Cleaning procedure for cleaning an application valve

Abstract

The present invention relates to a cleaning method for cleaning an electromagnetic application valve (12) with a dispensing opening that can be converted from a closed state to an open state by means of an electrical control signal from a control device for dispensing flowable application medium (14), preferably adhesive, onto a substrate, in particular after a (prolonged) standstill of the application valve (12), wherein the cleaning method for rinsing the application valve (12) comprises one or more high-frequency rinsing phases (F), in each of which a plurality of individual, separate medium portions of a rinsing medium (14) supplied to the application valve (12), preferably of the application medium (14) used as the rinsing medium (14), are dispensed from the dispensing opening of the application valve (12) by means of a high-frequency pulse sequence of control signals, as well as one or more rest phases for cooling the application valve (12), in which no rinsing medium (14) is dispensed.The cleaning method is characterized in that after a high-frequency rinsing phase (F) a continuous rinsing phase (D) takes place, in which rinsing medium (14) is continuously discharged from the application valve (12) to rinse the application valve (12).

Description

[0001] The present invention relates to a cleaning method for cleaning an electromagnetic application valve with a dispensing opening that can be changed from a closed state to an open state by means of an electrical control signal from a control device for dispensing flowable application medium, preferably adhesive, onto a substrate, in particular after a (longer) standstill of the application valve, wherein the cleaning method for rinsing the application valve comprises one or more high-frequency rinsing phases, in each of which a plurality of individual, separate medium portions of a rinsing medium supplied to the application valve, preferably of the application medium used as the rinsing medium, are dispensed from the dispensing opening of the application valve by means of a high-frequency pulse sequence of control signals, as well as one or more rest phases for cooling the application valve, in which no rinsing medium is dispensed.

[0002] Electromagnetic application valves for applying adhesive to substrates are frequently used in packaging machines, among other applications. For example, such application valves are used to apply portions of adhesive to the folding flaps of package blanks in order to bond them to other folding flaps or other parts of the respective package blank. Such application valves require frequent cleaning. High-frequency purging phases are known for this purpose. During these high-frequency purging phases, the adhesive supplied to the application valves is dispensed from the application valve at high frequency, thus "clearing" the application valve of any adhesive residue. In other words, the application valve is opened and closed at high frequencies during these high-frequency purging phases.

[0003] Since the application valve heats up considerably during this process, longer cooling phases are required between each high-frequency flushing phase. Furthermore, the high-frequency flushing phases cause significant wear on the valve components due to the high number of opening and closing movements of the application valve. Finally, the high-frequency flushing phases are either impossible or almost impossible to remove air pockets in the valve body and / or the supply lines.

[0004] Based on this state of the art, the object of the present invention is to further develop the cleaning method mentioned at the outset.

[0005] This object is achieved by a cleaning method having the features of claim 1.

[0006] Accordingly, the cleaning method according to the invention is characterized in that after a high-frequency rinsing phase, a continuous rinsing phase takes place in which rinsing medium is continuously discharged from the application valve to rinse the application valve.

[0007] In such a continuous flushing phase, the application valve is not opened and closed at high frequency, as is the case in the high-frequency flushing phase, but rather remains continuously open for the predetermined duration of this continuous flushing phase. The duration of the application valve's opening during the continuous flushing phase corresponds to a multiple of the duration of the application valve's opening in each individual opening phase in the high-frequency flushing phase.

[0008] The continuous flushing phase provided according to the invention, in combination with the high-frequency flushing phase, has multiple advantages. It reduces wear on the application valve, since no high-frequency opening of the valve occurs or is required during the continuous flushing phase. Furthermore, this allows air ingress from the application valve and / or the supply lines to be removed. Finally, rest phases can be shorter than if a high-frequency flushing phase were used instead of the continuous flushing phase, since the application valve heats up significantly less during such a continuous flushing phase than during a high-frequency flushing phase.

