PHOTO-ETCHED CHASSIS COOLING WALLS

Abstract

Housing (102) for electronic components, comprising: a plurality of outer walls, each outer wall comprising a thermally conductive material and an internal fluid channel within the respective outer wall for circulating cooling fluid; at least one partition wall structure (205) comprising a thermally conductive material and an internal fluid channel within the partition wall structure (205) in sealed fluid communication with the internal fluid channel of at least one outer wall of the plurality of outer walls, wherein the plurality of outer walls are interconnected to at least partially enclose a volume, and the at least one partition structure (205) is disposed within the volume and extends between two of the plurality of outer walls to define at least two compartments (212) each configured to receive electronic components; a fluid inlet port (180) in sealed fluid communication with the inner fluid channel of the at least one outer wall of the plurality of outer walls; and a fluid drain port (185) in sealed fluid communication with the inner fluid channel of the at least one outer wall of the plurality of outer walls, wherein the inner fluid channels of the plurality of outer walls and the inner fluid channel of the at least one partition wall structure (205) define a continuous fluid circulation path between the fluid inlet port (180) and the fluid outlet port (185).

Description

STATE OF THE ART

[0001] Electronic equipment such as computers and related components typically generate thermal energy (i.e., heat) during operation. The amount of heat generated can vary based on many factors, including the number and type(s) of electronic components, the operating condition of those components (and thus their power consumption), etc. Excessive temperature, in turn, can adversely affect the performance of electronic components.

[0002] US 4 829 402 A relates to a printed circuit board and chassis assembly comprising hollow plates for mounting printed circuit boards and a chassis provided with conduits connected to inlets and outlets in the surfaces of the hollow plates for circulating coolant.

[0003] DE 29 38 884 A1 relates to large electrical machines as used in power plants and concerns in particular junction boxes which form part of the dynamo-electric machine.

[0004] US 2004 / 0 057 211 A1 relates to an electronic device with a cooling device in which a cooling liquid circulates.

[0005] DE 43 11 839 A1 relates to a microcooling device for an electronic component with a silicon (Si) body which has a surface structured by means of recesses on at least one flat side, wherein the walls of these recesses are at least partly arranged obliquely with respect to the plane of the flat side and form heat exchange surfaces for a cooling medium. SHORT DESCRIPTION

[0006] A housing for electronic components according to claims 1 to 8, a housing system for electronic components according to claims 9 to 14 and a method for absorbing heat from an electronic component according to claims 15 to 20 are disclosed. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] For a detailed description of various examples, reference is now made to the attached drawings in which: Fig. 1 is a perspective view of a housing assembly for electronic components according to one or more examples of the present disclosure; Fig. 2 another perspective view of the housing arrangement for electronic components of Fig. 2 is; Fig. 3 is a perspective side view of a portion of the housing assembly for electronic components of Fig. 1 is; Fig. 4 illustrates a cooling fluid circulation path defined within a partition wall structure of an electronic component packaging assembly according to one or more examples of the present disclosure; Fig. 5 is a block diagram illustrating the use of multiple housing assemblies for electronic components according to one example; and Fig. 6 is a flowchart illustrating a method for enclosing an electronic component according to one or more examples of the present disclosure. DETAILED DESCRIPTION

[0008] As mentioned above, the amount of heat generated by electronic components can vary based on many factors, including the number and type(s) of electronic components, the operating state of those components (and thus their power consumption), etc. Electronic components such as semiconductor microprocessors and memory circuits can generate significant amounts of heat during operation. Excessive temperature can, in turn, adversely affect the performance of electronic components.

[0009] Computers and associated electronic components are often mounted and arranged in enclosures. Enclosures can physically protect the enclosed components from environmental conditions such as the ingress of dust and particles, moisture, etc., and facilitate the efficient assembly and installation of component systems, among other functions. However, because electronic equipment tends to generate heat, precautions must be taken to ensure that excessive heat does not accumulate around the enclosed components within the enclosures, as excessive heating can temporarily or permanently impair the functioning of the electronic components.These precautions include providing natural ventilation through enclosures, forced ventilation through the provision of electric fans, and the like, as well as providing other dedicated heat-dissipating components and structures such as heat sinks, circulating fluid cooling systems, and even completely immersing electronic components in dielectric fluids. Different approaches to heat dissipation for electronic systems can be perceived as having different advantages and disadvantages in terms of their relative cost, complexity, structural limitations, etc. Heat dissipation from electronic components and systems such as computers is particularly important for HPC (high-performance computing) systems, data and processing centers, and the like, which may contain large numbers of electronic systems capable of generating significant amounts of heat.

