Scoreboard, display device and method for manufacturing a scoreboard

Abstract

The present application provides a display panel, a display device, and a method for manufacturing a display panel, wherein the display panel comprises a substrate, an insulating structure, a light-emitting functional layer, and a first encapsulation layer, the insulating structure being arranged on one side of the substrate, and an opening structure being formed by enclosing the insulating structure. The light-emitting functional layer is arranged on one side of the substrate, the light-emitting functional layer comprising a plurality of light-emitting units arranged within the opening structure.The first encapsulation layer is arranged on the side of the light-emitting functional layer facing away from the substrate, the first encapsulation layer comprising a plurality of encapsulation sections associated with the light-emitting units, the thicknesses of which are different for at least some of the light-emitting units with different light colors. In one embodiment of the present application, the reliability of the display panel can be increased.

Description

Display panel, display device, and method for manufacturing display panel

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202310692518.5, filed on June 9, 2023, entitled “Display Panel, Display Device, and Method for Preparing Display Panel,” and the entire contents of that application are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of display devices, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0004] Flat display panels such as organic light emitting diode (OLED) panels and display panels using light emitting diode (LED) devices have been widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream display device.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, which can improve reliability.

[0007] In a first aspect, an embodiment of the present application provides a display panel, comprising:

[0008] substrate;

[0009] An isolation structure is provided on one side of the substrate, and the isolation structure encloses a plurality of opening structures;

[0010] a light-emitting functional layer, disposed on one side of the substrate, the light-emitting functional layer comprising a plurality of light-emitting units disposed in the plurality of opening structures;

[0011] a first encapsulation layer, disposed on a side of the light-emitting functional layer facing away from the substrate, the first encapsulation layer comprising a plurality of encapsulation portions disposed corresponding to the light-emitting units;

[0012] Wherein, at least some of the light-emitting units with different luminous colors correspond to different thicknesses of the packaging parts.

[0013] In some embodiments, the encapsulation portion includes a first portion, an orthographic projection of the first portion on the substrate is located outside an orthographic projection of the isolation structure on the substrate, and at least some of the light-emitting units of different colors have different thicknesses of the first portion.

[0014] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion sequentially arranged in a direction away from the substrate, wherein an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0015] An orthographic projection of the first portion on the substrate is located outside an orthographic projection of the second isolation portion on the substrate.

[0016] In some embodiments, each of the packaging parts includes a second portion located on a side of the isolation structure away from the substrate, and for multiple packaging parts corresponding to multiple light-emitting units with different luminous colors, the thickness of the second portions of the multiple packaging parts is different.

[0017] In some embodiments, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and the third light-emitting unit, each emitting light of different colors;

[0018] The plurality of encapsulation portions include a first encapsulation portion located on a side of the first light emitting unit away from the substrate, a second encapsulation portion located on a side of the second light emitting unit away from the substrate, and a third encapsulation portion located on a side of the third light emitting unit away from the substrate;

[0019] The thickness of the first encapsulation portion is greater than the thickness of the second encapsulation portion and the thickness of at least one of the third encapsulation portion;

[0020] In some embodiments, the thickness of the first encapsulation portion is greater than the thickness of the second encapsulation portion, and the thickness of the second encapsulation portion is greater than the thickness of the third encapsulation portion; or

[0021] The thickness of the first encapsulation portion is greater than the thickness of the second encapsulation portion, and the thickness of the second encapsulation portion is equal to the thickness of the third encapsulation portion.

[0022] In some embodiments, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit that emit light of different colors.

[0023] The plurality of encapsulation portions include a first encapsulation portion located on a side of the first light-emitting unit away from the substrate, and a second encapsulation portion located on a side of the second light-emitting unit away from the substrate, wherein a thickness of the first encapsulation portion is greater than a thickness of the second encapsulation portion;

[0024] In some embodiments, the first light emitting unit is configured to emit red light or green light, and the second light emitting unit is configured to emit blue light; or, the first light emitting unit is configured to emit blue light, and the second light emitting unit is configured to emit red light or green light;

[0025] In some embodiments, the plurality of light-emitting units further include a third light-emitting unit having a light-emitting color different from that of the first light-emitting unit and the second light-emitting unit;

[0026] The plurality of encapsulation portions include a third encapsulation portion located on a side of the third light-emitting unit away from the substrate, the thickness of the second encapsulation portion is greater than the thickness of the third encapsulation portion, or the thickness of the second encapsulation portion is equal to the thickness of the third encapsulation portion;

[0027] The first light emitting unit is used to emit blue light, the second light emitting unit is used to emit green light, and the third light emitting unit is used to emit red light; or, the first light emitting unit is used to emit red light, the second light emitting unit is used to emit green light, and the third light emitting unit is used to emit blue light.

[0028] In some embodiments, the thickness of at least one of the encapsulation parts is greater than or equal to 1.0 um and less than or equal to 2.5 um.

[0029] In some embodiments, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit emitting light of different colors, the plurality of encapsulation portions include a first encapsulation portion located on a side of the first light-emitting unit facing away from the substrate, and a second encapsulation portion located on a side of the second light-emitting unit facing away from the substrate, the thickness of the first encapsulation portion is greater than the thickness of the second encapsulation portion, and an etching selectivity ratio between the second encapsulation portion and the first encapsulation portion is SR1, where SR1 is ≥1;

[0030] In some embodiments, the plurality of light-emitting units further include a third light-emitting unit having a color different from that of the first light-emitting unit and the second light-emitting unit, and the plurality of packaging portions include a third packaging portion located on a side of the third light-emitting unit away from the substrate;

[0031] The etching selectivity ratio between the third encapsulation portion and the second encapsulation portion is SR2, and SR2 ≥ 1;

[0032] In some embodiments, SR1=1, the first packaging portion and the second packaging portion are made of the same material;

[0033] In some embodiments, SR1>1, the first encapsulation portion includes silicon oxide, and the second encapsulation portion includes silicon oxynitride;

[0034] In some embodiments, SR2>1, the second encapsulation portion includes silicon oxynitride, and the third encapsulation portion includes silicon nitride.

[0035] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion sequentially arranged in a direction away from the substrate, wherein an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0036] The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit that emit light of different colors, the isolation structure includes a first isolation structure and a second isolation structure, the first light-emitting unit is located within the opening structure enclosed by the first isolation structure, and the second light-emitting unit is located within the opening structure enclosed by the second isolation structure;

[0037] The plurality of encapsulation portions include a first encapsulation portion located on a side of the first light-emitting unit away from the substrate, and a second encapsulation portion located on a side of the second light-emitting unit away from the substrate, wherein a thickness of the first encapsulation portion is greater than a thickness of the second encapsulation portion;

[0038] In some embodiments, the thickness of the encapsulation portion corresponding to the light-emitting unit of at least one luminous color is greater than twice the thickness of the first isolation portion.

[0039] In some embodiments, the contour line of the orthographic projection of the first isolation portion on the substrate includes a first contour line corresponding to the first opening structure and a second contour line corresponding to the second opening structure; the contour line of the orthographic projection of the second isolation portion on the substrate includes a third contour line corresponding to the first opening structure and a fourth contour line corresponding to the second opening structure; the distance between the corresponding first contour line and the third contour line is L1, and the distance between the corresponding second contour line and the fourth contour line is L2, L1<L2; and / or, the length of the second isolation portion extending toward the first opening structure relative to the first isolation portion is L5, and the length of the second isolation portion extending toward the second opening structure relative to the first isolation portion is L6, L5<L6.

[0040] In some embodiments, the display panel further includes a pixel definition layer, the pixel definition layer including a first pixel defining portion and a second pixel defining portion, the first light-emitting unit is located in a pixel opening enclosed by the first pixel defining portion, the second light-emitting unit is located in the pixel opening enclosed by the second pixel defining portion, the pixel opening enclosed by the first pixel defining portion is connected to the opening structure enclosed by the first isolation structure, and the pixel opening enclosed by the second pixel defining portion is connected to the opening structure enclosed by the second isolation structure;

[0041] The contour lines of the positive projection of the first isolation portion on the substrate include a first contour line corresponding to the first opening structure and a second contour line corresponding to the second opening structure; the contour lines of the positive projection of the pixel defining portion on the substrate include a fifth contour line corresponding to the first pixel opening and a sixth contour line corresponding to the second pixel opening; the distance between the corresponding first contour line and the fifth contour line is L3, and the distance between the corresponding second contour line and the sixth contour line is L4, and L3<L4.

[0042] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion sequentially arranged in a direction away from the substrate, wherein an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0043] The packaging portion includes a first sub-portion disposed in contact with the first isolation portion, a second sub-portion connected to a side of the first sub-portion facing away from the substrate, and a third sub-portion connected to a side of the first sub-portion facing the substrate;

[0044] In at least part of the packaging portion, the second sub-portion is connected to the third sub-portion, and / or, in at least part of the packaging portion, the second sub-portion and the third sub-portion are spaced apart.

[0045] In some embodiments, the plurality of encapsulation parts include a first encapsulation part and a second encapsulation part, and the thickness of the first encapsulation part is greater than the thickness of the second encapsulation part;

[0046] In the first packaging part, the second sub-part is connected to the third sub-part, and in the second packaging part, the second sub-part is spaced apart from the third sub-part.

[0047] In some embodiments, the first electrode layer is provided between the light-emitting functional layer and the first encapsulation layer, and the first electrode layer includes a plurality of first electrodes provided corresponding to the plurality of light-emitting units;

[0048] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion sequentially arranged in a direction away from the substrate, wherein an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0049] The first isolation portion includes a conductive material, and the first electrode is arranged to overlap the first isolation portion.

[0050] In some embodiments, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit having different light-emitting colors, and the thickness of the first light-emitting unit is smaller than the thickness of the second light-emitting unit;

[0051] The plurality of packaging parts include a first packaging part located on a side of the first light emitting unit away from the substrate, and a second packaging part located on a side of the second light emitting unit away from the substrate, wherein the thickness of the first packaging part is greater than that of the second packaging part.

[0052] In some embodiments, the first light-emitting unit and the second light-emitting unit both include a hole transport layer, an electron transport layer, and a light-emitting material located between the hole transport layer and the electron transport layer, and the thickness of the light-emitting material in the first light-emitting unit is less than the thickness of the light-emitting material in the second light-emitting unit.

[0053] In some embodiments, the invention further includes a second encapsulation layer disposed on a side of the first encapsulation layer facing away from the substrate, the second encapsulation layer covering the plurality of encapsulation portions, the second encapsulation layer including a first surface facing away from the substrate, the first surface being parallel to the plane of the substrate;

[0054] In some embodiments, the second encapsulation layer comprises an organic material;

[0055] In some embodiments, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit that emit light of different colors, the plurality of encapsulation portions include a first encapsulation portion located on a side of the first light-emitting unit facing away from the substrate, and a second encapsulation portion located on a side of the second light-emitting unit facing away from the substrate, the thickness of the first encapsulation portion being greater than the thickness of the second encapsulation portion; and the thickness of the second encapsulation layer above the first encapsulation portion being less than the thickness of the second encapsulation layer above the second encapsulation portion.

[0056] In some embodiments, the display panel further includes a third encapsulation layer disposed on a side of the second encapsulation layer facing away from the substrate, wherein the third encapsulation layer covers the plurality of encapsulation portions;

[0057] In some embodiments, the first encapsulation layer and the third encapsulation layer include inorganic materials.

[0058] In some embodiments, the light-emitting units having different luminous colors correspond to different thicknesses of the packaging parts;

[0059] In some embodiments, the packaging parts corresponding to the light-emitting units with the same luminous color have the same thickness.

[0060] In some embodiments, the thicknesses of the encapsulation parts corresponding to at least two adjacent light-emitting units are different.

[0061] In a second aspect, an embodiment of the present application provides a display panel, including:

[0062] substrate;

[0063] An isolation structure is provided on one side of the substrate, and the isolation structure encloses a plurality of opening structures;

[0064] a light-emitting functional layer, disposed on one side of the substrate, the light-emitting functional layer comprising a plurality of light-emitting units disposed in the plurality of opening structures;

[0065] a first encapsulation layer, disposed on a side of the light-emitting functional layer away from the substrate, the first encapsulation layer comprising a plurality of encapsulation portions corresponding to the light-emitting units, the plurality of encapsulation portions comprising a first encapsulation portion and a second encapsulation portion corresponding to light-emitting units of different luminous colors;

[0066] The second packaging layer is arranged on the side of the first packaging layer away from the substrate. The second packaging layer covers multiple packaging parts. The thickness of the second packaging layer above the first packaging part is less than the thickness of the second packaging layer above the second packaging part.

[0067] In a third aspect, an embodiment of the present application provides a display panel, including:

[0068] substrate;

[0069] an isolation structure disposed on one side of the substrate, the isolation structure enclosing a plurality of opening structures, the isolation structure comprising a first isolation portion and a second isolation portion sequentially disposed in a direction away from the substrate, the orthographic projection of the first isolation portion on the substrate being within the orthographic projection of the second isolation portion on the substrate, the isolation structure comprising the first isolation structure and the second isolation structure;

[0070] a light-emitting functional layer disposed on one side of the substrate, the light-emitting functional layer comprising a plurality of light-emitting units disposed within the plurality of opening structures, the plurality of light-emitting units comprising a first light-emitting unit and a second light-emitting unit, the first light-emitting unit being located within the opening structure enclosed by the first isolation structure, and the second light-emitting unit being located within the opening structure enclosed by the second isolation structure;

[0071] a first encapsulation layer, disposed on a side of the light-emitting functional layer facing away from the substrate, the first encapsulation layer comprising a plurality of encapsulation portions disposed corresponding to the plurality of light-emitting units; the plurality of encapsulation portions comprising a first encapsulation portion located on a side of the first light-emitting unit facing away from the substrate, and a second encapsulation portion located on a side of the second light-emitting unit facing away from the substrate, the first encapsulation portion being thicker than the second encapsulation portion;

[0072] Among them, the contour line of the orthographic projection of the first isolation portion on the substrate includes a first contour line corresponding to the first opening structure and a second contour line corresponding to the second opening structure; the contour line of the orthographic projection of the second isolation portion on the substrate includes a third contour line corresponding to the first opening structure and a fourth contour line corresponding to the second opening structure; the distance between the corresponding first contour line and the third contour line is L1, and the distance between the corresponding second contour line and the fourth contour line is L2, L1<L2.

[0073] The encapsulation portion includes a first portion, an orthographic projection of the first portion on the substrate is located outside an orthographic projection of the isolation structure on the substrate, and thicknesses of the first portion corresponding to the first encapsulation portion and the second encapsulation portion are different;

[0074] In some embodiments, the orthographic projection of the first portion on the substrate is located outside the orthographic projection of the second isolation portion on the substrate.

[0075] In some embodiments, each of the encapsulation parts includes a second portion located on a side of the isolation structure away from the substrate, and thicknesses of the second portions corresponding to the first encapsulation part and the second encapsulation part are different.

