BUSBAR AND ELECTRICAL CONNECTION UNIT

Abstract

A busbar has a plate section. A surface of the plate section has a heat dissipation structure comprising at least one of a plurality of depressions and a plurality of protrusions.

Description

[Technical field]

[0001] Embodiments of the present invention relate to a busbar and an electrical connection unit. [State of the art]

[0002] An electrical connection unit comprising an electronic component and a busbar electrically connected to the electronic component is known. [State of the art document][Patent document]

[0003] [Patent document 1] Japanese unexamined patent application, first publication no. 2024-037492 [Description of the invention][Problems to be solved by the invention]

[0004] Furthermore, an improvement in the heat dissipation properties of an electrical connection unit is expected.

[0005] One embodiment provides a busbar and an electrical connection unit that is able to improve heat dissipation properties. [Means of solving the problem]

[0006] The busbar of one embodiment comprises a plate section. A surface of the plate section has a heat dissipation structure comprising at least one of a plurality of depressions and a plurality of projections. [Effects of the invention]

[0007] According to one embodiment, it is possible to improve a heat dissipation property. [Brief description of the drawings] [ Fig. 1] A cross-sectional view showing an electrical connection unit of one embodiment. [ Fig. 2] A perspective view to describe a main body of the embodiment. [ Fig. 3] A perspective view to describe a subunit of the embodiment. [ Fig. 4] A perspective view showing an electronic component and a connecting component of the embodiment. [ Fig. 5] A perspective view to describe a routing board of the embodiment. [ Fig. 6] A partially separated perspective view of the installation board of the embodiment. [ Fig. 7] A top view showing a subunit of the embodiment. [ Fig. 8] A cross-sectional view along line F8-F8 of the in Fig. 7 structure shown. [ Fig. 9] A cross-sectional view along line F9-F9 of the in Fig. 7 structure shown. [ Fig. 10] A top view to describe a first example of the form of a busbar of the embodiment. [ Fig. 11] A top view to describe a second example of the busbar design. [ Fig. 12] A perspective view showing another subunit of the embodiment. [ Fig. 13] A front view showing an electronic component of an embodiment. [ Fig. 14] A perspective view, which represents a basic element of the embodiment. [ Fig. 15] A top view showing a subunit of the embodiment. [ Fig. 16] A cross-sectional view along line F16-F16 of the in Fig. 15 depicted structure. [ Fig. 17] A cross-sectional view along line F17-F17 of the in Fig. 15 depicted structure. [ Fig. 18] A cross-sectional view along line F18-F18 of the in Fig. 15 depicted structure. [ Fig. 19] A perspective view showing a coupling structure between a plurality of subunits of the embodiment. [ Fig. 20] A cross-sectional view along line F20-F20 of the in Fig. 15 depicted structure. [Embodiments of the invention]

[0008] The following descriptions illustrate embodiments with reference to the drawings. In the following description, assemblies with the same or similar functions are named using the same reference numerals. Redundant descriptions of these assemblies can be omitted. Note that the assembly described below does not limit the scope of the embodiment.

[0009] In the present disclosure, the terms are defined as follows. The term "connection" is not limited to a mechanical connection and may also include an electrical connection. That is to say, the term "connection" is not limited to a case in which two elements that are connection targets are directly connected and may include a case in which two elements that are connection targets are connected by another, intervening element. The term "receiving" is not limited to the case in which the entire component is received, but may also include the case in which only a part of the component is received (a state in which the remaining part of the component protrudes). The term "facing" indicates that the virtual projection images of two target objects overlap when viewed from a certain direction.This means that the term "facing" is not limited to the case where two target objects are directly facing each other, but can also include the case where two target objects are facing each other in a state in which another element is located between the two target objects. "Parallel," "orthogonal," or "equal" can each include "substantially parallel," "substantially orthogonal," or "substantially equal," respectively.

[0010] In the present disclosure, a +X direction, a -X direction, a +Y direction, a -Y direction, a +Z direction, and a -Z direction are defined as follows. The +X direction is a direction from a first end 110e1 to a second end 110e2 of a metal plate 110, which is described later (see Fig. 2) The -X direction is a direction opposite to the +X direction. If the +X and -X directions are not distinguished, the directions will be referred to simply as the "X direction" in the following. The +Y direction and the -Y direction are directions that intersect the X direction (for example, orthogonal to it). The +Y direction is a direction from a third end 110e3 to a fourth end 110e4 of the metal plate 110, which will be described later (see Fig. 2) The -Y direction is a direction opposite to the +Y direction. If the +Y and -Y directions are not distinguished, the directions will simply be referred to as the "Y direction" in the following. The +Z direction and the -Z direction are directions that intersect the X and Y directions (for example, orthogonal to them). The +Z direction is a direction from the metal plate 110, which will be described later, to a principal body MU (see Fig. 2) The -Z direction is the opposite of the +Z direction. When the +Z and -Z directions are not distinguished, the directions are simply referred to as the "Z direction" in the following. The Z direction is an example of a "first direction." The Y direction is an example of a "second direction." The X direction is an example of a "third direction."

[0011] If the X and Y directions are not distinguished, the directions can be referred to as the "horizontal direction" in the following. The Z direction can be referred to as the "vertical direction" in the following. The side in the +Z direction can be referred to as "top" and the side in the -Z direction as "bottom". However, these terms are descriptive and do not define a gravity direction of an electrical connection unit 1 (an installation position of the electrical connection unit 1). (Design)<1. Structure of the electrical connection unit>

[0012] Fig. Figure 1 is a cross-sectional view depicting an electrical connection unit 1 of an embodiment. The electrical connection unit 1 is, for example, an in-vehicle device attached to a vehicle such as an electric vehicle (EV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV). The electrical connection unit 1 may be referred to, for example, as an "electrical junction box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0013] The electrical connection unit 1, for example, has a housing 5, a main body MU, a metal plate 110, a plurality of heat transfer elements 120 (see Fig. 2) and a plurality of insulating covers 130 on (see Fig. 2). <2. Case>

[0014] First, the housing 5 is described. The housing 5 forms a contour of the electrical connection unit 1. The housing 5 has, for example, a base 6 (first element) and a cover 7 (second element). The base 6 is an element that covers the main body MU and the metal plate 110 from below. The base 6 has, for example, a plate-like shape extending horizontally or a shell-like shape open in the +Z direction. The base 6 is made, for example, of a synthetic resin. The cover 7 is an element that covers the main body MU and the metal plate 110 from above. The base 6 has, for example, a shell-like shape open in the -Z direction. The cover 7 is made, for example, of a synthetic resin. In the present embodiment, the box-shaped housing 5 is formed by the combination of the base 6 and the cover 7. The shape of the housing 5 is not limited to the above example.For example, the metal plate 110, which will be described later, can serve as part of the base 6 or as the entire base 6. The housing 5 can be omitted.

[0015] In the present embodiment, the electrical connection unit 1 has a first region (first space) R1 and a second region (second space) R2. The first region R1 is a region where heat dissipation is a primary concern. For example, an electronic component 10S with a high heat generation is located in the first region R1. The second region R2, on the other hand, is a region where ease of assembly is a primary concern. For example, an electronic component 10T is located in the second region R2, which has a lower heat generation than the electronic component 10S and / or requires a more complex assembly structure than the electronic component 10S. However, these details do not limit the electrical connection unit 1 of the present disclosure.For example, the amount of heat generated by electronic component 10T can be greater than the amount of heat generated by electronic component 10S. <3. Main body>

[0016] Next, the main body MU will be described.

[0017] Fig. Figure 2 is a perspective view illustrating the main body MU. The main body MU is a section that performs a main function (for example, switching electrical connection states or overcurrent protection) of the electrical connection unit 1. In the present embodiment, the main body MU is divided into a plurality of subunits SU. The main body MU is formed, for example, by connecting the plurality of subunits SU. In the present embodiment, the main body MU contains two subunits SU (the subunits SUS and SUT). Each subunit SU can be referred to as a "circuit assembly body".

[0018] The subunit SUS has a primary electrical function. For example, the subunit SUS contains a plurality of electronic components 10S and a routing board 40S. The plurality of electronic components 10S are electrically connected to the routing board 40S. The base plate 41S contained in the subunit SUS (which will be described later) is an example of a "primary element".

[0019] The subunit SUT has a secondary electrical function. This secondary function is, for example, different from the primary function. The subunit SUT contains, for instance, a plurality of electronic components 10T and a routing structure 40T. The plurality of electronic components 10T are electrically connected to the routing structure 40T. The basic element 41T contained in the subunit SUT (described later) is an example of a "second basic element".

[0020] In the present embodiment, the subunit SUS is a subunit SU in which heat dissipation is the primary function. The subunit SUS is arranged in the first region R1 of the electrical connection unit 1, as described above. The subunit SUS faces a first region A1 of the metal plate 110, which will be described later, in the Z-direction.

[0021] Subunit SUT, on the other hand, is a subunit SU where mountability is paramount. For example, subunit SUT is positioned laterally in the +Y direction relative to subunit SUS. Subunit SUT is located in the second region R2 of electrical connection unit 1, as described above. Subunit SUT faces a second region A2 of metal plate 110, which will be described later, in the Z direction. When electronic component 10S and electronic component 10T are not distinguished, they will be referred to simply as "electronic component 10" in the following.

[0022] Note that the main body MU need not be subdivided into a plurality of subunits SU, as in the example described above. For example, the plurality of subunits SU can be formed as a single piece. For example, the base plate 41S of the routing board 40S and a base element 41T of the routing structure 40T, which will be described later, can be formed as a single piece. <4. Structure of the SUS subunit>

[0023] Next, the structure of the SUS subunit will be described.

[0024] Fig. Figure 3 is a perspective view illustrating the subunit SUS. The subunit SUS contains, for example, a plurality of electronic components 10, a plurality of connection components 20, and a routing board 40S. The connection component 20 is an element that forms a power supply path in the vertical direction. The connection component 20 can be referred to as a "vertical routing element". <4.1 Electronic Component>

[0025] First, the electronic component 10 is described. The electronic component 10 is an electronic component that is attached according to a function required for each subunit SU. For example, the electronic component 10 could be a connector, a fuse, a relay (for example, a mechanical relay or a solid-state relay), a capacitor, a branching component, any of several different sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit in which two or more of these components are combined. However, the type of electronic component 10 is not limited to the above example. The electronic component 10 could, for example, be a heat-generating component that produces heat when energy is supplied.

[0026] In the present embodiment, the majority of electronic components 10 include an electronic component 10S that generates a relatively large amount of heat when energy is supplied. The electronic component 10S is a relay (for example, a mechanical relay or a solid-state relay), a pyrolytic fuse, a current sensor (for example, a current sensor with a shunt resistor), or the like. However, the type of electronic component 10S is not limited to the example above.

[0027] Fig. Figure 4 is a perspective view showing the electronic component 10S and the connection component 20. The electronic component 10S is, for example, an electronic component in which a plurality of terminals 13 are arranged at one end of the electronic component 10S. The electronic component 10S includes, for example, a housing 11, a component body 12, a plurality of terminals 13, and a plurality of mounting sections 14. (Housing)

[0028] The housing 11 is an outer element that forms most of the outer shape of the electronic component 10S. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 contains the component body 12. The housing 11 and the component body 12 can be formed from a single piece.

