Integration of high-frequency components into flexible waveguides

Abstract

Exemplary embodiments create a flexible waveguide [e.g. for guiding at least one high-frequency signal, e.g. with a frequency greater than or equal to 0 Hz], with the following features: a first metallization [e.g. first shielding metallization], a second metallization [e.g. second shielding metallization], a flexible substrate arranged between the first metallization and the second metallization, at least one high-frequency component embedded in the substrate and connected to at least one center conductor [e.g. inner conductor] of the flexible waveguide.

Description

[0001] Embodiments of the present invention relate to the integration of at least one high-frequency component into a flexible waveguide. Some embodiments relate to the integration of RF components into flexible waveguides.

[0002] Quantum computers with superconducting qubits require many RF interconnects. Depending on their function (readout lines, drive lines, etc.), these lines must be equipped with RF components such as attenuators, low-pass filters, and band-pass filters.

[0003] In cryogenic applications, such as quantum computers with superconducting qubits, commercially available coaxial waveguides are currently used to transmit RF signals [1]. So far, semi-rigid coaxial cables with connectors have been used. Components with coaxial connectors are typically screwed into the cables. An example of this is the attenuators distributed across the signal lines at different temperature levels.

[0004] Furthermore, flexible multi-core cables with superconducting inner conductors are known from [2]. Additionally, a microstrip cable with an integrated so-called stepped-impedance low-pass filter is known from [3]. However, these can only be used at cryogenic temperatures and, due to their high attenuation at room temperature, are not suitable for connecting to signal generators and / or signal processors operating at room temperature in cryogenic applications.

[0005] The present invention is therefore based on the objective of creating a concept that makes it possible to reduce the space required for cables and / or to improve signal quality.

[0006] This problem is solved by the independent patent claims.

[0007] Advantageous further developments can be found in the dependent patent claims.

[0008] Exemplary embodiments create a flexible waveguide [e.g. for guiding at least one high-frequency signal, e.g. with a frequency greater than or equal to 0 Hz], with the following features: a first metallization [e.g. first shielding metallization], a second metallization [e.g. second shielding metallization], a flexible substrate arranged between the first metallization and the second metallization, at least one high-frequency component embedded in the substrate and connected to at least one center conductor [e.g. inner conductor] of the flexible waveguide.

[0009] In some embodiments, the flexible waveguide can be designed as a flat ribbon cable.

[0010] In exemplary embodiments, the at least one high-frequency component is at least two high-frequency components, wherein the at least two high-frequency components are arranged offset from each other.

[0011] In exemplary embodiments, an offset arrangement of the at least two high-frequency components refers to the fact that the geometric centers of the at least two high-frequency components are arranged at different positions along the wave propagation direction of the flexible waveguide and / or perpendicular to the wave propagation direction. For example, in the case of three or more high-frequency components, the geometric centers of the high-frequency components can lie on a straight line that runs parallel to the wave propagation direction of the flexible waveguide and / or on a straight line that runs perpendicular to the wave propagation direction of the flexible waveguide.

[0012] In exemplary embodiments, the at least two high-frequency components are arranged offset from each other in the wave propagation direction of the flexible waveguide and / or perpendicular to the wave propagation direction.

[0013] In exemplary embodiments, the at least two high-frequency components are at least three high-frequency components, wherein the at least three high-frequency components are arranged offset from each other according to a regular pattern, or wherein the at least three high-frequency components are arranged offset from each other according to a non-regular pattern [e.g. randomly].

[0014] For example, the regular pattern can be a regular checkerboard pattern with a predefined number of steps, running along and / or perpendicular to the wave propagation, such as 3x1, 3x2, 3x3, etc. Cascading is also possible, i.e., multiple regular checkerboard patterns with identical / different configurations.

[0015] For example, the non-regular pattern can be determined using a random number generator, or in other words, the positions of the high-frequency components can be determined using a random number generator.

[0016] In exemplary embodiments, at least two center conductors [e.g. inner conductors] are embedded in the flexible substrate, with the at least two high-frequency components each being connected to a center conductor.

[0017] In other words, the flexible waveguide can have a plurality of center conductors, with each high-frequency component connected to a center conductor.

[0018] In exemplary embodiments, the at least one high-frequency component is at least two high-frequency components, wherein the at least two high-frequency components are arranged in series with each other [i.e., are electrically connected in series via the center conductor].

[0019] In exemplary embodiments, one [e.g., first] high-frequency component of the at least one high-frequency component is a filter.

[0020] In exemplary embodiments, the high-frequency component has at least one stub line which is connected at a first end to the at least one center conductor.

[0021] In exemplary embodiments, at least one branch line is open at a second end.

[0022] In exemplary embodiments, at least one branch line is terminated at the second end.

[0023] In exemplary embodiments, the at least one branch line is terminated at the second end by at least one via which is connected to the first metallization and / or second metallization.

[0024] In exemplary embodiments, at least one section of the at least one spur line runs parallel to the at least one center conductor.

[0025] In exemplary embodiments, at least one section of the at least one branch line has a meandering or polygonal shape.

[0026] In exemplary embodiments, one [e.g., second] high-frequency component of the at least one high-frequency component is an attenuator.

[0027] In exemplary embodiments, the at least one center conductor has a first center conductor and a second center conductor, wherein the damping element is connected in series between the first center conductor [e.g. a first end of the first center conductor] and the second center conductor [e.g. a second end of the second center conductor].

[0028] In exemplary embodiments, the damping element comprises at least a first resistive element and a second resistive element, wherein the first resistive element is connected in series between the first center conductor and the second center conductor, and wherein the second resistive element is connected in series between the first center conductor and a first via which is connected to the first metallization and / or second metallization [e.g. electrically].

[0029] In exemplary embodiments, the damping element has a third resistive element, wherein the third resistive element is connected in series between the first center conductor and a second via which is connected to the first metallization and / or second metallization [e.g. electrically].

[0030] In exemplary embodiments, the damping element has a fourth resistive element and a fifth resistive element, wherein the fourth resistive element is connected between the second center conductor and a third via which is connected to the first metallization and / or second metallization [e.g. electrically], wherein the fifth resistive element is connected between the second center conductor and a fourth via which is connected to the first metallization and / or second metallization [e.g. electrically].

[0031] In exemplary embodiments, the resistive elements are each implemented by a stripline that has a higher insertion loss [e.g., with the same matching] than the first center conductor and / or the second center conductor [e.g., due to lossy materials [e.g., titanium-tungsten alloy] and / or a smaller cross-section].

[0032] In exemplary embodiments, the strip lines are connected to the first center conductor and / or the second center conductor.

[0033] In exemplary embodiments, one [e.g., third] high-frequency component of the at least one high-frequency component is a directional coupler.

[0034] In exemplary embodiments, the directional coupler has two interconnected striplines.

[0035] In exemplary embodiments, the two coupled strip lines run parallel to each other in the flexible substrate.

[0036] In exemplary embodiments, the two coupled strip lines are arranged in different planes within the flexible substrate.

[0037] For example, the two coupled striplines can be arranged one above the other in the flexible substrate [e.g. in relation to a straight line that is perpendicular to the first metallization and / or second metallization].

[0038] In exemplary embodiments, the two coupled strip lines have a meandering or polygonal course [e.g. the same] in at least one coupled section.

[0039] In exemplary embodiments, the two coupled strip lines are arranged in the same plane within the flexible substrate.

[0040] For example, the two coupled striplines can be arranged next to each other in the flexible substrate [e.g. in relation to a straight line that runs parallel to the first metallization and / or second metallization].

[0041] In exemplary embodiments, the two coupled strip lines have corresponding sawtooth shapes at least in one coupled section.

[0042] In exemplary embodiments, a first stripline of the two coupled striplines is connected at least to a first center conductor of the at least one center conductor, wherein a second stripline of the two coupled striplines is connected at least to a second center conductor of the at least one center conductor.

[0043] In exemplary embodiments, each of the two coupled striplines is connected to at least one center conductor.

[0044] In exemplary embodiments, one [e.g., fourth] high-frequency component of the at least one high-frequency component is a transformer.

[0045] In exemplary embodiments, the transformer has a first loop-shaped stripline and a second loop-shaped stripline.

[0046] In exemplary embodiments, the first loop-shaped strip line and the second loop-shaped strip line are arranged in different planes of the flexible substrate.

[0047] For example, the two loop-shaped strip conductors can be arranged one above the other in the flexible substrate [e.g., with respect to a straight line perpendicular to the first metallization and / or second metallization].

[0048] In exemplary embodiments, the first loop-shaped strip line is connected to a first center conductor of the at least one center conductor, wherein the second loop-shaped strip line is connected to a second center conductor of the at least one center conductor.

[0049] In exemplary embodiments, the first loop-shaped stripline is connected in series between the first center conductor and a first via that is connected to the first metallization and / or second metallization, wherein the second loop-shaped stripline is connected in series between the second center conductor and a second via that is connected to the first metallization and / or second metallization.

[0050] In exemplary embodiments, one [e.g., fifth] high-frequency component of the at least one high-frequency component is a power divider.

[0051] In exemplary implementations, the power divider is implemented using strip line technology.

[0052] In exemplary embodiments, the power divider is connected on the input side to a first center conductor of the at least one center conductor, wherein the power divider is connected on the output side to a second center conductor and a third center conductor of the at least one center conductor.

[0053] In exemplary embodiments, the power divider has a stripline, wherein a first end of the stripline is connected to the first center conductor, and wherein a second end of the stripline is connected to the second center conductor and the third center conductor.

[0054] In exemplary embodiments, the stripline has a length that is one quarter of a wavelength of a signal carried in the first center conductor.

[0055] In exemplary embodiments, the stripline has a characteristic impedance that is equal to the quotient of a characteristic impedance Z0 and the square root of two.

[0056] In exemplary embodiments, the power divider has a first stripline and a second stripline, wherein the first stripline is connected in series between the first center conductor and the second center conductor, and wherein the second stripline is connected in series between the first center conductor and the third center conductor.

[0057] In exemplary embodiments, the first stripline and the second stripline each have a length that is one quarter of a wavelength of a signal carried in the first center conductor.

[0058] In exemplary embodiments, the first stripline and the second stripline each have a characteristic impedance equal to the product of a characteristic impedance Z0 and the square root of two.

[0059] In exemplary embodiments, the power divider has a first [e.g. semicircular] stripline and a second [e.g. semicircular] stripline [e.g. mirrored to the first semicircular stripline], wherein the first stripline is connected in series between the first center conductor and the second center conductor, and wherein the second stripline is connected in series between the first center conductor and the third center conductor.

[0060] In exemplary embodiments, the first stripline and the second stripline are connected on the output side via a resistor [e.g. of size 2Z0] implemented in stripline technology.

[0061] In exemplary embodiments, the first stripline and the second stripline each have a length that is one quarter of a wavelength of a signal carried in the first center conductor.

[0062] In exemplary embodiments, the first stripline and the second stripline each have a characteristic impedance equal to the product of a characteristic impedance Z0 and the square root of two.

[0063] Further embodiments create a quantum computer with the following features: a quantum processor, a signal generator and / or signal evaluator, and at least one flexible waveguide according to one of the embodiments described herein for signal transmission between the quantum processor and the signal generator and / or signal evaluator.

[0064] In exemplary embodiments, the quantum processor is designed to operate at a cryogenic temperature [e.g. a temperature of less than 1 K].

[0065] In exemplary embodiments, the signal generator and / or signal evaluator is designed to operate at a cryogenic temperature [e.g. a temperature of less than 1 K] or a non-cryogenic temperature [e.g. a temperature of more than 253 K].

[0066] Further embodiments provide a method for manufacturing a flexible waveguide. The method comprises a step of providing a first layer of a flexible substrate. Furthermore, the method comprises a step of providing at least one center conductor and at least one high-frequency component on the first layer of the flexible substrate. The method further comprises a step of providing a second layer of the flexible substrate on top of the first layer of the flexible substrate and the center conductor with the high-frequency component, such that the at least one center conductor and the at least one high-frequency component are embedded between the first layer of the flexible substrate and the second layer of the flexible substrate.Furthermore, the method comprises a step of providing a first metallization and a second metallization, wherein the first metallization is provided on a first side of a stack consisting of the first layer of the flexible substrate and the second layer of the flexible substrate, and wherein the second metallization is provided on a second side of the stack opposite the first side.

[0067] Further embodiments provide a method for manufacturing a flexible waveguide with at least one integrated high-frequency component. The method comprises a step of providing a first layer of a flexible substrate for the flexible waveguide. Furthermore, the method comprises a step of forming at least one hole through the first layer of the flexible substrate. The method further comprises a step of coating both sides [e.g., by sputtering, thermal evaporation, or electroplating] of the first layer of the flexible substrate with a first metallization, wherein, in the double-sided coating, sidewalls of the at least one hole are coated with the first metallization to obtain at least one via. The method further comprises a step of structuring [e.g., by a combination of photolithography and etching [e.g.,The method comprises a first metallization (wet chemical and / or plasma-assisted) to obtain a center conductor of the flexible waveguide and at least one stripline of the high-frequency component connected to the center conductor on a first side of the first layer of the flexible substrate. The method further comprises a step of providing a second layer of the flexible substrate on the first side of the first layer of the flexible substrate. The method further comprises a step of forming a plurality of holes through the first and second layers of the flexible substrate. The method further comprises a step of coating both sides of the flexible substrate with a second metallization, wherein, during the coating process, the sidewalls of the plurality of holes are coated with the second metallization to obtain a plurality of vias.Furthermore, the process includes a step of structuring the second metallization to obtain a first shielding metallization of the flexible waveguide.

