Current sensor components and methods for their manufacture

Abstract

A current sensor component, and in particular a residual current sensor component, has a housing formed entirely of an encapsulating material that is exposed to the outside and forms an outer boundary of the housing. At least one magnetic field sensor is arranged within the housing. At least two current conductors have sections arranged side by side within the housing. A magnetic field concentrator surrounds the side by side sections of the at least two current conductors, at least partially, and is configured to concentrate a magnetic field generated by currents flowing through the at least two current conductors onto the magnetic field sensor. The magnetic field concentrator is arranged at least partially within the encapsulating material or is attached to an outer surface of the housing.

Description

[0001] This disclosure relates to current sensor components, and in particular residual current sensor components, and methods for manufacturing them. Specifically, this disclosure relates to current sensor components, and in particular residual current sensor components, comprising a magnetic field concentrator designed to concentrate currents flowing through one or more conductors onto a magnetic field sensor of the current sensor component. In particular, aspects of this disclosure also relate to how a magnetic field sensor and other components of the current sensor components are housed.

[0002] Generally, current sensor components and residual current sensor components, which are used, for example, as circuit breakers, are well-known. A residual current sensor is a component that measures the difference between the incoming and outgoing electrical current in a circuit. This allows unwanted current flow to be detected, and the residual current sensor can be used, for example, to trigger electrical safety devices, such as circuit breakers, to interrupt the power supply.

[0003] Residual current monitoring requires highly sensitive components or high magnetic field strengths. Typical solutions using enclosed fault sensors, such as those offered by LEM, are bulky and expensive. Traditional closed-circuit, magnetic core-based solutions can only be used for AC power supply fault conditions and cannot detect DC fault conditions. The use of fluxgate-based magnetic cores is also bulky and environmentally unfriendly. Furthermore, through-hole components can increase production costs at the product level.

[0004] There is therefore a need for current sensor components, especially residual current sensor components, that are easy to manufacture and space-saving, as well as for methods to manufacture them.

[0005] Examples from the present disclosure provide a fault current sensor component with the following features: a housing formed entirely from a potting material that is exposed to the outside and forms an outer boundary of the housing; at least one magnetic field sensor arranged in the housing; at least two conductors that have sections arranged side by side in the housing; a magnetic field concentrator that at least partially surrounds the adjacent sections of the at least two current conductors and is configured to concentrate a magnetic field generated by currents flowing through the at least two current conductors onto the magnetic field sensor, wherein the magnetic field concentrator is at least partially located in the potting material or attached to an outer surface of the housing.

[0006] Examples from the present disclosure provide a fault current sensor component with the following features: an insulating plate-shaped carrier; a magnetic field sensor; at least two conductors that have sections arranged side by side; a magnetic field concentrator that at least partially surrounds the adjacent sections of the at least two current conductors and is configured to concentrate a magnetic field generated by currents flowing through the at least two current conductors onto the magnetic field sensor, wherein the insulating plate-shaped support carries the magnetic field sensor, which carries at least two current conductors and the magnetic field concentrator, wherein a potting material is applied to a main surface of the insulating plate-shaped support, covering the magnetic field sensor and at least parts of the magnetic field concentrator, and where parts of the potting material and parts of the carrier are exposed to the outside and form an outer boundary of the fault current sensor component.

[0007] Examples from the present disclosure provide a current sensor component with the following features: a case; at least one magnetic field sensor chip arranged in the housing, which has a magnetic field sensor; at least one conductor which has a section arranged in the housing; a magnetic field concentrator that at least partially surrounds the section of the current conductor arranged in the housing and is configured to concentrate a magnetic field generated by a current flowing through the at least one current conductor onto the magnetic field sensor, where part of the magnetic field concentrator is formed on the chip surface of the magnetic field sensor chip.

[0008] Examples of the present disclosure provide methods for manufacturing current sensor components and fault current sensor components as described herein.

[0009] Examples of the present disclosure are thus directed towards the realization of current sensor components, in particular residual current sensor components, which can be manufactured in a semiconductor package using typical equipment for manufacturing semiconductor packages. In particular, this can be implemented by integrating one, two, or four current conductors, which can also be referred to as busbars, into the same package, which has an encapsulating material that is exposed to the outside and forms an outer boundary of the package. A magnetic field concentrator can be integrated into the package or clamped onto the package as a field concentrator clip. In some examples, parts of the magnetic field concentrator can be provided on a chip of the magnetic field sensor. Examples of the present disclosure thus enable simple manufacturing and space-saving components.Furthermore, examples enable the measurement of small currents due to the magnetic field concentrator.

[0010] Examples of the present disclosure are described in more detail below with reference to the accompanying drawings. These show: Fig. 1A to 1C schematic representations of a fault current sensor component with lateral detection and internal magnetic field concentrator according to an example of the present disclosure; Fig. 2A to 2C schematic representations of a fault current sensor component with vertical detection and internal magnetic field concentrator according to an example of the present disclosure; Fig. 3A and Fig. 3B Schematic representations of variants of a fault current sensor component with lateral detection and external magnetic field concentrator according to an example of the present disclosure; Fig. 4A and Fig. 4B Schematic representations of a fault current sensor component with vertical detection and external magnetic field concentrator according to an example of the present disclosure; Fig. 5A and Fig. 5B Schematic representations of variants of a fault current sensor component with lateral detection and internal magnetic field concentrator according to a further example of the present disclosure; Fig. 6 a schematic representation of a fault current sensor component with lateral detection and internal magnetic field concentrator according to another example of the present disclosure; Fig. 7 a schematic representation of a fault current sensor component with vertical detection and internal magnetic field concentrator according to another example of the present disclosure; Fig. 8 a schematic representation of a fault current sensor component with vertical detection and external magnetic field concentrator according to another example of the present disclosure; Fig. 9A and Fig. 9B Schematic representations of a fault current sensor component with lateral detection according to an example of the present disclosure, wherein part of the magnetic field concentrator is formed on a magnetic field sensor chip; Fig. 10 and Fig. 11 schematic representations of fault current sensor components with lateral detection and different conductor structures of a connection frame (leadframe) according to examples of the present disclosure; Fig. 12 and Fig. 13 schematic representations of fault current sensor components with vertical detection and different conductor structures of a connection frame according to examples of the present disclosure; Fig. 14A to 14D schematic representations of a fault current sensor component with lateral detection and internal magnetic field concentrator according to another example of the present disclosure in different manufacturing stages; Fig. 15A to 15C schematic representations of a fault current sensor component with vertical detection and external magnetic field concentrator according to another example of the present disclosure in different manufacturing stages; Fig. 16A to 16D schematic representations of a fault current sensor component with vertical detection and internal magnetic field concentrator according to another example of the present disclosure in different manufacturing stages; Fig. 17A to 17D schematic representations of a fault current sensor component with lateral detection and internal magnetic field concentrator, which is partly formed on a magnetic field sensor chip, according to another example of the present disclosure in different manufacturing stages; Fig. 18A to 18D schematic representations of a fault current sensor component with vertical sensing and internal magnetic field concentrator, which is partly formed on a magnetic field sensor chip, according to another example of the present disclosure in different manufacturing stages; Fig. 19A and Fig. 19B Schematic representations of a fault current sensor component with vertical detection and internal magnetic field concentrator according to another example of the present disclosure; Fig. 20A and Fig. 20B Schematic representations of a fault current sensor component with vertical detection and internal magnetic field concentrator according to another example of the present disclosure; Fig. 21A to 21D schematic representations of a fault current sensor component with lateral detection according to another example of the present disclosure in different manufacturing stages; Fig. 22A to 22D schematic representations of a fault current sensor component with vertical detection according to another example of the present disclosure in different manufacturing stages; Fig. 23A to 23F schematic representations of a fault current sensor component with lateral detection according to another example of the present disclosure in different manufacturing stages; Fig. 24A to 24F schematic representations of a fault current sensor component with lateral detection according to another example of the present disclosure in different manufacturing stages; Fig. 25A and Fig. 25B Schematic representations of a fault current sensor component with lateral detection and two current conductors according to an example of the present disclosure, to illustrate an example of a connection frame; Fig. 26 a schematic representation of a fault current sensor component with lateral detection and four current conductors according to an example of the present disclosure, to illustrate an example of a connection frame; Fig. 27A and Fig. 27B Schematic representations of an alternative example of a fault current sensor component: Fig. 28A to 28C schematic diagrams to explain magnetic field concentrators for lateral and vertical detection; Fig. 29A and Fig. 29B Schematic representations of examples of magnetic field concentrators; and Fig. 30A to 30C schematic diagrams to explain vertical and lateral detection.

[0011] Examples of the present disclosure are described in detail below, using the accompanying drawings. It should be noted that identical elements or elements having the same functionality are designated with the same or similar reference numerals, and repeated descriptions of elements with the same or similar reference numerals are typically omitted. In particular, identical or similar elements may each be designated with reference numerals that include the same number with a different lowercase letter or with no lowercase letter. Descriptions of elements with the same or similar reference numerals are interchangeable. Many details are described below to provide a more thorough explanation of examples of the disclosure.However, it is obvious to experts that other examples can be implemented without these specific details. Features of the different described examples can be combined unless features of such a combination are mutually exclusive or such a combination is explicitly excluded.

[0012] The dimensions and measurements mentioned in the following figure description are purely illustrative. They serve only to provide a rough idea of ​​the scale within which the innovative concept described herein unfolds. Elements in the figures may be depicted as at least partially transparent so as not to obscure elements beneath or behind them, thus facilitating the explanation of the revelation.

[0013] Examples of the present disclosure relate to the realization of current sensor components, in particular residual current sensor components, which can be manufactured in a typical semiconductor package consisting entirely of a cast potting material or consisting solely of an insulating support and a potting material applied to the support. The potting material can be applied by casting using a mold in the usual manner. Molten potting material can be introduced into a mold, flow around the semiconductor chip and a terminal frame, and fill the entire mold. Subsequently, the potting material can harden and form the outer housing, or together with an insulating support, the outer housing. Upon hardening, the potting material becomes rigid and forms a solid protective shell around the semiconductor chip.The components according to the present disclosure do not include shell-shaped housing components that are assembled modularly.

[0014] In some examples, an inherent overcurrent detection can be directly connected to a driver IC (Integrated Circuit) for fast response. These examples enable a miniaturized form factor and low weight. Furthermore, they offer lower costs compared to existing solutions.

[0015] Examples of the present disclosure are particularly suitable for wallbox applications, charging cables, or on-board chargers. In these examples, the magnetic field sensor can be implemented using Hall technology or xMR technology, for example, Hall chip technology or vertical xMR chip technology for vertical sensing, or xMR chip technology or vertical Hall chip technology for lateral sensing.