[0029] In the present embodiment, the housing 11 has an insulating rib 11a that projects horizontally (for example, in the Y-direction) and extends in the Z-direction. The insulating rib 11a has, for example, a plate-like shape formed horizontally (for example, in the Y-direction) and in the Z-direction. The insulating rib 11a extends, for example, over the entire length of the housing 11 in the Z-direction. The insulating rib 11a is arranged between the plurality of terminals 13 (a terminal 13A and a terminal 13B, which will be described later). The insulating rib 11a electrically isolates terminal 13A from terminal 13B. In the present embodiment, a portion of the insulating rib 11a is arranged between first sections 21 (which will be described later) of the two connection components 20 that are connected to the electronic component 10S.The insulating rib 11a provides electrical insulation between the first sections 21 of the two connecting components 20, which are connected to the electronic component 10S. (Component body)

[0030] The component body 12 is a section that performs a main function of the electronic component 10S. For example, if the electronic component 10S is a relay, the component body 12 contains a switch (for example, a contact) that toggles between a conductive and a non-conductive state. For example, if the electronic component 10S is a fuse, the component body 12 contains a melting section that blows when an overcurrent flows. For example, if the electronic component 10S is a capacitor, the component body 12 contains a section that stores electrical charge. (Connection)

[0031] Terminal 13 is an electrical connection section exposed to the outside of the housing 11. Terminal 13 is electrically connected to the component body 12 inside the housing 11. In the present embodiment, the electronic component 10S includes one terminal 13A and one terminal 13B as the plurality of terminals 13. One of the terminals 13A and 13B is a terminal on the positive electrode side. The other of the terminals 13A and 13B is a terminal on the negative electrode side. One of the terminals 13A and 13B is an example of a "first terminal." The other of the terminals 13A and 13B is an example of a "second terminal."

[0032] In the present embodiment, terminal 13A and terminal 13B are provided at one end of the electronic component 10S in a horizontal direction (for example, in the Y direction). Both terminal 13A and terminal 13B are oriented horizontally (for example, in the X direction). Each terminal 13 has a mounting hole 13h to which a fastening element 71 (for example, a screw or a bolt), which will be described later, is attached. The mounting hole 13h is open in the horizontal direction (for example, in the Y direction). An inner circumferential surface of the mounting hole 13h of the electronic component 10S has a groove for the screw. (Fortification section)

[0033] The mounting section 14 is a section for fixing the electronic component 10S. The mounting section 14 has a mounting hole 14h to which a fastening element 116 (for example, a screw or a bolt; and see Fig. 9), which will be described later, is attached. The mounting hole 14h is open in the Z-direction. The mounting hole 14h is an insertion hole through which the fastening element 116 passes. A fixing target for the fastening section 14 will be described later. <4.2 Connection component>

[0034] Next, the connection component 20 is described. The connection component 20 is a component that electrically connects the electronic component 10S to the routing board 40S. The connection component 20 forms part of a power supply path in the subunit SUS. The connection component 20 is made of metal (for example, copper, a copper alloy, aluminum, or an aluminum alloy). The connection component 20 can be referred to as a "metal component".

[0035] In the present embodiment, the connecting component 20 electrically connects the electronic component 10S to the busbar 42 (see Fig. 3), which is included in the routing board 40S. In the present embodiment, the longitudinal length L12 of the connecting component 20 (for example, in the Y-direction) of the electronic component 10S is less than the longitudinal length L11 of the electronic component 10S. The connecting component 20 includes, for example, a first section 21 and a second section 22. (First section)

[0036] The first section 21 of the connecting component 20 is a section connected to terminal 13 of the electronic component 10S. The first section 21 is a plate-shaped or rectangular parallelepiped section extending in the Z direction. The first section 21 extends in the Z direction along one end (for example, an end in the Y direction) of the electronic component 10S. The first section 21 is a vertical section oriented in the Z direction with respect to the routing board 40S (for example, with respect to a busbar 42, which will be described later). The first section 21 is horizontally adjacent (for example, in the Y direction) to the electronic component 10S.For example, the first section 21 borders the terminal 13 of the electronic component 10S in a horizontal direction (for example, in the Y direction) and is connected to the terminal 13 of the electronic component 10S in a horizontal direction (for example, in the Y direction).

[0037] The first section 21 of the connecting component 20 has a first mounting hole 21h through which the fastening element 71 (for example, a screw or a bolt) passes. The first mounting hole 21h is open in the horizontal direction (for example, in the Y direction). The fastening element 71, passing through the first mounting hole 21h, is connected to the mounting hole 13h of the terminal 13 of the electronic component 10S, so that the first section 21 is physically and electrically connected to the terminal 13 of the electronic component 10S. (Second Section)

[0038] The second section 22 of the connecting component 20 is a section that is connected to the busbar 42 (see Fig. 3) The second section 22 projects horizontally (for example, in the Y direction) from the end of the first section 21 on the side in the -Z direction. The second section 22 is a plate section provided in the horizontal direction. The second section 22 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 22 of the connecting component 20 is attached to the fastening element 43 (for example, a screw or a bolt; see Fig. 8) is attached, projecting from the busbar 42 in the +Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 22 of the connecting component 20 has a second mounting hole 22h through which the fastening element 43 passes. The second mounting hole 22h is open in the Z direction. In the second section 22, the fastening element 43 passes through the second mounting hole 22h. A coupling element 44 (for example, a nut; see Fig. 3) is coupled to the tip of the fastening element 43, which passes through the second fastening hole 22h, thereby fixing the second section 22 to the busbar 42. In the present embodiment, the first section 21 and the second section 22 form an L-shaped connecting component 20.

[0039] In the present embodiment, the busbar 42 is arranged at a position remote from the terminal 13 of the electronic component 10S (for example, at a position remote in the Z direction). The connecting component 20 is arranged between the electronic component 10S and the busbar 42. In the present disclosure, the phrase "the connecting component is arranged between the electronic component and the busbar" is not limited to the case where part of the connecting component is arranged between the electronic component and the busbar when viewed from the X or Y direction.The phrase "the connecting component is arranged between the electronic component and the busbar" can correspond to a case in which part of the connecting component is located between the electronic component and the busbar when viewed from a direction inclined with respect to the X-direction or the Y-direction. The connecting component 20 electrically connects the terminal 13 of the electronic component 10S to the busbar 42. <4.3 Installation board>

[0040] Next, the 40S routing board will be described.

[0041] Fig. Figure 5 is a perspective view to describe the 40S routing board.

[0042] The routing board 40S is a component that forms at least part of a power supply path between a plurality of electronic components 10 (for example, a plurality of electronic components 10S) and / or at least part of a power supply path between the electronic component 10 contained in the subunit SUS (for example, the electronic component 10S) and the electronic component 10 contained in another subunit SU (for example, the subunit SUT). In the present disclosure, the “routing board” denotes a board-like routing structure. The term “board-like” denotes a plate-like shape along a plane when viewed as a whole, irrespective of any fine detail.In the present disclosure, the term "plate-shaped," "sheet-shaped," or "flat" shape is not limited to the case where it is completely flat and may include a case in which a fixing structure, a rib, or the like, projecting in the Z-direction, is partially present, a case in which a non-uniform shape, following the thickness of the busbar, is present on the surface, and the like. In the present embodiment, the routing board 40S has a plate-shaped form in the X and Y directions.

[0043] The distribution board 40S includes, for example, a base plate 41S, one or more (for example, a plurality of) busbars 42, and a plurality of fastening elements 43. In the present embodiment, the base plate 41S and the plurality of busbars 42 are integrated by insert forming. For example, the distribution board 40S is formed as a single element by insert forming the busbar 42 with the base plate 41S after the fastening element 43 has been fixed to the busbar 42. That is, the busbar 42 is integrated with the base plate 41S without the use of a fastening element such as a screw or bolt. Note that the distribution board 40S can also be formed by using a different structure instead of insert forming. A modification example in which the distribution board 40S is formed by using a different structure is described later.

[0044] Fig. Figure 6 is a partially unfolded perspective view showing the routing board 40S. For the sake of simplicity, the base plate 41S, the busbar 42, and the fastening element 43 are described below with reference to the drawings in which the routing board 40S is partially unfolded. <4.3.1 Base plate>

[0045] The base plate 41S is a support element that integrally carries the plurality of busbars 42 arranged horizontally at intervals. The base plate 41S is made, for example, of a synthetic resin and has insulating properties. The base plate 41S electrically insulates the plurality of busbars 42 from one another. The base plate 41S is an example of a "base element." The base plate 41S can also be referred to as an "insulating substrate." The base plate 41S has, for example, a flat surface section 51, a frame section 52, and a plurality of fixing sections 53 (see Fig. 9). (Flat surface section)

[0046] The flat surface section 51 is a section formed in the base plate 41S in a plate-like shape. The flat surface section 51 is plate-like in the horizontal direction. The flat surface section 51 forms a main section of the base plate 41S. The flat surface section 51 forms an (insulating) base section of the base plate 41S. In the present embodiment, the flat surface section 51 extends over the entire width in the X direction of the base plate 41S and over the entire width in the Y direction of the base plate 41S, with the exception of the frame section 52 of the base plate 41S.

[0047] The flat surface section 51 has a first surface 51a and a second surface 51b (see Fig. 9) The first surface 51a is a surface oriented in the +Z direction. The first surface 51a is a flat surface provided in the horizontal direction. The first surface 51a faces the majority of electronic components 10 (for example, the majority of electronic components 10S). The second surface 51b is located on the side opposite the first surface 51a. The second surface 51b is a surface oriented in the -Z direction. The second surface 51b is a flat surface provided in the horizontal direction. The second surface 51b faces the metal plate 110 (see Fig. 2) One thickness direction (plate thickness direction) of the flat surface section 51 is the Z-direction. In the present embodiment, a thickness T11 of the flat surface section 51 in the Z-direction is less than a thickness T1 of the busbar 42 in the Z-direction (for example, a thickness of a horizontal plate section 42p, which will be described later, in the Z-direction) (see Fig. 8) The thickness T11 of the flat surface section 51 in the Z direction can be equal to or greater than the thickness T1 of the busbar 42 in the Z direction.

[0048] The flat surface section 51 has, for example, one or more (for example, a plurality of) receiving sections 55 in which the busbars 42 are each received. The plurality of receiving sections 55 are spaced apart from one another in the X or Y direction. Each of the receiving sections 55 is, for example, a through-hole that penetrates the flat surface section 51 in the Z direction. Note that the receiving section 55 can be a recess provided on the first surface 51a or the second surface 51b of the flat surface section 51 and is recessed in the Z direction, instead of a through-hole.In the present disclosure, the phrase “the receiving section penetrates the flat surface section in the first direction (Z-direction)” may include a case in which part of the total length of the receiving section 55 penetrates the flat surface section 51 in the Z-direction (for example, the remaining part of the receiving section 55 may be a recess in the Z-direction or be provided within the base plate 41S and not be exposed to the outside of the base plate 41S).Similarly, in the present disclosure, the phrase “the receiving section is recessed in the first direction (Z direction)” may include a case in which part of the total length of the receiving section 55 is recessed in the Z direction (for example, a remaining part of the receiving section 55 may be a through hole penetrating the flat surface section 51 in the Z direction, or it may be provided within the base plate 41S and is not exposed to the outside of the base plate 41S).

