CIRCUIT DEVICE AND DISPLAY DEVICE

Abstract

A circuit device is provided. The circuit device comprises a flexible circuit section and an antenna section. The circuit device includes a base substrate having a uniform structure extending from a region of the antenna section to a region of the flexible circuit section; and a first conductive layer on a first side of the base substrate. The first conductive layer includes one or more coil lines in the antenna section and one or more first conductive lines in the flexible circuit section.

Description

FIELD OF TECHNOLOGY

[0001] The present invention relates to display technology, particularly to a circuit device and a display apparatus. STATE OF THE ART

[0002] A flexible display is a bendable or deformable display device with a flexible display panel. Examples of flexible displays include a flexible organic light-emitting diode (OLED) display apparatus, a flexible electrophoretic display (EPD) apparatus, and a flexible liquid crystal display (LCD) apparatus. As a new generation display device, the flexible display is thinner and lighter, has high contrast, high responsiveness, and high brightness. It also offers full color and a wide viewing angle. The flexible display has found a wide range of applications in mobile phones, personal digital assistants (PDAs), digital cameras, in-flight displays, notebook computers, wall-mounted televisions, and various military applications.A flexible display device includes a flexible array substrate. A base substrate of the flexible array substrate may be made of a flexible material such as plastic. SUMMARY

[0003] In one aspect, the present disclosure provides a circuit device comprising a flexible circuit portion and an antenna portion; the circuit device comprising: a base substrate having a unitary structure extending from a region of the antenna portion to a region of the flexible circuit portion; and a first conductive layer on a first side of the base substrate; wherein the first conductive layer comprises one or more coil lines in the antenna portion and one or more first conductive lines in the flexible circuit portion.

[0004] Optionally, the circuit device further comprises a connector configured to connect the circuit device to a motherboard of a display device; wherein the one or more coil lines in the antenna portion are directly connected to the connector.

[0005] Optionally, the circuit device further comprises a first cap layer on a side of the first conductive layer remote from the base substrate; wherein an orthographic projection of the first cap layer on the base substrate at least partially overlaps with an orthographic projection of the one or more coil lines on the base substrate, and at least partially overlaps with an orthographic projection of the one or more first conductive lines on the base substrate.

[0006] Optionally, the circuit device further comprises a magnetic field enhancement layer on the first side of the base substrate, wherein the magnetic field enhancement layer is configured to enhance a magnetic field generated by the one or more coil lines; wherein the one or more coil lines substantially enclose the magnetic field enhancement layer.

[0007] Optionally, the magnetic field enhancement layer comprises a magnetic field enhancement material; and the magnetic field enhancement material comprises a metal or an alloy.

[0008] Optionally, the circuit device further comprises a first electromagnetic interference shielding layer on a side of a first cover layer remote from the base substrate, wherein the first electromagnetic interference shielding layer is configured to shield the flexible circuit section from electromagnetic waves; wherein an orthographic projection of the first electromagnetic interference shielding layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines in the flexible circuit section on the base substrate.

[0009] Optionally, the circuit device further comprises an adhesive layer on a side of a first cover layer and a first electromagnetic interference shielding layer remote from the base substrate; wherein the adhesive layer is configured to adhere the circuit device to a display panel; and the adhesive layer has a unitary structure extending from a region of the antenna portion to a region of the flexible circuit portion.

[0010] Optionally, the circuit device further comprises a second conductive layer on a second side of the base substrate, the second side being opposite the first side; wherein the second conductive layer is configured to shield the flexible circuit portion from electromagnetic waves; and an orthographic projection of the second conductive layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines in the flexible circuit portion on the base substrate.

[0011] Optionally, the circuit device further comprises a magnetic material layer on a second side of the base substrate, the second side being opposite the first side; wherein the magnetic material layer is configured to conduct magnetic flux generated by the one or more coil lines; and an orthographic projection of the magnetic material layer on the base substrate at least partially overlaps with an orthographic projection of the one or more coil lines and / or a magnetic field enhancement layer on the base substrate.

[0012] Optionally, the magnetic material layer comprises a ferrimagnetic material.

[0013] Optionally, the circuit device further comprises a second capping layer on a side of a second conductive layer remote from the base substrate; wherein an orthographic projection of the second capping layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines on the base substrate.

[0014] Optionally, the second cover layer has a uniform structure extending from a region of the antenna portion to a region of the flexible circuit portion; and the orthographic projection of the second cover layer on the base substrate at least partially overlaps with an orthographic projection of the one or more coil lines on the base substrate.

[0015] Optionally, the circuit device further comprises a second electromagnetic interference shielding layer on a side of a second cover layer remote from the base substrate, wherein the second electromagnetic interference shielding layer is configured to shield the flexible circuit section from electromagnetic waves; wherein an orthographic projection of the second electromagnetic interference shielding layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines in the flexible circuit section on the base substrate.

[0016] Optionally, the second electromagnetic interference shielding layer has a uniform structure extending from a region of the antenna portion to a region of the flexible circuit portion; and the orthographic projection of the second electromagnetic interference shielding layer on the base substrate at least partially overlaps with an orthographic projection of the one or more coil lines in the antenna portion on the base substrate.

[0017] Optionally, the circuit device further comprises a shielding layer on a side of a second cover layer remote from the base substrate, wherein the shielding layer is configured to shield the flexible circuit section from electromagnetic waves; wherein an orthographic projection of the shielding layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines in the flexible circuit section on the base substrate; the shielding layer has a uniform structure extending from a region of the antenna section to a region of the flexible circuit section; and the orthographic projection of the shielding layer on the base substrate at least partially overlaps with an orthographic projection of the one or more coil lines in the antenna section on the base substrate.

[0018] Optionally, the circuit device further comprises a protective layer on a side of a second electromagnetic interference shielding layer or a shielding layer remote from the base substrate.

[0019] Optionally, the one or more coil lines have a first thickness that is greater than a second thickness of the one or more first conductive lines.

[0020] Optionally, the one or more coil lines have a first average line width; the one or more first conductive lines have a second average line width; the first average line width is greater than the second average line width; coil lines of the one or more coil lines are spaced apart from each other by a first average distance; first conductive lines of the one or more first conductive lines are spaced apart from each other by a second average distance; and the first average distance is greater than the second average distance.

[0021] In another aspect, the present disclosure provides a display device comprising the circuit device described herein and a display panel connected to the circuit device.

[0022] Optionally, the display device comprises a stacked structure; the stacked structure comprising: a cover; the display panel on the cover; an adhesive layer on a side of the display panel remote from the cover; a first electromagnetic interference shielding layer on a side of the adhesive layer remote from the cover; a first cap layer on a side of the first electromagnetic interference shielding layer remote from the cover; the first conductive layer on a side of the first cap layer remote from the cover; and the base substrate on a side of the first conductive layer remote from the cover. SHORT DESCRIPTION OF THE CHARACTERS

[0023] The following drawings are merely examples for illustration according to various disclosed embodiments and are not intended to limit the scope of the present invention. Fig. 1 is a schematic diagram showing the structure of a circuit device in some embodiments according to the present disclosure. Fig. 2A is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. 2B is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. 2C shows the layout of one or more coil lines and one or more first conductive lines in some embodiments according to the present disclosure. Fig. 3 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. 4 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. 5 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. 6 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. 7 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. 8 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. 9 is a schematic diagram showing the structure of a display device in some embodiments according to the present disclosure. Fig. 10 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 11 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 12 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 13 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 14 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 15 is a cross-sectional view of a display device in some embodiments according to the present disclosure. DETAILED DESCRIPTION OF REVELATION

[0024] The disclosure will now be described in more detail with reference to the following embodiments. It should be noted that the following descriptions of some embodiments are presented herein for purposes of illustration and description only. They are not intended to be exhaustive or limited to the precise form disclosed.

[0025] In the manufacturing of associated display devices (e.g., a smartwatch), a flexible circuit board and an antenna (e.g., a near-field communication chip) are mounted on a display panel (e.g., a flexible display panel). Typically, in associated display devices, the antenna is first soldered to the flexible circuit board, and the welded combination is then mounted on the display panel, forming the display device. The inventors of the present disclosure have discovered that there are several problems associated with the corresponding manufacturing process. The solder joint is prone to breakage and failure, leading to connection defects. The soldering process generates dust and impurities, so it cannot be performed in a display panel manufacturing facility, which has strict requirements for a dust-free environment. Commercially available antennas generally have a larger area.When soldering the antenna to the flexible circuit board, the antenna typically overlaps a portion of the flexible circuit board. The magnetic field generated by the antenna adversely affects the flexible circuit board. To prevent the display panel from flickering when wirelessly charging, a metal foil is typically applied to the antenna and the flexible circuit board. Commercially available antennas and flexible circuit boards typically have different thicknesses, making it difficult to apply the metal foil to the soldered unit. The metal foil often peels off during application, and the metal foil is prone to wrinkle defects.

