Electronic component and electronic device including thermally bonded metal members

Abstract

According to various embodiments, an electronic component comprises: a housing including a synthetic resin injection part and a first metal member; a second metal member supported by the housing and including a first portion that is thermally bonded to at least a portion of the first metal member and a second portion that is electrically connected to the first portion; and at least one bonding portion in which at least a portion of the first metal member and at least a portion of the first portion of the second metal member are thermally bonded, wherein the synthetic resin that forms the synthetic resin injection part includes plant-derived polyamide and semi-aromatic polyamide, and the synthetic resin injection part may include at least one contact area in contact with the at least one bonding portion. Various other embodiments may be possible.

Description

Electronic components and electronic devices comprising thermally bonded metal members

[0001] Various embodiments of the present disclosure relate to electronic components and electronic devices including thermally bonded metal members.

[0002] Electronic components in electronic devices utilize a variety of materials, including metals and synthetic resins. With growing environmental concerns, efforts are increasingly being made to replace petroleum-derived synthetic resins used in electronic components with eco-friendly materials such as bioplastics and recycled plastics. Electronic components can be composed of multiple metal components, depending on their function and design. The different metal components that make up an electronic component can be thermally joined through welding, soldering, or other methods.

[0003] Electronic components in mobile electronic devices are becoming increasingly lightweight and thinner. Technological solutions are being explored to ensure that these components do not deform even in high-temperature environments during manufacturing and maintain high durability even after finalization.

[0004] The electronic component may include a frame (housing) including a synthetic resin (polymer) injection molding part and a first metal member. In addition, the frame (housing) may include a second metal member thermally bonded to the first metal member on the outer surface of the frame (housing).

[0005] In electronic components, areas where metal parts come into contact with each other thermally (e.g., the synthetic resin injection molding of the frame (housing)) must be heat-resistant enough to withstand high-temperature environments, such as soldering, during the component manufacturing process. Furthermore, after component assembly, it's crucial to ensure sufficient durability to prevent damage to the thermal joints even under various drop conditions.

[0006] However, when using eco-friendly materials such as bioplastics or recycled plastics for electronic components, the heat resistance of these materials is significantly lower than that of conventional petroleum-derived synthetic resins. Therefore, the use of eco-friendly materials poses challenges, including heat-induced deformation and product defects, as well as reduced mechanical properties, hindering sufficient durability.

[0007] According to various embodiments of the present disclosure, it is possible to provide electronic components and electronic devices including the same that can withstand high temperatures during manufacturing while using environmentally friendly materials and have sufficient durability and user reliability.

[0008] According to various embodiments of the present disclosure, an electronic component comprises: a housing including a synthetic resin injection part and a first metal member; a second metal member supported by the housing, the second metal member including a first portion thermally bonded to at least a portion of the first metal member and a second portion electrically connected to the first portion; and at least one joint portion in which at least a portion of the first metal member and at least a portion of the first portion of the second metal member are thermally bonded; wherein a synthetic resin forming the synthetic resin injection part includes a plant-derived polyamide and a semi-aromatic polyamide, and the synthetic resin injection part may include at least one contact area in contact with the at least one joint portion.

[0009] According to various embodiments, an electronic device includes a front surface; a rear surface; a housing enclosing a space between the front surface and the rear surface; and a plurality of electronic components having at least a portion disposed in an internal space between the front surface, the rear surface, and the housing, wherein at least one of the plurality of electronic components includes a component housing including a synthetic resin injection part and a first metal member, a second metal member supported by the component housing, the second metal member including a first portion thermally bonded to at least a portion of the first metal member and a second portion electrically connected to the first portion, and a joint portion in which at least a portion of the first metal member and at least a portion of the first portion of the second metal member are thermally bonded, and a synthetic resin forming the synthetic resin injection part includes a plant-derived polyamide and a semi-aromatic polyamide, and the synthetic resin injection part may include at least one contact area in contact with the at least one joint portion.

[0010] Various embodiments of the present disclosure can provide electronic components that utilize eco-friendly materials to ensure environmental friendliness while also addressing the inherent issues inherent in eco-friendly materials, thereby ensuring high heat resistance. Furthermore, the present disclosure can provide electronic components and electronic devices including such components that exhibit sufficient durability and reliability in various mobile environments. Furthermore, various benefits, directly or indirectly identified through this document, can be provided.

[0011] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0012] FIGS. 1A and 1B are exploded perspective views and perspective views of a portion of an electronic component according to various embodiments of the present disclosure.

