Electric light

Abstract

The invention relates to a luminaire (100) comprising: electrical lighting elements (20, 21), at least one circuit board (10) on which the electrical lighting elements (20, 21) are arranged, the circuit board (10) comprising conductive traces (50) via which the electrical lighting elements (20, 21) can be electrically contacted, and a luminaire body which is at least partially illuminated by the electrical lighting elements (20, 21) and which reflects their light. It is provided that the at least one circuit board (10) forms the luminaire body, wherein the circuit board (10) has at least two mutually angularly arranged partial surfaces (11, 12; 14, 18), each of which is provided with electrical lighting elements (20, 21).

Description

[0001] The invention relates to an electric lamp.

[0002] Electric luminaires are known that incorporate LEDs as light-emitting elements. For example, an electric luminaire is known from EP 2 058 581 A2 in which LEDs are arranged on curved radiating surfaces.

[0003] Luminaires of this type are known from WO 2020 / 048676 A1 and DE 10 2012 218 413 A1.

[0004] The present invention is based on the objective of providing an electric light that is constructed in a simple manner.

[0005] This problem is solved by an electric lamp having the features of claim 1. Embodiments of the invention are specified in the dependent claims.

[0006] The present invention provides an electric lamp comprising electric lighting elements and at least one circuit board on which the electric lighting elements are arranged, the circuit board comprising conductive traces via which the electric lighting elements can be electrically contacted. Furthermore, the electric lamp comprises a lamp body which is at least partially illuminated by the electric lighting elements and which reflects their light.

[0007] It is provided that the at least one circuit board forms the luminaire body, wherein the circuit board has at least two mutually angularly arranged partial surfaces, each equipped with electrical luminaire elements (and thus forming radiating surfaces). The electrical luminaire elements of the partial surfaces illuminate the other partial surface, so that each of the partial surfaces reflects light emitted by the other partial surface. The circuit board comprises the following layers: a metallic base plate, a dielectric arranged on the base plate, and a metallic layer arranged on the dielectric that forms conductive traces.

[0008] The present invention is therefore based on the idea of ​​dispensing with a separate luminaire body and instead forming it with the circuit board. The circuit board comprises at least two surfaces arranged at an angle to each other, which emit light through the electrical lighting elements arranged thereon and illuminate the other radiating surface, thus creating a spatial effect, and the shape of the luminaire body defines the direction of the emitted light.

[0009] A circuit board within the meaning of the present invention is any planar structure comprising conductive tracks. A circuit board can, for example, be a conventional printed circuit board, a conductive foil, or a metal core printed circuit board.

[0010] A luminaire body is a three-dimensional body that is illuminated by the light from the luminaire and whose shape defines the light emission of the luminaire. According to the present invention, the luminaire does not include a separate luminaire body, but rather this is formed by the circuit board. This results in a luminaire with a significantly simplified structure, as a separate luminaire body is no longer required. At the same time, the design of the circuit board as the luminaire body opens up new possibilities for the aesthetic design of the luminaire.

[0011] This means that the integrated design of the luminaire drastically reduces the number of components compared to conventional products. At least one circuit board serves as the housing, light source, and heat sink.

[0012] A further advantage associated with the present invention is that the circuit board gains additional structural stability by forming a three-dimensional body, resulting from the angular arrangement of the sub-surfaces. This is because joining or forming the circuit board sub-surfaces structurally reinforces them in terms of stability. This allows the use of very thin circuit boards. Similar to the forming of corrugated sheet metal or, for example, folded paper structures, self-supporting, stable forms can be developed.

[0013] One embodiment of the invention provides that the circuit board is bent along at least one fold line to form at least two mutually angularly arranged partial surfaces, wherein at least two of the partial surfaces comprise electrical lighting elements and form radiation surfaces. According to this embodiment, the circuit board is thus bent along one or more fold lines or edges. This results in several partial surfaces of the circuit board. At least two of these partial surfaces are provided with lighting elements and thus constitute radiation surfaces of the luminaire. Likewise, these or a further partial surface can, for example, serve for the attachment and integration of an electrical ballast in the luminaire.

