Collection support device and collection support procedure

Abstract

A collection support device comprises a path unit, a well unit, an imaging section, an update section, and a determination section. The imaging section captures a first well during an available acquisition period, during which it is assumed that a component will not be picked up in the first well, for each of the first wells that are at least one of several wells and for which it has been confirmed that the component was picked up by a component placement device. The update section updates a reference image obtained by capturing an empty well in which the component is not picked, using a first image obtained by capturing the first well by the imaging section, for each of the first wells.The determination section determines, using the reference image updated by the update section, whether the component is included in the first well.

Description

Technical field

[0001] The present description discloses a technique relating to a collection support device and a collection support method. State of the art

[0002] In a bulk material component feeding device described in patent literature 1, after components equipped with connectors have been scattered on a plate, at each time an image of the plate is taken by a camera, the image data after scattering is compared with the image data stored in a storage device before scattering. It is determined that a component equipped with connectors is present in a block in which the brightness difference between the image data before scattering and the image data after scattering is equal to or greater than a first threshold value.That is, in a block where the brightness difference between the image data (image data before scattering), in which there is clearly no connected component, and the image data (image data after scattering), in which the presence of the connected component is unknown, is equal to or greater than the first threshold, it is assumed that an object is present that is causing the brightness difference, and thus it is decided that there is a connected component in the block. Citation list for patent literature

[0003] Patent literature 1: WO 2017 / 208325 Summary of the invention: Technical problem

[0004] However, it can happen that, for example, a foreign object adheres to a recess in which a component is placed. A foreign object, such as a detached electrode fragment from the component, has the same luminance as an electrode fragment of the component, so a component placement device could incorrectly identify the component based on the foreign object. Consequently, the component placement device could incorrectly determine that a component is placed in the recess, even though this is not the case, and might fail to remove the component.Furthermore, even in a depression considered unsuitable for receptacles due to the adhesion of a foreign body, it may be possible to retrieve the component from the depression considered unsuitable, depending on the positional relationship between the component and the foreign body, for example in a case where the foreign body is covered by a component.

[0005] In view of these circumstances, the present description discloses a collection support device and a collection support method by which the presence or absence of a component in a recess can be determined even when the state of the recess changes during the manufacture of a printed circuit board. Solution to the problem

[0006] The present description discloses a collection support device comprising a track unit, a depression unit, an imaging section, an update section, and a determination section. The track unit comprises a conveyor path configured to convey a component dispensed from a component container holding the component in a bulk state to a feed area where the component can be picked up by a component placement device. The depression unit comprises multiple depressions in the feed area, each depression configured to receive one of the components conveyed from the conveyor path to the feed area in the track unit.The imaging section acquires an image of a first well during an available acquisition period in which the component is not expected to be picked up in the first well, for each of the first wells that are at least one of the multiple wells for which it has been confirmed that the component was picked up by the component placement device. The update section updates a reference image, obtained by acquiring an empty well in which the component has not been picked up, using a first image obtained by acquiring the first well by the imaging section, for each of the first wells. The determination section determines, using the reference image updated by the update section, whether the component is picked up in the first well.

[0007] Furthermore, the present description discloses a collection support device comprising a conveyor unit, a depression unit, a storage section, and a decision section. The conveyor unit comprises a conveying path configured to transport a component, discharged from a component container holding the component in a bulk state, to a feed area where the component can be picked up by a component placement device. The depression unit comprises multiple depressions in the feed area, each depression configured to receive one of the components conveyed from the conveyor path to the feed area in the conveyor unit.The memory section stores a position of a second well in the well unit and an image feature value that enables the identification of a faulty detection section that is incorrectly recognized as the component in a second image obtained by capturing the second well, in conjunction with each other in a memory device for each of the second wells that are at least one of the multiple wells for which it has been confirmed that the component cannot be picked up by the component placement device.The decision section decides whether the component is picked up in the second well, based on a degree of similarity between the image feature value that enables the identification of an inspection target section recognized as a component in an inspection image obtained by capturing the second well after attempting to pick up the component in the second well for component feeding, and the image feature value that enables the identification of the faulty recognition section stored in the storage device for each of the second wells.

[0008] Furthermore, the present description discloses a collection support method used in a component collection system of a bulk material feeding device comprising a conveyor unit and a depression unit, wherein the collection support method includes an image acquisition step, an update step, and a determination step. The conveyor unit comprises a conveying path configured to transport a component dispensed from a component container holding the component in a bulk state to a feed area where the component can be picked up by a component placement device. The depression unit comprises multiple depressions in the feed area, each depression configured to receive one of the components conveyed from the conveyor path to the feed area in the conveyor unit.In the image acquisition step, an image of a first well is acquired during an available acquisition period in which the component is not expected to be picked up in the first well. This is done for each of the first wells that are at least one of the multiple wells for which it has been confirmed that the component was picked up by the component placement device. In the update step, a reference image obtained by acquiring an empty well in which the component is not picked up is updated for each of the first wells using a first image obtained by acquiring the first well in the image acquisition step. In the determination step, it is determined, using the reference image updated in the update step, whether the component is picked up in the first well.

[0009] Furthermore, the present description discloses a collection support method used in a component collection process for a bulk material feeding device comprising a conveyor unit and a depression unit, wherein the collection support method includes a storage step and a decision step. The conveyor unit comprises a conveying path configured to transport a component, which is unloaded from a component container receiving the component in a bulk state, to a feed area where the component can be picked up by a component placement device. The depression unit comprises multiple depressions in the feed area, each depression being configured to receive one of the components conveyed from the conveyor path to the feed area in the conveyor unit.In the storage step, a position of a second well in the well unit and an image feature value that enables the identification of a faulty detection section, which is incorrectly recognized as the component, are stored in a storage device in a second image obtained by capturing the second well, for each of the second wells that are at least one of the multiple wells and for which it is confirmed that the component cannot be picked up by the component placement device.In the decision step, a decision is made as to whether the component is picked up in the second well, based on a degree of similarity between the image feature value that enables the identification of an inspection target section, which is recognized as the component in an inspection image obtained by capturing the second well after attempting to pick up the component in the second well for feeding the component, and the image feature value that enables the identification of the faulty detection section stored in the storage device, for each of the second wells.

