DISPLAY DEVICE

Abstract

A display device is disclosed, comprising: a substrate having a display region and a non-display region; a light-emitting element layer disposed on the substrate in the display region; an encapsulation layer disposed on the light-emitting element layer; a touch sensing layer disposed on the encapsulation layer; a color filter layer disposed on the touch sensing layer; a gate drive unit provided on the substrate in the non-display region; a dam disposed on the substrate in the non-display region and around the display region; a panel crack detector disposed at an edge portion of the substrate in the non-display region, the dam being disposed between the gate drive unit and the panel crack detector.

Description

[0001] The application claims priority from Korean Patent Application No. 10-2024-0028185, filed with the Korean Intellectual Property Office on February 27, 2024. BACKGROUND area

[0002] The disclosure relates to a display device and, more particularly, to a display device having a touch electrode. Description of the state of the art

[0003] With the entry into the information age, the field of display devices that visually represent electrical information signals has developed rapidly, and studies continue to be conducted to improve the performance of various display devices, such as reducing thickness, weight, and power consumption.

[0004] Examples of such display devices include liquid crystal displays (LCDs), electrowetting displays (EWDs), organic light emitting displays (OLEDs), and the like.

[0005] Among various display devices, an electroluminescent display device is a self-emitting display device, so unlike the LCD, a separate light source is not required. Therefore, the electroluminescent display device can be manufactured to be lighter in weight and thickness. Since the electroluminescent display device is driven by a low voltage, it is advantageous not only in terms of power consumption but also in terms of color realization, response speed, viewing angle, and contrast ratio (CR). Therefore, it is expected to be used in various fields.

[0006] In order to provide users with various functions, a display device provides a touch sensing function for detecting a touch of a finger or a stylus on the display panel and performing an input operation based on the detected touch. SUMMARY

[0007] An object to be achieved by the disclosure is to provide a display device having an improved degree of freedom in the arrangement of touch electrodes.

[0008] Another object to be achieved by the disclosure is to provide a display device having improved touch sensing capability.

[0009] The objects of the exemplary embodiment of the disclosure are not limited to the objects mentioned above, and other objects not mentioned above may be clearly apparent to those skilled in the art from the following descriptions.

[0010] Further details of the exemplary embodiments are included in the detailed description and drawings.

[0011] The object is achieved by the features of the independent claims. Preferred embodiments are specified in the dependent claims.

[0012] In the display device according to an exemplary embodiment of the disclosure, a touch sensing unit is arranged between an encapsulation layer and a color filter layer. Furthermore, touch electrodes of the touch sensing unit are arranged under a black matrix of the color filter layer. Therefore, it is possible to improve the degree of freedom in the arrangement of the touch electrodes.

[0013] In the display device according to an exemplary embodiment of the disclosure, a touch electrode line of the touch electrode is increased in width within a width of the black matrix. This allows a high metal density to be achieved. Therefore, it is possible to improve touch sensing performance.

[0014] In the display device according to an exemplary embodiment of the disclosure, a bridge electrode having a relatively lower metal density than the touch electrode is arranged on the touch electrodes. Thus, it is possible to suppress the occurrence of arcing between an inorganic layer covering the touch sensing unit and the touch electrodes. Therefore, it is possible to stably improve the touch sensing capability.

[0015] In the display device according to an exemplary embodiment of the disclosure, a dummy electrode is arranged locally on the touch electrodes. Therefore, it is possible to improve the touch sensing capability.

[0016] According to one aspect of the disclosure, there is provided a display device comprising: a substrate having a display region and a non-display region; a light-emitting element layer disposed on the substrate in the display region; an encapsulation layer disposed on the light-emitting element layer; a touch sensing layer disposed on the encapsulation layer; a color filter layer disposed on the touch sensing layer; a gate drive unit provided on the substrate in the non-display region; a dam disposed on the substrate in the non-display region and around the display region; and a panel crack detector disposed at an edge portion of the substrate in the non-display region.

[0017] Preferably, the dam may be arranged between the gate drive unit and the panel crack detector.

[0018] In one or more embodiments, the touch sensing layer may include a plurality of first touch electrodes, a plurality of second touch electrodes, and a first bridge electrode configured to electrically connect adjacent first touch electrodes.

[0019] In one or more embodiments, the color filter layer may comprise a black matrix having a plurality of first openings and a plurality of color filters each covering the plurality of first openings.

[0020] In one or more embodiments, the touch sensing layer may further comprise a touch interlayer insulating layer disposed between the first bridge electrode and the first touch electrodes.

[0021] In one or more embodiments, the first bridge electrode may be electrically connected to the first touch electrodes through a contact hole formed in the touch interlayer insulating layer.

[0022] In one or more embodiments, the first bridge electrode, the plurality of first touch electrodes, and the plurality of second touch electrodes may be disposed below the black matrix.

[0023] In one or more embodiments, the light-emitting element layer may include a plurality of sub-pixels and a bank layer having a plurality of second openings defining emission regions of the plurality of sub-pixels.

[0024] In one or more embodiments, the first opening and the second opening may have corresponding shapes.

[0025] In one or more embodiments, a size of the first opening may be greater than or equal to a size of the second opening.

[0026] In one or more embodiments, the touch sensing layer may further comprise a second bridge electrode configured to electrically connect adjacent second touch electrodes.

[0027] In one or more embodiments, the plurality of second touch electrodes and the second bridge electrode may be integrally formed on the same layer.

[0028] In one or more embodiments, in a plan view, the centers of a first opening and a second opening may overlap each other with a gap formed therebetween.

[0029] In one or more embodiments, the gap may have a circular ring shape or a polygonal ring shape.

[0030] In one or more embodiments, the plurality of first touch electrodes and the plurality of second touch electrodes may be formed in a mesh shape with a plurality of third openings.

[0031] In one or more embodiments, the plurality of sub-pixels may be arranged in the plurality of third openings in a plan view.

[0032] In one or more embodiments, the sub-pixel may not be arranged in at least one of the plurality of third openings in a plan view.

[0033] In one or more embodiments, the display device may further comprise a mesh-shaped dummy electrode.

[0034] In one or more embodiments, the dummy electrode may overlap the plurality of first touch electrodes and the plurality of second touch electrodes in a plan view.

[0035] The effects of the disclosure are not limited to the above-mentioned effects, and other effects not mentioned above will be apparent to those skilled in the art from the following description.

[0036] The objects to be achieved by the disclosure, the means for achieving the objects and the effects of the disclosure described above do not specify essential features of the claims and therefore the scope of the claims is not limited to the disclosure of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and other aspects, features and advantages of the disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: Fig. 1 is a block diagram of a display device of an embodiment of the disclosure; Fig. 2 is a plan view of a display panel of an embodiment of the disclosure; Fig. 3 is an exploded perspective view showing an arrangement structure of a touch sensing layer in the display device according to an exemplary embodiment of the disclosure; Fig. 4 is a plan view showing a structure of a touch sensing unit disposed on the touch sensing layer according to an exemplary embodiment of the disclosure; Fig. 5 a cross-sectional view along the line II' of Fig. 3; Fig. 6 is a plan view showing an overlap structure of a bank and a touch electrode in the display device according to an exemplary embodiment of the disclosure; Fig. 7 is a plan view showing an overlap structure of a black matrix and a touch electrode in the display device according to an exemplary embodiment of the disclosure; Fig. 8 a cross-sectional view along the line II-II' of Fig. 4, which shows another example of a touch electrode structure of the display device of an embodiment of the disclosure; Fig. 9 a cross-sectional view along the line II-II' of Fig. 4, which shows another example of the touch electrode structure of the display device of an embodiment of the disclosure; and Fig. 10 is a plan view showing an overlap structure of a touch electrode and a dummy electrode in the display device. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] Advantages and features of the disclosure, as well as a method for achieving the advantages and features, will become apparent by reference to various embodiments described in detail below together with the accompanying drawings. However, the disclosure is not limited to the various embodiments disclosed herein, but will be implemented in various forms. Various embodiments are provided only as examples so that those skilled in the art can fully understand the disclosures and scope of the disclosure.

