Superconducting wire

Abstract

A superconducting wire (10) comprises a substrate (1) and a superconducting material layer (5). The substrate (1) has a first principal surface (1a) and a second principal surface (1b) opposite the first principal surface (1a). The superconducting material layer (5) is arranged on the first principal surface (1a). Along at least a portion of the superconducting wire (10) in a direction in which the superconducting wire (10) extends, the superconducting material layer (5) is arranged such that it covers a side surface of the substrate (1) in a lateral direction of the substrate (1) and covers at least a portion of the second principal surface (1b). The thickness of the superconducting material layer (5) located on the first principal surface (1a) varies along the lateral direction.A maximum thickness of the superconducting material layer (5) located on the second principal surface (1b) is smaller than a maximum thickness of the superconducting material layer (5) located on the first principal surface (1a).

Description

TECHNICAL AREA

[0001] The present invention relates to a superconducting wire, and in particular to a superconducting wire in which a superconducting material layer is formed on a substrate. STATE OF THE ART

[0002] In recent years, the development of a superconducting wire, in which a superconducting material layer is formed on a metal substrate, has been advanced. A superconducting oxide wire is of particular interest. The superconducting oxide wire contains a superconducting material layer made of an oxide superconductor, which is a high-temperature superconductor with a transition temperature equal to or greater than the temperature of liquid nitrogen.

[0003] Such a superconducting oxide wire is generally produced by forming an interlayer on an orientation-aligned metal substrate, forming a superconducting oxide material layer on the interlayer, and further forming a stabilizing layer of silver (Ag) or copper (Cu) (see, for example, Japanese Patent Publication No. 2013-12406 (PTD 1)). Citation list patent document

[0004] PTD 1: Japanese Patent Publication No. 2013-12406 BRIEF DESCRIPTION OF THE INVENTION Technical Problem

[0005] The superconducting wire configured as described above has a multilayer structure in which a ceramic layer, consisting of the intermediate layer and the superconducting material layer, is formed on the metal substrate. When such a superconducting wire is cooled to its critical temperature, a difference in the coefficient of thermal expansion between the metal substrate and the ceramic layer causes mechanical stress from the metal substrate to act on the ceramic layer within the multilayer structure. However, the ceramic layer cannot withstand this mechanical stress. Therefore, the bond strength at the interface between the metal substrate and the ceramic layer is reduced, leading to the problem of localized delamination of the ceramic layer's edges.Because of this, it is likely that a break, deformation, or similar event will occur in part of the superconducting material layer, leading to a deterioration of the superconducting properties.

[0006] One object of the present invention is to provide a superconducting wire which has stable superconducting properties, since local detachment of the superconducting material layer is suppressed. Solution to the problem

[0007] A superconducting wire according to one aspect of the present invention comprises: a substrate having a first principal surface and a second principal surface located opposite the first principal surface, and a superconducting material layer arranged on the first principal surface of the substrate. Along at least a portion of the superconducting wire in a direction in which the superconducting wire extends, the superconducting material layer is arranged such that it covers a side surface of the substrate in a lateral direction of the substrate and covers at least a portion of the second principal surface. The thickness of the superconducting material layer located on the first principal surface varies along the lateral direction. The maximum thickness of the superconducting material layer located on the second principal surface is less than the maximum thickness of the superconducting material layer located on the first principal surface. Advantageous effects of the invention

[0008] As explained above, in a superconducting wire where the superconducting material layer is formed on the substrate, local delamination of the superconducting material layer can be suppressed. In this way, a superconducting wire with stable superconducting properties can be implemented. List of characters Fig. Figure 1 is a schematic cross-sectional view showing a configuration of a superconducting wire in a first embodiment. Fig. Figure 2 is a schematic cross-sectional view showing a configuration of a multi-layer stack in the first embodiment. Fig. Figure 3 is a schematic cross-sectional view showing a configuration of a multilayer stack of a superconducting wire in a comparative example. Fig. Figure 4 is a flowchart showing a method for producing the superconducting wire in the first embodiment. Fig. Figure 5 is a schematic cross-sectional view to illustrate the method for producing the superconducting wire in the first embodiment. Fig. Figure 6 is a schematic cross-sectional view to illustrate the method for producing the superconducting wire in the first embodiment. Fig. Figure 7 is a schematic cross-sectional view to illustrate the method for producing the superconducting wire in the first embodiment. Fig. Figure 8 is a schematic cross-sectional view to illustrate the method for producing the superconducting wire in the first embodiment. Fig. Figure 9 is a schematic cross-sectional view showing a configuration of a superconducting wire according to a first modification in the first embodiment. Fig. Figure 10 is a schematic cross-sectional view showing a configuration of a superconducting wire according to a second modification in the first embodiment. Fig. Figure 11 is a schematic cross-sectional view showing a configuration of a superconducting wire in a second embodiment. Fig. Figure 12 is a schematic cross-sectional view showing a configuration of a superconducting wire in a third embodiment. Fig. Figure 13 is a schematic cross-sectional view showing a configuration of a superconducting wire in a fourth embodiment. Fig. Figure 14 is a flowchart showing a method for producing the superconducting wire in the fourth embodiment. Fig. Figure 15 is a schematic cross-sectional view showing a configuration of a superconducting wire in a fifth embodiment. Fig. Figure 16 is a flowchart showing a process for manufacturing the superconducting wire in the fifth embodiment. Fig. Figure 17 is a diagram that schematically shows a configuration of a slotting device used for a wire thinning step. Fig. Figure 18 is a schematic cross-sectional view to illustrate the method for producing the superconducting wire in the fifth embodiment. Fig. Figure 19 is a schematic cross-sectional view showing a configuration of a superconducting wire according to a modification in the fifth embodiment. DETAILED DESCRIPTION Description of embodiments of the invention

[0009] First, aspects of the present invention will be described one after the other. (1) A superconducting wire 10 (see Fig. 1) according to one aspect of the present invention, a substrate contains 1 and a superconducting material layer 5 The substrate 1 It contains a first principal surface 1a and a second principal surface 1b, which is located opposite the first principal surface 1a. The superconducting material layer 5 is on the first main surface 1a of the substrate 1 arranged along at least a portion of the superconducting wire. 10 in a direction in which the superconducting wire 10 extends the superconducting material layer 5 arranged to form a side surface (at least one of a first side surface 1c and a second side surface 1d) of the substrate1 in a lateral direction of the substrate 1 to cover and to cover at least part of the second principal surface 1b. A thickness of the superconducting material layer 5 The surface area 1a, which is located on the first main surface, varies along the lateral direction. A maximum thickness T2 of the superconducting material layer 5 , which are located on the second main surface 1b of the substrate 1 is located, is smaller than a maximum thickness T1 of the superconducting material layer 5 , which is located on the first main area 1a.

[0010] The superconducting material layer 5 is thus formed in such a way that it forms the first main surface 1a of the substrate. 1 covered and also the side surface(s) of the substrate 1 and covers at least part of the second main area 1b. At the ends of the substrate lying in the lateral direction. 1Therefore, the bond strength between the substrate can be increased. 1 and the superconducting material layer 5 The likelihood of localized detachment of the superconducting material layer can be increased. Accordingly, the occurrence of localized detachment of the superconducting material layer may be affected. 5 are suppressed, and therefore a deterioration of the superconducting properties of the superconducting wire can occur. 10 be suppressed.

[0011] Since the maximum thickness T2 is smaller than the maximum thickness T1, the strength of the superconducting material layer is 5 , which is located on the second main surface 1b, less than the strength of the superconducting material layer 5 , which is located on the first main surface 1a. Accordingly, the probability that the superconducting material layer is present increases. 5 , which is located on the second main surface 1b, due to a mechanical stress acting on the superconducting material layer 5It acts, breaks before the superconducting material layer 5 , which is located on the first main surface 1a, breaks. Consequently, the protection of the superconducting material layer cannot be guaranteed. 5 , which is located on the first main surface 1a, is given a higher priority against breakage or deformation than the protection of the superconducting material layer. 5 , which is located on the second main surface 1b. The superconducting material layer 5 The section located on the first principal surface 1a is a major segment of a path carrying superconducting current. Since the protection of this segment is given higher priority, any deterioration of the superconducting properties of the superconducting wire can be prevented. 10 can be effectively suppressed. As a result, a superconducting wire can be used. 10 , which possesses stable superconducting properties, can be implemented. (2) The superconducting wire 10also contains an intermediate layer 3 , which are located between the first main surface 1a of the substrate 1 and the superconducting material layer 5 is arranged along at least a portion of the superconducting wire. 10 in the direction in which the superconducting wire 10 extends the intermediate layer 3 arranged so that they cover the side surface of the substrate 1 covered, and at least part of the second main surface 1b covered. A maximum thickness T4 of the intermediate layer 3 , which is located on the second main surface 1b, is smaller than a maximum thickness T3 of the intermediate layer 3 , which is located on the first main area 1a (see Fig. 8).

