BASIC COMPONENTS FOR DEVICES WITH OPERATING BUTTON ON THE DISPLAY AND ASSOCIATED SYSTEMS, PROCEDURES AND DEVICES

Abstract

Control knob on a display (KoD) device, comprising: a conductive cap (2606) on a top side of the KoD device, wherein the conductive cap (2606) has a contact surface (2502) at least in a center of the conductive cap (2606); a snap disc switch (2608) under the conductive cap (2606), wherein the snap disc switch (2608) is electrically connected to the contact surface (2502) of the conductive cap (2606); a printed circuit board (2610), wherein the printed circuit board (2610) contains conductive pads, and wherein the conductive pads contain one or more snap disc switch pads (1222) for mounting the snap disc switch (2608) on it; a basic assembly (2504) on a bottom side of the KoD device; an inner housing (2626) between the conductive cap (2606) and the base assembly (2504), wherein the inner housing (2626) is able to rotate about a post (2630) extending from the base assembly (2504); at least one electrode comprising an electrically conductive material, wherein the at least one electrode includes a first electrode which is electrically connected via the snap disc switch (2608) and the one or more snap disc switch pads (1222) to the contact surface (2502) of the conductive cap (2606), wherein the at least one electrode is mechanically coupled to the inner housing (2626) to rotate with the inner housing (2626); and wherein a bottom side of the base assembly (2504) is to be mounted to a touchscreen (3010) of a touchscreen device (3008), such that the at least one electrode is positioned in proximity to the touchscreen (3010) of the touchscreen device (3008) by the base assembly (2504).

Description

PRIORITY CLAIM

[0001] This patent application claims the benefit of the filing date of: U.S. Provisional Patent Application No. 62 / 887,657, filed August 15, 2019, and entitled "KNOB ON DISPLAY WITH PUSH USING A TACTILE DOME SWITCH AND RELATED SYSTEMS, METHODS, AND DEVICES" and U.S. Provisional Patent Application No. 62 / 901,383, filed September 17, 2019, entitled "KNOB ON DISPLAY WITH INTERNAL ELECTRODES". TECHNICAL FIELD

[0002] The present disclosure relates generally to display devices for touch screen devices, and more particularly to control button devices on displays including base assemblies. STATE OF THE ART

[0003] On-display buttons (KoDs, also referred to interchangeably herein as "KoD devices") are physical control buttons attached to a touchscreen device. For example, these KoDs are sometimes glued to the touchscreen device. KoDs are configured to interact with a touch sensor of the touchscreen device. The touchscreen device can provide several different graphical user interfaces, with which a KoD can be used to interact via the touch sensor.

[0004] Document WO 2018 / 109835 A1 discloses a mechanical rotary knob.

[0005] Document DE 10 2017 125 827 A1 discloses a turntable with a push function.

[0006] Document CN 109 192 587 A discloses a type of touch control button. US 2014 / 0042004 A1 discloses a control device for a rotary knob that is removably arranged on a touch panel for controlling the touch panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] While this disclosure concludes with claims particularly pointing out and distinctly claiming particular embodiments, various features and advantages of embodiments within the scope of this disclosure may be more readily ascertained from the following description when read in conjunction with the accompanying drawings in which: Fig. 1 is a block diagram of a first embodiment of a KoD system according to some embodiments; Fig. 2 is a bottom view of an example of a flat circuit for a KoD according to some embodiments; Fig. 3A is a top perspective view of a KoD according to some embodiments; Fig. 3B a bottom view of the KoD of Fig. 3A is; Fig. 3C a perspective bottom view of the KoD of Fig. 3A and Fig. 3B is; Fig. 4 a perspective view of the KoD of Fig. 3A, Fig. 3B and Fig. 3C in a KoD system according to some embodiments; Fig. 5 a perspective view of a KoD system including the KoD of Fig. 3A, Fig. 3B, Fig. 3C and Fig. 4 with the KoD in a released position; Fig. 6 a perspective view of the KoD system of Fig. 4 and Fig. 5 with the KoD in a depressed position; Fig. 7 is a bottom view of an example of a flat flexible circuit board for a KoD according to some embodiments; Fig. 8 is a cross-sectional view of an example of a KoD including the flexible circuit board of Fig. 7 is; Fig. 9A to 9C are a set of views of a portion of a two-PCB KoD according to some embodiments; Fig. 10 a cross-sectional view of a two-PCB KoD showing the section of Fig. 9A to 9C, according to some embodiments; Fig. 11A is a cross-sectional view of another two-PCB KoD showing the section of Fig. 9A to 9C, according to some embodiments; Fig. 11B is an exploded view of an example of the KoD of Fig. 11A is; Fig. 11C to Fig. 11H different views of the KoD of Fig. 11A are; Fig. 12 is a cross-sectional view of an injection-molded KoD according to some embodiments; Fig. 13A and Fig. 13B are respective views of an example of a substrate and an overmolding of the KoD of Fig. 12 is; Fig. 14A and Fig. 14B are views of another KoD according to some embodiments; Fig. 15A to 15C Views of an example of the overmolding structure of the KoD of Fig. 14A and Fig. 14B are; Fig. 16 a perspective side view of an overmolding of the overmolding structure of Fig. 15A to 15C; Fig. 17 a perspective top view of a substrate of the overmolding structure of Fig. 15A to 15C; Fig. 18A to 18F Views of the KoD of Fig. 14A to 14B are; Fig. 19 is a flow diagram illustrating a method of operating a KoD device according to some embodiments; Fig. 20 is a block diagram of a second embodiment according to some embodiments; Fig. 21A to 21J are views of a KoD device showing an example of the KoD device of the Fig. 20 is; Fig. 22A and Fig. 22B Views of a KoD system similar to the KoD system of Fig. 20 are; Fig. 23 is a flow diagram illustrating a method for assembling a KoD system according to some embodiments; and Fig. 24 is a block diagram of a computing device that may be used in some embodiments. MODE(S) FOR CARRYING OUT THE INVENTION

[0008] The invention is defined in the independent claims. The dependent claims define embodiments of the invention.

[0009] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific examples of embodiments in which the present disclosure may be practiced. These embodiments are described in sufficient detail to enable one of ordinary skill in the art to practice the present disclosure. However, other embodiments contemplated herein may be utilized, and changes in structure, material, and process may be made without departing from the scope of the disclosure.

[0010] The illustrations presented herein are not intended to be actual views of any particular method, system, device, or structure, but are merely idealized representations used to describe embodiments of the present disclosure. Similar structures or components in the various drawings may, in some cases, retain the same or similar numbering for the convenience of the reader; however, similarity in numbering does not necessarily imply that the structures or components are identical in size, composition, configuration, or any other characteristic.

[0011] The following description may include examples to enable one of ordinary skill in the art to practice the disclosed embodiments. The use of the terms "exemplary," "as an example," and "for example" means that the accompanying description is illustrative, and while the scope of the disclosure is intended to include the examples and their legal equivalents, the use of such terms is not intended to limit the scope of any embodiment or this disclosure to the specified components, steps, features, functions, or the like.

[0012] It should be understood that the components of the embodiments, as generally described herein and illustrated in the drawings, could be arranged and configured in a wide variety of different configurations. Thus, the following description of various embodiments is not intended to limit the scope of the present disclosure, but is merely representative of various embodiments. While the various aspects of the embodiments may be illustrated in the drawings, the drawings are not necessarily drawn to scale unless expressly indicated.

[0013] Furthermore, the specific implementations shown and described are only examples and should not be construed as the only way to implement the present disclosure unless otherwise stated herein. Elements, circuits, and functions may be shown in block diagram form in order not to obscure the present disclosure with unnecessary detail. Conversely, specific implementations shown and described are only examples and should not be construed as the only way to implement the present disclosure unless otherwise stated herein. Furthermore, block definitions and the partitioning of logic between various blocks are exemplary of a specific implementation. It will be readily apparent to one skilled in the art that the present disclosure may be implemented using numerous other partitioning approaches.Details of timing considerations and the like have largely been omitted to the extent that such details are not necessary for a complete understanding of the present disclosure and are within the capabilities of one of ordinary skill in the art.

[0014] One of ordinary skill in the art would understand that information and signals may be represented using a variety of different technologies and techniques. Some drawings may illustrate signals as a single signal for clarity of illustration and description. It will be appreciated by one of ordinary skill in the art that the signal may represent a bus of signals, where the bus may have a variety of bit widths, and the present disclosure may be implemented on any number of data signals, including a single data signal.

[0015] The various illustrative logic blocks, modules, and circuits described in connection with the embodiments disclosed herein may be implemented or performed using a general-purpose processor, a special-purpose processor, a digital signal processor (DSP), an integrated circuit (IC), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof configured to perform the functions described herein. A general-purpose processor (which may also be referred to herein as a host processor or simply a host) may be a microprocessor, but alternatively, the processor may be any conventional processor, controller, microcontroller, or state machine.A processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration. A general-purpose computer including a processor is considered a special-purpose computer, while the general-purpose computer is configured to execute computational instructions (e.g., software code) related to embodiments of the present disclosure.

[0016] Embodiments may be described with respect to a process represented as a flowchart, a flow diagram, a structural diagram, or a block diagram. Although a flowchart may describe operational acts as a sequential process, many of these acts may be performed in a different sequence, in parallel, or substantially concurrently. Furthermore, the order of the acts may be changed. A process may correspond to a method, a thread, a function, a procedure, a subroutine, a subprogram, another structure, or combinations thereof. Furthermore, the methods disclosed herein may be implemented in hardware, software, or both. When implemented in software, the functions may be stored or transmitted as one or more instructions or code on computer-readable media.Computer-readable media includes both computer storage media and communications media, including any media that supports the transmission of a computer program from one location to another.

[0017] Any reference to an element herein using a label such as "first," "second," etc., does not limit the set or order of those elements unless such a limitation is explicitly stated. Rather, these labels may be used herein as a convenient method of distinguishing between two or more elements or instances of an element. Thus, a reference to a first and a second element does not imply that only two elements may be substituted therein or that the first element must precede the second element in any way. Furthermore, unless otherwise stated, a set of elements may include one or more elements.

[0018] As used herein, the term "substantially" with respect to a given parameter, characteristic, or condition means, and includes, to an extent understood by one of ordinary skill in the art, that the given parameter, characteristic, or condition is satisfied with a small degree of variance, such as within acceptable manufacturing tolerances. By way of example, depending on the particular parameter, characteristic, or condition that is substantially satisfied, the parameter, characteristic, or condition may be at least 90% satisfied, at least 95% satisfied, or even at least 99% satisfied. As understood for the purposes of the embodiments described in this disclosure, a capacitive sensor may respond to the contact of an object (e.g.,a finger or stylus) with a contact-sensitive area of ​​the capacitive sensor or the proximity of the object to it. In this disclosure, "contact" and "touch" are intended to encompass both physical contact of an object with a contact-sensitive area (e.g., without limitation, an electrode or one or more overlays covering an electrode or group of electrodes) and the presence of an object near a contact-sensitive area without physical contact. Actual physical contact with a capacitive sensor is not necessarily required.

[0019] For example, when an object touches a capacitive sensor, a capacitance change can occur within the capacitive sensor at or near the contact. An analog acquisition front-end can detect the contact when it reaches a certain threshold. "Charge-then-transfer" is a non-limiting example of a technique implemented in some touch acquisition front-ends to detect capacitive changes, where a sensing capacitor is charged in response to the capacitance change (e.g., charging faster or slower) and a charge is transferred to an integration capacitor over multiple charge-transfer cycles.An amount of charge associated with such charge transfer can be converted into digital signals by an analog-to-digital converter (ADC), and a digital controller can process these digital signals (typically referred to as "delta counters" or just "deltas") to determine measurements and / or detect whether an object has touched a sensor.

[0020] Self-capacitance sensors (also referred to herein as "self-cap sensors") are capacitive field sensors that respond to changes in capacitance relative to ground. They are typically arranged in an array of rows and columns that respond independently to touch. As a non-limiting example, a self-cap sensor may include a circuit that uses repetitive charge-then-transfer cycles using a common CMOS push-pull driver integrated circuit with floating terminals.

[0021] Mutual capacitance sensors are capacitive field sensors that detect and respond to capacitance changes between two electrodes: a drive electrode and a sense electrode. The drive and sense electrode pairs at each intersection of the drive and sense lines form a capacitor. Self-capacitance and mutual capacitance techniques can be used in the same touch interface system and can be complementary; for example, self-capacitance can be used to confirm a touch detected using mutual capacitance.

