Arrangement of components for a current transformer, method for manufacturing at least one arrangement for a current transformer, and housing part for a current transformer

Abstract

The invention relates to an arrangement (100) of components for a current transformer (300), comprising the following components: - at least one cooler (10) for cooling the components, - at least one capacitor (20) for intermediate energy storage, wherein the at least one cooler (10) and the at least one condenser (20) are connected by a common potting compound (30), wherein at least the at least one condenser (20) is completely encased in the common potting compound (30), as well as a method for manufacturing an arrangement (100) for a current transformer (300) and a housing part (310) for a current transformer (300).

Description

[0001] The invention relates to an arrangement of components for a current transformer, a method for manufacturing at least one arrangement for a current transformer, and a housing part for a current transformer.

[0002] Current converters are used in electric and hybrid vehicles to convert, for example, the energy stored in a traction battery from direct current (DC) to alternating current (AC) for an electric motor. For the safe and reliable operation of the current converter, it is crucial that the installed components are protected from damage and can operate efficiently. Likewise, the available installation space should be used in a space-saving manner.

[0003] From DE 10 2019 112 010 A1 a motor vehicle inverter assembly is known which is arranged in the direction of current flow between a battery and an electric motor of a motor vehicle.

[0004] However, manufacturing such an inverter assembly is complex and expensive. Furthermore, the components in such an inverter assembly can be easily damaged during manufacturing or maintenance due to insufficient protection.

[0005] The technical problem is to create an arrangement of components for a current transformer, a method for manufacturing at least one arrangement for a current transformer, and a housing part for a current transformer that simplify manufacturing and better protect the components.

[0006] The solution to the technical problem is provided by the articles with the features of the independent claims. Further advantageous embodiments of the invention are described in the dependent claims.

[0007] A proposed arrangement of components for a current transformer comprises the following components: - at least one cooler to cool the components, - at least one capacitor for intermediate energy storage, wherein the at least one cooler and the at least one capacitor are connected by a common potting compound, wherein at least the at least one capacitor is completely encased in the common potting compound.

[0008] This arrangement offers several technical advantages. Firstly, the condenser is completely protected by the shared potting compound. Secondly, the cooler is also at least partially protected from environmental influences and damage by the same potting compound. Furthermore, the potting compound provides mechanical stability between the components, preventing them from shifting relative to each other, for example, during assembly. This simplifies manufacturing and enhances component protection, for instance, during the installation of the current transformer. Additionally, the potting compound ensures excellent thermal bonding between the condenser and the cooler, facilitating better heat dissipation during operation. Simultaneously, the potting compound provides electrical insulation to the components, protecting them from short circuits.

[0009] A further proposed method for manufacturing at least one arrangement for a current transformer comprises the following steps: - Arranging at least one condenser and at least one cooler in the arrangement, - Introducing a common potting compound into the arrangement, - Connecting the at least one cooler to the at least one condenser using the common potting compound.

[0010] The process can be implemented as follows. The condenser can, for example, be placed in a container. The container can define a potting area for the potting compound. The condenser can be mounted on a spacer so that the potting compound can also reach underneath it. The potting compound can be heated to a temperature to liquefy it. The potting compound can be poured into the container, for example, until the condenser is completely surrounded by it. The cooler can be at least partially immersed in the potting compound. The potting compound can be cured by a drying step. The potting compound can mechanically bond the cooler and condenser together, for example, by curing. The container can be coated, for example, to allow for removal after the components have been joined.The container is therefore not an essential feature of the arrangement.

[0011] A housing component for a current transformer is further proposed, wherein at least one capacitor is encapsulated in a potting compound within at least one receiving area of ​​the housing component. This housing component eliminates the need to place the capacitor in a separate container during manufacturing for potting with the compound. Instead, the potting compound can be poured directly into the receiving area. This makes the container redundant, resulting in space and weight savings for the current transformer. The receiving area can, for example, be designed as a recess in the housing component in which the at least one capacitor is positioned within the potting compound. The potting compound can be introduced into the receiving area, for example, through an opening in the housing component. The receiving area can define a potting chamber during the encapsulation of the at least one capacitor. The housing component can, for example,The housing part may be a cast or sheet metal component. In particular, the housing part may form the housing of the current transformer. Specifically, the at least one cooler may be connected to the at least one condenser by the potting compound. Furthermore, it is possible that the previously described arrangement is connected to the housing part by the potting compound. This will be explained in more detail below.

