Bone conduction headphones

Abstract

Earhook assembly for a bone conduction earphone, characterized in that the earhook assembly comprises an earhook housing and a decorative element, wherein the earhook housing comprises a receiving compartment, a flex transition section and an earphone attachment section, wherein the receiving compartment serves to receive a battery or a main control board, wherein the earphone attachment section serves to attach a core module, wherein the flex transition section connects the receiving compartment to the earphone attachment section and is bent to be suspended on the outside of a human ear, wherein the earhook housing is provided with a first groove at least at the flex transition section, and wherein the first groove serves for wiring.

Description

CROSS-REFERENCE

[0001] The present utility model claims priority from Chinese application 202020720127.1, Chinese application 202020720129.0 and Chinese patent application 202010367107.5, which were filed on April 30, 2020, and whose contents are incorporated herein by reference. TECHNICAL AREA

[0002] The present application relates to the technical field of bone conduction, in particular a bone conduction headphone. STATE OF THE ART

[0003] Bone conduction is a method of sound transmission in which electrical signals are converted into mechanical vibrations. These vibrations are then transmitted from the human skull bone, through the bony labyrinth, the fluid in the inner ear, the organ of Corti, and the auditory nerve, to the auditory cortex of the brain, thus transmitting sound waves. Bone conduction headphones utilize bone conduction technology for sound reception and fit snugly against the skull bone, allowing sound waves to travel directly through the bone to the auditory nerve without passing through the external ear canal and eardrum, effectively "freeing" both ears. REVELATION OF THE INVENTION

[0004] Exemplary embodiments of the present application provide a bone conduction headphone. The bone conduction headphone comprises an earhook assembly and a core module, wherein the core module is arranged at one end of the earhook assembly, wherein the earhook assembly comprises an earhook housing, and the core module comprises a core housing and a core, wherein one end of the core housing is open and forms a chamber structure for receiving the core; and wherein the elastic modulus of the core housing is greater than the elastic modulus of the earhook housing.

[0005] In some embodiments, the earhook housing comprises a headphone attachment section, a bend transition section, and a receiving compartment connected in succession, the headphone attachment section covering the open end of the core housing and being provided with a reinforcing structure such that the ratio of the difference between the stiffness of a skin contact area of ​​the core housing and the stiffness of the headphone attachment section to the stiffness of the skin contact area of ​​the core housing is less than or equal to 10%.

[0006] In some embodiments, the reinforcement structure includes a reinforcing rib provided on the headphone mounting section.

[0007] In some embodiments, the reinforcing rib is provided to be present multiple times, with the multiple reinforcing ribs being arranged next to each other or in a grid pattern.

[0008] In some embodiments, the headphone mounting section has a long-axis direction and a short-axis direction, wherein the dimension of the headphone mounting section in the long-axis direction is larger than its dimension in the short-axis direction, wherein the multiple reinforcing ribs are arranged in the long-axis and short-axis directions to form a lattice-like structure; or wherein the multiple reinforcing ribs extend in a strip-like fashion in the short-axis direction and are arranged side by side in the long-axis direction.

[0009] Some embodiments are characterized in that the ratio of the thickness of the reinforcing rib to the thickness of the headphone mounting section lies within a closed interval of [0,8, 1,2].

[0010] In some embodiments, the ratio of the width of the reinforcing rib to the thickness of the headphone mounting section is provided to be within a closed interval of [0,4, 0,6].

[0011] In some embodiments, the ratio of the distance between the reinforcing ribs to the thickness of the headphone mounting section is provided to be within the closed interval [1,6, 2,4].

[0012] In some embodiments, the thickness of the reinforcing rib is provided to be equal to the thickness of the headphone mounting section.

[0013] In some embodiments, the width of the reinforcing rib is provided to be half the thickness of the headphone mounting section.

[0014] In some embodiments, the distance between the reinforcing ribs is provided to be twice the thickness of the headphone mounting section.

[0015] In some embodiments, the reinforcing rib is provided to be present multiple times, with the multiple reinforcing ribs arranged radially centered around a predefined reference point on the headphone mounting section.

[0016] In some embodiments, the ends of the multiple reinforcing ribs that are close to each other are spaced apart, with the extension lines of the multiple reinforcing ribs intersecting at the predefined reference point.

[0017] In some embodiments, the reinforcement structure is provided to be a metal component, wherein the reinforcement structure and the headphone mounting section are formed as a single component by injection molding with metal inserts.

