Circuit layout and electrical distribution box

Abstract

Circuit arrangement (20, 60) comprising: a busbar substrate (30, 70) with several busbars (31, 71) arranged in different areas with spaces between them, and a plastic part (35) that rests against the underside and top surface of the busbars (31, 71), the plastic part (35) filling the spaces between adjacent busbars (31, 71); a press-fit element (50A, 50B) made of metal and pressed into the busbar substrate (30, 70); an electronic component (55) connected to the press-fit element (50A, 50B); solder (S) connecting the busbars (31, 71) and the press-fit element (50A, 50B); and a solder accumulation section (40, 73) which is formed with the plastic part (35) and in which the solder (S) is accumulated.

Description

Technical FieldThe present specification discloses a technique related to a circuit assembly and an electric junction box.General State of the ArtConventionally, a technique for pressing metal into a substrate is known. JP 2011-159 727 A discloses a substrate in which plastic layers and conductive layers made of thick copper are alternately stacked, and a copper insert press-fitted into a through hole formed in the substrate. When pressed into the through hole formed in the substrate, the copper insert abuts against holding members protruding from the conductive layers toward the center of the through hole, so that the holding members are bent and thus the copper insert and the holding members remain in contact with each other.JP 2015-47 032 A discloses a circuit structure including metal insert components, a circuit board in which conductive paths are formed on an insulating plate and which has press-in holes into which the insert components are press-inserted for connection to the conductive paths, and bus bars including metal plates and connected to the insert components. The insert components press-fitted into the press-fit holes of the circuit board are connected to the bus bars.JP 2016-122 679 A discloses a circuit body including a substrate having a surface on which an electronic component is mounted and in which openings are formed; and a conductive member that is a tabular member that is fixed on the other surface of the substrate and forms a conductive path. Relay elements formed of a conductive material and fixed on the surface of the conductive element on the substrate side are inserted into the openings formed on the substrate, and are connected to a plurality of terminals.WO 2011 / 113 867 A1 discloses a circuit unit having a printed circuit board, wherein the printed circuit board has at least one electronic component on a first surface of the printed circuit board, and wherein the printed circuit board has at least one busbar on the second surface facing away from the first surface having the electronic component, the busbar is fastened on the second surface of the printed circuit board by means of at least one fastening means and serves for the transmission of current and for the dissipation of heat.U.S. Pat. No. 6,395,999 B1 discloses a module comprising an aluminum-based metal substrate and at least one copper-based rail which forms an equipotential connection and is fastened to the substrate via an insulating layer. A power component is in direct contact with the rail over an area that is smaller than the area of the insulating layer. A printed circuit board mounted on and projecting from the rail carries components of the low heat dissipation module.JP 2016-134 957 A discloses a circuit structural body including a circuit board having a conductive path; a heat dissipation member on which the circuit board overlaps including a rough surface formed by forming a rough surface on the side of the circuit board; and an insulating layer formed by solidification on the rough surface. The printed circuit board is fixed with the insulation layer overlapping.SUMMARY OF THE INVENTIONTechnical TaskHere, in the above-described configuration, the holding parts protruding from the conductive layers are bent by the copper insert, but when the conductive layers are composed of a bus bar made of a metal plate material instead of thick copper, the bus bar is unlikely to be bent when the copper insert is press-fitted. Accordingly, a configuration is conceivable in which, when the bus bar and the pad are joined, the pad is press-fitted into a through hole formed in the bus bar, but in this case, a defect may occur in the connection between the pad and the bus bar if they do not have high dimensional accuracy, and thus there is concern that the reliability of