DISPLAY DEVICE AND METHOD FOR MANUFACTURING A DISPLAY DEVICE

Abstract

The disclosure relates to a display device (10) and a method for manufacturing a display device (10). A display device (10) according to embodiments of the present description comprises a substrate (100) having a display region and a non-display region, a drive circuit part arranged in the display region on the substrate (100);a plurality of planarization layers (111, 112) arranged on the driving circuit part, and a plurality of pixels (PXL) arranged on the plurality of planarization layers (111, 112) in the display area, wherein the plurality of pixels (PXL) have a plurality of first light-emitting element regions (ED1-1, ED2-1, ED3-1) and a plurality of second light-emitting element regions (ED1-2, ED2-2, ED3-2), and a first insulating layer (180) is arranged in the first light-emitting element regions (ED1-1, ED2-1, ED3-1) and the second light-emitting element regions (ED1-2, ED2-2, ED3-2), and the first insulating layer (180) has different heights (H1, H2) in the first light-emitting element regions (ED1-1, ED2-1, ED3-1) and the second light-emitting element regions (ED1-2, ED2-2, ED3-2);

Description

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0160826, filed on November 20, 2023. TECHNICAL FIELD

[0002] The present description relates to a display device. More particularly, the present description relates to a display device and a manufacturing method for preventing defects caused by contact between a first electrode and a second electrode in a display device using a micro-light-emitting diode. BACKGROUND

[0003] Liquid crystal display devices and organic light emitting display devices are used as flat display devices.

[0004] Organic light-emitting displays have advantages over liquid crystal displays, such as improved luminous efficiency, fast response speed, and wide viewing angles. However, organic light-emitting displays still have low luminous efficiency and are susceptible to moisture because they contain organic substances, which can reduce reliability and service life.

[0005] Recently, micro-LED display devices, which are inorganic light-emitting display devices, have been proposed.

[0006] Micro-LED display devices implement images by arranging inorganic light-emitting diodes with a size of 100 micrometers (µm) or less in each pixel. In micro-LED display devices, micro-LEDs grown on a single-crystal substrate can be arranged on an array substrate of the display device, and electrodes can be connected. EXPLANATION

[0007] An array substrate is provided by forming pixel driving circuit parts and connecting wiring on a substrate of a display device.

[0008] A first electrode connected to a micro light-emitting diode element (hereinafter referred to as a light-emitting element) may be arranged on the array substrate of the display device, the light-emitting element may be arranged on the array substrate, and then a second electrode may be arranged on the light-emitting element.

[0009] A light-emitting element grown on a single crystal substrate can be arranged on an array substrate by a transfer process.

[0010] After the light-emitting element is / has been arranged, the second electrode may connect the light-emitting element and a pixel driving circuit to transmit a power voltage.

[0011] During the transfer process, there is a case where the light-emitting element is not transferred to a predetermined position on the array substrate.

[0012] If the light-emitting element is not arranged, the first electrode under the light-emitting element and the second electrode may be in contact with each other so as to be electrically connected, which may cause a short circuit.

[0013] Accordingly, the inventors of the present specification have invented a display device and a manufacturing method thereof which are capable of improving reliability by preventing a short circuit between a second electrode and a first electrode arranged below the second electrode in a non-transferred region of a light-emitting element.

[0014] Objects of the present disclosure are not limited to the above-mentioned objects, and other objects not mentioned will be clearly understood by a person skilled in the art from the following disclosure. Various embodiments of the present disclosure provide a display device according to claim 1, a method of manufacturing a display device according to claim 13, and a display device according to claim 19. Further embodiments are described in the dependent claims.

[0015] A display device according to embodiments of the present description may include a substrate having a display region and a non-display region, a driving circuit part (which may also be referred to as a driving circuit unit) arranged in the display region on the substrate, a plurality of planarization layers arranged on the driving circuit part, and a plurality of pixels arranged on the plurality of planarization layers in the display region, wherein the plurality of pixels include a plurality of first light-emitting element regions and a plurality of second light-emitting element regions, and a first insulating layer in at least one (e.g., each) of the first light-emitting element regions and at least one (e.g.,each) of the second light-emitting element regions, and the first insulating layer may have different heights in the first light-emitting element region(s) and the second light-emitting element region(s).

[0016] A method for manufacturing a display device according to embodiments of the present description may include preparing a substrate having a display region and a non-display region, forming a driving circuit part and a plurality of planarization layers on the substrate, forming a protrusion on the plurality of planarization layers, forming a first connection electrode and a second connection electrode in a first light-emitting element region and a second light-emitting element region disposed on the protrusion, disposing a light-emitting element on one of the first connection electrode and the second connection electrode, and disposing a lens respectively on an upper portion of the other of the first connection electrode and the second connection electrode and on an upper portion of the light-emitting element,wherein a first insulating layer may be disposed on the first light-emitting element region and the second light-emitting element region.,

[0017] Another display device according to embodiments of the present description may include: a substrate having a display region and a non-display region; a driving circuit part arranged on the substrate; a plurality of planarization layers arranged on the driving circuit part, and a plurality of pixels arranged on the plurality of planarization layers in the display region, wherein the plurality of pixels have a plurality of first light-emitting element regions and second light-emitting element regions, a first connection electrode, a first light-emitting element arranged on the first connection electrode, a first lens arranged on the first light-emitting element, and a second electrode arranged on the first lens, in at least one (e.g.each) of the first light-emitting element regions, and a second connection electrode, a second lens arranged on the second connection electrode, and a second electrode arranged on the second lens are arranged in at least one (e.g., each) of the second light-emitting element regions.