[0010] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the examples disclosed herein. However, it will be apparent to those skilled in the art that the disclosed example embodiments may be practiced without these specific details. In other instances, structure and devices are shown in block diagram form to avoid obscuring the disclosed examples. Moreover, the language used in this disclosure has been chosen primarily for readability and teaching purposes and may not be chosen to define or circumscribe the subject matter of the invention, relying on the claims necessary to define such subject matter.Reference in the specification to "a single example" or "an example" means that a particular function, structure, or property described in connection with the examples is included in at least one implementation.

[0011] The terms “electronic component” and “electronic device” as used herein shall broadly and generally refer to any electrically powered device or system, including but not limited to computing devices such as microprocessors, memory modules, and all related components that may be mounted and arranged on one or more printed circuit boards (PCBs), electrical power supplies and transformers, etc., all of which tend to radiate thermal energy (heat) during normal operation.

[0012] Heat generation by electronic components can be particularly problematic when such devices or systems are mounted in enclosures, either as individual devices or systems in dedicated enclosures or with equipment that may include multiple components designed to be mounted in racks or cabinets commonly used for such purposes.

[0013] Excessive temperatures can degrade the performance of electronic components and, in extreme cases, lead to component failure. Heat generation is becoming an increasing concern in the context of high-performance computing (HPC) and other large data storage or data processing systems, which may include numerous processors and large amounts of electronic memory. Such systems may employ multiple processor cards, memory units, magnetic and / or solid-state hard disk drives, power supplies, and / or other electronic components and be contained within one or more enclosures. It is therefore desirable to provide heat dissipation from the immediate vicinity of enclosed electronic components, particularly the interiors of enclosures in which such components are housed.

[0014] As mentioned above, various heat dissipation approaches have been implemented, including, for example, heat sinks, air circulation fans (with appropriate ventilation), and liquid-cooled systems in which a cooling fluid such as water circulates between a heat source and a heat sink. Some heat dissipation systems involve the complete immersion of components in dielectric fluids, such as mineral oil. Such approaches can be effective to varying degrees in capturing and conducting a fraction of the heat from the immediate environment of the electronic components or dissipating it in other ways, for example, to the exterior of the enclosure containing the electronic components.

[0015] There may be trade-offs between the advantages and disadvantages of different heat absorption / dissipation approaches for electronic components. For example, in approaches that require ventilating electronic component enclosures, such as with cooling fans and / or by convection, the presence of vents may undesirably reduce the enclosure's ability to protect the electrical components from external mechanical / physical conditions. Vented openings in an enclosure can allow the ingress of dust and other particles and, in addition to temperature, may not protect internal components from high humidity or other undesirable environmental conditions.Electric fans used to promote heat-dissipating air circulation consume electricity themselves (potentially contributing to heat generation) and represent an additional system component that consumes power, requires maintenance, and is subject to potential mechanical failure. Noise generation can also be a concern.

[0016] Liquid-cooled systems that utilize dedicated heat-absorbing structures, such as cold plates coupled with heat-exchanging cooling fluid circuits, can be effective at absorbing heat from electronic components and transferring the heat to a heat exchanger or the like outside the immediate vicinity of the components and their enclosures. These dedicated heat-absorbing structures must be designed and configured to be mounted either in direct contact with specific heat-generating electronic components or in sufficient proximity to such components to absorb a significant amount of the heat generated from the areas surrounding high-power devices, such as the CPU, DIMM, or HCA (Host Card Adapter).Such dedicated structures take up valuable space within the enclosures, undesirably increase the weight of the enclosures, and must each be incorporated into a cooling fluid circulation circuit with dedicated piping and fluid connections. Furthermore, the presence of liquids such as water circulating in close proximity to electronic components can be considered undesirable due to the risk of fluid leakage.