[0026] Accordingly, the present disclosure provides, among other things, a circuit device and a display device that substantially eliminate one or more of the problems due to limitations and disadvantages of the related art. In one aspect, the present disclosure provides a circuit device. In some embodiments, the circuit device comprises a flexible circuit portion and an antenna portion. Optionally, the circuit device comprises a base substrate having a unitary structure extending from a region of the antenna portion to a region of the flexible circuit portion, and a first conductive layer on a first side of the base substrate. Optionally, the first conductive layer comprises one or more coil lines in the antenna portion and one or more first conductive lines in the flexible circuit portion.

[0027] Fig. 1 is a schematic diagram showing the structure of a circuit device in some embodiments according to the present disclosure. Referring to Fig. 1, in some embodiments, the circuit device comprises a flexible circuit section FPCP and an antenna section ATP, which are, for example, integrated with each other. As used herein, the term “integrated” refers to at least one layer in the flexible circuit section FPCP and at least one layer in the antenna section ATP being formed in the same process and using the same material. In one example, the flexible circuit FPCP comprises multiple layers, and the antenna section ATP comprises multiple layers. A respective layer of the multiple layers in the flexible circuit section FPCP and a respective layer of the multiple layers in the antenna section ATP are formed in the same process and using the same material. The antenna section ATP comprises an antenna, for example, a near-field communication circuit.Optionally, the antenna section ATP comprises one or more coil lines COL. The flexible printed circuit section FPCP comprises a plurality of circuit pins CPIN for connecting to one or more integrated circuits of the display panel. Optionally, the flexible printed circuit section FPCP comprises one or more electromagnetic interference shielding layers (e.g., a second electromagnetic interference shielding layer EMI2, which is described in . Fig. 1) configured to shield the circuit device from electromagnetic waves. For example, the one or more electromagnetic interference shielding layers may be configured to shield the circuit device from electromagnetic waves generated during wireless charging of the display panel.

[0028] In some embodiments, the circuit device further comprises a connector CN configured to connect the circuit device to a mainboard of a display device. The mainboard includes various components, including a processor, a microcontroller unit, or an integrated circuit. The connector CN is integrated with the antenna portion ATP and the flexible printed circuit portion FPCP. As shown in Fig. As shown in Figure 1, the one or more coil lines COL in the antenna section ATP are directly connected to the connector CN. For example, the one or more coil lines COL in the antenna section ATP are manufactured using the same process and material as one or more signal lines in the connector CN. Soldering of the antenna section is not required, thus avoiding connection defects due to solder joint breakage or failure.

[0029] In some embodiments, the circuit device further comprises a sensor SE integrated into the flexible printed circuit board portion FPCP. In one example, the sensor SE is a photosensor.

[0030] Fig. 2A is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. For example, Fig. 2A a cross-sectional view along an A-A' line in Fig. 1. With reference to Fig. 1 and Fig. 2A, in some embodiments, the circuit device comprises a base substrate BS, a first conductive layer CDL1 on a first side S1 of the base substrate BS, and a first cap layer CVL1 on a side of the first conductive layer CDL1 remote from the base substrate BS. The base substrate BS is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible printed circuit portion FPCP. Optionally, the first cap layer CVL1 is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible printed circuit portion FPCP.

[0031] In some embodiments, the first conductive layer CDL1 comprises one or more coil lines COL in the antenna section ATP and one or more first conductive lines CL1 in the flexible circuit section FPCP. The one or more coil lines COL in the antenna section ATP and the one or more first conductive lines CL1 in the flexible circuit section FPCP are in the same layer. As used herein, the term "same layer" refers to the relationship between the layers that are formed simultaneously in the same step. In one example, the one or more coil lines COL and the one or more first conductive lines CL1 are in the same layer if they are formed as a result of one or more steps of the same patterning process in a material deposited in a same deposition process.In another example, the one or more coil lines COL and the one or more first conductive lines CL1 may be formed in the same layer by simultaneously performing the step of forming the one or more coil lines COL and the step of forming the one or more first conductive lines CL. The term "same layer" does not always mean that the thickness of the layer or the height of the layer is the same in a cross-sectional view.

[0032] The inventors of the present disclosure have discovered that by having the one or more coil lines COL in the antenna section ATP and the one or more first conductive lines CL1 in the flexible circuit section FPCP in the same layer, the effect of the magnetic field generated by the one or more coil lines COL in the antenna section ATP on the flexible circuit section FPCP can be reduced or minimized.

[0033] Various suitable conductive materials and various suitable manufacturing methods can be used to form the first conductive layer CDL1. For example, a conductive metal material can be deposited on the substrate by magnetron sputtering, vapor deposition (e.g., plasma-enhanced chemical vapor deposition), or vacuum deposition. Examples of suitable conductive metal materials for forming the first conductive layer CDL1 include, but are not limited to, copper, titanium, tantalum, aluminum, molybdenum, chromium, and various alloys or laminates thereof.

[0034] Fig. 2B is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Referring to Fig. 1, Fig. 2A and Fig. 2B, the one or more coil lines COL in the antenna section ATP have a plurality of turns to generate inductance.

[0035] In Fig. 2B, the one or more coil lines COL in the antenna section ATP are equidistant. For example, the one or more coil lines COL have a plurality of turns surrounding a center. On the same side relative to the center, the distances between adjacent coil lines of the one or more coil lines COL are substantially equal.

[0036] In Fig. 2A, the one or more coil lines COL have a plurality of turns surrounding a center. On a same side relative to the center, at least two distances between the coil lines between at least two pairs of adjacent coil lines of the one or more coil lines COL are different from each other.

[0037] Various suitable materials can be used to fabricate the base substrate. Examples of materials suitable for fabricating the base substrate include, but are not limited to, polyimide, polyester, glass, quartz, silicon oxide (SiOy), silicon nitride (SiNy, e.g., Si3N4), and silicon oxynitride (SiOxNy).

[0038] Various suitable insulating materials and various suitable manufacturing methods can be used to form the first cover layer CVL1. In some embodiments, the first cover layer CVL1 comprises a plurality of sublayers. Optionally, the plurality of sublayers comprise an insulating material sublayer and an adhesive sublayer. The adhesive sublayer adheres the insulating material sublayer to an adjacent layer (e.g., the first conductive layer CDL1).

[0039] In some embodiments, an orthographic projection of the first capping layer CVL1 on the base substrate BS at least partially overlaps with an orthographic projection of the first conductive layer CDL1 on the base substrate BS. Optionally, the orthographic projection of the first capping layer CVL1 on the base substrate BS overlaps the orthographic projection of the first conductive layer CDL1 on the base substrate BS.

[0040] In some embodiments, the circuit device further comprises a first electromagnetic interference shielding layer EMI1 on a side of the first cap layer CVL1 remote from the base substrate BS. The first electromagnetic interference shielding layer EMI1 is configured to shield the circuit device (e.g., the flexible printed circuit board portion FPCP) from electromagnetic waves. For example, the first electromagnetic interference shielding layer EMI1 may be configured to shield the flexible printed circuit board portion FPCP from electromagnetic waves generated during wireless charging of the display panel.

[0041] Optionally, the first electromagnetic interference shielding layer EMI1 is located at least partially in the flexible printed circuit board section FPCP. Optionally, the first electromagnetic interference shielding layer EMI1 is at least partially absent in the antenna section ATP. Optionally, the first electromagnetic interference shielding layer EMI1 is completely absent in the antenna section ATP.

[0042] In some embodiments, an orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS. Optionally, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS overlaps the orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS.

[0043] In some embodiments, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS is at least partially non-overlapping with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS is completely non-overlapping with the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0044] In alternative embodiments, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS overlaps the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0045] Various suitable electromagnetic interference shielding materials and various suitable manufacturing methods can be used to form the first electromagnetic interference shielding layer EMI1. For example, an electromagnetic interference shielding material can be deposited on the substrate by magnetron sputtering, vapor deposition (e.g., plasma-enhanced chemical vapor deposition), or vacuum deposition. Examples of suitable electromagnetic interference shielding materials for forming the first electromagnetic interference shielding layer EMI1 include, but are not limited to, metals, alloys, carbons, ceramics, conductive polymers, and composites thereof.