[0018] According to embodiments of the present description, the driving reliability of the display device can be improved by preventing an electrical short circuit between the second electrode and the first electrode below the second electrode in the non-transfer region of the light-emitting element.

[0019] According to embodiments of the present description, the light efficiency of the light-emitting element may be increased by disposing a lens on an upper portion of the light-emitting element.

[0020] The effects of this description are not limited to the above-mentioned effects, and other effects not mentioned herein will be apparent to a person skilled in the art from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other objects, features and advantages of the present disclosure will become more apparent to those skilled in the art by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which: Fig. 1 is a plan view illustrating a display device according to an embodiment of the present specification; Fig. 2 is a plan view of a structure in which wirings of a pixel of Fig. 1 are arranged; Fig. 3 is a plan view of a structure in which light-emitting elements and lenses of a pixel of Fig. 1 are arranged; Fig. Figure 4 is a plan view of a structure in which a second electrode of a pixel is made of Fig. 1 is arranged; Fig. 5A to Fig. 5F are cross-sectional views illustrating a method of manufacturing a Fig. 3 in accordance with an embodiment of the present description; and Fig. 5G to Fig. 6 are cross-sectional views taken along the line BB' from Fig. 4, according to an embodiment of the present description. DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

[0022] Advantages and features / characteristics of the present description and methods for implementing them will become apparent by reference to preferred embodiments, which are described in detail in conjunction with the accompanying drawings. However, the present description is not limited to the embodiments described below and may be implemented in various forms. The embodiments are provided only to fully disclose the present disclosure and to fully convey the scope of the present disclosure to a person skilled in the art, and the present description is defined by the disclosed claims.

[0023] Since the shapes, sizes, proportions, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present disclosure are only examples, the present disclosure is not limited to the illustrated elements. The same reference numerals denote the same components throughout the description. Furthermore, when describing the present disclosure, if it is determined that a detailed description of related known technologies might unnecessarily obscure the gist of the present disclosure, the detailed description thereof will be omitted. When 'comprising', 'having', 'consisting', which are mentioned in the description, other parts may be added unless 'only' is used. A case where a component is expressed in the singular form includes a plural form unless expressly stated otherwise.

[0024] When interpreting the components, it is important to understand that an error area is included even if there is no separate explicit description.

[0025] In the case of describing a positional relationship, for example, when the positional relationship of two parts is described as 'on', 'at an upper portion', 'at a lower portion', 'beside' and the like, another part or parts may be arranged between the two parts unless 'immediately' or 'directly' is used.

[0026] The first, second, and so on are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component referred to below may be a second component within the technical spirit of the present disclosure.

[0027] The same reference numerals indicate the same components throughout the description.

[0028] The size and thickness of each component shown in the drawings are shown for convenience of description, and the present invention is not necessarily limited to the size and thickness of the components shown.

[0029] Each of the features / characteristics of the various embodiments of the present invention may be partially or fully combined with each other, and various locks and drives are technically possible, as will be fully understood by a person skilled in the art, and each embodiment may be implemented independently with respect to each other or may be implemented together in a related relationship.

[0030] Hereinafter, display devices according to embodiments of the present specification will be described in detail with reference to the accompanying drawings.

[0031] Fig. 1 is a plan view illustrating a display device according to an embodiment of the present specification.

[0032] Referring to Fig. 1, a display device 10 may have a display area in which an image is displayed and a non-display area in which no image is displayed, and a driving circuit and wirings for transmitting signals to the display area are arranged.

[0033] In the non-display area, the driving circuit may be mounted and a pad portion PAD to which an integrated circuit, a printed circuit, etc. are connected may be arranged.

[0034] A data driving circuit or a gate driving circuit may be arranged in the non-display area, and a control device signal for controlling a driving operation may be supplied to the non-display area.

[0035] The controller signal, which includes a plurality of timing signals such as a clock signal CLK, an input data enable signal, and synchronization signals, is received by the pad section PAD.

[0036] The display device 10 can drive a light-emitting element through a pixel drive transistor connected to a drive voltage EVDD. The drive voltage (EVDD) can be a high-potential voltage. The transistor includes a semiconductor element, a source / drain electrode, and a gate electrode, and the drive voltage EVDD is applied to the light-emitting element through a pixel electrode connected to the drain electrode. A high-potential voltage wiring can be a pixel electrode or a first electrode connected to a drive transistor of each pixel PXL, and a common voltage wiring used to supply a common voltage EVSS can be a cathode electrode or a second electrode connected to a light-emitting element. The common voltage EVSS can be a low potential voltage EVSS.

[0037] Additionally, a pixel driving circuit part on the substrate disposed on the display device 10 can drive pixels with a driving circuit chip. The pixel driving circuit part can drive a plurality of pixels by transmitting a signal from the driving circuit chip, such as a driving voltage, an image signal (digital signal), and a synchronization signal synchronized with the image signal, and outputting the driving voltage EVDD and the light-emitting element common voltage EVSS. The pixel driving circuit part can receive an image signal and a synchronization signal from a host system. The host system can include a motherboard of a portable system, a mobile system, a television (TV) system, a tablet computer, a notebook computer, a navigation system, a personal computer (PC), etc.

[0038] A driving voltage electrode or a common voltage electrode may generally be formed on a front surface of the display device.

