Method for applying and fixing a metal wire to a support

Abstract

A method for applying and fixing a metal wire 140 to a support 110, comprising the following steps: applying a layer of reactive thermosetting adhesive 120 to a support 110; placing the metal wire 140 onto the layer of reactive thermosetting adhesive 120; embedding the metal wire 140 in the layer of reactive thermosetting adhesive 120 by heating the reactive thermosetting adhesive 120, thereby activating the reactive thermosetting adhesive 120 and curing the activated thermosetting adhesive 120, so that the metal wire 140 is fixed in the layer of reactive thermosetting adhesive 120.

Description

[0001] The invention relates to a method for applying and fastening a metal wire to a carrier, for example for an antenna structure.

[0002] Antenna structures, for example for contactless chip cards, can be manufactured using various manufacturing processes.

[0003] For example, antenna structures can be manufactured by placing a wire on a substrate and inserting it, by printing, etching, or electroplating. Pre-wound coils can also be applied to a substrate and bonded to it.

[0004] In wire-laid antenna structures, the wire is laid on a carrier material using ultrasound, for example, with a so-called sonotrode. This sonotrode has an ultrasonic generator and a wire feeder in its head. The wire is heated by ultrasound at specific points to such an extent that it melts into the carrier material. By moving the sonotrode, any structure, such as antenna structures, can be applied to a carrier material, such as a chip card carrier material.

[0005] In order for the wire to melt well and form a stable connection with the carrier material, a thermoplastic carrier material such as polycarbonate, polyethylene terephthalate, epoxy laminate and / or polyimide is advantageous.

[0006] In addition to their high durability, wire-laid antenna structures offer the advantage of being limited in shape and size only by the dimensions of the carrier material. Another advantage of wire-laid antenna structures is that no environmentally harmful chemicals, such as solvents, are required during production.

[0007] When using environmentally friendly or renewable carrier materials such as paper or wood, wire-laid antenna structures cannot be fused into the carrier material as described. Carrier materials such as paper or wood do not melt when exposed to heat, thus preventing the desired stable and durable bond between the carrier material and the wire-laid antenna structure.

[0008] A method for applying and securing a metal wire to a carrier according to claim 1 is provided. Further embodiments are described in the subclaims.

[0009] In various embodiments, a method for applying and fastening a metal wire to a carrier is described, which ensures the required stable and durable connection between the carrier material and the wire-laid antenna structure.

[0010] Embodiments of the invention are illustrated in the figures and are explained in more detail below.

[0011] It shows Fig. 1 Placing a metal wire on a layer of reactive thermosetting adhesive arranged on a carrier; according to various embodiments; Fig. 2 Carriers with a layer of reactive thermosetting adhesive with embedded metal wire, after its installation; according to various embodiments; Fig. 3 Lamination process of the carrier with a layer of reactive thermosetting adhesive with embedded metal wire; according to various embodiments; Fig. 4 Carriers with a layer of activated thermosetting adhesive with embedded metal wire, after lamination; according to various embodiments; Fig. 5 Lamination process for a chip card with a carrier; according to various embodiments;

[0012] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced.

[0013] In this regard, directional terminology such as "top," "bottom," "front," "back," "fore," "rear," etc., is used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology is for illustrative purposes and is in no way limiting. It is understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It is understood that the features of the various exemplary embodiments described herein may be combined with one another unless specifically stated otherwise. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

[0014] Throughout this description, the terms "connected," "attached," and "coupled" are used to describe both a direct and an indirect connection, a direct or indirect connection, and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals where appropriate.

[0015] The Fig. 1 shows the application of a metal wire 140 to a layer of reactive thermosetting adhesive 120 arranged on a carrier 110.

[0016] The carrier 110 can, for example, comprise or consist of an environmentally friendly and / or renewable material, such as paper, wood and / or a recycled material and / or a composite material.

[0017] The carrier 110 has a layer of reactive thermosetting adhesive 120. For example, the layer of reactive thermosetting adhesive 120 can be less than or equal to 20 µm.

[0018] The metal wire 140 may, for example, be made of copper or a copper alloy.

[0019] The introduction of the metal wire 140 into the layer of reactive thermosetting adhesive 120 on the carrier 110 is carried out, for example, by means of ultrasonic energy 135 by a so-called sonotrode 130.

[0020] The sonotrode 130 has an ultrasonic transducer and a wire feeder in its head. The sonotrode 130 uses ultrasonic energy 135 to selectively heat the metal wire 140 and the layer of reactive thermosetting adhesive 120, allowing the metal wire 140 to melt into the layer of reactive thermosetting adhesive 120.