[0013] FIG. 2 is a drawing showing the location of a thermal joint among a portion of an electronic component according to various embodiments of the present disclosure.

[0014] FIG. 3 is a process diagram illustrating a manufacturing process of an electronic component according to various embodiments of the present disclosure.

[0015] Figure 4 illustrates a defect that occurred during the thermal bonding process of a part of an electronic component.

[0016] FIG. 5 shows a state of a bonding portion after a thermal bonding process of a portion of an electronic component according to various embodiments of the present disclosure and a comparative example.

[0017] FIG. 6 is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0018] FIG. 7 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0019] FIGS. 1A and 1B are exploded perspective views and perspective views of a portion of an electronic component according to various embodiments of the present disclosure.

[0020] A portion of the electronic component according to various embodiments of the present disclosure, as illustrated in FIGS. 1A and 1B, may be a portion of a speaker module. The electronic component according to various embodiments of the present disclosure is not limited to a speaker module, and may include a camera module, a sensor module, or an antenna module, as electronic components that utilize a thermal bonding process between dissimilar materials. Furthermore, the electronic component may include an RF connector module or a motor module.

[0021] Referring to FIGS. 1A and 1B, an electronic component according to various embodiments of the present disclosure may include a frame (200) including a synthetic resin injection part (210) and a first metal member (220), and a second metal member (300) supported by the frame (200).

[0022] In various embodiments of the present disclosure, the frame (200) may serve as a housing for an electronic component. The synthetic resin forming the synthetic resin injection molding part (210) may include plant-derived polyamide and semi-aromatic polyamide. The electronic component according to the present disclosure can be configured so that the frame includes a synthetic resin that uses both plant-derived polyamide and semi-aromatic polyamide, thereby enhancing environmental friendliness while also ensuring high heat resistance and durability.

[0023] The plant-derived polyamide may include at least one selected from the group consisting of polyamides containing at least one repeating unit selected from the group consisting of repeating units of the following chemical formula 1 and repeating units of the following chemical formula 2.

[0024] [Chemical Formula 1]

[0025]

[0026] [Chemical Formula 2]

[0027]

[0028] The polyamide containing the repeating unit of Chemical Formula 1 may be a polyamide referred to as "PA10". The polyamide containing the repeating unit of Chemical Formula 2 may be a polyamide referred to as "PA11". The plant-derived polyamide may be a bioplastic (or biomass plastic) derived from castor oil. The plant-derived polyamide may be synthesized through a conventional method known in the art, or various commercially available products referred to as PA10 or PA11 in the art may be used. The plant-derived polyamide according to one embodiment of the present disclosure may be PA10. The plant-derived polyamide according to one embodiment of the present disclosure may be PA11. The plant-derived polyamide according to one embodiment of the present disclosure may be a copolymerized polyamide containing the repeating unit of Chemical Formula 1 and the repeating unit of Chemical Formula 2 below.

[0029] From the viewpoint of satisfying both environmental friendliness and high heat resistance / high durability, the plant-derived polyamide may be contained in the synthetic resin in an amount of from more than about 0% by weight to less than about 40% by weight relative to the total weight of the synthetic resin, preferably from about 1% by weight to about 30% by weight, more preferably from about 3% by weight to about 25% by weight, and even more preferably from about 5% by weight to about 20% by weight.

[0030] Semi-aromatic polyamide is a polyamide containing an aromatic ring (benzene ring). Semi-aromatic polyamide according to various embodiments of the present disclosure may include at least one selected from the group consisting of polyamides containing at least one repeating unit selected from the group consisting of repeating units of the following chemical formula 3, repeating units of the following chemical formula 4, repeating units of the following chemical formula 5, repeating units of the following chemical formula 6, and repeating units of the following chemical formula 7.

[0031] [Chemical Formula 3]

[0032]

[0033] [Chemical Formula 4]

[0034]

[0035] [Chemical Formula 5]

[0036]

[0037] [Chemical Formula 6]

[0038]

[0039] [Chemical Formula 7]

[0040]