[0076] In a fourth aspect, an embodiment of the present application provides a display panel, including:

[0077] substrate;

[0078] A pixel definition layer is provided on one side of the substrate;

[0079] an isolation structure disposed on a side of the pixel definition layer facing away from the substrate, the isolation structure comprising a first isolation portion and a second isolation portion sequentially disposed in a direction away from the substrate, the orthographic projection of the first isolation portion on the substrate being located within the orthographic projection of the second isolation portion on the substrate, the isolation structure being provided with a plurality of opening structures, the plurality of opening structures comprising a first opening structure communicating with the first pixel opening and a second opening structure communicating with the second pixel opening;

[0080] a light-emitting functional layer disposed on one side of the substrate, the light-emitting functional layer comprising a plurality of light-emitting units disposed in the plurality of opening structures, the plurality of light-emitting units comprising a first light-emitting unit located in the first opening structure and a second light-emitting unit located in the second opening structure;

[0081] a first encapsulation layer, disposed on a side of the light-emitting functional layer facing away from the substrate, the first encapsulation layer comprising a plurality of encapsulation portions disposed corresponding to the plurality of light-emitting units; the plurality of encapsulation portions comprising a first encapsulation portion located on a side of the first light-emitting unit facing away from the substrate, and a second encapsulation portion located on a side of the second light-emitting unit facing away from the substrate, the first encapsulation portion being thicker than the second encapsulation portion;

[0082] In which, the contour line of the positive projection of the first isolation portion on the substrate includes a first contour line corresponding to the first opening structure and a second contour line corresponding to the second opening structure; the contour line of the positive projection of the pixel defining portion on the substrate includes a fifth contour line corresponding to the first pixel opening and a sixth contour line corresponding to the second pixel opening; the distance between the corresponding first contour line and the fifth contour line is L3, and the distance between the corresponding second contour line and the sixth contour line is L4, L3<L4.

[0083] The distance between the outer contour of the orthographic projection of the first isolation part in the first isolation structure on the substrate facing the substrate and the outer contour of the orthographic projection of the first pixel defining part on the substrate is L3, and the distance between the outer contour of the orthographic projection of the first isolation part in the second isolation structure on the substrate and the outer contour of the orthographic projection of the second pixel defining part on the substrate is L4, L3<L4.

[0084] In a fifth aspect, an embodiment of the present application provides a display panel, including:

[0085] substrate;

[0086] An isolation structure is provided on one side of the substrate, and the isolation structure encloses a plurality of opening structures;

[0087] a light-emitting functional layer, disposed on one side of the substrate, the light-emitting functional layer comprising a plurality of light-emitting units disposed in the plurality of opening structures;

[0088] a first encapsulation layer, disposed on a side of the light-emitting functional layer facing away from the substrate, the first encapsulation layer comprising a plurality of encapsulation portions disposed corresponding to the light-emitting units;

[0089] Wherein, at least some of the light-emitting units with different light-emitting colors have different etching times corresponding to the packaging parts.

[0090] In some embodiments, the packaging portion includes a first portion, which is a portion of the packaging portion located above the light-emitting unit, and etching times of the first portion corresponding to at least some of the light-emitting units of different colors are different.

[0091] In some embodiments, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and the third light-emitting unit, each emitting light of different colors;

[0092] The plurality of encapsulation portions include a first encapsulation portion located on a side of the first light emitting unit away from the substrate, a second encapsulation portion located on a side of the second light emitting unit away from the substrate, and a third encapsulation portion located on a side of the third light emitting unit away from the substrate;

[0093] The etching time of the first encapsulation part is longer than the etching time of at least one of the second encapsulation part and the third encapsulation part;

[0094] In some embodiments, the etching time of the second packaging portion is longer than the etching time of the third packaging portion, or the etching time of the second packaging portion is equal to the etching time of the third packaging portion.

[0095] In some embodiments, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit emitting light of different colors, the plurality of encapsulation portions include a first encapsulation portion located on a side of the first light-emitting unit facing away from the substrate, and a second encapsulation portion located on a side of the second light-emitting unit facing away from the substrate, and an etching time length of the first encapsulation portion is greater than an etching time length of the second encapsulation portion;

[0096] The first light emitting unit is configured to emit blue light, and the second light emitting unit is configured to emit red light or green light;

[0097] In some embodiments, the plurality of light-emitting units further include a third light-emitting unit having a light-emitting color different from that of the first light-emitting unit and the second light-emitting unit;

[0098] The plurality of encapsulation parts include a third encapsulation part located on a side of the third light-emitting unit facing away from the substrate, the etching time of the second encapsulation part is longer than the etching time of the third encapsulation part, or the etching time of the second encapsulation part is equal to the etching time of the third encapsulation part;

[0099] The first light emitting unit is configured to emit blue light, the second light emitting unit is configured to emit green light, and the third light emitting unit is configured to emit red light.

[0100] In some embodiments, the etching time of the packaging parts corresponding to the light-emitting units with the same luminous color is the same.

[0101] In some embodiments, the etching time lengths of the packaging parts corresponding to at least two adjacent light-emitting units are different.

[0102] In a sixth aspect, an embodiment of the present application provides a display device, comprising a display panel in any of the aforementioned embodiments.

[0103] In a seventh aspect, an embodiment of the present application provides a method for manufacturing a display panel, comprising:

[0104] An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses an opening structure, and the plurality of opening structures include at least one first opening structure and at least one second opening structure;

[0105] forming a first light-emitting unit in each of the opening structures and a first packaging material layer covering each of the first light-emitting units;

[0106] Etching the first packaging material layer and the first light-emitting unit in the second opening structure to retain the first light-emitting unit and the first packaging material layer in the first opening structure, wherein the etching time corresponding to the first packaging material layer is T1;

[0107] forming a second light-emitting unit in each of the opening structures and a second packaging material layer covering each of the second light-emitting units;

[0108] The second light emitting unit and the second packaging material layer in the first opening structure are etched to retain the second light emitting unit and the second packaging material layer in the second opening structure. The etching time corresponding to the second packaging material layer is T2, and T1>T2.

[0109] In some embodiments, the thickness of the first packaging material layer is greater than the thickness of the second packaging material layer; and / or,

[0110] An etching selectivity ratio between the second packaging material layer and the first packaging material layer is SR1, and SR1≥1.

[0111] In some embodiments, the plurality of opening structures further comprises at least one third opening structure;

[0112] After etching the second light-emitting unit and the second packaging material layer in the first opening structure to retain the second light-emitting unit in the second opening structure and the light-emitting unit in the second packaging material layer, the preparation method further includes:

[0113] forming a third light-emitting unit in each of the opening structures and a third packaging material layer covering each of the third light-emitting units;

[0114] performing an etching process on the third encapsulation material layer and the third light-emitting unit in the first opening structure and the second opening structure, so as to retain the third light-emitting unit and the third encapsulation material layer in the third opening structure;

[0115] The etching time of the second packaging material layer is longer than that of the third packaging material layer, or the etching time of the second packaging material layer is equal to that of the third packaging material layer.

[0116] In an eighth aspect, an embodiment of the present application provides a method for manufacturing a display panel, comprising:

[0117] An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of opening structures, wherein the plurality of opening structures include at least one first opening structure and at least one second opening structure;

[0118] forming a first light-emitting unit in each of the opening structures and a first packaging material layer covering each of the first light-emitting units;

[0119] removing the first encapsulation material layer and the first light-emitting unit within the second opening structure, and retaining the first light-emitting unit and the first encapsulation material layer within the first opening structure;

[0120] forming second light-emitting units and a second packaging material layer covering each of the second light-emitting units in the second opening structure, wherein the thickness of the second packaging material layer is less than that of the first packaging material layer;

[0121] The second encapsulation material layer and the second light-emitting unit in the first opening structure are removed, and the second light-emitting unit and the second encapsulation material layer in the second opening structure are retained.

[0122] In some embodiments, the plurality of opening structures include at least one third opening structure;

[0123] After removing the second encapsulation material layer and the second light-emitting unit in the first opening structure, the preparation method further includes:

[0124] forming a third light-emitting unit in each of the opening structures and a third packaging material layer covering each of the third light-emitting units;

[0125] removing the third encapsulation material layer and the third light-emitting unit in the first opening structure and the second opening structure, and retaining the third encapsulation material layer and the third light-emitting unit in the third opening;

[0126] The thickness of the second packaging material layer is greater than the thickness of the third packaging material layer, or the thickness of the second packaging material layer is equal to the thickness of the third packaging material layer.

[0127] The embodiments of the present application provide a display panel, a display device, and a method for preparing a display panel. The thickness of the packaging parts corresponding to at least some of the light-emitting units of different colors can be set differently according to the preparation order of the light-emitting units inside the display panel. Since the thickness of at least some of the packaging parts is relatively large, the damage to the packaging parts caused by subsequent processes can be more effectively reduced, thereby improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0128] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0129] FIG1 is a schematic cross-sectional view of a display panel according to an embodiment of the present application;

[0130] FIG2 is an enlarged structural diagram of area Q in FIG1 ;

[0131] 3a and 3b are schematic top views of an isolation structure and a light-emitting unit in another display panel provided by an embodiment of the present application;

[0132] FIG4 is a schematic cross-sectional view of another display panel provided in an embodiment of the present application;

[0133] FIG5 is a schematic cross-sectional view of another display panel provided in an embodiment of the present application;

[0134] FIG6 is a schematic cross-sectional view of another display panel provided in an embodiment of the present application;

[0135] FIG7 is a schematic cross-sectional view of another display panel provided in an embodiment of the present application;

[0136] FIG8 is a schematic structural diagram of a display device provided in an embodiment of the present application;

[0137] FIG9 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0138] 10a to 10e are schematic diagrams of the process structure of a method for manufacturing a display panel provided in an embodiment of the present application;

[0139] FIG11 is a schematic cross-sectional view of another display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0140] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0141] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0142] In the related art, an isolation structure may be provided in the display panel to achieve isolation between different light-emitting units. However, during the use of the display panel, display failure may easily occur.

[0143] Through research, the inventors discovered that this is because during the preparation of the display panel, the material used to form the light-emitting unit of a specific color and the packaging material corresponding to the light-emitting unit will fall into the opening structure formed by the isolation structure. Then, it is necessary to use an etching process to remove the packaging material in part of the opening structure and the material forming the light-emitting unit of a specific color to complete the preparation of the light-emitting unit and the corresponding packaging part. Thereafter, the above process is repeated to form the material of other light-emitting units of a specific color and the packaging material corresponding to the light-emitting unit in each opening structure, and then the packaging material in part of the opening structure and the corresponding light-emitting unit are removed through etching and other processes. In this process, the etching process corresponding to the light-emitting unit formed later is likely to damage the light-emitting unit formed earlier and the packaging material corresponding thereto, thereby causing some light-emitting units to fail and the risk of display abnormalities.

[0144] In view of this, in the first aspect, referring to Figures 1 and 2, an embodiment of the present application provides a display panel, which includes a substrate 10, an isolation structure 20, a light-emitting functional layer 30, and a first encapsulation layer 40. The isolation structure 20 is arranged on one side of the substrate 10, and the isolation structure 20 encloses a plurality of opening structures 21. The light-emitting functional layer 30 is arranged on one side of the substrate 10, and the light-emitting functional layer 30 includes a plurality of light-emitting units 31 arranged in the plurality of opening structures 21. The first encapsulation layer 40 is arranged on the side of the light-emitting functional layer 30 facing away from the substrate 10, and the first encapsulation layer 40 includes a plurality of encapsulation portions 41 arranged corresponding to the light-emitting units 31. Among them, the thickness M of the encapsulation portion 41 corresponding to the light-emitting units 31 with at least some different luminescent colors is different.

[0145] The substrate 10 has a supporting and load-bearing function, and other film layers are sequentially stacked on the substrate 10. The stacking arrangement mentioned here means that the other film layers are sequentially arranged along the thickness direction X of the substrate 10. Among them, various film layer structures can be provided in the substrate 10, and the specific film layer structure composition of the substrate 10 is not limited in the embodiments of the present application.

[0146] The isolation structure 20 may be located on the pixel definition layer, or the isolation structure 20 may be located on the planarization layer. The location of the isolation structure 20 is not specifically limited herein.

[0147] The isolation structure 20 and the light-emitting functional layer 30 are located on the same side of the substrate 10. The isolation structure 20 encloses a plurality of opening structures 21. The present embodiment does not limit the size and shape of the isolation structure 20. For example, referring to Figures 1 to 3a, the orthographic projection of the isolation structure 20 on the substrate 10 is a mesh-like structure.

[0148] The light-emitting functional layer 30 includes a plurality of light-emitting units 31. The light-emitting unit 31 is a structure for realizing a light-emitting function, which can emit light of a specific color under circuit control. The plurality of light-emitting units 31 are arranged in the plurality of opening structures 21. The plurality of light-emitting units 31 include but are not limited to a red light-emitting unit 31 for emitting red light, a green light-emitting unit 31 for emitting green light, and a blue light-emitting unit 31 for emitting blue light. Each light-emitting unit 31 may include a stacked hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer, a luminescent material layer, an electron transport layer (ETL), a hole blocking layer, and an electron injection layer (EIL).

[0149] The plurality of opening structures 21 enclosed by the isolation structure 20 may correspond one to one with the light-emitting units 31, with one light-emitting unit 31 disposed within one opening structure 21. Alternatively, multiple light-emitting units 31 may be disposed within one opening structure 21, for example, multiple light-emitting units 31 of the same color may be disposed within one opening structure 21.

[0150] The first encapsulation layer 40 is located on the side of the light-emitting functional layer 30 away from the substrate 10. The first encapsulation layer 40 can be used to protect the light-emitting unit 31 to reduce the probability of water and oxygen invading the light-emitting unit 31, thereby improving the reliability of the light-emitting unit 31.

[0151] The first encapsulation layer 40 includes a plurality of encapsulation parts 41. An encapsulation part 41 is a structure in the first encapsulation layer 40 that covers at least one adjacent light-emitting unit 31, so that one encapsulation part 41 can protect at least one adjacent light-emitting unit 31. In Figure 1, the encapsulation part 41 is schematically illustrated in the form of a box. Each encapsulation part 41 is respectively provided corresponding to each light-emitting unit 31 to achieve the encapsulation of the light-emitting unit 31. In some embodiments, a plurality of light-emitting units 31 are provided in a one-to-one correspondence with a plurality of encapsulation parts 41, so as to achieve independent encapsulation of the light-emitting unit 31. Alternatively, one encapsulation part 41 is provided corresponding to a plurality of light-emitting units 31, and a plurality of light-emitting units 31 are encapsulated by one encapsulation part 41. For example, a plurality of light-emitting units 31 of the same color are encapsulated by one encapsulation part 41.

[0152] On this basis, in the embodiment of the present application, the thickness M of the packaging portion 41 corresponding to at least some of the light-emitting units 31 of different colors is set to be different, so as to reduce the probability of failure of the light-emitting unit 31 .

[0153] Specifically, taking the example of preparing the red light-emitting unit 31 before the green light-emitting unit 31, due to the presence of the isolation structure 20, the red light-emitting unit 31 and the corresponding encapsulation portion 41 are prepared and formed before the green light-emitting unit 31. Then, according to this preparation order, the embodiment of the present application can adjust the thickness M of the encapsulation portion 41 corresponding to the red light-emitting unit 31 to be appropriately increased, so that its thickness is greater than the thickness M of the encapsulation portion 41 corresponding to the green light-emitting unit 31. In this way, when the green light-emitting unit 31 is etched, the probability of the encapsulation portion 41 corresponding to the red light-emitting unit 31 being etched and damaged can be reduced, thereby ensuring the effective encapsulation of the red light-emitting unit 31, reducing the risk of failure of the red light-emitting unit 31, and improving the reliability of the display panel.

[0154] Furthermore, for each light-emitting unit 31 of different colors, the thickness M of the corresponding encapsulation portion 41 can be set to be different as needed, or the thickness M of the corresponding encapsulation portion 41 can be set to be the same as needed. This embodiment of the present application is not limited to this, as long as the thickness M of the encapsulation portion 41 corresponding to some light-emitting units 31 of different colors in the display panel is different.