[0046] In some embodiments, the circuit device further comprises an adhesive layer AHL on a side of the first cover layer CVL1 remote from the base substrate BS. Optionally, the adhesive layer AHL is located on a side of the first cover layer CVL1 and the first electromagnetic interference shielding layer EMI1 remote from the base substrate BS. The adhesive layer AHL is configured to adhere the circuit device to the display panel, e.g., to a backside of the display panel. Optionally, the adhesive layer AHL is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible printed circuit portion FPCP.

[0047] Various suitable materials and various suitable manufacturing processes can be used to prepare the AHL adhesive layer. Examples of suitable pressure-sensitive adhesive materials include, but are not limited to, an acrylate-based adhesive material (e.g., homopolymers and copolymers of acrylic acid, methacrylic acid, isooctyl acrylate, acrylamide, methacrylamide, acrylonitrile, methacrylonitrile, methyl isoamyl acrylate, 2-ethylhexyl acrylate, and butyl acrylate), a polyacrylic-based adhesive material (e.g., polymethyl methacrylate (PMMA)), a cyclic olefin copolymer, a polycarbonate, epoxies, silicone-based adhesive materials, or a combination thereof.

[0048] In some embodiments, the first conductive layer CDL1, the first cap layer CVL1, the first electromagnetic interference shielding layer EMI1 and the adhesive layer AHL are located on the first side S1 of the base substrate BS.

[0049] In some embodiments, the circuit device further comprises a second conductive layer CDL2 on a second side S2 of the base substrate BS. Optionally, the second conductive layer CDL2 comprises one or more second conductive lines CL2.

[0050] Optionally, the second conductive layer CDL2 is located at least partially in the flexible printed circuit board section FPCP. Optionally, the second conductive layer CDL2 is at least partially absent in the antenna section ATP. Optionally, the second conductive layer CDL2 is completely absent in the antenna section ATP.

[0051] In some embodiments, an orthographic projection of the second conductive layer CDL2 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more first conductive lines CL1 in the flexible circuit section FPCP on the base substrate BS.

[0052] In some embodiments, the orthographic projection of the second conductive layer CDL2 on the base substrate BS is at least partially non-overlapping with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the second conductive layer CDL2 on the base substrate BS is completely non-overlapping with the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0053] Various suitable conductive materials and various suitable manufacturing methods can be used to form the second conductive layer CDL2. For example, a conductive metal material can be deposited on the substrate by magnetron sputtering, vapor deposition (e.g., plasma-enhanced chemical vapor deposition), or vacuum deposition. Examples of suitable conductive metal materials for forming the second conductive layer CDL2 include, but are not limited to, copper, titanium, tantalum, aluminum, molybdenum, chromium, and various alloys or laminates thereof.

[0054] In some embodiments, the circuit device further comprises a magnetic material layer MML on a second side S2 of the base substrate BS. Optionally, the magnetic material layer MML is configured to conduct the magnetic flux generated by the one or more coil lines COL. By converging the magnetic flux generated by the one or more coil lines COL, the read / write capability of the antenna section ATP can be significantly improved.

[0055] In some embodiments, an orthographic projection of the magnetic material layer MML on the base substrate BS at least partially overlaps with an orthographic projection of the one or more coil lines COL on the base substrate BS. Optionally, the orthographic projection of the magnetic material layer MML on the base substrate BS overlaps the orthographic projection of the one or more coil lines COL on the base substrate BS.

[0056] Various suitable magnetic materials can be used to fabricate the MML magnetic material layer. Examples of magnetic materials for fabricating the MML magnetic material layer include ferrimagnetic materials. Examples of ferrimagnetic materials include ferrite. Examples of ferrites include AO B2O3, where A and B are two metal elements. Optionally, A and B are selected from a group consisting of Fe, Mn, Zn, Ni, Mg, Co, Cu, Ba, Sr, and so on. In one example, A and B are different from each other. In another example, A and B represent the same metal element. Optionally, A is a mixture of two different metal elements, such as Ni and Zn, or Mn and Zn. Other examples of ferrites include Mn-Zn ferrite (Mn a Zn (1-a) BO4, B is optionally the element iron) and Ni-Zn-ferrite (Ni a Zn (1-a) BO4, B is optionally the element iron).

[0057] In some embodiments, the circuit device further comprises a second cap layer CVL2 on a side of the second conductive layer CDL2 remote from the base substrate BS. Various suitable insulating materials and various suitable manufacturing methods can be used to form the second cap layer CVL2. In some embodiments, the second cap layer CVL2 comprises a plurality of sublayers. Optionally, the plurality of sublayers comprises an insulating material sublayer and an adhesive sublayer. The adhesive sublayer adheres the insulating material sublayer to an adjacent layer (e.g., the second conductive layer CDL2).

[0058] In some embodiments, an orthographic projection of the second capping layer CVL2 on the base substrate BS at least partially overlaps with an orthographic projection of the first conductive layer CDL1 on the base substrate BS. Optionally, the orthographic projection of the second capping layer CVL2 on the base substrate BS overlaps the orthographic projection of the first conductive layer CDL1 on the base substrate BS.

[0059] In some embodiments, the circuit device further comprises a second electromagnetic interference shielding layer EMI2 on a side of the second cover layer CVL2 remote from the base substrate BS. The second electromagnetic interference shielding layer EMI2 is configured to shield the circuit device (e.g., the flexible printed circuit board portion FPCP) from electromagnetic waves. For example, the second electromagnetic interference shielding layer EMI2 may be configured to shield the flexible printed circuit board portion FPCP from electromagnetic waves generated during wireless charging of the display panel.

[0060] Optionally, the second electromagnetic interference shielding layer EMI2 is located at least partially in the flexible printed circuit board section FPCP. Optionally, the second electromagnetic interference shielding layer EMI2 is at least partially absent in the antenna section ATP. Optionally, the second electromagnetic interference shielding layer EMI2 is completely absent in the antenna section ATP.

[0061] In some embodiments, an orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS. Optionally, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS overlaps the orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS.

[0062] In some embodiments, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS is at least partially non-overlapping with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS is completely non-overlapping with the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0063] In alternative embodiments, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS overlaps the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0064] Various suitable electromagnetic interference shielding materials and various suitable manufacturing methods can be used to form the second electromagnetic interference shielding layer EMI2. For example, an electromagnetic interference shielding material can be deposited on the substrate by magnetron sputtering, vapor deposition (e.g., plasma-enhanced chemical vapor deposition), or vacuum deposition. Examples of suitable electromagnetic interference shielding materials for forming the second electromagnetic interference shielding layer EMI2 include, but are not limited to, metals, alloys, carbons, ceramics, electrically conductive polymers, and composites thereof.

[0065] In some embodiments, the magnetic material layer MML, the second conductive layer CDL2, the second cap layer CVL2 and the second electromagnetic interference shielding layer EMI2 are located on the second side S2 of the base substrate BS.

[0066] Fig. 2C shows the layout of one or more coil lines and one or more first conductive lines in some embodiments according to the present disclosure. In some embodiments, the one or more coil lines COL have a first average line width w1 in a range of 0.08 mm to 1.20 mm, e.g., 0.08 mm to 0.40 mm, 0.40 mm to 0.80 mm, and 0.80 mm to 1.20 mm. Optionally, coil lines of the one or more coil lines COL are spaced apart from each other by a first average distance d1 in a range of 0.10 mm to 0.30 mm, e.g., 0.10 mm to 0.15 mm, 0.15 mm to 0.20 mm, 0.20 mm to 0.25 mm, or 0.25 mm to 0.30 mm.

[0067] In some embodiments, the one or more first conductive lines CL1 have a second average line width w2 in a range of 0.05 mm to 0.20 mm, e.g., 0.05 mm to 0.10 mm, 0.10 mm to 0.15 mm, and 0.15 mm to 0.20 mm. Optionally, the first conductive lines of the one or more first conductive lines CL1 are spaced apart from each other by a second average distance d2 in a range of 0.05 mm to 0.08 mm, e.g., 0.05 mm to 0.06 mm, 0.06 mm to 0.07 mm, or 0.07 mm to 0.08 mm.

[0068] In some embodiments, the first average line width w1 is greater than the second average line width w2. In some embodiments, the first average pitch d1 is greater than the second average pitch d2.

