Semiconductor package with double-sided contacting
DE102025100980A1Undetermined Publication Date: 2026-07-16ZF FRIEDRICHSHAFEN AG
Patent Information
- Application Number
- DE102025100980
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-01-14
- Publication Date
- 2026-07-16
Smart Images

Figure 00000000_0000_ABST
Abstract
The present invention relates to a semiconductor package for a power semiconductor module of a traction converter, wherein the semiconductor package is essentially cuboid in shape with a top, an opposite bottom, and a first end face and an opposite second end face, comprising: a power semiconductor with a control terminal, a drain terminal and a source terminal; a first contacting unit for electrically connecting the source terminal to a source power supply, wherein the first contacting unit comprises an upper contact point on the top of the semiconductor package and a lower contact point on the bottom of the semiconductor package;a second contacting unit for electrically connecting the drain terminal to a drain power supply, wherein the second contacting unit comprises an upper contact point on the top side of the semiconductor package and a lower contact point on the bottom side of the semiconductor package; and a connector for electrically connecting the control terminal to a control unit, wherein the connector comprises an upper contact point on the top side of the semiconductor package and / or a lower contact point on the bottom side of the semiconductor package. The present invention also relates to a further semiconductor package, a power semiconductor module, and a traction converter.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Modular half-bridge module
DE102022202254A1
Stackable semiconductor component and method for producing the same
DE102006005420A1
Component with two mounting surfaces, system and method for its manufacture
DE102009040557A1
Package with an elevated conduit and a structure extending vertically from the base of the encapsulation medium
DE102020131070A1
Contact arrangement for power semiconductor chips and power electronics module
DE102023205330A1