Assembly support device

Abstract

An assembly support device comprises a recognition section configured to perform image processing on image data acquired by capturing an image of a feed area in which multiple components are fed in a bulk state, and to recognize the component in the feed area, wherein the image processing includes a generation step to generate multiple BLOBs, an extraction step to extract a candidate BLOB corresponding to a closed area of ​​at least one part of the component from the multiple BLOBs, and a recognition step to recognize a rectangular area comprising one or more of the candidate BLOBs as the component in the image data, and a determination section configured to determine, based on a shape or area of ​​the recognized component, whether the component is suitable for a target of a pick-up operation by a component picker.

Description

Technical field

[0001] The present invention relates to an assembly support device. State of the art

[0002] An assembly support device assists an assembly process using a component placement machine that employs a bulk material feeder. The bulk material feeder is integrated into a component placement machine that mounts a component onto a circuit board and feeds components in a bulk state (see patent reference 1). During an assembly operation, a component placement machine performs image processing to detect the feeding state of a component by such a bulk material feeder and controls the component pickup process using a suction nozzle based on the image processing result. List of cited documents Patent literature

[0003] Patent Literature 1:JP2011-114084 Summary of the invention; Technical task

[0004] Image processing for detecting a feeding state involves determining whether a component being fed into the feeding area of ​​a bulk material feeder is suitable for a pick-up operation by a component placement machine. If such image processing results in an incorrect detection, this can lead to an error in the pick-up operation, and even if the pick-up can be performed successfully, the subsequent processing can be impaired.

[0005] One objective of the present description is to provide an assembly support device that assists an assembly process by improving the accuracy of image processing for detecting the feeding state of a component by a bulk material feeder. Solution to the task

[0006] The present description discloses an assembly support device comprising a recognition section configured to perform image processing on image data acquired by capturing an image of a feed area in which multiple components are fed in a bulk state, and to recognize the component in the feed area, wherein the image processing includes a generation step for generating multiple BLOBs, an extraction step for extracting a candidate BLOB corresponding to a closed area of ​​at least one part of the component from the multiple BLOBs, and a recognition step for recognizing a rectangular area comprising one or more of the candidate BLOBs as the component in the image data, and a determination section configured to determine, based on a shape or surface of the recognized component,whether the component is suitable for a placement operation by a component picker.

[0007] The present description comprises an assembly support device with a recognition section configured to process image data obtained by capturing an image of a feed area in which several cavities are formed, each accommodating several components, and to recognize a position and shape of the component in the feed area, and a determination section configured to determine, based on whether the entire detected component is housed in the cavity closest to the component in the image data, whether the component is suitable for a target of a pick-up operation by a component picker.

[0008] The present description also discloses a technical idea wherein “the assembly support device according to claim 1 or 2” in claim 4 is amended to “assembly support device according to one of claims 1 to 3” upon filing of an application, and a technical idea wherein “the assembly support device according to claim 1 or 2” in claim 5 is amended to “assembly support device according to one of claims 1 to 4” upon filing of the application. Advantageous effects of the invention

[0009] With a first configuration of the assembly support device, a BLOB method is used to determine, based on the shape or surface of the detected component, whether a detected component is suitable for a target of a picking operation. Furthermore, with a second configuration of the assembly support device, its suitability is determined based on whether the detected component fits completely within a cavity. This configuration improves the accuracy of image processing. Consequently, it is possible to prevent errors during a picking operation by a component placement machine, thereby maintaining high productivity. Brief description of the drawings Fig. Figure 1 is a top view that schematically illustrates a component placement machine. Fig. Figure 2 is a side view that schematically illustrates a part of a bulk material feeder, which includes a feed area. Fig. 3 is a top view from direction III of Fig. 2 seen. Fig. Figure 4 is a block diagram illustrating a component placement machine that uses an assembly support device. Fig. Figure 5 is a flowchart illustrating the detection processing of a feed state. Fig. Figure 6 is a view illustrating image data obtained by capturing an image of the feed area. Fig. Figure 7 is an enlarged view illustrating image data obtained by performing a BLOB generation process. Fig. 8 is an enlarged view showing one from Fig. 7 extracted part illustrated. Fig. Figure 9 is a view illustrating a virtual component that was identified as a BLOB in image data. Fig. Figure 10 is a view illustrating a relationship between the center of a detected component and an area where the center of a component may be located in a cavity. Fig. Figure 11 is an illustrative view showing a component placed in a normal position in a cavity, two components placed in an abnormal position in a cavity, and a corresponding BLOB. Fig. Figure 12 is an illustrative view showing a relationship between a feed angle of a detected component and a defined angle in a cavity. Fig. Figure 13 is an illustrative view showing several components unsuitable for collection in the feed area and a corresponding BLOB. Description of exemplary embodiments 1. Overview of the assembly support device 50

[0010] The assembly support device 50 assists an assembly process by the component placement machine 10 using the bulk material feeder 30. In the present embodiment, the assembly support device 50 is integrated into the control device 20 of the component placement machine 10. The assembly support device 50 improves the accuracy of the image processing for detecting the feeding status of a component fed by the bulk material feeder 30, thereby suppressing the occurrence of an error during a scanning operation in an assembly process.