[0022] As one example, touch sensors in a two-dimensional (2-D) array (i.e., a 2-D touch sensor) may be overlaid on a 2-D contact-sensitive surface, for example, a touchpad or display screen, and may facilitate user interaction with an associated device or appliance. Insulating protective layers (e.g., resins, glass, and / or plastic, without limitation) may be used to cover touch sensors and may be referred to herein as an "overlay" or "touchscreen." As used herein, a "touchscreen device" is a display (such as a liquid crystal display (LCD), a thin-film transistor LCD (TFT-LCD), or a light-emitting diode (LED) display) that incorporates 2-D touch sensors (e.g.,implemented in a transparent medium above the display, sometimes with an overlay or a touchscreen including an additional transparent medium such as glass in front of the touch sensors).

[0023] Using the example of a touchscreen sensor employing a matrix sensing approach of mutual capacitance sensors using charge-transfer techniques, drive electrodes can extend in rows on one side of a substrate, and sense electrodes can extend in columns on a second side of the substrate to define a "matrix" array of N by M nodes. Each node corresponds to an intersection point between the electrically conductive lines of a drive electrode and a sense electrode. A drive electrode simultaneously drives all nodes in a given row, and a sense electrode senses all nodes in a given column.The capacitive coupling of the drive electrode and the sense electrode (mutual capacitance) or the coupling of a sense electrode and ground (self-capacitance) at a node position can be measured separately or measured together in response to a capacitive change indicating a touch event. For example, if a drive signal is applied to the drive electrode of row 2 and a sense electrode of column 3 is active, then the node position is: row 2, column 3. Nodes can be scanned by sequencing through different combinations of drive and sense electrodes. In one mode, the drive electrodes can be driven sequentially while the sense electrodes are all continuously monitored. In another mode, each sense electrode can be scanned sequentially.

[0024] Using the example of a touchscreen, where a matrix sensing approach of self-capacitance sensors is applied, electrodes can extend in rows and columns to define a "matrix" array of N by M nodes. The matrix sensor can be constructed with an intersection of electrodes at each node, with each electrode being individually addressable, or each row and column can be an addressable electrode and each node corresponds to a unique row / column pair. A drive signal (i.e., an A / C pulse) is repeatedly delivered to the sensor's electrodes. When an object touches the sensor, the coupling between the object and the electrodes increases the current drawn at the electrodes, increasing the apparent sensor capacitance, and this increase in sensor capacitance can be detected.For example, if an increase in capacitance is detected while a drive signal is applied to electrode row 2 and electrode column 3, then the location of a touch may be row 2, column 3. Interpolation techniques can be used to identify locations between nodes. By sequencing through combinations of rows and columns of electrodes, nodes can be sampled sequentially.

[0025] The drive signals described above (i.e., the AC pulse) are a source of electromagnetic emissions (EME). Typically, capacitance is measured synchronously with the drive signals. Thus, there is a direct relationship between the sampling rate of a measurement and the EME emission frequency.

[0026] The KoD devices disclosed herein include one or more conductive pads on a side of the KoD device facing the touch sensor. These conductive pads are detected by control logic (e.g., a microcontroller) through the touch sensor plate to report KoD positions, angles, and / or control button presses. Compared to previous KoD devices, KoDs disclosed herein may have one or more of the following advantages: reduced mechanical components, simplifies the design reduced Z-print distance (where Z is the direction to the touchscreen device) increased reliability of the electrical connection a total Z-height of the KoD less than ten millimeters (10 mm) for motor vehicle safety regulations.

[0027] The KoD devices disclosed herein may provide one or more of the following advantages: Act as tactile feedback, giving users a “click” feeling when pressing the KoD Providing a spring return for a push (snap disc material (e.g., metal) of a snap disc switch deflects and returns to its naturally formed released state) Providing an electrical connection path from a touch surface of a KoD (e.g., a surface on the KoD) to a rotating electrode pad. Providing an electrical connection path from the touch surface of the KoD to a pressure electrode pad when the snap disc is pressed, e.g., by a user pressing on the touch surface of the KoD. Creating a stable touch surface of the KoD that provides a smooth pushing sensation when a finger moves across its surface Providing a relatively good electrical connection with electrode pads Simplify the mechanical design compared to KoDs with electrode pads that move towards the touchscreen when the KoD is pressed Create a KoD sensor that incorporates design principles of a conventional fully mechanical solution (i.e. not based on a touch sensor) Detect rotation of an electrode pad

[0028] Detecting a press of the tactile snap disc.

[0029] Electrode pads of the KoD of the present embodiments are actually always physically in engagement proximity with the touch sensor of the touchscreen device. For example, the electrode pads of the KoD can be maintained at constant distances from the touchscreen and the touch sensor of the touchscreen device, regardless of a depressed position or a released position of the KoD. The rotating electrode pad is always electrically connected to a touch surface of the KoD, while the pressing electrode pad is in an electrically floating state, electrically separated from the touch surface of the KoD when the KoD switch is released, i.e., not depressed, then electrically connected to the touch surface of the KoD when the KoD switch is pressed.As a result, as opposed to relying on a pressure electrode pad that physically moves itself toward a touch-sensor surface when a user presses the touch surface of the KoD, the pressure electrode pad of the present embodiments remains in engagement proximity with the touch sensor but is selectively electrically connected to the touch surface of the KoD in response to the KoD being depressed. The pressure electrode pad and the rotating electrode pad can remain at constant respective distances from the touchscreen and touch sensor of the touchscreen device as the KoD transitions between depressed and released positions. As a result, embodiments disclosed herein avoid problems associated with pressure electrode pads that physically move toward the touch sensor when the KoD switch is depressed.For example, one avoided problem of the prior art is the use of a large Z-direction travel distance (e.g., one to two millimeters, which is much larger than that required for typical tactile dome switches) of the KoD switch when moving pressure electrode pads to ensure that the pressure electrode does not move within the detection threshold distance of the touch sensor while not being depressed. Another avoided problem of the prior art is the mechanical compatibility of KoD components with pressure pads that move in and out of engagement with touch sensor surfaces of touchscreen devices.

[0030] In some embodiments, a printed circuit board (PCB) or a flexible printed circuit board (FPC) can be used as the basis of a KoD directly on a touchscreen. The PCB / FPC can include rotating and pressing electrode pads connected to a tactile snap-disk switch. The rotating electrode pad is switch-connected to outer legs of a snap-disk, and a center of the snap-disk is connected (e.g., selectively based on a depressed or non-depressed state of the KoD) to the pressing electrode pad. Accordingly, a separate physical rotating electrode pad with a spring connection back to the KoD touch surface does not need to be used. Furthermore, the travel distance in the Z direction (toward the touchscreen device) in such embodiments can be less than one millimeter (e.g., 0.3 millimeters to 0.5 millimeters), which is typical for a tactile snap-disk switch.

[0031] In some embodiments, a KoD includes a folded FPC to allow a portion of the FPC to lie flat near the touchscreen without other portions of the FPC acting as additional electrodes on the touchscreen. Furthermore, the folded FPC may include a hole to accommodate a central hub that can be adhered to the touchscreen with an adhesive. The KoD may rotate about the central hub to allow rotation of a rotating electrode pad about the central hub.

[0032] In some embodiments, dual injection molding is used to produce conductive plastic used for electrode pad parts. In some embodiments, an insert molding technique is used prior to plastic injection to insert metal electrodes into a mold. In some embodiments, bi-material three-dimensional printing (3D printing) may be used, in which a filament encloses a conductive material. In some embodiments, laser-direct patterning may be used to create a molded interconnect device.

[0033] Embodiments disclosed herein may be used in the automotive and consumer product markets. As non-limiting examples, KoDs disclosed herein may be used in automotive center consoles and consumer devices. However, it should be understood that embodiments disclosed herein may be used in any environment where KoDs on touchscreen devices may be useful or helpful.

[0034] Also disclosed herein are KoD devices with robust electrode designs that exhibit reduced sensitivity to foreign elements such as water and dirt ingress, and an improved adhesion area for attachment to touchscreens of touchscreen devices. One or more conductive pads on the back of the KoD device are detected by control circuitry of a touchscreen device (e.g., via a touch sensor of the touchscreen device) to report positions / angles of the one or more conductive pads.

[0035] Some KoD devices disclosed herein are electromechanical solutions that provide at least some protection from foreign elements (e.g., water, dust, dirt). In some embodiments, a base assembly for a KoD device at least partially encloses the electrodes of the KoD device. This base assembly can be directly attached to the touchscreen using a full surface of the base assembly, thus maximizing adhesion (as opposed to using only a portion of the base assembly's surface that is adhered to the touchscreen). All foreign elements such as water and dirt are prevented from entering the electrode area, as an edge lip or side walls of the base assembly can reduce the inflow of water and dirt. In some embodiments, a fully sealed KoD device can be provided using a gasket (e.g.,a rubber seal) between a base assembly and an upper rotating component.

[0036] In contrast to placing one or more electrode pads in contact with a touchscreen surface of the touchscreen device, the KoD devices disclosed herein avoid allowing (i.e., inhibiting, but not necessarily always preventing) foreign elements such as dust and liquid from finding their way under the electrodes, which degrades both electrical and mechanical performance. The embodiments disclosed herein also allow adhesive to be applied to the entire underside of the base assembly, in contrast to KoD devices that have an adhesive surface limited to an inner central region to attach the KoD to the touch sensor. As a result, in contrast to other KoD devices known to the inventors of this disclosure, the KoD devices disclosed herein do not allow (i.e.,inhibit, but not necessarily always prevent) foreign elements from entering between a touchscreen and electrodes of a KoD device. Consequently, embodiments disclosed herein amount to robust solutions that inhibit liquid and dirt ingress, are at least partially sealed, and increase the adhesive surface to enable a KoD device to be well bonded to a touchscreen device.

[0037] Embodiments disclosed herein provide improved performance and water resistance compared to devices known to the inventors of this disclosure. Furthermore, dirt or liquid ingress may be prevented because dirt and liquid are prevented from penetrating beneath KoD devices disclosed herein because adhesive completely covers an underside of the base assembly. This improved adhesive surface may improve one or more of the strength, durability, and stability of the connections between a KoD device and a touchscreen device.

[0038] Fig. 1 is a block diagram of a KoD system 100 according to some embodiments. The KoD system 100 includes a KoD 102 and a touchscreen device 104. The touchscreen device 104 includes control circuitry 108 operably coupled to a touch sensor 106 and a touchscreen 120 above the touch sensor 106. The KoD 102 includes a touch surface 116, a switch 114, a rotating electrode pad 112, and a pressing electrode pad 110. The touch surface 116 is electrically connected to the rotating electrode pad 112 and selectively electrically connected to the pressing electrode pad 110 through the switch 114. The KoD 102 is configured to be mounted on the touchscreen device 104 with the rotating electrode pad 112 and the pressing electrode pad 110 in engagement proximity 118 to the touch sensor 106.

[0039] As used herein, the term "engagement proximity" refers to a proximity to a touchscreen (e.g., touchscreen 120) within which a touch sensor (e.g., touch sensor 106) of a touchscreen device (e.g., touchscreen device 104) can measurably respond to contact on a touch surface (e.g., touch surface 116), while a pressure electrode pad (e.g., pressure electrode pad 110) or a rotary electrode pad (e.g., rotary electrode pad 112) is electrically connected to a touch surface (e.g., touch surface 116). In some cases, an electrode pad may be referred to as being in engagement with a touchscreen of a touchscreen device, and in other cases, an electrode pad may be referred to as being in engagement with a touch sensor of a touchscreen device, both of which interchangeably refer to the definition of "engagement proximity" provided above.

[0040] In some embodiments, the KoD 102 includes a touch surface 116 including a conductive material (not shown), the touch surface 116 being configured such that the touch surface can be operatively positioned in a released position by default, and in a depressed position in response to pressure applied to the touch surface 116 (the pressure that triggers the switch 114). The KoD 102 also includes a pressure electrode pad 110 configured to be positioned proximate a touch sensor 106 of a touchscreen device 104 in both the released position and the depressed position. The pressure electrode pad 110 is maintained at a constant distance from the touchscreen 120 regardless of the released position or the depressed position of the KoD 102.The pressure electrode pad 110 is electrically connected to the conductive material of the touch surface 116 in response to the depressed position of the touch surface 116 and electrically isolated from the conductive material of the touch surface 116 in response to the released position of the touch surface 116. In some embodiments, the KoD 102 further includes a rotating electrode pad 112 configured to be positioned in engagement proximity to the touch sensor 106 of the touchscreen device 104 in both the released position and the depressed position of the touch surface 116. The rotating electrode pad 112 is electrically connected to the conductive material of the touch surface 116 in both the released position and the depressed position of the touch surface 116. Accordingly, the control circuitry 108 of the touchscreen device 104 can be programmed (e.g.,using firmware or software) to detect that the user is touching the touch surface 116 (e.g., a “grasp detection”).