[0009] Overall, this results in a highly efficient cleaning process that also reduces wear.

[0010] As for the flushing medium used for the flushing processes according to the invention, it can be provided that the application medium itself, which is already supplied to the application valve, is used for this purpose. In the case of adhesive valves or application valves that use liquid adhesive, such as hot melt or hot melt adhesive or even cold adhesive, the adhesive itself could be used as the flushing medium. However, it is also entirely within the scope of the invention to use a different fluid medium as the flushing medium instead of the application medium actually used, or any other suitable fluid medium.

[0011] According to the invention, even with the intended additional use of a continuous rinsing phase, it can further be provided to provide a rest phase between two consecutive high-frequency rinsing phases, preferably between each pair of consecutive high-frequency rinsing phases, during which no rinsing medium is dispensed from the dispensing opening. This rest phase could then be provided in particular after one or the continuous rinsing phase.

[0012] Furthermore, for the rest phases provided for in the cleaning method according to the invention, it is expedient that the control device does not generate any control signals that transfer the dispensing opening from the closed state to the open state during the rest phase(s).

[0013] As regards the at least one high-frequency rinsing phase, one, the or each high-frequency rinsing phase may comprise several high-frequency pulse sequences of control signals or control signal pulses, which are then each separated from one another by a pause time.

[0014] In particular, the duration of the respective pause time can be several times or many times longer than the duration between two adjacent control signals of a single pulse sequence.

[0015] Preferably, each pause time can have at least a time duration that is equal to or greater than the total time duration of the respective preceding high-frequency pulse sequence of control signals.

[0016] One or each pulse sequence of control signals of the or each high-frequency rinsing phase may preferably have a frequency of at least 150 Hz, preferably of at least 250 Hz.

[0017] The duration of the pause time between adjacent high-frequency pulse sequences of control signals of the or each high-frequency purging phase may be at least 200 ms seconds.

[0018] By one or each pulse sequence of control signals, at least 40, preferably at least 50 separate medium portions can be dispensed, preferably within a maximum of 300 ms, particularly preferably within a maximum of 200 ms.

[0019] Furthermore, it can advantageously be provided that the pressure of the supplied flushing medium is varied during the continuous flushing phase in order to generate pressure surges.

[0020] Furthermore, it can advantageously be provided that, in the closed state of the dispensing opening of the application valve, a closure member which is in a closed position and is acted upon by a closing force of a return member closes the dispensing opening, and that the dispensing opening is transferred into the open state by the closure member being moved from the closed position into an open position by the magnetic opening force of one or the electromagnet of the application valve, overcoming the closing force of the return member.

[0021] In the continuous purge phase, the control signal of the control device controlling the electric current in the coil of the electromagnet can be selected such that in an opening phase of the closure member, a higher opening current is set in the coil, transferring the closure member from the closed position to the open position, and in a second holding phase, a lower holding current is set, holding the closure member in one or the open position.

[0022] The cleaning process may also comprise one or more cleaning cycles. In particular, each cycle may comprise at least one high-frequency rinsing phase, at least one continuous rinsing phase, and at least one rest phase.

[0023] Particularly preferably, the application valve can be a component of a packaging machine for producing packages for, in particular, smokable products, preferably tobacco products. The cleaning process is preferably carried out after a shutdown of the packaging machine and / or the application valve, in particular before the packaging machine is transferred to normal operation.

[0024] The number of cleaning cycles comprising the cleaning process can preferably be selected depending on the downtime of the packaging machine and / or the application valve and / or depending on one or more other machine parameters of the packaging machine and / or the application valve.

[0025] Furthermore, it can be provided that the number of high-frequency pulse sequences of control signals of each high-frequency rinsing phase of one or each cleaning cycle and / or the duration of the respective pause time between adjacent, high-frequency pulse sequences of control signals and / or the frequency of the control signals of the or each pulse sequence of control signals of one or each cleaning cycle is selected depending on the downtime of the packaging machine and / or depending on one or more other machine parameters of the packaging machine.