[0041] The polyamide containing the repeating unit of formula 3 may be a polyamide referred to as "PA4T". The polyamide containing the repeating unit of formula 4 may be a polyamide referred to as "PA6T". The polyamide containing the repeating unit of formula 5 may be a polyamide referred to as "PA6I". The polyamide containing the repeating unit of formula 6 may be a polyamide referred to as "PA9T". The polyamide containing the repeating unit of formula 7 may be a polyamide referred to as "PA10T". The semi-aromatic polyamide according to one embodiment of the present disclosure may be a copolymerized polyamide containing two or more repeating units selected from the group consisting of the repeating unit of formula 4, the repeating unit of formula 5, the repeating unit of formula 6, and the repeating unit of formula 7. The semi-aromatic polyamide may be synthesized by conventional methods known in the art, or various commercially available products referred to in the art as PA4T, PA6T, PA6I, PA6I / 6T, PA9T, or PA10T may be used. The semi-aromatic polyamide according to one embodiment of the present disclosure may be PA4T. The semi-aromatic polyamide according to one embodiment of the present disclosure may be PA6T. The semi-aromatic polyamide according to one embodiment of the present disclosure may be PA6I. The semi-aromatic polyamide according to one embodiment of the present disclosure may be PA9T. The semi-aromatic polyamide according to one embodiment of the present disclosure may be PA10T. The semi-aromatic polyamide according to one embodiment of the present disclosure may be PA6I / 6T, which is a polyamide containing a repeating unit of Chemical Formula 5 and a repeating unit of Chemical Formula 4 below. The semi-aromatic polyamide may be preferably PA4T, PA6T, PA6I or PA6I / 6T from the viewpoint of satisfying both environmental friendliness and high heat resistance / high durability.

[0042] From the viewpoint of satisfying both environmental friendliness and high heat resistance / high durability, the semi-aromatic polyamide may be contained in the synthetic resin in an amount of from more than about 1 wt% to less than about 99.9 wt% based on the total weight of the synthetic resin, preferably from about 3 wt% to about 90 wt%, more preferably from about 5 wt% to about 80 wt%, more preferably from about 10 wt% to about 70 wt%, more preferably from about 15 wt% to about 60 wt%, and more preferably from about 20 wt% to about 50 wt%.

[0043] From the viewpoint of satisfying both environmental friendliness and high heat resistance / high durability, plant-derived polyamide and semi-aromatic polyamide can be contained in the synthetic resin at a ratio of about 1:0.1 to about 1:100 by weight, preferably about 1:0.5 to about 1:50, more preferably about 1:0.8 to about 1:30, more preferably about 1:1 to about 1:5, and more preferably about 1:1.5 to about 1:4.

[0044] The synthetic resin (polymer) forming the synthetic resin injection part (210) may additionally include recycled polyamide. By additionally including recycled polyamide, the environmental friendliness of the product can be further increased and it can also be economical in terms of cost. Recycled polyamide is a polyamide obtained by recycling materials that have been used more than once. The recyclable polyamide may be a polyamide obtained by recycling waste fishing nets, etc. The recyclable polyamide may be a polyamide manufactured by including recycled materials obtained by finely splitting and washing scraps such as sprues, runners, gates, etc. generated after injection molding and then re-extruding them. The recyclable polyamide according to various embodiments of the present disclosure may include at least one selected from the group consisting of polyamides containing at least one repeating unit selected from the group consisting of repeating units of the following chemical formula 8 and repeating units of the following chemical formula 9.

[0045] [Chemical Formula 8]

[0046]

[0047] [Chemical Formula 9]

[0048]

[0049] The polyamide containing the repeating unit of formula 8 may be a polyamide referred to as "PA6." The polyamide containing the repeating unit of formula 9 may be a polyamide referred to as "PA66." The regenerated polyamide may be synthesized through a conventional method known in the art, or various commercially available products referred to in the art as PA6 or PA66 may be used. The regenerated polyamide according to one embodiment of the present disclosure may be PA6. The regenerated polyamide according to one embodiment of the present disclosure may be PA66. The regenerated polyamide according to one embodiment of the present disclosure may include both PA6 and PA66.

[0050] From the viewpoint of satisfying both environmental friendliness and high heat resistance / high durability, the recycled polyamide may be contained in the synthetic resin in an amount of from more than about 0% by weight to less than about 40% by weight relative to the total weight of the synthetic resin, preferably from about 1% by weight to about 30% by weight, more preferably from about 3% by weight to about 25% by weight, and even more preferably from about 5% by weight to about 20% by weight. However, it is preferable that the total weight of the plant-derived polyamide and the recycled polyamide is less than or equal to about 40% by weight relative to the total weight of the synthetic resin.