[0012] At the ends of the substrate that lie in the lateral direction 1 Therefore, the bond strength between the substrate can be increased. 1 and the intermediate layer 3be increased, and a detachment of the intermediate layer 3 of the substrate 1 This can therefore be suppressed. Accordingly, the occurrence of delamination of the superconducting material layer can be prevented. 5 due to a detachment of the intermediate layer 3 be suppressed. Since the maximum thickness T4 is smaller than the maximum thickness T3, the strength of the intermediate layer is 3 , which is located on the second main surface 1b, less than the strength of the intermediate layer 3 , which is located on the first main surface 1a. This increases the probability that the intermediate layer 3 , which is located on the second main surface 1b, due to a mechanical stress acting on the intermediate layer 3 acts, breaks before the intermediate layer 3 , which are located on the first main area 1 is located, breaks. Consequently, the protection of the intermediate layer is compromised. 3and the superconducting material layer 5 , located on the first main surface 1a, are given a higher priority against breakage, deformation or the like than the protection of the intermediate layer 3 and the superconducting material layer 5 , which are located on the second main area 1b. (3) The superconducting wire 10 It also contains a protective layer 7 , which are located on the superconducting material layer 5 is trained. Along at least one part. of the superconducting wire 10 in the direction in which the superconducting wire 10 extends, the protective layer 7 arranged so that they cover the side surface of the substrate 1 covered, and at least part of the second main surface 1b covered. A maximum thickness T6 of the protective layer 7, which is located on the second main surface 1b, is smaller than a maximum thickness T5 of the protective layer 7 , which is located on the first main area 1a.

[0013] This allows the protective layer to 7 be designed so that they form the superconducting material layer 5 covering the side surface(s) of the substrate 1 covered, and at least part of the second main surface 1b. It is therefore possible to cover the superconducting material layer. 5 to protect and prevent the superconducting material layer from detaching 5 to contribute. Since the maximum thickness T6 is smaller than the maximum thickness T5, the superconducting material layer 5 and the protective layer 7 , which are located on the second main surface 1b, have a smaller overall thickness and therefore a lower strength than the superconducting material layer 5 and the protective layer 7, which are located on the first main surface 1a. Accordingly, the possibility that the superconducting material layer 5 , which is located on the second main surface 1b, breaks before the superconducting material layer 5 , which is located on the first main surface 1a, breaks, not prevented. (4) With regard to the superconducting wire 10 (see Fig. 1) the thickness of the superconducting material layer varies 5 , located on the first main surface 1a, along the latitude direction in such a way that the thickness of a central section of the superconducting material layer 5 in the lateral direction is greater than the thickness of at least one end of the superconducting material layer 5 in the lateral direction. Since the occurrence of local detachment of the superconducting material layer 5 of such a superconducting wire 10This can also be suppressed, potentially leading to a deterioration of the superconducting properties of the superconducting wire. 10 They are suppressed. Consequently, stable superconducting properties can be achieved. (5) With regard to the superconducting wire 10 (see Fig. 11) the thickness of the superconducting material layer varies 5 , located on the first main surface 1a, along the latitude direction in such a way that the thickness of at least one end of the superconducting material layer 5 in the lateral direction is greater than the thickness of a central section of the superconducting material layer 5 in the lateral direction. Since the occurrence of local detachment of the superconducting material layer 5 of such a superconducting wire 10 This can also be suppressed, potentially leading to a deterioration of the superconducting properties of the superconducting wire. 10They are suppressed. Consequently, stable superconducting properties can be achieved. (6) With regard to the superconducting wire 10 is the superconducting material layer 5, which is located on one end of the second principal surface 1b in the width direction, along at least a part of the superconducting wire 10 in the direction in which the superconducting wire 10 extends from the superconducting material layer 5 , which is located at another end of the second main surface 1b in the lateral direction, separated. In other words: One end, in the lateral direction, of the superconducting material layer 5 is designed such that it extends from over the first side surface 1c to over part of the second main surface 1b, and the other end, in the width direction, of the superconducting material layer 5It is designed such that it extends from over the second side surface 1d to over part of the second main surface 1b. The two ends of the superconducting material layer are located on the second main surface 1b. 5 separated from each other. Since the occurrence of local detachment of the superconducting material layer 5 of such a superconducting wire 10 This can also be suppressed, potentially leading to a deterioration of the superconducting properties of the superconducting wire. 10 They are suppressed. As a result, stable superconducting properties can be achieved. (7) With regard to the superconducting wire 10 Is the superconducting material layer 5 directly or indirectly on the first main surface 1a of the substrate? 1 arranged. The fact that the superconducting material layer 5 The fact that the intermediate layer is indirectly arranged on the first main surface 1a in the present text means that the intermediate layer3 or one or more further layers between the first main surface 1a and the superconducting material layer 5 are located. Both in the case where the superconducting material layer 5 directly on the first main surface 1a, as well as in the case where the superconducting material layer 5 indirectly arranged on the first main surface 1a, the bond strength between the substrate 1 and the superconducting material layer 5 The risk is increased, and therefore the occurrence of local detachment of the superconducting material layer can be increased. 5 be suppressed. (8) With regard to the superconducting wire 10 (see Fig. 15) contains the first main surface 1a of the substrate 1 a curved section. This means that the surface area of ​​the first principal surface 1a is larger than that of the flat first principal surface 1a of the substrate. 1It is therefore possible to determine the bond strength between the first main surface 1a and the superconducting material layer. 5 to increase further. Accordingly, the effect of suppressing the occurrence of delamination of the superconducting material layer can be increased. 5 be reinforced. (9) With regard to the superconducting wire 10 (see Fig. 19) is the curved section at one end of the first main surface 1a of the substrate. 1 in the lateral direction of the substrate 1 arranged. This allows the contraction of the superconducting material layer to be aligned at the end(s) of the first main surface 1a in the lateral direction. 5 with the contraction of the substrate 1 This can be improved during cooling. Accordingly, the occurrence of delamination of the superconducting material layer can be reduced. 5 be suppressed. (10) With regard to the superconducting wire10 The superconducting material layer consists of 5 made from a superconducting oxide material. Since local delamination of the superconducting material layer can be suppressed in this way, a superconducting oxide wire with stable superconducting properties can be implemented. DETAILS OF EXECUTION FORMS OF THE INVENTION

[0014] Embodiments of the present invention are described below with reference to the drawings. In the accompanying drawings, the same or corresponding parts are designated by the same reference numerals, and their description is not repeated. First embodiment: Configuration of the superconducting wire

[0015] Fig. Figure 1 is a schematic cross-sectional view showing a configuration of a superconducting wire in a first embodiment. Fig. Figure 1 shows a cross-section in the direction perpendicular to the direction in which a superconducting wire is oriented. 10 in the first embodiment. Therefore, the direction transverse to the plane of the drawing is the longitudinal direction of the superconducting wire, and superconducting current in a superconducting material layer. 5 It should flow in a direction perpendicular to the plane of the drawing. Furthermore, in the schematic cross-sectional views in Fig. In Figure 1 and the subsequent drawings, the difference between the size in the top-to-bottom direction (hereinafter also referred to as the "thickness direction") and the size in the left-to-right direction (hereinafter also referred to as the "width direction") of the rectangular cross-section is shown small for better clarity. However, in reality, the size in the thickness direction of the cross-section is sufficiently smaller than the size in the width direction of the cross-section.

[0016] As in Fig. As can be seen in the image above, the superconducting wire 10 In the first embodiment, the wire has an elongated shape (ribbon shape) with a rectangular cross-section, and the relatively larger areas of the wire extending in the longitudinal direction of the elongated shape are defined in this text as the principal surfaces. The superconducting wire 10 contains a substrate 1 , an intermediate layer 3 , a superconducting material layer 5 , a protective layer 7 and a stabilizing layer 9 .