[0026] It is also conceivable that the number and / or duration of continuous rinsing phases and / or rest phases of one or each cleaning cycle is selected depending on the downtime of the packaging machine and / or depending on one or more other machine parameters of the packaging machine.

[0027] Preferably, during normal operation of the packaging machine and / or the application valve, a continuous rinsing phase can take place cyclically, in particular after a predetermined period of time has elapsed and / or after completion of a working cycle of the packaging machine and / or the application valve, or several continuous rinsing phases can take place, each separated by a rest phase.

[0028] It is also conceivable that during normal operation of the packaging machine and / or the application valve, a high-frequency rinsing phase takes place cyclically, in particular after a predetermined period of time has elapsed and / or after the end of a working cycle of the packaging machine and / or the application valve.

[0029] Further preferably, the application valve can be moved from a working position in which the application medium can be applied to a substrate or the substrate, into a cleaning position, wherein the rinsing of the application valve then takes place in the continuous rinsing phase(s) and / or in the high-frequency rinsing phase(s) in this cleaning position.

[0030] It can further preferably be provided that the application valve can be moved from a working position in which the application medium can be applied to the substrate into a rest position in which the application valve, in particular a front (nozzle) section thereof comprising the dispensing opening, rests against a sponge roller to prevent the application medium from drying out, wherein the application valve is moved into the rest position before or after the application valve is rinsed in the continuous rinsing phase(s) and / or in the high-frequency rinsing phase(s).

[0031] Further features of the present invention emerge from the appended patent claims, the following description of preferred embodiments and the appended drawings.

[0032] It shows: Fig. 1 a schematic diagram of two application valves of a packaging machine which can be flushed by means of the cleaning method according to the invention, in which adhesive is used both as the flushing medium and as the application medium, each in a working or application position 1, in a cleaning position 2 and in a rest position 3 of the respective application valve, Fig. 2 a diagram of the time course of control signals of an application valve for hot melt adhesive during cleaning cycles Z of the application valve during a switch-on process E of the packaging machine after a longer machine stop as well as during normal operating cycles A after a longer standby S1 of the machine or after a shorter standby S2, Fig. 3 a diagram of the time course of control signals of an application valve for cold adhesive during cleaning cycles Z of the application valve during a switch-on process E of the machine after a longer machine stop as well as during normal operating cycles A after a longer standby S1 of the machine or after a shorter standby S2, Fig. 4 a section of the diagram according to Fig. 2 in detailed, enlarged form, namely a selected cleaning cycle Z, and below it a diagram showing the pressure of the supplied adhesive used during the cleaning cycle Z as a function of time, Fig. 5 Excerpts from the diagram according to Fig. 3 in detailed, enlarged form, namely the control signals during a selected cleaning cycle Z and during a selected normal operating cycle A, and below that a diagram in which the current positions 1, 2 and 3 in which the application valve is located during these cycles are shown as a function of time.

[0033] The Fig. 1, the adhesive application station 10 shown as an example and in detail serves to apply individual portions of fluid application medium, here adhesive, to a substrate 11, for example, to a blank for producing a pack for cigarettes or other products of the tobacco industry. Such a station can be part of a higher-level machine, for example, part of a corresponding packaging machine for producing such packs (not shown).

[0034] In the present case, the station 10 has two opposing electromagnetic or electromagnetically operated application valves 12. Such valves generally have an electromagnet with a current-carrying coil and a closure member which closes the dispensing opening 13 of the application valve 12, which is often arranged at the free end of a dispensing nozzle 16 and which is or can be moved by the magnetic field generated or generateable by the electromagnet.

[0035] In this case, such a movable closure element, which often acts as an armature of the electromagnet, closes the dispensing opening of the respective application valve in a closed position, in which it is further loaded by a return element, such as a spring or repelling permanent magnets, with a (mechanical or magnetic) closing force which holds the closure element in position or closed position.