[0051] The synthetic resin may contain an inorganic material as a reinforcing agent. The synthetic resin may further improve heat resistance and / or mechanical strength by including the inorganic material. The inorganic material may include at least one selected from the group consisting of talc, inorganic material whiskers, wollastonite, glass fiber (GF), carbon fiber (CF), and zirconium. The synthetic resin may also include a polyamide composite containing the inorganic material. The polyamide composite may be a glass fiber reinforced polyamide. The polyamide composite may be a carbon fiber reinforced polyamide. Examples of the glass fiber reinforced polyamide may include PA66 GF30, PA66 GF50, PA6 GF25 / PA6 GF30, MXD6, etc. Examples of the above glass fiber reinforced polyamide may include PA6 CF10, PA6 CF20, PA6 CF30, PA66 CF10, PA66 CF20, PA66 CF30, etc. From the viewpoint of satisfying both environmental friendliness and high heat resistance / high durability, the above inorganic material may be contained in the synthetic resin in an amount of about 10 wt% to about 90 wt% based on the total weight of the synthetic resin, preferably about 25 wt% to about 80 wt%, more preferably about 20 wt% to about 70 wt%, and even more preferably about 30 wt% to about 60 wt%.

[0052] The above synthetic resin may further include one or more other resins in addition to polyamide. The above synthetic resin may further include one or more selected from the group consisting of polycarbonate (PC) resin, polyethylene (PE) resin, polypropylene (PP) resin, polyetherimide (PEI) resin, polyphenylene ether (PPE) resin, polyphenylene oxide (PPO) resin, polyphenylene sulfide (PPS) resin, and polybutylene terephthalate (PBT) resin. The additional resin may be contained in the synthetic resin in an amount of about 0 wt% to about 20 wt% based on the total weight of the synthetic resin from the viewpoint of satisfying both environmental friendliness and high heat resistance / high durability, and may be contained in an amount of about 0.1 wt% to about 5 wt%, about 1 wt% to about 10 wt%, etc. depending on various purposes of the electronic component.

[0053] However, from the perspective of satisfying both environmental friendliness and high heat resistance / high durability, it is preferable that the synthetic resin does not contain epoxy resin. Various embodiments according to the present disclosure can secure the desired high heat resistance / high durability without including epoxy resin in the synthetic resin of the synthetic resin injection part (210).

[0054] In FIGS. 1A and 1B , an electronic component according to various embodiments of the present disclosure may include a second metal member (300) supported on a frame. The second metal member (300) may include a component that transmits vibrations generated from the electronic component. The second metal member (300) may be, for example, a component that constitutes a suspension or a vibration plate of a speaker module. The second metal member (300) may be electrically connected to a flexible circuit board (not shown, a flexible printed circuit board, FPCB) that transmits electrical signals to the electronic component.

[0055] In various embodiments of the present disclosure, a second metal member (300) may be supported on the frame (200). The second metal member (300) may be coupled with a first metal member (220) of the frame (200). The second metal member (300) may be thermally bonded to at least a portion of the first metal member (220). In one embodiment, the second metal member (300) may include a first portion (310) and a second portion (320), and the first portion (310) and the second portion (320) of the second metal member (300) may be thermally bonded to one or more coupling portions (221) in which at least a portion of the first metal member (220) is inserted into at least a portion of a synthetic resin injection molded part (210). The first portion (310) of the second metal member (300) may be a portion of a flexible printed circuit board (FPCB). The first portion (310) of the second metal member (300) may be a portion of a conductive member of a flexible printed circuit board (FPCB). The second portion (320) of the second metal member (300) may be a metal frame. The first portion (310) of the second metal member (300) may be thermally bonded to one or more connecting portions (221) inserted into at least a portion of the synthetic resin injection portion (210) to form a bonding portion (410).

[0056] Through thermal bonding at one or more joints (221) of the first metal member (220), the first portion (310) of the second metal member (300) can be electrically connected to a connection terminal (not shown) of the frame (200). The connection terminal of the frame (200) can be electrically connected to a printed circuit board (PCB) of an electronic device including an electronic component (100).

[0057] Thermal bonding between the first metal member (220) and the second metal member (300) may be achieved through soldering or welding. The temperature at which the thermal bonding occurs may be about 150°C or higher, preferably about 200°C or higher, about 250°C or higher, or about 300°C or higher, and more preferably about 350°C or higher and about 400°C or lower.

[0058] FIG. 2 is a drawing showing the location of a thermal joint among a portion of an electronic component according to various embodiments of the present disclosure.