[0068] In exemplary embodiments, the majority of vias can be arranged such that the majority of vias surround the center conductor and the high-frequency component.

[0069] Exemplary embodiments provide a flexible waveguide [e.g. for guiding at least one high-frequency signal, e.g. with a frequency greater than or equal to 0 Hz], with the following features: a first metallization [e.g. first shielding metallization], a second metallization [e.g. second shielding metallization], a flexible substrate arranged between the first metallization and the second metallization, and a center conductor [e.g. inner conductor] embedded in the flexible substrate, wherein the center conductor comprises at least two striplines, wherein at least one of the at least two striplines has a superconducting material.

[0070] For example, the flexible waveguide can be designed as a flat ribbon cable. In particular, the flexible waveguide can have multiple center conductors.

[0071] In exemplary embodiments, a first stripline of the at least two striplines has a first superconducting material, wherein a second stripline of the at least two striplines has a second superconducting material.

[0072] In exemplary embodiments, the first superconducting material and the second superconducting material are two different materials.

[0073] In exemplary embodiments, a first stripline of the at least two striplines has a superconducting material, wherein a second stripline of the at least two striplines has a non-superconducting material.

[0074] In exemplary embodiments, the non-superconducting material does not exhibit superconducting properties at any temperature.

[0075] In exemplary embodiments, the superconducting material exhibits superconducting properties at temperatures below a material-specific transition temperature.

[0076] In exemplary embodiments, the superconducting material can be one of the following materials: niobium, aluminium, lead, indium, zinc, tantalum or niobium nitride.

[0077] In exemplary embodiments, the non-superconducting material can be one of the following materials: copper, nickel, gold or silver.

[0078] In exemplary embodiments, the at least two strip lines run parallel to each other [e.g. with a constant distance].

[0079] In exemplary embodiments, the at least two strip lines are connected to each other [e.g. mechanically and / or electrically].

[0080] In exemplary embodiments, the at least two strip lines are directly connected [i.e., without an adhesion layer and / or without a diffusion barrier] [mechanically and / or electrically].

[0081] In exemplary embodiments, at least two strip lines are connected to each other [mechanically and / or electrically] by means of an adhesion layer [e.g. titanium (Ti), titanium-tungsten (Ti-W), chromium (Cr)] and / or by means of a diffusion barrier [e.g. titanium dioxide (TiO2) or titanium nitride (TiN)].

[0082] For example, stacking two metal layers on top of each other usually does not require an adhesive layer between the metal layers, as metal-to-metal adhesion is good. However, for some metal combinations, a diffusion barrier [e.g., titanium dioxide (TiO2) or titanium nitride (TiN)] is required to prevent the formation of an alloy between the two metals.

[0083] In some embodiments, the metal of the center conductor and / or the first metallization and / or second metallization can be bonded to the substrate [e.g., polymer substrate] by means of an adhesive layer [e.g., titanium (Ti), titanium-tungsten (Ti-W), chromium (Cr), ...]. Depending on the metal, however, the adhesive layer can also be omitted.

[0084] In exemplary embodiments, a third strip line of the at least two strip lines comprises a superconducting material, wherein the second strip line is arranged between the first strip line and the third strip line.

[0085] For example, the first stripline can be made of copper, the second stripline of niobium, and the third stripline of copper.

[0086] In exemplary embodiments, a third strip line of the at least two strip lines comprises a non-superconducting material, wherein the first strip line is arranged between the second strip line and the third strip line.

[0087] For example, the second stripline can contain niobium, the first stripline copper, and the third stripline niobium.

[0088] In exemplary embodiments, the second strip line is embedded between the first strip line and the third strip line.

[0089] In exemplary embodiments, the first stripline is embedded between the second stripline and the third stripline.

[0090] For example, the three striplines can be implemented through three layers of material, with one of the three material layers being embedded between two other of the three material layers.

[0091] In exemplary embodiments, the first metallization and / or the second metallization each comprise at least two metallization layers, wherein at least one of the at least two metallization layers comprises a superconducting material.

[0092] In exemplary embodiments, a first metallization layer of the at least two metallization layers comprises a first superconducting material, wherein a second metallization layer of the at least two metallization layers comprises a second superconducting material.

[0093] In exemplary embodiments, a first metallization layer of the at least two metallization layers comprises a superconducting material, wherein a second metallization layer of the at least two metallization layers comprises a non-superconducting material.

[0094] In exemplary embodiments, the flexible substrate consists of polyimide.

[0095] In exemplary embodiments, a first distance between the center conductor and the first metallization is smaller or larger than a second distance between the center conductor and the second metallization.

[0096] In exemplary embodiments, the first metallization and the second metallization are connected to each other via a plurality of vias [e.g. electrically].

[0097] In exemplary embodiments, the majority of vias each comprise two via layers [e.g., perpendicular to the first and / or second metallization], wherein a first via layer of the two via layers has a superconducting material, and wherein a second via layer of the via layers has a non-superconducting material.

[0098] In exemplary embodiments, the center conductor is a first center conductor, wherein the flexible waveguide has a second center conductor which is spaced apart from the first center conductor [e.g. parallel or vertically offset to the first center conductor].

[0099] In exemplary embodiments, the second center conductor is embedded in the flexible substrate.

[0100] In exemplary embodiments, the second center conductor can have the same structure / construction as the first center conductor. In particular, the second center conductor can comprise at least two striplines, wherein at least one of the at least two striplines comprises a superconducting material. For example, a first stripline can comprise a first superconducting material, while a second stripline can comprise a second superconducting material, the first and second superconducting materials being different. Of course, a first stripline of the at least two striplines can also comprise a superconducting material, while a second stripline of the at least two striplines can comprise a non-superconducting material.

[0101] In exemplary embodiments, the first center conductor and the second center conductor are arranged next to each other in the substrate with respect to the first and / or second metallization [e.g. with respect to a straight line that runs parallel to the first and / or second metallization] [e.g. such that the first center conductor and the second center conductor intersect a straight line [e.g. at different points] that runs parallel to the first and / or second metallization].

[0102] For example, the first center conductor and the second center conductor may have the same distance to the first and / or second metallization [e.g., and different distances to the majority of vias].

[0103] In exemplary embodiments, the first center conductor and the second center conductor are arranged one above the other in the substrate with respect to the first and / or second metallization [e.g. with respect to a straight line that is perpendicular to the first and / or second metallization] [e.g. so that the first center conductor and the second center conductor intersect a straight line [e.g. at different points] that is perpendicular to the first and / or second metallization].

[0104] For example, the first center conductor and the second center conductor may have different distances to the first and / or second metallization [e.g., and equal distances to the majority of vias].

[0105] In exemplary embodiments, the first center conductor and the second center conductor are connected to each other [e.g. electrically] via at least one via.

[0106] In exemplary embodiments, the substrate is a first substrate, wherein the flexible waveguide has a second substrate and a third metallization [e.g. third shielding metallization], wherein the second substrate is arranged between the second metallization and the third metallization, and wherein the second center conductor is embedded in the second substrate.

[0107] Further embodiments create a quantum computer with the following features: a quantum processor, a signal generator and / or signal evaluator, and at least one flexible waveguide according to one of the embodiments described herein for signal transmission between the quantum processor and the signal generator and / or signal evaluator.

[0108] In exemplary embodiments, the quantum processor is designed to operate at a cryogenic temperature [e.g. a temperature of less than 1 K].

[0109] In exemplary embodiments, the signal generator and / or signal evaluator is designed to operate at a cryogenic temperature [e.g. a temperature of less than 1 K] or a non-cryogenic temperature [e.g. a temperature of more than 253 K].

[0110] In exemplary embodiments, the flexible waveguide can have a connection surface, wherein the connection surface is arranged in a plane of the first metallization and is insulated from the first metallization [e.g. electrically], wherein the connection surface is connected to the center conductor [e.g. electrically] [e.g. via one or more vias].

[0111] In exemplary embodiments, the flexible waveguide can have a plurality of vias arranged such that the plurality of vias surround the center conductor and the connection surface.

[0112] In exemplary embodiments, the flexible waveguide can have a first connection surface and a second connection surface, wherein the first connection surface and the second connection surface are arranged in a plane of the first metallization and are insulated from the first metallization [e.g. electrically], wherein the first connection surface is connected to the first center conductor and the second connection surface is connected to the second center conductor [e.g. electrically].

[0113] In exemplary embodiments, the flexible waveguide can have a plurality of vias, wherein the plurality of vias are arranged such that the plurality of vias surround the first center conductor and the first termination surface, surround the second center conductor and the second termination surface, and shield the first center conductor and the first termination surface from the second center conductor and the second termination surface.

[0114] In exemplary embodiments, the first connection surface and the second connection surface can be arranged adjacent to an end of the flexible waveguide, wherein the first connection surface and the second connection surface have different distances to the end of the waveguide.

[0115] Further embodiments create a satellite with the following features: at least one external antenna, a transmitting and / or receiving device, and at least one waveguide according to one of the embodiments described herein for signal transmission between the at least one external antenna and the transmitting and / or receiving device.

[0116] Further embodiments provide a motor vehicle with the following features: a control unit, a sensor, and at least one waveguide according to one of the embodiments described herein for signal transmission between the control unit and the sensor.

[0117] Further embodiments provide a method for manufacturing a flexible waveguide. The method comprises a step of providing a first layer of a flexible substrate. The method further comprises a step of providing a center conductor on the first layer of the flexible substrate, wherein the center conductor comprises at least two striplines, and wherein at least one of the at least two striplines is a superconducting material. The method further comprises a step of providing a second layer of the flexible substrate on top of the first layer of the flexible substrate and the center conductor, such that the center conductor is embedded between the first layer of the flexible substrate and the second layer of the flexible substrate.Furthermore, the method comprises a step of providing a first metallization and a second metallization, wherein the first metallization is provided on a first side of a stack consisting of the first layer of the flexible substrate and the second layer of the flexible substrate, and wherein the second metallization is provided on a second side of the stack opposite the first side.

[0118] In exemplary embodiments, providing the center conductor includes providing an adhesion layer and / or a diffusion barrier between the first stripline and the second stripline.

[0119] In exemplary embodiments, the method further comprises a step of providing a plurality of vias between the first metallization and the second metallization [e.g., where the vias connect the first metallization and the second metallization [e.g., electrically]].

[0120] Further embodiments provide a method for manufacturing a flexible waveguide. The method comprises a step of providing a first layer of a flexible substrate for the flexible waveguide. The method further comprises a step of forming at least one hole through the first layer of the flexible substrate. The method further comprises a step of coating both sides [e.g., by sputtering, thermal evaporation, or electroplating] of the first layer of the flexible substrate with a first metallization, wherein, in the double-sided coating, sidewalls of the at least one hole are coated with the first metallization to obtain at least one via. The method further comprises a step of structuring [e.g., by a combination of photolithography and etching [e.g.,[Wet chemical and / or plasma-assisted] of the first metallization to obtain a center conductor of the flexible waveguide on a first side of the first layer of the flexible substrate and to obtain a connection surface for electrical contacting the center conductor on a second side of the first layer of the flexible substrate opposite the first side, wherein the connection surface and the center conductor are electrically connected to each other via the at least one via. The method further comprises a step of providing a second layer of the flexible substrate on the first side of the first layer of the flexible substrate. The method further comprises a step of forming a plurality of holes through the first layer and the second layer of the flexible substrate.Furthermore, the process includes a step of coating both sides of the flexible substrate with a second metallization, wherein, during this coating, the sidewalls of the majority of vias are coated with the second metallization to create a plurality of vias. The process also includes a step of structuring the second metallization to create a first shielding metallization of the flexible waveguide.

[0121] In exemplary embodiments, the first metallization can comprise at least two first metallization layers, wherein a first layer of the at least two first metallization layers comprises a superconducting material, and wherein a second layer of the at least two first metallization layers comprises a non-superconducting material.

[0122] In exemplary embodiments, the second metallization can comprise at least two second metallization layers, wherein a third layer of the at least two second metallization layers comprises a superconducting material, and wherein a fourth layer of the at least two second metallization layers comprises a non-superconducting material.

[0123] In exemplary embodiments, the majority of vias can be arranged such that the majority of vias surround the center conductor and the connection surface.