[0016] Examples from this disclosure relate to residual current monitors (RCMs), which are purpose-built devices designed for the continuous monitoring and measurement of current imbalances in a circuit. Examples from this disclosure can include residual current circuit breakers (RCCBs) or ground fault circuit interrupters (GFCIs), which are electrical safety devices that rapidly interrupt an electrical circuit with a leakage current to ground. This serves to protect equipment and reduce the risk of serious damage due to a sustained electric shock.

[0017] The examples of residual current sensor components described herein may be implemented using "classic semiconductor packages" or "classic semiconductor packages." Such a package may be an integrated semiconductor package where the package is created using a potting compound. In some examples, the package may be a single-piece body produced in one step from a potting material. In others, the package may consist entirely of a potting material that is exposed externally and forms an outer boundary of the package. In still others, the potting material may be applied to an insulating plate-shaped support, with portions of the potting material and portions of the support being exposed externally and forming an outer boundary of the residual current sensor component.In such examples, the potting material together with the insulating plate-shaped support thus constitutes a housing.

[0018] Examples of the present disclosure thus relate to enclosed components that do not have a modular housing, where a modular housing is understood to be a housing that has several parts that are assembled to form the housing, or where several process steps are necessary to achieve the enclosure. The present disclosure thus relates to housing bodies whose outer boundary is formed at least partially from potting material without requiring one or more prefabricated shells or casings.

[0019] Fault current sensor components according to the present disclosure comprise a magnetic field sensor, at least two conductors having adjacent sections, and a magnetic field concentrator that at least partially surrounds the adjacent sections of the at least two conductors and is configured to concentrate a magnetic field generated by currents flowing through the at least two conductors onto the magnetic field sensor. The magnetic field sensor includes a sensing element for detecting a magnetic field. The sensing elements can be magnetoresistive sensing elements, also abbreviated as xMR sensors. These include, for example, TMR sensors (Tunnel Magnetoresistance), AMR sensors (Anisotropic Magnetoresistance), GMR sensors (Giant Magnetoresistance), CMR sensors (Colossal Magnetoresistance), and the like.In principle, the electrical resistance or conductance of magnetoresistive sensors changes when exposed to a magnetic field. xMR sensors detect the field strength parallel to a reference direction. This is achieved through resistance-based measurement using various magnetoresistive sensor elements. These sensor elements output a signal that depends on the magnetic field in the direction in which they are sensitive. Alternatively, the sensor element can be a Hall effect sensor.

[0020] A magnetic field concentrator, as defined herein, is an element suitable for directing a magnetic field. For this purpose, the magnetic field concentrator can be made of suitable materials with high magnetic permeability, such as a micro-metal or ferrite. Other suitable magnetic materials include: MnZn, NiZn, AlSiFe, NiFeMo, NiFe, FeSi, Fe·Si·Nb·Cu·B, CoFe, or materials marketed under the brand name "Vitrovac". The magnetic field concentrator can serve, firstly, to direct magnetic fields generated by currents flowing through conductors to the magnetic field sensor in order to increase sensitivity, and secondly, to shield against external magnetic fields. Thus, examples of this disclosure enable a high signal-to-noise ratio compared to conventional coreless technologies.

[0021] According to the present disclosure, the magnetic field concentrator at least partially surrounds one, two, four, or more conductors. The definition that the magnetic field concentrator at least partially surrounds the adjacent conductors means that sections of the magnetic field concentrator are arranged on at least three sides of the adjacent conductor sections. In examples, the at least three sides include a side of the conductors facing away from the magnetic field sensor, a top, and a bottom. In other examples, sections of the magnetic field concentrator are arranged on all four sides of the conductors. The magnetic field concentrator need not be continuous and may have interruptions, provided that the interruptions are sufficiently small not to substantially impair the magnetic flux through the magnetic field concentrator and thus its function.

[0022] The design of the residual current sensor components described herein may differ depending on whether the magnetic field sensor is designed for vertical or lateral (horizontal) detection. Unless otherwise specified, the terms "vertical" and "horizontal" (lateral) refer to the chip plane of a magnetic field sensor chip that incorporates the magnetic field sensor. The chip plane is defined by the two main surfaces of the magnetic field sensor chip, i.e., its two largest opposing surfaces. Fig. 30A to 30C each indicate a magnetic field sensor chip. According to Fig. 30A is a magnetic field sensor S of the magnetic field sensor chip 10, a vertical Hall element designed to detect magnetic fields MF horizontal to the chip plane, i.e., an in-plane field. Such detection is also referred to herein as lateral detection. According to Fig. According to 30B, the magnetic field sensor chip 10 has an xMR sensor element S designed to detect magnetic fields MF horizontal to the chip plane (in-plane fields). Fig. In 30C, the magnetic field sensor chip 10 features a sensor element S designed to detect magnetic fields MF perpendicular to the chip plane. The sensor element S for vertical detection can be implemented by a horizontal (planar, lateral) Hall element or a vertical xMR element.

[0023] Referring to the Fig. Sections 28A to 28C below describe examples of magnetic field concentrators to assist in the lateral or vertical detection of magnetic fields generated by two current-carrying conductors. Fig. 28A an arrangement for lateral detection, while the Fig. 28B and Fig. 28C shows an arrangement for vertical acquisition.

[0024] The Fig. Figures 28A to 28C each show a first conductor 20 and a second conductor 22. The first conductor 20 carries a current I1, as shown in Fig. 28A in the direction shown by arrows. The conductor 22 carries a current I2 in the direction shown by arrows. Fig. Current flows in the direction shown in diagram 28A. Thus, currents flow in opposite directions through adjacent sections of conductors 20 and 22. In other words, the current paths formed by the two conductors 20 and 22 are occupied by different phases. The conductors 20 and 22 can, for example, represent a supply and return path from a consumer or a generator, such as a solar power system. If no fault occurs, the two currents should be equal, and no leakage current should occur. In the event of a fault, there will be a difference between the two currents, which can be detected. For this purpose, a magnetic field sensor chip 30 with a magnetic field sensor 32 is provided. The magnetic field sensor 32 is designed to detect magnetic fields generated by currents I1 and I2. When these currents are equal, the magnetic fields should cancel each other out.However, if a fault current is present, it generates a residual magnetic field that is detected by the magnetic field sensor 32. A magnetic field concentrator 34 is provided to concentrate the magnetic field generated by the currents I1 and I2 onto the magnetic field sensor 32.

[0025] The Fig. Figures 28A to 28C each show a schematic top view of a corresponding arrangement in their upper part and a schematic cross-sectional view in their lower part. As shown in the respective schematic cross-sectional view, the current flows through conductor 20 into the plane of the drawing and the current through conductor 22 out of the plane of the drawing. The current through conductor 20 thus generates a magnetic field MF1 and the current through conductor 22 generates a magnetic field MF2. The magnetic field concentrator 34 is designed to concentrate these magnetic fields onto the magnetic field sensor 32. The magnetic field sensor 32 thus detects a magnetic difference between the magnetic fields MF1 and MF2. Fig. In the example shown in Figure 28A, the magnetic field sensor 32 is designed to detect a magnetic field in a lateral direction. For this purpose, it is arranged in an area onto which the magnetic field concentrator 34 concentrates the magnetic field. In a top view, the magnetic field sensor is arranged overlapping an area between the at least two conductors 20 and 22, relative to the adjacent sections of the two conductors. Preferably, the magnetic field sensor 32 is arranged centered with respect to the at least two conductors. Preferably, in a top view, the magnetic field sensor 32 is arranged between the two conductors 20 and 22.The magnetic field concentrator 34 has first sections 34a extending away from the magnetic field sensor 32 in opposite directions, second sections 34b guided around the outer sides of the two current conductors 20 and 22 (generally around the outer sides of at least two current conductors), and a third section 34c extending on the side of the current conductors 20 and 22 facing away from the first sections 34a, between the second sections 34b of the magnetic field concentrator 34. As shown in . Fig. As shown in Figure 28A, the first sections 34a of the magnetic field concentrator 34 can taper towards the magnetic field sensor 32 in order to better concentrate the magnetic field on the magnetic field sensor 32. The Fig. The magnetic field sensor shown in Figure 28A can be formed by a vertical Hall element or an xMR sensor element.

[0026] Fig. Figure 28B shows an arrangement for vertical detection. More precisely, the magnetic field sensor 32 is designed to detect a magnetic field in a direction perpendicular to the direction in which the sections of the at least two current conductors 20 and 22 are arranged side by side. The magnetic field sensor 32 is located on the outer side of the section of the current conductor 22 that is adjacent to the corresponding section of the current conductor 20. A magnetic field concentrator 44 is provided to concentrate a magnetic field generated by corresponding currents I1 and I2 flowing through the current conductors 20 and 22 onto the magnetic field sensor 32. Extending from the magnetic field sensor 32, the magnetic field concentrator has sections 44a that extend transversely across the adjacent sections of the two conductors 20 and 22 and are located on opposite sides of the at least two conductors 20 and 22.The two sections 44a are connected to each other via a section 44b on the side of the two conductors 20 and 22 facing away from the magnetic field sensor 32. Furthermore, in the example shown, the magnetic field concentrator has sections extending vertically from the two sections 44a to the magnetic field sensor 32. The magnetic field sensor 32 is arranged in a gap of the magnetic field concentrator 44. The sections 44a of the magnetic field concentrator 44 taper towards the magnetic field sensor. Although in the figures relating to vertical detection, the lower part of the magnetic field concentrator is shown as not tapering in plan view for illustrative reasons, it should be noted that this lower section can also taper towards the magnetic field sensor 32 in reality.

[0027] Fig. Figure 28C shows an example of a vertical sensing arrangement in which two magnetic field sensors 32a and 32b are provided. The magnetic field sensors 32a and 32b can be provided in a common magnetic field sensor chip 30 or on separate magnetic field sensor chips. In the arrangement shown in Fig. In the example shown in Figure 28C, the two magnetic field sensors 32a and 32b are provided in a common magnetic field sensor chip 30, which is arranged above the adjacent sections of the current conductors 20 and 22. The magnetic field concentrator 44 has a second gap in which the second magnetic field sensor 32b is located. If the magnetic field sensors 32a and 32b are arranged on separate magnetic field sensor chips, the two magnetic field sensor chips can be positioned on either side of the two current conductors 20 and 22 analogously to the example shown in Figure 28C. Fig. The magnetic field sensor chip shown in 28B is provided. However, the one in Fig. The arrangement shown in 28C is more space-saving. In the case of the one in Fig. In the example shown in Figure 28C, the magnetic field concentrator 44 concentrates the magnetic field onto the two magnetic field sensors 32a and 32b. The magnetic field sensor chip 30 can be designed to generate a difference between the signals produced by the magnetic field sensors 32a and 32b, which can lead to increased accuracy.