[0155] In summary, the embodiments of the present application can set different thicknesses M of the encapsulation portions 41 corresponding to at least some of the different-colored light-emitting units 31 according to the order in which the light-emitting units 31 are prepared within the display panel. Since at least some of the encapsulation portions have a greater thickness, damage to the encapsulation portions during subsequent processes can be more effectively reduced. For example, the thickness M of the encapsulation portions 41 corresponding to the previously formed light-emitting units 31 is greater, thereby reducing the risk of damage to the encapsulation portions 41 of the previously formed light-emitting units 31 during etching of the subsequently formed light-emitting units 31 and the corresponding encapsulation materials, thereby causing failure of some of the light-emitting units 31 and improving the reliability of the display panel. Furthermore, when the light-emitting units 31 and the corresponding encapsulation portions 41 are subsequently formed, the later-formed light-emitting units 31 and encapsulation portions 41 will cover the encapsulation portions 41 of the previously formed light-emitting units 31. When etching the light-emitting units 31 and encapsulation portions 41 covering the encapsulation portions 41 of the previously formed light-emitting units 31, the etching time can be reduced due to the smaller thickness of the encapsulation portions 41 corresponding to the later-formed light-emitting units 31. In some embodiments, the isolation structure 20 can be a one-piece structure, such as an inverted trapezoidal structure, which can be formed from a single layer of material. Alternatively, the isolation structure 20 can be a split structure, such as a T-shaped or I-shaped structure, which can be formed from multiple layers of material. The shape of the isolation structure 20 is not limited herein, as long as the isolation structure 20 can isolate the light-emitting functional layer.

[0156] In some embodiments, the packaging portion 41 includes a first portion 411 , the orthographic projection of the first portion 411 on the substrate 10 is located outside the orthographic projection of the isolation structure 20 on the substrate 10 , and at least some light-emitting units 31 of different colors have different thicknesses of the first portion 411 .

[0157] Each packaging portion 41 includes a first portion 411 and a second portion 412. The first portion 411 is the portion of the packaging portion 41 corresponding to the opening structure 21. That is, the orthographic projection of this portion on the substrate 10 is located outside the orthographic projection of the isolation structure 20 on the substrate 10. The second portion 412 is the portion of the packaging portion 41 located above the isolation structure 20. The orthographic projection of the second portion 412 on the substrate 10 is located within the orthographic projection of the isolation structure 20 on the substrate 10. In Figure 2, the boundary between the first portion 411 and the second portion 412 is schematically indicated by a straight line W.

[0158] Typically, the first portion 411 serves as the primary encapsulation for the light-emitting unit 31. If the first portion 411 is damaged during the etching process, there is a risk of failure of the corresponding light-emitting unit 31. In view of this, in the embodiment of the present application, the thickness of the first portion 411 corresponding to at least some of the light-emitting units 31 of different colors is set to be different. The thickness of the first portion 411 in the encapsulation portion 41 corresponding to at least some of the light-emitting units 31 formed initially is as large as possible, thereby reducing the probability of the subsequent etching process completely damaging the previously formed first portion 411. This ensures that each light-emitting unit 31 can emit light reliably, thereby improving the light-emitting reliability of the display panel.

[0159] In some embodiments, as shown in Figures 1 and 2, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 sequentially arranged along a thickness direction X away from the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. The orthographic projection of the first portion 411 on the substrate 10 is located outside the orthographic projection of the second isolation portion 23 on the substrate 10.

[0160] The isolation structure 20 includes at least a first isolation portion 22 and a second isolation portion 23. The specific dimensions of the first isolation portion 22 and the second isolation portion 23 are not limited in this embodiment. For example, the orthographic projections of the first isolation portion 22 and the second isolation portion 23 on the substrate 10 are both mesh-like structures.

[0161] Because the orthographic projection of the first isolating portion 22 on the substrate 10 is located within the orthographic projection of the second isolating portion 23 on the substrate 10, that is, the second isolating portion 23 is at least partially positioned beyond the first isolating portion 22 in a direction parallel to the plane of the substrate 10. This design facilitates separation of the luminescent material within the opening structure 21 from the luminescent material on the side of the second isolating portion 23 facing away from the substrate 10 during the preparation of the light-emitting unit 31, thereby meeting the preparation requirements of the light-emitting unit 31. It should be noted that, in actual production, some of the luminescent material may contact the sidewalls of the first isolating portion 22, but this is not specifically limited here.

[0162] In some embodiments, each packaging portion 41 includes a second portion 412 located on the side of the isolation structure 20 away from the substrate 10. For multiple packaging portions 41 corresponding to multiple light-emitting units 31 with different luminous colors, the thickness of the second portions 412 of the multiple packaging portions 41 is different.

[0163] In the embodiment of the present application, the thickness of the encapsulation portion 41 corresponding to at least some of the light-emitting units 31 of different colors can be set differently based on the order in which the light-emitting units 31 are prepared within the display panel, resulting in different thicknesses of the second portion 412 corresponding to different encapsulation portions 41. Specifically, the second portion 412 of the encapsulation portion 41 corresponding to the previously prepared light-emitting units 31 is thicker. This reduces the risk of damage to the encapsulation portion 41 corresponding to the previously prepared light-emitting units 31 due to subsequent etching of the light-emitting units 31 and the corresponding encapsulation material, which could cause some of the light-emitting units 31 to fail, thereby improving the reliability of the display panel.

[0164] In some embodiments, the plurality of light-emitting units 31 include a first light-emitting unit 31a, a second light-emitting unit 31b, and a third light-emitting unit 31c having different light-emitting colors, and the plurality of packaging portions 41 include a first packaging portion 41a located on the side of the first light-emitting unit 31a facing away from the substrate 10, a second packaging portion 41b located on the side of the second light-emitting unit 31b facing away from the substrate 10, and a third packaging portion 41b located on the side of the third light-emitting unit 31c facing away from the substrate 10, and the thickness of the first packaging portion 41a is greater than the thickness of at least one of the second packaging portion 41b and the third packaging portion 41c.

[0165] Alternatively, in other embodiments, as shown in FIG. 1 and FIG. 2 , the plurality of light-emitting units 31 include a first light-emitting unit 31 a and a second light-emitting unit 31 b emitting light of different colors.

[0166] The plurality of packaging parts 41 include a first packaging part 41a located on the side of the first light emitting unit 31a away from the substrate 10, and a second packaging part 41b located on the side of the second light emitting unit 31b away from the substrate 10. The thickness of the first packaging part 41a is greater than that of the second packaging part 41b.

[0167] The multiple encapsulation parts 41 include a third encapsulation part 41c located on the side of the third light-emitting unit 31c away from the substrate 10, the thickness of the second encapsulation part 41b is greater than the thickness of the third encapsulation part 41c, or the thickness of the second encapsulation part 41b is equal to the thickness of the third encapsulation part 41c; or, the thickness of the first encapsulation part 41a is equal to the thickness of the second encapsulation part 41b, and the thickness of the second encapsulation part 41b is greater than the thickness of the third encapsulation part 41c.

[0168] Furthermore, in some optional embodiments, the first light-emitting unit 31a is configured to emit red light, the second light-emitting unit 31b is configured to emit green light, and the third light-emitting unit 31c is configured to emit blue light. That is, the light-emitting units 31 can be fabricated in the order of red, green, and blue, with the corresponding thickness of the encapsulation portion 41 gradually decreasing.

[0169] It should be noted that the first encapsulation portion 41a protects the first light-emitting unit 31a, the second encapsulation portion 41b protects the second light-emitting unit 31b, and the third encapsulation portion 41c protects the third light-emitting unit 31c. The first encapsulation portion 41a, the second encapsulation portion 41b, and the third encapsulation portion 41c each include a first portion 411 and a second portion 412.

[0170] Alternatively, the first light emitting unit 31a is configured to emit blue light, the second light emitting unit 31b is configured to emit green light, and the third light emitting unit 31c is configured to emit red light.

[0171] In the above optional embodiment, the thicknesses of the packaging parts 41 corresponding to the first light emitting unit 31 a , the second light emitting unit 31 b , and the third light emitting unit 31 c are different.

[0172] In some other optional embodiments, the thicknesses of the packaging parts 41 corresponding to the two colors of the first light-emitting unit 31 a , the second light-emitting unit 31 b , and the third light-emitting unit 31 c are different.

[0173] For example, the first light-emitting unit 31a is configured to emit red light or green light, and the second light-emitting unit 31b is configured to emit blue light. Specifically, the thickness of the packaging portion 41 corresponding to the light-emitting unit configured to emit blue light is thinner than the thickness of the packaging portion 41 corresponding to the light-emitting unit configured to emit red light, and the thickness of the packaging portion 41 corresponding to the light-emitting unit configured to emit blue light is thinner than the thickness of the packaging portion 41 corresponding to the light-emitting unit configured to emit green light.

[0174] In some optional embodiments, the thickness of at least one encapsulation portion 41 is greater than or equal to 1 μm and less than or equal to 2.5 μm.

[0175] In some embodiments, an etching selectivity ratio of the second encapsulation portion 41 b to the first encapsulation portion 41 a is SR1, where SR1≧1.

[0176] The “etching selectivity” mentioned in the embodiments of the present application refers to the relative etching rate of one material compared to another material under the same etching conditions. The etching selectivity is usually related to the properties of the material.

[0177] SR1≥1 indicates that the etching rate of the second packaging portion 41b is not less than the etching rate of the first packaging portion 41a. Furthermore, since the thickness of the first packaging portion 41a is greater than that of the second packaging portion 41b, the etching time corresponding to the second packaging portion 41b is less than the etching time of the first packaging portion 41a.

[0178] As can be seen from the above, the second light-emitting unit 31b is manufactured after the first light-emitting unit 31a, so the second packaging portion 41b corresponding to the second light-emitting unit 31b is also manufactured after the first light-emitting unit 31a.

[0179] On this basis, the embodiment of the present application controls the thickness of the second packaging part 41b to be smaller than that of the first packaging part 41a, and makes the etching selectivity ratio of the second packaging part 41b to the first packaging part 41a not less than 1, thereby reducing the etching time corresponding to the second packaging part 41b, so that the etching time corresponding to the second packaging part 41b is less than the etching time of the first packaging part 41a, thereby reducing the probability of damage to the first packaging part 41a due to excessive etching of the second packaging part 41b, and improving the packaging reliability of the first light-emitting unit 31a.

[0180] Similarly, in some embodiments, the etching selectivity ratio between the third encapsulation portion 41 c and the second encapsulation portion is SR2, and SR2 ≥ 1. This means that the etching rate of the third encapsulation portion 41 c is not less than the etching rate of the second encapsulation portion 41 b.

[0181] This design can reduce the etching time corresponding to the third packaging part 41c, so that the etching time corresponding to the third packaging part 41c is less than the etching time of the second packaging part 41b, thereby reducing the probability of damage to the second packaging part 41b due to excessive etching of the third packaging part 41c, and improving the packaging reliability of the second light-emitting unit 31b.

[0182] In some implementations, the first encapsulation portion 41 a and the second encapsulation portion 41 b are made of the same material, and SR=1.

[0183] This design does not require using different materials to form the first encapsulation portion 41 a and the second encapsulation portion 41 b , thereby reducing the material costs of the first encapsulation portion 41 a and the second encapsulation portion 41 b and reducing the manufacturing cost of the display panel.

[0184] In some embodiments, SR1>1, the first encapsulation portion 41a comprises silicon oxide, and the second encapsulation portion 41b comprises silicon oxynitride. Under the same conditions, the etching rate of silicon oxynitride is generally greater than that of silicon oxide. Furthermore, the thickness of the second encapsulation portion 41b is also less than that of the first encapsulation portion 41a. Therefore, the etching time corresponding to the second encapsulation portion 41b can be less than that of the first encapsulation portion 41a, thereby improving the reliability of display panel manufacturing.

[0185] In some embodiments, SR2>1, the second encapsulation portion 41b comprises silicon oxynitride, and the third encapsulation portion 41c comprises silicon nitride. Under the same conditions, the etching rate of silicon nitride is generally greater than that of silicon oxynitride. Furthermore, the thickness of the third encapsulation portion 41c is also less than that of the second encapsulation portion 41b. Therefore, the etching time corresponding to the third encapsulation portion 41c is ensured to be less than that of the second encapsulation portion 41b, thereby improving the reliability of display panel manufacturing.

[0186] In some embodiments, referring to Figures 1 to 3 , the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 sequentially disposed in a direction away from the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. The plurality of light-emitting units 31 include a first light-emitting unit 31a and a second light-emitting unit 31b emitting light of different colors. The plurality of opening structures 21 include at least one first opening structure 211 and at least one second opening structure 212. The first light-emitting unit 31a is located within the first opening structure 211, and the second light-emitting unit 31b is located within the second opening structure 212.

[0187] The multiple encapsulation portions 41 include a first encapsulation portion 41a located on the side of the first light-emitting unit 31a facing away from the substrate 10, and a second encapsulation portion 41b located on the side of the second light-emitting unit 31b facing away from the substrate 10. The thickness of the first encapsulation portion 41a is greater than that of the second encapsulation portion 41b. That is, the first light-emitting unit 31a is generally prepared before the second light-emitting unit 31b.

[0188] Optionally, the thickness of the encapsulation portion 41 corresponding to the light-emitting unit 31 of at least one light-emitting color is greater than twice the thickness of the first isolation portion. For example, the thickness of the encapsulation portion 41 corresponding to the light-emitting unit 31 emitting blue light and the light-emitting unit 31 emitting green light is greater than twice the thickness of the first isolation portion.

[0189] In some embodiments, Figure 2 is a cross-sectional view of Figure 3b in the AA direction. As shown in Figures 2 and 3b, the contour lines of the positive projection of the first isolation portion 22 on the substrate 10 include a first contour line 221 corresponding to the first opening structure 211 and a second contour line 222 corresponding to the second opening structure 212; the contour lines of the positive projection of the second isolation portion 23 on the substrate 10 include a third contour line 231 corresponding to the first opening structure 211 and a fourth contour line 232 corresponding to the second opening structure 212; the distance between the corresponding first contour line 221 and the third contour line 231 is L1, and the distance between the corresponding second contour line 222 and the fourth contour line 232 is L2, and L1<L2.

[0190] The second isolation portion 23 extends from the first isolation portion 22 to the first opening structure 211 by a length L5 , and extends from the first isolation portion 22 to the second opening structure 212 by a length L6 , where L5 < L6 .

[0191] It should be noted that both the first isolation structure 20a and the second isolation structure 20b include a first isolation portion 22 and a second isolation portion 23, and the first isolation structure 20a and the second isolation structure 20b can be interconnected. Specifically, as shown in Figures 2 and 3, a portion of the first isolation structure 20a and a portion of the second isolation structure 20b can be located between the first light-emitting unit 31a and the second light-emitting unit 31b, and the two can be interconnected.

[0192] Because the first light-emitting unit 31a is typically fabricated before the second light-emitting unit 31b, during the etching process corresponding to the first light-emitting unit 31a, the first light-emitting unit 31a will be present within the opening structure 21 enclosed by the first isolation structure 20a, while the light-emitting unit 31 will not be present within the opening structure 21 enclosed by the second isolation structure 20b and other portions of the isolation structure 20a. Furthermore, during the etching process, the first isolation portion 22 in the second isolation structure 20b will be affected by the etching process and will undergo side etching, while the first isolation portion 22 in the first isolation structure 20a will not undergo side etching or will only undergo a minor degree of side etching, thereby causing L1 corresponding to the first isolation structure 20a to be smaller than L2 corresponding to the second isolation structure 20b.

[0193] In some embodiments, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 sequentially arranged in a direction away from the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. The plurality of light-emitting units 31 include a first light-emitting unit 31a and a second light-emitting unit 31b of different colors. The isolation structure 20 includes a first isolation structure 20a and a second isolation structure 20b. The first light-emitting unit 31a is located within the opening structure 21 enclosed by the first isolation structure 20a, and the second light-emitting unit 31b is located within the opening structure 21 enclosed by the second isolation structure 20b. The first isolation structure 20a and the second isolation structure 20b are different structures at different positions of the isolation structure 20, respectively. The first isolation structure 20a can be connected to the second isolation structure 20b, or the first isolation structure 20a can be spaced apart from the second isolation structure 20b.