[0124] In exemplary embodiments, the center conductor can be a first center conductor, wherein the connection surface is a first connection surface, wherein a second center conductor and a second connection surface are formed during the structuring of the first metallization, wherein the second center conductor and the second connection surface are connected to each other via a via, wherein the plurality of vias are arranged such that the plurality of vias surround the first center conductor and the first connection surface, surround the second center conductor and the second connection surface, and shield the first center conductor and the first connection surface from the second center conductor and the second connection surface.

[0125] In exemplary embodiments, the first connection surface and the second connection surface can have different distances to one end of the waveguide in the wave propagation direction of the flexible waveguide.

[0126] Exemplary embodiments of the present invention are described in more detail with reference to the accompanying figures. These show: Fig. 1a A schematic sectional view through a flexible waveguide perpendicular to the direction of wave propagation, according to an exemplary embodiment, Fig. 1b a schematic sectional view through a flexible waveguide along the direction of wave propagation, according to an exemplary embodiment, Fig. 2 A schematic sectional view through a flexible waveguide perpendicular to the direction of wave propagation, according to an exemplary embodiment, Fig. 3a A schematic sectional view through a flexible waveguide transverse to the direction of wave propagation, wherein the waveguide has a central conductor with two striplines as a superconductor and a normal conductor, according to an embodiment, Fig.3b a schematic sectional view through a flexible waveguide transverse to the direction of wave propagation, wherein the waveguide has a central conductor with three striplines as superconductors and normal conductors, according to an embodiment, Fig. 4a in a diagram a course of the simulated insertion loss in dB of a flexible waveguide with superconductor and normal conductor plotted against the frequency in GHz, Fig. 4b in a diagram a curve of the simulated insertion loss in dB of a niobium waveguide plotted against the frequency in GHz, Fig. 5 A schematic sectional view through a flexible waveguide transverse to the direction of wave propagation, wherein the flexible waveguide has two center conductors embedded in different substrates, according to an embodiment, Fig.6a a schematic sectional view through a flexible waveguide transverse to the direction of wave propagation, wherein the flexible waveguide has two center conductors arranged side by side, according to an embodiment, Fig. 6b a schematic sectional view through a flexible waveguide transverse to the direction of wave propagation, wherein the flexible waveguide has two center conductors arranged one above the other, according to an embodiment, Fig. 7 A schematic sectional view through a flexible waveguide transverse to the direction of wave propagation, wherein the flexible waveguide has two center conductors arranged one above the other, which are connected to each other via vias, according to an embodiment, Fig.8 A schematic sectional view transverse to the wave propagation direction of a center conductor with three striplines, wherein a first stripline is embedded between a second stripline and a third stripline, according to an embodiment, Fig. 9 a flowchart of a process for manufacturing a flexible waveguide, according to an exemplary embodiment, Fig. 10a-g Schematic sectional views of the flexible waveguide after different steps of a manufacturing process for producing the flexible waveguide, according to an exemplary embodiment, Fig. 11 A schematic view of the connection surfaces of the flexible waveguide, according to an exemplary embodiment, Fig. 12 a schematic block diagram of a quantum computer, according to an exemplary embodiment, Fig.13 A schematic block diagram of a satellite with a flexible waveguide, according to an exemplary embodiment, Fig. 14 A schematic sectional view of a flexible waveguide along the direction of wave propagation, wherein at least one high-frequency component is integrated into the flexible waveguide, according to an embodiment, Fig. 15 A schematic sectional view of the flexible waveguide along the direction of wave propagation, wherein several RF components are integrated into the flexible waveguide, which are arranged offset from one another according to a regular pattern, according to an embodiment, Fig. 16 a schematic sectional view of the flexible waveguide along the direction of wave propagation, wherein several RF components are integrated into the flexible waveguide 100, which are arranged diagonally offset from each other, according to an embodiment, Fig. 17 A schematic sectional view of the flexible waveguide along the direction of wave propagation, wherein several RF components are integrated into the flexible waveguide, which are arranged offset from one another according to a non-regular pattern, according to an embodiment, Fig. 18 A schematic sectional view of the flexible waveguide along the direction of wave propagation, wherein several RF components are integrated into the flexible waveguide, which are arranged in series with each other and / or extend over the entire length of the flexible waveguide, according to an embodiment, Fig. 19a a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a filter implemented by spur lines, according to an embodiment, Fig.19b a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a filter implemented by spur lines, according to an embodiment, Fig. 19c a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a filter implemented by open meandering spurs, according to an embodiment, Fig. 19d a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a filter implemented by a closed meandering spur, according to an embodiment, Fig.20a a schematic sectional view through a flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is an attenuator implemented by striplines, according to an embodiment, Fig. 20b a schematic through the flexible waveguide made of Fig. 20a transverse to the direction of wave propagation, according to one embodiment, Fig. 21a a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a directional coupler implemented by striplines, according to an embodiment, Fig. 21b a schematic sectional view through the flexible waveguide transverse to the direction of wave propagation, according to an embodiment, according to an embodiment, Fig.22a a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a directional coupler implemented by sawtooth striplines, according to an embodiment, Fig. 22b a schematic sectional view through the flexible waveguide made of Fig. 22a transverse to the direction of wave propagation, according to one embodiment, Fig. 23 a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a transformer implemented by striplines, according to an embodiment, Fig.24a a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a power divider implemented by at least one stripline, according to a first embodiment, Fig. 24b a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a power divider implemented by at least one stripline, according to a second embodiment, Fig. 24c a schematic sectional view through the flexible waveguide along a plane parallel to the first and second metallization, wherein the high-frequency component is a power divider implemented by at least one stripline, according to a third embodiment.

[0127] In the following description of the embodiments of the present invention, identical or equivalent elements in the figures are provided with the same reference numeral, so that their descriptions are interchangeable.

[0128] Before exemplary implementations of the integration of high-frequency components into a flexible waveguide are described in Section 2, the underlying flexible waveguide is first described in Section 1. 1. Flexible waveguide

[0129] The (highly integrated) flexible waveguide described below enables the transmission of a large number of high-frequency signals in a small space and with a small cross-section. This solves the space problem and reduces (or even minimizes) passive heat input from the cables.

[0130] Fig.Figure 1a shows a schematic sectional view through a flexible waveguide 100 transverse (perpendicular) to the direction of wave propagation, while Fig. Figure 1b shows a schematic sectional view through the flexible waveguide along the direction of wave propagation, according to an exemplary embodiment. The waveguide 100 comprises a first metallization 102 (e.g., first shielding metallization), a second metallization 104 (e.g., second shielding metallization), a flexible substrate 106 arranged between the first metallization 102 and the second metallization 104, and a center conductor 108 (or inner conductor) embedded in the flexible substrate 106. The center conductor 108 comprises at least two striplines 110_1, 110_2, wherein at least one of the at least two striplines has a superconducting material.

[0131] In exemplary embodiments, a first stripline 110_1 of the at least two striplines 110_1, 110_2 can have a first superconducting material, wherein a second stripline 110_2 of the at least two striplines 110_1, 110_2 can have a second superconducting material, wherein the first superconducting material and the second superconducting material are different.

[0132] The first and second superconducting materials can be two different superconducting materials from those listed in Table 1, such as niobium and aluminum, niobium and lead, or niobium and aluminum. It should be noted that the two different superconducting materials are not limited to a specific material combination; rather, the superconducting materials listed in Table 1 can be combined with any other material. In other words, any of the superconducting materials listed in Table 1 can be combined with any other superconducting material listed in Table 1.

[0133] In exemplary embodiments, a first stripline 110_1 of the at least two striplines 110_1, 110_2 can have a superconducting material, wherein a second stripline 110_2 of the at least two striplines 110_1, 110_2 can have a non-superconducting material.

[0134] The superconducting material can be any superconducting material listed in Table 1, while the non-superconducting material can be any non-superconducting material listed in Table 2. For example, the superconducting material could be one made of niobium, aluminum, lead, indium, zinc, tantalum, and niobium nitride, while the non-superconducting material could be one made of copper, gold, and silver. It should be noted that the superconducting and non-superconducting materials are not limited to specific material combinations; rather, the superconducting materials listed in Table 1 and the non-superconducting materials listed in Table 2 can be combined in any way. In other words, any of the superconducting materials listed in Table 1 can be combined with any of the non-superconducting materials listed in Table 2.

[0135] In addition to the superconducting materials, the transition temperatures, i.e., the temperatures at which the respective materials become superconducting, are also listed in Table 1 below. Table 1: Superconducting materials and transition temperature [4] element symbol transition temperature Solid state normal pressure Provided that the condition indicated in parentheses is met. aluminum Al 1,18 K 3.6K (Film) Americium On 1 K beryllium Be 0,026 K 9.5K (Film) cadmium CD 0,52 K gallium Ga 1,08 K 8.6K (Film) hafnium Hf 0,38 K mercury Hg 4,15 K Indium In 3,4 K 4.2K (Film) iridium Ir 0,1 K Carbon nanotube 15 K Lanthan La 6 K 12.8 K (20 GPa) lutetium Lu 0,1 K 1.2 K (18 GPa) molybdenum Mon 0,92 K niobium Note 9,25 K 9.7 K (4.5 GPa) osmium Os 0,7 K Protactinium Pa 1,4 K Lead Pb 7,2 K rhenium re 1,7 K Rhodium Rh 0,000 035 K Ruthenium Ru 0,5 K tin Sn 3,7 K 4.7K (Film) Tantal Ta 4,4 K 4.5 K (40 GPa) Technetium Tc 8,2 K Thorium Th 1,4 K titanium Ti 0,5 K Thallium Tl 2,4 K uranium U 1,3 K 2.2 K (1 GPa) Vanadium V 5,4 K 17.2 K (120 GPa) tungsten W 0,01 K 5.5K (Film) zinc Zn 0,85 K 1.6K (film) Zirconium Zr 0,6 K 11 K (30 GPa)

[0136] Table 2 below lists non-superconducting materials. Table 2: Non-superconducting materials element symbol Gold Au copper Cu nickel Ni Silver AG

[0137] In exemplary embodiments, the other metallizations (e.g., first metallization, second metallization and / or a plurality of vias (see below)) can also be used. Fig. 3a and Fig. 3b) each have two layers, at least one of which has superconducting material.

[0138] In exemplary embodiments, the substrate can comprise a polymer, such as polyimide.

[0139] According to exemplary embodiments, suitable waveguides for high-frequency signals can be manufactured based on (polyimide) films or (polyimide) substrates coated with various metals (e.g., copper, niobium, aluminum, etc.). If the substrate is coated with superconducting materials (e.g., niobium or aluminum), superconducting cables can also be constructed. In these exemplary embodiments, a waveguide, such as a stripline, is implemented with at least three metal layers.

[0140] In exemplary embodiments, the substrate is implemented using a flexible material such as polyimide or thin polyimide films, which makes the entire waveguide flexible within certain limits and allows it to be used and bent in a manner comparable to a cable.

[0141] By appropriately placing vias at regular intervals, sufficiently high shielding attenuation can be achieved, so that even with adjacent transmission lines, the decoupling is less than -60 dB or below. These so-called via fences can be arranged in single, double, or multiple rows (n) to achieve even lower crosstalk, where n is a natural number greater than or equal to one. In the case of multi-row via fences, they can also be offset from each other to achieve even higher signal integrity; for example, by half a viar.

[0142] With suitable dimensioning and sufficient manufacturing tolerances and manufacturing capabilities, a highly integrated and flexible cable with multiple waveguides can be realized, such as 100 waveguides per inch.

[0143] Fig.Figure 2 shows a schematic sectional view through a flexible waveguide perpendicular to the direction of wave propagation, according to one embodiment. In other words, Fig. Figure 2 shows a cross-section of a flexible waveguide (e.g., a flexible cable) with several indicated conductors and three metal layers. As already mentioned in relation to Fig. 1a and Fig. As described in 1b, the waveguide 100 comprises a first metallization 102, a second metallization 104, a flexible substrate 106 arranged between the first metallization 102 and the second metallization 104, and a center conductor 108 embedded in the flexible substrate 106.

[0144] In exemplary embodiments, the center conductor 108 can be arranged asymmetrically with respect to the first metallization 102 and the second metallization 104. Thus, a first distance between the center conductor 108 and the first metallization 102 can be smaller than a second distance between the center conductor 108 and the second metallization 104.

[0145] As in Fig. As further indicated in Figure 2, the flexible substrate 106 can, in exemplary embodiments, comprise a first film 112_1 and a second film 112_2, wherein the central conductor 108 is arranged between the first film 112_1 and the second film 112_2. The first film 112_1 and the second film 112_2 can, for example, be polyimide films.

[0146] As in Fig.As can also be seen in Figure 2, the waveguide 100 can have a plurality of vias 114 in exemplary embodiments. The plurality of vias 114 can be arranged between the first metallization 102 and the second metallization 104, or the first metallization 102 and the second metallization 104 can be connected to each other via the plurality of vias 114 (e.g., electrically).

[0147] In exemplary embodiments, the majority of vias 114 can be arranged to shield the center conductor 108. For example, the majority of vias can be arranged on both sides (i.e., on opposite sides of the center conductor 108) along the center conductor 108, e.g., in the form of two via fences.

