EQUIPMENT CARRIER MODULE AND MOUNTING PANEL SYSTEM

Abstract

A mounting bracket module for a mounting panel system for an electrical distribution board comprises: a housing including a base plate arranged parallel to an X-direction and a Y-direction, the Y-direction being perpendicular to the X-direction; and one or more locking units for locking the mounting bracket module onto one or more parallel DIN rails, such that the one or more DIN rails run parallel to the X-direction. Each of the one or more locking units comprises: a first locking projection that is fixed relative to the housing; a locking element that is rotatable relative to the housing between a first position and a second position about an axis of rotation parallel to the X-direction, the locking element comprising a second locking projection; and a spring element for generating a spring force to bias the locking element towards the second position.By applying an external force to the housing in the direction of a DIN rail, the device carrier module can be moved linearly relative to the DIN rail from a removal position to an actuation position, against the spring force of the spring element. When the device carrier module is in the actuation position, the locking element is in the first position. With the locking element in the first position, the device carrier module can be moved linearly back and forth along the Y-direction relative to the DIN rail between the actuation position and a locking position. When the device carrier module is in the locking position and the locking element is in the second position, the DIN rail is clamped in the Y-direction between the first locking projection and the second locking projection, thus locking the device carrier module to the DIN rail.

Description

[0001] The present invention relates to a device carrier module for a mounting board system for an electrical distribution board and to a mounting board system for an electrical distribution board.

[0002] DIN rail-mounted devices or installation devices, such as circuit breakers, residual current devices, timers, D and DO fuses, DO switch-fuse units, panel switches, and panel-mounted sockets, are designed for installation in electrical distribution boards or installation distribution boards. Such distribution boards are now found in virtually every electrically equipped building.

[0003] Conventional DIN rail-mounted devices are primarily described by the German standard DIN 43 880. These devices, with standardized dimensions, are mounted on DIN rails in a distribution cabinet. Current is drawn from the devices conventionally via screw or spring-clamp terminals.

[0004] It is an object of the present invention to provide a device carrier module for a mounting board system for an electrical distribution board and a mounting board system for an electrical distribution board in order to improve user-friendliness taking into account the desired applications.

[0005] This problem is solved by a device carrier module according to claim 1, a system according to claim 15, a mounting panel system according to claim 16, a mounting panel system according to claim 17, and a locking element according to claim 18. Claims 2 to 14 relate to particularly advantageous implementations of the device carrier module according to claim 1.

[0006] The present invention relates to a device carrier module for a mounting panel system for an electrical distribution board. The mounting panel system can comprise a plurality of device carrier modules that are detachably attached to one another. Alternatively, the mounting panel system can comprise only one device carrier module. In particular, the mounting panel system can be identical to the device carrier module.

[0007] In particular, the device carrier module may comprise: a first side wall and a second side wall, arranged on opposite sides of the device carrier module and each extending at least partially or completely in a longitudinal direction or substantially in a longitudinal direction of the device carrier module. The device carrier module may be made at least partially or completely of an electrically insulating material (e.g., a plastic). The device carrier module may comprise one or more conductor insertion tracks that extend in the longitudinal direction or substantially in the longitudinal direction of the device carrier module and are designed for inserting and / or detachably fastening one or more conductor rails. If the device carrier module comprises at least two conductor insertion tracks, any two adjacent conductor insertion tracks may be separated from each other by an electrically insulating separating strip.However, it is also possible that the device carrier module comprises only one conductor insertion track, so that there are no two adjacent conductor insertion tracks of the device carrier module. For example, the device carrier module can comprise two conductor insertion tracks for inserting two busbars of a single-phase connection, four conductor insertion tracks for inserting four busbars corresponding to the neutral conductor N and the three phase conductors L1, L2, L3 of a three-phase connection, or multiples of three conductor insertion tracks for inserting multiples of three busbars, each corresponding to the phase conductors L1, L2, L3 of a three-phase connection. The busbars can be, in particular, electrical conductors, preferably copper conductors. Alternatively or additionally, the one or more conductor insertion tracks can be configured for inserting and / or detachably securing one or more other conductors, in particular signal lines or data lines.The signal lines or data lines can be inserted in particular into the free conductor insertion tracks, i.e., into the conductor insertion tracks in which no conductor rails are inserted.

[0008] Furthermore, the device carrier module can comprise: one or more first slots; and one or more second slots arranged at a predetermined longitudinal distance from the one or more first slots. In particular, every second slot can be arranged at a predetermined longitudinal distance from a corresponding first slot. The predetermined distance between a first slot and a second slot can, in particular, correspond to the height of a DIN rail device module that can be inserted into an operating position between a first connection module and a second connection module, which can be plugged onto the device carrier module at the first and second slots, respectively. In the operating position, the DIN rail device can be attached to or locked onto a device carrier module or the mounting panel system. The number of first and second slots can be determined by specifying the number of slots.The number of second slots can correspond to a number of installation rows of the electrical distribution board and, in particular, to a number of DIN rails on which the device carrier modules can be snapped. For example, each device carrier module can comprise three first and three second slots, four first and four second slots, five first and five second slots, or six first and six second slots, corresponding to three, four, five, or six parallel DIN rails.

[0009] The device carrier module may further comprise: one or more first transverse connecting elements and one or more second transverse connecting elements, which are designed such that the device carrier module and a first further device carrier module can be detachably fastened or snapped or automatically snapped to one another via the one or more second transverse connecting elements of the device carrier module and the one or more first transverse connecting elements of the first further device carrier module, such that: the first further device carrier module is arranged offset or displaced relative to the device carrier module in a transverse direction, wherein the transverse direction is perpendicular or substantially perpendicular to the longitudinal direction, and a conductor insertion track of the device carrier module and an adjacent conductor insertion track of the first further device carrier module are separated from each other by an electrically insulating separating track.At least part of this electrically insulating partition can be formed by at least part of the second side wall of the device carrier module and at least part of the first side wall of the first additional device carrier module; alternatively, this electrically insulating partition can comprise at least part of the second side wall of the device carrier module and at least part of the first side wall of the first additional device carrier module. If the device carrier module and the first additional device carrier module are attached to each other, the second side wall of the device carrier module can abut at least partially or completely against the first side wall of the first additional device carrier module.

