Camera for a motor vehicle and method for mounting a camera

Abstract

A camera (100) for a motor vehicle, comprising a camera housing (106) with a lens (101) fixed to the camera housing (106); a circuit board (104) with an image sensor (105) arranged on the circuit board (104), wherein the image sensor (105) faces the lens (101) and is optically aligned therewith; and a carrier element (109) which is fastened to the circuit board (104) on a side of the circuit board (105) facing away from the image sensor (105), and wherein the carrier element (109) has a flat plate (303) which is formed parallel to the circuit board (104). The camera further comprises at least two spacer elements (201) by means of which the carrier element (109) is fastened to the circuit board (104) at a distance from the circuit board (104).The support element (109) has at least two resilient tabs (110) arranged in a direction perpendicular to an optical axis (203) of the camera (100), which are arranged on an outer edge of the flat plate (303) of the support element (109). The resilient tabs (110) are each arranged in a pressing manner at contact points (202) of the camera housing (106) and are each secured to the camera housing (106) at the contact points (202) by means of laser welds (501).

Description

[0001] The present invention relates to a camera for a motor vehicle and a method for mounting a camera according to the independent claims. State of the art

[0002] The assembly of common cameras often follows the following procedure: first, an image sensor is mounted on a circuit board, and a lens holder is glued to the circuit board. This is usually followed by positioning and securing a lens in the lens holder. The lens is actively aligned with the image sensor and permanently fixed in the focused position using an adhesive bond.

[0003] An alternative to this, without adhesive bonds, is known from DE 10 2022 211 411. This discloses a camera for a motor vehicle, comprising a lens with at least one optical lens; a camera housing, wherein the lens is fixed to the camera housing; a circuit board with an image sensor arranged on the circuit board, wherein the image sensor faces the lens and is optically aligned with it. The camera further comprises a carrier element, which is fastened to the circuit board on a side of the circuit board facing away from the image sensor by means of at least one soldered connection, and wherein the carrier element is designed such that a gap is formed between the camera housing and the carrier element; and at least one gap bridging element, which is fastened at contact points to the carrier element and at contact points to the camera housing by means of laser welds.

[0004] The object of the present invention is to provide a further alternative for a camera without adhesive connections. Disclosure of the invention

[0005] The present invention is based on a camera for a motor vehicle comprising a camera housing with a lens fixed to the camera housing; a circuit board with an image sensor arranged on the circuit board, wherein the image sensor faces the lens and is optically aligned therewith; and a carrier element which is fastened to the circuit board on a side of the circuit board facing away from the image sensor, and wherein the carrier element has a flat plate which is formed parallel to the circuit board.

[0006] According to the invention, the camera further comprises at least two spacer elements by means of which the carrier element is fastened to the circuit board at a distance from the circuit board; and wherein the carrier element has at least two tabs which are resilient in a direction perpendicular to an optical axis of the camera and which are arranged on an outer edge of the flat plate of the carrier element; and wherein the resilient tabs are each arranged in a pressing manner at contact points of the camera housing and are fastened to the camera housing at the contact points by means of laser welds.

[0007] A lens can be screwed into the camera housing for fixation. Alternatively, the camera can have at least one welded or soldered connection for fixing the lens to the camera housing. The lens can have at least one optical lens. Multiple optical lenses can be designed as a lens stack. The at least one optical lens can be arranged in a lens housing (lens housing). In this case, the lens housing is fixed to the camera housing. Alternatively, the camera housing and the lens housing can be connected to one another as a one-piece component. In this case, the at least one lens of the lens is arranged in a region of the camera housing provided for this purpose.

[0008] The camera may further include a housing cover. The housing cover may be connected to the camera body on a side of the camera body facing away from the lens. The camera body and the housing cover may be connected to each other in such a way that the camera is protected from the ingress of media from the camera's environment. The camera body and the housing cover may be connected to each other by a material fit or a form fit.

[0009] The circuit board is particularly designed to accommodate the image sensor and the at least two spacer elements. The circuit board can accommodate additional components, such as a camera connector, as well as other electronic components. The fact that the image sensor is aligned with the lens means, in particular, that the image sensor is positioned in the camera housing during a camera assembly process in such a way that images projected onto the image sensor through the lens have the best possible quality.

[0010] The camera described here can, in particular, also have an electrical connector designed to electrically connect the circuit board. In this case, the flat plate of the support element can have an opening through which the connector protrudes.

[0011] The flat plate of the support element can in particular be understood as a stable region of the support element. The resilient tabs of the support element can in particular be understood as a flexible region of the support element. The flat plate can be square or polygonal. This is particularly the case if the camera housing and / or the circuit board is / are also square or polygonal. In this case, the outer edge of the flat plate can have four or more outer edges. The resilient tabs can be arranged on the outer edges. Alternatively, the flat plate can also be round. This is particularly the case if the camera housing is also round. In this case, the resilient tabs can be distributed around the outer edge of the flat plate.