[0011] The component placement machine 10 described above performs an assembly process to attach a component to the circuit board 91 as a predetermined circuit board operation. The component placement machine 10, together with another circuit board processing machine, forms a production line installed in the conveying direction of the circuit board 91. Each of the several circuit board processing machines is connected to a host computer 60 (see Fig. 4) connected, which controls the entire production line. The production line includes a printer, a component placement machine 10, a reflow oven and an inspection device as several circuit board processing machines. 2. Configuration of the component placement machine 102-1. Circuit board conveyor 11

[0012] As in Fig. As shown in Figure 1, the component placement machine 10 includes a circuit board conveyor 11. The circuit board conveyor 11 then conveys the circuit board 91 in a conveying direction and positions the circuit board 91 at a predetermined position within the placement machine. 2-2. Component feeding device 12

[0013] The component placement machine 10 includes a component feeding device 12. The component feeding device 12 feeds a component to be mounted on the circuit board 91. A feeder 122 is arranged in each of the several slots 121 in the component feeding device 12. A belt conveyor, which feeds a component to be picked up, for example by feeding and moving a carrier belt that holds a large number of components, is attached to the feeder 122. Additionally, a bulk material feeder 30, which feeds a component picked up in a bulk state, is attached to the feeder 122. Details of the bulk material feeder 30 are described below. 2-3. Component transfer device 13

[0014] The component placement machine 10 comprises a component transfer device 13. The component transfer device 13 transfers a component fed by the component feeder 12 to a predetermined placement position on the circuit board 91. The component transfer device 13 comprises a head drive device 131, a motion table 132, a placement head 133, and a suction nozzle 134. The head drive device 131 moves the motion table 132 horizontally (X-direction and Y-direction) by means of a linear motion mechanism. The placement head 133 is detachably attached to the motion table 132 by a clamping element (not illustrated) and is movably arranged horizontally within the placement device.

[0015] The placement head 133 carries several suction nozzles 134, which are rotatable, liftable, and lowerable. The suction nozzle 134 is a holding element that picks up and holds a component fed by the feeder 122. The suction nozzle 134 picks up a component fed by the feeder 122 using supplied vacuum air. A clamping device or similar can be used as the holding element, which is attached to the placement head 133 and holds a component by gripping it. 2-4. Parts camera 14 and circuit board camera 15

[0016] The component placement machine 10 comprises a component camera 14 and a circuit board camera 15. The component camera 14 and the circuit board camera 15 are digital imaging devices with imaging elements, such as CMOS. The component camera 14 and the circuit board camera 15 capture an image based on a control signal and transmit the image data acquired during image acquisition. The component camera 14 is configured to capture an image of a component held by the suction nozzle 134 from below. The circuit board camera 15 is movable on the motion table 132 in the horizontal direction and is integrally integrated with the placement head 133. The circuit board camera 15 is configured to capture an image of the circuit board 91 from above.

[0017] Furthermore, the circuit board camera 15 can use various devices or the like as imaging targets, as long as the various devices are located within an operating range of the motion table 132, in addition to using a surface of the circuit board 91 as an imaging target. For example, in the present embodiment, the circuit board 15 can be, as in Fig. Figure 3 shows how to capture an image of the feed area A, to which the bulk material feeder 30 feeds a component or a reference mark 49, which is provided on an upper part of the bulk material feeder 30, within a camera field of view. As described above, the circuit board 15 can be used together to capture images of different imaging targets in order to acquire image data that is used for various image processing operations. 2-5. Control device 20

[0018] As in Fig. As shown in Figure 1, the component placement machine 10 includes a control device 20. The control device 20 is primarily configured with a CPU, various types of memory, and a control circuit. The control device 20 includes a memory section 21, as shown in Figure 1. Fig. Figure 4 shows that memory section 21 is configured with a hard disk device or a storage device such as flash memory. Memory section 21 of the control device 20 stores various data, such as the control program M1, component information M2, and cavity information M3, which are used to control a placement process.

[0019] The control program M1 illustrates, in a planned assembly arrangement, a mounting position, a mounting angle, and a component type of the component to be mounted onto the circuit board 91 in an assembly process. Here, the assembly process comprises an operation in which a pick-and-place cycle (PP cycle), which includes a pick-up cycle and a placement cycle, is repeated multiple times. The "pick-up cycle" described above is a process in which a pick-up operation is repeated multiple times by the suction nozzle 134 to pick up the components fed by the component feeder 12.

[0020] Furthermore, the "assembly cycle" described above is a process in which an assembly operation, in which a picked-up component is mounted at a predetermined component mounting position on the circuit board 91 and at a predetermined mounting angle, is repeated multiple times. As described above, the execution sequence of the PP cycle, which consists of several picking operations and assembly operations grouped according to the number of suction nozzles 134 carried by the placement head 133, the movement path of the placement head 133, and the like, is predefined in the control program M1.