[0021] By moving the sonatrode 130, for example, an antenna structure can be applied to the carrier 110.

[0022] The applied ultrasonic energy 135 is selected such that it is slightly above the corresponding energy for (pre-)lamination but below the energy required for bonding or for the complete curing of the layer of reactive thermosetting adhesive 120. This ensures that only a local activation / curing of the layer of reactive thermosetting adhesive 120 occurs along the laid metal wire 140.

[0023] The Fig. 2 shows such a device 100 comprising a carrier 110 with a layer of reactive thermosetting adhesive 120 with embedded metal wire 140.

[0024] The ultrasonic energy 135 introduced by the sonotrode 130 locally melts the layer of reactive thermosetting adhesive 120, thereby locally activating and curing it parallel to the laid metal wire 140. This local area of ​​activated and cured thermosetting adhesive 122 parallel to the laid metal wire 140 ensures an initial, secure bond between the metal wire 140 and the carrier 110.

[0025] To fully cure the layer of reactive thermosetting adhesive 120 and improve the bond between the metal wire 140 and the carrier 110, a further lamination step is required, as described for example in Fig. 3 shown, necessary.

[0026] In order to prevent the laminating plates 320 from sticking to the device 100 during lamination, release films 310 are arranged on the top and bottom of the device 100.

[0027] The Fig. 4 shows a device 400 comprising a carrier 110 with a layer of active thermosetting adhesive 120A with embedded metal wire 140. The layer of active thermosetting adhesive 120A is fully cured after the lamination step and the metal wire 140 is stably and durably bonded to the carrier 110.

[0028] The device 400 can be used, for example, in a contactless RFID / NFC chip card or a dual interface chip card or in their manufacturing processes.

[0029] Alternatively, the Fig. The device 100 shown in Figure 2, comprising a carrier 110 with a layer of reactive thermosetting adhesive 120 with embedded metal wire 140, can also be used directly in chip card production.

[0030] The Fig.5, for example, shows a lamination process or a lamination process step for a chip card 500 with a device 100. In this case, an additional adhesive layer 520 is applied beforehand to the underside of the device 100. The adhesive layer 520 can, for example, also consist of a layer of reactive thermosetting adhesive.

[0031] Through the lamination process, additional chip card layers 550 can be bonded to the top and / or bottom of the device 100. The chip card layers 550 can also comprise or consist of environmentally friendly and / or renewable materials, such as paper, wood and / or a recycled material and / or a composite material.

Claims

[1] Method for applying and fixing a metal wire (140) to a support (110), • Applying a layer of reactive thermosetting adhesive (120) to a carrier (110); • Placing the metal wire (140) on the layer of reactive thermosetting adhesive (120); • Embedding the metal wire (140) in the layer of reactive thermosetting adhesive (120) by heating the reactive thermosetting adhesive (120), thereby activating the reactive thermosetting adhesive (120); and • Curing the activated thermosetting adhesive (120) so that the metal wire (140) is fixed in the layer of reactive thermosetting adhesive (120). [2] The method of claim 1, wherein the metal wire (140) is embedded in the layer of reactive thermosetting adhesive (120) by coupling energy into the metal wire (140). [3] The method of claim 2, wherein the metal wire (140) is embedded in the layer of reactive thermosetting adhesive (120) by coupling energy into the metal wire (140) by means of ultrasound. [4] Method according to one of claims 1 to 3, wherein the carrier (110) is made of an environmentally friendly and / or renewable materials such as paper, wood and / or recycled material and / or a composite material. [5] A method according to any one of claims 1 to 4, wherein an antenna structure is formed from the metal wire (140). [6] Device (100) comprising • a carrier (110); • a layer of reactive thermosetting adhesive (120) on the carrier (110); • a metal wire (140) on the layer of reactive thermosetting adhesive (120); • wherein the metal wire (140) is embedded in the layer of reactive thermosetting adhesive (120). [7] The device (100) according to claim 6, wherein the metal wire (140) is an antenna structure. [8] Device (100) according to one of claims 6 to 7, wherein the metal wire (140) is made of copper or a copper alloy. [9] Device (100) according to one of claims 6 to 8, wherein the carrier (110) is made of an environmentally friendly and / or renewable material, such as paper, wood and / or recycled material and / or a composite material. [10] Device (100) according to one of claims 6 to 9, wherein the layer of reactive thermosetting adhesive (120) is < 20µm thick. [11] Chip card comprising a device (100) according to one of claims 6 to 10.

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