[0036] From this closed position, the closure member can be moved into an open position, releasing the dispensing opening, by appropriately controlling the electromagnet, which causes an electric current in its coil that generates a magnetic opening force.

[0037] The application valve or its electromagnet is controlled by a suitable control device. The control signals are usually (electrical) voltage signals, which then generate the corresponding electrical (opening) currents in the coil of the electromagnet, which cause the respective magnet opening force.

[0038] In the Fig. The application valves 12 shown in Figure 1 can be so-called cold adhesive valves, to which cold adhesive is supplied as the application medium 14, or so-called hot adhesive valves, to which hot adhesive (hot melt) is supplied. It is understood that the cleaning method according to the invention can also be used to clean other types of electromagnetic application valves that use other application media.

[0039] As can be seen, the application valves 12 can be Fig. 1 by means of suitable mechanics from a working or application position 1, in which they can apply the application medium 14 to the substrate, into a cleaning or rinsing position 2 or, in the present case, pivoted about a pivot axis 15, in which they can then be cleaned by rinsing processes described in more detail later, in particular by repeatedly or cyclically dispensing a rinsing medium that is supplied to the application valve 12 or is already contained in the application valve 12 from the application valve 12, taking with it application medium residues that may be located within the application valve 12.

[0040] In the cleaning position 2, the respective application valve 12 is located in the present case above a collecting tray 21 for the rinsing medium used during the cleaning process, which is then dispensed from the dispensing opening 13 during the respective rinsing process.

[0041] The application valves 12 can furthermore be pivoted into a rest position 3, in which the respective application valve 12, in particular a front (nozzle) section thereof comprising the dispensing opening 13, rests against a sponge roller 17 to prevent the application medium from drying out.

[0042] The present application valves 12 are cleaned in a special way to remove adhesive residues or to reduce or remove air pockets in their lines. As mentioned, the relationships described in this application can also be applied to other application valves.

[0043] Fig. Figure 2 shows various machine cycles of a packaging machine with application valves 12 designed as hot melt valves. After a lengthy machine stoppage, it is assumed that there are adhesive residues in the area of the dispensing opening 13, some of which may already have set and must be removed accordingly. Furthermore, there is the possibility of air pockets in the respective application valve 12. For this reason, the respective application valve 12 (usually all application valves 12 of station 10 simultaneously) is automatically cleaned as part of a switch-on process E before the packaging machine is started up or before the packaging machine is transferred to normal operation in which the substrates 11 are provided with application medium portions or adhesive portions by the respective application valve 12. It is cleaned by being rinsed in a special way using a rinsing medium (one or more times).In the present case, the application medium 12 itself is used as the flushing medium, i.e., the adhesive supplied to the application valve 12. However, it is understood that a flushing medium other than the application medium 12 could also be used.

[0044] In this case, several cleaning cycles Z are carried out (but at least one cleaning cycle Z). A cleaning cycle Z initially comprises a high-frequency rinsing phase F to "clear" the area of the dispensing opening 13. Each high-frequency rinsing phase F comprises - but this does not have to be the case - several separate high-frequency pulse sequences 18 of control signals or control signal pulses 19 for the respective application valve 12, with each individual control signal pulse 19 leading to a brief opening of the application valve 12 by a corresponding magnetic force-induced movement of the closure member, followed by a closing process caused by the restoring force of the return member.

[0045] The individual adjacent high-frequency pulse sequences 18 of a high-frequency rinsing phase F (in Fig. 4, three pulse sequences 18 can be seen in succession) are separated from each other by a pause time 20 for the interim cooling of the application valve 12 and, if necessary, for controlling the average frequency of the high-frequency rinsing phase F, during which the application valve 12 is closed and, accordingly, no control signal is generated.

