Radiation cooling system

The radiative cooling system addresses heat dissipation challenges in high-speed servers by using a freezing compartment and metal insulating plate with a refrigerant pipe for radiation-based heat exchange, ensuring effective cooling without liquid-related hazards.

DE102025105268B3Undetermined Publication Date: 2026-07-02WANG MENG THENG

Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
WANG MENG THENG
Filing Date
2025-02-13
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Conventional cooling methods for high-speed computing servers, such as fan cooling and liquid cooling, fail to effectively dissipate heat without risking damage from liquid leakage or short circuits.

Method used

A radiative cooling system using a freezing compartment, humidity controller, and metal insulating plate with a refrigerant pipe to exchange heat via radiation, eliminating liquid contact and enhancing heat dissipation efficiency.

Benefits of technology

Efficient heat dissipation without liquid leakage risks, maintaining server performance and preventing component damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a radiative cooling system, wherein the interior of the server mechanism is divided into a freezing zone (10) and a heat source zone (40) by a metal insulating plate (20), the metal insulating plate (20) serving as a heat exchange element between the freezing zone (10) and the heat source zone. A freezing device (30) is provided in the freezing zone (10). The refrigerant pipe (302) of the freezing device (30) contacts the metal insulating plate (20). This allows the heat generated by the heat source zone to be exchanged with the metal insulating plate (20) by radiation, thereby reducing the temperature in the heat source zone. The freezing device (30) dissipates the heat absorbed by the metal insulating plate (20).
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Description

Technical field The invention relates to a cooling system, in particular a radiative cooling system, which does not use any coolant and can effectively increase cooling efficiency. State of the art "Heat dissipation" is a topic that has been frequently mentioned recently in the age of Industry 4.0 and information technology. Every device that requires work generates heat. If this heat cannot be dissipated effectively and in a timely manner, operational efficiency is impaired, or in the worst case, work is brought to a standstill. In conventional cooling devices (e.g., Taiwanese Publication No. M415556), cooling modules are technologies or structures used to dissipate or reduce the heat generated by the devices or systems. These modules often incorporate various cooling components that help regulate the device's temperature and ensure normal operation. The cooling module can utilize different cooling technologies to enhance efficiency and reliability. The most common cooling methods are air cooling, water cooling, and immersion cooling. Servers typically need to run for extended periods to process large amounts of data and application programs, generating significant heat. If this heat isn't effectively dissipated, it can reduce server performance or even lead to hardware damage. Conventional server cooling methods and technologies include: Fan cooling system: Servers are typically equipped with a fan cooling system that draws air from the server chassis to cool internal components. However, as high-speed computing servers become increasingly common, conventional fan cooling can no longer meet these requirements. Cooling fins and heat sinks: Cooling fins and heat sinks serve to increase the surface area in order to improve heat dissipation. They are typically connected to the central processing unit and other high-temperature components to transfer heat to large-area aluminum or copper heat sinks, thus increasing heat dissipation efficiency. However, this cooling method also cannot meet the requirements of high-speed computing servers. Liquid cooling system: Some high-performance servers use liquid cooling systems, in which liquid flows through pipes and radiators to dissipate heat. These systems are generally more efficient than air cooling and are particularly suitable for server applications that require efficient cooling. However, if pipes, connections, and other components that transport the liquids are damaged or cracked, leakage of the liquid can cause a short circuit or even damage the electronic components. Object of the invention The object of the invention is to solve the problem that conventional fan cooling systems, including cooling fins and fans, cannot meet the requirements of high-speed computing servers, which generate a significant amount of heat. Liquid cooling systems have the problem that liquid leakage can cause a short circuit or even damage electronic components if pipes, connections, and other components used to transport the liquid are damaged or cracked. This task is solved by the radiative cooling system, which comprises: a freezing compartment containing a freezing device; a heat source compartment adjacent to the freezing compartment containing a humidity controller; and a metal insulating plate positioned between the freezing compartment and the heat source compartment, forming a heat exchanger between the two. The freezing device includes a refrigerant pipe in contact with the metal insulating plate. This allows the heat generated by the heat source compartment to be efficiently exchanged with the cold metal insulating plate by radiation, thereby reducing the temperature in the heat source compartment.The freezing device completely dissipates the heat absorbed by the metal insulation plate, without the problem of liquid leakage causing a short circuit in the circuit and damaging the electronic components. In one embodiment, the refrigerant tube contacts the surface of the first side of the metal insulating plate. This allows the heat absorbed by the insulating metal plate to be dissipated through the refrigerant tube. In one embodiment, a groove is provided on the first side of the metal insulating plate, with the refrigerant pipe being arranged in the groove and in contact with the metal insulating plate. This allows the refrigerant pipe and the metal insulating plate to have a larger contact area, so that the heat absorbed by the metal insulating plate can be dissipated more efficiently through the refrigerant pipe. Preferably, a plurality of ribs are provided on the second side of the metal insulating plate, extending into the heat source area. This increases the contact area between the metal insulating plate and the heat source area through the plurality of ribs, in order to absorb the heat more efficiently. In one embodiment, the heat source area is a server cabinet, wherein the freezing area is located in the server cabinet and is separated by the metal insulating plate. Preferably, a fan is provided on the side wall of the server cabinet. This supports heat dissipation in the heat source area to further improve heat dissipation. In one embodiment, the freezing device consists of a freezer located outside the server cabinet and connected to the two ends of the refrigerant pipe via a feed pipe and an outlet pipe. Brief description of the drawings Fig. 1 is a perspective view of the application to the server cabinet of the cooling system of the embodiment of the invention, Fig. 2 is a front view of the application to the server cabinet of the cooling system of the embodiment of the invention, Fig. 3 is a sectional view according to Fig. 2, Fig. 4 is a view of the arrangement of the refrigerant pipe on the first side of the metal insulating plate of a further embodiment of the invention, Fig. 5 is a sectional view along line VV in Fig. 4. Ways to implement the invention Figures 1, 2 to 3 show an embodiment of the radiative cooling system of the present invention applied to a server rack. A metal insulating plate 20 with good thermal conductivity is arranged inside the rack to separate a freezing zone 10 and a heat source zone 40. That is, the freezing zone 10 and the heat source zone 40 are arranged adjacent to each other. More precisely, the heat source zone 40 is located at the front of the rack. After opening the door, the server 401 can be inserted or removed. The freezing zone 10 is located at the rear of the rack. The metal insulating plate 20 absorbs the heat generated by the server 401 and then dissipates it through the freezing device 30 arranged in the freezing zone 10. Preferably, the first side of the metal insulating plate 20 (i.e., the side facing the rear of the rack) is in contact with the freezing device 30.The second side of the metal insulating plate 20 (i.e., the side facing the front of the cabinet) forms a plurality of ribs 201. The ribs 201 extend into the heat source area 40 to increase the contact area of ​​the metal insulating plate 20 with the heat and serve as a heat exchange element between the freezing area 10 and the heat source area. The freezing device 30 consists of a freezer 301 and a refrigerant pipe 302. The freezer 301 is located outside the server cabinet. The refrigerant pipe 301 contacts the first side of the metal insulating plate 20. The first opening 3021 and the second opening 3022 at the two ends of the refrigerant pipe 301 are connected to an outlet pipe 304 and a supply pipe 303. The outlet pipe 304 and the supply pipe 303 are connected to the outlet and inlet of the freezer 301. The freezer 301 has a compressor, a drive motor, a condenser, an expansion valve, and the refrigerant pipe 302 (i.e., evaporator), which form a refrigeration cycle. During the refrigeration cycle, the compressor draws in the gaseous refrigerant, which is evaporated in the evaporator, and compresses it to form a high-pressure gaseous refrigerant. The gaseous high-pressure refrigerant is condensed in the condenser.Due to the cooling of the surrounding air or water, the gaseous refrigerant is converted into a liquid high-pressure refrigerant at ambient temperature. The pressure of the liquid high-pressure refrigerant flowing from the condenser is reduced in the expansion valve, converting the refrigerant into a liquid low-pressure refrigerant. The liquid low-pressure refrigerant is introduced into the refrigerant pipe 302 to absorb the heat conducted from the heat source area 40 by the metal insulating plate 20 and then evaporates back into a gaseous refrigerant. It then flows back to the compressor to start another cooling cycle. In one embodiment of the present invention, the refrigerant tube 301 can contact the surface of the first side of the metal insulating plate 20 (as shown in Fig. 3). Alternatively, in another embodiment of the present invention, a zigzag-shaped groove 202 can be provided on the first side of the metal insulating plate 20 corresponding to the refrigerant tube 301 (as shown in Figs. 4 and 5). By arranging the refrigerant tube 301 in the groove 202, the contact area with the metal insulating plate 20 is increased, so that the heat absorbed by the insulating metal plate 20 can be dissipated more efficiently through the refrigerant tube 302. The cooling system of the present invention, as described above, allows the heat generated by the operation of the server 401 in the heat source area 40 to be absorbed by radiation from the metal insulating plate 20 and the fins 201. This heat is then efficiently exchanged with the cold refrigerant pipe 302, thereby efficiently reducing the temperature of the heat source area 40 and dissipating the heat through the freezing device 30. Since the server is not exposed to any liquid during the entire cooling process, there is no risk of the liquid causing short circuits or damaging electronic components. Furthermore, the present invention also allows for the installation of a fan 60 and a humidity controller 50 on the side wall of the server cabinet (as shown in Figures 1 and 2). The fan 60 assists in heat dissipation in the heat source area 40, thereby further increasing the efficiency of heat dissipation. The humidity controller 50 serves to monitor the humidity in the heat source area 40 in order to prevent excessive humidity from having a negative impact on the server.