[0041] In some embodiments, the KoD 102 further includes an FPC configured to electrically connect the printing electrode pad 110 and the rotating electrode pad 112 to the touch surface 116. In some embodiments, the KoD 102 includes a PCB configured to electrically connect the printing electrode pad 110 and the rotating electrode pad 112 to the touch surface 116. In some embodiments, the KoD 102 includes a folded FPC configured to electrically connect the printing electrode pad 110 and the rotating electrode pad 112 to the touch surface 116. In some embodiments, the KoD 102 includes a conductive overmolding enclosing the printing electrode pad 110 and the rotating electrode pad 112.

[0042] In some embodiments, a distance between the released position of the touch surface 116 and the depressed position of the touch surface 116 is less than one millimeter, preferably between three-tenths of a millimeter (0.3 mm) and one-half of a millimeter (0.5 mm). In some embodiments, a distance between the released position of the touch surface 116 and the depressed position of the touch surface 116 is about six-tenths of a millimeter (0.6 mm). In some embodiments, the pressure electrode pad 110 is configured to remain in an electrically floating state (e.g., not electrically connected to the touch surface 116) in response to the touch surface 116 being in the released position.The KoD 102 further includes the switch 114 configured to selectively operably couple the pressure electrode pad 110 to the conductive material of the touch surface 116 in response to the depressed position (e.g., the switch 114 may include the touch surface 116 thereon). The present embodiments will be described in some detail with the pressure electrode pad 110 coupled to the conductive material of the touch surface 116 in response to the depressed position and not electrically connected to the touch surface 116 in response to the touch surface 116 being in the released position, it being understood that the reversal can be similarly accomplished. Thus, in general, the touch surface 116 is operatively coupled in response to a first position of the KoD device 102 (e.g.,depressed) is electrically connected to the printing electrode pad 110, with the touch surface 116 being electrically isolated from the printing electrode pad 110 in response to a second position of the KoD device 102 (e.g., released). In some embodiments, the switch 114 includes a snap-disk switch. In some embodiments, the switch 114 includes multiple snap-disk switches (e.g., for KoD devices large enough to accommodate multiple KoDs).

[0043] Fig. 2 is a bottom view of an example of a flat circuit 200 for a KoD according to some embodiments. The flat circuit 200 includes a PCB 208 and a tactile dome switch 206 electrically connected to the PCB 208 via one or more dome switch pads 210. The PCB 208 includes a push electrode pad 202 and a rotating electrode pad 204. The rotating electrode pad 204 is electrically connected to the dome switch pads 210 such that the rotating electrode pad 204 is electrically connected to a touch surface 212 of the tactile dome switch 206 regardless of a position of the tactile dome switch 206.Accordingly, when a user's finger, stylus, or other touch instrument is in contact with the tactile dome switch 206, the rotating electrode pad 204 is electrically connected to the finger, stylus, or other touch instrument via the dome switch pads 210 and the touch surface 212.

[0044] The pressure electrode pad 202 is selectively electrically connected to the touch surface 212 of the tactile dome switch 206 in response to a depressed position of the tactile dome switch 206 and electrically isolated from the touch surface 212 in response to a released position of the tactile dome switch 206. As a result, when a user's finger, stylus, or other touch instrument contacts the tactile dome switch 206 and depresses it to the depressed position, the pressure electrode pad 202 is electrically connected to the finger, stylus, or other touch instrument via the touch surface 212.On the other hand, when the tactile dome switch 206 is in the released position, the pressure electrode pad 202 is electrically isolated from the user's finger, stylus, or other touch device, even when the user's finger, stylus, or other touch device is in contact with the touch surface 212. As a non-limiting example, a conductive trace electrically connected to the pressure electrode pad 202 may extend beneath the tactile dome switch 206 to a contact pad 214 beneath the tactile dome switch 206. With the KoD applied to a touchscreen of a touchscreen device, the tactile dome switch 206 is located out of engagement with the touch sensor of the touchscreen device.When the tactile dome switch 206 is depressed, the tactile dome switch 206 can contact the contact pad below the tactile dome switch 206, which electrically connects the tactile dome switch 206 to the pressure electrode pad 202.

[0045] Fig. 3A to Fig. 3C are various views of a KoD 300 according to some embodiments. Fig. Figure 3A is a perspective top view of the KoD 300. Fig. 3B is a bottom view of the KoD 300 from Fig. 3A. Fig. 3C is a perspective bottom view of the KoD 300 from Fig. 3A and Fig. 3B.

[0046] The KoD 300 includes a body 306 supporting conductive (e.g., metallic) structures, including a pressure electrode pad 310, a rotating electrode pad 312, a snap-disk switch pad 314, a pressure contact trace 308, a rotating trace 316, a conductive structure 402, and a conductive structure 404. The body 306 may include a rigid, electrically insulating material (e.g., acrylic). The pressure electrode pad 310 and the rotating electrode pad 312 may be positioned on a bottom surface of the KoD 300, which may be configured to be rotatably secured near a touchscreen (e.g., directly on the touchscreen, in engagement with a touch sensor of the touchscreen).

[0047] The dome switch pad 314 and the pressure contact trace 308 may be positioned on a top surface of the KoD 300. The KoD 300 also includes a dome switch 302 operably coupled to the dome switch pad 314. The dome switch pad 314 is electrically connected to the rotating electrode pad 312 by a rotating trace 316 on the top surface of the body 306. As a non-limiting example, the conductive structure 404 may connect the rotating trace 316 on the top surface of the body 306 to the rotating electrode pad 312 on the bottom surface of the body 306. The pressure contact trace 308 may extend beneath the dome switch 302 to a pressure contact 406.The pressure contact 406 is configured to electrically connect to the snap-disk switch 302 in response to the snap-disk switch 302 being in a depressed position, and is electrically isolated from the snap-disk switch 302 in response to the snap-disk switch 302 being in a released position. The pressure contact trace 308 is electrically connected to the pressure electrode pad 310 through the conductive structure 402.

[0048] The KoD 300 includes a snap-disk switch 302 and a touch surface 304 on the snap-disk switch 302. The touch surface 304 includes electrically conductive material to electrically connect the touch surface 304 to a user's finger or stylus interacting with the KoD 300. In both a released position and a depressed position of the snap-disk switch 302, a touch of the touch surface 304 may be electrically coupled to the rotating electrode pad 312 via the snap-disk switch 302, the snap-disk switch pad 314, the rotating trace 316, and the conductive structure 404. In the released position of the snap-disk switch 302, a touch of the touch surface 304 may be electrically isolated from the pressing electrode pad 310.In the depressed position of the snap-disk switch 302, a touch of the touch surface 304 may be electrically connected to the pressure electrode pad 310 via the snap-disk switch 302, the pressure contact 406, the pressure contact trace 308, and the conductive structure 402.

[0049] The KoD 300 further includes a recess 408 configured to receive a central hub (not shown). The central hub can be attached (e.g., adhered) to a touchscreen, and the KoD 300 can rotate about the central hub. Accordingly, in operation, the KoD 300 can rotate 412 about a central axis 410 of the KoD 300, and the positions of the printing electrode pad 310 and the rotating electrode pad 312 can rotate 412 about the central axis 410.

[0050] Fig. 4 is a perspective view of the KoD 300 from Fig. 3A, Fig. 3B and Fig. 3C in a KoD system 700 according to some embodiments. The KoD system 700 includes a touchscreen device (e.g., the touchscreen device 806 of Fig. 5) including a touchscreen 702. The KoD 300 is mounted on the touchscreen 702 (e.g., glued to the touchscreen 702 using an adhesive). With the KoD 300 positioned on the touchscreen 702, there are the rotating electrode pad 312 and the printing electrode pad 202 ( Fig. 3A) of the KoD 300 is constantly in engagement with the touchscreen 702 (e.g., with a touch sensor of the touchscreen 702). The rotating electrode pad 312 is permanently connected to the snap disk, and the pressure electrode pad 202 is, by default, in an electrically floating state (e.g., electrically separated from the touch surface 304 ( Fig. 3A)). A rotation 706 of the KoD 300 results in a rotation of the rotating electrode pad 312 with the KoD 300. Pressing the snap-disk switch 302 ( Fig. 3A) electrically connects the pressure electrode pad 202 to the touch surface 304, as previously discussed.

[0051] Fig. 5 is a perspective view of the KoD system 700 with the KoD 300 in a released position 808. Fig. 5 illustrates a touchscreen device 806, the touchscreen 702 of the touchscreen device 806, the KoD 300, and a finger 804 of a user touching the touch surface 304 ( Fig. 3A), without the snap-disk switch 302 ( Fig. 3A) into a depressed position. In other words, the KoD is in a released position 808. As a result, the rotating electrode pad 312 ( Fig. 3B) electrically connected to the contact surface 304 ( Fig. 3A) and in turn connected to the user's finger 804. Consequently, the touchscreen 702 detects the touch near the rotating electrode pad 312. A rotating ring 802 is shown depicted near the rotating electrode pad 312 on the touchscreen 702 to indicate the detected touch via the rotating electrode pad 312. The KoD 300 can be rotated, thereby moving the position of the detected touch radially about a longitudinal central axis of the KoD 300 with rotation of the rotating electrode pad 312.

[0052] Fig. 6 is a perspective view of the KoD system 700 with the KoD 300 in a depressed position 904. Fig. Figure 6 illustrates a user's finger 804 applying pressure 906 to the snap-disk switch 302 ( Fig. 3A). As a result, the KoD 300 is in a depressed position 904. The pressure of the snap-disk switch 302 connects the touch surface 304 ( Fig. 3A) electrically with the pressure electrode pad 310 ( Fig. 3A, Fig. 3B, Fig. 3C), which electrically connects the user's finger 804 to the pressure electrode pad 310. As a result, a touch sensor of the touchscreen device 806 detects a touch in the vicinity of the pressure electrode pad 310, which is illustrated by a pressure ring 902 displayed on the touchscreen 702 to indicate the detection of a touch detected in response to the pressure electrode pad 310. The rotating ring 802 is also illustrated because the rotating electrode pad 312 ( Fig. 3B) is always electrically connected to the touch surface 304 and thus is also electrically connected to the user's finger 804 when in contact with the touch surface 304, causing a touch to be detected by the touchscreen 702 near a location on the rotating electrode pad 312. In some embodiments, as in Fig. 6, the depressed position 904 may result in less than one millimeter (e.g., 0.3 millimeters to 0.5 millimeters, without limitation) of displacement of a touch surface relative to a position of the touch surface in the released position 808 ( Fig. 5) lead.

[0053] In some embodiments, the touchscreen device 806 is configured to display a plurality of different graphical user interface elements proximate the KoD 300 at different times to enable the user to interact with the different graphical user interface elements at different times via the KoD 300. As a non-limiting example, the touchscreen device 806 may be configured to display different automotive graphical user interface elements at different times. As a specific non-limiting example, a first set of graphical user interface elements may include climate control user interface elements, a second set of graphical user interface elements may include stereo control user interface elements, and a third set of graphical user interface elements may include car seat and / or rearview mirror control elements.The touchscreen device 806 and the KoD 300 can work together to allow the user to connect to these elements via rotations and presses of the KoD 300.

[0054] Fig. Figure 7 is a bottom view of an example of a flattened FPC 1000 for a KoD (e.g., a KoD 1100 of Fig. 8) according to some embodiments. The FPC 1000 includes a center hole 1006, snap-on switch contacts 1008, and a press-down contact 1014. The FPC 1000 also includes electrode pads, including a push electrode pad 1010 and a rotating electrode pad 1012.

[0055] The rotating electrode pad 1012 may be electrically connected to the snap-disk switch contacts 1008 (e.g., via one or more electrically conductive traces of the FPC 1000). Accordingly, when a user touches a snap-disk switch coupled to the snap-disk switch contacts 1008, the user's finger may be electrically connected to the snap-disk switch contacts 1008, regardless of a position of a switch (e.g., switch 114 of Fig. 1) of the KoD (e.g. the KoD 1100 from Fig. 8) be electrically connected to the rotating electrode pad 1012.

[0056] The pressure electrode pad 1010 may be electrically connected to the depress contact 1014 (e.g., via one or more electrically conductive traces of the FPC 1000). Accordingly, when a user depresses a dome switch coupled to the dome switch contacts 1008, the user's finger may be electrically connected to the pressure electrode pad 1010 in response to the depressing of the dome switch (e.g., contacting the dome switch with the depress contact 1014 in a depressed position of the switch).