[0014] In this design, the conductive traces for contacting the lighting elements can extend across a fold line between two sub-areas. The circuit board, and in particular the conductive traces, are thus sufficiently robust so that bending the circuit board along a fold line does not compromise the integrity of the conductive traces. This is achieved through material-specific dimensioning of the material thickness and grade, as well as the bending radius of the fold lines.

[0015] In other configurations, the circuit board comprises at least two separate sub-areas, which were originally individual components and supplied separately. These sub-areas are connected to each other along at least one edge. Such a connection can be made, for example, by soldering, welding, or a plug connection. Other connection methods include, for example, a current-carrying connection via pre-made connectors, screws, or terminals. In these configurations, at least two of the separate sub-areas comprise electrical lighting elements and form radiation surfaces.

[0016] According to the invention, the circuit board has the following structure: a metallic base plate (for example, made of aluminum), a dielectric arranged on the base plate, and a metallic layer arranged on the dielectric that forms conductive tracks. The light-emitting elements are electrically connected to these conductive tracks. Such a structure can be implemented in one direction or in both directions, with light-emitting elements arranged on one side or on both sides of the circuit board. Such a structure is also referred to as a metal-core circuit board. The metal-core circuit board can have further layers, such as an outer protective layer.

[0017] Embodiments of the invention provide that the metallic base plate is partially exposed (i.e., all layers except the metallic base plate are removed) and is, for example, polished or roughened. This allows for the creation of special lighting effects.

[0018] Another embodiment of the present invention provides that the luminaire further comprises a control electronics unit that is an integral part of the luminaire, wherein the luminaire can be connected directly to the AC mains supply via a plug. The term "control electronics" refers to all components required for the electrical operation of the luminaire, including an LED driver (which may, for example, have a rectifier and optionally a DC-DC converter connected upstream, or which integrates such elements).

[0019] This aspect of the invention thus provides that the electronic control unit is an integral part of the luminaire, so that it can be connected to the mains power supply and used immediately without any further measures. The electronic control unit can be arranged on the circuit board itself. This can be done, for example, in an area of ​​the circuit board where no light elements are located, or in specially designed areas between the light elements.

[0020] Advances in chip technology allow for small dimensions in pre-wiring electronics. This offers greater design flexibility and freedom compared to conventionally bulky external power supplies or pre-wiring components.

[0021] A further embodiment of the invention provides that the circuit board is coated on at least one side with a colored, opaque, translucent, or transparent layer. The type of coating can achieve aesthetic effects and also influence the thermal state of the luminaire.

[0022] Furthermore, the circuit board can be designed to be reflective on at least one side. For example, the back of the board can be reflective. However, the inside of the board, where the light-emitting elements are located, or areas illuminated by these elements, can also be reflective to achieve specific lighting effects. For instance, in the case of a metal-core circuit board, the metallic base plate can be exposed on the inside. In the case of a transparent conductive film, the film can be coated with reflective layers.

[0023] According to embodiments of the invention, the radiation surfaces formed by partial surfaces of the circuit board are flat or curved. A combination of flat and curved surfaces can also be provided.

[0024] Another design involves at least partially exposing the conductor tracks. This can result in further aesthetic lighting effects.

[0025] According to one embodiment of the invention, the electrical lighting elements are designed as LEDs. However, the invention is not limited to this, and other types of light sources are also conceivable. The LEDs can be provided in any configuration and technical implementation known to those skilled in the art. Examples include LEDs that are arranged on the circuit board using chip-on-board technology or as surface-mount devices (SMDs).

[0026] Another advantage of using LEDs is that direct mounting of the LEDs onto the circuit board provides cooling of the light-emitting elements directly through the conductive traces or, subsequently, through the circuit board itself. This increases heat dissipation and thus thermal efficiency compared to LEDs mounted or glued in heat sinks or housings. This improves the electrical efficiency of the LEDs and reduces their thermal degradation, resulting in a significant extension of their lifespan.

[0027] A further embodiment of the invention provides that at least the electrical lighting elements, and in some embodiments also the other electronic components, are provided with a coating, a casing, a potting compound, or a cover. This serves to protect the lighting elements and, if applicable, the other components from external influences and to provide electrical insulation, but can also influence the aesthetic appearance of the luminaire as well as the lighting effect.