the connection between the pad and the bus bar may decrease.The technique disclosed in the present specification has been made in view of the above circumstances, and an object thereof is to improve reliability of connection between a bus bar and a press-fit member.Solution of the ProblemA circuit arrangement according to the invention has the features of one of the independent claims 1, 4 or 5.According to such a configuration, the bus bar and the press-fit member are connected to each other via the solder accumulated in the solder accumulating portion, and thus it is possible to improve the reliability of connection between the bus bar and the press-fit member. In addition, the solder accumulating portion is formed with the resin member abutting on the bus bar, and thus it is possible to easily form the solder accumulating portion and easily shape-change the solder accumulating portion, so that the freedom of design can be increased.The following aspects are preferred as embodiments of the technique described in the present specification.The resin part may have a protrusion portion protruding from an end edge of the bus bar beyond the bus bar, and the press-fit member may be pressed to the protrusion portion.Thus, compared with a configuration in which the press-fit member is directly press-fitted into the bus bar, it is possible to suppress a press-fit defect that may occur due to an assembly accuracy error.The plastic part may have a press-in hole into which the press-in element is press-fitted.For example, when a press-fit member is directly press-fit into a through hole formed in a bus bar, high dimensional accuracy is required and thus press-fit is not easy. In addition, when a press-fit recess is provided in the bus bar by cutting an edge thereof, press-fitting a predetermined portion of the periphery of the press-fit member, and the remaining part thereof is not in contact with the bus bar, there is a problem that the retaining force of the bus bar upon holding the press-fit member is likely to decrease, although the operation for pressing the press-fit member is simple from pressing over the entire periphery thereof. According to this configuration, since the press-fit member is press-fitted into the press-fit hole formed in the plastic part, press-fitting of the press-fit member is easy, and at the same time, it is possible to suppress a decrease in the retaining force of the bus bar substrate when holding the press-fit member, since the press-fit member can be press-fitted over its entire circumference. Here, when the press-fitting is performed on the resin part in this manner, the configuration is such that a clearance is generated between the bus bar and the press-fitting member and the bus bar and the press-fitting member are not in direct contact with each other, but the electrical connection between the press-fitting member and the bus bar can be secured by the solder accumulated in the solder accumulating portion.An insulating substrate may be provided in which a conductive path is formed on an insulating plate and which is placed on the bus bar substrate, the press-fit member having a thickness larger than a thickness of the bus bar substrate, and a surface of the press-fit member to which the electronic component is connected is coplanar with a surface of the insulating substrate.Thus, it is possible to eliminate unevenness in connecting lead terminals of the electronic component to the press-fit member and the insulating substrate.A plurality of the press-fit members are connected to an electronic component, the resin part may have a partition portion that separates the adjacent press-fit members from each other, and the partition portion may protrude from a surface of the resin part that is located on the upper surface of the bus bar.Thus, movement of solder between the adjacent press-fit members is suppressed by the partitioning portion, making it possible to ensure insulation between the adjacent press-fit members.There is further provided an electrical junction box according to the invention as defined in independent claim 6, comprising the circuit arrangement and a housing in which the circuit arrangement is accommodated.Advantageous Effects of the InventionWith the technique described in the present specification, it is possible to improve the reliability of connection between a bus bar and a press-fit member.Brief Description of the DrawingsFIG. 