Placement support device

Abstract

A placement support device is equipped with a recognition part that performs image processing of image data obtained by capturing an image of a feed area in which several cavities are formed for individually receiving several components, and thus recognizes the reference positions of the components in the feed area; and an evaluation part that, based on a defined area determined by the shape of the cavity receiving the component and the reference position of the component, assesses whether the component is suitable as an object for removal by a component placement machine or not.

Description

TECHNICAL AREA

[0001] The present invention relates to a placement support device. TECHNICAL BACKGROUND

[0002] A placement support device assists the placement process of a component placement machine by means of bulk material feeders. The bulk material feeders are attached to the component placement machine for placing components onto a circuit board and supply the components in a bulk state (see patent document 1). During the placement process, the component placement machine performs image processing to detect the feeding state of the components from the bulk material feeder and, based on the results of the image processing, controls the suction operation for picking up the components via suction nozzles. DOCUMENT ON THE STATE OF THE TECHNOLOGY PATENT DOCUMENT

[0003] Patent Document 1: JP 2011-114084 A SUMMARY OF THE INVENTION TASK TO BE SOLVED BY THE INVENTION

[0004] The image processing for detecting the feed status includes assessing whether the component fed into the feed area of ​​the bulk material feeder is suitable for removal by the component placement machine. An incorrect assessment in this image processing leads to errors in the removal process. Even if removal is possible, there is a risk that the subsequent processing will be affected.

[0005] The present description aims to provide a placement support device that supports the placement process by increasing the accuracy of image processing for detecting the feed status of the components from the bulk material feeder. MEANS OF SOLVING THE TASK

[0006] The present description discloses a placement support device comprising a recognition element that performs image processing of image data obtained by capturing an image of a feed area in which several cavities are formed for individually receiving several components, and thus recognizes the reference positions of the components in the feed area; and an evaluation element that, based on a defined area determined by the shape of the cavity receiving the component and the reference position of the component, assesses whether the component is suitable as an object for removal by a component placement machine.

[0007] The present description discloses a placement support device comprising a recognition element that performs image processing of image data obtained by capturing an image of a feed area in which several cavities are formed for individually receiving several components, and thus recognizes the feed angles of the components in the feed area; and an evaluation element that, based on a defined angle determined by the shape of the cavity receiving the component and the feed angle of the component, assesses whether the component is suitable as an object for removal by a component placement machine.

[0008] The present description discloses a placement support device comprising a recognition element that performs image processing of image data obtained by capturing an image of a feed area in which several cavities are formed for individually receiving several components, and thereby recognizes feed states of the components in the feed area, wherein the image processing includes a formation step for forming several blobs, an extraction step for extracting candidate blobs, whose individual center positions are contained in a correct area determined on the basis of the positions of the several cavities, from the several blobs, and a recognition step for recognizing a rectangular area containing one or more of the candidate blobs as the component in the image data;and an assessment section that, based on the condition of the component as supplied, determines whether the component is suitable as an object for removal by a component placement machine or not; is provided.

[0009] The present description also discloses the technical idea in which the “assembly support device according to one of claims 1 to 4” according to claim 6 in the original version is replaced by the “assembly support device according to one of claims 1 to 5”. ADVANTAGES OF THE INVENTION

[0010] According to the first design of the placement support device, the suitability of a component for removal is determined based on the defined area, which is determined by the shape of the cavity, and the reference position of the detected component. According to the second design, the suitability of a component for removal is determined based on the defined angle, which is determined by the shape of the cavity, and the feed angle of the detected component. According to the third design, the component is identified by extracting candidate blobs from several formed blobs. These designs allow for increased accuracy in image processing.This prevents errors from occurring during the removal process by the component placement machine and consequently maintains high productivity on the component placement machine. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a top view schematically representing a component placement machine. Fig. Figure 2 is a side view schematically representing part of a bulk material feeder, including a feed area. Fig. Figure 3 is a top view, seen from the III direction in Fig. 2. Fig. Figure 4 is a block diagram illustrating a component placement machine to which a placement support device is applied. Fig. Figure 5 is a flowchart illustrating the recognition processing of a supply state. Fig. 6 is a view for displaying image data after the image has been captured of the input area. Fig. Figure 7 is an enlarged view showing image data after blob education processing. Fig. Figure 8 shows enlarged views illustrating an extended part of the Fig. 7. Fig. Figure 9 shows explanatory views for the representation of virtual components, which are recognized as blobs in the image data. Fig. Figure 10 shows views illustrating the relationship between the center of the detected component and an area in a cavity where the component center may be located. Fig. Figure 11 shows views illustrating a component taken in a cavity in a normal position, two components taken in the cavity in an abnormal position, and the corresponding blobs. Fig. Figure 12 shows views illustrating the relationship between a feed angle of the detected component and a defined angle in the cavity. Fig. Figure 13 shows views illustrating several components that are not suitable for removal in the feed area, and the corresponding blobs. EXECUTION OF THE INVENTION 1. Summary of a placement support device 50

[0011] A placement support device 50 assists the placement process by a component placement machine 10 using bulk material feeders 30. In the present embodiment, the placement support device 50 is integrated into a control device 20 of the component placement machine 10. The placement support device 50 suppresses the occurrence of errors during the removal process by increasing the accuracy of the image processing for detecting the feed status of the components supplied by the bulk material feeder 30.