[0148] In exemplary embodiments, the flexible waveguide 100 can also have further intermediate conductors which can be arranged in the same substrate 106 between the first and the second metallization 102, 104, for example to the right and / or left with respect to the Fig. The plurality of vias 114 shown in Figure 2, or in other words, the center conductors are separated from each other by so-called via fences running between the first and second metallizations 102, 104. In this case, the plurality of vias can serve to reduce crosstalk between the different center conductors. Of course, the flexible waveguide 100 can also have further center conductors arranged in other substrates, e.g., with respect to Fig. 2 above the second metallization 104 and / or below the first metallization 102.

[0149] In other words, Fig.Figure 2 shows a cross-section of an exemplary flexible waveguide (e.g., a flexible cable). In the flexible waveguide (e.g., a flexible cable) shown, the center conductor 108 can be arranged such that it is closer to the lower shielding metallization 102 than to the upper shielding metallization 104 (so-called "asymmetrical design"). In this asymmetrical design, the layer thicknesses of the dielectrics 112_1 and 112_2 are chosen to be different. This offers the technical advantage of simplifying layer changes and connector transitions. The flexible waveguide could, for example, have the following layer thicknesses: film 2 with 50 µm, film 1 with 25 µm, and a metallization thickness of 0.5 µm. The asymmetrical design also improves the impedance matching during the connector transition.

[0150] Fig. Figure 3a shows a schematic sectional view through a flexible waveguide 100 transverse to the wave propagation direction, wherein the waveguide 100 has a central conductor 108 with two striplines 110_1, 110_2 as a superconductor and a normal conductor, according to one embodiment. In other words, Fig. Figure 3a shows a cross-section of a flexible waveguide (e.g., flexible cable) with superconductor and normal conductor materials.

[0151] As already mentioned in relation to the Fig. 1a and Fig. As described in 1b, the center conductor 108 can have two striplines 110_1, 110_2. A first stripline 110_1 of the at least two striplines 110_1, 110_2 can have a superconducting material, while a second stripline 110_2 of the at least two striplines 110_1, 110_2 can have a non-superconducting material.

[0152] As in Fig.As shown in Figure 3a, the first stripline 110_1 and the second stripline 110_2 can be arranged one above the other with respect to the first and / or second metallization 102, 104, for example, such that the first stripline and the second stripline 110_2 intersect a straight line 152 at different points, which is perpendicular to the first and / or second metallization 102, 104. Alternatively, the first stripline 110_1 and the second stripline 110_2 can also be arranged side by side with respect to the first and / or second metallization 102, 104, for example, such that the first stripline and the second stripline 110_2 intersect a straight line 154 at different points, which runs parallel to the first and / or second metallization 102, 104.

[0153] Fig.Figure 3b shows a schematic sectional view through a flexible waveguide 100 transverse to the wave propagation direction, wherein the waveguide 100 has a central conductor 108 with three striplines 110_1, 110_2, 110_3 as a superconductor and normal conductor, according to one embodiment. In other words, Fig. Figure 3b shows a cross-section of a flexible waveguide (e.g. flexible cable) with superconductor and normal conductor materials - three-part center conductor.

[0154] Compared to the one in Fig. The embodiment shown in 3a comprises the Fig.Figure 3b shows a central conductor 108 comprising three striplines 110_1-110_3. A first stripline 110_1 and a third stripline 110_3 can each comprise a superconducting material (e.g., the same superconducting material or different superconducting materials), while a second stripline 110_2 can comprise a non-superconducting material. Of course, in exemplary embodiments, the first stripline 110_1 and the third stripline 110_3 can each comprise non-superconducting materials, while the second stripline 110_2 comprises a superconducting material.

[0155] As this is shown in the Fig. 3a and Fig.As indicated in 3b, in exemplary embodiments the other metallizations, i.e. first metallization 102, second metallization 104 and / or the plurality of vias 114, may also have several layers, wherein a first layer comprises a superconducting material and a second layer comprises a non-superconducting material.

[0156] For example, the first metallization 102 can have a first layer 102_1 of superconducting material and a second layer 102_2 of non-superconducting material. The second metallization 104 can have a first layer 104_1 of non-superconducting material and a second layer 104_2 of superconducting material. The vias can have a first layer 114_1 of superconducting material and a second layer 114_2 of non-superconducting material.

[0157] In other words, Fig. 3a and Fig.Figure 3b shows the cross-section of further exemplary flexible waveguides (e.g., flexible cables). The flexible waveguides (e.g., flexible cables) shown are characterized by the fact that the metallization of the center conductor and / or the shielding is carried out using a material combination of at least one superconducting material (e.g., niobium below the transition temperature) and one non-superconducting material (e.g., copper). Optionally, an adhesive layer (e.g., titanium-tungsten) can be used as part of the material combination to bond the superconducting and non-superconducting materials. The adhesive layer can be incorporated into the material combination during manufacturing.

[0158] If the substrate is coated with copper only, for example, superconductivity cannot be achieved, but the waveguide (e.g., the cable) can still be used at higher temperatures (e.g., above the transition temperature of superconducting materials). The high shielding attenuation and decoupling described above are maintained in this case as well. If, on the other hand, the substrate is coated with aluminum, it can function both as a superconductor at cryogenic temperatures and as a normal conductor at higher temperatures.

[0159] By combining several conductor materials from normal conductors and superconductors (e.g., copper and niobium, copper and aluminum), a particularly low-loss waveguide can be easily realized, operating from cryogenic temperatures through room temperature and up to high temperatures (e.g., triple-digit degrees Celsius). Fig. 3a and Fig.3b is the normal conductor with reference numbers 110_2, 102_2, 104_1 and 114_2, and the superconductors with reference numbers 110_1, 110_3, 102_1, 104_2 and 114_1. This combination is also possible in reverse. Furthermore, a three-part inner conductor is also possible in the combination normal conductor-superconductor-normal conductor or superconductor-normal conductor-superconductor (see Fig. 3b). The magnitude of the simulated S21 parameters (insertion loss) in decibels for one millimeter of cable length is given in Fig. 4a to be recognized.

[0160] In detail, it shows Fig.Figure 4a shows a diagram depicting the simulated insertion loss in dB of a flexible waveguide with superconductors and normal conductors plotted against the frequency in GHz. A first curve 50 describes the insertion loss of the superconductors and normal conductors at room temperature, while a second curve 52 shows the insertion loss of the superconductors and normal conductors at cryogenic temperatures. In other words, Fig. Figure 4a shows a diagram simulating S21 parameters of superconductors and normal conductors at room temperature (50) and cryogenic temperatures (52).

[0161] This shows that the waveguide (e.g., the cable) can be used at both cryogenic and higher temperatures. For comparison, a purely niobium-based flexible waveguide (e.g., flexible cable) is shown in Fig. 4b shown.

[0162] In detail, it shows Fig.Figure 4b shows a graph of the simulated insertion loss in dB of a niobium waveguide plotted against the frequency in GHz. A first curve 60 describes the insertion loss of the niobium waveguide at room temperature, while a second curve 62 shows the insertion loss of the niobium waveguide at cryogenic temperatures. In other words, Fig. Figure 4b shows a diagram simulating S21 parameters of a niobium waveguide (e.g. niobium cable) at room temperature (60) and cryogenic temperatures (62).

[0163] Fig. Figure 5 shows a schematic sectional view through a flexible waveguide 100 transverse to the wave propagation direction, wherein the flexible waveguide 100 has two center conductors 108 embedded in different substrates, according to one embodiment. In other words, Fig.Figure 5 shows an example of an n*3 layered flexible waveguide (e.g., flexible cable) with correspondingly more channels. The first center conductor 108_1 is embedded in a first substrate 106, which is arranged between the first metallization 102 and the second metallization 104, while the second center conductor 108_2 is embedded in a second substrate 106_2, which is arranged between the second metallization 104 and a third metallization 116.

[0164] As in Fig. As indicated in Figure 5, in exemplary embodiments the majority of vias can connect the first metallization 102, the second metallization 104 and the third metallization 116 (e.g. electrically) to each other.

[0165] In other words, Fig.Figure 5 shows the cross-section of another exemplary flexible waveguide (e.g., flexible cable). The waveguide (e.g., cable) shown uses more than three metal layers. The structure could, for example, correspond to the sequence: shield - center conductor - shield - center conductor - shield - (...). Such an arrangement allows for the realization of multiple layers, thereby further increasing the integration density of the flexible waveguide (e.g., flexible cable).

[0166] Fig. Figure 6a shows a schematic sectional view through a flexible waveguide 100 transverse to the wave propagation direction, wherein the flexible waveguide 100 has two adjacent center conductors 108, according to an embodiment.

[0167] Fig.Figure 6b shows a schematic sectional view through a flexible waveguide 100 transverse to the direction of wave propagation, wherein the flexible waveguide 100 has two center conductors 108 arranged one above the other, according to an embodiment.

[0168] As already described above in the other embodiments, the one in the Fig. 6a and Fig. 6b Waveguide 100 shown a first metallization 102, a second metallization 104, a flexible substrate 106 arranged between the first metallization 102 and the second metallization 104, and a plurality of vias 114 running between the first metallization 102 and the second metallization 104 and connecting them (e.g. electrically).

[0169] Compared to the embodiments described above, the one described in the Fig. 6a and Fig.6b shows flexible waveguide 100 not only one center conductor, but two center conductors 108_1 and 108_2.

[0170] At the in Fig. In the embodiment shown in 6a, the two center conductors 108_1 and 108_2 are arranged next to each other, e.g. so that the first center conductor 108_1 and the second center conductor 108_2 intersect a straight line 156 at different points, which runs parallel to the first and / or second metallization 102, 104.

[0171] At the in Fig. In the embodiment shown in 6b, the two center conductors 108_1 and 108_2 are arranged one above the other, so that the first center conductor 108_1 and the second center conductor 108_2 intersect a straight line 158 at different points, which is perpendicular to the first and / or second metallization 102, 104.

[0172] In other words, Fig. 6a and Fig.Figure 6b shows cross-sections of further exemplary flexible waveguides (e.g., flexible cables). The flexible waveguides (e.g., flexible cables) shown use different arrangements with center conductors positioned (directly) above one another or (directly) next to each other for carrying (e.g., differential) signals. For example, this can achieve higher common-mode rejection and thus better signal integrity.

[0173] The in Fig. The central conductors shown in 5a-6b can of course each have at least two striplines, where at least one of the at least two striplines has superconducting material.

[0174] In exemplary embodiments, the other metallizations (e.g., first metallization, second metallization and / or the plurality of vias) can each have two layers, with at least one of the two layers having superconducting material.

[0175] Fig.Figure 7 shows a schematic sectional view through a flexible waveguide 100 transverse to the wave propagation direction, wherein the flexible waveguide 100 has two center conductors 108 arranged one above the other, which are connected to each other via vias 118, according to an exemplary embodiment. In other words, Fig. Figure 7 shows a cross-section of a flexible waveguide (e.g., a flexible cable) with two center conductors, the two center conductors being connected to each other by means of a via.

[0176] As described above, the Fig.Figure 7 shows a waveguide 100 comprising a first metallization 102, a second metallization 104, a flexible substrate 106 arranged between the first metallization 102 and the second metallization 104, and a plurality of vias 114 running between the first metallization 102 and the second metallization 104 and connecting them (e.g., electrically). The waveguide 100 also includes two center conductors 108_1 and 108_2 embedded in the substrate 106 and arranged one above the other, which are connected to each other via vias 118.

[0177] In other words, Fig.Figure 7 shows a cross-section of another exemplary flexible waveguide (e.g., flexible cable). In the flexible waveguide (e.g., flexible cable) shown, two center conductors are connected by means of a via to form a conductor with a larger cross-sectional area. This allows for higher current-carrying capacity and better heat dissipation.

[0178] Fig. Figure 8 shows a schematic sectional view transverse to the wave propagation direction of a center conductor 108 with three striplines 110_1-110_3, wherein a first stripline 110_1 is embedded between a second stripline 110_2 and a third stripline 110_3, according to an exemplary embodiment. As in Fig.As can be seen in Figure 8, the first stripline 110_1 can be arranged on the second stripline 110_2, wherein the third stripline 110_3 can be arranged on the first stripline 110_1 and the second stripline 110_2, so that the third stripline 110_3 and the second stripline 110_3 embed the first stripline 110_1.

[0179] The middle conductor 108 is in this case Fig. 8 is arranged on a first film 112_1 of a flexible substrate. A second film could be arranged on the center conductor 108 and the first film 112_2 to embed the center conductor 108 in the first film 112_1 and the second film. The two films could then again form a flexible substrate, with the substrate being arranged between two metallizations to form a flexible waveguide, as already described in detail above.

[0180] All features of the embodiments disclosed herein, as described or shown herein, can be combined in any way to simultaneously realize their technical advantages. For example, the asymmetrical structure can be combined with a material combination of superconducting and non-superconducting material. Furthermore, a single-ended or differential signal can be transmitted via the flexible waveguide (e.g., flexible cable).