[0017] The substrate 1 It has a first main surface 1a and a second main surface 1b. The second main surface 1b is located opposite the first main surface 1a. The substrate 1 It further has a first side surface 1c and a second side surface 1d opposite the first side surface 1c. Preferably, the substrate consists of 1For example, it is made of a metal and has an elongated shape (ribbon shape) with a rectangular cross-section. If the superconducting wire is to be wound into a coil, the substrate extends 1 preferably over a long distance of approximately 2 km.

[0018] An orientation-aligned metal substrate is particularly preferred as a substrate. 1The term "orientation-aligned metal substrate" refers to a substrate in which crystal orientations are aligned in two axial directions within a plane of the substrate surface. For example, an alloy of at least two metals selected from nickel (Ni), copper (Cu), chromium (Cr), manganese (Mn), cobalt (Co), iron (Fe), palladium (Pd), silver (Ag), and gold (Au) is preferably used for the orientation-aligned metal substrate. These metals and another metal or alloy can be layered on top of each other. For example, an alloy such as SUS, which is a high-strength material, can also be used. The substrate material 1 is not limited to those mentioned above, and any material other than metal can be used, for example.

[0019] The superconducting wire 10For example, it has a width dimension of approximately 4 mm to 10 mm. To increase the current density in the superconducting wire 10 where the substrate flows, it has a smaller cross-sectional area. 1 preferred. However, an excessively thin substrate may be 1 (in the direction from top to bottom in Fig. 1) to a deterioration of the substrate's strength 1 This leads to the following: Therefore, the thickness of the substrate is... 1 preferably about 0.1 mm.

[0020] The intermediate layer 3 is applied to the first main surface 1a of the substrate 1 formed. The superconducting material layer 5 will be on the main surface (the upper main surface in Fig. 1) the intermediate layer 3 opposite their main surface, which is the substrate 1 is formed facing the superconducting material layer. 5 is on the first main surface 1a of the substrate1 with the intermediate layer 3 between the superconducting material layer 5 and the substrate 1 arranged. The material that forms the intermediate layer 3 The material used to form the superconducting layer is preferably, for example, yttrium oxide-stabilized zirconia (YSZ), cerium oxide (CeO2), magnesium oxide (MgO), yttrium oxide (Y2O3), or strontium titanate (SrTiO3). These materials exhibit extremely low reactivity with the superconducting layer. 5 and do not impair the superconducting properties of the superconducting material layer 5, not even at the boundary adjacent to the superconducting material layer 5 This is particularly relevant in cases where a metal is used as a material that forms the substrate. 1 The intermediate layer can function by reducing the difference in orientation between the superconducting material layer and the superconducting material layer. 5 and the substrate 1, which has a crystal orientation alignment in its surface, in order to prevent metal atoms from leaving the substrate 1 in the superconducting material layer 5 escape, while a superconducting material layer 5 It is formed at a high temperature. The material that forms the intermediate layer 3 The education component is not specifically limited to those mentioned above.

[0021] The intermediate layer 3 can consist of several layers. In the case where the intermediate layer 3 consisting of several layers, the layers that make up the intermediate layer can be 3 consists of respective materials that are different from each other, or some of the layers that make up the intermediate layer 3 components that consist of the same material can be manufactured from the same material.

[0022] The superconducting material layer 5is a thin film layer in the superconducting wire 10 , and current flows superconducting in this superconducting material layer. 5 Although there are no specific restrictions on the superconducting material, it is preferably, for example, an SE-123-based oxide superconductor. "SE-123-based oxide superconductor" refers to a superconductor made of SEBa₂Cu₃O₃. y is represented (y is 6 to 8, particularly preferably 6.8 to 7, and SE represents yttrium or a rare-earth element, such as Gd, Sm, Ho or the like). To improve the order of magnitude of the superconducting current in the superconducting material layer 5 flows, has the superconducting material layer 5 preferably a thickness of 0.5 µm to 10 µm.

[0023] The protective layer 7 will be on the main surface (the upper main surface in Fig. 1) the superconducting material layer 5opposite its main surface, which is the intermediate layer 3 The protective layer 7 is formed facing the surface. Preferably, the protective layer 7 consists, for example, of silver (Ag) or a silver alloy and has a thickness of not less than 0.1 µm and not more than 50 µm.

[0024] The substrate 1 , the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 , as described above, form a multi-layer stack 20 The stabilizing layer 9 is arranged so that it forms the perimeter edge of the multilayer stack 20 covered. In the present embodiment, the stabilizing layer is 9 arranged so that they define the outer circumference of the multilayer stack 20 covered, essentially the entire outermost surface of the multilayer stack 20covered. It should be noted that the “peripheral edge of the multilayer stack” in the present invention is not limited to the entire circumferential edge and need only be a main surface of the multilayer stack. The stabilizing layer 9 is formed from a highly conductive metal foil or plating layer or the like.

[0025] The stabilizing layer 9 functions in conjunction with the protective layer 7 as a bypass to commutate the current in the superconducting material layer 5 , when the transition of the superconducting material layer 5 from the superconducting state to the normal conducting state. The material that forms the stabilizing layer. 9The material used to form the stabilizing layer is, for example, preferably copper (Cu) or a copper alloy or the like. Although there are no specific limitations on the thickness of the stabilizing layer 9, the thickness is preferably 10 µm to 500 µm to form the protective layer. 7 and the superconducting material layer 5 to protect physically.

[0026] Fig. Figure 2 is a schematic cross-sectional view showing a configuration of the multi-layer stack. 20 in the first embodiment. Fig. Figure 2 shows a cross-section in the direction perpendicular to the direction in which the superconducting wire is oriented. 10 in the first embodiment.

[0027] In the multi-layer stack 20 In the first embodiment, the superconducting material layer 5 arranged so that they cover the side surface(s) of the substrate 1 in the latitude direction (direction from left to right in Fig. 2) covered and at least part of the second main area 1b.

[0028] In particular, in the Fig. 2 multi-layer stacks shown 20 one end, in the lateral direction, of the superconducting material layer 5 designed so that it extends from over the first side surface 1c to over part of the second main surface 1b, and the other end, in the width direction, of the superconducting material layer 5 It is designed such that it extends from over the second side surface 1d to over a part of the second main surface 1b. The two ends of the superconducting material layer 5 are separated from each other on the second main surface 1b. In other words: The superconducting material layer 5 is arranged so that they form the first main surface 1a and the side surfaces 1c, 1d of the substrate 1The second main surface 1b is completely covered, and the second main surface is partially covered. This configuration allows for an increase in bond strength between the substrate and the substrate. 1 and the superconducting material layer 5 compared to a conventional superconducting wire, where the superconducting material layer 5 only the first main area 1a of the substrate 1 is covered.

[0029] In detail, the following should be noted: When a superconducting wire, in which a superconducting material layer (a ceramic layer) is formed on a metal substrate, is cooled to its critical temperature, a mechanical stress is generated between the metal substrate and the superconducting material layer due to a difference in the coefficients of thermal expansion between the metal and the ceramic material. More precisely, each layer in the wire contracts when the superconducting wire is cooled. Because the superconducting material layer has a lower coefficient of thermal expansion than the metal substrate, the superconducting material layer cannot contract to the same extent as the metal substrate at that moment and is therefore subjected to mechanical stress.Consequently, in the conventional superconducting wire, the superconducting material layer could detach, especially at the ends of the substrate lying in the lateral direction.

[0030] In a superconducting wire where an intermediate layer exists between the substrate and the superconducting material layer, this intermediate layer, which is a ceramic layer, could detach from one end of the substrate in the lateral direction, similar to the superconducting material layer described above. The occurrence of detachment of the superconducting material layer or the intermediate layer, for example, makes it more likely that the superconducting material layer will break or deform, which could lead to a deterioration of the superconducting properties.

[0031] In the superconducting wire 10 According to the first embodiment, the superconducting material layer extends 5from the side surfaces 1c, 1d of the substrate 1 to at least part of the second main surface 1b. This allows the bonding area between the substrate to be increased compared to the conventional superconducting wire. 1 and the superconducting material layer 5 be increased, and the bond strength between the substrate 1 and the superconducting material layer 5 This effect can therefore be amplified. Thus, when the superconducting wire 10 is cooled, the contraction of the superconducting material layer is confirmed. 5 with the contraction of the substrate 1 Improved. A detachment of the superconducting material layer. 5 of the substrate 1 can therefore be suppressed. As a result, the superconducting material layer can be prevented from 5 is broken or deformed, and a deterioration of the superconducting properties of the superconducting wire 10can therefore be suppressed.

