Multilayer capacitor

Abstract

The present invention relates to a multilayer capacitor, a printed circuit board containing the multilayer capacitor, and an integrated circuit package containing the multilayer capacitor. A multilayer capacitor comprises a body containing alternating dielectric layers and internal electrode layers, each comprising a first electrode and a second, coplanar electrode, the first electrode having a main body with at least one terminal tab extending from a top edge and a bottom edge, respectively. The capacitor also comprises a first external terminal and a second external terminal, each wrapping from a top surface along an end surface to a bottom surface.The first external terminal is electrically connected to the first electrode of the first internal electrode layers along the front edges of the terminal tab, and the second external terminal is electrically connected to the first electrode of the second internal electrode layers along the front edges of the terminal tab.

Description

Related registration

[0001] This application is based upon and claims priority from U.S. Provisional Patent Application Serial No. 63 / 420,724, filed October 31, 2022, which is hereby incorporated by reference. BACKGROUND OF THE INVENTION

[0002] Multilayer capacitors are generally constructed with a plurality of dielectric layers and internal electrode layers arranged in a stack. During manufacturing, the stacked dielectric layers and internal electrode layers are pressed and sintered to achieve a substantially uniform capacitor body. In an attempt to improve the performance of these capacitors, various configurations and designs are used for the dielectric layers and internal electrode layers.

[0003] However, because rapid changes are taking place in the electronics industry that require new performance criteria, these configurations are frequently tampered with. In particular, various application design considerations have created a need to redefine capacitor parameters and their performance in high-speed environments, especially in light of faster and denser integrated circuits. For example, higher current ratings, denser printed circuit boards, and spiraling costs have all served to focus on the need for better and more efficient capacitors. Furthermore, the design of various electronic components is driven by a general industry trend toward miniaturization and increased functionality.

[0004] In this regard, there is a need to provide a capacitor with improved operating characteristics. BRIEF DESCRIPTION OF THE INVENTION

[0005] According to one embodiment of the present invention, a multilayer capacitor is disclosed. The multilayer capacitor comprises a body having a length extending in a longitudinal direction, a width extending in a lateral direction, and a height extending in a vertical direction. The body includes alternating dielectric layers and internal electrode layers. The internal electrode layers include first internal electrode layers and second internal electrode layers. Each internal electrode layer includes a first electrode having a main body defined by a longitudinally extending upper edge, a lower edge vertically opposite the upper edge and extending in the longitudinal direction, and two side edges extending vertically between the upper edge and the lower edge.Each internal electrode layer further comprises at least one terminal tab extending away from the top edge of the main body. The at least one terminal tab extends along the height direction away from the top edge and has a front edge extending along the length direction and spaced apart from the main body along the height direction. Each internal electrode layer also comprises at least one terminal tab extending away from the bottom edge of the main body. The at least one terminal tab extends along the height direction away from the bottom edge and has a front edge extending along the length direction and spaced apart from the main body along the height direction. Each internal electrode layer further comprises a second electrode coplanar with the first electrode.The multilayer capacitor also includes external terminals electrically connected to the internal electrode layers. The external terminals include a first external terminal and a second external terminal. Both the first external terminal and the second external terminal are formed on an upper surface of the multilayer capacitor, a lower surface of the multilayer capacitor opposite the upper surface of the multilayer capacitor along the height direction, and an end surface extending between the upper surface and the lower surface.The first external terminal is electrically connected to the first electrode of the first internal electrode layers along the front edge of the at least one terminal tab extending from the top edge and the front edge of the at least one terminal tab extending from the bottom edge, and the first external terminal is also electrically connected to the second electrode of the second internal electrode layers. The second external terminal is electrically connected to the second electrode of the first internal electrode layers and the first electrode of the second internal electrode layers along the front edge of the at least one terminal tab extending from the top edge and the front edge of the at least one terminal tab extending from the bottom edge.

[0006] Further features and aspects of the present invention are set forth in more detail below. Brief description of the drawings

[0007] In the remainder of the specification and with reference to the accompanying drawings, a full and reproducible disclosure of the present invention, including the best mode thereof, is particularly set forth for those skilled in the art, in which: Fig. 1A is an external perspective view, generally from above and from the sides, of one embodiment of a capacitor including two external terminals in accordance with the present invention; Fig. 1B is a perspective side view of the internal electrode layers of the capacitor of Fig. 1A; Fig. 1C is a perspective side view of the internal electrode layers of the capacitor of Fig. 1A; Fig. 1D is a perspective side view of an internal electrode layer of the capacitor of Fig. 1A; Fig. 1E is a perspective side view of an internal electrode layer of the capacitor of Fig. 1A; Fig. 2A is an external perspective view, generally from above and from the sides, of another embodiment of a capacitor including four external terminals in accordance with the present invention; Fig. 2B is a perspective side view of the internal electrode layers of the capacitor of Fig. 2A; Fig. 2C is a perspective side view of the internal electrode layers of the capacitor of Fig. 2A; Fig. 3 a perspective view of the capacitor of Fig. 1A mounted on a mounting surface according to the present invention; and Fig. 4 is a side view of a package for a printed circuit board and an integrated circuit incorporating a capacitor according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0008] Those skilled in the art should appreciate that the present discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of the present invention.

[0009] Generally speaking, the present invention relates to a multilayer capacitor. The multilayer capacitor (or simply capacitor) includes alternating dielectric layers and internal electrode layers. Each internal electrode layer comprises a first electrode and a second counter electrode coplanar with the first electrode. The first electrode has a main body with at least one terminal tab extending from an upper edge of the main body and at least one terminal tab extending from a lower edge of the main body. The capacitor further includes two or more external terminals, wherein the terminal tabs and second electrodes assist in forming the external terminals.

[0010] The special arrangement of the capacitor's elements can provide several advantages. For example, the inventors have discovered that by using such configurations for the capacitor and the electrode layers therein, as well as by using special materials for the electrodes and dielectrics as described here, the multilayer capacitor can exhibit a low equivalent series resistance, particularly over a wide range of frequencies. In particular, such a low equivalent series resistance can be achieved at relatively high frequencies and is inexpensive.

[0011] In this regard, the capacitor may have an equivalent series resistance of 100 ohms or less, such as 75 ohms or less, such as 50 ohms or less, such as 40 ohms or less, such as 30 ohms or less, such as 25 ohms or less, such as 20 ohms or less, such as 15 ohms or less, such as 10 ohms or less, such as 8 ohms or less, such as 5 ohms or less, such as 3 ohms or less, such as 2 ohms or less, such as 1 ohm or less. The equivalent series resistance can be 0.01 ohms or more, such as 0.1 ohms or more, such as 0.2 ohms or more, such as 0.3 ohms or more, such as 0.5 ohms or more, such as 0.8 ohms or more, such as 1 ohm or more, such as 2 ohms or more, such as 3 ohms or more, such as 5 ohms or more, such as 8 ohms or more, such as 10 ohms or more. Such an equivalent series resistance can be realized when measuring over a frequency range of 1 GHz to 10 GHz, such as 2 GHz to 10 GHz, such as 3 GHz to 10 GHz, such as 4 GHz to 9 GHz.The equivalent series resistance can be measured using general techniques known in the art and described herein.

[0012] In some embodiments, the capacitor may have the above-mentioned equivalent series resistance at about a single frequency. For example, in one embodiment, the capacitor may have the above-mentioned equivalent series resistance at about 2 GHz, such as at about 3 GHz, such as at about 4 GHz, such as at about 5 GHz, such as at about 6 GHz, such as at about 7 GHz, such as at about 8 GHz, such as at about 9 GHz, such as at about 10 GHz. In one embodiment, the capacitor may have the above-mentioned equivalent series resistance at more than one of the above-mentioned frequencies.

[0013] The resulting capacitor not only exhibits a relatively low equivalent series resistance due to the selective control of the particular configuration of the electrodes and capacitor, as well as the materials for the electrodes and dielectrics, but can also exhibit a low equivalent series inductance. For example, the use of the capacitor of the present invention can result in an inductance on the order of picohenries or even femtohenries, compared to prior art capacitors that exhibit inductance of larger orders of magnitude. Generally, the inductance can be less than 1 nanohenry.In particular, the inductance may be 900 picohenry or less, such as 750 picohenry or less, such as 500 picohenry or less, such as 400 picohenry or less, such as 250 picohenry or less, such as 100 picohenry or less, such as 50 picohenry or less, such as 25 picohenry or less, such as 15 picohenry or less, such as 10 picohenry or less. The inductance may be 1 femtohenry or more, such as 25 femtohenry or more, such as 50 femtohenry or more, such as 100 femtohenry or more, such as 250 femtohenry or more, such as 500 femtohenry or more, such as 750 femtohenry or more. Minimizing this inductance can contribute to good performance, especially good decoupling performance, especially under transient high-speed conditions. Low values ​​of equivalent series inductance can also be characterized by a low impedance value, reflecting parasitic inductance.

[0014] As stated, the present invention comprises a multilayer capacitor comprising an upper surface and a lower surface opposite the upper surface. The capacitor also comprises at least one side surface, in particular at least two side surfaces, extending between the upper surface and the lower surface. The capacitor may also comprise at least one end surface, in particular at least two end surfaces extending between the upper surface and the lower surface. In general, the side surfaces may extend in the longitudinal or length direction (L) and generally have a longer dimension than the end surfaces, which extend in the lateral or width direction (W) and generally have a shorter dimension. In one embodiment, the capacitor comprises at least six total surfaces (e.g., one top, one bottom, two sides, and two at the ends).For example, the capacitor can have the shape of a parallelepiped, like a cuboid.

[0015] Furthermore, the capacitor can have a desired height. For example, the height can be 10 µm or more, such as 25 µm or more, such as 50 µm or more, such as 100 µm or more, such as 200 µm or more, such as 250 µm or more, such as 300 µm or more, such as 350 µm or more, such as 400 µm or more, such as 450 µm or more, such as 500 µm or more, such as 1000 µm or more, such as 2000 µm or more. The height can be 5000 µm or less, such as 4000 µm or less, such as 2500 µm or less, such as 2000 µm or less, such as 1000 µm or less, such as 750 µm or less, such as 600 µm or less, such as 500 µm or less, such as 450 µm or less. When surrounded by a ball grid array, the height of the capacitor can be within 10%, such as within 7%, such as within 5%, such as within 3%, such as within 2%, such as within 1%, of the height (or diameter) of the balls of the ball grid array.For example, this height can be the original height before reflow soldering.

[0016] The capacitor can have a desired length. For example, the length can be 10 µm or more, such as 25 µm or more, such as 50 µm or more, such as 100 µm or more, such as 200 µm or more, such as 250 µm or more, such as 300 µm or more, such as 350 µm or more, such as 400 µm or more, such as 450 µm or more, such as 500 µm or more, such as 1000 µm or more, such as 1500 µm or more, such as 2000 µm or more, such as 2500 µm or more, such as 3000 µm or more, such as 3500 µm or more, such as 4000 µm or more. The length may be 10000 µm or less, such as 8000 µm or less, such as 6000 µm or less, such as 5000 µm or less, such as 4000 µm or less, such as 3000 µm or less, such as 2500 µm or less, such as 2000 µm or less, such as 1000 µm or less, such as 750 µm or less, such as 600 µm or less, such as 500 µm or less, such as 450 µm or less.

[0017] The capacitor can also have a desired width. For example, the width can be 10 µm or more, such as 25 µm or more, such as 50 µm or more, such as 100 µm or more, such as 200 µm or more, such as 250 µm or more, such as 300 µm or more, such as 350 µm or more, such as 400 µm or more, such as 450 µm or more, such as 500 µm or more, such as 750 µm or more, such as 1000 µm or more, such as 1500 µm or more, such as 2000 µm or more, such as 2500 µm or more, such as 3000 µm or more. The width may be 5000 µm or less, such as 4000 µm or less, such as 3000 µm or less, such as 2500 µm or less, such as 2000 µm or less, such as 1500 µm or less, such as 1000 µm or less, such as 750 µm or less, such as 600 µm or less, such as 500 µm or less, such as 450 µm or less.

