ELECTRONIC COMPONENT, ELECTRICAL DEVICE, BUSBAR, METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING AN ELECTRICAL DEVICE

Abstract

An electronic component (100) comprises a main body (110) and a busbar (120). The main body (110) contains an electronic element (111). The busbar (120) is electrically connected to the electronic element (111). The busbar (120) contains a hole (121). The hole (121) opens onto a contact surface (122). An uneven area (122a) is formed on the contact surface (122). The uneven area (122a) has an uneven structure (123) around the hole (121).

Description

TECHNICAL AREA

[0001] The present invention relates to an electronic component, an electrical device, a busbar, a method for manufacturing the electronic component and a method for manufacturing the electrical device. TECHNICAL BACKGROUND

[0002] There are electronic components that have busbars and are electrically connected to other conductive elements (hereinafter also referred to as contacting elements) through the busbars. With regard to such a technology, patent document 1 below discloses a switching device (1) having an input busbar (30) and an output busbar (40). It also describes that a nickel plating layer (37) is provided on a surface of the input busbar (30). Mounting terminals (101A, 101B) connected to cable harnesses (100A, 100B) coupled to a battery are attached to these busbars (30, 40).In particular, bolts (110A, 110B) are inserted into through holes provided in the busbars (30, 40), and nuts (113A, 113B) are attached to the tips of the bolts (110A, 110B), thereby securing the busbars (30, 40) to the mounting terminals (101A, 101B). CITATION LIST PATENT DOCUMENT

[0003] PATENT DOCUMENT 1: JP 2015 - 139289 A SUMMARY OF THE INVENTION TASK TO BE SOLVED BY THE INVENTION

[0004] The electronic component and the contacted element (the mounting terminals (101A, 101B) in patent document 1) are electrically connected by being in contact with each other. If the electrical contact resistance at the contact surface is high, at least one of the following problems occurs: the current flowing through the electronic component and the contacted element decreases, and elements near the contact surface can deform due to heat generation.

[0005] The present invention was developed taking into account the above problems and provides an electronic component, an electronic device, a busbar, a method for manufacturing an electronic component and a method for manufacturing an electronic device in which current losses are reduced. MEANS OF SOLVING THE TASK

[0006] The present invention provides an electronic component comprising a main body containing an electronic element and a busbar electrically connected to the electronic element, wherein the busbar has a hole and an uneven area having an uneven structure is formed around the hole at a contact surface into which the hole opens.

[0007] The present invention further provides an electrical device comprising an electronic component with a main body containing an electronic element and a busbar electrically connected to the electronic element, as well as a second busbar in contact with the first busbar, wherein the busbar has a hole and an uneven area with an uneven structure is formed around the hole at a contact surface into which the hole opens, wherein the second busbar is in contact with the contact surface at a surface facing the contact surface and upper sections projecting as front ends in the uneven structure are pressed into the second busbar.

[0008] The present invention further provides a conductive busbar with a hole, wherein an uneven area with an uneven structure is formed around the hole at a contact surface into which the hole opens.

[0009] The present invention further provides a method for manufacturing an electronic component comprising a main body containing an electronic element and a busbar electrically connected to the electronic element, wherein the method comprises: a forming step for forming a hole in a hole forming area; and an embossing step for pressing a pressing element against the hole or a circumference of the hole forming area to form an uneven structure around the hole or in the hole forming area.

[0010] The present invention further provides a method for manufacturing an electrical device comprising an electronic component with a main body containing an electronic element and a busbar electrically connected to the electronic element, as well as a second busbar in contact with the busbar, wherein the busbar includes a hole, wherein an uneven area with an uneven structure is formed around the hole at a contact surface into which the hole opens, wherein the busbar and the second busbar are arranged such that the contact surface faces an adjacent surface of the second busbar, and wherein the method comprises a step in which the contact surface and the adjacent surface are pressed together so that part of the uneven structure is pressed into the second busbar. EFFECTS OF THE INVENTION

[0011] According to an electronic component of the present invention, the uneven structure can engage with a contacted element that is in contact with the busbar and can come into contact with the busbar because the busbar has an uneven structure. This allows the contact area between the busbar and the contacted element to be increased, and the busbar can engage with and be pressed against the contacted element, thereby reducing the contact resistance and preventing current losses. BRIEF DESCRIPTION OF THE FIGURES

[0012] The above tasks, as well as other tasks, features and advantages, will become clearer from the following preferred embodiments and the accompanying drawings. Fig. Figure 1A is a perspective view showing an example of an electronic component according to a first embodiment of the present invention. Fig. 1B is a front view of a first busbar. Fig. 2A is a cross-sectional view along a [path / section] in Fig. 1B shown dashed line of the electronic component according to the first embodiment, seen in the direction of arrow II-II. Fig. 2B is an enlarged view of an area X in Fig. 2A. Fig. Figure 3A is a schematic diagram of an electronic device according to the first embodiment. Fig. 3B is a schematic diagram of a joined section in which a first busbar and a second busbar are joined together. Fig. 3C is a schematic enlarged cross-sectional view showing how a second busbar was joined to a circumferential edge section of a first busbar. Fig. 4A is a diagram showing an example of values ​​for the electrical contact resistance of a first busbar with an uneven structure and a busbar without an uneven structure. Fig. Figure 4B is a diagram showing an example of values ​​for the electrical contact resistance of a first busbar with an oxide film and a busbar without an oxide film. Fig. Figure 5A is a perspective view showing an example of an electronic component according to a second embodiment of the present invention. Fig. 5B is a front view of a first busbar. Fig. 6A is a cross-sectional view along a [path / section] in Fig. 5B shown dashed line of the electronic component according to the second embodiment, viewed in the direction of arrow VV. Fig. 6B is an enlarged view of an area Z in Fig. 6A. Fig. 6C is an enlarged view of a region Y in Fig. 6A. Fig. Figure 7A is a schematic enlarged cross-sectional view showing how a second busbar was joined to an outer circumferential edge section of a first busbar in the electronic component according to the second embodiment. Fig. Figure 7B is a schematic enlarged cross-sectional view showing how a second busbar was joined to an inner circumferential edge section of a first busbar. DESCRIPTION OF THE EXECUTION FORMS

[0013] The various components of an electronic component, an electrical device, and a busbar according to the present invention need not be independent of one another. Various components are possible; for example, an element can be formed from several components, a component can be formed from several elements, a component can be part of another component, or a part of a component can be duplicated as part of another component.

[0014] In a manufacturing process for an electronic component or electronic device of the present invention, several steps are described sequentially; however, the order of the step descriptions does not restrict the sequence or timing for carrying out the steps. Therefore, when the manufacturing process for the electronic component or electronic device of the present invention is carried out, the sequence of the several steps can be changed without altering the content, and it is also possible for some or all of the steps to overlap.

[0015] The following describes embodiments of the present invention with reference to the drawings. Identical components in the drawings are identified by the same reference numerals and are not described twice if necessary.

[0016] In the present embodiment, an x-direction, a y-direction, and a z-direction are defined as shown in the drawings. However, these are defined solely for illustrative purposes to more easily describe the relative relationships between components and do not restrict the directions during the manufacture or use of the product embodying the present invention.

[0017] Furthermore, the term "flat surface" as used here means a shape that is physically formed with a flat surface as its goal, and it is not absolutely necessary that the surface be a geometrically perfect flat surface. <Erste Ausführungsform> Electronic component

[0018] Fig. Figure 1A is a perspective view showing an example of an electronic component 100 according to a first embodiment of the present invention.

[0019] First, an overview of the electronic component 100 according to the present embodiment is described.

[0020] The electronic component 100 comprises a main body 110 and a busbar (a first busbar 120). The main body 110 contains an electronic element 111. The first busbar 120 is electrically connected to the electronic element 111. The first busbar 120 contains a hole 121. In a contact surface 122, where the hole 121 opens, an uneven area 122a is formed, the uneven area having an uneven structure 123 (see Fig. 1B) around hole 121.

[0021] Since the first busbar 120 the uneven structure 123 (see Fig. 1B), the uneven structure 123 can be incorporated into a contacted element (a second busbar 200 (see Fig. 3A), which is described below), engages, coming into contact with the first busbar 120, thereby bringing the first busbar 120 into contact with the second busbar 200. Thus, the contact area between the first busbar 120 and the contacted element is larger than in the case where a busbar, which does not have an uneven structure 123 but rather a flat contact surface, rests against or is pressed against the contacted element. Furthermore, the first busbar 120 can engage with the contacted element and be pressed against it, and the first busbar 120 and the contacted element can be connected to each other due to the pressure exerted on their surfaces. This reduces the contact resistance and prevents current losses.

[0022] Next, the electronic component 100 according to the present embodiment will be described in detail.

[0023] Electronic component 100 refers to a section containing electronic element 111, which forms an electronic circuit. More precisely, electronic component 100 refers to a structural element that can be connected to or detached from the contacted element. Electronic element 111 is a structural element within electronic component 100 and is a part containing a core or coil that is part of an electronic circuit. The main function of electronic component 100 is determined by electronic element 111. Electronic element 111 can contain a core or coil, and electronic component 100 as a whole can be a coil component, such as an inverter, an inductor, a transformer, or an antenna.In the present embodiment, the electronic component 100 is a vehicle-integrated electronic component that forms an electrical device mounted on the body of an automobile. More specifically, an example of the electrical device is a battery device, such as a lithium-ion battery or a solid-state battery, mounted on an electric vehicle. The electronic component 100 can be a suitable choke connected to an electrical device, which is a vehicle-integrated battery device, with a current being applied to the choke during charging or discharging.

[0024] The main body 110 is part of the electronic component 100 and contains the electronic element 111. The main body 110 preferably contains the electronic element 111 within its interior. The entire main body 110 can be formed from or covered with plastic or the like. In the present embodiment, the main body 110 is a shape in which one longitudinal direction is an x-axis direction; however, the main body 110 can have any shape.

[0025] The busbar is formed from a conductive material such as a copper-containing metal. Preferably, the busbar has a cross-sectional area (a cross-section cut horizontally with respect to the contact surface 122 described below) that is larger than that of a wire and has an overall shape that is essentially rod-like or plate-like. In the present embodiment, the electronic component 100 or an electrical device 1, which is described below, includes the first busbar 120 or the second busbar 200 as the busbar. Hereinafter, the term "longitudinal direction" of the busbar may refer to a direction in which the busbar has its largest dimension, i.e., a height direction, a width direction, or a thickness direction of the busbar. In the present embodiment, the longitudinal direction of the first busbar 120 and the second busbar 200 (see Fig. 3A) the z-axis direction. In the present embodiment, the cross-section of the first busbar 120 is a cross-section cut horizontally with respect to the contact surface 122; in other words, a cross-section cut vertically to a plate thickness direction (y-direction) of the first busbar 120. The cross-section of the busbar can have a polygonal shape, such as a rectangular shape, or it can have a circular or elliptical shape.

[0026] The first busbar 120 is an element that electrically connects the contacted element, which is connected to the electronic component 100, to the electronic element 111. In the present embodiment, a part at the bottom end (in the -z direction) of the first busbar 120 is embedded in the interior of the main body 110, and another part at the front end (z direction) projects outwards from the main body 110. As shown in Fig. As shown in Figure 1B, an outer edge of the front end of the first busbar 120 extends semicircularly along a circumferential wall surface 121b, which defines the hole 121 to be described below. In the present embodiment, as shown in Fig. As shown in Figure 1A, the first busbar 120 is electrically connected to the electronic element 111 inside the main body 110.