[0194] The multiple encapsulation portions 41 include a first encapsulation portion 41a located on the side of the first light-emitting unit 31a facing away from the substrate 10, and a second encapsulation portion 41b located on the side of the second light-emitting unit 31b facing away from the substrate 10. The thickness of the first encapsulation portion 41a is greater than that of the second encapsulation portion 41b. That is, the first light-emitting unit 31a is generally prepared before the second light-emitting unit 31b.

[0195] As shown in Figures 2 and 3b, the display panel further includes a pixel definition layer 90. The pixel definition layer 90 includes a plurality of pixel openings and a pixel defining portion 91 between adjacent pixel openings. The plurality of pixel openings include a first pixel opening and a second pixel opening. The first light-emitting unit 31a is located within the first pixel opening, and the second light-emitting unit 31b is located within the second pixel opening. The first pixel opening is connected to the first opening structure 211, and the second pixel opening is connected to the second opening structure 212. The contour lines of the orthographic projection of the first isolation portion 22 on the substrate 10 include a first contour line 221 corresponding to the first opening structure 211 and a second contour line 222 corresponding to the second opening structure 212. The contour lines of the orthographic projection of the pixel defining portion 91 on the substrate 10 include a fifth contour line 92 corresponding to the first pixel opening and a sixth contour line 93 corresponding to the second pixel opening. The distance between the corresponding first contour line 221 and the fifth contour line 92 is L3, and the distance between the corresponding second contour line 222 and the sixth contour line 93 is L4, where L3 is less than L4.

[0196] In some embodiments, referring to FIG. 4 , the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 sequentially arranged in a direction away from the substrate 10 , and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10 .

[0197] The packaging portion 41 includes a first sub-portion 413 disposed in contact with the first isolation portion 22 , a second sub-portion 414 connected to the side of the first sub-portion 413 facing away from the substrate 10 , and a third sub-portion 415 connected to the side of the first sub-portion 413 facing the substrate 10 .

[0198] During the preparation of the encapsulation portion 41, the corresponding encapsulation material can extend along the sidewalls of the isolation structure 20, so that the formed encapsulation portion 41 includes a first sub-portion 413, a second sub-portion 414, and a third sub-portion 415. The first sub-portion 413 is disposed in contact with the sidewall of the first isolation portion 22, and the second sub-portion 414 can be partially disposed in contact with the sidewall of the second isolation portion 23 and partially extend to the side of the second isolation portion 23 facing away from the substrate 10. That is, the second sub-portion 414 can include the second portion 412. The third sub-portion 415 is disposed to cover the light-emitting unit 31.

[0199] As can be seen from the foregoing, the thicknesses of different packaging portions 41 in the embodiments of the present application may be different, and on this basis, different morphologies corresponding to different packaging portions 41 may be different. Further optionally, in at least part of the packaging portion 41, the second sub-portion 414 is connected to the third sub-portion 415, that is, the first sub-portion 413, the second sub-portion 414 and the third sub-portion 415 can together form a closed space, and specifically refer to the morphology of the packaging portion 41 arranged above the first light-emitting unit 31a in Figure 4. In at least part of the packaging portion 41, the second sub-portion 414 and the third sub-portion 415 are spaced apart, that is, the first sub-portion 413, the second sub-portion 414 and the third sub-portion 415 can together form a space with an opening, and specifically refer to the morphology of the packaging portion 41 arranged above the second light-emitting unit 31b in Figure 4.

[0200] In some optional embodiments, the plurality of encapsulation sections 41 include a first encapsulation section 41a and a second encapsulation section 41b. The thickness of the first encapsulation section 41a is greater than the thickness of the second encapsulation section 41b. Furthermore, the thicker the encapsulation section 41, the easier it is for the second subsection 414 within it to connect to the third subsection 415. Therefore, in the first encapsulation section 41a, the second subsection 414 is connected to the third subsection 415, and in the second encapsulation section 41b, the second subsection 414 and the third subsection 415 are spaced apart.

[0201] In some embodiments, referring to FIG. 5 , the display panel further includes a first electrode layer 50 disposed between the light-emitting functional layer 30 and the first encapsulation layer 40 . The first electrode layer 50 includes a plurality of first electrodes 51 disposed corresponding to the plurality of light-emitting units 31 .

[0202] The first electrode layer 50 is located on the side of the light-emitting functional layer 30 facing away from the substrate 10. The first electrode layer 50 includes a plurality of first electrodes 51. The plurality of first electrodes 51 are arranged corresponding to the plurality of light-emitting units 31. The first electrodes 51 are used to drive the light-emitting units 31 to achieve light-emitting display. Exemplarily, the first electrode 51 is a cathode.

[0203] Optionally, the display panel further includes a second electrode layer 60, which is located on the side of the light-emitting functional layer 30 facing the substrate 10. The second electrode layer 60 includes a plurality of second electrodes 61 arranged corresponding to the light-emitting units 31. For example, the second electrodes 61 are anodes, and the first electrodes 51 and the second electrodes 61 jointly drive the light-emitting units 31 to achieve light-emitting display.

[0204] Due to the existence of the isolation structure 20 , the first electrode layer 50 includes a plurality of first electrodes 51 located in different opening structures 21 .

[0205] In some embodiments, at least some of the light emitting units 31 of different colors have different thicknesses of the first electrodes 51. In Figure 5, the thickness of the first electrode 51 corresponding to the first light emitting unit 31a is greater than the thickness of the first electrode 51 corresponding to the second light emitting unit 31b.

[0206] The first electrode 51 is located between the light-emitting unit 31 and the packaging portion 41. If the packaging portion 41 is over-etched, the first electrode 51 may be exposed, which may cause the first electrode 51 to be damaged by etching. On this basis, the embodiment of the present application can make the thickness of the first electrode 51 corresponding to the light-emitting unit 31 formed earlier larger according to the preparation order of the light-emitting units 31 of different colors, so that the first electrode 51 can have a certain risk resistance, thereby reducing the probability that the first electrode 51 corresponding to the previously formed light-emitting unit 31 will be excessively damaged and unable to work normally due to the etching process of the packaging portion 41 corresponding to the subsequent light-emitting unit 31. In this way, the reliability of each first electrode 51 corresponding to the different light-emitting units 31 is improved, ensuring that the display panel can be used normally.

[0207] In some embodiments, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23, which are sequentially arranged in a direction away from the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. The first isolation portion 22 includes a conductive material, and the first electrode 51 is overlapped with the first isolation portion 22.

[0208] Due to the presence of the isolation structure 20, the first electrodes 51 corresponding to different light-emitting units 31 are spaced apart from each other. On this basis, to enable at least a portion of the first electrodes 51 to receive corresponding potential signals, the embodiment of the present application includes a conductive structure in the first isolation portion 22, with the first electrodes 51 overlapping the first isolation portion 22. This design allows at least a portion of the first electrodes 51 to be electrically connected to the first isolation portion 22, thereby transmitting a specific potential signal to the first electrodes 51 through the first isolation portion 22, thereby achieving drive control of at least a portion of the first electrodes 51.

[0209] In some embodiments, as shown in FIG5 , the plurality of encapsulation portions 41 include a first encapsulation portion 41a and a second encapsulation portion 41b, wherein the thickness of the first encapsulation portion 41a is greater than the thickness of the second encapsulation portion 41b. The plurality of first electrodes 51 include a first type of electrode 51a and a second type of electrode 51b. The first type of electrode 51a is located on the side of the first encapsulation portion 41a facing the substrate 10, and the second type of electrode 51b is located on the side of the second encapsulation portion 41b facing the substrate 10. The thickness of the first type of electrode 51a is greater than the thickness of the second type of electrode 51b.

[0210] In the embodiment of the present application, in addition to different thicknesses of the packaging portions 41, different first electrodes 51 may also have different thicknesses. Specifically, the thicker first-type electrodes 51a can be covered by the thicker first packaging portion 41a, thereby reducing the risk of damage to the first-type electrodes 51a and improving overall reliability.

[0211] In some embodiments, the plurality of light-emitting units 31 include a first light-emitting unit 31a and a second light-emitting unit 31b, each emitting light of different colors. The thickness of the first light-emitting unit 31a is less than that of the second light-emitting unit 31b. The plurality of encapsulation portions 41 include a first encapsulation portion 41a located on a side of the first light-emitting unit 31a facing away from the substrate 10, and a second encapsulation portion 41b located on a side of the second light-emitting unit 31b facing away from the substrate 10. The thickness of the first encapsulation portion 41a is greater than that of the second encapsulation portion 41b.

[0212] In the embodiment of the present application, in addition to different thicknesses of the packaging portions 41, different thicknesses of the light-emitting units 31 can also be varied. Specifically, the first light-emitting unit 31a with a smaller thickness can be covered by the first packaging portion 41a with a larger thickness, thereby reducing the risk of damage to the first light-emitting unit 31a and improving overall reliability.

[0213] Further optionally, the first light-emitting unit 31a and the second light-emitting unit 31b both include a hole transport layer, an electron transport layer, and a light-emitting material located between the hole transport layer and the electron transport layer, and the thickness of the light-emitting material in the first light-emitting unit 31a is less than the thickness of the light-emitting material in the second light-emitting unit 31b.

[0214] In some embodiments, referring to FIG. 6 , the display panel further includes a second encapsulation layer 70 disposed on the side of the first encapsulation layer 40 facing away from the substrate 10 , the second encapsulation layer 70 covering the plurality of encapsulation portions 41 , and the second encapsulation layer 70 including a first surface facing away from the substrate 10 , the first surface being parallel to the plane of the substrate 10 .

[0215] The first encapsulation layer 40 and the second encapsulation layer 70 are used together to achieve the encapsulation effect of the display panel. The second encapsulation layer 70 is located on the side of the first encapsulation layer 40 facing away from the substrate 10. As can be seen from the foregoing, the thickness of the encapsulation portion 41 corresponding to at least some light-emitting units 31 of different colors is different. Therefore, the side of the first encapsulation layer 40 facing away from the substrate 10 is not a flat surface, which can easily have an adverse effect on the film layer above.

[0216] In view of this, during the preparation process of the embodiment of the present application, the size and shape of the second encapsulation layer 70 are controlled so that the second encapsulation layer 70 is a whole-surface structure, and the surface of the second encapsulation layer 70 facing away from the substrate 10 can be parallel to the plane where the substrate 10 is located, thereby reducing the impact on the subsequent film layer preparation.

[0217] Further optionally, the second encapsulation layer 70 may include an organic material. Organic materials generally have strong leveling properties, so when forming the second encapsulation layer 70 , it helps to achieve a smooth surface on the side of the second encapsulation layer 70 facing away from the substrate 10 .

[0218] As shown in FIG6 , because the second encapsulation layer 70 has strong leveling properties, the side of the second encapsulation layer 70 facing away from the substrate 10 is flat. Therefore, if the thickness of the first encapsulation portion 41 a is greater than the thickness of the second encapsulation portion 41 b, the thickness of the second encapsulation layer 70 above the first encapsulation portion 41 a is correspondingly less than the thickness of the second encapsulation layer 70 above the second encapsulation portion 41 b.

[0219] In some embodiments, referring to FIG. 7 , the display panel further includes a third encapsulation layer 80 disposed on a side of the second encapsulation layer 70 facing away from the substrate 10 . The third encapsulation layer 80 covers the plurality of encapsulation portions 41 .

[0220] Similar to the second encapsulation layer 70, the third encapsulation layer 80 is also a full-surface structure and can cover multiple encapsulation portions 41. The first encapsulation layer 40, the second encapsulation layer 70, and the third encapsulation layer 80 can together form a thin film encapsulation structure to improve the encapsulation effect of the display panel.

[0221] Optionally, the first encapsulation layer 40 and the third encapsulation layer 80 include inorganic materials.

[0222] In some embodiments, the thickness of the packaging portion 41 corresponding to the light emitting units 31 with different luminous colors is different.

[0223] In the embodiment of the present application, the thickness of the corresponding encapsulation portion 41 can be set to decrease sequentially according to the preparation order of the light-emitting units 31 of different luminescent colors, thereby helping to ensure the reliability of the encapsulation portion 41 corresponding to each light-emitting unit 31 and the reliability of the light-emitting unit 31. Optionally, the thickness of the encapsulation portion 41 corresponding to the light-emitting units 31 of the same luminescent color is the same.

[0224] In some optional embodiments, the thicknesses of the packaging parts 41 corresponding to at least two adjacent light-emitting units 31 are different.

[0225] In a second aspect, embodiments of the present application provide a display panel comprising a substrate 10, an isolation structure 20, a light-emitting functional layer 30, and a first encapsulation layer 40. The isolation structure 20 is disposed on one side of the substrate 10 and encloses a plurality of opening structures 21. The light-emitting functional layer 30 is disposed on one side of the substrate 10 and includes a plurality of light-emitting units 31 disposed within the plurality of opening structures 21. The first encapsulation layer 40 is disposed on a side of the light-emitting functional layer 30 facing away from the substrate 10 and includes a plurality of encapsulation portions 41 disposed corresponding to the light-emitting units 31.

[0226] The display panel further includes a second encapsulation layer 70 disposed on a side of the first encapsulation layer 40 facing away from the substrate 10 . The second encapsulation layer 70 covers the plurality of encapsulation portions 41 . The second encapsulation layer 70 includes a first surface facing away from the substrate 10 , and the first surface is parallel to the plane of the substrate 10 .

[0227] The substrate 10 serves as a support and bearing structure, and other film layers are sequentially stacked on the substrate 10. The stacking mentioned here refers to the sequential arrangement of the other film layers along the thickness direction X of the substrate 10. The substrate 10 may include a variety of film layer structures, and the specific film layer structure of the substrate 10 is not limited in this embodiment.

[0228] The isolation structure 20 may be located on the pixel definition layer, or the isolation structure 20 may be located on the planarization layer. The location of the isolation structure 20 is not specifically limited herein.

[0229] The isolation structure 20 and the light-emitting functional layer 30 are located on the same side of the substrate 10. The isolation structure 20 encloses a plurality of opening structures 21. The present embodiment does not limit the size and shape of the isolation structure 20. For example, referring to Figures 1 to 3, the orthographic projection of the isolation structure 20 on the substrate 10 is a mesh-like structure.

[0230] The light-emitting functional layer 30 includes a plurality of light-emitting units 31. The light-emitting unit 31 is a structure for realizing a light-emitting function, which can emit light of a specific color under circuit control. The plurality of light-emitting units 31 are arranged in the plurality of opening structures 21. The plurality of light-emitting units 31 include but are not limited to a red light-emitting unit 31 for emitting red light, a green light-emitting unit 31 for emitting green light, and a blue light-emitting unit 31 for emitting blue light. Each light-emitting unit 31 may include a stacked hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer, a luminescent material layer, an electron transport layer (ETL), a hole blocking layer, and an electron injection layer (EIL).

[0231] The plurality of opening structures 21 enclosed by the isolation structure 20 may correspond one to one with the light-emitting units 31, with one light-emitting unit 31 disposed within one opening structure 21. Alternatively, multiple light-emitting units 31 may be disposed within one opening structure 21, for example, multiple light-emitting units 31 of the same color may be disposed within one opening structure 21.

[0232] The first encapsulation layer 40 is located on the side of the light-emitting functional layer 30 away from the substrate 10. The first encapsulation layer 40 can be used to protect the light-emitting unit 31 to reduce the probability of water and oxygen invading the light-emitting unit 31, thereby improving the reliability of the light-emitting unit 31.

[0233] The first encapsulation layer 40 includes a plurality of encapsulation portions 41. The encapsulation portion 41 is a structure of the first encapsulation layer 40 that protects a single light-emitting unit 31. In FIG1 , the encapsulation portion 41 is schematically illustrated as a box. Each encapsulation portion 41 is provided corresponding to each light-emitting unit 31 to achieve encapsulation of the light-emitting unit 31. In some embodiments, a plurality of light-emitting units 31 are provided in a one-to-one correspondence with a plurality of encapsulation portions 41, thereby achieving independent encapsulation of the light-emitting units 31. Alternatively, one encapsulation portion 41 is provided corresponding to a plurality of light-emitting units 31, and a plurality of light-emitting units 31 are encapsulated by a single encapsulation portion 41. For example, a plurality of light-emitting units 31 of the same color are encapsulated by a single encapsulation portion 41.