[0017] A problem can also arise in large data storage and / or data processing centers that may include HPC systems comprising a large number of enclosures within a single space, such as a room or building, which in turn may also be enclosed. Although heat can be effectively transferred to the exterior of individual enclosures using techniques as described above, the combined heat of a number of enclosures in a common enclosed space can lead to undesirable thermal ambient conditions within the common space itself. This, in turn, may require further adaptations, such as the provision of powerful and costly HVAC air conditioning and / or air exchange systems, to maintain the desired temperature and humidity conditions in the wider environment.

[0018] Therefore, it may be desirable to provide an enclosure for electronic components or systems that is capable of absorbing all or substantially all of the heat generated by the enclosed electronic components and dissipating the heat to an external location, such as a heat exchanger. It may also be desirable not to add weight or increase system size to achieve heat absorption. It may also be desirable to provide a fully sealed enclosure to prevent dust, moisture, and the like from entering the enclosure. A fully sealed system enables wider customer acceptance by allowing a more flexible range of deployments, independent of many environmental constraints.

[0019] Referring to Fig. 1 shows a perspective view of a housing assembly 100 for electronic components according to an example. The housing assembly 100 in Fig. 1 includes an outer casing having a top portion 111, a rear portion 113, first and second side portions 115 and 120, and first and second end portions 125 and 130. As described herein, the outer casing encloses and protects a substantially sealed enclosure 102. As used herein, the descriptor "substantially sealed" refers to an enclosure that does not allow air exchange between the exterior of the enclosure and the interior of the enclosure. In this illustrative example, the main enclosure 102 may have dimensions of approximately 61 cm (24 inches) wide, 50.8 cm (20 inches) high, and 101.6 cm (40 inches) long.

[0020] In the example of Fig. 1, the housing assembly 100 further comprises the first and second auxiliary housings 135 and 140. The auxiliary housing 135 includes an auxiliary side panel 145 (in the view of Fig. 1 not visible), an auxiliary deck fairing 150, an auxiliary end fairing 155 and opposing auxiliary end fairings (in the view of Fig. 1 not visible). The auxiliary casing 140 includes an auxiliary side fairing 160, an auxiliary deck fairing 165, an auxiliary end fairing 170 (and an opposite auxiliary end fairing shown in the view of Fig. 1 is not visible).

[0021] With further reference to Fig. 1, the housing assembly 100 is provided with a cooling fluid inlet port 180 and a cooling fluid outlet port 185. These ports 180, 185 allow the housing assembly 100 to be coupled to a fluid cooling circulation circuit as described below. In the example of Fig. 1, both ports 180 and 185 are shown, generally located near the bottom of the housing assembly 100. In an alternative example, the inflow port 180 may be arranged as shown, while the outflow port 185 is located at or near the top of the housing assembly. In still other examples, more than one inflow port 180 and / or one outflow port 185 may be provided to facilitate fluid flow.

[0022] Fig. 2 is another perspective view of the housing assembly 100 of Fig. 1. In Fig. 2, the housing assembly 100 is shown with respect to the orientation of Fig. 1 rotated by 180°; also in the view of Fig. 2, an end wall for the auxiliary housing 135 opposite the end panel 155 is not shown to reveal the internal structure of the auxiliary housing, and the end panel 130 of the main housing 102 is not shown to reveal the internal elements of the housing assembly 100.

[0023] As in Fig. 2, a plurality of internal partition wall structures 205 extend within the main housing 102. In this example, the partition wall structures 205 have dimensions that substantially correspond to the volume defined within the wall structures. The partition wall structures 205 may define one or more internal compartments 212 within the main housing 102, as described below. As also shown in Fig. 2, a plurality of partition structures 210 are provided within the space defined by the auxiliary housing 135, with the partition structures 210 defining a plurality of internal chambers within the auxiliary housing 135. (It should be understood that nearly as many partition structures—not shown—may be provided within the space defined by the auxiliary housings 135 and 140.)