[0039] The shapes, sizes, ratios, angles, numbers, and the like illustrated in the accompanying drawings for describing various embodiments of the disclosure are merely examples, and the disclosure is not limited thereto. Like reference numerals generally designate like elements throughout the disclosure. Furthermore, in the following description of the disclosure, detailed explanation of known related technologies may be omitted in order not to unnecessarily obscure the subject matter of the disclosure. The terms "comprising," "having," and "consisting of" as used herein are generally intended to allow for the addition of other components unless the terms are used with the term "only." All references in the singular may include the plural unless expressly stated otherwise.

[0040] Components are designed to include a typical error range, even if this is not explicitly stated.

[0041] When the positional relationship between two parts is described with terms such as "on", "over", "under" and "next to", one or more parts may be positioned between the two parts, unless the terms are used with the term "immediate" or "direct".

[0042] When one element or layer is placed "on top of" another element or layer, another layer or element may be placed directly on top of the other element or between them.

[0043] Although the terms "first," "second," and the like are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from the other components. Therefore, a first component mentioned below may be a second component in a technical concept of the disclosure.

[0044] Like reference numerals generally refer to like elements throughout the disclosure.

[0045] The size and thickness of each component shown in the drawings are shown for ease of explanation and are not limited to the size and thickness of the component shown in embodiments of the disclosure.

[0046] The features of the various embodiments of the disclosure may be partially or fully coupled or combined with each other and may be interlocked and operated in technically different ways, and respective embodiments may be practiced independently of each other or in conjunction with each other.

[0047] Further details of the exemplary embodiments are contained in the detailed description and the drawings.

[0048] Fig. 1 is a block diagram of a display device of an embodiment of the disclosure.

[0049] Fig. 2 is a plan view of a display panel of one embodiment of the disclosure.

[0050] With reference to Fig. 1 and Fig. 2, a display device 100 according to an exemplary embodiment of the disclosure may include an image processor 151, a timing controller 152, a data driver 153, a gate driver 154, and a display panel DP.

[0051] The image processor 151 outputs drive signals including an externally supplied data signal DATA and a data enable signal DES. In addition to the data enable signal DES, the image processor 151 may output drive signals including one or more vertical synchronization signals, a horizontal synchronization signal, and a clock signal.

[0052] The timing controller 152 is supplied with the data signal DATA along with a drive signal including the data enable signal DES from the image processor 151. The timing controller 152 outputs a gate timing control signal GDC for controlling an operating timing of the gate driver 154 based on the drive signal. The timing controller 152 outputs the data signal DATA supplied from the image processor 151 and a data timing control signal DDC for controlling an operating timing of the data driver 153.

[0053] Data driver 153 samples and holds the data signal DATA supplied from timing controller 152 in response to the data timing control signal DDC supplied from timing controller 152. Data driver 153 then converts the data signal into a gamma reference voltage and outputs the converted gamma reference voltage. Data driver 153 outputs the data signal DATA via data lines DL1 through DLn.

[0054] Gate driver 154 can output a gate signal while shifting a gate voltage level in response to gate timing control signal GDC supplied from timing controller 152. Gate driver 154 also outputs the gate signal via gate lines GL1 through GLm.

[0055] To provide a touch sensing function, the display device 100 according to the exemplary embodiment of the disclosure may further include a touch sensing unit including a plurality of touch electrodes. Furthermore, the display device 100 may include a touch sensing circuit that supplies a touch drive signal to the touch sensing unit, detects a touch sensing signal from the touch sensing unit, and detects the presence of a user's touch and a touched position (or coordinates).

[0056] For example, the touch sensing circuit may include a touch control circuit configured to provide the touch control signal to the touch sensing unit and detect the touch sensing signal from the touch sensing unit. Furthermore, the touch sensing circuit may include a touch controller configured to detect the presence of the user's touch and / or the touched position based on the touch sensing signal detected by the touch control circuit. The touch control circuit and the touch controller may be implemented as separate components or integrated into a single component, if desired.

[0057] Meanwhile, the data driver 153, the gate driver 154, and the touch drive circuit may each be implemented as one or more integrated circuits. Regarding the electrical connection to the display panel DP, the data driver 153, the gate driver 154, and the touch drive circuit may each be implemented by a COG (chip-on-glass) type, a COF (chip-on-film) type, a TCP (tape carrier assembly) type, or the like.

[0058] Furthermore, the timing controller 152, the data driver 153 and the gate driver 154 for display driving, and the touch sensing circuit elements may each be implemented as one or more individual components. In some cases, at least one of the display driving elements 152, 153, and 154 and at least one of the touch sensing circuit elements may be functionally integrated into one or more components. For example, the data driver 153 and the touch driving circuit may be integrated into one or more integrated circuit chips. In the case where the data driver 153 and the touch driving circuit are integrated into two or more integrated circuit chips, each of the two or more integrated circuit chips may have a data driving function and a touch driving function.

[0059] The display panel DP may include a plurality of pixels P. Each of the plurality of pixels P emits light in response to data signals and gate signals supplied from the data driver 153 and the gate driver 154 to display images.

[0060] Each pixel P may consist of a plurality of sub-pixels SP. For example, each pixel P may include three or more sub-pixels SP configured to emit light of different colors in different wavelength ranges. For example, in the display device 100 according to the exemplary embodiment of the disclosure, each pixel P may include sub-pixels SP that emit red light, green light, and blue light, respectively. However, the number of sub-pixels SP included in each pixel P is not limited. For example, each pixel SP may include a sub-pixel SP that emits white light, in addition to the sub-pixels SP that emit red light, green light, and blue light, respectively.

[0061] A plurality of gate lines GL1 to GLm extending in a first direction and a plurality of data lines DL1 to DLn extending in a second direction different from the first direction are arranged on the display panel DP so as to intersect each other. Subpixels SP are defined at the respective intersections of the plurality of gate lines and the plurality of data lines on the display panel DP.

[0062] As it is in Fig. 2, the display panel DP comprises a substrate 110.

[0063] The substrate 110 is a component for supporting various components of the display device 100. The substrate 110 may be made of an insulating material. The substrate 110 may also be made of a transparent material. Furthermore, the substrate 110 may be a rigid substrate or a flexible substrate that can be bent, folded, rolled, or the like. The substrate 110 may be made of glass or a plastic material that has flexibility. For example, when the substrate 110 is made of polyimide (PI), a plastic material, a manufacturing process of the display device 100 is performed in a state where a support substrate made of glass is arranged under the substrate 110. After the manufacturing process of the display device 100 is completed, the support substrate can be released.