[0234] The first encapsulation layer 40 and the second encapsulation layer 70 are used together to achieve the encapsulation effect of the display panel. The second encapsulation layer 70 is located on the side of the first encapsulation layer 40 facing away from the substrate 10. As can be seen from the foregoing, the thickness of the encapsulation portion 41 corresponding to at least some light-emitting units 31 of different colors is different. Therefore, the side of the first encapsulation layer 40 facing away from the substrate 10 is not a flat surface, which can easily have an adverse effect on the film layer above.

[0235] In view of this, during the preparation process of the embodiment of the present application, the size and shape of the second encapsulation layer 70 are controlled so that the second encapsulation layer 70 is a whole-surface structure, and the surface of the second encapsulation layer 70 facing away from the substrate 10 can be parallel to the plane where the substrate 10 is located, thereby reducing the impact on the subsequent film layer preparation.

[0236] Further optionally, the second encapsulation layer 70 may include an organic material. Organic materials generally have strong leveling properties, so when forming the second encapsulation layer 70 , it helps to achieve a smooth surface on the side of the second encapsulation layer 70 facing away from the substrate 10 .

[0237] In a third aspect, embodiments of the present application provide a display panel comprising a substrate, an isolation structure, a light-emitting functional layer, and a first encapsulation layer. The isolation structure is disposed on one side of the substrate, and the isolation structure encloses an opening structure. The light-emitting functional layer is disposed on one side of the substrate, and the light-emitting functional layer includes a plurality of light-emitting units disposed within the opening structure. The first encapsulation layer is disposed on a side of the light-emitting functional layer facing away from the substrate, and the first encapsulation layer includes a plurality of encapsulation portions disposed corresponding to the light-emitting units. The encapsulation portions corresponding to at least some light-emitting units emitting different colors are made of different materials.

[0238] In some embodiments, the etching rates of the encapsulation portions corresponding to at least some light-emitting units of different colors are different. Specifically, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit of different colors, and the plurality of encapsulation portions include: a first encapsulation portion located on a side of the first light-emitting unit facing away from the substrate, a second encapsulation portion located on a side of the second light-emitting unit facing away from the substrate, and a third encapsulation portion located on a side of the third light-emitting unit facing away from the substrate, and at least two of the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion have different etching rates.

[0239] For example, the first light-emitting unit is configured to emit red light, the second light-emitting unit is configured to emit green light, and the third light-emitting unit is configured to emit blue light. The etching rates of the first packaging portion, the second packaging portion, and the third packaging portion increase sequentially. In an embodiment of the present application, the materials of the packaging portions corresponding to at least some of the light-emitting units of different colors can be set differently based on the preparation order of the light-emitting units within the display panel, so that the etching time of the packaging portion corresponding to the light-emitting unit prepared later is shorter than the etching time of the packaging portion corresponding to the light-emitting unit prepared earlier. This reduces the risk of damage to the packaging portion corresponding to the light-emitting unit formed earlier due to etching of the subsequent light-emitting units and the corresponding packaging materials, which may cause failure of some of the light-emitting units, thereby improving the reliability of the display panel.

[0240] It should be noted that, in the embodiment of the present application, the thicknesses of different packaging parts may be the same or different, and the embodiment of the present application does not limit this.

[0241] In some embodiments, the plurality of light-emitting units 31 include a first light-emitting unit 31a and a second light-emitting unit 31b having different luminous colors, and the plurality of packaging parts 41 include a first packaging part 41a located on the side of the first light-emitting unit 31a away from the substrate 10, and a second packaging part 41b located on the side of the second light-emitting unit 31b away from the substrate 10, and the etching selectivity ratio of the second packaging part 41b to the first packaging part 41a is SR1, and SR1≥1.

[0242] The “etching selectivity” mentioned in the embodiments of the present application refers to the relative etching rate of one material compared to another material under the same etching conditions. The etching selectivity is usually related to the properties of the material.

[0243] SR1≥1 indicates that the etching rate of the second packaging portion 41b is not less than the etching rate of the first packaging portion 41a. Furthermore, since the thickness of the first packaging portion 41a is greater than that of the second packaging portion 41b, the etching time corresponding to the second packaging portion 41b is less than the etching time of the first packaging portion 41a.

[0244] As can be seen from the above, the second light-emitting unit 31b is manufactured after the first light-emitting unit 31a, so the second packaging portion 41b corresponding to the second light-emitting unit 31b is also manufactured after the first light-emitting unit 31a.

[0245] On this basis, the embodiment of the present application controls the thickness of the second packaging part 41b to be smaller than that of the first packaging part 41a, and makes the etching selectivity ratio of the second packaging part 41b to the first packaging part 41a not less than 1, thereby reducing the etching time corresponding to the second packaging part 41b, so that the etching time corresponding to the second packaging part 41b is less than the etching time of the first packaging part 41a, thereby reducing the probability of damage to the first packaging part 41a due to excessive etching of the second packaging part 41b, and improving the packaging reliability of the first light-emitting unit 31a.

[0246] Similarly, in some embodiments, the etching selectivity ratio between the third encapsulation portion 41 c and the second encapsulation portion is SR2, and SR2 ≥ 1. This means that the etching rate of the third encapsulation portion 41 c is not less than the etching rate of the second encapsulation portion 41 b.

[0247] This design can reduce the etching time corresponding to the third packaging part 41c, so that the etching time corresponding to the third packaging part 41c is less than the etching time of the second packaging part 41b, thereby reducing the probability of damage to the second packaging part 41b due to excessive etching of the third packaging part 41c, and improving the packaging reliability of the second light-emitting unit 31b.

[0248] In some implementations, the first encapsulation portion 41 a and the second encapsulation portion 41 b are made of the same material, and SR=1.

[0249] This design does not require using different materials to form the first encapsulation portion 41 a and the second encapsulation portion 41 b , thereby reducing the material costs of the first encapsulation portion 41 a and the second encapsulation portion 41 b and reducing the manufacturing cost of the display panel.

[0250] In some embodiments, SR1>1, the first encapsulation portion 41a comprises silicon oxide, and the second encapsulation portion 41b comprises silicon oxynitride. Under the same conditions, the etching rate of silicon oxynitride is generally greater than that of silicon oxide. Furthermore, the thickness of the second encapsulation portion 41b is also less than that of the first encapsulation portion 41a. Therefore, the etching time corresponding to the second encapsulation portion 41b can be less than that of the first encapsulation portion 41a, thereby improving the reliability of display panel manufacturing.

[0251] In some embodiments, SR2>1, the second encapsulation portion 41b comprises silicon oxynitride, and the third encapsulation portion 41c comprises silicon nitride. Under the same conditions, the etching rate of silicon nitride is generally greater than that of silicon oxynitride. Furthermore, the thickness of the third encapsulation portion 41c is also less than that of the second encapsulation portion 41b. Therefore, the etching time corresponding to the third encapsulation portion 41c is ensured to be less than that of the second encapsulation portion 41b, thereby improving the reliability of display panel manufacturing.

[0252] In some optional embodiments, the thicknesses of the packaging parts 41 corresponding to at least two adjacent light-emitting units 31 are different.

[0253] In a fourth aspect, as shown in FIG4 , an embodiment of the present application provides a display panel, which includes a substrate 10, an isolation structure 20, a light-emitting functional layer 30, and a first encapsulation layer 40. The isolation structure 20 is arranged on one side of the substrate 10, and the isolation structure 20 encloses a plurality of opening structures 21. The light-emitting functional layer 30 is arranged on one side of the substrate 10, and the light-emitting functional layer 30 includes a plurality of light-emitting units 31 arranged in the plurality of opening structures 21. The first encapsulation layer 40 is arranged on the side of the light-emitting functional layer 30 away from the substrate 10, and the first encapsulation layer 40 includes a plurality of encapsulation portions 41 provided corresponding to the plurality of light-emitting units 31. Among them, the encapsulation portion 41 includes a second portion 412 located on the side of the isolation structure 20 away from the substrate 10, and the thickness of the second portion 412 corresponding to different encapsulation portions 41 is different.

[0254] In the embodiment of the present application, the thickness of the packaging portion 41 corresponding to at least some of the light-emitting units 31 of different colors can be set differently based on the order in which the light-emitting units 31 are prepared within the display panel, so that the thickness of the second portion 412 corresponding to different packaging portions 41 is different. Specifically, the second portion 412 of the packaging portion 41 corresponding to the previously prepared light-emitting units 31 is thicker. This reduces the risk of damage to the packaging portion 41 corresponding to the previously prepared light-emitting units 31 due to subsequent etching of the light-emitting units 31 and the corresponding packaging materials, which could cause some of the light-emitting units 31 to fail, thereby improving the reliability of the display panel.

[0255] In some embodiments, the second portion 412 includes a first surface M1 facing away from the substrate 10 , and the first surfaces M1 corresponding to different packaging parts 41 are located on different planes.

[0256] The first surface M1 is the surface of the second portion 412 facing away from the substrate 10. As can be seen from the foregoing, the second portions 412 corresponding to different encapsulation portions 41 have different thicknesses, thereby improving the reliability of the display panel. Furthermore, the first surfaces M1 corresponding to different encapsulation portions 41 are located on different planes, i.e., the different first surfaces M1 are spaced apart in the thickness direction X.

[0257] Further optionally, as shown in FIG. 4 , the plurality of packaging parts 41 include a first packaging part 41 a and a second packaging part 41 b adjacent to each other, and a first surface M1 corresponding to the first packaging part 41 a and a first surface M1 corresponding to the second packaging part 41 b have a height difference H1 in the thickness direction X of the substrate 10 .

[0258] In some optional embodiments, the plurality of encapsulation portions 41 include a third encapsulation portion disposed adjacent to the second encapsulation portion 41 b and located on a side of the second encapsulation portion 41 b away from the first encapsulation portion 41 a. A first surface M1 corresponding to the third encapsulation portion and a first surface M1 corresponding to the second encapsulation portion 41 b have a height difference H2 in the thickness direction X of the substrate 10, where H1≠H2.

[0259] In a sixth aspect, as shown in Figures 1 and 2, an embodiment of the present application provides a display panel, which includes a substrate 10, an isolation structure 20, a light-emitting functional layer 30, and a first encapsulation layer 40. The isolation structure 20 is disposed on one side of the substrate 10, and the isolation structure 20 encloses a plurality of opening structures 21. The light-emitting functional layer 30 is disposed on one side of the substrate 10, and the light-emitting functional layer 30 includes a plurality of light-emitting units 31 disposed within the plurality of opening structures 21. The first encapsulation layer 40 is disposed on a side of the light-emitting functional layer 30 facing away from the substrate 10, and the first encapsulation layer 40 includes a plurality of encapsulation portions 41 disposed corresponding to the plurality of light-emitting units 31.

[0260] The isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23, which are sequentially arranged in a direction away from the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. The plurality of light-emitting units 31 include a first light-emitting unit 31a and a second light-emitting unit 31b of different colors. The isolation structure 20 includes a first isolation structure 20a and a second isolation structure 20b. The first light-emitting unit 31a is located within the opening structure 21 enclosed by the first isolation structure 20a, and the second light-emitting unit 31b is located within the opening structure 21 enclosed by the second isolation structure 20b. The first isolation structure 20a and the second isolation structure 20b are respectively partial structures at different positions of the isolation structure 20. The first isolation structure 20a can be connected to the second isolation structure 20b, or the first isolation structure 20a can be spaced apart from the second isolation structure 20b.

[0261] The multiple encapsulation portions 41 include a first encapsulation portion 41a located on the side of the first light-emitting unit 31a facing away from the substrate 10, and a second encapsulation portion 41b located on the side of the second light-emitting unit 31b facing away from the substrate 10. The thickness of the first encapsulation portion 41a is greater than that of the second encapsulation portion 41b. That is, the first light-emitting unit 31a is generally prepared before the second light-emitting unit 31b.

[0262] Furthermore, in the first isolation structure 20a, the distance between the orthographic outer contour of the first isolation portion 22 on the substrate 10 and the orthographic outer wheel of the second isolation portion 23 on the substrate 10 is L1, and in the second isolation structure 20b, the distance between the orthographic outer contour of the first isolation portion 22 on the substrate 10 and the orthographic outer wheel of the second isolation portion 23 on the substrate 10 is L2, and L1<L2.

[0263] Because the first light-emitting unit 31a is typically fabricated before the second light-emitting unit 31b, during the etching process corresponding to the first light-emitting unit 31a, the first light-emitting unit 31a will be present within the opening structure 21 enclosed by the first isolation structure 20a, while the light-emitting unit 31 will not be present within the opening structure 21 enclosed by the second isolation structure 20b and other portions of the isolation structure 20a. Furthermore, during the etching process, the first isolation portion 22 in the second isolation structure 20b will be affected by the etching process and will undergo side etching, while the first isolation portion 22 in the first isolation structure 20a will not undergo side etching or will only undergo a minor degree of side etching, thereby causing L1 corresponding to the first isolation structure 20a to be smaller than L2 corresponding to the second isolation structure 20b.

[0264] In some embodiments, the display panel further includes a pixel definition layer 90, which includes a first pixel defining portion and a second pixel defining portion. The pixel opening formed by the first pixel defining portion is connected to the first isolation structure 20a, and the pixel opening formed by the second pixel defining portion is connected to the second isolation structure 20b. The first light-emitting unit 31a is located within the pixel opening formed by the first pixel defining portion, and the second light-emitting unit 31b is located within the pixel opening formed by the second pixel defining portion. The first pixel defining portion and the second pixel defining portion are different structures at different locations on the pixel definition layer 90, respectively. The first pixel defining portion can be connected to the second pixel defining portion, or the first pixel defining portion can be spaced apart from the second pixel defining portion.

[0265] Furthermore, the distance between the orthographic outer contour of the first isolation portion 22 in the first isolation structure 20a on the substrate 10 and the orthographic outer wheel of the first pixel defining portion on the substrate 10 is L3, and the distance between the orthographic outer contour of the first isolation portion 22 in the second isolation structure 20b on the substrate 10 and the orthographic outer wheel of the second pixel defining portion on the substrate 10 is L4, and L3<L4.

[0266] Because the first light-emitting unit 31a is typically fabricated before the second light-emitting unit 31b, during the etching process corresponding to the first light-emitting unit 31a, the first light-emitting unit 31a will be present within the opening structure 21 enclosed by the first isolation structure 20a, while the light-emitting unit 31 will not be present within the opening structure 21 enclosed by the second isolation structure 20b and other portions of the isolation structure 20a. Furthermore, during the etching process, the first isolation portion 22 in the second isolation structure 20b will be affected by the etching process and will undergo side etching, while the first isolation portion 22 in the first isolation structure 20a will not undergo side etching or will only undergo a minor degree of side etching, thereby causing L3 corresponding to the first isolation structure 20a to be smaller than L4 corresponding to the second isolation structure 20b.

[0267] In some embodiments, the packaging portion 41 includes a first portion 411 , the orthographic projection of the first portion 411 on the substrate 10 is located outside the orthographic projection of the second isolation portion 23 on the substrate 10 , and the thickness of the first portion 411 corresponding to the first packaging portion 41a and the second packaging portion 41b is different.

[0268] The packaging portion 41 includes a first portion 411 and a second portion 412. The first portion 411 corresponds to the opening structure 21. That is, the orthographic projection of the first portion 411 on the substrate 10 is located outside the orthographic projection of the isolation structure 20 on the substrate 10, while the orthographic projection of the second portion 412 on the substrate 10 is located within the orthographic projection of the isolation structure 20 on the substrate 10. In FIG. 2 , the boundary between the first portion 411 and the second portion 412 is indicated by a straight line.