[0024] Now referring to Fig. 3 is a perspective end view of a portion of the housing assembly 100 that includes a portion of the main housing 102. It should be noted that Fig. 3 is not to scale, and for clarity neither the deck cladding 111 nor the floor plate 106 is shown. As in Fig. 3, each partition structure 205 includes a substantially planar portion 302 extending between the lower wall structure 105 and the upper wall structure 110 of the main housing 102, which collectively define the plurality of compartments 212 within the main housing 102. Additionally, each partition structure 205 includes an integrated lower attachment portion 304 for attaching the partition structure 205 to the lower wall structure 105 and an upper attachment portion 306 for attaching the partition structure 205 to the upper wall structure 110.

[0025] Fig. 3 shows that the lower wall structure 105 is a laminar structure comprising a lamination of an upper layer 308 and a lower layer 310. In this example, both the upper and lower layers 308 and 310 are made of steel, although other metals and materials with suitable thermal conductivity, corrosion resistance, and mechanical strength may be used. As shown in Fig. 3, the lower layer 310 of the lower wall structure 105 is configured to define a plurality of inflow channels 312 between the lower layer 310 and the substantially planar upper layer 308. The inflow channels 312 are configured to be in sealed fluid communication with the fluid inflow port 180, as shown in Fig. 1, so that the cooling fluid 314 (e.g., water) can be directed into and circulated through the housing assembly 100. In one example, inflow channels are formed in the lower layer 310 by mechanical deformation of the material.

[0026] To maintain a sealed fluid circulation path through the housing assembly 100, welding, soldering, diffusion bonding, adhesives, or other suitable joining methods may also be used to seal the upper layer 308 to the lower layer 310 of the lower wall structure 105. This is achieved by the welded joints 316 in Fig. 3 shown.

[0027] Each partition structure 205, including each substantially planar portion 302, the lower attachment portion 304, and the upper attachment portion 306, includes at least one internal fluid channel that provides a path for circulating cooling fluid through the structure 205. In this example, each partition structure 205 is a laminar structure comprising at least an outer layer 318 and an inner layer 320. Both layers 318, 320 may be made of steel, although other metals or materials with sufficient thermal conductivity, corrosion resistance, and mechanical strength may be used. The outer layers 318 and the inner layers 320 are joined together by welding, diffusion bonding, or other suitable joining methods to form a laminated, substantially uniform, sealed structure.The outer layers 318 and the inner layers 320 are present in each section 302, 304, and 306 of each partition wall structure 205. Continuous, permanent connections, such as welding, diffusion bonding, etc., between the outer layer 318 and the inner layer 320 are shown in FIG. Fig. 3 is designated by the reference numerals 322.

[0028] In this example, one (or both) of layer 318 and inner layer 320 of each laminar septum structure 205 is fabricated to define sealed fluid circulation paths between outer layer 318 and inner layer 320. In one example, a layer such as layer 320 is photoetched to remove material in a pattern that defines at least one fluid circulation channel that provides fluid circulation between layers 318 and 320. Fluid circulation channels are Fig. 3 with the reference numeral 324. As with the two layers 308 and 310 of the lower wall structure 105, the outer layer 318 and the inner layer 320 of each partition wall structure may be fused together by any suitable means, such as welding, diffusion bonding, etc., so that circulation channels 324 are sealed to ensure that no cooling fluid circulating through the partition wall structures 205 escapes.

[0029] Photoetching is a proven technique for photochemically forming features in metal (or other materials) in a highly precise and repeatable manner. In this example, each profile 302 of the partition wall structures 205 may be on the order of 0.069 cm (0.027 inches) thick, with each outer layer and inner layer comprising approximately half of the total thickness. These dimensions are exemplary only, and the dimensions of specific implementations may vary. (It is again noted that Fig. 3 is not to scale.) However, the example shows that heat-absorbing baffle structures 205 can be included without occupying more volume within the main housing 102 than would be occupied by conventional structures in such housings and without significantly increasing the weight of the main housing 102 compared to heat-dissipating structures in which no fluid circulation channels are defined.

[0030] Using photoetching techniques, circulation channels 324 may be formed by etching a portion of the thickness of one or both of the outer layers 318 and the inner layers 320 of the partition wall structures 205. The outer layers 318 and the inner layers 320 may then be diffusion bonded, vacuum brazed, or otherwise joined together by suitable means to ensure that the circulation channels 324 are fluid-tight.