[0046] As can be seen, the duration of the respective pause time 20 is (significantly or a multiple) longer than the duration between two individual, temporally adjacent control signal pulses 19 of an individual pulse train 18, wherein preferably each pause time 20 has at least a duration which is equal to or longer than the total duration of the respectively preceding high-frequency pulse train 18 of control signals.

[0047] Advantageously, in this case, each pulse train 18 of control signal pulses 19 has a frequency of, for example, 250 Hz, whereby a pulse train 18 can, for example, have a total duration of 200 ms. If, for example, a pulse train contains 50 control signal pulses 19 and each pause time 20 between adjacent high-frequency pulse trains is 200 ms, and such a pause time is also observed after the last pulse train, an average frequency of 125 Hz is achieved.

[0048] The cleaning cycle Z further comprises, in the present example, a continuous rinsing phase D to remove air inclusions, which in this case takes place after the high-frequency rinsing phase F.

[0049] In such a continuous rinsing phase D, the application valve 12 is not opened and closed at high frequency, as is the case in the high-frequency rinsing phase F, but remains continuously open during the predetermined period of time that this continuous rinsing phase D lasts.

[0050] As in Fig. 4, the time period for which the application valve 12 is open during the continuous flushing phase D is a multiple of the time period for which the application valve 12 is open in a respective individual opening phase in the high-frequency flushing phase F. In the present example, the continuous flushing phase is approximately 20 s to 30 s. However, this can of course be different.

[0051] It can be provided that in the continuous flushing phase D, the control signal of the control device controlling the electric current in the coil of the electromagnet is selected such that, in an (initial) opening phase of the closure member, a higher opening current is established in the coil, necessary for the initial opening movement and transferring the closure member from the closed position to the open position, and then, in a second holding phase, a lower holding current is established, holding the closure member in one or the open position. In this way, the total current intensity during the continuous flushing phase and therefore the heating of the application valve can be reduced compared to a control in which the higher opening current would be generated throughout the entire continuous flushing phase D.

[0052] Finally, the cleaning cycle Z further comprises a longer rest phase R after the continuous rinsing phase D, during which the application valve 12 is not activated and therefore not opened. In this way, or in this rest phase R, the application valve can cool down and "recover" from the previous continuous opening. In this phase R, the application valve 12 can, as shown in Fig. 4, can also be depressurized.

[0053] Analogous to the previous phase D, the rest phase R can also be 20 s to 30 s before the cleaning cycle Z is completed.

[0054] According to the invention, the cleaning cycle Z could be repeated several times in the switch-on phase E, for example for a period of 5 to 10 minutes.

[0055] As in Fig. 4 can also be seen, see the lower diagram, the pressure of the flushing medium can be varied to improve the flushing effect during the continuous flushing phase D, so that individual pressure pulses are emitted.

[0056] The number of cleaning cycles Z carried out and / or the number and / or sequence of the individual phases F, D and R etc. can advantageously be based on the previous downtime of the packaging machine and / or on other parameters of the packaging machine.

[0057] Once the switch-on process E has been completed with the execution of n cleaning cycles Z and the application valves 12 are thus cleaned and ready for use, the packaging machine can go into normal operation by carrying out work cycles A, in which, among other things, the regular application of the application medium portions to the substrate 11 takes place.

[0058] Should the machine then stop again or, for example, a longer standby phase S1 otherwise occur during normal operation, the application valve 12 can be cleaned regularly (for example every 20 minutes) by a single phase F of high-frequency pulses during this time, cf. Fig. 2, before the work cycles A begin again. The same can happen after a shorter standby phase S2, immediately before the machine resumes normal operation or a work cycle A begins.

[0059] The Fig. 3 and Fig. 5 show analogous to the Fig. 2 and Fig. 4 shows the time course of control signals for an application valve 12, but in this case a cold adhesive valve. The cleaning cycle Z is also divided into phases F, D and R. Unlike the cleaning process according to Fig. 2, however, due to the special characteristics of the cold adhesive, a high-frequency rinsing phase F is also provided as standard during normal operation in order to “clear” the application valve 12.