[0010] This description discloses a technical idea in which "the collection support device according to claim 1" is amended in claim 4, which is described in the claims originally appended to the application (hereinafter referred to as the original claims), to "the collection support device according to any one of claims 1 to 3". Furthermore, this description discloses a technical idea in which "the collection support device according to claim 1" is amended in claim 5, which is described in the original claims, to "the collection support device according to any one of claims 1 to 4". Furthermore, this description discloses a technical idea in which "the collection support device according to claim 6" is amended in claim 9, which is described in the original claims, to "the collection support device according to any one of claims 6 to 8". Advantageous effects of the invention

[0011] According to the collection support device described above, it is possible to determine the presence or absence of the component in the recess even in cases where the recess's condition changes during the production of the product plate. The above description of the collection support device can be similarly applied to the collection support method. Brief description of the drawings Fig. Figure 1 is a top view showing a configuration example of a component placement device. Fig. Figure 2 is a side view of the surroundings of a feed area, which is an example of a bulk material feed device. Fig. Figure 3 is a top view in the direction of arrow III in Fig. 2. Fig. Figure 4 is a schematic representation showing an example of a depression to which a foreign object is adhered. Fig. 5 is a schematic diagram that illustrates a case in which the foreign body is in Fig. 4 is incorrectly identified as a component. Fig. Figure 6 is a block diagram that shows an example of a control block of a collection support device. Fig. Figure 7 is a flowchart that illustrates an example of a control process by the collection support device. Fig. Figure 8 is a schematic diagram that represents a calculation example for a difference image. Fig. Figure 9 is a schematic diagram that represents another calculation example for the difference image. Fig. Figure 10 is a block diagram that provides another example of the control block of the collection support device. Fig. Figure 11 is a flowchart that provides another example of the control procedure of the collection support device. Fig. Figure 12 is a schematic diagram showing an example of an inspection image and a second image in a case where a component is captured in a second recess. Fig. Figure 13 is a schematic diagram showing an example of an inspection image and a second image in a case where the component is not included in the second recess. Fig. Figure 14 is a schematic diagram showing an example of an inspection image and a second image in a case where a foreign body is newly adhering to the second depression. Description of embodiments 1. Embodiments 1-1. Configuration example for a component placement device 10

[0012] The component placement device 10 mounts the component 91 onto the printed circuit board 90. As shown in Fig. As shown in Figure 1, the component placement device 10 comprises a printed circuit board transport device 11, a component feeding device 12, a component transfer device 13, a parts camera 14, a printed circuit board camera 15, and a control device 16. The collection support device 60 is applied to a collection of components from the bulk material feeder 20 provided in the component feeding device 12.

[0013] The printed circuit board transport device 11 comprises, for example, a conveyor belt and the like, and transports the printed circuit board 90 in one conveying direction (X-axis direction). The printed circuit board 90 is a circuit board on which an electronic circuit, an electrical circuit, a magnetic circuit, and the like are formed. The printed circuit board transport device 11 conveys the printed circuit board 90 into the component placement device 10 and positions the printed circuit board 90 at a predetermined position in the component placement device 10. The printed circuit board transport device 11 conveys the printed circuit board 90 out of the component placement device 10 after a component placement operation of the component 91 by the component placement device 10 has been completed.

[0014] The component feeder 12 delivers the component 91 to be mounted on the printed circuit board 90. The component feeder 12 comprises several feeders 12b arranged along the conveying direction (X-axis direction) of the printed circuit board 90. Each of the several feeders 12b is detachably attached to a slot 12a. In this embodiment, at least one of the feeders 12b is a belt feeder and one of the bulk material feeders 20. The belt feeder conveys a carrier belt containing several components 91 incrementally and delivers the component 91 to a feed position so that the component 91 can be picked up.The bulk material feeder 20 feeds the component 91, which has been taken from the component container 50 in which the component 91 is housed, in a bulk material state (a state in which the positions of several components 91 are irregular) so that the component placement device 10 can receive the component 91.

[0015] The component transfer device 13 comprises a head drive device 13a, a movable table 13b, a mounting head 13c, and a holding element 13d. The head drive device 13a is configured to move the movable table 13b in the X-direction and in the Y-direction (one direction orthogonal to the X-direction on a horizontal plane) by means of a linear motion mechanism. The mounting head 13c is provided on the movable table 13b in a removable (replaceable) manner by means of a clamping element. The mounting head 13c receives the component 91, supplied by the component feeder 12, with at least one holding element 13d, holds it securely, and mounts the component 91 onto the printed circuit board 90, which is positioned by the printed circuit board transport device 11. A suction nozzle, a gripper, and the like can be used as the holding element 13d.

[0016] A known imaging device can be used as the part camera 14 and the printed circuit board camera 15. The part camera 14 is mounted on a base of the component placement device 10 such that an optical axis points upwards in a vertical direction (a Z-axis direction orthogonal to the X-axis and Y-axis directions). The part camera 14 can capture an image of the component 91, held by the holding element 13d or the like, from below. The printed circuit board camera 15 is positioned on the motion table 13b of the component transfer device 13 such that an optical axis points downwards in a vertical direction (Z-axis direction). The printed circuit board camera 15 can capture an image of the printed circuit board 90 or the like from above. The part camera 14 and the printed circuit board camera 15 capture images based on a control signal transmitted by the control device 16.The image data from the images captured by the part camera 14 and the circuit board camera 15 are transmitted to the control device 16.

[0017] The control device 16 comprises a known computing device and a storage device and is configured with a control circuit. Information, image data, and the like, output by various sensors provided in the component placement device 10, are input into the control device 16. The control device 16 transmits the control signal to each device based on a control program, a predefined assembly condition, and the like.

[0018] For example, the control device 16 causes the printed circuit board camera 15 to take an image of the printed circuit board 90 positioned by the printed circuit board transport device 11. The control device 16 performs image processing of the image taken by the printed circuit board camera 15 to detect the positioning state of the printed circuit board 90. In addition, the control device 16 causes the holding element 13d to pick up and hold the component 91 fed by the component feeder 12, and causes the part camera 14 to take an image of the component 91 held by the holding element 13d. The control device 16 performs image processing of the image taken by the part camera 14 to detect the holding position of the component 91.

[0019] The control device 16 moves the holding element 13d across a planned mounting position, which was previously defined by the control program or the like. Furthermore, the control device 16 corrects the planned mounting position and determines the mounting position at which the component 91 is actually mounted, based on the positioning state of the circuit board 90, the holding position of the component 91, and the like. In addition to the position (X-axis coordinate and Y-axis coordinate), the planned mounting position and the mounting position include a rotation angle.

[0020] The control device 16 corrects a target position (X-axis coordinate and Y-axis coordinate) and the rotation angle of the holding element 13d according to the mounting position. The control device 16 lowers the holding element 13d at the corrected rotation angle at the corrected target position and mounts the component 91 onto the printed circuit board 90. The control device 16 performs the mounting operation for mounting multiple components 91 onto the printed circuit board 90 by repeating the pick-up and placement cycle described above. 1-2. Configuration example for the bulk material feeding device 20

[0021] The bulk material feeder 20 can take on various forms, as long as it can deliver the components 91 taken from the component container 50 to the component placement device 10. As shown in Fig. As shown in Figure 2, the bulk material feeding device 20 of the embodiment comprises a feeding main body 21. The feeding main body 21 is designed in the form of a flat box.

[0022] The connector 21a and two pins 21b and 21b are attached to a distal end section (right end section in the drawing in Fig. 2) of the feeder main body 21. When the feeder main body 21 is placed in the slot 12a of the component feeder 12, the bulk material feeder 20 is energized via the connector 21a and can communicate with the control device 16 of the component placement device 10. Two pins 21b and 21b are inserted into guide holes provided in the slot 12a and serve to position the feeder main body 21 when the feeder main body 21 is inserted into the slot 12a.

[0023] Furthermore, the bulk material feeding device 20 includes a conveying unit 30. The conveying unit 30 is detachably attached to the main feeding body 21. In addition, the conveying unit 30 supports the fixed component container 50. The conveying unit 30 is a unified unit that transports the component 91, discharged from the component container 50, from an area where the component 91 is received to the feeding area As0.

