POWER MODULE

Abstract

A power module (300) having a module main body with a polygonal shape in plan view, the power module (300) comprising: a plurality of first active elements (157) configuring one of upper and lower branch circuits; a plurality of second active elements (155) configuring the other of the upper and lower branch circuits; and a first conductor (410) to which a collector electrode of each of the plurality of first active elements (157) is connected, the power module (300) further comprising: a second conductor (411) to which an emitter electrode of the plurality of second active elements (155) is connected; an AC side terminal (320B) protruding from one side of the module main body; a positive electrode side terminal (315B) and a negative electrode side terminal (319B) projecting from the other side (301b) different from the one side (301a) of the module main body; an intermediate electrode portion (414) connecting the first conductor (410) and the second conductor (411) to each other; and a first collector detection wiring (452a) in which the collector electrode of the first active element (157) and the first conductor (410) are connected to each other via a first detection connection section (415), wherein the intermediate electrode portion (414) is arranged near the first active element (157) which is closest to the AC side terminal (320B) among the plurality of first active elements (), and the first detection connection portion (415) is arranged near the first active element (157) which is farthest from the AC side terminal (320B) among the plurality of first active elements (157), wherein the first conductor (410) has an element side region portion provided on one side of the plurality of first active elements (157) in a thickness direction, and a wiring side region portion provided on a side opposite to the first active element (157) side in the thickness direction, and wherein the first detection connection portion (415) is connected to the wiring side portion via a metal joining member, and the AC side terminal (320B) is connected to the element side portion.

Description

Technical FieldThe present invention relates to a power module.Prior ArtPower conversion devices that adopt switching of power semiconductor elements have high conversion efficiency. Consequently, the power conversion devices are widely used in consumer, vehicle, railway and substation facilities. The power semiconductor elements generate heat when electric power is supplied thereto. Therefore, heat dissipation is strongly required. As a power module configuring the power conversion device, there is a power module having a structure in which an insulated gate bipolar transistor (IGBT) and a diode are clamped by a pair of metal plates and sealed with a molding resin. Terminals connected to the IGBT and the diode are exposed from the mold resin. The IGBT and the diode configure either an upper arm circuit or a lower arm circuit. In a power module having a 2-in-1 structure including either the upper arm circuit or the lower arm circuit, a structure is known in which a collector lead and a collector detection are formed integrally with a metal plate (see, for example, PTL 1).PTL 2 discloses a power module including embedded bus bars and an output bus arranged to reduce the parasitic inductance.Keep ListPatent LiteraturePTL 1: JP 2007-73 743 APTL 2: US 2006 / 0 290 689 A1SUMMARY OF THE INVENTIONTechnical ProblemPTL 1 has no disclosure regarding connection of collector detection in the power module having the 2-in-1 structure in which the circuits of the upper and lower arms are integrated with each other.Solution to the ProblemAccording to an aspect of the present invention, there is provided a power module including a module main body having a polygonal shape in a plan view. The power module includes a plurality of first active elements configuring one of upper and lower arm circuits, a plurality of second active elements configuring the other of the upper and lower arm circuits, a first conductor to which a collector electrode of each of the plurality of first active elements is connected, a second conductor to which an emitter electrode of the plurality of second active elements is connected, a positive electrode side terminal and a negative electrode side terminal protruding from one side of the module main body, an AC side terminal protruding from the other side different from the one side of the module main body, an intermediate electrode portion connecting the first conductor and the second conductor to each other, and a first collector sensing wiring having a first sensing connection portion, and wherein the collector electrode of the first active element and the first conductor are connected to each other via a first detection connection portion. The intermediate electrode portion is disposed near the first active element closest to the AC side terminal among the plurality of first active elements, and the first detection connection portion is disposed near the first active element farthest from the AC side terminal among the plurality of first active elements. The first conductor includes an element side region portion provided on a side of the plurality of first active elements in a thickness direction, and a wiring side region portion provided on a side opposite to the side of the first active element in the thickness direction. The first detection connection portion is connected to the wiring side portion via a metal joining member, and the AC side terminal is connected to the member side portion.Advantageous Effects of the InventionAccording to the present invention, detection accuracy of collector detection in detecting voltage can be improved.Brief Description of the Drawings[FIG. 1 ] FIG. 1 is an external perspective view of an embodiment of a power module according to the present invention.[FIG. 2 ] FIG. 2 is a cross-sectional view taken along line II-II of the power module illustrated in FIG. 1.[FIG. 3] FIG. 3 is a circuit diagram illustrating an example of a circuit of the power module illustrated in FIG. 1.[FIG. 4] FIGS. 4( a) to 4( c) are cross-sectional views in each step for describing a method of manufacturing the power module illustrated in FIG. 1.[FIG. 5 ] FIG. 5 ( a) and FIG. 5 ( b) are cross-sectional views in each step for describing a method of manufacturing the power module subsequent to FIGS. 4( a) to 4( c).[FIG. 6 ] Figs. 6(a) to 6(c) are perspective views of steps corresponding to Figs. 4(a) to 4(c), respectively.[FIG. 7 ] FIGS. 7( a) and 7( b) are perspective views of steps corresponding to FIGS. 5( a) and 5( b), respectively.[FIG. 8 ] FIG. 8( a) is a cross-sectional view of a step of performing resin molding by installing an unsealed module structural body in a mold, and FIG. 8( b) is an enlarged view of a region VIIIb in FIG. 8( a).[FIG. 9 ] FIG. 9( a) is a plan view illustrating a current flow in the power module according to the present invention, and FIG. 9( b) is a cross-sectional view taken along line IXb-IXb in FIG. 9( a).[FIG. 10] FIG. 10 is a plan view illustrating an arrangement relationship between a power terminal and a detection connection portion in the power module according to the present invention.[FIG. 11 ] FIG. 11( a) is a plan view illustrating a positional relationship between an active element arrangement region and the detection connection portion and an AC side electrode in the power module according to the present invention, and FIG. 11( b) is a cross-sectional view of the power module according to the present invention.[FIG. 12] FIG. 12 is a plan view of a power module of a comparative example, which is illustrated as a comparison with the power module according to the present invention illustrated in FIG. 10.[FIG. 13 ] FIG. 13 is a circuit diagram of a power conversion device using the power module according to the present invention.[FIG. 14] FIG. 14 is an external perspective view illustrating an example of the power conversion device illustrated in FIG. 13.[FIG. 15 ] FIG. 15 is a cross-sectional view taken along line XV-XV of the power conversion device illustrated in FIG. 14.[FIG. 16] FIG. 16 illustrates a power module provided with a cooling flow path illustrated in FIG. 15, FIG. 16( a) is a perspective view as viewed from above, and FIG. 16( b) is a perspective view as viewed from below.