[0028] It goes without saying that here too, the lower part of the magnetic field concentrator 44, as seen from above, can be designed to taper towards the magnetic field sensors 32a and 32b.

[0029] The Fig. 29A and Fig. Figure 29B shows exemplary configurations of magnetic field concentrator sections 34a, 44a, which taper towards the magnetic field sensor 32. According to Fig. 29A the tapering takes place over the entire length of the corresponding section, while according to Fig. 29B the tapering only occurs in certain areas over the corresponding section. The magnetic field concentrator and its formation near the sensing element, i.e., the magnetic field sensor 32, is configured to assist in concentrating the magnetic field onto the sensing element of the magnetic field sensor, the shapes shown being purely exemplary.

[0030] The above statements regarding lateral and vertical detection, as well as the above statements regarding the arrangement of the current conductors, the magnetic field sensor, the magnetic field sensor chip, and the magnetic field concentrator, can be adopted for all the examples explained below, provided they do not contradict the examples, and are not repeated in detail in each case.

[0031] Referring to the Fig. In 1A to 1C, a fault current sensor component is now described according to an example of the present disclosure, wherein a housing 50 consists entirely of a potting material which is exposed to the outside and forms an outer boundary of the housing. Fig. 1A shows a schematic cross-sectional view along QQ in Fig. 1B, while Fig. Figure 1B shows a schematic top view of the component. A magnetic field sensor chip 30 with a magnetic field sensor 32 is arranged in the housing 50 with respect to a magnetic field concentrator 34 as described above. The residual current sensor component also has a leadframe, wherein current conductors 20 and 22 are formed as part of the leadframe. The leadframe also has signal and power supply connections A1 to A4. In the figures, parts of the leadframe are generally represented by vertical hatching.

[0032] It requires no further explanation that the magnetic field sensor chip 30, which is a semiconductor chip, has a suitable circuit configuration alongside the magnetic field sensor 32 to generate sensor output signals. Terminals A1 to A4 can be configured to output corresponding signals, possibly based on appropriate control signals, and to supply power to the magnetic field sensor chip 30. A sufficient creeppage clearance (CC) should exist between terminals A1 to A4 and the power conductors 20 and 22 to minimize the risk of arcing or leakage current.

[0033] As in Fig. As shown in Figure 1B, the respective terminals of the magnetic field sensor chip 30 can be connected to terminals A1 to A4 via bond wires 52. Furthermore, in Fig. Figure 1B shows an insulating structure in the form of an insulating layer 54 which can be provided between the magnetic field sensor chip 30 and the connection frame, more precisely the current conductors 20 and 22 thereof. Fig. Figure 1A shows the finished component, where it can be seen that the housing 50 is formed from the potting material, from which the connections of the connection frame, e.g., the connections of the conductors 20 and 22, protrude. Furthermore, as shown in Fig. As shown in Figure 1B, the connections A1 to A4 of the connection frame from housing 50 are also shown.

[0034] As in Fig. As shown in Figure 1B, the conductors 20 and 22 are U-shaped, each having two parallel sections forming the legs of the U-shaped conductor and a connecting section linking the two legs. The connecting sections of the U-shaped conductors 20 and 22 form the adjacent sections of the at least two conductors. Fig. Figure 1C shows an exemplary representation of the magnetic field concentrator 34. The magnetic field concentrator is arranged surrounding the connecting section of the U-shaped current conductors 20 and 22. In this example, the magnetic field concentrator is completely embedded in the potting material.

[0035] The term leadframe is used here in its usual professional sense, referring to a metallic frame, which may be made of copper or a copper alloy, for example, to support integrated circuits. The leadframe may be coated with silver, nickel, or gold to improve conductivity and prevent corrosion. The leadframe can serve as a support for a semiconductor chip, such as the magnetic field sensor chip 30, and can provide it with mechanical stability. It can hold and protect the chip in a fixed position both during the manufacturing process and in use, and its main function is to establish electrical connections between the internal circuitry of the integrated circuit and external terminals of the package.During manufacturing, the magnetic field sensor chip is placed on the mounting frame, and the chip's leads are connected to corresponding leads on the frame using wire bonding or flip-chip technology. The chip is then encapsulated in potting compound to complete the component, creating a robust unit for use in electronic devices. For example, the potting compound can consist of an epoxy resin, which may contain fillers and additives. Epoxy resin is suitable as a potting material due to its good electrical insulation, heat resistance, and moisture resistance, providing mechanical protection against damage from vibrations or shocks. Furthermore, epoxy resin is easily workable in its liquid state and subsequently cures to form a solid, protective housing.In other examples, the potting material can consist of silicone, polyurethane, polyamide, acrylic, thermoplastic potting compounds or liquid crystal polymer.

[0036] The Fig. Figures 2A to 2C show schematic representations of a fault current sensor component with vertical detection, in which the housing is also entirely made of a potting material that is exposed to the outside and forms an outer boundary of the housing. Fig. 2A shows a schematic cross-sectional view along QQ in Fig. 2B represents, while Fig. 2B shows a schematic top view, and Fig. 2C is a perspective view of the magnetic field concentrator. As above, referring to the Fig. As described in sections 1A to 1C, two conductors 20 and 22 and terminals A1 to A4 are again designed as parts of a connection frame. The two conductors 20 and 22 are designed as straight conductors. A magnetic field concentrator 44 is provided to at least partially surround the two conductors 20 and 22, for example, as described above. Fig. 28B. However, in this example, the sections of the magnetic field concentrator 44 extending vertically towards the magnetic field sensor 32 are not provided. As described in Fig. As shown in Figure 2A, the magnetic field sensor chip 30 can be arranged directly on a part of the connection frame, wherein a contact surface of the magnetic field sensor chip 30 can also be connected directly to the corresponding part of the connection frame via a flip-chip connection instead of bond wires 52. Also in the case shown in Fig. In the example shown in 2B, all components except the foreground connections of the connection frame are arranged in the housing which is entirely made of a potting material.

[0037] The in Fig. Example 2B is advantageous in that the sections of the at least two conductors arranged in the housing run straight through the housing.

[0038] As described, in some examples the magnetic field concentrator is completely embedded in the potting material. In other examples, at least parts of the magnetic field concentrator are attached to an outer surface of the housing. In some examples, the magnetic field concentrator is clamped onto the housing as a chip.

[0039] It should be noted at this point that the parts of the connection frame relating to connections A1 to A4 are shown in the schematic cross-sectional view in Fig. 2A are shown purely schematically and are labelled Ax and Ay, whereby, according to the present disclosure, the exact design of the connecting lines A1 to A4 is not important. The same applies to the corresponding cross-sectional views of the other special examples described herein.

[0040] Fig. 3A shows a schematic cross-sectional view along QQ in Fig. 3B and Fig. Figure 3B shows a schematic top view of an example of a residual current sensor component having a magnetic field concentrator 64 mounted on an outer surface of the housing 50. For example, the magnetic field concentrator 64 can be clipped onto the outer surface of the housing 50. In this case, first sections 64a of the magnetic field concentrator 64 extend from the magnetic field sensor 32 to the outer edges of the housing 50, and second sections 64b extend around the outer edges of the housing 50. A third section 64c of the magnetic field concentrator 64 extends between the second sections 64b on the side of the current conductors 20 and 22 facing away from the first sections 64a. As shown in Fig. As can be seen in Figure 3B, the magnetic field sensor chip is positioned on a corresponding section of the terminal frame in the form of a chip pad, with an insulator 54 potentially positioned between them. In the examples described herein, the magnetic field sensor chip can be mounted on a chip pad of a terminal frame in the usual form. The terminals of the magnetic field sensor chip 30 can, in turn, be connected to the terminals A1 to A4 of the terminal frame via bond wires. Furthermore, it should be noted that the first sections 64a can rest on the upper surface of the housing 50 and not, as shown in Figure 3B, on the housing 50. Fig. 3A is shown, and they are spaced apart from it. Furthermore, reference can be made to the above statements regarding the Fig. 1A and Fig. Reference is made to 1B. In this regard, it should be noted that, depending on the circumstances, the magnetic field sensor chip may be oriented longitudinally, as shown in Fig. 1B is shown, or across, as in Fig. 3B is shown, with respect to the conductors 20 and 22, wherein Fig. Figure 3A schematically shows the magnetic field sensor chip arranged longitudinally, while Fig. Figure 3B shows the magnetic field sensor chip 30 arranged transversely. In the Fig. 3A and Fig. In the example shown in 3B, the magnetic field sensor chip 32 is designed for lateral detection.

[0041] Fig. 4A shows a schematic cross-sectional view along QQ in Fig. 4B and Fig. Figure 4B shows a schematic top view of a vertically sensing residual current sensor component in which a magnetic field concentrator 74 is arranged on an outer surface of the housing 50, which is formed entirely from a potting material. For example, the magnetic field concentrator 74 can be clipped onto an outer surface of the potting material of the housing 50. The Fig. 4A and Fig. The example shown in 4B therefore differs from the one in the Fig. The example shown in 2A to 2C is achieved by the arrangement of the magnetic field concentrator 74, whereby reference can otherwise be made to the above explanations. The one in the Fig. 4A and Fig. The example shown in Figure 4B is advantageous in that the conductors 20 and 22 can run completely straight within the housing 50, and secondly, the magnetic field concentrator 74 can be easily clamped, for example, onto the potting material of the housing 50. Furthermore, the magnetic field concentrator 74 can have a U-shaped form, as shown in Figure 4B. Fig. 2C is shown, wherein only the legs of the U-shape and the section connecting the legs are each adjusted in length to fit around the potting material, the legs extending in the direction transverse to the adjacent current conductors 20 and 22 to the magnetic field sensor 32.