[0024] After the bulk material feeder 20 has been used for a predetermined assembly operation, a removal operation is performed as one of the maintenance tasks, in which the internal component 91 is removed in preparation for its next use. The conveying unit 30 is provided as a unit that acts as a conveying path for the component 91 and is detachable from the feeder main body 21 of the feeder to improve efficiency, assuming the removal operation described above. The conveying unit 30 of this embodiment comprises a housing support element 31, a track unit 32, and a coupling element 33.

[0025] The housing support element 31 is configured to vibrate relative to the feed body 21. The housing support element 31 is set into vibration by the first vibration device 22. The housing support element 31 supports the fixed component container 50. The housing support element 31 receives the component 91 dispensed from the component container 50. In this embodiment, a section of the housing support element 31 that receives the component 91 has an inclined surface that is inclined in the vertical direction (Z-axis direction) with respect to the horizontal plane towards the distal end of the bulk material feed device 20. The housing support element 31 forms a conveying path for the component 91 that extends upwards in the vertical direction (Z-axis direction) from a lower end section of the inclined surface.

[0026] The conveyor unit 32 is designed to oscillate relative to the feeder body 21. The conveyor unit 32 is set into oscillation by a second oscillation device 23. The conveyor unit 32 comprises a conveying path Rd0 through which several components 91 are conveyed, and a feed area As0, which is connected to the conveying path Rd0 and opens upwards in the vertical direction (Z-axis direction) so that several components 91 can be collected. The feed area As0 is an area in which the component placement device 10 can receive the component 91. In particular, the feed area As0 is an area in which the component 91 can be received by the holding element 13d mounted by the assembly head 13c and is contained within the range of motion of the assembly head 13c.Furthermore, the conveying path Rd0 refers to a conveying path of the components 91, in which the component 91, which comes from the housing support element 31 to the track unit 32, is conveyed to the feed area As0.

[0027] The track unit 32 is designed such that its overall shape extends along one direction of extension of the feeder main body 21 (shown in the drawing in Fig. 2 in the left-right direction). In the track unit 32 of the embodiment, the recess unit 42 is interchangeably attached to the track main body 41. For example, the recess unit 42 is at least a plate-shaped element. In the track unit 32, a recess unit 42, selected from several types of recess units 42 corresponding to the shapes of several types of components 91, is attached to a common track main body 41 to form a single track element.

[0028] The recess unit 42 comprises several recesses 43 in the feed area As0, each of which serves to receive one of the components 91 that are transported from the conveyor path Rd0 to the feed area As0 in the track unit 32. As in Fig. As shown in Figure 3, the depression unit 42 of the embodiment comprises several depressions 43 arranged in a predetermined pattern (for example, staggered). Each of the several depressions 43 is rectangular in shape, slightly larger than the outer shape of the component 91 supplied by the bulk material feed device 20.

[0029] Each of the multiple recesses 43 is designed to accommodate a component 91 in a position (normal position) in which the thickness direction of the component 91 coincides with the vertical direction (Z-axis direction). A pair of side walls 44 and 44, projecting upwards in the vertical direction (Z-axis direction), are located on both edges of the track unit 32 in the width direction (top-bottom direction in the drawing). Fig. 3) formed. The pair of side walls 44 and 44 together with the distal end section 45 of the conveyor unit 32 surrounds the circumference of the conveying path Rd0 and prevents the escape of components 91 that are conveyed on the conveying path Rd0.

[0030] A closure 46, which can close the opening of the feed area As0, is provided above the web unit 32 in the vertical direction (Z-axis direction). When the web unit 32 is attached to the feed main body 21, the closure 46 is opened and closed under the control of a closure drive device. By opening and closing the closure 46, the bulk material feeder 20 can prevent components 91 from protruding, foreign matter from mixing into the feed area As0, and the like.

[0031] The coupling element 33 connects the housing support element 31 and the track unit 32 in such a way that several components 91 can pass between them. The coupling element 33 is tubular in shape, allowing several components 91 to pass through it. The coupling element 33 is flexible and absorbs vibrations by deforming in accordance with the vibrations of the housing support element 31 and the vibrations of the track unit 32. This allows the coupling element 33 to reduce or block vibrations transmitted between the housing support element 31 and the track unit 32, which vibrate independently of each other.

[0032] When the conveying unit 30 is attached to the feeder main body 21, pressurized air is supplied by the air supply device 24, and the conveying unit 30 causes several components 91 to pass from the housing support element 31 to the conveyor unit 32 via the coupling element 33. Based on a command from the feeder control device 25, the air supply device 24 can supply externally supplied pressurized air from below the housing support element 31 and block the supply of the pressurized air.

[0033] The bulk material feeder 20 comprises a first vibration device 22 and a second vibration device 23, which are provided in the feeder main body 21. The first vibration device 22 vibrates the housing support element 31 to discharge the component 91 from the defined component container 50. The second vibration device 23 vibrates the conveyor unit 32 so that multiple components 91 are conveyed along the conveying path Rd0. When the second vibration device 23 vibrates the conveyor unit 32, the conveyor unit 32 performs an elliptical motion in a side view.

[0034] As a result, an external force is exerted on the distal end of the bulk material feed device 20 (right side in the drawing in Fig. 2) and upwards in a vertical direction (Z-axis direction) or an external force on the proximal end face of the bulk material feed device 20 (left side in the drawing in Fig. 2) and upwards in a vertical direction (Z-axis direction) is exerted on several components 91 on the conveying path Rd0 according to a direction of rotation of the elliptical motion of the conveyor unit 32. As a result, several components 91 are conveyed to the distal end or the proximal end of the bulk material feeder 20 in the conveyor unit 32. The bulk material feeder 20 can change the conveying speed, distribution degree, conveying direction, and the like of the component 91 to be conveyed by controlling the frequency and amplitude of the vibration exerted on the conveyor unit 32, the direction of rotation of the elliptical motion caused by the vibration, and the like.

[0035] The bulk material feeder 20 comprises a feeder control device 25. The feeder control device 25 includes a known computing device and a storage device and is configured with a control circuit. In a state where the feeder main body 21 is inserted into the slot 12a of the component feeder 12, the feeder control device 25 is powered via the terminal 21a and can communicate with the control device 16 of the component placement device 10.

[0036] Various data, such as a program for controlling a component feeder or a conveying parameter for component 91, are stored in the feeder control device 25. The conveying parameter is a parameter for driving and controlling the second vibration device 23, so that the vibration becomes suitable for oscillating the conveyor unit 32 when component 91 is conveyed in the component feeder, and is, for example, predefined in connection with each type of component 91.

[0037] The feed control device 25 drives and controls the first vibrating device 22, the second vibrating device 23, the air supply device 24, the closure drive device, and the like. For example, the feed control device 25 drives and controls the second vibrating device 23 based on a preset parameter to perform a component feeding operation. As a result, the conveyor unit 32 is set into vibration, and the component 91 on the conveying path Rd0 is conveyed by absorbing an external force so that it moves in the conveying direction.

[0038] The component container 50 holds several components 91 in bulk. The component container 50 is an external device that is interchangeably mounted on the housing support element 31 in the conveying unit 30 of the bulk material feeding device 20. The component container 50 is designed in the form of a flat box, similar to the main feeding body 21.