[FIG. 17 ] FIG. 17 is a cross-sectional view taken along the line XVII-XVII in FIG. 16( a).DESCRIPTION OF EMBODIMENTSHereinafter, an embodiment of the present invention will be described with reference to the drawings. The following description and drawings are examples for describing the present invention, and are omitted and simplified as appropriate for the purpose of explanation. The present invention may be implemented in various other forms. Unless otherwise stated, respective configuration elements may be expressed by a singular form or multiple forms.In some cases, a position, a size, a shape, or a range of the respective configuration elements illustrated in the drawings may not represent an actual position, size, shape, or an actual range in order to facilitate understanding of the invention. Therefore, the present invention is not necessarily limited to the position, size, shape, or range disclosed in the drawings.FIG. 1 is a plan view of an embodiment of a flow rate sensor according to the present invention as viewed from an upper surface side. FIG. 2 is a plan view of the flow rate sensor illustrated in FIG. 1 as viewed from a rear surface side. FIG. 3 is a cross-sectional view taken along line III-III of the flow rate sensor illustrated in FIG. 1. FIG. 4 is a cross-sectional view taken along line IV-IV of the flow rate sensor illustrated in FIG. 1.In the following description, an X direction, a Y direction, and a Z direction are as illustrated.FIG. 1 is an external perspective view of an embodiment of a power module according to the present invention.A power module 300 includes a power module main body 301 as a resin case in which internal electronic components are sealed with a resin 850, a fin base 800, a plurality of power terminals for inputting and outputting a large current, and a plurality of signal terminals for inputting and outputting a signal. The power module main body 301 has a substantially rectangular parallelepiped shape, in other words, a substantially rectangular shape, in a plan view when a main surface 302 having the largest area is viewed in a vertical direction. The plurality of power terminals and the plurality of signal terminals project from one side 301 aof the power module main body 301 in a length direction (X direction) and the other side 301 bfacing the one side. The fin base 800 having a large number of fins is provided on each of the main surface 302 of the power module main body 301 and a back surface 303 that is a facing surface of the main surface 302. An annular groove 802 is formed at an outer peripheral edge of each fin base 800.Power terminals such as a positive electrode side terminal 315B and a negative electrode side terminal 319B protrude from the other side 301 bof the power module main body 301. As the power terminal, an AC side terminal 320B protrudes from a side 301 aof the power module main body 301.Signal terminals such as a lower arm gate terminal 325L, a mirror emitter signal terminal 325M, a Kelvin emitter signal terminal 325K, and a collector detection signal terminal 325C protrude from the other side 301 bof the power module main body 301. Signal terminals such as an upper arm gate terminal 325U, a temperature detection signal terminal 325S, a mirror emitter signal terminal 325M, a Kelvin emitter signal terminal 325K, and a collector detection signal terminal 325C protrude from a side 301 aof the power module main body 301.A signal transmitted from the Kelvin emitter signal terminal 325K indicates a reference of a gate signal. A signal transmitted from the collector detection signal terminal 325C is used for short-circuit protection.As described later, the power module 300 includes upper and lower arm circuits. When any one of the circuits of the upper and lower arms is short-circuited, short-circuit protection is performed by opening an arm circuit on a side not short-circuited to bring a current into a shut-down state. A mirror emitter may also be used together with collector detection of each branch circuit in detecting the short circuit protection. Redundancy can be created using multiple detection methods together. A signal transmitted from the temperature detection signal terminal 325S is used in monitoring a temperature of an active element (to be described later). When the temperature of the active element is higher than a predetermined temperature, the signal is used for protecting the active element by suppressing an increase in temperature.In the present specification, the plurality of power terminals and the plurality of signal terminals for inputting and outputting the signal include the power terminal including the positive electrode side terminal 315B, the negative electrode side terminal 319B, and the AC side terminal 320B. In addition, the plurality of power terminals and the plurality of signal terminals also include the signal terminals such as the mirror emitter signal terminal 325M, the Kelvin emitter signal terminal 325K, and the collector detection signal terminal 325C.As illustrated in FIG. 1, the positive electrode side terminal 315B and the negative electrode side terminal 319B, which are the power terminals, and the AC side terminal 320B are provided so as to face the other side 301 band the one side 301 aof the power module main body 301. Moreover, the positive electrode side terminal 315B, the negative electrode side terminal 319B, and the AC side terminal 320B are arranged on a diagonal line.In addition, the collector detection signal terminal 325C protruding from one side 301 aof the power module main body 301 and the AC side terminal 320B are disposed apart from each other in the vicinity of one end of the one side 301 aand in the vicinity of the other end on an opposite side thereto. The collector detection signal terminal 325C protruding from the other side 301 bof the power module main body 301, the positive electrode side terminal 315B, and the negative electrode side terminal 319B are arranged away from each other in the vicinity of one end of the other side 301 band in the vicinity of the other end on an opposite side thereto. Therefore, the collector detection signal terminal 325C protruding from one side 301 aof the power module main body 301 and the collector detection signal terminal 325C protruding from the other side 301 bof the power module main body 301 are arranged on another diagonal line of the power module main body 301 having a rectangular shape.The plurality of power terminals and the plurality of signal terminals are bent vertically from a length direction (X direction) to a height direction (Z direction) and extend in the same direction. The plurality of signal terminals are oriented in the same direction. Consequently, a control circuit or a drive circuit is easily connected. In addition, a control terminal is protruded by being divided into two sides of one side 301 aand the other side 301 bof the power module main body 301. Consequently, a creepage distance or a space distance between the terminals is ensured.The positive electrode side terminal 315B and the negative electrode side terminal 319B are disposed adjacent to each other on the other side 301 bof the power module main body 301 in the Y direction. In addition, the positive electrode side terminal 315B and the negative electrode side terminal 319B are arranged to face a side surface that is a small area bent in an L shape, thereby obtaining an advantageous effect of reducing inductance while bringing input and output currents close to each other. In addition, the positive electrode side terminal 315B and the negative electrode side terminal 319B, which are DC terminals, are connected to a capacitor module 500 (see FIG. 13 ) connected to a battery. Consequently, both terminals protrude from the same other side 301 b, thereby obtaining an advantageous effect in that an inverter arrangement can be simplified. The AC side terminal 320B protrudes from a surface facing a surface from which a DC side terminal protrudes. The AC side terminal 320B is connected to a current sensor 180 (see FIG. 13 ), is thereafter output from the inverter, and is connected to motor generators 192 and 194 (see FIG. 13 ). Therefore, the AC side terminal 320B protrudes in a direction different from that of the DC terminal connected to the capacitor module 500. In this way, an advantageous effect is obtained in that the inverter arrangement can be simplified.FIG. 2 is a cross-sectional view taken along line II-II of the power module illustrated in FIG. 1. FIG. 3 is a circuit diagram illustrating an example of a circuit of the power module illustrated in FIG. 1.The power module 300 includes an upper arm circuit including a switching element including an active element 155 and a diode 156, and a lower arm circuit including a switching element including an active element 157 and a diode 158. As the active elements 155 and 157, transistors such as an insulated gate bipolar transistor (IGBT) and a metal oxide semiconductor field effect transistor (MOSFET) are used. As the diodes 156 and 158, a Schottky diode (SBD) and a fast recovery diode (FRD) are used. As illustrated in FIG. 3, the positive electrode side terminal 315B is connected to a third conductor 412. A collector electrode of the active element 155 configuring the switching element of the upper arm circuit and a cathode electrode of the diode 156 are electrically connected to each other through the third conductor 412. An emitter electrode of the active element 155 and an anode electrode of the diode 156 are electrically connected to each other by a second conductor 411.The negative electrode side terminal 319B is electrically connected to a fourth conductor 413. An emitter electrode of the active element 157 configuring the switching element of the lower arm circuit and an anode electrode of the diode 158 are electrically connected to each other through the fourth conductor 413. A collector electrode of the active element 157 and a cathode electrode of the diode 158 are electrically connected to each other by a first conductor 410. The first conductor 410 and the second conductor 411 are electrically connected to each other via an intermediate electrode portion 414. The AC side terminal 320B is electrically connected to the first conductor 410. The Kelvin emitter signal terminal 325K is connected to the emitter electrode and the collector electrode of each of the upper arm circuit and the lower arm circuit. The upper arm circuit collector detection signal terminal 325C is electrically connected to the third conductor 412, and the lower arm circuit collector detection signal terminal 325C is connected to the first conductor 