[0032] In the Fig. 2 multi-layer stacks shown 20 is the intermediate layer 3 arranged so that they form the first main surface 1a and the side surfaces 1c, 1d of the substrate 1 The second main surface 1b is completely covered and partially covered. This allows for the bond strength between the substrate to be determined. 1 and the superconducting material layer 5 , the bond strength between the substrate 1 and the intermediate layer 3 will be increased. The detachment of the intermediate layer. 3 of the substrate 1 This can therefore be suppressed. Accordingly, the occurrence of delamination of the superconducting material layer can be prevented. 5 due to a detachment of the intermediate layer 3 be suppressed. Preferably, the superconducting material layer covers 5 the ends, in the lateral direction, of the intermediate layer3 , as in Fig. 2 shown. Accordingly, the effect of suppressing detachment of the intermediate layer can be 3 be reinforced.

[0033] In the Fig. 2 multi-layer stacks shown 20 is the protective layer 7 arranged so that they form the first main surface 1a and the side surfaces 1c, 1d of the substrate 1 completely covered and the second main area 1b partially covered. This allows the protective layer to be applied. 7 be designed so that they form the superconducting material layer 5 covering the side surfaces 1c, 1d and the second main surface 1b of the substrate. 1 covered. The protective layer 7 This protects the superconducting material layer. 5 and can prevent the superconducting material layer from detaching 5 contribute. Preferably, the protective layer covers 7the ends, in the lateral direction, of the superconducting material layer 5 , as in Fig. 2 shown. Accordingly, the effect of suppressing detachment of the superconducting material layer can be 5 be reinforced.

[0034] As long as the superconducting material layer 5 , the intermediate layer 3 and the protective layer 7 in the superconducting wire 10 in the first embodiment at least a part of the second main surface 1b along at least a part of the superconducting wire 10 in the direction in which the superconducting wire 10 extends (longitudinal direction), covering, can increase the bond strength between the substrate 1 and the superconducting material layer 5 and the intermediate layer 3 be reinforced.

[0035] In the Fig. 2 multi-layer stacks shown 20 have the intermediate layer 3, the superconducting material layer 5 and the protective layer 7 The layers located on the first main surface 1a each have a cross-sectional shape that projects in the lateral direction at their central section. In particular, the intermediate layer 3, the superconducting material layer, have this shape. 5 and the protective layer 7 Each has a top surface in an outwardly curved convex shape. Accordingly, the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 , located on the first main surface 1a, each have a thickness that varies along the latitudinal direction. In the example in Fig. 2. The apex of this curve is located essentially in the middle, in the latitude direction, on the top side. The intermediate layer 3 , the superconducting material layer 5 and the protective layer 7Therefore, each has a thickness that is greater in its central section in the width direction than the thickness at its end in the width direction.

[0036] In the multi-layer stack 20 is a maximum thickness T2 of the superconducting material layer 5 , which is located on the second main surface 1b, smaller than a maximum thickness T1 of the superconducting material layer 5 , which is located on the first main area 1a (T2 <T1).

[0037] Since T2 is smaller than T1, the strength of the superconducting material layer is 5 , which is located on the second main surface 1b, less than the strength of the superconducting material layer 5 , which is located on the first main surface 1a. Therefore, if the superconducting material layer 5 is subjected to a mechanical stress that is applied to the substrate 1If this occurs, there is a high probability that the superconducting material layer will be affected. 5 , which is located on the second main surface 1b, breaks before the superconducting material layer 5 The layer located on the first main surface 1a breaks. As a result, the protection of the superconducting material layer is compromised. 5 The stress on the first main surface 1a has a higher priority than the mechanical stress acting on the superconducting material layer 5. Since the superconducting material layer 5 Since the section located on the first main surface 1a is a main section of the path along which the superconducting current flows, a higher priority can be given to the protection of this section in order to effectively suppress any deterioration of the superconducting properties.

[0038] If T2 is much smaller than T1, there is a possibility that there will not be sufficient bond strength between the second main surface 1b and the superconducting material layer. 5 can be maintained. In light of this, the ratio of T2 to T1 (T2 / T1) is preferably 0.1% or more and 95% or less. If this ratio is 95% or less, the strength of the superconducting material layer is ensured. 5 , which is located on the second main surface 1b, is smaller than the strength of the superconducting material layer 5 , which is located on the first main surface 1a, and therefore the effect described above can be sufficiently realized. In contrast, if this ratio is less than 0.1%, sufficient bond strength between the substrate and the substrate cannot be achieved. 1 and the superconducting material layer 5, which is located on the second main surface 1b, cannot be maintained, and there is a possibility that the effect described above cannot be sufficiently realized.

[0039] Furthermore, the superconducting wire 10 In the first embodiment, advantageous effects compared to a Fig. The three comparative examples shown are illustrated. Fig. Figure 3 is a schematic cross-sectional view showing a configuration of a multilayer stack of a superconducting wire in a comparative example. Fig. Figure 3 shows a cross-section of the superconducting wire in the comparative example in the direction perpendicular to the direction in which the superconducting wire extends.

[0040] As in Fig. As can be seen in the comparison example 3, a multi-layer stack of 200 basically has a similar configuration to the one in Fig. 2 multi-layer stacks shown 20However, the multi-layer stack 200 differs from the one in Fig. 2 multi-layer stacks shown 20 by the fact that the former is an intermediate layer 3 , a superconducting material layer 5 and a protective layer 7 contains, which are arranged such that they form a first principal surface 1a of the substrate 1 cover and side surfaces 1c, 1d of the substrate 1 partially cover. In other words: With regard to the multilayer stack 200, the superconducting material layer extends 5 and the intermediate layer 3 not over the second main area 1b. Therefore, the one in Fig. 2 multi-layer stacks shown 20 compared to the multi-layer stack 200, both a larger bonding area between the substrate 1 and the superconducting material layer 5 as well as a larger bonding area between the substrate 1 and the intermediate layer 3 .

[0041] The substrate 1 Upon cooling, it contracts not only in the width direction but also in the thickness direction. In the Fig. 2 multi-layer stacks shown 20 the superconducting material layer extends 5 and the intermediate layer 3 up to and including the second main surface 1b, and therefore the agreement is high not only in the contraction in the width direction, but also in the contraction in the thickness direction. In contrast, with regard to the multilayer stack 200, the agreement in the contraction in the thickness direction of the substrate is 1 low, although the agreement in contraction in the lateral direction of the substrate is 1 through the superconducting material layer 5 and the intermediate layer 3 , which is located on side surfaces 1c, 1d, can be realized.

[0042] Furthermore, the end sections of the superconducting material layer lying in the lateral direction 5 in a cross-section of the in Fig. In the multilayer stack 20 shown, each layer has a U-shape. Therefore, the end sections of the superconducting material layer lying in the width direction are 5 essentially in a state where they capture the second principal surface 1b. In this state, the end sections act as hooks to secure the superconducting material layer. 5 on the substrate 1 With regard to the structure. Consequently, a structure can be implemented that offers greater resistance to the mechanical stress of the substrate. 1 has as the comparative example.

[0043] For the reasons outlined above, the superconducting wire 10 in the first embodiment a stronger effect of suppressing detachment of the superconducting material layer 5and / or the intermediate layer 3 from substrate 1 as the superconducting wire in the comparison example.

[0044] In the first embodiment, the intermediate layer 3 and the superconducting material layer 5 , which form the side surface(s) of the substrate 1 cover and cover at least part of the second main surface 1b, each being formed such that they cover both the first side surface 1c and the second side surface 1d, as shown in the Fig. 1 and Fig. 2 shown, or they can be designed to cover only one of the first face 1c and the second face 1d. In other words: The intermediate layer 3 and the superconducting material layer 5can be arranged such that they cover at least one of the first side face 1c and the second side face 1d and cover at least part of the second main face 1b. Both configurations allow, in comparison to the conventional superconducting wire and the comparison example ( Fig. 3) an increase in bond strength between the substrate 1 , the intermediate layer 3 and the superconducting material layer 5 . Method for producing a superconducting wire

[0045] Next, a procedure similar to that used in the Fig. 4 to Fig. Figure 8 shows the production of the superconducting wire in the first embodiment.

[0046] Fig. Figure 4 is a flowchart showing a method for producing the superconducting wire in the first embodiment. The present embodiment is described below in conjunction with a method for producing a superconducting wire. 10 using a substrate 1 described, which was subjected to wire thinning to a width of 4 mm as an example.