[0181] Furthermore, multiple layers can be arranged on top of each other, with each layer having an identical structure. Alternatively, depending on the application, the individual layers can also have different structures. 1.2. Manufacturing process for a flexible waveguide

[0182] The following describes an exemplary embodiment of a method for manufacturing a flexible waveguide.

[0183] Fig.Figure 9 shows a flowchart of a method 200 for fabricating a flexible waveguide according to an exemplary embodiment. The method 200 comprises a step 202 of providing a first layer of a flexible substrate. Furthermore, the method 200 comprises a step 204 of providing a center conductor on the first layer of the flexible substrate, wherein the center conductor comprises at least two striplines, and wherein at least one of the at least two striplines comprises a superconducting material. The method 200 further comprises a step 206 of providing a second layer of the flexible substrate on the first layer of the flexible substrate and the center conductor, such that the center conductor is embedded between the first layer of the flexible substrate and the second layer of the flexible substrate.Furthermore, the method 200 comprises a step 208 of providing a first metallization and a second metallization, wherein the first metallization is provided on a first side of a stack consisting of the first layer of the flexible substrate and the second layer of the flexible substrate, and wherein the second metallization is provided on a second side of the stack opposite the first side.

[0184] The following describes a further embodiment of a method for manufacturing a flexible waveguide. Such a method enables, for example, the automated and reproducible production of flexible waveguides (e.g., flexible cables). The production and automated manufacturing of flexible three-layer waveguides can, for example, be carried out consecutively in several process steps, such as in an automated roll-to-roll process, as described in the Fig. 10a-g is shown.

[0185] In detail, we show Fig. 10a-g schematic sectional views of the flexible waveguide after different steps during its manufacture. In other words, Fig. Figures 10a-g show process steps for the production of flexible waveguides.

[0186] In detail, it shows Fig. 10a a schematic sectional view of the flexible waveguide during its manufacture after a step of providing a first layer of a flexible substrate of the flexible waveguide and a step of forming at least one hole 120 through the first layer of the flexible substrate.

[0187] In exemplary embodiments, vias and alignment markers can first be laser-drilled through the entire thickness of a flexible substrate film, for example, made of polyimide (PI) (e.g., with a thickness of 25 µm). The vias can later serve as signal vias for electrical contact between the front and back of the substrate film. The alignment markers serve to align the metallization with the vias during lithographic structuring.

[0188] Fig. Figure 10b shows a schematic sectional view of the flexible waveguide during its manufacture after a step of coating (e.g. by sputtering, thermal evaporation, or electroplating) the first layer 112_1 of the flexible substrate with a first metallization 102, wherein in the case of double-sided coating, side walls of the at least one hole 120 are coated with the first metallization to obtain at least one via.

[0189] In exemplary embodiments, the following steps can be taken: Fig. 10b a metal layer on both sides and in the borehole walls of the foil from the step of Fig. 10a. For example, it can be deposited by sputtering. The surface of the substrate film may need to be pre-activated (within the sputtering tool, without interrupting the vacuum). This ensures the required adhesion of the metal to the film. Another way to improve the adhesion between a metal layer, such as niobium, and a PI film is to deposit, for example, TiW as an interlayer. To produce superconducting structures, metallizations (e.g., niobium) can be applied that become superconducting below a critical temperature.

[0190] During this process step, it is also possible to deposit different metals in order to integrate various functions in a very small space, depending on the requirements. For example, signal cables could be made partly of niobium and partly of copper to optimize heat conduction within the cable.

[0191] Fig. Figure 10c shows a schematic sectional view of the flexible waveguide during its fabrication after a structuring step (e.g., by a combination of photolithography and etching (e.g., wet chemical and / or plasma-assisted) of the first metallization 102) to obtain a central conductor of the flexible waveguide on a first side of the first layer of the flexible substrate and to obtain a contact surface for electrical contacting the central conductor on a second side of the first layer of the flexible substrate opposite the first side, wherein the contact surface and the central conductor are connected to each other via the at least one via (e.g., electrically).

[0192] In exemplary embodiments, the pre-processed film can be laminated on both sides with a photoresist. The structure of the signal lines and the contact pads of the flexible waveguide to be manufactured is defined on the front and back sides, for example, by (double-sided) UV exposure. The exposed area of ​​the photoresist cross-links (negative toner resist) and becomes insoluble. The unexposed area is dissolved in a solution, for example, sodium carbonate (Na₂CO₃), and washed off. The metallization on the front and back sides of the film is structured by etching. This can be done either by plasma or wet etching. Finally, the photoresist is wiped off in a solution, for example, potassium hydroxide (KOH).

[0193] Fig. Figure 10d shows a schematic sectional view of the flexible waveguide during its manufacture after a step of providing a second layer 112_2 of the flexible substrate on the first side of the first layer of the flexible substrate.

[0194] In exemplary embodiments, the metallized film can now be laminated with a second dielectric layer, with or without an (acrylic) adhesive between the two film layers.

[0195] Fig. Figure 10e shows a schematic sectional view of the flexible waveguide during its manufacture after a step of forming a plurality of holes through the first layer 112_1 and the second layer 112_2 of the flexible substrate.

[0196] In some embodiments, through-holes and new alignment markings can be laser-drilled through the laminated film. The through-holes later serve as the electrical contact between the front and back sides of the waveguide's outer shield layer. The laser-applied alignment markings are used to position the metallization.

[0197] Fig. Figure 10f shows a schematic sectional view of the flexible waveguide during its manufacture after a step of coating both sides of the flexible substrate with a second metallization 124, wherein in the coating both sides sidewalls of the majority of holes are coated with the second metallization to obtain a majority of vias.

[0198] In exemplary embodiments, an additional metal layer is deposited onto the pre-processed substrate on the outer surfaces and the previously created bore walls as shielding, for example by sputtering. This electrically connects the front and back of the shielding layer via vias. Niobium and / or copper, for example, can be used as the shielding metallization, so that no heat is generated in the superconducting state due to conduction losses. The additionally deposited copper could serve to dissipate passive heat caused by temperature differences in the cryostat.

[0199] Fig. Figure 10g shows a schematic sectional view of the flexible waveguide during its manufacture after a step of structuring the second metallization 124 to obtain a first shielding metallization of the flexible waveguide.

[0200] In some embodiments, a photoresist can be applied to the layered structure and exposed to create a pattern on the shield layer metallization. Niobium, for example, can be patterned by plasma etching. When using other metallizations, such as copper, wet etching can be performed using, for example, sodium persulfate solution (Na₂S₂O₈). Both etching steps can be carried out with the same photoresist layer.

[0201] Through the structuring in the Fig. The 10g shown in the step are ultimately those in the step from Fig. The contact surfaces generated in 10c are electrically separated from the surrounding shielding layers. This results, for example, in a contact surface according to Fig. 11. 1.3. Connection surfaces of the flexible waveguide

[0202] Fig. Figure 11 shows a schematic view of the connection surfaces 130_1-130_3 of the flexible waveguide 100, according to an exemplary embodiment. In other words, Fig. Figure 11 shows an example contact area of ​​a flexible waveguide 100.

[0203] As in Fig. As can be seen in Figure 11, the connection surfaces 130_1-130_3 can be exposed in a plane of the first metallization 102 (or alternatively the second metallization), i.e., they can be electrically insulated from the first metallization 102. The connection surfaces 130_1-130_3 can be connected to the respective center conductors of the flexible waveguide 100 via vias 132_1-132_3.

[0204] In exemplary embodiments, the flexible waveguide 100 can have a plurality of vias 134, wherein the plurality of vias 134 are arranged such that the plurality of vias 134 surround the first terminal 130_1 (and the first center conductor), surround the second terminal 130_2 (and the second center conductor), and surround the third terminal 130_3 (and the third center conductor), and shield the first terminal 130_1, the second terminal 130_2, and the third terminal 130_3 from each other. This reduces crosstalk between the different terminals and the respective center conductors.

[0205] In exemplary embodiments, the three connection surfaces 130_1-130_3 can have different distances to one end 134 of the flexible waveguide. 1.4. Applications of the flexible waveguide

[0206] Examples of flexible waveguide designs are used when it is necessary to transmit signals in a very confined space while simultaneously optimizing heat conduction. The latter is made possible in particular by a combination of materials and the described layer structure. 1.4.1 Quantum computations with superconducting qubits

[0207] One conceivable application of flexible waveguides (e.g., connection systems) is signal transmission in a quantum computer. Examples of flexible waveguide designs can be used to replace coaxial cables, significantly increasing the signal density in the cryostat. By using superconducting materials for the signal transmission and shielding layers of the flexible waveguide (e.g., niobium), heat losses can be reduced. Simultaneously, additional metal layers can be added to optimize heat conduction, ensuring that only a small amount of passive heat is transferred from one temperature stage in the cryostat to the next. This allows for an increase in the number of conductors in the cryostat. Thus, even with an increasing number of qubits in the quantum computer, the flexible waveguide can guarantee signal and power supply within the cryostat.

[0208] Fig. Figure 12 shows a schematic block diagram of a quantum computer 300, according to one embodiment. In other words, Fig. Figure 12 shows an installation of flexible waveguides in the cryostat. The quantum computer 300 comprises a quantum processing unit (QPU) 302, a signal generator and / or signal evaluator 304, a cryostat for generating different temperature levels (e.g., room temperature, 300 K, 4 K, 1.5 K, 100 mK, 20 mK), and at least one flexible waveguide 100 for signal transmission between the quantum processor 304 and the signal generator and / or signal evaluator 304.

[0209] As in Fig. As can be seen from Figure 12, at least one flexible waveguide 100 can be used across all temperature levels (e.g. room temperature, 300 K, 4 K, 1.5 K, 100 mK, 20 mK), i.e. continuously from a temperature level (e.g. room temperature) of the signal generator and / or signal evaluator 304 to a temperature level of the quantum processor, e.g. via feedthroughs in the temperature levels (or temperature stages) of the cryostat.

[0210] Exemplary implementations allow lines to be routed directly from the 4K stage to the so-called mixing chamber (MXC), since the heat transfer is reduced (or even minimized) by the material combination, thus enabling the desired temperature of a few mK to be achieved despite passive heat conduction.

[0211] The shielding concept also ensures low crosstalk between the lines and thus high signal integrity. Manufacturing can be carried out according to the procedure described above. 1.4.2 Phase-controlled array antennas

[0212] Examples of flexible waveguides can be used to connect remote phased array antennas, for example in radar and communications applications. Superconducting materials are not typically used in such cases, as these are not cryogenic applications. Good conductors, such as copper or silver, are more suitable. This allows for a more compact antenna with few or no active components. Active signal processing takes place in a central processing unit.

[0213] This could be the case, for example, in a satellite. The highly integrated waveguide connects an external antenna array mounted on the satellite to a central unit that transmits and receives the data and processes it accordingly. This has the advantage that most of the heat generated by the transmitting and receiving system is dissipated elsewhere. This can simplify cooling. Hybrid solutions are also conceivable, in which some electronic components, such as phase shifters or amplifiers, are integrated into the antennas, while the connection to the transmitting and receiving unit is made via numerous highly integrated waveguides.

[0214] Fig. Figure 13 shows a schematic block diagram of a satellite 320 with a flexible waveguide 100, according to an exemplary embodiment. The satellite 320 comprises an external antenna 322, such as an antenna array, and a transmitting and / or receiving device 324, wherein the flexible waveguide 100 is used for signal transmission between the at least one external antenna 322 and the transmitting and / or receiving device 324.

[0215] Remote antennas connected via highly integrated cables are also conceivable for radar systems with electronically controlled group antennas. 1.4.3 Sensor signal connection for automotive applications

[0216] Examples of flexible cable designs can be used as part of an automotive electrical system. Due to its potentially high signal density, it can supply electronic components in the vehicle with both power and signals. One possible application is, for example, the transmission of sensor data to a control unit.

[0217] This also offers the advantage that the flexible waveguide can be adapted to the vehicle's contours, thus optimizing the use of installation space. This is of central importance, especially given the increasing functional density of modern vehicles. 2. Integration of RF components into a flexible waveguide

[0218] Fig. Figure 14 shows a schematic sectional view of a flexible waveguide 100 along the direction of wave propagation, wherein at least one high-frequency (HF) component 140 is integrated into the flexible waveguide 100. The flexible waveguide 100 comprises a first metallization 102, a second metallization 104, a flexible substrate 106 arranged between the first metallization 102 and the second metallization 104, and at least one center conductor 108 (e.g., inner conductor) connected to the at least one HF component 140.

[0219] In exemplary embodiments, the flexible waveguide 100 can be the flexible waveguide described in Section 1. For example, the center conductor can have at least two striplines, wherein at least one of the at least two striplines has a superconducting material, and / or the center conductor can be arranged asymmetrically with respect to the first metallization 102 and the second metallization 104. However, it should be noted that the flexible waveguide 100 is not limited to such exemplary embodiments. Rather, it is equally possible that the center conductor has only one stripline made of superconducting or non-superconducting material and / or that the center conductor is arranged symmetrically (i.e., centrally) with respect to the first metallization 102 and the second metallization 104.