[0028] Another design involves equipping at least the electrical lighting elements with a diffuser or secondary optics. Here, too, such a diffuser or secondary optics serves to protect the lighting elements from external influences, but can also affect the aesthetic appearance of the luminaire and the lighting effect. However, secondary optics or added diffusers are only optional components, as the lighting effect is primarily determined by the luminaire's shape, the LED arrangement, their number and density, and the properties of the substrate material.

[0029] The invention is explained in more detail below with reference to the figures in the drawing, using several exemplary embodiments. The figures show: Fig. 1 a first embodiment of a luminaire in which a circuit board comprising two sub-surfaces provided with COB LEDs and arranged at an angle to each other forms a luminaire body; Fig. 2 the light of the Fig. 1 in the switched-on state, with each of the sub-areas illuminating the other sub-area; Fig. 3. Schematic representation of the manufacturing of the circuit board of the lamp. Fig. 1 from a flat circuit board cutout; Fig. 4 an embodiment in which partial surfaces of a circuit board are produced by bending the circuit board along a fold line; Fig. 5 an embodiment in which partial areas of a circuit board consist of separate parts which are connected to each other by soldering; Fig. 6 an embodiment in which partial areas of a circuit board consist of separate parts which are connected to each other by plug connections; Fig. 7 a variant of the light fixture Fig. 1, in which the inside of the circuit board is partially exposed and the exposed aluminium layer of the circuit board core has been polished; Fig. 8 a variant of the light fixture Fig. 1, in which the inside of the circuit board is partially exposed and the exposed aluminium layer of the circuit board core has been roughened; Fig. 9 a variant of the light fixture Fig. 1, wherein the circuit board is formed from a transparent PET conductive film; Fig. 10 a variant of the light fixture Fig. 1, in which a conductor layer is exposed on the inside; Fig. 11 a variant of the light fixture Fig. 1, wherein the circuit board is provided on the inside with a bright glossy coating; Fig. 12 a variant of the light fixture Fig. 1, wherein the circuit board is provided on the inside with a dark and rough textured coating; Fig. 13 a variant of the light fixture Fig. 1, wherein the lighting elements are designed as chip-on-board (COB) LEDs; Fig. 14 a variant of the light fixture Fig. 1, wherein the lighting elements are designed as SMD LEDs; Fig. 15 a variant of the light fixture Fig. 1, wherein the light fixture is additionally assigned a shutter; Fig. 16 the light of the Fig. 14, wherein the aperture is placed on the light fixture; Fig. 17 schematically a circuit board of a lamp according to the invention with special representation of the conductor tracks of the circuit board; Fig. 18 an embodiment in which elements of a ballast and LEDs are arranged on a partial area of ​​a circuit board; Fig. 19 the exemplary embodiment of the Fig. 17, wherein the ballast elements and the LEDs are coated with a protective layer; Fig. 20 the exemplary embodiment of the Fig. 17, wherein the ballast elements and the LEDs are covered with a cover; Fig. 21 the exemplary embodiment of the Fig. 17, wherein the ballast elements and the LEDs are encapsulated using a frame-and-fill process; and Fig. 22 schematically in cross-section the structure of a circuit board designed as a metal core printed circuit board.

[0030] Before discussing the actual invention, the background of the present invention will first be explained.

[0031] LEDs – light-emitting diodes – are a typical basic component of an electric light. An LED is a semiconductor device that emits light when an electric current flows in the forward direction. In the reverse direction, the LED blocks the current. LEDs are available in a wide variety of designs and sizes and are generally extremely small compared to conventional light sources.

[0032] Standard components of well-known LED lights include a housing made of one or more parts for mounting individual components, a heat sink for cooling the LEDs and other electronic components, sockets for mounting and connecting the LEDs or associated parts, as well as lenses and / or apertures for covering the LEDs and for shaping and directing the light.

[0033] Standard electronic components of an LED light are: mains plugs or power cable fittings for connecting to power sources, cables for connecting the respective electronic components, switches or interfaces for operation, power supply or ballast electronics for providing or converting the necessary supply voltage for the LED lighting, and LED lighting element as the light source.