[0027] In the present embodiment, the electronic component 100 includes a first busbar 120, but the electronic component 100 can also include several first busbars 120.

[0028] The hole 121 of the first busbar 120 is a hole into which a shaft element 140 (see Fig. 3A), which is described below. The hole 121 can be a through hole, as in the present embodiment, but can also be a concave section with a bottom. The hole 121 is defined by the circumferential wall surface 121b, which is also part of the outer surface of the first busbar 120. A penetration direction or depth direction (hereinafter collectively referred to as the penetration direction, here the y-axis direction) of the hole 121 is preferably a direction orthogonal to the longitudinal direction (z-axis direction) of the first busbar 120. More precisely, as in Fig. 3B shows the penetration direction of the hole 121 preferably a direction equal to the direction (y-axis direction) along which the first busbar 120 and the contact element (second busbar 200) are located (see e.g. Fig. 3A)), which comes into contact with the first busbar 120, are arranged side by side.

[0029] As in Fig. As shown in Figure 1B, in the present embodiment the shape of the hole 121, viewed in the direction of penetration, is circular, but is not limited to this. The shape of the hole can also be a polygonal shape, such as a rectangular shape, or it can be an elliptical shape other than a circle. The shape and dimensions in the direction of penetration of the hole 121 are preferably sufficient so that the shaft element 140 (see Figure 1B) Fig. 3A) can be used in it. In other words, as in Fig. As shown in Figure 3B and described below, a gap is preferably provided between the circumferential wall surface 121b of the hole 121 and a circumferential surface of the shaft element 140 when the shaft element 140 is inserted into the hole 121. More precisely, if the hole 121 is circular when viewed in the direction of penetration and a cross-section of the shaft element 140 is circular, the radius of the hole 121 is preferably larger than the radius of the cross-section of the shaft element 140 (in particular, a shaft section 142).

[0030] As in Fig. As shown in Figure 1B, the hole 121 opens at least into the contact surface 122. If the hole 121 is a through hole, it opens into the contact surface 122 and into a rear surface (a surface pointing in the -y direction of the first busbar 120) located on a side opposite the contact surface 122. The contact surface 122 is a sub-area of ​​the outer surface of the first busbar 120. The contact surface 122 is a sub-area that is in contact with the contacted element (for example, the second busbar 200), or a sub-area that is to be brought into contact with the contacted element later.The contact area 122 can be formed exclusively by a surface area that is in contact with the contacted element or is to be brought into contact with the contacted element later, but can also include surface areas around this surface area that are not in contact with the contacted element and are not to be brought into contact with the contacted element later.

[0031] The uneven area 122a is a sub-area of ​​the contact surface 122 and refers to a surface area in which the uneven structure 123 is formed. In other words, the uneven area 122a is an area whose unevenness is greater than that of another area (for example, an outer circumferential section 122b) that borders the outside of the uneven area 122a. The uneven area 122a is a flat area that extends approximately in the same direction as the contact surface 122.

[0032] The fact that the uneven area 122a is formed around the hole 121 means that the uneven area 122a is formed on a portion of the contact surface 122 near the hole 121. More precisely, the shortest distance along the contact surface 122 between the hole 121 and the uneven area 122a (a distance between the circumferential wall surface 121b of the hole 121 and the circumferential edge of the uneven area 122a, viewed in the direction of penetration of the hole 121) is preferably smaller than the dimension of an overhang of a shaft head section 141, which is described below. Here, the dimension of the overhang of the shaft head section 141 specifies a height of an outer circumferential edge of the shaft head section 141 relative to the circumferential surface of the shaft section 142. Furthermore, the distance is preferably smaller than the radius of the hole 121. Even more preferably, the distance is zero.When the uneven area 122a is arranged around the hole 121 in this way, the shaft element 140 (in particular the shaft head section 141) can apply sufficient tension to press or fit the uneven structure 123, which is described below, into the contact element (for example, the second busbar 200).

[0033] In the present embodiment, the uneven area 122a is configured to completely surround the circumference of the hole 121. In other words, the uneven area 122a extends radially around the hole 121 in all directions. Here, the radial direction of the hole 121 is a direction extending from an axial center passing through the center of the hole 121 and in the direction of penetration of the hole 121 to the circumferential wall surface 121b that defines the hole 121. Alternatively, the uneven area 122a can be configured only on a portion of the outer surface in the radial direction of the hole 121.

[0034] The uneven area 122a is a partial area of ​​a surface (oriented in the y-direction) that encloses the contact surface 122 on the outer surface of the first busbar 120. In other words, viewed from the contact surface 122, part or all of the outer circumferential edge of the uneven area 122a is preferably located further inward than the outer circumferential edge of the first busbar 120. In the present embodiment, as shown in Fig. 1B shows a part of the outer circumferential edge of the uneven area 122a, which is located at the bottom end (in the drawing a part on a bottom side), further inwards than the outer circumferential edge of the first busbar 120.

[0035] Additionally, if the first busbar 120 is connected to the second busbar 200, which is described below, the uneven area 122a can be formed in a portion of the y-directed surface that overlaps the second busbar 200 as seen in the direction of penetration of the hole 121 (hereinafter also referred to as the overlap section). The outer circumferential edge of the uneven area 122a can be located outside or inside the overlap section as seen in the direction of penetration of the hole 121.

[0036] The uneven structure 123 is a structure with several concave or convex sections. As described above, the uneven region 122a as a whole exhibits the uneven structure 123 and thus has a rough surface with a greater surface roughness than a surrounding region of the uneven region 122a (for example, the outer circumferential section 122b, which is described below).

[0037] Here, the concave sections in the uneven structure 123 are sections arranged on an inward-facing side of the projections on the first busbar 120 in the uneven area, and the convex sections of the uneven structure 123 are sections arranged on an outward-facing side of the projections of the first busbar 120 in the uneven area 122a. Here, the "inward-facing side" refers to a direction from the outer surface of the first busbar toward its interior, and the "outward-facing side" refers to a direction from the interior of the first busbar toward its outer surface.

[0038] As in Fig. As shown in Figure 1B, the uneven structure 123 of the present embodiment is formed by at least two concave grooves 123a with a bottom, arranged side by side. Each concave groove 123a is defined by a bottom section (bottom section 123a1 of the concave groove (see Figure 1B)). Fig. 2B)) and a pair of wall sections (wall section 123a2 of the concave groove (see Fig. 2B)) defined, flanking the bottom section 123a1 of the concave groove. Here, "concave grooves 123a" means that the concave grooves 123a are arranged side by side, that the concave grooves 123a extend in the same direction, and that the concave grooves 123a are preferably substantially parallel to each other. The direction in which the concave grooves 123a extend can be linear, as in the present embodiment, but can also be undulating. Alternatively, the multiple concave grooves 123a can also have concentric circular shapes with different radii. In other words, the direction in which the concave grooves 123a extend can be circular. Even if the concave grooves 123a are undulating or circular, the concave grooves 123a that are arranged side by side are preferably arranged side by side.

[0039] In the present embodiment, as in Fig. As shown in Figure 1B, the multiple concave grooves 123a, which are essentially linear in shape, extend in the longitudinal direction (z-axis direction) of the first busbar 120. Furthermore, the multiple concave grooves 123a are arranged continuously along the direction (x-axis direction) orthogonal to the longitudinal direction. As shown in Fig. As shown in Figure 3A, in the present embodiment the first busbar 120 and the second busbar 200 are arranged side by side in the longitudinal direction (z-axis direction) of the first busbar 120, while partially overlapping and contacting each other in the y-axis direction. The concave grooves 123a, which extend in the longitudinal direction of the first busbar 120, are arranged along a direction orthogonal to the longitudinal direction, so that the contact surface between the first busbar 120 and the second busbar 200 is difficult to displace laterally in a direction that intersects the longitudinal direction. Alternatively to the present embodiment, the concave grooves 123a can also extend in a direction orthogonal to the longitudinal direction of the first busbar 120, with the multiple concave grooves 123a being arranged side by side along the longitudinal direction.

[0040] In comparison to the concave groove 123a, which is in Fig. 2B and Fig. Figure 3C shows the widths of the bottom sections 123a1 and the upper sections 123b of the concave grooves 123a, as well as an inclination angle of the wall sections 123a2 of the concave grooves. Fig. 1A, Fig. 1B and Fig. 2A is shown in a modified form for illustrative purposes.

[0041] In the present embodiment, the uneven structure 123 is formed by the several concave grooves 123a, but alternatively to the present embodiment, the uneven structure 123 can also be formed by several point-by-point or isolated projecting sections (for example, projecting sections with a conical or pyramidal shape).

[0042] As in Fig. As shown in Figure 2B, the uneven structure 123 of the present embodiment can include several projecting sections 123e. The projecting sections 123e are sections that project from the inward-facing side to the outward-facing side of the first busbar 120 and form part of the first busbar 120. In the present embodiment, the projecting sections 123e are parts of the first busbar 120 that are each arranged between a concave groove 123a and another concave groove 123a adjacent to the first concave groove 123a. More precisely, the projecting sections 123e are parts of the first busbar 120 that are defined by the wall sections 123a2 of the concave groove that define the concave groove 123a and the upper section 123b. In the present embodiment, the projecting sections 123e extend in a substantially linear direction along the concave grooves 123a.

[0043] The width of the projecting sections 123e preferably decreases along the projection direction of the uneven structure 123. Furthermore, the extent to which the projecting sections 123e project is preferably greater than the width of the projecting sections 123e (in particular, the width at the base of the projecting sections 123e). This makes it easier to press the projecting sections into the second busbar 200 in an assembly step described below. Hereinafter, the direction in which the uneven structure 123 projects is also simply referred to as the "projecting direction." The "lateral direction" of the projecting sections 123e refers to the direction orthogonal to the projection direction in which the dimension of the projecting sections 123e is smallest. The "lateral dimension" or "width" of the projecting sections 123e is the extent of the projecting sections 123e in the lateral direction.In the present embodiment, in which the uneven structure 123 is formed by the multiple concave grooves 123a arranged side by side, the “width dimension” of the projection sections 123e is the extent of the projection sections 123e in the direction along which the multiple concave grooves 123a are arranged side by side.

[0044] As in Fig. As shown in Figure 2B, in the present embodiment the upper section 123b, which is the front end projecting from the uneven structure 123, is flat. In other words, the upper section 123b has a predetermined width dimension.

[0045] The upper section 123b is a section arranged on the outward-facing side of the projections of the first busbar 120 in the uneven structure 123. In the present embodiment, the areas arranged between the multiple concave grooves 123a are the upper sections 123b, the upper sections 123b extending substantially in the same direction as the concave grooves 123a (namely, in the z-axis direction). The upper sections 123b have a predetermined width dimension in the direction along which the concave grooves 123a are arranged side by side (in the x-axis direction). If the uneven structure 123 is formed by point-like or isolated projection sections, the projecting ends of these projection sections are the upper sections 123b.

[0046] Here, "flat" means that the upper section 123b is planar or that the radius of curvature of the upper section 123b at a point located furthest outward on the projecting section is greater than half the width of the projecting section (in particular, greater than the width of the projecting front end). In other words, the upper section 123b can have a curved surface that is gently curved inward or outward with respect to the first busbar 120. Preferably, the radius of curvature of the upper section 123b is greater than the width of the projecting section. Even more preferably, the upper section 123b is planar.

[0047] As an alternative to the present embodiment, the upper section 123b can also have a shape that is pointed outwards with respect to the first busbar 120. In other words, the radius of curvature of the upper section 123b at the point located furthest outwards on the projecting section can also be less than half the width of the projecting section (in particular, less than the width of the projecting front end). If the upper section 123b is pointed, it can be more easily pressed into the second busbar 200 when the first busbar 120 and the second busbar 200 are pressed together.