[0042] Fig. 5A shows a schematic cross-sectional view (along QQ in Fig. 5B) of a part of a residual current sensor component with lateral detection and Fig. Figure 5B shows a schematic top view of a corresponding residual current sensor component. In this example, the magnetic field concentrator 34 is completely enclosed in the housing 50, which is entirely made of a potting material. The semiconductor chip 30 is mounted via an insulator 54 on parts of the terminal frame that form the current conductors 20 and 22. In the Fig. In the variant shown in 5A, the distance between the two conductors 20 and 22 is slightly less than in the one shown in Fig. Variant shown in 5B. As in Fig. As shown in Figure 5B, in this example the two conductors 20 and 22 run completely straight through the housing 50. The magnetic field sensor 32 is arranged between the conductors 20 and 22, and the magnetic field concentrator 34 extends around the two conductors 20 and 22, as shown, for example, in Figure 5B above. Fig. 1B was described and in Fig. Figure 5B shows that in this example, the chip, together with the connection frame, can first be encapsulated in a potting compound to form an inner housing section around which the magnetic field concentrator 34 is placed. This is followed by encapsulation in another potting compound 50 to complete the housing, with this potting compound being exposed to the outside and forming an outer boundary of the housing. It should be noted that the cross-sectional view of Fig. 5A is cut off and does not show the part with connections A1 to A4.

[0043] In examples of the present disclosure, sections of two conductors are arranged side by side in the housing. In other examples, the conductors comprise four conductors, with the magnetic field concentrator at least partially surrounding adjacent sections of the four conductors. Fig. Figure 6 shows a schematic top view of a residual current sensor component with lateral detection, in which sections of four conductors are arranged side by side in the housing 50. As in Fig. As shown in Figure 6, four conductors 90, 92, 94, and 96 extend completely straight through the housing 50, forming part of the connection frame. Conductors 90 to 96 carry currents of different phases L3, L2, L1, and N. The magnetic field sensor 32 is arranged to detect a magnetic field generated by these currents. This magnetic field should cancel out when no fault is present. In the event of a fault, a residual current generates a residual magnetic field, which is detected by the magnetic field sensor 32. For this purpose, the magnetic field concentrator 34 is provided. The magnetic field sensor 32 is positioned between the two middle conductors 92 and 94, and the magnetic field concentrator 34 extends around all four current conductors 90 to 96. The magnetic field concentrator 34 is located between the two middle conductors 92 and 94. Fig. The example shown in section 6 differs from the one in the Fig. 5A and Fig. In example 5B, this is achieved by replacing the two conductors 20 and 22 with four conductors 90 to 96. For further details, please refer to the explanations above.

[0044] Fig. Figure 7 shows a schematic top view of a residual current sensor component according to the present disclosure, in which four current conductors 90, 92, 94 and 96 are provided in the housing 50. Otherwise, the [unclear] corresponds to the [unclear] Fig. The component shown in section 7 refers to the one above. Fig. The component described in sections 2A to 2C is described, so reference is again made to the above explanations. The magnetic field sensor 32 is located in the section described in Fig. The example shown in Figure 7 is designed for vertical detection, and the magnetic field concentrator 44 extends around adjacent sections of all four current conductors 90 to 96. The magnetic field sensor 32 is arranged on an outer side of the outer current conductor 96, as shown in Figure 7. Fig. 7 is shown.

[0045] Fig. Figure 8 shows a schematic top view of an example of a residual current sensor component in which a magnetic field concentrator 74 is provided on an outer surface of the housing, which consists entirely of a potting material. The in Fig. The example shown in point 8 corresponds to the one in Fig. 4B example, with the exception that instead of the two conductors 20 and 22 there are four conductors 90 to 96, as shown above, for example, with reference to the Fig. 6B and Fig. The magnetic field concentrator 74 is again designed to enclose all four current conductors 90 to 96, and the magnetic field sensor 32 is, as described above, Fig. As described in section 7, the magnetic field concentrator is arranged on an outer side of the conductor 96. This example is advantageous in that a fault current with respect to four conductors 90 to 96, carrying different phases, can be detected, and the magnetic field concentrator can be easily attached to an outer surface of the potting material, for example, in the form of a clip. For further details, reference is made again to the above explanations.

[0046] In examples from the present disclosure, sections of the magnetic field concentrator are formed on a chip surface of the magnetic field sensor. The definition of "sections of the magnetic field concentrator are formed on a chip surface of the magnetic field sensor" here means that these sections are generated on the chip surface of the magnetic field sensor before the magnetic field sensor chip is positioned relative to other parts of the magnetic field concentrator to create the complete magnetic field concentrator.

[0047] One such example of a magnetic field sensor with lateral detection is in the Fig. 9A and Fig. 9B shown, where Fig. 9A a schematic cross-sectional view of the lower part of Fig. 9B along QQ and Fig. Figure 9B shows a schematic top view. The magnetic field concentrator 98 is completely enclosed in the housing 50, which is entirely made of a potting material. An insulating component 54 is arranged between two current conductors 20, 22 and the magnetic field sensor chip 30. The magnetic field sensor chip 30 is arranged such that, in plan view, the magnetic field sensor 32 is located between the current conductors 20, 22. The portions of the current conductors 20 and 22 located in the housing 50 are straight.The magnetic field concentrator 98 has first sections 98a, which are formed on an upper surface of the magnetic field sensor chip 30 and extend away from the magnetic field sensor 32 in opposite directions, second sections 98b, which are guided externally around the two current conductors 20 and 22, and a third section 98c, which extends on the side of the current conductors 20, 22 facing away from the first sections 98a between the second sections 98b of the magnetic field concentrator 98. The [unclear text] Fig. 9A and Fig. The example shown in 9B differs from the one in the Fig. 5A and Fig. As shown in the example in Figure 5B, the magnetic field concentrator 98 is not formed in one piece, like the magnetic field concentrator 34, but parts of the magnetic field concentrator 98, namely the first sections 98a, are formed on a surface of the magnetic field sensor chip 30.

[0048] In some examples, the magnetic field concentrator is designed such that the distance between parts of the magnetic field concentrator arranged on the surface of the magnetic field sensor chip 30 and other sections is as small as possible. For this purpose, laterally extending sections of the magnetic field concentrator 64 could be provided at the upper end of the second sections 98b, extending towards the outer ends of the first sections 98a. Furthermore, it should be noted that the magnetic field concentrators disclosed herein do not necessarily have to completely surround the current conductors, as long as the purpose of concentrating the magnetic field onto the magnetic field sensor can be achieved. Thus, gaps could be provided between sections of the respective magnetic field concentrator, but these gaps would be sufficiently small not to significantly impair the magnetic flux.

[0049] The Fig. 10 and Fig. Figure 11 shows schematic top views of examples of residual current sensor components according to the present disclosure, and in particular exemplary wiring options. In the Fig. 10 and Fig. In the 11 examples shown, the magnetic field sensor 32 is designed to detect a lateral magnetic field. In the example shown in Fig. In the example shown in Figure 10, four current conductors 90 to 96 are U-shaped, with legs of the U-shaped current conductors forming outer terminals arranged on one longitudinal side of the housing 50. Signal / power supply terminals A1 to A4 are arranged on the opposite longitudinal side of the housing. Fig. 11 Four straight conductors 90 to 96 are arranged in the housing, with the terminals of the four straight conductors located on opposite transverse sides (short sides) of the housing, while four signal / power supply terminals A1 to A4 are located on one longitudinal side of the housing 50. In the Fig. In the example shown in Figure 10, the magnetic field concentrator 34 is completely enclosed in the housing 50, while the magnetic field concentrator 64 is located in the housing 50. Fig. 11. Example shown is provided on the outer surface of the housing 50.

[0050] The Fig. 12 and Fig. Figure 13 shows schematic top views of examples of vertically sensing residual current sensor components and, in particular, examples of different wiring options. According to Fig. Figure 12 provides two U-shaped current conductors 20 and 22, around which the magnetic field concentrator 44, arranged in the housing 50, extends to concentrate the magnetic field onto the magnetic field sensor 32. Connections of the current conductors 20 and 22 extend from one longitudinal side of the housing 50. Signal / power supply connections A1 to A4 extend from the opposite longitudinal side of the housing 50. Fig. Four U-shaped conductors 90 to 96 are provided, the terminals of which extend from one longitudinal side of the housing 50. The magnetic field concentrator 44 surrounds the four conductors 90 to 96 on three sides of them to concentrate the magnetic field on the magnetic field sensor 32. Signal / power supply terminals A1, A2, A3 and A4 extend from an opposite longitudinal side of the housing 50.

[0051] In examples, the fault current sensor component has an insulating component in which the adjacent sections of the at least two current conductors are arranged, wherein the magnetic field concentrator is formed on the outer surface of the insulating component, and wherein the potting material of the housing covers the magnetic field sensor and at least parts of the magnetic field concentrator and the insulating component.

[0052] Such an example is given below with reference to the Fig. Sections 14A to 14D explain in more detail a method for producing the same.

[0053] Fig. Figure 14A shows an intermediate product comprising an insulating component 100. The insulating component 100 has a main surface in which Fig. 14A of the upper surface, of which a recess 102 is located in which the magnetic field sensor chip 30 with the magnetic field sensor 32 is arranged. An adhesive layer can be arranged between the insulating component and the magnetic field sensor chip 30. The intermediate product further comprises a connection frame which has two current conductors 20 and 22. Fig. 14A thus represents an intermediate product comprising an insulating component 100, the magnetic field sensor 32 and at least two current conductors 20, 22.

[0054] A preform of a magnetic field concentrator is then provided. The preform of the magnetic field concentrator is U-shaped with two legs 104, 106, which are partially shown with dashed lines. Fig. The preform of the magnetic field concentrator is attached to the intermediate product by inserting the insulating component 100 into the interior of the U-shaped preform of the magnetic field concentrator. An adhesive layer 110 can be provided between the insulating component 100 and the preform of the magnetic field concentrator. The upper ends of the legs 104 and 106 are then bent inwards so that they lie on the top surface of the insulating component. This bends the ends of the legs 104 and 106 towards the magnetic field concentrator to create a magnetic field concentrator 34, as shown above, for example, with reference to the Fig. 28A, was described.

[0055] Subsequently, a potting process is carried out to form the housing 50. Potting material is applied to at least cover the magnetic field concentrator 34 and form the housing 50. As in Fig. As shown in Figure 14C, the housing is formed entirely from the potting material, which is exposed to the outside and forms an outer boundary of the housing. Fig. Figure 14C shows a schematic cross-sectional view of the finished product along QQ in Fig. 14D. Fig. Figure 14D shows a schematic top view of the product. The resulting component can essentially be compared to the one shown in the Fig. The components shown in 1A-1C correspond to this, with further explanations referred to the above statements. As in Fig. As shown in Figure 14D, the shape of the conductors 20, 22 and the terminals A1 to A4 differs slightly from the shape shown in the Fig. 1A-1C is shown.