[0018] Generally, the multilayer capacitor includes a plurality of alternating dielectric layers and internal electrode layers. The capacitor also includes external terminals electrically connected to the internal electrode layers, the external terminals being formed on a top surface of the capacitor and a bottom surface of the capacitor opposite the top surface of the capacitor, and at least two opposite end surfaces.

[0019] Generally, the capacitor comprises at least one set of alternating dielectric layers and internal electrode layers. The capacitor may also include a second set of alternating dielectric layers and internal electrode layers. In this regard, the capacitor may comprise at least two, such as at least three, such as at least four, sets of alternating dielectric layers and internal electrode layers. However, it should be understood that the present invention may include any number of sets of alternating dielectric layers and internal electrode layers and is not necessarily limited. Furthermore, the respective sets of alternating dielectric layers and internal electrode layers may be separated from an adjacent set by a certain distance. For example, this distance is greater than the thickness of any individual dielectric layer in the set.

[0020] In particular, the distance may be at least two, such as at least 3, such as at least 5, such as at least 10, times the thickness of a dielectric layer in the set.

[0021] The set or sets of alternating dielectric layers and internal electrode layers may form at least part of the body of the capacitor. By arranging the dielectric layers and the internal electrode layers in a stacked or laminated configuration, the capacitor may be referred to as a multilayer capacitor, and in particular as a multilayer ceramic capacitor, for example, when the dielectric layers comprise a ceramic.

[0022] The set of alternating dielectric layers and internal electrode layers comprises dielectric layers arranged alternately with internal electrode layers. Specifically, the internal electrode layers comprise first internal electrode layers and second internal electrode layers interleaved in an opposing and spaced-apart relationship with a dielectric layer located between each two internal electrode layers.

[0023] In general, the thickness of the dielectric layers and the internal electrode layers is not limited and can be any thickness depending on the performance characteristics. For example, the thickness of the internal electrode layers can be, but is not limited to, about 500 nm or more, such as about 1 µm or more, such as about 2 µm or more, to about 10 µm or less, such as about 5 µm or less, such as about 4 µm or less, such as about 3 µm or less, such as about 2 µm or less. For example, the internal electrode layers can have a thickness of about 1 µm to about 2 µm.

[0024] Furthermore, the present invention is not necessarily limited by the number of internal electrode layers per set of alternating dielectric layers and internal electrode layers or in the entire capacitor. For example, each set may include 10 or more, such as 25 or more, such as 50 or more, such as 100 or more, such as 200 or more, such as 300 or more, such as 500 or more, such as 600 or more, such as 750 or more, such as 1,000 or more internal electrode layers. Each quantity may have 5000 or less, such as 4000 or less, such as 3000 or less, such as 2000 or less, such as 1500 or less, such as 1000 or less, such as 750 or less, such as 500 or less, such as 400 or less, such as 300 or less, such as 250 or less, such as 200 or less, such as 175 or less, such as 150 or less, internal electrode layers. Furthermore, the entire capacitor may comprise the above-mentioned number of electrode layers.

[0025] Each internal electrode layer of the plurality of internal electrode layers alternating with the plurality of dielectric layers comprises a first electrode and a second (counter) electrode. For example, each internal electrode layer comprises a first electrode and a second electrode, and each second internal electrode layer comprises a first electrode and a second electrode. The second internal electrode layers may have a similar, mirrored structure to the first internal electrodes.

[0026] The first electrode and the second electrode of an internal electrode layer are coplanar, i.e., they lie substantially in the same plane in the longitudinal and transverse directions. The first electrode comprises a central portion or main body extending away from one external terminal and from one end of the first electrode toward the other external terminal. Such a portion may extend directly away from the external terminal. Alternatively, each portion may extend from a base portion of the first electrode, which, together with the central portion or main body, also extends away from the external terminal. Generally, the base portion of the first electrode extends along a side edge of the first electrode adjacent to the external terminal. Furthermore, the main bodies of the first electrodes of adjacent electrode layers at least partially overlap in the horizontal direction.

[0027] The central portion or main body of the first electrode may have a certain length in the longitudinal direction, for example, the length is the distance of the main body of the first electrode from the side edge adjacent to and connected to the external terminal to the opposite side edge of the central portion or main body. For example, the internal electrode layer comprising the first electrode and the second electrode extends between a first external terminal and a second external terminal. The main body of the first electrode may extend in the longitudinal or length direction by 40% or more, such as 50% or more, such as 55% or more, such as 60% or more, such as 65% or more, such as 70% or more, of a length of the capacitor body between the opposite end surfaces (i.e., the length between the external terminals formed along the end surfaces).The main body of the first electrode may also extend by less than 100%, such as 90% or less, such as 85% or less, such as 80% or less, such as 75% or less, such as 70% or less, such as 65% or less, of the length of the capacitor body.

[0028] The second (counter) electrode in each internal electrode layer may extend 5% or more, such as 10% or more, such as 15% or more, such as 18% or more, such as 20% or more, such as 22% or more, of the distance between the first external terminal and the second external terminal. The second electrode may extend 50% or less, such as 40% or less, such as 35% or less, such as 30% or less, such as 25% or less, of the distance between the first external terminal and the second external terminal.

[0029] Furthermore, a gap may be present between the central portion or main body of the first electrode and the second electrode within an inner electrode layer. Such a gap may be 2% or more, such as 5% or more, such as 7% or more, such as 9% or more, such as 10% or more, such as 12% or more, of the distance between the first external terminal and the second external terminal. Such a gap may be 40% or less, such as 30% or less, such as 25% or less, such as 20% or less, such as 15% or less, such as 13% or less, such as 11% or less, of the distance between the first external terminal and the second external terminal.

[0030] The gap may be 5% or more, such as 7% or more, such as 10% or more, such as 13% or more, such as 15% or more, such as 18% or more, such as 20% or more, of the length of the center portion of the first electrode. The gap may be 40% or less, such as 35% or less, such as 30% or less, such as 25% or less, such as 22% or less, such as 20% or less, such as 18% or less, such as 15% or less, of the length of the center portion of the first electrode.

[0031] Furthermore, the main body of the first electrode of each internal electrode layer has an upper edge and a lower edge opposite the upper edge. The main body also has two side edges extending between the upper edge and the lower edge. The side edges, the upper edge, and the lower edge define the main body of the first electrode. Generally, the main body may have a rectangular configuration or shape.

[0032] In general, the upper edge and the lower edge of the main body may have the same dimension (e.g., in the length or longitudinal direction L). The side edges of the main body may have the same dimension (e.g., height direction T). In general, the side edges may have a dimension (e.g., height direction T) that is shorter than a dimension (e.g., length or longitudinal direction L) of the upper edge and / or lower edge. In this regard, the height of a side edge of the main body, as it extends between the upper and lower surfaces of the capacitor, may be less than the length of the upper edge and / or the lower edge of the main body as it extends between end surfaces of the capacitor. In other words, the main body may have an upper edge and / or a lower edge with a larger dimension than the side edges with the smaller dimension.In this respect, the “short” sides of the internal electrode layers can coincide with the height direction of the capacitor.

[0033] The internal electrode layers have terminal tabs extending from the main body of the first electrode. The terminal tabs extend from a top edge and a bottom edge. In other words, the internal electrode layers may have terminal tabs extending from the "long" sides or edges of the layers. The terminal tabs may extend to an edge of a dielectric layer and / or a surface of the capacitor. For example, in a staggered configuration, a leading edge of a respective terminal tab may extend to an edge of a dielectric layer. Such a leading edge may be used to form the external terminals.Furthermore, the upper edge and the lower edge of a first electrode of an internal electrode layer may have at least one terminal tab, such as at least two terminal tabs, such as at least three terminal tabs, such as at least four terminal tabs extending therefrom.

[0034] Each upper edge and lower edge of the main body of the first electrodes may have an equal number of terminal tabs extending therefrom. For example, each upper edge and lower edge may have at least one terminal tab extending therefrom. In another embodiment, each upper edge and lower edge may have at least two terminal tabs extending therefrom. However, it should be understood that the present invention may include any number of terminal tabs extending from the internal electrode layers and is not necessarily limited.

[0035] In one embodiment, at least one terminal tab extends from a top edge and at least one terminal tab extends from a bottom edge of the main body of the first electrode of the internal electrode layer, and an edge of at least one terminal tab is aligned with a side edge of the main body. For example, at least one side edge (i.e., an edge running in the height direction) of the at least one terminal tab extending from the top edge or the at least one terminal tab extending from the bottom edge may be substantially aligned with a respective side edge of the main body of the first electrode. In this regard, at least one terminal tab may not be offset from the side edge of the main body.

[0036] Furthermore, if more than one terminal tab may be present along an edge, the terminal tab may extend from an inner part of an upper edge and a lower edge of the main body of the first electrode. In this regard, the terminal tab may not extend directly from a side edge of the main body. In other words, the terminal tab may be offset from a side edge of the main body. The offset may be such that it is offset and positioned between the side edges of the main body, in particular at a position that is at least 50% of the length of the main body (i.e., beyond the center of the main body).

[0037] The terminal tabs extending from an upper edge of a respective first electrode and a lower edge of the same first electrode of an internal electrode layer may be offset by the same distance from a side edge. In this regard, at least one side edge (i.e., edge that coincides in a height direction) of the terminal tabs may be substantially aligned. In one embodiment, both side edges of the respective terminal tabs may be substantially aligned.

[0038] Likewise, the length (i.e., extending in the longitudinal or lengthwise direction from one end face to another end face) of a terminal tab extending from the upper edge may be the same as the length of a corresponding terminal tab extending from the lower edge.

[0039] The length of the terminal lug can be 0.3 mm or more, such as 0.4 mm or more, such as 0.5 mm or more, such as 0.6 mm or more, such as 0.7 mm or more. The length of the terminal lug can be 1.1 mm or less, such as 0.9 mm or less, such as 0.8 mm or less, such as 0.7 mm or less, such as 0.6 mm or less, such as 0.5 mm or less. If more than one terminal lug is present along an edge, each terminal lug can have the same length.

[0040] In another embodiment, each terminal tab may have a different length. For example, the terminal tab substantially aligned with the side edge of the main body of the first electrode may have a length greater than the terminal tab offset from the side edges of the main body. In this regard, the ratio of the length of the terminal tab aligned with the side edge of the main body to the length of the terminal tab offset from the side edges of the main body may be 0.3 or more, such as 0.5 or more, such as 0.7 or more, such as 0.9 or more, such as 1 or more, such as 1.1 or more, such as 1.2 or more, such as 1.3 or more, such as 1.4 or more, such as 1.5 or more. The ratio may be 5 or less, such as 4 or less, such as 3 or less, such as 2 or less, such as 1.8 or less, such as 1.7 or less, such as 1.6 or less, such as 1.5 or less, such as 1.4 or less.

[0041] “Substantially aligned” means that the offset from a side edge of a lateral edge of a first terminal tab and / or second terminal tab at a top edge is within + / -10%, such as within + / -5%, such as within + / -4%, such as within + / -3%, such as within + / -2%, such as within + / -1%, such as within + / -0.5% of the offset from a side edge of a corresponding lateral edge of a first terminal tab and / or second terminal tab at a bottom edge.

[0042] The spacing between adjacent exposed terminal tabs of the internal electrode layers in a given column may be specifically designed to ensure guided terminal formation. This spacing between exposed terminal tabs of the internal electrode layers in a given column may be about 10 µm or less, such as about 8 µm or less, such as about 5 µm or less, such as about 4 µm or less, such as about 2 µm or less, such as about 1.5 µm or less, such as about 1 µm or less. The spacing may be about 0.25 µm or more, such as about 0.5 µm or more, such as about 1 µm or more, such as about 1.5 µm or more, such as about 2 µm or more, such as about 3 µm or more. However, it should be understood that this spacing is not necessarily limited.

[0043] Additionally, the spacing between adjacent columnar stacks of electrode tabs may be, although not limited, at least a factor of two greater than the spacing between adjacent electrode tabs in a given column to ensure that different terminals do not merge. In some embodiments, the spacing between adjacent columnar stacks of exposed metallization is approximately four times the spacing between adjacent exposed electrode tabs in a given stack. However, this spacing may vary depending on the desired capacitance performance and board configuration.