[0010] According to the present invention, the device carrier module comprises a housing that includes a base plate or base or base section. The base plate is arranged at least partially or completely parallel to an X-direction and a Y-direction, the Y-direction being perpendicular to the X-direction. The X-direction can be the transverse direction and the Y-direction can be the longitudinal direction, as described above. Hereinafter, a Z-direction denotes a direction that is perpendicular to both the X-direction and the Y-direction. The device carrier module can further comprise a cover plate or cover or a cover section. The cover plate can be arranged at least partially or completely parallel or substantially parallel to the base plate.

[0011] The device carrier module further comprises one or more locking units for locking the device carrier module and / or the housing to one or more parallel DIN rails, for example three, four, five or six parallel DIN rails, so that the one or more DIN rails run parallel to the X direction and preferably at least partially, e.g. with their respective first and / or second end sections, rest against the base plate or against a side surface (outer surface) of the base plate.

[0012] The one or more detent units each comprise a first detent projection (or a first stop), a detent element (detent) and a spring element.

[0013] The first locking projection is fixed relative to the housing or base plate. In particular, the first locking projection can be attached to the housing, be integrally formed with the housing, or be a component of the housing.

[0014] The locking element is rotatably arranged relative to the housing or base plate between a first position and a second position about an axis of rotation parallel to the X-direction. The axis of rotation may be fixed relative to the housing. The locking element further comprises a second locking projection (or a second stop). The locking element may be arranged at least partially or completely within the housing. In particular, the axis of rotation of the locking element may be arranged within the housing. The locking element may be arranged at least partially in the Z-direction between the base plate and the cover plate. In particular, the axis of rotation in the Z-direction may be arranged between the base plate and the cover plate. The locking element may be arranged at least partially or completely in a separating track, as described above.

[0015] The spring element is configured to generate a spring force, restoring force, or preload force to bias the detent element toward the second position. Specifically, if an external force acts on the detent element, moving it relative to the housing from the second position toward the first position, the spring element can be elastically deformed, thereby generating a spring force that acts on the detent element and opposes the external force. In particular, the spring force can bias the detent element toward the second position or, when no external force acts on the detent element, return it to the second position. The spring element can be located at least partially or completely within the housing.

[0016] By applying an external force to the housing in the direction of a DIN rail, the device carrier module can be moved linearly relative to the DIN rail from a removal position to an actuation position, against the spring force of the spring element. The external force can point in the opposite Z-direction (a direction opposite to the Z-direction). In particular, the external force can be greater than the spring force. The device carrier module can be moved linearly from the removal position to the actuation position towards the DIN rail, especially along the opposite Z-direction. Furthermore, the device carrier module can be moved linearly relative to the DIN rail from the actuation position to the removal position along the Z-direction (away from the DIN rail). When the device carrier module is in the actuation position, the locking element is in the first position.If the device carrier module is in the removal position and no external force acts on the locking element, the locking element can be arranged in the second position.

[0017] The external force acting on the housing can be transferred from the housing to the locking element, which may be attached to the housing along the axis of rotation. The locking element, in particular the second locking projection, can further transfer the force to the DIN rail. The DIN rail can therefore generate a counterforce that acts on the locking element, in particular on the second locking projection. This counterforce can cause the locking element to move from the second position to the first position against the spring force of the spring element when the device carrier module is moved from the removal position to the actuation position by the external force.

[0018] In particular, when the device carrier module is in the actuated position, the locking element or the second locking projection and the DIN rail or a first end section of the DIN rail can touch or be in contact with each other, and the DIN rail or the first end section of the DIN rail can exert a counterforce on the locking element or the second locking projection. Furthermore, when the device carrier module is in the actuated position, the DIN rail or a second end section of the DIN rail can touch the base plate or rest against the base plate or a side surface (outer surface) of the base plate. The first and / or the second end section of the DIN rail can each be arranged parallel to the X and Y directions, respectively.When the device carrier module is in the locking position, the first and / or the second end section of the DIN rail can each touch the base plate or rest against the base plate or against a side surface (outer surface) of the base plate.

[0019] When the locking element is in the first position, the device carrier module is linearly movable back and forth along the Y-direction relative to the DIN rail between the actuation position and a locking position. Specifically, when the locking element is in the first position, the device carrier module can be linearly movable relative to the DIN rail from the actuation position to the locking position along an opposite Y-direction (a direction opposite to the Y-direction). In particular, as long as the external force that moved the device carrier module from the removal position to the actuation position continues to act on the housing, the locking element can remain in the first position, and therefore the device carrier module can be linearly moved relative to the DIN rail from the actuation position to the locking position along the opposite Y-direction.

[0020] When the device carrier module is in the locked position and the locking element is in the second position, the DIN rail is clamped or clamped in the Y-direction between the first and second locking projections, so that the device carrier module is locked to the DIN rail. This can prevent or hinder movement of the device carrier module relative to the DIN rail (especially along the Y-direction). Thus, when the device carrier module is in the locked position, it can be immovably positioned relative to the DIN rail (especially along the Y-direction).

[0021] In particular, when the device carrier module is in the locking position and no external force acts on the locking element, the locking element can be in the second position. Specifically, when the device carrier module is in the locking position, the DIN rail or the first end section of the DIN rail may no longer contact the locking element or the second locking projection and thus exert no counterforce on the locking element. Therefore, when the device carrier module is moved from the actuation position to the locking position, the spring force of the spring element can move the locking element from the first position to the second position.