[0012] The aforementioned component placement machine 10 performs a placement operation to populate a circuit board 91 with components as a predefined circuit board processing operation. The component placement machine 10, together with other circuit board processing machines, is arranged in the conveying direction of the circuit board 91 and forms a production line. Several circuit board processing machines are each equipped with a main computer 60 (see figure). Fig. 4), which holistically controls the production line, is communicatively connected. The production line is equipped, for example, with a printing press, the component placement machine 10, a reflow oven and a testing machine as several circuit board processing machines. 2. Design of the component placement machine 102-1. Circuit board conveyor device 11

[0013] The component placement machine 10 is equipped with a circuit board conveyor 11, as shown in Fig. Figure 1 shows the circuit board conveyor device 11 transports the circuit board 91 sequentially in the conveying direction and positions the circuit board 91 at a predetermined location in the machine. 2-2. Component feeding device 12

[0014] The component placement machine 10 is equipped with a component feeder 12. The component feeder 12 supplies components that are placed on the circuit board 91. The component feeder 12 has several slots 121, each equipped with a feeder 122. For example, a belt feeder is used as the feeder 122, which feeds the components by advancing a carrier belt containing many components so that they can be removed. Alternatively, a bulk feeder 30 is used as the feeder 122, through which the components, which are in a bulk state, are fed so that they can be removed. The bulk feeder 30 will be described in detail later. 2-3. Component transfer device 13

[0015] The component placement machine 10 is equipped with a component transfer device 13. The component transfer device 13 transfers the component fed by the component feeder 12 to a predetermined placement location on the circuit board 91. The component transfer device 13 is equipped with a head drive 131, a motion frame 132, a placement head 133, and suction nozzles 134. The head drive 131 moves the motion frame 132 in the horizontal direction (X and Y directions) by means of a linear motion mechanism. The placement head 133 is detachably fixed to the motion frame 132 by a clamping element (not shown) and is designed to be movable in the horizontal direction within the machine.

[0016] Several suction nozzles 134 are rotatably and vertically mounted on the placement head 133. The suction nozzle 134 is a holding element that picks up and holds the component fed by the feeder 122. The suction nozzle 134 uses supplied vacuum air to draw in the component fed by the feeder 122. A chuck, etc., which holds the component by gripping, can be used as the holding element attached to the placement head 133. 2-4. Component camera 14, circuit board camera 15

[0017] The component placement machine 10 is equipped with a component camera 14 and a circuit board camera 15. The component camera 14 and circuit board camera 15 are digital image acquisition devices with image sensors, such as CMOS, etc. The component camera 14 and circuit board camera 15 capture an image based on a control signal and transmit the image data obtained through image acquisition. The component camera 14 is designed to capture an image of the component held by the suction nozzle 134 from below. The circuit board camera 15 is mounted integrally with the placement head 133 on the movement frame 132 and is movable in the horizontal direction. The circuit board camera 15 is designed to capture an image of the circuit board 91 from above.

[0018] The image acquisition object of the circuit board camera 15 is not limited to the surface of the circuit board 91. Various devices, etc., can also serve as image acquisition objects, provided they lie within the movable area of ​​the movement frame 132. In the present embodiment, the circuit board camera 15 can, for example, perform image acquisition such that the feed area As for feeding the components from the bulk material feeder 30, or reference marks 49 provided on the upper part of the bulk material feeder 30, are within the camera's field of view, as shown in Fig. 3 shown. In this way, the circuit board camera 15 can also be used to capture images of various image capture objects in order to obtain image data for use in various image processing applications. 2-5. Control device 20

[0019] The component placement machine 10 is equipped with a control device 20, as shown in Fig. Figure 1 shows that the control device 20 essentially consists of a CPU, various memory components, and a control circuit. The control device 20 is provided with a memory component 21, as shown in Figure 1. Fig. Figure 4 shows the memory section 21, which is formed from a hard disk device or storage device such as flash memory. A control program M1, used for controlling the assembly process, and various data, such as component data M2, cavity information M3, etc., are stored in the memory section 21 of the control device 20.

[0020] The control program M1 displays the placement locations, placement angles, and component types of the components to be placed on circuit board 91 during the assembly process, in a planned placement sequence. Assembly processing here refers to a process in which a pick-and-place cycle, comprising a removal cycle and a placement cycle, is repeated several times. The aforementioned "removal cycle" is a process in which the removal operation for the component fed by the component feeder 12 is repeated several times using the suction nozzle 134.

[0021] The aforementioned "placement cycle" is a process in which the placement operation for placing the removed component at a predetermined placement location on circuit board 91 is repeated several times at a predetermined placement angle. In this way, the execution sequence in the PP cycle is predetermined in the control program M1. This cycle consists of multiple removal and placement operations, grouped according to the number of suction nozzles 134 supported on the placement head 133 and the movement path of the placement head 133.