[0039] For example, the feed control device 25 dispenses component 91 from the component container 50 based on an external feed command. Specifically, the feed control device 25 drives the first vibration device 22, causing the housing support element 31, to which the component container 50 is attached, to vibrate. When the component container 50 vibrates, component 91 is dispensed from a dispensing point. The dispensed component 91 falls onto an inclined section of the housing support element 31 located below the dispensing point and moves along the inclined surface of the section. This holds component 91 against a lower end section of the inclined section.

[0040] In this state, the feed control device 25 instructs the air supply device 24 to supply pressurized air. The pressurized air supplied by the air supply device 24 inflates the retained multiple components 91 and flows together with the component 91 through the flow path formed in the housing support element 31. As a result, the pressurized air and the multiple components 91 flow from the housing support element 31 via the coupling element 33 to the web unit 32 and reach the conveying path Rd0 of the web unit 32. The pressurized air is released to the outside through an outlet opening formed in the cover of the web unit 32.

[0041] When the conveyor unit 32 is set into vibration by the second vibration device 23 after the component 91 has reached the conveying path Rd0, several components 91 are conveyed towards the feed area As0. Furthermore, the conveyor unit 32 is subjected to vibration, depending on the quantity of component 91 being fed into the feed area As0, either to move the component 91 to the side of the feed area As0 or to move it to the side of the component container 50. Some of the several components 91 conveyed to the feed area As0 are collected in recesses 43. The component 91 that is not collected in the recesses 43 is moved by vibration by the second vibration device 23 along the conveying path Rd0 and removed from the feed area As0.With such a component feeding process, the component 91 received in the recess 43 is brought into a state in which it can be received by the component placement device 10. 1-3. Configuration example for the collection support device 60

[0042] For example, a foreign body 92 can adhere to the recess 43 in which the component 91 is contained. Fig. Figure 4 shows an example of a recess 43 to which a foreign body 92 adheres. The figure is a schematic diagram of a recess 43 in which the component 91 is not received when viewed from above in the vertical direction (Z-axis direction). For example, a foreign body 92, which may have resulted from the detachment of an electrode section of the component 91, has the same luminance as an electrode section of the component 91. Therefore, the component placement device 10 may incorrectly detect the component 91 based on the foreign body 92. Fig. 5 represents an example of a case in which the foreign body 92 is in Fig. 4 is incorrectly identified as component 91.

[0043] For example, the control device 16 of the component placement device 10 performs image processing (for example, binarization processing) on ​​the captured image of the recess 43 in order to detect the component 91. In particular, the control device 16 derives, for example, by binarization processing, an area (in this case, a rectangular area indicated by a dashed line) that represents the detected section (seven foreign bodies 92 in Fig. 5) contains. For example, the control device 16 determines that the component 91 is received in the recess 43 if the area of ​​the rectangular region lies within an assumed region of the area of ​​the component 91, and determines that the component 91 is not received in the recess 43 if the area of ​​the rectangular region does not lie within the assumed region of the area of ​​the component 91.

[0044] In the Fig. In the example shown in Figure 5, the area of ​​the rectangular region lies within the assumed area of ​​component 91. Therefore, the control device 16 of the component placement device 10 may incorrectly determine that component 91 is received in the recess 43, even though component 91 is not received in the recess 43, and may not receive component 91. The above description can be applied similarly to a case in which the difference between the reference image PC0, calculated by capturing the empty recess 43e, to which no foreign body 92 adheres and in which no component 91 is received, and the inspection image PD0 of the recess 43, to which a foreign body 92 adheres, is used to determine whether component 91 is received in the recess 43.

[0045] Therefore, the collection support device 60 is applied to the component receiving area of ​​the bulk material feeder 20. The collection support device 60 can detect the presence or absence of component 91 in the recess 43, even if the state of the recess 43 changes during the manufacture of the printed circuit board. In particular, the collection support device 60 comprises a track unit 32, a recess unit 42, an imaging section 61, an update section 62, and a determination section 63. As described above, the track unit 32 comprises a conveying path Rd0 that transports component 91, which is dispensed from the component container 50 receiving component 91 in bulk, to a feed area As0 from which the component placement device 10 can collect component 91.The depression unit 42 comprises several depressions 43 in the feed area As0, each of which is intended to receive one of the components 91 that are transported from the conveyor path Rd0 to the feed area As0 in the track unit 32.

[0046] Imaging section 61, update section 62, and determination section 63 can be provided in various computing devices, control devices, management devices, and the like. For example, at least part of imaging section 61, update section 62, and determination section 63 can be provided in the control device 16 of the component placement device 10. At least part of imaging section 61, update section 62, and determination section 63 can be provided in a management device that manages the component placement device 10. At least part of imaging section 61, update section 62, and determination section 63 can be implemented in a cloud.

[0047] As in Fig. As shown in Figure 6, the imaging section 61, the update section 62, and the determination section 63 of the embodiment are provided in the control device 16 of the component placement device 10. Furthermore, the collection support device 60 of the embodiment incorporates a control according to a [reference to a specific feature or concept]. Fig. The flowchart shown in Figure 7 illustrates this process. In particular, the imaging section 61 performs the processing shown in step S20. The update section 62 performs the processing shown in step S21. After the processing shown in step S21 has been carried out, the determination section 63 performs the determination shown in step S14. The control device 16 of the component placement device 10 performs other processing and determination operations. The procedures described in this description can be selected and applied as appropriate. Furthermore, the procedures described in this description can be combined as appropriate.

[0048] It can be ensured that component 91 is not received in the recess 43 in which it has been confirmed that component 91 was received by the component placement device 10, at least at the time of confirmation. In this description, among several recesses 43, at least one recess 43 in which it has been confirmed that component 91 was received by the component placement device 10 is referred to as the first recess 43a. For each of the first recesses 43a, the imaging section 61 acquires an image of the first recess 43a during an available acquisition period in which it is assumed that component 91 is not received in the first recess 43a.

[0049] For each of the first wells 43a, the update section 62 updates the reference image PC0, which was obtained by capturing the empty well 43e, in which component 91 is not contained, using the first image PC1, obtained by capturing the first well 43a by the imaging section 61. Consequently, for example, if the condition of well 43 changes during the manufacture of the product plate, such as if a foreign body 92 adheres to well 43, the update section 62 can update the reference image PC0 using the first image PC1 after the condition of well 43 has changed. The determination section 63 can then use the reference image PC0 updated by the update section 62 to determine whether component 91 is contained in the first well 43a.The following is an example of how the collection support device 60 determines the presence or absence of component 91.

[0050] For example, component 91 is not placed in recess 43 after the component placement device 10 is activated (after switching on). Therefore, the control device 16 acquires the reference image PC0 after the component placement device 10 has been activated (step S11, shown in Fig. 7) For example, the control device 16 can capture an image of the recess unit 42 using the printed circuit board camera 15. The control device 16 can capture a reference image PC0 for each of the multiple recess units 42 of the recess unit 42.

[0051] Next, the control device 16 determines whether the manufacturing of the printed circuit board has started (step S12). If the manufacturing of the printed circuit board has started (yes in step S12), the control device 16 delivers the component 91 to the recess 43 (step S13). As described above, the control device 16 causes the feed control device 25 to execute the component feeding process. The feed control device 25 can actuate and control the first vibration device 22, the second vibration device 23, the air supply device 24, and the like, so that the component 91 can be received in the recess 43.

