therein. The cooling arrangement according to the invention can, in principle, be implemented in any of the sensors or control units or in the control device 2.

[0029] Depending on the design of the measurement technology and the mechanical structure chosen, measurements can be taken continuously or in test cycles with freely definable or fixable distances and freely defined or fixable lengths.

[0030] In Fig. 2 shows an embodiment of a control device two according to the invention. The control device two has a housing or control device housing 10 in which a printed circuit board 11 (or also circuit board or circuit carrier) is arranged. Furthermore, a component to be cooled in the form of an IC module or chip 12 is provided on the printed circuit board 11. The component is arranged on a wall 14a of a fluid cooling system 14 via a TIM layer 13 and is thus in thermally conductive contact with the fluid cooling system 14, so that heat can be dissipated from the chip 12. The fluid cooling system 14 further comprises a fluid channel 14b and an outer wall 14c. The direction of flow of the fluid is marked with the black arrows, wherein the fluid cooling system 14 can be inserted into a coolant circuit (not shown) via the front openings of the fluid channel 14b (fluid inlet and fluid outlet).The fluid cooling system replaces, so to speak, a cover of the control device housing 10 and is thus an (integral) component of the control device housing 10. Furthermore, a detection device is provided, which comprises one or two temperature sensors 15a, 15b and a heating element 16. The temperature sensors 15a, 15b and the heating element 16 are also arranged on the wall 14a of the fluid cooling system 14 via a TIM layer 13. Furthermore, further detection devices can also be provided (in . Fig. 2 not shown). This enables cost-effective integration of multiple measuring units or detection devices at the fluid cooling system 14. A redundant design can achieve an increased level of safety for the detection device. Furthermore, input and output-side measurements can also be used to identify errors in the control unit or control device 2 itself, for example, if the cooling medium heats up unexpectedly high or too low with a known coolant flow. In particular, if more than one temperature sensor is installed upstream and downstream of the heating element, the influence of the cooling fluid flow on the heating by the heating element can be sensed or measured.

[0031] The components or detection device relevant for the detection or measurement are mounted on the printed circuit board 11, which is preferably also used for other components (electronic components, chips, semiconductors, IC modules, or the like) of the control device 2. In a practical way, the fluid cooling can be designed such that the housing parts carrying the cooling medium are structurally brought close to the components relevant for the measurement (temperature sensor(s) 15a, 15b and heating element 16, e.g., a resistor) in such a way that they approach the corresponding components in one area. For example, a projection 17 can be provided on which the detection device is arranged and over which cooling medium flows on the other side of the housing wall. In addition, a step 18 can also be provided, as in Fig. 3, as well as partial tapers of the housing wall to the detection device ( Fig. 3., Fig. 4. and Fig. 5.) to provide a certain thermal decoupling.

[0032] In addition, various structures can be provided in the cooling channel, such as thickenings 19 ( Fig. 4) and / or Finns 20 ( Fig. 5) and / or the like. For example, Fig. 5 shows an embodiment of a control device 2 according to the invention, in which two detection devices are provided on the circuit board 11, one detection device being arranged in the cooling fluid inlet area and one in the cooling fluid outlet area of ​​the control device 2. The coolant channel 14b or the coolant channels of the fluid cooling 14 can have different cross-sections. Fig. 6A-6E show various configurations of cross sections of the coolant channel 14b with walls 14a and 14c as examples, wherein Fig. 6E shows an embodiment in which the fluid cooling 14 or the coolant channel 14b has a taper.

[0033] Alternatively, the cooling arrangement according to the invention can also comprise a foil cooler or a cooling pad, which fits snugly against the control device 2 to be cooled, as in Fig. 7. In this case, the components of the cooling arrangement, temperature sensor(s) and heating element(s), can be thermally contacted directly on the cooling pad 21 or indirectly via a housing part on the film of the cooling pad 21. In order to reduce heat transfer resistance between the cooling pad 21 and the detection device and / or the component to be cooled and to overcome construction tolerances, thermal interface material (e.g. in the form of paste, adhesive, aluminum blocks 22 or thermally conductive pad) can be provided. However, when using the film coolers or cooling pads 21 and directly adjacent components, this is generally not necessary. Furthermore, a cover 10b is provided, which closes the control device housing 10, and a second cover 23, which gives the cooling pad 21 additional stability, depending on the installation requirements. Furthermore, instead of a closing cover, another control device ora further control device 24 (with circuit board 25 and a connection 26) may be attached, similar to . Fig. 8 but with a flexible cooling pad instead of the one in Fig. 8 shown cooling channel integrated in the housing, so that this is a control device system in which the control devices 2, 24 have a common fluid cooling 14, which, so to speak, serves the control devices 2, 24 or dissipates heat from the components to be cooled.