410.An active element 155 is configured to include a plurality of active elements 155, such as shown in FIG. 9. As illustrated in FIG. 2, the collector electrode of the plurality of active elements 155 and the anode electrode of the plurality of diodes 156 are joined to the third conductor 412 via a metal joining member 51 such as solder and sintered metal. The emitter electrode of the plurality of active elements 155 and the cathode electrode of the plurality of diodes 156 are joined to the second conductor 411 via the metal joining member 51 such as solder and sintered metal. The collector electrode of the plurality of active elements 157 and the anode electrode (not illustrated in FIG. 2 ) of the plurality of diodes 158 are joined to the first conductor 410 via the metal joining member 51 such as solder and sintered metal. The emitter electrode of the plurality of active elements 157 and the cathode electrode (not illustrated in FIG. 2 ) of the plurality of diodes 158 are joined to the fourth conductor 413 via the metal joining member 51 such as solder and sintered metal. The first conductor 410 is joined to the intermediate electrode portion 414 (see FIG. 6( a) ) integrally connected to the second conductor 411 via the metal joining member 51. In this manner, the first conductor 410 and the second conductor 411 are electrically connected to each other. In the active elements 155 and 157, the entire lower surface is the collector electrode. In the diodes 156 and 158, the entire lower surface is the anode electrode. An active region of the upper surface is the cathode electrode.The first to fourth conductors 410 to 413 are formed of copper or aluminum, but other materials may be used as long as the materials have high electric conductivity. A collector-side wiring board 423 is disposed below the first conductor 410 and the third conductor 412 (in a -Z direction). The collector-side wiring board 423 is joined to the first conductor 410 and the third conductor 412 via the metal joining member 51 such as solder and sintered metal. The collector-side wiring board 423 is configured such that a wiring 452 made of copper or aluminum is formed on front and rear surfaces of an insulation plate 451 made of ceramic. The first conductor 410 and the third conductor 412 are joined to the wiring 452 via the metal joining member 51. The conductor or the wiring subjected to the metal joining may be plated or may be provided with fine irregularities to increase the joining strength. Each electrode of the respective active elements 155 and 157 is connected to the wiring formed in the collector-side wiring board 423 by a wire 840. The connection between each electrode of the respective active elements 155 and 157 and the wiring will be described later.An emitter-side wiring board 422 is disposed over the second conductor 411 and the fourth conductor 413 (in the Z direction). The emitter-side wiring board 422 is joined to the second conductor 411 and the fourth conductor 413 via the metal joining member 51 such as solder and sintered metal. The emitter-side wiring board 422 is configured such that a wiring 454 made of copper or aluminum is formed on front and rear surfaces of an insulation plate 453 made of ceramic. The second conductor 411 and the fourth conductor 413 are united with the wiring 454 formed in the emitter-side wiring board 422 via the metal joining member 51.The fin base 800 is integrated with each of the lower surface of the collector-side wiring board 423 and the upper surface of the emitter-side wiring board 422. The collector-side wiring board 423 or the emitter-side wiring board 422 and the fin base 800 are joined to each other via the metal joining member 51 such as solder and sintered metal.A space between the upper and lower fin bases 800 is sealed with a resin 850. The resin 850 is formed by, for example, transfer molding.FIGS. 4( a) to 4( c) are cross-sectional views in each step for describing a method of manufacturing the power module illustrated in FIG. 1. FIGS. 5( a) and 5( b) are cross-sectional views in each step for describing a method of manufacturing the power module subsequent to FIGS. 4( a) to 4( c). In addition, Figs. 6(a) to 6(c) are perspective views of steps corresponding to Figs. 4(a) to 4(c), respectively. Figs. 7(a) and 7(b) are perspective views of steps corresponding to Figs. 5(a) and 5(b), respectively.Referring to FIGS. 4(a) to 4(c), 5(a) and 5(b), 6(a) to 6(c) and 7(a) and 7(b), a method for manufacturing the power module 300 shown in FIG. 1 will be described.As illustrated in FIGS. 4( a) and 6( a), the collector electrode of the plurality of active elements 155 and the cathode electrode of the plurality of diodes 156 are joined to the third conductor 412 via the metal joining member 51. Also, the collector electrode of the plurality of active elements 157 and the cathode electrode of the plurality of diodes 158 are joined to the first conductor 410 via the metal joining member 51.In addition, the upper surface of the plurality of active elements 155 and the anode electrode of the plurality of diodes 156 are joined to the second conductor 411 via the metal joining member 51. Also, the upper surface of the plurality of active elements 155 and the anode electrode of the plurality of diodes 156 are joined to the fourth conductor 413 via the metal joining member 51.As illustrated in FIG. 9, the plurality of (four are illustrated in the embodiment) active elements 155 and diodes 156 are disposed between the third conductor 412 and the second conductor 411. Also, the plurality (four in the embodiment) of active elements 157 and diodes 158 are disposed between the first conductor 410 and the fourth conductor 413. The upper arm circuit and the lower arm circuit are configured to include the plurality of active elements 155 and 157 and the diodes 156 and 158. In this manner, a large current can be supplied to a load such as a motor.As illustrated in FIGS. 4( a) to 4( c), and FIGS. 5( a) and 5( b), the AC side terminal 320B having a thickness smaller than that of the first conductor 410 is formed integrally with the first conductor 410. In the AC side terminal 320B, an upper surface to which the active element 157 and the diode 158 are united is flush with an upper surface of the first conductor 410, and a lower surface side has a step recessed from the lower surface of the first conductor 410 (located upward in the Z direction in the drawing). In addition, the positive electrode side terminal 315B is integrally formed with the third conductor 412, and the negative electrode side terminal 319B is joined to an intermediate electrode 414A (see FIGS. 6 and 9 ) formed in the fourth conductor 413, for example, via a metal joining member.Next, as illustrated in FIGS. 4( b) and 6( b), the collector-side wiring board 423 is joined to the lower surface of the first conductor 410 and the third conductor 412 via the metal joining member 51. Each electrode of the respective active elements 155 and 157 is electrically connected to the wiring 452 of the collector-side wiring board 423 through the wire 840. In addition, each wiring 452 and all signal terminals illustrated in FIG. 1 are connected to each other by a wire 841. Figs. 4(b) and 6(b) illustrate only one of the wires 840 and 841. However, as shown in FIG. 9( a), a plurality of the wires 840 and 841 are provided, respectively. As shown in FIG. 6( b), the wiring 452 includes a collector detection wiring 452 a, and the collector detection wiring 452 ais connected to the collector detection signal terminal 325C by a wire 841 a.Next, as illustrated in FIGS. 4( c) and 6( c), the wiring 454 on the lower side (side in the -Z direction) of the emitter-side wiring board 422 is joined to the upper surface of the second conductor 411 and the fourth conductor 413 via the metal joining member 51.A power module structural body illustrated in FIGS. 4( c) and 6( c) is set as an unsealed module structural body 304.The present embodiment adopts a structure in which the first conductor 410 and the third conductor 412, which are the collector-side conductors, are separated from the collector-side wiring board 423. The thickness of the wiring 452 of the collector-side wiring board 423 is thin. However, since the thickness of the first conductor 410 and the third conductor 412 is thick, heat may be diffused in a planar direction. The thickness of the wiring 452 of the collector-side wiring platinum 423 is thinned. In this way, the collector-side wiring board 423 can be inexpensive. In addition, since the thickness of the wiring 452 is thin, a fine wiring pattern can be obtained. Therefore, an area of the collector-side wiring board 423 can be reduced, and a size thereof can be reduced.The same applies to the emitter side. The second conductor 411 and the fourth conductor 413, which are the emitter-side conductors, are separated from the emitter-side wiring board 422. In this manner, heat can be diffused in a planar direction through the second conductor 411 and the fourth conductor 413. In addition, the emitter-side wiring board 422 can be inexpensive, and a size thereof can be reduced.Next, as illustrated in FIGS. 5( a) and 7( a), the fin bases 800 are respectively joined to the lower surface of the collector side wiring board 423 and the upper surface of the emitter side wiring board 422 via the metal joining member 51. The fin base 800 is made of, for example, aluminum. When the wiring 452 of the emitter side wiring board 423 and the wiring 