[0021] The M2 component data includes shape data for each component type. The "shape data" described above includes at least one outer edge shape of a component, a shape of a characteristic section of the component, or a dimension of the component. The "outer edge shape" of the component corresponds to the shape of the outer edge when the interior of the component and its background are divided using an outer edge of the component as the boundary.

[0022] The "shape of the characteristic section" of the component corresponds to a boundary shape of the characteristic section in appearance based on a shape, pattern, color, or similar feature of the component. A corner area, a raised section, an end section, a front section, or the like can be used as a characteristic part of a component. Furthermore, in addition to the shape data, the component data M2 can include, for example, the maximum permissible deviation in rotational speed (acceleration), the pickup position (for example, a position where contact with the suction nozzle 134 occurs), and the like for each component.

[0023] The cavity information M3 is generated in the feed area As of the bulk material feeder 30, and information on cavities 45, which individually hold components, is linked to identification information (ID) of the bulk material feeder 30. The cavity information M3 can include a shape (including the length and depth of each side), a position, an orientation, the type of the corresponding component, and the like for the cavity 45 in the feed area As. Details of the processing to which the cavity information M3 is applied are described below.

[0024] The control device 20 performs a detection processing of the holding state of a component held by each of the multiple holding elements (suction nozzles 134). In particular, the control device 20 performs image processing of the image data acquired by capturing an image with the part camera 14 and detects the position and angle of each component relative to a reference position of the placement head 133. In addition to the part camera 14, the control device 20 can, for example, perform image processing of the image data acquired by capturing an image of a component from the side, bottom, or top using a head camera unit or the like integrally provided on the placement head 133.

[0025] During an assembly process, the control device 20 controls an assembly operation by using the placement head 133, so that a component is mounted on the circuit board 91 in a predetermined position. At this point, the control device 20 controls the assembly operation based on the holding state of the detected component. That is, the control device 20 corrects the position of the placement head 133 and the angle of the suction nozzle 134 about a Q-axis to correct deviations in the position and angle of a component held by the suction nozzle 134 with respect to the Q-axis (a rotational axis of the suction nozzle 134). This ensures that the component held by the suction nozzle 134 is mounted at a predetermined component mounting position and angle, as specified by the control program M1. 3. Configuration of the bulk material feeder 30

[0026] The bulk material feeder 30 is mounted in the component placement device 10 and functions as part of the component feeding device 12. The bulk material feeder 30 feeds a component that is contained in a component container in a bulk state (a scattered state in which each position is irregular) and is not packaged like a carrier belt. Since the bulk material feeder 30 does not use a carrier belt, unlike a belt conveyor, this has the advantage that loading the carrier belt, collecting the used belt, and similar tasks are eliminated.

[0027] For example, there is a bulk material feeder 30 that delivers a component in an irregular position to a feed area As with a flat shape. However, if components are so close together that they touch or overlap (a state in which they lie on top of each other in the vertical direction), or if the components are arranged horizontally in the feed area As with their widths aligned vertically, the component picker 10 cannot consider the components as pick-up targets. To increase the proportion of pick-upable components, there is therefore a bulk material feeder 30 that feeds components into the feed area As in an aligned state. In the present embodiment, a bulk material feeder 30 is described in which the components are aligned.

[0028] The bulk material feeder 30 is equipped with a rail unit 40, which is vibratingly and detachably attached to the feeder main body 31, which is designed in the form of a flat box. At a front section (a right end section in Fig. 2) The feeder main body 31 is provided with a connector 311 and two positioning pins 312. When the feeder main body 31 is inserted into the slot 121 of the component feeder 12, power is supplied via the connector 311, and the feeder main body 31 can communicate with the control device 20 of the component placement machine 10.

[0029] The rail unit 40 is set into vibration by the vibration device 35. The rail unit 40 is designed with a conveyor track R through which several components are transported, and a feed area As, which is connected to the conveyor track R and open at the top so that several components can be received. The rail unit 40 is designed to move in a forward-backward direction (in Fig. 3 in a left-right direction) of the feeder main body 31. The pair of side walls 46, which project upwards, extends along both edges of the rail unit 40 in the width direction (in Fig. 3 in the vertical direction). The pair of side walls 46 are wall elements which, together with the front end section 47 of the rail unit 40, surround a circumferential edge of the conveyor track R and prevent a component transported along the conveyor track R from escaping.

[0030] As in Fig. As illustrated in Figure 3, several cavities 45 are formed in the feed area As of the rail unit 40. Each of the several cavities 45 is open at the top to accommodate a component in a position where the component's thickness runs vertically. In the present embodiment, several cavities 45 are arranged in a staggered manner. Here, the "feed area As" of the rail unit 40 is an area into which a component is fed in bulk and an area from which a component can be picked up by a suction nozzle 134, which is supported by a placement head 133. Furthermore, the "conveyor track R" of the rail unit 40 is a passage for a component through which the component, distributed from the component container side to the rail unit 40, is conveyed to the feed area As.