[0048] If the upper section 123b is flat, it comes into surface contact with the surface of the second busbar 200 in a joining step described below, before being pressed into the second busbar 200. This prevents the upper section 123b from slipping on the second busbar 200. As a result, the first busbar 120 and the second busbar 200 can be continuously pressed against each other in a desired positional relationship. Furthermore, the upper sections 123b are pressed in a concentrated manner at predetermined positions on the surface of the second busbar 200, so that they can be easily pressed into these positions.

[0049] If the spacing between the concave grooves 123a is constant, it is possible to make the angle of inclination of the wall sections defining the concave grooves 123a (the wall sections 123a2 of the concave grooves described below) relative to the outer circumferential section 122b larger if the upper section 123b has some width, than if the upper section 123b has essentially no width and is pointed. This makes it easier to remove an oxide film covering the wall sections 123a2 of the concave grooves in the joining step described below.

[0050] The width of the upper sections 123b, each arranged between two concave grooves 123a, is greater than that of the bottom sections of the concave grooves 123a (the bottom sections 123a1 formed by the concave grooves). In the present embodiment, each upper section 123b has a predetermined width dimension in the direction along which the multiple concave grooves 123a are arranged side by side (in the x-axis direction). In the present embodiment, the bottom section 123a1 formed by the concave grooves has a predetermined width dimension in the direction along which the concave grooves 123a are arranged side by side (in the x-axis direction), but is not limited to this. The bottom section 123a1 formed by the concave grooves can be substantially straight, and the width of the bottom section 123a1 formed by the concave grooves can be substantially zero.In this case too, the width of the upper section 123b is greater than the width of the bottom section 123a1 defined by the concave grooves.

[0051] Since, as described above, the width of the upper sections 123b is greater than the width of the bottom sections 123a1 defined by the concave grooves, the width of the upper sections 123b is sufficiently ensured. Therefore, as mentioned above, misalignment between the first busbar 120 and the second busbar 200 is adequately prevented during the joining process.

[0052] In the joining step described below, the upper sections 123b are pressed into the second busbar 200, causing a portion of the material of the second busbar 200 to be forced out and raised around the upper sections 123b. Since the concave grooves 123a are deep, such that the width of the bottom section 123a1 defined by the concave grooves is sufficiently small, this portion of the second busbar 200 can penetrate towards the bottom section of the concave grooves 123a. This makes it easy to maintain a state in which the upper sections 123b are pressed into the second busbar 200. Furthermore, since the contact area between the second busbar 200 and the first busbar 120 increases as a portion of the second busbar 200 penetrates towards the bottom section of the concave grooves 123a, the contact resistance can be reduced.

[0053] Alternatively to the present embodiment, the width of the upper sections 123b can also be equal to or less than the width of the bottom section 123a1 given by the concave grooves.

[0054] Furthermore, the width of the upper sections 123b is preferably smaller than the width of the concave grooves 123a at the opening of the concave grooves 123a. If the width of the upper sections 123b is sufficiently small, the upper sections 123b can be easily pressed into the second busbar 200 in the joining step described below.

[0055] As in Fig. As shown in 1B, the contact area 122 also includes the outer circumferential section 122b, which is a section that borders the uneven area 122a outside the uneven area 122a.

[0056] The outer circumferential section 122b is a partial surface area adjacent to the uneven area 122a of the contact surface 122 and is an area in which the uneven structure 123 is not formed. In other words, the outer circumferential section 122b is an area whose surface is flatter than the uneven area 122a. Furthermore, the outer circumferential section 122b is an area located outside the uneven area 122a when viewed radially from the shaft element 140. For example, the outer circumferential section 122b is a partial surface area with a predetermined width along a portion of the outer edge of the uneven area 122a.In the present embodiment, in which the uneven area 122a is configured such that, viewed in the direction of penetration of the hole 121, it surrounds the circumference of the shaft element 140, the outer circumferential section 122b is a region configured such that, viewed in said direction of penetration, it surrounds the circumference of the uneven area 122a and has a predetermined width in the radial direction of the shaft element 140. In the present embodiment, the outer circumferential section 122b is a partial surface area located outside the uneven area 122a on the side facing the bottom end (in the -z direction) of the first busbar 120. In other words, the outer circumferential section 122b is a region located between the outer circumferential edge of the uneven area 122a and the area in the hole 121. Fig. The dashed-dotted line shown in Figure 1B is arranged as an alternative to the present embodiment. If the uneven area 122a is formed only in a portion in the radial direction of the hole 121, the outer circumferential section 122b can also be an area formed outside the uneven area 122a in that portion in the radial direction of the hole 121. The outer circumferential section 122b according to a second embodiment, which is described below, is a partial surface area that completely surrounds the outer circumferential edge of the uneven area 122a, as shown in Figure 1B. Fig. 5B shown.

[0057] As in Fig. As shown in Figure 2B, the upper sections 123b project further in the y-direction of the uneven structure 123 than the outer circumferential section 122b. In other words, each upper section 123b is positioned further outwards in the y-direction than the outer circumferential section 122b. Here, the y-direction of the uneven structure 123 is a direction from the height of the concave sections (the height of the concave groove bottom sections 123a1) to the height of the upper section 123b in the uneven structure 123. Of those directions that are orthogonal to the contact surface 122 (to the uneven area 122a), the y-direction coincides with the direction that points from the contact surface 122 to the outside of the first busbar 120 (i.e., the y-direction).

[0058] Since the upper section 123b projects further in the direction of the uneven structure 123 than the outer circumferential section 122b, the upper section 123b comes into contact with the second busbar 200 in the joining step described below before the outer circumferential section 122b comes into contact with the second busbar 200. This allows the upper section 123b to be easily pressed into the second busbar 200.

[0059] As an alternative to the present embodiment, the outer circumferential section 122b and the upper section 123b can also be arranged at the same level in the direction of projection of the uneven structure 123, or the outer circumferential section 122b can project further in the direction of projection of the uneven structure 123 than the upper section 123b. In this case, wear or abrasion of the convex sections of the uneven structure 123 can be avoided.

[0060] The first busbar 120 comprises a conductor section 125 and an oxide film 126. The oxide film 126 covers the conductor section 125. The conductor section 125 is a section of the first busbar 120 made of a material such as a copper-containing metal with good conductivity. The oxide film 126 is a thin film made of an oxide of the metal used for the conductor section 125 and is formed on a surface of the conductor section 125. The oxide film 126 is insulating or has a higher resistance than the conductor section 125. The oxide film 126 covers at least part of the conductor section 125. If the first busbar 120 is not connected to the second busbar 200, the oxide film 126 covers at least the entire contact area 122.If the first busbar 120 is not connected to the second busbar 200, then the thickness of the oxide film 126 is preferably approximately uniform over the entire surface of the first busbar 120. In the . Fig. 2B, Fig. 3C, Fig. 6B and Fig. 6C, the thickness of the oxide film 126 is shown larger than the actual thickness of the oxide film for illustrative purposes. busbar

[0061] The first busbar 120 can also be provided as a single busbar without the main body 110. As described above, the first busbar 120 is a conductor and contains the hole 121. In the contact surface 122, where the hole 121 is provided, the uneven area 122a, which has the uneven structure 123, is formed around the hole 121. Electronic device

[0062] The electronic component 100 of the present embodiment can be provided as an electrical device 1 containing the electronic component 100. The electrical device 1 contains the electronic component 100 and the second busbar (second busbar 200). As described above, the electronic component 100 includes the main body 110, which contains the electronic element 111, and the first busbar 120, which is electrically connected to the electronic element 111. The first busbar 120 contains the hole 121, and the uneven area 122a, which has the uneven structure 123, is formed around the hole 121 at the contact surface 122 where the hole 121 is provided.

[0063] The second busbar 200 is in contact with the first busbar 120. The second busbar 200 is in contact with contact surface 122 on an adjacent surface 210, which faces contact surface 122. As in Fig. As shown in Figure 3C, the upper sections 123b, which protrude in the uneven structure 123, are pressed into the second busbar 200.

[0064] Fig. Figure 3A is a schematic diagram showing an example of the electrical device 1. The electrical device 1 is a device containing the electronic component 100, and in the present embodiment, the electrical device 1 is vehicle-specific, i.e., provided in a vehicle. The electrical device 1 can be a self-contained electronic circuit or can also be electrically connected to another electrical device.

[0065] The second busbar 200 is a busbar that is electrically connected to the first busbar 120. The second busbar 200 can be a busbar used to connect to another electrical device that is electrically connected to the electrical device 1, or it can be a busbar used to connect to another electronic component contained in the electrical device 1. In the present embodiment, the second busbar 200 is a plate-shaped busbar. The direction of extension of the second busbar 200 is substantially the same as the direction of extension of the first busbar 120, with the first busbar 120 and the second busbar 200 being arranged substantially parallel to each other.As described above, the first busbar 120 and the second busbar 200 are arranged such that they partially overlap in the axial direction of the shaft element 140.

[0066] The facing surface 210 in the second busbar 200 refers to a partial area on the outer surface of the second busbar 200 and is an area that includes a section that is in contact with, or is intended to be brought into contact with, the first busbar 120. The facing surface 210 can include part or all of the area that is in contact with, or is intended to be brought into contact with, the first busbar 120. The facing surface 210 can also include a partial area that is located near an area that is in contact with, or is intended to be brought into contact with, the first busbar 120, but which is not in contact with, or is not intended to be brought into contact with, the first busbar 120.

[0067] The fact that a part (e.g., the upper sections 123b) of the first busbar 120 is pressed into the second busbar 200 means that this part is located within the outer contour of the second busbar 200. The outer contour of the second busbar 200 is a three-dimensional shape that includes the interior of large and small concave sections (not limited to the concave sections in the uneven structure 123) formed on the surface of the second busbar 200.

[0068] The portion of the first busbar 120 that is pressed into the second busbar 200 is not limited to the upper sections 123b. Preferably, not only the upper sections 123b, but also a portion at the front end of the wall sections 123a2 (on the side of the upper sections 123b) of the concave grooves are pressed into the second busbar 200. Even more preferably, as shown in Fig. As shown in Figure 3C, at least half of the wall sections 123a2 of the concave grooves are pressed into the second busbars 200. In other words, part of the lower side of the wall sections 123a2 of the concave grooves and the bottom sections 123a1 of the concave grooves are located outside the second busbar 200. As an alternative to the present embodiment, the wall sections 123a2 of the concave grooves can also be pressed into the second busbar 200 in their entirety. Furthermore, the parts that are pressed into the second busbar 200 (the upper sections 123b and part of the wall sections 123a2 of the concave grooves in the present embodiment) are in surface contact with the second busbar 200.

[0069] The upper sections 123b are pressed into the second busbar 200 in this way, thereby increasing the contact area between the second busbar 200 and the first busbar 120 compared to when the upper sections 123b are not pressed into the second busbar 200. This reduces the contact resistance at the contact surface between the second busbar 200 and the first busbar 120.

[0070] As in Fig. As shown in Figure 3C, the first busbar 120, even in the electrical device 1 in which the second busbar 200 is connected or joined to the first busbar 120, comprises the conductor section 125 and the oxide film 126. The oxide film 126 covers at least part of the conductor section 125. In the electrical device 1 in which the first busbar 120 and the second busbar 200 are connected or joined to each other, the area of ​​the conductor section 125 covered by the oxide film 126 differs from the area of ​​a conductor section 125 covered by the oxide film 126 in an electronic component 100 that is not connected or joined to a second busbar 200. More precisely, the outer circumferential section 122b is a covered section that is covered by the oxide film 126. On the other hand, at least part of the uneven structure 123 is an exposed section that is exposed from the oxide film 126.The exposed section is embedded in the second busbar 200.