[0056] In examples of the present disclosure, the insulating component 100 can be a pre-cast component made of plastic. In other examples, the insulating component can be formed from a suitable other insulating material, such as ceramic or epoxy resin.

[0057] The Fig. Figures 15A to 15C show schematic diagrams illustrating a method for manufacturing an example of a vertically sensing residual current sensor component, in which the magnetic field concentrator is provided on an outer surface of the housing. Fig. 15A and Fig. 15B presents schematic cross-sectional views along QQ in Fig. 15C. The method can be used, for example, to create a residual current sensor component, such as that found in Fig. 4A and Fig. As shown in 4B, to produce. Fig. As shown in Figure 15A, a housing is first manufactured or provided in which the magnetic field sensor 32 and the at least two current conductors 20, 22 are housed. The housing 50 consists entirely of potting material. The magnetic field concentrator is applied to the outer surface of the potting material 50. For this purpose, a preform of the magnetic field concentrator, which is in Fig. 15A, partially shown in dashed lines, is provided. The preform has a right angle with a lateral leg 120 and a vertical leg 122. The lateral leg is attached to the underside of the housing 50, as indicated by an arrow 124 in Fig. 15A. An adhesive layer may be provided between the lateral leg 120 and the housing 50. The lower part of the vertical leg 122 rests against the outside of the housing 50, with an adhesive layer also possible between it and the lower part. Subsequently, the upper part of the vertical leg 122 is bent inwards, as indicated by arrow 126 in Figure 15A. Fig. 15A indicates this. As a result, this upper part of the vertical leg 122 rests on the upper surface of the housing 50, with an adhesive layer potentially being arranged between them. This allows the magnetic field concentrator 74, as described above, for example, with reference to Fig. As described in section 4A, it is generated. A top view of the resulting component is shown in Fig. 15C shown, this essentially being the one shown in the Fig. 4A and Fig. 4B can correspond to the components described.

[0058] As an alternative to the procedure described above, the magnetic field concentrator 74 can be clipped onto the outer surface of the housing 50. Fig. Figure 15B shows such a procedure, in which the magnetic field concentrator 74 is provided as a clip and is inserted from one side, in Fig. 15B of the right side, is pushed onto the housing and clamped, as indicated by an arrow 128 in Fig. 15B is shown. This also results in a component as shown in Fig. The clip is U-shaped, and in its initial state the distance between the two ends of the legs can be slightly less than the thickness of the housing 50 in the vertical direction, so that these ends are pulled apart to slide onto the housing 50, and after releasing them clamp the magnetic field concentrator 74 onto the housing 50.

[0059] Referring to the Fig. In sections 15A to 15C, methods for applying a magnetic field concentrator to a housing that includes a magnetic field sensor for vertical detection were described. Corresponding methods can also be used to apply a magnetic field concentrator to a housing that includes a magnetic field sensor for lateral detection. For this purpose, a preform of a magnetic field concentrator, as described above with reference to the Fig. As described in 14A to 14D, which is adapted accordingly for a housing, are slid onto the housing from below, whereby the upper ends of the legs of the U-shaped preform are then bent inwards to form a magnetic field concentrator 64, such as that described in 14A to 14D. Fig. As shown in section 3A of the present application, an adhesive medium can be provided between areas of the magnetic field concentrator and the housing in such examples.

[0060] Referring to the Fig. Sections 16A to 16D describe another example of a vertically sensing residual current sensor component and a method for manufacturing it. Fig. 16A and Fig. Figure 16B shows intermediate products during the manufacturing process. Fig. Figure 16C shows a schematic cross-sectional view of a part of the fault current sensor component along QQ in Fig. 16D and Fig. 16D a schematic top view of the same.

[0061] First, as in Fig. Figure 16A shows an intermediate product that includes the connection frame with signal / power supply connections Ax, Ay and two power conductors 22 and 20. As shown in Fig. As can be seen from 16A, the magnetic field sensor chip 30 with the magnetic field sensor 32 is mounted on part of the connection frame. The current conductors 20 and 22 are provided on an insulating component 129. The in Fig. The elements shown in 16A can be connected to each other via parts of the connection frame (not shown). These parts can be removed in the usual way, for example, after the housing has been produced from the potting compound, and this can apply to all the examples described herein. Starting from the one in Fig. The intermediate product shown in Figure 16A is a preform of a magnetic field concentrator, which forms a right angle with a lateral leg 120 and a vertical leg 122, which is in Fig. 16B, which is partially shown with dashed lines, has the following features. The lateral leg 120 is attached to the underside of the insulating component 129. The lower part of the vertical leg 122 rests against the outside of the insulating component 129. Subsequently, the upper part of the vertical leg 122 is bent around the edge of the insulating component 129, as indicated by an arrow 126 in Fig. Figure 16B shows that this creates a U-shaped magnetic field concentrator 44, as shown above, for example. Fig. 2A to 2B as described. Subsequently, a potting compound is applied to create the housing 50, which is formed entirely from the potting compound. The one described in the Fig. 16C and Fig. The product shown in 16D can essentially be compared to the one shown in Fig. The component shown in 2B corresponds to this, so that for further explanations refer to the above statements regarding the Fig. 2A to 2C can be referred to.

[0062] Referring to the Fig. Sections 17A to 17D below describe an example of a fault current sensor component with lateral detection, in which part of the magnetic field concentrator is formed on the magnetic field sensor chip. Fig. Figure 17A shows a schematic cross-sectional view of a preform comprising the magnetic field sensor chip 30 with the magnetic field sensor 32 and a connection frame with the current conductors 20 and 22. The magnetic field sensor chip 30 is mounted on the connection frame, for example, by means of an insulating adhesive layer 130. First sections 98a of a magnetic field concentrator are formed on the upper surface of the magnetic field sensor chip 30. A U-shaped part 98d of the magnetic field concentrator is slid onto this preform from the side of the connection frame facing away from the magnetic field sensor chip 30. Legs of the U-shaped part 98d represent second sections 98b of the magnetic field concentrator, and one end of the U-shaped part 98d represents a third section 98c of the magnetic field concentrator. This results in a magnetic field concentrator, such as the one described above with reference to Fig. As described in Figure 9A, parts of which, namely the first sections 98a, are formed on the upper surface of the magnetic field sensor chip 30. An adhesive layer 132 can again be provided between the third section 98c and the connection frame. Again, the upper ends of the second sections 98b extend as close as possible to the outer ends of the first sections 98a in order to minimize the gap between these sections of the magnetic field concentrator. Subsequently, a potting compound is applied to create the outer housing of the residual current sensor component, which is formed entirely from the potting compound, as described in Figure 9A. Fig. 17C is shown. Regarding the Fig. The example described in 17A to 17D differs from the one in the Fig. 9A and Fig. In the example shown in Figure 9B, the conductors 20 and 22 are U-shaped, so that the arrangement of the magnetic field sensor chip 30 and the magnetic field concentrator 98 is rotated by 90 degrees. Reference can also be made here to the description above.

[0063] In the described examples, where parts of the magnetic field concentrator are formed on the surface of the magnetic field sensor chip, these parts can also be connected to the other parts of the magnetic field concentrator, either through direct contact or via additional connecting elements. This can improve the magnetic flux between these parts.

[0064] Referring to the Fig. Sections 18A to 18D below describe an example of a fault current sensor component with vertical detection, together with process steps for its manufacture, in which parts of the magnetic field concentrator are formed on the magnetic field sensor chip.

[0065] Fig. Figure 18A shows a schematic cross-sectional view of a preform comprising the magnetic field sensor chip 30 with the magnetic field sensor 32 and the connection frame with the conductors 20 and 22. The magnetic field sensor chip 30 is, for example, mounted on the connection frame by means of an adhesive layer 130. A portion 140a of a magnetic field concentrator 140 is formed on the upper surface of the magnetic field sensor chip 30. As shown in Fig. As shown in Figure 18B, an L-shaped part 140b of the magnetic field concentrator 140 is slid onto the connection frame from the side of the connection frame facing away from the magnetic field sensor chip 30 and attached to it, for example, by means of an adhesive layer 132. This positions the upper end of the short leg of the L-shaped part 140b near the outer end of part 140a to create a magnetic field concentrator 140, the part 140a of which extends from the magnetic field sensor 32 to the upper end of the short leg of part 140b, with the long leg of the L-shaped part 140b extending on the opposite side from the magnetic field sensor 32. This allows a vertical magnetic field to be concentrated at the location of the magnetic field sensor 32. Again, the gap between the outer end of part 140a and the upper end of the short leg of part 140b should be as small as possible in order not to unduly impair the magnetic flux.For this purpose, a vertical section could be provided at the end of the long leg of the L-shaped part, extending towards the magnetic field sensor 32.

[0066] Following this, as in Fig. Figure 18C shows that potting material has been applied to form the outer housing 50 of the fault current sensor component. Fig. Figure 18C shows a partial cross-sectional view along QQ of only the lower part of Fig. 18D. Fig. Figure 18D shows a schematic top view of the fault current component with the terminals of the conductors 20 and 22 protruding from the housing 50 and the signal / power supply terminals A1 to A4.

[0067] The Fig. 19A and Fig. Figure 19B shows another example of a vertically sensing residual current sensor component with an internal magnetic field concentrator, in which a housing cast entirely from a potting material is cast into another housing. This shows Fig. 19A a schematic top view and Fig. 19B a schematic cross-sectional view along QQ in Fig. 19A. A magnetic field sensor chip 30 with a magnetic field sensor 32 is mounted on a terminal frame, for example, on a chip pad thereof. The terminal frame has the two current conductors 20 and 22 as well as signal / power supply connections A1 to A5. The magnetic field sensor chip 30 and the terminal frame with the two current conductors 20 and 22 are enclosed in a housing 150 made of a potting material. As in Fig. As shown in Figure 19B, a magnetic field concentrator 44 is provided on the outer surface of the housing 150, which surrounds the two conductors 20 and 22 on three sides and extends in a U-shape from the top of the magnetic field sensor 32 to the bottom of the same. As shown in Fig. As shown in Figure 19B, the ends of the legs of the U-shaped magnetic field concentrator 44 extend obliquely towards the magnetic field sensor. The ends of the magnetic field concentrator can have a similar shape in other examples as well. The housing 150 can be considered an inner housing in the form of an insulating component. The magnetic field concentrator 44 is formed on an outer surface of this insulating component. Furthermore, another housing 152, which contains a potting compound, is provided above the magnetic field concentrator 44. This "outer" housing 152 encloses the magnetic field concentrator and parts of the inner housing 50, and thus also the magnetic field sensor. The inner and / or the outer housing 152 can be cast using potting material in the usual way.