[0057] Fig. Figure 8 is a cross-sectional view of an example of a KoD 1100 including an FPC 1000 of Fig. 7. The FPC 1000 is in a folded FPC configuration as opposed to the flattened FPC 1000 of Fig. 7, which is in a flat configuration (i.e., not folded). The KoD 1100 includes a snap-disk switch 1104 that is operatively connected to the snap-disk switch contacts 1008 ( Fig. 7) the FPC 1000 is coupled (e.g., electrically connected and mechanically connected). The KoD 1100 also includes a body 1110 configured to support the FPC 1000. The KoD 1100 further includes a central support pin 1106 extending through the central hole 1006 of the FPC 1000. In some embodiments, the body 1110 may be configured to rotate about the central support pin 1106. Accordingly, the KoD 1100 is configured to rotate about a central axis 1112 of the KoD 1100. The body 1110, the central support pin 1106, or both may include locking features to secure the central support pin 1106 to the body 1110 in a manner that allows rotation of the body 1110 about the central support pin 1106.As a non-limiting example, one of the body 1110 and the central support post 1106 may include detents (not shown), and the other of the body 1110 and the central support post 1106 may include detent actuators (not shown) to mechanically connect the body 1110 to the central support post 1106. In some embodiments, the central support post 1106 may be configured to be directly attached (e.g., glued) to a touchscreen. In some embodiments, one or more intervening structures may be placed between the KoD 1100 and the touchscreen. As a non-limiting example, a base assembly (e.g., base assembly 2318 of FIG. Fig. 20, a base module 2504 of Fig. 21A, a base module 2504 from Fig. 21B) between the KoD 1100 and the touchscreen.

[0058] The KoD 1100 also includes an actuator 1108 operably coupled to the snap-disk switch 1104. The actuator 1108 includes a touch surface 1102 (e.g., a top surface of and / or side surfaces of the actuator 1108). Accordingly, when a user touches the touch surface 1102, the user's finger may be electrically connected to the snap-disk switch 1104 and the snap-disk switch contacts 1008 via the actuator 1108. For example, in response to a touch of the touch surface 1102, the user's finger may be electrically connected to the rotating electrode pad 1012 ( Fig. 7), which is electrically connected (e.g., continuously) to the snap-disk switch 1008 via the FPC 1000. As a result, when the user rotates the KoD 1100, the rotating electrode pad 1012 can be continuously detected by a touch sensor of a touchscreen to which the KoD 1100 is secured, regardless of a position (e.g., depressed position, released position) of the KoD 1100. As a result, when the rotating electrode pad 1012 moves in front of the touchscreen of a touchscreen device, the touch sensor of the touchscreen device can track a position of the rotating electrode pad 1012. The snap-disk switch 1104 is also configured to selectively electrically connect the touch surface 1102 to the pressing electrode pad 1010 ( Fig. 7) of the FPC 1000 via the depression contact 1014 when the KoD 1100 is in the depressed position. As a result, in response to the user pressing the actuator 1108 with the KoD 1100 in the depressed position, the touch surface 1102 is electrically connected to the pressure electrode pad 1010, which registers a touch by the touch sensor in response to the pressure electrode pad 1010 being electrically connected to the user's finger. Although the pressure electrode pad 1010 may rotate with rotation of the KoD 1100, a press of the KoD 1100 may be detected in response to the detection of both the pressure electrode pad 1010 and the rotating electrode pad 1012. Detection of only one pad may be associated with an enabled state of the KoD 1100.

[0059] Fig. 9A through 9C are a set of views of a portion 1208 of a two-PCB KoD according to some embodiments. Fig. 9A is a perspective top view, Fig. 9B is a perspective bottom view and Fig. 9C is a top perspective view showing a snap-disk switch 1228 of section 1208. Section 1208 includes a lower PCB 1214, an upper PCB 1218, and detent actuators 1216 between the lower PCB 1214 and the upper PCB 1218. An adhesive may be used to bond the various layers of section 1208. As a non-limiting example, an adhesive may be used between the lower PCB 1214 and the detent actuators 1216 to secure the lower PCB 1214 to the detent actuators 1216. Additionally, an adhesive may be used between the detent actuators 1216 and the upper PCB 1218 to secure the detent actuators 1216 to the upper PCB 1218.

[0060] Fig. Figure 9B illustrates that the lower PCB 1214 includes a rotating electrode pad 1210 and a printing electrode pad 1212 (e.g., metal electrodes such as copper electrodes). Accordingly, if a different number, size, or configuration of electrode pads is desired, the lower PCB 1214 can easily be replaced with another lower PCB having electrode pads of the desired number, size, and configuration. Fig. 9A and Fig. 9C illustrate that the upper PCB 1218 includes a snap-disk switch pad 1222 configured to mount a snap-disk switch 1228 thereon, and a rotary trace 1226 configured to electrically connect the snap-disk switch pad 1222 to the rotary electrode pad 1210. The upper PCB 1218 also includes a pressure contact 1220 configured to electrically connect to the snap-disk switch 1228 in response to a depressed position of the snap-disk switch 1228 and to electrically isolate from the snap-disk switch 1228 in response to a released position of the snap-disk switch 1228. The upper PCB 1218 further includes a pressure contact trace 1224 configured to electrically connect the pressure contact 1220 to the pressure electrode pad 1212.

[0061] Fig. 10 is a cross-sectional view of a two-PCB KoD 1300 including section 1208 of Fig. 9A to 9C according to some embodiments. Fig. 11A is a cross-sectional view of another two-PCB KoD 1400 according to some embodiments. The KoD 1300 of Fig. 10 includes a touch cap 1306 on a pad 1304. The KoD 1400 of Fig. 11A includes a touch cap 1308 held in place by clips 1320. The KoD 1300 and the KoD 1400 illustrate the section 1208 including the lower PCB 1214, the locking actuators 1216 and the upper PCB 1218, and the snap-disk switch 1228 on the upper PCB 1218. The KoD 1300 and the KoD 1400 also include a hub 1310 extending through the lower PCB 1214. The hub 1310 may be configured to locate on a touchscreen (e.g., the touchscreen 702 of Fig. 4). As a non-limiting example, the hub 1310 may secure the touchscreen through an adhesive 1316 on the bottom of the hub 1310. Similar to the rotation of the KoD 1100 about the central retaining pin 1106 of Fig. 8, the section 1208 is configured to rotate about the hub 1310 to control the movement of the rotating electrode pad 1210 ( Fig. 9B) when the portion 1208 rotates. In some embodiments, the hub 1310 may include detents 1312 configured to provide mechanical resistance to the detent actuators 1216 when the portion 1208 rotates relative to the hub 1310. The detent actuators 1216 and the detents 1312 may also function as locking features 1330 between the portion 1208 and the hub 1310 to secure the portion 1208 to the hub 1310 in a manner that allows rotation of the portion 1208 about the hub 1310.

[0062] The KoD 1300 includes a touch cap 1306 operably coupled to the dome switch 1228 to allow a user to press the dome switch 1228 into a depressed position by pressing on the touch cap 1306. The KoD 1300 also includes the pad 1304 positioned on the top PCB 1218 at a perimeter of the top PCB 1218. The pad 1304 is configured to compress in response to pressing the touch cap 1306 to allow the touch cap 1306 to translate relative to the portion 1208. As a non-limiting example, the cushion 1304 may include an open cell foam or other material (e.g., an elastic polymer) or an object (e.g., a spring) that compresses and returns to the pre-compressed volume and shape.

[0063] The touch cap 1306 includes a touch surface 1314 thereon. At least a portion of the touch cap 1306 includes an electrically conductive material to electrically connect the touch surface 1314 to the snap-disk switch 1228. Accordingly, when a user touches the touch surface 1314, the user's finger is electrically connected to the snap-disk switch 1228. Because the snap-disk switch 1228 is continuously electrically connected to the rotating electrode pad 1210, the user's finger is electrically connected to the rotating electrode pad 1210 in both the depressed position of the KoD 1300 and the released position of the KoD 1300. In addition, the user's finger is electrically connected to the pressing electrode pad 1212 ( Fig. 9B) when the KoD 1300 is in the depressed position and electrically isolated from the pressure electrode pad 1212 when the KoD 1300 is in the released position.

[0064] The KoD 1400 also includes a touch cap 1308 operably coupled to the dome switch 1228 to allow a user to push the dome switch 1228 into a depressed position by pressing on the touch cap 1308. The touch cap 1308 includes touch cap sides 1318 that extend downwardly around lateral sides of the section 1208 to guide the touch cap 1308 when the touch cap is pushed into the depressed position. The KoD 1400 also includes clips 1320 that extend through the top PCB 1218 to retain the touch cap 1308 relative to the section 1208. The locking actuators 1216 may include passageways 1322 to allow the clips 1320 to pass through the locking actuators 1216.The upper PCB 1218 may also include passages for the clips 1320 to extend therethrough, although a distal end of each of the clips 1320 may have a horizontal dimension larger than the passages through the upper PCB 1218 to prevent the touch cap 1308 from being pulled away from the portion 1208. A proximal end of each of the clips 1320 may be attached to the touch cap 1308.

[0065] The touch cap 1308 includes a touch surface 1324 thereon. The touch surface 1324 may extend along a top surface of the touch cap 1308 and / or along outer surfaces of the sides 1318 of the touch cap 1308. At least a portion of the touch cap 1308 includes an electrically conductive material to electrically connect the touch surface 1324 to the dome switch 1228. Accordingly, when a user touches the touch surface 1324, the user's finger is electrically connected to the dome switch 1228. Because the dome switch 1228 is continuously electrically connected to the rotating electrode pad 1210, the user's finger is electrically connected to the rotating electrode pad 1210 in both the depressed position of the KoD 1400 and the released position of the KoD 1400.In addition, the user's finger is electrically connected to the pressure electrode pad 1212 when the KoD 1400 is in the depressed position and electrically isolated from the pressure electrode pad 1212 when the KoD 1400 is in the released position.

[0066] Fig. 11B is an exploded view of an example of the KoD 1400 from Fig. 11A. As previously discussed, the KoD 1400 includes a touch cap 1308 having a touch surface 1324 thereon, a snap-disk switch 1228, clips 1320 (e.g., electrically conductive clips), an upper PCB 1218, locking actuators 1216, a lower PCB 1214, a hub 1310, and an adhesive 1316 (e.g., adhesive for applying the KoD 1400 to a touchscreen of a touchscreen device).

[0067] Fig. 11C to 11H are different views of the KoD 1400 from Fig. 11A and Fig. 11B. Fig. 11C is a bottom view, Fig. 11D is a cross-sectional view along a cross section DD of the Fig. 11C, Fig. 11E is a plan view, Fig. 11F is a cross-sectional view taken along a cross section FF of the Fig. 11C, Fig. 11G is a perspective top view, and Fig. 11H is a perspective bottom view.

[0068] Fig. 12 is a cross-sectional view of an injection-molded KoD 1600 according to some embodiments. As a non-limiting example, the KoD 1600 may include a double-shot injection-molded KoD. The KoD 1600 may bear some similarity to the KoD 1300 of Fig. 10. For example, the KoD 1600 includes detent actuators 1606, a hub 1610, detents 1612, an adhesive 1628, a touch cap 1616, a touch surface 1618, a dome switch 1608, and a pad 1614 similar to the detent actuators 1616, the hub 1610, the detents 1312, the adhesive 1628, the touch cap 1306, the touch surface 1314, the dome switch 1608, and the pad 1304 of the KoD 1300 of Fig. 10. Instead of the lower PCB 1214 and the upper PCB 1218 of the KoD 1300 of Fig. 10, however, the KoD 1600 includes a substrate 1604 (e.g., an ABS substrate) and an overmolding 1602 (e.g., a conductive overmolding).

[0069] The overmolding 1602 includes electrically conductive structures such as a pressure electrode pad 1624, a rotary electrode pad 1626, a snap-disk switch pad 1622, and a pressure contact 1620, which correspond to the pressure electrode pad 1212, the rotary electrode pad 1210, the snap-disk switch pad 1222, and the pressure contact 1220 of Fig. 9A to 9C. Unlike a conductive trace material on a PCB, such as its counterparts in the KoD 1300 from Fig. 10, however, the pressure electrode pad 1624, the rotating electrode pad 1626, the dome switch pad 1622, and the pressure contact 1620 may include an injection material. As a non-limiting example, the injection material may include an electrically conductive polymer, an electrically insulating polymer coated in an electrically conductive material, or another conductive overmolding material. The pressure electrode pad 1624 is electrically connected to the pressure contact 1620 via the overmolding 1602. Additionally, the rotating electrode pad 1626 is electrically connected to the dome switch pad 1622 via the overmolding 1602. However, the pressure electrode pad 1624 and the pressure contact 1620 are electrically insulated from the rotating electrode pad 1626 and the dome switch pad 1622 by the substrate 1604.It should be noted that for simplicity, the pressure electrode pad 1624, the pressure contact 1620, the rotary electrode pad 1626, and the snap-disk switch pad 1622 are shown in FIG. Fig. 12 are not shown in detail to illustrate their separate structures. However, such detail is shown in Fig. 13A and Fig. 13B shown.