[0034] LED semiconductor chips are used in various form factors. They are either individually customized as chip-on-board, dual-inline-pin, through-hole mounted, or surface-mounted devices to form modules, or they are sold in commercially available, prefabricated forms such as LED strips, filaments, and chip-on-board LEDs.

[0035] Power supplies or driver modules are required to operate LEDs, as they typically require low DC voltage. These modules typically handle the conversion of AC to DC, as well as the transformation from high to low voltage, and regulate / adjust the current, which fluctuates during operation. Furthermore, they can also include circuits for controlling and remotely monitoring the LEDs. This allows, for example, the brightness and color temperature of individual or multiple LEDs to be controlled and adjusted independently. Power supplies and driver modules are usually installed externally as separate components or integrated and connected internally.

[0036] Solderable modules, open-frame assemblies or system-on-modules (SOMs) are electronic components on which electrical systems are already integrated on a separate printed circuit board, so that they only need to be mounted as a whole onto, for example, a circuit board and connected by a few solder or plug points.

[0037] Driver-on-board LEDs (DOB LEDs) are light sources typically based on a printed circuit board (PCB) on which both the LEDs and the necessary electronic control circuitry – usually in the form of integrated circuit drivers – are integrated. These are usually mounted in or on a housing or heat sink for electrical insulation and cooling. They are most commonly used in retrofit LEDs or recessed luminaires.

[0038] Printed circuit boards (PCBs) are typically manufactured using a composite substrate made of paper or fiberglass. However, flexible conductive films are also available, manufactured using a film substrate of polyimide or polyethylene terephthalate (PET). Both are suitable for manufacturing LED circuits, but their cooling capacity is limited to the conductor tracks and pads, as the PCB material itself is thermally insulating.

[0039] A special type of printed circuit board is the metal core circuit board. LED modules are often based on metal core circuit boards, onto which individual LED chips or LED components are mounted. They typically consist of a sandwich laminate comprising a metallic base plate, a dielectric layer, a copper layer (conductor track), and a solder mask layer. They are frequently used in LED modules because of their excellent thermal conductivity – meaning they dissipate heat from the LEDs directly connected to the board. These are usually mounted either on heat sinks or in / on housing components. For better integration into luminaires, metal core circuit boards are either pre-shaped to match the shape of the luminaire or made very thin so that they can be deformed and adjusted during installation.

[0040] The so-called frame-and-fill method is used to protect sensitive areas or to fix components on electronic circuit boards. In the first step, a highly viscous frame is applied. In the next step, this area is filled with a low-viscosity filler material. This method allows selected areas on the circuit board to be selectively protected from mechanical stress.

[0041] Coatings and conformal coatings are used to protect components against environmental influences. Various types of permanently curing adhesives are applied to the populated printed circuit boards to protect and seal them.

[0042] Various embodiments of the invention are described below.

[0043] The Fig. Figure 1 shows an electric lamp 100, which has a circuit board 10. The circuit board 10 is designed, for example, as a double-sided coated metal core circuit board and, in this case, has a structure as exemplified in the Fig. 22 is shown. According to this, the circuit board 10 comprises a lower metallic base plate 101, for example made of aluminum, which in the case of the lamp 100 of the Fig. 1 forms the outer surface of the luminaire. Furthermore, the circuit board 10 comprises a dielectric 102, which is arranged on the base plate 101. A metallic layer, for example a copper layer 103, is formed on the dielectric 102, forming conductive traces 50. LED chips (not shown) are arranged on the conductive traces. The top surface can be provided with a coating such as a solder mask 104.

[0044] Referring again to the Fig. 1 forms the circuit board 10 sub-surfaces, which are arranged at angles to each other, namely at 90° to each other in the illustrated embodiment, although other angles can also be realized. The sub-surfaces are formed by folding / bending the circuit board 10 along fold lines 15, 16. Thus, sub-surfaces 11, 12 were created by bending around the click line 15. Sub-surfaces 11, 13 were created by bending around the click line 16.