1 is a perspective view illustrating an electric junction box according to Embodiment 1. FIG. 2 is an exploded perspective view of the electric connection box. FIG. 3 is a plan view illustrating a circuit arrangement. FIG. 4 is a cross-sectional view taken along line A-A in FIG. 3. FIG. 5 is a cross-sectional view taken along a line B-B in FIG. 3. FIG. 6 is a plan view illustrating a bus bar substrate. FIG. 7 is a cross-sectional view taken along a line C-C in FIG. 6. FIG. 8 is a cross-sectional view taken along a line D-D in FIG. 6. FIG. 9 is a perspective view illustrating a plurality of bus bars. FIG. 10 is a perspective view illustrating a method in which press-fit members are press-fitted into the bus bar substrate. FIG. 11 is a perspective view illustrating a method in which an insulating substrate and the bus bar substrate are bonded to each other. FIG. 12 is a perspective view illustrating a state in which the circuit assembly is closely attached to the upper surface of a heat dissipation member via an insulating layer. FIG. 13 is a cross-sectional view of a circuit arrangement according to Embodiment 2 taken along line A-A in FIG. 3. FIG. 14 is a cross-sectional view of the circuit taken along line B-B in FIG. 3. FIG. 15 is a cross-sectional view of the circuit taken along line C-C in FIG. 6. FIG. 16 is a cross-sectional view of the circuit taken along line D-D in FIG. 6.DESCRIPTION OF EMBODIMENTSEmbodiment 1An electric junction box 10 (FIG. 1 ) according to Embodiment 1 is installed in vehicles such as electric vehicles or hybrid vehicles on a path from a power source such as a battery to a load such as an engine. For the following description, it is assumed that the "X direction" leads forward, the "Y direction" leads leftward, and the "Z direction" leads upward.Electrical Junction Box 10As shown in FIG. 2, the electric junction box 10 is provided with a circuit assembly 20 and a housing 11 in which the circuit assembly 20 is accommodated. The housing 11 is made of metal such as aluminum or an aluminum alloy, and is provided with a heat dissipation member 12 that dissipates heat of the circuit assembly 20, and a cover 14 that covers the circuit assembly 20 from above.The heat dissipation member 12 has a flat top surface 12A and a bottom surface on which a plurality of heat dissipation fins 13 are comb-shaped. The circuit assembly 20 is bonded to the upper surface 12A of the heat dissipation member 12, for example, with an insulating adhesive, insulating adhesive sheet, or the like. It is noted that the circuit assembly 20 may also be screwed to the heat dissipation member 12 with screws (not shown).Circuit arrangement 20As shown in FIGS. 3 and 4, the circuit assembly 20 is provided with an insulating substrate 21 in which a conductive path is formed on an insulating plate, a bus bar substrate 30 on which the insulating substrate 21 is placed, press-fit members 50A and 50B press-fit into the bus bar substrate 30, and a plurality of electronic components 55 connected to the press-fit members 50A and 50B.Insulating Substrate 21The insulating substrate 21 has the shape of a substantially rectangular plate and has a configuration in which, on the upper surface of an insulating plate made of an insulating material, a conductive path (not shown) made of a conductive material such as copper foil is formed by printed wiring. The insulating substrate 21 has a plurality of insertion holes 22 into which the press-fit members 50A and 50B are insertable, and a plurality of through holes 23 for connecting the conductive path formed on the upper surface of the insulating substrate 21 to bus bars 31.Bus Bar Substrate 30The bus bar substrate 30 is in the form of a substantially rectangular plate almost completely overlying the insulating substrate 21, and is provided with the bus bars 31 and a plastic part 35 overlying and abutting the bus bars 31 in intimate (planar) contact therewith. The bus bar substrate 30 may be manufactured by insert molding, for example, in which the bus bars 31 are disposed in a mold.The bus bars 31 are formed by punching a metal plate material such as copper or copper alloy into the shape of a conductive path with a press, and are arranged with gaps in different areas on the same plane as shown in FIG. 9. Adjacent bus bars 31 have insertion recesses 32A and 32B into which press-fit members 50A and 50B are inserted with a space therebetween, the insertion recesses 32A and 32B being arranged opposite to each other.The plastic part 35 is made of, for example, an insulating synthetic resin such as an epoxy resin, and as shown in FIGS. 7 and 8, the plastic part 35 overlaps with a predetermined thickness the upper and lower sides of the bus bars 31 and fills