[0070] The substrate 1604 is configured to provide structural support to the overmolding 1602 and to isolate the pressure electrode pad 1624 and the pressure contact 1620 from the rotating electrode pad 1626 and the snap-disk switch pad 1622. The substrate 1604 includes an electrically insulating material. Further details regarding the KoD 1600 are described in Fig. 13A and Fig. 13B illustrates.

[0071] Fig. 13A and Fig. 13B are views of an example of a substrate 1604 and an overmolding 1602 of the KoD 1600 of Fig. 12. Fig. 13A is a perspective bottom view and Fig. Figure 13B is a top perspective view of the substrate 1604 and the overmolding 1602. Fig. Figure 13A illustrates the printing electrode pad 1624 and the rotating electrode pad 1626. Fig. Figure 13B illustrates the pressure contact 1620 and the snap-disk switch pad 1622.

[0072] Fig. 14A and Fig. 14B are a series of views of another KoD 2000 according to some embodiments. Fig. 14A is a perspective bottom view and Fig. 14B is a top perspective view of the KoD 2000. The KoD 2000 includes an overmold structure 1806 and a touch cap 1808. The touch cap 1808 includes a touch surface 1810. The overmold structure 1806 includes a printing electrode pad 1812 and a rotating electrode pad 1814. The touch surface 1810 is electrically connected to the rotating electrode pad 1814 regardless of whether the KoD 2000 is in a depressed position or a released position. The touch surface 1810 is electrically connected to the printing electrode pad 1812 in response to the KoD 2000 being in a depressed position. The touch surface 1810 is electrically isolated from the pressure electrode pad 1812 in response to the KoD 2000 being in a released position.

[0073] The KoD 2000 also includes a hub 1816 inserted into the overmold structure 1806. The hub 1816 is configured to be secured to a touchscreen, and the overmold structure 1806 is configured to rotate about the hub 1816. Accordingly, the rotating electrode pad 1814 is configured to move along the touchscreen in a rotational direction about the hub 1816 in response to the rotation of the overmold structure 1806 about the hub 1816. The printing electrode pad 1812 can also rotate about the hub 1816. As a result, both the printing electrode pad 1812 and the rotating electrode pad 1814 can be detected in response to a depressed position of the KoD 2000 and a touch of the touch surface 1810. In such a depressed position of the KoD 2000, the rotation of the KoD can be tracked by tracking the rotation of the rotating electrode pad 1814, the printing electrode pad 1812, or both.

[0074] Fig. 15A to 15C are views of an example of the overmolding structure 1806 of the KoD 2000 of Fig. 16A and Fig. 16B. Fig. 15A is a perspective top view, Fig. 15B is a perspective bottom view and Fig. 15C is a side perspective view of the overmold structure 1806 including an overmold 1916 positioned within a substrate 1918. The overmold structure 1806 includes an overmold 1916 and a substrate 1918 configured to support the overmold 1916. In some embodiments, the overmold 1916 is configured to snap into the substrate 1918. In some embodiments, the overmold 1916 and / or the substrate 1918 includes one or more structures configured to mate with one or more recesses of the substrate 1918 and / or the overmold 1916.

[0075] Fig. 16 is a perspective side view of the overmolding 1916 of the overmolding structure 1806 of Fig. 15A to 15C. The overmold 1916 includes a dome switch pad 1922 electrically connected to the rotating electrode pad 1814. The dome switch pad 1922 is configured to allow a dome switch to be mounted thereon. The dome switch is operably coupled to the touch cap 1808 such that the touch surface 1810 of the touch cap 1808 is electrically connected to the dome switch pad 1922 and the rotating electrode pad 1814 through the dome switch in response to both the depressed position and the released position of the KoD 2000.

[0076] The overmolding 1916 also includes a pressure contact 1920 that is electrically connected to the pressure electrode pad 1812. The pressure contact 1920 is configured to contact the touch surface 1810 ( Fig. 14B) of the contact cap 1808 ( Fig. 14A and Fig. 14B) in response to a depressed position of the KoD 2000 ( Fig. 14A and Fig. 14B). As a non-limiting example, the dome switch may be configured to contact the pressure contact 1920 in response to the depressed position of the KoD 2000. Furthermore, the dome switch may be configured not to contact the pressure contact 1920 in response to the released position of the KoD 2000.

[0077] Fig. 17 is a perspective top view of the substrate 1918 of the overmolding structure 1806 of Fig. 15A to 15C. The substrate 1918 includes cap clips 1912 configured to support the touch cap 1808 ( Fig. 14A and Fig. 14B) to the overmolding structure 1806. The substrate 1918 also includes locking actuators 1914 (e.g., spring locking actuators) configured to engage the detents in the hub 1816 ( Fig. 14A). In some embodiments, the locking actuators 1914 are mirrored (e.g., bilaterally symmetrical), as shown in Fig. 17 to provide a similar experience to a user rotating the KoD 2000 in either direction of rotation of the KoD 2000.

[0078] Fig. 18A to 18F are views of the KoD 2000 from Fig. 14A and Fig. 14B. Fig. 18A is an exploded view of the KoD 2000 from Fig. 14A and Fig. 14B. As previously discussed, the KoD 2000 includes the touch cap 1808 with the touch surface 1810, a snap-disk switch 2004, an overmold structure 1806, a hub 1816 with detents 2006 (configured to correspond to the detent actuators 1914 of Fig. 17) and adhesive 2002 (e.g., to secure the hub 1816 to a touchscreen device).

[0079] Fig. 18B to 18F are other views of the KoD 2000 from Fig. 14A to 14B and the Fig. 18A, with labels identifying the various elements as indicated above. Fig. 18B is a bottom view, Fig. 18D is a plan view, Fig. 18C is a cross-sectional view along line CC of Fig. 18B, Fig. 18E is a cross-sectional view along cross section EE of Fig. 18B, and Fig. 18F is a cross-sectional view along section FF of Fig. 18B.

[0080] Fig. 19 is a flowchart illustrating a method 2200 for operating a KoD device (e.g., one of the KoD devices disclosed herein) according to some embodiments. At operation 2202, the method 2200 includes electrically connecting a user's finger touching a touch surface of a KoD device to a rotating electrode pad in response to a touch of the finger on the touch surface, regardless of a depressed position of the KoD device or a released position of the KoD device.

[0081] At operation 2204, method 2200 includes electrically connecting the finger to a pressure electrode pad of the KoD device in response to the depressed position of the KoD device. In some embodiments, electrically connecting the finger to the pressure electrode pad in response to the depressed position includes contacting a pressure contact with a dome switch electrically connected to the touch surface in response to the dome switch being depressed onto the pressure contact, wherein the pressure contact is electrically connected to the pressure electrode pad.

[0082] At operation 2206, method 2200 includes electrically isolating the finger from the pressure electrode pad of the KoD device in response to the released position of the KoD device. In some embodiments, electrically isolating the finger from the pressure electrode pad in response to the released position comprises electrically isolating a pressure contact from a snap-disk switch electrically connected to the touch surface, the pressure contact being electrically connected to the pressure electrode pad.

[0083] At operation 2208, method 2200 includes maintaining the pressure electrode pad at a constant distance from a touchscreen of a touchscreen device regardless of the depressed position and the released position of the KoD device.

[0084] Fig. 20 is a block diagram of a KoD system 2300 according to some embodiments. The KoD system 2300 may be similar to the KoD system 100 of Fig. 1. For example, the KoD system 2300 includes a KoD device 2302 and a touchscreen device 2304 similar to the KoD 102 and touchscreen device 104 of Fig. 1. Similar to the control circuitry 108 and the touch sensor 106 of the touchscreen device 104 of Fig. 1, the touchscreen device 2304 includes control circuitry 2308 operably coupled to a touch sensor 2306. The KoD device 2302 includes a touch surface 2316, a switch 2314, a rotating electrode pad 2312, and a pressing electrode pad 2310, similar to the touch surface 116, the switch 114, the rotating electrode pad 112, and the pressing electrode pad 110 of Fig. 1. The at least one electrode (e.g., the pressure electrode pad 2310, the rotating electrode pad 2312) includes an electrically conductive material. The touch surface 2316 is electrically connected to the rotating electrode pad 2312 and selectively electrically connected to the pressure electrode pad 2310 by the switch 2314. The KoD device 2302 is configured to be mounted on a touchscreen 2320 of the touchscreen device 2304 with the at least one electrode (e.g., the rotating electrode pad 2312 and the pressure electrode pad 2310) in engaging proximity to the touch sensor 2306. As a non-limiting example, the rotating electrode pad 2312 and the pressure electrode pad 2310 may be positioned at a constant distance from the touchscreen 2320 of the touchscreen device 2304.

[0085] The KoD device 2302 also includes a base assembly 2318 configured to be positioned between the touchscreen 2320 of the touchscreen device 2304 and the pressure electrode pad 2310 and the rotating electrode pad 2312. The at least one electrode is configured to interact with the touch sensor 2306 through the base assembly 2318 and the touchscreen 2320. For example, the base assembly 2318 may be sufficiently thin to allow the touch sensor 2306 to detect the at least one electrode (e.g., the pressure electrode pad 2310 and the rotating electrode pad 2312) through the base assembly 2318 and the touchscreen 2320. In other words, the at least one electrode is located in engagement proximity 2322 with the touch sensor 2306 through the base assembly.In some embodiments, the base assembly 2318 is configured to at least partially cover an end of the KoD device 2302, including the one or more electrodes. A thickness of the base assembly 2318, including an adhesive that secures the base assembly 2318 to the touchscreen device 2304, may be about 0.5 millimeters (0.5 mm) or less, without limitation.

[0086] In some embodiments, the base assembly 2318 includes one or more sidewalls that extend toward a conductive cap of the KoD device 2302 (e.g., at least partially an inner housing, such as an inner housing 2626 of Fig. 21B). In some embodiments, the KoD device 2302 includes one or more seals between the one or more sidewalls of the base assembly 2318 and the conductive cap to seal an interior of the KoD device 2302 (e.g., from liquids, dust, dirt, or other contaminants). In some embodiments, the base assembly 2318 includes a post (e.g., a post 2630 of Fig. 21B) configured to extend therefrom into an inner housing (e.g., the inner housing 2626 of Fig. 21B) of the KoD device 2302 to allow the inner housing to rotate about the post. Rotation of the inner housing may allow rotation of the rotating electrode pad 2312 and the printing electrode pad 2310, which are mechanically coupled to the inner housing via the post. In some embodiments, the base assembly includes detents (e.g., detents 2628 of Fig. 21B), and the inner housing includes locking actuators (e.g., a locking ball 2618 and a locking spring 2622 of Fig. 21B) to provide mechanical resistance and, in some cases, tactile "click" feedback to rotation of the inner housing about the post. The detents and detent actuators can act as a locking mechanism to secure the base assembly to the inner housing, while allowing the inner housing to rotate around the post and within the base assembly.

[0087] The KoD device 2302 includes a touch surface 2316 including a conductive material, wherein the touch surface 2316 is configured to be positioned in a released position by default and in a depressed position in response to pressure applied to the touch surface 2316 (the pressure that closes the switch 2314 to electrically connect the touch surface 2316 to the pressure electrode pad 2310). The KoD device 2302 also includes the pressure electrode pad 2310, which is configured to be positioned in engagement with a touch sensor 2306 of a touchscreen device 2304 in both the released position and the depressed position.For example, the touch pressure electrode pad 2310 may be positioned at constant distances from the touchscreen 2320 and the touch sensor 2306, regardless of the released position and the depressed position of the KoD device 2302. The pressure electrode pad 2310 is electrically connected to the conductive material of the touch surface 2316 in response to the depressed position and electrically isolated from the conductive material of the touch surface 2316 in response to the released position. The KoD device 2302 further includes a rotating electrode pad 2312 configured to be positioned proximate to the touch sensor 2306 of the touchscreen device 2304 in both the released position and the depressed position.For example, the rotating electrode pad 2312 may be positioned at constant distances from the touchscreen 2320 and the touch sensor 2306, regardless of the released and depressed positions of the KoD device 2302. The rotating electrode pad 2312 is electrically connected to the conductive material of the touch surface 2316 in both the released and depressed positions.

[0088] In some embodiments, the base assembly 2318 is configured to receive an adhesive (e.g., an adhesive 2624 of Fig. 21B) on a side of the base assembly 2318 opposite the at least one electrode (e.g., a surface of the base assembly 2318 facing the touchscreen 2320 of the touchscreen device 2304). The adhesive is configured to attach the KoD device 2302 to the touchscreen 2320 of the touchscreen device 2304. Accordingly, the base assembly 2318 is configured to be attached to the touchscreen 2320. In some embodiments, at least substantially the entire side of the base assembly opposite the at least one electrode is configured to carry the adhesive.