[0069] In some embodiments, the one or more coil lines COL are spaced from the nearest edge of the base substrate BS by an average distance ranging from 0.10 mm to 0.20 mm, e.g., 0.10 mm to 0.15 mm or 0.15 mm to 0.20 mm.

[0070] In some embodiments, the base substrate BS has an average thickness of 15 µm to 30 µm, e.g., 15 µm to 20 µm, 20 µm to 25 µm, or 25 µm to 30 µm. In some embodiments, the first cap layer CVL1 or the second cap layer CVL2 has an average thickness of 10 µm to 20 µm, e.g., 10 µm to 15 µm or 15 µm to 20 µm. In some embodiments, the first electromagnetic interference shielding layer or the second electromagnetic interference shielding layer has an average thickness of 5 µm to 15 µm, e.g., 5 µm to 10 µm or 10 µm to 15 µm. In some embodiments, the adhesive layer AHL has an average thickness of 40 µm to 60 µm, e.g., 40 µm to 50 µm or 50 µm to 60 µm. In some embodiments, the magnetic material layer MML has an average thickness of 50 µm to 70 µm, e.g., 50 µm to 60 µm or 60 µm to 70 µm.

[0071] Fig. 3 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. For example, Fig. 3 a cross-sectional view along an A-A' line in Fig. 1. With reference to Fig. 1 and Fig. 3, in some embodiments, the circuit device comprises a base substrate BS, a first conductive layer CDL1 on a first side S1 of the base substrate BS, and a first cap layer CVL1 on a side of the first conductive layer CDL1 remote from the base substrate BS. The base substrate BS is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible printed circuit portion FPCP. Optionally, the first cap layer CVL1 is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible printed circuit portion FPCP.

[0072] In some embodiments, the first conductive layer CDL1 comprises one or more coil lines COL in the antenna section ATP and one or more first conductive lines CL1 in the flexible circuit section FPCP. The one or more coil lines COL in the antenna section ATP and the one or more first conductive lines CL1 in the flexible circuit section FPCP are located in the same layer. The inventors of the present disclosure have discovered that by having the one or more coil lines COL in the antenna section ATP and the one or more first conductive lines CL1 in the flexible circuit section FPCP in the same layer, the effect of the magnetic field generated by the one or more coil lines COL in the antenna section ATP on the flexible circuit section FPCP can be reduced or minimized.

[0073] With reference to Fig. 1 and Fig. 3, in some embodiments, the circuit device further comprises a magnetic field enhancement layer MEL on the first side S1 of the base substrate BS. The magnetic field enhancement layer MEL is configured to enhance a magnetic field generated by the one or more coil lines COL of the antenna section ATP. In some embodiments, the one or more coil lines COL substantially surround the magnetic field enhancement layer MEL. The one or more coil lines COL in the antenna section ATP have a plurality of turns for generating inductance. The plurality of turns substantially surround the magnetic field enhancement layer MEL.

[0074] In some embodiments, an orthographic projection of the first capping layer CVL1 on the base substrate BS at least partially overlaps with an orthographic projection of the first conductive layer CDL1 on the base substrate BS. Optionally, the orthographic projection of the first capping layer CVL1 on the base substrate BS overlaps the orthographic projection of the first conductive layer CDL1 on the base substrate BS.

[0075] In some embodiments, the circuit device further comprises a first electromagnetic interference shielding layer EMI1 on a side of the first cap layer CVL1 remote from the base substrate BS. The first electromagnetic interference shielding layer EMI1 is configured to shield the circuit device (e.g., the flexible printed circuit board portion FPCP) from electromagnetic waves. For example, the first electromagnetic interference shielding layer EMI1 may be configured to shield the flexible printed circuit board portion FPCP from electromagnetic waves generated during wireless charging of the display panel.

[0076] Optionally, the first electromagnetic interference shielding layer EMI1 is located at least partially in the flexible printed circuit board section FPCP. Optionally, the first electromagnetic interference shielding layer EMI1 is at least partially absent in the antenna section ATP. Optionally, the first electromagnetic interference shielding layer EMI1 is completely absent in the antenna section ATP.

[0077] In some embodiments, an orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS. Optionally, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS overlaps the orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS.

[0078] In some embodiments, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS is at least partially non-overlapping with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS is completely non-overlapping with the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0079] In alternative embodiments, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS overlaps the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0080] In some embodiments, the circuit device further comprises an adhesive layer AHL on a side of the first cover layer CVL1 remote from the base substrate BS. Optionally, the adhesive layer AHL is located on a side of the first cover layer CVL1 and the first electromagnetic interference shielding layer EMI1 remote from the base substrate BS. The adhesive layer AHL is configured to adhere the circuit device to the display panel, e.g., to a backside of the display panel. Optionally, the adhesive layer AHL is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible printed circuit portion FPCP.

[0081] In some embodiments, the first conductive layer CDL1, the first cap layer CVL1, the first electromagnetic interference shielding layer EMI1 and the adhesive layer AHL are located on the first side S1 of the base substrate BS.

[0082] In some embodiments, the magnetic field enhancement layer MEL is in direct contact with the base substrate BS on one side and in direct contact with the adhesive layer AHL on the other side.

[0083] In some embodiments, the circuit device further comprises a second conductive layer CDL2 on a second side S2 of the base substrate BS. Optionally, the second conductive layer CDL2 comprises one or more second conductive lines CL2.

[0084] Optionally, the second conductive layer CDL2 is located at least partially in the flexible printed circuit board section FPCP. Optionally, the second conductive layer CDL2 is at least partially absent in the antenna section ATP. Optionally, the second conductive layer CDL2 is completely absent in the antenna section ATP.

[0085] In some embodiments, an orthographic projection of the second conductive layer CDL2 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more first conductive lines CL1 in the flexible circuit section FPCP on the base substrate BS.

[0086] In some embodiments, the orthographic projection of the second conductive layer CDL2 on the base substrate BS is at least partially non-overlapping with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the second conductive layer CDL2 on the base substrate BS is completely non-overlapping with the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0087] In some embodiments, the circuit device further comprises a magnetic material layer MML on a second side S2 of the base substrate BS. Optionally, the magnetic material layer MML is configured to conduct the magnetic flux generated by the one or more coil lines COL. By converging the magnetic flux generated by the one or more coil lines COL, the read / write capability of the antenna section ATP can be significantly improved.

[0088] In some embodiments, an orthographic projection of the magnetic material layer MML on the base substrate BS at least partially overlaps with an orthographic projection of the one or more coil lines COL on the base substrate BS. Optionally, the orthographic projection of the magnetic material layer MML on the base substrate BS overlaps the orthographic projection of the one or more coil lines COL on the base substrate BS.

[0089] In some embodiments, an orthographic projection of the magnetic material layer MML on the base substrate BS at least partially overlaps with an orthographic projection of the magnetic field enhancement layer MEL on the base substrate BS. Optionally, the orthographic projection of the magnetic material layer MML on the base substrate BS overlaps the orthographic projection of the magnetic field enhancement layer MEL on the base substrate BS.

[0090] In some embodiments, the circuit device further comprises a second cap layer CVL2 on a side of the second conductive layer CDL2 remote from the base substrate BS. Various suitable insulating materials and various suitable manufacturing methods can be used to form the second cap layer CVL2. In some embodiments, the second cap layer CVL2 comprises a plurality of sublayers. Optionally, the plurality of sublayers comprises an insulating material sublayer and an adhesive sublayer. The adhesive sublayer adheres the insulating material sublayer to an adjacent layer (e.g., the second conductive layer CDL2).

[0091] In some embodiments, an orthographic projection of the second capping layer CVL2 on the base substrate BS at least partially overlaps with an orthographic projection of the first conductive layer CDL1 on the base substrate BS. Optionally, the orthographic projection of the second capping layer CVL2 on the base substrate BS overlaps the orthographic projection of the first conductive layer CDL1 on the base substrate BS.

[0092] In some embodiments, the circuit device further comprises a second electromagnetic interference shielding layer EMI2 on a side of the second cover layer CVL2 remote from the base substrate BS. The second electromagnetic interference shielding layer EMI2 is configured to shield the circuit device (e.g., the flexible printed circuit board portion FPCP) from electromagnetic waves. For example, the second electromagnetic interference shielding layer EMI2 may be configured to shield the flexible printed circuit board portion FPCP from electromagnetic waves generated during wireless charging of the display panel.