[0012] During camera assembly, the at least two spacer elements can be moved at contact points on the support element during optical alignment along a first axis (image vertical, X-axis) and a second axis (image horizontal, Y-axis) of the image sensor to the lens. After optical alignment, the at least two spacer elements can be fixed at the contact points on the support element.

[0013] When mounting the camera, the support element can also be moved within the camera housing by means of the spring-loaded tabs for optical alignment along a third axis (focusing, Z-axis) and along a first rotation axis (rotation of the image sensor around the image vertical, X_rot) and a second rotation axis (rotation of the image sensor around the image horizontal, Y_rot).

[0014] The advantage of the invention is that the carrier element allows easy alignment of the image sensor to the lens during camera assembly. The spring-loaded tabs enable contact between the carrier element and the camera housing. Due to the flexibility of the spring-loaded tabs, the carrier element and thus also the circuit board with the image sensor can be aligned easily and precisely during assembly. The laser-welded connections at the contact points enable good and long-lasting fixation. Adhesive connections in the camera can be avoided. Adhesive connections have the disadvantage of unfavorable behavior due to expansion under temperature fluctuations, swelling due to moisture and / or aging of their properties over time. By avoiding such adhesive connections in the camera presented here, it is possible to maintain a constant optical alignment of the image sensor to the lens.For example, a change in the distance between the image sensor and the lens, and the associated focus loss, can be avoided even in the face of temperature fluctuations, humidity, or over time. The connections between the lens and the camera body, as well as between the circuit board and the support element and the camera body, are designed to be very robust in the camera presented here.

[0015] In an advantageous embodiment, the camera housing has tapered portions at the contact points. The advantage of this design is that the formation of the laser welded joints at the contact points is simplified during camera assembly. Due to the tapered portions of the camera housing, the heat from a laser during welding can more easily reach the contact points between the spring-loaded tabs and the camera housing.

[0016] In a further advantageous embodiment, the spacer elements are connected to the circuit board in a material-to-material or form-fitting manner. A material-to-material connection can be, for example, a soldered or welded connection. A form-fitting connection can be, for example, a riveted connection. The advantage of this embodiment is that an adhesive connection can be avoided at this point on the camera as well.

[0017] In a further advantageous embodiment, the spacer elements are each attached to the support element by means of laser-welded connections. The spacer elements are attached to the support element, particularly at contact points with the support element. The advantage of this embodiment is that adhesive connections can be avoided at this point on the camera as well.

[0018] The invention further relates to a method for assembling a camera, comprising the following steps: providing a first subassembly comprising a camera housing and a lens fixed to the camera housing; providing a second subassembly comprising a printed circuit board with an image sensor arranged on the printed circuit board and a carrier element arranged on a side of the printed circuit board facing away from the image sensor, wherein the carrier element is arranged at a distance from the printed circuit board by means of at least two spacer elements, and wherein the carrier element has a flat plate and the flat plate is formed parallel to the printed circuit board, and wherein the carrier element has at least two tabs which are resilient in a direction perpendicular to an optical axis of the camera to be mounted and which are arranged on an outer edge of the flat plate of the carrier element;Inserting the second subassembly into the camera housing of the first subassembly, with the image sensor facing the lens, and with the resilient tabs each pressing against contact points of the camera housing; optically aligning the image sensor with the lens; attaching the spacer elements to the support element; and attaching the resilient tabs to the contact points by means of laser welding.

[0019] In particular, in the method for assembling the camera, the at least two spacer elements are moved along a first axis (image vertical, X-axis) and a second axis (image horizontal, Y-axis) of the image sensor to the lens at contact points on the support element during the optical alignment step. After the optical alignment, the at least two spacer elements are fixed at the contact points on the support element.

[0020] In particular, in the method for assembling the camera, the carrier element is further displaced in the optical alignment step by means of the resilient tabs along a third axis (focusing, Z-axis) and along a first rotation axis (rotation of the image sensor about the image vertical, X_rot) and a second rotation axis (rotation of the image sensor about the image horizontal, Y_rot) within the camera housing.

[0021] During the step of optically aligning the image sensor to the lens, the image sensor is advantageously actively operated, with the resulting image of the test image captured over the fixed lens being automatically evaluated for sharpness in various image sections and for various positions. The final positioning of the image sensor is performed based on the contrast gradients determined by image processing. The final positioning of the image sensor is performed such that a predefined image quality criterion is met across the entire image field. The optical alignment is preferably performed using a computer-controlled mechanical adjustment unit.