[0034] If several components of the detection device are arranged close to the housing, for example, regions 10a with a thinner housing wall thickness can be provided to create better thermal separation from the adjacent components. Furthermore, one or more cooling nubs or fins can be formed in the housing part, which is preferably made of a die-cast aluminum alloy, in such a way that direct heat dissipation can occur to the components to be cooled.

[0035] In practice, the cooling arrangement can be used with various structures of a fluid cooling system. The fluid cooling system can, for example, be an aluminum die-cast part onto which the fluid channel connections can be welded or glued, or the closure can be introduced with inserted or dispensed seals. Furthermore, the fluid connections in the figures are only shown as examples, whereby the fluid connections can be attached in different directions (e.g. at an angle or both on one side or the like) and are generally designed as a single piece and not as two-shell pieces. In addition, the cooling arrangement can be expanded to varying degrees depending on the required depth of information on the cooling status or the cooling capacity of the cooling system. Of course, a similar construction technology can also be used for a temperature control system orIt can be used as a heating system or combined with such a cooling system. In this case, a component to be cooled simply needs to be replaced by a component to be tempered, with heat being transferred through the medium to the component to be tempered.

[0036] Preferably, a (direct or indirect) power supply 27 and / or data connection 28 can also be implemented via a connector 29 to a pump 30 or a controllable valve, as in Fig.9. A link to the pump 30 is provided here, allowing the evaluation of pump information such as pump parameters, speed, voltage, temperature, current consumption, or parts of this information, or the like. The pump 30 is integrated into a coolant circuit 31 of a cooling system 32 (not described in detail) (e.g., with a radiator, possibly an active cooling unit, and other control units or components connected to branches of the cooling system, e.g., pumps and valves).

[0037] Furthermore, a link or comparison can be made with internal measurements of the recording system to determine whether these deliver consistent results (i.e. are plausible) or the data can be combined to generate more or earlier information and activities. Of course, the measurement ensemble in the control unit and data for a pump control strategy can also be transmitted directly from the control unit or indirectly by sending data to other controllers that control the pump. The link can be used to generate redundancies or additional information, e.g., expected fluid temperatures (which can lead to a higher ASIL rating), and in the event of faults, it offers the opportunity to enable strategies for extended availability of the cooling system control unit.For example, the pump speed can be increased if the temperature of the cooling medium rises in order to maintain sufficient cooling or to provide a time buffer. The pump speed and pump volume, as well as a temperature difference caused by a known power loss in the control unit, can be used to draw conclusions about the heat storage capacity of the cooling medium. The pump power, which is represented in the control unit as a flow rate from the inlet to the outlet, can also be adjusted. If a time offset or delay from the inlet to the outlet is greater than expected, a smaller flow volume can be inferred. Furthermore, by accessing one or more control valves, the flow rate can also be adjusted or, for example, a temperature can be inferred. List of reference symbols 1 vehicle 2 Control device 3 Steering 4 Engine 5 Brake 6 radar sensor 7 Lidar sensor 8 front camera 9a-9d Ultrasonic sensor 10 control unit housing 10a range (low housing wall thickness) 10b Lid 11 Circuit board 12 chips 13 TIM 14 Fluid cooling 14a wall 14b Fluid channel 14c wall 15a Temperature sensor 15b Temperature sensor 16 Heating element 17 lead 18th level 19 Thickening 20 Finn 21 cooling pad 22 aluminum blocks 23 lids 24 Control device 25 circuit board 26 connection 27 Power supply 28 Data connection 29 connector plugs 30 Pump (or alternatively valve) 31 Coolant circuit 32 Cooling system QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2021 102 178 A1