[0012] The technical effects and advantages explained in this disclosure for the arrangement naturally also apply to the method and the housing part, and vice versa.

[0013] The arrangement can be designed for use in a motor vehicle. For example, it can be positioned between a traction battery and the vehicle's electric motor. The arrangement can at least partially form the current transformer. The current transformer can be, for example, an inverter, rectifier, frequency converter, and / or pulse inverter. In addition to the components mentioned, the arrangement can include further components such as a semiconductor module and / or the housing component described earlier. Furthermore, the arrangement can include means for thermally bonding the components—such as thermal paste—means for metallurgical bonding of the components—such as solder or sintered material—and / or means for conducting current—such as busbars.

[0014] The radiator can be coolant-operated and, for example, use a coolant such as water. The radiator can have at least one inlet and / or outlet for supplying and / or removing the coolant. The radiator can be cuboid in shape. The radiator can have one or more sections. The sections can form at least part of the radiator's outer surface. One section of the radiator can, for example, be part of the underside of the radiator. Another section can, for example, be part of the top of the radiator.

[0015] The capacitor can be a DC link capacitor. For example, the capacitor can be a Cx capacitor or a Cy capacitor. The capacitor can have one or more layers. For example, an electrode of the capacitor and / or a dielectric of the capacitor can form a layer. The capacitor can be designed as a wound capacitor, with the layers arranged in a wound configuration. The capacitor can have one or more sections. The sections of the capacitor can form at least part of the outer surface of the capacitor. The sections can be electrically conductive or non-conductive. An electrically conductive section can, for example, be an electrical terminal of the capacitor, allowing, for example, the electrodes of the capacitor to be connected to means of conducting current. An electrically non-conductive section can, for example, be a shell of the capacitor. The shell can be, for example, made of...to hold one winding of the capacitor layers in position.

[0016] The potting compound primarily consists of an epoxy resin. Epoxy resin is characterized by high mechanical strength, good thermal conductivity, and electrical insulating properties. Alternatively or in combination, the potting compound may contain polyurethane and / or silicone. The potting compound may also be referred to as a "mold."

[0017] The cooler and condenser can be connected, for example, by the common potting compound covering one or more sections of the cooler and one or more sections of the condenser's outer surface. It is also possible that a section of the condenser, such as a section of the outer surface where the cooler rests on the condenser, is directly connected to the cooler. The condenser is considered fully encapsulated in the common potting compound when its outer surface is almost completely covered by the compound and at least partially covered by the cooler.

[0018] In one embodiment, at least a section of the underside of the at least one cooler is connected to an outer surface of the at least one condenser by the common potting compound. In this way, another side of the cooler, e.g., a opposite top side of the cooler, can be used to mount at least one further component of the assembly. Of course, the term "underside" does not necessarily refer to the actual orientation of the cooler relative to the condenser. Rather, the term serves to better understand the relative orientation of the components to each other. In particular, the at least one cooler and the at least one condenser are oriented along a common axis. The common axis can, for example, be a vertical axis. The axis can, for example, pass through a center of volume and / or mass of the condenser and / or the cooler. The common axis can, for example,The assembly must be oriented against gravity. In particular, at least one other component of the arrangement can also be arranged along the common axis. Arranging the components along a common axis simplifies the successive assembly of the assembly. For example, assembly can be carried out by first placing the capacitor in the housing part or container described above, and then placing a portion of the underside of the cooler along the common axis, e.g., from above, onto the outer surface of the capacitor. As a further component, the semiconductor module, in particular at least one half-bridge, can be arranged on the other side of the cooler, especially on the top side. This will be explained in more detail below.