[0022] The advantage of the invention is that the carrier element allows for easy alignment of the image sensor to the lens during assembly. The spring-loaded tabs ensure contact between the carrier element and the camera housing. Due to the flexibility of the spring-loaded tabs, the carrier element, and thus also the circuit board with the image sensor, can be easily and precisely aligned during assembly. Laser-welded connections at the contact points ensure a secure and long-lasting fixation. Adhesive bonds in the camera can be avoided.

[0023] Using the process described here, a camera as described above can be manufactured.

[0024] In an advantageous embodiment, it is provided that the spacer elements are fastened at contact points to the carrier element by means of laser welding connections.

[0025] It is understood that the features mentioned above and those to be explained below can be used not only in the combination specified in each case, but also in other combinations or on their own, without departing from the scope of the present invention. Drawings

[0026] Embodiments of the present invention are explained in more detail below with reference to the accompanying drawings. Like reference numerals in the figures denote like or equivalent elements. They show: Fig. 1 an embodiment of a camera in a half-section view; Fig. 2 the embodiment of the camera in a sectional view; Fig. 3 an embodiment of a second subassembly; Fig. 4 an embodiment of the optical alignment and fastening of the spacer elements to the carrier element; Fig. 5 an embodiment of the optical alignment and fastening of the resilient tabs at the contact points.

[0027] Fig. 1 shows an embodiment of a camera 100 in a half-section view. Fig. 2 shows the same embodiment in a sectional view.

[0028] The camera 100 comprises the camera housing 106 with the lens 101 fixed to the camera housing 106. In this example, the lens 101 comprises the lens stack 101, which is arranged in the lens housing 102. The camera 100 also comprises the printed circuit board 104. The image sensor 105 is arranged on the printed circuit board 104. The image sensor 105 faces the lens 101 and is optically aligned with it. The camera 100 also comprises a carrier element 109, which is fastened to the printed circuit board 104 on the side of the printed circuit board 104 facing away from the image sensor 105. In the example shown here, the connector 108 is also arranged on the side of the printed circuit board 104 facing away from the image sensor 105. The connector 108 protrudes through a recess in the carrier element 109. The camera 100 shown here also has the housing cover 107. This also includes a recess through which the connector 108 protrudes into the exterior of the camera 100.

[0029] The support element 109 has at least two resilient tabs 110 oriented perpendicular to the optical axis 203 of the camera 100. The resilient tabs 110 press against the camera housing 106 at contact points 202. At the contact points 202, the resilient tabs 110 are also each secured to the camera housing 106 by laser welding. The camera housing 106 also has tapered portions 111 at the contact points 202.

[0030] In Fig. 2 shows that the camera 100 further comprises at least two spacer elements 201. The support element 109 is secured at a distance from the circuit board 104 by means of the spacer elements 201. The spacer elements 201 can be connected to the circuit board 104 in a materially bonded or form-fitting manner. Furthermore, the spacer elements 201 can each be secured to the support element 109 by means of laser-welded connections.

[0031] Fig. 3 shows an embodiment of a second sub-assembly, as it is used in the partially Fig. 4 and Fig. 5 is used to assemble a camera described above. In other words, the second subassembly can be considered as part of the Fig. 1 and Fig. 2 shown camera 100.

[0032] The second subassembly comprises the circuit board 104 and an image sensor (not visible here) arranged on the circuit board 104. However, the support element 109 arranged on the side of the circuit board 104 facing away from the image sensor is visible. The support element 109 has the flat plate 303, which is parallel to the circuit board 104. The flat plate 303 from the present example has a square base. In the example shown here, four resilient tabs 110-1 to 110-4 are arranged on the outer edge of the flat plate 303. In each case, one resilient tab 110-1 to 110-4 is arranged on an outer edge of the square flat plate 303. Each of the four outer edges of the flat plate 303 has a recess 302-1 to 302-4 in which the respective tab 110-1 to 110-4 is arranged. One of the resilient tabs 110-1 to 110-4 protrudes from each recess 302-1 to 302-4.As a result, a distance between the resilient tabs 110-1 to 110-4 and the contact points 202 on the camera housing 106 can advantageously be designed such that the resilient tabs 110-1 to 110-4 press against the contact points 202 with sufficient pressure, but also allows for displacement of the carrier element 109 during optical alignment. In the example shown here, the end of each resilient tab 110-1 to 110-4 protrudes beyond the flat plate 303, pointing away from the circuit board 104. This allows the contact points 202 to be sufficiently far away from the circuit board 104 so that the latter is not impaired during the formation of the laser-welded connections.

[0033] The pre-assembly further comprises the four spacer elements 201-1 to 201-4. It can also be seen that the support element 109 has a recess 301 in the center, through which a connector 108 protrudes from the circuit board 104.

[0034] In a method for assembling a camera 100 as described above, one step is the optical alignment of the image sensor 105 to the lens 101. This optical alignment can comprise two sub-steps, which are described below in the Fig. 4 and Fig. 5 are described.