[0049] Each receiving section 55 has an outer shape that, viewed from the Z-direction, corresponds to the shape of the busbar 42 to be received. For example, the majority of receiving sections 55 contain four receiving sections 55A, 55B, 55C, and 55D. Receiving section 55A is designed to correspond to a busbar 42A, which will be described later, and receives at least a portion of the busbar 42A. Receiving section 55B is designed to correspond to a busbar 42B, which will be described later, and receives at least a portion of the busbar 42B. Receiving section 55C is designed to correspond to a busbar 42C, which will be described later, and receives at least a portion of the busbar 42C. Receiving section 55D is designed to correspond to a busbar 42D, which will be described later, and receives at least a portion of the busbar 42D. (Frame section)

[0050] Frame section 52 is provided at one circumferential end of the base plate 41S. Frame section 52 is a reinforcing rib that projects vertically from the end of the flat surface section 51 (see Fig. 8) For example, the width (thickness) H11 of the frame section 52 in the Z-direction is less than half the width (thickness) H12 of the electronic component 10 in the Z-direction (see Fig. 8). Note that section 52 of the framework can be omitted. (Fixation section)

[0051] The fixing section 53 is a section that is fixed to the metal plate 110 (see Fig. 9) The fixing section 53 has a mounting hole 53h that penetrates the base plate 41S in the Z direction. A fastening element 115 (for example, a screw or a bolt), which will be described later, passes through the mounting hole 53h. This will be described later. <4.3.2 Busbar>

[0052] The busbar 42 is a routing element (electrical connection element) contained in the routing board 40S. The busbar 42 is, for example, a routing element for electrically connecting a plurality of electronic components (for example, a plurality of electronic components 10S). Alternatively, the busbar 42 can also be a routing element for electrically connecting the electronic component 10 (for example, the electronic component 10S) to the electronic component 10 contained in another subunit SU (for example, the subunit SUT). The busbar 42 is made of metal (for example, copper, a copper alloy, aluminum, or an aluminum alloy) and is conductive. In the present embodiment, a plurality of busbars 42, for example, four busbars 42A, 42B, 42C, and 42D, are included.The four busbars 42A, 42B, 42C, and 42D are arranged horizontally at intervals. The four busbars 42A, 42B, 42C, and 42D contain sections arranged in the same plane. The four busbars 42A, 42B, 42C, and 42D are supported by the flat surface section 51 of the base plate 41S. In the present disclosure, the phrase "the busbar is supported by the flat surface section" is not limited to the case where the busbar 42 is received in the receiving section 55, but can also include the case where the busbar 42 is attached to the first surface 51a or the second surface 51b of the flat surface section 51.

[0053] At least a portion of each busbar 42 has a plate-like shape extending horizontally. At least a portion of each busbar 42 is received in the receiving section 55 and extends along the flat surface section 51. That is, at least a portion of each busbar 42 extends along the first surface 51a of the flat surface section 51. At least a portion of each busbar 42 extends horizontally within the receiving section 55. Hereinafter, a plate-like portion of each busbar 42 extending horizontally may be referred to as the "horizontal plate section 42p". The horizontal plate section 42p is an example of a "plate section". The busbar 42 is an element that forms a horizontal energy supply path. The busbar 42 may also be referred to as a "horizontal routing element".

[0054] The plate section (for example, the horizontal plate section 42p) of the busbar 42 has a first surface 42a1 and a second surface 42a2 (see Fig. 8 and Fig. 9) The first surface 42a1 is a surface facing upwards in the plate thickness direction (+Z direction). The first surface 42a1 is a flat surface oriented horizontally. The first surface 42a1 faces the plurality of electronic components 10 (for example, a plurality of electronic 10S) and / or the connecting component 20. In a case where the first surface 42a1 faces the plurality of electronic components 10 (for example, the plurality of electronic components 10S) and the connecting component 20, the second surface 42a2 is located on the side opposite the first surface 42a1 and faces the heat transfer element 120 (see Fig. 8) For example, the first surface 42a1 in the present disclosure faces the plurality of electronic components 10 (for example, the plurality of electronic components 10S) and the connecting component 20. The second surface 42a2 is a surface facing downwards (-Z direction) in the plate thickness direction. The second surface 42a2 is a flat surface that is provided in the horizontal direction. The second surface 42a2 faces the metal plate 110 (see Fig. 2) The thickness direction (plate thickness direction) of the horizontal plate section 42p is the Z-direction and coincides with the first direction.

[0055] Fig. Figure 7 is a top view showing the SUS subunit. Each busbar 42, for example, has a connecting section 61, a connecting section 62, and an extending section 63.

[0056] The connection section 61 is located in the middle of the busbar 42 or at the first end of the busbar 42. The connection section 61 is a section that is connected to the electronic component 10 (for example, the electronic component 10S) directly or via the connection component 20. The connection section 61 has, for example, a section that overlaps the connection component 20 when viewed from the Z-direction. The connection section 61 is adjacent to the connection component 20 in the Z-direction and is connected to the connection component 20 in the Z-direction. Instead of the above example, the connection section 61 may, for example, be adjacent to the terminal 13 of the electronic component 10 in the Z-direction and be directly connected to the terminal 13 of the electronic component 10 in the Z-direction.

[0057] The connecting section 62 is located in the middle of the busbar 42 or at the second end of the busbar 42. The connecting section 62 is a section that is connected to another electronic component 10 directly or via another connecting component 20. Instead of the example above, the connecting section 62 can be connected to another busbar 42 (for example, the busbar 42 contained in another subunit SU) or to an external connecting busbar 76 (see Fig. 15).

[0058] Extending section 63 extends from connecting section 61 in the X-direction or in the Y-direction. Extending section 63 is provided between connecting section 61 and connecting section 62. Extending section 63 extends over connecting section 61 and connecting section 62. Extending section 63 connects connecting section 61 to connecting section 62.

[0059] In the present embodiment, the horizontal plate section 42p described above comprises at least the entire connecting section 61 and a part of the extending section 63. That is to say, at least the entire connecting section 61 and a part of the extending section 63 are received in the receiving section 55 and are located on the same plane.

[0060] In the present embodiment, the extending sections 63 of some busbars 42 are received in the receiving section 55 such that they extend over both sides of a region R, specifically through the region R that overlaps the electronic component 10 when viewed from the Z direction. For example, the extending section 63 over the region R that overlaps the electronic component 10 when viewed from the Z direction extends over the side in the -Y direction and the side in the +Y direction of region R. That is, the busbar 42 is received in the receiving section 55 in such a way that it can easily be routed along a better path (for example, a path with a shorter distance) without being obstructed by the presence of the electronic component 10.

[0061] One or more busbars 42 may have an extension 64 in addition to the connecting section 61, the connecting section 62, and the extending section 63. The extension 64 is a section in which the busbar 42 extends to increase a heat dissipation area and / or to increase heat storage capacity (heat absorption). The extension 64 is a section that is not used for electrical connection. For example, the extension 64 is located on the side opposite the extending section 63 with respect to the connecting section 61 (or the connecting section 62). The extension 64 has a plate-like shape formed in the horizontal direction. The extension 64 is contained within the horizontal plate section 42p. The extension 64 is contained within the receiving section 55 and extends along the flat surface section 51.The extension 64 extends to the region R, which overlaps the electronic component 10 as seen from the Z direction, and has an end 42e1 of the busbar 42 at a position which overlaps the electronic component 10 as seen from the Z direction. (Heat dissipation structure of the busbar)

[0062] Here, a heat dissipation structure 42 is described in more detail. Although the busbar 42 contained in the subunit SUS is described as an example, another subunit SUT may have a similar busbar.

[0063] The surface of the horizontal plate section 42p has a heat dissipation structure 42HDS with at least one of a plurality of depressions and a plurality of projections. For example, the heat dissipation structure 42HDS in the present disclosure has a plurality of depressions. Here, if the heat dissipation structure 42HDS has a plurality of depressions, the busbar 42 can utilize a clearance that is generated when the depressions are provided. The heat dissipation structure 42HDS has a plurality of grooves that extend linearly as the plurality of depressions. In the present disclosure, the groove extends linearly in the horizontal direction (for example, in the X-direction) that intersects the plate thickness direction. The heat dissipation structure 42HDS has a first heat dissipation structure 42HDS1 and a second heat dissipation structure 42HDS2.The first heat dissipation structure 42HDS1 is provided in the first surface 42a1. The second heat dissipation structure 42HDS2 is provided in the second surface 42a2.

[0064] For example, the first heat dissipation structure 42HDS1 in the present disclosure has a plurality of recesses and the second heat dissipation structure 42HDS2 has a plurality of recesses.

[0065] In extension 64, the heat dissipation structure 42HDS (the first heat dissipation structure 42HDS1 and the second heat dissipation structure 42HDS2) can be provided with at least one of a plurality of recesses and a plurality of projections.

[0066] The heat dissipation structure 42HDS is formed on the surface of the horizontal plate section 42p by plastic deformation of a portion of the horizontal plate section 42p in the plate thickness direction by pressing or similar processes. If the first heat dissipation structure 42HDS1 is formed on the first surface 42a1, a portion of the horizontal plate section 42p is plastically deformed in the -Z direction by pressing or similar processes. The majority of the depressions on the first surface 42a1 are formed as a result of plastic deformation. If the second heat dissipation structure 42HDS2 is formed on the second surface 42a2, a portion of the horizontal plate section 42p is plastically deformed in the +Z direction by pressing or similar processes. The majority of the depressions on the second surface 42a2 are formed as a result of plastic deformation.

[0067] If the majority of depressions are formed in the surface of the horizontal plate section 42p, a force is generated to move a substrate in the busbar 42 in the plate thickness direction due to pressing or the like. In the case of pressing, it is less likely that the substrate will move in the plate thickness direction on a part of the busbar 42 that is in contact with a die, due to the presence of the die (alternatively also referred to as a "bottom form") facing an indentation form. Therefore, if the majority of depressions are formed on the surface of the horizontal plate section 42p, clearance is generated in the substrate in a direction that intersects the plate thickness direction.

[0068] The horizontal plate section 42p has a first region 42R1 and a second region 42R2. The first region 42R1 is a region provided with a plurality of recesses. For example, the heat dissipation structure 4HDS (the first heat dissipation structure 42HDS1 and the second heat dissipation structure 42HDS2) is located in the first region 42R1 in the present disclosure. The second region 42R2 is adjacent to the first region 42R1 in the second and third directions and is a region in which the plurality of recesses is not provided.

[0069] It should be noted that the first region 42R1 is a region provided with a plurality of recesses and is a region exhibiting the play described above. In a case where the extension direction of the extending section 63 coincides with the second direction and the direction intersecting the first direction, and the second direction is the third direction, the following relationship between the first region 42R1 and the second region 42R2 is satisfied. In the other direction of the second and third directions, the width of the first region 42R1 is greater than the width of the second region 42R2. For example, in the first region 42R1 in the present disclosure, the width of the first region 42R1 is greater than the width of the second region 42R2 in the X direction.