[0047] As in Fig. As shown in section 4, a substrate preparation step (S10) is performed first. In particular, as shown in Fig. 5 to see, a substrate 1 manufactured from an orientation-aligned metal substrate and having a strip shape with a desired width (width: for example, 4 mm). The substrate 1It has a first main surface 1a and a second main surface 1b, which is located opposite the first main surface 1a, as well as a first side surface 1c and a second side surface 1d opposite the first side surface 1c. The thickness of the substrate 1 It can be conveniently adjusted to fulfill any desired purpose and is usually in a range of 10 µm to 500 µm. For example, the thickness of the substrate is... 1 approximately 100 µm.

[0048] Next, an intermediate layer formation step (S20 in Fig. 4) to form an intermediate layer 3 on the substrate 1 executed. In particular, as in Fig. 6 to see, the intermediate layer 3 formed on the first main surface 1a of the substrate 1. This is the process for forming the intermediate layer. 3Any method can be used. For example, a physical vapor deposition process, such as pulsed laser deposition (PLD), can be used.

[0049] Next, a superconducting layer formation step (S30 in Fig. 4) to form a superconducting material layer 5 on the intermediate shift 3 executed. In particular, as in Fig. 7 to see the superconducting material layer 5 from an SE-123-based oxide superconductor on the main surface (the upper main surface in Fig. 7) the intermediate layer 3 opposite their main surface, which is the substrate 1 is directed towards it. As the process for forming the superconducting material layer 5Any method can be used. For example, a vapor-phase process, a liquid-phase process, or a combination thereof can be used to form the layer. Examples of vapor-phase processes include laser evaporation, sputtering, electron beam evaporation, and the like. This step can be performed by at least one of a laser evaporation process, a sputtering process, an electron beam process, and an organometallic deposition process to create the superconducting material layer. 5 to form surfaces whose surface exhibits excellent crystal orientation and surface smoothness.

[0050] Next, a protective layer formation step (S40 in) is carried out. Fig. 4) to form a protective layer 7 on the superconducting material layer 5 executed. In particular, as in Fig. 8 to see, the protective layer 7, which consists of silver (Ag) or silver alloy, on the main surface (the upper main surface in Fig. 8) the superconducting material layer 5 opposite its main surface, which is the intermediate layer 3 The protective layer is formed by a physical vapor deposition process, such as sputtering, electroplating, or the like. 7 can be formed to enhance the surface of the superconducting material layer 5 to protect it. Afterwards, an oxygen annealing process is carried out, specifically heating in an oxygen environment (an oxygen introduction step), to introduce oxygen into the superconducting material layer. 5 to initiate a multi-layer stack. The steps described above will create a multi-layer stack. 20 formed, which has a width of approximately 30 mm.

[0051] Next, a stabilization layer formation step (S50 in) is performed. Fig. 4) to form a stabilizing layer 9 on the circumferential edge of the multilayer stack 20. In particular, the stabilizing layer 9 , which consists of copper (Cu) or copper alloy, formed by the known plating process to cover the outer circumference of the multilayer stack 20 to cover, essentially the entire outermost surface of the multilayer stack 20 to cover. The process for forming the stabilizing layer. 9 Bonding copper foil instead of plating is one option. The superconducting wire is created using the steps described above. 10 in the Fig. 1 first embodiment shown.

[0052] In the Fig. 8 multi-layer stacks shown 20 is a maximum thickness T4 of the intermediate layer 3 , which is located on the second main surface 1b, preferably smaller than a maximum thickness T3 of the intermediate layer3 , which is located on the first main area 1a (T4 <T3).

[0053] Since T4 is smaller than T3, the strength of the intermediate layer is 3 , which is located on the second main surface 1b, less than the strength of the intermediate layer 3 , which is located on the first main surface 1a. Therefore, if the intermediate layer 3 is subjected to a mechanical stress imposed by the substrate 1 The more this influences, the greater the probability that the intermediate layer will be affected. 3 , which is located on the second main surface 1b, breaks before the intermediate layer 3 , which is located on the first main surface 1a, breaks. Accordingly, the protection of the intermediate layer is compromised. 3 , which is located on the first main surface 1a, in front of the mechanical stress that is applied to the intermediate layer 3A higher priority is given to the protection of the superconducting material layer 5, which is located on the first main surface 1a, for example against breakage or deformation.

[0054] In the multi-layer stack 20 is a maximum thickness T6 of the protective layer 7 , which is located on the second main surface 1b, preferably smaller than a maximum thickness T5 of the protective layer 7 , which is located on the first main area 1a (T6 <T5).

[0055] Since T6 is smaller than T5, the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 , located on the second main surface 1b, have a smaller overall thickness and therefore a lower strength than the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7, which are located on the first main surface 1a. Accordingly, the probability that the superconducting material layer 5 , which is located on the second main surface 1b, breaks before the superconducting material layer 5 , which is located on the first main surface 1a, breaks, not prevented. Modification of the first embodiment

[0056] Based on the Fig. 9 and Fig. 10. Modifications of the superconducting wire in the first embodiment are described.

[0057] Fig. Figure 9 is a schematic cross-sectional view showing a configuration of a superconducting wire 10A according to a first modification in the first embodiment. Fig. Figure 9 shows a cross-section in the direction perpendicular to the direction in which the superconducting wire 10A extends.

[0058] As in Fig. As can be seen in Figure 9, the superconducting wire 10A of the first modification basically has a similar structure to the one in Figure 9. Fig. 1 superconducting wire shown 10 , except that the shape of a stabilizing layer 9 of the superconducting wire 10A from the superconducting wire 10 differs.

[0059] In the superconducting wire 10A, the thickness of the stabilizing layer is 9 , located at the ends of the first main surface 1a of the substrate that lie in the lateral direction 1 is arranged, larger than the thickness of the stabilizing layer 9 , which is located above a central section of the first main surface 1a lying in the lateral direction. The thickness of the stabilizing layer 9 , located at the ends of the second main surface 1b of the substrate that lie in the lateral direction 1 The arrangement is also greater than the thickness of the stabilizing layer. 9, which is located above a central section of the second main surface 1b lying in the latitude direction.

[0060] In the superconducting wire 10A, the intermediate layer 3 and the superconducting material layer 5 also designed to extend from above the side surfaces 1c, 1d of the substrate 1 extend over part of the second main surface 1b. The maximum thickness T2 of the superconducting material layer 5 , which is located on the second main surface 1b, is smaller than the maximum thickness T1 of the superconducting material layer 5 , which is located on the first main surface 1a. Furthermore, the respective maximum thicknesses of the intermediate layer are 3 and the protective layer 7 , located on the second main surface 1b, smaller than the respective maximum thicknesses of the intermediate layer 3 and the protective layer 7, which are located on the first main surface 1a. The superconducting wire 10A can therefore have similar effects as in the case of the one in Fig. 1 superconducting wire shown 10 realize.

[0061] A method for producing a superconducting wire 10A has fundamentally similar structural elements to the method for producing the superconducting wire in the first embodiment, which was described above based on the Fig. 4 to Fig. 8 was described, except that the conditions for forming the stabilizing layer in the stabilizing layer formation step (S50 in Fig. 4) of the first method differ from those of the first embodiment. For example, if the electroplating method is used to create the stabilizing layer 9 to form the outer perimeter of the multilayer stack 20 with the stabilizing layer 9To cover, the current is likely to concentrate at the corners of the multilayer stack. 20 As a result, the plating layer covering the corners is relatively thicker. This allows the Fig. 9 shown stabilization layer 9 They are formed. In this way, the superconducting wire 10A is obtained.

[0062] Fig. Figure 10 is a schematic cross-sectional view showing a configuration of a superconducting wire 10B according to a second modification in the first embodiment. Fig. Figure 10 shows a cross-section in the direction perpendicular to the direction in which the superconducting wire 10B extends.

[0063] As in Fig. As can be seen in Figure 10, the superconducting wire 10B of the second modification basically has a similar structure to the one in Figure 10. Fig. 1 superconducting wire shown 10 , except that the structure of the multilayer stack 20 from the of in Fig. 2 multi-layer stacks shown 20 differs.