[0018] In some embodiments, the core housing comprises a bottom wall and an annular circumferential wall, the bottom wall comprising the skin contact area of ​​the core housing, one end of the annular circumferential wall being integrally connected to the bottom wall, the headphone mounting section comprising a mounting main body connected to the bending transition section and an annular flange integrally connected to the mounting main body and extending towards the core housing, the annular flange and the other end of the annular circumferential wall, located far from the bottom wall, being connected to each other, and the reinforcement structure comprising an arc-shaped structure provided between the mounting main body and the annular flange; or the reinforcement structure being a thickening layer integrally formed with the mounting main body.

[0019] In some embodiments, the ear hook housing includes an elastic metal wire that is arranged in the headphone attachment section, the bend transition section and / or the receiving compartment.

[0020] In some embodiments, the reinforcement structure is made from one of the materials polycarbonate, polyamide and acrylonitrile butadiene styrene copolymer.

[0021] In some embodiments, the core module further comprises a cover plate that covers the opening of the core housing, with the ear hook housing being connected to the cover plate; wherein the elastic modulus of the cover plate is greater than the elastic modulus of the ear hook housing.

[0022] In some embodiments, the elastic modulus of the cover plate is provided to be less than or equal to the elastic modulus of the core housing.

[0023] In some embodiments, the core housing comprises a bottom wall and an annular circumferential wall, wherein one end of the annular circumferential wall is integrally connected to the bottom wall, wherein the cover plate covers the other end of the annular circumferential wall and is arranged opposite the bottom wall, and wherein at least a part of the bottom wall is in contact with the user's skin; wherein the ratio of the difference between the stiffness of the bottom wall and the stiffness of the cover plate to the stiffness of the bottom wall is less than or equal to 10%.

[0024] In some embodiments, it is provided that the area of ​​the bottom wall is less than or equal to the area of ​​the cover plate and the thickness of the bottom wall is less than or equal to the thickness of the cover plate.

[0025] In some embodiments, the material of the cover plate is the same as the material of the core housing, wherein the ratio of the thickness to the area of ​​the cover plate to the thickness to the area of ​​the bottom wall is greater than or equal to 90%.

[0026] In some embodiments, it is provided that the ratio of the thickness to the area of ​​the bottom wall is equal to the ratio of the thickness to the area of ​​the cover plate.

[0027] In some embodiments, the earhook housing comprises a receiving compartment, a flex transition section, and a headphone attachment section, wherein the receiving compartment serves to receive a battery or a main control circuit board, wherein the flex transition section connects the receiving compartment to the headphone attachment section and is curved to be suspended on the outside of a human ear, and wherein the headphone attachment section covers a side of the cover plate facing away from the core housing.

[0028] In some embodiments, the headphone mounting section and the cover plate are connected by adhesive bonding or a combination of snap-fit ​​and adhesive bonding.

[0029] In some embodiments, the cover plate is completely covered by the headphone mounting section, with the fill level of the adhesive provided between the headphone mounting section and the cover plate being greater than or equal to 90% of the space between them.

[0030] In some embodiments, a button receptacle is provided on the side of the cover plate facing away from the core housing, the earhook assembly further comprising a button and a decorative element, the decorative element comprising a decorative support that is mounted and attached to one side of the earhook housing, the headphone attachment section being provided with a button counter-hole, the button being arranged in the button receptacle and exposed through the button counter-hole, the decorative support further extending in the form of a projection to above the button exposed through the button counter-hole and being able to trigger the button when pressed by an external force.

[0031] In some embodiments, a sound transducer receiving recess is provided on the side of the cover plate facing away from the core housing, wherein the core module further comprises a first sound transducer and a second sound transducer, the first sound transducer being received in the core housing, while the second sound transducer is arranged in the sound transducer receiving recess and is covered by the headphone mounting section.

[0032] In some embodiments, the cover plate is made from a mixture of one or more of the materials polycarbonate, polyamide and acrylonitrile butadiene styrene with glass fibers and / or carbon fibers.

[0033] In some embodiments, the ear hook housing is made from one of the materials polycarbonate, polyamide and acrylonitrile butadiene styrene copolymer.

[0034] In some embodiments, the core casing is made from a mixture of one or more of the materials polycarbonate, polyamide and acrylonitrile butadiene styrene with glass fibers and / or carbon fibers.