[0019] In one embodiment, the at least one cooler has a bulge, wherein at least part of the bulge is connected to an outer surface of the at least one condenser by the common potting compound. This increases the cooling volume of the cooler, allowing for greater heat dissipation. In particular, the cooler bulge can be at least partially immersed in the potting compound. This improves the thermal connection and mechanical retention between the components of the arrangement. Furthermore, the cooler bulge can be at least partially recessed in a depression of the aforementioned housing part or container. In further detail, the bulge is designed for a positive-locking connection with the aforementioned housing part and / or container, for example, by inserting the bulge into the receiving area or the internal volume of the container.This further improves the mechanical connection of the components.

[0020] In one embodiment, the arrangement further comprises at least one half-bridge, wherein the at least one half-bridge is connected to the at least one cooler by the common potting compound. In this way, the half-bridge can also be protected by the common potting compound. The half-bridge is, for example, part of a semiconductor module. The half-bridge can, for example, be configured for converting direct current to alternating current and providing the alternating current for operating an electric motor on one of three phases. The cooler and the half-bridge can be connected, for example, by the common potting compound covering both one or more sections of the cooler and one or more sections of the half-bridge. In particular, the arrangement has at least three half-bridges, wherein the at least three half-bridges are connected to the at least one cooler by the common potting compound.The common potting compound can, in particular, completely cover one upper surface of the at least three half-bridges and / or be continuous.

[0021] In one embodiment, at least one half-bridge and at least one capacitor are connected by at least one current-conducting means, wherein the at least one means is at least partially encased in the common potting compound. This provides better protection for the current-conducting means against short circuits, e.g., between the means and the cooler. The current-conducting means can, for example, be a busbar. The current-conducting means can, for example, be made of copper. Furthermore, due to the potting compound's superior dielectric properties compared to air, the distance between the current-conducting means and other components of the arrangement can be reduced, e.g., the distance between a means with a high electrical potential and a means with a low electrical potential.The reduced distance, in turn, ensures that parasitic inductances in the arrangement are reduced.

[0022] In one embodiment, the at least one condenser and the at least one cooler are at least partially arranged in at least one container, wherein the at least one container defines a potting chamber for the common potting compound. In this way, for example, the potting chamber for the common potting compound can be clearly defined. The container can be, for example, a cast iron, sheet metal, or plastic container. The container can have a receiving area, for example, the interior of the container, in which the condenser and the cooler are at least partially arranged when the potting compound is introduced into the container. The cooler can be at least partially immersed in the container—for example, with the previously described bulge—in order to come into contact with the potting compound and thus establish the connection between the condenser and cooler through the potting compound.

[0023] In one embodiment, the at least one container is designed as a housing component for the current transformer. In this way, the arrangement can be provided as a single component that can, for example, be installed in the current transformer without further intermediate steps and simultaneously serves to enclose the current transformer. The housing component has already been described, mutatis mutandis.

[0024] In one embodiment, the arrangement is heated to a temperature sufficient to create a metallurgical bond between at least one half-bridge and the at least one cooler by introducing the potting compound. This allows both the potting compound to be introduced into the arrangement and the metallurgical bond between the at least one half-bridge and the at least one cooler to be created in a single manufacturing step. This reduces the number of manufacturing steps. The metallurgical bond can, for example, be a soldered joint. A solder material can be positioned between the at least one half-bridge and the cooler before the potting compound is introduced. For example, the potting compound is introduced into the arrangement at a temperature sufficient to melt the solder material, e.g., 200°C.In particular, the potting compound can be introduced into the arrangement at a temperature sufficient to passively heat the half-bridge and / or the cooler to a temperature that allows for a metallurgical bond between the half-bridge and the cooler.

[0025] The invention is explained in more detail using exemplary embodiments. The figures show: Fig. 1 a schematic representation of an arrangement of components for a current transformer according to the state of the art, Fig. 2 a schematic representation of an embodiment of an arrangement of components for a current transformer, Fig. 3 a schematic representation of another embodiment of an arrangement of components for a current transformer, Fig. 4 a schematic representation of an embodiment of a method for manufacturing an arrangement for a current transformer and Fig. 5 a schematic representation of an embodiment of a housing part for a current transformer.