[0022] The device carrier module or mounting panel system according to the invention can be attached to one or more DIN rails particularly easily, quickly, and securely. In particular, connection modules or DIN rail-mounted device modules, which can be plugged onto or inserted into the device carrier module, do not need to be attached to the DIN rails themselves, thus simplifying the installation of the electrical distribution board. The snap-in units can be designed and dimensioned such that the device carrier module or mounting panel system can be installed in conventional control cabinets with DIN rails, for example, on several, in particular three, parallel DIN rails with a width of 35 mm and a center-to-center distance of 150 mm between rails.

[0023] The device carrier module according to the invention can be attached, detachably attached, or latched to one or more parallel DIN rails as follows: The device carrier module can initially be in the removal position, and the latching element can be arranged in the second position in the absence of an external force. By applying an external force to the housing, the device carrier module can be moved along the opposite Z-direction (towards the DIN rails) into the actuation position. This tensions the spring element, and the latching element is moved from the second position to the first position against the spring force of the spring element. The device carrier module can then be moved relative to the DIN rail from the actuation position to the latching position.When the mounting module is in the locked position, the spring element can relax, and the spring force moves the locking element from the first to the second position. In this state, the DIN rail is clamped in the Y-direction between the first and second locking projections. This prevents movement of the mounting module relative to the DIN rail. The mounting module is thus locked to the DIN rail.

[0024] In particular, no tools are required to operate the one or more locking units for mounting or locking the device carrier module onto the one or more DIN rails. Mounting or locking is achieved simply by pressing the device carrier module against the DIN rails (moving it along the opposite Z-direction from the removal position to the actuation position by applying external force to the housing) and then sliding the device carrier module parallel to the DIN rails (moving it along the opposite Y-direction from the actuation position to the locking position). This allows the device carrier module or mounting panel system to be attached to the DIN rails particularly easily, quickly, stably, and securely, thus increasing user-friendliness.

[0025] This technical feature is particularly advantageous when the mounting module has multiple locking units, for example, one or more locking units for each DIN rail. In this case, the entire mounting module can be easily installed and locked into place by simply pressing the module or housing against the DIN rails and then sliding it parallel to the rails. Specifically, the multiple locking units can be operated simultaneously to secure the mounting module to the DIN rails. No tools are required to mount or lock the mounting module to the DIN rails. This allows the mounting module or mounting panel system to be attached to the DIN rails particularly easily, quickly, securely, and reliably, thus increasing user-friendliness.

[0026] Furthermore, the device carrier module and the mounting panel system according to the invention can be manufactured particularly efficiently and cost-effectively.

[0027] In a preferred embodiment, when the device carrier module is in the locking position relative to the DIN rail, the DIN rail or a second end section of the DIN rail is clamped or clamped or arranged between the base plate and the first locking projection. In particular, the DIN rail or the second end section can be clamped in the Z-direction between the base plate and the first locking projection.

[0028] Thus, when the device carrier module is in the locked position, movement of the device carrier module relative to the DIN rail (especially along the Z-direction) can be prevented or made more difficult. This allows the device carrier module to be positioned immovably relative to the DIN rail (especially along the Z-direction). This enables a particularly stable and secure locking of the device carrier module to one or more DIN rails, thereby increasing user-friendliness.

[0029] In a preferred embodiment, when the locking element is in the second position, the second locking projection extends beyond the base plate in the direction of the DIN rail or in the opposite Z-direction.

[0030] When an external force acts on the housing and is transferred from the housing to the locking element, the locking element, particularly the second locking projection, can touch or be in contact with the DIN rail and transmit the force to the DIN rail. The DIN rail can therefore generate a counterforce that acts on the locking element, especially on the second locking projection. This counterforce can cause the locking element to move from the second position to the first position against the spring force of the spring element when the device carrier module is moved from the removal position to the actuation position by the external force. This allows the device carrier module to be attached to the DIN rails particularly easily and quickly, thus increasing user-friendliness.

[0031] In a preferred embodiment, when the locking element is in the second position, the second locking projection is limited in the direction of the DIN rail or in the opposite Z-direction by a first boundary surface that runs parallel or substantially parallel to the base plate.

[0032] When an external force acts on the housing and is transferred from the housing to the locking element, the locking element, particularly the second locking projection, can be in surface contact with the DIN rail and transfer the force to the DIN rail very efficiently. The DIN rail can therefore generate a counterforce that acts particularly efficiently on the locking element, especially on the second locking projection. This allows the device carrier module to be attached to the DIN rails very efficiently, easily, and quickly, thus increasing user-friendliness.

[0033] In a preferred embodiment, when the locking element is in the second position, the second locking projection in the Y-direction is bounded by a second boundary surface, wherein the angle between the base plate and the second boundary surface is greater than 90°. The second boundary surface can, in particular, be conical.

[0034] This allows for the compensation of DIN rail tolerances. For example, if a DIN rail has a greater extension in the Y-direction than intended, the DIN rail can still be clamped between the first and second locking protrusions when the device carrier module is in the locked position. In this case, when the spring element is released, the locking element only moves from the first position to a position close to the second position, so that the distance between the first and second locking protrusions in the Y-direction is greater than if the locking element were exactly in the second position. This enables a particularly stable and secure locking of the device carrier module to the DIN rails, even in the case of DIN rail tolerances, thus increasing user-friendliness.

[0035] In a preferred embodiment, when the detent element is in the second position, the second detent projection in the opposite Y direction is limited by a third boundary surface which is centric with respect to the axis of rotation.

[0036] This allows the locking element to be supported against a guide surface in the housing, particularly when the mounting panel is attached to the DIN rails in such a way that gravity acts in the opposite Y-direction. The concentric design of the third boundary surface and the guide surface enables surface contact between the third boundary surface and the guide surface, allowing the locking element to rotate around the axis of rotation between the first and second positions. This ensures a particularly stable and secure locking of the device carrier module to the DIN rails, thereby increasing user-friendliness.