[0031] In this example, for each septum structure 205, the cooling fluid 314 is conveyed from the inflow channels 312 defined in the bottom wall 105 through an inflow port 326 formed in the upper layer 308 of the bottom wall 105, which in turn are aligned with the ports 328 defined in the outer layer 318 of the septum structure 205. In one example, the pattern 402 is formed in one or more layers of laminar structures such as the wall structures 105, 110, 115, 120, 125, and 130 and one or more septum structures 205 by a photo-etching process that can precisely and repeatably partially remove material from the desired layers.

[0032] An example of a pattern 402 for creating cooling fluid circulation channels 324 within a partition wall structure 205, and in particular in a substantially planar portion 302 of a partition wall structure, is shown in Fig. 4 shown.

[0033] In Fig. 3, dashed lines 330 show circulation paths for the fluid 314 from the inflow channel 314 through the ports 326 and 328 and through the partition wall structures 205. At the upper attachment portion 306 of each partition wall structure 205, the fluid 314 passes through a drain port 332 in the outer layer 318 of the partition wall structure 205 and a corresponding drain port 334 in a lower layer 336 of the upper wall structure 110 of the housing.

[0034] The fluid 314 passing through the ports 332 and 334 as just described is collected in the drainage channels 340 defined between the upper layer 338 and the lower layer 336 of the upper wall structure 110.

[0035] The upper wall structure 110 is configured substantially in the same manner as the lower wall structure 105, with a lower layer 336 and an upper layer 338 defining at least one sealed fluid drainage channel 340. For example, fluid drainage channels 340 may be formed by mechanically deforming the upper layer 338. The upper and lower layers 336 and 338 of the upper wall structure 110 may be joined in the same manner as the upper and lower layers 308 and 310 of the lower wall structure 105. This joining may be achieved, for example, by diffusion bonding techniques and may further include additional welded joints 316, as shown in Fig. 3. The drainage channels 340 defined within the upper wall structure 110 are in fluid communication with the cooling fluid drainage port 185 previously described with reference to Fig. 1 to enable the circulation of fluid through at least one continuous cooling fluid flow path defined by one or more wall structures 105, 110, 115, 120, 125 and 130 and one or more partition wall structures 205 of the housing assembly 100 between the inlet port 180 and the outlet port 185.

[0036] As in Fig. 3, a plurality of partition wall structures 205 may be provided within the main enclosure 102. In the present example, the combined heat dissipation surface area of the various components with fluid circulation paths defined therein, including the wall structures 105, 110, 115, 120, 125, and 130, as well as the partition wall structures 205, enhances the thermal dissipation performance of the enclosure assembly as a whole, thereby making it possible to implement an enclosure assembly 100 as a substantially sealed enclosure. It is contemplated that, although the enclosure 102 is substantially sealed, in one example, one or more internal fans may still be provided to enhance internal air circulation and thereby improve the heat dissipation capability within the enclosure 102.

[0037] Partition wall structures 205 may be attached to the lower wall structure 105 using fasteners of a suitable type (e.g., threaded fasteners, rivets, etc.). In the example of Fig. 3, a plurality of rivets 342 are shown at locations where no circulation path 324 exists between the upper layer 308 and the lower layer 310 of the lower wall structure 105 to ensure the integrity of the sealed cooling fluid circulation circuit. The rivets 342 secure each partition wall structure 205 to the lower wall structure 105 to ensure a fluid-tight connection between them. To further ensure the integrity of the cooling fluid circulation circuit, O-rings 344 may be provided, as shown in Fig. 3. Similar connections with rivets 342 and O-rings 344 can be made between the upper attachment portions 306 of the partition wall structures 205 and the upper wall structure 110.

[0038] With further reference to Fig. 1 and Fig. 2, in one example, the housing assembly 100 includes auxiliary housings 135 and 140, each containing a plurality of partition structures 210 therein. In this example, the auxiliary housings 135 and 140 may be used to house a plurality of power supply units (PSUs) that provide operating power to electronic components, such as processing units and storage units, housed within the main housing 102.