[0031] Furthermore, the vibratory application device 35 exerts a vibration on the rail unit 40, causing multiple components to be conveyed along the conveyor track R. When the rail unit 40 vibrates, a forward and upward external force or a backward and upward external force is exerted on a component. As a result, multiple components are conveyed to the front or rear of the rail unit 40. The bulk material feeder 30 conveys a component while the operation of the vibratory application device 35 is controlled by the feeder control device 36 and performs a feeding operation of the component to the feeding area As. When components are picked up by the feeding operation in multiple cavities 45, the suction nozzle 134 is in a state in which it can pick up the components.

[0032] The flap 48 can open and close the feed area As, which is located above the track unit 40. When the track unit 40 is attached to the feeder main body 31, the opening and closing operations of the flap 48 are controlled by a flap drive device (not shown). By opening and closing the flap 48, the bulk material feeder 30 can prevent a component from protruding and foreign objects from entering the feed area As. 4. Configuration of the assembly support device 50

[0033] A configuration of the assembly support device 50 is described with reference to the Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Fig. 10, Fig. 11, Fig. 12 to Fig. 13 described. The assembly support device 50 supports the recognition processing of a component's feeding state, which is performed by the control device 20 of the component placement machine 10 in an assembly process. The recognition processing of the feeding state includes image processing, and the image processing includes determining whether a component being fed to the feeding area As of the bulk material feeder 30 is suitable for a target of a picking operation by the component placement machine 10.

[0034] In particular, the control device 20 performs image processing on image data D1 (see Fig. 6) By capturing an image with a camera (in the present embodiment, the circuit board camera 15), the control device 20 detects whether there is a component in the feed area As that is suitable for a target of a capture operation and detects the position and angle of the component if a component suitable for the capture operation is present. Subsequently, the control device 20 controls the operation of the placement head 133 during a capture operation based on the result of the detection processing of a feed state.

[0035] In the suitability determination described above, errors in image processing, such as when multiple components are incorrectly identified as a single component or when a foreign object is incorrectly identified as part of a component, can lead to discrepancies between the position and orientation of a detected component (hereinafter also referred to as the "detection component") and its actual position and orientation. This can result in errors during the acquisition operation. Furthermore, even if a component can be successfully captured, there is a possibility that subsequent processing, such as component transfer or assembly, will be affected.

[0036] Therefore, in the present embodiment, the assembly support device 50 integrated in the control device 20 of the component placement device 10 has a configuration with which the accuracy of the image processing included in the recognition processing (see Fig. 5) can be improved in a component feeding state. As in Fig. As shown in Figure 4, the assembly support device 50 comprises a detection section 51 and a determination section 52. As shown in Fig. As illustrated in Figure 5, the assembly support device 50 acquires image data D1, which is obtained by taking an image with the circuit board camera 15 (S11). The recognition section 51 performs recognition processing S20 using the image data D1. The determination section 52 performs determination processing S30 to determine whether a component is suitable for a recording operation. 5-2. Recognition section 51

[0037] The recognition section 51 performs image processing on the image data D1, which was acquired by capturing the image of the feed area As, in which several cavities 45 are formed for individually receiving several components 92, and acquires information about the recognition components 80. In the present embodiment, BLOB analysis is used as a method for recognizing the components 92 scattered in the feed area As as recognition components 80.

[0038] In particular, the recognition section 51 first performs the generation step S21 to generate multiple BLOBs 70 for image data D1. Specifically, the recognition section 51 binarizes the image data D1 by using a predetermined threshold and, for example, sets white if a luminance value of each pixel is higher than the threshold, and sets black if the luminance value is less than or equal to the threshold. Fig. Figure 7 illustrates a portion of the binarized image data D1 in an enlarged view, where cavities 45 are indicated by dashed lines before processing. BLOBs 70 correspond to white closed areas in the binarized image data D1.

[0039] Here, a case is assumed in which BLOB 70, for example, specifies a pair of electrode sections formed at both ends in the longitudinal direction of component 92, as shown on the left side of Fig. Figure 8 illustrates, and indicates the entirety comprising a body of component 92, as shown on the right side of Fig. Figure 8 illustrates this. These differ from one another depending on the type of component 92 (including the color and gloss of the body and the electrode) and a threshold value used for binarization. In the present embodiment, the component 92 is recognized in the recognition processing S20 by one or two BLOBs 70.

[0040] However, as in Fig. As illustrated in Figure 9, the BLOB 70 in the binarized image data D1 can, for example, comprise a component 92 that is not housed in the cavity 45, or foreign bodies 89 (see Fig. 6) If these faulty BLOBs 72 and 73 are incorrectly identified as part of component 92, the accuracy of the detection processing decreases. Therefore, the detection section 51 extracts a suitable candidate BLOB 71 from several BLOBs 70 (S22). In other words, this extraction step is a process for removing BLOBs 70 (72 and 73) that are unsuitable for the detection process.

[0041] In particular, the recognition section 51 extracts a candidate BLOB 71 from several BLOBs 70 whose respective centers 75 encompass a suitable area Rh defined on the basis of the positions of several cavities 45 (S22). Specifically, the recognition section 51 first detects the central midpoint 75 for each of the several BLOBs 70. The central midpoint 75 can be the midpoint of a circumscribing rectangle of the BLOB 70 or the centroid of the circumscribing rectangle.