[0052] For example, if component 91 is received in recess 43, the control device 16, using the printed circuit board camera 15, captures an image of recess unit 42 (step S13). The control device 16 captures an inspection image PD0 for each of the multiple recess units 42 of recess unit 42. The inspection image PD0 refers to an image obtained by capturing recess 43 after an attempt has been made to receive component 91 in recess 43. If printed circuit board manufacturing is not started (No in step S12), the control, via the collection support device 60, returns to the determination shown in step S12, and the control device 16 waits until printed circuit board manufacturing begins.

[0053] Next, the control device 16 determines whether the component 91 housed in the recess 43 can be removed (step S14). Similar to the determination section 63, the control device 16 determines, for example, using the inspection image PD0 and the reference image PC0, whether the component 91 is present in the recess 43. Details of how the determination section 63 determines the presence or absence of the component 91 are described later.

[0054] If component 91 is received in recess 43 and can be removed (Yes in step S14), the control device 16 removes component 91 using the holding element 13d, which is supported by the mounting head 13c (step S15). In a case where component 91 is received in a position in recess 43 in which the thickness of component 91 coincides with the vertical direction (Z-axis direction) (normal position), the control device 16 can determine that component 91 can be received.

[0055] Next, the control device 16 determines whether component 91 has been picked up by the holding element 13d (step S16). For example, the control device 16 can use the part camera 14 to capture an image of component 91 held by the holding element 13d. The control device 16 can then determine, by processing the captured image, whether component 91 has been picked up by the holding element 13d. In particular, the control device 16 determines that component 91 has been picked up by the holding element 13d if component 91 can be detected as a result of the image processing, and determines that component 91 has not been picked up by the holding element 13d if component 91 cannot be detected.

[0056] If it is confirmed that component 91 has been removed (Yes in step S16), the recess 43 in which component 91 is received is the first recess 43a. Therefore, the control device 16 stores the first recess 43a in which component 91 has been received (step S17). Specifically, the control device 16 stores position information of the first recess 43a in the recess unit 42. The position information can be represented, for example, by position coordinates or a matrix. The control device 16 then mounts or ejects component 91 according to the removal status of component 91 (step S18).

[0057] In particular, if the position and angle of component 91 relative to the retaining element 13d are within a permissible range for mounting component 91, the control device 16 mounts component 91 at a predetermined position on the circuit board 90. If the position and angle of component 91 relative to the retaining element 13d are not within the permissible range for mounting component 91, the control device 16 rejects component 91. In this case, the control device 16 places component 91 in a disposal container. If component 91 is mounted or rejected, if component 91 cannot be collected (No in step S14), or if it is not confirmed that component 91 has been collected (No in step S16), the control device 16 proceeds with the determination shown in step S19 via the collection support device 60.

[0058] In particular, the control device 16 determines whether, for all wells 43 of the well unit 42, it has been established that the component 91 contained in well 43 can be collected (step S19). If the determination has been performed for all wells 43 (Yes in step S19), the imaging section 61 acquires an image of the first well 43a during a predetermined available acquisition period (step S20). The update section 62 updates the reference image PC0 (step S21). If the determination has not been performed for all wells 43 (No in step S19), the control, via the collection support device 60, reverts to the determination shown in step S14, and the processing and determination described above are repeated until it has been performed for all wells 43.

[0059] For each of the first wells 43a, the imaging section 61 acquires an image of the first well 43a during an available acquisition period in which it is assumed that the component 91 is not located in the first well 43a (step S20). For example, the imaging section 61 can acquire an image of the well unit 42 using the circuit board camera 15. The imaging section 61 can identify the position of the first well 43a based on the stored position information of the first well 43a and acquire a first image PC1 in which the first well 43a is captured.

[0060] The available intake period can be any period during which component 91 is assumed not to be contained in the first well 43a and is not particularly limited. For example, it can be ensured that component 91 is not contained in the first well 43a during a period beginning when it is confirmed that component 91 has been removed from the first well 43a and ending when an attempt is made to contain component 91 into the first well 43a in order to introduce the next component 91.

[0061] Therefore, the available acquisition period can be defined as a period that begins when it is confirmed that component 91 has been removed from the first well 43a and ends when an attempt is made to insert component 91 into the first well 43a to feed the next component 91. As described above, the process of capturing an image of the first well 43a, as shown in step S20, is performed after it has been confirmed that component 91 has been removed from the first well 43a (Yes in step S16). Furthermore, when the reference image PC0 is updated by the update section 62, the control device 16 determines whether the PCB manufacturing should be terminated (step S22).

[0062] When the PCB manufacturing process is completed (Yes in step S22), the control by the collection support device 60 is temporarily terminated. When the PCB manufacturing process is resumed (No in step S22), the control by the collection support device 60 returns to the processing shown in step S13, and the control device 16 delivers the component 91 to the well 43 (step S13). As described above, the imaging section 61 of the embodiment can acquire an image of the first well 43a during the available acquisition period and reliably acquire an image of the well 43 (first well 43a) in which the component 91 is not housed.

[0063] As shown in the flowchart in Fig. As shown in Figure 7, the imaging section 61 can acquire an image of the first well 43a each time the available acquisition period occurs. In this case, the imaging section 61 can acquire a first image PC1, in which the first well 43a is captured, each time an attempt is made to supply component 91. Furthermore, the imaging section 61 can also acquire an image of the first well 43a each time the number of available acquisition periods reaches a predetermined number. In this case, the imaging section 61 can acquire a first image PC1, in which the first well 43a is captured, each time the acquisition of component 91 is attempted a predetermined number of times.Furthermore, in this case, imaging section 61 can reduce the working time associated with acquisition compared to a case in which an image of the first well 43a is acquired each time the available acquisition period occurs.

[0064] Immediately after activation of the component placement device 10 or immediately after completion of maintenance of the well unit 42 (e.g., cleaning of well 43), there is a high probability that the condition of well 43 has changed. Therefore, the imaging section 61 can acquire an image of at least the first well 43a in a case where the available acquisition period occurs for the first time after activation of the component placement device 10. Furthermore, the imaging section 61 can also acquire an image of at least the first well 43a when the available acquisition period occurs for the first time after completion of maintenance of the well unit 42. In both cases, the imaging section 61 can acquire an image of the first well 43a in a situation where there is a high probability that the condition of well 43 has changed.

[0065] For each of the first wells 43a, the update section 62 updates the reference image PC0, which was obtained by capturing the empty well 43e, in which component 91 is not housed, using the first image PC1 obtained by capturing the first well 43a by the imaging section 61 (step S21). Specifically, the update section 62 sets the first image PC1 captured by the imaging section 61 as the reference image PC0, instead of the reference image PC0 captured after the component placement device 10 was activated. When the first image PC1 is recaptured by the imaging section 61, the update section 62 sets the first image PC1 currently captured by the imaging section 61 as the reference image PC0, instead of the first image PC1 previously captured by the imaging section 61.

[0066] The update section 62 can set the most recent first image PC1, acquired by the imaging section 61, as the reference image PC0 by repeating the process described above each time the first image PC1 is acquired by the imaging section 61. Therefore, for example, even in a case where the state of the well 43 changes during the manufacture of the printed circuit board, such as when a foreign body 92 adheres to the well 43, the update section 62 can set the first image PC1 after the change in the state of the well 43 as the reference image PC0.