[0045] On two of the sub-surfaces, namely sub-surfaces 11 and 12, electrical lighting elements 20 are arranged. These are COB LEDs, which in the illustrated embodiment, but not necessarily, are arranged in a linear arrangement on sub-surfaces 11 and 12. The LEDs 20 are connected by the conductor tracks (see Fig. 22) electrically contacted on circuit board 10. It may be provided that the conductor tracks extend across the bend line 15.

[0046] The sub-area 13 serves as a base, without any LEDs being arranged on it, although this could alternatively be the case.

[0047] Since they are equipped with LED lighting elements 20, the two sub-surfaces 11 and 12 each form radiation surfaces of the luminaire 100; that is, they emit light with their LEDs but also reflect the light emitted by the other sub-surface. They thus create a spatial effect of the light emission from the luminaire 100. The two sub-surfaces 11 and 12 therefore form a luminaire body. The luminaire body is formed directly by the sub-surfaces 11 and 12 of the circuit board. No other structural components of the luminaire are present.

[0048] For the electrical contacting of the LEDs 20, an electrical ballast 40 is shown, which comprises several components known to those skilled in the art and are depicted schematically. Such components include, for example, an LED driver, a rectifier bridge, electrolytic capacitors, ceramic capacitors, transformers, resistors, inductors, PCB terminals and PCB connectors, diodes and / or solder bridges, as well as a WLAN module for remote control. A WLAN module (or Bluetooth module or the like) eliminates the need for mechanical switches and interfaces, since the WLAN module enables digital switching and control of the light.In particular, a WLAN module, a digital interface, enables switchless and location-independent switching on and off, dimming of brightness, switching between different light colors as well as any further programmable control (timer, stored states, Human Centric Lighting etc.) of the LEDs.

[0049] Since the construction of an electrical ballast 40 is familiar to those skilled in the art, it will not be discussed further here. A cable 60 leads from the electrical ballast 40 to a plug 70, with which the light 100 can be connected to a conventional power outlet.

[0050] The electrical ballast 40 is not designed as a separate component, but is integrated into the luminaire 100. The electrical ballast 40 is thus arranged directly on the circuit board 10, partially on surface 11 and partially on surface 12. This is merely an example, however. Alternatively, the electrical ballast 40 could be arranged on only one of the surfaces 11 or 12, or alternatively on surface 13.

[0051] In the Fig. The partial surfaces 11, 12, each equipped with LEDs 20 and forming radiation surfaces, are planar. However, this is not necessarily the case. In other configurations, one or more partial surfaces may be curved.

[0052] The Fig. 2 shows the light 100 of the Fig. 1 in the switched-on state, when the LEDs 20 emit light. It can be seen that the LEDs 20 illuminate the other radiation surface 11, 12 and the lamp 100 emits the emitted light with a directional characteristic defined by the partial surfaces 11, 12.

[0053] The Fig. Figure 3 shows circuit board 10 of the light fixture 100. Fig. Figure 1 illustrates several steps for the production and forming of the circuit board. In the left illustration, the circuit board 10 is formed as a flat blank, in which the subsequent base surface 13 is already structurally defined. In the middle illustration, the two sub-surfaces 11 and 12 are produced by bending the circuit board 10 around the fold line 15. In the right illustration, the base surface 13 is angled relative to the sub-surface 11 along the fold line 16.

[0054] The Fig. Figure 4 shows a further embodiment of an electric lamp 100, which has a circuit board 10 forming two sub-surfaces 14, 18 arranged at an angle of 90° to each other. An electrical ballast 40 and LEDs 21 are arranged on sub-surface 14, the LEDs 21 being in the Fig. 4 are designed as SMD LEDs and form individual light points.

[0055] The Fig. Figure 5 shows an electric light fixture with essentially the same construction as in the Fig. 4, where the circuit board 10 is in the Fig. 5 is not formed in one piece (in which case the sub-areas are produced by bending the circuit board 10), but rather consists of individual, separate sub-areas 14A, 14B, 18 which are connected to each other. The sub-areas 14A, 14B are connected to each other along their adjacent edges via a solder joint 31. It is also provided that the solder joint 31 connects the individual conductor tracks to each other, as shown in the schematic representation of the Fig. 5 is not shown in detail. Similarly, the sub-areas 14A and 18 are connected to each other via a soldered connection 31.