[0071] The covered section is a partial area on the outer surface of the first busbar 120 where the oxide film 126 is formed and the conductor section 125 is not exposed. The exposed section is a partial area on the outer surface of the first busbar 120 where the oxide film 126 is not formed and the conductor section 125 is exposed. Part or all of the surface of the uneven structure 123 is an exposed section. In the present embodiment, only part of the surface of the uneven structure 123 is an exposed section, and the other part is a covered section.

[0072] The fact that the outer circumferential section 122b is a covered section means that at least part of the outer circumferential section 122b is a covered section. Preferably, substantially the entire outer circumferential section 122b is a covered section, as in the present embodiment.

[0073] As described in detail below, in the present embodiment the wall sections 123a2 of the concave grooves are exposed sections and the other remaining parts on the outer surface of the first busbar 120 are covered sections covered with the oxide film 126.

[0074] In the electrical device 1 of the present embodiment, in which the first busbar 120 and the second busbar 200 are connected to each other, at least a portion of the exposed sections of the first busbar 120 is pressed into the second busbar 200. In the present embodiment, substantially all of the exposed sections are pressed into the second busbar 200. The conductor section 125 of the first busbar 120 is in contact with the second busbar 200 at the exposed sections that are pressed into the second busbar 200.

[0075] Busbars are typically plated with a metal such as nickel to prevent oxide film formation, improve electrical contact, and protect the conductive section. Since part of the surface of the uneven structure 123 is an exposed section where the conductor section 125 is exposed, the first busbar 120 and the second busbar 200 come into contact at this exposed section and are electrically connected. This allows good conductivity to be maintained without metal plating, making it easier to manufacture the first busbar 120. Furthermore, the conductor section 125 is exposed in the uneven structure 123, which is electrically connected to the second busbar 200, and the outer surfaces of the other sections in the first busbar 120 are covered with the oxide film 126, thus protecting the conductor section 125 in these sections.

[0076] As in Fig. As shown in Figure 3C, the wall sections 123a2 of the concave grooves are arranged obliquely with respect to the outer circumferential section 122b. At least part of the wall sections 123a2 of the concave grooves are exposed sections that are in contact with the second busbar 200.

[0077] In the present embodiment, part of the wall sections 123a2 of the concave grooves on the side of the upper sections 123b are exposed sections, and part of the concave grooves on the side of the bottom section 123a1 are covered sections. However, the oxide film 126 can also remain locally on the part of the wall sections 123a2 of the concave grooves on the side of the upper sections 123b to form covered sections.

[0078] In the present embodiment, the first busbar 120 is in contact with the second busbar 200 at the upper sections 123b and the wall sections 123a2 of the concave grooves (in particular the part on the side of the upper sections 123b), but the bottom sections 123a1 of the concave grooves and the second busbar 200 are spaced apart from each other. In other words, a cavity is provided within the concave groove 123a near the bottom section 123a1 of the concave groove, the cavity being defined by the bottom section 123a1 of the concave groove, the wall sections 123a2 of the concave groove, and the second busbar 200. At least a portion of the bottom sections 123a1 of the concave grooves that are spaced apart from the second busbar 200 are covered sections.

[0079] As in Fig. As shown in Figure 2B, since the wall sections 123a2 of the concave grooves are arranged obliquely with respect to the outer circumferential section 122b, they are positioned obliquely opposite the thickness direction in which the second busbar 200 is pressed against the first busbar 120 in the joining step described below. Thus, the oxide film 126 on the wall sections 123a2 of the concave grooves is more easily wiped off by the second busbar 200 than if the wall sections 123a2 of the concave grooves were orthogonal to the outer circumferential section 122b (i.e., vertical) or parallel to the outer circumferential section 122b.

[0080] Furthermore, if the wall sections 123a2 of the concave grooves are inclined with respect to the outer circumferential section 122b, the contact area between the wall sections 123a2 of the concave grooves and the second busbar 200 is larger than if the wall sections 123a2 of the concave grooves are orthogonal to the outer circumferential section 122b or parallel to the outer circumferential section 122b, provided the upper sections 123b are inserted into the second busbar 200 at the same insertion depth. This reduces the contact resistance.

[0081] In the present embodiment, at least a portion of the upper sections 123b are covered sections. The thickness of the oxide film 126 on the upper sections 123b is preferably less than the thickness of the oxide film 126 on the bottom sections 123a1 formed by the concave grooves. This improves the electrical connection between the first busbar 120 and the second busbar 200 on the upper sections 123b. Alternatively, the upper sections 123b can all be exposed sections where the conductor section 125 is exposed.

[0082] As an alternative to the present embodiment, the oxide film 126 can also remain on the surface of the uneven structure 123, and the entire area of ​​the uneven structure 123 can be a covered section. In this case, the thickness of the oxide film 126 in the uneven structure 123 can be substantially uniform or non-uniform. For example, the oxide film 126 pressed into the second busbar 200 can be thinner than the oxide film 126 located outside the second busbar 200. For example, the thickness of the oxide film 126 covering a portion of the wall sections 123a2 of the concave grooves on the side of the upper sections 123b can be less than the thickness of the oxide film 126 covering the bottom sections 123a1 formed by the concave grooves.

[0083] The second busbar 200 comprises a second conductor section 220 and a second oxide film 230 covering the second conductor section 220. A portion of the outer surface of the second busbar 200 that comes into contact with the first busbar 120 (a portion of the facing surface 210) is a second exposed section in which the second conductor section 220 is exposed. The other portion of the outer surface of the second busbar 200 is a second covered section, which is covered with the second oxide film 230.

[0084] The second conductor section 220 is a section of the second busbar 200 made of a material such as copper with good conductivity. The second oxide film 230 is a thin film formed on the surface of the second conductor section 220 by an oxide of the metal of the second conductor section 220. The second oxide film 230 is insulating or has a higher resistance than the second conductor section 220. The second oxide film 230 covers at least a portion of the second conductor section 220. Preferably, the second oxide film 230 covers substantially the entire second conductor section 220. Here, "substantially covering the entire second conductor section 220" means that a portion of the facing surface 210 may also have a small area (a second exposed section, as described below) where the conductor section 125 is exposed without being covered by the oxide film 126.

[0085] A part or all of the facing surface 210 that is in contact with the first busbar 120 is the second exposed section, in which the second conductor section 220 is exposed, and a section of the facing surface 210 that is not in contact with the first busbar 120 can be a second covered section covered with the second oxide film 230. In particular, parts of the facing surface 210 that face and are in contact with the wall sections 123a2 of the concave grooves are second exposed sections. Furthermore, parts of the facing surface 210 that face and are in contact with the upper sections 123b or the outer circumferential section 122b are second covered sections. Also, parts of the facing surface 210 that face and are spaced apart from the bottom sections 123a1 of the concave grooves are second covered sections.The thickness of the second oxide film 230 in the second covered sections, which face the bottom sections 123a1 of the concave grooves and are spaced apart from them, is preferably greater than the thickness of the second oxide film 230 in the parts which face the upper sections 123b or the outer circumferential sections 122b and are in contact with them.

[0086] A part of the outer surface of the second busbar 200, which comes into contact with the first busbar 120, can be considered as the second exposed section, and if the other parts are covered with the second oxide film 230, plating of the second busbar 200 may not be necessary.

[0087] As in Fig. As shown in Figure 3B, in the present embodiment the connection between the first busbar 120 and the second busbar 200 is made by the shaft element 140 (see Figure 3B). Fig. 3A) maintained. The shaft element 140 is an elongated element containing the shaft section 142, which is inserted into the hole 121 in the first busbar 120 and a hole provided in the second busbar 200. As in Fig. As shown in Figure 3B, the shaft element 140 in the present embodiment is a bolt. The shaft element 140 includes at one end of the shaft section 142 a shaft head section 141, which has a larger diameter than the shaft section 142 that is inserted into the busbars. A nut 143 can be tightened from the other end of the shaft element 140, and the first busbar 120 and the second busbar 200 can be fastened to each other by the shaft head section 141 and the nut 143, thereby maintaining the connection between the first busbar 120 and the second busbar 200.

[0088] As an alternative to the present embodiment, it is also possible that the shaft element 140 does not include the shaft head section 141. In this case, for example, after inserting the shaft section 142 into the hole 121, one end of the shaft element 140 can be attached to a part of the first busbar 120 by welding or the like, and the first busbar 120 and the second busbar 200 can be arranged between one end of the shaft element 140 and the nut 143 to maintain the connection between them. Alternatively, one end of the shaft element 140 can also be attached to a wall section of another element, for example by welding or the like, and the first busbar 120 and the second busbar 200 can be arranged between the wall section and the nut 143 to maintain the connection between them. Method for manufacturing an electronic component

[0089] The following describes a method for manufacturing the electronic component 100 of the present embodiment (hereinafter also referred to as the present method).

[0090] First, an overview of the present procedure is described.

[0091] As described above, the present method is a method for manufacturing the electronic component 100, which comprises the main body 110 containing the electronic element 111 and the first busbar 120 electrically connected to the electronic element 111. The present method includes a forming step and an embossing step.

[0092] The following section describes the present procedure in detail.

[0093] First, the forming step is described. In this step, the hole 121 is formed in a designated hole-forming area. The hole-forming area is a partial surface area on the outer surface of the conductive element, which serves as the raw material for the first busbar 120, and is the area in which the hole 121 is to be formed. The conductive element can be shaped into the outer form of the first busbar 120 by cutting or similar means before the hole 121 is formed in the forming step. In this case, a hole 121 can be formed in the conductive element with the outer form of the first busbar 120. Hereinafter, the conductive element with the outer form of the first busbar 120 will also be referred to as the first busbar 120.Alternatively, before the embossing step, which is described below, after the hole 121 has been formed in the forming step, or after the forming step and after the embossing step, a conductive element provided with several holes 121 can be cut so that it corresponds to the outer shape of the first busbar 120, thus producing several first busbars 120. Alternatively, the outer shape of the first busbar 120 and the hole 121 can also be formed simultaneously by a die.

[0094] If the forming step is carried out after the embossing step as described below, the area in which the hole is to be formed is located near the uneven area 122a. Preferably, the area in which the hole is to be formed is located substantially in the middle of the uneven area 122a.

[0095] The embossing step is described next. The embossing step is a step in which the uneven structure 123 is embossed onto the first busbar 120. More precisely, a pressing element (not shown) is pressed around the hole 121, or in the area where the hole is to be formed. Thus, the uneven structure 123 is formed around the hole 121, or in the area where the hole is to be formed. The pressing element is an element that is pressed against the first busbar 120 or the conductive element (hereinafter collectively referred to as the first busbar 120) to form the uneven structure 123. The pressing element has a pressing surface area on its outer surface that is pressed against the first busbar 120. This pressing surface area has irregularities that correspond to the uneven structure 123.When the pressing surface area around the hole 121, or around the area where the hole is to be formed, is pressed down, the irregularities are transferred to form the uneven structure 123. In the present embodiment, the pressing surface area is provided with several convex sections having shapes and dimensions that correspond to the shapes and dimensions of the concave grooves 123a.