[0042] Furthermore, the “suitable area Rh” defined on the basis of a cavity 45 position is an area obtained by adding a permissible deviation to an area in which the center point of BLOB 70, corresponding to component 92, can be located with respect to cavity 45 when component 92 is housed in cavity 45, and is, for example, defined as an area having the same shape as cavity 45. Recognition section 51 extracts the BLOB 70 whose center position is encompassed by the suitable area Rh, defined on the basis of cavity information M3, as candidate BLOB 71 (shown in the lower part of Fig. 9).

[0043] Accordingly, for example, the defective BLOB 72, corresponding to a closed region of component 92 not contained within cavity 45, or the defective BLOB 73, corresponding to a foreign body 89 located outside cavity 45, can be removed so that they are not used in subsequent processing. In extraction step S22, depending on the relationship to subsequent processing, the extraction using the central position 75 of BLOB 70 and the appropriate region Rh, as described above, can be omitted, and an approach can simply be adopted in which a candidate BLOB 71, corresponding to a closed region of at least one part of component 92 among several BLOB 70s, is extracted (partial inclusion of a defective BLOB is permissible).

[0044] Subsequently, the recognition section 51 performs the recognition step S23, in which a rectangular area comprising one or more candidate BLOBs 71 is recognized as a component 92 in the image data D1. In the present embodiment, the recognition section 51 recognizes, as shown in Fig. Figure 8 illustrates a rectangular area that circumscribes one or more candidate BLOBs 71 as component 92 in the image data D1. Accordingly, for example, the detection components 80 configured with a pair of candidate BLOBs 71 and the detection components 80 configured with one candidate BLOB 71 are detected.

[0045] The recognition section 51 also recognizes information required for subsequent processing, such as the reference position Ps, an angle (feed angle Ls), a shape (including the lengths of a short side and a long side), and an area (corresponding to the number of pixels encompassed in a rectangular area) in the feed area As for each of the multiple recognition components 80. Through this processing, the recognition section 51 recognizes a feed state of the component 92 in the feed area As and stores a recognition result in memory 21.

[0046] In the recognition processing S20 described above, it is assumed that the component placement device 10 only targets the component 92, which is properly placed in the cavity 45, as the target of a picking operation. Therefore, if the bulk material feeder 30 is of a type that does not have a cavity 45 in the feed area As, the recognition section 51 can, provided that, for example, the candidate BLOB 71 has an area of ​​a certain region and a BLOB shape that is close to a rectangular shape, extract a candidate BLOB 71 from several BLOBs 70 and detect a position and shape of the recognition part 80 in the feed area As. 5-3. Determination section 52

[0047] Determination section 52 determines whether the component 92 (detection component 80) detected in recognition processing S20 is suitable for a pick-up operation by the component placement machine 10 based on a feed state of component 92 (S30). In recognition processing S20, there are cases in which the detection component 80, even if detected using a candidate BLOB 71 corresponding to a closed region of at least one part of component 92, is not suitable for the pick-up operation.

[0048] One possible cause is that if two components 92 are placed in the cavity 45 such that their longitudinal directions run vertically (see left side of Fig. 11), a section of each component 92 is incorrectly identified as a section of a component 92 and the detection component 80 is identified. Furthermore, if at least one part of another component 92 overlaps the component 92 housed in the cavity 45 (see right side of Fig. 13), it is assumed that the component is falsely detected in the same way as described above.

[0049] Furthermore, if the removal processing of BLOB 70 outside cavity 45 is omitted in the detection processing S20, it is assumed that the defective BLOB 73, corresponding to the foreign body 89, is incorrectly detected as part of component 92, and the detection component 80 is detected. Even if the removal processing described above is performed, it is assumed, for example, that if the electrode sections of both components 92 are located inside cavity 45 in the top view, component 92 with the electrode section is incorrectly detected as present, and the detection component 80 is detected.

[0050] In the present embodiment, a cause for the assumed faulty detection described above is added, and various aspects are adopted for the suitability determination. The suitability determination aspects described below (S31 and S32) can be appropriately combined or partially omitted, taking into account the type of component 92, an imaging environment, the shape of the feed area of ​​the bulk material feeder 30, and the like.

[0051] Determination section 52 first determines, based on the number of BLOBs 70 (candidate BLOBs 71) that configure the detection component 80 (S31), whether the BLOBs 70 are defective. Specifically, determination section 52 determines whether a region of the BLOB 70 lies within a specific, predefined range, which is based on the number of BLOBs 70 that configure the detection component 80. If a region of at least one of the BLOBs 70 that constitute the detection component 80 does not lie within a specific range, determination section 52 determines, for example, that the BLOB 70 is a foreign body in the cavity 45 or a component 92 in an unsuitable position, and therefore the BLOB 70 is defective.