[0067] Determination section 63 uses the reference image PC0, updated by update section 62, to determine whether component 91 has been received in the first well 43a (step S14 after performing the processing described in step S21). For example, determination section 63 calculates a difference for each pixel between an image feature value of the inspection image PD0, obtained by capturing the first well 43a after attempting to receive component 91 into the first well 43a, and an image feature value of the reference image PC0.

[0068] Determination section 63 can determine that component 91 is located in the first well 43a if there exists a specific region AR0 where the difference between the image feature values ​​exceeds a predetermined range, and the area of ​​a closed region containing the specific region AR0 falls within the assumed area of ​​component 91. In a case where the specific region AR0 is not present, or the area of ​​the closed region containing the specific region AR0 is not within the assumed area of ​​component 91, determination section 63 can determine that component 91 is not located in the first well 43a. Determination section 63 can calculate the difference using a known image feature value.For example, determination section 63 can calculate the difference using the luminance, brightness, saturation, and the like of the pixel. Determination section 63 of the embodiment calculates the difference using the luminance of the pixel.

[0069] Fig. Figure 8 illustrates a calculation example for the difference image PS0. The inspection image PD0 in Fig. Figure 8 represents an image obtained by capturing the first depression 43a, at which the in Fig. 4. Foreign body 92 is shown, and component 91 is not housed in it. The reference image PC0 in Fig. 8 represents an image obtained by capturing the empty depression 43e, at which the in Fig. 4 foreign bodies shown 92 adheres. The difference image PS0 in Fig. Figure 8 represents an image obtained by calculating a difference between the image feature value of the inspection image PD0 and the image feature value of the reference image PC0 for each pixel.

[0070] Since the image feature value (luminance) of the foreign body area 92 in the inspection image PD0 is equal to the image feature value (luminance) of the foreign body area 92 in the reference image PC0, the foreign body area 92 disappears in the difference image PS0, in which the difference between the image feature values ​​(luminances) is calculated for each pixel. Therefore, the area in Fig. The difference image PS0 shown in Figure 8 is obtained, in which nothing is detected. In this case, there is no specific area AR0 in which the difference between the image feature values ​​exceeds the specified range. Therefore, the determination section 63 can determine that component 91 is not located in the first well 43a.

[0071] Fig. Figure 9 illustrates another calculation example for the difference image PS0. The inspection image PD0 in Fig. 9 represents an image obtained by capturing the first depression 43a, in which the in Fig. 4. Foreign body 92 is shown and component 91 is housed within it. In inspection image PD0 in Fig. 9 are four foreign bodies 92 out of seven in Fig. The four foreign bodies 92 shown are obscured by component 91, and three foreign bodies 92 are detected. The reference image PC0 in Fig. 9 represents an image obtained by capturing the empty depression 43e, at which the in Fig. 4 foreign bodies shown 92 adheres. The difference image PS0 in Fig. Figure 9 represents an image obtained by calculating the difference between the image feature value of the inspection image PD0 and the image feature value of the reference image PC0 for each pixel.

[0072] Similar to the one in Fig. The 8 case depicted disappears in the Fig. The difference image PS0 shown in 9 indicates the areas of the three foreign bodies 92 that are not obscured by component 91. Furthermore, the difference between the image feature value (luminance) of the electrode section of component 91 in inspection image PD0 exceeds Fig. 9 and the image feature value (luminance) of the corresponding area in the reference image PC0 define a predetermined area, and a specific area AR0 is present. Furthermore, the area of ​​the closed region (in this case, the rectangular region) encompassing the specific area AR0 lies within the assumed area of ​​component 91. Therefore, the determination section 63 can determine that component 91 is located in the first well 43a. Since the electrode section and the foreign body 92 have the same luminance, the area of ​​the foreign body 92 is absent from the specific area AR0. 1-4. Another configuration example for the collection support device 60

[0073] Even in the case of a depression 43 that cannot be collected due to the adhesion of a foreign body 92, for example, component 91 can be collected from the depression 43 that cannot be collected, depending on the positional relationship between component 91 and the foreign body 92, for example in a case where the foreign body 92 is covered by component 91.

[0074] Therefore, the collection support device 60 of the second embodiment comprises a track unit 32, a depression unit 42, a storage section 64, and a decision section 65. As described above, the track unit 32 comprises a conveying path Rd0, which transports the component 91 dispensed from the component container 50, which receives the component 91 in a bulk state, to a feed area As0, from which the component placement device 10 can collect the component 91. The depression unit 42 comprises several depressions 43 in the feed area As0, each of which is intended to receive one of the components 91 that are conveyed from the conveying path Rd0 to the feed area As0 in the track unit 32.

[0075] Memory section 64 and decision section 65 can be provided in various computing devices, control devices, management devices, and the like. For example, at least part of memory section 64 and decision section 65 can be provided in the control device 16 of the component placement device 10. At least part of memory section 64 and decision section 65 can be provided in a management device that manages the component placement device 10. At least part of memory section 64 and decision section 65 can be implemented in a cloud. As described in Fig. As shown in Figure 10, the storage section 64 and the decision section 65 are also provided in the control device 16 of the component placement device 10 in the collection support device 60 of the second embodiment.

[0076] Furthermore, the collecting support device 60 of the second embodiment incorporates a control according to a Fig. The flowchart shown in Figure 11 is carried out. In particular, the memory section 64 performs the processing shown in steps S31 and S40. The decision section 65 performs the processing and decision shown in steps S33 to S36. The control device 16 of the component placement device 10 performs other processing and decision-making. In this description, descriptions that overlap with aspects of the collection support device 60 of the first embodiment, including the web unit 32, the depression unit 42, the imaging section 61, the update section 62, and the determination section 63, are omitted. Furthermore, the aspects described in the collection support device 60 of the first embodiment and the collection support device 60 of the second embodiment can be selected and applied accordingly and combined as appropriate.

[0077] The recess 43, which is at least one of several recesses 43 of the recess unit 42 and in which it has been confirmed that the component 91 cannot be picked up by the component placement device 10, is designated as the second recess 43b. As described above, the control device 16 can, for example, image the component 91 held by the holding element 13d using the part camera 14. The control device 16 can determine, by image processing of the captured image, whether the component 91 has been picked up by the holding element 13d.

[0078] The memory section 64 stores, for each of the second wells 43b, the position of the second well 43b in the well unit 42 and the image feature value that enables the identification of the erroneous detection section 80m, incorrectly recognized as component 91, in the second image PC2 obtained by capturing the second well 43b in the memory device 64a, in conjunction with each other (in Fig. (Step S31, shown in Figure 11). For example, the position of the second well 43b can be represented by position coordinates or a matrix. Furthermore, for example, the control device 16 can acquire the second image PC2 by recording the second well 43b with the printed circuit board camera 15.

[0079] In the Fig. In the example shown in Figure 5, a rectangular area marked by a dashed line, containing seven foreign bodies 92, is incorrectly identified as component 91. Therefore, in this case, the erroneous detection section 80m corresponds to the rectangular area. The erroneous detection section 80m can be identified using various image feature values. The image feature value is described later. Furthermore, the storage device 64a can take various forms, as long as it can store the information described above. For example, a known storage device, a database, or the like can be used as the storage device 64a. The storage device 64a can also be implemented in a cloud.