[0096] The protrusion height by which the convex sections project into the irregularities of the pressing surface area is preferably greater than the depth of the concave sections 123a (the concave grooves 123a) of the uneven structure 123. The protrusion height of the convex sections here refers to the dimension of the convex sections in the direction of their protrusion. The pressing surface area, which has such irregularities with a large protrusion height, can be pressed against the first busbar 120 or the conductive element until a portion of the irregularities on the front face of the convex sections is pressed into the first busbar 120 or the conductive element.In other words, the pressing surface area can be pressed against the first busbar 120 or the conductive element to such an extent that the concave sections formed between two convex sections in the pressing surface area are not completely pressed into the first busbar 120 or the conductive element.

[0097] Thus, a portion of the first busbar 120 or conductive material that is forced out by being pressed against the convex sections of the pressing surface area can enter the concave sections formed between the convex sections. In this way, a space is provided in which the portion of the first busbar 120 or conductive material that is forced out and convex enters the concave sections, thereby easily forming the uneven structure 123 in the first busbar 120 or conductive element. Furthermore, if the portion of the first busbar 120 or conductive element that is forced out through the convex sections of the pressing surface area shifts into the concave sections, the depth of the formed concave sections 123a becomes greater than the depth to which the convex sections are pressed into the first busbar 120 or conductive element.This makes it possible to form the concave grooves 123a with sufficient depth, while minimizing the force with which the pressing element is pressed.

[0098] The forming and embossing steps can be performed simultaneously, but they can also be performed sequentially. "Sequential" here includes both cases where the embossing step is performed after the forming step and cases where the forming step is performed after the embossing step. Furthermore, "simultaneous" includes not only cases where the forming and embossing steps are performed completely at the same time, but also cases where only parts of the steps overlap.

[0099] If the forming and embossing steps are performed simultaneously, the die that punches the first busbar 120 or the conductive element to form the hole 121 can, for example, also serve as a pressing element. In other words, while the hole 121 is formed by the die, the uneven structure 123 around the hole 121 is formed at the same time.

[0100] If the forming step is performed before the embossing step, the pressing element is pressed around the hole 121 during the embossing step. If, on the other hand, the embossing step is performed before the forming step, the hole 121 is formed, as described above, in the uneven area 122a, preferably in its center.

[0101] The first busbar 120 formed in this way is combined with the main body 110 and electrically connected to the electronic element 111, thereby producing the electronic component 100.

[0102] It should be noted that a series of steps, including the forming step and the embossing step in the present method, can be used as a method for manufacturing the first busbar 120 instead of the electronic component 100, which is part of an electronic component. Method for manufacturing an electrical device

[0103] The following describes a method for manufacturing an electrical device 1 according to the present embodiment (hereinafter, the method for manufacturing the electrical device 1 and the method for manufacturing the electronic component 100 are also referred to as the present method).

[0104] First, an overview of the present procedure is described.

[0105] The electrical device 1 produced by the present method comprises the electronic component 100 as described above and the second busbar 200, which is brought into contact with the first busbar 120. The electronic component 100 comprises the main body 110 with the electronic element 111, as well as the first busbar 120, which is electrically connected to the electronic element 111. The first busbar 120 contains the hole 121, and the uneven area 122a, which has the uneven structure 123, is formed around the hole 121 at the contact surface 122 where the hole 121 is provided.

[0106] The present method includes a joining step for joining the first busbar 120 and the second busbar 200.

[0107] In the joining step, the first busbar 120 and the second busbar 200 are first arranged such that the contact surface 122 of the first busbar 120 faces the adjacent surface 210 of the second busbar 200. Here, "contact surface 122" and the adjacent surface 210 face each other, meaning that the contact surface 122 and the adjacent surface 210 have the same directional component, as shown in the diagram. Fig. 3B shown, wherein the contact surface 122 and the facing surface 210 are preferably substantially parallel to each other.

[0108] In the joining step, the contact surface 122 and the facing surface 210 are pressed together, so that part of the uneven structure 123 is pressed into the second busbar 200. The contact surface 122 and the facing surface 210 are pressed together by the tension they exert on each other in a direction that intersects (preferably orthogonally to) the contact surface 122 and the contact surface of the facing surface 210. This direction is subsequently referred to as the "pressing direction of the contact surface 122 and the facing surface 210" or simply as the "pressing direction".

[0109] In this context, the upper sections 123b are, in particular, the part of the uneven structure 123 that is pressed into the second busbar 200. The contact surface 122 is pressed against the facing surface 210 with sufficient force so that the upper sections 123b are pressed into the second busbar 200. At least the upper sections 123b and part of the wall sections 123a2 of the concave grooves on the side of the upper sections 123b are pressed into the second busbar 200. The facing surface 210 is essentially flat before being pressed in, but when the upper sections 123b are pressed in, the uneven structure 123 is transferred to the facing surface 210, making the facing surface 210 a surface that exhibits irregularities in certain areas.

[0110] The contact surface 122 and the facing surface 210 can also be pressed together by firmly clamping the first busbar 120 and the second busbar 200 between the shaft head section 141 and the nut 143. More precisely, before the contact surface 122 and the facing surface 210 are pressed together, the shaft element 140 can be loosely inserted into the first busbar 120 and the second busbar 200, and the nut 143 can be tightened to firmly clamp the first busbar 120 and the second busbar 200 between the shaft head section 141 and the nut 143. Alternatively, the contact surface 122 and the facing surface 210 can also be pressed together by holding them with a tool (not shown), inserting the shaft element 140 while held, and then tightening the nut 143.

[0111] As described above, the first busbar 120 comprises the conductor section 125 and the oxide film 126 covering the conductor section 125.

[0112] In the present embodiment, the contact surface 122 and the facing surface 210 are pressed together in the joining step described above, thereby removing part of the oxide film 126 that is pressed against the second busbar 200 and exposing part of the conductor section 125, thus creating an exposed section. The exposed section and the second busbar 200 thus come into contact with each other.

[0113] During the step in which the contact surface 122 and the facing surface 210 are pressed together and a portion of the first busbar 120 (in particular the upper sections 123b and the portion of the wall sections 123a2 of the concave grooves on the side of the upper sections 123b) is pressed into the second busbar 200, the first busbar 120 and the second busbar 200 rub against each other. This causes the surface of a portion of the oxide film 126 covering the outer surface of the first busbar 120 to rub against the second busbar 200 and be partially removed, becoming thinner or completely removed, thus exposing the conductor section 125. In particular, in the present embodiment, at least the upper sections 123b and the wall sections 123a2 of the concave grooves are pressed against the second busbar 200 and rub against it.As a result, the oxide film 126 covering the upper sections 123b and the wall sections 123a2 of the concave grooves is removed. More precisely, the oxide film 126 covering the portion of the wall sections 123a2 of the concave grooves on the side of the upper sections 123b is removed, thereby exposing the inner conductor section 125, and the surface of the oxide film 126 covering the upper sections 123b is partially removed and becomes thinner.

[0114] The reason why the aspect of removing the oxide film 126 from the upper sections 123b differs from the aspect of removing the oxide film 126 from the wall sections 123a2 of the concave grooves is that the aspect of the pressure between the upper sections 123b and the facing surface 210 differs from that of the pressure between the wall sections 123a2 of the concave grooves and the facing surface 210. More precisely, in the present embodiment, the flat upper section 123b is arranged essentially orthogonally to the pressure direction. On the other hand, the wall sections 123a2 of the concave grooves are arranged parallel to the pressure direction or preferably obliquely to the pressure direction.For this reason, the oxide film 126 covering the wall sections 123a2 of the concave grooves is more easily peeled off due to the pressure between the first busbar 120 and the second busbar 200 than the oxide film 126 covering the upper sections 123b. As a result, the oxide film 126 covering the wall sections 123a2 of the concave grooves is sufficiently removed to expose the conductor section 125, and the oxide film 126 covering the upper sections 123b is removed to the extent that a thin oxide film 126 remains.

[0115] The portion of the wall sections 123a2 of the concave grooves from which the oxide film 126 is removed, i.e., on the side of the upper sections 123b, becomes the exposed sections. On the exposed sections of the wall sections 123a2 of the concave grooves, the second busbar 200 is in direct contact with the conductor section 125 of the first busbar 120. On the upper sections 123b, the oxide film 126 of the first busbar 120 is in contact with the second busbar 200.

[0116] In the present embodiment, the oxide film 126 covering the upper sections 123b remains thin, but alternatively, the oxide film 126 covering the upper sections 123b can also be completely removed to expose the upper sections 123b. In this case, the conductor section 125 and the second busbar 200 are in direct contact with each other in at least a portion of the upper sections 123b that is exposed after the oxide film 126 has been removed.

[0117] Furthermore, the outer circumferential section 122b may or may not be in contact with the facing surface 210 of the second busbar 200. If the outer circumferential section 122b is in contact with the facing surface 210 of the second busbar 200, the surface of the oxide film 126 covering a portion of the outer circumferential section 122b that faces and is in contact with the second busbar 200 can be partially removed and thinned. Alternatively, the oxide film 126 covering the portion of the outer circumferential section 122b can also be removed to such an extent that the conductor section 125 is exposed.

[0118] As an alternative to the present embodiment, the oxide film 126 can also remain over the entire area of ​​the uneven structure 123 without being removed when the second busbar 200 is pressed into place. More precisely, an oxide film 126, whose surface is partially worn away due to friction and thus made thinner, can remain over the entire area of ​​the uneven structure 123. In this case, the electrical connection between the second busbar 200 and the first busbar 120 is improved due to the thinner oxide film 126. Since, in this case, the entire uneven structure 123, including the wall sections 123a2 of the concave grooves, etc., is covered, the conductor section 125 can be protected over substantially the entire area of ​​the uneven structure 123.

[0119] As described above, the second busbar 200 also comprises a second conductor section 220 and a second oxide film 230 covering the second conductor section 220. Since the upper sections 123b and the wall sections 123a2 of the concave grooves rub against the second busbar 200, the second oxide film 230 covering the second busbar 200 is also removed to such an extent that it becomes thinner, or removed and peeled away to such an extent that the conductor section 125 is exposed. More precisely, in the present embodiment, after the joining step, a portion of the outer surface of the second busbar 200 facing the wall sections 123a2 of the concave grooves is a second exposed section that is not covered with the second oxide film 230. Furthermore, after the joining step, part of the outer surface of the second busbar 200, which faces the upper sections 123b, has the second oxide film 230, which is worn away and becomes thinner.The thickness of the second oxide film 230, which covers the part of the outer surface of the second busbar 200 facing the upper sections 123b, is less than the thickness of the second oxide film 230, which covers the part of the outer surface of the second busbar 200 facing the bottom sections 123a1 given by the concave grooves.

[0120] The following refers to Fig. 4A and Fig. 4B describes a case in which the uneven structure 123 is provided for the electrical device 1 of the present embodiment in order to reduce the contact resistance. Fig. 4A and Fig. 4B indicates the vertical axis as the value of the contact resistance at the contact surface between the first busbar 120 and the second busbar 200 when the first busbar 120 and the second busbar 200 are pressed together with a predetermined tension. Fig. 4A and Fig. 4B indicates the horizontal axis and the screw tightening force applied to press the first busbar 120 and the second busbar 200 together.