[0044] The pitch may be 0.1 mm or more, such as 0.2 mm or more, such as 0.3 mm or more, such as 0.4 mm or more, such as 0.5 mm or more, such as 0.6 mm or more. The pitch may be 1.5 mm or less, such as 1.3 mm or less, such as 1 mm or less, such as 0.9 mm or less, such as 0.7 mm or less, such as 0.6 mm or less, such as 0.5 mm or less, such as 0.4 mm or less. This pitch may, in one embodiment, be determined based on the center point of each terminal tab. In another embodiment, the pitch may be based on the distance between adjacent lateral edges of the terminal tabs. Additionally, this pitch may correspond to the separation distance of the ball on a ball grid array.

[0045] A terminal tab of a first internal electrode layer and a terminal tab of a second internal electrode layer within a set of alternating dielectric layers and internal electrode layers are offset from one another in the longitudinal direction. This means that the terminal tabs of the respective internal electrode layers can be offset by a certain distance symmetrically from a centerline (e.g., a longitudinal centerline or approximately a vertical line) of the internal electrode layers and / or dielectric layer. This means that the terminal tabs of the respective internal electrode layers can be offset symmetrically about a vertical line of the internal electrode layers and / or dielectric layer. Regardless of this, a gap region is created between the terminal tabs of the respective internal electrode layers.

[0046] Furthermore, the internal electrode layers may be symmetrical in a given direction, regardless of the number of terminal tabs extending therefrom. For example, the terminal tabs may be symmetrical about a horizontal line (i.e., a line extending from the center of one side edge to the center of the other side edge of the first electrode of the internal electrode layer) through the center of the main body of the first electrode.

[0047] Furthermore, as stated herein, each first electrode of an internal electrode layer comprises at least two side edges. When stacked on top of each other to form the body of the capacitor, such side edges of the first electrodes of the alternating internal electrode layers may be substantially non-aligned. For example, the side edges may be offset from each other.

[0048] As stated, the capacitor comprises a set of alternating dielectric layers and internal electrode layers. If the capacitor comprises a second set of alternating dielectric layers and internal electrode layers, in one embodiment, the distance between the first internal electrode layer of one set and the last internal electrode layer of another set may be greater than the distance between adjacent internal electrode layers within a given set. For example, the distance between the first internal electrode layer of a first set and the last internal electrode layer of a second set may be greater than the distance between the first internal electrode layer and the second internal electrode layer of the first set.

[0049] The capacitor of the present invention also includes external terminals on the top surface and the bottom surface. The capacitor also includes external terminals on opposite end surfaces. In a particular embodiment, the external terminals may not be present on either side surface of the capacitor. For example, the external terminals present on the top surface and bottom surface extend only to the end surfaces, and the respective top and bottom external terminals, including the wrap-around terminals, do not touch each other. In this regard, each external terminal wraps around and touches three surfaces (e.g., the top surface, one end surface, and the bottom surface, and the top surface, the other end surface, and the bottom surface).Such a wrap-around connection can be achieved through the use of various electrode configurations, including anchor or dummy electrodes, as described herein.

[0050] The capacitor also includes a first external terminal and a second external terminal. Generally, the first electrodes of the first internal electrode layers and the second electrodes of the second internal electrode layers are electrically connected to the first external terminal. Meanwhile, the first electrodes of the first internal electrode layers and the second electrodes of the first internal electrode layers are electrically connected to the second external terminal. As described herein, the second electrodes of the internal electrode layers may be anchor or dummy electrodes (also referred to as anchor or dummy tabs) configured to assist in forming the first external terminal and the second external terminal.

[0051] The external terminals comprise at least one terminal of a first polarity and at least one terminal of a second, opposite polarity. The capacitor may comprise at least one, such as at least two, such as at least four, such as at least six, such as at least eight, terminals of a first polarity and / or terminals of a second, opposite polarity on an upper surface of the capacitor. Furthermore, the capacitors may comprise the above-mentioned number of terminals on a lower surface of the capacitor.

[0052] The capacitor may include an equal number of terminals of a first polarity and / or terminals of a second polarity on the top surface of the capacitor and the bottom surface of the capacitor. The number of terminals of the first polarity may be equal to the number of terminals of the second, opposite polarity on an top surface of the capacitor. The number of terminals of the first polarity may be equal to the number of terminals of the second, opposite polarity on a bottom surface of the capacitor. The total number of terminals present on an top surface of the capacitor may be equal to the total number of terminals present on a bottom surface of the capacitor.The total number of terminals of the first polarity present on an upper surface and a lower surface of the capacitor may be equal to the total number of terminals of the second, opposite polarity present on an upper surface and a lower surface of the capacitor.

[0053] In general, the like-polarity terminals on the bottom surface of the capacitor, corresponding to a certain set of alternating dielectric layers and internal electrode layers, are electrically connected to the like-polarity terminals on the top surface of the capacitor. The like-polarity terminals located on an upper surface and a lower surface of a capacitor may not interdigitate. In this respect, corresponding like-polarity terminals on an upper and lower surface may not be offset by one terminal position, but may instead be located directly above or below another like-polarity terminal on the opposite upper or lower surface, respectively.In other words, corresponding terminals of the same polarity corresponding to a given set of alternating dielectric layers and internal electrode layers, and in particular the corresponding terminal tabs of such a set, may be substantially aligned with each other. "Substantially aligned" means that the offset from a side edge of a terminal of one polarity on a top surface is within + / -10%, such as within + / -5%, such as within + / -4%, such as within + / -3%, such as within + / -2%, such as within + / -1%, such as within + / -0.5% of the offset from a side edge of a terminal of the corresponding polarity on a bottom surface.

[0054] In general, the pitch (i.e., the nominal center-to-center spacing, also called center-to-center spacing) of the external terminals may be fixed by the particular board configuration. The pitch between external terminals in one direction (i.e., the x- or y-direction) may be the same as the pitch between adjacent external terminals in the other direction (i.e., the y- or x-direction, respectively). That is, the pitch between any two adjacent external terminals may be substantially the same as the pitch between any two other adjacent external terminals.

[0055] The regular pitch may be about 0.1 mm or more, such as about 0.2 mm or more, such as about 0.3 mm or more, such as about 0.4 mm or more, such as about 0.5 mm or more, such as about 0.6 mm or more, such as about 0.7 mm or more, such as about 0.8 mm or more, such as about 0.9 mm or more, such as about 1.0 mm or more. The regular pitch may be about 2.0 mm or less, such as about 1.5 mm or less, such as about 1.4 mm or less, such as about 1.3 mm or less, such as about 1.2 mm or less, such as about 1.1 mm or less, such as about 1.0 mm or less. For example, the regular pitch may be about 0.2 mm, about 0.4 mm, about 0.6 mm, about 0.8 mm, about 1.0 mm, about 1.2 mm, etc. In particular, the regular spacing may be 0.6 mm, 0.8 mm, or 1.0 mm. In one embodiment, the regular spacing may be approximately 0.6 mm, such as 0.6 mm + / - 10%, such as + / - 5%, such as + / - 2%, such as + / - 1%.In another embodiment, the regular spacing may be approximately 0.8 mm, such as 0.8 mm + / - 10%, such as + / - 5%, such as + / - 2%, such as + / - 1%. In another embodiment, the regular spacing may be approximately 1 mm, such as 1 mm + / - 10%, such as + / - 5%, such as + / - 2%, such as + / - 1%.

[0056] As mentioned, extending a leading edge of a terminal tab can assist in the formation of external terminals. In this regard, the regular spacing between a terminal tab on a first internal electrode layer and a terminal tab on a second internal electrode layer can be the same as mentioned above. That is, the regular spacing between a terminal tab on a first internal electrode layer and a terminal tab on a second internal electrode layer can be substantially the same as the regular spacing between the corresponding external terminals for which the terminal tabs are used.

[0057] Furthermore, the external terminals can be placed similarly to the configuration of a ball grid array. For example, the external terminals can be provided to make contacts as typically employed in a ball grid array, particularly in a surrounding ball grid array. In this respect, the regular spacing of the external terminals can be the same as the regular spacing of a surrounding ball grid array. That is, the regular spacing can be within 10%, within 5%, within 2%, within 1%, within 0.5%, or within 0.1% of the regular spacing of a surrounding ball grid array.

[0058] Furthermore, the external terminals may be provided in rows and columns like a ball grid array. That is, the external terminals may be provided so as to be present in at least one row and at least two columns. For example, the external terminals may be provided in at least one row, such as at least two rows, such as at least three rows, such as at least four rows. The number of rows may be fixed by the number of different sets of alternating dielectric layers and internal electrode layers. Furthermore, the external terminals may be provided in at least two columns, such as at least three columns, such as at least four columns. The number of columns may be fixed by the number of different column-like tabs of the internal electrodes.

[0059] Furthermore, the length of an external terminal extending longitudinally or lengthwise along the upper surface may be the same as the length of a corresponding external terminal extending along the lower surface. The length of an external terminal may be measured from one terminal end face to the other terminal end face, which are opposite each other longitudinally.

[0060] The length of the external terminal may be 0.3 mm or more, such as 0.4 mm or more, such as 0.5 mm or more, such as 0.6 mm or more, such as 0.7 mm or more. The length of the external terminal may be 1.1 mm or less, such as 0.9 mm or less, such as 0.8 mm or less, such as 0.7 mm or less, such as 0.6 mm or less, such as 0.5 mm or less. If there is more than one external terminal along a surface, each external terminal may have the same length. Furthermore, the length of the external terminal may be smaller than the length of the capacitor, such as 50% or less, such as 40% or less, such as 30% or less, such as 25% or less, such as 20% or less, such as 15% or less, of the length of the capacitor.

[0061] In another embodiment, each external terminal may have a different length. For example, the external terminal adjacent to an end face may have a length greater than the offset of the external terminal from the end face. In this regard, the ratio of the length of the external terminal adjacent to an end face to the length of the external terminal offset from the end face may be 0.3 or more, such as 0.5 or more, such as 0.7 or more, such as 0.9 or more, such as 1 or more, such as 1.1 or more, such as 1.2 or more, such as 1.3 or more, such as 1.4 or more, such as 1.5 or more. The ratio may be 5 or less, such as 4 or less, such as 3 or less, such as 2 or less, such as 1.8 or less, such as 1.7 or less, such as 1.6 or less, such as 1.5 or less, such as 1.4 or less.

[0062] Furthermore, the width of an external terminal extending in the lateral or transverse direction may be the same on the top surface and the bottom surface. The width of an external terminal may be measured from one terminal side surface to another end side surface, which are opposite to each other in the transverse direction.

[0063] The width of an external terminal can be 0.3 mm or more, such as 0.4 mm or more, such as 0.5 mm or more, such as 0.6 mm or more, such as 0.7 mm or more. The width of the external terminal can be 1.1 mm or less, such as 0.9 mm or less, such as 0.8 mm or less, such as 0.7 mm or less, such as 0.6 mm or less, such as 0.5 mm or less. If there is more than one external terminal along a surface, each external terminal can have the same width. Furthermore, the width of the external terminal can be smaller than the width of the capacitor.

[0064] As described herein, the formation of the external terminals or external poles is generally guided by the position of the exposed edges of the internal electrode layers. Such phenomena may be referred to as "self-determining" because the formation of the external metallized terminals is determined by the configuration of the exposed conductive metal of the electrode layers at the selected peripheral locations on the capacitor. In some embodiments, the capacitor may include "dummy tabs" to provide exposed conductive metal along portions of the capacitor body that do not include other electrodes (e.g., active or shield electrodes).In some embodiments, one or more "dummy tabs," "dummy electrodes," anchor tabs, and / or anchor electrodes, for example, may be added features for a nucleation function, such as occurs during an FCT (fine copper termination, electroless plating) process. Such dummy tabs, anchor tabs, or electrodes may be positioned internally or externally relative to the body of the component to nucleate deposited metallization material and thereby form external metallized terminals in an FCT process. For example, a first plurality of dummy tabs may be connected to the first external terminal, and a second plurality of dummy tabs may be connected to the second external terminal.Generally, the second electrodes of the internal electrode layers are dummy or anchor tabs or electrodes that support the formation of the first external terminal and the second external terminal.