454 of the emitter side wiring board 422 are made of copper, the fin base 800 is distorted due to the thermal expansion difference between the aluminum and the copper. However, in the present embodiment, the fin bases 800 are respectively integrated with the collector side wiring board 423 integrated with the first conductor 410 and the third conductor 412 and the emitter side wiring board 422 integrated with the second conductor 411 and the fourth conductor 413 via the metal integration member 51. Consequently, it is possible to reduce the distortion when the fin base 800 is united. Therefore, a merging step of the fin base 800 may be a low pressure or no pressure merging process instead of a pressure merging process. In this way, manufacturing equipment costs can be reduced.A joining surface of the fin base 800 may be plated with nickel.In addition, the collector side wiring board 423 or the emitter side wiring board 422 may be previously joined to the fin base 800 via the metal joining member 51.Next, as illustrated in FIGS. 5( b) and 7( b), the unsealed module structural body 304 provided between the pair of upper and lower fin bases 800 is sealed with the resin 850. The sealing with the resin 850 is performed, for example, by means of resin molds such as transfer molding. Before resin molding, the unsealed module structural body 304 may be covered with a thin resin film.FIG. 8( a) is a cross-sectional view of a step of performing resin molding by installing the unsealed module structural body in a mold.As illustrated in FIG. 8( a), the unsealed module structural body 304 is installed in a cavity of a mold 852 configured to include a lower mold 852 aand an upper mold 852 bin a state in which the fin bases 800 are united with the upper and lower surfaces of the unsealed module structural body 304. A groove 802 is formed at an outer peripheral edge of each fin base 800, and an outer peripheral portion 806 which is a portion on the outer peripheral side of the groove 802 is brought into contact with a step portion 855 aof the lower die 852 aor a step portion 855 bof the upper die 852 b.FIG. 8( b) is an enlarged view of a region VIIIb in FIG. 8( a). However, in FIG. 8( b), the collector-side wiring board 423 is omitted from illustration.The length between the lower surfaces of the outer peripheral portions 806 of the upper and lower fin bases 800 is longer than the length between the step portion 855 aof the lower die 852 aand the step portion 855 bof the upper die 852 b. In addition, the length from the inner surface of the lower portion of the lower die 852 ato the upper surface of the step portion 855 ais longer than the length from the lower surface of the fin base 800 to the lower surface of the outer peripheral portion 806 of the fin base 800. Therefore, when the die 852 is clamped, the outer peripheral portion 806 is pressed against the upper surface of the step portion 855 aand the fin base 800 is bent in the groove 802. In this manner, a resin material 850S injected into the periphery of the unsealed module structural body 304 disposed between the pair of fin bases 800 does not leak to the fin base 800 side from a contact portion between the outer peripheral portion 806 and the step portion 855 aof the fin base 800.When the unsealed module structural body 304 with which the pair of fin bases 800 are united is strongly clamped by the mold 852, an excessive load is generated in the active elements 155 and 157. However, the groove 802 is provided in the fin base 800, and the fin base 800 is configured to be bent in the small load groove 802. Therefore, the stress acting on the active elements 155 and 157 can be relieved.In addition, a spring mechanism 854 is provided inside the mold 852. The spring mechanism 854 has a function of preventing peeling acting on the active elements 155 and 157 via the first to fourth conductors 410 to 413 or the collector-side and emitter-side wiring boards 422 and 423. That is, since the resin material 850S fills the periphery of the unsealed module structural body 304 installed in the cavity of the mold 852, a pressure acts on the upper and lower fin bases 800 so that a space between the fin bases 800 is widened. Therefore, a peeling force acts on the active elements 155 and 157 via the first to fourth conductors 410 to 413 or the collector-side and emitter-side wiring boards 423 and 422. A pressing force applied to the unsealed module structural body 304 by the spring mechanism 854 is set to be stronger than a pressing force applied to the unsealed module structural body 304 by a mold clamping force of the upper and lower molds 852 aand 852 b. In this manner, the peeling force acting on the active elements 155 and 157 can be canceled out.The active elements 155 and 157 are strong against the pressing force but weak against the peeling force, thereby causing breakage or failure. The pressing force applied to the unsealed module structural body 304 by the spring mechanism 854 is set to be stronger than the peeling force generated by the pressure of the resin material 850S. In this manner, it is possible to prevent the breakage or the failure of the active elements 155 and 157 during the resin molding.Although not illustrated, the first to fourth conductors 410 to 413, the power terminal, and the signal terminal are sealed up to a resin molding step in a state where the first to fourth conductors 410 to 413, the power terminal, and the signal terminal are connected by a connecting rod. After the resin molding, the connecting rod is cut and the power terminal and the signal terminal are machined into the predetermined shape. In this manner, the power module 300 illustrated in FIG. 1 can be obtained.FIG. 9( a) is a plan view illustrating a current flow in the power module according to the present invention.As illustrated in FIG. 3, the power module 300 according to the present embodiment has a 2-in-1 structure in which the upper arm circuit and the lower arm circuit are integrated with each other.In FIG. 9( a), the fin base 800, the resin 850, and the emitter-side wiring board 422 are not illustrated. The second conductor 411 and the fourth conductor 413, which are the emitter-side conductors, are illustrated in a semi-transparent manner, and an outer shape of the resin 850 is illustrated by a broken line. In addition, the current flow through the active elements 155 and 157 is represented by an arrow. In currents, a current flowing on the collector side is represented by a solid line, and a current flowing on the emitter side is represented by a broken line.The current intensively enters the positive electrode side terminal 315B, which is the power terminal connected to the positive electrode of the capacitor module 500 (see FIG. 13 ) from the capacitor side.The current entering from the positive electrode side terminal 315B is divided and enters each collector electrode of the plurality of active elements 155 through the third conductor 412 which is the collector side conductor of the upper arm circuit. The current entering the collector electrode of each active element 155 is output from the emitter electrode of each active element 155, flows to the inter-electrode portion 414 through the second conductor 411, which is the emitter-side conductor of the upper-arm circuit, and concentrates on the inter-electrode portion 414.The current concentrated at the intermediate electrode portion 414 flows to the first conductor 410 which is the collector-side conductor of the lower arm circuit. The current is divided into two current paths by the first conductor 410. One is a current path through which the current flows to the AC side electrode 406 which is the power terminal, and the other is a current path divided into a plurality of active elements 157. The AC side electrode 406 is a region inside the resin 850 connected to the AC side terminal 320B. The alternating current is supplied to motor generators 192 and 194 (see FIG. 13 ) through alternating current side electrode 406 and alternating current side terminal 320B.The current concentrated at the intermediate electrode portion 414 is divided and enters each collector electrode of the plurality of active elements 157 configuring the lower arm circuit from the intermediate electrode portion 414 through the first conductor 410. The current entering the collector electrode of each active element 157 is output from the emitter electrode of each active element 157, and concentrates again on the negative electrode side terminal 319B, which is the power terminal, through the fourth conductor 413 and the intermediate electrode 414A, which are the emitter side conductors of the lower arm circuit.That is, the current flowing from the capacitor module 500 side to the power module 300 intensively flows to the intermediate electrode portion 414 and the positive electrode side terminal 315B, the negative electrode side terminal 319B, and the AC side terminal 320B, which are the power terminals. Therefore, among the plurality of upper arm circuit active elements 155 and the plurality of lower arm circuit active elements 157, the current tends to concentrate on the active elements 155 and 157 near the positive electrode side terminal 315B, the negative electrode side terminal 319B, the AC side terminal 320B, and the intermediate electrode portion 414. On the other hand, the current tends to be less likely to concentrate on the active elements 155 and 157 other than the terminals.FIG. 9( b) is a cross-sectional view taken