[0056] In the Fig. In principle, the structure of section 6 is similar to that of the... Fig. 5, wherein the circuit board 10 consists of individual, separate sub-areas 14A, 14B, 18. These are in the Fig. 6 are connected to each other by schematically represented plug connectors 32, whereby the individual conductor tracks are also connected to each other via the plug connectors 32. Corresponding edge connectors are well known to those skilled in the art.

[0057] The Fig. Figures 7 to 12 illustrate how special lighting effects can be achieved by choosing the type of circuit board and / or by modifying the circuit board. All of the Fig. 7-12 are based on the embodiment of the Fig. 1, where the area in the transition between the electrical ballast 40 and the partial areas 11, 12 provided with lighting elements 21 (designed as individual LEDs in these figures) is shown, however, apply generally to any luminaires.

[0058] At the Fig. 7 is the metallic base plate 101 in circuit board 10 (see Fig. 22) partially exposed, i.e., the overlying layers have been removed. The exposed surface of the metallic base plate 101 has been polished. As already noted, the metallic base plate 101 is, for example, an aluminum plate.

[0059] At the Fig. 8 is the same as with the Fig. 7 The metallic base plate 101 of the circuit board 10 is partially exposed. The surface of the corresponding metal layer is roughened, resulting in a different surface effect and a different reflection and scattering of light.

[0060] In the case not relating to the invention Fig. The circuit board 10 is designed as a transparent PET conductive film. The conductive traces 50 printed on the conductive film, which contact the LEDs 21, are clearly visible.

[0061] The Fig. Figure 10 shows a variant embodiment in which, in one sub-area 12, layer 103, which forms the conductive traces (typically a copper layer), is exposed in the circuit board 10. The corresponding area 103 is therefore reflective. The exposed area of ​​layer 103 is not current-carrying.

[0062] In the Fig. 11 The inner surface of sub-areas 11 and 12 is coated with a glossy, light-colored finish. In the Fig. Sections 11 and 12 are provided with a dark, rough surface coating. This results in different optical effects and radiation characteristics for the luminaire 100.

[0063] The Fig. Figure 13 shows the luminaire 100 in a representation that corresponds to the representation of the Fig. 1 corresponds to. Fig. 13 The light-emitting elements are designed as chip-on-board (COB) LEDs 20. They form an elongated strip in which the individual LEDs are no longer individually identifiable, resulting in a spatially continuous radiation effect.

[0064] At the Fig. In contrast, Figure 14 provides that the sub-areas are equipped with individual LEDs 21 that are distinguishable. For example, these are SMD LEDs. They are also arranged along a row. However, this is only an example. For instance, several rows could alternatively be arranged next to each other, forming a grid, or other arrangements of LEDs 21 could be provided.

[0065] The Fig. 15 and Fig. Figure 16 illustrates that the LEDs 21 (or, correspondingly, the LEDs 20 of the Fig. 1) can additionally be covered with an aperture 80 or secondary optics. As shown, the aperture 80 or secondary optics can also cover the electrical ballast 40. Depending on the number of LEDs and the size and orientation of the sub-areas 11, 12, the aperture 80 or secondary optics can have a wide variety of designs.

[0066] The Fig. Figure 17 shows a top view of a circuit board 10 that is not yet bent, which will form a circuit board with partial surfaces according to the Fig. 1 can be bent. The conductive traces 50, which electrically contact the LEDs 21, are shown. It can be seen that the conductive traces 50 also extend over an area 51 which, after bending the circuit board 10, forms a crease line 15, see crease line 15 of the Fig. 1 (which is in the Fig. 17 is only indicated), so that the conductor tracks 50 extend transversely or optionally at an angle to and continuously through the bend line 15.

[0067] The conductor tracks 50 can be arranged according to the Fig. 22 be covered and protected by a layer not shown. For improved heat dissipation and cooling, it is advantageous if the conductor tracks 50 have a large surface area.