Claims

Radiant cooling system, comprising a freezing area (10) in which a freezing device (30) is provided; a heat source area (40) which is arranged adjacent to the freezing area (10) and in which a humidity controller (50) is provided; and a metal insulating plate (20) which is arranged between the freezing area (10) and the heat source area (40) and forms a heat exchange element between the freezing area (10) and the heat source area (40), wherein the freezing device (30) has a refrigerant pipe (302) which contacts the metal insulating plate (20). Radiation cooling system according to claim 1, characterized in that the refrigerant tube (302) contacts the surface of the first side of the metal insulating plate (20). Radiation cooling system according to claim 1, characterized in that a groove (202) is provided on the first side of the metal insulating plate (20), wherein the refrigerant pipe (302) is arranged in the groove (202) and is in contact with the metal insulating plate (20). Radiation cooling system according to claim 1 or 2, characterized in that a plurality of ribs (201) are provided on the second side of the metal insulating plate (20) which extend into the heat source area (40). Radiation cooling system according to claim 1, characterized in that the heat source area (40) is a server cabinet, wherein the freezing area (10) is located in the server cabinet and is separated by the metal insulating plate (20). Radiation cooling system according to claim 5, characterized in that a fan (60) is provided on the side wall of the server cabinet. Radiation cooling system according to claim 5, characterized in that the freezing device (30) consists of a freezer (301) located outside the server cabinet and connected to the two ends of the refrigerant pipe (302) via a feed pipe (303) and an outlet pipe (304).