the spaces between adjacent bus bars 31 except for the insertion recesses 32A and 32B. The portion of the plastic member 35 overlying the top surface of the bus bars 31 has a plurality of through holes 38 formed through this portion and configured to electrically connect the conductive path formed on the top surface of the insulating substrate 21 to the bus bars 31 by soldering or the like. The portion of the resin member 35 that overlies the lower surface (the one surface) of the bus bars 31 has, at locations that overlie the insertion recesses 32A and 32B of the bus bars 31, protrusion portions 36 that protrude beyond the bus bars 31 (toward the press-fit member 50A, 50B). Each protrusion portion 36 extends outward from the end edge of an insertion recess 32A or 32B, and the end edge of the protrusion portion 36 serves as the hole edge of a rectangular press-fit hole 37A or 37B into which the press-fit member 50A or 50B is press-fitted. The press-fit holes 37A and 37B are sized such that the press-fit members 50A and 50B are press-fit almost without clearance, respectively, and the press-fit holes 37A and 37B are formed through the bus bar substrate 30.Two adjacent press-fit holes 37A and 37B have different sizes. The resin member 35 has partitioning portions 39 each disposed in a space between adjacent press-fit members 50A and 50B to separate the adjacent press-fit members 50A and 50B from each other. The partitioning portions 39 are plate-shaped (wall-shaped) and have a thickness substantially equal to the thickness of the press-fit members 50A and 50B. The upper edges of the partition portions 39 are located above the top surface of the resin part 35 that overlies the top surface of the bus bars 31 (on the electronic component 55 side), and are formed coplanar with the top surface of the press-fit members 50A and 50B and the top surface of the insulating substrate 21. In addition, the lower edges of the partition portions 39 are formed coplanar with the lower surface of the press-fit members 50A and 50B and the lower surface of the resin member 35 that overlies the lower surface of the bus bars 31.As shown in FIGS. 4 and 5, solder accumulating portions 40 in which solder S accumulates are provided, the solder accumulating portions 40 being respectively formed by a protrusion portion 36, a side surface 53 of a press-fit member 50A or 50B, and an insertion recess 32A or 32B of a bus bar 31. The solder accumulating portion 40 extends in the form of a groove along the peripheral edge of the press-fit member 50A or 50B (the end edge of the insertion recess 32A or 32B), and has a groove bottom formed by the top of the protrusion portion 36, and a pair of groove walls formed by the side surface 53 of the press-fit member 50A or 50B and the insertion recess 32A or 32B, the pair of groove walls standing up from the groove bottom. Note that the solder accumulation portion 40 is formed on the entire periphery of the press-fit member 50A or 50B except for the side where the press-fit member 50A or 50B is in contact with the partition portion 39.The solder S accumulated in the solder accumulating portion 40 extends circularly around the press-fit member 50A or 50B (except for the partitioning portion 39), and electrically connects the space between the press-fit member 50A or 50B and the bus bar 31. The solder S can also be a lead-free solder, for example.Press-fit members 50A and 50BThe press-fit members 50A and 50B are formed by stamping a metal plate material such as copper or a copper alloy (for example, the same metal as the metal of the bus bars 31) with a press, and have the shape of a substantially rectangular plate having almost the same thickness as a superposition between the insulating substrate 21 and the bus bar substrate 30.Electronic Components 55The electronic components 55 are, for example, semiconductor switching elements such as field effect transistors (FETs), and are heat generating elements that generate heat depending on the current flowing therethrough. The electronic components 55 each include a body 56 having a box-shaped package and a plurality of lead terminals 57. One of the lead terminals 57 is provided at the bottom of the body 56, and the remaining lead terminals 57 are projected from a side surface of the body 56. The lead terminals 57 are soldered to the press-fit members 50A and 50B and the conductive pattern formed on the upper surface of the insulating substrate 21.A method of manufacturing the electric junction box 10 will be described.The bus bars 31 are formed by subjecting a metal plate