along the line IXb-IXb in FIG. 9( a).The fourth conductor 413 is joined to the upper surface side of the active element 157 via the metal joining member 51, and the emitter-side wiring board 422 is joined to the upper surface of the fourth conductor 413 via the metal joining member 51. The fin base 800 is joined to the upper surface of the emitter-side wiring board 422 via the metal joining member 51. The emitter-side wiring board 422 has a structure in which the wiring 454 is formed on each of the upper and lower surfaces of the insulation plate 453. The fourth conductor 413 is united with the wiring 454 on the lower surface side of the emitter-side wiring board 422 and the fin base 800 is united with the wiring 454 on the upper surface side of the emitter-side wiring board 422.The first conductor 410 is joined to the lower surface side of the active element 157 via the metal joining member 51, and the collector-side wiring board 423 is joined to the lower surface of the first conductor 410 via the metal joining member 51. The fin base 800 is joined to the lower surface of the collector-side wiring board 423 via the metal joining member 51. The collector-side wiring board 423 has a structure in which the wiring 452 is formed on each of the upper and lower surfaces of the insulation plate 451. The first conductor 410 is united with the upper surface side wiring 452 of the collector side wiring board 423, and the fin base 800 is united with the lower surface side wiring 452 of the collector side wiring board 423.The upper surface side wiring 452 of the collector side wiring board 423 includes the collector detection wiring 452 a(see FIG. 6( b)). The collector detection wiring 452 ais joined to the lower surface of the first conductor 410 via the metal joining member 51, and is electrically connected to the first conductor 410. In the collector detection wiring 452 a, a portion intersecting a side edge 410 aof the first conductor 410 is a detection connection portion 415. Although the above-described configuration illustrates a structure of a collector detection region on the lower arm side, a structure of a collector detection region on the upper arm side is the same.The lower arm side detection connection portion 415 is disposed in an end portion on a side in the Y direction opposite to an end portion at which the AC side terminal 320B is disposed in the side edge 410 aof the first conductor 410. In addition, the upper arm side detection connection portion 415 is disposed in an end portion on a side in the Y direction opposite to an end portion where the positive electrode side terminal 315B is disposed in a side edge 412 a(see FIG. 9( a) ) of the third conductor 412. The AC side terminal 320B and the positive electrode side terminal 315B are arranged on a diagonal line of the power module 300.In general, when there is a change in current, a voltage is influenced by self inductance L, current I, and time t, thereby generating an induced electromotive force V of -L(dl / dt). The induced electromotive force is added to a voltage to be detected by the collector detection. Consequently, the accuracy in detecting the voltage is deteriorated. A location where the current flows intensively has a large current change due to switching. Consequently, the induced electromotive force V increases. That is, the detection connection portion 415 that detects the voltage by the collector detection is separated from a current concentration portion. In this way, there is an advantageous effect in that the accuracy in detecting the voltage is improved. The power module 300 having the 2-in-1 structure incorporating the upper arm circuit and the lower arm circuit has the intermediate electrode portion 414. The intermediate electrode portion 414 is not found in a 1-in-1 structure in which the upper arm circuit and the lower arm circuit are not integrated with each other. The intermediate electrode portion 414 is the current concentration portion. Thus, the collector detection connection portion 415 is provided at a location away from any of the intermediate electrode portion 414, the positive electrode side terminal 315B, the negative electrode side terminal 319B, and the AC side terminal 320B. In this manner, the voltage can be more accurately detected.As illustrated in FIG. 9( b), the detection connection portion 415 is disposed on the lower surface on a side opposite (-Z direction) in the thickness direction to the upper surface of the first conductor 410 with which the active element 157 is united. In addition, as illustrated in FIGS. 4 and 5, the AC side terminal 320B is thinner than the first conductor 410. The lower surface of the AC side terminal 320B is disposed on the side of the upper surface to which the active element 157 is united, as compared with the lower surface of the first conductor 410. That is, in the thickness direction, the first conductor 410 includes an element side region portion provided on the active element 155 and 157 side and a wiring side region portion provided on a side opposite to the active element 155 and 157 side in the thickness direction. The detection connection portion 415 is connected to the wiring side region portion via the metal joining member 51, and the AC side terminal 320B is connected to the element side region portion. The detection connection portion 415 is disposed at a position away from the upper surface in the thickness direction of the first conductor 410 with which the active elements 155 and 157 of the first conductor 410 where the current concentrates are united. Therefore, the collector detection can detect the voltage more accurately.FIG. 10 is a plan view illustrating an arrangement relationship between the power terminal and the detection connection portion in the power module according to the present invention.In FIG. 10, the fin base 800, the resin 850, and the emitter-side wiring board 422 are not illustrated. The second conductor 411 and the fourth conductor 413, which are the emitter-side conductors, are illustrated in a semi-transparent manner, and the outer shape of the resin 850 is illustrated by a broken line. Also, a first line segment 417 connecting the positive electrode side terminal 315B and the AC side terminal 320B to each other, a second line segment 418 connecting the negative electrode side terminal 319B and the AC side terminal 320B to each other, and a third line segment 419 connecting the lower arm circuit detection connection portion 415 and the upper arm circuit detection connection portion 415 to each other are illustrated.As illustrated in FIG. 10, the first line segment 417 connecting the positive electrode side terminal 315B and the AC side terminal 320B together intersects the third line segment 419 connecting the lower arm circuit detection connection portion 415 and the upper second circuit detection connection portion 415 together. In addition, the second line segment 418, which connects the negative electrode side terminal 319B and the AC side terminal 320B to each other, intersects the third line segment 419, which connects the lower arm circuit detection connection portion 415 and the upper arm circuit detection connection portion 415 to each other.The power terminals such as the positive electrode side terminal 315B, the negative electrode side terminal 319B, and the AC side terminal 320B are thicker and wider than the signal terminals. Consequently, the weight of the power terminals is heavy. The first line segment 417 and the third line segment 419 intersect each other, and the second line segment 418 and the third line segment 419 intersect each other. In this manner, the heavy terminals are arranged on the diagonal line.According to this structure, when the fin base 800 is joined by soldering, weight imbalance caused by the power terminals gathered on one side of the unsealed module structural body 304 is prevented. In this manner, there is an advantageous effect in that the fin base 800 can be united to have a uniform thickness. In addition, the fin bases 800 are united to have the uniform thickness. Consequently, bending angles in the groove 802 of the fin base 800 may be substantially uniform in a state of being installed in the cavity of the mold 852 during transfer molding. Therefore, there is an advantageous effect in that the resin material 850S can be reliably prevented from leaking to the fin base 800 side. Further, a structure in which the third line segment 419 intersects the first line segment 417 and the second line segment 418 is adopted. In this manner, there is an advantageous effect in that the detection connection portion 415 is disposed in a position away from not only the power terminals such as the positive electrode side terminal 315B, the negative electrode side terminal 319B, and the AC side terminal 320B but also the intermediate electrode portion 414 that is the current concentration portion.FIG. 11( a) is a plan view illustrating a positional relationship between an array region of the active element and the detection connection portion and the AC side electrode in the power module according to the present invention. FIG. 11( b) is a cross-sectional view of the power module according to the present invention. Fig. 11(b) is the same as Fig. 2, but is again shown to facilitate understanding of comparison with Fig. 11(a).In FIG. 11( a), the fin base 800, the resin 850, and the emitter-side wiring board 422 are not illustrated. The second conductor 411 and the fourth conductor 