[0080] Next, the control device 16 delivers component 91 to the well 43 (step S32). As described above, the control device 16 causes the feeder control device 25 to execute the component feeding process. The feeder control device 25 can actuate and control the first vibration device 22, the second vibration device 23, the air supply device 24, and the like, so that component 91 can be received in well 43. When component 91 is received in well 43, the control device 16, for example, captures an image of the well unit 42 with the printed circuit board camera 15 (step S32). The decision section 65 can identify the position of the second well 43b based on the position of the second well 43b stored in the storage device 64a and capture the inspection image PD0 in which the second well 43b is captured.

[0081] In this way, the decision section 65 can acquire the inspection image PD0 for each of the second recesses 43b, which is obtained by acquiring the second recess 43b after an attempt has been made to insert the component 91 into the second recess 43b. Based on the degree of agreement between the image feature value that enables the identification of the inspection target area 80c recognized as component 91 in the inspection image PD0 and the image feature value that enables the identification of the faulty detection area 80m stored in the memory device 64a, the decision section 65 decides whether the component 91 is located in the second recess 43b.

[0082] Fig. Figure 12 shows an example of the inspection image PD0 and the second image PC2 in a case where component 91 is located in the second well 43b. In this case, component 91 is detected, and the inspection target area 80c indicates the shape of component 91. Fig. Figure 13 shows an example of an inspection image PD0 and a second image PC2 in a case where component 91 is not captured in the second well 43b. In this case, seven foreign bodies 92 are incorrectly identified as component 91, and the inspection target area 80c shows a rectangular area encompassing seven foreign bodies 92. In both cases, seven foreign bodies 92 are obscured by component 91.

[0083] The image feature value is not restricted as long as the inspection target area 80c and the fault detection area 80m can be identified. For example, the positions of the inspection target area 80c and the fault detection area 80m in the second well 43b can be used as an image feature value. For example, the reference position can be set at the center of the second well 43b. Furthermore, the inspection target area 80c is a rectangular area, and the center of the rectangular area can be defined as the position of the inspection target area 80c (step S33). Similarly, the fault detection area 80m is a rectangular area, and the center of the rectangular area can be defined as the position of the fault detection area 80m.

[0084] In a case where component 91 is located in the second well 43b, its position within the second well 43b is more likely to vary compared to a foreign body 92 adhering to the second well 43b. Therefore, decision section 65 calculates a difference between the image feature value (position) of the inspection target area 80c in inspection image PD0 and the image feature value (position) of the defective detection area 80m in the second image PC2 (step S34). If the difference between the image feature values ​​(positions) exceeds the predefined range (Yes in step S34), decision section 65 decides that component 91 is located in the second well 43b (step S35).

[0085] If the difference between the image feature values ​​(positions) lies within the specified range (No in step S34), decision section 65 decides that component 91 is not included in the second well 43b (step S36). The specified range can be derived in advance, for example, by simulation, verification using an actual device, or the like. In the Fig. In example 12, the difference between the image feature values ​​(positions) exceeds the specified range, and decision section 65 can decide that component 91 is included in the second well 43b. Furthermore, in the example shown in Fig. 13. Example to be shown is the difference between the image feature values ​​(positions) within the predetermined area, and decision section 65 can decide that component 91 is not included in the second well 43b.

[0086] The inclination of the inspection target section 80c and the fault detection section 80m with respect to the second recess 43b can also be used as an image feature value. For example, the reference angle can be set in the longitudinal direction of the second recess 43b. Furthermore, the inspection target section 80c is a rectangular area, and an angle formed by the longitudinal direction of the rectangular area with respect to the reference angle can be defined as the inclination of the inspection target section 80c (step S33). Similarly, the fault detection section 80m is a rectangular area, and an angle formed by the longitudinal direction of the rectangular area with respect to the reference angle can be defined as the inclination of the fault detection section 80m.

[0087] Furthermore, the luminance of the inspection target section 80c may differ in a case where the inspection target section 80c is a component 91, compared to the luminance of the inspection target section 80c in a case where the inspection target section 80c is a foreign body 92. In this case, the luminance of the inspection target section 80c and the fault detection section 80m can be used as an image feature value.

[0088] The above description for luminance can be similarly applied to the area. Furthermore, the above description for luminance can be similarly applied to a long-side to short-side ratio if the inspection target section 80c and the fault detection section 80m have a rectangular shape.

[0089] At least one of the image feature values ​​described above can be used. That is, at least one of the following can be used as an image feature value: the positions of the inspection target section 80c and the fault detection area 80m in the second recess 43b, the inclinations of the inspection target section 80c and the fault detection area 80m with respect to the second recess 43b, the luminance of the inspection target section 80c and the fault detection section 80m, the areas of the inspection target section 80c and the fault detection section 80m, and the ratio of the long side to the short side in a case where the inspection target section 80c and the fault detection section 80m have a rectangular shape.

[0090] As in Fig. As shown in Figure 14, the image feature value of the faulty detection section 80m in the second image PC2 may change due to a foreign object 92 newly adhering to the second well 43b. In a case where the decision section 65 makes an incorrect decision due to the deviation and component 91 cannot be picked up by the component placement device 10, it is necessary to check the second image PC2 stored in the storage device 64a. If the decision section 65 decides that component 91 is located in the second well 43b, but component 91 cannot be picked up by the component placement device 10, the storage section 64a stores the inspection image PD0 as the second image PC2 in the storage device 64a.

[0091] In particular, if the determination section 65 decides that component 91 is located in the second recess 43b and can be received, the control device 16 receives component 91 using the holding element 13d supported by the mounting head 13c (step S37). The control device 16 determines whether component 91 has been received by the holding element 13d (step S38). For example, the control device 16 can use the part camera 14 to take an image of component 91 held by the holding element 13d. The control device 16 can then determine, by image processing of the received image, whether component 91 has been received by the holding element 13d.

[0092] If it is confirmed that component 91 has been picked up (Yes in step S38), the control device 16 either picks up or rejects component 91 according to the pick-up status of component 91, as described above (step S39). Control by the collection support device 60 is temporarily terminated. If it is not confirmed that component 91 has been picked up (No in step S38), the memory section 64 stores the information in Fig. 14 Inspection image PD0 shown as second image PC2 in storage device 64a (step S40).

[0093] In the Fig. In the inspection image PD0 shown in Figure 12, the inclination direction of the inspection target section 80c with respect to the second recess 43b is the left direction in the drawing. In the Fig. In the inspection image PD0 shown in Figure 14, the inclination direction of the inspection target section 80c with respect to the second recess 43b is the right direction in the drawing. As described above, this differs from the Fig. Inspection image PD0 shown in 14 from the Fig. The inspection image PD0 shown in Figure 12 is in the inclination direction of the inspection target section 80c with respect to the second recess 43b. When the second image PC2 stored in the storage device 64a is updated, the control by the collection support device 60 is temporarily terminated. 2. Collective support procedure

[0094] The above description for the collection support device 60 of the first embodiment can be applied similarly to a collection support method of the first embodiment. In particular, the collection support method of the first embodiment is applied to the component holding of the bulk material feed device 20, including the web unit 32 and the depression unit 42, and comprises an image acquisition step, an update step, and a determination step. The image acquisition step corresponds to the control performed by the imaging section 61. The update step corresponds to the control performed by the update section 62. The determination step corresponds to the control performed by the determination section 63.