[0060] After each high-frequency rinsing phase F and before each high-frequency rinsing phase F, the application valve 12 is pivoted to the sponge roller 17, i.e. into the rest position 3, see also the lower diagram in Fig. 5. In this position, drying of the cold adhesive at the tip of the dispensing nozzle 16 is prevented.

[0061] Analogous to the application valve 12 for hot glue, the application valve 12 for cold glue is released again immediately before the resumption of the working cycle A after a shorter standby phase S2.

[0062] However, after a completed working cycle of the application valve 12, which is followed by a predetermined standby phase S2, a one-time or multiple post-rinsing CD takes place as standard and cyclically within the framework of a “forced cleaning”, cf. Fig. 3, whereby the heated cold adhesive is flushed out and does not set in the application valve 12 at all.

[0063] The intervals between these forced cleanings can vary greatly depending on the type of adhesive used. List of reference symbols: A working cycle CD Rinse phase D Continuous rinsing phase E Switch-on process F High-frequency rinsing phase R Rest phase S1 Standby S2 Standby Z cleaning cycle 10 stations 11 Substrat 12 Application valve 13 Dispensing opening application valve 14 Application and rinsing medium 15 Swivel axis 16 Dispensing nozzle 17 Sponge roller 18 pulse sequences 19 Control signal pulse 20 break time 21 drip tray