[0035] Advantageous effects of the present application include the following: In the bone conduction headphone according to the present application, a reinforcing structure is provided on the headphone attachment section of the ear hook housing in order to reduce, when the elastic modulus of the core housing is greater than the elastic modulus of the ear hook housing, the ratio of the difference between the stiffness of the skin contact area of ​​the core housing and the stiffness of the headphone attachment section to the stiffness of the skin contact area of ​​the core housing to less than or equal to 10%.This can not only ensure that the core housing has sufficient stiffness so that its resonant frequency is in the highest possible frequency range, but also reduce the stiffness difference between the headphone mounting section and the core housing, thus increasing the resonant frequency of the structure and improving sound loss of the bone conduction headphones.

[0036] Further advantageous effects of the present application include the following: In the bone conduction headphone according to the present application, the cover plate is connected to the core housing instead of the ear hook housing, wherein the elastic modulus of the core housing is greater than the elastic modulus of the ear hook housing and the elastic modulus of the cover plate is greater than the elastic modulus of the ear hook housing in order to increase the stiffness of the relevant structures at the open end of the core housing. This can not only ensure that the core housing has sufficient stiffness so that its resonant frequency is in the highest possible frequency range, but also reduce the stiffness difference between the relevant structures at the open end of the core housing and the core housing itself, thus increasing the resonant frequency of the structure and improving sound loss in the bone conduction headphone. BRIEF DESCRIPTION OF THE FIGURES

[0037] The present application is explained in more detail by means of exemplary embodiments, which are described in detail with reference to the figures. Such embodiments are not limiting. In the embodiments, the same reference numerals denote the same structures. These show: Fig. 1 a schematic structural exploded view of a bone conduction headphone according to some embodiments of the present application; Fig. 2 a schematic structural exploded view of an ear hook assembly according to some embodiments of the present application according to Fig. 1; Fig. 3 a schematic structural representation of an ear hook housing according to some embodiments of the present application according to Fig. 2; Fig. 4 a schematic structural exploded view of the ear hook assembly according to some embodiments of the present application according to Fig. 1; Fig. 5 a schematic structural representation of the ear hook housing according to some embodiments of the present application according to Fig. 4; Fig. 6 a schematic structural representation of a side of a decorative support located near the ear hook housing according to some embodiments of the present application according to Fig. 4; Fig. 7 a schematic representation of the principle of triggering a button by the decorative support according to some embodiments of the present application according to Fig. 4; Fig. 8 a schematic structural exploded view of a core module according to some embodiments of the present application according to Fig. 1; Fig. 9 a frequency response curve of the bone conduction headphone according to some embodiments of the present application; Fig. 10 a schematic structural sectional view of a reinforcement structure provided on the ear hook housing according to some embodiments of the present application according to Fig. 8; Fig. 11 a schematic structural top view of the reinforcement structure provided on the ear hook housing according to some embodiments of the present application in accordance with Fig. 8; Fig. 12 Frequency response curves of various amplification structures according to some embodiments of the present application according to Fig. 10 and Fig. 11; Fig. 13 a schematic structural sectional view of the core module in the assembled state according to some embodiments of the present application in accordance with Fig. 8 through direction II; Fig. 14 a schematic structural representation of a core support according to some embodiments of the present application according to Fig. 8; Fig. 15 a schematic structural top view of the core module in assembled state according to some embodiments of the present application in accordance with Fig. 8; Fig. 16 a schematic structural exploded view of the core module according to some embodiments of the present application according to Fig. 1; Fig. 17 Frequency response curves of the structures with adhesives of different types between the ear hook assembly and a cover plate according to some embodiments of the present application according to Fig. 14; Fig. 18 a schematic structural sectional view of the core module in the assembled state according to some embodiments of the present application according to Fig. 16 through direction II- II; Fig. 19 a schematic structural representation of a side of the cover plate located near the core housing according to some embodiments of the present application according to Fig. 16; Fig. 20 a schematic structural top view of the cover plate according to some embodiments of the present application in accordance with Fig. 19; Fig. 21 a schematic structural exploded view of the core module according to some embodiments of the present application in accordance with Fig. 16 from a different perspective; Fig. 22 a schematic structural top view of the cover plate according to some embodiments of the present application in accordance with Fig. 21; Fig. 23 a schematic representation of a core according to some embodiments of the present application; Fig. 24 a schematic representation of the relationship between a magnet and a force coefficient BL according to some embodiments of the present application according to Fig. 23; Fig. 25 a schematic representation of the relationship between the thickness of a magnetically conductive cover and a magnetically conductive plate and the force coefficient BL according to some embodiments of the present application in accordance with Fig. 23; Fig. 26 a schematic representation of the relationship between the height of the magnetically conductive cover and the force coefficient BL according to some embodiments of the present application in accordance with Fig. 23; Fig. 27 a schematic representation of the state of the bone conduction headphones in a non-worn state according to some embodiments of the present application according to Fig. 1; Fig. 28 a schematic structural sectional view of a back headband assembly according to some embodiments of the present application according to Fig. 1 through direction III-III. DETAILED DESIGNS