[0039] In this example, the auxiliary enclosures 135 and 140 may be constructed substantially according to the main enclosure 102 disclosed herein. This may include providing auxiliary enclosure sidewall structures 145 and 165, auxiliary enclosure upper wall structures 150 and 170, and the respective auxiliary enclosure endwall structures in the form of laminated, heat-absorbing laminate panels corresponding to the sidewall structures 110 and 115 and the partition wall structures 205 described herein with reference to Fig. 1 to 4. Fluid circulation paths formed in these structures can be introduced into the cooling fluid circulation circuit entering and exiting the housing assembly 100 through the cooling fluid inlet port 180 and outlet port 185.

[0040] In one example, operation of the housing assembly 100 is as follows: Lower temperature (i.e., chilled or ice-cooled) cooling fluid 314, such as water, is provided at the cooling fluid inlet port 180. The incoming cooling fluid may be supplied, for example, from a heat exchanger unit. The fluid inlet port 180 is in fluid communication with the inlet channels 312 formed in the bottom wall 105 of the assembly 100. The cooled fluid 314 follows a circulation path that extends within one or more partition wall structures 205 between the bottom wall structure 105 and the top wall structure 110. As cooling fluid traverses this circulation path, it absorbs heat within the housing assembly 100. A portion of the circulation path includes an attachment portion 304 of the one or more partition wall structures 205 for creating a fluid-tight seal between the partition wall structures 205 and the lower wall structure 105.Another part of the circulation path includes an attachment portion 306 of the one or more partition wall structures 205 for creating a fluid-tight seal between the partition wall structures 205 and the top wall structure 110. The cooling fluid 314 flows into the drainage channels 340 defined in the top wall structure 110. The drainage channels 340, in turn, are in fluid communication with the cooling fluid drainage port 185, from which cooling fluid that absorbs heat within the housing assembly 100 is returned to a heat exchange unit where the heat absorbed along the fluid circulation path can be extracted.

[0041] Fig. 5 is a schematic / block diagram illustrating an example of inserting multiple housings for electronic components such as the housing assembly 100 of Fig. 1. In the example of Fig. 5, a plurality of heat-absorbing enclosure assemblies 500-1, 500-2, ... 500-N (collectively, enclosure assemblies 500) are deployed in a common environment 502, which may be a data or data processing center or the like. The common environment 502 may be of essentially any size, ranging from a single room to an entire building.

[0042] As in Fig. 5, each housing assembly 500 is provided with a cooling fluid inlet port 580 and a cooling fluid outlet port 585, which are substantially the same as described with respect to the cooling fluid inlet port 180 and the outlet port 185 for the housing assembly 100 described above. With the ports 580 and 585, the housing assemblies 500 are incorporated into a cooling fluid circulation circuit 503, which also includes a heat exchanger 504.

[0043] The heat exchanger 504 is adapted to receive heated cooling fluid such as water at a fluid inlet 506 and to use one of many known methods to extract heat from the fluid, wherein the heated input fluid is directed as indicated by arrow 508 in Fig. 5. After the heat exchange, the circulation circuit 503 continues, with the now cooled fluid being returned via a fluid outlet 510, the fluid flow being directed as indicated by the arrow 512 in Fig. 5. The cooled fluid returns to the environment 502 and is then distributed to the cooling fluid inlet ports 585 of the housing assemblies 500.

[0044] With the goal of achieving thermal neutrality of the adjacent room environment (outside the enclosure 100 / 500) for enclosure assemblies 500 while electronic components are operating therein, the fluid connections comprising any part of the circulation circuit 503 located within the environment 502 may be provided with suitable thermal insulation, thereby preventing or minimizing the transfer of absorbed heat to the environment 502.

[0045] Fig. 6 is a flowchart illustrating a method 600 for enclosing an electronic component according to an example. As in Fig. 6, block 602 represents enclosing an electronic component in a substantially sealed housing including a plurality of thermally conductive outer walls and a partition structure. Block 604 in Fig.6 illustrates circulating cooling fluid in a continuous loop through an internal fluid channel in at least one of the plurality of outer walls and an internal fluid channel in the partition wall structure.

[0046] The foregoing discussion is intended to illustrate the principles and various implementations of the present disclosure. Numerous variations and modifications will become apparent to those skilled in the art after the foregoing disclosure is fully appreciated. It is intended that the following claims be interpreted to encompass all such variations and modifications.