[0093] Optionally, the second electromagnetic interference shielding layer EMI2 is located at least partially in the flexible printed circuit board section FPCP. Optionally, the second electromagnetic interference shielding layer EMI2 is at least partially absent in the antenna section ATP. Optionally, the second electromagnetic interference shielding layer EMI2 is completely absent in the antenna section ATP.

[0094] In some embodiments, an orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS. Optionally, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS overlaps the orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS.

[0095] In some embodiments, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS is at least partially non-overlapping with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS is completely non-overlapping with the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0096] In alternative embodiments, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the second electromagnetic interference shielding layer EMI2 on the base substrate BS overlaps the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0097] In some embodiments, the magnetic material layer MML, the second conductive layer CDL2, the second cap layer CVL2 and the second electromagnetic interference shielding layer EMI2 are located on the second side S2 of the base substrate BS.

[0098] In some embodiments, the one or more coil lines COL have a first average line width in a range of 0.08 mm to 1.20 mm, e.g., 0.08 mm to 0.40 mm, 0.40 mm to 0.80 mm, and 0.80 mm to 1.20 mm. Optionally, the coil lines of the one or more coil lines COL are spaced apart from each other by a first average distance in a range of 0.10 mm to 0.30 mm, e.g., 0.10 mm to 0.15 mm, 0.15 mm to 0.20 mm, 0.20 mm to 0.25 mm, or 0.25 mm to 0.30 mm.

[0099] In some embodiments, the one or more first conductive lines CL1 have a second average line width in a range of 0.05 mm to 0.20 mm, e.g., 0.05 mm to 0.10 mm, 0.10 mm to 0.15 mm, and 0.15 mm to 0.20 mm. Optionally, the first conductive lines of the one or more first conductive lines CL1 are spaced apart from each other by a second average distance in a range of 0.05 mm to 0.08 mm, e.g., 0.05 mm to 0.06 mm, 0.06 mm to 0.07 mm, or 0.07 mm to 0.08 mm.

[0100] In some embodiments, the first average line width is greater than the second average line width. In some embodiments, the first average pitch is greater than the second average pitch.

[0101] In some embodiments, the one or more coil lines COL are spaced from the nearest edge of the base substrate BS by an average distance ranging from 0.10 mm to 0.20 mm, e.g., 0.10 mm to 0.15 mm or 0.15 mm to 0.20 mm.

[0102] In some embodiments, the base substrate BS has an average thickness of 15 µm to 30 µm, e.g., 15 µm to 20 µm, 20 µm to 25 µm, or 25 µm to 30 µm. In some embodiments, the first cover layer CVL1 or the second cover layer CVL2 has an average thickness of 10 µm to 20 µm, e.g., 10 µm to 15 µm or 15 µm to 20 µm. In some embodiments, the first electromagnetic interference shielding layer EMI1 or the second electromagnetic interference shielding layer EMI2 has an average thickness of 5 µm to 15 µm, e.g., 5 µm to 10 µm or 10 µm to 15 µm. In some embodiments, the adhesive layer AHL has an average thickness of 40 µm to 60 µm, e.g., 40 µm to 50 µm or 50 µm to 60 µm. In some embodiments, the magnetic field enhancement layer MEL has an average thickness of 20 µm to 45 µm, e.g., 20 µm to 25 µm, 25 µm to 30 µm, 30 µm to 35 µm, 35 µm to 40 µm, or 40 µm to 45 µm.In some embodiments, the magnetic material layer MML has an average thickness of 50 µm to 70 µm, e.g., 50 µm to 60 µm or 60 µm to 70 µm.

[0103] Various suitable magnetic field enhancement materials can be used to fabricate the magnetic field enhancement layer (MEL). Examples of suitable magnetic field enhancement materials include various magnetically permeable materials such as various metals and various alloys. Specific examples of magnetic field enhancement materials include stainless steel, iron, silicon steel, various ferrite materials, and various permalloys such as iron-aluminum alloys, iron-nickel alloys, iron-cobalt alloys, and neodymium-iron-boron alloys.

[0104] In one example, the circuit device does not include a magnetic field enhancement layer MEL (see e.g. Fig. 2A and Fig. 2B), and the magnetic field generated by the one or more coil lines COL is 3.45 A / m. In another example, the circuit device comprises a magnetic field enhancement layer MEL (see, for example, Fig. 3), the magnetic field enhancement layer MEL comprises stainless steel, and the magnetic field generated by the one or more coil lines COL is enhanced to 8.51 A / m. In another example, the circuit device comprises a magnetic field enhancement layer MEL (see, e.g., Fig. 3), the magnetic field enhancement layer MEL comprises iron, and the magnetic field generated by the one or more coil lines COL is enhanced to 6.86 A / m. In another example, the circuit device comprises a magnetic field enhancement layer MEL (see, e.g., Fig. 3), the magnetic field enhancement layer MEL comprises an iron-aluminum alloy, and the magnetic field generated by the one or more coil lines COL is enhanced to 7.84 A / m.

[0105] Fig. 4 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. The circuit device shown in Figure 4 differs from that shown in Fig. 2A in that the one or more coil lines COL have a thickness that is different from a thickness of the one or more first conductive lines CL1. Fig. 5 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. The circuit device shown in Figure 5 differs from that shown in Fig. 3 in that the one or more coil lines COL have a thickness that differs from a thickness of the one or more first conductive lines CL1.

[0106] With reference to Fig. 4 and Fig. 5, in some embodiments, the one or more coil lines COL has a first thickness that is greater than a second thickness of the one or more first conductive lines CL, e.g., by at least 10%, by at least 20%, by at least 30%, by at least 40%, by at least 50%, by at least 60%, by at least 70%, by at least 80%, by at least 90%, by at least 100%, by at least 110%, by at least 120%, by at least 130%, by at least 140%, by at least 150%, by at least 160%, by at least 170%, by at least 180%, by at least 190%, or by at least 200%.

[0107] In alternative embodiments, the one or more first conductive lines CL1 have a second thickness that is greater than a first thickness of the one or more coil lines COL, e.g., by at least 10%, by at least 20%, by at least 30%, by at least 40%, by at least 50%, by at least 60%, by at least 70%, by at least 80%, by at least 90%, by at least 100%, by at least 110%, by at least 120%, by at least 130%, by at least 140%, by at least 150%, by at least 160%, by at least 170%, by at least 180%, by at least 190%, or by at least 200%.

[0108] Fig. 6 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. For example, Fig. 6 a cross-sectional view along an A-A' line in Fig. 1. With reference to Fig. 1 and Fig. 6, in some embodiments, the circuit device comprises a base substrate BS, a first conductive layer CDL1 on a first side S1 of the base substrate BS, and a first cap layer CVL1 on a side of the first conductive layer CDL1 remote from the base substrate BS. The base substrate BS is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible printed circuit portion FPCP. Optionally, the first cap layer CVL1 is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible printed circuit portion FPCP.

[0109] In some embodiments, the first conductive layer CDL1 comprises one or more coil lines COL in the antenna section ATP and one or more first conductive lines CL1 in the flexible circuit section FPCP. The one or more coil lines COL in the antenna section ATP and the one or more first conductive lines CL1 in the flexible circuit section FPCP are located in the same layer. The inventors of the present disclosure have discovered that by having the one or more coil lines COL in the antenna section ATP and the one or more first conductive lines CL1 in the flexible circuit section FPCP in the same layer, the effect of the magnetic field generated by the one or more coil lines COL in the antenna section ATP on the flexible circuit section FPCP can be reduced or minimized.

[0110] With reference to Fig. 1 and Fig. 6, in some embodiments, the circuit device further comprises a magnetic field enhancement layer MEL on the first side S1 of the base substrate BS. The magnetic field enhancement layer MEL is configured to enhance a magnetic field generated by the one or more coil lines COL of the antenna section ATP. In some embodiments, the one or more coil lines COL substantially surround the magnetic field enhancement layer MEL. The one or more coil lines COL in the antenna section ATP have a plurality of turns for generating inductance. The plurality of turns substantially surround the magnetic field enhancement layer MEL.

[0111] In some embodiments, an orthographic projection of the first capping layer CVL1 on the base substrate BS at least partially overlaps with an orthographic projection of the first conductive layer CDL1 on the base substrate BS. Optionally, the orthographic projection of the first capping layer CVL1 on the base substrate BS overlaps the orthographic projection of the first conductive layer CDL1 on the base substrate BS.