[0065] The second electrodes (i.e., the tab or dummy electrodes or anchor tabs or electrodes) may have any configuration known in the art. For example, in some embodiments, the second electrodes may have a rectangular configuration or shape, while in other embodiments, the second electrodes may have a C-shaped configuration or an L-shaped configuration. For example, the second electrodes may include a base portion and at least one, such as two, electrode arms extending from the base portion, particularly from the lateral ends of the base portion. Such electrode arms may extend longitudinally from one end of the capacitor body. Such electrode arms of the second electrodes may also be longitudinally oriented. However, it should be noted that the second electrodes may have any shape, as is well known in the art.

[0066] The capacitor of the present invention can be further constructed according to the embodiments shown in the Fig. 1A-1E and 2A-2C.

[0067] Fig. 1A shows a capacitor 10 in a 1-by-2 configuration. That is, the capacitor 10 includes two external terminals arranged linearly in a single dimension on a top and bottom surface of the capacitor. In the depicted embodiment, the capacitor 10 includes external terminals arranged linearly or in a single row along a longitudinal direction L, which may be referred to as a linear terminal arrangement.

[0068] In addition, the capacitor includes terminals along one end surface such that they wrap from the top surface to the bottom surface along the adjacent end surface. In this regard, the capacitor 10 includes a body 16 with external terminals 12, 14 including a first external terminal 12 and a second external terminal 14. The first external terminal 12 is disposed on the top surface 18a, an end surface 18c, and the bottom surface 18b and is electrically connected to the first internal electrode layers 105 ( Fig. 1B-1E). The first external terminal 14 is arranged on the upper surface 18a, an end surface 18d and the lower surface 18b and is electrically connected to the second internal electrode layers 115 ( Fig. 1B, Fig. 1C).

[0069] In addition, the capacitor comprises 10 of Fig. 1A includes at least one terminal of a first polarity 12 and at least one terminal of a second, opposite polarity 14 on the upper surface 18a. Although not shown, the lower surface 18b includes at least one terminal of a first polarity 12 and one terminal of a second, opposite polarity 14.

[0070] The body 16 of the capacitor 10 has a length 15 extending in a longitudinal or length direction L. The length 15 can be measured from one end surface 18c to the opposite end surface 18d. Furthermore, the body 16 of the capacitor 10 has a width 17 extending in a lateral or transverse direction W. The width 17 can be measured from one side surface 18e to the opposite side surface 18e. Furthermore, the body 16 of the capacitor 10 has a height 19 extending in the vertical or height direction T. The height 19 can be measured from the upper surface 18a to the opposite lower surface 18b.

[0071] As in Fig. 1A, the external terminals 12, 14 have a terminal width BW extending in the lateral or transverse direction W. The external terminals 12, 14 also have a terminal length BL along the top surface 18a, wherein the terminal length BL extends in the longitudinal or lengthwise direction L. It should be noted that one or both terminals 12, 14 may also have a terminal length BL along the bottom surface 18b, which may be the same as or different from the terminal length BL along the top surface 18a.

[0072] If we focus on the Fig. 1A-1C, the capacitor 10 comprises external terminals 12, 14 and a set of alternating dielectric layers and internal electrode layers 110. If we refer to the Fig. 1B and Fig. 1C, the set of alternating dielectric layers and internal electrode layers 110 includes first and second internal electrode layers 105, 115 and dielectric layers (not shown) in an alternating arrangement.

[0073] In general, the first internal electrode layers 105 each comprise a first electrode 101 and a second electrode 102, and the second internal electrode layers 115 each comprise a first electrode 103 and a second electrode 104. Furthermore, the internal electrode layers 105, 115 comprise at least one terminal tab 120, 130, 140, 150 extending along the vertical or height direction T from an upper edge and a lower edge of a main body of the first electrodes 101, 103. Therefore, the connection tabs 120, 130, 140, 150 extend from the main body perpendicular to a length 107, 108 of the first electrode 101, 103 and the length 15 of the capacitor body 16, wherein the lengths 107, 108 of the first electrode and 15 of the capacitor body each extend along the longitudinal direction L.

[0074] Generally, the terminal tabs 120, 130, 140, 150 of the internal electrode layers 105, 115 extend to the top surface and the bottom surface of the capacitor and assist in forming the external terminals 12, 14. In this regard, the terminal tabs 120, 130, 140, 150 may be exposed on the top surface 18a and the bottom surface 18b of the capacitor and enable a connection between the main body of the first electrodes 101, 103 and the external terminals 12, 14.

[0075] For example, the terminal tabs 120, 130, 140, 150 may include front edges 123, 133, 143, 153 that extend to an edge of a dielectric layer and enable the formation of the external terminals. The front edges 123, 133, 143, 153 each extend along the longitudinal direction L and are spaced apart from the main body along the vertical or height direction T. The first external terminal 12 may be electrically connected to the first electrode 101 of the first internal electrode layers 105 along the front edge 123 of the terminal tab 120 and the front edge 133 of the terminal tab 130. Likewise, the first external terminal 14 can be electrically connected to the first electrode 103 of the second internal electrode layers 115 along the front edge 143 of the terminal tab 140 and the front edge 153 of the terminal tab 150.

[0076] As in the Fig. 1B and Fig. 1C, a first internal electrode layer 105 comprises precisely one terminal tab 120, 130 extending along an upper edge 105c and a lower edge 105d away from a main body 135. A second internal electrode layer 115 comprises precisely one terminal tab 140, 150 extending along an upper edge and a lower edge away from the main body 145.

[0077] The main body 135, 145 of the first electrode 101, 103 of each internal electrode layer 105, 115 has an upper edge 105c and a lower edge 105d opposite the upper edge 105c along the vertical or height direction T. Both the upper edge 105c and the lower edge 105d extend along the longitudinal direction L. The main body 135, 145 also has two side edges 105a, 105b extending along the vertical or height direction T between the upper edge 105c and the lower edge 105d. The side edges 105a, 105b, the upper edge 105c and the lower edge 105d define the main body 135, 145 of the first electrode 101, 103. In general, the main body 135, 145 may have a rectangular configuration or shape.

[0078] The connection tabs 120, 130 at the top and bottom edges of the main body 135 can be aligned in the vertical or height direction T. For example, a lateral edge 121, 122 of a first connection tab 120 can be aligned along an upper edge 105c, and a lateral edge 131, 132 of a first connection tab 130 can be aligned along a lower edge 105d opposite the upper edge 105c. Furthermore, such lateral edges 121, 131 can also be aligned with the side edge 105a of the main body 135.

[0079] However, it should be understood that both lateral edges 121, 122 of the first terminal tab 120 along an upper edge 105c may be aligned with the lateral edges 131, 132 of a first terminal tab 130 along a lower edge 105d opposite the upper edge 105c. In other words, the lateral edges 122, 132 may be aligned, and both lateral edges 122, 132 may be offset from the lateral edges 105a, 105b by the same distance along a lower edge 105d and the upper edge 105c.

[0080] Likewise, the terminal tabs 140, 150 can be aligned at the top edge and at the bottom edge of the main body 145 in the vertical or height direction T. That is, a lateral edge 141, 142 of a first terminal tab 140 along an upper edge can be aligned with a lateral edge 151, 152 of a first terminal tab 150 along a lower edge opposite the top edge. In one embodiment, both lateral edges 141, 142 of the first terminal tab 140 along an upper edge can be aligned with the lateral edges 151, 152 of a first terminal tab 150 along a lower edge opposite the top edge. The relationship between lateral edges of a first terminal tab at an upper edge and a first terminal tab at a lower edge, as mentioned with respect to the internal electrode layer 105, can also apply to the internal electrode layer 115.

[0081] With such an arrangement, a tab gap 116 can be created between terminal tab 120 of the first internal electrode layer 105 and terminal tab 140 of the second internal electrode layer 115. Likewise, a tab gap 118 can be created between terminal tab 130 of the first internal electrode layer 105 and terminal tab 150 of the second internal electrode layer 115. The size of the respective tab gaps 116, 118 can be substantially the same.

[0082] Terminal tabs 120 and 140 may be arranged parallel to terminal tabs 130 and 150, respectively, extending from internal electrode layers 105 and 115, such that terminal tabs extending from alternating electrode layers 105 and 115 may be aligned in a respective column. For example, terminal tabs 120 and 130 of internal electrode layer 105 may be arranged in a corresponding stacked configuration, while terminal tabs 140 and 150 of internal electrode layer 115 may be arranged in a corresponding stacked configuration.

[0083] It should be noted that terminal tabs 120 are connected to external terminal 12, while terminal tabs 140 are connected to external terminal 14. Accordingly, the respective terminal tabs 120 interlock with the respective terminal tabs 140 in a manner similar to the external terminals 12 and 14. The interlocking terminal tabs can provide multiple adjacent current injection points on the associated main electrode portions.

[0084] As in the Fig. 1B, Fig. 1D and Fig. 1E, the second electrode 102 of the first internal electrode layers 105 is coplanar with the first electrode 101 or substantially in the same plane as the first electrode 101, and as shown in Fig. 1C, the second electrode 104 of the second internal electrode layers 115 is coplanar with, or substantially in the same plane as, the first electrode 103. In one embodiment, the first electrode 101 may be considered to have an end or base portion 109 that extends to and is exposed along a dimension of a surface of an incomplete stack of dielectric and electrode layers. Likewise, the first electrode 103 may be considered to have an end or base portion 111 that extends to and is exposed along a dimension of a surface of an incomplete stack of dielectric and electrode layers. The respective main body 135, 145 extends from the respective end part 109, 111 along the longitudinal or length direction L, and the connecting tabs 120, 130, 140, 150 extend from the respective end part 109, 111 along the height direction T.The second electrode 102, 104 also extends to and is exposed along an unfinished stack of dielectric and electrode layers. If we look at the . Fig. 1B and Fig. 1C, the second internal electrode layers 115 are configured similarly to the first internal electrode layers 105 and have a mirror image structure to that of the first internal electrode layers 105.

[0085] In particular in Fig. 1B and Fig. 1C, each of the second electrodes 102, 104 may be substantially rectangular. However, in other embodiments, the second electrodes 102, 104 may have other shapes. For example, as shown in Fig. 1D, each of the second electrodes 102 may be substantially C-shaped, with a first arm 102a extending from a top surface of an end or base portion 102c of the second electrode 102 and a second arm 102b extending from a bottom surface of the end or base portion 102c. As another example, if we refer to Fig. 1E, each of the second electrodes 102 may be substantially L-shaped, with an arm 102d extending from either a top or bottom surface of an end or base portion 102c of the second electrode. In some embodiments of L-shaped second electrodes 102, internal electrode layers 105 having the arm 102d extending from the top surface of the end or base portion 102c may be stacked alternately with internal electrode layers 105 (as well as dielectric layers and internal electrode layers 115, as described herein) having the arm 102d extending from the bottom surface of the end or base portion 102c. Fig. 1D and Fig. 1E illustrates a second electrode 102 of a first internal electrode layer 105, it should be noted that the second electrodes 104 of the second internal electrode layers 115 may be configured similarly to the illustrated second electrode 102 and may have a C-shape or an L-shape. Of course, in other embodiments, the second electrodes may have any suitable shape.

[0086] In some embodiments, the first electrode 101, 103 and the second electrode 102, 104 extend along and / or are exposed along the entire surface of a non-connected stack of dielectric and electrode layers. In other embodiments, the first electrode 101, 103 and the second electrode 102, 104 do not extend along and / or are not exposed along the entire surface of a non-connected stack of dielectric and electrode layers.

[0087] The main body 135 of the first electrode 101 has a length 107 in the longitudinal direction L, and the main body 145 of the first electrode 103 has a length 108 in the longitudinal or length direction L. The length 107, 108 is the distance of the main body 135, 145 of the first electrode 101, 103 from the side edge adjacent to and connected to the external terminal to the opposite side edge of the main body 135, 145. For example, the first electrode 101 of a first internal electrode layer 105 may have a length 107 from the side edge 105a to the side edge 105b.

