METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND BUSBAR

DE112023005778T5Pending Publication Date: 2025-12-24SUMIDA CORP
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Patent Information

Application Number
DE112023005778
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-04-04
Publication Date
2025-12-24

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Abstract

An electronic component (100) comprises a main body containing an electronic element, a busbar (120) electrically connected to the electronic element, and a cover section (130) that covers part of an outer surface of the busbar (120). A method for manufacturing an electronic component (100) includes a forming step. In the forming step, a pressing element is used that has a pressing surface with irregularities. In the forming step, the pressing element covers another part of the outer surface such that the pressing surface is pressed against this other part, and the cover material is placed around the pressing element to form the cover section. The irregularities are transferred to the other part when the pressing surface is pressed against this other part, thereby forming an uneven structure (123).
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Citation Information

Patent Citations

  • Busbar insert component

    JP2019215997A