[0026] In the descriptions of the Fig. References 2 to 5 denote identical reference symbols for elements with the same technical characteristics. For clarity, the identical reference symbols are grouped in... Fig. 1 is used, however the elements in Fig. 1 only features according to the state of the art.

[0027] Fig. Figure 1 shows a schematic representation of an arrangement 100 of components for a current transformer 300 according to the prior art. The current transformer 300 can, for example, be an inverter.

[0028] The arrangement 100 comprises several components, which can be arranged as follows. A capacitor 20 for an intermediate circuit of the current transformer 300 is positioned in a container 25 made of plastic or sheet metal. The container 25 is, in turn, arranged in a receiving area 210 of a housing part 310. The container 25 is, for example, mechanically connected to the underside of a cooler 10 in order to mechanically connect the capacitor 20 to the arrangement 100. The cooler 10 rests, for example, on the housing part 310. The cooler 10 is, for example, operated by means of water. To establish a coolant circuit, the cooler 10 can have an inlet 15 and an outlet 16. The housing part 310 can, in turn, have, for example, bores for the inlet 15 and outlet 16.

[0029] On one upper side of the cooler 10, three half-bridges 40 are thermally connected to the cooler 10 by means of a thermal paste 31 or a soldering material. The half-bridges 40 form a semiconductor module which, for example, converts direct current from a traction battery (not shown) into alternating current for an electric motor (not shown).

[0030] One aspect in the production of the in Fig. In the arrangement 100 shown in Figure 1, components such as the capacitor 20 are manufactured by a supplier to an automotive manufacturer and then delivered to the manufacturer for assembly. Therefore, the container 25 serves, among other things, to protect the capacitor 20 from damage or environmental influences before assembly by covering at least a large part of an outer surface 21 of the capacitor 20. However, this has the disadvantage that, on the one hand, only a short section, e.g., on the top side of the capacitor 20, is available for thermal connection of the capacitor 20 to the cooler 10. On the other hand, part of the receiving area 210 in the housing part 310 remains unused, thus wasting installation space and resulting in no thermal connection between the capacitor 20 and the housing part 310.

[0031] In the prior art, the thermal connection is therefore made by means of a thermal paste 31, which is arranged between the top of the condenser 20 and a bottom of the cooler 10.

[0032] Fig. Figure 2 shows a schematic representation of an embodiment of an arrangement 100 of components for a current transformer 300. The arrangement 100 is intended for use in a vehicle 1000, e.g., a passenger car. The current transformer 300 can be an inverter.

[0033] The components of the arrangement 100 are arranged along a common axis. The common axis is a vertical axis Z of a Cartesian coordinate system. The vertical axis Z is oriented opposite to one direction of gravity. A longitudinal axis X and a transverse axis Y are oriented orthogonally to the vertical axis Z. The longitudinal axis X can be parallel to a direction of travel of the vehicle 1000. The transverse axis Y can be oriented orthogonally to the direction of travel of the vehicle 1000. Fig. Figure 2 shows a section through the arrangement 100 in the plane spanned by the vertical axis Z and the transverse axis Y.

[0034] Arrangement 100 avoids the disadvantages identified in the prior art by connecting the cooler 10 and the condenser 20 with a common potting compound 30, and by completely encasing at least the condenser 20 in the common potting compound 30. The common potting compound 30 can, for example, be epoxy resin and be introduced in a liquid state into the receiving area 210, where it hardens to connect the condenser 20 and the cooler 10. The housing part 310 thus replaces the one described in Fig. 1 container 25 shown. In addition, the housing part 310 defines a potting area for the common potting compound 30. In other words: The container 25 is designed as the housing part 310 for the current transformer 300.

[0035] The common potting compound 30 allows both a bottom surface 11 of the cooler 10 and an outer surface 21 of the capacitor 20 to be thermally connected to the housing part 310. The receiving area 210 is thus used efficiently for the thermal connection.