[0088] The main body 135, 145 of the first electrode 101, 103 may extend to 40% or more, such as 50% or more, such as 55% or more, such as 60% or more, such as 65% or more, such as 70% or more, of a length 15 of the capacitor body (ie, as shown in Fig. 1A, the length between the opposite end surfaces 16c, 16d in the longitudinal or length direction L). The main body 135, 145 of the first electrode 101, 103 may extend by less than 100%, such as 90% or less, such as 85% or less, such as 80% or less, such as 75% or less, such as 70% or less, such as 65% or less, of the length 15 of the body 16 of the capacitor 10. For example, the main body 135, 145 may extend from 50% to less than 100% of the length 15 of the capacitor body 16.

[0089] As in the Fig. 1B-1E, the second electrode 102 has a length 117 extending in the longitudinal or length direction L, and the second electrode 104 has a length 119 extending in the longitudinal or length direction L. The length 117, 119 of each of the second electrodes 102, 104 may be less than the length 15 of the capacitor body 16, that is, the length 117, 119 of each of the second electrodes 102, 104 may be a fraction or percentage of the length 15 of the capacitor body 16. For example, each of the second electrodes 102, 104 may extend from 5% to 50% of the length 15 of the capacitor body 16.As further examples, the second electrode 102, 104 in each internal electrode layer 105, 115 may extend 5% or more, such as 10% or more, such as 15% or more, such as 18% or more, such as 20% or more, such as 22% or more, of the length 15 of the body 16 of the capacitor 10. Each of the second electrodes 102, 104 may extend 50% or less, such as 40% or less, such as 35% or less, such as 30% or less, such as 25% or less, of the length 15 of the capacitor body 16.

[0090] Furthermore, within a first internal electrode layer 105, a gap 113 may be present between the main body 135 of the first electrode 101 and the second electrode 102, and within a second internal electrode layer 115, a gap 114 may be present between the main body 145 of the first electrode 103 and the second electrode 104. Such a gap 113, 114 may be 2% or more, such as 5% or more, such as 7% or more, such as 9% or more, such as 10% or more, such as 12% or more, of the length 15 of the capacitor body 16. Such a gap 113, 114 may be 40% or less, such as 30% or less, such as 25% or less, such as 20% or less, such as 15% or less, such as 13% or less, such as 11% or less, of the length 15 of the capacitor body 16. For example, the gap 113, 114 may be 2% to 40% of the length 15 of the capacitor body 16.

[0091] A respective gap 113, 114 may be 5% or more, such as 7% or more, such as 10% or more, such as 13% or more, such as 15% or more, such as 18% or more, such as 20% or more, of the length 107, 108 of the main body 135, 145 of a respective first electrode 101, 103. The gap 113, 114 may be 40% or less, such as 35% or less, such as 30% or less, such as 25% or less, such as 22% or less, such as 20% or less, such as 18% or less, such as 15% or less, of the length 107, 108 of the main body 135, 145 of the first electrode 101, 103. For example, the gap 113, 114 can be 5% to 40% of the length 107, 108 of the respective main body 135, 145.

[0092] If we focus on Fig. 1A, the external terminals 12, 14 can be a first external terminal 12 and a second external terminal 14. The first external terminal 12 is located at one end of the capacitor 10, e.g., at the end of the body 16 adjacent to the end face 18c, and the second external terminal 14 is located at the opposite end of the capacitor 10 along the longitudinal or length direction L, e.g., the second external terminal 14 is located at the end of the body 16 adjacent to the end face 18d. The first external terminal 12 is electrically connected to the first electrode 101 of the first internal electrode layers 105 and the second electrode 104 of the second internal electrode layers 115. The second external terminal 14 is electrically connected to the second electrode 102 of the first internal electrode layers 105 and the first electrode 103 of the second internal electrode layers 115.As previously described, the external terminals of capacitor 10 wrap around capacitor body 16 from top surface 18a to bottom surface 18b, forming a portion of first external terminal 12 along end surface 18c and a portion of second external terminal 14 along end surface 18d. Second electrodes 102, 104 may be dummy tabs or electrodes that extend to the respective ends of body 16 to assist in forming external terminals 12, 14 along end surfaces 18c, 18d.

[0093] Furthermore, Fig. 1A, the external terminals 12, 14 of the capacitor 10 are spaced from the side surfaces of the body 16. That is, the side surfaces of the external terminals 12, 14 are spaced from the side surfaces 18e, 18f or the long sides of the body 16, which extend along the longitudinal direction L between the end surfaces 18c, 18d, such that only dielectric material is located between the external terminals 12, 14 and the side surfaces 18e, 18f of the body 16. In other embodiments, however, one or both of the external terminals 12, 14 could extend to one or both side surfaces of the capacitor body 16 and would not need to be spaced from the side surface(s), as in Fig. 1A shown.

[0094] As in the Fig. 1A-1E, the capacitor includes two external terminals formed on the top surface and the bottom surface, and each internal electrode layer includes at least one terminal tab extending from an upper edge and a lower edge of a main body of the respective layer. However, as previously stated, the present invention is not limited by the number of external terminals and / or the number of terminal tabs extending from an upper edge and / or a lower edge.

[0095] For example, Fig. 2A, a capacitor 20 containing four external terminals each on the upper surface and the lower surface and two terminal tabs each extending from the upper surface and the lower surface of the internal electrode layers. Fig. 2A-2C, the same reference numerals are used as in the Fig. 1A-1E to indicate identical or similar features.

[0096] As in Fig. As shown in Figure 2A, capacitor 20 has a 1-by-4 configuration. That is, capacitor 200 includes four external terminals arranged linearly in a single dimension on a top and bottom surface of the capacitor. In the depicted embodiment, capacitor 200 includes external terminals arranged linearly, or in a single row, along a longitudinal direction L, which may be referred to as a linear terminal arrangement.

[0097] In this regard, the capacitor 20 comprises a body 26 having a total of four external terminals 22a, 22b, 24a, 24b on an upper surface 28a and four corresponding external terminals (not shown) on a lower surface 28b, wherein the external terminals 22a, 22b, 24a, 24b on the upper surface 28a are electrically connected to the corresponding external terminals 22a, 22b, 24a, 24b on the lower surface 28b.

[0098] In addition, the capacitor includes terminals along one end surface such that they wrap from the top surface to the bottom surface along the adjacent end surface. In this regard, the external terminals 22a, 22b, 24a, 24b include a first external terminal 22a and a second external terminal 24a. The first external terminal 22a is disposed on the top surface 28a, an end surface 28c, and the bottom surface 28b and is electrically connected to the first internal electrode layers 205 ( Fig. 2B, Fig. 2C). The second external terminal 24a is arranged on the upper surface 28a, an end surface 28d and the lower surface 28b and is electrically connected to the second internal electrode layers 215 ( Fig. 2B, Fig. 2C). The remaining external terminals include a third external terminal 22b on the upper surface 28a, a fourth external terminal 24b on the upper surface 28a, a fifth external terminal 22b on the lower surface 28b, and a sixth external terminal 24b on the lower surface 28b.

[0099] In addition, the capacitor includes 20 of Fig. 2A, at least one terminal of a first polarity and at least one terminal of a second, opposite polarity on an upper surface. Although not shown, the lower surface includes at least one terminal of a first polarity and one terminal of a second, opposite polarity. In particular, the capacitor 20, as shown in Fig. 2A, two positive terminals 22a, 22b and two negative terminals 24a, 24b on the upper surface 28a.

[0100] The body 26 of the capacitor 20 has a length 25 extending in a longitudinal or length direction L, which can be measured from one end surface 28c to the opposite end surface 28d. Furthermore, the body 26 of the capacitor 20 has a width 27 extending in a lateral or transverse direction and which can be measured from one side surface 28e to the opposite side surface 28e. Furthermore, the body 26 of the capacitor 20 has a height 29 extending in the vertical or height direction T and which can be measured from the upper surface 28a to the opposite lower surface 28b.

[0101] As in Fig. 2A, the external terminals 22a, 22b, 24a, 24b each have a terminal width BW extending in the lateral or transverse direction W. The external terminals 22a, 24a also have a terminal length BLA along the upper surface 18a, wherein the terminal length BLA extends in the longitudinal or length direction L. Likewise, the external terminals 22b, 24b have a terminal length BLB along the upper surface 18a that extends in the longitudinal or length direction L. It should be noted that one or both terminals 22a, 24a or one or both terminals 22b, 24b along the lower surface 18b may have a terminal length BLA or BLB, respectively, which may be the same as or different from the respective terminal length BLA, BLB along the upper surface 18a.

[0102] If we focus on the Fig. 2A-2C, the capacitor 20 comprises external terminals 22a, 22b, 24a, 24b and a set of alternating dielectric layers and internal electrode layers 210. Referring in particular to the Fig. 2B and Fig. 2C, the set of alternating dielectric layers and internal electrode layers 210 includes first and second internal electrode layers 205, 215 and dielectric layers (not shown) in an alternating arrangement.

[0103] In general, the first internal electrode layers 205 each comprise a first electrode 201 and a second electrode 202, and the second internal electrode layers 215 each comprise a first electrode 203 and a second electrode 204. Furthermore, the internal electrode layers 205, 215 comprise at least one terminal tab 220a, 220b, 230a, 230b, 240a, 240b, 250a, 250b extending along the vertical or height direction T from an upper edge and a lower edge of a main body of the first electrodes 201, 203. Therefore, the connection tabs 220a, 220b, 230a, 230b, 240a, 240b, 250a, 250b extend from the main body perpendicular to a length 207, 208 of the first electrode 201, 203 and the length 25 of the capacitor body 26, wherein the lengths 207, 208 of the first electrode and the length 25 of the capacitor body each extend along the longitudinal direction L.

[0104] Generally, the terminal tabs 220a-b, 230a-b, 240a-b, 250a-b of the internal electrode layers 205, 215 extend to the top surface and bottom surface of the capacitor and assist in forming the external terminals 22a, 22b, 24a, 24b. In this regard, the terminal tabs 220a-b, 230a-b, 240a-b, 250a-b may be exposed on the top surface 28a and bottom surface 28b of the capacitor and enable a connection between the main body of the first electrodes 201, 203 and the external terminals 22a, 22b, 24a, 24b.

[0105] For example, the terminal tabs 220a-b, 230a-b, 240a-b, 250a-b may include front edges 223a, 223b, 233a, 233b, 243a, 243b, 253a, 253b that extend to an edge of a dielectric layer and enable the formation of the external terminals. The front edges 223a, 223b, 233a, 233b, 243a, 243b, 253a, 253b each extend along the longitudinal direction L and are spaced from the main body along the vertical or height direction T. The first external terminal 22a may be electrically connected to the first electrode 201 of the first internal electrode layers 205 along the front edge 223a of the terminal tab 220a and the front edge 233a of the terminal tab 230a.Likewise, the second external terminal 14 may be electrically connected to the second electrode 102 of the first internal electrode layers 105 and to the first electrode 103 of the second internal electrode layers 115 along the front edge 143 of the terminal tab 140 and the front edge 153 of the terminal tab 150.

[0106] As in the Fig. 2B and Fig. 2C, a first internal electrode layer 205 includes at least two terminal tabs 220a, 220b, 230a, 230b extending along an upper edge 205c and a lower edge 205d from a main body 235. For example, in the illustrated embodiment, two terminal tabs 220a, 220b extend from the main body 235 along the upper edge 205c, and two terminal tabs 230a, 230b extend from the main body 235 along the lower edge 205d. A second internal electrode layer 215 includes at least two terminal tabs 240a, 240b, 250a, 250b extending along an upper edge and a lower edge from the main body 245. For example, as shown in FIGS. Fig. 2B and Fig. 2C, two terminal tabs 240a, 240b extend from the main body 245 along the upper edge, and two terminal tabs 250a, 250b extend from the main body along the lower edge.

[0107] As shown in the figures, the main body 235 of the first electrode 201 of the first internal electrode layer 205 has an upper edge 205c and a lower edge 205d opposite the upper edge 205c along the vertical or height direction T. Both the upper edge 205c and the lower edge 205d extend along the longitudinal direction L. The main body 235 also has two side edges 205a, 205b extending along the vertical or height direction T between the upper edge 205c and the lower edge 205d. The side edges 205a, 205b, the upper edge 205c and the lower edge 205d define the main body 235 of the first electrode 201. It should be noted that the main body 245 of the first electrode 203 of the second inner electrode layer 215 is defined by an upper edge, a lower edge and two side edges in the same or substantially similar manner as the main body 235 of the first electrode 201.In general, the main body 235, 245 may have a rectangular configuration or shape.