[0037] In a preferred embodiment, the locking element is bounded by a fourth boundary surface. When the locking element is in the second position, the fourth boundary surface rests, at least partially or completely, against the base plate or against a side surface (inner surface) of the base plate under a preload generated by the spring element.

[0038] This allows for a particularly stable and secure arrangement of the locking element in the second position, so that the device carrier module can be locked onto the DIN rails particularly easily and securely.

[0039] In a preferred embodiment, the housing comprises a cover plate arranged parallel to the base plate. The locking element is bounded by a fifth boundary surface. When the locking element is in the first position, the fifth boundary surface rests at least partially or completely against the cover plate or against a side surface (inner surface) of the cover plate.

[0040] This allows for a particularly stable and secure arrangement of the locking element in the first position, so that the device carrier module can be mounted on the DIN rails particularly easily and securely.

[0041] In a preferred embodiment, the detent element comprises an engagement element (an actuating element, an actuating area) into which a user can engage with a tool, in particular a screwdriver, to move the detent element from the second position to the first position against the spring force of the spring element. The engagement element can, in particular, be designed as a recess in the detent element that points in the Z-direction.

[0042] Thus, when the device carrier module is in the locked position, the user can move the locking element from the second position to the first position using a tool, against the spring force of the spring element. The user can then move the device carrier module linearly along the Y-direction relative to the DIN rail from the locked position to the actuation position to release the locking mechanism between the device carrier module and the DIN rail. The user can then, for example, move the device carrier module to the removal position to detach it from the DIN rail. This allows the device carrier module to be removed from the DIN rails particularly easily and quickly, for example, for maintenance or repair of the device carrier module or the DIN rails themselves. This significantly improves user-friendliness.

[0043] In a particularly preferred embodiment, the housing comprises a cover plate arranged parallel to the base plate. When the locking element is in the second position, the locking element is at least partially positioned between the base plate and the cover plate, and the engagement element is exposed through an opening in the cover plate, particularly in the Z-direction.

[0044] This allows a user to insert the tool through the opening in the cover plate and into the engagement element to detach the device carrier module from the DIN rail. In particular, the cover plate does not need to be removed to detach the device carrier module from the DIN rail. This makes it especially easy and quick to remove the device carrier module from the DIN rails, for example, for maintenance or repair of the device carrier module or the DIN rails themselves. This significantly improves user-friendliness.

[0045] In a preferred embodiment, the locking element is plate-shaped. This makes the locking element particularly stable and allows for particularly quick and cost-effective production, thus increasing user-friendliness.

[0046] In a preferred embodiment, the locking element is made of plastic. This makes the locking element particularly stable and allows it to be manufactured very quickly and cost-effectively, thus increasing user-friendliness.

[0047] In a preferred embodiment, the spring element and the locking element are formed in one piece. In particular, the spring element can be designed as an elastic section of the plate-shaped locking element. This reduces the number of components of the device carrier module. This increases the stability of the device carrier module and reduces manufacturing costs, thus improving user-friendliness.

[0048] Alternatively, the spring element can be made of steel or a steel alloy. This makes the spring element particularly stable and break-resistant. Furthermore, the locking element can be manufactured more easily and cost-effectively, as no elastic section is required to function as a spring element. The spring element can also be easily integrated into the device carrier module as a cost-effective, standard component. This improves user-friendliness.

[0049] The present invention further relates to a mounting panel system for an electrical distribution board. The mounting panel system comprises the device carrier module as described above and a first additional device carrier module as described above. The device carrier module and the first additional device carrier module can, in particular, be identical in design. The device carrier module and the first additional device carrier module can be attached to one another such that the first additional device carrier module is arranged offset relative to the device carrier module in the X-direction. In particular, the device carrier module and the first additional device carrier module can be snapped onto the same one or more parallel DIN rails via their respective one or more snap-in units.

[0050] This allows the electrical distribution panel to be flexibly assembled from several modules, depending on the desired application. The technical advantages described above for the device carrier module also apply to the mounting panel system.

[0051] The present invention further relates to a mounting panel system, preferably as described above, for an electrical distribution panel. The mounting panel system comprises the device carrier module as described above and a second device carrier module as described above. The device carrier module and the second device carrier module can, in particular, be identical. The device carrier module and the second device carrier module can be attached to one another such that the second device carrier module is arranged offset relative to the device carrier module in the Y-direction.In particular, the device carrier module can be snapped onto one or more parallel DIN rails via its one or more snap-in units, and the second further device carrier module can be snapped onto one or more further parallel DIN rails via its one or more snap-in units, wherein the one or more further DIN rails run parallel to the one or more DIN rails and are offset relative to the one or more DIN rails in the Y-direction.

[0052] This allows the electrical distribution panel to be flexibly assembled from several modules, depending on the desired application. The technical advantages described above for the device carrier module also apply to the mounting panel system.

[0053] The present invention further relates to a locking element for locking a device carrier module, preferably a device carrier module as described above, to one or more parallel DIN rails, such that the one or more DIN rails run parallel to an X-direction, wherein the device carrier module comprises: a housing comprising a base plate arranged parallel to the X-direction and a Y-direction, the Y-direction being perpendicular to the X-direction; a first locking projection arranged immovably relative to the housing; and a spring element; wherein the locking element is configured such that it can be rotatably arranged relative to the housing between a first position and a second position about an axis of rotation parallel to the X-direction; wherein the spring element is configured to generate a spring force for biasing the locking element towards the second position;wherein the locking element comprises a second locking projection; wherein, by the application of an external force to the housing in the direction of a DIN rail, the device carrier module is linearly movable relative to the DIN rail from a removal position to an actuation position against the spring force of the spring element; wherein, when the device carrier module is in the actuation position, the locking element is arranged in the first position; wherein, when the locking element is in the first position, the device carrier module is linearly movable back and forth along the Y-direction relative to the DIN rail between the actuation position and a locking position;and wherein, when the device carrier module is in the locking position and the locking element is arranged in the second position, the DIN rail is clamped in the Y-direction between the first locking projection and the second locking projection, thereby locking the device carrier module to the DIN rail. This locking element can have all the features described above for the locking element of the device carrier module and contributes analogously to the technical effects mentioned above.