[0039] This description describes an example in which common voltage electrodes are generally formed, but is not limited thereto.

[0040] Referring to Fig. 1, the common voltage EVSS may generally be arranged on the front surface of the display device or may generally be arranged at / on each pixel row PXL, but is not limited thereto.

[0041] A pixel PXL can have one or more sub-pixels, for example a red, a green and a blue sub-pixel.

[0042] Fig. 2 to Fig. 5A are enlarged top and cross-sectional views of the pixel PXL of Fig. 1.

[0043] The display device 10 may include a pixel driving circuit part 200, a buffer layer 110, planarization layers 111 and 112, and a plurality of wirings arranged on a substrate 100.

[0044] The substrate 100 may be made of a flexible plastic. For example, the substrate 100 may be made of a single layer or multiple layers of a material such as, but not limited to, polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, polyarylate, polysulfone, and cyclic olefin copolymer. The substrate 100 may be made of glass.

[0045] The pixel driving circuit part 200 may be arranged on the substrate 100.

[0046] The pixel driving circuit part 200 may include a plurality of thin-film transistors using an amorphous silicon semiconductor, a polycrystalline silicon semiconductor, or an oxide semiconductor, and at least one storage capacitor. The thin-film transistors may include at least one driving thin-film transistor, at least one switching thin-film transistor, and the like. When a plurality of thin-film transistors are included in the pixel driving circuit part 200, they may be formed on the substrate 100 using a TFT manufacturing process.

[0047] Furthermore, the pixel driving circuit part 200 may include a driving circuit chip.

[0048] The driving circuit chip can transmit a driving voltage for driving a light-emitting element, an image signal (digital signal), a synchronization signal synchronized with the image signal, etc. to the light-emitting element. If the pixel driving circuit part 200 is a driving circuit chip, an adhesive layer may be further disposed between the substrate 100 and the pixel driving circuit part 200.

[0049] The adhesive layer can be made of acrylic resin, silicone resin, etc., but is not limited to these.

[0050] The buffer layer 110 covering the pixel driving circuit portion 200 may be disposed on the substrate 100. The buffer layer 110 may be made of an organic insulating material, such as, but not limited to, photosensitive photoacrylic or photosensitive polyimide.

[0051] In addition, the buffer layer 110 may be formed by stacking an inorganic insulating material, for example, silicon nitride (SiN x ) or silicon oxide (SiO2), in multiple layers, and can be used by stacking an organic insulating material and an inorganic insulating material in multiple layers.

[0052] The buffer layer 110 may surround a side surface of the pixel driving circuit part 200 and cover a portion of a top surface. An opening exposing a portion of the pixel driving circuit part 200 may be arranged to expose a first contact electrode 210 and a second contact electrode 220 of the pixel driving circuit part 200.

[0053] The plurality of planarization layers 111 and 112 may be disposed on the buffer layer 110. The plurality of planarization layers 111 and 112 may be made of an organic insulating material, such as, but not limited to, photosensitive photoacrylic or photosensitive polyimide.

[0054] A plurality of contact holes may be formed in the plurality of planarization layers 111 and 112, so that a first connection wiring 230 and a third connection wiring 250 transmitting signals of the first contact electrode 210 of the pixel driving circuit part 200, and a second connection wiring 240 and a fourth connection wiring 260 transmitting signals of the second contact electrode 220 may be arranged on the first planarization layer 111 and the second planarization layer 112.

[0055] The first interconnection wiring 230, the second interconnection wiring 240, the third interconnection wiring 250, and the fourth interconnection wiring 260 may include at least one of titanium (Ti), molybdenum (Mo), aluminum (Al), and indium tin oxide (ITO) or indium zinc oxide (IZO).

[0056] A protrusion 120 may be disposed on the third and fourth interconnect wirings 250 and 260 and a portion of the second planarization layer 112.

[0057] The protrusion 120 may be made of an organic insulating material such as, but not limited to, photosensitive photoacrylic or photosensitive polyimide.

[0058] The first connection electrode 131 and the second connection electrode 132 may be arranged on the upper surface and the side surface of the projection 120.

[0059] The first connection electrode 131 and the second connection electrode 132 can be formed by the same process as the signal lines 101-a, 101-b, 102-a, 102-b, 103-a and 103-b of Fig. 2 and may extend from the signal lines 101-a, 101-b, 102-a, 102-b, 103-a and 103-b so as to be arranged on the upper surface and the side surface of the projection 120.

[0060] The signal lines 101-a, 101-b, 102-a, 102-b, 103-a, and 103-b may be electrically connected to the fourth connection wiring 260 below so as to transmit a driving voltage EVDD from the pixel driving circuit part 200 to the light-emitting element EM.

[0061] The signal lines 101-a, 101-b, 102-a, 102-b, 103-a and 103-b may extend in a second direction DR2 and may each be arranged between sub-pixels Sub_PXL.

[0062] The first connection electrode 131 and the second connection electrode 132 may be arranged to extend in a first direction DR1 intersecting the second direction DR2. Each sub-pixel Sub_PXL includes two light-emitting elements. If one of the light-emitting elements has an abnormality or the light-emitting element is not transferred, the luminance of the other light-emitting element may be adjusted to prevent a reduction in light emission efficiency.

[0063] The signal lines 101-a, 101-b, 102-a, 102-b, 103-a and 103-b are arranged on both sides of each sub-pixel Sub_PXL, and each sub-pixel Sub_PXL may have first light-emitting element regions ED1-1, ED2-1 and ED3-1 and second light-emitting element regions ED1-2, ED2-2 and ED3-2.