[0089] In some embodiments, the KoD device 2302 further includes an FPC configured to electrically connect the pressure electrode pad 2310 and the rotational electrode pad 2312 to the touch surface 2316. In some embodiments, the KoD device 2302 includes a PCB configured to electrically connect the rotational electrode pad 2312 to the touch surface 2316 and further switchably connect the pressure electrode pad 2310 to the touch surface 2316. In some embodiments, the KoD device 2302 includes a folded FPC configured to electrically connect the rotational electrode pad 2312 to the touch surface 2316 and further switchably connect the pressure electrode pad 2310 to the touch surface 2316.In some embodiments, the KoD device 2302 includes a conductive overmolding that encloses the printing electrode pad 2310 and the rotating electrode pad 2312.

[0090] In some embodiments, a distance between the released position of touch surface 2316 and the depressed position of touch surface 2316 is less than one millimeter (e.g., 0.3 mm to 0.5 mm). In some embodiments, a distance between the released position of touch surface 2316 and the depressed position of touch surface 2316 is approximately 0.6 mm. In some embodiments, pressure electrode pad 2310 is configured to remain in an electrically floating state in response to touch surface 2316 being in a released position. KoD device 2302 further includes a switch 2314 configured to selectively operably couple pressure electrode pad 2310 to the conductive material of touch surface 2316 in response to the depressed position.In some embodiments, switch 2314 includes a snap-disk switch.

[0091] Similar to the KoD 102 of the Fig. 1, the KoD device 2302 may include any KoD such as the KoD 300, the KoD 1100, the KoD 1300, the KoD 1400, the KoD 1600, the KoD 2000, or other KoD devices with the addition of the base assembly 2318. As a non-limiting example, the KoD device 2302 may include an overmolded inner package implementation (e.g., similar to the KoD 1600 or the KoD 2000) with the addition of the base assembly.

[0092] Fig. 21A to 21J are views of a KoD device 2500 which is an example of the KoD device 2302 of Fig. 20 is. Fig. 21A is a perspective view of the KoD device 2500. The KoD device 2500 includes a touch surface 2502 and a base assembly 2504. The base assembly 2504 includes a side 2506 configured to adhere to a touchscreen of a touchscreen device. The side 2506 of the base assembly 2504 is configured to face the touchscreen and to be opposite a side of the base assembly 2504 that faces one or more electrodes of the KoD device 2500. To adhere the KoD device 2500 to the touchscreen, an adhesive may be applied to at least substantially an entire surface of the side 2506 of the base assembly 2504 that faces the one or more electrodes.

[0093] Fig. 21B is an exploded view of the KoD device 2500 of Fig. 21A. The KoD device 2500 includes a conductive decorative ring 2602 (e.g., including laser-cut metal), a ring adhesive 2604 (e.g., can be replaced with clamps to clamp the conductive decorative ring 2602 to the conductive cap 2606), a conductive cap 2606 (e.g., including the touch surface 2502), a dome switch 2608, a dome PCB 2610, a starlock retainer 2612, a bearing 2614, connecting springs 2616 (e.g., two connecting springs), a detent ball 2618 (e.g., a ball that serves as a detent actuator, in some cases a 3 mm ball formed from a thermoplastic such as Delrin®), an electrode PCB 2620 (e.g., including at least one Electrode such as the rotating electrode pad 2312 and / or the pressure electrode pad 2310 of Fig. 20), a detent spring 2622, a base assembly 2504 (e.g., formed from ABS), and an adhesive 2624 (e.g., adhesive 467 from 3M). In some embodiments, the adhesive 2624 may be sized to cover at least substantially an entire surface of the side 2506 of the base assembly 2504 that faces one or more electrodes of the electrode PCB 2620 (i.e., the side 2506 of the base assembly 2504 configured to face the touchscreen device). For example, as in Fig. 21B illustrates that the adhesive 2624 is the same size as the side 2506 of the base assembly 2504.

[0094] The base assembly 2504 and the conductive cap 2606 together enclose the other components (e.g., the electrode PCB 2620, the inner housing 2626, the detent spring 2622, the detent ball 2618, the bearing 2614, the connecting springs 2616, the starlock retainer 2612, the dome PCB 2610, and the dome switch 2608). The base assembly 2504 can be directly attached to a touchscreen (e.g., the touchscreen 2320 of Fig. 20) with adhesive 2624. The base assembly 2504 may also include detents 2628 to engage the detent ball 2618 and provide mechanical resistance to rotation of the KoD device 2500 and mechanically secure the base assembly 2504 to the inner housing 2626. The base assembly 2504 further includes a post 2630 configured to couple to the bearing 2614, allowing the inner housing 2626 and its coupled components (e.g., the electrode PCB 2620, the dome PCB 2610, the dome switch 2608, the conductive cap 2606, the ring adhesive 2604, the conductive decorative ring 2602) to rotate relative to the post 2630.

[0095] In some embodiments, the connecting springs 2616 are configured to connect the dome PCB 2610 to the inner housing 2626. In some embodiments, the assembly may be attached to the base assembly 2504 using the Starlock retainer 2612 and the connecting springs 2616. However, in some embodiments, solder may be used to connect the dome PCB 2610 to the electrode PCB 2620. A relatively thin bearing 2614, in some embodiments 1 to 2 mm thick, may be used to reduce the overall height of the KoD device 2500. In some embodiments, instead of using a bearing 2614, an interface between two different plastics may be used as the bearing, which may be a relatively inexpensive implementation. As stated above, the overall height of the KoD device 2500 should preferably not exceed 10 mm.

[0096] The at least one electrode of the electrode PCB 2620 (e.g., the printing electrode pad 2310, the rotating electrode pad 2312 of Fig. 20) can be captured by the base assembly 2504 and the adhesive 2624. The thickness of the base assembly 2504 can affect performance because the base assembly becomes an extension of the touch sensor surface.

[0097] Fig. 21C to 21H illustrate various views of the KoD device, with the labels identified as above. Fig. 21C is a bottom view, Fig. 21E is a plan view and Fig. 21G is a perspective view of the KoD device 2500. Fig. 21D is a cross-sectional view through section DD of Fig. 21C, Fig. 21F is a cross-sectional view through section FF of Fig. 21C, and Fig. 21H is a cross-sectional view through the cross section HH of Fig. 21C.

[0098] Fig. 21I and Fig. 21J are cross-sectional views of the KoD device 2500. Fig. 21I illustrates the detent ball 2618 engaged with the detents 2628 of an inner wall of a side wall 2812 of the base assembly 2504. The detent spring 2622 is configured to apply an outward force to the detent ball 2618 to maintain engagement between the detent ball 2618 and the detents 2628. Fig. 21I also illustrates the adhesive 2624 applied to (supported by) the side 2506 of the base assembly 2504 configured to face the touchscreen device. As a non-limiting example, the adhesive 2624 may be configured to span at least substantially the entire side 2506 of the base assembly 2504, as shown in Fig. 21I. Also as a non-limiting example, a thickness 2810 of the base assembly 2504 may be substantially 0.5 mm or less.

[0099] As in Fig. 21J, the KoD device 2500 may include at least one seal 2806 between the base assembly 2504 and the conductive cap 2606 to prevent foreign materials from entering the KoD device 2500. In some embodiments, the conductive cap 2606 includes one or more clips 2808 configured to secure the conductive cap 2606 to the inner housing 2626, as shown in Fig. 21J illustrates.

[0100] Fig. 22A and Fig. 22B are views of a KoD system 3002 similar to the KoD system 2300 of Fig. 20. The KoD system 3002 includes a touchscreen device 3008 similar to the touchscreen device 2304 of Fig. 20. The touchscreen device 3008 includes a touchscreen 3010 similar to the touchscreen 2320 of Fig. 20. The touchscreen device 3008 also includes a touch sensor and control circuitry (not shown), similar to the touch sensor 2306 and control circuitry 2308 of Fig. 20. The KoD system 3002 further includes the KoD device 2500 of Fig. 21A, which is attached to the touchscreen 3010. As a non-limiting example, the base assembly 2504 (not shown) of the KoD device 2500 may be bonded using the adhesive 2624 ( Fig. 21B) may be attached to the touchscreen 3010. Rotation 3018 of the conductive cap 2606 may cause a rotating electrode pad of the KoD device 2500 to rotate with the conductive cap 2606. A pressure electrode pad and the rotating electrode pad of the KoD device 2500 may be in engagement proximity 3016 to the touch sensor of the touchscreen device 3008.

[0101] Fig. Figure 22B illustrates a user's finger 3012 touching the touch surface 2502 of the KoD device 2500. In response to the finger 3012 touching the touch surface 2502, the touchscreen device 3008 is arranged to display a ring 3014 on the touchscreen 3010 corresponding to a detection of one or more of the pressure electrode pad and the rotary electrode pad. This detection results from the electrical connection of the touch surface 2502 to the rotary electrode pad and the switchable connection of the touch surface 2502 to the pressure electrode pad, as discussed above. Accordingly, the KoD device 2500 is configured to electrically connect the finger 3012 to one or more of the pressure electrode pad and the rotary electrode pad.

[0102] Firmware of the control logic (e.g. the control logic 2308 of Fig. 20) The touchscreen device 3008 can be tuned based on the sensitivity performance of the KoD device 2500, given the presence of the base assembly 2504, to provide adequate performance.

[0103] Fig. 23 is a flowchart illustrating a method 3100 for assembling a KoD system (e.g., the KoD system 2300 of Fig. 20) according to some embodiments. In operation 3102, the method 3100 includes applying an adhesive (e.g., the adhesive 2624 of Fig. 21B) to a base assembly (e.g. the base assembly 2318 of Fig. 20, the base module 2504 of Fig. 21A) of a KoD device (e.g. the KoD device 2302 of Fig. 20, the KoD device 2500 of Fig. 21A), wherein the base assembly at least partially comprises one or more electrodes (e.g., the pressure electrode pad 2310 and / or the rotation electrode pad 2312 of Fig. 20) configured to interact with a touch sensor (e.g., the touch sensor 2306 of Fig. 20) a touchscreen device (e.g., the touchscreen device 2304 of Fig. 20, the touchscreen device 3008 of Fig. 22A and Fig. 22B). As a non-limiting example, Fig. 21B illustrates an adhesive 2624 to be applied to a base assembly 2504. In some embodiments, applying the adhesive to the base assembly includes applying the adhesive to substantially an entire surface of the base assembly configured to face the touchscreen device.

[0104] In operation 3104, the method 3100 includes securing the KoD device to a touchscreen of the touchscreen device with the base assembly between the one or more electrodes and the touchscreen. As a non-limiting example, Fig. 22A and Fig. 22B a KoD device 2500, which has the adhesive 2624 of Fig. 21B is attached to a touchscreen device 3008.

[0105] Fig. 24 is a block diagram of a computing device 3200 that may be used in some embodiments. The computing device 3200 includes one or more processors 3202 (sometimes referred to herein as "processors 3202") operably coupled to one or more data storage devices (sometimes referred to herein as "storage 3204"). The memory 3204 includes computer-readable instructions (e.g., software, firmware) stored thereon. The computer-readable instructions are configured to instruct the processors 3202 to perform operations of the embodiments disclosed herein. As non-limiting examples, the computer-readable instructions may be configured to instruct the processors 3202 to execute at least a portion or all of the control circuitry 108 of Fig. 1 and / or the control logic 2308 of Fig. 20 to be carried out.

[0106] In some embodiments, processors 3202 include a central processing unit (CPU), a microcontroller, a programmable logic controller (PLC), another programmable device, or any combination thereof. In some embodiments, storage 3204 includes volatile data storage (e.g., random access memory (RAM)), non-volatile data storage (e.g., flash memory, a hard disk drive, a solid-state drive, erasable programmable read-only memory (EPROM), without limitation). In some embodiments, processors 3202 are configured to transfer computer-readable instructions stored in non-volatile data storage to volatile data storage for execution. In some embodiments, processors 3202 and storage 3204 may be implemented in a single device (e.g., a semiconductor device product, a system on a chip (SOC)).

[0107] It should be noted that capacitive coupling between a snap-disk switch and a pressure electrode pad can trigger false pressure detection. If this capacitance is at least four times (or even ten times) smaller than the electrode node capacitance in the depressed state, false detections should be minimal or eliminated. It should also be noted that placing a central snap-disk too close to a touchscreen, thereby interfering with the touchscreen, should be avoided. Furthermore, for extremely low-profile KoDs, care should be taken to keep the touch surface out of the engagement proximity of the touch sensor, especially in the released position, to prevent the touch surface itself from triggering a touch by the touch sensor. Furthermore, for KoDs with relatively large diameters, multiple pressure electrode pads can be used around the diameter.In response to a pressure on the KoD, a pressure electrode pad closest to the location of the pressure may be electrically connected to a touch surface of the KoD. Examples

[0108] The following is a non-exhaustive, non-limiting list of exemplary embodiments. Not every exemplary embodiment listed below is explicitly and individually stated to be combinable with all other exemplary embodiments listed below and the embodiments discussed above. However, it is intended that these exemplary embodiments be combined with all other exemplary embodiments and the embodiments discussed above, unless it is obvious to one skilled in the art that the embodiments are incombinable.