[0054] These and other features and advantages of the invention will become clear with reference to the accompanying drawings, which show particularly advantageous embodiments. They show: Fig. 1A a top view of a mounting panel system according to an embodiment of the present invention, which includes three device carrier modules 3 according to embodiments of the present invention; Fig. 1B a side view from the left side in Fig. 1A of the mounting panel system; Fig. 1C a perspective view of the mounting panel system from Fig. 1A; Fig. 2A a perspective view of a locking element of a device carrier module according to an embodiment of the present invention; Fig. 2B a side view of the grid element from Fig. 2A; Fig. 2C a top view of the locking element from Fig. 2A; Fig. 3A a cross-sectional view along AA in Fig. 1A, when the device carrier module is in a removal position relative to the DIN rail; Fig. 3B a cross-sectional view along AA in Fig. 1A, when the device carrier module is in the operating position relative to the DIN rail; and Fig. 3C a cross-sectional view along AA in Fig. 1A, when the device carrier module is in the locking position relative to the DIN rail.

[0055] Fig. Figure 1A shows a top view of a mounting panel system according to an embodiment of the present invention, which includes three device carrier modules 3 according to embodiments of the present invention. Fig. Figure 1B shows a side view from the left side in Fig. 1A of the mounting panel system. Fig. Figure 1C shows a perspective view of the mounting panel system made of Fig. 1A. In this embodiment, the modular mounting panel system comprises three device carrier modules 3: one in Fig. 1A Left-hand device carrier module 3 (hereinafter referred to as "left device carrier module 3"), a Fig. 1A centrally arranged device carrier module 3 (hereinafter referred to as "central device carrier module 3") and a in Fig. 1A Right-hand mounting module 3 (hereinafter referred to as "right mounting module 3"). The middle mounting module 3 is offset relative to the left mounting module 3 in the X-direction (transverse direction), and the right mounting module 3 is offset relative to the middle mounting module 3 in the X-direction. The left mounting module 3 and the middle mounting module 3, as well as the middle mounting module 3 and the right mounting module 3, are each attached to one another in the X-direction to form a mounting panel or mounting panel system for an electrical distribution board.

[0056] In this embodiment, three installation rows of DIN rail device modules are provided. Each DIN rail device module can be inserted in its operating position between two connection modules 2, which can be plugged onto the device carrier modules 3, as shown in Fig. 1A to 1C shown. Each of the three installation rows can contain four connection modules 2: a feed-in module 2, which is mounted or plugged onto the left equipment carrier module 3, a transverse displacement module 2, which extends over the three equipment carrier modules 3, and two output modules 2, which are mounted on the middle and right equipment carrier modules 3 respectively.

[0057] In this embodiment, the left device carrier module 3 comprises four conductor insertion tracks, while the middle and right device carrier modules 3 each comprise three conductor insertion tracks. In this embodiment, the middle device carrier module 3 and the right device carrier module 3 can be identical. The conductor insertion tracks each extend in the Y-direction (longitudinal direction). Two adjacent conductor insertion tracks can be separated from each other by an electrically insulating separating strip. For example, four conductor rails can be arranged in the conductor insertion tracks of the left device carrier module 3, corresponding to the neutral conductor N and the three phase conductors L1, L2, and L3 of a three-phase connection. The conductor insertion tracks are concealed by electrically insulating covers 36 and are therefore in Fig. 1A to 1C not visible. Power is transferred to the conductor rails via a power supply block with four input terminals (clamping screws), which in this embodiment is attached to an upper section of the left device carrier module 3 (in Fig. 1A top left) is arranged.

[0058] The device carrier modules 3 each comprise a housing that includes a base plate 41 or a base 41 or base section 41. The base plate 41 is arranged at least partially parallel to the X-direction and the Y-direction, with the Y-direction being perpendicular to the X-direction. Hereinafter, a Z-direction denotes a direction that is perpendicular to both the X-direction and the Y-direction. The device carrier module 3 further comprises a cover plate 36 or cover 36 or a cover section 36. The cover plate 36 is arranged parallel to the base plate 41.

[0059] The device carrier modules 3 each contain three locking units for locking the device carrier module 3 and / or the housing to three parallel DIN rails 7 for attaching the mounting panel to three parallel DIN rails 7, so that the DIN rails 7 run parallel to the X-direction and preferably at least partially, e.g. with their respective first end sections 71 and / or second end sections 72 (see Fig. 3C), resting against the base plate 41 (or against a side surface of the base plate 41 that points in the opposite Z-direction). A mounting panel system can also comprise several (e.g., two or more) device carrier modules that are attached to one another in the Y-direction, e.g., for mounting on more than three (e.g., six or a multiple of three) DIN rails 7. The locking units each comprise a first locking projection 45 (or a first stop 45), a locking element 43, and a spring element 44. The first locking projection 45 is arranged immovably relative to the housing or the base plate 41. In particular, the first locking projection 45 can be attached to the housing, formed integrally with the housing, or be a component of the housing.

[0060] Fig. Figure 2A shows a perspective view of a locking element 43 of the device carrier module 3 according to an embodiment of the present invention. Fig. Figure 2B shows a side view of the locking element 43. Fig. 2A. Fig. Figure 2C shows a top view of the locking element 43. Fig. 2A. Fig. 3A shows a cross-sectional view along AA in Fig. 1A, when the device carrier module 3 is in a removal position relative to the DIN rail 7. Fig. 3B shows a cross-sectional view along AA in Fig. 1A, when the device carrier module 3 is in an operating position relative to the DIN rail 7. Fig. 3C shows a cross-sectional view along AA in Fig. 1A, when the device carrier module 3 is in a locking position relative to the DIN rail 7.