[0036] The cooler 10 also has a protrusion 12. At least part of the protrusion 12 can be inserted flush into an opening of the receiving area 210 facing the cooler 10. For example, during the manufacture of the assembly 100, the protrusion 12 can be at least partially immersed in the still-liquid potting compound 30 to connect the cooler 10 to the condenser 20 via the potting compound 30. The protrusion 12 thus provides a way to improve the mechanical retention of the cooler 10 within the assembly 100, while simultaneously increasing the cooling volume of the cooler 10 and allowing for quick and easy connection of the cooler 10 to the condenser 20 by immersion in the potting compound 30.

[0037] The arrangement 100 further comprises three half-bridges 40, which form a semiconductor module for converting, for example, direct current into alternating current. The three half-bridges 40 are metallurgically bonded to a top surface of the cooler 10 by means of a soldering material 41. In addition, the three half-bridges 40 are covered by the continuous potting compound 30 and are further bonded to the cooler 10 by the common potting compound 30. This protects the half-bridges 40 from environmental influences on all sides.

[0038] The potting compound 30 can, for example, be applied simultaneously to the half-bridges 40 and introduced into the receiving area 210 during manufacturing, allowing the potting compound 30 to be applied in a single manufacturing step. To protect the cooler 10 or other components from contamination by excess potting compound 30, the cooler 10 or the other components of the arrangement 100 can be partially masked during manufacturing using a mask (not shown). The mask can also be used to ensure that the space between the half-bridges 40 is not filled at all or not completely with the potting compound 30. This reduces the amount of potting compound 30 used, thus saving weight and installation space for the arrangement 10.

[0039] Fig. Figure 3 shows a schematic representation of another embodiment of an arrangement 100 of components for a current transformer 300 in a vehicle 1000. In contrast to Fig. 2 shows Fig. 3. A section through the arrangement in the plane spanned by the vertical axis Z and the longitudinal axis X. This reveals further aspects of arrangement 100.

[0040] Thus, at least one of the half-bridges 40 is electrically connected to the capacitor 20 by means 51, 52 for conducting current. The means 51, 52 are designed as copper busbars and are connected, for example, to a respective terminal 22, 23 of the electrodes of the capacitor 20. As a result, means 51 carries a higher electrical potential than means 52.

[0041] The elements 51 and 52 are arranged, for example, in the arrangement 100 and metallurgically bonded to the terminals 22 and 23 and the half-bridge 40 before the potting compound 30 is introduced into the receiving area 210. This at least partially encapsulates the elements 51 and 52 in the common potting compound 30. The common potting compound 30 electrically isolates the elements 51 and 52 from each other, allowing them to be arranged closer together and reducing parasitic inductances in the arrangement 100.

[0042] For better clarity, in Fig. Figure 3 also shows a traction battery 400 designed as a high-voltage battery and an electric motor 500 for driving the vehicle 1000. The traction battery 400 can supply direct current to the means 51, 52 via, for example, current connections 221, 222 of the current transformer 300. This allows the direct current to be supplied to the half-bridge 40 and the capacitor 20. The half-bridge 40 can convert the direct current into alternating current and supply it to the electric motor 500 via another current connection 223. This is shown in Fig. 3 represented by dashed lines.

[0043] Fig. Figure 4 shows a schematic representation of an embodiment of a method for manufacturing an arrangement 100 for a current transformer 300. The method comprises several steps, which are explained below.

[0044] In step S1, a capacitor 20 is arranged in, for example, a receiving area 210 of a housing part 310 of the current transformer 300 (see figure). Fig. 2 and Fig. 3) Furthermore, a cooler 10 can be arranged in a mounting position before the cooler 10 is connected to the condenser 20 by means of a common potting compound 30.

[0045] In step S2, the common potting compound 30 is introduced into the receiving area 210, e.g. by pouring the potting compound 30 in liquid form over the capacitor 20. Here, the receiving area 210 limits the potting space for the potting compound 30 and the capacitor 20 is completely covered with the potting compound 30.

[0046] In step S3, the cooler 10 is connected to the condenser 20 by means of a common potting compound 30. For example, a protrusion 12 of the cooler 10 can be immersed from the mounting position into the receiving area 210 while the potting compound 30 is still liquid. As soon as the common potting compound 30 hardens, the aforementioned components of the arrangement 100 are firmly connected to one another by the common potting compound 30, and the arrangement 100 can be mounted as part of the current transformer 300 (see Figure 3). Fig. 2 and Fig. 3).