[0064] The third connection electrode 130 may be arranged on a side surface of the sub-pixel Sub_PXL between the signal lines 101-a, 101-b, 102-a, 102-b, 103-a, and 103-b. The third connection electrode 130 may be electrically connected to the third connection wiring 250 through a first contact hole 130H1 and may be connected to a second electrode 190 (see Fig. 6) be connected through a second contact hole 130H2 to transmit a signal of the pixel driving circuit part 200.

[0065] With reference to Fig. 3 to Fig. 4, first light-emitting elements EM1-1, EM2-1 and EM3-1 and second light-emitting elements EM1-2 and EM2-2 may be arranged in the first light-emitting element regions ED1-1, ED2-1 and ED3-1 and the second light-emitting element regions ED1-2 and ED2-2.

[0066] For example, a pixel PXL may have light-emitting elements EM1, EM2, and EM3-1 of three colors. The first light-emitting element EM1 may be a red light-emitting element, the second light-emitting element EM2 may be a green light-emitting element, and the third light-emitting element EM3-1 may be a blue light-emitting element.

[0067] For example, the light-emitting element cannot be transferred to an area to which the light-emitting element is not transferred, for example, to the second light-emitting element area ED3-2 of the blue sub-pixel among the plurality of sub-pixels Sub_PXL of the pixel PXL.

[0068] The lens 300 may be arranged on the first light-emitting elements EM1-1, EM2-1 and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 and the second light-emitting element region ED3-2.

[0069] Around an upper pad electrode and the second electrode 190 of the light-emitting element, which are arranged on upper surfaces of the first light-emitting elements EM1-1, EM2-1 and EM3-1 and the second light-emitting elements EM1-2 and EM2-2, the lens 300 may be formed to have a short side length or less of the upper surfaces of the first light-emitting elements EM1-1, EM2-1 and EM3-1 and the second light-emitting elements EM1-2 and EM2-2.

[0070] For example, if the size of the upper surfaces of the first light-emitting elements EM1-1, EM2-1 and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 is 10 µm * 15 µm, the lens 300 can have a maximum diameter of less than 10 µm.

[0071] For example, a maximum area ratio occupied by the lens 300 on the upper portions of the first light-emitting elements EM1-1, EM2-1, and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 may not exceed π / 4. Here, π may represent the ratio of the circumference of a circle to its diameter.

[0072] The maximum size of the lens 300 for contacting the second electrode 190 with the upper electrodes of the first light-emitting elements EM1-1, EM2-1, and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 may be a size obtained by multiplying the upper areas of the first light-emitting elements EM1-1, EM2-1, and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 by (1-π / 4).

[0073] The lens 300 may comprise acrylate or siloxane as a polymer-based material.

[0074] The second electrode 190 may be arranged on the first light-emitting elements EM1-1, EM2-1 and EM3-1, the second light-emitting elements EM1-2 and EM2-2 and the lens 300.

[0075] Fig. 5A ((I) in Fig. 5A) to Fig. 5G are cross-sectional views showing a method of manufacturing a region formed along the line AA' of Fig. 3 and line BB' Fig. 4, in accordance with an embodiment of the present description.

[0076] The first connection electrode 131 and the second connection electrode 132 may be arranged on the top surface and the side surface of the protrusion 120. Here, the first connection electrode 131 and the second connection electrode 132 may be collectively referred to as a first electrode to be connected to the light-emitting element.

[0077] The first connection electrode 131 and the second connection electrode 132 may be a multi-layer comprising titanium (Ti), molybdenum (Mo), aluminum (Al), indium tin oxide (ITO), and indium zinc oxide (IZO).

[0078] (II) in Fig. 5A is an enlarged cross-sectional view of a portion of the second connection electrode 132. The second connection electrode 132 may be formed in a multi-layer structure including a first layer 131a, a second layer 131b, a third layer 131c, and a fourth layer 131d.

[0079] The first layer 131a, the second layer 131b, the third layer 131c and the fourth layer 131d may comprise titanium (Ti), molybdenum (Mo) or aluminum (Al).

[0080] The fourth layer 131d may comprise a transparent conductive oxide layer, such as indium tin oxide (ITO) or indium zinc oxide (IZO), which has corrosion resistance and acid resistance.

[0081] By removing a portion of the fourth layer 131d in which the light-emitting element EM is not arranged, the fourth layer 131d can be divided into a fourth-first-layer 131d-1 region in which the light-emitting element EM is arranged, and a fourth-second-layer 131d-2 region in which the first layer 131a, the second layer 131b and the third layer 131c are arranged.

[0082] The third layer 131c may be exposed in a region from which a portion of the fourth layer 131d is removed. The third layer 131c may increase the light output by reflecting light upward from the light-emitting element EM that performs top emission, using a metal material with high reflectivity, such as aluminum (Al).

[0083] A protective layer 160 may be formed on the second planarization layer 112, the first connection electrode 131, the second connection electrode 132, and the protrusion 120. The protective layer 160 may be formed by stacking an inorganic insulating material, such as silicon nitride (SiN x ) or silicon oxide (SiO2), in a single layer or multiple layers.

[0084] The protective layer 160 on the fourth-first layer 131d-1 can be removed by a process of removing a portion of the fourth layer 131d and dividing the region into the fourth-first-layer 131d-1 region in which the light-emitting element EM is arranged and the fourth-second-layer 131d-2 region.