[0061] The locking element 43 is positioned relative to the housing or base plate 41 between a first position (see Fig. 3B) and a second position (see Fig. 3A and Fig. 3C) rotatably arranged about a rotational axis 42 that runs parallel to the X-direction. The rotational axis 42 can be arranged to be fixed relative to the housing. The locking element 43 can be arranged at least partially or completely inside the housing. In particular, the rotational axis 42 of the locking element 43 can be arranged inside the housing. The locking element 43 can be arranged at least partially in the Z-direction between the base plate 41 and the cover plate 36. In particular, the rotational axis 42 can be arranged in the Z-direction between the base plate 41 and the cover plate 36.

[0062] The detent element 43 further comprises a second detent projection 430 (or a second stop 430). When the detent element 43 is in the second position (see Fig. 3A and Fig. 3C), the second locking projection 430 extends beyond the base plate 41 in the direction of the DIN rail 7 or in the opposite Z-direction. When the locking element 43 is in the second position, the second locking projection 430 is bounded in the direction of the DIN rail 7 or in the opposite Z-direction by a first boundary surface 431 that runs parallel or substantially parallel to the base plate 41.

[0063] The spring element 44 is configured to generate a spring force, restoring force, or preload force to bias the detent element 43 toward the second position. Specifically, if an external force acts on the detent element 43, causing it to move relative to the housing from the second position toward the first position, the spring element 44 can be elastically deformed, thereby generating a spring force that acts on the detent element 43 and opposes the external force. In particular, the spring force can bias the detent element 43 toward the second position or, when no external force acts on the detent element 43, move it back into the second position.In this embodiment, the spring element 44 and the locking element 43 are formed in one piece; in particular, the spring element 44 is designed as an elastic section of the plate-shaped locking element 43. Alternatively, the spring element 44 can be made, for example, of steel or a steel compound.

[0064] By applying an external force to the housing of the device carrier module 3 in the direction of a DIN rail 7, the device carrier module 3 is moved relative to the DIN rail 7 from the removal position (as shown in Fig. 3A shown) into the actuation position (as shown in Fig. (shown in 3B) linearly movable against the spring force of the spring element 44 (see the arrow from right to left in Fig. 3A, which indicates the direction of movement of the device carrier module 3 relative to the DIN rail 7 or the direction of the external force on the housing), particularly when the external force is greater than the spring force of the spring element. When the device carrier module 3 is in the removal position and no external force acts on the locking element 43, the locking element 43 can be arranged in the second position, as shown in Fig. Figure 3A shows that when the device carrier module 3 is in the actuating position, the locking element 43 is in the first position, as shown in Fig. Figure 3B illustrates this. The external force acting on the housing can be transmitted from the housing to the locking element 43. The locking element 43, in particular the second locking projection 430, can transmit the force to the DIN rail 7. The DIN rail 7 can therefore generate a counterforce that acts on the locking element 43, in particular on the second locking projection. This counterforce can cause the locking element 43 to move from the second position to the first position against the spring force of the spring element 44 when the device carrier module 3 is moved from the removal position to the actuation position by the external force.

[0065] In particular, when the device carrier module 3 is in the actuation position, the second detent projection 430 and a first end section 71 of the DIN rail 7 can touch or be in contact with each other (see Fig. 3B), and the first end section 71 of the DIN rail 7 can exert the counterforce on the second locking projection 430. Furthermore, when the device carrier module 3 is in the actuating position, a second end section 72 of the DIN rail 7 can touch the base plate 41 or bear against the base plate 41 (or against a side surface of the base plate 41 that points in the opposite Z-direction). The first end section 71 and / or the second end section 72 of the DIN rail 7 can each be arranged parallel to the X-direction and the Y-direction, respectively. When the device carrier module 3 is in the locking position (see Fig. 3C), the first end section 71 and / or the second end section 72 of the DIN rail 7 can each touch the base plate 41 or be in contact with the base plate 41 (or with a side surface of the base plate 41 that points in the opposite Z direction).

[0066] When the locking element 43 is in the first position (see Fig. 3B), the device carrier module 3 is linearly movable back and forth along the Y-direction relative to the DIN rail 7 between the actuation position and a locking position. In particular, when the locking element 43 is in the first position, the device carrier module 3 can be linearly moved relative to the DIN rail 7 from the actuation position to the locking position along an opposite Y-direction (a direction opposite to the Y-direction), as indicated by the downward arrow in Fig. 3B shown. In particular, as long as the external force with which the device carrier module 3 was moved from the removal position to the actuation position continues to act on the housing, the locking element 43 can remain in the first position and therefore the device carrier module 3 can be moved linearly relative to the DIN rail 7 from the actuation position to the locking position along the opposite Y direction.

[0067] When the device carrier module 3 is in the locking position (see Fig. 3C) and the locking element 43 is in the second position, the DIN rail 7 is clamped or clamped or arranged in the Y-direction between the first locking projection 45 and the second locking projection 430, so that the device carrier module 3 is locked onto the DIN rail 7. This can prevent or hinder movement of the device carrier module 3 relative to the DIN rail 7 (especially along the Y-direction). Thus, when the device carrier module 3 is in the locking position, it can be arranged immovably relative to the DIN rail 7 (especially along the Y-direction). In particular, when the device carrier module 3 is in the locking position (see Fig. 3C) and no external force acts on the locking element 43, the locking element 43 may be in the second position. In particular, when the device carrier module 3 is in the locking position, the DIN rail 7 or the first end section of the DIN rail 7 can no longer contact the locking element 43 or the second locking projection and thus no longer exert a counterforce on the locking element 43. When the device carrier module 3 is moved from the actuation position to the locking position (arrow from top to bottom in Fig. 3B), therefore the locking element 43 can be moved from the first position to the second position by the spring force of the spring element 44.