413, which are emitter-side conductors, are illustrated in a semi-transparent manner, and the outer shape of the resin 850 is illustrated by a broken line.The plurality (four are illustrated in the embodiment) of active elements 157 united with the upper surface of the first conductor 410 configuring the lower arm circuit are arranged at a predetermined interval along a side edge 410 aof the first conductor 410. A region from the active element 157 closest to the detection connection portion 415 disposed on one end side in the Y direction of the side edge 410 aof the first conductor 410 to the active element 157 closest to the AC side terminal 320B disposed on the other end side in the Y direction of the side edge 410 aof the first conductor 410 is an element array region 416. In FIG. 11( a), the element arrangement area 416 is shaded.The lower arm circuit detection connection portion 415 is disposed outside the active element 157 that is the farthest in the element arrangement region 416 from the AC side terminal 320B.In this manner, the lower arm circuit detection connection portion 415 is disposed outside the active element 157 that is the farthest from the AC side terminal 320B in the element array region 416. In other words, the collector detection detection connection portion 415 is provided at a position away from the AC side terminal 320B where the current concentrates. Consequently, the collector detection can detect the voltage more accurately.FIG. 12 is a plan view of a power module according to a comparative example, which is shown in comparison with the power module according to the present invention shown in FIG. 10.In FIG. 12, the fin base 800, the resin 850, and the emitter-side wiring board 422 are not illustrated. The second conductor 411 and the fourth conductor 413, which are the emitter-side conductors, are illustrated in a semi-transparent manner, and the outer shape of the resin 850 is illustrated by a broken line. Also, the first line segment 417 connecting the positive electrode side terminal 315B and the AC side terminal 320B to each other, the second line segment 418 connecting the negative electrode side terminal 319B and the AC side terminal 320B to each other, and the third line segment 419 connecting the lower arm circuit detection connection portion 415 and the upper arm circuit collector detection connection portion 415 to each other are illustrated.As illustrated in FIG. 12, a power module 300R having a structure in which the third line segment 419 does not intersect the first line segment 417 and the second line segment 418 is manufactured as a comparative example. That is, in the power module 300R according to the comparative example, the AC side terminal 320B is not disposed on the diagonal line of the side facing the positive electrode side terminal 315B or the negative electrode side terminal 319B, and is disposed on substantially the same end portion side of the facing side. In addition, the detection connection portions 415 of the upper arm and the lower arm are disposed in an end portion on a side opposite to the power terminal side of the facing side.As described above, the power terminals such as the positive electrode side terminal 315B, the negative electrode side terminal 319B, and the AC side terminal 320B are thicker and wider than the signal terminals. Consequently, the weight of the power terminals is heavy. The heavy power terminals are disposed on the substantially same end portion side of the facing side. Therefore, when the fin base 800 is joined by soldering, the power terminals are gathered on one side, resulting in weight imbalance, and the fin base 800 has an uneven joining thickness. In addition, a structure in which the third line segment 419 intersects neither the first line segment 417 nor the second line segment 418 is adopted. As illustrated in FIG. 12, a structure is thus adopted such that the collector detection connection portion 415 of the lower arm circuit is close to the intermediate electrode portion 414 which is the current concentration portion. Therefore, a large induced electromotive force overlaps with the voltage detected by the collector detection, and the accuracy of the collector detection in detecting the voltage is deteriorated.FIG. 13 is a circuit diagram of a power conversion device using a power module according to the present invention.A power conversion device 200 includes inverter circuit units 140 and 142, an auxiliary machine inverter circuit unit 43, and a capacitor module 500. The inverter circuit units 140 and 142 include a plurality of the power modules 300 connected to each other to configure a three-phase bridge circuit. When the current capacity is large, the power modules 300 are further connected in parallel, and the parallel connection is performed corresponding to each phase of the three-phase inverter circuit. In this way, it is possible to cope with an increase in current capacity. In addition, the active elements 155 and 157 and the diodes 156 and 158, which are the power semiconductor elements incorporated in the power module 300, are connected in parallel. In this manner, it is also possible to cope with the increase in the current capacity.The inverter circuit unit 140 and the inverter circuit unit 142 have the same basic circuit configuration and have basically the same control method or operation. A schematic circuit operation of the inverter circuit unit 140 is well known, and thus the detailed description thereof will be omitted here.As described above, the upper arm circuit includes the upper arm active element 155 and the upper arm diode 156 as switching power semiconductor elements. The lower arm circuit includes the lower arm active element 157 and the lower arm diode 158 as switching power semiconductor elements. The active elements 155 and 157 perform a switching operation by receiving a drive signal output from one or the other of the two drive circuits configuring the drive circuit 174, and converts DC power supplied from a battery 136 into three-phase AC power.As described above, the upper arm active element 155 and the lower arm active element 157 include a collector electrode, an emitter electrode, and a gate electrode. The upper arm diode 156 and the lower arm diode 158 include two electrodes such as a cathode electrode and an anode electrode. As shown in FIG. 3, the cathode electrode of the diodes 156 and 158 is electrically connected to the collector electrode of the IGBTs 155 and 157, and the anode electrode is electrically connected to the emitter electrode of the active elements 155 and 157, respectively. In this manner, the current flows in a forward direction from the emitter electrode to the collector electrode of the upper-arm active element 155 and the lower-arm active element 157.A metal oxide semiconductor field effect transistor (MOSFET) may be used as the active element. In this case, the upper arm diode 156 and the lower arm diode 158 are unnecessary.The positive electrode side terminal 315B and the negative electrode side terminal 319B of the respective series circuits of the upper and lower arms are connected to capacitor connection DC terminals of the capacitor module 500, respectively. The AC power is generated in each connection portion between the upper arm circuit and the lower arm circuit, and the connection portion between the upper arm circuit and the lower arm circuit of the respective upper and lower arm series circuits is connected to the AC side terminal 320B of the respective power modules 300. The AC side terminals 320B of the respective power modules 300 having each phase are respectively connected to AC output terminals of the power conversion device 200, and the generated AC power is supplied to a stator winding of the motor generator 192 or 194.A control circuit 172 generates a timing signal for controlling the switching timing of the upper arm active element 155 and the lower arm active element 157 on the basis of input information from a vehicle side control device or a sensor (for example, the current sensor 180). The driving circuit 174 generates a driving signal for performing a switching operation on the upper arm active element 155 and the lower arm active element 157 on the basis of the timing signal output from the control circuit 172.Reference numerals 181, 182 and 188 represent merging elements.The series circuits of the upper and lower arms include a temperature sensor (not illustrated), and temperature information of the series circuits of the upper and lower arms is input to a microcomputer. In addition, voltage information on the DC positive electrode side of the series circuits of the upper and lower arms is input to the microcomputer. The microcomputer performs over-temperature detection and over-voltage detection based on the information. When an overtemperature or an overvoltage is detected, the microcomputer stops a switching operation of all the upper arm active elements 155 and all the lower arm active elements 157 to protect the series circuits of the upper and lower arms from the overtemperature or the overvoltage.FIG. 14 is an external perspective view illustrating an example of the power conversion device illustrated in FIG. 13. FIG. 14 is an external perspective view illustrating an example of the power conversion device illustrated in FIG. 13. FIG. 15 is a cross-sectional view taken along line XV-XV of the power conversion device illustrated in FIG. 14. In addition, FIG. 16 illustrates a power module provided