[0085] An adhesion layer 170 may be disposed on a portion of the fourth-first layer 131d-1 from which the protective layer 160 is / has been removed. An adhesion layer 170 may be made of, but is not limited to, indium (In), tin (Sn), metal paste, or an alloy thereof. Herein, the adhesion layer may also be referred to as contact wiring, where appropriate, and sometimes may simply be referred to as a metal layer.

[0086] The light-emitting element EM formed on a single crystal substrate can be primarily transferred to a donor substrate DN and secondarily transferred to the substrate 100, which is an array substrate.

[0087] A plurality of light-emitting elements EM may be included in a donor substrate DN and may be transferred into the first light-emitting element regions ED1-1, ED2-1 and ED3-1 and the second light-emitting element regions ED1-2, ED2-2 and ED3-2 on the protrusion 120.

[0088] The light-emitting element EM can have a different shape and size depending on the light emission efficiency for each sub-pixel Sub_PXL.

[0089] In addition, as shown, in the case of upper light emission, it can have an inverted conical shape to increase the light emission efficiency, and in the case of lower light emission, it can have a trapezoidal shape or a square shape.

[0090] The light-emitting element EM can be inorganic light-emitting diodes. The inorganic light-emitting diodes can have a size of 1 to 50 µm or 1 to 20 µm in the horizontal direction (in the X-axis direction or Y-axis direction). The inorganic light-emitting diodes can be referred to as micro-light-emitting diodes. The inorganic light-emitting diode can include a p-doped semiconductor layer, an active layer (e.g., including one or more quantum well layers), and an n-doped semiconductor layer. Furthermore, the inorganic light-emitting diode can include a first pad electrode connected to the p-doped semiconductor layer and a second pad electrode connected to the n-doped semiconductor layer. The inorganic light-emitting diodes can be fabricated using group II-VI or group III-V compound semiconductors.The inorganic light-emitting diode may be manufactured by a separate manufacturing process and may be arranged on a first adhesive layer 170a by a transfer process.

[0091] A second adhesive layer 170b (where the second adhesive layer may also be referred to as a first metal layer where appropriate) for increasing a contact force between the light-emitting element EM and the first adhesive layer 170a may be further arranged between the light-emitting element EM and the first adhesive layer 170a.

[0092] The second adhesive layer 170b may be, but is not limited to, an adhesive containing gold (Au), a metal paste, or a conductive material.

[0093] The first adhesive layer 170a and the second adhesive layer 170b are formed by eutectic bonding into the adhesive layer 170 to attach the light-emitting element EM.

[0094] The transfer method of the light-emitting element EM may use a laser and embossing process, and the light-emitting element EM may be arranged in the light-emitting element region by means of such a transfer process. However, due to misalignment of the donor substrate DN and the substrate 100 or poor contact between the first adhesive layer 170a and the second adhesive layer 170b, the light-emitting element EM may be transferred to the first light-emitting element region ED3-1, and the light-emitting element EM may not be transferred to the second light-emitting element region ED3-2.

[0095] A laser transfer method may include lowering the donor substrate DN toward the substrate 100, aligning and contacting the light-emitting element EM with the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2, and transferring the laser from an upper portion of the donor substrate DN to remove the adhesion between the donor substrate DN and the light-emitting element EM and enable the light-emitting element EM to be disposed and adhesively attached to the first adhesive layer 170a and the second adhesive layer 170b of the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2.

[0096] An embossing-transfer method may include lowering the donor substrate DN toward the substrate 100, aligning and contacting the light-emitting element EM with the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2, and pressing the donor substrate DN toward the substrate 100 at a low temperature to enable the light-emitting element EM to be arranged and adhesively attached to the first adhesive layer 170a and the second adhesive layer 170b of the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2.

[0097] A first insulating layer 180 may be disposed on the first light-emitting element region ED3-1, the second light-emitting element region ED3-2, and the protrusion 120. The first insulating layer 180 may be made of an organic insulating material and may further include scattering particles, such as titanium dioxide, for reflecting or scattering light as materials to improve the light efficiency of the light-emitting element EM. The first insulating layer 180 may be disposed to surround the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2, thereby improving a light emission effect.

[0098] The first insulating layer 180 is disposed on the protrusion 120 on which the light-emitting element EM is disposed, and surrounds the side and top surfaces of the protrusion 120.

[0099] The first insulation layer 180 may be formed to have a thickness of 1 to 60 µm or 1 to 30 µm to surround the protrusion 120 and the light-emitting element EM.

[0100] The heights of the first light-emitting element region ED3-1 and the first insulating layer 180 may be formed to be different from each other due to the non-transfer of the light-emitting element EM into the second light-emitting element region ED3-2.

[0101] To connect the second electrode 190 and the light-emitting element EM, an upper second pad electrode of the light-emitting element EM may be exposed. A portion of the first insulating layer 180 in the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2 may be removed by a masking process.

[0102] Through this masking process, the first insulating layer 180 in the second light-emitting element region ED3-2 can be removed to expose the first adhesive layer 170a.

[0103] A lens 300 may be formed on an upper second pad electrode of the light-emitting element EM and on the first adhesive layer 170a in the second light-emitting element region ED3-2.

[0104] The lens 300 may be formed from an organic insulating film material on the substrate and formed into a micro-partial lens shape through a masking process. The lens 300 is a polymer-based material, which is a photosensitive material, and may include acrylate or siloxane.