[0022] The component data M2 contains shape data for each component type. The "shape data" includes at least the component's outer edge shape, the shape of the component's feature, and the component's size. The component's "outer edge shape" corresponds to the shape of its outer edge when the inside of the component is separated from the background using the component's outer edge as the boundary.

[0023] The "shape of the feature" of the component corresponds to the boundary shape of the external feature assigned to the component, which is based on the shape, pattern, color, etc. Corners, bumps, clamps, leads, etc., can be used as the feature of the component. Furthermore, the component data M2 can include not only the shape data, but also, for example, the maximum permissible movement speed (degree of acceleration), the point of extraction (e.g., the point of contact with the suction nozzle 134), etc., for each component.

[0024] The cavity information M3 refers to information about cavities 45 formed in the feed area As of the bulk material feeder 30 for the individual pickup of components, and this information is related to the identification information (ID) of the bulk material feeder 30. The cavity information M3 can include the shape (including the length and depth of each side), position, and direction of the cavities 45 in the feed area As, as well as the type of corresponding components, etc. The processing using the cavity information M3 will be described in detail later.

[0025] The control device 20 performs a detection process to determine the holding state of the component held by each of the multiple holding elements (suction nozzles 134). Specifically, the control device 20 processes the image data acquired by the component camera 14 and recognizes the position and angle of each component relative to the reference position of the placement head 133. The control device 20 can acquire an image of the component from the side, bottom, or top not only using the component camera 14, but also, for example, using a head camera unit integrated with the placement head 133, and process the resulting image data.

[0026] The control device 20 controls the placement operation of the placement head 133 in the placement process such that the component is placed on the circuit board 91 in a predefined position. The control device 20 controls the placement operation based on the holding state of the detected component. That is, the control device 20 corrects the position of the placement head 133 and the angle of the suction nozzles 134 about the Q-axis such that the deviation of the position and angle of the component held by the suction nozzle 134 from the Q-axis (rotational axis of the suction nozzle 134) is corrected. As a result, a predefined placement location, to which the control program M1 indicates, is populated with the component held by the suction nozzle 134 at a predefined placement angle. 3. Construction of the bulk material feeder 30

[0027] The bulk material feeder 30 is attached to the component placement machine 10 and functions as part of the component feeding device 12. The bulk material feeder 30 feeds components that are contained in a component housing in an unpackaged bulk state (in a loose state where the individual components are irregular), unlike in a carrier belt. Therefore, the bulk material feeder 30 has the advantage of eliminating the need to insert the carrier belt, retract the used belt, etc., since, unlike the belt feeder, no carrier belt is used in the bulk material feeder 30.

[0028] Bulk material feeder 30 includes, for example, a type for feeding components in an irregular orientation to the flat feed area As. However, on the component placement machine 10, the components cannot serve as removal objects if they are so close together in the feed area As that they come into contact with each other, or if they pile up (are in a state overlapping in the vertical and vertical directions), or if they are in a sideways orientation where the width of the component corresponds to the vertical and vertical directions. Bulk material feeder 30 also includes a type for feeding components in an aligned state in the feed area As, so that the proportion of removable components is increased. In the present embodiment, the bulk material feeder 30 of the component alignment type is described by way of example.

[0029] On the bulk material feeder 30, a track unit 40 is provided in a pivotable and removable manner on a feeder main body 31, which is formed in the shape of a flat box. At the front part of the feeder main body 31 (at the right end in Fig. 2) A connecting element 311 and two positioning pins 312 are provided. When the feeder main body 31 is placed in the slot 121 of the component feeder 12, it is supplied with power via the connecting element 311 and brought into a state that can communicate with the control device 20 of the component placement machine 10.

[0030] Vibrations are applied to the track unit 40 by a vibration device 35. The track unit 40 includes a conveyor track R, on which several components are transported, and a feed area As, which is connected to the conveyor track R and open upwards to allow the removal of multiple components. The track unit 40 is configured to rotate in the forward and reverse direction of the feeder main body 31 (left-right direction). Fig. 3) extends. At both edges of track unit 40 in the lateral direction (upward and downward direction in Fig. 3) A pair of side walls 46, projecting upwards, is formed. The pair of side walls 46 are wall elements which, together with the front part 47 of the track unit 40, enclose the circumferential edge of the conveyor track R and thus prevent the components conveyed on the conveyor track R from escaping.

[0031] In the supply area As of the track unit 40, several cavities 45 are formed, as shown in Fig. Figure 3 shows that each of the several cavities 45 is open upwards to accommodate the component in a position where the component's thickness direction corresponds to the upward and downward directions. In the present embodiment, several cavities 45 are arranged in a staggered arrangement. The "feed area As" of the track unit 40 is a region for feeding components in a bulk state, from which the components can be removed by the suction nozzles 134 supported on the loading head 133. Furthermore, the "conveyor path R" of the track unit 40 is a component path along which the component, guided from the side of the component housing to the track unit 40, is conveyed to the feed area As.