with a cooling flow path illustrated in FIG. 15. FIG. 16( a) is a perspective view as viewed from above. FIG. 16( b) is a perspective view as viewed from below. FIG. 17 is a cross-sectional view taken along line XVII-XVII of FIG. 16( a).The power conversion device 200 is configured to include a lower case 11 and an upper case 10, and includes a housing 12 formed in a substantially rectangular parallelepiped shape. The housing 12 internally accommodates the cooling flow path power module 900 and the capacitor module 500 illustrated in FIG. 15. The cooling flow path power module 900 has a cooling flow path. A cooling water inflow pipe 13 and a cooling water outflow pipe 14 communicating with the cooling flow path protrude from a side surface of the housing 12. As illustrated in FIG. 15, the lower case 11 is open on the upper side (Z direction), and the upper case 10 is fixed to the lower case 11 by closing an opening of the lower case 11. The upper case 10 and the lower case 11 are made of aluminum alloy and are fixed to each other from the outside in a sealed state. The upper case 10 and the lower case 11 may be integrated with each other. The housing 12 has a simple rectangular parallelepiped shape. Consequently, the housing 12 can be easily mounted on a vehicle and can be easily manufactured.A joining member 17 is fixed to a side surface of the housing 12 in a longitudinal direction, and an AC terminal 18 is connected to the joining member 17. In addition, a merging member 21 is provided on a surface from which the cooling water inflow pipe 13 and the cooling water outflow pipe 14 are led out.As illustrated in FIG. 15, the power module 900 provided with a cooling flow path is accommodated inside the housing 12. The control circuit 172 and the drive circuit 174 are disposed above the cooling flow path power module 900 (Z direction), and the capacitor module 500 is accommodated below the cooling flow path power module 900 (-Z direction). As illustrated in FIG. 16, the power module 900 provided with the cooling flow path has a 6-in-1 structure including three power modules 300 having the 2-in-1 structure. That is, the cooling flow path power module 900 includes one of the inverter circuit units 140 and 142 illustrated in FIG. 13. In FIG. 16( b), in order to illustrate the arrangement of the power module 300, the fin base 800 is illustrated through a transparent flow path forming member 604.The AC side terminal 320B of the power module 300 penetrates the current sensor 180 and is united with a bus bar 361. In addition, the positive electrode side terminal 315B and the negative electrode side terminal 319B, which are DC terminals of the power module 300, are respectively united with the positive and negative electrode terminals 362A and 362B of the capacitor module 500.In the power module 300 illustrated in FIG. 15, the AC side terminal 320B is not bent and extends straight. In addition, the positive electrode side terminal 315B and the negative electrode side terminal 319B have a short shape cut on a root side.The power conversion device 200 is manufactured as follows.The capacitor module 500 is accommodated in the lower case 11. The cooling flow path power module 900 prepared in advance is accommodated in the capacitor module 500. The control circuit 172 and the drive circuit 174 are accommodated on the power module 900 provided with the cooling flow path. When the power module 900 provided with the cooling flow path is accommodated, the AC side terminal 320B of each power module 300 is joined to the bus bar 361. The positive electrode side terminal 315B and the negative electrode side terminal 319B are respectively united with the positive and negative electrode terminals 362A and 362B of the capacitor module 500. When the control circuit 172 and the drive circuit 174 are accommodated, the signal terminal of each power module 300 is connected to each connection terminal (not shown) of the control circuit 172 and the drive circuit 174. The power conversion device 200 illustrated in FIG. 14 is obtained as follows. The cooling flow path power module 900, the capacitor module 500, the control circuit 172, and the driving circuit 174 are accommodated in the lower case 11, and thereafter are sealed with the upper case 10.As illustrated in FIGS. 16( a), 16( b), and 17, the cooling flow path power module 900 has an elongated rectangular parallelepiped shape. The cooling flow path power module 900 includes a flow path cover 601 formed of an iron or aluminum alloy and a flow path case 602.As illustrated in FIG. 17, the flow path housing 602 includes an intermediate flow path member 603 and the flow path forming member 604. As illustrated in FIG. 16( b), the intermediate flow path member 603 internally accommodates three power modules 300 arranged in the longitudinal direction. The intermediate flow path member 603 includes an upper plate 611 and a lower plate 612, each of which has an opening into which the power module 300 is inserted. Each power module 300 is inserted into the opening of the upper plate 611 and the lower plate 612, and is disposed so that the resin 850 is accommodated inside the accommodation space 621 provided between the upper plate 611 and the lower plate 612. In this state, the upper and lower fin bases 800 of each power module 300 are respectively joined to joining portions 622 of the upper plate 611 and the lower plate 612. The fin base 800 and the top plate 611 or the bottom plate 612 may be joined by metal joining using a welding member or a metal melting member.The flow path forming member 604 has a flow path communicating with the cooling water inflow pipe 13 and the cooling water outflow pipe 14. In the intermediate flow path member 603, a connection portion 623 that connects the upper plate 611 and the lower plate 612 to each other is provided outside the accommodation space 621. The connecting portion 623 has a through hole 624 penetrating in an up-down direction. The cooling water flowing from the cooling water inflow pipe 13 flows into the intermediate flow path member 603 from a flow path, and cools the fin base 800 on the lower side. The cooling water flows into the upper side of the through hole 624 and cools the fin base 800 on the upper side. After cooling the fin base 800, the cooling water flows out of the cooling water outflow pipe 14 via the other flow path of the flow path forming member 604.In this manner, the power module 900 provided with the cooling flow path is formed with the 6-in-1 structure using three power modules 300 having the 2-in-1 structure. Each power module 300 causes the collector detection to accurately detect the voltage, and includes the plurality of active elements 155 and 157 provided between the conductors. Therefore, it is possible to obtain the power conversion device capable of supplying a large power.According to the embodiment of the present invention, the following advantageous effects are achieved.(1) The power module 300 includes the power module main body 301 having the first conductor 410 to which the plurality of active elements 157 configuring one of the upper and lower arm circuits are connected, and the second conductor 411 to which the plurality of active elements 155 configuring the other of the upper and lower arms are connected. In addition, the power module 300 includes the AC side terminal 320B protruding from one side 301 aof the power module main body 301, the positive electrode side terminal 315B and the negative electrode side terminal 319B protruding from the other side 301 bof the power module main body 301, the intermediate electrode portion 414 connecting the first conductor 410 and the second conductor 411 to each other, and the collector detection wiring 452 ain which the collector electrode of the active element 157 and the first conductor 410 are connected to each other via the detection connection portion 415. The intermediate electrode portion 414 is disposed near the active element 157 closest to the AC side terminal 320B among the plurality of active elements 157. The detection connection portion 415 is disposed near the active element 157 that is farthest from the AC side terminal 320B, among the plurality of active elements 157.According to the above-described configuration, the detection connection portion 415 is separated from the current concentration portion. Therefore, the voltage can be detected more accurately. In addition, the plurality of active elements 157 are connected to the first conductor 410 and the second conductor 411, respectively. Therefore, a large output can be obtained.(2) The power module 300 further includes the third conductor 412 facing the second conductor 411 with the active element 155 sandwiched therebetween, the fourth conductor 413 facing the first conductor 410 with the active element 157 sandwiched therebetween, and the collector detection wiring 452 ain which the collector electrode of the active element 155 and the third conductor 412 are connected to each other via the detection connection portion 415. The detection connection portion 415 is disposed near the active element 155 that is the farthest from the positive electrode side terminal 315B and the negative electrode side terminal 319B, among the plurality of active elements 155. According to the above-described configuration, the detection connection portion 415 is separated from the current concentration portion. Therefore, the voltage can be detected more accurately.