[0059] Referring to FIG. 2, the second metal member (300) can be thermally bonded to at least a portion of the first metal member (220). In one embodiment, at least one of the first portion (310) and the second portion (320) of the second metal member (300) can be thermally bonded to one or more connecting portions (221) in which at least a portion of the first metal member (220) is inserted into at least a portion of the synthetic resin injection-molded part (210). For example, the first portion (310) of the second metal member (300) can be thermally bonded to the connecting portion (221) of the first metal member (220) to form a connecting portion (410). The synthetic resin injection-molded part (210) can have a contact area (211) that is in contact with the connecting portion (410). For example, the contact area (2110) of the synthetic resin injection part (210) may be an area formed at a position corresponding to the joint part (410) and the peripheral part of the joint part (410). At least a portion (310) of the second metal member (300) may be thermally bonded to at least a portion of the first metal member (220) of the frame (200) to form a metal joint part (420).

[0060] Thermal bonding between the first metal member (220) and the second metal member (300) may be achieved through soldering or welding. The soldering or welding may be performed by any conventional means and method known in the art. The temperature at which the thermal bonding occurs may be about 150°C or higher, preferably about 200°C or higher, about 250°C or higher, or about 300°C or higher, and more preferably about 350°C or higher and about 400°C or lower.

[0061] FIG. 3 is a process diagram illustrating a manufacturing process for an electronic component (100) according to various embodiments of the present disclosure. FIG. 3 exemplarily illustrates a process diagram for manufacturing a speaker module, one of various examples of electronic components according to the present disclosure. However, the electronic component manufacturing process of the present disclosure is not limited thereto. Furthermore, similar or modified processes may be applied to other types of electronic components.

[0062] Referring to FIG. 3, a manufacturing process (1000) of an electronic component (100) according to one embodiment may include a step of manufacturing a frame (200) (1100), a thermal bonding step (1200) of a suspension including the frame (200) and a second metal member, a coil assembly step (1300), a coil attachment step (1400), a diaphragm primary bonding step (1500), a diaphragm secondary bonding step (1600), a mesh insertion step (1700), and an electronic component final assembly step (1800).

[0063] The step (1100) of manufacturing the frame (200) may include a process of injecting a synthetic resin injection part (210) so that the frame (200) is formed with a first metal member (220) attached to at least a portion of the synthetic resin injection part (210). The first metal member (220) may be a metal insert, specifically, a stainless steel (SUS) insert.

[0064] The thermal bonding step (1200) of the frame (200) and the suspension may include a process in which the second metal member (300) of the suspension is thermally bonded to the first metal member (220) at least in part while being supported by the frame (200). The thermal bonding between the first metal member (220) and the second metal member (300) may be achieved through soldering or welding. The soldering or welding may be performed by any conventional means and method known in the art. The temperature at which the thermal bonding occurs may be about 150°C or higher, preferably about 200°C or higher, about 250°C or higher, or about 300°C or higher, and more preferably about 350°C or higher and about 400°C or lower.

[0065] The coil assembly step (1300) may include a process of joining the coil portion to the frame.

[0066] The coil portion attachment step (1400) may include a process of attaching the coil portion, which is a connection point with an external terminal, to a part of the frame (200) so that power can be applied to the coil.

[0067] The electronic component manufacturing process (1000) of the present disclosure may include a vibration plate primary bonding process (1500), a vibration plate secondary bonding process (1600), a mesh insertion process (1700), and an electronic component final assembly process (1800), and may include additional processes.

[0068] Figure 4 illustrates a defect that occurred during the thermal bonding process of a part of an electronic component.

[0069] Referring to FIG. 4, when regenerated polyamide is mainly used as a synthetic resin included in the frame (200) of the electronic component (100), a problem may arise in which a burr (circled area in FIG. 4), which is a carbonization defect caused by gas generation during thermal bonding of adjacent members, appears.

[0070] FIG. 5 shows a state of a bonding portion after a thermal bonding process of a portion of an electronic component according to various embodiments of the present disclosure and a comparative example.

[0071] Referring to FIG. 5, the states of the joints (410) of three samples that have undergone a thermal bonding process of the first metal member (220) and the second metal member (300) of the frame (200) according to one embodiment of the present disclosure illustrated in FIGS. 1a, 1b, and 2 are respectively illustrated.

[0072] Example 1 used a synthetic resin containing about 15 wt% of PA11 as a plant-derived polyamide, about 35 wt% of PA6T as a semi-aromatic polyamide, and about 50 wt% of glass fiber as a material for the synthetic resin injection part (210) of the frame (200). The first metal member (220) and the second metal member (300) of the frame (200) were soldered at a temperature of about 370°C using a conventional method, and then the appearance of the joint was evaluated. As a result, the joint showed a clean result without any part deformed by heat.