[0064] As it is in Fig. As shown in Figure 2, the substrate 110 of the display panel DP may include a display area DA and a non-display area NA located outside the display area DA and in which the plurality of pixels P are not arranged. The non-display area NA is adjacent to the display area DA and may be located in an outer portion more than the display area DA.

[0065] The display area DA of the substrate 110 may refer to an area where the pixels P are arranged and images are displayed. A plurality of sub-pixels SP1, SP2, and SP3 may be arranged in the display area DA, and the plurality of sub-pixels SP1, SP2, and SP3 may constitute one pixel P.

[0066] The non-display region NA of the substrate 110 may include a peripheral region surrounding the display region DA, a bending region BA extending and bending from one side of the peripheral region, and a pad region PA extending from the bending region BA. Fig. 2 shows a state before the substrate 110 is bent.

[0067] The non-display area NA of the substrate 110 refers to an area where various wiring lines and circuits for driving the sub-pixels SP1, SP2, and SP3 arranged in the display area DA are arranged. The non-display area NA is an area where no image is displayed and therefore need not be seen from the front side of the display panel DP. Therefore, a partial area of ​​the non-display area NA of the substrate 110 may be bent toward the rear surface of the display panel DP. For example, an edge of the substrate 110 may be bent toward the rear surface of the display panel DP to have a predetermined curvature. In this case, the pad area PA may be arranged to overlap the display area DA on the rear surface of the display panel DP.Accordingly, it is possible to ensure an area for the wiring lines and drive circuits and reduce the non-display area NA.

[0068] A contact pad unit 114 may be arranged in the contact pad area PA of the substrate 110. The contact pad unit 114 may be a metal pattern to which an external module, e.g., a flexible printed circuit board (FPCB) and a chip-on-film (COF), is connected. Although Fig. 2 shows that the contact point unit 114 is arranged on one side of the non-display area NA, the shape and arrangement of the contact point unit 114 are not limited thereto.

[0069] In addition, a connection line 116 may be arranged in a part of the non-display region NA of the substrate 110. For example, the connection line 116 may be arranged in a part of the edge region of the substrate 110 adjacent to the bending region BA.

[0070] The connection line 116 can transmit a signal (e.g., a voltage) from the external module connected to the pad unit 114 to the display area DA or a circuit unit such as a gate drive unit 112 included in the gate driver 154. The gate drive unit 112 supplies a gate signal to a thin-film transistor of a pixel drive circuit and includes various gate drive circuits. In the display device 100 according to the exemplary embodiment of the disclosure, the gate drive unit 112 can be provided in a gate-in-panel (GIP) structure in which the gate drive circuits are provided directly on the substrate 110.

[0071] Various signals and voltages, such as gate signals, data signals, high-potential voltages, and low-potential voltages, can be transmitted via the connection line 116. The connection line 116 can be classified as a power connection line and / or a signal connection line depending on the voltage and / or signal to be transmitted. The power connection line can transmit a voltage supplied from the external module to the display area DA. The power connection line can be connected to, but is not limited to, a low-potential voltage line VSS, a high-potential voltage line VDD, and a gate low-voltage line and / or a gate high-voltage line included in the gate drive unit 112. In addition, the signal connection line can transmit a signal supplied from the external module to the display area DA for image display.The signal connection line may be connected to, but is not limited to, a gate line and / or a data line.

[0072] A dam 117 may be disposed in the non-display region NA of the substrate 110 to enclose all or part of the display region DA. The dam 117 is adjacent to the display region DA and may be disposed more in an outer portion than the display region DA. The dam 117 may be disposed along the periphery of the display region DA to control the flow of a layer containing an organic material in an encapsulation layer disposed on a light-emitting element. There may be one or more than one dam 117.

[0073] A panel crack detector 118 may further be disposed in a portion of the non-display area NA of the substrate 110. The panel crack detector 118 may be disposed between an end point of the substrate 110 and the dam 117. The panel crack detector 118 may also be disposed below the dam 117 so as to overlap at least a portion of the dam 117. The panel crack detector 118 may be disposed on an outer periphery of the display device 100 to detect defects such as cracks that may occur in an outer peripheral portion.

[0074] Fig. 3 is an exploded perspective view showing an arrangement structure of a touch sensing layer in the display device according to an exemplary embodiment of the disclosure.

[0075] With reference to Fig. 3, the display device 100 according to the exemplary embodiment of the disclosure includes a substrate layer SUB having a plurality of sub-pixels SP arranged in the display area DA of the substrate 110. Furthermore, the display device 100 includes a touch sensing layer TSL arranged on the substrate layer SUB and including a plurality of touch electrodes TE. Furthermore, the display device 100 includes a color filter layer CFL arranged on the touch sensing layer TSL and including a plurality of color filters and a black matrix arranged between the color filters on the same layer.

[0076] The display area DA of the substrate 110 refers to an area in which the plurality of pixels P are arranged to realize images. Each pixel P may include a plurality of sub-pixels SP, which include a light-emitting element 200 and a pixel drive circuit configured to control the current flowing in the light-emitting element 200. The pixel drive circuit may include a plurality of drive transistors (TFTs).

[0077] In an exemplary embodiment of the disclosure, the display device 100 is assumed to be an organic light-emitting display device, but it is not limited thereto. For example, when the display device 100 is an organic light-emitting display device, each sub-pixel may include the light-emitting element 200 having an anode, a light-emitting layer on the anode, and a cathode on the light-emitting layer. In this case, the light-emitting element 200 may include an organic light-emitting layer as the light-emitting layer. Furthermore, the light-emitting element 200 may include, in addition to the organic light-emitting layer, a hole-transport layer, a hole-injection layer, an electron-injection layer, and an electron-transport layer.As another example, when the display device 100 is a liquid crystal display device, a display unit may be configured to include a liquid crystal layer.

[0078] With reference to Fig. 3, the pixel drive circuit of the sub-pixel SP according to an exemplary embodiment of the disclosure may include a drive transistor DT, a switching transistor ST, and a capacitor Cst. Furthermore, the pixel drive circuit may include a gate line GL, a data line DL, and lines connected to the power supplies VDD and VSS for driving pixels.

[0079] The light-emitting element 200 can emit light in response to a drive current generated by the drive transistor DT. The switching transistor ST can perform a switching operation such that a data signal supplied via the data line DL is stored as a data voltage in the capacitor Cst in response to the gate signal supplied via the gate line GL. The drive transistor DT can operate such that a constant drive current flows between the high-potential power supply VDD and the low-potential power supply VSS in response to the data voltage stored in the capacitor Cst.

[0080] Each sub-pixel SP in the display device 100 according to the exemplary embodiment of the disclosure has been described above as having a 2T1C (2-transistor-1-capacitor) structure including a switching transistor ST, a driving transistor DT, and a capacitor Cst.

[0081] In another example, the subpixel may further include a compensation circuit 135 as shown in Fig. 3 is shown.

[0082] Compensation circuit 135 is a circuit for compensating a threshold voltage, etc., of drive transistor DT and may include one or more thin-film transistors and capacitors. The configuration and structure of a compensation thin-film transistor and a compensation capacitor are not limited and may vary depending on the compensation method. When compensation circuit 135 is added to the sub-pixel, the sub-pixel may be formed in various shapes, such as 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, and 7T2C.

[0083] Hereinafter, the touch sensing unit of the display device 100 according to the exemplary embodiment of the disclosure will be described with reference to Fig. 4 to Fig. 7 described in detail.