[0070] The heat dissipation structure 42HDS (the first heat dissipation structure 42HDS1 and the second heat dissipation structure 42HDS2) in the present disclosure is provided on each of the first surface 2a1 and the second surface 42a2. When viewed from the plate thickness direction, the first heat dissipation structure 42HDS1 may, but need not, overlap the electronic component 10. The second heat dissipation structure 42HDS2 is in contact with the heat transfer element 120.

[0071] When viewed from the plate thickness direction, the first heat dissipation structure 42HDS1 is located, for example, in a section that overlaps the electronic component 10 in the horizontal plate section 42p (see Fig. 7) When viewed from the plate thickness direction, for example, the second heat dissipation structure 42HDS2 overlaps the connecting component 20 and the heat transfer element 120 (see Fig. 7 and Fig. 8).

[0072] Some routing examples for busbar 42 are described below. The majority of electronic components 10S contain three electronic components 10A, 10B, and 10C. The majority of connection components 20 contain five connection components 20A, 20B, 20C, 20D, and 20E.

[0073] Busbar 42A has connecting section 61, connecting section 62, and extending section 63. Connecting section 61 is connected to terminal 13A of electronic component 10A via connecting component 20A. Connecting section 62 is located at the end of subunit SUS on the side in the +Y direction and is connected to busbar 42 contained in another subunit SU. Extending section 63 is received in receiving section 55 such that, viewed from the Z direction, it extends over both sides of region R through region R, which overlaps electronic component 10A.

[0074] In the busbar 42A, the first heat dissipation structure 42HDS1 is located, for example, in the extending section 63 (see Fig. 7) The second heat dissipation structure 42HDS2 is located in the first connection section 61 of the busbar 42A (see Fig. 7 and Fig. 8).

[0075] Busbar 42B has connecting section 61, connecting section 62, extending section 63, and extension 64. Connecting section 61 is connected to terminal 13B of electronic component 10A via connecting component 20B. Connecting section 62 is connected to terminal 13A of electronic component 10B via connecting component 20C. Extension 64 extends to region R, which overlaps electronic component 10B as viewed from the Z-direction, and has an end 42e1 of busbar 42 at a position that overlaps electronic component 10B.

[0076] In busbar 42B, the first heat dissipation structure 42HDS1 is located, for example, in the extending section 63 and the extension 64. In busbar 42B, the second heat dissipation structure 42HDS2 is located in the first connecting section 61 and the second connecting section 62.

[0077] Busbar 42C has connecting section 61, connecting section 62, and extending section 63. Connecting section 61 is connected to terminal 13B of electronic component 10B via connecting component 20D. Connecting section 62 is located at the end of subunit SUS on the side in the +Y direction and is connected to busbar 42 contained in another subunit SU.

[0078] In busbar 42C, the first heat dissipation structure 42HDS1 is located, for example, in extension 64. In busbar 42C, the second heat dissipation structure 42HDS2 is located in the first connection section 61 and the second connection section 62.

[0079] Busbar 42D has connecting section 61, connecting section 62, and extending section 63. Connecting section 61 is connected to terminal 13A of electronic component 10C via connecting component 20E. Connecting section 62 is located at the end of subunit SUS on the side in the +Y direction and is connected to busbar 42 contained in another subunit SU.

[0080] In busbar 42D, the first heat dissipation structure 42HDS1 is located, for example, in the extending section 63. In busbar 42D, the second heat dissipation structure 42HDS2 is located in the first connecting section 61 and the second connecting section 62.

[0081] In the above installation example, the following relationship between the first area 42R1 and the second area 42R2 in each busbar 42 is satisfied. In the third direction (for example, in the X direction), the width of the first area 42R1, where the heat dissipation structure 42HDS (the first heat dissipation structure 42HDS1 and the second heat dissipation structure 42HDS2) is located, is greater than the width of the second area 42R2. (Exposed structure on the upper surface side of each busbar)

[0082] In the present embodiment, at least a portion of the busbar 42 is exposed towards the upper surface of the base plate 41S. For example, the connecting section 61, the connecting section 62, and the extending section 63 of the busbar 42 are exposed on the upper surface (the first surface 51a of the flat surface section 51) of the base plate 41S. For example, the extending section 63 of the busbar 42 is exposed on the upper surface of the base plate 41S at least over its entire length between the connecting section 61 and the connecting section 62. (Exposed structure on the lower surface side of each busbar)

[0083] In the present embodiment, at least a portion of the busbar 42 is exposed towards the lower surface of the base plate 41S. For example, the entire connecting section 61 and at least a portion of the extending section 63 are exposed on the lower surface of the base plate 41S (the second surface 51b of the flat surface section 51) facing the outside of the base plate 41S. In the present embodiment, a gap S1 is formed between the flat surface section 51 of the base plate 41S and the metal plate 110 (see Fig. 8). The busbar 42 has an exposed section 42u, which is exposed towards the gap S1 (see Fig. 8). The exposed section 42u, for example, includes the entire connecting section 61 and at least part of the extending section 63. <4.3.3 Fastener>

[0084] Next, the fastening element 43 will be described.

[0085] Fig. 8 is a cross-sectional view along line F8-F8 of the in Fig. The structure shown in Figure 7. The fastening element 43 is a component for fixing the busbar 42 to the connecting component 20, which corresponds to the busbar 42. The fastening element 43 is, for example, a crimping bolt fixed to the busbar 42. The fastening element 43 is an example of a "fastening section".

[0086] In the present embodiment, the connecting section 61 and / or the connecting section 62 of the busbar 42 have a through-hole 42h. The through-hole 42h penetrates the busbar 42 in the Z-direction. The fastening element 43 is, for example, a bolt with a shank 43a and a head 43b. A circumferential surface of the shank 43a has a groove for the screw. The head 43b has a diameter larger than that of the shank 43a. The head 43b of the fastening element 43 is riveted and fixed to the busbar 42 in such a way that the shank 43a passes through the through-hole 42h of the busbar 42. With this fixing, the fastening element 43 is electrically and physically connected to the busbar 42, in a state in which the shaft 43a protrudes from the through hole 42h of the busbar 42 in the +Z direction.The fastening element 43 is not limited to fixing by riveting, but can also be fixed to the busbar 42 by welding or other methods.

[0087] In the present embodiment, the connecting component 20, having previously been fixed to the electronic component 10 via the fastening element 71, is attached to the fastening element 43 in the Z-direction. For example, in the connecting component 20, the shaft 43a of the fastening element 43 is inserted into the second fastening hole 22h of the second section 22. The coupling element 44 (for example, a nut) is connected to the shaft 43a of the fastening element 43, which protrudes from the second fastening hole 22h of the second section 22 of the connecting component 20. The coupling element 44 is attached to the shaft 43a in the Z-direction. This coupling secures the second section 22 of the connecting component 20 to the fastening element 43. (Heat transfer element)

[0088] First, the heat transfer element 120 is described.

[0089] The heat transfer element 120 is an element for transferring the heat generated by the electronic component 10 (for example, the electronic component 10S) at the time of energy supply and / or the heat generated by the busbar 42 itself at the time of energy supply (Joule heat) to the metal plate 110. The heat transfer element 120 is, for example, a heat transfer film (for example, a thermally conductive silicone film) that is elastic. The heat transfer element 120 consists, for example, of a material with a higher thermal conductivity than the base plate 41S (or the base element 41T, which will be described later). However, the heat transfer element 120 is not limited to the above example, but can also be a heat transfer element made of a thermally conductive gel or another material. In the present embodiment, the heat transfer element 120 has an insulating property.

[0090] In the present embodiment, the heat transfer element 120 is partially provided in the routing board 40S (see Fig. 2) For example, the heat transfer element 120 is arranged in a position that overlaps a portion of the busbar 42 as viewed from the Z-direction. The heat transfer element 120 is located between the busbar 42 and a flat surface section 111 of the metal plate 110, which will be described later. For example, the heat transfer element 120 is located between the exposed section 42u of the busbar 42 and the flat surface section 111 of the metal plate 110, and is in contact with both the exposed section 42u of the busbar 42 and the flat surface section 111 of the metal plate 110. The heat transfer element 120 transfers the heat transferred from the electronic component 10 (for example, the electronic component 10S) to the busbar 42 and / or the heat generated by the busbar 42 from the busbar 42 to the flat surface section 111 of the metal plate 110.

[0091] In the present embodiment, the heat transfer element 120 is arranged in a position that overlaps a portion of the busbar 42 near the electronic component 10 (for example, the electronic component 10S) when viewed from the Z-direction. In the present embodiment, the heat transfer element 120 is arranged in a position that overlaps the connecting component 20 when viewed from the Z-direction. In other words, the heat transfer element 120 is arranged in a position that overlaps the connecting section 61 or the connecting section 62 of the busbar 42 when viewed from the Z-direction. The heat transfer element 120 transfers the heat transferred from the electronic component 10S to the busbar 42 via the connecting component 20 from the busbar 42 to the flat surface section 111 of the metal plate 110.As described above, the second heat dissipation structure 42HDS2 overlaps the connecting component 20 and the heat transfer element 120 in the horizontal section 42p of the busbar 42 when viewed from the Z-direction. At this point, the heat transfer element 120 is in contact with the second heat dissipation structure 42HDS2. <4.4 Fixing structure of the installation board and electronic component>

[0092] Next, a fixing structure for the routing board 40S and the electronic component 10 is described.

[0093] Fig. 9 is a cross-sectional view along line F9-F9 of the in Fig. The structure shown in Figure 7. The metal plate 110, for example, has a fixing section 112 and a fixing section 113 in addition to a flat surface section 111, which will be described later.

[0094] The fixing section 112 is a section for fixing the base plate 41S to the metal plate 110. The fixing section 112 is located in a position corresponding to the fixing section 53 of the base plate 41S when viewed from the Z-direction. The fixing section 112 is a cylindrical or prismatic projection that extends in the +Z direction from the flat surface section 111 of the metal plate 110. The fixing section 112 has a coupling hole 112h that is open in the +Z direction. An inner circumferential surface of the coupling hole 112h has a groove for the screw.

[0095] As described above, the fixing section 53 of the base plate 41S has a mounting hole 53h. A fastening element 115 (for example, a screw or a bolt) passes through the mounting hole 53h. When the fastening element 115, which passes through the mounting hole 53h of the fixing section 53 of the base plate 41S, engages in the coupling hole 112h of the fixing section 112 of the metal plate 110, the base plate 41S is fixed to the metal plate 110.

[0096] The fixing section 113 is a fixing section for directly fixing the electronic component 10 (for example, the electronic component 10S) to the metal plate 110 without the base plate 41S being interposed. The fixing section 113 is located in a position corresponding to the mounting section 14 of the electronic component 10 when viewed from the Z-direction. The fixing section 113 is a cylindrical or prismatic projection that extends from the flat surface section 111 in the +Z direction. The fixing section 113 has a coupling hole 113h that is open in the +Z direction. An inner circumferential surface of the coupling hole 113h has a groove for the screw.