[0032] The aforementioned vibration device 35 imparts vibrations to the track unit 40 such that several components are conveyed along the conveyor track R. By vibrating the track unit 40, either a front and upper external force or a rear and upper external force is applied to the components. As a result, several components are conveyed to the front or rear of the track unit 40. By controlling the operation of the vibration device 35 via a feeder control device 36, the bulk material feeder 30 conveys the components and performs the feeding operation of the components to the feed area As. During the feeding operation, the components are received in several cavities 45 and thus brought into a state in which they can be removed through the suction nozzles 134.

[0033] A closure 48, which can close the opening of the feed area As, is provided at the upper part of the track unit 40. When the track unit 40 is attached to the feeder main body 31, the closure 48 is moved into a state in which its opening and closing operation is controlled by a closure drive (not shown). By opening and closing the closure 48, the bulk material feeder 30 can prevent the components from escaping and foreign materials from entering the feed area As. 4. Construction of a placement support device 50

[0034] The design of the placement support device 50 is described with reference to Fig. 4 - Fig. 13 explained. The placement support device 50 supports a detection processing of the component's feed status, which is carried out by the control device 20 of the component placement machine 10 during the placement process. The detection processing of the feed status includes image processing that assesses whether the component fed to the feed area As of the bulk material feeder 30 is suitable as an object for removal by the component placement machine 10.

[0035] Specifically, the control device 20 subjects the image data D1 obtained by image acquisition using the camera (circuit board camera 15 in the present embodiment) to Fig. 6) an image processing system and detects whether components suitable for pick-and-place operation are present in the feed area As or not. If the components suitable for pick-and-place operation are present, the control device 20 detects the positions and angles of these components. The control device 20 then controls the operation of the placement head 133 in pick-and-place mode based on the results of the feed state detection processing.

[0036] If the suitability assessment described above results in an incorrect evaluation during image processing—specifically, if a part of several components is incorrectly identified as a single component, or if a foreign substance is incorrectly identified as part of the components—the position or orientation of the identified component (hereinafter also referred to as the "identified component") will differ from the actual position, which can cause errors during the picking process. Even if the component could be removed, there is a risk that subsequent processing, such as component transfer or component placement, will be affected.

[0037] In the present embodiment, therefore, a design can be applied for the placement support device 50, which is installed in the control device 20 of the component placement machine 10, by which the accuracy of the detection processing of the feed state of the components (see Fig. 5) the image processing included can be increased. Specifically, the placement support device 50 is provided with a recognition part 51 and an evaluation part 52, as shown in Fig. 4 shown. The placement support device 50 acquires image data D1, which is obtained by image acquisition using the circuit board camera 15 (S11), as shown in Fig. Figure 5 shows the recognition unit 51 performing recognition processing (S20) using the image data D1. The evaluation unit 52 performing evaluation processing (S30) determines whether the component is suitable for removal operation or not. 5-2. Recognition part 51

[0038] The recognition element 51 performs image processing of the image data D1, which is obtained by capturing images of the feed area As, in which several cavities 45 are formed for individually receiving several components 92, in order to obtain information about the recognition components 80. Blob analysis is used as a method for recognizing the components 92 scattered in the feed area As as the recognition components 80 in the present embodiment.

[0039] Specifically, the recognition unit 51 first performs a processing step (S21) on the image data D1 to create several blobs 70. In more detail, the recognition unit 51 performs a binarization of the image data D1 with a predefined threshold, whereby, for example, each pixel whose brightness value is higher than the threshold is colored white and pixels whose brightness value is lower than the threshold are colored black. Fig. Figure 7 shows an enlarged portion of the binarized image data D1, where the cavity 45 is indicated by a dashed line before processing. The blob 70 corresponds to a closed white area in the binarized image data D1.

[0040] For this purpose, a case in which the blobs 70 represent, for example, a pair of electrode sections formed longitudinally at both ends of the component 92, as shown on the left side of the Fig. 8, as well as a case in which the blob 70 represents the entirety of component 92, including its body, as shown on the right side of the Fig. 8, assumed. These depend on the type of component 92 (including the color and gloss of the body and electrode) and the threshold used for binarization. In the present embodiment, component 92 is recognized in the recognition processing (S20) by one or two blobs 70.

[0041] However, the blobs 70 in the binarized image data D1 can include, for example, components 92 or foreign materials 89 not recorded in the cavity 45 (see below). Fig. 6) illustrate how in Fig. Figure 9 shows that if these error blobs 72, 73 are incorrectly identified as part of component 92, the accuracy of the recognition processing is reduced. Therefore, the recognition component 51 extracts candidate blobs 71 suitable for recognition processing from several blobs 70 (S22). In other words, this extraction step is a processing step to eliminate blobs 70 (72, 73) that are unsuitable for recognition processing.

[0042] Specifically, the recognition part 51 extracts from several blobs 70 the candidate blobs 71 whose individual center positions 75 are contained within a correct area Rh determined by the positions of the several cavities 45 (S22). In detail, the recognition part 51 first identifies the center position 75 for each of the several blobs 70. The center position 75 can be the center or the centroid of the surrounding rectangle of the blob 70.