[0269] Normally, the first portion 411 plays a major role in encapsulating the light-emitting unit 31. If the first portion 411 is damaged due to the etching process, it is easy to cause the corresponding light-emitting unit 31 to fail abnormally. In view of this, the embodiment of the present application sets the thickness of the first portion 411 corresponding to at least some of the light-emitting units 31 of different colors to be different, ensuring that the thickness of the first portion 411 in the encapsulation portion 41 corresponding to at least some of the light-emitting units 31 prepared first is as large as possible, thereby reducing the probability of the subsequent etching process completely damaging the previously formed first portion 411, thereby ensuring that each light-emitting unit 31 can emit light reliably and improving the light-emitting reliability of the display panel. Optionally, the orthographic projection of the first portion 411 on the substrate 10 is located outside the orthographic projection of the second isolation portion 23 on the substrate 10.

[0270] Because the orthographic projection of the first isolating portion 22 on the substrate 10 is located within the orthographic projection of the second isolating portion 23 on the substrate 10, that is, the second isolating portion 23 is at least partially positioned beyond the first isolating portion 22 in a direction parallel to the plane of the substrate 10. This design facilitates separation of the luminescent material within the opening structure 21 from the luminescent material on the side of the second isolating portion 23 facing away from the substrate 10 during the preparation of the light-emitting unit 31, thereby meeting the preparation requirements of the light-emitting unit 31. It should be noted that, in actual production, some of the luminescent material may contact the sidewalls of the first isolating portion 22, but this is not specifically limited here.

[0271] In some embodiments, each packaging portion 41 includes a second portion 412 located on a side of the isolation structure 20 facing away from the substrate 10 , and the thickness of the second portion 412 corresponding to the first packaging portion 41 a and the second packaging portion 41 b is different.

[0272] In the embodiment of the present application, the thickness of the packaging portion 41 corresponding to at least some of the light-emitting units 31 of different colors can be set differently based on the order in which the light-emitting units 31 are prepared within the display panel, so that the thickness of the second portion 412 corresponding to different packaging portions 41 is different. Specifically, the second portion 412 of the packaging portion 41 corresponding to the previously prepared light-emitting units 31 is thicker. This reduces the risk of damage to the packaging portion 41 corresponding to the previously prepared light-emitting units 31 due to subsequent etching of the light-emitting units 31 and the corresponding packaging materials, which could cause some of the light-emitting units 31 to fail, thereby improving the reliability of the display panel.

[0273] In some embodiments, an etching selectivity ratio of the second encapsulation portion 41 b to the first encapsulation portion 41 a is SR1, where SR1≧1.

[0274] The “etching selectivity” mentioned in the embodiments of the present application refers to the relative etching rate of one material compared to another material under the same etching conditions. The etching selectivity is usually related to the properties of the material.

[0275] SR1≥1 indicates that the etching rate of the second packaging portion 41b is not less than the etching rate of the first packaging portion 41a. Furthermore, since the thickness of the first packaging portion 41a is greater than that of the second packaging portion 41b, the etching time corresponding to the second packaging portion 41b is less than the etching time of the first packaging portion 41a.

[0276] As can be seen from the above, the second light-emitting unit 31b is manufactured after the first light-emitting unit 31a, so the second packaging portion 41b corresponding to the second light-emitting unit 31b is also manufactured after the first light-emitting unit 31a.

[0277] On this basis, the embodiment of the present application controls the thickness of the second packaging part 41b to be smaller than that of the first packaging part 41a, and makes the etching selectivity ratio of the second packaging part 41b to the first packaging part 41a not less than 1, thereby reducing the etching time corresponding to the second packaging part 41b, so that the etching time corresponding to the second packaging part 41b is less than the etching time of the first packaging part 41a, thereby reducing the probability of damage to the first packaging part 41a due to excessive etching of the second packaging part 41b, and improving the packaging reliability of the first light-emitting unit 31a.

[0278] Similarly, in some embodiments, the etching selectivity ratio between the third encapsulation portion 41 c and the second encapsulation portion is SR2, and SR2 ≥ 1. This means that the etching rate of the third encapsulation portion 41 c is not less than the etching rate of the second encapsulation portion 41 b.

[0279] This design can reduce the etching time corresponding to the third packaging part 41c, so that the etching time corresponding to the third packaging part 41c is less than the etching time of the second packaging part 41b, thereby reducing the probability of damage to the second packaging part 41b due to excessive etching of the third packaging part 41c, and improving the packaging reliability of the second light-emitting unit 31b.

[0280] In some implementations, the first encapsulation portion 41 a and the second encapsulation portion 41 b are made of the same material, and SR=1.

[0281] This design does not require using different materials to form the first encapsulation portion 41 a and the second encapsulation portion 41 b , thereby reducing the material costs of the first encapsulation portion 41 a and the second encapsulation portion 41 b and reducing the manufacturing cost of the display panel.

[0282] In some embodiments, SR1>1, the first encapsulation portion 41a comprises silicon oxide, and the second encapsulation portion 41b comprises silicon oxynitride. Under the same conditions, the etching rate of silicon oxynitride is generally greater than that of silicon oxide. Furthermore, the thickness of the second encapsulation portion 41b is also less than that of the first encapsulation portion 41a. Therefore, the etching time corresponding to the second encapsulation portion 41b can be less than that of the first encapsulation portion 41a, thereby improving the reliability of display panel manufacturing.

[0283] In some embodiments, SR2>1, the second encapsulation portion 41b comprises silicon oxynitride, and the third encapsulation portion 41c comprises silicon nitride. Under the same conditions, the etching rate of silicon nitride is generally greater than that of silicon oxynitride. Furthermore, the thickness of the third encapsulation portion 41c is also less than that of the second encapsulation portion 41b. Therefore, the etching time corresponding to the third encapsulation portion 41c is ensured to be less than that of the second encapsulation portion 41b, thereby improving the reliability of display panel manufacturing.

[0284] In a seventh aspect, as shown in FIG4 , an embodiment of the present application provides a display panel, comprising a substrate 10, an isolation structure 20, a light-emitting functional layer 30, and a first encapsulation layer 40. The isolation structure 20 is disposed on one side of the substrate 10, and the isolation structure 20 encloses a plurality of opening structures 21. The light-emitting functional layer 30 is disposed on one side of the substrate 10, and the light-emitting functional layer 30 includes a plurality of light-emitting units 31 disposed within the plurality of opening structures 21. The first encapsulation layer 40 is disposed on a side of the light-emitting functional layer 30 facing away from the substrate 10, and the first encapsulation layer 40 includes a plurality of encapsulation portions 41 disposed corresponding to the plurality of light-emitting units 31.

[0285] The packaging portion 41 includes a first sub-portion 413 disposed in contact with the first isolation portion 22 , a second sub-portion 414 connected to the side of the first sub-portion 413 facing away from the substrate 10 , and a third sub-portion 415 connected to the side of the first sub-portion 413 facing the substrate 10 .

[0286] During the preparation of the packaging part 41, the corresponding packaging material can extend along the side wall of the isolation structure 20, so that the formed packaging part 41 can include a first sub-part 413, a second sub-part 414 and a third sub-part 415, wherein the first sub-part 413 is adhered to the side wall of the first isolation part 22, the second sub-part 414 can be partially adhered to the side wall of the second isolation part 23 and partially extend to the side of the second isolation part 23 away from the substrate 10, and the third sub-part 415 is arranged to cover the light-emitting unit 31.

[0287] As can be seen from the foregoing, the thicknesses of different packaging portions 41 in the embodiments of the present application may be different, and on this basis, the morphologies corresponding to different packaging portions 41 may be different. Further optionally, in at least a portion of the packaging portion 41, the second sub-portion 414 is connected to the third sub-portion 415, that is, the first sub-portion 413, the second sub-portion 414, and the third sub-portion 415 can together form a closed space. And / or, in at least a portion of the packaging portion 41, the second sub-portion 414 and the third sub-portion 415 are spaced apart, that is, the first sub-portion 413, the second sub-portion 414, and the third sub-portion 415 can together form a space with an opening.

[0288] In some optional embodiments, the plurality of encapsulation sections 41 include a first encapsulation section 41a and a second encapsulation section 41b. The first encapsulation section 41a and the second encapsulation section 41b have different thicknesses. In the first encapsulation section 41a, the second subsection 414 is connected to the third subsection 415. In the second encapsulation section 41b, the second subsection 414 and the third subsection 415 are spaced apart.

[0289] In combination with the foregoing, it can be seen that due to the different thicknesses of the packaging parts 41, the morphologies corresponding to different packaging parts 41 are different. Furthermore, in the first packaging part 41a, the second sub-part 414 is connected to the third sub-part 415, that is, the first sub-part 413, the second sub-part 414 and the third sub-part 415 in the first packaging part 41a can together form a closed space. In the second packaging part 41b, the second sub-part 414 and the third sub-part 415 are spaced apart, that is, the first sub-part 413, the second sub-part 414 and the third sub-part 415 in the second packaging part 41b can together form a space with an opening. Further optionally, the thickness of the first packaging part 41a is greater than the thickness of the second packaging part 41b.

[0290] In an eighth aspect, an embodiment of the present application provides a display panel, comprising a substrate 10, an isolation structure 20, a light-emitting functional layer 30, and a first encapsulation layer 40. The isolation structure 20 is disposed on one side of the substrate 10, and the isolation structure 20 encloses a plurality of opening structures 21. The light-emitting functional layer 30 is disposed on one side of the substrate 10, and the light-emitting functional layer 30 includes a plurality of light-emitting units 31 disposed within the plurality of opening structures 21. The first encapsulation layer 40 is disposed on a side of the light-emitting functional layer 30 facing away from the substrate 10, and the first encapsulation layer 40 includes a plurality of encapsulation portions 41 disposed corresponding to the plurality of light-emitting units 31. The thickness of the encapsulation portions 41 corresponding to at least two adjacent light-emitting units 31 is different.

[0291] In the implementation of the present application, at least two light-emitting units 31 are prepared and formed separately in different processes. On this basis, the thickness of the packaging part 41 corresponding to at least two adjacent light-emitting units 31 is further set to be different, so that the thickness of the packaging part 41 corresponding to the previously prepared light-emitting unit 31 is larger, thereby reducing the risk of damage to the packaging part 41 corresponding to the previously formed light-emitting unit 31 due to subsequent etching treatment of the light-emitting unit 31 and the corresponding packaging material, causing some light-emitting units 31 to fail, thereby improving the reliability of the display panel.

[0292] In a ninth aspect, an embodiment of the present application provides a display panel, comprising a substrate 10, a light-emitting functional layer 30, and a first encapsulation layer 40. The light-emitting functional layer 30 is disposed on one side of the substrate 10, and the light-emitting functional layer 30 includes a plurality of light-emitting units 31. The first encapsulation layer 40 is disposed on a side of the light-emitting functional layer 30 facing away from the substrate 10, and the first encapsulation layer 40 includes a plurality of encapsulation portions 41 corresponding to the plurality of light-emitting units 31. The encapsulation portions 41 corresponding to at least some light-emitting units 31 of different luminescent colors have different etching times.

[0293] In the embodiment of the present application, the etching time of the packaging part 41 corresponding to at least some of the light-emitting units 31 of different colors can be set to be different according to the preparation order of the light-emitting units 31 inside the display panel, so as to reduce the risk of damage to the packaging part 41 corresponding to the previously formed light-emitting unit 31 due to subsequent etching treatment of the light-emitting unit 31 and the corresponding packaging material, causing some of the light-emitting units 31 to fail, thereby improving the reliability of the display panel.

[0294] In some embodiments, the packaging portion 41 includes a first portion 411 , which is the portion of the packaging portion 41 located above the light-emitting unit 31 . At least some light-emitting units 31 of different colors have different etching times for the first portion 411 .

[0295] In the embodiment of the present application, the thickness of the first portion 411 in different packaging parts 41 can be adjusted to be different, so that the etching time corresponding to different first portions 411 is different. Further optionally, the multiple light-emitting units 31 include a first light-emitting unit 31a, a second light-emitting unit 31b, and a third light-emitting unit 31c, each of which emits light of different colors.

[0296] The multiple encapsulation portions 41 include a first encapsulation portion 41a located on a side of the first light-emitting unit 31a facing away from the substrate 10, a second encapsulation portion 41b located on a side of the second light-emitting unit 31b facing away from the substrate 10, and a third encapsulation portion 41c located on a side of the third light-emitting unit 31c facing away from the substrate 10. The etching time of the first encapsulation portion 41a is longer than the etching time of at least one of the second encapsulation portion 41b and the third encapsulation portion 41c.

[0297] In some optional embodiments, the etching time of the second packaging part 41b is longer than that of the third packaging part 41c, or the etching time of the second packaging part 41b is equal to that of the third packaging part 41c.

[0298] In some embodiments, the plurality of light-emitting units 31 include a first light-emitting unit 31a and a second light-emitting unit 31b emitting light of different colors. The plurality of encapsulation portions 41 include a first encapsulation portion 41a located on the side of the first light-emitting unit 31a facing away from the substrate 10, and a second encapsulation portion 41b located on the side of the second light-emitting unit 31b facing away from the substrate 10. The etching time of the first encapsulation portion 41a is longer than the etching time of the second encapsulation portion 41b. The first light-emitting unit 31a is configured to emit blue light, and the second light-emitting unit 31b is configured to emit red or green light.

[0299] Further optionally, the multiple light-emitting units 31 also include a third light-emitting unit 31c having a different light-emitting color from the first light-emitting unit 31a and the second light-emitting unit 31b, and the multiple packaging parts 41 include a third packaging part 41c located on the side of the third light-emitting unit 31c away from the substrate 10, the etching time of the second packaging part 41b is greater than the etching time of the third packaging part 41c, or the etching time of the second packaging part 41b is equal to the etching time of the third packaging part 41c, the first light-emitting unit 31a is used to emit blue light, the second light-emitting unit 31b is used to emit green light, and the third light-emitting unit 31c is used to emit red light.

[0300] In some embodiments, the etching time of the packaging parts 41 corresponding to the light-emitting units 31 with the same light-emitting color is the same.

[0301] In some embodiments, the encapsulation portions 41 corresponding to at least two adjacent light-emitting units 31 are etched for different lengths of time.

[0302] In the tenth aspect, please refer to FIG8 . An embodiment of the present application provides a flexible display device, comprising the display panel in any of the aforementioned embodiments.

[0303] The flexible display device provided in the embodiment of the present application has the beneficial effects of the display panel in any of the aforementioned embodiments. For details, please refer to the aforementioned description of the beneficial effects of the display panel, which will not be repeated in the embodiment of the present application.

[0304] In an eleventh aspect, referring to FIG. 9 and FIG. 10 , an embodiment of the present application provides a method for manufacturing a display panel, including:

[0305] S100: forming an isolation structure on one side of the substrate.

[0306] Referring to Figure 10a, in step S100, the isolation structure 20 encloses a plurality of opening structures 21. The specific structure of the isolation structure 20 is not limited in this embodiment of the present application. For example, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23, which are sequentially arranged in a direction away from the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. The plurality of opening structures 21 include at least one first opening and at least one second opening. The first opening structure is used to subsequently accommodate a first light-emitting unit 31a, and the second opening structure is used to subsequently accommodate a second light-emitting unit 31b.

[0307] S110: forming a first light-emitting unit in each opening structure and a first packaging material layer covering each first light-emitting unit.

[0308] 10b, in step S110, due to the presence of the isolation structure 20, the first light-emitting units 31a are formed in each opening structure 21, and the first light-emitting units 31a in different opening structures 21 are spaced apart from each other. The first encapsulation material layer 41a' can be a full-surface structure.