[0064] The protective layer is applied to the superconducting wire 10B. 7 , located on the second principal surface 1b, is arranged such that it completely covers the second principal surface 1b. In the superconducting wire 10B, the intermediate layer 3 and the superconducting material layer are 5 also designed to extend from above the side surfaces 1c, 1d of the substrate 1 extend over part of the second main surface 1b. The maximum thickness T2 of the superconducting material layer 5 , which is located on the second main surface 1b, is smaller than the maximum thickness T1 of the superconducting material layer 5 , which is located on the first main surface 1a. Furthermore, the respective maximum thicknesses of the intermediate layer are 3 and the protective layer 7, located on the second main surface 1b, smaller than the respective maximum thicknesses of the intermediate layer 3 and the protective layer 7 , which are located on the first main surface 1a. The superconducting wire 10B can therefore have similar effects as in the case of the one in Fig. 1 superconducting wire shown 10 realize.

[0065] A method for producing a superconducting wire 10B has fundamentally similar structural elements to the method for producing the superconducting wire in the first embodiment, which was described above based on the Fig. 4 to Fig. 8 was described, except that the conditions for the formation of the protective layer in the protective layer formation step (S40 in Fig. 4, Fig. 8) of the first method differ from those of the first embodiment. For example, if the electroplating method is used to apply the protective layer 7on the main surface of the superconducting material layer 5 opposite its main surface, which is the intermediate layer 3 To form the second main surface 1b, which is facing the other side, the second main surface can be completely plated to form the area shown in the diagram. Fig. 10 protective layers shown 7 to form. In this way, the superconducting wire 10B is obtained.

[0066] Even in the modifications that were in the Fig. 9 and Fig. As shown in 10, the bond strength between the substrate can be increased. 1 and the superconducting material layer 5 will be increased as long as the superconducting material layer 5 a portion of the second main surface 1b along at least a portion of the superconducting wire in the longitudinal direction. The intermediate layer 3 can cover part of the second main area 1b, and the protective layer 7can cover at least a part of the second principal surface 1b along at least a part of the superconducting wire in the longitudinal direction. Second embodiment

[0067] Fig. Figure 11 is a schematic cross-sectional view showing a configuration of a superconducting wire 10C in a second embodiment. Fig. Figure 11 shows a cross-section in the direction perpendicular to the direction in which the superconducting wire 10C extends.

[0068] As in Fig. As can be seen in Figure 11, the superconducting wire 10C in the second embodiment basically has a similar structure to the one in Figure 11. Fig. 1 superconducting wire shown 10 , except that the structure of the multilayer stack 20 from the of in Fig. 2 multi-layer stacks shown 20 differs.

[0069] The superconducting wire 10C contains the intermediate layer 3, the superconducting material layer 5 and the protective layer 7 , located on the first main surface 1a, protrude at opposite ends in the lateral direction and accordingly have a cross-section whose central section extends in the lateral direction towards the substrate 1 withdraws. In other words: The top side of the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 Each has a concave shape that points towards the substrate. 1 It is curved. Therefore, the thickness of the intermediate layer varies. 3 , the superconducting material layer 5 and the protective layer 7 , located on the first main surface 1a, along the latitude direction. In the example in Fig. 11 is the thickness at the ends, in the width direction, of the intermediate layer. 3 , the superconducting material layer 5and the protective layer 7 each greater than the thickness at the central section in the width direction.

[0070] In the superconducting wire 10C, the maximum thickness T2 of the superconducting material layer is 5 , which is located on the second main surface 1b, is also smaller than the maximum thickness T1 of the superconducting material layer 5 , which is located on the first main surface 1a. The respective maximum thicknesses of the intermediate layer 3 and the protective layer 7 , located on the second main surface 1b, are smaller than the respective maximum thicknesses of the intermediate layer 3 and the protective layer 7 , which are located on the first main surface 1a. The superconducting wire 10C can therefore have similar effects as in the case of the one in Fig. 1 superconducting wire shown 10 realize.

[0071] A method for producing a superconducting wire 10C has fundamentally similar structural elements to the method for producing the superconducting wire in the first embodiment, which was described above based on the Fig. 4 to Fig. 8 was described, except that the conditions for the formation of the layers in the interlayer formation step (S20 in Fig. 4, Fig. 6), the superconducting layer formation step (S30 in Fig. 4, Fig. 7) and the protective layer formation step (S40 in Fig. 4, Fig. 8) differ from those in the first embodiment. Third embodiment

[0072] Fig. Figure 12 is a schematic cross-sectional view showing a configuration of a superconducting wire 10D in a third embodiment. Fig. Figure 12 shows a cross-section in the direction perpendicular to the direction in which the superconducting wire 10D extends.

[0073] As in Fig. As can be seen in Figure 12, the superconducting wire 10D of the third embodiment basically has a similar structure to the one in Figure 12. Fig. 1 superconducting wire shown 10 , except that the structure of the multilayer stack 20 from the of in Fig. 2 multi-layer stacks shown 20 differs.

[0074] In the superconducting wire 10D, the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 , located on the second principal surface 1b, are each arranged such that they completely cover the second principal surface 1b. In the superconducting wire 10D, the maximum thickness T2 of the superconducting material layer is 5 , which is located on the second main surface 1b, is also smaller than the maximum thickness T1 of the superconducting material layer 5, which is located on the first main surface 1a. The respective maximum thicknesses of the intermediate layer 3 and the protective layer 7 , located on the second main surface 1b, are also smaller than the respective maximum thicknesses of the intermediate layer 3 and the protective layer 7 , which are located on the first main surface 1a. The superconducting wire 10D can therefore have similar effects as in the case of the one in Fig. 1 superconducting wire shown 10 realize.

[0075] As long as the superconducting material layer 5 The second main surface 1b is completely covered along at least a part of the superconducting wire 10D in the longitudinal direction, which can increase the bond strength between the substrate 1 and the superconducting material layer 5 be increased. The intermediate layer 3 can completely cover the second main area 1b, and the protective layer7 can completely cover the second main surface 1b along at least a part of the superconducting wire 10D in the longitudinal direction.

[0076] A method for producing a superconducting wire 10D has fundamentally similar structural elements to the method for producing the superconducting wire in the first embodiment, which was described above based on the Fig. 4 to Fig. 8 was described, except that the conditions for layer formation in the interlayer formation step (S20 in Fig. 4, Fig. 6), the superconducting layer formation step (S30 in Fig. 4, Fig. 7) and the protective layer formation step (S40 in Fig. 4, Fig. 8) differ from those in the first embodiment. Fourth embodiment

[0077] Fig. Figure 13 is a schematic cross-sectional view showing a configuration of a multilayer stack in a superconducting wire 10E in a fourth embodiment. Fig. Figure 13 shows a cross-section in the direction perpendicular to the direction in which the superconducting wire 10E extends.

[0078] As in Fig. As can be seen in Figure 13, the superconducting wire 10E in the fourth embodiment basically has a similar structure to the one in Figure 13. Fig. 1 superconducting wire shown 10 , except that the structure of the multilayer stack 20 from the of in Fig. 2 multi-layer stacks shown 20 differs.

[0079] The superconducting wire 10E contains the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 arranged so that they form the first main surface 1a and the first side surface 1c of the substrate 1completely cover and partially cover the second main surface 1b. In contrast, the second side surface 1d of the substrate will 1 not through the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 covered.

[0080] The superconducting wire 10E contains the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 , located on the first main surface 1a, each protruding at one end in the lateral direction. In other words: respective upper surfaces of the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 They each have an outwardly curved convex shape. Therefore, the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7, located on the first main surface 1a, each have a thickness that varies along the latitudinal direction. In the in Fig. The 13 examples shown have the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 each has a thickness at one end in the width direction that is greater than its thickness at the other end in the width direction.

[0081] In the superconducting wire 10E, the maximum thickness T2 of the superconducting material layer is 5 , which is located on the second main surface 1b, is also smaller than the maximum thickness T1 of the superconducting material layer 5 , which is located on the first main surface 1a. The respective maximum thicknesses of the intermediate layer 3 and the protective layer 7 , located on the second main surface 1b, are also smaller than the respective maximum thicknesses of the intermediate layer 3and the protective layer 7 , which are located on the first main surface 1a. The superconducting wire 10E can therefore have similar effects as in the case of the one in Fig. 1 superconducting wire shown 10 realize.

[0082] Fig. Figure 14 is a flowchart showing a process for manufacturing the superconducting wire in the fourth embodiment. As in Fig. As can be seen in Figure 14, the method for producing the superconducting wire in the fourth embodiment has essentially similar structural elements to the method for producing the superconducting wire in the first embodiment, which was described above. Fig. 4 to Fig. 8 was described. However, the first method differs from the first embodiment in that the first method includes a wire thinning step.