[0043] The “correct area Rh” determined based on the positions of the cavities 45 is an area obtained by adding a tolerance to an area in which the center of the blobs 70 corresponding to the component 92 contained in cavity 45 can exist, with this area being determined, for example, to be an area of ​​the same shape as cavity 45. The recognition part 51 selects the blobs 70 whose center positions are contained in the correct area Rh determined based on the cavity information M3 as the candidate blobs 71 (in the lower side of the Fig. 9 shown).

[0044] This allows, for example, a defect blob 72, corresponding to the closed area of ​​the component 92 not included in the cavity 45, or a defect blob 73, corresponding to the foreign material 89 located outside the cavity 45, to be eliminated and thus not used in subsequent processing steps. Depending on the context of the subsequent processing steps, a configuration can be applied in the extraction step (S22) such that the aforementioned extraction using the central positions 75 of the blobs 70 and the correct area Rh is omitted, and only the extraction of the candidate blobs 71, which correspond to at least part of the closed area of ​​the component 92, is carried out from several blobs 70 (whereby it is permissible that some may contain defect blobs).

[0045] Subsequently, the detection element 51 performs a detection step (S23) to identify a rectangular area containing one or more candidate blobs 71 as the component 92 in the image data D1. In the present embodiment, the detection element 51 identifies the rectangular area surrounding one or more candidate blobs 71 as the component 92 in the image data D1, as shown in Fig. 8 shown. This yields, for example, the recognition component 80, which is formed from a pair of candidate blobs 71, or the recognition component 80, which is formed from a single candidate blob 71.

[0046] The recognition unit 51 simultaneously recognizes information required for subsequent processing, such as reference position Ps, angle (feed angle Ls), shape (including the length of the short and long sides), area (corresponding to the number of pixels contained in the rectangular area), etc., in the feed area As for several recognition components 80. Through this processing, the recognition unit 51 recognizes the feed status of component 92 in the feed area As and allows the storage unit 21 to store the results of the recognition.

[0047] The recognition processing described above (S20) assumes that only the component 92 correctly positioned in the cavity 45 serves as an object for the removal operation of the component placement machine 10. In the case of the bulk material feeder 30 of the type that has no cavities 45 in the feed area As, the recognition element 51 can extract the candidate blobs 71 from several blobs 70, e.g., provided they have a certain surface area and a blob shape similar to a rectangle, and thus determine the position and shape of the recognition component 80 in the feed area As. 5-3. Assessment section 52

[0048] The assessment section 52 evaluates, based on the feed condition of component 92, whether the component 92 (recognition component 80) recognized in the recognition processing (S20) is suitable as the object for removal by the component placement machine 10 or not (S30). Even if a recognition component 80 were recognized in the recognition processing (S20) using the candidate blobs 71, which correspond to at least part of the closed area of ​​component 92, the recognition component 80 may still not be suitable for removal.

[0049] The reason for this is assumed to be that the detection component 80 is detected, for example, by the fact that two components 92, which are received in the cavity 45 in such a way that their longitudinal direction corresponds to the upward and downward direction (see left side in Fig. 11), the electrode sections of the individual components 92 are incorrectly identified as the electrode sections of one component 92. Furthermore, it is to be assumed that the component 92 received in the cavity 45, which overlaps at least partially with another component 92 (see right side in Fig. 13), is incorrectly identified in the same way as above.

[0050] If the removal processing of the blob 70 outside the cavity 45 is omitted in the detection processing (S20), it is assumed that the detection component 80 is detected by incorrectly identifying the defect blob 73 corresponding to the foreign substance 89 as part of the component 92. Even if the removal processing described above is performed, it is assumed that the detection component 80 is detected if, for example, an electrode section of each of two components 92 is positioned in the cavity 45 in a top view, thus incorrectly identifying the existence of a component 92 that has these electrode sections.

[0051] In the present embodiment, various configurations for the suitability assessment are applied, incorporating the causes for false detection assumed above. The configurations of the suitability assessment mentioned later (S31, S32) can be appropriately combined or partially omitted depending on the circumstances, taking into account the type of components 92, their image acquisition environment, the shape of the feed area As of the bulk material feeder 30, etc.

[0052] Assessment Part 52 first assesses the quality of the blobs 70 based on the number of blobs 70 forming the recognition component 80 (candidate blobs 71) (S31). Specifically, Assessment Part 52 assesses whether the surface areas of the blobs 70 are contained within a specific range, which is predetermined according to the number of blobs 70 forming the recognition component 80. If the surface area of ​​at least one of the blobs 70 forming the recognition component 80 is not within the specified range, Assessment Part 52 assesses that the blob 70 represents, for example, a foreign substance in the cavity 45 or a component 92 in an unsuitable position and is therefore defective.

[0053] In addition to or instead of the above assessment based on surface area, assessment part 52 evaluates the quality of the blobs 70 depending on whether the shape of the blobs 70 forming the recognition component 80 is similar to the shape corresponding to the closed area of ​​the component 92. That is, in the case of one blob 70, the quality of the blob 70 is evaluated depending on whether its shape is similar to the overall shape of the component 92 or not, or in the case of two blobs 70, depending on whether these shapes are each similar to the shape of the paired electrode sections of the component 92 or not.