[0309] S120: performing etching on the first packaging material layer and the first light-emitting unit in the second opening structure to remove the first packaging material layer and the first light-emitting unit in the second opening structure, and retaining the first light-emitting unit and the first packaging material layer in the first opening structure.

[0310] Referring to FIG. 10c , in step S120 , the first encapsulation material layer is etched, forming first encapsulation portions 41a corresponding to portions of the first light-emitting units 31a. The first light-emitting units 31a within the second opening structure are then removed, i.e., the portions of the first light-emitting units 31a not corresponding to the first encapsulation portions 41a are removed by etching, etc. The etching time for the first encapsulation material layer is T1.

[0311] S130: forming a second light-emitting unit and a second packaging material layer covering the second light-emitting unit in each opening structure.

[0312] Please refer to Figure 10d. In step S130, due to the presence of the isolation structure 20, the second light-emitting unit 31b will be formed in each opening structure 21, wherein a portion of the second light-emitting unit 31b covers the first encapsulation portion 41a on the first light-emitting unit 31a, and the second light-emitting units 31b located in different opening structures 21 are spaced apart from each other. The second encapsulation material layer can be a full-surface structure. The thickness of the first encapsulation material layer is greater than the thickness of the second encapsulation material layer 41b'. The thickness of the first encapsulation material layer 41a' refers to the thickness of the first encapsulation material layer 41b' above the first light-emitting unit 31a, and the thickness of the second encapsulation material layer 41b' refers to the thickness of the second encapsulation material layer 41b' above the second light-emitting unit 31b.

[0313] S140: performing an etching process on the second light-emitting unit and the second packaging material layer in the first opening structure to remove the second packaging material layer and the second light-emitting unit in the first opening structure, and retaining the second light-emitting unit and the second packaging material layer in the second opening structure.

[0314] 10e, in step S140, the second packaging material layer and the second light-emitting unit 31b are processed in a manner similar to that of the first packaging material layer and the first light-emitting unit 31a, and will not be further described in this embodiment. The etching time corresponding to the second packaging material layer is T2, where T1>T2.

[0315] In this process, since the etching time of the second packaging material layer is shorter than the etching time of the first packaging material layer, the probability of excessive damage to the first packaging part 41a due to the etching process of the second packaging material layer and the second light-emitting unit 31b can be reduced, thereby ensuring that the first packaging part 41a can play a packaging and protection role for the first light-emitting unit 31a, thereby improving the reliability of the display panel.

[0316] It should be noted that the embodiments of the present application do not limit how to control the etching time of the first and second packaging material layers. For example, the thickness of the first packaging material layer can be controlled to be greater than the thickness of the second packaging material layer, so that T1>T2; or the first and second packaging material layers can be made of different materials so that the etching selectivity ratio SR1 of the second packaging material layer to the first packaging material layer is ≥1, thereby achieving T1>T2.

[0317] In addition, when the thickness of the first packaging material layer 41a' is greater than the thickness of the second packaging material layer 41b', part of the material in the first packaging material layer 41a' may be removed during the process of etching the second packaging material layer 41b', so that the thickness of the first packaging part 41a finally formed may be greater than the thickness of the second packaging part 41b.

[0318] It should be noted that, as shown in FIG. 11 , after step S140 is completed, a third light-emitting unit 31 c and a corresponding third packaging portion 41 c may be formed, which is not limited in this embodiment of the present application.

[0319] In some embodiments, the thickness of the first packaging material layer is greater than the thickness of the second packaging material layer; and / or, an etching selectivity ratio of the second packaging material layer to the first packaging material layer is SR1, where SR1≥1.

[0320] In related art, the order in which light-emitting units 31 are prepared in a display panel may be determined based on the corresponding luminescence stability of different light-emitting units 31. Specifically, light-emitting units 31 with high luminescence stability are typically prepared first, that is, light-emitting units 31 less susceptible to failure and degradation are prepared first, followed by light-emitting units 31 with lower luminescence stability. Furthermore, the first light-emitting unit 31a is typically prepared before the second light-emitting unit 31b.

[0321] The "luminescence stability" mentioned in the embodiments of the present application refers to the time it takes for the luminescent material to fail under specific conditions. The higher the luminescence stability, the less likely the corresponding light-emitting unit 31 will fail, and its service life will generally be longer.

[0322] In view of this, the embodiment of the present application, based on the preparation sequence of the light-emitting units 31, ensures that the thickness of the encapsulation portion 41 corresponding to the first light-emitting unit 31a, which has higher luminous stability, is greater than the thickness of the encapsulation portion 41 corresponding to the second light-emitting unit 31b. This reduces the probability of damage to the encapsulation portion 41 corresponding to the first light-emitting unit 31a during etching of the second light-emitting unit 31b and its encapsulation portion 41, thereby helping to improve the packaging reliability of the first light-emitting structure. Optionally, the first light-emitting unit 31a is configured to emit red or green light, and the second light-emitting unit 31b is configured to emit blue light.

[0323] In some embodiments, after step S140, the method further includes:

[0324] S150: forming a third light-emitting unit in each opening structure and a third packaging material layer covering each third light-emitting unit.

[0325] S160: Removing the third encapsulation material layer and the third light-emitting unit within the first opening structure and the second opening structure by etching the third encapsulation material layer and the third light-emitting unit. The etching time of the second encapsulation material layer is longer than the etching time of the third encapsulation material layer, or the etching time of the second encapsulation material layer is equal to the etching time of the third encapsulation material layer.

[0326] In a twelfth aspect, an embodiment of the present application provides a method for manufacturing a display panel, comprising:

[0327] S100: forming an isolation structure on one side of the substrate.

[0328] Referring to Figure 10a, in step S100, the isolation structure 20 encloses an opening structure 21, wherein the plurality of opening structures 21 include at least one first opening structure and at least one second opening structure. The specific structure of the isolation structure 20 is not limited in this embodiment of the present application. For example, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23, which are sequentially arranged in a direction away from the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10.

[0329] S110: forming a first light-emitting unit in each opening structure and a first packaging material layer covering each first light-emitting unit.

[0330] 10b, in step S110, due to the presence of the isolation structure 20, the first light-emitting units 31a are formed in each opening structure 21, and the first light-emitting units 31a in different opening structures 21 are spaced apart from each other. The first encapsulation material layer 41a' can be a full-surface structure.

[0331] S120: removing the first packaging material layer and the first light-emitting unit in the second opening structure, and retaining the first light-emitting unit and the first packaging material layer in the first opening structure.

[0332] Referring to FIG. 10c , in step S120 , the first encapsulation material layer is etched, forming first encapsulation portions 41a corresponding to portions of the first light-emitting units 31a. The first light-emitting units 31a within the second opening structure are then removed, i.e., the portions of the first light-emitting units 31a not corresponding to the first encapsulation portions 41a are removed by etching, etc. The etching time for the first encapsulation material layer is T1.

[0333] S130: forming a second light-emitting unit and a second packaging material layer covering the second light-emitting unit in each opening structure.

[0334] Referring to FIG. 10d , in step S130 , due to the presence of the isolation structure 20 , the second light-emitting units 31b are formed within each opening structure 21 , and the second light-emitting units 31b located within different opening structures 21 are spaced apart from each other. The second encapsulation material layer can be a full-surface structure. The thickness of the first encapsulation material layer is greater than the thickness of the second encapsulation material layer 41b ′.

[0335] S140: removing the second packaging material layer and the second light-emitting unit in the first opening structure, and retaining the second light-emitting unit and the second packaging material layer in the second opening structure.

[0336] 10e, in step S140, the second packaging material layer and the second light-emitting unit 31b are processed in a manner similar to that of the first packaging material layer and the first light-emitting unit 31a, and will not be further described in this embodiment. The etching time corresponding to the second packaging material layer is T2, where T1>T2.

[0337] In this process, since the thickness of the first packaging material layer is greater than the thickness of the second packaging material layer, the etching time of the second packaging material layer is less than the etching time of the first packaging material layer. Therefore, the probability of damage to the first packaging part 41a due to the etching process of the second packaging material layer and the second light-emitting unit 31b can be reduced, thereby ensuring that the first packaging part 41a can play a packaging and protection role for the first light-emitting unit 31a, thereby improving the reliability of the display panel.

[0338] In some embodiments, after step S140, the method further includes:

[0339] S150: forming a third light-emitting unit in each opening structure and a third packaging material layer covering each third light-emitting unit.

[0340] S160: removing the third encapsulation material layer and the third light-emitting unit in the first opening structure and the second opening structure, and retaining the third encapsulation material layer and the third light-emitting unit in the third opening structure.

[0341] The thickness of the second packaging material layer is greater than the thickness of the third packaging material layer, or the thickness of the second packaging material layer is equal to the thickness of the third packaging material layer.

[0342] Although the embodiments disclosed in this application are as described above, the contents described are merely embodiments adopted to facilitate understanding of this application and are not intended to limit the present invention. Any person skilled in the art to which this application belongs may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in this application. However, the scope of protection of this application shall still be based on the scope defined by the appended claims.

[0343] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the replacement of other connection methods described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the scope of protection of this application.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate, and the isolation structure encloses a plurality of opening structures; A light-emitting functional layer is disposed on one side of the substrate, and the light-emitting functional layer includes a plurality of light-emitting units disposed in the plurality of opening structures; A first encapsulation layer is arranged on a side of the light-emitting functional layer away from the substrate, and the first encapsulation layer includes a plurality of encapsulation parts arranged corresponding to the light-emitting units; Wherein, at least some of the light-emitting units with different luminous colors correspond to different thicknesses of the packaging parts.

2. The display panel according to claim 1, characterized in that: The packaging portion includes a first portion, the orthographic projection of the first portion on the substrate is located outside the orthographic projection of the isolation structure on the substrate, and at least some of the light-emitting units of different colors have different thicknesses of the first portion; Preferably, the isolation structure comprises a first isolation portion and a second isolation portion which are sequentially arranged in a direction away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; The orthographic projection of the first portion on the substrate is located outside the orthographic projection of the second isolation portion on the substrate.

3. The display panel according to claim 1, characterized in that: Each of the packaging parts includes a second portion located on a side of the isolation structure away from the substrate, and for a plurality of the packaging parts corresponding to a plurality of the light-emitting units with different luminous colors, the thickness of the second portions of the plurality of the packaging parts is different.

4. The display panel according to claim 1, characterized in that: The plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit and a third light-emitting unit, which emit light of different colors; The plurality of packaging parts include a first packaging part located at a side of the first light emitting unit away from the substrate, a second packaging part located at a side of the second light emitting unit away from the substrate, and a third packaging part located at a side of the third light emitting unit away from the substrate; The thickness of the first encapsulation portion is greater than the thickness of the second encapsulation portion and the thickness of at least one of the third encapsulation portion; Preferably, the thickness of the first encapsulation part is greater than the thickness of the second encapsulation part, and the thickness of the second encapsulation part is greater than the thickness of the third encapsulation part; or, The thickness of the first encapsulation part is greater than the thickness of the second encapsulation part, and the thickness of the second encapsulation part is equal to the thickness of the third encapsulation part; or, The thickness of the first encapsulation portion is equal to the thickness of the second encapsulation portion, and the thickness of the second encapsulation portion is greater than the thickness of the third encapsulation portion.

5. The display panel according to claim 1, characterized in that: The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit having different light-emitting colors; The plurality of encapsulation parts include a first encapsulation part located on a side of the first light emitting unit away from the substrate, and a second encapsulation part located on a side of the second light emitting unit away from the substrate, wherein the thickness of the first encapsulation part is greater than the thickness of the second encapsulation part; Preferably, the first light emitting unit is used to emit red light or green light, and the second light emitting unit is used to emit blue light; or, the first light emitting unit is used to emit blue light, and the second light emitting unit is used to emit red light or green light; Preferably, the plurality of light-emitting units further include a third light-emitting unit having a light-emitting color different from that of the first light-emitting unit and the second light-emitting unit; The plurality of encapsulation parts include a third encapsulation part located on a side of the third light-emitting unit away from the substrate, the thickness of the second encapsulation part is greater than the thickness of the third encapsulation part, or the thickness of the second encapsulation part is equal to the thickness of the third encapsulation part; The first light emitting unit is used to emit blue light, the second light emitting unit is used to emit green light, and the third light emitting unit is used to emit red light; or the first light emitting unit is used to emit red light, the second light emitting unit is used to emit green light, and the third light emitting unit is used to emit Emit blue light.

6. The display panel according to claim 1, characterized in that: The thickness of at least one of the packaging parts is greater than or equal to 1.0 um and less than or equal to 2.5 um.

7. The display panel according to claim 1, characterized in that: The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit that emit light of different colors, the plurality of encapsulation parts include a first encapsulation part located on a side of the first light-emitting unit away from the substrate, and a second encapsulation part located on a side of the second light-emitting unit away from the substrate, the thickness of the first encapsulation part is greater than the thickness of the second encapsulation part, and the etching selection ratio of the second encapsulation part to the first encapsulation part is SR1, and SR1≥1; Preferably, the plurality of light-emitting units further include a third light-emitting unit having a color different from that of the first light-emitting unit and the second light-emitting unit, and the plurality of packaging parts include a third packaging part located on a side of the third light-emitting unit away from the substrate; The etching selection ratio between the third encapsulation part and the second encapsulation part is SR2, SR2≥1; Preferably, SR1=1, the first packaging part and the second packaging part are made of the same material; Preferably, SR1>1, the first encapsulation portion includes silicon oxide, and the second encapsulation portion includes silicon oxynitride; Preferably, SR2>1, the second encapsulation portion includes silicon oxynitride, and the third encapsulation portion includes silicon nitride.

8. The display panel according to claim 1, characterized in that: The isolation structure comprises a first isolation portion and a second isolation portion which are sequentially arranged in a direction away from the substrate, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit that emit light of different colors, the plurality of opening structures include at least one first opening structure and at least one second opening structure, the first light-emitting unit is located in the first opening structure, and the second light-emitting unit is located in the second opening structure; The plurality of packaging parts include a first light emitting unit located on a side away from the substrate an encapsulation portion, and a second encapsulation portion located on a side of the second light-emitting unit away from the substrate, wherein a thickness of the first encapsulation portion is greater than a thickness of the second encapsulation portion; Preferably, the thickness of the encapsulation portion corresponding to the light-emitting unit of at least one light-emitting color is greater than twice the thickness of the first isolation portion.

9. The display panel according to claim 8, characterized in that: The contour line of the orthographic projection of the first isolation portion on the substrate includes a first contour line corresponding to the first opening structure and a second contour line corresponding to the second opening structure; The contour line of the orthographic projection of the second isolation portion on the substrate includes a third contour line corresponding to the first opening structure and a fourth contour line corresponding to the second opening structure; The corresponding distance between the first contour line and the third contour line is L1, and the corresponding distance between the second contour line and the fourth contour line is L2, L1<L2; and / or, A length of the second isolation portion extending toward the first opening structure relative to the first isolation portion is L5, and a length of the second isolation portion extending toward the second opening structure relative to the first isolation portion is L6, where L5<L6.

10. The display panel according to claim 8, characterized in that: The display panel further includes a pixel definition layer, the pixel definition layer includes a plurality of pixel openings and a pixel defining portion between adjacent pixel openings, the plurality of pixel openings include a first pixel opening and a second pixel opening, the first light emitting unit is located in the first pixel opening, the second light emitting unit is located in the second pixel opening, the first pixel opening is connected to the first opening structure, and the second pixel opening is connected to the second opening structure; The contour line of the orthographic projection of the first isolation portion on the substrate includes a first contour line corresponding to the first opening structure and a second contour line corresponding to the second opening structure; The contour line of the orthographic projection of the pixel defining portion on the substrate includes a fifth contour line corresponding to the first pixel opening and a sixth contour line corresponding to the second pixel opening; The corresponding distance between the first contour line and the fifth contour line is L3, and the corresponding distance between the second contour line and the sixth contour line is L4, and L3<L4.