[0068] The device carrier module 3 can therefore be attached, detachably attached, or locked to the DIN rails 3 as follows: The device carrier module 3 can initially be in the removal position, and the locking element 43 can be arranged in the second position in the absence of an external force, as shown in Fig. Figure 3A shows that by applying an external force to the housing, the device carrier module 3 can be moved into the actuation position along the opposite Z-direction (towards the DIN rails) (arrow from right to left). Fig. 3A). The spring element 44 is tensioned, and the locking element 43 is moved from the second position to the first position against the spring force of the spring element 44. The device carrier module 3 can then be moved relative to the DIN rail 7 from the actuating position to the locking position (arrow from top to bottom in Fig. 3B). When the device carrier module 3 is in the locking position, the spring element 44 can relax again and the locking element 43 can be moved from the first to the second position by the spring force of the spring element 44 (see Fig. 3C). In this state, the DIN rail 7 is clamped in the Y-direction between the first locking projection 45 and the second locking projection 430. This prevents movement of the device carrier module 3 relative to the DIN rail 7 (especially along the Y-direction).

[0069] Thus, the device carrier module 3 can first be mounted on the DIN rails 7 in the Fig. 3A, inserted in the direction of the arrow shown (from right to left) and then in the Fig. The device carrier module 3 is pushed in the direction of the arrow shown in 3B (from top to bottom). This tensions the spring element 44. When the device carrier module 3 reaches the stop 45, the spring element 44 relaxes again and prevents the device carrier module 3 from moving relative to the DIN rail 7.

[0070] Furthermore, if the device carrier module 3 is in the locking position relative to the DIN rail 7 (see Fig. 3C), the second end section 72 of the DIN rail 7 is clamped or clamped or arranged between the base plate 41 and the first locking projection 45. In particular, the DIN rail 7 or the second end section 45 can be clamped in the Z-direction between the base plate 41 and the first locking projection 45. Thus, when the device carrier module 3 is in the locking position, movement of the device carrier module 3 relative to the DIN rail 7 (especially along the Z-direction) is prevented. The device carrier module 3 is therefore locked to the DIN rail 7.

[0071] When the locking element 43 is in the second position, the second locking projection 430 is bounded in the Y direction by a second boundary surface 432, wherein an angle (α) between the base plate 41 and the second boundary surface 432 is greater than 90° (see Fig. 2B). The second boundary surface 432 can, in particular, be conical. This allows for the compensation of DIN rail tolerances, as described above.

[0072] Furthermore, when the detent element 43 is in the second position, the second detent projection 430 in the opposite Y-direction is limited by a third boundary surface 433, which is formed centrally with respect to the axis of rotation 42 (see Fig. 2B). This allows the locking element 43 to be supported on a guide surface 46 in the housing, particularly when the mounting panel is mounted on the DIN rails such that the Earth's gravity points in the opposite Y-direction (as in Fig. 3A to Fig. Figure 3C shows that gravity acts from top to bottom in these figures. The central design of the third boundary surface 433 and the guide surface 46 allows for surface contact between the third boundary surface 433 and the guide surface 46, enabling the locking element 43 to rotate about the axis of rotation 42 between the first and second positions.

[0073] Furthermore, the locking element 43 is bounded by a fourth boundary surface 434. When the locking element 43 is in the second position, the fourth boundary surface 434 is under a preload generated by the spring element 44 and rests at least partially or completely against the base plate 41 (or against a side surface of the base plate 41 pointing in the Z direction) (see Fig. 3A and Fig. 3C). When the detent element 43 is in the second position, the spring element may already be (slightly) pre-tensioned. Furthermore, the detent element 43 is bounded by a fifth boundary surface 435. When the detent element 43 is in the first position, the fifth boundary surface 435 rests at least partially or completely against the cover plate 36 (or against a side surface of the cover plate 36 that points in the opposite Z-direction) (see Fig. 3B).

[0074] As in Fig. 2A to 2C and Fig. As shown in Figures 3A to 3C, the locking element 43 further comprises an engagement element 436 into which a user can engage a tool, in particular a screwdriver, to move the locking element 43 from the second position to the first position against the spring force of the spring element 44. The engagement element 436 can, in particular, be configured as a recess in the locking element 43 that points in the Z-direction. When the locking element 43 is in the second position, it is at least partially positioned between the base plate 41 and the cover plate 36, and the engagement element 436 is freely accessible through an opening 362 in the cover plate 36, particularly in the Z-direction (as shown in Figures 3A to 3C). Fig. 3A and Fig. 3C (shown).

[0075] Thus, when the device carrier module 3 is in the locking position (as shown in Fig.(as shown in Figure 3C), the user moves the locking element 43 from the second position to the first position using the tool, against the spring force of the spring element 44. Specifically, the user can engage the engagement element 436 from the outside through the opening 362 of the cover plate 36 using the tool. The user can then move the device carrier module 3 linearly along the Y-direction relative to the DIN rail 7 from the locking position to the actuation position to release the locking state between the device carrier module 3 and the DIN rail 7. The user can then, for example, move the device carrier module 3 to the removal position to remove it from the DIN rail 7. List of reference symbols 3 Device carrier module 36 Cover plate, cover 362 opening 41 Base plate 42 Rotation axis 43 Latching element, latch 430 Second resting point 431 First boundary surface 432 Second boundary surface 433 Third boundary surface 434 Fourth boundary surface 435 Fifth boundary surface 436 Intervention element 44 Spring element 45 First resting position 46 guide surface 7 DIN rail 71 First final section 72 Second final section α angle