[0047] Naturally, the arrangement 100 can include the previously described half-bridges 40. The half-bridges 40 can, for example, be arranged on the top side of the cooler 10.

[0048] By introducing the common potting compound 30, the arrangement 100 can be heated to a temperature sufficient to bond at least one half-bridge 40 to the cooler 20. For example, the temperature may be sufficient to melt a solder material 41 between the half-bridge 40 and the cooler 10, so that after the solder material 41 has hardened, the bond is established (see Figure 1). Fig. 2 and Fig. 3).

[0049] Fig. Figure 5 shows a schematic representation of an embodiment of a housing part 310 for a current transformer 300. In a receiving area 210 of the housing part 310, a capacitor 20 is completely encapsulated in a potting compound 30. Naturally, the housing part 310 can be part of the previously described arrangement 100 (see Figure 5). Fig. 2 and Fig.3) The housing part 310 can be mounted to another housing part 320 of the current transformer 300 to form a housing of the current transformer 300. Reference symbol list 10 coolers 11. Bottom 12 Bulge 15 Admission 16 Outlet 20 Capacitor 21 outdoor area 22 and 23 Power connection 25 containers 30 potting compound 31 Thermopaste 40 Half bridge 41 Soldering material 51 and 52 Means of conducting electricity 210 recording area 221 to 223 Power connection 300 current transformers 310 and 320 housing part 400 traction battery 500 electric motor 1000 vehicles S1 step S2 step S3 step X Longitudinal axis Y transverse axis Z vertical axis QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2019 112 010 A1

[0003]

Claims

[1] Arrangement (100) of components for a current transformer (300), comprising the following components: - at least one cooler (10) for cooling the components, - at least one capacitor (20) for intermediate energy storage, wherein the at least one cooler (10) and the at least one capacitor (20) are connected by a common potting compound (30), wherein at least the at least one capacitor (20) is completely encased in the common potting compound (30). [2] Arrangement (100) according to claim 1, characterized by , that at least one section of a bottom surface (11) of the at least one cooler (10) is connected by the common potting compound (30) to an outer surface (21) of the at least one condenser (20). [3] Arrangement (100) according to any of the preceding claims, characterized by, that the at least one cooler (10) has a bulge (12), wherein at least a part of the bulge (12) is connected to an outer surface (21) of the at least one condenser (20) by the common potting compound (30). [4] Arrangement (100) according to any of the preceding claims, characterized by , that the arrangement (100) further comprises at least one half-bridge (40), wherein the at least one half-bridge (40) is connected to the at least one cooler (10) by the common potting compound (30). [5] Arrangement (100) according to any of the preceding claims, characterized by , that at least one half-bridge (40) and the at least one capacitor (20) are connected by at least one means (51, 52) for conducting current, wherein the at least one means (51, 52) is at least partially encased in the common potting compound (30). [6] Arrangement (100) according to any of the preceding claims, characterized by, that the at least one condenser (20) and the at least one cooler (10) are arranged at least partially in at least one container (25), wherein the at least one container (25) defines a potting chamber of the common potting compound (30). [7] Arrangement according to claim 6, characterized by , that the at least one container (25) is designed as a housing part (310) for the current transformer (300). [8] Method for manufacturing at least one arrangement (100) for a current transformer (300), comprising the steps: - Arranging (S1) at least one condenser (20) and arranging at least one cooler (10) in the arrangement (100), - Introducing (S2) a common potting compound (30) into the arrangement (100), - Connecting (S3) the at least one cooler (10) to the at least one condenser (20) through the common potting compound (30). [9] Method according to claim 8, characterized by, that the arrangement (100) is heated to a temperature by the introduction of the potting compound (30), the temperature being sufficient to connect at least one half-bridge (40) to the at least one cooler (10) in a materially bonded manner. [10] Housing part (310) for a current transformer (300), wherein at least one capacitor (20) is encapsulated in a potting compound (30) in at least one receiving area (210) of the housing part (310).

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