[0108] The connection tabs 220a-b, 230a-b at the upper edge 205c and the lower edge 205d of the main body 235 can be aligned in the vertical or height direction T. For example, a lateral edge 221a, 222a of a first connection tab 220a along an upper edge 205c can be aligned with a lateral edge 231a, 232a of a first connection tab 230a along a lower edge 205d opposite the upper edge 205c. Furthermore, such lateral edges 221a, 231a can also be aligned with a lateral edge 205a of the main body 235.

[0109] However, it should be understood that both lateral edges 221a, 222a of the first terminal tab 220a along an upper edge 205c may be aligned with the lateral edges 231a, 232a of a first terminal tab 230a along a lower edge 205d opposite the upper edge 205c. In other words, the lateral edges 222a, 232a may be aligned with each other, and both lateral edges 222a, 232a may be offset from the lateral edges 205a, 205b by the same distance along a lower edge 205d and the upper edge 205c.

[0110] When an upper edge 205c and a lower edge 205d include at least two terminal tabs 220a-b, 230a-b, at least one lateral edge of each terminal tab at an upper edge 205c may be aligned with a corresponding lateral edge of a terminal tab at the lower edge 205d. Furthermore, both lateral edges of each terminal tab at an upper edge 205c may be aligned with a corresponding lateral edge of the terminal tabs at the lower edge 205d.

[0111] Likewise, the connection tabs 240a, 240b, 250a, 250b can be aligned at the top edge and the bottom edge of the main body 245 in the vertical or height direction T. That is, a lateral edge 241a, 242a of a first connection tab 240 along an upper edge can be aligned with a lateral edge 251a, 252a of a first connection tab 250 along a lower edge opposite the upper edge. In one embodiment, both lateral edges 241a, 242a of the first connection tab 240a along an upper edge can be aligned with the lateral edges 251a, 252a of a first connection tab 250a along a lower edge opposite the upper edge. The relationship between lateral edges of a first terminal tab at an upper edge and a first terminal tab at a lower edge, as mentioned with respect to the internal electrode layer 205, may also apply to the internal electrode layer 215.

[0112] With such an arrangement, a tab gap may be formed between any of the terminal tabs along an upper edge 205c of the first internal electrode layer 205, the second internal electrode layer 215, or both. For example, a tab gap may be formed between any terminal tabs 220a-b, 240a-b extending from the upper edges of the respective internal electrode layers. Furthermore, a tab gap may be formed between any of the terminal tabs along an upper edge 205d of the first internal electrode layer 205, the second internal electrode layer 215, or both. For example, a tab gap may be formed between any terminal tabs 230a-b, 250a-b extending from the upper edges of the respective internal electrode layers.Furthermore, the size of a tab gap between two respective tabs extending from a top edge, whether from the same internal electrode layer or from adjacent internal electrode layers, may be substantially the same as the size of a gap between the corresponding two respective tabs extending from a bottom edge. For example, a first tab gap 216a between terminal tabs 220a and 220b may be substantially the same as a first tab gap 218a between terminal tabs 230a and 230b. Likewise, a second tab gap 216b between terminal tabs 220a and 240a may be substantially the same as a second tab gap 218b between terminal tabs 230a and 250a.

[0113] Any or all of the terminal tabs 220a-b, 240a-b may be arranged parallel to the respective terminal tabs 230a-b, 250a-b extending from the layers 205 and 215, such that the terminal tabs extending from alternating electrode layers 205 and 215 may be aligned in a respective column. For example, the terminal tabs 220a-b and 230a-b of the internal electrode layer 205 may be arranged in a corresponding stacked configuration, while the terminal tabs 240a-b and 250a-b of the internal electrode layer 215 may be arranged in a corresponding stacked configuration.

[0114] It should be noted that terminal tabs 220a and 220b are connected to external terminals 22a and 22b, respectively, while terminal tabs 240a, 240b are connected to external terminals 24a, 24b. Accordingly, the respective terminal tabs 220a-b interlock with the respective terminal tabs 240a-b in a manner similar to the external terminals 22a-b and 24a-b. The interlocking terminal tabs can provide multiple adjacent current injection points on the associated main electrode portions.

[0115] As in the Fig. 2B and Fig. 2C, the second electrode 202 of the first internal electrode layers 205 is coplanar with, or substantially in the same plane as, the first electrode 201, and the second electrode 204 of the second internal electrode layers 215 is coplanar with, or substantially in the same plane as, the first electrode 203. In one embodiment, the first electrode 201 may be considered to have an end or base portion 209 that extends to and is exposed along a dimension of a surface of an unterminated stack of dielectric and electrode layers. Likewise, the first electrode 203 may be considered to have an end or base portion 211 that extends to and is exposed along a dimension of a surface of an unterminated stack of dielectric and electrode layers.The respective main body 235, 245 extends from the respective end portion 209, 211 along the longitudinal or length direction L, and the connecting tabs 220a, 230a, 240b, 250b extend from the respective end portion 209, 211 along the height direction T. Like the first electrode 201, 203, the second electrode 202, 204 also extends to and is exposed along a surface of an unconnected stack of dielectric and electrode layers. If we . Fig. 2B and Fig. 2C, the second internal electrode layers 215 are configured similarly to the first internal electrode layers 205 and have a mirror image structure to that of the first internal electrode layers 205.

[0116] In particular in Fig. 2B and Fig. 2C, each of the second electrodes 202, 204 may be substantially rectangular. However, in other embodiments, the second electrodes 202, 204 may have other shapes. For example, the second electrodes 202, 204 may be substantially C-shaped, or the second electrodes 202, 204 may be substantially L-shaped, for example, as described above with respect to the capacitor 10. Of course, in other embodiments, the second electrodes 202, 204 may have any suitable shape.

[0117] In some embodiments, the first electrode 201, 203 and the second electrode 202, 204 extend along and / or are exposed along the entire surface of a non-connected stack of dielectric and electrode layers. In other embodiments, the first electrode 201, 203 and the second electrode 202, 204 do not extend along and / or are not exposed along the entire surface of a non-connected stack of dielectric and electrode layers.

[0118] The main body 235 of the first electrode 201 has a length 207 in the longitudinal or length direction L, and the main body 245 of the first electrode 203 has a length 208 in the longitudinal or length direction L. The length 207, 208 is the distance of the main body 235, 245 of the first electrode 201, 203 from the side edge adjacent to and connected to the external terminal to the opposite side edge of the main body 235, 245. For example, the first electrode 201 of a first internal electrode layer 205 may have a length 207 from the side edge 205a to the side edge 205b.

[0119] The main body 235, 245 of the first electrode 201, 203 may extend to 40% or more, such as 50% or more, such as 55% or more, such as 60% or more, such as 65% or more, such as 70% or more, of a length 25 of the capacitor body 26 (ie, as shown in Fig. 2A, the length between the opposite end surfaces 28c, 28d in the longitudinal or length direction L). The main body 235, 245 of the first electrode 201, 203 may extend by less than 100%, such as 90% or less, such as 85% or less, such as 80% or less, such as 75% or less, such as 70% or less, such as 65% or less, of the length 25 of the body 26 of the capacitor 20. For example, the main body 235, 245 may extend from 50% to less than 100% of the length 25 of the capacitor body 26.

[0120] As in the Fig. 2B and Fig. 2C, the second electrode 202 has a length 217 extending in the longitudinal or length direction L, and the second electrode 204 has a length 219 extending in the longitudinal or length direction L. The length 217, 219 of each of the second electrodes 202, 204 may be less than the length 25 of the capacitor body 16, i.e., the length 217, 219 of each of the second electrodes 202, 204 may be a fraction or percentage of the length 25 of the capacitor body 26. For example, each of the second electrodes 202, 204 may extend 5% to 50% of the length 25 of the capacitor body 26. As further examples, the second electrode 202, 204 in each internal electrode layer 205, 215 may extend 5% or more, such as 10% or more, such as 15% or more, such as 18% or more, such as 20% or more, such as 22% or more, of the length 25 of the body 26 of the capacitor 20.Each of the second electrodes 202, 204 may extend by 50% or less, such as 40% or less, such as 35% or less, such as 30% or less, such as 25% or less, of the length 25 of the capacitor body 26.

[0121] Furthermore, within a first internal electrode layer 205, a gap 213 may be present between the main body 235 of the first electrode 201 and the second electrode 202, and within a second internal electrode layer 215, a gap 214 may be present between the main body 245 of the first electrode 203 and the second electrode 204. Such a gap 213, 214 may be 2% or more, such as 5% or more, such as 7% or more, such as 9% or more, such as 10% or more, such as 12% or more, of the length 25 of the capacitor body 26. Such a gap 213, 214 may be 40% or less, such as 30% or less, such as 25% or less, such as 20% or less, such as 15% or less, such as 13% or less, such as 11% or less, of the length 25 of the capacitor body 26. For example, the gap 213, 214 may be 2% to 40% of the length 25 of the capacitor body 26.

[0122] A respective gap 213, 214 may be 5% or more, such as 7% or more, such as 10% or more, such as 13% or more, such as 15% or more, such as 18% or more, such as 20% or more, of the length 207, 208 of the main body 235, 245 of a respective first electrode 201, 203. The gap 213, 214 may be 40% or less, such as 35% or less, such as 30% or less, such as 25% or less, such as 22% or less, such as 20% or less, such as 18% or less, such as 15% or less, of the length 207, 208 of the main body 235, 245 of the first electrode 201, 203. For example, the gap 213, 214 may be 5% to 40% of the length 207, 208 of the respective main body 235, 245.

[0123] If we focus on Fig. 2A, the external terminals 22a, 22b, 24a, 24b may comprise a first external terminal 22a located at one end of the capacitor 20, e.g., at the end of the body 26 adjacent to the end face 28c; and a second external terminal 24a located at the opposite end of the capacitor 20 along the longitudinal or length direction L, e.g., the second external terminal 24a is located at the end of the body 26 adjacent to the end face 28d. The first external terminal 22a is electrically connected to the first electrode 201 of the first internal electrode layers 205 and the second electrode 204 of the second internal electrode layers 215. The second external terminal 24a is electrically connected to the second electrode 202 of the first internal electrode layers 205 and the first electrode 203 of the second internal electrode layers 215.As previously described, the first and second external terminals 22a, 24a (or terminal external terminals) of the capacitor 20 wrap around the capacitor body 26 from the top surface 28a to the bottom surface 28b, such that a portion of the first external terminal 22a is formed along the end surface 28c and a portion of the second external terminal 24a is formed along the end surface 28d. The second electrodes 202, 204 may be dummy tabs or electrodes that extend to the respective ends of the body 26 to assist in forming the external terminals 22a, 24a along the end surfaces 28c, 28d.

[0124] Furthermore, Fig. 2A, the external terminals 22a, 22b, 24a, 24b of the capacitor 20 are spaced from the side surfaces of the body 26. That is, the side surfaces of the external terminals 22a-b, 24a-b are spaced from the side surfaces 28e, 28f or the long sides of the body 26, which extend along the longitudinal direction L between the end surfaces 28c, 28d, such that only dielectric material is located between the external terminals 22a-b, 24a-b and the side surfaces 28e, 28f of the body 26. In other embodiments, however, one or both of the external terminals 22a-b, 24a-b could extend to one or both side surfaces of the capacitor body 26 and would not need to be spaced from the side surface(s), as in Fig. 2A shown.

[0125] As in the Fig. 2A-2C, the capacitor includes four external terminals formed on the top surface and the bottom surface, with two external terminals also extending along respective end surfaces. Further, each internal electrode layer includes at least two terminal tabs extending from an upper edge and a lower edge of a main body of the respective layer. However, as previously stated, the present invention is not limited by the number of external terminals, the number of terminal tabs extending from an upper edge and / or a lower edge, and / or the number of sets of alternating dielectric layers and internal electrode layers.