[0097] In the present embodiment, the flat surface section 51 of the base plate 41S has a through-hole 51h. The through-hole 51h penetrates the flat surface section 51 in the Z-direction. The through-hole 51h is located at a position corresponding to the fixing section 113 of the metal plate 110 when viewed from the Z-direction. The fixing section 113 of the metal plate 110 passes through the through-hole 51h of the base plate 41S and projects to the same position as the first surface 51a of the flat surface section 51 or closer to the side in the +Z direction than the first surface 51a of the flat surface section 51.The fastening section 14 of the electronic component 10 is in contact with the fixing section 113 at the same position as the first surface 51a of the flat surface section 51 or at a position closer to the side in the +Z direction than the first surface 51a of the flat surface section 51.

[0098] A fastening element 116 (for example, a screw or a bolt) passes laterally in the +Z direction through the fastening hole 14h of the fastening section 14 of the electronic component 10. When the fastening element 116, passing through the fastening hole 14h of the fastening section 14 of the electronic component 10, engages in the coupling hole 113h of the fixing section 113 of the metal plate 110, the electronic component 10 is fixed to the metal plate 110 without the base plate 41S being interposed. Note that instead of the above example, the electronic component 10 can be fixed to a fixing section provided in the base plate 41S. <5. Busbar form examples>

[0099] Next, examples of the form of busbar 42 will be described. <5.1 First example of a busbar design>

[0100] Fig. Figure 10 is a top view illustrating a first embodiment of the busbar 42. In the present embodiment, the busbar 42A is an example of a "first busbar". The connecting section 61 of the busbar 42A is an example of a "first connecting section". The extending section 63 of the busbar 42A has a first straight section 63a extending in the Y direction from the connecting section 61 of the busbar 42A, and a second straight section 63b angled from the first straight section 63a and extending in the X direction. The first straight section 63a of the busbar 42A is an example of a "first extending section". The connecting component 20A is an example of a "first connecting component".

[0101] The width W11 of the connecting section 61 of the busbar 42A in the X-direction is greater than the width W12 of the extending section 63 of the busbar 42A in the X-direction (for example, the width W12 of the first straight section 63a in the X-direction). In the present embodiment, the connecting section 61 and the first straight section 63a of the extending section 63 are accommodated in the receiving section 55. Within the receiving section 55, the width W11 of the connecting section 61 of the busbar 42A in the X-direction is greater than the width W12 of the extending section 63 of the busbar 42A in the X-direction. The width W11 is, for example, the minimum width of the connecting section 61 in the X-direction. The width W12 is, for example, the minimum width of the extending section 63 in the X direction (for example, the minimum width of the first straight section 63a in the X direction).

[0102] The clearance incorporated in the heat dissipation structure HDS increases the width of the connection section 61 (or connection section 62) connected to the electronic component 10, thereby improving the heat dissipation properties of the connection section 61 (or connection section 62). This structure makes it possible to suppress a local temperature rise in the connection section 61 (or connection section 62) compared to the extending section 63, and it is possible to improve the thermal properties of the electrical connection unit.

[0103] In the present embodiment, the width W12 (for example, the width W12 of the first straight section 63a in the X direction) of the extending section 63 of the busbar 42A in the X direction is equal to or less than a width W13 (see Fig. 7) of the connecting component 20A in the X-direction. In contrast, the width W11 of the connecting section 61 in the X-direction is greater than the width W13 of the connecting component 20A in the X-direction. The width W13 is, for example, the minimum width of the connecting component 20A in the X-direction.

[0104] The connecting segment 61 has an edge 61e1 extending in the Y direction and an edge 61e2 located in the X direction on the side opposite edge 61e1 and extending in the Y direction. Edge 61e1 is an example of a "first edge". Edge 61e2 is an example of a "second edge".

[0105] The extending section 63 (for example, the first straight section 63a) has an edge 63e1 extending in the Y direction and an edge 63e2 located in the X direction on the side opposite edge 63e1 and extending in the Y direction. Edge 63e1 is an example of a "third edge". Edge 63e2 is an example of a "fourth edge".

[0106] In the present embodiment, the edge 61e1 of the connecting section 61 and the edge 63e1 of the extending section 63 follow each other linearly in the Y direction. However, in the X direction, a step 42st is located between the edge 61e2 of the connecting section 61 and the edge 63e2 of the extending section 63.

[0107] Here, the second heat dissipation structure 42HDS2, located in the connecting section 61 (or the connecting section 62), and / or the first heat dissipation structure 41HDS 1, located in the extending section 63 (or the extension 64), can have a plurality of recesses or a plurality of protrusions to connect the edge 61e2 of the connecting section 61 (or the edge of the connecting section 62 in the X direction) and the edge 63e2 of the extending section 63 (or the edge of the extension 64 in the X direction). In a case where the busbar 42 has a heat dissipation structure with a plurality of recesses or a plurality of protrusions to connect the respective edges, a heat dissipation area of ​​a section exposed to the outside (for example, a step section formed between the edges like a step 42st) is simply enlarged.When viewed from the plate thickness direction, the step section is not located in a position that overlaps the electronic component 10, so the heat dissipation of the busbar 42 is simply enhanced in the step section.

[0108] For example, busbar 42B has two primary heat dissipation structures 42DHS1 with multiple recesses to connect the edges. Busbar 42C has a secondary heat dissipation structure 42HDS2 with multiple recesses to connect the edges.

[0109] In the present embodiment, the busbar 42B is an example of a "second busbar". The connecting section 61 of the busbar 42B is an example of a "second connecting section". The extending section 63 of the busbar 42B has a first straight section 63a extending in the Y direction from the connecting section 61 of the busbar 42B, and a second straight section 63b angled from the first straight section 63a and extending in the X direction. The first straight section 63a of the extending section 63 of the busbar 42B is an example of a "second extending section". The connecting component 20B is an example of a "second connecting component".

[0110] In the present embodiment, the width W21 of the connecting section 61 of the busbar 42B in the X-direction is greater than the width W22 of the extending section 63 of the busbar 42B in the X-direction (for example, the width W22 of the first straight section 63a in the X-direction). In the present embodiment, the connecting section 61 and the first straight section 63a of the extending section 63 are received in the receiving section 55. Within the receiving section 55, the width W21 of the connecting section 61 of the busbar 42B in the X-direction is greater than the width W22 of the extending section 63 of the busbar 42B in the X-direction. The width W21 is, for example, the minimum width of the connecting section 61 in the X-direction. The width W22 is, for example, the minimum width of the extending section 63 in the X direction (for example, the minimum width of the first straight section 63a in the X direction).

[0111] As in Fig. As shown in Figure 10, the connecting section 61 of busbar 42A and the connecting section 61 of busbar 42B lie side by side in the X-direction. The first straight section 63a of the extending section 63 of busbar 42A and the first straight section 63a of the extending section 63 of busbar 42B lie side by side in the X-direction. In the present embodiment, the connecting section 61 of busbar 42A projects outward on the side opposite busbar 42B (side in the -X-direction) with respect to the first straight section 63a of the extending section 63 of busbar 42A. Conversely, the connecting section 61 of busbar 42B projects outward on the side opposite busbar 42A (side in the +X-direction) with respect to the first straight section 63a of the extending section 63 of busbar 42B.

[0112] In the present embodiment, the width W11 of the connecting section 61 of the busbar 42A in the X-direction and the width W21 of the connecting section 61 of the busbar 42B in the X-direction are equal. However, the width W12 of the extending section 63 of the busbar 42A in the X-direction is less than the width W22 of the extending section 63 of the busbar 42B in the X-direction. For example, the busbar 42B has a greater heat dissipation or heat storage capacity than the busbar 42A.

[0113] In the present embodiment, the heat transfer element 120 has a size that extends over the connection section 61 of busbar 42A and the connection section 61 of busbar 42B. For example, the heat transfer element 120 overlaps the connection section 61 of busbar 42A and the connection section 61 of busbar 42B when viewed from the Z-direction. The heat transfer element 120 thermally connects busbar 42A to busbar 42B. Therefore, if the temperature of busbar 42B is lower than the temperature of busbar 42A, some of the heat from busbar 42A is transferred to busbar 42B via the heat transfer element 120. According to such a design, the heat dissipation properties of the electrical connection unit 1 can be further improved by heat equalization between the multiple busbars 42. <5.2 Second example of a busbar design>

[0114] Fig. Figure 11 is a top view illustrating a second embodiment of the busbar 42. In the present embodiment, the electronic component 10A is an example of a "first electronic component." The electronic component 10B is an example of a "second electronic component." The connecting section 61 of the busbar 42B is an example of a "first connecting section." The connecting section 62 of the busbar 42B is an example of a "second connecting section." In the present embodiment, the extending section 63 of the busbar 42B, for example, has a first straight section 63a, a second straight section 63b, and a third straight section 63c.

[0115] The first straight section 63a extends from connecting section 61 in a direction that differs from the direction from connecting section 61 of busbar 42B to the connecting section 62 with the shortest distance. For example, the first straight section 63a extends in the Y direction. The first straight section 63a is an example of a "first extending section".

[0116] The first straight section 63a has a first end (a first section) 63aa, which is connected to the connecting section 61, and a second end (a second section) 63ab, which is located on a side opposite the first end 63aa. For example, the first end 63aa is located on the side in the -Y direction with respect to the connecting section 62 in the extension direction (Y direction) of the first straight section 63a. Conversely, the second end 63ab is located on the side opposite the first end 63aa (side in the +Y direction) with respect to the connecting section 62 in the extension direction (Y direction) of the first straight section 63a.

[0117] In the present embodiment, at least a part of the first straight section 63a overlaps the electronic component 10A in the Z-direction. For example, the first straight section 63a extends over the region R that overlaps the electronic component 10A as seen from the Z-direction, over the side in the -Y-direction and the side in the +Y-direction of region R.

[0118] The second straight section 63b extends from the second end 63ab of the first straight section 63a in a direction approaching the connecting section 62. However, for example, the second straight section 63b extends from the second end 63ab in a direction different from the direction from the second end 63ab of the first straight section 63a to the connecting section 62 of the busbar 42B with the shortest distance. For example, the second straight section 63b is angled from the first straight section 63a and extends in the X direction. The second straight section 63b is an example of a "second extending section". The second straight section 63b does not overlap any electronic component 10 viewed from the Z direction.

[0119] The third straight section 63c extends from the second straight section 63b to the connecting section 62 of busbar 42B. The third straight section 63c extends, for example, in the Y-direction. In other words, the third straight section 63c extends parallel to the first straight section 63a. The third straight section 63c is an example of a "third extending section".

[0120] In the present embodiment, the connecting section 61, the connecting section 62, the first straight section 63a, the second straight section 63b, and the third straight section 63c of the busbar 42B are contained within the horizontal plate section 42p and are located in the same plane. The connecting section 61, the connecting section 62, the first straight section 63a, the second straight section 63b, and the third straight section 63c of the busbar 42B are, for example, accommodated within the receiving section 55.

[0121] In the present embodiment, the width W23 of the second straight section 63b of the busbar 42B in the Y-direction is greater than the width W22 of the first straight section 63a of the busbar 42B in the X-direction. The width W22 is, for example, the width in the X-direction of a section of the busbar 42B in region R that overlaps the electronic component 10A as viewed from the Z-direction. The width W22 is, for example, the minimum width of the first straight section 63a in the X-direction. The width W23 is, for example, the minimum width of the second straight section 63b in the Y-direction.