[0073] Comparative Example 1 used a synthetic resin containing about 30 wt% of PA11 as a plant-derived polyamide, about 20 wt% of PA6T as a semi-aromatic polyamide, and about 50 wt% of glass fiber as a material for the synthetic resin injection part (210) of the frame (200). The first metal member (220) and the second metal member (300) of the frame (200) were soldered at a temperature of about 370°C using a conventional method, and then the appearance of the joint was evaluated. As a result, it was found that carbonization defects occurred at the boundary of the joint, and the metal member and the synthetic resin injection part were partially deformed due to heat.

[0074] Comparative Example 2 used a synthetic resin containing about 15 wt% PA6 as a regenerated polyamide, about 35 wt% PA66 / 6T as a semi-aromatic polyamide, and about 50 wt% glass fiber as a material for the synthetic resin injection part (210) of the frame (200). The first metal member (220) and the second metal member (300) of the frame (200) were soldered at a temperature of about 370°C using a conventional method, and then the appearance of the joint was evaluated. As a result, serious carbonization defects occurred at the boundary of the joint, and the degree of deformation of the metal member and the synthetic resin injection part was very large, resulting in a significant reduction in marketability.

[0075] The durability of Example 1 and Comparative Examples 1 and 2 was evaluated through a drop simulation test. The results of the evaluation by dropping Example 1, Comparative Examples 1 and 2 onto an iron plate, granite, and sand, respectively, from a specific height were as follows. The evaluation results showed that Example 1 had high durability as there was almost no breakage of the adhesive part and peeling of the attachment. Comparative Examples 1 and 2 were evaluated to have much lower durability than Example 1.

[0076] FIG. 6 is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 7 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0077] The electronic device (900) of FIGS. 6 and 7 may be at least partially similar to the electronic device (101) of FIG. 1, or may further include other embodiments of the electronic device.

[0078] Referring to FIGS. 6 and 7, the electronic device (900) may include a housing (910) that includes a first side (or front side) (910A), a second side (or back side) (910B), and a side surface (910C) that surrounds a space between the first side (910A) and the second side (910B). In another embodiment (not shown), the housing (910) may refer to a structure that forms a portion of the first side (910A), the second side (910B), and the side surface (910C) of FIG. 7. In one embodiment, the first side (910A) may be formed by a front plate (902) that is at least partially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (910B) may be formed by a substantially opaque back plate (911). The rear plate (911) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (910C) may be formed by a side bezel structure (or “side member”) (918) that is coupled to the front plate (902) and the rear plate (911) and comprises a metal and / or polymer. In some embodiments, the rear plate (911) and the side bezel structure (918) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0079] In the illustrated embodiment, the front plate (902) can include a first region (910D) that extends seamlessly from the first side (910A) toward the back plate, on both long edges of the front plate (902). In the illustrated embodiment (see FIG. 7), the back plate (911) can include a second region (910E) that extends seamlessly from the second side (910B) toward the front plate (902), on both long edges of the front plate (902). In some embodiments, the front plate (902) or the back plate (911) can include only one of the first region (910D) or the second region (910E). In some embodiments, the front plate (902) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second side (910B). In the above embodiments, when viewed from the side of the electronic device (900), the side bezel structure (918) may have a first thickness (or width) on the side that does not include the first region (910D) or the second region (910E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (910D) or the second region (910E).

[0080] According to various embodiments, the electronic device (900) may include at least one of a display (901) (e.g., a first display), an input device (903), an audio output device (907, 914), a sensor module (904, 919), a camera module (905, 912, 913), a key input device (917), an indicator (not shown), and a connector (908, 909). In some embodiments, the electronic device (900) may omit at least one of the components (e.g., the key input device (917) or the indicator) or may additionally include other components.

[0081] The display (901) may be exposed, for example, through a substantial portion of the front plate (902). In some embodiments, at least a portion of the display (901) may be exposed through the front plate (902), which forms the first area (910D) of the first surface (910A) and the side surface (910C). For example, the display (901) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic stylus pen. In some embodiments, at least a portion of the sensor modules (904, 919), and / or at least a portion of the key input device (917), may be disposed in the first area (910D), and / or the second area (910E).