[0038] To clarify the technical solutions of the embodiments of the present application, the drawings required for describing these embodiments are briefly presented below. Naturally, the following drawings merely represent some examples or embodiments of the present application, and a person skilled in the art in this field can apply the present application to other similar scenarios without inventive step by means of such drawings. Unless obvious from the context or otherwise indicated, identical reference numerals in the drawings refer to identical structures or processes. It should be understood that the drawings serve only for illustration and description and are not intended to limit the scope of the present application. It should also be understood that the drawings are not drawn to scale.

[0039] It is understood that, for the sake of clarity in describing the present application, the terms "central", "upper surface", "lower surface", "top", "bottom", "uppermost", "lowest", "inside", "outside", "axial", "radial", "outer circumference", "outer", etc., are used in relation to the positional relationships shown in the respective illustration. These terms in no way imply a predetermined configuration of the device, assembly, or unit in question, and therefore do not constitute a limitation of the present application.

[0040] As shown in the present application and in the claims, the terms "a" and / or "the" need not necessarily refer to the singular form, but may also include the plural form unless clearly indicated otherwise in the context. Generally speaking, the terms "comprise" and "contain" merely serve to indicate the inclusion of expressly identified steps and elements, and these steps and elements do not constitute an exclusive list. Methods or devices may also contain other steps or elements.

[0041] The present application is described in more detail below with reference to the accompanying drawings and the exemplary embodiments. It should be noted in particular that the following exemplary embodiments serve only to illustrate the present application and do not limit its scope. Similarly, the following exemplary embodiments represent only some of the exemplary embodiments, rather than all of them, of the present application. All other exemplary embodiments that could be obtained by a person skilled in the art without inventive steps are also within the scope of protection of the present application.

[0042] The term "embodiment" used in this application should be understood to mean that certain features, structures, or properties described by reference to the embodiment may be included in at least one embodiment of this application. It is understood, both implicitly and explicitly, by those skilled in the art in this field that the embodiments described in this application can be combined with other embodiments.

[0043] As in Fig. As shown in Figures 1 to 5, the bone conduction headphone 10 can comprise two core modules 20, two earhook assemblies 30, a back-of-the-headband assembly 40, a main control circuit board 50, and a battery 60. In some embodiments, the two earhook assemblies 30 are each connected at one end to a corresponding core module 20, and the two ends of the back-of-the-headband assembly 40 are connected to the two earhook assemblies 30 at their other ends, which are located far from the respective core modules 20. In some embodiments, the two earhook assemblies 30 are designed to be suspended on the outside of the user's ears, and the back-of-the-headband assembly 40 is designed to wrap around the back of the user's head to meet the requirements for the user wearing the bone conduction headphone 10.This means that when the bone conduction headphones 10 are in a worn state, the two core modules 20 are located on the left and right sides of the user's head, respectively; and that, through the interaction of the two ear hook assemblies 30 and the back-of-the-head hook assembly 40, the two core modules 20 are able to clamp the user's head and come into contact with the user's skin, thereby enabling sound transmission based on bone conduction technology.

[0044] In some embodiments, the main control circuit board 50 and the battery 60 can be arranged in the same ear-hook assembly 30. Alternatively, they can each be arranged in two ear-hook assemblies 30, the specific structure being described in detail in the following sections. In some embodiments, both the main control circuit board 50 and the battery 60 can be connected via conductors (in Fig. (1 to 5 not shown) are connected to the two core modules 20, the former being used to control the sound generation of the core modules 20 (e.g., converting electrical signals into mechanical vibrations) and the latter being used to supply power to the bone conduction headphone 10 (e.g., the two core modules 20). Naturally, according to the present application, the bone conduction headphone 10 can also include sound transmitters such as a microphone, a sound transducer, and communication elements such as Bluetooth. Such components can also be connected via wires to the main control circuit board 50 and the battery 60 to implement corresponding functions.