[0126] Furthermore, in the embodiments of the figures, only two internal electrode layers are used per set of alternating dielectric layers and internal electrode layers. However, it should be understood that the present invention may include any number of internal electrode layers per set, as stated herein, and is not necessarily limited.

[0127] In general, the present invention provides a capacitor having a unique configuration that provides various benefits and advantages. In this regard, it should be understood that the materials used in constructing the capacitor are not limited and may be any materials commonly used in the art, and may be formed using any method commonly used in the art.

[0128] In general, the dielectric layers are typically formed of a material having a relatively high dielectric constant (K), such as about 10 to about 40,000, in some embodiments about 50 to about 30,000, and in some embodiments about 100 to about 20,000.

[0129] In this regard, the dielectric material may be a ceramic. The ceramic may be provided in a variety of forms, such as a wafer (e.g., pre-fired) or as a dielectric material fired within the component itself.

[0130] Specific examples of high-dielectric-constant materials include NPO (COG) (up to about 100), X7R (about 3000 to about 7000), X7S, Z5U, and / or Y5V materials. It should be understood that the above-mentioned materials are described by their industry-accepted definitions, some of which are standard classifications established by the Electronic Industries Alliance (EIA), and therefore should be recognized by those skilled in the art. For example, such a material may include a ceramic. Such materials may include a perovskite, such as barium titanate and related solid solutions (e.g., barium strontium titanate, barium calcium titanate, barium zirconate titanate, barium strontium zirconate titanate, barium calcium zirconate titanate, etc.), lead titanate and related solid solutions (e.g., lead zirconate titanate, lead lanthanum zirconate titanate), sodium bismuth titanate, etc.For example, in a particular embodiment, barium strontium titanate (“BSTO”) of the formula Ba. x Sr 1-x TiO3, where x = 0 to 1, in some embodiments about 0.15 to about 0.65, and in some embodiments about 0.25 to about 0.6. Other suitable perovskites are, for example, Ba x Ca 1-x TiO3, where x is about 0.2 to about 0.8, and in some embodiments is about 0.4 to about 0.6, Pb x Zr 1-x TiO3 (“PZT”), where x ranges from about 0.05 to about 0.4, lead lanthanum zirconium titanate (“PLZT”), lead titanate (PbTiO3), barium calcium zirconium titanate (BaCaZrTiO3), sodium nitrate (NaNO3), KNbO3, LiNbO3, LiTaO3, PbNb2O6, PbTa2O6, KSr(NbO3), and NaBa2(NbO3)5KHb2PO4. Other complex perovskites include A[B1 1 / 3 B2 2 / 3 ]O3 materials, where A = Ba x Sr 1-x is (x can have a value from 0 to 1); B1 = Mg y Zn 1-yis (y can have a value from 0 to 1); B2 = Ta z Nb 1-z (z can have a value from 0 to 1). In a particular embodiment, the dielectric layers may comprise a titanate.

[0131] The internal electrode layers may be made of any of a variety of different metals known in the art. The internal electrode layers may be made of a metal, such as a conductive metal. The materials may include precious metals (e.g., silver, gold, palladium, platinum, etc.), base metals (e.g., copper, tin, nickel, chromium, titanium, tungsten, etc.), and various combinations thereof. Sputtered titanium / tungsten (Ti / W) alloys, as well as the respective sputtered layers of chromium, nickel, and gold, may also be suitable. In a particular embodiment, the internal electrode layers may comprise nickel or an alloy thereof.

[0132] The external terminals may be made of any of a variety of different metals known in the art. The external terminals may be made of a metal, such as a conductive metal. The materials may include precious metals (e.g., silver, gold, palladium, platinum, etc.), base metals (e.g., copper, tin, nickel, chromium, titanium, tungsten, etc.), and various combinations thereof. In a particular embodiment, the external terminals may comprise copper or an alloy thereof.

[0133] The external terminals can be formed using any method well known in the art. The external terminals can be formed using methods such as sputtering, painting, printing, electroless plating or fine copper termination (FCT), electroplating, plasma deposition, propellant spraying, etc.

[0134] The external terminals may be formed such that the external terminal is a thin-film metallization. Such a thin-film metallization may be formed by depositing a conductive material, such as a conductive metal, on an exposed portion of an internal electrode layer. For example, a leading edge of an internal electrode layer may be exposed in such a way that it may allow the formation of a metallized terminal.

[0135] The external terminals may have an average thickness of about 50 µm or less, such as about 40 µm or less, such as about 30 µm or less, such as about 25 µm or less, such as about 20 µm or less, to about 5 µm or more, such as about 10 µm or more, such as about 15 µm or more. For example, the external terminals may have an average thickness of about 5 µm to about 50 µm, such as about 10 µm to about 40 µm, such as about 15 µm to about 30 µm, such as about 15 µm to about 25 µm.

[0136] In general, the external terminal may comprise a metallized terminal. For example, the external terminal may comprise a galvanized terminal, an electroless plated terminal, or a combination thereof. For example, a galvanized terminal may be formed by electrolytic deposition. An electroless plated terminal may be formed by electroless deposition.

[0137] If the external terminal is constructed from multiple layers, the external terminal can comprise a plated terminal and an electroless plated terminal. For example, electroless plating can be used first to deposit an initial material layer. Then, the metallization technique can be switched to a plating system, which can enable faster material buildup.

[0138] When forming the metallized terminals using either metallization method, a leading edge of the terminal tabs of the internal electrode layers exposed from the main body of the capacitor is exposed to a metallization solution. This exposure allows the capacitor, in one embodiment, to be immersed in the metallization solution.

[0139] The metallization solution contains a conductive material, such as a conductive metal, and is used to form the metallized terminal. This conductive material can be any of the materials mentioned above or any material generally known in the art. For example, the metallization solution can be a nickel sulfamate bath solution or another nickel solution, such that the metallization layer and the external terminal comprise nickel. Alternatively, the metallization solution can be a copper acid bath or another suitable copper solution, such that the metallization layer and the external terminal comprise copper.

[0140] Furthermore, it should be noted that the metallization solution may also include other additives well known in the art. For example, the additives may include other organic additives and media that can assist the metallization process. Furthermore, additives may be used to maintain the metallization solution at a desired pH. In one embodiment, resistance-reducing additives may be used in the solutions to promote complete metallization coverage and bonding of the metallization materials to the capacitor and the exposed leading edges of the terminal tabs of the internal electrode layers.

[0141] The capacitor may be exposed to, submerged in, or immersed in the metallization solution for a predetermined period of time. This exposure time is not necessarily limited, but it may be sufficient to allow enough metallization material to deposit to form the metallized terminal. In this regard, the time should be sufficient to allow the formation of a continuous connection between the desired exposed adjacent leading edges of terminal tabs of a given polarity of the respective internal electrode layers within a set of alternating dielectric layers and internal electrode layers.

[0142] In general, the difference between electroplating and electroless plating is that electroplating involves an electrical bias, such as using an external power source. The electroplating solution can typically be exposed to a high current density range, for example, 10 to 15 amps / ft 2 (rated at 9.4 volts). A connection can be formed with a negative connection to the capacitor, which requires the formation of the metallized terminals, and a positive connection to a solid material (e.g., Cu in Cu metallizing solution) in the same metallizing solution. This means that the capacitor is biased to a polarity opposite to that of the metallizing solution. With such a process, the conductive material of the metallizing solution is attracted to the metal of the exposed leading edge of the terminal tabs of the internal electrode layers.

[0143] Before the capacitor is immersed in or exposed to a metallization solution, various pretreatment steps can be used. Such steps can be performed for a variety of purposes, including catalyzing, accelerating, and / or improving the adhesion of the metallization materials to the leading edges of the terminal tabs.

[0144] In addition, a preliminary cleaning step can be used before metallization or any other pretreatment steps.

[0145] Such a step may be employed to remove any accumulated oxide that may form on the exposed terminal tabs of the internal electrode layers. This cleaning step may be particularly useful in assisting in the removal of any accumulation of nickel oxide when the internal electrodes or other conductive elements are made of nickel. Cleaning of the components may be accomplished by full immersion in a pre-cleaning bath, such as one containing an acid cleaner. In one embodiment, exposure may be for a predetermined time, such as on the order of about 10 minutes. Alternatively, cleaning may be accomplished through chemical polishing or harperization steps.

[0146] In addition, a step for activating the exposed metallic leading edges of the terminal tabs of the internal electrode layers may also be performed to facilitate the deposition of the conductive materials. Activation can be achieved by immersion in palladium salts, photopatterned palladium-organic precursors (via mask or laser), screen-printed or inkjet-deposited palladium compounds, or electrophoretic palladium deposition. It should be understood that palladium-based activation is disclosed herein merely as an example of activation solutions that often work well with activation of exposed tab parts made of nickel or an alloy thereof. However, it should be understood that other activation solutions may also be used and are therefore not necessarily limited.

[0147] Furthermore, instead of or in addition to the above-mentioned activation step, the activation dopant can also be introduced into the conductive material when forming the internal electrode layers of the capacitor. For example, if the internal electrode layer comprises nickel and the activation dopant comprises palladium, the palladium dopant can be introduced into the nickel ink or composition forming the internal electrode layers. This can eliminate the palladium activation step. It should also be noted that some of the above activation methods, such as organometallic precursors, are also suitable for the co-deposition of glass formers for enhanced adhesion to the generally ceramic body of the capacitor.When activation steps are undertaken as described above, traces of the activator material may often remain on the exposed conductive parts before and after the terminals are metallized.

[0148] In addition, post-treatment steps can also be used after metallization if desired or necessary. Such steps can be performed for a variety of purposes, including strengthening and / or improving the adhesion of the materials. For example, a heating (or annealing) step can be used after the metallization step. This heating can be achieved by baking, laser irradiation, UV exposure, microwave exposure, arc welding, etc.

[0149] As stated, the external terminal may comprise at least one metallization layer. In one embodiment, the external terminal may comprise only a single metallization layer. However, it should be understood that the external terminals may also comprise a plurality of metallization layers. For example, the external terminals may comprise a first metallization layer and a second metallization layer. Furthermore, the external terminals may also comprise a third metallization layer. Furthermore, the materials for these metallization layers may be any of those mentioned above and those generally known in the art.

[0150] For example, a metallization layer, such as a first metallization layer, may comprise copper or an alloy thereof. Another metallization layer, such as a second metallization layer, may comprise nickel or an alloy thereof. Alternatively, another metallization layer, such as the second metallization layer, may comprise copper or an alloy thereof. Another metallization layer, such as a third metallization layer, may comprise tin, lead, gold, or a combination thereof, such as an alloy. Alternatively, an initial metallization layer may also comprise nickel, followed by metallization layers of tin or gold. In another embodiment, an initial metallization layer of copper and then a nickel layer may be formed.

[0151] In one embodiment, the initial or first metallization layer may consist of a conductive metal (e.g., copper). This region may be covered with a second layer containing a polymeric resistive material for sealing. The region may then be polished to selectively remove polymeric resistive material and then re-metallized with a third layer containing a conductive metallic material (e.g., copper).

[0152] The above-mentioned second layer above the initial metallization layer may correspond to a solder barrier layer, for example, a nickel solder barrier layer. In some embodiments, the above-mentioned layer may be formed by electroplating an additional layer of metal (e.g., nickel or copper) over an electrolessly deposited or electroplated initial layer (e.g., deposited copper). Other exemplary materials for the above-mentioned solder barrier layer are nickel-phosphorus, gold, and silver. A third layer on the above-mentioned solder barrier layer may, in some embodiments, correspond to a conductive layer, such as deposited Ni, Ni / Cr, Ag, Pd, Sn, Pb / Sn, or another suitable deposited solder metal.

[0153] Additionally, a metallization layer may be formed, followed by an electroplating step to obtain a resistive alloy or a coating of a higher-resistivity metal alloy, such as an electroless Ni-P alloy, over such metallization. However, it should be understood that any metal coating may be used, as will be understood by those skilled in the art from the full disclosure herein.

[0154] It should be noted that each of the above steps can be performed as a volume process, such as drum metallization, fluidized bed metallization, and / or flow metallization termination methods, all of which are well known in the art. Such volume processes allow multiple components to be processed at once, resulting in an efficient and rapid termination process. This is a particular advantage over conventional termination methods, such as thick-film termination printing, which require individual processing of components.