[0112] In some embodiments, the circuit device further comprises a first electromagnetic interference shielding layer EMI1 on a side of the first cap layer CVL1 remote from the base substrate BS. The first electromagnetic interference shielding layer EMI1 is configured to shield the circuit device (e.g., the flexible printed circuit board portion FPCP) from electromagnetic waves. For example, the first electromagnetic interference shielding layer EMI1 may be configured to shield the flexible printed circuit board portion FPCP from electromagnetic waves generated during wireless charging of the display panel.

[0113] Optionally, the first electromagnetic interference shielding layer EMI1 is located at least partially in the flexible printed circuit board section FPCP. Optionally, the first electromagnetic interference shielding layer EMI1 is at least partially absent in the antenna section ATP. Optionally, the first electromagnetic interference shielding layer EMI1 is completely absent in the antenna section ATP.

[0114] In some embodiments, an orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS. Optionally, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS overlaps the orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS.

[0115] In some embodiments, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS is at least partially non-overlapping with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS is completely non-overlapping with the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0116] In alternative embodiments, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the first electromagnetic interference shielding layer EMI1 on the base substrate BS overlaps the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0117] In some embodiments, the circuit device further comprises an adhesive layer AHL on a side of the first cover layer CVL1 remote from the base substrate BS. Optionally, the adhesive layer AHL is located on a side of the first cover layer CVL1 and the first electromagnetic interference shielding layer EMI1 remote from the base substrate BS. The adhesive layer AHL is configured to adhere the circuit device to the display panel, e.g., to a backside of the display panel. Optionally, the adhesive layer AHL is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible printed circuit portion FPCP.

[0118] In some embodiments, the first conductive layer CDL1, the first cap layer CVL1, the first electromagnetic interference shielding layer EMI1 and the adhesive layer AHL are located on the first side S1 of the base substrate BS.

[0119] In some embodiments, the magnetic field enhancement layer MEL is in direct contact with the base substrate BS on one side and in direct contact with the adhesive layer AHL on the other side.

[0120] In some embodiments, the circuit device further comprises a second conductive layer CDL2 on a second side S2 of the base substrate BS. Optionally, the second conductive layer CDL2 comprises one or more second conductive lines CL2.

[0121] Optionally, the second conductive layer CDL2 is located at least partially in the flexible printed circuit board section FPCP. Optionally, the second conductive layer CDL2 is at least partially absent in the antenna section ATP. Optionally, the second conductive layer CDL2 is completely absent in the antenna section ATP.

[0122] In some embodiments, an orthographic projection of the second conductive layer CDL2 on the base substrate BS at least partially overlaps with an orthographic projection of the one or more first conductive lines CL1 in the flexible circuit section FPCP on the base substrate BS.

[0123] In some embodiments, the orthographic projection of the second conductive layer CDL2 on the base substrate BS is at least partially non-overlapping with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the second conductive layer CDL2 on the base substrate BS is completely non-overlapping with the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0124] In some embodiments, the circuit device further comprises a magnetic material layer MML on a second side S2 of the base substrate BS. Optionally, the magnetic material layer MML is configured to conduct the magnetic flux generated by the one or more coil lines COL. By converging the magnetic flux generated by the one or more coil lines COL, the read / write capability of the antenna section ATP can be significantly improved.

[0125] In some embodiments, an orthographic projection of the magnetic material layer MML on the base substrate BS at least partially overlaps with an orthographic projection of the one or more coil lines COL on the base substrate BS. Optionally, the orthographic projection of the magnetic material layer MML on the base substrate BS overlaps the orthographic projection of the one or more coil lines COL on the base substrate BS.

[0126] In some embodiments, an orthographic projection of the magnetic material layer MML on the base substrate BS at least partially overlaps with an orthographic projection of the magnetic field enhancement layer MEL on the base substrate BS. Optionally, the orthographic projection of the magnetic material layer MML on the base substrate BS overlaps the orthographic projection of the magnetic field enhancement layer MEL on the base substrate BS.

[0127] In some embodiments, the circuit device further comprises a second cap layer CVL2 on a side of the second conductive layer CDL2 and the magnetic material layer MML remote from the base substrate BS. The second cap layer CVL2 is a unitary structure extending from a region of the antenna portion ATP to a region of the flexible circuit portion FPCP. In some embodiments, the second cap layer CVL2 comprises a plurality of sublayers. Optionally, the plurality of sublayers comprise an insulating material sublayer and an adhesive sublayer. The adhesive sublayer adheres the insulating material sublayer to an adjacent layer (e.g., the second conductive layer CDL2 or the magnetic material layer MML).

[0128] In some embodiments, an orthographic projection of the second capping layer CVL2 on the base substrate BS at least partially overlaps with an orthographic projection of the first conductive layer CDL1 on the base substrate BS. Optionally, the orthographic projection of the second capping layer CVL2 on the base substrate BS overlaps the orthographic projection of the first conductive layer CDL1 on the base substrate BS.

[0129] In some embodiments, the orthographic projection of the second capping layer CVL2 on the base substrate BS at least partially overlaps with an orthographic projection of the second conductive layer CDL2 on the base substrate BS, and at least partially overlaps with an orthographic projection of the magnetic material layer MML on the base substrate BS. Optionally, the orthographic projection of the second capping layer CVL2 on the base substrate BS overlaps the orthographic projection of the second conductive layer CDL2 on the base substrate BS and overlaps the orthographic projection of the magnetic material layer MML on the base substrate BS.

[0130] In some embodiments, the circuit device further comprises a shielding layer SDL on a side of the second cover layer CVL2 remote from the base substrate BS. The shielding layer SDL is configured to shield the circuit device (e.g., the flexible printed circuit section FPCP) from electromagnetic waves. For example, the shielding layer SDL may be configured to shield the flexible printed circuit section FPCP from electromagnetic waves generated during wireless charging of the display panel.

[0131] Optionally, the shielding layer SDL is located at least partially in the flexible printed circuit board section FPCP and at least partially in the antenna section ATP.

[0132] In some embodiments, an orthographic projection of the shielding layer SDL on the base substrate BS at least partially overlaps with an orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS. Optionally, the orthographic projection of the shielding layer SDL on the base substrate BS overlaps the orthographic projection of the one or more first conductive lines CL1 in the flexible printed circuit section FPCP on the base substrate BS.

[0133] In some embodiments, the orthographic projection of the shielding layer SDL on the base substrate BS at least partially overlaps with an orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS. Optionally, the orthographic projection of the shielding layer SDL on the base substrate BS overlaps the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0134] In some embodiments, the orthographic projection of the shielding layer SDL on the base substrate BS overlaps the orthographic projection of the one or more first conductive lines CL1 in the flexible circuit section FPCP on the base substrate BS and overlaps the orthographic projection of the one or more coil lines COL in the antenna section ATP on the base substrate BS.

[0135] In some embodiments, the circuit device further comprises a protective layer PL on a side of the shielding layer SDL remote from the base substrate BS2. In one example, the protective layer PL is an ink material layer.

[0136] The inventors of the present disclosure have discovered that by providing the shielding layer SDL and the protective layer PL, the problem of the water ripple pattern on the display panel during wireless charging of the display panel can be reduced or eliminated.

[0137] In some embodiments, the magnetic material layer MML, the second conductive layer CDL2, the second cap layer CVL2, the shielding layer SDL and the protection layer PL are located on the second side S2 of the base substrate BS.

[0138] In some embodiments, the one or more coil lines COL have a first average line width in a range of 0.08 mm to 1.20 mm, e.g., 0.08 mm to 0.40 mm, 0.40 mm to 0.80 mm, and 0.80 mm to 1.20 mm. Optionally, the coil lines of the one or more coil lines COL are spaced apart from each other by a first average distance in a range of 0.10 mm to 0.30 mm, e.g., 0.10 mm to 0.15 mm, 0.15 mm to 0.20 mm, 0.20 mm to 0.25 mm, or 0.25 mm to 0.30 mm.

[0139] In some embodiments, the one or more first conductive lines CL1 have a second average line width in a range of 0.05 mm to 0.20 mm, e.g., 0.05 mm to 0.10 mm, 0.10 mm to 0.15 mm, and 0.15 mm to 0.20 mm. Optionally, the first conductive lines of the one or more first conductive lines CL1 are spaced apart from each other by a second average distance in a range of 0.05 mm to 0.08 mm, e.g., 0.05 mm to 0.06 mm, 0.06 mm to 0.07 mm, or 0.07 mm to 0.08 mm.