[0054] The evaluation part 52 then assesses whether the recognition component 80 represents component 92, which is removable and fed into the feed area As, or not (S32). Specifically, the evaluation part 52 selectively performs the following assessments (A) - (E). In the present embodiment, the evaluation part 52 performs all of the assessments (A) - (E) in a sequence.

[0055] In assessment (A), the assessment part 52 evaluates the removal possibility of the recognition component 80 depending on whether the reference position Ps of the recognized component 92 (recognition component 80) is located within a defined area Rd or not. In the present embodiment, the reference position Ps of the component 92 (recognition component 80) is determined to be the center position of the component 92, as shown in Fig. 10 shown.

[0056] The above “defined area Rd” is a region defined by the shape of the cavity 45 accommodating component 92. In the present embodiment, this area is defined as a region Rc in which the center of component 92, correctly accommodated in the cavity 45, can lie. If the reference position Ps of the detection component 80 is not located within the defined area Rd, the evaluation component 52 assesses that component 92 is not correctly accommodated in the cavity 45 and is therefore unsuitable as the object of the removal operation. Fig. 10: NG (= not good)).

[0057] In assessment (B), assessment part 52 evaluates the suitability of the recognition component 80 for removal based on a histogram of pixels of the recognition component 80 in the image data D1. Specifically, a histogram of the brightness value is generated for several pixels located on the rectangular inner surface of the recognition component 80. Assessment part 52 then determines that the component is unsuitable for removal if the shape of the histogram is not similar to that of the histogram generated for the normal component 92.

[0058] Specifically, the evaluation part 52 can assess the suitability of the removal process by determining whether the number N1, N2 of pixels with a given brightness value in the histogram (e.g., 255 to represent white) is within the normal range (Nmin - Nmax). For example, if two components 92 are positioned in a cavity 45 such that their longitudinal direction corresponds to the upward and downward directions, the electrode sections in the recorded image are larger than normal, even though the external shape of the detection component 80 is normal. In this case, the number N2 of pixels with a brightness value corresponding to white exceeds the normal range (N2 > Nmax). Therefore, the evaluation part 52 determines that the detection component 80 is not suitable as the object for removal. Fig. 11: NG).

[0059] In assessment (C), the assessment part 52 evaluates the removal possibility of the detection component 80 based on a defined angle Ld and a feed angle Ls of the detected component 92 (detection component 80) in the feed area As. The defined angle Ld is an angle determined by the shape of the cavity 45 receiving the component 92, where, in the present embodiment, the longitudinal direction of the cavity 45 (left-right direction) Fig. 12) is set to 0 degrees, as in Fig. 12 shown.

[0060] The feed angle Ls of the recognition component 80 is an angle obtained during the recognition processing (S20) formed by the longitudinal direction of the rectangular area surrounding the candidate blob 71 relative to the reference direction of the feed area As (Y-direction in the present embodiment). Depending on whether the feed angle Ls of the component 92 correctly received in the cavity 45 lies within a possible range Na relative to the specified angle Ld, the evaluation component 52 assesses whether it is suitable as the object for the removal operation. The range Na is predetermined based on the shape of the cavity 45 and the shape of the component 92.

[0061] For example, component 92, which is normally received in cavity 45, may be in a state in which another component 92 is placed above it. In this case, the assessment part 52 can determine by assessment (C) that the other component 92 is not suitable as the object of the removal operation if the feed angle Ls of the other component 92 is not within the range Na possible for the specified angle Ld ( Fig. 12: NG).

[0062] In the assessment (D), the assessment part 52 determines, based on the shape or surface area of ​​the detected component 92 (detection component 80), whether the component 92 is suitable as the object for removal by the component placement machine 10. The detection component 80 can be detected using the candidate blob 71 located in the cavity 45, for example, if a component 92 is received in the cavity 45 in an upright position and another component 92 is located on the outside of the cavity 45, as shown on the left side of the Fig. 13.

[0063] Furthermore, the detection component 80 can be detected using the candidate blob 71 located in the cavity 45 if, for example, a component 92 received in the cavity 45 overlaps at least partially with another component 92, as shown on the right side of the Fig. 13. However, this recognition component 80 may differ from the normal recognition component 80 in its area or shape.

[0064] As the design of the suitability assessment based on the area, assessment part 52 therefore concludes that the component 92 is not suitable as the object of the removal operation by the component placement machine 10 if the area of ​​the component 92 (recognition component 80), which is determined based on the number of pixels contained in the rectangular area in the image data D1, lies outside a defined range ( Fig. 13: NG). If the normal component 92 serves as the image acquisition object, the "defined area" is determined to be an area obtained by adding the tolerance based on manufacturing-related individual differences, image acquisition conditions, or image processing to the apparent area in the image data D1. If the area is enclosed within the defined area due to the pixel count of the recognition component 80, it is judged as correct in the evaluation (D).

[0065] As part of the suitability assessment based on the form, assessment section 52 also determines that the identified component 92 (identification component 80) is not suitable as the object of the removal operation by the component placement machine 10 if the ratio between the short side and the long side (aspect ratio) of component 92 (identification component 80) lies outside a defined range ( Fig. 13: NG). The “specified range” is determined to be a range obtained by adding the tolerance based on manufacturing-related individual variations, image acquisition conditions, or image processing to the ratio between the short side and the long side of the normal component 92. If the aspect ratio of the recognition component 80 is included within the specified range, it is judged to be correct in the assessment (D).