[0035] Fig. 4 shows an embodiment of the optical alignment and fastening of the spacer elements 201 to the carrier element 109. In particular, Fig. 4 a partial step of the optical alignment. The Fig. Figure 4 shows a section of the assembly process for a camera described above. A second subassembly, such as that used in Fig. 3, is introduced into a first subassembly comprising a camera housing 106 and a lens 101 fixed to the camera housing. The resilient tabs 110 of the carrier element 109 each press against contact points 202 of the camera housing 106. The spacer elements 201 and thus the circuit board 104 fastened thereto with the image sensor 105 are still movable at this stage of the method. The spacer elements 201 are not yet fastened to the carrier element 109. Rather, the spacer elements 201 can each be displaced in a recess 401 of the carrier element 109. In order to align the image sensor 105 with the lens 101, the spacer elements 201 and thus the circuit board 104 fastened thereto with the image sensor 105 can be displaced along a first axis (X-axis) and along a second axis (Y-axis) of the image sensor. This is symbolized by the double arrow marked X, Y.The alignment along these two axes can then be fixed by attaching the spacer elements 201 to the support element 109. For this purpose, the spacer elements 301 can each be attached to the support element 109 by means of a laser weld.

[0036] Fig. Figure 5 shows an embodiment of the optical alignment and fastening of the resilient tabs 110 to the contact points 202. In particular, Fig. 5 a sub-step of the optical alignment. The sub-step shown here can, for example, be added to the sub-step from Fig.4. Due to the flexibility of the resilient tabs 110, the support element 109, and thus also the circuit board 104 with the image sensor 105, can be aligned during the method for assembling a camera 100 described above. The support element 109 is initially still movable at this stage of the method. Thus, in this sub-step, the support element 109 can be displaced within the camera housing 106 by means of the resilient tabs 110 along a third axis (Z axis) and along a first rotation axis (X_rot) and a second rotation axis (Y_rot).

[0037] This is symbolized by the double arrow marked Z, X_red, and Y_red. The alignment along these axes can subsequently be fixed by attaching the resilient tabs 110 to the contact points 202. For this purpose, the resilient tabs 110 can each be attached to the contact points 202 using a laser weld connection 501. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2022 211 411

[0003]

Claims

[1] Camera (100) for a motor vehicle comprising: • a camera body (106) with a lens (101) fixed to the camera body (106); • a circuit board (104) with an image sensor (105) arranged on the circuit board (104), wherein the image sensor (105) faces the lens (101) and is optically aligned therewith; and • a carrier element (109) which is fastened to the circuit board (104) on a side of the circuit board (105) facing away from the image sensor (105), and wherein the carrier element (109) has a flat plate (303) which is formed parallel to the circuit board (104); characterized by , that • the camera (100) further comprises at least two spacer elements (201) by means of which the carrier element (109) is fastened to the circuit board (104) at a distance from the circuit board (104); and wherein • the support element (109) has at least two resilient tabs (110) in a direction perpendicular to an optical axis (203) of the camera (100), which are arranged on an outer edge of the flat plate (303) of the support element (109); • and wherein the resilient tabs (110) are each arranged in a pressing manner at contact points (202) of the camera housing (106) and are each fastened to the camera housing (106) at the contact points (202) by means of laser welding connections (501). [2] Camera (100) according to claim 1, wherein the camera housing (106) has tapers (111) at the contact points (202). [3] Camera (100) according to one of the preceding claims, wherein the spacer elements (201) are connected to the circuit board (104) in a materially or positively locking manner. [4] Camera (100) according to one of the preceding claims, wherein the spacer elements (201) are each fastened to the support element (109) by means of laser welding connections (402). [5] A method for mounting a camera comprising the steps of: • Providing a first subassembly comprising a camera body and a lens fixed to the camera body; • Providing a second subassembly comprising a circuit board with an image sensor arranged on the circuit board and a carrier element arranged on a side of the circuit board facing away from the image sensor, wherein the carrier element is arranged at a distance from the circuit board by means of at least two spacer elements, and wherein the carrier element has a flat plate and the flat plate is formed parallel to the circuit board, and wherein the carrier element has at least two tabs which are resilient in a direction perpendicular to an optical axis of the camera to be mounted and which are arranged on an outer edge of the flat plate of the carrier element; • Inserting the second subassembly into the camera housing of the first subassembly, with the image sensor facing the lens, and with the resilient tabs each pressing against contact points of the camera housing; • Optical alignment of the image sensor to the lens; • Attaching the spacer elements to the support element; and • Fastening the spring-loaded tabs to the contact points using laser welding. [6] Method according to claim 5, wherein the spacer elements are fastened at contact points to the carrier element by means of laser welding connections.

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