[0122] In the present embodiment, the first straight section 63a is at least partially (for example, entirely) and the second straight section 63b is at least partially (for example, entirely) enclosed within the receiving section 55. Within the receiving section 55, the width W23 of the second straight section 63b in the Y direction is greater than the width W22 of the first straight section 63a in the X direction.

[0123] From another perspective, in the present embodiment the width W23 of the second straight section 63b of the busbar 42B in the Y direction is greater than the width W13 (see Fig. 7) of the connecting component 20B in the X direction. <6. Structure of the SUT subunit>

[0124] Next, the structure of the SUT subunit will be described.

[0125] Fig. Figure 12 is a perspective view depicting the subunit SUT. The subunit SUT contains, for example, a plurality of electronic components 10, a routing structure 40T, and an auxiliary basic element 101 (see Figure 12). Fig. 16) and a metal section 90 (see Fig. 14). <6.1 Electronic Component>

[0126] First, the electronic component 10 is described. The majority of electronic components 10 contain a majority of electronic components 10TA (only one is in Fig. 12 shown) and a plurality of electronic components 10TB (only one is in Fig. 12 shown). Note that the majority of electronic components 10 may also only contain the electronic component 10TA or the electronic component 10TB.

[0127] Electronic component 10TA is an example of electronic component 10T described above. Electronic component 10TA generates less heat than electronic component 10S when power is supplied. Electronic component 10TB, on the other hand, is another example of electronic component 10T described above. Electronic component 10TB is less easily mounted (requiring, for example, a more complex implementation structure) than electronic component 10S. For instance, electronic component 10TB has a terminal 13 that protrudes in the -Z direction towards the flat surface section 111 of the metal plate 110 (see Fig. 16). For example, the electronic component 10TB generates less heat when power is supplied than the electronic component 10S.

[0128] If electronic component 10TA and electronic component 10TB are not distinguished, the electronic components will be referred to simply as "electronic component 10T" in the following. Electronic component 10T could be, for example, a connector, a fuse, a capacitor, a branching component, any of several different sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit in which two or more of these components are combined. However, the nature of electronic component 10T is not limited to the above example.

[0129] Fig. Figure 13 is a front view depicting the electronic component 10TA. The electronic component 10TA is, for example, an electronic component in which a plurality of terminals 13 are arranged separately at both ends of the electronic component 10TA in a horizontal direction. In the present embodiment, terminal 13A and terminal 13B are arranged separately at both ends of the electronic component 10TA in the Y-direction. Terminals 13A and 13B project horizontally (for example, in the +Y-direction or -Y-direction) from the center of the housing 11 in the Z-direction. Each terminal 13 has a mounting hole 13h through which a fastening element 43 (e.g., a screw or a bolt) passes. The mounting hole 13h is open in the Z-direction. <6.2 Laying structure>

[0130] Next, with further reference to Fig. 12. The routing structure 40T is described. The routing structure 40T is a component that forms at least part of a power supply path between the plurality of electronic components 10 (for example, the plurality of electronic components 10T) and / or at least part of a power supply path between the electronic component 10 contained in the subunit SUT (for example, the electronic component 10T) and the electronic component 10 contained in another subunit SU (for example, the subunit SUS). The routing structure 40T has, for example, a base element 41T, one or more (for example, a plurality of) busbars 42, and a plurality of fastening elements 43. Note that the details of the fastening element 43 are similar to those of the fastening element 43 described in the subunit SUS, which is why a further description is omitted. <6.2.1 Basic element>

[0131] Fig. Figure 14 is a perspective view showing the base element 41T. The base element 41T is a support element that integrally carries the plurality of busbars 42 arranged at intervals in a horizontal direction. The base element 41T is made, for example, of a synthetic resin and has insulating properties. The base element 41T electrically insulates the plurality of busbars 42 from each other, for example, by means of a rib (not shown). The base element 41T can also be referred to as an "insulating substrate." The base element 41T has a three-dimensional structure that is thicker in the Z-direction than the base plate 41S contained in the subunit SUS. The base element 41T has, for example, a support wall 81, a frame section 85 (a circumferential wall section), and a fixing section 87. (Support wall)

[0132] The support wall 81, for example, is a plate-shaped wall section designed to run horizontally. The majority of busbars 42 are arranged on the support wall 81 and are supported from below by the support wall 81 (see Fig. 12) The support wall 81, which supports the busbar 42, is not limited to a horizontally oriented wall section, but can also be a grid-like wall section consisting of a plurality of ribs extending in the Z direction. In the present embodiment, the fastening element 43 is attached to the support wall 81. The fastening element 43 projects from the support wall 81 in the +Z direction. (Recording section for recording an electronic component)

[0133] In the present embodiment, the base element 41T has a receiving section 84A that is open laterally in the +Z direction. The receiving section 84A is, for example, a recess in which a portion of the support wall 81 is recessed in the Z direction, or a through-hole that penetrates the support wall 81 in the Z direction. The receiving section 84A has an outer shape that, viewed from the Z direction, corresponds to the shape of the housing 11 (i.e., the component body 12) of the electronic component 10 (for example, the electronic component 10T). At least a portion of the electronic component 10 (for example, the electronic component 10T) (for example, at least a portion of the component body 12) is received in the receiving section 84A. At least a portion of the electronic component 10 received in the receiving section 84A is located laterally in the -Z direction relative to the support wall 81. (Recording section for recording the metal section)

[0134] In the present embodiment, the base element 41T has a receiving section 84B that is open laterally in the +Z direction. The receiving section 84B is, for example, a recess in which a portion of the support wall 81 is recessed in the Z direction, or a through-hole that penetrates the support wall 81 in the Z direction. The receiving section 84B has an outer shape that, viewed from the Z direction, corresponds to the shape of the metal section 90, which will be described later. At least a portion of the metal section 90 is received in the receiving section 84B. At least a portion of the metal section 90 received in the receiving section 84B is located laterally in the -Z direction relative to the support wall 81. (Frame section)

[0135] Frame section 85 is provided at one circumferential end of the base element 41T. Frame section 85 is a rib (circumferential wall section) that extends in the Z-direction at the circumferential end of the base element 41T. For example, the width (thickness) H21 of frame section 85 (circumferential wall section) in the Z-direction is half or more of the width (thickness) H22 of electronic component 10 (for example, electronic component 10TA) in the Z-direction (see Fig. 16). Note that section 85 of the framework may be omitted. (Fixation section)

[0136] The fixing section 87 is a section that is fixed to the metal plate 110 (see Fig. 16) The fixing section 87 faces the fixing section 112 of the metal plate 110 in the Z-direction. The fixing section 87 has a mounting hole 87h that penetrates the base element 41T in the Z-direction. A fastening element 115 (for example, a screw or a bolt) passes through the mounting hole 87h. When the fastening element 115, passing through the mounting hole 87h, engages in the coupling hole 112h of the fixing section 112 of the metal plate 110, the base element 41T is fixed to the metal plate 110. <6.2.2 Busbar>

[0137] Next, the busbar 42 contained in the installation structure 40T will be described.

[0138] Fig. Figure 15 is a top view showing the routing structure 40T. The busbar 42 is a routing element (electrical connection element) contained within the routing structure 40T. The busbar 42 is, for example, a routing element for electrically connecting a plurality of electronic components 10 (for example, a plurality of electronic components 10T). Alternatively, the busbar 42 can also be a routing element for connecting the electronic component 10 (for example, the electronic component 10T) to the electronic component 10 contained in another subunit SU (for example, the subunit SUS). In the present embodiment, the plurality of busbars 42 are supported from below by the base element 41T and are arranged at positions remote from the metal plate 110. The busbar 42 is, for example, arranged directly below the terminal 13 of the electronic component 10.The busbar 42 overlaps the component body 12 of the electronic component 10 as seen from the X-direction or the Y-direction (see . Fig. 17).

[0139] The plurality of busbars 42, for example, contains four busbars 42E, 42F, 42G, and 42I. The four busbars 42E, 42F, 42G, and 42I are arranged at intervals in the horizontal direction. The four busbars 42E, 42F, 42G, and 42I contain sections arranged in the same plane. At least one part of each busbar 42 is the horizontal plate section 42p. In the present embodiment, each busbar 42 has a plate shape extending horizontally over its entire length. The horizontal plate section 42p of each busbar 42 contains the connecting section 61, the connecting section 62, and the extending section 63. In the present embodiment, the subunit SUT contains an electronic component 10D as one of the plurality of electronic components 10T.

[0140] The connecting section 61 of busbar 42E is connected to busbar 42 contained in subunit SUS. Similarly, connecting section 61 of busbar 42F is connected to busbar 42 contained in subunit SUS. Connecting section 62 of busbar 42F is physically and electrically connected to terminal 13A of electronic component 10D. For example, terminal 13A of electronic component 10D is located on the horizontal plate section 42p of busbar 42F to be connected to connecting section 62 of busbar 42F.

[0141] The connecting section 61 of busbar 42G is physically and electrically connected to terminal 13B of electronic component 10D. For example, terminal 13B of electronic component 10D is located on the horizontal plate section 42p of busbar 42G to be connected to connecting section 61 of busbar 42G. Connecting section 61 of busbar 42G is an example of a "first connecting section". Connecting section 62 of busbar 42G is physically and electrically connected to the external connecting busbar 76. Connecting section 62 of busbar 42G is connected to an external device via busbar 76. Connecting section 62 of busbar 42G is an example of a "second connecting section". Busbar 76 is an example of an "external connecting component".Note that the connecting section 62 of the busbar 42G may be physically and electrically connected to the terminal 13 of another electronic component 10 instead of the busbar 76.

[0142] The connecting section 61 of busbar 42I is connected to busbar 42 contained in subunit SUS. The connecting section 62 of busbar 42I is physically and electrically connected to terminal 13A of electronic component 10T (not shown). <6.3 Auxiliary Element>

[0143] Next, the auxiliary basic element 101 will be described.

[0144] Fig. 16 is a cross-sectional view along line F16-F16 of the in Fig. The structure shown in Figure 15 is as follows. The auxiliary base element 101 consists, for example, of a synthetic resin and has insulating properties. A plurality of wires 102 are provided on the surface of the auxiliary base element 101. The wiring 102 is, for example, a conductive layer (metal layer) provided on the surface of the auxiliary base element 101. The auxiliary base element 101 is arranged in the Z-direction between the base element 41T and the flat surface section 111 of the metal plate 110. The auxiliary base element 101 faces the electronic component 10TB from the side in the -Z-direction. The terminal 13 of the electronic component 10TB is electrically connected to the wiring 102 provided on the auxiliary base element 101 at a position between the base element 41T and the flat surface section 111 of the metal plate 110. The auxiliary base element 101 is an example of a "third base element". <6.4 Metal Section>

[0145] Next, section 90 of the metals will be discussed with reference to Fig. 14 described. The metal section 90, for example, is a structure that reduces thermal disturbances from an external device to the electronic component 10 contained in the subunit SUT.