[0066] In the assessment (E), the assessment part 52 evaluates, based on the degree of incorporation of the recognition component 80 in the cavity 45 in the image data D1, whether it is suitable as the object of the removal operation or not. For example, in the case of two components 92 that are incorporated in the cavity 45 such that their longitudinal direction is inclined upwards and downwards, as shown on the right side of the Fig. 11. A portion of the outer shape of component 92 may protrude from the cavity 45, even if the outer shape of the recognition component 80 is normal. In this case, the evaluation component 52 first detects the cavity 45 in the image data D1, which is closest to component 92 (recognition component 80). Based on the image data D1 and cavity information M3, the evaluation component 52 can then identify the cavity 45, which is presumed to contain the recognition component 80.

[0067] Then, the assessment part 52 evaluates whether the entire detected detection component 80 is contained within the cavity 45 or not. If part of the detection component 80 is not enclosed within the cavity 45 (right side of the Fig. 11), the assessment part 52 concludes that component 92 (detection component 80) is not suitable as the object of the removal operation by the component placement machine 10 ( Fig. 11: NG). If, on the other hand, the entire detection component 80 is enclosed in the cavity 45 (center of the Fig. 11), it is assessed as correct in the assessment (E) ( Fig. 11: OK). When assessing whether the entire recognition component 80 has been captured or not, the tolerance of the image processing, etc., can be added.

[0068] The above assessment processing (S30), including the quality assessment of the blob (S31) and the suitability assessment of the recognition component 80 (S32), is performed sequentially for each recognition component 80 detected by the recognition part 51. This allows the placement support device 50 to obtain assessment results for several recognition components 80 at a time, determining whether they are suitable for removal or not. These assessment results are stored as information representing, for several cavities 45, whether the removable components 92 have been received or not. The removable components 92 are associated with information such as their reference positions Ps (center positions) and feed angles Ls, etc. 6. Placement processing by the component placement machine 10

[0069] The component placement process using the component placement machine 10 is explained. The component feeder 12 is equipped with bulk material feeders 30. After the bulk material feeders 30 are attached to the slots 121, the control device 20 performs a calibration process and detects the positions of the several cavities 45 in the machine. During the calibration process described above, the control device 20 first moves the circuit board camera 15 to the upper side of the reference marks 49 of the bulk material feeder 30 and acquires image data by capturing images with the circuit board camera 15.

[0070] The control device 20 then uses image processing to determine the position of the bulk material feeder 30 in the machine based on the positions of the pair of reference marks 49 and the position of the circuit board camera 15 during image acquisition, as contained in the image data. Based on the results of the calibration processing and cavity information M3, which shows the arrangement of the cavities 45, the control device 20 can obtain coordinate values ​​for each individual cavity 45.

[0071] During the component placement process, the circuit board conveyor 11 of the component placement machine 10 first performs an infeed conveying process for the circuit board 91. This conveys the circuit board 91 into the machine and simultaneously positions it at a predetermined location within the machine. Following or concurrently with the infeed conveying process of the circuit board 91, the control device 20 initiates the bulk material feeder 30 to perform the feeding operation. During the feeding operation, the bulk material feeder 30 is brought into a state in which several components 92 are at least partially contained in its multiple cavities 45. After the bulk material feeder 30 has completed its feeding operation, the placement support device 50 performs the detection process of the component 92's feeding status.

[0072] This allows certain information about the cavities 45 (addresses of the cavities 45, etc.) that currently hold the components 92 in a feed state ready for removal, as well as the reference positions Ps and feed angle Ls of the removable components 92 (components 92 suitable for removal operation), to be obtained. The control device 20 then executes the PP cycle. In the PP cycle, the control device 20 performs the removal cycle, in which the removal operation for the component 92 is repeated using several suction nozzles 134. The control device 20 controls the operation of the placement head 133 during removal such that the placement head 133 is positioned sequentially according to the reference position Ps of the removable component 92. The control device 20 determines the angle of the suction nozzle 134 according to the feed angle Ls of the removable component 92.

[0073] The control device 20 then performs the detection processing of the holding state of each component 92 held by several suction nozzles 134. In detail, the control device 20 moves the placement head 133 to the upper side of the component camera 14 and sends an image acquisition command to the component camera 14. The control device 20 processes the image data acquired by the component camera 14 and detects the position (position and angle) of each component 92 held by the several suction nozzles 134. The results of the holding state detection processing are stored in the memory unit 21 as operating results, indicating whether or not pick-up errors occurred during the pick-up process.

[0074] The control device 20 then executes the placement cycle, in which the placement operation for the component is repeated using several suction nozzles 134. During the placement operation in the placement cycle, the control device 20 controls the operation of the placement head 133 such that the components 92 are placed at the placement location specified by the control program M1. Furthermore, the control device 20 controls the operation of the placement head 133 such that the positioning and angle determination of the suction nozzle 134, relative to the placement location, are based on the results of the recognition processing.