[0121] Fig. Figure 4A shows the electrical contact resistance at the contact surface when a busbar replicating the first busbar 120 of the present embodiment (hereinafter also referred to as the first busbar 120) is pressed against the second busbar 200 with loads from 0 [N] to 6000 [N]. For comparison with the first busbar 120 with the uneven structure 123, a busbar with a flat contact surface 122 without the uneven structure 123 (hereinafter referred to as the first comparison busbar) was also pressed against the second busbar 200 in the same manner. Fig. Figure 4A also shows the electrical contact resistance at the contact surface when the first reference busbar is pressed against the second busbar 200 with loads from 0 [N] to 6000 [N]. Specifically, as described above, the first busbar 120 and the second busbar 200 are pressed together such that the contact surface 122 of the first busbar 120, or the contact surface of the first reference busbar, faces the adjacent surface 210 of the second busbar 200. The pressed-in state was maintained by the shaft element 140, and a current was passed through the first busbar 120, or the first reference busbar, and the second busbar 200 to measure the electrical contact resistance at the contact surface between the busbars.

[0122] When the first busbar 120 with the uneven structure 123 was used, the electrical contact resistance was lower than the electrical contact resistance when the first reference busbar was used, regardless of the applied load, across the entire range from 0 N to 6000 N. Specifically, when a load of 500 N to 3000 N was applied, the electrical contact resistance when the first busbar 120 was used was lower than the electrical contact resistance when the reference busbar was used. Furthermore, even when the busbars were pressed together with an extremely high load of 6000 N, the electrical contact resistance when the first busbar 120 with the uneven structure 123 was used was lower than the electrical contact resistance when the reference busbar was used.The above results confirm that the electrical contact resistance can be reduced if the first busbar 120 has the uneven structure 123.

[0123] Next, the electrical contact resistance at the contact surface between a first busbar 120, on whose surface the oxide film 126 had formed (also referred to as the "coated first busbar"), and a first busbar 120 on which no oxide film 126 had formed (also referred to as the "uncovered first busbar"), and the second busbar 200 was measured. The oxide film 126 of the covered first busbar was artificially formed by placing the uncovered first busbar in a thermostatic bath maintained at 100°C for 50 hours. The uncovered first busbar can also be considered the first busbar 120 that includes only the conductor section 125 but no oxide film 126. The values ​​of the electrical contact resistance in the covered first busbar and the uncovered first busbar are shown in Fig. 4B shown.

[0124] As in Fig. As shown in Figure 4B, the electrical contact resistance with the covered first busbar is greater than the electrical contact resistance with the uncovered first busbar when the busbars are pressed together with 0 N or 500 N. It appears that the electrical contact resistance with the covered first busbar is higher because the oxide film 126, which is insulating or has a higher resistance than the conductor section 125, is located between the conductor section 125 and the second busbar 200.

[0125] On the other hand, when the busbars are pressed together with a load of at least 1000 N, the difference between the electrical contact resistance with the covered first busbar and the electrical contact resistance with the uncovered first busbar is smaller than when a load of 0 N or 500 N is applied. Furthermore, when the busbars are pressed together with a load of at least 3000 N, the electrical contact resistance with the covered first busbar is equal to the electrical contact resistance with the uncovered first busbar. As described above, when the busbars are pressed together with a sufficient load, a portion of the covered first busbar (in particular, the upper sections 123b) is forced into the second busbar 200, and the oxide film 126 of the covered first busbar is removed, thereby exposing the conductor section 125 or thinning the oxide film 126.It appears that the electrical contact resistance between the busbars is reduced when the exposed conductor section 125 and the second busbar 200 are electrically connected without the oxide film 126, or when the conductor section 125 and the second busbar 200 are electrically connected through the oxide film 126, which is thin and has low resistance. Furthermore, when the busbars are pressed together with a force of at least 3000 N, the electrical contact resistance between the busbars is reduced if the oxide film 126 is sufficiently removed, the conductor section 125 is sufficiently exposed, and the conductor section 125 and the second busbar 200 are directly electrically connected.As described above, even if an oxide film 126 covering the conductor section 125 of the first busbar 120 is formed, the electrical contact resistance between the first busbar 120 and the second busbar 200 is reduced because of the uneven structure 123. <Zweite Ausführungsform> Electronic component

[0126] Fig. Figure 5A is a perspective view showing an example of an electronic component 100 according to the present embodiment.

[0127] First, an overview of the electronic component 100 according to the present embodiment is described.

[0128] The electronic component 100 of the present embodiment comprises a main body 110 and a busbar (first busbar 120), similar to the electronic component 100 of the first embodiment. The main body 110 contains an electronic element 111. The first busbar 120 is electrically connected to the electronic element 111. The first busbar 120 contains a hole 121. An uneven area 122a, having an uneven structure 123, is formed around the hole 121 at the contact surface 122 where the hole 121 is located.

[0129] Next, the electronic component 100 of the present embodiment will be described in detail.

[0130] The electronic component 100 of the present embodiment differs from that of the first embodiment in that a shaft element 140 is pressed against a circumferential wall surface 121b, which defines the hole 121 (through hole 121), which is a through hole, and protrudes from the hole 121.

[0131] In the present embodiment, the through-hole 121 has a shape and dimensions small enough that a portion of the first busbar 120 abuts the shaft element 140 when a shaft section 142 of the shaft element 140 is inserted. For example, if the through-hole 121 is circular in the direction of penetration and a cross-section of the shaft section 142 is circular, then the radius of the through-hole 121 is smaller than the radius of the cross-section of the shaft section 142.

[0132] As in Fig. As shown in Figure 5B, in the present embodiment the contact surface 122 comprises an inner circumferential section 122c which is arranged closer to the shaft element 140 than the uneven area 122a. The inner circumferential section 122c is a partial surface area of ​​the contact surface 122. In the present embodiment, the contact surface 122 is arranged such that, viewed in the direction of penetration of the through-hole 121, it surrounds the circumference of the through-hole 121, and the inner circumferential section 122c is a surface area which, viewed in the direction of penetration of the through-hole 121, is closer to the through-hole 121 than an inner circumferential edge of the uneven area 122a.In other words, in the present embodiment, viewed in the direction of penetration of the through-hole 121, the inner circumferential section 122c is arranged such that it surrounds the circumference of the through-hole 121, and the uneven area 122a is arranged such that it surrounds the inner circumferential section 122c. Alternatively to the present embodiment, if the uneven area 122a is formed in the radial direction of the through-hole 121 only in one part and not in the radial direction in the other part, the inner circumferential section 122c can also be an area which, viewed in the direction of penetration of the through-hole 121, is arranged between the circumferential wall surface 121b of the through-hole 121 and the uneven area 122a.

[0133] As in Fig. As shown in Figure 6A, the inner circumferential section 122c is flat. The fact that the inner circumferential section 122c is flat means that the uneven structure 123 is not formed on the inner circumferential section 122c. The fact that the inner circumferential section 122c is flat also includes the case where the inner circumferential section 122c is a curved surface that is convex outwards in the projection direction of the first busbar 120 or recessed inwards in the projection direction. The inner circumferential section 122c is preferably planar.

[0134] If the inner circumferential section 122c is flat, it rests against an adjacent surface 210 of a second busbar 200 in a joining step described below, so that the first busbar 120 and the second busbar 200 can be positionally aligned with each other. More precisely, the inner circumferential section 122c comes into surface contact with the adjacent surface 210 at the beginning or during the step in which the second busbar 200 and the first busbar 120 are pressed together, with the contact surface 122 of the first busbar 120 and the adjacent surface 210 of the second busbar 200 being arranged parallel to each other.

[0135] In the present embodiment, the first busbar 120, as described below, is convex or curved in the projection direction of the uneven structure 123. More precisely, an area near the shaft element 140 is most convex in the projection direction. For this reason, the virtual surface II described below (in the Fig. 6B and Fig. 6C (represented by a two-dotted line), which connects the projecting ends 123b of the projection sections 123e, is curved or arched in the projection direction of the uneven structure 123. More precisely, the part of the virtual surface II closest to the shaft element 140 is most curved in the projection direction. In other words, the virtual surface II, which rises in the Fig. 6B and Fig. As shown in Figure 6C, the virtual surfaces I and II extend diagonally upwards from left to right. Fig. 6B and Fig. The areas shown in 6C are connected to each other.

[0136] In Fig. 6A shows the curved shape of the first busbar 120 not shown, and the first busbar 120 is shown flat.

[0137] The curved shape of the first busbar 120 (the curved shape of the virtual surface II) can be formed, for example, by cutting it during the forming of the outer shape of the first busbar 120 or by applying a tension. Furthermore, the shape can also be formed by pressing the shaft element 140 into the through-hole 121.

[0138] In the present embodiment, the outer circumferential section 122b is a region which, viewed in the direction of penetration of the through hole 121, surrounds the circumference of the uneven region 122a and has a predetermined width in the radial direction of the through hole 121.

[0139] In the present embodiment, the inner circumferential section 122c projects further in the direction of the uneven structure 123 than the outer circumferential section 122b. Since the inner circumferential section 122c projects further in the direction of the uneven structure 123 than the outer circumferential section 122b, the inner circumferential section 122c is continuously pressed against the second busbar 200 in the joining step described below, before the outer circumferential section 122b is pressed against the second busbar 200. The inner circumferential section 122c is deformed by the stress exerted by the second busbar 200. More precisely, a portion of the inner circumferential section 122c presses against the shaft element 140 in a radially inward direction (in a direction from a circumferential edge of the shaft element 140 toward its axial center) (see Fig. 3A). Thus, the contact force between the shaft element 140 and the circumferential wall surface 121b of the through hole 121 is increased, and the shaft element 140 and the first busbar 120 are fixed more firmly to each other.

[0140] As an alternative to the present embodiment, the inner circumferential section 122c and the outer circumferential section 122b can also be arranged at the same level in the protruding direction of the uneven structure 123. In other words, the inner circumferential section 122c and the outer circumferential section 122b can also be arranged in the same plane. With such an arrangement, the first busbar 120 and the second busbar 200 come into essentially simultaneous pressure contact with each other at both a portion of the contact surface 122 on the side near the shaft element 140 and at a portion of the contact surface 122 on the side of the circumferential edge when the first busbar 120 and the second busbar 200 are pressed together in the joining step described below. Thus, the first busbar 120 and the second busbar 200 can be pressed together while they are being positioned relative to each other.

[0141] Alternatively to the present embodiment, the outer circumferential section 122b can also project further in the direction of the uneven structure 123 than the inner circumferential section 122c.

[0142] As in the Fig. 6A to Fig. As shown in Figure 6C, the uneven structure 123 contains several projecting sections 123e. The projecting ends 123b (the upper sections 123b described below) of the projecting sections 123e extend further in the projection direction of the uneven structure 123 than the inner circumferential section 122c. It is sufficient if only one projecting section 123e extends further in the projection direction of the uneven structure 123 than substantially the entire inner circumferential section 122c. As described above, the virtual surface II in the figures is inclined obliquely upwards from left to right. Accordingly, in the present embodiment, the projecting end 123b of the projecting section 123e extends next to the inner circumferential section 122c (for example, the projecting section 123e on the right side in Figure 6C). Fig. 6B) in the projection direction further than the inner circumferential section 122c. The other projection sections 123e may or may not project further in the projection direction than the inner circumferential section 122c. In other words, the inner circumferential section 122c may or may not project further in the projection direction than the other projection sections 123e. In the present embodiment, the inner circumferential section 122c projects further in the projection direction of the uneven structure 123 than the projection sections 123e that are arranged near the outer circumferential section 122b.

[0143] Alternatively to the present embodiment, the projecting ends 123b of all projection sections 123e in the uneven structure 123 can project further in the projection direction of the uneven structure 123 than substantially the entire inner circumferential section 122c.

[0144] In the present embodiment, the projecting ends 123b of the projection sections 123e extend further forward in the projection direction of the uneven structure 123 than the outer circumferential section 122b.