[0084] Fig. 4 is a plan view showing a structure of a touch sensing unit disposed on the touch sensing layer according to an exemplary embodiment of the disclosure. Fig. 5 is a cross-sectional view along line II' of Fig. 3. Fig. 6 is a plan view showing an overlap structure of a bank and a touch electrode in the display device according to an exemplary embodiment of the disclosure. Fig. 7 is a plan view showing an overlap structure of a black matrix and a touch electrode in the display device according to an exemplary embodiment of the disclosure.

[0085] With reference to Fig. 4 and Fig. 5, the touch sensing layer TSL is located on an encapsulation layer ENCAP, and the touch sensing unit is arranged in the touch sensing layer TSL. In this case, the touch sensing unit includes the plurality of touch electrodes TE and the plurality of bridge electrodes BE1 and BE2, which are configured to electrically connect unit electrodes of the plurality of touch electrodes TE.

[0086] As it is in Fig. For example, as shown in Figure 4, the touch sensing unit includes a plurality of first touch electrodes TE1, each extending in a first direction, and a plurality of second touch electrodes TE2, each extending in a second direction intersecting the first direction. Further, a plurality of first touch routing lines, each connected to the plurality of first touch electrodes TE1, a plurality of second touch routing lines, each connected to the plurality of second touch electrodes TE2, and a plurality of touch pads, each connected to the plurality of first and second touch routing lines, may be arranged on the substrate 110.

[0087] Each of the plurality of first touch electrodes TE1 and the plurality of second touch electrodes TE2 may include a plurality of unit electrodes. For example, each of the first touch electrodes TE1 and the second touch electrodes TE2 may include a plurality of unit electrodes structured in a mesh network.

[0088] Fig. 4 shows that the first touch electrode TE1 includes unit electrodes structured in a rhombic mesh pattern in series, but this is not limited to this. The unit electrodes may be structured in various shapes, such as triangles, squares, diamonds, or other polygonal shapes. Here, the unit electrodes of the first touch electrode TE1 and the plurality of second touch electrodes TE2 structured in a mesh pattern may include a plurality of first touch electrode lines TEL1 and a plurality of second touch electrode lines TEL2 surrounding an opening OA_T. The first touch electrode line TEL1 and the second touch electrode line TEL2 serve as an essential touch electrode to which touch drive signals are applied or touch detection signals are detected.Each of the at least one opening OA_T in the first touch electrode TE1 can correspond to an emission region of the sub-pixel SP. That is, a plurality of openings OA_T serve as a path along which light emitted from the sub-pixels SP arranged below it exits. Fig. 4 shows an example of the structure of the unit electrodes of the first touch electrode TE1, but the second touch electrode TE2 may also have the same structure.

[0089] The display device 100 according to the exemplary embodiment of the disclosure may detect a touch by a mutual capacitance scheme or a self-capacitance scheme as a capacitance-based touch detection scheme.

[0090] In the case of a mutual-capacitance-based touch sensing scheme, the plurality of touch electrodes TE may be divided into touch drive electrodes to which touch drive signals are applied, and touch sensing electrodes at which touch sensing signals are detected and which form capacitances with the touch drive electrodes. For example, the first touch electrodes TE1 may serve as touch sensing electrodes configured to detect touch sensing signals. In this case, the second touch electrodes TE2 may serve as drive electrodes to which drive signals are applied, but are not limited thereto. That is, the first touch electrodes TE1 may serve as drive electrodes, and the second touch electrodes TE2 may serve as touch sensing electrodes.

[0091] In the case of a self-capacitance-based touch sensing scheme, the plurality of touch electrodes TE can serve as both drive electrodes and touch sensing electrodes. That is, the touch sensing circuit applies touch drive signals to one or more touch electrodes TE, detects touch sensing signals through the touch electrodes TE to which the touch drive signals are applied, detects a capacitance change formed between a pointer such as a finger or a stylus and the touch electrodes TE based on the detected touch sensing signals, and detects the presence of a touch and / or the coordinates of a touch. In the case of the self-capacitance-based touch sensing scheme, the drive electrodes and the touch sensing electrodes are not distinguished.For example, each of the plurality of first touch electrodes TE1 and the plurality of second touch electrodes TE2 may serve as both a drive electrode and a touch sensing electrode.

[0092] With joint reference to Fig. 4 to Fig. 6, the touch electrode line TEL1 of the first touch electrode TE1 may be arranged on a bank 400 arranged between the sub-pixels SP in a non-emission region. As shown in Fig. 6, the bank 400 has a plurality of openings OA_BK corresponding to the emission areas of the plurality of sub-pixels SP. Therefore, the opening OA_T of the touch electrode may overlap the opening OA_BK of the bank 400. In one embodiment, the sub-pixels SP are each located in the opening OA_T of the touch electrode in a plan view. However, as shown in Fig. As can be seen in Figure 6, the subpixels SP are not present in at least some of the openings OA_T in the top view.

[0093] With joint reference to Fig. 4 to Fig. 7, the touch electrode line TEL1 of the first touch electrode TE1 may be located under a black matrix 710 arranged between the sub-pixels SP in the non-emission region. As shown in Fig. As shown in FIG. 7, the black matrix 710 has a plurality of openings OA_BM corresponding to the emission regions of the plurality of sub-pixels SP. Therefore, the opening OA_T of the first touch electrode TE1 may overlap the opening OA_BK of the bank 400 and the opening OA_BM of the black matrix 710.

[0094] The plurality of subpixels SP may have different pixel structures. For example, a blue subpixel, a green subpixel, and a red subpixel may have different pixel structures. Since the plurality of subpixels SP have different pixel structures, the opening OA_BM of the black matrix 710 and the opening OA_BK of the bank 400 may have different shapes for respective emission regions of the blue subpixel, the green subpixel, and the red subpixel. However, the disclosure is not limited thereto.

[0095] An example of the structure of the unit electrodes of the first touch electrode TE1 has been described above, but the second touch electrode TE2 may also have the same structure.

[0096] As it is in Fig. 4, the touch sensing unit includes a first bridge electrode BE1 configured to electrically connect the unit electrodes of the first touch electrode TE1. Furthermore, the touch sensing unit includes a second bridge electrode BE2 configured to electrically connect the unit electrodes of the second touch electrode TE2. Here, the first touch electrode TE1 and the first bridge electrode BE1 are arranged on different layers, and the first bridge electrode BE1 is arranged on an upper layer of the first touch electrode TE1. However, the disclosure is not limited thereto. In another embodiment, the first bridge electrode BE1 may be arranged below the first touch electrode TE1. Furthermore, the second touch electrode TE2 and the second bridge electrode BE2 may be arranged on the same layer.For example, the second touch electrode TE2 and the second bridge electrode BE2 may be integrally structured. In this case, the second bridge electrode may serve to connect one end of any unit electrode of the second touch electrode TE2 and one end of another unit electrode of the second touch electrode TE2. However, the disclosure is not limited thereto. In another embodiment, the first touch electrode TE1 and the first bridge electrode BE1 may be arranged on the same layer and integrally structured, and the second touch electrode TE2 and the second bridge electrode BE2 may be arranged on different layers, and the second bridge electrode BE2 may be arranged above / below the second touch electrode TE2.

[0097] Next, a laminated structure of the sub-pixel SP, the touch sensing layer TSL and the color filter layer CFL arranged in the display area DA on the substrate 110 will be described with reference to Fig. 5 described in more detail.