[0140] In some embodiments, the first average line width is greater than the second average line width. In some embodiments, the first average pitch is greater than the second average pitch.

[0141] In some embodiments, the one or more coil lines COL are spaced from a nearest edge of the base substrate BS by an average distance ranging from 0.10 mm to 0.20 mm, e.g., 0.10 mm to 0.15 mm, or 0.15 mm to 0.20 mm.

[0142] In some embodiments, the base substrate BS has an average thickness of 15 µm to 30 µm, e.g., 15 µm to 20 µm, 20 µm to 25 µm, or 25 µm to 30 µm. In some embodiments, the first cap layer CVL1 or the second cap layer CVL2 has an average thickness of 10 µm to 20 µm, e.g., 10 µm to 15 µm, or 15 µm to 20 µm. In some embodiments, the first electromagnetic interference shielding layer EMI1 has an average thickness of 5 µm to 15 µm, e.g., 5 µm to 10 µm, or 10 µm to 15 µm. In some embodiments, the adhesive layer AHL has an average thickness of 40 µm to 60 µm, e.g., 40 µm to 50 µm, or 50 µm to 60 µm. In some embodiments, the magnetic field enhancement layer MEL has an average thickness of 20 µm to 45 µm, e.g., 20 µm to 25 µm, 25 µm to 30 µm, 30 µm to 35 µm, 35 µm to 40 µm, or 40 µm to 45 µm.In some embodiments, the magnetic material layer MML has an average thickness of 50 µm to 70 µm, e.g., 50 µm to 60 µm or 60 µm to 70 µm. In some embodiments, the shielding layer SDL has an average thickness of 50 µm to 100 µm, e.g., 50 µm to 60 µm, 60 µm to 70 µm, 70 µm to 80 µm, 80 µm to 90 µm, or 90 µm to 100 µm. In some embodiments, the protective layer PL has an average thickness of 50 µm to 100 µm, e.g., 50 µm to 60 µm, 60 µm to 70 µm, 70 µm to 80 µm, 80 µm to 90 µm, or 90 µm to 100 µm.

[0143] Fig. 7 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. The circuit device shown in Figure 7 differs from that shown in Fig. 6 shown circuit device in that the Fig. 7, a second electromagnetic interference shielding layer EMI2 instead of the one shown in Fig. 6 includes the shielding layer SDL.

[0144] Fig. 8 is a cross-sectional view of a circuit device in some embodiments according to the present disclosure. Fig. The circuit device shown in Figure 8 differs from that shown in Fig. 6 shown circuit device in that the Fig. 8 does not comprise a magnetic field enhancement layer MEL.

[0145] In another aspect, the present disclosure provides a display device comprising the circuit device described herein and a display panel connected to the circuit device. Examples of suitable display devices include, but are not limited to, an electronic paper, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital album, a GPS, etc. In one example, the display device is a smartwatch.

[0146] Fig. 9 is a schematic diagram showing the structure of a display device in some embodiments according to the present disclosure. Referring to Fig. 9, in some embodiments, the display device comprises a flexible printed circuit board portion FPCP and an antenna portion ATP, which are integrated, for example, as a circuit device. The circuit device further comprises a connector CN. The circuit device is connected to a mainboard of a display device via the connector CN. The connector CN is integrated with the antenna portion ATP and the flexible printed circuit board portion FPCP. The antenna portion ATP comprises an antenna, for example, a near-field communication circuit.

[0147] With reference to Fig. 9, in some embodiments, the display device further comprises one or more integrated circuits IC. The flexible printed circuit section FPCP comprises a plurality of circuit pins CPIN for connecting to the one or more integrated circuits IC.

[0148] In some embodiments, the flexible printed circuit board portion FPCP comprises one or more electromagnetic interference shielding layers (e.g., a second electromagnetic interference shielding layer EMI2, which is Fig. 9) configured to shield the circuit device from electromagnetic waves. For example, the one or more electromagnetic interference shielding layers may be configured to shield the circuit device from electromagnetic waves generated during wireless charging of the display panel.

[0149] In some embodiments, the circuit device further comprises a sensor SE integrated into the flexible printed circuit board portion FPCP. In one example, the sensor SE is a photosensor.

[0150] Fig. 10 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 10 may, for example, be a cross-sectional view along a B-B' line in Fig. 9. With reference to Fig. 9 and Fig. 10, in some embodiments, the display device includes a circuit device CD and a display panel DP connected to the circuit device CD. The circuit device CD is adhered to a backside of the display panel DP by the adhesive layer AHL of the circuit device CD. In some embodiments, the display device further includes a cover C on a light-emitting side of the display panel DP.

[0151] Fig. 11 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 11 corresponds to the cross-sectional view of the Fig. 2A. With reference to Fig. 11, the display panel DP and the cover C are located on the first side S1 of the base substrate BS. The display panel DP is located on a side of the adhesive layer AHL remote from the base substrate BS, and the cover C is located on a side of the display panel DP remote from the base substrate BS.

[0152] In some embodiments, the display device comprises a stacked structure including a cover C, a display panel DP on the cover C, an adhesive layer AHL on a side of the display panel DP remote from the cover C, a first electromagnetic interference shielding layer EMI1 on a side of the adhesive layer AHL remote from the cover C, a first cap layer CVL1 on a side of the first electromagnetic interference shielding layer EMI1 remote from the cover C, a first conductive layer CDL1 on a side of the first cap layer CVL1 remote from the cover C, a base substrate BS on a side of the first conductive layer CDL1 remote from the cover C, a magnetic material layer MML and a second conductive layer CDL2 on a side of the base substrate BS remote from the cover C, a second cap layer CVL2 on a side of the second conductive layer CDL2 remote from the cover C,and a second electromagnetic interference shielding layer EMI2 on a side of the second cover layer CVL2 remote from the cover C.,

[0153] Fig. 12 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 12 corresponds to the cross-sectional view of the Fig. 3 illustrated circuit device. With reference to Fig. 12, the display device comprises a stacked structure including a cover C, a display panel DP on the cover C, an adhesive layer AHL on a side of the display panel DP remote from the cover C, a first electromagnetic interference shielding layer EMI1 on a side of the adhesive layer AHL remote from the cover C, a first cap layer CVL1 on a side of the first electromagnetic interference shielding layer EMI1 remote from the cover C, a first conductive layer CDL1 and a magnetic field enhancement layer MEL on a side of the first cap layer CVL1 remote from the cover C, a base substrate BS on a side of the first conductive layer CDL1 and the magnetic field enhancement layer MEL remote from the cover C, a magnetic material layer MML and a second conductive layer CDL2 on a side of the base substrate BS remote from the cover C,a second cover layer CVL2 on a side of the second conductive layer CDL2 remote from the cover C, and a second electromagnetic interference shielding layer EMI2 on a side of the second cover layer CVL2 remote from the cover C.

[0154] Fig. 13 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 13 corresponds to the cross-sectional view of the Fig. 6 illustrated circuit device. With reference to Fig. 13, the display device comprises a stacked structure including a cover C, a display panel DP on the cover C, an adhesive layer AHL on a side of the display panel DP remote from the cover C, a first electromagnetic interference shielding layer EMI1 on a side of the adhesive layer AHL remote from the cover C, a first cap layer CVL1 on a side of the first electromagnetic interference shielding layer EMI1 remote from the cover C, a first conductive layer CDL1 and a magnetic field enhancement layer MEL on a side of the first cap layer CVL1 remote from the cover C, a base substrate BS on a side of the first conductive layer CDL1 and the magnetic field enhancement layer MEL remote from the cover C, a magnetic material layer MML and a second conductive layer CDL2 on a side of the base substrate BS remote from the cover C,a second cover layer CVL2 on a side of the magnetic material layer MML and the second conductive layer CDL2 remote from the cover C, a shielding layer SDL on a side of the second cover layer CVL2 remote from the cover C, and a protective layer PL on a side of the shielding layer SDL remote from the cover C.