[0105] The lens 300 may be formed to be equal to or larger than the area of ​​the first adhesive layer 170a of the second light-emitting element region ED3-2. Thus, the second electrode 190 disposed on the upper portion of the lens 300 does not contact this adhesive layer.

[0106] When the second electrode 190, which is arranged on an upper portion of the lens 300, is connected to the first adhesive layer 170a, a short circuit may occur due to the electrical connection.

[0107] Furthermore, the lens 300 may be formed to have a smaller area than an upper surface of the second pad electrode of the light-emitting element EM. A minimum area that does not overlap the lens 300 may be required on an upper surface of the light-emitting element EM, so that the light-emitting element EM and the second electrode 190 disposed on the lens 300 of the upper portion of the light-emitting element EM can be electrically connected to the second pad electrode of the upper portion of the light-emitting element EM.

[0108] For example, if an area of ​​the upper surface of the light-emitting element EM is 10 µm*15 µm, a maximum diameter of the lens 300 can be less than 10 µm.

[0109] For example, a maximum area ratio occupied by the lens 300 in the upper portion of the light-emitting element EM may not exceed π / 4, and a maximum size of the lens 300 for contact between the second electrode 190 and an upper electrode of the light-emitting element EM may be a size obtained by multiplying an upper area of ​​the light-emitting element EM by (1-π / 4). Here, π may represent the ratio of the circumference of a circle to its diameter.

[0110] The first insulating layer 180 may have a first height H1 of the uppermost surface of the first insulating layer 180 of the first light-emitting element region ED3-1 from the upper surface of the substrate 100 and a second height H2 of the uppermost surface of the first insulating layer 180 of the second light-emitting element region ED3-2 from the upper surface of the substrate 100.

[0111] The first height H1 can be higher than the second height H2.

[0112] A second insulating layer 181 may be formed on an upper portion of the substrate 100 and on a side surface of the first insulating layer 180.

[0113] The second insulating layer 181 may planarize a top surface and may be arranged to surround the side surface of the first insulating layer 180.

[0114] The second insulating layer 181 may be formed of an organic insulating material and may be made of, but is not limited to, siloxane, photosensitive photoacrylic, or photosensitive polyimide.

[0115] A second contact hole 130H2 may be formed in the second insulating layer 181 to expose a third connection electrode 130.

[0116] The second electrode 190 may be arranged on the second contact hole 130H2, the lens 300, the light-emitting element EM, the first insulating layer 180, and the second insulating layer 181.

[0117] The second electrode 190 may be electrically connected to the third connection electrode 130 to transmit a drive voltage EVDD or a common voltage EVSS to the light-emitting element EM.

[0118] On the second electrode 190, a third insulating layer 182 (see Fig. 6) be disposed in an opening region of the first insulating layer 180 formed on the upper portion of the light-emitting element EM and the lens 300. The third insulating layer 182 may further include scattering particles, such as titanium dioxide, in the organic insulating material. The third insulating layer 182 may be formed of the same material as the first insulating layer 180 and may reflect or scatter light as a material for improving the light efficiency of the light-emitting element EM, and may planarize the upper surface thereof.

[0119] Fig. 6 is a cross-sectional view taken along the line BB' of Fig. 4 is taken.

[0120] A light-blocking layer 191 may be disposed on the second insulating layer 181, the second electrode 190, and the third insulating layer 182 on which the light-emitting element EM is not disposed.

[0121] The light-blocking layer 191 may be disposed on the entire surface of the substrate on which the light-emitting element EM is not disposed, and the light-blocking layer 191 may be formed by filling the second contact hole 130H2.

[0122] The light-blocking layer 191 may be formed of an organic material including a black material, but is not limited thereto.

[0123] A fourth insulating film 192 and a protective film may be further disposed on the second electrode 190 and the light-blocking layer 191, and a touch part having a touch electrode for driving a touch may be disposed on the protective film.

[0124] In addition, if necessary, a color filter may be additionally arranged in a region corresponding to the light-emitting element, but is not limited thereto.

[0125] An upper substrate 193 for protecting the display device may be disposed on the fourth insulating film 192.

[0126] The upper substrate 193 may be made of a single layer or multiple layers of materials such as, but not limited to, glass, polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, polyarylate, polysulfone, and cyclic olefin copolymer. A display device according to embodiments of the present specification may be described as follows.

[0127] A display device according to embodiments of the present description can be described as follows.

[0128] A display device according to embodiments of the present description may include: a substrate having a display region and a non-display region; a driving circuit part arranged in the display region on the substrate; a plurality of planarization layers arranged on the driving circuit part; and a plurality of pixels arranged on the plurality of planarization layers in the display region, wherein the plurality of pixels may include a plurality of first light-emitting element regions and a plurality of second light-emitting element regions, a first insulating layer in at least one (e.g., each) of the first light-emitting element regions and at least one (e.g.,each) of the second light-emitting element regions, and the first insulating layer may have different heights in the first light-emitting element region(s) and the second light-emitting element region(s).

[0129] According to some embodiments of the present description, a height of the first insulating layer may have a first height from a top surface of the substrate to the top surface of the first insulating layer arranged in the first light-emitting element region(s), and a second height from the top surface of the substrate to the top surface of the first insulating layer arranged in the second light-emitting element region(s).

[0130] According to some embodiments of the present description, the first height may be higher than the second height.

[0131] According to some embodiments of the present description, the plurality of pixels may include a plurality of sub-pixels, and each sub-pixel may include at least one protrusion.