[0098] With reference to Fig. 5, the display device 100 according to the exemplary embodiment of the disclosure may have a structure in which the substrate layer SUB, a transistor layer TRL on the substrate layer SUB, a planarization layer PLN on the transistor layer TRL, a light-emitting element layer EDL on the planarization layer PLN, the encapsulation layer ENCAP on the light-emitting element layer EDL, the touch sensing layer TSL on the encapsulation layer ENCAP, and the color filter layer CFL on the touch sensing layer TSL are sequentially laminated. In this case, a protective layer, an organic layer, a polarization layer, and a cap layer may be disposed on the color filter layer CFL of the display device 100.

[0099] Fig. 5 shows, as an example, two subpixels emitting light in different wavelength ranges among the plurality of subpixels SP in the display area DA. However, other subpixels emitting light in other wavelength ranges may have the same structure, except for the light output from light-emitting stacks of the light-emitting elements 200.

[0100] The substrate layer SUB includes the substrate 110, which serves to support and protect the components of the display device arranged thereon.

[0101] For example, if the substrate 110 is made of polyimide (PI), moisture may permeate through the PI substrate 110 and penetrate into the thin-film transistor or the light-emitting element, thus degrading the performance of the display device 100. The display device 100 according to the exemplary embodiment of the disclosure may use a double PI structure as the substrate 110 to suppress the degradation of the performance of the display device 100 caused by moisture intrusion.

[0102] For example, the substrate 110 may include a first substrate and a second substrate, each made of PI, and an inorganic insulating layer disposed between the first substrate and the second substrate. The inorganic insulating layer may be composed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx), or multiple layers thereof. The inorganic insulating layer may be composed of, for example, but not limited to, a silicon dioxide (SiO2) material. The inorganic insulating layer may be formed by a double layer of SiO2 and SiNx. The inorganic insulating layer serves to prevent moisture from penetrating the second substrate. Furthermore, when charges are loaded into the first substrate, the inorganic insulating layer may block the effect of the charged charges on a thin-film transistor 300 through the second substrate.Since the charges in the lower PI are blocked by the inorganic insulating layer, product performance reliability can be improved. Furthermore, a separate process for forming a metal layer to block the charges can be eliminated, simplifying the overall process and reducing production costs.

[0103] The substrate layer SUB may also include a buffer layer 120 arranged on the substrate 110.

[0104] Buffer layer 120 may, for example, comprise a multiple buffer layer arranged on substrate 110 and an active buffer layer arranged on the multiple buffer layer. A metal layer serving as a light shield may also be arranged between the multiple buffer layer and the active buffer layer. The metal layer may also be referred to as a light-shielding layer.

[0105] A thin film transistor comprising a drive transistor Td and at least one switching transistor Ts, various patterns for forming at least one capacitor, various insulating layers, and various metal patterns may be arranged in the transistor layer TRL.

[0106] With reference to Fig. 5, the thin-film transistor 300 may be arranged on the buffer layer 120. The thin-film transistor 300 may include an active layer 310, a gate electrode 330, a source electrode 350, and a drain electrode 370. Fig. 5 shows that the drain electrode 370 of the thin-film transistor 300 is electrically connected to an anode (or first electrode) 210 of the light-emitting element 200, which will be described below. However, the disclosure is not limited thereto. That is, depending on the design of the pixel drive circuit, the source electrode 350 may serve as the drain electrode and the drain electrode 370 may serve as the source electrode.

[0107] The active layer 310 of the thin-film transistor 300 may include a channel region in which a channel is formed when the thin-film transistor 300 is driven, as well as a source region and a drain region on both sides of the channel region. The source region of the active layer 310 is connected to the source electrode 350, and the drain region is connected to the drain electrode 370. The source region and the drain region may be formed, for example, by ion doping (impurity doping) of the active layer 310. The source region and the drain region may be created by doping ions into a polysilicon material. The channel region may refer to a portion where the ions are not doped, but the polycrystalline silicon material remains. However, the disclosure is not limited thereto.

[0108] A gate insulating layer 130 is disposed on the active layer 310. The gate insulating layer 130 may be disposed on the entire substrate 110, including the active layer 310. The gate insulating layer 130 may be formed, for example, by a single layer of silicon nitride (SiNx) or silicon oxide (SiOx), or a multilayer thereof. The gate insulating layer 130 may include contact holes. The contact holes serve to connect the source electrode 350 and the drain electrode 370 of the thin-film transistor 300 to the source region and the drain region, respectively, of the active layer 310 of the thin-film transistor 300.

[0109] The gate electrode 330 of the thin-film transistor 300 is disposed on the gate insulating layer 130. The gate electrode 330 may, for example, consist of a single layer of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), and neodymium (Nd), or an alloy thereof, or a multilayer thereof. The gate electrode 330 may be formed on the gate insulating layer 130 such that it overlaps the channel region of the active layer 310 of the thin-film transistor 300.

[0110] An interlayer insulating layer 140 is disposed on the gate electrode 330. The interlayer insulating layer 140 may, for example, consist of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx), or a multilayer thereof. The interlayer insulating layer 140 may include contact holes for exposing the source and drain regions of the active layer 310 of the thin-film transistor 300.

[0111] A first inorganic layer 150 may be disposed on the interlayer insulating layer 140. The first inorganic layer 150 may be a passivation layer for protecting the thin-film transistor 300 and may be omitted. The first inorganic layer 150 may be made of, for example, silicon nitride (SiNx) or silicon oxide (SiOx), or may be formed by a double layer thereof.

[0112] A planarization layer 160 consisting of at least one layer is disposed in the planarization layer PLN. The planarization layer 160 may be an organic layer that planarizes and protects upper portions of the thin-film transistor 300. For example, the planarization layer 160 may be made of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0113] The light-emitting element 200 arranged in the light-emitting element layer EDL comprises the anode 210, a light-emitting layer 220, and a cathode (or second electrode) 230. Furthermore, the bank 400 arranged in the light-emitting element layer EDL defines emission regions of the plurality of sub-pixels SP. In Fig. 6, the bank 400 may, for example, have the opening OA_BK to expose a portion corresponding to an emission region of the sub-pixel SP.

[0114] The anode 210 of the light-emitting element 200 is disposed on the planarization layer 160. The anode 210 may be made of a metallic material and electrically connected to the thin-film transistor 300 via the contact hole formed in the planarization layer 160. For example, if the display device 100 according to the exemplary embodiment of the disclosure is of the top-emission type, the light emitted from the light-emitting element 200 is emitted above the substrate 110. In this case, the anode 210 may further include a transparent conductive layer and a reflective layer on the transparent conductive layer. For example, the transparent conductive layer may be made of a transparent conductive oxide such as ITO or IZO, and the reflective layer may be made of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof.

[0115] Bank 400 may be arranged to cover both ends of anode 210, and a portion of anode 210 may be exposed through opening OA_BK of bank 400. Bank 400 may be made of, for example, an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), or an organic insulating material such as benzocyclobutene resin, acrylic resin, or imide resin, but is not limited thereto. A spacer may further be arranged on bank 400.

[0116] The light-emitting layer 220 of the light-emitting element 200 is arranged on and around the opening OA_BK of the bank 400. Therefore, the light-emitting layer 220 can be arranged on the anode 210, which is exposed through the opening OA_BK of the bank 400. The light-emitting layer 220 can, for example, comprise a plurality of organic films. The cathode 230 is arranged on the light-emitting layer 220 of the light-emitting element 200.