[0155] Fig. 14 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 14 corresponds to the cross-sectional view of the Fig. 7. With reference to Fig. 14, the display device comprises a stacked structure including a cover C, a display panel DP on the cover C, an adhesive layer AH Lon a side of the display panel DP remote from the cover C, a first electromagnetic interference shielding layer EMI1 on a side of the adhesive layer AHL remote from the cover C, a first cover layer CVL1 on a side of the first electromagnetic interference shielding layer EMI1 remote from the cover C, a first conductive layer CDL1 and a magnetic field enhancement layer MEL on a side of the first cover layer CVL1 remote from the cover C, a base substrate BS on a side of the first conductive layer CDL1 and the magnetic field enhancement layer MEL remote from the cover C, a magnetic material layer MML and a second conductive layer CDL2 on a side of the base substrate BS remote from the cover C, a second cover layer CVL2 on a side of the magnetic material layer MML and the second conductive layer CDL2 remote from the cover C,a second electromagnetic interference shielding layer EMI2 on a side of the second cover layer CVL2 remote from the cover C and a protective layer PL on a side of the second electromagnetic interference shielding layer EMI2 remote from the cover C.,

[0156] Fig. 15 is a cross-sectional view of a display device in some embodiments according to the present disclosure. Fig. 15 corresponds to the cross-sectional view of the Fig. 8 illustrated circuit device. With reference to Fig.15, the display device comprises a stacked structure including a cover C, a display panel DP on the cover C, an adhesive layer AHL on a side of the display panel DP remote from the cover C, a first electromagnetic interference shielding layer EMI1 on a side of the adhesive layer AHL remote from the cover C, a first cap layer CVL1 on a side of the first electromagnetic interference shielding layer EMI1 remote from the cover C, a first conductive layer CDL1 on a side of the first cap layer CVL1 remote from the cover C, and a base substrate BS on a side of the first conductive layer CDL1 remote from the cover C, a magnetic material layer MML and a second conductive layer CDL2 on a side of the base substrate BS remote from the cover C, a second cap layer CVL2 on a side of the magnetic material layer MML and the second conductive layer CDL2 remote from the cover C,a shielding layer SDL on a side of the second cover layer CVL2 remote from the cover C, and a protective layer PL on a side of the shielding layer SDL remote from the cover C.

[0157] The foregoing description of embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form or exemplary embodiments disclosed. Accordingly, the foregoing description should be considered illustrative rather than restrictive. Obviously, numerous modifications and variations will occur to those skilled in the art. The embodiments were chosen and described in order to explain the principles of the invention and their best practical application, and thus to enable those skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use or implementation contemplated.The scope of the invention is intended to be defined by the appended claims and their equivalents, in which all terms are to be construed in their broadest reasonable sense unless otherwise indicated. Therefore, the term "the invention," "the present invention," or the like does not necessarily limit the scope of the claims to any particular embodiment, and reference to exemplary embodiments of the invention does not imply, and no such limitation should be inferred. The invention is limited only by the spirit and scope of the appended claims. Furthermore, these claims may refer to the use of "first," "second," etc., followed by a noun or element.Such terms should be understood as nomenclature and should not be construed to limit the number of elements modified by such nomenclature unless a specific number has been stated. The described advantages and benefits may not apply to all embodiments of the invention. It should be appreciated that the embodiments described by those skilled in the art may be varied by persons without departing from the scope of the present invention as defined in the following claims. Furthermore, no element or component in the present disclosure is intended to be dedicated to the public, regardless of whether the element or component is specifically recited in the following claims.

Claims

[1] A circuit device comprising a flexible printed circuit board portion and an antenna portion; the circuit device comprising: a base substrate having a uniform structure extending from a region of the antenna portion to a region of the flexible circuit board portion; and a first conductive layer on a first side of the base substrate; wherein the first conductive layer comprises one or more coil lines in the antenna portion and one or more first conductive lines in the flexible circuit portion. [2] The circuit device according to claim 1, further comprising a connector configured to connect the circuit device to a main board of a display device; wherein the one or more coil lines in the antenna portion are directly connected to the connector. [3] The circuit device of claim 1, further comprising a first cap layer on a side of the first conductive layer remote from the base substrate; wherein an orthographic projection of the first cap layer on the base substrate at least partially overlaps with an orthographic projection of the one or more coil lines on the base substrate, and at least partially overlaps with an orthographic projection of the one or more first conductive lines on the base substrate. [4] The circuit device of claim 1, further comprising a magnetic field enhancement layer on the first side of the base substrate, wherein the magnetic field enhancement layer is configured to enhance a magnetic field generated by the one or more coil lines; wherein the one or more coil lines substantially enclose the magnetic field enhancement layer. [5] The circuit device according to claim 4, wherein the magnetic field enhancement layer comprises a magnetic field enhancement material; and the magnetic field enhancement material comprises a metal or an alloy. [6] The circuit device according to claim 1, further comprising a first electromagnetic interference shielding layer on a side of a first cover layer remote from the base substrate, the first electromagnetic interference shielding layer being configured to shield the flexible circuit section from electromagnetic waves; wherein an orthographic projection of the first electromagnetic interference shielding layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines in the flexible circuit section on the base substrate. [7] The circuit device according to claim 1, further comprising an adhesive layer on a side of a first cover layer and a first electromagnetic interference shielding layer remote from the base substrate; wherein the adhesive layer is configured to adhere the circuit device to a display panel; and the adhesive layer has a uniform structure extending from a region of the antenna portion to a region of the flexible circuit board portion. [8] The circuit device of claim 1, further comprising a second conductive layer on a second side of the base substrate, the second side being opposite to the first side; wherein the second conductive layer is configured to shield the flexible circuit board portion from electromagnetic waves; and an orthographic projection of the second conductive layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines in the flexible circuit section on the base substrate. [9] The circuit device of claim 1, further comprising a magnetic material layer on a second side of the base substrate, the second side being opposite to the first side; wherein the magnetic material layer is configured to conduct magnetic flux generated by the one or more coil lines; and an orthographic projection of the magnetic material layer on the base substrate at least partially overlaps with an orthographic projection of the one or more coil lines and / or a magnetic field enhancement layer on the base substrate. [10] The circuit device according to claim 9, wherein the magnetic material layer comprises a ferrimagnetic material. [11] The circuit device of claim 1, further comprising a second capping layer on a side of a second conductive layer remote from the base substrate; wherein an orthographic projection of the second capping layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines on the base substrate. [12] The circuit device of claim 11, wherein the second cap layer has a unitary structure extending from a region of the antenna portion to a region of the flexible circuit portion; and the orthographic projection of the second cap layer on the base substrate at least partially overlaps with an orthographic projection of the one or more coil lines on the base substrate. [13] The circuit device according to claim 1, further comprising a second electromagnetic interference shielding layer on a side of a second cover layer remote from the base substrate, the second electromagnetic interference shielding layer being configured to shield the flexible circuit section from electromagnetic waves; wherein an orthographic projection of the second electromagnetic interference shielding layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines in the flexible circuit section on the base substrate. [14] The circuit device according to claim 1, further comprising a shielding layer on a side of a second cover layer remote from the base substrate, the shielding layer being configured to shield the flexible circuit board portion from electromagnetic waves; wherein an orthographic projection of the shielding layer on the base substrate at least partially overlaps with an orthographic projection of the one or more first conductive lines in the flexible circuit section on the base substrate; the shielding layer has a uniform structure extending from a region of the antenna portion to a region of the flexible circuit board portion; and the orthographic projection of the shielding layer on the base substrate at least partially overlaps with an orthographic projection of the one or more coil lines in the antenna section on the base substrate. [15] The circuit device according to claim 1, further comprising a protective layer on a side of a second electromagnetic interference shielding layer or a shielding layer remote from the base substrate. [16] The circuit device of claim 1, wherein the one or more coil lines have a first thickness that is greater than a second thickness of the one or more first conductive lines. [17] The circuit device of claim 1, wherein the one or more coil lines have a first average line width; the one or more first conductive lines have a second average line width; the first average line width is larger than the second average line width. [18] Circuit device according to claim 1, wherein Coil lines of the one or more coil lines are spaced apart from each other by a first average distance; first conductive lines of the one or more first conductive lines are spaced apart by a second average distance; and the first average distance is greater than the second average distance. [19] A display device comprising the circuit device according to any one of claims 1 to 18 and a display panel connected to the circuit device. [20] A display device according to claim 19, comprising a stacked structure; wherein the stacked structure comprises: a cover; the display panel on the cover; an adhesive layer on a side of the display panel remote from the cover; a first electromagnetic interference shielding layer on a side of the adhesive layer remote from the cover; a first cover layer on a side of the first electromagnetic interference shielding layer remote from the cover; the first conductive layer on a side of the first cover layer remote from the cover; and the base substrate on a side of the first conductive layer remote from the cover.

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