[0095] Furthermore, the above description for the collection support device 60 of the second embodiment can be applied similarly to a collection support method of the second embodiment. In particular, the collection support method of the second embodiment is applied to the component holding of the bulk material feed device 20, including the web unit 32 and the depression unit 42, and comprises a storage step and a decision step. The storage step corresponds to the control performed by the storage section 64. The decision step corresponds to the control performed by the decision section 65. 3. Example of the effects of the embodiment

[0096] According to the collection support device 60, it is possible to determine the presence or absence of component 91 in the recess 43 even in a case where the state of the recess 43 changes during the manufacture of the product plate. The above description for the collection support device 60 can be applied similarly to the collection support method. List of reference symbols 10 Component placement device, 20: Bulk material feeding device, 32: Web unit, 42 Advanced Unit, 43: Advanced Unit, 43a: First Advanced Unit, 43b Second depression, 43e: Empty depression, 50: Component container, 60 Collection support device, 61 Imaging section, 62 Update section, 63 Determination section, 64 Storage section, 64a: Storage device, 65: Decision section, 80c: Inspection target section, 80m Faulty detection section, 91: Component, As0: Feed area, Rd0: Conveyor path, ARO Specific area, PC0: Reference image, PC1: First image, PC2 Second image, PD0: Inspection image. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] WO 2017 / 208325

[0003]

Claims

[1] Collective support device comprising: a track unit comprising a conveying path configured to convey a component, which is unloaded from a component container receiving the component in a bulk state, to a feed area where the component can be received by a component placement device; a depression unit comprising multiple depressions in the feed area, each depression being configured to receive one of the components being conveyed from the conveying path to the feed area in the track unit; an imaging section configured to capture a first well during an available acquisition period in which the component is not expected to be picked up in the first well, for each of the first wells that is at least one of the multiple wells and for which it is confirmed that the component was picked up by the component placement device; an update section configured to update a reference image obtained by capturing an empty well in which the component is not included, using an initial image obtained by capturing the first well through the mapping section, for each of the initial wells; and a determination section that is configured to determine, using the reference image updated by the update section, whether the component is included in the first well. [2] The collection support device according to claim 1, wherein the available collection period is a period from the time at which it is confirmed that the component has been removed from the first well until the collection of the component in the first well is attempted for the feeding of a next component. [3] The collection support device according to claim 1 or 2, wherein the imaging section captures the first recess each time the available recording period occurs or when the number of available recording periods reaches a predetermined number. [4] The collection support device according to claim 1, wherein the illustration section captures at least the first depression in a case in which the capture period occurs for the first time after activation of the component placement device or after completion of maintenance of the depression unit. [5] The collection support device according to claim 1, wherein the determining section calculates a difference between an image feature value of an inspection image obtained by capturing the first well after attempting to pick up the component in the first well for feeding the component and the image feature value of the reference image for each pixel, in order to determine that the component is picked up in the first well if there is a certain area in which the difference between the image feature values ​​exceeds a predetermined range, and an area of ​​a closed region comprising the certain region is contained within an assumed region of an area of ​​the component, and to determine that the component is not picked up in the first well if no certain region is present or the area of ​​the closed region comprising the certain region isis not included in the assumed area of ​​the component's surface. [6] A collection support device comprising: a conveyor unit comprising a conveying path configured to convey a component dispensed from a component housing receiving the component in a bulk state to a feed area where the component can be collected by a component placement device; a depression unit comprising several depressions in the feed area, each of which is configured to accommodate one of the components being conveyed from the conveyor path to the feed area in the conveyor unit; a memory section configured to store, in conjunction with each other, a second well position in the well unit and an image feature value enabling the identification of a faulty detection section that is erroneously recognized as the component in a second image obtained by capturing the second well, in a memory device for each of the second wells that are at least one of the multiple wells for which it has been confirmed that the component cannot be collected by the component placement device; and a decision section configured to decide whether the component is accommodated in the second well, based on a degree of agreement between the image feature value that enables the identification of an inspection target section recognized as the component in an inspection image obtained by capturing the second well after attempting to receive the component in the second well for component feeding, and the image feature value that enables the identification of the faulty detection section stored in the storage device for each of the second wells. [7] The collection support device according to claim 6, wherein the decision section calculates a difference between the image feature value of the inspection target section in the inspection image and the image feature value of the defective detection section in the second image and decides that the component is picked up in the second well if the difference between the image feature values ​​exceeds a predetermined range, and decides that the component is not picked up in the second well if the difference between the image feature values ​​is within the predetermined range. [8] The collection support device according to claim 6 or 7, wherein the storage section stores the inspection image as the second image in the storage device when the decision section has decided that the component has been picked up in the second recess, but the component could not be collected by the component placement device. [9] The image collection support device according to claim 6, wherein the image feature value is at least one of the following: positions of the inspection target section and the fault detection section in the second well; inclinations of the inspection target section and the fault detection section with respect to the second well; luminances of the inspection target section and the fault detection section; areas of the inspection target section and the fault detection section; and a ratio of a long side to a short side in a case where the inspection target section and the fault detection section have a rectangular shape. [10] A collection support method applied to a component collection of a bulk material feeding device comprising a track unit comprising a conveying path configured to convey a component dispensed from a component container receiving the component in a bulk state to a feed area where the component can be collected by a component placement device, and a depression unit comprising multiple depressions in the feed area, each of the depressions being configured to receive one of the components conveyed from the conveying path to the feed area in the track unit, the collection support method comprising: an image acquisition step to capture a first well during an available acquisition period in which the component is not expected to be captured in the first well, for each of the first wells that are at least one of the multiple wells and for which it has been confirmed that the component was collected by the component placement device; an update step to update a reference image obtained by capturing an empty well in which the component is not included, using an initial image obtained by capturing the first well through the image acquisition step, for each of the initial wells; and a determination step to determine whether the component is included in the first well, using the reference image updated by the update step. [11] A collection support method applied to a component collection of a bulk material feeding device comprising a track unit comprising a conveying path configured to convey a component unloaded from a component container receiving the component in a bulk state to a feed area where the component can be collected by a component placement device, and a depression unit comprising multiple depressions in the feed area, each of the depressions being configured to receive one of the components conveyed from the conveying path to the feed area in the track unit, the collection support method comprising: a storage step for storing a position of a second well in the well unit and an image feature value that enables the identification of a faulty detection section that is incorrectly recognized as the component in a second image obtained by capturing the second well, in conjunction with each other in a storage device, for each of the second wells that are at least one of the multiple wells for which it has been confirmed that the component cannot be picked up by the component placement device; and a decision step to decide whether the component is received in the second well, based on a degree of agreement between the image feature value that enables the identification of an inspection target section recognized as the component in an inspection image obtained by capturing the second well after attempting to receive the component in the second well for component feeding, and the image feature value that enables the identification of the faulty recognition section stored in the storage device for each of the second wells.

Images