[0082] In one embodiment, the input device (903) may include a microphone. In some embodiments, the input device (903) may include multiple microphones arranged to detect the direction of sound. The audio output device (907, 914) may include speakers. The audio output device (907, 914) may include an external speaker (907) and a call receiver (914). In some embodiments, the input device (903), the audio output device (907, 914), and the connectors (908, 909) may be arranged in a space of the electronic device (900) and may be exposed to the external environment through at least one hole formed in the housing (910). In some embodiments, the hole formed in the housing (910) may be used jointly for the input device (903) and the audio output device (907, 914). In some embodiments, the audio output device (907, 914) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (910).

[0083] According to one embodiment, the sensor modules (904, 919) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (900) or an external environmental state. The sensor modules (904, 919) may include, for example, a first sensor module (904) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (910A) of the housing (910), and / or a third sensor module (919) (e.g., an HRM sensor) disposed on a second surface (910B) of the housing (910). The fingerprint sensor may be disposed on the first surface (910A) of the housing (910). The fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (901) on the first surface (910A). The electronic device (900) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (904).

[0084] According to one embodiment, the camera modules (905, 912, 913) may include a first camera module (905) disposed on a first side (910A) of the electronic device (900), and / or a second camera module (912) disposed on a second side (910B), and / or a flash (913). The camera modules (905, 912) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (913) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (900).

[0085] In one embodiment, the key input device (917) may be positioned on a side surface (910C) of the housing (910). In another embodiment, the electronic device (900) may not include some or all of the key input devices (917), and the key input devices (917) that are not included may be implemented in another form, such as soft keys, on the display (901). In another embodiment, the key input device (917) may be implemented using a pressure sensor included in the display (901).

[0086] The indicator may be disposed, for example, on the first side (910A) of the housing (910). The indicator may provide, for example, status information of the electronic device (900) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (905). The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0087] According to one embodiment, the connector holes (908, 909) may include a first connector hole (908) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (909) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0088] In one embodiment, some of the camera modules (905, 912), some of the sensor modules (904, 919), or indicators may be arranged to be exposed through the display (901). For example, the camera module (905), the sensor module (904), or the indicator may be arranged to be in contact with the external environment through an opening perforated from the internal space of the electronic device (900) to the front plate (902) of the display (901). In another embodiment, some of the sensor modules (904) may be arranged to perform their functions without being visually exposed through the front plate (902) in the internal space of the electronic device. For example, in this case, an area of ​​the display (901) facing the sensor modules may not require a perforated opening.

[0089] According to various embodiments, the electronic device (900) may include a conductive portion (9183) disposed on a side member (918) through a pair of spaced-apart non-conductive portions (9181, 9182) and operating as an antenna (A1) via a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). In one embodiment, the electronic device (630) may include a conductive pattern (3151) disposed on the back surface of the front plate (902) or the side member (918). In one embodiment, the conductive pattern (3151) may help improve the radiation performance of the antenna (A1) by having at least one point electrically connected to the conductive portion (9183).

[0090] According to various embodiments of the present disclosure, an electronic device includes a front surface; a rear surface; a housing enclosing a space between the front surface and the rear surface; and a plurality of electronic components at least partially disposed in the internal space between the front surface, the rear surface and the housing, wherein at least one of the plurality of electronic components includes a component housing including a synthetic resin (polymer) and a first metal member, and a second metal member supported by the component housing and thermally bonded to at least a portion of the first metal member, wherein the synthetic resin may include a plant-derived polyamide and a semi-aromatic polyamide.

[0091] At least one of the plurality of electronic components included in the electronic device according to various embodiments may be an electronic component (100) according to various embodiments of the present disclosure as described above. The housing of the electronic component (100) may be a frame (200) according to FIGS. 1A, 1B, and 2, as illustrated by way of example. The synthetic resin (polymer) may be the synthetic resin described above for the synthetic resin injection part (210). The first metal member may be the first metal member (220) as described above. The second metal member may be the second metal member (300) as described above. The plant-derived polyamide may be the plant-derived polyamide as described above. The semi-aromatic polyamide may be the semi-aromatic polyamide as described above. In addition, the sub-structure of at least one of the plurality of electronic components and the materials included in the sub-structure and the bonding relationship between the sub-structures may be the same as or similar to those described above for the electronic component (100) according to various embodiments of the present disclosure. Additionally, the manufacturing process of at least one of the plurality of electronic components may be the same as or similar to the manufacturing process (1000) of the electronic component (100) according to various embodiments of the present disclosure or the process illustrated in FIG. 4.

[0092] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0093] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0094] The embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments of the present disclosure in addition to the embodiments disclosed herein.