material to press processing or the like (FIG. 9 ). Then, by performing insert molding in which the bus bars 31 are disposed in a mold, the bus bar substrate 30 is formed. Then, as shown in FIG. 10, the press-fit members 50A and 50B are press-fit into the press-fit holes 37A and 37B formed in the bus bar substrate 30. Then, as shown in FIG. 12, the insulating substrate 21 is bonded to the upper surface of the bus bar substrate 30 with an adhesive.Then, for example, solder paste is applied to the solder accumulating portions 40 and the upper surfaces of the press-fit members 50A and 50B, the electronic components 55 are placed on the press-fit members 50A and 50B, and reflow soldering is performed thereon. Accordingly, the solder paste melts and reaches the entirety (entire length) of the solder accumulating portions 40, so that the bus bars 31 and the press-fit members 50A and 50B are joined to each other by the solder, and the lead terminals 57 of the electronic components 55 are soldered to the press-fit members 50A and 50B. In this way, the circuit arrangement 20 is formed (FIG. 3 ). Then, the circuit assembly 20 is bonded to the upper surface of the heat dissipation member 12 with an adhesive or the like (FIG. 12 ), and the cover 14 is placed over the heat dissipation member 12 and fixed thereto with screws (not shown), so that the electric junction box 10 is formed (FIG. 1 ).According to the described embodiment, the following functions and effects can be obtained.The circuit assembly 20 is provided with the bus bar substrate 30 including the bus bars 31 and the resin part 35 abutting on the bus bars 31, the press-fit members 50A and 50B made of metal and press-fit into the bus bar substrate 30, the electronic components 55 connected to the press-fit members 50A and 50B, the solder S connecting the bus bars 31 and the press-fit members 50A and 50B, and the solder accumulation portions 40 formed with the resin part 35 and in which the solder S is accumulated.According to the present embodiment, the bus bars 31 and the press-fit members 50A and 50B are connected to each other via the solder S accumulated in the solder accumulating portions 40, and thus it is possible to improve the reliability of connection between the bus bars 31 and the press-fit members 50A and 50B press-fit into the bus bars 31. In addition, the solder accumulating portions 40 are formed with the resin member 35 abutting against the bus bars 31, and thus, it is possible to easily form the solder accumulating portions 40 and easily shape-change the solder accumulating portions 40, so that the freedom of design can be increased.In addition, the resin member 35 has the protrusion portions 36 protruding from the end edges of the bus bars 31 beyond the bus bars 31, and the press-fit members 50A and 50B are pressed to the protrusion portion 36.With this, compared with a configuration in which the press-fit members 50A and 50B are directly press-fitted into the bus bars 31, it is possible to suppress a press-fit defect that may occur due to a mounting accuracy error.In addition, the plastic part 35 has the press-fit holes 37A and 37B into which the press-fit members 50A and 50B are press-fit.For example, when the press-fit members 50A and 50B are directly press-fit into through holes formed in the bus bars 31, high dimensional accuracy is required and press-fit is thus not easy. In addition, when press-fit recesses are provided in the bus bars 31 by cutting edges thereof and a part of the peripheries of the press-fit members 50A and 50B is press-fit and the remaining part thereof is not in contact with the bus bars 31, despite the simplicity of the process of press-fitting the press-fit members 50A and 50B, there is a problem that the retaining force of the bus bars 31 when holding the press-fit members 50A and 50B is likely to decrease. According to the present embodiment, since the press-fit members 50A and 50B can be press-fit into the press-fit holes 37A and 37B formed in the plastic part 35, the press-fit of the press-fit members 50A and 50B is easy, and at the same time, it is possible to suppress a decrease in the retaining force of the bus bar substrate 30 in holding the press-fit members 50A and 50B because the press-fit members 50A and 50B can be press-fit over the entire circumference thereof. Here, when the press-fitting is performed on the resin part 35 in this manner, the configuration is such that a clearance is generated between the bus bars 31 and the press-fitting members 50A and 50B and the bus bars 31 and the press-fitting members 50A