[0068] The dimensions (size and thickness) and design (material and properties) of the circuit board or printed circuit board can be configured so that the conductor tracks, conductive areas, or circuit boards connected to the LEDs initially meet the minimum size required for cooling. Furthermore, these "cooling surfaces" can be optimized to ensure the energy efficiency and lifespan of the LEDs through enhanced, direct, and more efficient heat dissipation. The conductor tracks can either conduct the heat into the substrate material, which acts as a heat sink, or they themselves can function as heat sinks for the LEDs.

[0069] It is pointed out that according to the Fig. 17 also the components of the ballast 40 are arranged in such a way that the circuit board 10 can be bent along the bend line 15 without affecting the functionality of the ballast 40.

[0070] The Fig. Figures 18-21 show different ways to protect lighting elements from external influences and to electrically insulate them. The following is shown: Fig. Figure 18 schematically shows a partial area 17 of a circuit board (further partial areas are not shown), wherein on the partial area 17 a ballast 40 is implemented and LEDs 21 are arranged in a grid.

[0071] According to the Fig. The ballast 40 and the LEDs 21 are coated or encased with a coating 91. For this purpose, the circuit board can be coated, encased, or covered by means of lacquering, dip coating, or conformal coating (e.g., with lacquers, synthetic resins, or elastomers; these may be thermally conductive and electrically insulating).

[0072] According to the Fig. The ballast 40 and the LEDs 21 are each covered with a cover 92 and thus protected and insulated.

[0073] According to the Fig.In Figure 21, both the components of the ballast 40 and the LEDs 21 are selectively encapsulated using a frame-and-fill process, with the respective encapsulation material 93 being shown. The electronic components and LEDs are encapsulated or covered to electrically insulate and mechanically protect them. These processes can also be used in combination or additively in multiple layers. Insulation is of particular importance to protect against short circuits in the electronics or electrical shocks and to ensure the luminaire is fully and safely usable.

[0074] It should be noted that the present invention is suitable for any type of luminaire, for example floor lamps, wall and ceiling lamps, pendant lamps and spotlights.

[0075] Finally, the following aspects of the invention are highlighted: By strategically inserting and routing conductor tracks – especially along the bend line – or by soldering or plugging them in with connectors, in principle all electronic components can be arranged arbitrarily on several surfaces, or each of the surfaces can also be designed as a radiation surface with LEDs.

[0076] The luminaire's lighting effect derives from the targeted design of radiating surfaces and their spatial positioning and arrangement, thereby precisely directing and aligning light propagation and shadowing. The substrate material can also influence light propagation and characteristics (e.g., polished or matte aluminum, transparent conductive films, the choice of material for exposed conductors, or any structured or colored coatings). Furthermore, the luminaire's lighting parameters can be influenced by different LED control methods.

[0077] To further enhance the lighting effect and quality, LEDs of different light colors can also be used to define the spectral properties of the light or to make them adjustable and variable by selectively controlling the LEDs.

[0078] In embodiments of the invention, all electronic components necessary for operation—in particular, the ballast electronics required for operation at mains voltage, as well as the electronics required for control and remote operation—can be integrated directly onto the luminaire body, which consists of printed circuit boards or circuit boards, using integrated circuits and soldered components. Alternatively, the ballast electronics and control unit can also be applied in the form of prefabricated solderable modules—essentially a single electronic component. To prevent obsolescence, it may be advantageous to connect individual components, such as electrolytic capacitors, which have a short lifespan, using soldered sockets, so that they can be easily and conveniently replaced in the event of failure.

[0079] Thanks to the specially developed, directly integrated and individually optimized DOB ballast electronics of the luminaires, the LEDs are operated electrically and therefore also thermally more efficiently than is the case with conventional LED luminaires, which usually consist of a large number of comparatively, roughly compatible prefabricated electronic components with cumulative inefficiencies.

[0080] Almost all processes involved in manufacturing the lamp are essentially integrated circuit board production processes. For example, the circuit boards can be manufactured, populated with electronics, shaped, and coated by a single manufacturer. This simplifies production and makes it more economical, as it eliminates the need for multiple manufacturing processes involving individual components and companies. It also avoids complex supply chains and reduces the coordination effort required for manufacturing and final assembly of the lamp. The production, further processing, and assembly of circuit boards are largely automated machine processes requiring little to no manual labor. This accelerates and reduces the cost of the manufacturing process.