[0132] According to some embodiments of the present description, the first light-emitting element region(s) and the second light-emitting element region(s) may be arranged on the at least one protrusion.

[0133] According to some embodiments of the present description, a first connection wiring corresponding to the first light-emitting element region(s) may be arranged below the at least one protrusion, and a second connection wiring corresponding to the second light-emitting element region(s) may be arranged.

[0134] According to some embodiments of the present description, a first connection electrode may be arranged on the first connection wiring and a second connection electrode may be arranged on the second connection wiring.

[0135] According to some embodiments of the present description, a first light-emitting element may be arranged on the first connection electrode.

[0136] According to some embodiments of the present description, the display device includes a lens disposed on the first light-emitting element and a lens disposed on the second connection electrode.

[0137] According to some embodiments of the present description, a second electrode may be arranged on the lens and the first insulating layer.

[0138] According to some embodiments of the present description, the display device may further comprise a second insulating layer disposed on the second electrode.

[0139] According to some embodiments of the present description, the second insulating layer may be formed of a same material as the first insulating layer and / or may have a planar upper surface.

[0140] A method for manufacturing a display device according to embodiments of the present description may include: preparing a substrate having a display region and a non-display region; forming a driving circuit part and a plurality of planarization layers on the substrate; forming a protrusion on the plurality of planarization layers; forming a first connection electrode and a second connection electrode in a first light-emitting element region and a second light-emitting element region disposed on the protrusion; disposing a light-emitting element on one of the first connection electrode and the second connection electrode;and disposing a lens on an upper portion of the other of the first connection electrode and the second connection electrode and on an upper portion of the light-emitting element, respectively, wherein a first insulating layer is disposed on the first light-emitting element region and the second light-emitting element region.;

[0141] According to some embodiments of the present description, said disposing of the light-emitting element may comprise: performing a laser transfer or an embossing transfer from a donor substrate to the prepared substrate.

[0142] According to some embodiments of the present description, the first insulating layer may have a first height from a top surface of the substrate to the top surface of the first insulating layer arranged in the first light-emitting element region, and a second height from the top surface of the substrate to the top surface of the first insulating layer arranged in the second light-emitting element region.

[0143] According to some embodiments of the present description, the first height may be formed to be higher than the second height.

[0144] According to some embodiments of the present description, an adhesive layer is formed on the first connection electrode and the second connection electrode.

[0145] According to some embodiments of the present description, the lens may be formed to be equal to or larger than an area of ​​the adhesive layer.

[0146] A display device according to embodiments of the present description may include: a substrate having a display region and a non-display region; a driving circuit part arranged on the substrate; a plurality of planarization layers arranged on the driving circuit part; and a plurality of pixels arranged on the plurality of planarization layers in the display region, wherein the plurality of pixels may include a plurality of first light-emitting element regions and second light-emitting element regions, wherein a first connection electrode, a first light-emitting element arranged on the first connection electrode, a first lens arranged on the first light-emitting element, and a second electrode arranged on the first lens are arranged in at least one (e.g.each) of the first light-emitting element regions, and a second connection electrode, a second lens arranged on the second connection electrode, and a second electrode arranged on the second lens may be arranged in at least one (e.g., each) of the second light-emitting element regions.

[0147] According to some embodiments of the present description, the second connection electrode and the second electrode may be physically and electrically separated by the second lens, that is, may not touch each other due to the second lens.

[0148] According to some embodiments of the present description, the second connecting electrode and the second electrode are not touched by the lens.

[0149] According to some embodiments of the present description, a protective layer may be disposed on the second connection electrode so that a portion of the second connection electrode is exposed, contact wiring may be disposed on the exposed portion of the second connection electrode, and the second lens may cover the contact wiring.

[0150] According to some embodiments of the present description, an area of ​​the second lens may be larger than an area of ​​the contact wiring and smaller than an area of ​​an upper surface of the first light-emitting element.

[0151] The embodiments of the present specification have been described in detail with reference to the accompanying drawings, but the present specification is not necessarily limited to these embodiments and may be modified in various ways without departing from the present invention. The scope of the present invention should be interpreted by the following claims. [Description of reference symbols] 100 substrate 200 pixel control circuit part 110 Buffer layer 111 First planarization layer 112 Second planarization layer 120 lead ED1, ED2, ED3 light-emitting element areas 191 light-blocking layer 160 protective layer 170 adhesive layer 180 First insulating layer 181 Second insulating layer 182 Third insulating layer 190 Second electrode QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] KR 10-2023-0160826

[0001]

