METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND BUSBAR
DE112023005778T5Pending Publication Date: 2025-12-24SUMIDA CORP
Patent Information
- Application Number
- DE112023005778
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-04-04
- Publication Date
- 2025-12-24
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Abstract
An electronic component (100) comprises a main body containing an electronic element, a busbar (120) electrically connected to the electronic element, and a cover section (130) that covers part of an outer surface of the busbar (120). A method for manufacturing an electronic component (100) includes a forming step. In the forming step, a pressing element is used that has a pressing surface with irregularities. In the forming step, the pressing element covers another part of the outer surface such that the pressing surface is pressed against this other part, and the cover material is placed around the pressing element to form the cover section. The irregularities are transferred to the other part when the pressing surface is pressed against this other part, thereby forming an uneven structure (123).
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Citation Information
Patent Citations
Busbar insert component
JP2019215997A