[0146] The metal section 90 is, for example, a heat transfer section that transfers a portion of the heat directed from an external device to the electronic component 10 (for example, the electronic component 10T) via the busbar 76 to the flat surface section 111 of the metal plate 110, which will be described later. Alternatively, the metal section 90 can be a heat transfer section that transfers at least a portion of the heat generated by the electronic component 10 and / or at least a portion of the heat generated by the busbar 42 itself to the flat surface section 111 of the metal plate 110. The flat surface section 111 of the metal plate 110 is located away from the busbar 42 in the Z-direction. The flat surface section 111 of the metal plate 110 faces the busbar 42 in the Z-direction.The flat surface section 111 of the metal plate 110 is an example of a “facing section”.

[0147] The metal section 90, for example, is a heat storage element (heat-absorbing element) that increases the heat capacity of the energy supply path contained in the subunit SUT. The metal section 90 stores (absorbs) some of the heat transferred from an external device, for example via the busbar 76, to the electronic component 10 (for example, the electronic component 10T). Alternatively, the metal section 90 can store (absorb) at least some of the heat generated by the electronic component 10 and / or at least some of the heat generated by the busbar 42 itself. When the metal section 90 is used as a heat storage element, it does not need to be thermally connected to the metal plate 110.

[0148] Fig. 17 is a cross-sectional view along line F17-F17 of the in Fig. 15 depicted structure. Fig. 18 is a cross-sectional view along line F18-F18 of the in Fig. The structure shown in Figure 15 is shown. In the present embodiment, the metal section 90 is provided separately from the metal plate 110. The metal section 90 is, for example, a solid metal block. The shape of the metal section 90 is not limited to the example above. The metal section 90 can be an element with an I-shaped, L-shaped, or C-shaped cross-sectional shape. The metal section 90 can be formed integrally with the base element 41T by insert forming.

[0149] The thickness H31 of the metal section 90 in the Z-direction is greater than the thickness T1 of the horizontal plate section 42p of the busbar 42 in the Z-direction. For example, the thickness H31 of the metal section 90 in the Z-direction is twice or more the thickness T1 of the horizontal plate section 42p of the busbar 42 in the Z-direction.

[0150] In the present embodiment, the width W31 of the metal section 90 in the X direction is greater than the width W32 of the electronic component 10 in the X direction (see Fig. 15). From another perspective, the width W31 (see Fig. 15) of the metal section 90 in the X direction greater than the above thickness H31 (see Fig. 18) of the metal section 90 in the Z direction.

[0151] In the present embodiment, the base element 41T is arranged between the busbar 42 and the flat surface section 111 of the metal plate 110. The base element 41T has a receiving section 84B, which is open in the Z direction. At least a part of the metal section 90 is received in the receiving section 84B.

[0152] The metal section 90 is arranged in the Z-direction between the busbar 42 and the flat surface section 111 of the metal plate 110. The metal section 90 faces the busbar 42 from the Z-direction and is thermally connected to the busbar 42.

[0153] In the present embodiment, the metal section 90 is arranged, for example, between the extending section 63 of the busbar 42 and the flat surface section 111 of the metal plate 110. The metal section 90 faces the extending section 63 of the busbar 42 from the Z-direction and is thermally connected to the extending section 63 of the busbar 42.

[0154] In the present embodiment, the metal section 90 has a coupling hole 90h that is open in the +Z direction. The inner circumferential surface of the coupling hole 90h has a groove for the screw. The extending section 63 of the busbar 42 has a through-hole 42h that faces the coupling hole 90h. A fastening element 117 (for example, a screw or a bolt) passes through the through-hole 42h of the busbar 42 from the side in the +Z direction. When the fastening element 117, which passes through the through-hole 42h of the busbar 42, engages in the coupling hole 90h of the metal section 90, the extending section 63 of the busbar 42 is fixed to the metal section 90.

[0155] In the present embodiment, the heat transfer element 120 is arranged between the metal section 90 and the flat surface section 111 of the metal plate 110. Instead of / in addition to the above example, the heat transfer element 120 can be arranged between the metal section 90 and the busbar 42.

[0156] As in Fig. As shown in Figure 15, the metal section 90, viewed from the Z-direction, is located between the terminal 13B of the electronic component 10 and the external connecting busbar 76. Therefore, heat directed from the busbar 76 towards the electronic component 10 passes through the busbar 42 directly to the metal section 90 before reaching the electronic component 10.

[0157] The metal section 90, for example, contains a first section 91 and a second section 92. Viewed from the Z-direction, the first section 91 is located on the side in the +Y direction relative to terminal 13B of the electronic component 10. Viewed from the Z-direction, the second section 92 is located on the side in the -X direction or the side in the +X direction relative to terminal 13B of the electronic component 10. The first section 91 and the second section 92 are formed in one piece. This design makes it easy to achieve a larger volume for the metal section 90 compared to a metal section 90 with a rectangular parallelepiped shape. <7. Coupling structure of the subunit>

[0158] Next, a coupling structure between the majority of subunits SU is described.

[0159] Fig. Figure 19 is a perspective view showing a coupling structure between subunit SUS and subunit SUT. In the present embodiment, a step ST is formed between subunit SUS and subunit SUT, based on a height difference in the Z-direction between the base plate 41S of subunit SUS and the base element 41T of subunit SUT. The step ST creates a cross-sectional structure in which the busbar 42 contained in subunit SUS and the busbar 42 contained in subunit SUT intersect three-dimensionally.

[0160] For example, the busbars 42E, 42F, and 42I contained in the subunit SUT maintain the height supported by the base element 41T in the Z-direction and extend in the -Y-direction to a position that overlaps the base plate 41S of the subunit SUS in the Z-direction. The connecting section 61 of each busbar 42E, 42F, and 42I is separated from the base plate 41S of the subunit SUS in the Z-direction and faces the base plate 41S of the subunit SUS in the Z-direction.

[0161] In contrast, the connecting section 62 of the busbar 42A contained in the subunit SUS is raised in the +Z direction relative to the extending section 63 of the busbar 42A and is in contact with the connecting section 61 of the busbar 42E from the side in the -Z direction. The connecting section 62 of the busbar 42A and the connecting section 61 of the busbar 42E are fixed by the fastening element 43 and the coupling element 44.

[0162] Similarly, the connecting section 62 of the busbar 42C contained in the subunit SUS is raised in the +Z direction relative to the extending section 63 of the busbar 42C and is in contact with the connecting section 61 of the busbar 42I from the side in the -Z direction. The connecting section 62 of the busbar 42C and the connecting section 61 of the busbar 42I are fixed by the fastening element 43 and the coupling element 44.

[0163] The extending section 63 of the busbar 42D contained in the subunit SUS extends in the X direction between the flat surface section 111 of the metal plate 110 and the busbar 42I. For example, the extending section 63 of the busbar 42D passes through a region that overlaps the busbar 42I as viewed from the Z direction and extends across the side in the +X direction and the side in the -X direction of the busbar 42I. The connecting section 62 of the busbar 42D is raised in the +Z direction with respect to the extending section 63 of the busbar 42D and is in contact with the connecting section 61 of the busbar 42F from the side in the -Z direction. The connecting section 62 of the busbar 42D and the connecting section 61 of the busbar 42F are fixed by the fastening element 43 and the coupling element 44.

[0164] Between subunit SUS and subunit SUT, a sufficient space for easy airflow is ensured above the routing board 40S (routing board 40SB) due to a height difference in the Z-direction between the first base element (e.g., base plate 41S) of subunit SUS and the second base element (e.g., base element 41T) of subunit SUT. Since the heat dissipation structure 42HDS is provided in the busbar contained in the routing board 40S, the heat dissipation properties of the electrical connection unit 1 in the first area R1 are improved at this point. <8. Extending structure of the busbar>

[0165] Fig. 20 is a cross-sectional view along the line F20-F20 of the in Fig. The structure shown in Figure 15 is described. In the present embodiment, a busbar 42 (busbar 42K) is arranged between the base element 41T and the flat surface section 111 of the metal plate 110 and extends in the Y direction in a gap S2 between the base element 41T and the flat surface section 111 of the metal plate 110. The busbar 42K extends, for example, over the side in the -Y direction and the side in the +Y direction of the base element 41T. The connecting section 61 of the busbar 42K is physically and electrically connected to the busbar 42 contained in the subunit SUS. The connecting section 62 of the busbar 42K is physically and electrically connected to the external connecting busbar 76. The busbar 42K is an example of a "third busbar". <9. Metal plate and insulating cover>

[0166] Next, with further reference to Fig. 2 the metal plate 110 and the insulating cover 130 are described. <9.1 Metal plate>

[0167] The metal plate 110 is an element for ensuring the rigidity of the electrical connection unit 1 and for improving its heat dissipation properties. The metal plate 110 is made of metal (for example, aluminum or an aluminum alloy). The metal plate 110 is an example of a "rigid element." The metal plate 110 can also be referred to as a "metal element" or a "heat dissipation element." The metal plate 110 faces the busbar 42 from the side opposite the connection component 20.

[0168] The metal plate 110 has a rectangular shape formed in the X and Y directions. The metal plate 110 has a first end 110e1, a second end 110e2, a third end 110e3, and a fourth end 110e4. The first end 110e1 and the second end 110e2 are a pair of ends of the metal plate 110 in the longitudinal direction, separated from each other in the X direction. The third end 110e3 and the fourth end 110e4 are a pair of ends of the metal plate 110 in the lateral direction, separated from each other in the Y direction. The metal plate 110 contains, for example, the flat surface section 111 and the plurality of fixing sections 112 described above (see Fig. 9) and the majority of fixing sections 113 described above (see Fig. 9).

[0169] The flat surface section 111 is a section formed in the metal plate 110 in a plate-like shape. The flat surface section 111 is plate-like in the horizontal direction. The flat surface section 111 forms a main section of the metal plate 110. The flat surface section 111 forms a base section (metal base section) of the metal plate 110. The flat surface section 111 is large enough to cover the two subunits SU from below.

[0170] In the present embodiment, the flat surface section 111 has a first region A1 and a second region A2. The first region A1 is, for example, a region on the side in the -Y direction of the flat surface section 111. The subunit SUS described above faces the first region A1 of the flat surface section 111 when viewed from the Z direction. That is, the majority of electronic components 10S and the base plate 41S contained in the subunit SUS face the first region A1 of the flat surface section 111 in the Z direction.

[0171] The second region A2, for example, is a region on the side in the +Y direction of the flat surface section 111. The subunit SUT described above faces the second region A2 of the flat surface section 111 when viewed from the Z direction. That is, the majority of electronic components 10T and the basic element 41T contained in the subunit SUT face the second region A2 of the flat surface section 111 in the Z direction. <9.2 Insulating cover>

[0172] The insulating cover 130 is a component that prevents a user's finger from coming into contact with the power supply path of the subunit SU. The insulating cover 130 is made, for example, of a synthetic resin and has insulating properties. The insulating cover 130 has, for example, a box-shaped form that is open on the side in the -Z direction. The insulating cover 130 has multiple ventilation holes 130h. The insulating cover 130 partially or completely covers the corresponding subunit SU. Note that the insulating cover 130 is not limited to a box-shaped form; it can also be a sheet-metal element that covers the power supply path of the main body MU. The insulating cover 130 can be omitted. <10. Advantages> <A. Vorteile bezüglich des Vorsehens einer Wärmeableitungsstruktur in einer Sammelschiene einer elektrischen Verbindungseinheit>

[0173] As a comparative example, consider a setup in which heat generated in an electronic component is transferred to a heat dissipation element via a busbar. In such a setup, the busbar can store heat during the transfer process, and an improvement in the busbar's heat dissipation properties may be necessary.