[0081] It is understood that the invention is not limited to the embodiments described above and that various modifications and improvements can be made without deviating from the concepts described herein. Furthermore, it is noted that any of the described features can be used separately or in combination with any other features, provided they are not mutually exclusive. The disclosure extends to and includes all combinations and subcombinations of one or more features described herein. Where ranges are defined, these include all values ​​within those ranges as well as all sub-ranges that fall within a range.

Claims

[1] Electric light (100) which has: - electric lighting elements (20, 21), - at least one circuit board (10) on which the electrical lighting elements (20, 21) are arranged, wherein the circuit board (10) comprises conductor tracks (50) via which the electrical lighting elements (20, 21) can be electrically contacted, - a luminaire body that is at least partially illuminated by the electrical luminaire elements (20, 21) and that reflects their light, - wherein the at least one circuit board (10) forms the luminaire body, wherein the circuit board (10) has two sub-surfaces (11, 12; 14, 18) arranged at an angle to each other, each of which is provided with electrical luminaire elements (20, 21), characterized by , that - the electrical lighting elements (20, 21) of the sub-areas (11, 12; 14, 18) illuminate the other sub-area (12, 11; 18, 14), so that each of the sub-areas (11, 12; 14, 18) reflects light emitted by the other sub-area (12, 11; 18, 14), wherein - the circuit board (10) has the following layers: ◯ a metallic base plate (101), ◯ a dielectric (102) arranged on the base plate, and ◯ a metallic layer arranged on the dielectric (102) and forming conductor tracks (103, 50). [2] Luminaire according to claim 1, characterized by , that the circuit board (10) is bent along at least one fold line (15) to form at least two sub-surfaces (11, 12; 14, 18) arranged at an angle to each other, wherein at least two of the sub-surfaces (11, 12; 14, 18) comprise electrical lighting elements (20, 21) and form radiation surfaces. [3] Luminaire according to claim 2, characterized by, that the conductor tracks (50) for contacting the lighting elements (20, 21) extend across the bend line (15). [4] Luminaire according to claim 1, characterized by , that the circuit board (10) has at least two separate sub-areas (14A, 14B, 18) which are connected to each other along at least one edge, wherein at least two of the separate sub-areas (14B, 18) comprise electrical lighting elements (20, 21) and form radiation surfaces. [5] Luminaire according to claim 1, characterized by , that the metallic base plate (101) is partially exposed and polished or roughened. [6] Luminaire according to any of the preceding claims, characterized by , that the luminaire (100) further comprises a ballast electronics (40) which is an integrated part of the luminaire (100), wherein the luminaire (100) can be connected directly to an AC power supply via a plug (70). [7] Luminaire according to claim 6, characterized by, that the pre-electronics (40) are arranged on the circuit board (10). [8] Luminaire according to any of the preceding claims, characterized by , that the circuit board (10) is coated on at least one side with a colored, opaque, translucent or transparent layer. [9] Luminaire according to any of the preceding claims, characterized by , that the circuit board (10) is designed to be reflective on at least one side. [10] Luminaire according to any of the preceding claims, characterized by , that the radiation surfaces formed by partial surfaces (11, 12; 14, 18) of the circuit board (10) are flat or curved. [11] Luminaire according to any of the preceding claims, characterized by , that a metallic layer (103) forming the conductor tracks is at least partially exposed in a non-current-carrying area. [12] Luminaire according to any of the preceding claims, characterized by, that the electrical lighting elements (20, 21) are designed as LEDs. [13] Luminaire according to any of the preceding claims, characterized by , that the electrical lighting elements (20, 21) are arranged on the circuit board (10) using chip-on-board technology or as SMD elements. [14] Luminaire according to any of the preceding claims, characterized by , that at least the electrical lighting elements (20, 21) are provided with a coating (91), a casing, a potting (93) or a cover (92) which provides electrical insulation. [15] Luminaire according to any of the preceding claims, characterized by , that at least the electric lighting elements (20, 21) are provided with a diaphragm (80) or secondary optics.

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