[0045] It should be noted that the core module 20 is provided in a quantity of two according to the present application. The two core modules 20 can generate sound, primarily to enable the bone conduction headphone 10 to produce stereo sound and thus improve user satisfaction with the bone conduction headphone 10. Therefore, in some other application scenarios that do not place particularly high demands on stereo sound, such as hearing aids for patients with hearing impairments or teleprompters for presenters, the bone conduction headphone 10 may also be equipped with only one core module 20. In some embodiments, the conductor can be a wire used to establish electrical connections between individual electronic components of the bone conduction headphone 10.If several circuits are to be electrically connected, the conductor can accordingly be multi-core, so that the conductor can be a multi-core wire.

[0046] As in Fig. As shown in Figure 2, the earhook assembly 30 can comprise an earhook housing 31 and a decorative element 32, which can be connected to one another by one of the following assembly methods: adhesive bonding, snap-fit ​​connection, and threaded connection, or a combination thereof. In some embodiments, when the bone conduction headphones 10 are in the worn state, the decorative element 32 is located on a side of the earhook housing 31 facing away from the core module 20, that is, on the outside of the bone conduction headphones 10, in order to allow the decorative element 32 to adorn the earhook housing 31 and thereby improve the aesthetic appearance of the bone conduction headphones 10. In this case, the decorative element 32 can protrude from the earhook housing 31 or be recessed into the earhook housing 31.In some embodiments, the decorative element 32, without being limited thereto, may be a sticker, a plastic part, a metal part or the like, and may be printed with a geometric pattern, a cartoon pattern, a logo pattern, etc., or coated with a fluorescent material, a reflective material, etc., to achieve the appropriate decorative effect.

[0047] As in Fig. 2 and Fig. As shown in Figure 3, the earhook housing 31 can comprise a headphone attachment section 311, a flex transition section 312, and a receiving compartment 313, which are connected sequentially. In some embodiments, the headphone attachment section 311 can serve to attach the core module 20, their interaction being described in detail below. The flex transition section 312 can serve to connect the receiving compartment 313 to the headphone attachment section 311 and is curved to be suspended on the outside of the human ear. In some embodiments, an end of the receiving compartment 313 located far from the headphone attachment section 311 can be connected to the back-of-the-headband assembly 40 by one of the following assembly methods: adhesive bonding, snap-fit ​​connection, and threaded connection, or a combination thereof, to allow the earhook assembly 30 and the back-of-the-headband assembly 40 to be mounted together.In some embodiments, one end of the receiving compartment 313 is open to accommodate the main control circuit board 50 or the battery 60. In some embodiments, the ear hook housing 31 may further comprise a compartment cover 314, which covers the open end of the receiving compartment 313.

[0048] In some embodiments, where the receiving compartment 313 is mainly used to receive the main control circuit board 50, the ear hook assembly 30 can be, as in Fig. Figure 2 further includes a control button 33 and a TYPE-C (USB) interface 34. In some embodiments, the control button 33 and the TYPE-C (USB) interface 34 can be located on the receiving compartment 313 to facilitate their connection to the main control circuit board 50 and thereby reduce the wiring length. In this case, the control button 33 and the TYPE-C (USB) interface 34 can be partially exposed on the earhook housing 31 to allow the user to operate them. Thus, the control button 33 can perform functions such as turning the bone conduction headphones 10 on and off, volume control, etc., and the TYPE-C (USB) interface 34 can perform functions such as data transfer, charging, etc. Additionally, the earhook assembly 30 can further include an indicator light 35.In some embodiments, the indicator light 35 can be arranged on the receiving compartment 313 to facilitate the connection to the main control circuit board 50 and thereby shorten the wiring length. In this case, the indicator light 35 may be partially exposed on the ear hook housing 31, as shown in [reference]. Fig. 2 shown. Alternatively, it can specifically be an LED light source concealed within the ear hook housing 31 and a light guide element (in Fig. 2 and Fig. 3 (not shown), which is partially exposed on the ear hook housing 31. Thus, the indicator light 35 can inform the user in scenarios such as when charging the bone conduction headphones 10, when the battery level is insufficient, etc.