[0174] On the other hand, the busbar of the present embodiment is a busbar with a plate section (for example, the horizontal plate section 42p). The surface of the plate section has the heat dissipation structure 42HDS (the first heat dissipation structure 42HDS1 and the second heat dissipation structure 42HDS2) with at least one of a plurality of recesses and a plurality of projections.

[0175] According to this design, since the surface of the plate section has the heat dissipation structure 42HDS, the heat dissipation area of ​​the busbar 42 is simply increased. Therefore, it is possible to provide a busbar that is able to improve its heat dissipation properties.

[0176] In the present embodiment, the heat dissipation structure 42HDS has a plurality of grooves extending linearly as a plurality of depressions. According to such a design, a lower surface of the electronic component 10 or the like, which is placed on the busbar 42, can be used.

[0177] In the present embodiment, the plate section comprises the connecting section 61, which is connected to the electronic component 10 directly or via the connecting component 20, and the extending section 63, which extends from the connecting section 61. In a case where the thickness direction of the plate section is a first direction (for example, the Z direction), the extension direction of the extending section 63 is a second direction (for example, the Y direction), and a direction intersecting the first and second directions is a third direction (for example, the X direction), the following relationship between the first region 42R1 and the second region 42R2 is satisfied.The plate section has a first area 42R1, which is provided with the plurality of depressions, and a second area 42R2, which is adjacent to the first area 42R1 in one direction (e.g., the Y-direction) and does not have the plurality of depressions. In the other direction (e.g., the X-direction), the width of the first area 42R1 is greater than the width of the second area 42R2. According to this design, since the first area 42R1 is provided with the plurality of depressions and is a clearance area, it is less likely that the cross-sectional area of ​​the plate section will change before and after depressions are provided in the plate section.Therefore, it is less likely that the electrical resistance of busbar 42 will change, and replacing the existing busbar with busbar 42 is easy.

[0178] In the present embodiment, the electrical connection unit 1 comprises the busbar 42 mentioned above and the electronic component 10, which is electrically connected to the busbar 42. According to this design, since the surface of the plate section has the heat dissipation structure 42HDS, the heat dissipation area of ​​the busbar 42 is simply increased. Therefore, it is possible to provide the electrical connection unit, which is capable of improving the heat dissipation properties.

[0179] The present embodiment comprises a connecting component 20, which connects the electronic component 10 and the busbar 42, a heat dissipation element (for example, a metal plate 110), and a heat transfer element 120, which has elasticity. The heat dissipation element faces the busbar 42 on the side opposite the connecting component 2. The heat transfer element 120 is arranged between the heat dissipation element and the busbar. The plate section has a first surface 42a1 and a second surface 42a2. The first surface 42a1 faces the connecting component 20. The second surface 42a2 is located on the side opposite the first surface 42a1 and faces the heat transfer element 120. The heat dissipation structure 42HDS (for example, the second heat dissipation structure 42HDS2) is provided in the second surface 42a2 and is in contact with the heat transfer element 120.According to this configuration, the heat transfer element 120 is in contact with the second heat dissipation structure HDS2. Since the second heat dissipation structure HDS2 has at least one of a plurality of recesses and a plurality of projections, it is easy to extend the contact area with the heat transfer element 120. Therefore, the heat transfer element 120 simply transfers the heat transferred from the electronic component 10 to the busbar 42 and / or the heat generated by the busbar 42 to the heat dissipation element.

[0180] In the present embodiment, the connecting component 20, the heat transfer element 120, and the heat dissipation structure 42HDS (for example, the second heat dissipation structure 42HDS2) overlap when viewed from the first direction (for example, the Z-direction), which is the thickness direction of the plate section. According to this configuration, the heat transfer element 120 is in sufficient contact with the second heat dissipation structure 42HDS2. Therefore, the heat transfer element 120 more easily transfers the heat transferred from the electronic component 10 to the busbar 42 and / or the heat generated by the busbar 42 to the heat dissipation element.

[0181] In the present embodiment, the plate section has the first surface 42a1, which faces the electronic component 10. The heat dissipation structure 42HDS (for example, the first heat dissipation structure 42HDS1) is provided in the first surface 42a1. According to such a design, it is easy to extend the heat dissipation area of ​​the busbar 42 by means of the first surface 42a1 on the side of the electronic component 10.

[0182] In the present embodiment, the plate section, viewed from the first direction (e.g., the Z-direction), which is the thickness direction of the plate section, extends through the area R that overlaps the electronic component 10. According to such a configuration, in which the heat dissipation structure 42HDS (e.g., the first heat dissipation structure 42HDS1) is provided in a section of the plate section that overlaps the electronic component 10 when viewed from the first direction, it is easy to extend the heat dissipation area of ​​the busbar 42 by means of the lower surface of the electronic component 10. <B. Vorteile im Zusammenhang mit der Aufteilung in eine Mehrzahl von Regionen in der elektrischen Verbindungseinheit>

[0183] As a comparative example, consider a setup in which an electronic component where heat dissipation is a priority and an electronic component where ease of mounting is a priority are attached to a base element. If a base element with a predetermined thickness is chosen, improving the heat dissipation properties of such a setup can be difficult.

[0184] In contrast, the electrical connection unit (for example, the electrical connection unit 1) of the present embodiment comprises a rigid element (for example, the metal plate 110), a first electronic component (for example, the electronic component 10S), a first base element (for example, the base plate 41S), and a first busbar (for example, the busbars 42A, 42B, 42C, and 42D). A second electronic component (for example, the electronic component 10T), a second base element (for example, the base element 41T), and a second busbar (for example, the busbars 42E, 42F, 42G, and 42I) are also included. The rigid element has a first region (for example, the first region A1) and a second region (for example, the second region A2). The first electronic component faces the first region in the first direction.The first basic element faces the first region in the first direction, has a flat surface section (for example, the flat surface section 51), and possesses insulating properties. The first busbar is supported by the flat surface section and is electrically connected to the first electronic component. The second electronic component faces the second region in the first direction and generates less heat than the first electronic component. The second basic element faces the second region in the first direction, has a thicker three-dimensional structure in the first direction than the first basic element, and possesses insulating properties. The second busbar is supported by the second basic element and is electrically connected to the second electronic component.

[0185] According to this design, by using the first basic element with the flat surface section, it is possible to position the first electronic component, where heat dissipation is paramount, near the rigid element, thus enhancing heat dissipation with the rigid element acting as a heat sink. Conversely, by using the second basic element with its thick, three-dimensional structure in the first direction, it is possible to mount the second electronic component, where ease of assembly is paramount, appropriately. By correctly utilizing these areas, it is possible to provide an electrical connection unit that achieves both improved heat dissipation and ease of assembly. <11. Modification Examples>

[0186] The following are some modification examples. Note that a different setup than the one described below in each modification example corresponds to the setup of the embodiment described above. (First modification example)

[0187] The routing board 40S is not limited to a structure in which the base plate 41S and the busbar 42 are integrated by insert forming. For example, the busbar 42 can be positioned in the receiving section 55 after the base plate 41S, which provides the receiving section 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 can be fitted to the receiving section 55 or fixed to the receiving section 55 by an adhesive or other fastener. In these cases, potting can be performed to fill any gap between the busbar 42 and the receiving section 55. (Second modification example)

[0188] The basic element of the busbar 40S is not limited to the base plate 41S with the plate-shaped, flat surface section 51. The busbar 40S can be a basic element (for example, an insulating foil) with a sheet-shaped, flat surface section 51. In this case, the receiving section 55 can be formed by a portion of the flat surface section 51 that follows the outer shape of the busbar 42. In the present disclosure, the term "sheet-shaped" or "sheet" is not limited to an element with a thickness of 1 mm or more, and an element (a so-called foil) with a thickness of less than 1 mm can also be used. (Third modification example)

[0189] The base plate 41S of the installation board 40S can contain a plurality of elements (plate elements or sheet metal elements). These elements are provided to accommodate the plurality of busbars 42, which are arranged horizontally. For example, the plurality of elements are integrated by joining the plurality of busbars 42 together, for instance, by laminate forming. The plurality of elements forms the flat surface section 51. In this case, the receiving section 55 can be formed in a hollow shape within the base plate 41S (between the plurality of elements). The plurality of elements can be a plurality of plate elements, a plurality of sheet metal elements, or a combination of a plate element and a sheet metal element. The plate element can, for example, be a flexible plate element.The flat surface section 51 formed from the plurality of elements has an opening through which at least the first connecting section 61 and the second connecting section 62 of the busbar 42 are exposed.

[0190] When the plurality of elements are integrated by accommodating the plurality of busbars 42 between them, for example by laminate forming, a synergistic effect with the heat dissipation structure 42HDS of the busbar 42 in the present disclosure is expected. In particular, the recessed section or the projecting section provided in the first region 42R1 of the heat dissipation structure 42HDS simply engages with the plurality of elements. Therefore, the position of the busbar 42 in the horizontal direction is simply restricted. Thus, the routing board 40S can simply ensure an insulating property between the plurality of busbars 42. (Fourth modification example)

[0191] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting component 20. The electronic component 10 can be connected directly to the busbar 42 by means of a fastening element (for example, a bolt or a screw), by welding, or similar means. (Fifth modification example)

[0192] The busbar 42 described above with the heat dissipation structure 42HDS can be provided in the installation structure 40T instead of the installation board 40S. (Sixth modification example)

[0193] In the heat dissipation structure 42HDS, the first heat dissipation structure 42HDS 1 has a plurality of depressions, and the second heat dissipation structure 42HDS2 has a plurality of depressions. On the other hand, in the present modification example, one of the first heat dissipation structure 42HDS 1 and the second heat dissipation structure 42HDS2 can have a plurality of depressions, and the other of the first heat dissipation structure 42HDS 1 and the second heat dissipation structure 42HDS2 can have a plurality of protrusions.

[0194] Several embodiments and modification examples have been described above. However, the embodiment and modification examples are not limited to those described above. For example, most of the modification examples described above can be implemented in combination. [List of reference symbols] 1 electrical connection unit SU, SUS, SUT subunit 10, 10S, 10T, 10TA, 10TB electronic component 13, 13A, 13B connection 20 connection components 40S routing board 40T laying structure 41S Base plate 41T basic element 42 busbar 42HDS heat dissipation structure 42HDS1 first heat dissipation structure 42HDS2 second heat dissipation structure 42R1 first section 42R2 second area 42a1 first surface 42a2 second surface 51 flat surface section 52 Frame section 55 Recording section 61 Connecting section 62 Connecting section 63 extending section 63a first straight section 63aa first end (first section) 63ab second end (second section) 63b second even section 63c third even section 84A, 84B Recording section 85 Frame section 90 Metal section 101 Auxiliary basic element 102 Wiring 110 Metal plate (rigid element, metal element, heat dissipation element) 111 flat surface section (facing section) 120 Heat transfer element

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