Semiconductor package with double-sided contacting
DE102025100980A1Undetermined Publication Date: 2026-07-16ZF FRIEDRICHSHAFEN AG
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- ZF FRIEDRICHSHAFEN AG
- Filing Date
- 2025-01-14
- Publication Date
- 2026-07-16
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Abstract
The present invention relates to a semiconductor package for a power semiconductor module of a traction converter, wherein the semiconductor package is essentially cuboid in shape with a top, an opposite bottom, and a first end face and an opposite second end face, comprising: a power semiconductor with a control terminal, a drain terminal and a source terminal; a first contacting unit for electrically connecting the source terminal to a source power supply, wherein the first contacting unit comprises an upper contact point on the top of the semiconductor package and a lower contact point on the bottom of the semiconductor package;a second contacting unit for electrically connecting the drain terminal to a drain power supply, wherein the second contacting unit comprises an upper contact point on the top side of the semiconductor package and a lower contact point on the bottom side of the semiconductor package; and a connector for electrically connecting the control terminal to a control unit, wherein the connector comprises an upper contact point on the top side of the semiconductor package and / or a lower contact point on the bottom side of the semiconductor package. The present invention also relates to a further semiconductor package, a power semiconductor module, and a traction converter.
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