[0117] In the encapsulation layer ENCAP on the light-emitting element layer EDL, an encapsulation layer 500 is arranged, which has a single-layer or multi-layer structure. As shown in Fig. As shown in Figure 5, the encapsulation layer 500 may, for example, include a first encapsulation layer 510, a second encapsulation layer 520, and a third encapsulation layer 530. The first encapsulation layer 510 and the third encapsulation layer 530 may be formed by inorganic films, and the second encapsulation layer 520 may be formed by an organic film. Of the first encapsulation layer 510, the second encapsulation layer 520, and the third encapsulation layer 530, the second encapsulation layer 520 is the thickest and may serve as a planarization layer.

[0118] The first encapsulation layer 510 may be disposed closest to the light-emitting element 200. That is, the first encapsulation layer 510 may be disposed on the cathode 230 of the light-emitting element layer EDL. The first encapsulation layer 510 may be made of an inorganic insulating material capable of low-temperature deposition. For example, the first encapsulation layer 510 may be made of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), aluminum oxide (Al2O3), or the like. The first encapsulation layer 510 is deposited under a low-temperature atmosphere. In this way, it is possible to prevent damage to the light-emitting layer 200, which contains an organic material sensitive to a high-temperature atmosphere, during the deposition process.

[0119] The second encapsulation layer 520 may be formed to have a smaller surface area than the first encapsulation layer 510. In this case, the second encapsulation layer 520 may be formed so that both ends of the first encapsulation layer 510 are exposed. The second encapsulation layer 520 may serve as a buffer to relieve interlayer stress caused by bending of the flexible display device and to improve planarization performance. The second encapsulation layer 520 may be made of, for example, an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene, or silicon oxycarbide (SiOC). The second encapsulation layer 520 may be formed, for example, by an inkjet process. However, the disclosure is not limited thereto.

[0120] The third encapsulation layer 530 may be formed on the substrate 110 on which the second encapsulation layer 520 is formed, such that it covers the top and side surfaces of the second encapsulation layer 520 and the first encapsulation layer 510. In this case, the third encapsulation layer 530 may minimize or block the penetration of external moisture or oxygen into the first encapsulation layer 510 and the second encapsulation layer 520. The third encapsulation layer 530 may be formed, for example, by an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3). As shown in Fig. 2, at least one dam 117 may be arranged in the non-display region NA to block the flow of the second encapsulation layer 520 of the encapsulation layer 500.

[0121] The touch sensing unit is arranged in the touch sensing layer TSL in an upper portion of the encapsulation layer ENCAP. The touch sensing unit includes a plurality of touch electrodes and a plurality of bridge electrodes. As described above with reference to Fig. 4, the touch sensing unit includes a plurality of first touch electrodes TE1 extending in the first direction. Furthermore, the touch sensing unit includes a plurality of second touch electrodes TE2 extending in the second direction intersecting the first direction. Each of the plurality of first touch electrodes TE1 and the plurality of second touch electrodes TE2 may include a plurality of unit electrodes. For example, each of the first touch electrode TE1 and the second touch electrode TE2 may include a plurality of unit electrodes structured in a mesh network shape. Furthermore, the touch sensing unit includes the first bridge electrode BE1 configured to electrically connect the unit electrodes of the first touch electrode TE1.The touch sensing unit further includes the second bridge electrode BE2, which is configured to electrically connect the unit electrodes of the second touch electrode TE2. The first touch electrode TE1 and the first bridge electrode BE1 are arranged on different layers, and the first bridge electrode BE1 is arranged on an upper layer of the first touch electrode TE1. Alternatively, the second touch electrode TE2 and the second bridge electrode BE2 may be arranged on the same layer.

[0122] With reference to Fig. 5, a touch insulation layer 600 comprising insulating films is disposed on the encapsulation layer 500 for accommodating the touch sensing unit. A touch buffer layer 610 is disposed on the third encapsulation layer 530, and the first touch electrode TE1 is disposed on the touch buffer layer 610. The second touch electrode TE2 may also be disposed on the touch buffer layer 610.

[0123] The touch buffer layer 610 can suppress damage to the light-emitting layer 220, which contains a material susceptible to chemicals or moisture. When the touch sensing layer TSL is formed, chemicals (e.g., developers, etchants, etc.) used in the process, external moisture, or the like may be introduced. The touch sensing layer 610 and the touch sensing unit are disposed thereon. Therefore, it is possible to suppress the penetration of chemicals, moisture, or the like into the light-emitting layer 220, which contains an organic material, during a manufacturing process of the touch sensing unit. Furthermore, the touch buffer layer 610 can suppress damage to the light-emitting layer 220, which contains an organic material sensitive to high temperatures.Here, the touch buffer layer 610 may be formed of an organic insulating material that can be formed at a temperature below a predetermined temperature (e.g., 100°C) and has a low dielectric constant of 1 to 3. For example, the touch buffer layer 610 may be formed of an acrylic-, epoxy-, or siloxane-based material. As described above, the touch buffer layer 610 made of an organic insulating material can suppress damage to the encapsulation layer ENCAP caused by bending of the flexible display device. Thus, the touch buffer layer 610 can also suppress breakage of the plurality of touch electrodes TE1 and TE2 and the plurality of bridge electrodes BE1 and BE2 arranged on the encapsulation layer ENCAP.

[0124] A touch interlayer insulating layer 620 is disposed on the first touch electrode TE1 and the touch buffer layer 610, and the first bridge electrode BE1 is disposed on the touch interlayer insulating layer 620. The first touch electrode TE1 may be insulated from the first bridge electrode BE1 by the touch interlayer insulating layer 620. That is, the plurality of first touch electrodes TE1 extending in the first direction may be electrically connected via the bridge electrode BE1 disposed thereon. This serves to suppress a short circuit at the intersections of the plurality of touch electrodes arranged in the first direction and the second direction. At this time, the touch interlayer insulating layer 620 may have a contact hole for electrically connecting the first touch electrode TE1 and the first bridge electrode BE1.The touch interlayer insulating layer 620 may also be an organic film made of an organic material. However, the material of the touch interlayer insulating layer 620 is not limited thereto. For example, the touch interlayer insulating layer 620 may be an inorganic film made of an inorganic material.

[0125] A second inorganic layer 630 is disposed on the first bridge electrode BE1 and the touch sensing layer 620 to cover the touch sensing unit. The second inorganic layer 630 suppresses damage to the electrodes of the touch sensing unit caused by chemicals (e.g., developers, etc.) used to process the upper layer or by moisture.

[0126] Meanwhile, the display device 100 according to the exemplary embodiment of the disclosure may improve the touch sensing capability of the touch electrodes by increasing the metal density of the plurality of touch electrodes TE1 and TE2. Specifically, the touch sensing capability of the touch sensing unit may be improved by increasing the width of the touch electrode lines of the touch electrodes TE1 and TE2 or the surface area of ​​the touch electrodes TE1 and TE2 themselves to increase the metal density of the touch electrodes. For example, at least some of the touch electrode lines TEL1 of the plurality of first touch electrodes TE1 and the touch electrode lines of the plurality of second touch electrodes TE2 may have a width equal to or substantially equal to the width between some adjacent openings of the plurality of openings of the black matrix 710.Furthermore, the sum of the width of the bridge electrode BE1 and the widths of the touch electrode lines of the unit electrodes of the touch electrodes TE1 connected by the bridge electrode BE1 may be equal to or substantially equal to a width between still other adjacent openings among the plurality of openings of the black matrix 710. Furthermore, the sum of the width of the bridge electrode BE2 and the widths of the touch electrode lines of the unit electrodes of the touch electrodes TE2 connected by the bridge electrode BE2 may be equal to or substantially equal to a width between still other adjacent openings among the plurality of openings of the black matrix 710. All of the plurality of touch electrodes TE1 and TE2 and the plurality of bridge electrodes BE1 and BE2 are arranged under the black matrix 710. Therefore, they are not visible from the outside, and the metal density of the touch electrodes is increased.Accordingly, it is possible to improve the touch sensing capability of the touch electrodes.