Claims

[1] Cleaning method for cleaning an electromagnetic application valve (12) with a dispensing opening that can be converted from a closed state to an open state by means of an electrical control signal from a control device for dispensing flowable application medium (14), preferably adhesive, onto a substrate, in particular after a (prolonged) standstill of the application valve (12), wherein the cleaning method for rinsing the application valve (12) comprises one or more high-frequency rinsing phases (F), in each of which, by means of a high-frequency pulse sequence of control signals, several individual, separate medium portions of a rinsing medium (14) supplied to the application valve (12), preferably of the application medium (14) used as the rinsing medium (14), are dispensed from the dispensing opening of the application valve (12), as well as one or more rest phases for cooling the application valve (12), in which no rinsing medium (14) is dispensed, characterized bythat after a high-frequency rinsing phase (F) a continuous rinsing phase (D) takes place, in which rinsing medium (14) is continuously dispensed from the application valve (12) to rinse the application valve (12). [2] Cleaning method according to claim 1, characterized by that between two successive high-frequency rinsing phases (F), preferably between each pair of successive high-frequency rinsing phases (F), there is a rest phase in which no rinsing medium (14) is dispensed from the dispensing opening, in particular after one or the continuous rinsing phase (D). [3] Cleaning method according to claim 1 or 2, characterized by that the control device does not generate any control signals that change the dispensing opening from the closed state to the open state during the rest phase(s). [4] Cleaning method according to one or more of the preceding claims, characterized bythat one, the or each high-frequency rinsing phase (F) consists of several high-frequency pulse sequences of control signals, each separated from one another by a pause time, the duration of which is (significantly) longer than the duration between two adjacent control signals of an individual pulse sequence, wherein preferably each pause time has at least a duration which is equal to or longer than the total duration of the respectively preceding high-frequency pulse sequence of control signals. [5] Cleaning method according to one or more of the preceding claims, characterized bythat one or each pulse sequence of control signals of the or each high-frequency rinsing phase (F) has a frequency of at least 150 Hz, preferably of at least 250 Hz, and / or that the duration of the pause time between adjacent high-frequency pulse sequences of control signals of the or each high-frequency rinsing phase (F) is at least 200 ms, and / or that at least 40, preferably at least 50 separate medium portions are dispensed by one or each pulse sequence of control signals, preferably within a maximum of 300 ms, particularly preferably within a maximum of 200 ms. [6] Cleaning method according to one or more of the preceding claims, characterized by that during the continuous flushing phase (D) the pressure of the supplied flushing medium (14) is varied to generate pressure surges. [7] Cleaning method according to one or more of the preceding claims, characterized bythat in the closed state of the dispensing opening of the application valve (12), a closure member which is in a closed position and is acted upon by a closing force of a return member closes the dispensing opening, and that the dispensing opening is transferred into the open state by the closure member being moved from the closed position into an open position by the magnetic opening force of one or the electromagnet of the application valve (12) while overcoming the closing force of the return member. [8] Cleaning method according to claim 7, characterized bythat in the continuous rinsing phase (D) the control signal of the control device controlling the electric current in the coil of the electromagnet is selected such that in an opening phase of the closure member a higher opening current is set in the coil, transferring the closure member from the closed position to the open position, and in a second holding phase a lower holding current is set, holding the closure member in one or the open position. [9] Cleaning method according to one or more of the preceding claims, characterized by that the cleaning process comprises one or more cleaning cycles, each comprising at least one high-frequency rinsing phase (F), at least one continuous rinsing phase (D) and at least one rest phase. [10] Cleaning method according to one or more of the preceding claims, characterized bythat the application valve (12) is a component of a packaging machine for producing packs for, in particular, smokable products, preferably for tobacco products, and that the cleaning process is carried out after a standstill of the packaging machine and / or the application valve (12), in particular before the packaging machine is transferred to normal operation. [11] Cleaning method according to claim 9 and 10, characterized by that the number of cleaning cycles comprising the cleaning method is selected depending on the downtime of the packaging machine and / or the application valve (12) and / or depending on one or more other machine parameters of the packaging machine and / or the application valve (12). [12] Cleaning method according to one or more of the preceding claims, at least according to claim 10, characterized bythat the number of high-frequency pulse sequences of control signals of each high-frequency rinsing phase (F) of one or each cleaning cycle and / or the duration of the respective pause time between adjacent, high-frequency pulse sequences of control signals and / or the frequency of the control signals of the or each pulse sequence of control signals of one or each cleaning cycle is selected depending on the downtime of the packaging machine and / or depending on one or more other machine parameters of the packaging machine, and / or that the duration of the continuous rinsing phase (D) and / or the rest phase of one or each cleaning cycle is selected depending on the downtime of the packaging machine and / or depending on one or more other machine parameters of the packaging machine. [13] Cleaning method according to one or more of the preceding claims, at least according to claim 10, characterized bythat during normal operation of the packaging machine and / or the application valve (12), a continuous rinsing phase (D) takes place cyclically, in particular after a predetermined period of time has elapsed and / or after the end of a working cycle (A) of the packaging machine and / or the application valve (12), or several continuous rinsing phases (D) are carried out, each separated by a rest phase, and / or that during normal operation of the packaging machine and / or the application valve (12), a high-frequency rinsing phase (F) takes place cyclically, in particular after a predetermined period of time has elapsed and / or after the end of a working cycle (A) of the packaging machine and / or the application valve (12). [14] Cleaning method according to one or more of the preceding claims, at least according to claim 10, characterized bythat the application valve (12) can be moved from a working position, in which the application medium (14) can be applied to a or the substrate, into a cleaning position, and that the rinsing of the application valve (12) takes place in the continuous rinsing phase(s) (D) and / or in the high-frequency rinsing phase(s) (F) in the cleaning position. [15] Cleaning method according to one or more of the preceding claims, at least according to claim 10, characterized bythat the application valve (12) can be moved from a working position in which the application medium (14) can be applied to the substrate, into a rest position in which the application valve (12), in particular a front (nozzle) section thereof comprising the dispensing opening, rests against a sponge roller to prevent the application medium (14) from drying on, and that the application valve (12) is moved into the rest position before or after rinsing the application valve (12) in the continuous rinsing phase(s) (D) and / or in the high-frequency rinsing phase(s) (F).

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