[0109] Example 1: A control button on a display (KOD), comprising: a touch surface comprising a conductive material, wherein the touch surface is configured to be positioned in a released position by default and in a depressed position in response to pressure applied to the touch surface; and a pressure electrode pad configured to be positioned in engagement with a touch sensor of a touchscreen device in both the released position and the depressed position, wherein the pressure electrode pad is electrically connected to the conductive material of the touch surface in response to the depressed position and electrically insulated from the conductive material of the touch surface in the released position.

[0110] Example 2: The KoD device of Example 1, further comprising a rotating electrode pad configured to be positioned in engagement proximity to the touch sensor of the touchscreen device in both the released position and the depressed position, wherein the rotating electrode pad is electrically connected to the conductive material of the touch surface in both the released position and the depressed position.

[0111] Example 3: The KoD device of Example 2, further comprising a flexible circuit board configured to electrically connect the pressure electrode pad and the rotation electrode pad to the touch surface.

[0112] Example 4: The KoD device of Example 2, further comprising a circuit board configured to electrically connect the pressure electrode pad and the rotation electrode pad to the touch surface.

[0113] Example 5: The KoD device of Example 2, further comprising a folded flexible circuit board configured to electrically connect the pressure electrode pad and the rotation electrode pad to the touch surface.

[0114] Example 6: The KoD device of Example 2, further comprising a conductive overmolding enclosing the printing electrode pad and the rotating electrode pad.

[0115] Example 7: The KoD device according to any one of examples 1 to 6, wherein a distance between the released position of the touch surface and the depressed position of the touch surface is less than one millimeter (1 mm) (e.g., 0.3 to 0.5 mm).

[0116] Example 8: The KoD device according to any one of examples 1 to 7, wherein a distance between the released position of the touch surface and the depressed position of the touch surface is between three-tenths of a millimeter (0.3 mm) and five millimeters (5 mm).

[0117] Example 9: The KoD device of any one of examples 1 to 8, wherein the pressure electrode pad is configured to remain in an electrically floating state in response to the touch surface being in the released position.

[0118] Example 10: The KoD device of any one of Examples 1 to 9, further comprising a switch configured to selectively operably couple the pressure electrode pad to the conductive material of the touch surface in response to the depressed position.

[0119] Example 11: The KoD device of Example 10, wherein the switch comprises a snap-disk switch.

[0120] Example 12: A control button on a display (KOD) comprising: at least one electrode comprising an electrically conductive material, wherein the at least one electrode is configured to be positioned in engagement proximity to a touch sensor of a touchscreen device; and a base assembly configured to be positioned between a touchscreen of the touchscreen device and the at least one electrode, wherein the at least one electrode is configured to interact with the touch sensor through the base assembly.

[0121] Example 13: The KoD device of Example 12, wherein the base assembly is configured to carry an adhesive on a touch sensor side of the base assembly opposite the at least one electrode to attach the KoD device to the touchscreen of the touchscreen device.

[0122] Example 14: The KoD device of Example 13, wherein at least substantially all of the touch sensor side of the base assembly is configured to carry the adhesive.

[0123] Example 15: The KoD device of any one of examples 12 to 14, wherein the base assembly is configured to at least partially cover an end of the KoD device including the at least one electrode.

[0124] Example 16: The KoD device of any one of examples 12 to 15, wherein the base assembly is about 0.5 millimeters thick (0.5 mm).

[0125] Example 17: The KoD device of any one of examples 12 to 16, wherein the base assembly includes one or more sidewalls extending toward a conductive cap of the KoD device.

[0126] Example 18: The KoD device of Example 17, further comprising one or more seals between the one or more sidewalls of the base assembly and the conductive cap of the KoD device.

[0127] Example 19: The KoD device of any one of examples 12 to 18, wherein the at least one electrode includes a pressure electrode pad configured to interact with the touch sensor in response to a user pressing a conductive cap of the KoD device.

[0128] Example 20: The KoD device of any one of examples 12 to 19, wherein the at least one electrode includes a rotating electrode pad configured to rotate within engagement proximity of the touch sensor in response to a user rotating the conductive cap of the KoD device.

[0129] Example 21: A vehicle including a CoD system, wherein the CoD system comprises the touchscreen device and the CoD device according to any one of Examples 12 to 20.

[0130] Example 22: A control button on a display (KOD), comprising: at least one electrode comprising an electrically conductive material, wherein the at least one electrode is configured to be positioned in engagement proximity to a touchscreen of a touchscreen device; and a base assembly configured to be positioned between the touchscreen of the touchscreen device and the at least one electrode, wherein the at least one electrode is configured to be positioned in engagement proximity to the touchscreen of the touchscreen device by the base assembly.

[0131] Example 23: The KoD device of Example 22, further comprising an adhesive on a side of the base assembly opposite the at least one electrode to attach the KoD device to the touchscreen of the touchscreen device.

[0132] Example 24: The KoD device of Example 23, wherein the adhesive is applied to at least substantially the entire side of the base assembly opposite the at least one electrode such that the adhesive is the same size as the entire side of the base assembly opposite the at least one electrode.

[0133] Example 25: The KoD device of any one of examples 22 to 24, wherein the base assembly is configured to at least partially cover one end of the KoD device.

[0134] Example 26: The KoD device of any one of examples 22 to 25, wherein the base assembly has a thickness of 0.5 millimeters or less.

[0135] Example 27: The KoD device of any one of examples 22 to 26, wherein the base assembly includes one or more sidewalls extending toward a conductive cap of the KoD device.

[0136] Example 28: The KoD device of Example 27 further comprising one or more seals between the one or more sidewalls of the base assembly and the conductive cap of the KoD device.

[0137] Example 29: The KoD device of any one of examples 22 to 28, wherein the at least one electrode includes a pressure electrode pad configured to interact with the touch sensor in response to a conductive cap of the KoD device being depressed.

[0138] Example 30: The KoD device of any one of examples 22 to 29, wherein the at least one electrode includes a rotating electrode pad configured to rotate within the engagement proximity of the touch sensor in response to rotation of the conductive cap of the KoD device.

[0139] Example 31: The KoD device of any one of examples 22 to 30, further comprising: an inner housing coupled to the at least one electrode; and a bearing coupled to the inner housing; wherein the base assembly includes a post coupled to the bearing to enable the inner housing and the at least one electrode to rotate about the post.

[0140] Example 32: The KoD device of Example 31, wherein the base assembly includes detents and the inner housing includes one or more detent actuators to provide mechanical resistance to rotation of the inner housing about the post.

[0141] Example 33: A control button on a display (COD) system comprising: a touchscreen device including a touch sensor and a touchscreen; and a COD device including: a base assembly attached to the touchscreen of the touchscreen device; and one or more electrodes positioned in engagement proximity to the touch sensor of the touchscreen device by the base assembly.

[0142] Example 34: The KoD system of Example 33, wherein: the base assembly includes a post extending therefrom; and the KoD device further includes an inner housing coupled to the one or more electrodes, the base assembly configured to at least partially receive the inner housing, the inner housing and the one or more electrodes configured to rotate about the post of the base assembly.

[0143] Example 35: The KoD system of any one of examples 33 to 34, wherein the touchscreen device further comprises control circuitry configured to control the touchscreen device to display a plurality of different graphical user interfaces with which the KoD device is configured to interact.

[0144] Example 36: The KoD system of any one of examples 33 to 35, wherein the base assembly is attached to the touchscreen using an adhesive.

[0145] Example 37: The KoD system of Example 36, wherein the adhesive spans at least substantially an entire surface of the base assembly facing the touchscreen.

[0146] Example 38: The KoD system of any one of Examples 33 to 37, wherein the KoD device further comprises a touch surface electrically connected to a pressure electrode pad of the one or more electrodes in response to a first position of the KoD device, the touch surface electrically isolated from the pressure electrode pad in response to a second position of the KoD device.

[0147] Example 39: The KoD system of example 38, wherein the one or more electrodes include a rotating electrode pad configured to be electrically connected to a touch surface of the KoD device independently of the first position of the KoD device and the second position of the KoD device.

[0148] Example 39A: The KoD system of any one of Examples 33 to 39, wherein the one or more electrodes include a rotating electrode pad configured to be electrically connected to a touch surface of the KoD device independently of a depressed position of the KoD device and a released position of the KoD device.

[0149] Example 40: A method of assembling a control button on display (COD) system, the method comprising: applying an adhesive to a base assembly of a COD device, the base assembly at least partially receiving one or more electrodes; and attaching the COD device to a touchscreen of a touchscreen device with the base assembly between the one or more electrodes and the touchscreen and with the one or more electrodes positioned in engagement proximity to the touch sensor of the touchscreen device through the base assembly.

[0150] Example 41: The method of Example 40, wherein applying the adhesive to the base assembly comprises applying the adhesive to substantially an entire surface of the base assembly configured to face the touchscreen.

[0151] Example 41A: The method of Example 40, wherein the one or more electrodes are positioned at a fixed distance from the touch sensor of the touchscreen device.

[0152] Example 42: A control button on a display (KOD) device comprising: a touch surface comprising a conductive material, the touch surface configured to be positioned in a released position and a depressed position; and a pressure electrode pad configured to be positioned in engagement proximity to a touch sensor of a touchscreen device in both the released position and the depressed position, the pressure electrode pad being electrically connected to the conductive material of the touch surface in response to one of the depressed position and the released position, and electrically insulated from the conductive material of the touch surface in the other of the depressed position and the released position.

[0153] Example 42A: The KoD device of Example 40, wherein the pressure electrode pad is electrically connected to the conductive material of the touch surface in response to the depressed position and is electrically isolated from the conductive material of the touch surface in the released position.

[0154] Example 43: The KoD device of Example 42, further comprising a rotating electrode pad configured to be positioned proximate to the touch sensor of the touchscreen device in both the released position and the depressed position, wherein the rotating electrode pad is electrically connected to the conductive material of the touch surface in both the released position and the depressed position.

[0155] Example 44: The KoD device of Example 43, further comprising a flexible printed circuit board configured to electrically connect the pressure electrode pad and the rotation electrode pad to the touch surface in response to the one of the depressed position and the released position.

[0156] Example 45: The KoD device of Example 43, further comprising a circuit board configured to electrically connect the pressure electrode pad and the rotation electrode pad to the touch surface in response to the one of the depressed position and the released position.

[0157] Example 46: The KoD device of Example 43, further comprising a folded flexible circuit board configured to electrically connect the pressure electrode pad and the rotation electrode pad to the touch surface in response to the one of the depressed position and the released position.

[0158] Example 47: The KoD device of Example 43, further comprising a conductive overmolding enclosing the printing electrode pad and the rotating electrode pad.

[0159] Example 48: The KoD device of any one of examples 43 to 47, further comprising a hub configured to be attached to a touchscreen of a touchscreen device, wherein the rotating electrode pad is configured to rotate about the hub.

[0160] Example 49: The KoD device of Example 48, further comprising detent actuators mechanically coupled to the rotating electrode pad, wherein the hub includes detents configured to provide mechanical resistance to the detent actuators in response to rotation of the detent actuators about the hub.

[0161] Example 50: The KoD device according to any one of examples 42 to 6, wherein a distance between the released position of the touch surface and the depressed position of the touch surface is less than one millimeter (1 mm) (e.g., 0.3 to 0.5 mm).

[0162] Example 51: The KoD device of any one of examples 42 to 50, wherein a distance between the released position of the touch surface and the depressed position of the touch surface is between 0.3 and 0.5 millimeters (0.3 to 0.5 mm).

[0163] Example 52: The KoD device of any one of examples 42 to 51, wherein the pressure electrode pad is configured to remain in an electrically floating state in response to the touch surface being in the released position.

[0164] Example 53: The KoD device of any one of Examples 42 to 52, further comprising a switch configured to selectively operably couple the pressure electrode pad to the conductive material of the touch surface in response to the depressed position.

[0165] Example 54: The KoD device of example 53, wherein the switch comprises a snap-disk switch.

[0166] Example 55: A method of operating a control button on a display (KoD) device, the method comprising: electrically connecting a touch surface of a KoD device to a rotary electrode pad regardless of a depressed position of the KoD device or a released position of the KoD device; electrically connecting the touch surface to a pressure electrode pad of the KoD device in response to the depressed position of the KoD device; and electrically isolating the touch surface from the pressure electrode pad of the KoD device in response to the released position of the KoD device.