[0127] As described above, in the display device 100 according to the exemplary embodiment of the disclosure, an overlap area between the user's touch input means (e.g., a finger or a stylus) and the touch electrodes is increased by increasing the metal density of the touch electrodes. This increases a capacitance formed between the user's touch input means and the touch electrodes. This makes it possible to improve the touch sensing capability of the touch electrodes. Fig. Figure 5 shows only the first touch electrode TE1 and the first bridge electrode BE1 to describe the structure of the touch sensing unit with a touch electrode and a bridge electrode arranged on different layers. However, like the first touch electrode TE1, the second touch electrode TE2 may also have an increased metal density.

[0128] As it is in Fig. As shown in Figure 5, the second inorganic layer 630, which is configured to shield the touch-sensing unit, is disposed on a front surface of an uppermost portion of the touch-sensing layer TSL. The second inorganic layer 630 serves as a shielding layer to minimize damage to the electrodes of the touch-sensing unit caused by chemicals (e.g., a developer, an etchant, etc.) used to form the color filter layer CFL, which is an upper layer of the touch-sensing layer TSL.

[0129] In the display device 100 according to the exemplary embodiment of the disclosure, the plurality of touch electrodes are designed to maximize the metal density. Therefore, when the plurality of touch electrodes are disposed directly under the second inorganic layer 630, an arc fault may occur at the touch electrodes having a high metal density during a process (e.g., a plasma process) for depositing the second inorganic layer 630 on the touch sensing unit. To suppress this problem, the display device 100 according to the exemplary embodiment of the disclosure includes a plurality of touch electrodes TE1 and TE2 disposed under the touch interlayer insulating layer 620, which is an organic film.Furthermore, the first bridge electrode BE1, which has a lower metal density, is disposed on the touch interlayer insulating layer 620 and under the second inorganic layer 630. Therefore, it is possible to suppress the occurrence of an arc fault during a process of forming the second inorganic layer 630 and improve the touch sensing performance.

[0130] A plurality of color filters 720 and the black matrix 710 formed between the plurality of color filters 720 on the same layer are arranged in the color filter layer CFL on an upper portion of the touch sensing layer TSL.

[0131] As it is in Fig. 5, the color filters 720_A and 720_B and the black matrix 710 are arranged on the second inorganic layer 630.

[0132] The black matrix 710 is arranged on the second inorganic layer 630 so as to overlap the bank 400, and the plurality of color filters 720 are arranged so as to overlap a plurality of openings OA_BM of the black matrix 710. Each color filter 720 reduces the reflection and perception of external light entering the bank 400 from the outside, but does not block the light emitted from the light-emitting element 200. Thus, it is possible to maintain the luminous efficiency. The black matrix 710 is arranged so as to overlap an edge of an emission region of the light-emitting element 200 and serves to absorb light entering the black matrix 710 from the outside. Thus, it is possible to reduce the amount of external light entering the emission region and also suppress the perception of reflected light of the external light. The opening OA_BM of the black matrix 710 may overlap the opening OA_BK of the bank 400.In addition, the opening OA_BM of the black matrix 710 may have a larger area than the opening OA_BK of the bank 400. In this case, the width of a touch electrode line of each of the touch electrodes TE1 and TE2 may not be larger than, and may be substantially equal to, the width between the openings OA_BM of the black matrix 710. That is, the openings OA_BM of the black matrix 710, the opening OA_T of the first touch electrode TE1, and the opening OA_BK of the bank 400 are provided at corresponding positions in a direction perpendicular to the substrate 110. For example, the centers of the openings OA_BM, the opening OA_T, and the opening OA_BK may be on the same line perpendicular to the substrate 110, and the openings OA_BM, the opening OA_T, and the opening OA_BK may have corresponding shapes. In one embodiment, the size of the opening OA_T may be greater than or equal to the size of the opening OA_BK.In one embodiment, the size of the opening OA_T may be smaller than, but substantially equal to, the size of the openings OA_BM. In one embodiment, the centers of the opening OA_BM and the opening OA_BK overlap, with a gap formed therebetween, which may have a circular ring shape or a polygonal ring shape.

[0133] An insulating layer 730 may be disposed on the black matrix 710 and the plurality of color filters 720, and the insulating layer 730 may be made of an organic material.

[0134] In a display device in which the touch sensing unit is arranged on the color filter layer CFL or does not have the color filter layer CFL, external light is reflected by the touch electrodes. This makes the touch electrodes perceptible. In this case, the arrangement and area of ​​the touch electrodes are limited. However, in the display device 100 according to the exemplary embodiment of the disclosure, the touch sensing unit is arranged between the encapsulation layer ENCAP and the color filter layer CFL. In addition, the touch electrodes of the touch sensing unit are arranged below the black matrix 710. Therefore, the degree of freedom in the arrangement of the touch electrodes is increased. This makes it possible to increase the metal density of the touch electrodes.

[0135] In the display device 100 according to the exemplary embodiment of the disclosure, the plurality of first touch electrodes TE1, the plurality of second touch electrodes TE2, and the plurality of first bridge electrodes BE1 disposed on the touch electrodes are each arranged to overlap the black matrix 710. In this case, the plurality of first touch electrodes TE1 and the plurality of second touch electrodes TE2 may each be arranged to extend vertically parallel to a part of the black matrix 710. Furthermore, the plurality of first touch electrodes TE1 and the plurality of second touch electrodes TE2 may each have a width equal to or substantially equal to a width between two adjacent openings among the plurality of openings OA_BM of the black matrix 710.

[0136] The following are examples of a touch electrode structure of a display device according to an exemplary embodiment of the disclosure with reference to Fig. 8 to Fig. 10 described.

[0137] Fig. Figure 8 is a cross-sectional view along line II-II' of Fig. 4 and shows an example of a touch electrode structure of the display device according to an exemplary embodiment of the disclosure. Fig. 9 is a cross-sectional view along the line II-II' of Fig. 4 and shows another example of the touch electrode structure of the display device according to an exemplary embodiment of the disclosure. Fig. 10 is a plan view showing an overlap structure of a touch electrode and a dummy electrode in the display device.

[0138] Fig. 8 shows an example of the touch electrode structure of the display device 100 according to an exemplary embodiment of the disclosure. In this case, the first touch electrode TE1 and the first bridge electrode BE1 disposed thereon are electrically connected to each other through the contact hole of the touch interlayer insulating film 620. At this time, a touch electrode line of the first touch electrode TE1 may have a width equal to or substantially equal to the width between the openings of the black matrix 710. Thus, it is possible to increase the capacitance for touch sensing by increasing the metal density of the touch electrodes and improve the touch sensing capability. Furthermore, the bridge electrode, which has a lower metal density of the touch electrodes, is disposed under the second inorganic layer 630.In this way, it is possible to suppress the occurrence of an arc fault during a process of depositing the second inorganic layer 630.