[0145] Since the projecting ends 123b of the projection section 123e extend further in the projection direction of the uneven structure 123 than the inner circumferential section 122c, the projecting ends 123b of the projection sections 123e abut the second busbar 200 in the joining step described below before the inner circumferential section 122c abuts the second busbar 200. For this reason, the projection sections 123e, including the projecting ends 123b, can be easily pressed into the second busbar 200 in the joining step.

[0146] As an alternative to the present embodiment, the inner circumferential section 122c and the projecting ends 123b can also be arranged at substantially the same level in the uneven structure 123 in the projection direction. Furthermore, the inner circumferential section 122c can project further in the projection direction of the uneven structure 123 than the projecting ends 123b of the projection sections 123e. In this case, the outer circumferential section 122b can project further in the projection direction of the uneven structure 123 than the projecting ends 123b of the projection sections 123e, or the projecting ends 123b of the projection sections 123e can project further in the projection direction than the outer circumferential section 122b.If the inner circumferential section 122c projects further in the direction of the uneven structure 123 than the projecting ends 123b of the projecting sections 123e, the inner circumferential section 122c abuts the facing surface 210 in the joining step described below even before the projecting ends 123b (see . Fig. 3B) of the second busbar 200. Thus, as described above, the inner circumferential section 122c is deformed by the tension from the second busbar 200, and the contact force between the shaft element 140 and the circumferential wall surface 121b of the through-hole 121 is increased, causing the shaft element 140 (see Fig. 3B) and the first busbar 120 are fixed more firmly to each other. Furthermore, since the flat inner circumferential section 122c abuts the facing surface 210 of the second busbar 200 in the joining step before the projecting ends 123b, the first busbar 120 and the second busbar 200 can be positioned relative to each other as described above.

[0147] As in the Fig. 6B and Fig. As shown in Figure 6C, the uneven structure 123, as described above, has concave sections 123a (concave grooves 123a) provided with a bottom. The depth of some of the concave sections 123a is greater than the depth of other concave sections 123a located on the side of the circumferential edge of the uneven region 122a (on the left side in the figures, hereinafter also referred to simply as the "circumferential edge side of the uneven region"). Here, the depth of a concave section 123a is the depth of a bottom section of the concave section (bottom section 123a1 of the concave groove) relative to the virtual surface II. As described above, in the present embodiment, the virtual surface II is inclined obliquely upwards from left to right, as shown in Fig. 6B and Fig. 6C shown. The depth of a concave section 123a can be assumed to be the maximum depth, the minimum depth, or the average depth of the bottom section of the concave section 123a relative to the virtual surface II.

[0148] In the present embodiment, the concave sections 123a are concave grooves 123a. In the present embodiment, the depth of a concave section 123a can be considered as the depth from an upper end (an end extending to the upper section 123b) of one of the wall sections 123a2 of the concave groove defining the concave groove 123a to the bottom section 123a1 of the concave groove.

[0149] The fact that the depth of one part of the concave sections 123a is greater than the depth of another part of the concave sections 123a located on the circumferential edge of the uneven region means that the depth of one partial length of a concave groove 123a is greater than the depth of another partial length of this concave groove 123a located further on the circumferential edge. Alternatively, the fact that the depth of one part of the concave sections 123a is greater than the depth of another part of the concave sections 123a located on the circumferential edge of the uneven region can also mean that the depth of one partial length of a concave groove 123a is greater than the depth of another partial length of a concave groove 123a located closer to the circumferential edge of the uneven region than this partial length.

[0150] In the present embodiment, the extent by which a projecting section 123e projects is greater than the extent by which another projecting section 123e projects on the circumferential edge side of the uneven area. In other words, the projecting end 123b of one projecting section 123e projects further in the direction of projection of the uneven structure 123 than the projecting end 123b of another projecting section 123e on the circumferential edge side of the uneven area. Here, the extent by which the projecting section 123e projects is the height of the projecting end 123b relative to the height of the foot end of the projecting section 123e in the direction of projection of the uneven structure 123 (this height is equal to the height of the concave groove bottom section 123a1).

[0151] As described below, the first busbar 120 and the second busbar 200 are fixed by being positioned between the shaft head section 141 and the nut 143. For this reason, the area of ​​the uneven section 122a on the side near the shaft element 140 comes into greater contact with the second busbar 200 than the area further towards the side of the circumferential edge of the uneven section. Because the depth of the concave grooves 123a in a region of the uneven section 122a is greater the closer it is to the shaft element 140, the increased depth of the concave sections 123a allows the second busbar 200 to be pressed deeper into the concave sections 123a in an area where the contact force between the first busbar 120 and the second busbar 200 is high.

[0152] As described above, in the present embodiment, the portion of virtual surface II on the side closest to the shaft element 140 is most curved in the direction of projection of the uneven structure 123. In other words, the projecting end 123b of a projection section 123e projects further in the direction of projection of the uneven structure 123 than the projecting end 123b of another projection section 123e on the circumferential edge side of the uneven area. Furthermore, the bottom sections of the concave sections 123a are arranged at a uniform height (a height represented by virtual surface I) in the direction of projection of the uneven structure 123. In other words, the concave groove bottom sections 123a1 are at the same height in the protrusion direction over the entire length of the concave grooves 123a, and the heights of the concave groove bottom sections 123a1 of two adjacent concave grooves 123a are the same with respect to the protrusion direction.

[0153] Since the protruding ends 123b of a projection section 123e project further in the projection direction of the uneven structure 123 than the protruding ends 123b of another projection section 123e on the circumferential edge side of the uneven area, the projection sections 123e can be pressed into the second busbar 200 one after the other from the side of the shaft element 140 in the joining step described below.

[0154] As an alternative to the present embodiment, the virtual surface II can also be a plane perpendicular to the direction of penetration of the through-hole 121. In other words, the heights of the projecting ends of the multiple projection sections 123e can be equal in the direction of projection of the uneven structure 123.

[0155] As in Fig. As shown in Figure 6C, part of the outer surface of the first busbar 120 is an adjacent section 124, which borders the contact surface 122 (the outer circumferential section 122b) in the radial direction of the shaft element 140 and is located outside the contact surface 122 (of the outer circumferential section 122b). In the present embodiment, a step is formed between the outer circumferential section 122b and the adjacent section 124, which rises from the outer circumferential section 122b to the adjacent section 124. In other words, the adjacent section 124 projects further forward in the direction of projection of the uneven structure 123 than the outer circumferential section 122b, and at the boundary between the adjacent section 124 and the outer circumferential section 122b, the height changes abruptly in the direction of projection.A surface that stands upright on the contact section 122 at the boundary between the adjacent section 124 and the outer circumferential section 122b is referred to as the step surface 124a of this step (hereinafter also simply referred to as "step surface 124a"). The step surface 124a is arranged at an angle to the contact section 122 and is preferably arranged perpendicular to the contact section 122.

[0156] The stepped surface 124a can be formed by pressing a pressing element against the first busbar 120 in the embossing step.

[0157] As an alternative to the present embodiment, the outer shape of the first busbar 120, the through-hole 121, and the uneven structure 123 can also be formed simultaneously, as described in the first embodiment. For example, if the outer shape of the first busbar 120 and the through-hole 121 are formed by a die, the uneven structure 123 can be formed by a press-fit area provided on the die. In this case, it is also possible that no stepped surface 124a is formed on the first busbar 120.

[0158] As in Fig. 7A or Fig. As shown in Figure 7B, the electronic component 100 of the present embodiment has the following features as in the first embodiment.

[0159] The upper sections 123b, which are the front ends that protrude in the uneven structure 123, are flat.

[0160] The uneven structure 123 is formed by at least two concave grooves 123a with a bottom, arranged side by side. The width of the upper sections 123b, each arranged between two concave grooves 123a, is greater than that of the bottom sections of the concave grooves (the bottom sections 123a1 formed by the concave grooves).

[0161] The contact surface 122 also includes the outer circumferential section 122b, which is a section that borders the uneven area 122a outside the uneven area 122a. The upper sections 123b project further forward in the direction of the uneven structure 123 than the outer circumferential section 122b.

[0162] Furthermore, the electronic component 100 of the present embodiment can be connected to a second busbar and provided as part of an electrical device 1, similar to the first embodiment. The electrical device 1 has the following features, as in the first embodiment.

[0163] The second busbar 200 is in contact with the first busbar 120. The second busbar 200 is in contact with the contact surface 122 on the facing surface 210, which faces the contact surface 122. The upper sections 123b, which are the front ends projecting in the uneven structure 123, are pressed into the second busbar 200.

[0164] The first busbar 120 comprises the conductor section 125 and the oxide film 126. The oxide film 126 covers the conductor section 125. The outer circumferential section 122b is a covered section, covered by the oxide film 126. At least part of the uneven structure 123 is an exposed section, exposed by the oxide film 126. The exposed section is embedded in the second busbar 200.

[0165] The uneven structure 123 is formed by at least two concave grooves 123a with a bottom, arranged side by side. Each concave groove 123a is defined by a bottom section (bottom section 123a1 of the concave groove) and a pair of wall sections (wall section 123a2 of the concave groove) flanking the bottom section 123a1 of the concave groove. The wall sections 123a2 of the concave grooves are arranged obliquely with respect to the outer circumferential section 122b. At least a portion of the wall sections 123a2 of the concave grooves are exposed sections in contact with the second busbar 200.

[0166] The second busbar 200 comprises a second conductor section 220 and a second oxide film 230 covering the second conductor section 220. A portion of the outer surface of the second busbar 200 that comes into contact with the first busbar 120 is a second exposed section in which the second conductor section 220 is exposed. The other portion of the outer surface of the second busbar 200 is a second covered section covered by the second oxide film 230.

[0167] Similar to the first embodiment, the electronic component 100 of the present embodiment can be connected to the second busbar 200 and provided as an electrical device 1. Furthermore, the first busbar 120 in the electronic component 100 of the present embodiment can also be provided as a busbar without including the main body 110. Method for manufacturing an electronic component

[0168] As in the first embodiment, a method for manufacturing the electronic component 100 of the present embodiment (hereinafter also referred to as the present method) comprises a forming step and an embossing step.

[0169] In the present embodiment, the method comprises an insertion step that is carried out after the forming step and before the embossing step. As in Fig. As shown in Figure 6A, the shaft element 140 is inserted into the through-hole 121 from the rear side in the direction of the contact surface 122 (in the y-direction) during the insertion step. This presses it against the circumferential wall surface 121b, which defines the through-hole 121, causing it to protrude from the through-hole 121 or stand upright. The fact that the shaft element 140 protrudes from the through-hole 121 means that it is positioned at an angle to the contact surface 122, preferably perpendicular to it. In the present embodiment, the shaft element 140 is inserted into the through-hole 121 from the other end, which will later abut the shaft head section 141, and is held in place by the y-axis. Fig. 6A is inserted from bottom to top into the through hole 121 until the shaft head section 141 rests against the first busbar 120.

[0170] When the shaft element 140 is inserted into the through-hole 121, the surface area of ​​the contact surface 122 around the through-hole 121 can be pressed in a direction opposite to the insertion direction of the shaft element 140 using a tool (not shown). The tool may, for example, have a surface for pressing all or part of the contact surface 122. Pressing the contact surface 122 by the tool in the direction opposite to the insertion direction of the shaft element 140 prevents excessive deformation of the first busbar 120. After the insertion process, the first busbar 120 may be a flat, uncurved plate, or it may have a curved surface that is slightly convex in the insertion direction of the shaft element 140, as described above. Fig. 6A upwards). In Fig.6A shows the curved shape of the first busbar 120 not shown, and the first busbar 120 is shown flat.