[0052] In addition to or instead of the determination based on an area, determination section 52 determines whether the BLOB 70 is defective by determining whether a shape of the BLOB 70 that configures the detection component 80 resembles a shape corresponding to a closed region of the component 92. That is, whether the BLOB 70 is defective is determined by checking whether the BLOB 70 resembles the entire shape of the component 92 when the BLOB 70 is one, and by checking whether the BLOB 70 resembles each of the shapes of a pair of electrode sections of the component 92 when the BLOB 70 is two.

[0053] Next, the determination section 52 determines whether the recognition component 80 is the component 92 that is fed into the feed area As (S32) as receptive. Specifically, the determination section 52 selectively performs the following determinations (A) to (E). In the present embodiment, the determination section 52 performs all determinations (A) to (E) sequentially.

[0054] In determination (A), determination section 52 determines whether the detection component 80 can be received, based on whether the reference position Ps of the detected component 92 (detection component 80) is present in the defined area Rd. In the present embodiment, the reference position Ps of the component 92 (detection component 80) is defined at a central position of the component 92, as shown in Fig. 10 shown.

[0055] Furthermore, the “defined area Rd” described above is an area defined based on the shape of the cavity 45 that receives the component 92, and in the present embodiment is defined as the area Rc in which the center point of the component 92 can be located when the component 92 is properly received in the cavity 45. If the reference position Ps of the detection component 80 is not located in the defined area Rd, the determination section 52 determines that the component 92 is not properly received in the cavity 45 and is not suitable for a receiving operation. Fig. 10: NG).

[0056] In determination (B), determination section 52 determines whether the recognition component 80 can be detected based on a histogram relating to pixels of the recognition component 80 in the image data D1. In particular, a histogram of the luminance values ​​of several pixels within a rectangular shape of the recognition component 80 is generated, and if the shape of the histogram does not match a histogram generated for the component 92, determination section 52 determines that the recognition component 80 is not suitable for a detection operation.

[0057] As in Fig. As illustrated in Figure 11, the determination section 52 can determine whether an image acquisition is possible by considering whether the number of pixels N1 and N2 with a given luminance value (e.g., 255 for white) in a histogram lies within a normal range (Nmin to Nmax). For example, if two components 92 are positioned in the cavity 45 such that their longitudinal direction is vertical, even with a normal detection component 80, an image of an electrode section will be acquired that is larger than usual, and the number of pixels N2 with a white luminance value will exceed a normal range (N2 > Nmax). In such a case, the determination section 52 determines that the detection component 80 is not suitable for a target of an image acquisition operation ( Fig. 11: NG).

[0058] In determination (C), determination section 52 determines whether the detection component 80 can be received based on the defined angle Ld in the feed area As and the feed angle Ls of the detected component 92 (detection component 80). The defined angle Ld described above is an angle defined based on a shape of the cavity 45 that receives the component 92, and in the present embodiment, as in Fig. Figure 12 shows an angle where the longitudinal direction of the cavity is 45° (the left-right direction in Fig. 12) 0 degrees.

[0059] The feed angle Ls of the detection component 80 is an angle detected during the detection processing S20 and is an angle formed by a longitudinal direction of a rectangular area that circumscribes the candidate BLOB 71 with respect to a reference direction (in this embodiment, the Y-direction) of the feed area As. The determination section 52 determines whether the component 92 is suitable for a target of a pickup operation based on whether the feed angle Ls of the component 92 lies within the range Na that can be taken with respect to the defined angle Ld when the component 92 is suitably accommodated in the cavity 45. The range Na described above is predetermined based on a shape of the cavity 45 and a shape of the component 92.

[0060] For example, another component 92 can be arranged above the component 92 that is normally housed in the cavity 45. In this respect, according to determination (C) described above, if the feed angle Ls of another component 92 is not within the range Na that can be assumed with respect to the defined angle Ld, determination section 52 can determine that another component 92 is not suitable for a receiving operation target ( Fig. 12: NG).

[0061] In determination (D), determination section 52 uses a shape or surface of the detected component 92 (detection component 80) to determine whether the component 92 is suitable for a target of a picking operation by the component placement machine 10. For example, as shown on the left side of Fig. Figure 13 illustrates that if a component 92 is housed in an erect state in the cavity 45 and another component 92 is located outside the cavity 45, the detection component 80 can be detected using the candidate BLOB 71, which is located inside the cavity 45.

[0062] Furthermore, for example, as shown on the right side of Fig. Figure 13 illustrates that if at least part of another component 92 overlaps the component 92 housed in the cavity 45, the detection component 80 will be detected when the candidate BLOB 71 located within the cavity 45 is used. However, such a detection component 80 may differ in its area or shape from a normal detection component 80.

[0063] Therefore, as an aspect of the suitability determination based on an area, section 52 stipulates that if an area of ​​component 92 (detection component 80), calculated on the basis of the number of pixels contained in a rectangular area in the image data D1, lies outside a defined area, the corresponding component 92 is not suitable for a target of a recording operation by the component placement operator 10 ( Fig. 13: NG). The “defined area” described above is defined as an area obtained by adding an allowable deviation based on individual differences in manufacturing, imaging conditions, and image processing to an apparent area occupied in the image data D1 when the normal component 92 is an imaging target. If an area based on the number of pixels of the detection component 80 lies within the defined area, it is deemed suitable in determination (D).