[0068] The Fig. 20A and Fig. Figure 20B shows a schematic top view and a schematic cross-sectional view along QQ in Fig. 20A of a corresponding component, which differs from the one in the Fig. 19A and Fig. The component shown in Figure 19B differs in that it has four conductors 90 to 96 arranged in the housing 150, 152. Accordingly, the magnetic field concentrator 44 surrounds the four conductors 90 to 96 on three sides. For further details, please refer to the above statements regarding the Fig. 19A and Fig. Reference is made to 19B and the above statements regarding examples of vertically sensing residual current sensor components having four conductors.

[0069] Referring to the Fig. Examples of the following disclosure are described below in 21A to 21D and 22A to 22D, in which the residual current sensor component has an insulating plate-shaped support and a potting material, wherein parts of the potting material and parts of the support are exposed to the outside and form an outer boundary of the residual current sensor component and thus a housing thereof. Based on the Fig. Sections 21A to 21D describe an example of a horizontally sensing fault current sensor component, including a method for its manufacture, while the Fig. Sections 22A to 22D contain a corresponding description of an example of a fault current sensor component with vertical detection.

[0070] The Fig. 21A and Fig. Figure 21B shows schematic cross-sectional views of an intermediate product in the manufacture of a corresponding component, while Fig. 21C a schematic cross-sectional representation along QQ in Fig. 21D and Fig. 21D shows a schematic top view. As in Fig. As shown in Figure 21A, the intermediate product has an insulating plate-shaped support 200, which is embedded in a main surface of the same, in Fig. 21A of the upper surface has a recess 202 in which a magnetic field sensor chip 30 with a magnetic field sensor 32 is arranged. A connection frame with conductors 20 and 22 is also arranged in the insulating component 200. The magnetic field sensor chip 30 is attached in the recess 202, for example, by means of an adhesive layer 230. The insulating plate-shaped carrier 200 also has openings (in Fig. 21A not shown) through which parts of a preform of a magnetic field concentrator can be inserted. The magnetic field concentrator can have a preform as described above with reference to Fig. 14B described, namely a U-shape with legs 104 and 106 and a base 108. The legs 104 and 106 are pushed through the openings from a side of the plate-shaped carrier 200 facing away from the magnetic field sensor chip, so that they protrude on the side facing the magnetic field sensor chip 30, as shown by dashed lines in Fig. 21B is shown. An adhesive layer can again be provided between the base 108 and the facing side of the plate-shaped support 200. Subsequently, the upper parts of the legs 104 and 106 are bent inwards, as shown above with reference to Fig. 14B was described, so that the one in Fig. The magnetic field concentrator 34 shown in Figure 21B is then applied. A potting material 250 is subsequently applied, covering the magnetic field sensor chip 30 and thus the magnetic field sensor, and at least parts of the magnetic field concentrator 34. In the example shown, the potting material covers the inwardly curved parts of the legs 104 and 106. The magnetic field concentrator surrounds the adjacent sections of the at least two current conductors on three sides, in a manner as described above with reference to examples in this disclosure. The plate-shaped insulating support can be connected to parts of the connection frame via bond wires or by means of flip-chip connections. In the examples in this disclosure, the insulating plate-shaped support can consist of a suitable insulating material, for example, a pre-formed plastic, a ceramic material, or another suitable substrate material.

[0071] The Fig. Figures 22A to 22D show corresponding illustrations of a residual current sensor component with vertical sensing. A Fig. The intermediate product shown in Figure 22A has an insulating plate-shaped support 200 which has a recess 202 in a main surface, in Fig. 22A of the upper surface, in which a magnetic field sensor chip 30 with a magnetic field sensor 32 is arranged. The terminals of the magnetic field sensor chip 30 can in turn be suitably connected to terminal areas of a terminal frame by bond wires 52 or by flip-chip connections. The terminal frame is attached to or supported by the insulating plate-shaped carrier 200. The terminal frame in turn has current conductors 20 and 22 as well as signal / power supply terminals A1 to A4, which are located in the Fig. 22A to 22C are designated Ax and Ay. Based on the one in Fig. In the intermediate product shown in Figure 22A, a preform of a metal field concentrator is attached to the insulating plate-shaped carrier 200 from the side facing away from the magnetic field sensor chip 30, for example by means of an adhesive layer. The preform of the magnetic field concentrator in turn has a rectangular shape, with a horizontal, lateral section 120 and a vertical section which is Fig. 22B is shown partially with dashed lines in its initial form. After attaching the preform of the magnetic field concentrator, the upper part of the vertical part 122 is bent inwards towards the magnetic field sensor 32, as indicated by an arrow 126. Fig. 22B is shown. This forms an essentially U-shaped magnetic field concentrator 44, which may have a shape similar to that of the one in Fig. 2C corresponds to the magnetic field concentrator shown, with reference to the above statements regarding examples of the present disclosure for further details of such a magnetic field concentrator.

[0072] After the magnetic field concentrator is attached, a potting compound is applied that covers the magnetic field sensor chip 30 and thus the magnetic field sensor 32 and at least parts of the magnetic field concentrator 44. A schematic cross-sectional view (along QQ in Fig. 22D) and a schematic top view of the resulting component are in the Fig. 22C and Fig. 22D shown. These views represent the finished component, showing that parts of the potting material 250 and parts of the carrier 200 are exposed to the outside and form an outer boundary of the fault current sensor component shown.

[0073] Further examples of residual current sensor components with an insulating plate-shaped carrier and a magnetic field sensor, in which parts of the potting material and parts of the carrier are exposed to the outside and form an outer boundary of the residual current sensor component, are now referred to in the Fig. Explained in sections 23 to 26.

[0074] Fig. Figure 23A shows a schematic cross-sectional view of an intermediate product comprising an insulating plate-shaped carrier 300 and a magnetic field sensor chip 30 arranged in a recess 302 in a main surface of the plate-shaped carrier 300. The magnetic field sensor chip 30 can be attached to the recess 302 via an adhesive layer and conductively connected to a terminal frame 304 formed on the insulating plate-shaped carrier 300 via bond wires 52 or flip-chip connections. The insulating plate-shaped carrier 300 has holes 306 penetrating it between its main surfaces. As shown in Figure 23A, the magnetic field sensor chip 30 can be attached to the recess 302 via bond wires 52 or flip-chip connections. Fig. As shown in Figure 23B, a magnetic field concentrator 310 is attached to the insulating plate-shaped support. As shown in the left part of Figure 23B, a magnetic field concentrator 310 is attached to the insulating plate-shaped support. Fig. Figure 23E, which is a schematic top view of the magnetic field concentrator 310 and the magnetic field sensor chip 30, shows that the magnetic field concentrator 310 is essentially ring-shaped and has tapered sections towards the magnetic field sensor 32. In the region of the magnetic field sensor 32, the magnetic field concentrator may be interrupted or may have a narrow region. As shown in the right part of Fig. As shown in Figure 23E, the sections of the magnetic field concentrator 310 leading to the magnetic field sensor 32 can also be tapered in the thickness direction, i.e., perpendicular to the chip plane of the magnetic field sensor chip 30, i.e., in the vertical direction, towards the magnetic field sensor. The corresponding sections of the magnetic field concentrator 310 can thus be tapered in the vertical and / or lateral direction.

[0075] Based on the one in Fig. 23B shows the state in which the magnetic field concentrator 310 is attached to the main surface of the plate-shaped support 300 in order to be arranged with respect to the magnetic field sensor chip 30 as shown in Fig. As shown in Figure 23E, two U-shaped conductors are now inserted into the holes 306, such that each conductor extends through a respective first hole from a first main surface of the support 300 to a second opposite main surface of the support 300, and then through a respective second hole from the second main surface of the support 300 back to the first main surface of the support 300. This is shown in Figure 23E. Fig. Figure 23C shows a conductor 320 extending through the left hole from the lower main surface of the support 300 to the upper main surface of the support 300, bending there, and then extending through the right hole 306 of the support 300 from its upper surface to its lower surface. A current I1 can flow through the conductor 320 in the direction indicated by the arrows. Fig. 23D is shown. A second conductor 322 is guided through corresponding further holes 306 in the support 300, as shown in the top view in Fig. 23F can be seen. Two of the holes 306 are positioned adjacent to each other such that the conductors 320 and 322 have adjacent sections through which currents of opposite polarity flow. The magnetic field concentrator 310 is designed to surround these two sections of the current conductors 320 and 322, as shown in Fig. 23F can be identified.

[0076] After the current conductors are inserted into the openings 306, a potting material 250 is applied to the main surface of the carrier 300, in which the recess 302 is formed, such that it covers the magnetic field sensor chip 30 and thus the magnetic field sensor 32, and at least parts of the magnetic field concentrator 310. In the example shown in Fig. As shown in Figure 23D, the potting material is also provided over the holes 306 on the main surface of the insulating carrier 300, in which the recess 302 is formed, so that this potting material forms a housing for the parts of the current conductors 320, 322, for the magnetic field concentrator 310 and for the magnetic field sensor chip 30 arranged in the holes. As shown in the Fig. 23C and Fig. As shown schematically in 23D, further parts of the connecting frame 304 can be formed in the plate-shaped support 300.

[0077] The Fig. Sections 24A to 24F show corresponding illustrations for an example of a residual current sensor component with four conductors, the only difference being that shown in the Fig. 24A to 24F example shown and the one in the Fig. The difference shown in the example 23A to 23F is that four conductors are provided instead of two. A further description of the corresponding features is therefore omitted. As in Fig. As shown in Figure 24F, the magnetic field concentrator 310 is configured to surround four adjacent sections of four current conductors 320, 322, 324, and 326, which are inserted through corresponding holes 306 in the body 300. Thus, the magnetic field concentrator 310 is configured to concentrate a magnetic field generated by currents through these conductors onto the magnetic field sensor 32.

[0078] The Fig. 25A and Fig. Figure 25B schematically shows a top view of an example of a component, as described above with reference to the Fig. Sections 23A to 23F were described to illustrate aspects relating to the terminal frame 304. For example, the terminal frame 304 can have four signal / power supply connections A1 to A4, a chip pad, CP, on which the magnetic field sensor chip 30 is mounted, and support elements 330, 332, and 334, which can be used to support the magnetic field concentrator. In this regard, it should be noted that the Fig. 25A and Fig. Figure 25B is purely schematic, intended to describe the relevant features of the connection frame, with further details omitted from these illustrations. As in Fig. As can be seen from 25B, the support elements 330, 332, 334 can be designed to hold the magnetic field concentrator 310 above the magnetic field sensor chip 30. Fig. Figure 26 shows a corresponding schematic top view to illustrate features of the connection frame 304 in connection with a residual current sensor component with four conductors, as referred to above in the Fig. 24A to 24F was described.