[0049] It should be noted that the bone conduction headphone 10 is suspended from the outside of the human ear when worn. Specifically, the core module 20 is generally located at the front of the ear, and the main control circuit board 50 or the battery 60 is generally located at the back. In this case, the ear acts as a support point for the bone conduction headphone 10, meaning it bears most of the headphone's weight. Wearing the headphone 10 for extended periods can lead to discomfort. Therefore, the ear hook housing 31 (particularly the bend transition section 312) is generally made of a soft material to improve the comfort of the bone conduction headphone 10.In some embodiments, the material of the ear hook housing 31 can comprise polycarbonate (PC), polyamides (PA), acrylonitrile butadiene styrene copolymer (ABS), polystyrene (PS), high-impact polystyrene (HIPS), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyurethanes (PU), polyethylene (PE), phenol-formaldehyde resin (PF), urea-formaldehyde resin (UF), melamine-formaldehyde resin (MF), silicone, etc., or a combination thereof. In some embodiments, the soft nature of the ear hook housing 31 results in insufficient stiffness and difficulty maintaining its structure under external force, with the risk of breakage due to insufficient strength. Therefore, the ear hook housing 31 (at least in the bend transition section 312) can incorporate an embedded elastic metal wire (in . Fig. 3 (not shown) to improve the strength of the ear hook housing 31 and thereby increase its reliability. In some embodiments, the material of the elastic metal wire can be spring steel, titanium alloy, titanium-nickel alloy, chromium-molybdenum steel, etc., but is not limited to these. In some embodiments, the ear hook housing 31 can be formed as a one-piece component by injection molding with metal inserts.

[0050] In some embodiments, an elastic metal wire can be provided in each of the headphone attachment section 311, the bending transition section 312, and the receiving compartment 313. In some embodiments, the elastic metal wire can be arranged at the headphone attachment section 311, the bending transition section 312, and / or the receiving compartment 313. In some embodiments, the shape of the elastic metal wire can be adapted to the shape of the component of the ear hook housing 31 that supports it. For example, if the elastic metal wire is arranged in the bending transition section 312, the elastic metal wire can run in the direction of extension of the bending transition section 312.In some other embodiments, the elastic metal wire can be bent into a specific shape (such as spiral, wave-shaped, or arc-shaped) before being arranged in the headphone attachment section 311, the bending transition section 312 and / or the receiving compartment 313 to further increase the strength of the ear hook housing 31.

[0051] Based on the detailed description above, since the core module 20 is located at one end of the earhook assembly 30 (for example, at the end where the headphone attachment section 311 is located), and the main control circuit board 50 or the battery 60 is located at the other end of the earhook assembly 30 (for example, at the other end where the receiving compartment 313 is located), a conductor wire must pass at least through the area where the bend transition section 312 is located when the core module 20 is connected to the main control circuit board 50 and the battery 60 via the conductor wire. In some embodiments, for the sake of the aesthetic appearance of the bone conduction headphones 10, the conductor wire is not exposed at the earhook housing 31. Instead, it is routed within the earhook housing 31, such that at least the bend transition section 312 encloses the conductor wire.However, due to the generally soft nature of the conductor wire, routing the conductor wire within the ear hook housing 31 is difficult. As in . Fig. As shown in Figures 2 to 5, in some embodiments the ear hook housing 31 is provided with a first groove 315 at least at the bend transition section 312. The first groove 315 can serve for wire routing to facilitate the routing of the conductor wire within the ear hook housing 31. In some embodiments, the first groove 315 can be specifically formed on a side of the ear hook housing 31 located near the decorative support 321. In some embodiments, the decorative element 32 can be recessed into and attached to the first groove 315, which is associated with the bend transition section 312, to form a conductor channel (in Fig. 2 and Fig. 4 (not marked) to form, which allows the conductor wire to run from the core module 20 through the conductor channel into the receiving compartment 313, thus facilitating the connection of the core module 20 to the main control circuit board 50 and the battery 60 via the conductor wire. Thus, when the conductor wire is routed through the first groove 315 within the earpiece housing 31, the decorative element 32 can cover the conductor wire to prevent it from being exposed at the earpiece housing 31. In some embodiments, the decorative element 32 can not only decorate the earpiece housing 31 but also cover the conductor wire, thereby fulfilling two functions.

[0052] As in Fig. As shown in Figure 2, the decorative element 32 can comprise a decorative support 321 and a decorative strip 322. In some embodiments, the decorative support 321 is bent according to the bending transition section 312, so that when the decorative support 321 is inserted into and secured in the first groove 315 associated with the bending transition section 312, the decorative support 321 interacts with the first groove 315 on the bending transition section 312 to form a channel that allows the conductor wire to run from the core module 20 through the channel into the receiving compartment 313. In some embodiments, the decorative strip 322 is inserted into the first groove 315 and attached abutting the decorative support 312. In some embodiments, the decorative support 321 can be a plastic part and can be mounted on the ear hook housing 31 by gluing and / or snapping it into place.The decorative strip 322 can be a sticker and can be attached to the decorative support 312 by adhesive. This ensures that if the user wishes to change the decorative effect of the decorative element 32, the user only needs to replace the decorative strip 322 without having to remove the entire decorative element 32 from the ear hook housing 31. Of course, in some embodiments, such as in . Fig. As shown in Figure 6, the decorative support 321 is further provided with a second groove 3211 on its side facing the earpiece housing 31, so that when the decorative support 321 is inserted into and secured in the first groove 315, the second groove 3211 and the first groove 315 cooperate to form the conduit channel.