[0064] Furthermore, if a ratio (aspect ratio) between a short side and a long side of a detected component 92 (detection component 80) lies outside a defined range established as an aspect of the suitability determination based on a shape, determination section 52 determines that the component 92 (detection component 80) is not suitable for a target of a pickup operation by the component picker 10 ( Fig. 13: NG). The “defined range” described above is defined as a range obtained by adding an allowable deviation based on individual differences in manufacturing, imaging conditions, and image processing to a ratio between a short side and a long side of a normal component 92. If the aspect ratio of the detection component 80 is within the defined range, it is deemed suitable in determination (D).

[0065] In determination (E), determination section 52 determines whether the recognition component 80 is suitable for a target of an imaging operation, based on a degree of adaptation of the recognition component 80 in the determination image data D1 and the cavity 45. Here, as shown, for example, on the right side of Fig. Figure 11 illustrates that if two components 92 are placed in cavity 45 such that their longitudinal directions are inclined vertically, part of the outer shape may protrude from cavity 45, even if the detection component 80 has a normal outer shape. Therefore, the detection section 52 first detects the cavity 45 that is closest to component 92 (detection component 80) in the image data D1. At this point, the detection section 52 can detect the cavity 45 that is intended to receive the detection component 80, based on the image data D1 and the cavity information M3.

[0066] Next, determination section 52 determines whether the entire detection component 80 is housed in cavity 45. If part of the detection component 80 is not housed in cavity 45 (right side in Fig. 11), the determination section 52 determines that the component 92 (detection component 80) is not suitable for a target of a pickup operation by the component placement machine 10 ( Fig. 11: NG). If, however, the entire detection component 80 is housed in cavity 45 (center of Fig. 11), it is determined to be suitable in provision (E) ( Fig. 11: OK). When determining whether the entire recognition component 80 is accommodated, a permissible deviation of the image processing or the like may be added.

[0067] The determination process S30 described above, which includes the quality determination of BLOB (S31) and the suitability determination of the recognition component 80 (S32), is subsequently performed for all recognition components 80 detected by the recognition section 51. Accordingly, the assembly support device 50 receives a determination result as to whether each of the multiple recognition components 80 is suitable for a picking operation. The determination result is stored, for example, as information indicating whether the component 92 to be picked up can be accommodated in each of the multiple cavities 45. Furthermore, information such as the reference position Ps (center position) and the feed angle Ls are linked to the component 92 to be picked up. 6. Assembly process by the component picker 10

[0068] An assembly process using the component placement machine 10 is described. It is assumed that the component feeding device 12 is equipped with a bulk material feeder 30. After the bulk material feeder 30 has been inserted into the slot 121, the control device 20 performs a calibration process and detects the positions of several cavities 45 within the placement machine. In the calibration process described above, the control device 20 first moves the circuit board camera 15 over the reference mark 49 of the bulk material feeder 30 and acquires image data by taking a picture with the circuit board camera 15.

[0069] The control device 20 then detects the position of the bulk material feeder 30 within the pick-and-place machine based on the positions of a pair of reference marks 49 included in the image data, through image processing, and the position of the circuit board camera 15 when an image is captured. The control device 20 can acquire a coordinate value for each cavity 45 based on the result of the calibration processing and the cavity information M3, which specifies an arrangement of the cavities 45.

[0070] During the assembly process, the circuit board conveyor 11 of the component placement machine 10 first loads the circuit board 91. Accordingly, the circuit board 91 is loaded into the placement machine and positioned at a predetermined position within the machine. The control device 20 then instructs the bulk material feeder 30 to perform a feeding operation after or concurrently with the loading of the circuit board 91. During this feeding operation, several components 92 are picked up into at least some of the cavities 45 of the bulk material feeder 30. After the feeding operation by the bulk material feeder 30 is completed, the assembly support device 50 performs a detection process to determine the feeding status of the component 92.

[0071] Accordingly, specific information (such as the address of cavity 45) of cavity 45, which receives the current component 92 in a receptive manner as a feed state, as well as the reference position Ps and the feed angle Ls of the receptive component 92 (component 92 suitable for a receptive operation), are acquired. Next, the control device 20 executes the PP cycle. In the PP cycle, the control device 20 performs a receptive cycle in which a receptive operation to pick up components 92 using multiple suction nozzles 134 is repeated. At this point, the control device 20 controls the operation of the placement head 133 in a receptive operation such that the placement head 133 is subsequently positioned according to the reference position Ps of the component 92 to be picked up.At this point, the control device 20 determines an angle of the suction nozzle 134 according to the feed angle Ls of the component 92 to be picked up.

[0072] The control device 20 then performs a detection processing of the holding state of components 92, each of which is held by several suction nozzles 134. Specifically, the control device 20 moves the placement head 133 over the part camera 14 and sends an imaging command to the part camera 14. The control device 20 performs image processing of the image data acquired by the part camera 14 and detects the position (position and angle) of the component 92 held by each of the several suction nozzles 134. A result of the holding state detection processing is recorded in a memory 21 as an operating result, indicating whether a capture error occurred during the capture operation.