Claims

[1] Housing (102) for electronic components, comprising: a plurality of outer walls, each outer wall comprising a thermally conductive material and an internal fluid channel within the respective outer wall for circulating cooling fluid; at least one partition wall structure (205) comprising a thermally conductive material and an internal fluid channel within the partition wall structure (205) in sealed fluid communication with the internal fluid channel of at least one outer wall of the plurality of outer walls, wherein the plurality of outer walls are interconnected to at least partially enclose a volume, and the at least one partition structure (205) is disposed within the volume and extends between two of the plurality of outer walls to define at least two compartments (212) each configured to receive electronic components; a fluid inlet port (180) in sealed fluid communication with the inner fluid channel of the at least one outer wall of the plurality of outer walls; and a fluid drain port (185) in sealed fluid communication with the inner fluid channel of the at least one outer wall of the plurality of outer walls, wherein the inner fluid channels of the plurality of outer walls and the inner fluid channel of the at least one partition wall structure (205) define a continuous fluid circulation path between the fluid inlet port (180) and the fluid outlet port (185). [2] The electronic component housing (102) of claim 1, wherein each of the plurality of outer walls comprises a laminar structure including first and second layers defining the internal fluid channel therebetween, the first layer comprising a first outer surface of the respective outer wall and the second layer comprising a second outer surface of the respective outer wall on a side of the respective outer wall opposite the first outer surface. [3] The electronic component package (102) of claim 2, wherein the at least one partition wall structure (205) comprises a laminar structure including first and second layers (318, 320) defining the internal fluid channel therebetween, the internal fluid channel of the at least one partition wall structure (205) being in sealed fluid communication with the internal fluid channel of the at least one outer wall of the plurality of outer walls. [4] The electronic component housing (102) of claim 3, wherein the plurality of outer walls and the at least one partition wall structure (205) are formed of steel. [5] Housing (102) for electronic components according to claim 1, wherein each of the plurality of outer walls has a first surface facing into the volume and a second surface opposite the first surface and facing out of the housing (102), and the inner fluid channel of the respective outer wall is disposed between the first and second surfaces of the respective outer wall; and wherein the at least one partition structure (205) comprises a first surface facing into one of the at least two compartments (212) and a second surface opposite the first surface facing into another of the at least two compartments (212), and the internal fluid channel of the at least one partition structure (205) is arranged between the first and second surfaces of the at least one partition structure (205). [6] The housing (102) for electronic components according to claim 1, wherein the at least one partition wall structure (205) comprises at least one connecting portion for establishing a sealed fluid connection between the inner fluid channel of the at least one partition wall structure (205) and the inner fluid channel of the at least one outer wall. [7] The housing (102) for electronic components according to claim 1, wherein the inner fluid channel is sealed within the respective outer wall. [8] The electronic component housing (102) of claim 7, wherein the internal fluid channel is sealed within the at least one partition wall structure (205). [9] Housing system for electronic components, comprising: a substantially sealed heat-absorbing housing (102), the housing (102) comprising: a plurality of outer walls, each outer wall comprising a thermally conductive material and an internal fluid channel within the respective outer wall for circulating cooling fluid; at least one partition structure (205) defining at least one compartment within the plurality of outer walls, the at least one partition structure (205) comprising a thermally conductive material and an internal fluid channel within the partition structure (205) in sealed fluid communication with the internal fluid channel of at least one outer wall of the plurality of outer walls, wherein the plurality of outer walls are interconnected to at least partially enclose a volume, and the at least one partition structure (205) is disposed within the volume and extends between two of the plurality of outer walls to define at least two compartments (212) each configured to receive electronic components; a fluid inlet port (180) in sealed fluid communication with the inner fluid channel of the at least one outer wall of the plurality of outer walls; and a fluid drain port (185) in sealed fluid communication with the inner fluid channel of the at least one outer wall of the plurality of outer walls, wherein the inner fluid channels of the plurality of outer walls and the inner fluid channel of the at least one partition wall structure (205) define at least one fluid circulation path between the fluid inlet port (180) and the fluid outlet port (185); and a heat exchanger (504) coupled to the fluid inlet port (180) and the fluid outlet port (185) of the