Claims

[1] Display device (10) comprising: a substrate (100) having a display area and a non-display area; a drive circuit part arranged in the display area on the substrate (100); a plurality of planarization layers (111, 112) arranged on the drive circuit part; and a plurality of pixels (PXL) arranged on the plurality of planarization layers (111, 112) in the display area, wherein the plurality of pixels (PXL) have a plurality of first light-emitting element regions (ED1-1, ED2-1, ED3-1) and a plurality of second light-emitting element regions (ED1-2, ED2-2, ED3-2), a first insulating layer (180) is arranged in the first light-emitting element regions (ED1-1, ED2-1, ED3-1) and the second light-emitting element regions (ED1-2, ED2-2, ED3-2), and the first insulating layer (180) has different heights (H1, H2) in the first light-emitting element regions (ED1-1, ED2-1, ED3-1) and the second light-emitting element regions (ED1-2, ED2-2, ED3-2). [2] The display device (10) according to claim 1, wherein a height of the first insulating layer (180) has a first height (H1) from a top surface of the substrate (100) to the top surface of the first insulating layer (180) arranged in the first light-emitting element regions (ED1-1, ED2-1, ED3-1), and a second height (H2) from the top surface of the substrate (100) to the top surface of the first insulating layer (180) arranged in the second light-emitting element regions (ED1-2, ED2-2, ED3-2). [3] Display device (10) according to claim 2, wherein the first height (H1) is higher than the second height (H2). [4] The display device (10) according to any one of claims 1 to 3, wherein the plurality of pixels (PXL) comprise a plurality of sub-pixels (Sub_PXL), and each sub-pixel (Sub_PXL) comprises at least one protrusion (120). [5] The display device (10) according to claim 4, wherein the first light-emitting element regions (ED1-1, ED2-1, ED3-1) and the second light-emitting element regions (ED1-2, ED2-2, ED3-2) are arranged on the at least one projection (120). [6] The display device (10) according to claim 5, wherein below the at least one projection (120) a first connection wiring (230) corresponding to the first light-emitting element regions (ED1-1, ED2-1, ED3-1) is arranged and a second connection wiring (240) corresponding to the second light-emitting element regions (ED1-2, ED2-2, ED3-2) is arranged. [7] The display device (10) according to claim 6, wherein a first connection electrode (131) is arranged on the first connection wiring (230) and a second connection electrode (132) is arranged on the second connection wiring (240). [8] A display device (10) according to claim 7, wherein a first light-emitting element (EM) is arranged on the first connection electrode (131). [9] Display device (10) according to claim 8, further comprising: a lens (300) arranged on the first light-emitting element (EM), and a lens (300) arranged on the second connection electrode (132). [10] The display device (10) according to claim 9, wherein a second electrode (190) is disposed on the lenses (300) and the first insulating layer (180). [11] Display device (10) according to claim 10, further comprising: a second insulating layer (182) disposed on the second electrode (190). [12] The display device (10) of claim 10, wherein the second insulating layer (182) is formed of a same material as the first insulating layer (180) and / or has a planar upper surface. [13] A method for manufacturing a display device (10), comprising: Creating a substrate (100) having a display area and a non-display area; Forming a drive circuit part and a plurality of planarization layers (111, 112) on the substrate (100); Forming a protrusion (120) on the plurality of planarization layers (111, 112); Forming a first connection electrode (131) and a second connection electrode (132) in a first light-emitting element region and a second light-emitting element region (ED1-2, ED2-2, ED3-2) which are arranged on the projection (120); Arranging a light-emitting element (EM) on one of the first connection electrode (131) and the second connection electrode (132); and Arranging a lens (300) on an upper portion of the other of the first connecting electrode (131) and the second connecting electrode (132) and on an upper portion of the light-emitting element (EM), wherein a first insulating layer (180) is arranged on the first light-emitting element region and the second light-emitting element region (ED1-2, ED2-2, ED3-2). [14] The method of claim 13, wherein said disposing of the light-emitting element (EM) comprises: performing a laser transfer or an embossing transfer from a donor substrate (DN) to the fabricated substrate (100). [15] The method according to claim 13 or 14, wherein the first insulating layer (180) has a first height (H1) from a top surface of the substrate (100) to the top surface of the first insulating layer (180) arranged in the first light-emitting element region, and a second height (H2) from the top surface of the substrate (100) to the top surface of the first insulating layer (180) arranged in the second light-emitting element region (ED1-2, ED2-2, ED3-2). [16] The method according to claim 15, wherein the first height (H1) is formed to be higher than the second height (H2). [17] The method according to any one of claims 13 to 16, wherein an adhesive layer (170, 170a) is formed on the first connection electrode (131) and the second connection electrode (132). [18] The method according to claim 17, wherein the lens (300) is formed to be equal to or larger than an area of the adhesive layer (170, 170a). [19] Display device (10) comprising: a substrate (100) having a display area and a non-display area; a drive circuit part arranged on the substrate (100); a plurality of planarization layers (111, 112) arranged on the drive circuit part; and a plurality of pixels (PXL) arranged on the plurality of planarization layers (111, 112) in the display area, wherein the plurality of pixels (PXL) have a plurality of first light-emitting element regions (ED1-1, ED2-1, ED3-1) and second light-emitting element regions (ED1-2, ED2-2, ED3-2), a first connection electrode (131), a first light-emitting element (EM) arranged on the first connection electrode (131), a first lens (300) arranged on the first light-emitting element (EM), and a second electrode (190) arranged on the first lens (300) are arranged in the first light-emitting element regions (ED1-1, ED2-1, ED3-1), and a second connection electrode (132), a second lens (300) arranged on the second connection electrode (132), and a second electrode (190) arranged on the second lens (300) are arranged in the second light-emitting element regions (ED1-2, ED2-2, ED3-2). [20] The display device (10) according to claim 19, wherein the second connection electrode (132) and the second electrode (190) do not contact each other due to the second lens (300). [21] The display device (10) according to claim 19 or 20, wherein a protective layer (160) is disposed on the second connection electrode (132) so that a portion of the second connection electrode (132) is exposed, a contact wiring is arranged on the exposed portion of the second connection electrode (132), and the second lens (300) covers the contact wiring. [22] The display device (10) according to claim 21, wherein an area of the second lens (300) is larger than an area of the contact wiring and smaller than an area of an upper surface of the first light-emitting element (EM).

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