(3) The plurality of active elements 157 include the element arrangement regions 416 arranged along the side edge 410 aat an interval from each other from the detection connection portion 415 side toward the AC side terminal 320B. The detection connection portion 415 is disposed outside the active element 155 that is the farthest in the element array region 416 as viewed from the AC side terminal 320B. In this manner, the detection connection portion 415 and the AC side terminal 320B are arranged so as to be separated from each other by at least the length of the element arrangement region 416, and are away from the current concentration portion. Therefore, the voltage can be detected more accurately.(4) The first conductor 410 includes the element side region portion provided on the side of the plurality of active elements 157 in the thickness direction and the wiring side region portion provided on the side opposite to the side of the active element 157 in the thickness direction. The detection connection portion 415 is connected to the wiring side portion via the metal joining member 51, and the AC side terminal 320B is connected to the element side portion. The detection connection portion 415 is disposed at the position away from the upper surface in the thickness direction of the first conductor 410 with which the active element 155 of the first conductor 410 where the current concentrates is united. Therefore, the collector detection can detect the voltage more accurately.In the above-described embodiment, the power module main body 301 has been described as an example adopting a structure having a substantially rectangular shape in a plan view. However, the power module main body 301 may be formed into a polygonal shape in addition to a triangular shape in a plan view.In the above-described embodiment, the power modules 300 and 900 having the 2-in-1 structure and the 6-in-1 structure in which the upper arm circuit and the lower circuit are integrated with each other have been described as examples. However, the power modules 300 and 900 are applicable to other structures such as a 3-in-1 structure and a 4-in-1 structure. The 3-in-1 structure includes, for example, a structure in which three upper arm circuits are encapsulated or a structure in which three lower arm circuits are encapsulated. An upper arm package in which three upper arm circuits are encapsulated may be combined with a lower arm package in which three lower arm circuits are encapsulated. In this manner, a power module having a 6-in-1 structure can be formed.In the above-described embodiment, a structure in which the collector-side wiring board 423 including the wiring 452 including the collector detection wiring 452 ais stacked on the first conductor 410 and the third conductor 412 has been described as an example. However, the collector sensing wiring 452 amay be integrated with the first conductor 410. Alternatively, a lead member for collector detection may be adopted instead of the collector detection wiring 452 a. In this structure, the wiring 452 other than the collector detection wiring 452 amay be adopted as the lead member. In this manner, it is possible to adopt a configuration in which the collector-side wiring board 423 is unnecessary.In the above-described embodiment, a structure in which the fin base 800 has the annular groove 802 has been described as an example. However, a structure in which the fin base 800 does not have the annular groove 802 may be adopted. In addition, a cooling structure can be formed in a case of accommodating the power module without providing the fin base 800.In the above-described embodiment, a structure in which the conductor and the wiring of the wiring board and the wiring of the wiring board and the fin plate are joined to each other via the metal joining member has been described as an example. However, instead of the joining via the metal joining member, other joining methods such as conductive adhesive, welding, and fusion joining performed by ion beam irradiation may be used.List of reference characters155 Active element (second active element) 156 Diode 157 Active element (first active element) 158 Diode 200 Power conversion device 300 Power module 301 Power module main body 301 aOne side 301 bOther side 304 Unsealed module structural body 315B Positive electrode side terminal 319B Negative electrode side terminal 320B Alternating current side terminal 325 Collector detection signal terminal 406 Alternating current side electrode 410 First conductor 411 Second conductor 412 Third conductor 413 Fourth conductor 414 Intermediate electrode portion 415 Detection connection portion 416 Element arrangement region 417 First line segment 418 Second line segment 419 Third line segment 451 Insulation plate 452 Wiring 452 a Collector detection wiring 800 Fin base 850 Resin 900 Cooling flow path-equipped power module

Claims

A power module (300) having a module main body having a polygonal shape in plan view, the power module (300) comprising: a plurality of first active elements (157) configuring one of circuits of the upper and lower arms; a plurality of second active elements (155) configuring the other of the circuits of the upper and lower arms; and a first conductor (410) to which a collector electrode of each of the plurality of first active elements (157) is connected, the power module (300) further comprising: a second conductor (411) to which an emitter electrode of the plurality of second active elements (155) is connected; an AC side terminal (320B) protruding from a side of the module main body; a positive electrode side terminal (315B) and a negative electrode side terminal (319B) protruding from the other side (301 b) different from the one side (301 a) of the module main body; an intermediate electrode portion (414) connecting the first conductor (410) and the second conductor (411); and a first collector detection wiring (452 a) in which the collector electrode of the first active element (157) and the first conductor (410) are connected to each other via a first detection connection portion (415), wherein the intermediate electrode portion (414) is disposed near the first active element (157) closest to the AC side terminal (320B) among the plurality of first active elements () and the first detection connection portion (415) is disposed near the first active element (157), the most remote from the AC side terminal (320B), out of the plurality of first active elements (157), wherein the first conductor (410) has an element side region portion provided on a side of the plurality of first active elements (157) in a thickness direction and a wiring side region portion provided on a side opposite to the side of the first active element (157) in the thickness direction, and wherein the first detection connection portion (415) is connected to the wiring side region portion via a metal joining member, and the AC side terminal (320B) is connected to the element side region portion.The power module (300) according to claim 1, further comprising: a third conductor (412) facing the second conductor (411), with the second active element (155) being sandwiched therebetween; a fourth conductor (413) facing the first conductor (410), with the first active element (157) being sandwiched therebetween; and a second collector detection wiring (452a) in which the collector electrode of the second active element (155) and the third conductor (412) are connected to each other via a second detection connection portion (415), the second detection connection portion (415) being disposed near the second active element (155) farthest from the positive electrode side terminal (315B) and the negative electrode side terminal (319B), among the plurality of second active elements (155).The power module (300) according to claim 2, wherein the module main body has a rectangular shape, and wherein when a straight line connecting the positive electrode side terminal (315B) and the AC side terminal (320B) to each other is defined as a first line segment (417), a straight line connecting the negative electrode side terminal (319B) and the AC side terminal (320B) to each other is defined as a second line segment (418), and a straight line connecting the first detection connection portion (415) and the second detection connection portion (415) to each other is defined as a third line segment (419), the AC terminal, the first detection connection portion (415), and the second detection connection portion (415) are arranged such that the third line segment (419) intersects the first line segment (417) and the second line segment (418).The power module (300) according to claim 1, wherein the plurality of first active elements (157) include element arrangement regions (416) arranged along the one side (301a) at an interval from the first detection connection portion (415) side toward the AC side terminal (320B), and wherein the first detection connection portion (415) is arranged outside the active element that is farthest in the element arrangement region (416) as viewed from the AC side terminal (320B).The power module (300) according to claim 1, wherein the AC side terminal (320B) is integrally formed with the element side portion of the first conductor (410).The power module (300) according to any one of claims 1 to 5, wherein the first detection connection portion (415) is provided in a collector detection wiring (452a) formed on a surface of an insulation plate (451).

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