[0155] As described here, the formation of the external terminals is generally guided by the position of the exposed leading edges of the terminal tabs of the internal electrode layers. Such phenomena can be described as "self-determining," since the formation of the external metallized terminals is determined by the configuration of the exposed conductive metal of the internal electrode layers at the selected peripheral locations on the capacitor.

[0156] Additional aspects of the above-described technique for forming thin-film metallized terminals are described in U.S. Patent Nos. 7,177,137 (Ritter et al.) and 7,463,474 (Ritter et al.), which are incorporated herein by reference for all purposes. It should be understood that additional methods for forming capacitor terminals may also be within the scope of the present technique. Exemplary alternatives include, but are not limited to, forming terminals by metallization, magnetism, masking, electrophoresis / electrostatics, sputtering, vacuum deposition, printing, or other methods for forming both thick-film and thin-film conductive layers.

[0157] Furthermore, the capacitor can then be subjected to a solder mask. For example, this can enable coating of the capacitor. Without wishing to be bound, such a mask can help prevent oxidation of the metallization layers, such as the copper plating layer, particularly if this layer is the final metallization layer of the external terminal. Such solder mask material is not necessarily limited by the present invention. For example, this material can comprise any of those mentioned above with respect to the solder barrier layer. Additionally or alternatively, this material can also comprise an epoxy resin, such as a liquid epoxy resin, which is then cured.

[0158] When such a material is provided on the capacitor, it may be necessary to gain access to the metallization layer and the external terminal to form an electrical connection. In this regard, a laser can be used to create a hole through the mask layer. This hole can then be filled with a conductive material, such as copper. This can then be used to form an electrical connection to the capacitor.

[0159] If we focus on the Fig. 3 and Fig. 4, the capacitor as disclosed herein may be mounted using various methods. For example, the capacitor may be mounted on a printed circuit board including a substrate (e.g., insulating layer) having a top surface and a bottom surface. When we refer to Fig. 3, a capacitor 10 as shown in Fig. 1A, the capacitor 10 may be mounted on a circuit board 350 having a top surface 352 and a bottom surface 354. The circuit board 350 has a plurality of electrical traces defined therein. The external terminals 12, 14 of the capacitor 10 are in respective electrical communication with the predetermined traces of the circuit board 350. Additionally, the external terminals 12, 14 of the capacitor 10 may be physically connected to the circuit board 350 using any method well known in the art, such as general soldering techniques. It should be noted that the capacitor 10 is used only as an example; in other embodiments, the capacitor 10 may be mounted on a mounting surface, such as a circuit board 350.

[0160] As in Fig. 4, a package of an integrated circuit 460 may also be provided on a circuit board 450. The package of the integrated circuit 460 may be connected to the circuit board 450 using a ball grid array 462. The circuit board may further include a processor 464. The processor 464 may also be connected to the circuit board 460 using a ball grid array 466.

[0161] In general, the ball grid array 462 may be configured such that the pitch is 1.5 mm or less, for example 1.25 mm or less, for example 1 mm or less, for example 0.8 mm or less, for example 0.6 mm or less, and 0.4 mm or more, for example 0.5 mm or more, for example 0.6 mm or more.

[0162] Additionally, the package of the integrated circuit 460 may also be connected to the circuit board 450 using a capacitor as defined herein. In this regard, the internal electrode layers of the capacitor 10 / 20 may be positioned so as to be perpendicular to a horizontal plane of the circuit board 450 and the integrated circuit package 460. In other words, the internal electrode layers of the capacitor 10 / 20 may be positioned so as to be substantially non-parallel to the circuit board 450. For example, the capacitor 10 / 20 may be positioned between the integrated circuit package 460 and the circuit board 450 such that the capacitor 10 / 20 is sandwiched between the two components. In this regard, the capacitor 10 / 20 is directly connected to the integrated circuit package 460 and the circuit board 450.For example, capacitor 10 / 20 may be connected (e.g., physically and / or electrically) to circuit board 450 and / or to a circuit package 460 using any method well known in the art, such as general soldering techniques.

[0163] By using the capacitor in the above arrangement, the capacitor 10 / 20 can allow the removal of some of the original ball grid array 462. However, the capacitor 10 / 20 can still be surrounded by a ball grid array 462, as shown in Fig. 4 is shown.

[0164] Thus, as in Fig.4, the capacitor 10 / 20 of the present invention may be directly connected to an integrated circuit package 460 and a circuit board 450, such as a printed circuit board. This direct connection allows current 468 to flow through the capacitor, thus establishing a direct power-to-ground connection.

[0165] Furthermore, although not shown here, in one embodiment, the package of the integrated circuit itself may include the multilayer capacitor. In this regard, the capacitor may be embedded directly within the package. This embedding of the capacitor may enable a reduction in size, which may be beneficial for various electronic applications.

[0166] While the above provides only one example of a method for mounting the capacitor disclosed herein, it should be understood that other methods may also be used. For example, the capacitor may be mounted using a land grid array configuration. The capacitor may also be embedded in another substrate or component.

[0167] In the embodiments described above, the internal electrode layers are oriented substantially in a vertical configuration. For example, an internal electrode layer may have a length perpendicular to a direction along which one or more tabs extend to assist in forming the external terminals. As another example, the one or more tabs extend from a main body of an internal electrode layer along a direction perpendicular to a surface on which the capacitor is mounted or to a substrate in which the capacitor is embedded. However, in some embodiments, it may be suitable to use other geometric configurations, such as a horizontal configuration.

[0168] These and other modifications and variations of the present invention may be practiced by those skilled in the art without departing from the spirit and scope of the present invention. Furthermore, it should be understood that aspects of the various embodiments may be substituted for one another, in whole or in part. Furthermore, those skilled in the art will appreciate that the above description is merely exemplary and is not intended to limit the invention, which is particularly described in the appended claims. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] US 63 / 420,724

[0001] US 7,177,137

[0156]

Claims

[1] Multilayer capacitor comprising: a body having a length extending in a longitudinal direction, a width extending in a lateral direction, and a height extending in a vertical direction, the body including alternating dielectric layers and internal electrode layers, the internal electrode layers comprising first internal electrode layers and second internal electrode layers, each internal electrode layer comprising: a first electrode having a main body defined by a longitudinally extending upper edge, a lower edge opposite the upper edge in the vertical direction and extending in the longitudinal direction, and two side edges extending in the vertical direction between the upper edge and the lower edge, wherein at least one connection tab extends away from the upper edge of the main body, wherein the at least one connection tab extends away from the upper edge along the height direction, wherein the at least one connection tab extends away from the upper edge, which has a front edge extending along the longitudinal direction and spaced apart from the main body along the height direction, wherein at least one connection tab extends away from the lower edge of the main body, the at least one connection tab extends away from the lower edge along the height direction, the at least one connection tab extends away from the lower edge, which has a front edge extending along the longitudinal direction and spaced apart from the main body along the height direction, and a second electrode coplanar with the first electrode; and external terminals that are electrically connected to the internal electrode layers, wherein the external terminals comprise a first external terminal and a second external terminal, wherein each of the first external terminal and the second external terminal is formed on an upper surface of the multilayer capacitor, a lower surface of the multilayer capacitor opposite to the upper surface of the multilayer capacitor along the height direction, and an end surface extending between the upper surface and the lower surface, wherein the first external terminal is electrically connected to the first electrode of the first internal electrode layers along the front edge of the at least one terminal tab extending from the upper edge and the front edge of the at least one terminal tab extending from the lower edge, and the first external terminal is also electrically connected to the second electrode of the second internal electrode layers, and wherein the second external terminal is electrically connected to the second electrode of the first internal electrode layers and the first electrode of the second internal electrode layers along the front edge of the at least one terminal tab extending from the upper edge and the front edge of the at least one terminal tab extending from the lower edge. [2] A multilayer capacitor according to claim 1, wherein the external terminals are linearly arranged on the upper surface and the lower surface of the body. [3] A multilayer capacitor according to claim 2, wherein the body has a pair of side surfaces opposite each other along a lateral direction, and wherein the external terminals are spaced from the side surfaces of the body such that only dielectric material is disposed between the external terminals and the side surfaces of the body. [4] The multilayer capacitor according to claim 1, wherein the second electrode has a substantially rectangular configuration. [5] A multilayer capacitor according to claim 1, wherein the second electrode has a substantially C-shaped configuration. [6] A multilayer capacitor according to claim 1, wherein the second electrode has a substantially L-shaped configuration. [7] A multilayer capacitor according to claim 1, wherein the main body of the first electrode extends from 40% to less than 100% of the length of the body of the capacitor. [8] A multilayer capacitor according to claim 7, wherein the main body extends from 50% to less than 100% of the length of the body of the capacitor. [9] A multilayer capacitor according to claim 1, wherein a gap is provided between the first electrode and the second electrode. [10] A multilayer capacitor according to claim 9, wherein the gap measures 2% to 40% of the length of the body of the capacitor. [11] A multilayer capacitor according to claim 9, wherein the gap measures 5% to 40% of the length of the main body of the first electrode. [12] A multilayer capacitor according to claim 1, wherein the second electrode extends from 5% to 50% of the length of the body of the capacitor. [13] A multilayer capacitor according to claim 1, wherein the first internal electrode layer and the second internal electrode layer are interlocked in an opposite position, and a dielectric layer is provided between the first internal electrode layer and the second internal electrode layer. [14] A multilayer capacitor according to claim 13, wherein the dielectric layers comprise a ceramic. [15] The multilayer capacitor according to claim 1, wherein the at least one terminal tab extending from the upper edge of the main body and the at least one terminal tab extending from the lower edge of the main body comprise a lateral edge oriented like a lateral edge of the main body. [16] A multilayer capacitor according to claim 1, wherein each internal electrode layer comprises at least two terminal tabs extending from the top edge, the bottom edge, or both the top edge and the bottom edge, the two terminal tabs comprising a first terminal tab and a second terminal tab. [17] A multilayer capacitor according to claim 1, wherein at least one lateral edge of the terminal tab at the upper edge is substantially aligned with at least one lateral edge of the terminal tab at the lower edge. [18] A multilayer capacitor according to claim 1, wherein both lateral edges of the terminal tab at the upper edge are substantially aligned with both lateral edges of the terminal tab at the lower edge. [19] A multilayer capacitor according to claim 16, wherein at least one lateral edge of the first terminal tab and at least one lateral edge of the second terminal tab at an upper edge are substantially aligned with at least one lateral edge of the first terminal tab and at least one lateral edge of the second terminal tab at an upper edge, respectively. [20] The multilayer capacitor according to claim 16, wherein both lateral edges of the first terminal tab and both lateral edges of the second terminal tab at an upper edge are substantially aligned with both lateral edges of the first terminal tab and both lateral edges of the second terminal tab at the upper edge. [21] A multilayer capacitor according to claim 1, wherein the internal electrode layers comprise a conductive metal. [22] A multilayer capacitor according to claim 1, wherein the external terminals comprise a plating layer. [23] A multilayer capacitor according to claim 1, wherein the external terminals comprise a layer deposited by electroless plating. [24] A multilayer capacitor according to claim 1, wherein the external terminals comprise an electroless plating layer and a plating layer. [25] A multilayer capacitor according to claim 1, wherein the external terminals comprise a first electroless plating layer, a second plating layer, and a third plating layer. [26] A multilayer capacitor according to claim 25, wherein the first electroless plating layer comprises copper, the second plating layer comprises nickel, and the third plating layer comprises tin. [27] A multilayer capacitor according to claim 1, wherein the capacitor comprises at least three sets of alternating dielectric layers and internal electrode layers. [28] A printed circuit board comprising the multilayer capacitor according to claim 1 located on the printed circuit board. [29] The circuit board of claim 28, wherein the board further comprises an integrated circuit package, and wherein the multilayer capacitor is located between the circuit board and the integrated circuit package in a vertical direction such that the circuit board, the multilayer capacitor, and the integrated circuit package are in a stacked arrangement. [30] The circuit board of claim 29, wherein the multilayer capacitor is directly connected to the circuit board and the integrated circuit package. [31] An integrated circuit package containing the multilayer capacitor according to claim 1.

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