[0083] As in Fig. As can be seen in Figure 14, a substrate preparation step (S10) is performed first. In particular, a substrate is 1 manufactured from an orientation-aligned metal substrate and exhibiting a wide band shape. The width of the substrate 1 At this point, for example, the width (e.g., 8 mm) may be approximately twice the width (e.g., 4 mm) of the substrate. 1 in the superconducting wire 10E.

[0084] Next, on this wide substrate 1An interlayer formation step (S20), a superconducting material layer formation step (S30), and a protective layer formation step (S40) are performed in that order. The interlayer formation step, the superconducting material layer formation step, and the protective layer formation step are performed in a similar manner to the corresponding steps in the first embodiment. These steps are thus performed to create a wide multilayer stack. 20 to form.

[0085] Next, a wire thinning step (S60) is used to cut a wide multilayer stack. 20 to such that each has a predetermined width (for example, 4 mm). In particular, rotary blades are used to perform a mechanical slotting operation to mechanically cut the multi-layer stack of 8 mm width into those that have a width of 4 mm.

[0086] In the wire thinning step (S60), a multi-layer stack is formed. 20 , which, for example, has a width dimension of approximately 8 mm, is cut in half widthwise to form two multi-layer stacks 20 to produce, each with a width of 4 mm. The in Fig. 13 multi-layer stacks shown 20 This is one of these multi-layer stacks. Respective cut surfaces of two multi-layer stacks 20 The surfaces exposed by this cutting can each form an end face in the width direction. In the Fig. 13 multi-layer stacks shown 20 The second side surface 1d of the substrate will be 1 exposed and is neither through the intermediate layer 3 , the superconducting material layer 5 still through the protective layer 7 covered. The other multi-layer stack 20 (not shown), which of the intersection surface of the in Fig. 13 multi-layer stacks shown 20 The substrate has a free first side surface 1c facing it. 1 More precisely, they cover the multi-layer stack. 20 , which is not shown, the intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 completely the first main surface 1a and the second side surface 1d of the substrate 1 and partially cover the second main surface 1b. In contrast, the first side surface 1c is not covered by the intermediate layer. 3 , the superconducting material layer 5 still through the protective layer 7 It is covered and therefore lies exposed.

[0087] In the wire thinning step (S60), laser processing can be performed to cut the multilayer stack into thin wires. The in Fig. 13 multi-layer stacks shown 20This can also be achieved by adjusting the conditions for laser processing.

[0088] Next, a stabilization layer formation step (S50) is performed to form a stabilization layer. 9 on the circumferential edge of the multilayer stack 20 , which has undergone wire thinning. The stabilization layer formation step is carried out in a similar manner to the first embodiment. The steps described above are carried out to thereby achieve the in Fig. To produce the superconducting wire 10E shown in 13. Fifth embodiment

[0089] Fig. Figure 15 is a schematic cross-sectional view showing a configuration of a multilayer stack of a superconducting wire 10F in a fifth embodiment. Fig. Figure 15 shows a cross-section in the direction perpendicular to the direction in which the superconducting wire 10F extends.

[0090] As in Fig. As can be seen in Figure 15, the superconducting wire 10F in the fifth embodiment basically has a similar structure to the one in Figure 15. Fig. 1 superconducting wire shown 10 , except that the structure of the multilayer stack 20 from the of in Fig. 2 multi-layer stacks shown 20 differs.

[0091] In the superconducting wire 10F, the first principal surface 1a of the substrate 1 an outwardly curved convex shape. The vertex of this curve is located essentially in the middle of the first principal surface 1a in the latitude direction. The ends of the curve are located at the ends of the first principal surface 1a in the latitude direction. The intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 are formed along the first main surface 1a. Therefore, the top surface (the top surface of the protective layer) 7 ) of the multi-layer stack 20also an outwardly curved convex shape. The intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 Each has a thickness that varies along its width. In the Fig. 15 multi-layer stacks shown 20 is the maximum thickness T2 of the superconducting material layer 5 , which is located on the second main surface 1b, is also smaller than the maximum thickness T1 of the superconducting material layer 5 , which is located on the first main area 1a.

[0092] With respect to the superconducting wire 10F, the first principal surface 1a is curved. Therefore, the surface area of ​​the first principal surface 1a can be compared to the substrate. 1 , which has the flat first main surface 1a, will be enlarged. The intermediate layer 3 and the superconducting material layer 5are designed in such a way that they completely cover the first main surface 1a, which has the curved section, and therefore the bonding surface between the substrate can 1 and the intermediate layer 3 and the bonding surface between the substrate 1 and the superconducting material layer 5 can be increased. Accordingly, the bond strength between the substrate can be increased. 1 and the intermediate layer 3 and the bond strength between the substrate 1 and the superconducting material layer 5 will be increased further.

[0093] The curved surface section can be the entire first principal surface 1a, as in Fig. 15 shown, or can be part of the first principal surface 1a. The curved surface section can have an outwardly curved convex shape or can be curved in the direction of the second principal surface 1b (concave shape).

[0094] Fig. Figure 16 is a flowchart showing a process for manufacturing the superconducting wire in the fifth embodiment. As in Fig. As can be seen in Figure 16, the method for producing the superconducting wire in the fifth embodiment has essentially similar structural elements to the method for producing the superconducting wire in the first embodiment, which was described above. Fig. 4 to Fig. 8 was described. However, the first method differs from the first embodiment in that the first method includes a wire thinning step.

[0095] As in Fig. As can be seen in Figure 16, a substrate preparation step (S10) is performed first. In particular, a substrate is 1 manufactured, consisting of an orientation-aligned metal substrate and having a wide band shape (approximately 30 mm wide).

[0096] Next, a wire thinning step (S70) is performed to cut the substrate 1, which has a width of 30 mm, into sections of a previously defined width (for example, 4 mm). In particular, as shown in Fig. Figure 17 shows rotary blades used to perform mechanical slitting to remove material from the substrate. 1 , which has a width of 30 mm, to be mechanically cut into those which each have a width of 4 mm.

[0097] Fig. Figure 17 schematically shows a configuration of a slotting device used for the wire thinning step. On the right side in Fig. 17 is the configuration of the substrate 1 shown that a slotting through the slotting device 30 is subjected to.

[0098] As in Fig. 17, which can be seen, contains the slot device 30 several rotary blades 31 and several spacers 32The slot device 30 It contains, for example, a total of seven rotary blades. 31 . On an upper rotating shaft of the slotting device 30 are three rotary blades 31 Each arranged with a width of approximately 4 mm. Between rotating blades. 31 The spacer is formed by the spacers that lie next to each other in the direction of the axis of rotation. 32 arranged. On a lower rotating shaft of the slotting device 30 There are also four rotary blades. 31 arranged, each with a width of approximately 4 mm. The width of the rotary blades 31 , which are arranged on the upper and lower rotating shafts, can be adjusted to any desired width.

[0099] As in Fig. 17 showed, the substrate 1 , which uses rotary blades 31is slotted, which touches the second principal surface 1b, a cross-sectional shape in which a central section of the first principal surface 1a protrudes in the width direction (the first principal surface 1a has a convex shape), because slot conditions, such as the free space between adjacent rotation blades 31 and the vertical overlap of rotary blades 31 , were adjusted accordingly. In this way, a substrate can 1 to be obtained, which has a cross-sectional shape as in Fig. 18 shown. In contrast, the substrate 1 , which uses rotary blades 31 is slotted, touching the first principal surface 1a, a cross-sectional shape in which a central section of the second principal surface 1b protrudes in the width direction (the second principal surface 1b has a convex shape), because slot conditions, such as the free space between adjacent rotational blades 31and the vertical overlap of rotary blades 31 , were adjusted accordingly.

[0100] As described above, mechanical slitting cuts the substrate. 1 by shearing using the upper rotating blades 31 and the opposite lower rotating blades 31 The resulting thin wires (substrate) 1 ) depending on the direction in which the rotating blades 31 The grooves should be laid out (in the direction of the slitting), each with curved edges. This is especially important with regard to thin wires (substrate). 1e ), which are connected to the upper rotary blades by slits from the side of the first main surface 1a 31 The edges of the substrate are produced. 1 curved in the direction of the first main surface 1a. In contrast, with regard to thin wires (substrate) 1f), which are connected to the lower rotary blades by slits from the side of the second main surface 1b 31 to be produced, the edges of the substrate 1 curved in the direction of the second principal surface 1b, and accordingly the first principal surface 1a has a convex shape.