[0220] In some embodiments, the flexible waveguide can be designed as a flat ribbon cable.

[0221] In exemplary implementations, multiple RF components (e.g., two or more than two RF components) can of course be integrated. In this case, each RF component can be connected to at least one center conductor.

[0222] RF components that can be integrated into printed circuit boards (stripline technology) can be incorporated into flexible waveguides according to the exemplary embodiments. Any conductor material (e.g., copper, aluminum, gold, silver) or even superconducting materials (e.g., niobium, indium, lead, etc.) can be used. Furthermore, lossy materials can also be selectively applied during manufacturing; this can be used, for example, for attenuators or RF terminations.

[0223] To integrate the components compactly into the flexible substrate, they can be arranged in an offset pattern, as shown below. Fig. This is described in sections 15 to 18. This achieves, for example, the technical advantage of reducing crosstalk between individual RF components. At the same time, the individual RF components are only arranged over a short section of the cable, allowing for a compact design.

[0224] Fig. Figures 15 to 18 show schematic sectional views of the flexible waveguide 100 along the direction of wave propagation, wherein several RF components 140 are integrated into the flexible waveguide 100 and are arranged offset from each other.

[0225] In exemplary embodiments, the RF components can be arranged offset from each other in the wave propagation direction of the flexible waveguide and / or perpendicular to the wave propagation direction, wherein in the Fig. 15 to 18, for example, it is assumed that the high-frequency components are arranged offset from each other in the direction of wave propagation.

[0226] For example, the RF components can be arranged offset from each other according to a regular pattern, as shown in the Fig. 15 and Fig. 16 is shown.

[0227] In detail, it shows Fig. Figure 15 shows a schematic sectional view of the flexible waveguide 100 along the direction of wave propagation, wherein several RF components 140 are integrated into the flexible waveguide 100, which are arranged offset from one another according to a regular pattern. In other words Fig. Figure 15 shows a schematic representation of an arrangement variant of the integrated RF components 140 in the flexible substrate 106.

[0228] Fig. Figure 16 shows a schematic sectional view of the flexible waveguide 100 along the direction of wave propagation, in which several RF components 140 are integrated into the flexible waveguide 100 and arranged diagonally offset from one another. In other words, Fig. Figure 16 shows a schematic representation of a diagonal arrangement variant of the integrated RF components 140 in the flexible substrate 106.

[0229] Of course, the RF components can also be arranged in a non-regular pattern (e.g., randomly) offset from each other, as shown in Fig. 17 is shown.

[0230] In detail, it shows Fig. Figure 17 shows a schematic sectional view of the flexible waveguide 100 along the direction of wave propagation, wherein several RF components 140 are integrated into the flexible waveguide 100, which are arranged offset from one another according to a non-regular pattern. In other words, Fig. Figure 17 shows a schematic representation of a randomized arrangement variant of the integrated RF components 140 in the flexible substrate 106.

[0231] Furthermore, it is possible that the RF components 140 are arranged in series with each other and / or extend over the entire length of the flexible waveguide 100, as shown in Fig. 18 is shown.

[0232] In detail, it shows Fig. Figure 18 shows a schematic sectional view of the flexible waveguide 100 along the direction of wave propagation, wherein several RF components 140 are integrated into the flexible waveguide 100, which are arranged in series with each other and / or extend over the entire length of the flexible waveguide 100. In other words, Fig. Figure 18 shows a schematic representation of an arrangement variant of the integrated RF components in the flexible substrate, wherein several RF components are arranged in series or an RF component is integrated over the entire cable length.

[0233] In exemplary embodiments, the offset can therefore be both regular (see Fig. 15 and Fig. 16) as well as in a randomized arrangement (see Fig. 17) by means of a regular offset. Symmetries of the arrangement can be exploited in the design of the individual RF components. For example, it can be assumed that the individual RF components are subject to comparable coupling / scattering effects with each other. By means of a randomized arrangement, however, a targeted averaging of the coupling / scattering effects between the individual RF components can be achieved. The randomization can be carried out, for example, with respect to the length and / or the width and / or the position of the individual RF components along the respective line.

[0234] In exemplary embodiments, a serial arrangement of the individual RF components is possible (see Fig. 18, above). It is also possible to integrate a specific RF component over the entire cable length (see Fig. 18, below). This achieves the technical advantage that multi-stage operations, such as multiple attenuation / filter stages, can be implemented particularly easily. In particular, filters with higher filter orders can also be implemented.

[0235] In exemplary embodiments, the integration density in all the aforementioned examples can be significantly increased by a suitable arrangement of the individual RF components relative to each other.

[0236] In exemplary embodiments, in addition to integrating all required RF components into a single flexible waveguide, it is also possible to manufacture individual modules that implement a single RF component.

[0237] In some embodiments, the RF components within the flexible waveguide, as well as the waveguide itself, can be flexible, bendable, and highly integrated. This allows for an efficient signal chain even in limited installation space. A further advantage of this type of component integration is that all components are always shielded by the waveguide structure. 2.1 Preferred structure of the flexible waveguide

[0238] The arrangement variants shown and described can be implemented particularly advantageously in a flexible multi-core cable.

[0239] Based on (polyimide) films or (polyimide) substrates coated with various metals (e.g., copper, niobium, aluminum, etc.), suitable waveguides for high-frequency signals can be manufactured. If the substrate is coated with superconducting materials (e.g., niobium or aluminum), superconducting cables can also be constructed. The basic idea of ​​the invention is to realize waveguides such as striplines with at least three metal layers.

[0240] If a flexible material such as thin polyimide films is used, the entire waveguide is flexible within certain limits and can be used and bent in a manner similar to a cable.

[0241] By strategically placing vias at regular intervals, sufficiently high shielding attenuation can be achieved, ensuring that even with adjacent transmission lines, the decoupling is less than -60 dB. The vias can be arranged in single, double, or multiple rows to further reduce crosstalk. To achieve even greater signal integrity, the multi-row vias can also be offset from each other, for example, by half a viar unit.

[0242] With skillful dimensioning and sufficient manufacturing tolerances and capabilities, a highly integrated and flexible cable with, for example, 100 waveguides per inch can be realized.

[0243] As mentioned above, shows Fig. Figure 2 shows the cross-section of an exemplary flexible cable. In the flexible cable shown, the center conductor is arranged such that it is closer to the lower shielding metallization than to the upper shielding metallization (so-called "asymmetrical construction"). With this asymmetrical construction, the thicknesses of the dielectric layers are therefore chosen to be different. This offers the technical advantage that layer changes and connector transitions can be implemented more easily. Furthermore, it offers the technical advantage that the impedance matching at the connector transition can be significantly improved.

[0244] As mentioned above, it shows Fig. Figure 5 shows the cross-section of another exemplary flexible cable. The cable shown uses more than three metal layers. Its construction could, for example, correspond to the sequence: shield - center conductor - shield - center conductor - shield - (...). This arrangement allows for multiple layers, further increasing the integration density of the flexible cable. 2.2 Implementation examples for individual RF components 2.2.1 Filters

[0245] In exemplary embodiments, the RF component 140 can be a filter, as shown below. Fig. 19a-d will be explained in more detail.

[0246] Fig. 19a and Fig. Figure 19b shows a schematic sectional view through the flexible waveguide 100 along a plane parallel to the first and second metallizations, where the RF component 140 is a filter implemented by spur lines 142. In other words, Fig. 19a and Fig. Figure 19b shows two variants of integrated branch line filters.

[0247] As in the Fig. 19a and Fig. As can be seen in Figure 19b, the spur lines (strip lines) 142 can each be connected to the center conductor 108 at one end and be open at the other end. The spur lines 142 can be essentially straight and / or run parallel to the center conductor 108, at least in sections.

[0248] The flexible waveguide can have a plurality of vias 114 running between the first metallization 102 and the second metallization 104, connecting them to each other. The plurality of vias 114 can be arranged in the form of via fences around the center conductor 108 and the branch conductors 142. Fig. In 19a, it is assumed by way of example that the majority of vias 114 (via fences) are arranged along two straight lines that run parallel to the center conductor 108 at a distance greater than the RF component, whereas in Fig. 19b assumes that the majority of vias 114 (via fences) are closely connected to the center conductor 108 and the RF component. The filter characteristics can be modified by varying the arrangement of the majority of vias 114.

[0249] Fig. Figure 19c shows a schematic sectional view through the flexible waveguide 100 along a plane parallel to the first and second metallizations, where the RF component 140 is a filter implemented by meandering spur lines 142. In other words, Fig. Figure 19c shows an integrated branch line filter with meandering.

[0250] As in Fig. As can be seen in Figure 19c, the branch lines (strip lines) 142 can each be connected to the center conductor 108 at one end and be open at the other. The flexible waveguide can have a plurality of vias 114 running between the first metallization 102 and the second metallization 104, connecting them. The plurality of vias 114 can be arranged in the form of via fences around the center conductor 108 and the branch lines 142.

[0251] Fig. Figure 19d shows a schematic sectional view through the flexible waveguide 100 along a plane parallel to the first and second metallizations, where the RF component 140 is a filter implemented by a meandering spur line 142. In other words, Fig. Figure 19d shows an integrated stub line filter with meandering and short circuit as the termination impedance.

[0252] As in Fig. As can be seen in 19d, the spur line (strip line) 142 can be connected to the center conductor 108 at one end and terminated at a second end, e.g. via a via which is connected to the first metallization and / or second metallization, such as one of the vias of the via fences 114.

[0253] In some implementation examples, the filter can achieve the desired frequency response.

[0254] In exemplary embodiments, the filter can be implemented using strip line technology.

[0255] In some embodiments, the filter requires little space.

[0256] In some implementation examples, arbitrary inductances and capacitances can be achieved using spur lines. This is accomplished by appropriately dimensioning the line length and selecting the termination impedance (open circuit or short circuit).

[0257] In exemplary embodiments, the short circuit can be implemented both on the spur line and with a connection to existing grounded vias (see figure). Fig. 19d).

[0258] In exemplary implementations, filters of any order can be implemented using stripline technology with the realized reactances. The filters can be used as branch line filters (see Fig. 19a and Fig. 19b) or be designed as coupled line filters.

[0259] In exemplary embodiments, miniaturization techniques such as meandering the lines (see) can be used to minimize the space required for the filters. Fig. 19c) or polygonal lines may be used.

[0260] In exemplary implementations, phase shifters and baluns can (e.g.) be additionally implemented via the realized reactances.

[0261] In some embodiments, the structures can be integrated directly into the flexible waveguide.

[0262] In these exemplary implementations, potential reflection points at connector transitions are eliminated.

[0263] In exemplary implementations, a high integration density is enabled. 2.2.2 Attenuators

[0264] In exemplary embodiments, the RF component 140 can be an attenuator, as shown below. Fig. 20a and Fig. 20b will be explained in more detail.

[0265] Fig. Figure 20a shows a schematic sectional view through the flexible waveguide 100 along a plane parallel to the first and second metallization, wherein the RF component 140 is an attenuator implemented by striplines, according to an embodiment.

[0266] Fig. Figure 20b shows a schematic diagram through the flexible waveguide made of Fig. 20a transverse to the direction of wave propagation, according to one embodiment.

[0267] In exemplary embodiments, the damping element 140 can be connected in series between a first center conductor 108_1 and a second center conductor 108_2 and implemented by means of striplines (see Fig. 20a). In exemplary embodiments, the striplines can form resistive elements or act as resistive elements, e.g. by using materials with higher losses for the striplines than for the center conductors and / or by adjusting the resistance of the striplines via a dimensioning (e.g. width and / or height).

[0268] In exemplary embodiments, the strip lines can be connected as a Pi element, T element or cross element.

[0269] In the Fig. 20a and Fig. In the embodiment shown in Figure 20b, the attenuator 140 can have five striplines 142_1-142_5, wherein a first stripline 142_1 can be connected in series between the first center conductor 108_1 and the second center conductor 108_2, wherein a second stripline 142_2 is connected in series between the first center conductor 108_1 and at least one via of a plurality of vias 114 which are connected (e.g. electrically) to the first metallization 120 and / or second metallization 104, wherein a third stripline 142_3 is connected in series between the first center conductor 108_1 and at least one via of the plurality of vias 114, wherein a fourth stripline 142_4 is connected in series between the second center conductor 108_2 and at least one via of the plurality of vias 114, and wherein a fifth stripline 142_5 is connected in series between the second center conductor 108_1 and at least one via of the majority of vias 114.

[0270] As in Fig. 20a and Fig. As can be seen from 20b, at least those vias of the majority of vias 114 which are arranged in the area of ​​the damping element 140 can be connected to each other via respective mass surfaces 144.

[0271] In other words, Fig. Figure 20a shows a schematic top view of a damping element 140 in strip line technology in flexible substrate 106 implemented as a symmetrical Pi element, wherein Fig. Figure 20b shows a schematic cross-sectional view of the damping element 140 in the flexible substrate 106.