[0073] The control device 20 then executes an assembly cycle in which an assembly operation for mounting components using multiple suction nozzles 134 is repeated. During the assembly operation of the assembly cycle, the control device 20 controls the operation of the placement head 133 so that each of the components 92 is mounted at a mounting position defined by the control program M1. Furthermore, the control device 20 controls the operation of the placement head 133 so that the suction nozzle 134 is positioned and oriented based on the result of the recognition processing with respect to the mounting position.

[0074] Furthermore, in parallel to the PP cycle described above, the control device 20 performs feed management processing of component 92. This feed management processing includes determining the execution time of a feed operation of component 92 by the bulk material feeder 30, issuing a command for the feed operation, processing the detection of a feed state, and the like. For example, when a feed operation of component 92 is performed, the feed operation by the bulk material feeder 30 is carried out within a period from the completion of a pickup cycle of the current PP cycle until the beginning of a pickup cycle of the next PP cycle. When the feed operation by the bulk material feeder 30 is carried out, the assembly support device 50 again performs the detection processing of the feed state described above.

[0075] The control device 20 performs an unloading process of the circuit board 91 when all PP cycles based on the control program M1 have been completed. During the unloading process of the circuit board 91, the circuit board conveyor 11 releases the positioned circuit board 91 from its clamping and unloads the circuit board 91 outside the component placement machine 10. 7. Impact of the configuration of the exemplary embodiment

[0076] According to a configuration of the assembly support device 50 described above, it is possible to improve the accuracy of the image processing when detecting the feeding status of a component 92 fed by the bulk material feeder 30. Accordingly, it is possible to prevent errors during a picking operation by the component placement machine 10, thereby maintaining high productivity of the component placement machine 10. 8. Modification aspect of the exemplary embodiment

[0077] In one embodiment, the assembly support device 50 is configured to be integrated into the control device 20 of the component placement machine 10. Alternatively, part or all of the assembly support device 50 can be integrated into the host computer 60 and other external devices. For example, the assembly support device 50 can be a dedicated device integrated into the host computer 60 or installed in the production line Ln. Reference symbol list 10 component pickers 12 Component feeding device 13 Component transfer device 131 Head drive device 132 Movement table 133 Placement head 134 Suction nozzle 14-part camera 15 circuit board camera 20 Control device 21 Storage section 30 bulk material feeders 31 Feeder main body 40 rail units 45 Cavity 46 side wall 47 Anterior section 48 flap 49 Reference mark 50 Assembly support device 51 Recognition section 52 Section for Determination 60 host computers 70 BLOB 71 candidates - BLOB 72, 73 defective BLOB 75 central position (of the BLOB) 80 Recognition component 89 foreign bodies 91 circuit board 92 components As feed area R Conveyor M1 control program M2 component data M3 cavity information D1 image data Rd defined area Rc area (in which the component center can be located in the cavity) Ls feed angle Ld defined angle Na area (in which the feed angle can be assumed at a defined angle in the cavity) PS Reference position QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2011-114084

[0003]

Claims

[1] Assembly support device comprising: a recognition section configured to perform image processing on image data acquired by capturing an image of a feed area in which multiple components are provided in a bulk state, and to recognize the component in the feed area, wherein the image processing comprises a generation step to generate multiple BLOBs, an extraction step to extract a candidate BLOB corresponding to a closed region of at least one part of the component from the multiple BLOBs, and a recognition step to recognize a rectangular region containing one or more of the candidate BLOBs as the component in the image data; and a determination section configured to determine, based on the shape or surface of the detected component, whether the component is suitable for a pick-up operation target by a component picker. [2] Assembly support device according to claim 1, wherein the recognition section in the recognition step recognizes the rectangular area that describes one or more of the candidate BLOBS as the component in the image data. [3] Assembly support device according to claim 1 or 2, wherein, if a ratio between a short side and a long side of the detected component is outside a defined range, the determination section determines that the component is not suitable for the purpose of the picking operation by the component picker. [4] Assembly support device according to claim 1 or 2, wherein, if an area of ​​the detected component lies outside a defined area, the determination section determines that the component is not suitable for the objective of the picking operation by the component picker. [5] Assembly support device according to claim 1 or 2, wherein The feed area has several cavities, each of which can accommodate one of the several components. The recognition section performs image processing of the image data and detects the position and shape of the component in the feed area, and The determination section, based on whether the entire detected component is accommodated in the cavity that is closest to the component in the image data, determines whether the component is suitable for the target of the placement operation by the component picker. [6] Assembly support device comprising: a recognition section configured to perform image processing on image data acquired by capturing an image of a feed area in which multiple cavities are formed, each accommodating multiple components, and to recognize the position and shape of the component within the feed area; and a determination section configured to determine, based on whether the detected component is fully accommodated in the cavity closest to the component in the image data, whether the component is suitable for a placement operation target by a component picker.

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