[0167] Example 56: The method of Example 55, further comprising maintaining the pressure electrode pad and the rotation electrode pad at a constant distance from a touchscreen of a touchscreen device regardless of the depressed position and the released position of the KoD device.

[0168] Example 57: The method of any one of examples 55 to 56, wherein electrically connecting the touch surface to the pressure electrode pad in response to the depressed position comprises contacting the snap-disk switch with a pressure contact in response to depressing the snap-disk switch to the pressure contact, the snap-disk switch being electrically connected to the touch surface, the pressure contact being electrically connected to the pressure electrode pad.

[0169] Example 58: The method of any one of examples 55 to 57, wherein electrically isolating the touch surface from the pressure electrode pad in response to the released position comprises electrically isolating a pressure contact from a snap-disk switch, the snap-disk switch being electrically connected to the touch surface, the pressure contact being electrically connected to the pressure electrode pad.

[0170] Example 59: A control button on a display (KoD) system comprising: a touchscreen device including a touchscreen and a touch sensor; and a KoD device attached to the touchscreen, the KoD device comprising: a touch surface; and a pressure electrode pad and a rotation electrode pad configured to remain at a constant distance from the touchscreen regardless of a depressed position and a released position of the KoD device.

[0171] Example 60: The (KoD) system of Example 59, wherein the KoD device further comprises a hub attached to the touchscreen, wherein the rotating electrode pad is configured to rotate about the hub in response to rotation of the KoD device.

[0172] Example 61: The (KoD) system of any one of Examples 59 to 60, wherein the rotating electrode pad is electrically connected to the touch surface regardless of the depressed position and the released position of the KoD device, and wherein the pressing electrode pad is electrically connected to the touch surface in response to the depressed position and electrically isolated from the touch surface in response to the released position. Concluding statement

[0173] As used in the present disclosure, the terms "module" or "component" may refer to specific hardware implementations configured to perform the actions of the module or component and / or software objects or software routines that may be stored on and / or executed by general-purpose hardware (e.g., computer-readable media, processing devices, etc.) of the computing system. In some embodiments, the various components, modules, engines, and services described in the present disclosure may be implemented as objects or processes that execute on the computing system (e.g., as separate threads).Although some of the systems and methods described in the present disclosure are generally described as being implemented in software (stored on and / or executed by general purpose hardware), specific hardware implementations or a combination of software and specific hardware implementations are also possible and are contemplated.

[0174] As used in the present disclosure, the term "combination" when referring to a plurality of elements may include a combination of all of the elements or any of various different subcombinations of some of the elements. For example, the phrase "A, B, C, D, or combinations thereof" may refer to any one of A, B, C, or D; the combination of any of A, B, C, and D; and any subcombination of A, B, C, or D, such as A, B, and C; A, B, and D; A, C, and D; B, C, and D; A and B; A and C; A and D; B and C; B and D; or C and D.

[0175] Terms used in the present disclosure, and in particular in the appended claims (e.g., contents of the appended claims), are generally intended to be "open" terms (e.g., the term "including" should be interpreted as "including, but not limited to," the term "comprising" should be interpreted as "at least comprising," the term "includes" should be interpreted as "includes, but is not limited to," etc.).

[0176] Furthermore, where a specific number of introduced claim statements are intended, such an intention will be expressly stated in the claim, and in the absence of such a list, no such intention exists. As an aid to understanding, for example, the following appended claims may include the use of the introductory phrases “at least one” and “one or more” to introduce claim lists. However, the use of such phrases should not be construed to imply that the introduction of a claim statement by the indefinite articles “a” or “an” limits a particular claim containing such introduced claim statement to embodiments containing only one such statement, even if the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” and / or “an” (e.g.,"a" and / or "an" shall be interpreted to mean "at least one" or "one or more"; the same applies to the use of certain articles used to introduce claim particulars.

[0177] Even if a particular number of an introduced claim list is explicitly stated, one skilled in the art will recognize that such a list should be interpreted to mean at least the stated number (e.g., the mere listing of "two lists" without other modifiers means at least two lists or two or more lists). Furthermore, where a convention analogous to "at least one of A, B, and C, etc." or "one or more of A, B, and C, etc." is used, such a construction is generally intended to mean A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B, and C together, etc.

[0178] Furthermore, any disjoint word or phrase representing two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibility of including either of the terms, one or the other, or both. For example, the phrase "A or B" should be understood to include the possibilities "A" or "B" or "A and B."

[0179] While the present disclosure has been described herein with reference to certain illustrated embodiments, those skilled in the art will recognize and appreciate that the present invention is not limited thereto. Rather, many additions, deletions, and modifications may be made to the illustrated and described embodiments without departing from the scope of the invention as claimed below, along with its legal equivalents. In addition, features from one embodiment may be combined with features of another embodiment while still being included within the scope of the invention as contemplated by the inventor.

Claims

[1] Control knob on a display (KoD) device, comprising: a conductive cap (2606) on a top surface of the KoD device, the conductive cap (2606) having a touch surface (2502) at least in a center of the conductive cap (2606); a snap-disk switch (2608) under the conductive cap (2606), the snap-disk switch (2608) being electrically connected to the touch surface (2502) of the conductive cap (2606); a circuit board (2610), the circuit board (2610) including conductive pads, and the conductive pads including one or more snap-disk switch pads (1222) for mounting the snap-disk switch (2608) thereon; a base assembly (2504) on a bottom side of the KoD device; an inner housing (2626) between the conductive cap (2606) and the base assembly (2504), the inner housing (2626) being capable of rotating about a post (2630) extending from the base assembly (2504); at least one electrode comprising an electrically conductive material, the at least one electrode including a first electrode electrically connected to the touch surface (2502) of the conductive cap (2606) via the snap-disk switch (2608) and the one or more snap-disk switch pads (1222), the at least one electrode being mechanically coupled to the inner housing (2626) for rotation with the inner housing (2626); and wherein a bottom side of the base assembly (2504) is to be mounted to a touchscreen (3010) of a touchscreen device (3008) such that the at least one electrode is positioned in engagement proximity to the touchscreen (3010) of the touchscreen device (3008) by the base assembly (2504). [2] The KoD device of claim 1, further comprising an adhesive (2624) applied to the underside of the base assembly (2504) opposite the at least one electrode to attach the KoD device to the touch screen (3010) of the touch screen device (3008). [3] The KoD device of claim 1, wherein the circuit board (2610) containing the conductive pads comprises a folded flexible circuit board containing the at least one electrode. [4] KoD device according to claim 1, wherein the conductive pads contain a pressure contact (1920) under the snap-disk switch (2608), the one or more electrodes contain a second electrode, the second electrode is electrically connected to the pressure contact (1920), the second electrode is mechanically coupled to the inner housing (2626) to rotate with the inner housing (2626), the snap-disk switch (2608), in response to a depressed position of the touch surface (2502), is electrically connected to the pressure contact (1920) such that the touch surface (2502) is electrically connected to the second electrode, and the touch surface (2502) is electrically isolated from the second electrode in response to a released position of the touch surface (2502). [5] The KoD device of claim 1, wherein the base assembly (2504) has a thickness of 0.5 millimeters or less. [6] The KoD device of claim 1, wherein the base assembly (2504) includes one or more side walls extending toward the conductive cap (2606). [7] The KoD device according to claim 1, wherein the circuit board (2610) containing the conductive pads comprises a printed circuit board (2610), PCB, or a flexible circuit board. [8] The KoD device of claim 1, wherein the conductive cap (2606), the snap-on switch (2608), and the circuit board (2610) containing the conductive pads are configured to rotate in response to rotation of the conductive cap (2606). [9] The KoD device of claim 1, further comprising: a bearing (2614) coupled to the inner housing (2504); wherein the post (2630) is coupled to the bearing (2614) to allow the inner housing (2504) and the at least one electrode to rotate about the post (2630). [10] The KoD device of claim 9, wherein the base assembly comprises detents and the inner housing (2626) includes one or more detent actuators to provide mechanical resistance to rotation of the inner housing (2626) about the post (2630). [11] A control button system on a display (KoD system), comprising: a touchscreen device (3008) comprising a touch sensor and a touchscreen (3010); and a KoD device, including: a conductive cap (2606) on a top surface of the KoD device, the conductive cap (2606) having a touch surface (2502) at least in a center of the conductive cap (2606); a snap-disk switch (2608) under the conductive cap (2606), the snap-disk switch (2608) being electrically connected to the touch surface (2502) of the conductive cap (2606); a circuit board (2610), the circuit board (2610) including conductive pads, and the conductive pads including one or more snap-disk switch pads (1222) for mounting the snap-disk switch (2608) thereon; a base assembly (2504) on a bottom side of the KoD device; an inner housing (2626) between the conductive cap (2606) and the base assembly (2504), the inner housing (2626) being capable of rotating about a post (2630) extending from the base assembly (2504); and one or more electrodes comprising an electrically conductive material, the one or more electrodes including a first electrode electrically connected to the touch surface (2502) of the conductive cap (2606) via the snap-disk switch (2608) and the one or more snap-disk switch pads (1222), the one or more electrodes being mechanically coupled to the inner housing (2626) to rotate with the inner housing (2626) a bottom surface of the base assembly (2504) attached to the touchscreen (3010) of the touchscreen device (3008); and the one or more electrodes positioned in engagement proximity to the touch sensor of the touchscreen device (3008) by the base assembly (2504). [12] The KoD system of claim 11, wherein the circuit board (2610) containing the conductive pads comprises a folded flexible circuit board containing the at least one electrode. [13] The KoD system of claim 11, wherein the base assembly (2504) is attached to the touchscreen (3010) using an adhesive (2624). [14] The KoD system of claim 11, wherein the circuit board (2610) comprising the conductive pads comprises a printed circuit board (2610), PCB, or a flexible circuit board. [15] A KoD system according to claim 11, wherein: the conductive pads contain a pressure contact (1920) under the snap-disk switch (2608), the one or more electrodes contain a second electrode, the second electrode is electrically connected to the pressure contact (1920), the second electrode is mechanically coupled to the inner housing (2626) to rotate with the inner housing (2626), the snap-disk switch (2608) is electrically connected to the pressure contact (1920) in response to a depressed position of the touch surface (2502) such that the touch surface (2502) is electrically connected to the second electrode, and wherein the touch surface (2502) is electrically isolated from the second electrode in response to a released position. [16] The KoD system of claim 15, wherein the first electrode is electrically connected to the touch surface (2502) of the conductive cap (2606) regardless of the depressed position of the touch surface (2502) and the released position of the touch surface (2502). [17] The KoD system of claim 11, wherein the conductive cap (2606), the snap-on switch (2608), and the circuit board (2610) containing the conductive pads are configured to rotate in response to rotation of the conductive cap (2606). [18] A method of assembling a control button on display (KoD) system, the method comprising: Providing a KoD device comprising a conductive cap (2606) on a top surface of the KoD device, the conductive cap (2606) having a touch surface (2502) at least in the center of the conductive cap (2606); a snap-disk switch (2608) under the conductive cap (2606), the snap-disk switch (2608) being electrically connected to the touch surface (2502) of the conductive cap (2606); a circuit board (2610), the circuit board (2610) including conductive pads, and the conductive pads including one or more snap-disk switch pads (1222) for mounting the snap-disk switch (2608) thereon; a base assembly (2504) on a bottom surface of the KoD device; an inner housing (2626) between the conductive cap (2606) and the base assembly (2504), the inner housing (2626) being capable of rotating about a post (2630) extending from the assembly;and one or more electrodes comprising an electrically conductive material, the one or more electrodes including a first electrode electrically connected to the touch surface (2502) of the conductive cap (2606) via the snap-disk switch (2608) and the one or more snap-disk switch pads (1222), the one or more electrodes being mechanically coupled to the inner housing (2626) for rotation with the inner housing (2626); ; Applying (3102) an adhesive (2624) to a bottom surface of the base assembly (2504) of the KoD device; and Attaching (3104) the KoD device to a touchscreen (3010) of a touchscreen device (3008) with the adhesive (2624) on the underside of the base assembly (2504) such that the one or more electrodes are positioned in engagement proximity to a touch sensor of the touchscreen device (3008) through the base assembly (2504). [19] The method of claim 18, wherein applying the adhesive (2624) to the underside of the base assembly (2504) comprises applying the adhesive (2624) to substantially an entire lower surface of the base assembly (2504) facing the touchscreen (3010). [20] The method of claim 18, wherein providing the KoD device comprises: Providing the circuit board (2610) containing the conductive pads as a printed circuit board (2610) (PCB) or folded flexible circuit board.

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