Claims

1. In electronic components, A housing including a synthetic resin injection part and a first metal member; A second metal member supported by the housing, comprising a first portion thermally bonded to at least a portion of the first metal member and a second portion electrically connected to the first portion; and At least one joint portion in which at least a portion of the first metal member and at least a portion of the first portion of the second metal member are thermally joined; The synthetic resin forming the above synthetic resin injection part includes plant-derived polyamide and semi-aromatic polyamide, The synthetic resin injection part includes at least one contact area that comes into contact with the at least one joint portion. Electronic components.

2. In paragraph 1, An electronic component, wherein the plant-derived polyamide comprises at least one selected from the group consisting of polyamides containing at least one repeating unit selected from the group consisting of repeating units of the following chemical formula 1 and repeating units of the following chemical formula 2. [Chemical Formula 1] [Chemical Formula 2] 3. In paragraph 1, An electronic component comprising at least one selected from the group consisting of polyamides containing at least one repeating unit selected from the group consisting of a repeating unit of the following chemical formula 3, a repeating unit of the following chemical formula 4, a repeating unit of the following chemical formula 5, a repeating unit of the following chemical formula 6, and a repeating unit of the following chemical formula 7. [Chemical Formula 3] [Chemical Formula 4] [Chemical Formula 5] [Chemical Formula 6] [Chemical Formula 7] 4. In paragraph 1, An electronic component wherein the synthetic resin further comprises recycled polyamide.

5. In paragraph 4, An electronic component, wherein the above-mentioned regenerated polyamide comprises at least one selected from the group consisting of polyamides containing at least one repeating unit selected from the group consisting of repeating units of the following chemical formula 8 and repeating units of the following chemical formula 9. [Chemical Formula 8] [Chemical Formula 9] 6. In paragraph 1, An electronic component wherein the above synthetic resin additionally contains an inorganic material.

7. In paragraph 6, An electronic component, wherein the above inorganic material comprises at least one selected from the group consisting of talc, inorganic material whiskers, wollastonite, glass fiber (GF), carbon fiber (CF), and zirconium.

8. In paragraph 1, An electronic component, wherein the synthetic resin further comprises at least one selected from the group consisting of polycarbonate (PC) resin, polyethylene (PE) resin, polypropylene (PP) resin, polyetherimide (PEI) resin, polyphenylene ether (PPE) resin, polyphenylene oxide (PPO) resin, polyphenylene sulfide (PPS) resin, and polybutylene terephthalate (PBT) resin.

9. In paragraph 1, An electronic component, wherein the plant-derived polyamide and the semi-aromatic polyamide are contained in the synthetic resin in a ratio of 1:1 to 1:5 by weight.

10. In paragraph 1, An electronic component wherein the above thermal bonding is performed by soldering or welding.

11. In paragraph 1, An electronic component having a thermal bonding temperature of 350°C or higher and 400°C or lower.

12. In electronic devices, front; back side; a housing enclosing the space between the front and rear; and A plurality of electronic components, at least part of which is disposed in the internal space between the front, rear and housing, At least one of the above plurality of electronic components, A component housing including a synthetic resin injection part and a first metal member, A second metal member supported on the component housing, comprising a first portion thermally bonded to at least a portion of the first metal member and a second portion electrically connected to the first portion, and At least one joint in which at least a portion of the first metal member and at least a portion of the first part of the second metal member are thermally joined Includes, The synthetic resin forming the above synthetic resin injection part includes plant-derived polyamide and semi-aromatic polyamide, An electronic device, wherein the synthetic resin injection part includes at least one contact area that comes into contact with the at least one joint.

13. In paragraph 12, An electronic device, wherein the plant-derived polyamide comprises at least one selected from the group consisting of polyamides containing at least one repeating unit selected from the group consisting of repeating units of the following chemical formula 1 and repeating units of the following chemical formula 2. [Chemical Formula 1] [Chemical Formula 2] 14. In paragraph 12, An electronic device comprising at least one selected from the group consisting of polyamides containing at least one repeating unit selected from the group consisting of a repeating unit of the following chemical formula 3, a repeating unit of the following chemical formula 4, a repeating unit of the following chemical formula 5, a repeating unit of the following chemical formula 6, and a repeating unit of the following chemical formula 7. [Chemical Formula 3] [Chemical Formula 4] [Chemical Formula 5] [Chemical Formula 6] [Chemical Formula 7] 15. In paragraph 12, An electronic device wherein the synthetic resin further comprises a recycled polyamide.

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