[0079] The Fig. 27A and Fig. Figure 27B shows another example of a fault current sensor component with vertical sensing. Fig. Figure 27A shows a schematic cross-sectional view, while Fig. Figure 27B shows a schematic top view. In this example, the magnetic field concentrator is formed by a ferrite core 400 with a top plate 402. Two current conductors 20 and 22 are arranged relative to the ferrite core 400, for example by means of an insulator, such that magnetic fields caused by currents flowing through the conductors 20 and 22 are concentrated by the ferrite core 400 and the top cover 402 onto the magnetic field sensor 32 of the magnetic field sensor chip 30, as indicated by arrows 406 in Figure 27B. Fig. Figure 27A shows that the ferrite core 400 has a symmetrical structure and a central elevation on which the magnetic field sensor chip 30 is mounted. The magnetic field sensor chip can, in turn, be mounted on a connection frame 404. The Fig. 27A and Fig. The arrangement shown in Figure 27B can in turn be enclosed by a potting material, so that the housing is formed entirely from the potting material. Signal / power supply connections of the magnetic field sensor chip 30 and connections of the two current conductors 20 and 22 can then protrude from the housing in a known manner.

[0080] In examples of fault current sensor components according to the present disclosure, part of the magnetic field concentrator is formed on a surface of the magnetic field sensor chip. This part, together with another part that is not formed on the surface of the magnetic field sensor chip, forms the entire magnetic field concentrator. Examples of the present disclosure include a current sensor component in which, using a suitable magnetic field concentrator, the magnetic field from only one current conductor is concentrated onto a magnetic field sensor. Examples of the present disclosure may thus have a structure such as that described in the Fig. Figures 9A and 9B, 17A to 17D, and 18A to 18D show a current sensor component, but instead of two conductors, only a single conductor is formed within the housing. Accordingly, such a current sensor component can be used to detect a current flowing through the conductor by concentrating the magnetic field generated by the current onto the magnetic field sensor using the magnetic field concentrator, and the magnetic field sensor detecting the field. For further details regarding the features of such a current sensor component, please refer to the descriptions above. Fig. Reference is made to 9A and 9B, 17A to 17D and 18A to 18D, whereby the reference therein to two conductors is to be replaced by a reference to one conductor.

[0081] Examples of the present disclosure thus provide a residual current sensor component with a housing body made of a potting material without a prefabricated shell or casing. Therefore, no shell is used into which various subcomponents, including the magnetic field concentrator, are inserted. According to the present disclosure, the components are potted without the use of an additional cover or shell element. According to the disclosure, the potting material defines the housing body and its surface. In examples of the disclosure, the potting material constitutes at least a partial all-round boundary of the component. In examples, the definition means that a magnetic field concentrator at least partially surrounds adjacent sections of at least two current conductors, and that it at least partially surrounds the current conductors on at least three sides of these conductors.Examples of disclosure thus refer to an integrated package that is fully integrated in that it can be fabricated using standard semiconductor processes. In examples of disclosure, the current is guided through the magnetic core, i.e., the magnetic field concentrator, such that the current-carrying conductors generate magnetic field components within the magnetic field concentrator. These components cancel each other out when the currents are equal, so that no output signal is generated. If the currents differ, a differential signal is generated, indicating a fault current. In examples of disclosure, the corresponding current conductors can be part of a connection frame, also called a leadframe, so that the current conductors, signal lines, and power supply lines can all be integrated into a leadframe in a conventional manner.

[0082] In some examples, the main components of the current sensor component, particularly the residual current sensor component, are simply the magnetic field sensor chip, the connection frame, the magnetic field concentrator, and the housing made of potting material, with no other housing components being provided. In other examples, only one additional housing component is provided: a plate-shaped support, which, together with the potting material, forms the housing. No other housing components are provided.

[0083] Aspects of the present revelation are set forth below: Aspect 1: Residual current sensor component with the following features: a housing formed entirely from a potting material that is exposed to the outside and forms an outer boundary of the housing; at least one magnetic field sensor arranged in the housing; at least two conductors that have sections arranged side by side in the housing; a magnetic field concentrator that at least partially surrounds the adjacent sections of the at least two current conductors and is configured to concentrate a magnetic field generated by currents flowing through the at least two current conductors onto the magnetic field sensor, wherein the magnetic field concentrator is at least partially located in the potting material or attached to an outer surface of the housing. Aspect 2: Residual current sensor component with the following features: an insulating plate-shaped carrier; a magnetic field sensor; at least two conductors that have sections arranged side by side; a magnetic field concentrator that at least partially surrounds the adjacent sections of the at least two current conductors and is configured to concentrate a magnetic field generated by currents flowing through the at least two current conductors onto the magnetic field sensor, wherein the insulating plate-shaped support carries the magnetic field sensor, which carries at least two current conductors and the magnetic field concentrator, wherein a potting material is applied to a main surface of the insulating plate-shaped support, covering the magnetic field sensor and at least parts of the magnetic field concentrator, and where parts of the potting material and parts of the carrier are exposed to the outside and form an outer boundary of the fault current sensor component. Aspect 3: Fault current sensor component according to aspect 1 or 2, in which sections of the magnetic field concentrator taper towards the magnetic field sensor. Aspect 4: Fault current sensor component according to one of aspects 1 to 3, in which the at least two current conductors have four current conductors, wherein the magnetic field concentrator at least partially surrounds the adjacent sections of the four current conductors. Aspect 5: Residual current sensor component according to one of aspects 1 to 4, in which at least two conductors are parts of a connection frame. Aspect 6: Residual current sensor component according to one of aspects 1 to 5, in which the sections of the at least two conductors arranged in the housing run straight through the housing. Aspect 7: Fault current sensor component according to one of aspects 1 to 6, in which the magnetic field concentrator is completely embedded in the potting material. Aspect 8: Fault current sensor component according to one of aspects 1 to 7, wherein the magnetic field sensor is designed to detect a magnetic field in a direction in which the sections of the at least two current conductors are arranged next to each other, wherein the magnetic field sensor, in a top view of the adjacent sections of the at least two current conductors, overlaps an area between the at least two current conductors and is preferably centered with respect to the at least two current conductors. Aspect 9: Fault current sensor component according to aspect 8, in which the magnetic field concentrator has first sections extending away from the magnetic field sensor in opposite directions, second sections guided around the outer of the at least two current conductors and a third section extending on the side of the current conductors facing away from the first sections between the second sections of the magnetic field concentrator. Aspect 10: Fault current sensor component according to one of aspects 1 to 7, wherein the magnetic field sensor is designed to detect a magnetic field in a direction perpendicular to a direction in which the sections of the at least two current conductors are arranged side by side, wherein the magnetic field sensor is arranged on an outer side of one of the sections of the at least two current conductors that are arranged side by side. Aspect 11: Fault current sensor component according to aspect 10, in which the magnetic field concentrator, starting from the magnetic field sensor, has sections extending across the adjacent sections of the at least two conductors, which are arranged on opposite sides of the at least two conductors. Aspect 12: Fault current sensor component according to aspect 10 or 11, wherein the magnetic field sensor is a first magnetic field sensor, and which has a second magnetic field sensor which is located on an outer side of another of the sections of the at least two current conductors which are arranged side by side. Aspect 13: Residual current sensor component according to one of aspects 1 to 12 with reference to aspect 1, comprising an insulating component in which the adjacent sections of the at least two current conductors are arranged, wherein the magnetic field concentrator is formed on the outer surface of the insulating component, and wherein the potting material of the housing is provided to cover the magnetic field sensor and at least parts of the magnetic field concentrator and the insulating component. Aspect 14: Fault current sensor component according to one of aspects 2 and 3 to 12 with reference to aspect 2, in which the insulating plate-shaped support is an insulating component in which the magnetic field sensor and the adjacent sections of the at least two current conductors are arranged. Aspect 15: Fault current sensor component according to aspect 13 or 14, in which sections of the magnetic field concentrator are bent around the insulating component. Aspect 16: Fault current sensor component according to one of aspects 1 to 15, in which sections of the magnetic field concentrator are formed on a chip surface of the magnetic field sensor. Aspect 17: Fault current sensor component according to one of aspects 1, 2 to 13, 15 and 16 in reference to aspect 1, in which the magnetic field concentrator is clamped onto the housing as a clip. Aspect 18: Fault current sensor component according to one of Aspects 2 and 3 or 4 with reference to Aspect 2, wherein the insulating plate-shaped support has a recess in which the magnetic field sensor is arranged, the insulating plate-shaped support further comprising holes through which the at least two current conductors are passed, each current conductor extending through a respective first hole from a first main surface of the insulating plate-shaped support to a second main surface of the insulating plate-shaped support and then extending through a respective second hole from the second main surface back to the first main surface, the magnetic field concentrator extending on the side of the first main surface of the insulating plate-shaped support from the magnetic field sensor through a region between the first and second holes and back to the magnetic field sensor.the potting material is provided on the side of the first main surface on the magnetic field concentrator. Aspect 19: Residual current sensor component according to aspect 18, in which the potting material is provided over the holes on the first surface of the insulating carrier. Aspect 20: Current sensor component with the following features: a case; at least one magnetic field sensor chip arranged in the housing, which has a magnetic field sensor; at least one conductor which has a section arranged in the housing; a magnetic field concentrator that at least partially surrounds the section of the current conductor arranged in the housing and is configured to concentrate a magnetic field generated by a current flowing through the at least one current conductor onto the magnetic field sensor, where part of the magnetic field concentrator is formed on the chip surface of the magnetic field sensor chip. Aspect 21: Current sensor component according to aspect 20, in which the magnetic field concentrator is at least partially arranged in a potting material of the housing or is attached to an outer surface of the potting material. Aspect 22: Current sensor component according to aspect 20 or 21, wherein the main surfaces of the magnetic field sensor chip are parallel to a magnetic field sensor chip plane, wherein the magnetic field sensor is configured to detect a magnetic field perpendicular to the magnetic field sensor chip plane, and wherein the magnetic field concentrator at least partially surrounds the at least one current conductor on three sides of the same. Aspect 23: Current sensor component according to aspect 20 or 21, wherein the main surfaces of the magnetic field sensor chip are parallel to a magnetic field sensor chip plane, wherein the magnetic field sensor is configured to detect a magnetic field parallel to the magnetic field sensor chip plane, and wherein the magnetic field concentrator at least partially surrounds the at least one current conductor on four sides of the same. Aspect 24: Method for manufacturing a fault current sensor component according to Aspect 15, with the following features: Providing an intermediate product comprising an insulating component, the magnetic field sensor and at least two electrical conductors; Providing a precursor to the magnetic field concentrator; Attaching the preform of the magnetic field concentrator to the intermediate product and bending at least one section of the preform of the magnetic field concentrator towards the magnetic field sensor; and Applying the potting compound to at least cover the magnetic field concentrator. Aspect 25: Method for manufacturing a fault current sensor component according to one of aspects 1, 3 to 6 with reference to aspects 1 and 17, with the following features: Manufacturing a housing in which the magnetic field sensor and the at least two current conductors are enclosed using the potting material; Applying the magnetic field concentrator to an outer surface of the potting material. Aspect 26: Method according to Aspect 25, comprising providing the magnetic field concentrator as a clip and clamping the magnetic field concentrator onto the housing, or comprising providing a preform of the magnetic field concentrator and bending a part of the preform of the magnetic field concentrator around the housing. Aspect 27: Method for manufacturing a fault current sensor component according to Aspect 18, with the following features: Producing an intermediate product comprising the insulating plate-shaped carrier with the holes, the magnetic field sensor, and the magnetic field concentrator; Inserting at least two electrical conductors into the holes; and Apply the potting material at least above the magnetic field concentrator. Aspect 28: Method according to aspect 27, in which the potting material is also applied over the holes on the first surface of the insulating support.