[0101] With regard to the in Fig. The 17 mechanical slots shown have the rotary blades. 31 , which are applied to the first main surface 1a, have an identical width to the rotary blades 31 , which are applied to the second main surface 1b. However, the rotary blades can 31 , which are attached to the second main surface 1b, have a previously defined width (for example 4 mm), and the rotary blades 31 The wires attached to the first main surface 1a can have a narrower width. In this way, the number of thinned wires (substrate) can be reduced. 1, which has the first principal surface 1a in a convex shape, as in Fig. 18), which are obtained by slitting the side of the second main surface 1b, are increased.

[0102] Next, on the in Fig. 18 substrates shown 1 An intermediate layer formation step (S20), a superconducting material layer formation step (S30), and a protective layer formation step (S40) are performed in this order. The intermediate layer formation step, the superconducting material layer formation step, and the protective layer formation step are each performed in a similar manner to the first embodiment. These steps are performed to thereby achieve the Fig. 15 multi-layer stacks shown 20 to form.

[0103] Next, a stabilization layer formation step (S50) is performed to form the stabilization layer. 9 on the circumferential edge of the multilayer stack 20The stabilization layer formation step is carried out in a similar manner to the first embodiment. These steps are carried out to thereby achieve the Fig. To produce the superconducting wire 10F shown in 15. Modification of the fifth embodiment

[0104] Fig. Figure 19 is a schematic cross-sectional view showing a configuration of a superconducting wire 10G according to a modification in the fifth embodiment. Fig. Figure 19 shows a cross-section in the direction perpendicular to the direction in which the superconducting wire 10G extends.

[0105] As in Fig. As can be seen in Figure 19, the superconducting wire 10G, according to the modification, basically has a similar structure to the one in Figure 19. Fig. 1 superconducting wire shown 10 , except that the structure of the multilayer stack 20 from the of in Fig. 2 multi-layer stacks shown 20 differs.

[0106] With regard to the superconducting wire 10G, the first principal surface 1a of the substrate 1 curved sections at the ends in the lateral direction of the substrate 1 Accordingly, the first principal surface 1a has an outwardly curved convex shape. The intermediate layer 3 , the superconducting material layer 5 and the protective layer 7 Each layer has a thickness that varies along its width. With regard to the 10G superconducting wire, the maximum thickness T2 of the superconducting material layer is... 5 , which is located on the second main surface 1b, is also smaller than the maximum thickness T1 of the superconducting material layer 5 , which is located on the first main surface 1a. The respective maximum thicknesses of the intermediate layer 3 and the protective layer 7, located on the second main surface 1b, are smaller than the respective maximum thicknesses of the intermediate layer 3 and the protective layer 7 , which are located on the first main area 1a.

[0107] Since the curved sections at the ends are in the lateral direction of the substrate 1 The agreement of the contraction of the intermediate layer can be found. 3 and the superconducting material layer 5 with the contraction of the substrate 1 The ends of the first main surface 1a are improved in the lateral direction. Accordingly, it can be prevented that the intermediate layer 3 and the superconducting material layer 5 from the substrate 1 replace.

[0108] Next, a method for producing a [product / service] will be described. Fig. The superconducting wire 10G shown in section 19 is described. Basically, the superconducting wire 10G can be created by carrying out the steps shown in Fig. The 16 steps shown (S10 to S70) are obtained. In the wire thinning step described above (S70), the wide substrate can be 1 by laser processing into those which each have a previously defined width, and the first main surface 1a of the resulting substrate 1 , which was cut, can be subject to a process of forming curved sections at the ends of the first principal surface 1a in the lateral direction of the substrate. 1 be subjected to this.

[0109] With regard to the configuration in which the superconducting material layer in the first to fifth embodiments is arranged such that it covers the side surface(s) of the substrate and at least a part of the second main surface, the configuration has been described above in which the intermediate layer, the superconducting material layer and the protective layer each cover the side surface(s) of the substrate and at least a part of the second main surface.However, the present invention is not limited to this configuration, but further comprises a configuration in which the intermediate layer and the superconducting material layer cover the side surface(s) of the substrate and cover at least a part of the second main surface, a configuration in which only the superconducting material layer covers the side surface(s) of the substrate and covers at least a part of the second main surface, and a configuration in which the superconducting material layer and the protective layer cover the side surface(s) of the substrate and cover at least a part of the second main surface.Among these configurations, the preferred configuration is one in which the interlayer and the superconducting material layer cover the side surface(s) of the substrate and cover at least part of the second main surface, because the orientation of the superconducting material layer can be improved not only in the first main surface, but also in the side surface(s) of the substrate and the second main surface of the substrate, and because detachment of the interlayer can be prevented.

[0110] Although the configuration in which the stabilizing layer is formed to cover the outer circumference of the multilayer stack is illustrated above in conjunction with the first to fifth embodiments, the stabilizing layer can also be arranged on at least the top surface of the multilayer stack. In this case, after the stabilizing layer has been formed on the protective layer, an insulating coating layer can be formed to cover the outer circumference of the superconducting wire in order to protect the superconducting wire.

[0111] It is understood that the embodiments disclosed in the present text serve in every respect only for illustration and not for limitation. It is intended that the scope of protection of the present invention be defined by the claims and not by the above description, and include all modifications and variations that are equivalent to the claims in meaning and scope of protection. Reference symbol list 1, 1e, 1f Substrat 3 Intermediate layer 5 superconducting material layer 7 Protective layer 9 Stabilizing layer 10, 10A-10G superconducting wire 20 multi-layer stacks 30 slot device 31 Rotary blade 32 spacers QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2013012406 [0003, 0004]

Claims

[1] Superconducting wire comprising: a substrate that has a first main surface and a second main surface located opposite the first main surface, and a superconducting material layer arranged on the first main surface of the substrate, wherein along at least a part of the superconducting wire in a direction in which the superconducting wire extends, the superconducting material layer is arranged such that it covers a side surface of the substrate in a width direction of the substrate, and covers at least a part of the second principal surface, wherein the thickness of the superconducting material layer located on the first main surface varies along the lateral direction, wherein a maximum thickness of the superconducting material layer located on the second principal surface is smaller than a maximum thickness of the superconducting material layer located on the first principal surface. [2] Superconducting wire according to claim 1, further comprising an intermediate layer arranged between the first main surface of the substrate and the superconducting material layer, wherein along at least a part of the superconducting wire in the direction in which the superconducting wire extends, the intermediate layer is arranged such that it covers the side surface of the substrate and at least a part of the second main surface, and a maximum thickness of the intermediate layer located on the second main surface is smaller than a maximum thickness of the intermediate layer located on the first main surface. [3] Superconducting wire according to claim 1 or 2, further comprising a protective layer formed on the superconducting material layer, wherein along at least a part of the superconducting wire in the direction in which the superconducting wire extends, the protective layer is arranged such that it covers the side surface of the substrate and at least a part of the second main surface, and a maximum thickness of the protective layer located on the second main surface is less than a maximum thickness of the protective layer located on the first main surface. [4] Superconducting wire according to any one of claims 1 to 3, wherein the thickness of the superconducting material layer located on the first principal surface varies along the width direction in such a way that the thickness of a central section of the superconducting material layer in the width direction is greater than the thickness of at least one end of the superconducting material layer in the width direction. [5] Superconducting wire according to any one of claims 1 to 3, wherein the thickness of the superconducting material layer located on the first principal surface varies along the width direction in such a way that the thickness of at least one end of the superconducting material layer in the width direction is greater than the thickness of a central section of the superconducting material layer in the width direction. [6] Superconducting wire according to any one of claims 1 to 5, wherein along at least a part of the superconducting wire in the direction in which the superconducting wire extends, the superconducting material layer located at one end of the second principal surface in the width direction is separated from the superconducting material layer located at another end of the second principal surface in the width direction. [7] Superconducting wire according to any one of claims 1 to 6, wherein the superconducting material layer is arranged directly or indirectly on the first principal surface of the substrate. [8] Superconducting wire according to any one of claims 1 to 7, wherein the first principal surface of the substrate includes a curved section. [9] Superconducting wire according to claim 8, wherein the curved section is arranged at one end of the first principal surface in the width direction. [10] Superconducting wire according to any one of claims 1 to 9, wherein the superconducting material layer consists of a superconducting oxide material.