[0272] In exemplary embodiments, the damping element can be implemented using strip line technology.

[0273] In exemplary embodiments, the damping element can be adapted to be low-reflection.

[0274] In exemplary embodiments, the damping element may have a low frequency response.

[0275] In exemplary embodiments, the damping element can have a desired damping value.

[0276] In exemplary embodiments, the attenuator can be implemented with different topologies, such as a Pi element, T element, or cross element. To realize resistive elements, materials with higher losses (e.g., a titanium-tungsten alloy) can be introduced into the waveguide, for example, by sputtering. Alternatively or additionally, the resistance can be arbitrarily adjusted via geometric dimensioning. Another way to implement resistive elements is by using very thin layers of an electrical conductor.

[0277] In some embodiments, the damping element can be integrated directly into the flexible waveguide.

[0278] In some embodiments, the damping element can be extended over the entire length of the conductor. This allows for more efficient dissipation of Joule's heat. 2.2.3 Directional coupler

[0279] In exemplary embodiments, the RF component 140 can be a directional coupler, as shown below. Fig. 21a and b and 22a and b will be explained in more detail.

[0280] In detail, it shows Fig. 21a a schematic sectional view through the flexible waveguide 100 along a plane parallel to the first and second metallization 102, 104, wherein the RF component 140 is a directional coupler implemented by striplines 142_1 and 142_2, while Fig. Figure 21b shows a schematic sectional view through the flexible waveguide 100 perpendicular to the direction of wave propagation, according to an exemplary embodiment.

[0281] As in the Fig. 21a and Fig. As can be seen in Figure 21b, the directional coupler can have two interconnected striplines 142_1 and 142_2. The two interconnected striplines 142_1 and 142_2 can run parallel to each other in the flexible substrate 106.

[0282] In exemplary embodiments, the at least two interconnected striplines 142_1 and 142_ can each be connected to at least one center conductor of the flexible wave liter 100.

[0283] In exemplary embodiments, the two coupled strip lines 142_1 and 142_2 can be arranged in different planes in the flexible substrate 106 (see Figure 1). Fig. 21b). For example, the two coupled striplines can be arranged one above the other in the flexible substrate (e.g. with respect to a straight line 146 that is perpendicular to the first metallization 102 and / or second metallization 104, or in other words, such that the two coupled striplines 142_1 and 142_2 intersect the straight line 148 in different positions).

[0284] As in Fig. As shown in Figure 21a, in exemplary embodiments the two coupled striplines 142_1 and 142_2 can have a meandering course (e.g., the same one) at least in one coupled section. Of course, the two coupled striplines 142_1 and 142_2 can also have a straight course or a polygonal course.

[0285] Fig. Figure 22a shows a schematic sectional view through the flexible waveguide 100 along a plane parallel to the first and second metallization 102, 104, wherein the RF component 140 is a directional coupler implemented by sawtooth striplines 142_1 and 142, while Fig. Figure 22b shows a schematic sectional view through the flexible waveguide 100 perpendicular to the direction of wave propagation, according to an exemplary embodiment.

[0286] Compared to the one in the Fig. 21a and Fig. In the embodiment shown in 21b, the two coupled strip lines 142_1 and 142_2 run in the Fig. 22a and Fig. 22b shown embodiment in the same plane. Thus, the two coupled striplines 142_1 and 142_2 can be arranged side by side in the flexible substrate 106 (e.g. with respect to a straight line 148 that runs parallel to the first metallization and / or second metallization, or in other words, such that the two coupled striplines 142_1 and 142_2 intersect the straight line 148 in different positions).

[0287] To increase coupling between striplines 142_1 and 142_2, the two coupled striplines 142_1 and 142_2 can have corresponding sawtooth shapes, at least in one coupled section, as shown in Fig. 22a can be seen.

[0288] In other words, Fig. Figure 21a shows a top view of the inner layer of a possible embodiment of an integrated meandering coupler, while Fig. Figure 21b shows a cross-section of a coupler with broadside coupling. Fig. Figure 22a shows a top view of the inner layer of a possible embodiment of an integrated sawtooth coupler, while Fig. Figure 22b shows a cross-section of a coupler with sawtooth coupling.

[0289] In exemplary embodiments, the directional coupler can be implemented using stripline technology.

[0290] In exemplary embodiments, the directional coupler can have desired properties, such as coupling factor, coupling attenuation, matching, frequency range, etc.

[0291] In some embodiments, the directional coupler can have a small footprint.

[0292] In exemplary embodiments, the coupled lines can also be stacked on top of each other using broadside coupling (see [reference]). Fig. or by means of sawtooth coupling (see Fig. 22a and Fig. 22b) must be implemented to ensure sufficient coupling even with small metallization thicknesses.

[0293] In exemplary implementations, miniaturization techniques, such as meandering the lines or polygonal paths, can be used to reduce (or even minimize) the space required for the filters.

[0294] In exemplary embodiments, the structures of the directional coupler can be integrated directly into the flexible waveguide.

[0295] In these exemplary embodiments, potential reflection points at connector transitions are eliminated.

[0296] Examples of implementations allow for a high integration density. 2.2.4 Transformer

[0297] In exemplary embodiments, the RF component 140 can be a transformer, as shown below. Fig. 23 will be explained in more detail.

[0298] Fig. Figure 23 shows a schematic sectional view through the flexible waveguide 100 along a plane parallel to the first and second metallization, wherein the RF component 140 is a transformer implemented by striplines 142_1 and 142_2.

[0299] As in Fig. As can be seen in Figure 23, the transformer can have a first loop-shaped stripline 142_1 and a second loop-shaped stripline 142_2, which are integrated / embedded in the flexible substrate 106, wherein the first loop-shaped stripline 142_1 and the second loop-shaped stripline 142_2 are arranged in different planes of the flexible substrate 106. For example, the two loop-shaped striplines can be arranged one above the other in the flexible substrate (e.g., with respect to a straight line that is perpendicular to the first metallization and / or second metallization).

[0300] In exemplary embodiments, a first end of the first loop-shaped stripline 142_1 can be connected to a first center conductor of the flexible waveguide 100, while a first end of the second loop-shaped stripline 142_2 can be connected to a second center conductor of the flexible substrate.

[0301] In exemplary embodiments, a second end of the first loop-shaped stripline 142_1 can be connected to the first metallization and / or second metallization of the flexible waveguide via a first via 143_1, while a second end of the second loop-shaped stripline 142_2 can be connected to the first metallization and / or second metallization of the flexible waveguide via a second via 143_2.

[0302] In other words, Fig. Figure 23 shows an integrated transformer / transformer with adjustable impedance ratio.

[0303] In exemplary embodiments, the transformer can be designed using strip line technology.

[0304] In some embodiments, the transformer may exhibit slight reflections.

[0305] In some embodiments, the desired impedance ratio of the transformer can be adjusted.

[0306] In some embodiments, the transformer can have a small footprint.

[0307] In exemplary implementations, miniaturization techniques, such as meandering the conductors, can be used to reduce (or even minimize) the space required by the transformer.

[0308] In exemplary embodiments, a desired transmission ratio can be set via the winding ratio. 2.2.5 Power divider

[0309] In exemplary embodiments, the RF component 140 can be a power divider, as shown below. Fig. Sections 24a to 24c are explained in more detail.

[0310] Fig. Figures 24a to 24c each show a schematic sectional view through the flexible waveguide 100 along a plane parallel to the first and second metallization, wherein the RF component 140 is a power divider implemented by at least one stripline.

[0311] In exemplary embodiments, the power divider implemented by at least one stripline can be integrated into the flexible substrate 106 of the flexible waveguide 100.

[0312] In exemplary embodiments, the power divider can be connected on the input side to a first center conductor 108_1 of the flexible waveguide, while on the output side the power divider can be connected to a second center conductor 108_2 and a third center conductor 108_3 of the flexible waveguide. The first center conductor 108_1, the second center conductor 108_2, and the third center conductor 108_3 can each have a characteristic impedance Z0.

[0313] Fig. Figure 21a shows an embodiment in which the power divider is implemented by a stripline 142.

[0314] In this case, a first end of the strip line 142 can be connected to the first center conductor 108_1, and a second end of the strip line 142 can be connected to the second center conductor 108_2 and the third center conductor 108_3.

[0315] In exemplary embodiments, the stripline 142 can have a length that is one quarter of a wavelength of a signal carried in the first center conductor 108_1.

[0316] In exemplary embodiments, the stripline 142 can have a characteristic impedance equal to a quotient of a characteristic impedance Z0 and the square root of two.

[0317] Fig. Figure 21b shows an embodiment in which the power divider is implemented by a first stripline 142_1 and a second stripline 142_2.

[0318] The first stripline 142_1 can be connected in series between the first center conductor 108_1 and the second center conductor 108_2, with the second stripline 142_2 being connected in series between the first center conductor 108_1 and the third center conductor 108_2.

[0319] In exemplary embodiments, the first stripline 142_1 and the second stripline 142_2 can each have a length that is one quarter of a wavelength of a signal carried in the first center conductor 108_1.

[0320] In exemplary embodiments, the first stripline 142_1 and the second stripline 142_2 can each have a characteristic impedance equal to a product of a characteristic impedance Z0 and the square root of two.

[0321] Fig. Figure 21c shows an embodiment in which the power divider is implemented by a first stripline 142_1 and a second stripline 142_2, wherein the first stripline 142_1 and the second stripline 142_2 are connected on the output side via a resistor (e.g. of size 2Z0) implemented in stripline technology.

[0322] The first stripline 142_1 can be connected in series between the first center conductor 108_1 and the second center conductor 108_2, with the second stripline 142_2 being connected in series between the first center conductor 108_1 and the third center conductor 108_2.

[0323] In exemplary embodiments, the first stripline 142_1 and the second stripline 142_2 can each have a semicircular shape, as shown in Fig. Figure 24c shows an example. However, embodiments are not limited to such a routing of the strip lines. Rather, the strip lines can also have a different routing, for example a straight or slightly curved routing.

[0324] In exemplary embodiments, the first stripline 142_1 and the second stripline 142_2 can each have a length that is one quarter of a wavelength of a signal carried in the first center conductor 108_1.

[0325] In exemplary embodiments, the first stripline 142_1 and the second stripline 142_2 can each have a characteristic impedance equal to a product of a characteristic impedance Z0 and the square root of two.

[0326] In other words, Fig. Figure 24a shows a first variant of an integrated λ / 4 power divider, while Fig. 24b shows a second variant of an integrated λ / 4 power divider, and while Fig. 24c shows an integrated Wilkinson power divider.

[0327] In exemplary implementations, the power divider can be designed using strip line technology.

[0328] In exemplary embodiments, the power divider may exhibit slight reflections.

[0329] In exemplary implementations, the power divider can provide a desired division ratio.

[0330] In some embodiments, the power divider can have a small footprint.

[0331] In exemplary implementations, miniaturization techniques, such as meandering the lines, can be used to reduce (or even minimize) the space required for the power dividers.

[0332] In some embodiments, lossy materials can be incorporated into the waveguide, for example by sputtering, if resistive elements are required. Another way to implement resistive elements is by using very thin layers of an electrical conductor.

[0333] Various types of power dividers can be implemented in exemplary embodiments. For example, a λ / 4 power divider (see Fig. 24a and Fig. 24b) or a Wilkinson power divider (see Fig. 24c).

[0334] In exemplary implementations, the division ratio can be symmetrical – an even power distribution in a 1:1 ratio (for example, in the Fig. (shown in sections 24a to 24c) - or they may be asymmetrical. With an asymmetrical division ratio, the characteristic impedance of the λ / 4 transformers changes accordingly (see 24a to 24c). Fig. 24b and Fig. 24c). 2.3 Possible applications

[0335] Quantum computers with superconducting qubits require highly precise and low-noise control of the implemented qubits. The necessary connections for the control lines should be placed as close as possible to the quantum chip. This is not easily achievable, as various RF components must be integrated into the signal chain. To overcome this, it is advantageous to integrate the RF components directly into the control lines. Furthermore, this significantly reduces the number of external components and thus also the susceptibility to errors in the design of the quantum system.

[0336] Currently, coaxial semi-ridged cables are typically used. The RF components employed in these cables are currently external coaxial. Due to the space required, the achievable qubit count is limited to three-digit values. The current integration density provided by semi-ridged cables and external RF components is insufficient to achieve even higher qubit counts.

[0337] In contrast, embodiments of the flexible waveguide described herein with at least one integrated high-frequency component can be used for signal transmission in a quantum computer 300 between the quantum processor 302 and the signal generator and / or signal evaluator 304, as described in Fig. Figure 12 shows examples of the flexible waveguide described herein. It is possible to increase the integration density and thus realize higher qubit numbers. 3. Further examples

[0338] Although some aspects have been described in connection with a device, it is understood that these aspects also constitute a description of the corresponding process, such that a block or component of a device can also be understood as a corresponding process step or as a feature of a process step. Similarly, aspects described in connection with or as a process step also constitute a description of a corresponding block, detail, or feature of a corresponding device. Some or all of the process steps can be performed by (or using) a hardware apparatus, such as a microprocessor, a programmable computer, or an electronic circuit. In some embodiments, some or more of the key process steps can be performed by such an apparatus.