and 50B are not in direct contact with each other, but the electrical connection between the press-fitting members 50A and 50B and the bus bars 31 can be secured by the solder S accumulated in the solder accumulating portions 40.In addition, the insulating substrate 21 is provided in which a conductive path is formed on an insulating plate and which is placed on the bus bar substrate 30. The press-fit members 50A and 50B have a thickness larger than the thickness of the bus bar substrate 30, and the surfaces of the press-fit members 50A and 50B to which the electronic components 55 are connected are coplanar with a surface of the insulating substrate 21.With this, it is possible to eliminate unevenness in connecting the lead terminals 57 of the electronic components 55 to the press-fit members 50A and 50B and the insulating substrate 21.In addition, the press-fit members 50A and 50B connected to a single electronic component 55 are provided, the resin part 35 has a partition portion 39 that separates the adjacent press-fit members 50A and 50B from each other, and the partition portion 39 protrudes from the surface of the resin part 35 located on the upper side of the bus bars 31.With this, movement of the solder S between the adjacent press-fit members 50A and 50B is prevented by the partitioning portion 39, making it possible to ensure insulation between the adjacent press-fit members 50A and 50B.Embodiment 2Embodiment 2 will be described with reference to Figs. 13 to 16. In Embodiment 1, the press-fit members 50A and 50B are formed for press-fit into the press-fit holes 37A and 37B formed in the plastic member 35, whereas in Embodiment 2, as shown in FIG. 13, the press-fit members 50A and 50B are formed for press-fit into press-fit recesses 72A and 72B formed in the bus bars 31, and solder accumulating portions 73 each having a groove bottom formed by the top of a bus bar 31 are formed. The other configurations are the same as in Embodiment 1, and thus the same configurations as in Embodiment 1 are denoted by the same reference numerals below, and description thereof is omitted.A circuit assembly 60 is provided with an insulating substrate 21, a bus bar substrate 70 on which the insulating substrate 21 is placed, press-fit members 50A and 50B press-fitted into the bus bar substrate 70, and a plurality of electronic components 55. The bus bar substrate 70 is provided with a plurality of bus bars 71 and a plastic part 35 abutting on the bus bars 71.The bus bars 71 have the press-fit recesses 72A and 72B into which the press-fit members 50A and 50B are press-fitted. The press-fit recesses 72A and 72B have a shape cut out into a rectangle having such a size that three of the sides of the press-fit members 50A and 50B can be press-fit (a shape in which their inner spaces are slightly smaller than the press-fit recesses 32A and 32B). End portions 35A of the resin member 35 abutting on the upper surface of the bus bars 71 are spaced from the side surfaces 53 of the press-fit members 50A and 50B. Accordingly, solder accumulating portions 73 are formed in which solder S is accumulated, each solder accumulating portion 73 having a groove bottom formed by the top surface of a bus bar 71 (on the press-in recess 72A, 72B side) and a pair of groove walls formed by the side surface 53 of a press-in member 50A or 50B and an end portion 35A of the plastic member 35, the pair of groove walls standing up from the groove bottom. The solder accumulating portion 73 extends circularly in the shape of a groove along the peripheral edge of the corresponding press-fit member 50A or 50B (except for the partitioning portion 39).According to Embodiment 2, the bus bars 71 and the press-fit members 50A and 50B are connected to each other via the solder S accumulated in the solder accumulating portions 73, and the metal of the bus bars 71 and the metal of the press-fit members 50A and 50B are directly connected to each other, making it possible to improve the reliability of the electrical connection.Further EmbodimentsThe technique described in the present specification is not limited to the embodiments described in the above description with reference to the drawings, and the technical scope of the technique described in the present specification includes, for example, the following embodiments. (1) The shape and number of the press-fit members 50A and 50B are not limited to the shape and number in the foregoing embodiments. For example, the shape is not limited to a rectangle as in the foregoing embodiments, and may be a circle, an oval, or a polygon. In