[0084] Although some aspects of the present disclosure have been described as features related to a device, it is clear that such a description can also be considered a description of corresponding process features. Although some aspects have been described as features related to a process, it is clear that such a description can also be considered a description of corresponding features of a device or the functionality of a device.

[0085] In the preceding detailed description, various features were sometimes grouped together in examples to streamline the disclosure. This type of disclosure should not be interpreted as indicating that the claimed examples have more features than are expressly stated in each claim. Rather, as the following claims reflect, the subject matter may consist of fewer than all the features of a single disclosed example. Consequently, the following claims are hereby incorporated into the detailed description, with each claim potentially representing a separate, independent example.While each claim can stand as a separate example, it should be noted that, although dependent claims refer back to a specific combination with one or more other claims, other examples also include a combination of dependent claims with the subject matter of any other dependent claim, or a combination of any feature with other dependent or independent claims. Such combinations are included unless it is stated that a specific combination is not intended. Furthermore, it is intended that a combination of features of a claim with any other independent claim is also included, even if that claim is not directly dependent on the independent claim.

[0086] The examples described above are merely illustrative of the principles of this disclosure. It is understood that modifications and variations of the arrangements and details described are obvious to those skilled in the art. It is therefore intended that the disclosure is limited only by the attached claims and not by the specific details set forth for the purpose of describing and explaining the examples.

Claims

[1] Residual current sensor component with the following features: a housing formed entirely from a potting material that is exposed to the outside and forms an outer boundary of the housing; at least one magnetic field sensor arranged in the housing; at least two conductors that have sections arranged side by side in the housing; a magnetic field concentrator that at least partially surrounds the adjacent sections of the at least two current conductors and is configured to concentrate a magnetic field generated by currents flowing through the at least two current conductors onto the magnetic field sensor, wherein the magnetic field concentrator is at least partially located in the potting material or attached to an outer surface of the housing. [2] Residual current sensor component with the following features: an insulating plate-shaped carrier; a magnetic field sensor; at least two conductors that have sections arranged side by side; a magnetic field concentrator that at least partially surrounds the adjacent sections of the at least two current conductors and is configured to concentrate a magnetic field generated by currents flowing through the at least two current conductors onto the magnetic field sensor, wherein the insulating plate-shaped support carries the magnetic field sensor, which carries at least two current conductors and the magnetic field concentrator, wherein a potting material is applied to a main surface of the insulating plate-shaped support, covering the magnetic field sensor and at least parts of the magnetic field concentrator, and where parts of the potting material and parts of the carrier are exposed to the outside and form an outer boundary of the fault current sensor component. [3] Fault current sensor component according to claim 1 or 2, wherein sections of the magnetic field concentrator taper towards the magnetic field sensor. [4] Fault current sensor component according to one of claims 1 to 3, wherein the at least two current conductors have four current conductors, the magnetic field concentrator at least partially surrounding the adjacent sections of the four current conductors. [5] Residual current sensor component according to one of claims 1 to 4, wherein the at least two current conductors are parts of a connection frame. [6] Residual current sensor component according to one of claims 1 to 5, wherein the sections of the at least two current conductors arranged in the housing pass straight through the housing. [7] Fault current sensor component according to one of claims 1 to 6, wherein the magnetic field concentrator is completely arranged in the potting material. [8] Fault current sensor component according to one of claims 1 to 7, wherein the magnetic field sensor is designed to detect a magnetic field in a direction in which the sections of the at least two current conductors are arranged next to each other, wherein the magnetic field sensor, in a top view of the adjacent sections of the at least two current conductors, overlaps an area between the at least two current conductors and is preferably arranged centered with respect to the at least two current conductors. [9] Fault current sensor component according to claim 8, wherein the magnetic field concentrator has first sections extending away from the magnetic field sensor in opposite directions, second sections guided around the outer of the at least two current conductors and a third section extending on the side of the current conductors facing away from the first sections between the second sections of the magnetic field concentrator. [10] Fault current sensor component according to one of claims 1 to 7, wherein the magnetic field sensor is designed to detect a magnetic field in a direction perpendicular to a direction in which the sections of the at least two current conductors are arranged next to each other, wherein the magnetic field sensor is arranged on an outer side of one of the sections of the at least two current conductors which are arranged next to each other. [11] Fault current sensor component according to claim 10, wherein the magnetic field concentrator, starting from the magnetic field sensor, has sections extending transversely over the adjacent sections of the at least two conductors, which are arranged on opposite sides of the at least two conductors. [12] Fault current sensor component according to claim 10 or 11, wherein the magnetic field sensor is a first magnetic field sensor, and which has a second magnetic field sensor which is arranged on an outer side of another of the sections of the at least two current conductors which are arranged side by side. [13] Residual current sensor component according to any one of claims 1 to 12 with reference to claim 1, comprising an insulating component in which the adjacent sections of the at least two current conductors are arranged, wherein the magnetic field concentrator is formed on the outer surface of the insulating component, and wherein the potting material of the housing is provided to cover the magnetic field sensor and at least parts of the magnetic field concentrator and the insulating component. [14] Residual current sensor component according to one of claims 2 and 3 to 12 with reference to claim 2, wherein the insulating plate-shaped support is an insulating component in which the magnetic field sensor and the adjacent sections of the at least two current conductors are arranged. [15] Fault current sensor component according to claim 13 or 14, wherein sections of the magnetic field concentrator are bent around the insulating component. [16] Fault current sensor component according to one of claims 1 to 15, wherein sections of the magnetic field concentrator are formed on a chip surface of the magnetic field sensor. [17] Residual current sensor component according to any one of claims 1, 2 to 13, 15 and 16 with reference to claim 1, wherein the magnetic field concentrator is clamped onto the housing as a clip. [18] A fault current sensor component according to one of claims 2 and 3 or 4 with reference to claim 2, wherein the insulating plate-shaped support has a recess in which the magnetic field sensor is arranged, the insulating plate-shaped support further comprising holes through which the at least two current conductors are guided, each current conductor extending through a respective first hole from a first main surface of the insulating plate-shaped support to a second main surface of the insulating plate-shaped support and then extending through a respective second hole from the second main surface back to the first main surface, the magnetic field concentrator extending on the side of the first main surface of the insulating plate-shaped support from the magnetic field sensor through a region between the first and second holes and back to the magnetic field sensor,the potting material is provided on the side of the first main surface on the magnetic field concentrator. [19] Residual current sensor component according to claim 18, wherein the potting material is provided over the holes on the first surface of the insulating support. [20] Current sensor component with the following features: a case; at least one magnetic field sensor chip arranged in the housing, which has a magnetic field sensor; at least one conductor which has a section arranged in the housing; a magnetic field concentrator that at least partially surrounds the section of the current conductor arranged in the housing and is configured to concentrate a magnetic field generated by a current flowing through the at least one current conductor onto the magnetic field sensor, where part of the magnetic field concentrator is formed on the chip surface of the magnetic field sensor chip. [21] Current sensor component according to claim 20, wherein the magnetic field concentrator is at least partially arranged in a potting material of the housing or is attached to an outer surface of the potting material. [22] Current sensor component according to claim 20 or 21, wherein the main surfaces of the magnetic field sensor chip are parallel to a magnetic field sensor chip plane, wherein the magnetic field sensor is configured to detect a magnetic field perpendicular to the magnetic field sensor chip plane, and wherein the magnetic field concentrator at least partially surrounds the at least one current conductor on three sides thereof. [23] Current sensor component according to claim 20 or 21, wherein the main surfaces of the magnetic field sensor chip are parallel to a magnetic field sensor chip plane, wherein the magnetic field sensor is configured to detect a magnetic field parallel to the magnetic field sensor chip plane, and wherein the magnetic field concentrator at least partially surrounds the at least one current conductor on four sides thereof. [24] Method for manufacturing a fault current sensor component according to claim 15, comprising the following features: Providing an intermediate product comprising an insulating component, the magnetic field sensor and at least two electrical conductors; Providing a precursor to the magnetic field concentrator; Attaching the preform of the magnetic field concentrator to the intermediate product and bending at least one section of the preform of the magnetic field concentrator towards the magnetic field sensor; and Applying the potting compound to at least cover the magnetic field concentrator. [25] Method for manufacturing a fault current sensor component according to one of claims 1, 3 to 6 with reference to claims 1 and 17, comprising the following features: Manufacturing a housing in which the magnetic field sensor and the at least two current conductors are enclosed using the potting material; Applying the magnetic field concentrator to an outer surface of the potting material. [26] Method according to claim 25, comprising providing the magnetic field concentrator as a clip and clamping the magnetic field concentrator onto the housing or comprising providing a preform of the magnetic field concentrator and bending a part of the preform of the magnetic field concentrator around the housing. [27] Method for manufacturing a fault current sensor component according to claim 18, comprising the following features: Producing an intermediate product comprising the insulating plate-shaped carrier with the holes, the magnetic field sensor, and the magnetic field concentrator; Inserting at least two electrical conductors into the holes; and Apply the potting material at least above the magnetic field concentrator. [28] Method according to claim 27, wherein the potting material is also applied over the holes on the first surface of the insulating support.

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