[0053] In some embodiments, the bottom of the first groove 315 can be provided with a recess 316 at a position near one end of the decorative strip 322. This allows the user to lift the end of the decorative strip 322 out of the first groove 315 by pressing it into the recess 316, thus facilitating replacement of the decorative strip 322. In this case, the first groove 315 can extend further to the receiving compartment 313, and the recess 316 can be formed in the receiving compartment 313. In some embodiments, the recess 316 is located outside the area of ​​the first groove 315 covered by the decorative support 321, and the decorative strip 322 is attached to the decorative support 321 and covers the recess 316. In this case, the overall length of the decorative strip 322 can be greater than the overall length of the decorative support 321.

[0054] It should be noted that the decorative support 321 and the decorative strip 322 can also be molded as a single component. In some embodiments, the material of the decorative support 321 and the material of the decorative strip 322 can be different. Both components can be molded by two-component injection molding, so that the decorative support 321 can serve for support and the decorative strip 322 can fulfill a decorative function. In this case, the total length of the decorative strip 322 can be greater than or equal to the total length of the decorative support 321.

[0055] As in Fig. As shown in Figure 3, the first groove 315 can be subdivided into a first partial groove segment 3151 located at the bending transition section 312, a second partial groove segment 3152 located at the headphone mounting section 311, and a third partial groove segment 3153 located at the receiving compartment 313. In some embodiments, the depth of the first partial groove segment 3151 is greater than the depth of the second partial groove segment 3152 and the third partial groove segment 3153, so that the first partial groove segment 3151 mainly serves to receive the decorative support 321 and to route the wire, while the second partial groove segment 3152 and the third partial groove segment 3153 mainly serve to receive the decorative strip 322. In other words, in addition to its positioning within the first partial groove segment 3151, the decorative strip 322 can extend further into the second partial groove segment 3152 and the third partial groove segment 3153.In some embodiments, the recess 316 can be formed on the third partial groove segment 3153. In some embodiments, the depth of the second partial groove segment 3152 can be equal to the depth of the third partial groove segment 3153. After the decorative support 321 is inserted into and secured in the first partial groove segment 3151, the side of the decorative support 321 facing away from the ear hook housing 31 can be substantially flush with the groove bottom of the second partial groove segment 3152 and the third partial groove segment 3153, thus allowing the decorative strip 322 to lie flat against the headphone mounting section 311, the decorative support 321, and the receiving compartment 313.

[0056] In some embodiments, the contact thickness between the decorative strip 322 and the decorative support 321 can be less than the bonding thickness between the decorative support 321 and the bending transition section 312. In some embodiments, if the decorative strip 322 and the decorative support 321 are bonded together, the contact thickness can refer to the adhesive strength between the two components. In this case, the size of the contact thickness can depend primarily on the roughness of the contacting surfaces of the decorative support 321 and the decorative strip 322 and / or on the amount (and / or tackiness) of the adhesive between the decorative strip 322 and the decorative support 321. In some embodiments, if the decorative support 321 and the bending transition section 312 are connected by snap-fit, the bonding thickness can refer to the snap-fit ​​connection strength between the two components.In this case, the fastening strength can depend primarily on the clearance between the decorative support 321 and the bending transition section 312 and / or on the depth of the snap-fit ​​connection between the two components. This ensures that, if the decorative support 321 and the ear hook housing 31 are primarily mounted by snapping them together, the two ends of the decorative strip 322 can each be bonded to the receiving compartment 313 and the headphone mounting section 311, respectively. This can further secure the decorative support 321, and prevents the decorative support 321 from being pulled upwards due to excessive contact thickness between it and the decorative strip 322 when the decorative strip 322 is replaced to change the decorative effect of the decorative element 32.