[0006]

Claims

[1] Cooling arrangement, comprising a circuit carrier, at least one component to be cooled, which is arranged on the circuit carrier, a fluid cooling means (14) arranged on the component to be cooled to dissipate heat from the component to be cooled, and a detection device for detecting information of the fluid cooling (14), wherein the detection device is arranged on the circuit carrier and on a wall (14a) of the fluid cooling in order to detect the information of the fluid cooling (14). [2] Cooling arrangement according to claim 1, characterized bythat the detection device comprises a heating element (16) and at least one sensor (15a, 15b), with which preferably the fluid temperature, the fluid flow, the heat or storage capacity of the fluid, the flow velocity of the fluid and / or the like can be calculated and / or changes in these can be calculated and detected. [3] Cooling arrangement according to claim 1 or 2, characterized by that the information is collected continuously or in test cycles with a definable interval and length. [4] Cooling arrangement according to one of the preceding claims, characterized by that a plurality of detection devices are provided which detect information at different points of the fluid cooling (14), preferably in a fluid inlet area and a fluid outlet area. [5] Cooling arrangement according to claim 3, characterized bythat the fluid cooling (14) has a projection (17) or a region with reduced wall thickness, and the detection device and / or the component to be cooled is arranged on the projection (17). [6] Cooling arrangement according to one of the preceding claims, characterized by that a TIM (13) is arranged between the detection device and the wall of the fluid cooling (14) and / or the component to be cooled and the wall (14a) of the fluid cooling (14). [7] Cooling arrangement according to one of the preceding claims, characterized byin that the fluid cooling (14) comprises an elastic bellows or a cooling pad (21) which is made at least partially of flexible material and is arranged in such a way that the elastic bellows or the cooling pad (21) conforms to the component to be cooled and / or the detection device, wherein metal foil, in particular aluminum foil or copper foil, and / or plastic foil and / or a laminate and / or a composite foil, which in particular comprises a metal foil and a plastic foil, is preferably provided as the flexible material. [8] Cooling arrangement according to one of the preceding claims, characterized by that the fluid cooling (14) has internal structures arranged in the fluid flow, in particular thickenings (19) and / or ribs and / or knobs and / or pins and / or fins (20), which are preferably arranged in the region of the detection device. [9] Cooling arrangement according to one of the preceding claims, characterized bythat the fluid cooling (14) has a tapered cross-section. [10] Cooling arrangement according to one of the preceding claims, characterized by that the fluid cooling (14) has a fluid flow control device, in particular a pump (30) or valve, and information of the fluid flow control device can be detected. [11] Cooling arrangement according to claim 10, characterized by that a plausibility comparison is carried out between the information of the fluid cooling (14) and the information of the fluid flow control device, and a malfunction, in particular a malfunction of the cooling arrangement, is detected on the basis of the plausibility comparison. [12] Control device (2, 24) or sensor comprising a housing (10) and a cooling arrangement according to one of the preceding claims. [13] Control device (2, 24) according to claim 12, wherein the fluid cooling or a part of the fluid cooling is an integral part of the housing (10). [14] Control device (2, 24) according to claim 12 or 13, wherein a cooling arrangement according to claim 10 or 11 is provided, and wherein information from the detection device or the fluid cooling (14) and information from the fluid flow control device are used to generate control data for the fluid flow control device, which are in particular provided to effect a shutdown or a delayed shutdown or a non-shutdown of the control device (2, 24). [15] Control system comprising at least two control devices (2, 24) according to one of claims 13 or 14, wherein the control devices (2, 24) have a common fluid cooling (14).

Citation Information

Patent Citations

  • Device and method for determining the flow rate of a coolant through a cooling channel

    DE102013219789A1

  • Automotive inverter assembly

    DE102019112010A1

  • Temperature sensing device and system for sensing the temperature of a coolant-carrying component of a heating or cooling device for an automobile

    DE102021102178A1

  • Cooled electronic block with temperature sensor

    DE102021212368A1

  • Cooling system for a vehicle

    DE112011105018T5