housing (102), the heat exchanger (504) serving to circulate cooling fluid through the at least one fluid circulation path. [10] The housing system of claim 9, wherein each outer wall of the plurality of outer walls comprises a laminar structure including first and second layers defining the internal fluid channel therebetween, the first layer comprising a first outer surface of the respective outer wall and the second layer comprising a second outer surface of the respective outer wall on a side of the respective outer wall opposite the first outer surface. [11] The housing system of claim 10, wherein the at least one partition wall structure (205) comprises a laminar structure comprising first and second layers (318, 320) defining the internal fluid channel therebetween, the internal fluid channel of the at least one partition wall structure (205) being in sealed fluid communication with the internal fluid channel of the at least one outer wall of the plurality of outer walls. [12] The enclosure system of claim 11, wherein the plurality of exterior walls and the at least one partition wall structure (205) are formed of steel. [13] Housing system according to claim 9, wherein each of the plurality of outer walls has a first surface facing into the volume and a second surface opposite the first surface and facing out of the housing (102), and the inner fluid channel of the respective outer wall is disposed between the first and second surfaces of the respective outer wall; and wherein the at least one partition structure (205) comprises a first surface facing into one of the at least two compartments (212) and a second surface opposite the first surface facing into another of the at least two compartments (212), and the internal fluid channel of the at least one partition structure (205) is arranged between the first and second surfaces of the at least one partition structure (205). [14] The housing system of claim 9, wherein the at least one partition wall structure (205) comprises at least one connecting portion for establishing a sealed fluid connection between the inner fluid channel of the at least one partition wall structure (205) and the inner fluid channel of the at least one outer wall of the plurality of outer walls. [15] A method (600) for absorbing heat from an electronic component, comprising: Enclosing (602) the electronic component in a substantially sealed housing (102) comprising a plurality of outer walls and at least one partition structure (205) defining at least one compartment within the housing (102), wherein the plurality of outer walls are connected to each other to at least partially enclose a volume, and the at least one partition structure (205) is disposed within the volume and extends between two of the plurality of outer walls to define at least two compartments (212), one of which encloses the electronic component; and Circulating (604) cooling fluid in at least one circuit through an internal fluid channel in each of the outer walls and an internal fluid channel in the at least one partition structure (205), wherein the fluid channel in the at least one partition structure (205) is in sealed fluid communication with the internal fluid channel of at least one outer wall of the plurality of outer walls, wherein for each of the outer walls the internal fluid channel is located within the respective outer wall and the internal fluid channel of the at least one partition structure (205) is located within the at least one partition structure (205). [16] The method (600) of claim 15, further comprising: Forming each outer wall of the plurality of outer walls as a laminar structure including first and second layers defining the internal fluid channel therebetween, the first layer comprising a first outer surface of the respective outer wall and the second layer comprising a second outer surface of the respective outer wall on a side of the respective outer wall opposite the first outer surface. [17] The method (600) of claim 16, further comprising: Forming the at least one partition wall structure (205) as a laminar structure including the first and second layers (318, 320) defining the internal fluid channel therebetween. [18] The method (600) of claim 17, further comprising: Forming the plurality of exterior walls and the at least one partition wall structure (205) from steel. [19] The method (600) of claim 18, further comprising: Photoetching at least one of the first and second layers of each outer wall of the plurality of outer walls to form the internal fluid channels of the plurality of outer walls; and Photoetching at least one of the first and second layers (318, 320) of the at least one partition structure (205) to form the internal fluid channel of the at least one partition structure (205). [20] Method (600) according to claim 15, wherein each of the plurality of outer walls comprises a first surface facing into the volume and a second surface opposite the first surface and facing out of the housing (102), and the inner fluid channel of the respective outer wall is disposed between the first and second surfaces of the respective outer wall; and wherein the at least one partition structure (205) comprises a first surface facing into one of the at least two compartments (212) and a second surface opposite the first surface facing into another of the at least two compartments (212), and the internal fluid channel of the at least one partition structure (205) is arranged between the first and second surfaces of the at least one partition structure (205).

Images