[0339] The embodiments described above merely illustrate the principles of the present invention. It is understood that modifications and variations of the arrangements and details described herein will be obvious to other people skilled in the art. Therefore, it is intended that the invention be limited only by the scope of protection set forth in the following claims and not by the specific details presented herein by way of description and explanation of the embodiments. Bibliography [1] Krinner, S., Storz, S., Kurpiers, P. et al. “Engineering cryogenic setups for 100-qubit scale superconducting circuit systems” - EPJ Quantum Technology 6(1) [2] David B Tuckerman, Michael C Hamilton, David J Reilly, Rujun Bai, George A Hernandez, John M Hornibrook, John A Sellers, Charles D Ellis, “Flexible superconducting Nb transmission lines on thin film polyimide for quantum computing applications”, Superconductor Science and Technology 29 (2016) 084007 (12pp), DOI:10.1088 / 0953-2048 / 29 / 8 / 084007. [3] Shuna Wang, Wenbing Jiang, Huiqin Yu et al. “Functional flexible cables for cryogenic quantum systems” - 2022 IEEE 15th Workshop on Low Temperature Electronics (WOLTE) [4] Page “List of transition temperatures of chemical elements”. In: Wikipedia - The Free Encyclopedia. Revision as of 4 July 2022, 10:16 UTC. URL: https: / / de.wikipedia.org / w / index.php?title=Liste_der_Sprungtemperaturen_chemier_Elemente&oldid=224223235 (Accessed: 22 September 2023, 12:39 UTC) QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited non-patent literature

[0000] Krinner, S., Storz, S., Kurpiers, P. et al. “Engineering cryogenic setups for 100-qubit scale superconducting circuit systems” - EPJ Quantum Technology 6(1)

[0339] David B Tuckerman, Michael C Hamilton, David J Reilly, Rujun Bai, George A Hernandez, John M Hornibrook, John A Sellers, Charles D Ellis, “Flexible superconducting Nb transmission lines on thin film polyimide for quantum computing applications”, Superconductor Science and Technology 29 (2016) 084007 (12pp), DOI:10.1088 / 0953-2048 / 29 / 8 / 084007

[0339] Shuna Wang, Wenbing Jiang, Huiqin Yu et al. “Functional flexible cables for cryogenic quantum systems” - 2022 IEEE 15th Workshop on Low Temperature Electronics (WOLTE

[0339] List of transition temperatures of chemical elements. In: Wikipedia - The Free Encyclopedia. Revision as of 4 July 2022, 10:16 UTC. URL: https: / / de.wikipedia.org / w / index.php?title=Liste_der_Sprungtemperaturen_chemier_Elemente&oldid=224223235 (Accessed: 22 September 2023, 12:39 UTC

[0339]

Claims

[1] Flexible waveguide (100), having the following features: a first metallization (102), a second metallization (104), a flexible substrate (104) arranged between the first metallization (102) and the second metallization (104), at least one high-frequency component (140) embedded in the substrate (104) and connected to at least one center conductor (108) of the flexible waveguide (100). [2] Flexible waveguide (100) according to claim 1, wherein the at least one high-frequency component (140) is at least two high-frequency components (140), wherein the at least two high-frequency components (140) are arranged offset from one another. [3] Flexible waveguide (100) according to claim 2, wherein the at least two high-frequency components (140) are arranged offset from one another in the wave propagation direction of the flexible waveguide (100) and / or perpendicular to the wave propagation direction. [4] Flexible waveguide (100) according to one of claims 2 to 3, wherein the at least two high-frequency components (140) are at least three high-frequency components (140), wherein the at least three high-frequency components (140) are arranged offset from one another according to a regular pattern, or wherein the at least three high-frequency components (140) are arranged offset from one another according to a non-regular pattern. [5] Flexible waveguide (100) according to one of claims 2 to 4, wherein at least two center conductors (108) are embedded in the flexible substrate (104), and wherein the at least two high-frequency components (140) are each connected to a center conductor (108). [6] Flexible waveguide (100) according to claim 1, wherein the at least one high-frequency component (140) is at least two high-frequency components (140), and wherein the at least two high-frequency components (140) are arranged in series with one another. [7] Flexible waveguide (100) according to one of claims 1 to 6, wherein a high frequency component (140) of the at least one high frequency component (140) is a filter. [8] Flexible waveguide (100) according to claim 7, wherein the high frequency component (140) has at least one stub (142) connected at a first end to the at least one center conductor (108). [9] Flexible waveguide (100) according to claim 8, wherein the at least one stub line (142) is open at a second end, or wherein the at least one stub line (142) is terminated at the second end. [10] Flexible waveguide (100) according to claim 9, wherein the at least one stub (142) is terminated at the second end by at least one via (114) connected to the first metallization (102) and / or second metallization (104). [11] Flexible waveguide (100) according to one of claims 8 to 10, wherein at least a portion of the at least one stub line (142) runs parallel to the at least one center conductor (108), or wherein at least one section of the at least one stub line (142) has a meandering or polygonal course. [12] Flexible waveguide (100) according to one of claims 1 to 11, wherein a high-frequency component (140) of the at least one high-frequency component (140) is an attenuator. [13] Flexible waveguide (100) according to claim 12, wherein the at least one center conductor (108) comprises a first center conductor (108_1) and a second center conductor (108_2), wherein the attenuator is connected in series between the first center conductor (108_1) and the second center conductor (108_2). [14] Flexible waveguide (100) according to claim 13, wherein the attenuator comprises at least a first resistive element (142_1) and a second resistive element (142_2), wherein the first resistive element (142_1) is connected in series between the first center conductor (108_1) and the second center conductor (108_2), wherein the second resistive element (142_2) is connected in series between the first center conductor (108_1) and a first via (114) connected to the first metallization (102) and / or second metallization (104). [15] Flexible waveguide (100) according to claim 14, wherein the attenuator comprises a third resistive element (142_3), wherein the third resistive element (142_3) is connected in series between the first center conductor (108_1) and a second via (114) connected to the first metallization (102) and / or second metallization (104). [16] Flexible waveguide (100) according to claim 14, wherein the attenuator comprises a fourth resistive element (142_4) and a fifth resistive element (142_5), wherein the fourth resistive element (142_4) is connected between the second center conductor (108_2) and a third via (114) connected to the first metallization (102) and / or second metallization (104), wherein the fifth resistive element (142_5) is connected between the second center conductor (108_2) and a fourth via (114) connected to the first metallization (102) and / or second metallization (104). [17] Flexible waveguide (100) according to one of claims 14 to 16, wherein the resistive elements are each implemented by a stripline having a higher insertion loss than the first center conductor (108_1) and / or the second center conductor (108_2). [18] Flexible waveguide (100) according to claim 17, wherein the striplines are connected to the first center conductor (108_1) and / or the second center conductor (108_2). [19] Flexible waveguide (100) according to one of claims 1 to 18, wherein a high-frequency component (140) of the at least one high-frequency component (140) is a directional coupler. [20] Flexible waveguide (100) according to claim 19, wherein the directional coupler comprises two striplines (142_1, 142_2) coupled to each other. [21] Flexible waveguide (100) according to claim 20, wherein the two coupled striplines (142_1, 142_2) run parallel to each other in the flexible substrate (104). [22] Flexible waveguide (100) according to one of claims 20 and 21, wherein the two mutually coupled striplines (142_1, 142_2) are arranged in different planes in the flexible substrate (104). [23] Flexible waveguide (100) according to claim 22, wherein the two strip lines (142_1, 142_2) coupled to one another have a meandering or polygonal course at least in a coupled section. [24] Flexible waveguide (100) according to one of claims 20 and 21, wherein the two mutually coupled striplines (142_1, 142_2) are arranged in the same plane in the flexible substrate (104). [25] Flexible waveguide (100) according to claim 24, wherein the two mutually coupled striplines (142_1, 142_2) have corresponding sawtooth shapes at least in a coupled section. [26] Flexible waveguide (100) according to one of claims 20 to 25, wherein a first stripline (142_1) of the two mutually coupled striplines (142_1, 142_2) is connected to at least a first center conductor (108_1) of the at least one center conductor (108), wherein a second stripline (142_2) of the two mutually coupled striplines (142_1, 142_2) is connected to at least a second center conductor (108_2) of the at least one center conductor (108). [27] Flexible waveguide (100) according to one of claims 20, wherein each of the two coupled striplines (142_1, 142_2) is connected to at least one center conductor (108). [28] Flexible waveguide (100) according to one of claims 1 to 27, wherein a high frequency component (140) of the at least one high frequency component (140) is a transformer. [29] The flexible waveguide (100) of claim 28, wherein the transformer comprises a first loop-shaped stripline (142_1) and a second loop-shaped stripline (142_2). [30] Flexible waveguide (100) according to claim 29, wherein the first loop-shaped stripline (142_1) and the second loop-shaped stripline (142_2) are arranged in different planes of the flexible substrate (104). [31] Flexible waveguide (100) according to one of claims 29 and 30, wherein the first loop-shaped stripline (142_1) is connected to a first center conductor (108_1) of the at least one center conductor (108), wherein the second loop-shaped stripline (142_2) is connected to a second center conductor (108_2) of the at least one center conductor (108). [32] Flexible waveguide (100) according to claim 31, wherein the first loop-shaped stripline (142_1) is connected in series between the first center conductor (108_1) and a first via (143_1) connected to the first metallization (102) and / or second metallization (104), wherein the second loop-shaped stripline (142_2) is connected in series between the second center conductor (108_2) and a second via (143_2) connected to the first metallization (102) and / or second metallization (104). [33] Flexible waveguide (100) according to one of claims 1 to 32, wherein a high-frequency component (140) of the at least one high-frequency component (140) is a power divider. [34] Flexible waveguide (100) according to claim 33, wherein the power divider is implemented in stripline technology. [35] Flexible waveguide (100) according to one of claims 33 to 34, wherein the power divider is connected on the input side to a first center conductor (108_1) of the at least one center conductor (108), wherein the power divider is connected on the output side to a second center conductor (108_2) and a third center conductor (108_3) of the at least one center conductor (108). [36] Flexible waveguide (100) according to claim 35, wherein the power divider comprises a stripline (142), wherein a first end of the stripline (142) is connected to the first center conductor (108_1), and wherein a second end of the stripline (142) is connected to the second center conductor (108_2) and the third center conductor (108_3). [37] Flexible waveguide (100) according to claim 36, wherein the stripline (142) has a length which is one quarter of a wavelength of a signal carried in the first center conductor (108_1), and / or wherein the stripline (142) has a line characteristic impedance which is equal to a quotient of a line characteristic impedance Z0 and the square root of two. [38] Flexible waveguide (100) according to one of claims 33 to 34, wherein the power divider comprises a first stripline (142_1) and a second stripline (142_2), wherein the first stripline (142_1) is connected in series between the first center conductor (108_1) and the second center conductor (108_2), and wherein the second stripline (142_2) is connected in series between the first center conductor (108_1) and the third center conductor (108_3). [39] Flexible waveguide (100) according to claim 38, wherein the first stripline (142_1) and the second stripline (142_2) each have a length which is one quarter of a wavelength of a signal carried in the first center conductor (108_1), and / or wherein the first stripline (142_1) and the second stripline (142_2) each have a line characteristic impedance that is equal to a product of a line characteristic impedance Z0 and the square root of two. [40] Flexible waveguide (100) according to one of claims 33 to 34, wherein the power divider comprises a first stripline (142_1) and a second stripline (142_2), wherein the first stripline (142_1) is connected in series between the first center conductor (108_1) and the second center conductor (108_2), and wherein the second stripline (142_2) is connected in series between the first center conductor (108_1) and the third center conductor (108_3). [41] Flexible waveguide (100) according to claim 40, wherein the first stripline (142_1) and the second stripline (142_2) are connected on the output side via a resistor implemented in stripline technology. [42] Flexible waveguide (100) according to claim 41, wherein the first stripline (142_1) and the second stripline (142_2) each have a length which is one quarter of a wavelength of a signal carried in the first center conductor (108_1), and / or wherein the first stripline (142_1) and the second stripline (142_2) each have a line characteristic impedance that is equal to a product of a line characteristic impedance Z0 and the square root of two. [43] Quantum computer (300), with the following features: a quantum processor (302), a signal generator and / or signal evaluator (304), and at least one flexible waveguide (100) according to one of claims 1 to 42 for signal transmission between the quantum processor (302) and the signal generator and / or signal evaluator (304). [44] Quantum computer according to claim 43, wherein the quantum processor (302) is configured to operate at a cryogenic temperature, and / or wherein the signal generator and / or signal evaluator (304) is designed to operate at a cryogenic temperature or a non-cryogenic temperature.

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