[0075] In addition, the control device 20 performs feed control processing of the components 92 in parallel to the PP cycle described above. This feed control processing includes setting the timing of the feed operation for component 92 from the bulk material feeder 30, issuing the feed operation command, processing the feed status detection, and so on. For example, when the feed operation for component 92 is performed, the feed operation by the bulk material feeder 30 takes place within a period from the completion of the removal cycle in the current PP cycle until the beginning of the removal cycle in the next PP cycle. Once the feed operation by the bulk material feeder 30 is complete, the placement support device 50 again performs the feed status detection processing described above.

[0076] The control device 20 performs a removal process of the circuit board 91 when all PP cycles have been completed according to the control program M1. During the removal process of the circuit board 91, the circuit board conveyor 11 unclamps the positioned circuit board 91 and simultaneously transports the circuit board 91 outwards from the component placement machine 10. 7. Effect of the design according to the embodiment

[0077] According to the above design of the placement support device 50, the accuracy of the image processing in the detection processing of the feed state of the component 92 supplied by the bulk material feeder 30 can be increased. This prevents the occurrence of errors during the removal operation by the component placement machine 10 and consequently maintains high productivity on the component placement machine 10. 8. Variant form of the embodiment

[0078] In this embodiment, the placement support device 50 is designed to be integrated into the control device 20 of the component placement machine 10. Alternatively, the placement support device 50 can be partially or completely integrated into the main computer 60 or another external device. For example, the placement support device 50 can be integrated into the main computer 60 and also serve as a device provided for exclusive use on the production line Ln. REFERENCE MARK LIST 10 Component placement machine 12 Component feeding device 13 Component transfer device 131 Head drive 132 Movement frame 133 Placement head 134 Suction nozzle 14 Component camera 15 circuit board camera 20 Control device 21 Storage section 30 bulk material feeders 31 Feeder main body 40 career unit 45 cavity 46 side wall 47 front part 48 Closure 49 Reference mark 50 Placement support device 51 Recognition part 52 Assessment section 60 main computers 70 Blob 71 candidate blob 72, 73 Error blob 75 Middle position (of the blob) 80 Recognition component 89 Foreign substance 91 circuit board 92 components As supply area R Conveyor M1 control program M2 component data M3 cavity information D1 image data Rd defined area RC area (in which the component center can lie in the cavity) Ls feed angle Ld fixed angle Na area (of the possible feed angle in the cavity at the specified angle) Ps reference position QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2011-114084 A

[0003]

Claims

[1] Placement support device which is equipped with a recognition component that performs image processing of image data obtained by capturing images of a feed area in which several cavities are formed for individually receiving several components, and thus recognizes the reference positions of the components in the feed area, and an assessment section which, based on a defined area determined by the shape of the cavity receiving the component and the reference position of the component, assesses whether the component is suitable as an object for removal by a component placement machine or not, is provided. [2] Assembly support device according to claim 1, wherein the reference position of the component is determined to the center position of the component, wherein the defined area is determined to be an area in which the center of the component correctly received in the cavity can be located. [3] Placement support device according to claim 1 or 2, wherein the recognition part performs the image processing and thus recognizes feed angles of the components in the feed area, wherein the evaluation part assesses, based on a defined angle which is determined by the shape of the cavity receiving the component and the feed angle of the component, whether the component is suitable as the object of the removal operation by the component placement machine or not. [4] Placement support device which is equipped with a recognition component that performs image processing of image data obtained by capturing images of a feed area in which several cavities are formed for individually receiving several components, and thus recognizes feed angles of the components in the feed area, and a judgment section which, based on a defined angle determined by the shape of the cavity receiving the component and the feed angle of the component, assesses whether the component is suitable as an object for removal by a component placement machine or not. [5] A placement support device according to claim 3 or 4, wherein the evaluation part assesses whether the component is suitable as the object of the removal operation or not, depending on whether the feed angle of the component correctly received in the cavity is within a range possible for the specified angle or not. [6] Placement support device according to one of claims 1 to 4, wherein the recognition part performs the image processing of the image data and thereby recognizes the feed states of the components in the feed area, wherein the image processing comprises a formation step for forming several blobs, an extraction step for extracting candidate blobs, whose individual center positions are contained in a correct area determined on the basis of the positions of the several cavities, from the several blobs, and a recognition step for recognizing a rectangular area containing one or more of the candidate blobs as the component in the image data, and wherein the evaluation part assesses, on the basis of the feed state of the component, whether the component is suitable as the object of the removal operation by the component placement machine or not. [7] A placement support device comprising a recognition element that performs image processing of image data obtained by capturing an image of a feed area in which several cavities are formed for individually receiving several components, and thereby recognizes feed states of the components in the feed area, wherein the image processing comprises a formation step for forming several blobs, an extraction step for extracting candidate blobs, whose individual center positions are contained in a correct area determined on the basis of the positions of the several cavities, from the several blobs, and a recognition step for recognizing a rectangular area containing one or more of the candidate blobs as the component in the image data, and an evaluation element that, on the basis of the feed state of the component, assesses whether the component is suitable or not as an object for removal by a component placement machine.

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