[0171] In the present embodiment, the pressing element includes a relief hole in which the shaft element 140 is received during the stamping step. During the stamping step, in which the pressing element comes into pressure contact with the first busbar 120, into which the shaft element 140 is inserted, the shaft element 140 is received in a relief hole. The relief hole is a blind hole or a through hole provided in the pressing element. The depth direction of the relief hole is the direction in which the pressing element comes into pressure contact with the first busbar 120. In the present embodiment, the shape and dimensions of a cross-section in the depth direction of the relief hole are essentially the same as the shape and dimensions of the cross-section of the shaft section 142. Thus, the pressing element can come into pressure contact with the first busbar 120 at a desired position.

[0172] As an alternative to the present embodiment, the shape and dimensions of the cross-section in the depth direction of the relief hole can also be larger than the shape and dimensions of the cross-section of the shaft section 142. Thus, it is also possible that a portion of the contact surface 122, which is later to form the inner circumferential section 122c, does not come into pressure contact with the pressing surface area of ​​the pressing element. Therefore, the inner circumferential section 122c can project further in the direction of the uneven structure 123 after the embossing step than the outer circumferential section 122b in the first busbar 120.

[0173] The shaft element 140 is inserted before the uneven structure 123 is formed, and thus the outer surface of the first busbar 120 is supported by the tool, making it possible to prevent the uneven structure 123 from being deformed or crushed, and to form the uneven area 122a essentially flat.

[0174] In the present embodiment, the embossing step is carried out after the insertion step. This makes it possible to prevent the tool from coming into pressure contact with the uneven structure 123 during the insertion step, and thus prevent the uneven structure 123 from being deformed.

[0175] As an alternative to the present embodiment, the insertion step and the embossing step can also be performed simultaneously. Performing the insertion step and the embossing step simultaneously means that at least part of the insertion step and at least part of the embossing step overlap each other. In particular, after the pressing element is positioned on the first busbar 120 such that the pressing surface area is in contact with the contact surface 122 of the first busbar 120, the shaft element 140 can be inserted into the through-hole 121 of the first busbar 120. The insertion of the shaft element 140 causes the first busbar 120 to buckle in the insertion direction of the shaft element 140, thus allowing the first busbar 120 and the pressing element to come into pressure contact with each other.Alternatively, the shaft element 140 is used, and the shaft head section 141 pre-tensions the first busbar 120, allowing the first busbar 120 and the pressing element to come into pressure contact with each other to form the uneven structure 123.

[0176] Furthermore, the insertion step can also be performed after the embossing step. For example, the shaft element 140 can be inserted from the rear surface of the first busbar 120 towards the contact surface 122 (from the first busbar 120 towards the second busbar 200) in a state where the first busbar 120 and the second busbar 200 are in contact with each other, with the contact surface 122 and the facing surface 210 facing each other. In this case, the first busbar 120 is convex in the insertion direction of the shaft element 140 when the shaft element 140 is inserted into the through-hole 121, and the first busbar 120 begins to engage with, or continues to engage with, the second busbar 200. Thus, the upper sections 123b can be pressed into the second busbar 200.In this case, the shaft element 140 is preferably inserted loosely into the hole provided in the second busbar 200.

[0177] The present invention is not limited to the embodiments described above, and various modifications, improvements, and other aspects are possible, as long as the objective of the present invention is achieved. Hereinafter, the first and second embodiments may be referred to collectively as "the present embodiments."

[0178] The following modifications can be combined as needed.

[0179] If the hole 121 is a concave section with a bottom, the shaft section 142 can be connected to the shaft element 140 and the first busbar 120 by joining with an adhesive, soldering or the like.

[0180] The electrical device 1, the electronic component 100, and the first busbar 120 of the present embodiments are not limited to those produced by the manufacturing process described above. For example, there is no restriction to the uneven structure 123 being formed by pressure contact of the pressing element. The uneven structure 123 can also be formed by laser irradiation or can be physically cut by a cutting blade. Reference symbol list 1 electrical device 100 electronic components 110 Main body 111 electronic element 120 first busbar 121 holes, through hole 121b surrounding wall surface 122 contact area 122a uneven area 122b outer circumferential section 122c inner circumferential section 123 uneven structure 123a concave groove, concave section 123a1 floor section given by the concave grooves 123a2 wall section given by the concave grooves 123b upper section, projecting end 123rd section 124 adjacent section 124a Step area 125 ladder section 126 Oxide film 140 shaft element 141 Stock head section 142 shaft section 143 Mother 200 second busbar 210 facing area 220 second ladder section 230 second oxide film

[0181] The above embodiments include the following technical ideas: (1) Electronic component comprising a main body containing an electronic element and a busbar electrically connected to the electronic element, the busbar contains a hole, and at a contact surface into which the hole opens, an uneven area is formed around the hole, which has an uneven structure. (2) Electronic component according to (1), wherein upper sections which project as front ends in the uneven structure are flat. (3) Electronic component according to (2), wherein the uneven structure is formed by at least two concave grooves, each having a bottom section and arranged side by side, and The upper sections, which are arranged between two of the concave grooves, have a greater width than the bottom sections of the concave grooves. (4) Electronic component according to any of (1) to (3), wherein upper sections projecting as front ends into the uneven structure project further in a projection direction of the uneven structure than an outer circumferential section which is part of the contact surface and adjoins the uneven area outside the uneven area. (5) Electrical device comprising an electronic component, comprising a main body containing an electronic element and a busbar electrically connected to the electronic element, and a second busbar in contact with the first busbar, the busbar contains a hole, at a contact surface into which the hole opens, an uneven area is formed around the hole, which has an uneven structure, the second busbar is in contact with the contact surface on an adjacent surface that faces the contact surface and Upper sections, which protrude as front ends in the uneven structure, are pressed into the second busbar. (6) Electrical device according to (5), wherein the busbar includes a conductor section and an oxide film covering the conductor section, the contact surface includes an outer circumferential section, which is a part that borders the uneven area outside the uneven area, the outer circumferential section is a covered section that is covered with the oxide film, at least part of the uneven structure is an exposed section that is free from the oxide film, and the exposed section is embedded in the second busbar. (7) Electrical device according to (6), wherein the uneven structure is formed by at least two concave grooves with a bottom section, arranged side by side, the concave grooves are each defined by a bottom section and a pair of wall sections flanking the bottom section, the wall section is arranged obliquely in relation to the outer perimeter section, and at least part of the wall section is the exposed section and is in contact with the second busbar. (8) Electrical device according to any one of claims (5) to (7), wherein the second busbar includes a second conductor section and a second oxide film covering the second conductor section, a part of an outer surface of the second busbar that is in contact with the busbar, a second exposed section where the second conductor section is exposed, and another part of the outer surface of the second busbar is a second covered section, which is covered with the second oxide film. (9) Conductive busbar with a hole, wherein at a contact surface into which the hole opens, an uneven area is formed around the hole, which has an uneven structure. (10) Method for manufacturing an electronic component comprising a main body containing an electronic element and a busbar electrically connected to the electronic element, the method comprising: a forming step to create a hole in a hole forming area; and an embossing step for pressing a press element against the hole or circumference of the hole forming area to create an uneven structure around the hole or in the hole forming area, where the forming step and the embossing step are carried out simultaneously or one after the other. (11) Method for manufacturing an electrical device comprising an electronic component with a main body containing an electronic element and a busbar electrically connected to the electronic element, and a second busbar in contact with the busbar, the busbar contains a hole, at a contact surface into which the hole opens, an uneven area is formed around the hole, which has an uneven structure, the busbar and the second busbar are arranged such that the contact surface of an adjacent surface faces the second busbar, and The process includes a step in which the contact surface and the facing surface are pressed together, so that part of the uneven structure is pressed into the second busbar. (12) Method for manufacturing an electrical device according to (11), wherein the busbar comprises a conductor section and an oxide film covering the conductor section, the contact surface and the facing surface are pressed together, thereby removing part of the oxide film that is pressed against the second busbar and exposing part of the conductor section, thus forming an exposed section, and the exposed section and the second busbar come into contact with each other. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2015 - 139289 A

[0003]

Claims

[1] Electronic component comprising: a main body containing an electronic element; and a busbar that is electrically connected to the electronic element, the busbar contains a hole, and at a contact surface into which the hole opens, an uneven area is formed around the hole, which has an uneven structure. [2] Electronic component according to claim 1, wherein upper sections which project as front ends in the uneven structure are flat. [3] Electronic component according to claim 2, wherein the uneven structure is formed by at least two concave grooves, each having a bottom section and arranged side by side, and the upper sections, each arranged between two of the concave grooves, have a greater width than the bottom sections of the concave grooves. [4] Electronic component according to one of claims 1 to 3, wherein upper sections projecting as front ends in the uneven structure project further in a projection direction of the uneven structure than an outer circumferential section which is part of the contact surface and adjoins the uneven area outside the uneven area. [5] Electrical device comprising: an electronic component comprising a main body containing an electronic element and a busbar electrically connected to the electronic element; and a second busbar that is in contact with the busbar, the busbar contains a hole, at a contact surface into which the hole opens, an uneven area is formed around the hole, which has an uneven structure, the second busbar is in contact with the contact surface on an adjacent surface that faces the contact surface and Upper sections, which protrude as front ends in the uneven structure, are pressed into the second busbar. [6] Electrical device according to claim 5, wherein the busbar comprises a conductor section and an oxide film covering the conductor section, the contact surface includes an outer circumferential section, which is a part that borders the uneven area outside the uneven area, the outer circumferential section is a covered section that is covered with the oxide film, at least part of the uneven structure is an exposed section that is free from the oxide film, and the exposed section is embedded in the second busbar. [7] Electrical device according to claim 6, wherein the uneven structure is formed by at least two concave grooves with a bottom section, arranged side by side, the concave grooves are each defined by a bottom section and a pair of wall sections flanking the bottom section, the wall section is arranged obliquely in relation to the outer perimeter section, and at least part of the wall section is the exposed section and is in contact with the second busbar. [8] Electrical device according to any one of claims 5 to 7, wherein the second busbar has a second conductor section and a second oxide film covering the second conductor section, a part of an outer surface of the second busbar that is in contact with the busbar, a second exposed section where the second conductor section is exposed, and another part of the outer surface of the second busbar is a second covered section, which is covered with the second oxide film. [9] Conductive busbar, with a hole, wherein at a contact surface into which the hole opens an uneven area is formed around the hole which has an uneven structure. [10] A method for manufacturing an electronic component comprising a main body containing an electronic element and a busbar electrically connected to the electronic element, wherein the method comprises: a forming step to create a hole in a hole forming area; and an embossing step for pressing a press element against the hole or circumference of the hole forming area to create an uneven structure around the hole or in the hole forming area, where the forming step and the embossing step are carried out simultaneously or one after the other. [11] Method for manufacturing an electrical device comprising an electronic component with a main body containing an electronic element and a busbar electrically connected to the electronic element, and a second busbar in contact with the busbar, the busbar contains a hole, at a contact surface into which the hole opens, an uneven area is formed around the hole, which has an uneven structure, the busbar and the second busbar are arranged such that the contact surface of an adjacent surface faces the second busbar, and The process includes a step in which the contact surface and the facing surface are pressed together, so that part of the uneven structure is pressed into the second busbar. [12] Method for manufacturing an electrical device according to claim 11, wherein the busbar comprises a conductor section and an oxide film covering the conductor section, the contact surface and the facing surface are pressed together, thereby removing part of the oxide film that is pressed against the second busbar and exposing part of the conductor section, thus forming an exposed section, and the exposed section and the second busbar come into contact with each other.

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