[0139] Fig. Figure 9 shows another example of the touch electrode structure of the display device according to the exemplary embodiment of the disclosure. In this case, a dummy electrode DE may be arranged on a part of the first touch electrode TE1 that is not connected to the first bridge electrode BE1. The dummy electrode DE is arranged on the same layer as the first bridge electrode BE1.

[0140] As it is in Fig. As shown in Figure 9, the dummy electrode DE is arranged on an upper layer of the first touch electrode TE1 so as to overlap the first touch electrode TE1. However, the disclosure is not limited thereto. In another embodiment, the dummy electrode DE is arranged below the first touch electrode TE1. For example, the dummy electrode DE, which is formed in a mesh shape and overlaps the first touch electrode TE1 and the second electrode TE2, may be arranged below the black matrix 710. Accordingly, a double electrode structure including the dummy electrode DE and the first touch electrode TE1 is formed, and a stray electric field effect is generated. Due to the double electrode structure including the dummy electrode DE and the first touch electrode TE1, a capacitance between the user's touch input means (e.g., a finger or a stylus) and the touch electrodes is increased.As a result, it is possible to further improve touch sensing capability. Fig. Figure 9 shows an example in which the dummy electrode DE is arranged on the first touch electrode TE1. However, the dummy electrode DE may also be arranged on the second touch electrode TE2.

[0141] The positions and number of dummy electrodes DE corresponding to the first touch electrode TE1 or the second touch electrode TE2 are not limited. However, the dummy electrode DE may be arranged locally to suppress the occurrence of an arc fault during the process of depositing the second inorganic layer 630. That is, the dummy electrode DE may be arranged to correspond to all or some of the plurality of first touch electrodes TE1 and the plurality of second touch electrodes TE2.

[0142] Furthermore, at least one of the first touch electrode TE1 and the second touch electrode TE2 may be electrically insulated from the dummy electrode DE disposed thereon by the touch interlayer insulating layer 620. In this case, the dummy electrode DE may be floating.

[0143] According to Fig. 10, the dummy electrode DE may have a smaller width than the first touch electrode TE1 and the second touch electrode TE2. Fig. 10 shows an example in which the dummy electrodes DE are arranged sequentially on the first touch electrode lines TEL1 constituting the unit electrodes of the first touch electrode TE1. However, the dummy electrodes DE may be arranged locally on the unit electrodes of the touch electrodes, or regularly or randomly on the unit electrodes of the touch electrode. Furthermore, a plurality of unit electrodes constituting a touch electrode may include a unit electrode on which the dummy electrode DE is not arranged, and there may be a touch electrode on which the dummy electrode DE is not arranged.

[0144] As it is in Fig.As shown in Figure 10, the dummy electrode DE, which has a narrower width than the first touch electrode TE1 and the second touch electrode TE2, is disposed under the inorganic layer 630. Thus, it is possible to suppress the occurrence of an arc fault during the process of depositing the inorganic layer 630. Furthermore, it is possible to further improve the touch sensing capability.

[0145] Although the exemplary embodiments of the disclosure have been described in detail with reference to the accompanying drawings, the disclosure is not limited thereto and may be embodied in many different forms without departing from the technical concept of the disclosure. Therefore, the exemplary embodiments of the disclosure are for illustrative purposes only and are not intended to limit the technical concept of the disclosure. The scope of the technical concept of the disclosure is not limited thereto. Therefore, it is to be understood that the exemplary embodiments described above are illustrative in all respects and do not limit the disclosure. The scope of the disclosure should be interpreted based on the following claims, and all technical concepts within their equivalents should be construed as falling within the scope of the disclosure. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] KR 10-2024-0028185

[0001]

Claims

[1] Display device comprising: a substrate (110) having a display area (DA) and a non-display area (NA); a light-emitting element layer (EDL) arranged on the substrate (110) in the display area (DA); an encapsulation layer (ENCAP) disposed on the light-emitting element layer (EDL); a touch sensing layer (TSL) disposed on the encapsulation layer (ENCAP); a color filter layer (CFL) disposed on the touch sensing layer (TSL); a gate drive unit (112) provided on the substrate (110) in the non-display area (NA); a dam (117) disposed on the substrate (110) in the non-display area (NA) and adjacent to the display area (DA); a panel crack detector (118) arranged at an edge portion of the substrate (110) in the non-display area (NA), wherein the dam (117) is arranged between the gate drive unit (112) and the panel crack detector (118). [2] The display device according to claim 1, wherein the touch sensing layer (TSL) comprises a plurality of first touch electrodes (TE1), a plurality of second touch electrodes (TE2), and a first bridge electrode (BE1) configured to electrically connect adjacent first touch electrodes (TE1). [3] The display device according to claim 1 or 2, wherein the color filter layer (CFL) comprises a black matrix (710) having a plurality of first openings (OA_BM) and a plurality of color filters (720) each covering the plurality of first openings (OA_BM). [4] The display device according to claim 1, 2 or 3, wherein the touch sensing layer (TSL) further comprises a touch interlayer insulating layer (620) disposed between the first bridge electrode (BE1) and the first touch electrodes (TE1), preferably the first bridge electrode (BE1) being electrically connected to the first touch electrodes (TE1) via a contact hole formed in the touch interlayer insulating layer (610). [5] The display device according to claim 3 or 4, wherein the first bridge electrode (BE1), the plurality of first touch electrodes (TE1) and the plurality of second touch electrodes (TE2) are arranged under the black matrix (710). [6] The display device according to claim 5, wherein the light-emitting element layer (EDL) comprises a plurality of sub-pixels (SP1, SP2, SP3) and a bank layer (400) having a plurality of second openings (OA_BK) defining emission regions of the plurality of sub-pixels (SP1, SP2, SP3), and preferably the first opening (OA_BM) and the second opening (OA_BK) have corresponding shapes and a size of the first opening (OA_BM) is greater than or equal to a size of the second opening (OA_BK). [7] The display device according to any one of the preceding claims 2 to 6, wherein the touch sensing layer (TSL) further comprises a second bridge electrode (BE2) configured to electrically connect adjacent second touch electrodes (TE2), wherein preferably the plurality of second touch electrodes (TE2) and the second bridge electrode (BE2) are integrally formed on the same layer. [8] Display device according to claim 6, wherein in a plan view the centers of a first opening (OA_BM) and a second opening (OA_BK) overlap each other, wherein a gap is formed therebetween, which preferably has a circular ring shape or a polygonal ring shape. [9] The display device according to claim 6, wherein the plurality of first touch electrodes (TE1) and the plurality of second touch electrodes (TE2) are formed in a mesh network shape having a plurality of third openings (OA_T), preferably in a plan view, the plurality of subpixels (SP1, SP2, SP3) are arranged in the plurality of third openings, and / or preferably in a plan view the subpixel (SP1, SP2, SP3) is not arranged in at least one of the plurality of third openings (OA_T). [10] A display device according to any one of the preceding claims, further comprising a dummy electrode (DE) formed in a mesh network shape, and wherein, in a plan view, the dummy electrode (DE) overlaps the plurality of first touch electrodes (TE1) and the plurality of second touch electrodes (TE2).

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