addition, the shape of the solder accumulating portions may be modified depending on the shape of the press-fit members, as appropriate. (2) The insulating substrate 21 may also be a multilayer substrate in which one or more conductive tracks are superimposed. (3) In the circuit assembly 20, the insulating substrate 21 and the bus bar substrate 30 constitute a circuit substrate, but the present invention is not limited thereto, and a configuration is also possible in which the insulating substrate 21 is not provided and only the bus bar substrate 30 functions as a circuit substrate. (4) As the electronic components 55, FETs are used, but the present invention is not limited thereto, and coils or capacitors may also be used as the electronic components 55, for example. (5) The soldering for connecting the bus bars 31 or 71 and the press-fit members 50A and 50B is not limited to reflow soldering, and various known methods can also be used for soldering.List of Reference Numbers10 Electrical junction box 11 Housing 20, 60 Circuit assembly 21 Insulating substrate 30, 70 Bus bar substrate 31, 71 Bus bar 32A, 32B Insertion recess 35 Plastic part 36 Protrusion portion 37A, 37B Press-fit hole 39 Partition portion 40, 73 Solder accumulation portion 50A, 50B Press-fit member 55 Electronic component 72A, 72B Press-fit recess S Solder

Claims

A circuit assembly (20, 60) comprising: a bus bar substrate (30, 70) having a plurality of bus bars (31, 71) disposed in different areas with spaces therebetween, and a plastic part (35) abutting on the bottom and top surfaces of the bus bars (31, 71), the plastic part (35) filling the spaces between adjacent bus bars (31, 71); a press-fit member (50A, 50B) made of metal and press-fitted into the bus bar substrate (30, 70); an electronic component (55) connected to the press-fit member (50A, 50B); solder (S) connecting the bus bars (31, 71) and the press-fit member (50A, 50B); and a solder accumulating portion (40, 73) formed with the plastic member (35) and in which the solder (S) is accumulated.The circuit assembly (20, 60) according to claim 1, wherein the plastic part (35) has a protrusion portion (36) protruding from an end edge of the bus bars (31, 71) beyond the bus bars (31, 71), and the press-fit member (50A, 50B) is pressed to the protrusion portion (36).The circuit assembly (20, 60) according to claim 1 or 2, wherein the plastic part (35) has a press-fit hole (37A, 37B) into which the press-fit member (50A, 50B) is press-fit.A circuit assembly (20, 60) comprising: a bus bar substrate (30, 70) including a bus bar (31, 71) and a resin part (35) abutting against the bus bar (31, 71); a press-fit member (50A, 50B) made of metal and press-fitted into the bus bar substrate (30, 70); an electronic component (55) connected to the press-fit member (50A, 50B); solder (S) connecting the bus bar (31, 71) and the press-fit member (50A, 50B); and a solder accumulating portion (40, 73) formed with the resin part (35) and in which the solder (S) is accumulated; an insulating substrate (21) in which a conductive path is formed on an insulating plate and which is placed on the bus bar substrate (30, 70), wherein the press-fit member (50A, 50B) has a thickness larger than a thickness of the bus bar substrate (30, 70), and a surface of the press-fit member (50A, 50B) to which the electronic component (55) is connected is coplanar with a surface of the insulating substrate (21).A circuit assembly (20, 60) comprising: a bus bar substrate (30, 70) including a bus bar (31, 71) and a resin part (35) abutting against the bus bar (31, 71); a plurality of press-fit members (50A, 50B) made of metal and press-fitted into the bus bar substrate (30, 70); an electronic component (55) connected to the press-fit members (50A, 50B); solder (S) connecting the bus bar (31, 71) and the press-fit members (50A, 50B); and a solder accumulating portion (40, 73) formed with the resin part (35) and in which the solder (S) is accumulated; wherein the plurality of press-fit members (50A, 50B) are connected to an electronic component (55), the plastic part (35) has a partition portion (39) which separates the adjacent press-fit members (50A, 50B) from each other, and the partition portion (39) protrudes from a surface of the plastic part (35) which is located on the upper side of the bus bar (31, 71).An electrical junction box (10) comprising: a circuit assembly (20) according to any one of claims 1 to 5; and a housing (11) in which the circuit assembly (20) is accommodated.

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