11. The display panel according to claim 1, characterized in that: The isolation structure comprises a first isolation portion and a second isolation portion which are sequentially arranged in a direction away from the substrate, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; The packaging part includes a first sub-part which is arranged in contact with the first isolation part, a second sub-part which is connected to the first sub-part on a side away from the substrate, and a third sub-part which is connected to the first sub-part on a side facing the substrate; In at least part of the packaging portion, the second sub-portion is connected to the third sub-portion, and / or, in at least part of the packaging portion, the second sub-portion is spaced apart from the third sub-portion.

12. The display panel according to claim 11, characterized in that: The plurality of packaging parts include a first packaging part and a second packaging part, and the thickness of the first packaging part is greater than the thickness of the second packaging part; In the first packaging part, the second sub-part is connected to the third sub-part, and in the second packaging part, the second sub-part is spaced apart from the third sub-part.

13. The display panel according to claim 1, characterized in that: It also includes a first electrode layer disposed between the light-emitting functional layer and the first encapsulation layer, the first electrode layer including a plurality of first electrodes disposed corresponding to the plurality of light-emitting units; Preferably, the isolation structure comprises a first isolation portion and a second isolation portion which are sequentially arranged in a direction away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; The first isolation portion includes a conductive material, and the first electrode is disposed in overlapping relation with the first isolation portion.

14. The display panel according to claim 1, characterized in that: The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit that emit light of different colors, and the thickness of the first light-emitting unit is smaller than the thickness of the second light-emitting unit; The plurality of packaging parts include a first light emitting unit located on a side away from the substrate A packaging portion, and a second packaging portion located at a side of the second light-emitting unit away from the substrate, wherein the thickness of the first packaging portion is greater than the thickness of the second packaging portion.

15. The display panel according to claim 14, characterized in that: The first light-emitting unit and the second light-emitting unit both include a hole transport layer, an electron transport layer and a light-emitting material located between the hole transport layer and the electron transport layer, and the thickness of the light-emitting material in the first light-emitting unit is less than the thickness of the light-emitting material in the second light-emitting unit.

16. The display panel according to claim 1, characterized in that: It also includes a second encapsulation layer disposed on a side of the first encapsulation layer away from the substrate, the second encapsulation layer covers the plurality of encapsulation portions, the second encapsulation layer includes a first surface away from the substrate, the first surface is parallel to the plane where the substrate is located; Preferably, the second encapsulation layer comprises an organic material; Preferably, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit emitting light of different colors, the plurality of encapsulation parts include a first encapsulation part located at a side of the first light-emitting unit away from the substrate, and a second encapsulation part located at a side of the second light-emitting unit away from the substrate, and the thickness of the first encapsulation part is greater than the thickness of the second encapsulation part; The thickness of the second encapsulation layer above the first encapsulation portion is smaller than the thickness of the second encapsulation layer above the second encapsulation portion; Preferably, the display panel further comprises a third encapsulation layer disposed on a side of the second encapsulation layer away from the substrate, and the third encapsulation layer covers the plurality of encapsulation parts; Preferably, the first encapsulation layer and the third encapsulation layer comprise inorganic materials.

17. The display panel according to claim 1, characterized in that: The thickness of the packaging part corresponding to the light-emitting units with different light-emitting colors is different; Preferably, the packaging parts corresponding to the light-emitting units with the same light-emitting color have the same thickness.

18. The display panel according to claim 1, characterized in that: The thicknesses of the packaging parts corresponding to at least two adjacent light-emitting units are different.

19. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate, and the isolation structure encloses a plurality of opening structures; A light-emitting functional layer is disposed on one side of the substrate, and the light-emitting functional layer includes a plurality of light-emitting units disposed in the plurality of opening structures; A first encapsulation layer is arranged on a side of the light-emitting functional layer away from the substrate, the first encapsulation layer comprises a plurality of encapsulation parts arranged corresponding to the light-emitting units, the plurality of encapsulation parts comprises a first encapsulation part and a second encapsulation part corresponding to the light-emitting units of different light-emitting colors; The second encapsulation layer is arranged on the side of the first encapsulation layer away from the substrate, the second encapsulation layer covers the plurality of encapsulation parts, and the thickness of the second encapsulation layer above the first encapsulation part is less than the thickness of the second encapsulation layer above the second encapsulation part.

20. A display panel, characterized in that: include: substrate; an isolation structure, disposed on one side of the substrate, the isolation structure enclosing a plurality of opening structures, the isolation structure comprising a first isolation portion and a second isolation portion sequentially disposed in a direction away from the substrate, the orthographic projection of the first isolation portion on the substrate being located within the orthographic projection of the second isolation portion on the substrate, the plurality of opening structures comprising at least one first opening structure and at least one second opening structure; A light-emitting functional layer is disposed on one side of the substrate, the light-emitting functional layer includes a plurality of light-emitting units disposed in the plurality of opening structures, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit, the first light-emitting unit is located in the first opening structure, and the second light-emitting unit is located in the second opening structure; A first encapsulation layer is arranged on a side of the light-emitting functional layer away from the substrate, wherein the first encapsulation layer includes a plurality of encapsulation parts arranged corresponding to the plurality of light-emitting units; the plurality of encapsulation parts include a first encapsulation part located on a side of the first light-emitting unit away from the substrate, and a a second packaging portion of the second light-emitting unit facing away from the substrate, wherein the thickness of the first packaging portion is greater than the thickness of the second packaging portion; Wherein, the contour line of the orthographic projection of the first isolation portion on the substrate includes a first contour line corresponding to the first opening structure and a second contour line corresponding to the second opening structure; The contour line of the positive projection of the second isolation portion on the substrate includes a third contour line corresponding to the first opening structure and a fourth contour line corresponding to the second opening structure; the distance between the corresponding first contour line and the third contour line is L1, and the distance between the corresponding second contour line and the fourth contour line is L2, L1<L2.

21. The display panel according to claim 20, characterized in that: The packaging part includes a first portion, the orthographic projection of the first portion on the substrate is located outside the orthographic projection of the isolation structure on the substrate, and the thickness of the first portion corresponding to the first packaging part and the second packaging part is different; Preferably, an orthographic projection of the first portion on the substrate is located outside an orthographic projection of the second isolation portion on the substrate.

22. The display panel according to claim 20, characterized in that: Each of the packaging parts includes a second portion located at a side of the isolation structure away from the substrate, and the thickness of the second portion corresponding to the first packaging part and the second packaging part is different.

23. A display panel, characterized in that: include: substrate; A pixel definition layer is disposed on one side of the substrate, and a plurality of pixel openings are disposed on the pixel definition layer, wherein the plurality of pixel openings include a first pixel opening and a second pixel opening; an isolation structure, arranged on a side of the pixel definition layer away from the substrate, the isolation structure comprising a first isolation portion and a second isolation portion sequentially arranged in a direction away from the substrate, the orthographic projection of the first isolation portion on the substrate being located within the orthographic projection of the second isolation portion on the substrate, a plurality of opening structures being arranged on the isolation structure, the plurality of opening structures comprising a first opening structure communicating with the first pixel opening and a second opening structure communicating with the second pixel opening; A light-emitting functional layer is disposed on one side of the substrate, wherein the light-emitting functional layer includes a plurality of light-emitting units disposed in the plurality of opening structures, wherein the plurality of light-emitting units include a first light-emitting unit located in the first opening structure and a second light-emitting unit located in the second opening structure; A first encapsulation layer is arranged on a side of the light-emitting functional layer away from the substrate, the first encapsulation layer comprises a plurality of encapsulation parts arranged corresponding to the plurality of light-emitting units; the plurality of encapsulation parts comprises a first encapsulation part located on a side of the first light-emitting unit away from the substrate, and a second encapsulation part located on a side of the second light-emitting unit away from the substrate, the thickness of the first encapsulation part being greater than the thickness of the second encapsulation part; Wherein, the contour line of the orthographic projection of the first isolation portion on the substrate includes a first contour line corresponding to the first opening structure and a second contour line corresponding to the second opening structure; The contour lines of the positive projection of the pixel defining portion on the substrate include a fifth contour line corresponding to the first pixel opening and a sixth contour line corresponding to the second pixel opening; the distance between the corresponding first contour line and the fifth contour line is L3, and the distance between the corresponding second contour line and the sixth contour line is L4, L3<L4.

24. The display panel according to claim 23, characterized in that: The packaging part includes a first portion, an orthographic projection of the first portion on the substrate is located outside the orthographic projection of the isolation structure on the substrate, and the first portion corresponding to the first packaging part and the second packaging part respectively has a different thickness.

25. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate, and the isolation structure encloses a plurality of opening structures; A light-emitting functional layer is disposed on one side of the substrate, and the light-emitting functional layer includes a plurality of light-emitting units disposed in the plurality of opening structures; A first encapsulation layer is arranged on a side of the light-emitting functional layer away from the substrate, and the first encapsulation layer includes a plurality of encapsulation parts arranged corresponding to the light-emitting units; Among them, the packaging parts corresponding to at least some of the light-emitting units of different light-emitting colors are The corresponding etching time is different.

26. The display panel according to claim 25, characterized in that: The packaging part includes a first portion, which is a portion of the packaging part located above the light-emitting unit, and the etching time lengths of the first portion corresponding to at least some of the light-emitting units of different colors are different.

27. The display panel according to claim 25, characterized in that: The plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit and a third light-emitting unit, which emit light of different colors; The plurality of packaging parts include a first packaging part located at a side of the first light emitting unit away from the substrate, a second packaging part located at a side of the second light emitting unit away from the substrate, and a third packaging part located at a side of the third light emitting unit away from the substrate; The etching time length of the first encapsulation part is longer than the etching time length of at least one of the second encapsulation part and the third encapsulation part; Preferably, the etching time of the first encapsulation part is longer than the etching time of the second encapsulation part, and the etching time of the second encapsulation part is longer than the etching time of the third encapsulation part; or, The etching time of the first packaging part is longer than the etching time of the second packaging part, and the etching time of the second packaging part is equal to the etching time of the third packaging part; or, The etching time length of the first packaging part is equal to the etching time length of the second packaging part, and the etching time length of the second packaging part is greater than the etching time length of the third packaging part.

28. The display panel according to claim 25, characterized in that: The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit that emit light of different colors, the plurality of packaging parts include a first packaging part located on a side of the first light-emitting unit away from the substrate, and a second packaging part located on a side of the second light-emitting unit away from the substrate, and the etching time length of the first packaging part is longer than the etching time length of the second packaging part; The first light emitting unit is used to emit blue light, and the second light emitting unit is used to emit red light or green light; Preferably, the plurality of light emitting units further include the first light emitting unit and the second a third light-emitting unit having a light-emitting color different from that of the light-emitting unit; The plurality of encapsulation parts include a third encapsulation part located on a side of the third light-emitting unit away from the substrate, the etching time of the second encapsulation part is longer than the etching time of the third encapsulation part, or the etching time of the second encapsulation part is equal to the etching time of the third encapsulation part; The first light emitting unit is used to emit blue light, the second light emitting unit is used to emit green light, and the third light emitting unit is used to emit red light.

29. The display panel according to claim 25, characterized in that: The etching time of the packaging parts corresponding to the light-emitting units with the same light-emitting color is the same; Preferably, the etching durations of the packaging parts corresponding to at least two adjacent light-emitting units are different.

30. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 29.

31. A method for preparing a display panel, characterized in that: include: An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of opening structures, and the plurality of opening structures include at least one first opening structure and at least one second opening structure; forming a first light-emitting unit in each of the opening structures and a first packaging material layer covering each of the first light-emitting units; Performing etching on the first light-emitting unit and the first packaging material layer in the second opening structure to retain the first light-emitting unit and the first packaging material layer in the first opening structure, wherein the etching time length corresponding to the first packaging material layer is T1; forming second light-emitting units and a second packaging material layer covering each of the second light-emitting units in the second opening structure and on the first packaging material layer; The second light emitting unit and the second packaging material layer on the first packaging material layer are etched to retain the second light emitting unit and the second packaging material layer in the second opening structure. The etching time corresponding to the second packaging material layer is T2, and T1>T2.

32. The preparation method according to claim 31, characterized in that: The thickness of the first packaging material layer is greater than the thickness of the second packaging material layer; and / or, An etching selectivity ratio between the second packaging material layer and the first packaging material layer is SR1, and SR1≥1.

33. The preparation method according to claim 31, characterized in that: The plurality of opening structures further comprises at least one third opening structure; After etching the second light-emitting unit and the second packaging material layer on the first packaging material layer to retain the second light-emitting unit and the light-emitting unit of the second packaging material layer in the second opening structure, the preparation method further includes: forming a third light emitting unit and a third packaging material layer covering each of the third light emitting units in the third opening structure, on the first packaging material layer and the second packaging material layer; Performing an etching process on the first packaging material layer and the third light emitting unit and the third packaging material layer on the second packaging material layer, so as to retain the third light emitting unit and the third packaging material layer in the third opening structure; The etching time of the second packaging material layer is greater than that of the third packaging material layer, or the etching time of the second packaging material layer is equal to that of the third packaging material layer.

34. A method for preparing a display panel, characterized in that: include: An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of opening structures, wherein the plurality of opening structures include at least one first opening structure, at least one second opening structure, and at least one third opening structure; forming a first light-emitting unit in each of the opening structures and a first packaging material layer covering each of the first light-emitting units; Performing etching processing on at least the first light-emitting unit and the first packaging material layer in the second opening structure, retaining the first light-emitting unit and the first packaging material layer in the first opening structure, wherein the etching time length corresponding to the first packaging material layer is T1; On the second opening structure, the third opening structure and the first packaging material layer forming a second light emitting unit and a second packaging material layer covering the second light emitting unit; Performing etching processing on at least the second light-emitting unit and the second packaging material layer in the third opening structure, retaining the second light-emitting unit and the second packaging material layer in the second opening structure, wherein the etching time length corresponding to the second packaging material layer is T2; forming a third light emitting unit and a third packaging material layer in the third opening structure and above the first packaging material layer and the second packaging material layer; The third light emitting unit and the third packaging material layer are etched to retain the third light emitting unit and the third packaging material layer in the third opening structure, and the etching time corresponding to the third packaging material layer is T3, where T3<T1.

35. The preparation method according to claim 34, characterized in that: T3<T2<T1, or, T3=T2<T1; or, T3<T2=T1.

36. A method for preparing a display panel, characterized in that: include: An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of opening structures, and the plurality of opening structures include at least one first opening structure and at least one second opening structure; forming a first light-emitting unit in each of the opening structures and a first packaging material layer covering each of the first light-emitting units; removing the first packaging material layer and the first light-emitting unit in the second opening structure, and retaining the first light-emitting unit and the first packaging material layer in the first opening structure; forming second light-emitting units and a second packaging material layer covering each of the second light-emitting units in the second opening structure and on the first packaging material layer, wherein the thickness of the second packaging material layer is less than the thickness of the first packaging material layer; The second light emitting unit and the second encapsulation material layer on the first encapsulation material layer are removed, and the second light emitting unit and the second encapsulation material layer in the second opening structure are retained.

37. The preparation method according to claim 36, characterized in that: The plurality of opening structures include at least one third opening structure; Remove the second light emitting unit and the second packaging material on the first packaging material layer After the layer, the preparation method further comprises: forming a third light emitting unit and a third encapsulation material layer covering each of the third light emitting units in the third opening structure, above the second encapsulation material layer and above the third encapsulation material layer; removing the third encapsulation material layer and the third light-emitting unit above the second encapsulation material layer and the third encapsulation material layer, and retaining the third encapsulation material layer and the third light-emitting unit in the third opening; The thickness of the second packaging material layer is greater than the thickness of the third packaging material layer, or the thickness of the second packaging material layer is equal to the thickness of the third packaging material layer.

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