Claims

[1] Equipment carrier module (3) for a mounting panel system for an electrical distribution board, wherein the equipment carrier module (3) comprises: a housing (4) comprising a base plate (41) arranged parallel to an X-direction and a Y-direction, wherein the Y-direction is perpendicular to the X-direction; and one or more locking units for locking the device carrier module (3) to one or more parallel DIN rails (7), such that the one or more DIN rails (7) run parallel to the X direction; each comprising one or more resting units: - a first detent projection (45) which is arranged immovably relative to the housing (4); - a detent element (43) rotatably arranged relative to the housing (4) between a first position and a second position about a rotation axis (42) parallel to the X direction, the detent element (43) comprising a second detent projection (430); and - a spring element (44) for generating a spring force to pre-tension the detent element (43) towards the second position; wherein by the application of an external force to the housing (4) in the direction of a DIN rail (7) the device carrier module (3) is linearly movable relative to the DIN rail (7) from a removal position to an actuation position against the spring force of the spring element (44); wherein, when the device carrier module (3) is in the actuation position, the locking element (43) is arranged in the first position; wherein, when the locking element (43) is in the first position, the device carrier module (3) is linearly movable back and forth along the Y-direction relative to the DIN rail (7) between the actuation position and a locking position; and wherein, when the device carrier module (3) is in the locking position and the locking element (43) is in the second position, the DIN rail (7) is clamped in the Y direction between the first locking projection (45) and the second locking projection (430) and thereby the device carrier module (3) is locked onto the DIN rail (7). [2] Device carrier module (3) according to claim 1, wherein when the device carrier module (3) is in the locking position relative to the DIN rail (7), the DIN rail (7) is clamped between the base plate (41) and the first locking projection (45). [3] Device carrier module (3) according to claim 1 or 2, wherein, when the locking element (43) is in the second position, the second locking projection (430) extends beyond the base plate (41) in the direction of the DIN rail (7). [4] Device carrier module (3) according to one of the preceding claims, wherein, when the locking element (43) is in the second position, the second locking projection (430) is limited in the direction of the DIN rail by a first limiting surface (431) which runs parallel to the base plate (41). [5] Device carrier module (3) according to one of the preceding claims, wherein, when the locking element (43) is in the second position, the second locking projection (430) is limited in the Y direction by a second boundary surface (432), wherein an angle (α) between the base plate (41) and the second boundary surface is greater than 90°. [6] Device carrier module (3) according to one of the preceding claims, wherein, when the locking element (43) is in the second position, the second locking projection (430) is limited in the opposite Y direction by a third limiting surface (433) which is formed centrally with respect to the axis of rotation (42). [7] Device carrier module (3) according to one of the preceding claims, wherein the locking element (43) is limited by a fourth limiting surface (434); wherein, when the locking element (43) is in the second position, the fourth limiting surface (434) bears at least partially or completely against the base plate (41) under a preload generated by the spring element (44). [8] Device carrier module (3) according to one of the preceding claims, wherein the housing (4) comprises a cover plate (36) arranged parallel to the base plate (41); wherein the locking element (43) is bounded by a fifth boundary surface (435); and wherein, when the locking element (43) is in the first position, the fifth boundary surface (435) is at least partially or completely in contact with the cover plate (36). [9] Device carrier module (3) according to one of the preceding claims, wherein the locking element comprises an engagement element (436) into which a user can engage with a tool to move the locking element from the second position to the first position against the spring force of the spring element (44). [10] Device carrier module (3) according to claim 9, wherein the housing (4) comprises a cover plate (36) arranged parallel to the base plate (41); and wherein, when the locking element (43) is in the second position, the locking element (43) is arranged at least partially between the base plate (41) and the cover plate (36) and the engagement element (436) is exposed through an opening (362) of the cover plate (36). [11] Device carrier module (3) according to one of the preceding claims, wherein the locking element is plate-shaped. [12] Device carrier module (3) according to one of the preceding claims, wherein the locking element is made of plastic. [13] Device carrier module (3) according to one of the preceding claims, wherein the spring element (44) and the locking element (43) are formed in one piece. [14] Device carrier module (3) according to one of claims 1 to 12, wherein the spring element (44) is made of steel. [15] System comprising the device carrier module (3) according to any of the preceding claims and the one or more DIN rails (7). [16] Mounting panel system for an electrical distribution board, wherein the mounting panel system comprises the device carrier module (3) according to any one of claims 1 to 14 and a first further device carrier module (3), wherein the device carrier module (3) and the first further device carrier module (3) can be attached to one another, such that the first further device carrier module (3) is arranged offset relative to the device carrier module (3) in the X-direction. [17] Mounting panel system, preferably according to claim 16, for an electrical distribution panel, wherein the mounting panel system comprises the device carrier module (3) according to one of claims 1 to 14 and a second further device carrier module (3), wherein the device carrier module (3) and the second further device carrier module (3) can be attached to each other, such that the second further device carrier module (3) is arranged offset relative to the device carrier module (3) in the Y direction. [18] Locking element (43) for locking a device carrier module (3), preferably a device carrier module (3) according to one of claims 1 to 14, to one or more parallel DIN rails (7), such that the one or more DIN rails (7) run parallel to an X-direction, wherein the device carrier module (3) comprises: a housing (4) comprising a base plate (41) arranged parallel to the X-direction and a Y-direction, the Y-direction being perpendicular to the X-direction; a first locking projection (45) arranged immovably relative to the housing (4); and a spring element (44); wherein the locking element (43) is configured such that it can be rotatably arranged relative to the housing (4) between a first position and a second position about a rotation axis (42) which runs parallel to the X direction; wherein the spring element (44) is configured to generate a spring force to pre-tension the detent element (43) towards the second position; wherein the detent element (43) comprises a second detent projection (430); wherein by the application of an external force to the housing (4) in the direction of a DIN rail (7) the device carrier module (3) is linearly movable relative to the DIN rail (7) from a removal position to an actuation position against the spring force of the spring element (44); wherein, when the device carrier module (3) is in the actuation position, the locking element (43) is arranged in the first position; wherein, when the locking element (43) is in the first position, the device carrier module (3) is linearly movable back and forth along the Y-direction relative to the DIN rail (7) between the actuation position and a locking position; and wherein, when the device carrier module (3) is in the locking position and the locking element (43) is in the second position, the DIN rail (7) is clamped in the Y direction between the first locking projection (45) and the second locking projection (430) and thereby the device carrier module (3) is locked onto the DIN rail (7).

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