[0057] It should be noted that if this is in Fig. The 2 shown mounting compartment 313 mainly serves to accommodate the main control circuit board 50, then the one in Fig. The compartment 313 shown in section 4 can primarily serve to hold the battery 60. In this case, if the Fig. 2. Ear hook assembly 30 shown corresponds to the left ear hook of the bone conduction headphones, then the in Fig. The ear hook assembly 30 shown in Figure 4 corresponds to the right ear hook of the bone conduction headphone 10; conversely, if the in Fig. If the ear hook assembly 30 shown corresponds to the right ear hook of the bone conduction headphone 10, then the in Fig. The earhook assembly 30 shown in Figure 4 corresponds to the left earhook of the bone conduction headphone 10. In other words, the main control circuit board 50 and the battery 60 can each be arranged in two earhook assemblies 30. This can not only increase the capacity of the battery 60 to improve the operating time of the bone conduction headphone 10, but also balance the weight of the bone conduction headphone 10 to improve its wearing comfort. In some embodiments, the main control circuit board 50 and the battery 60 can be connected to each other via a conductor wire built into the rear cover assembly 40, the specific structure of which is described in detail below.

[0058] As in Fig. As shown in Figure 4, the ear hook assembly 30 can further include a button 36, and the ear hook housing 31 is further provided with a button counter hole 317. In some embodiments, the decorative support 321 is mounted and attached to one side of the ear hook housing 31. The button 36 is located on the other side of the ear hook housing 31, facing away from the decorative support 321, and is exposed to the outside through the button counter hole 317. The decorative support 321 also extends in the form of a projection above the button 36 exposed through the button counter hole 317 and can trigger the button 36 when pressed by an external force. Thus, the button 36 can replace the aforementioned control button 33 to simplify the structure of the bone conduction headphones 10; it can also coexist with the aforementioned control button 33 and can be used to implement functions such as play / pause, AI activation, etc.can be used to expand the interaction capability of the bone conduction headphones 10.

[0059] In some embodiments, the button counter hole 317 can be incorporated into the headphone attachment section 311, allowing the user to press the button 36 on the headphone attachment section 311. In this case, the ear hook assembly 30 can further include a sealing element 37, the sealing element 37 being arranged between the button 36 and the headphone attachment section 311. In some embodiments, the material of the sealing element 37 can be silicone, rubber, etc., but is not limited to this. This can both increase the water resistance of the headphone attachment section 311 in the area of ​​the button 36 and improve the tactile feedback of the button 36.

[0060] In some embodiments, when the core module 20 is arranged at one end of the earhook assembly 30 (specifically at the end where the headphone attachment section 311 is located) and the battery 60 is arranged at the other end of the earhook assembly 30 (specifically at the other end where the receiving compartment 313 is located), the conductor wire must pass at least through the area where the bending transition section 312 is located to facilitate the connection of the core module 20 to the battery 60 via the conductor wire. For this purpose, as shown in Fig. Figure 4 shows that the ear hook housing 31 is provided with a first groove 315 at least on one side of the headphone mounting section 311 and the bending transition section 312 that is close to the decorative support 321. This first groove 315 can serve for wire routing to facilitate the routing of the conductor wire within the ear hook housing 31. In some embodiments, one end of the first groove 315 communicates with the button counter hole 317, so that when the decorative support 321 is inserted into and secured in the first groove 315, the decorative support 321 can also cover the button counter hole 317 to facilitate the release of the button 36.

[0061] In this way, the decorative element 32 can not only decorate the ear hook housing 31 and conceal the conductor wire, but also conceal and trigger the button 36, thus enabling the decorative element 32 to perform four functions.

[0062] As in Fig. As shown in Figure 5, the first groove 315 can be subdivided into a first partial groove segment 3151 located at the bending transition section 312 and a second partial groove segment 3152 located at the headphone mounting section 311. In some embodiments, the depth of the first partial groove segment 3151 is greater than the depth of the second partial groove segment 3152, so that the first partial groove segment 3151 mainly serves for wire routing, while the second partial groove segment 3152, together with the first partial groove segment 3151, serves to accommodate the decorative support 321. In this case, the button counter hole 317 can be formed in the second partial groove segment 3152, that is, the projections of the two components on the headphone mounting section 311 overlap at least partially.In some embodiments, the first groove 315 can be further subdivided into a third partial groove segment 3153 located at the receiving compartment 313, and the recess 316 can be provided in the third partial groove segment 3153. In some embodiments, the depth of the second partial groove segment 3152 can be greater than the depth of the third partial groove segment 3153, so that the third partial groove segment 3153 mainly serves to receive the decorative strip 322. In other words, in addition to its positioning within the first partial groove segment 3151 and the second partial groove segment 3152, the decorative strip 322 can extend further into the third partial groove segment 3153.In this case, after the decorative support 321 is inserted into and secured in the first partial groove segment 3151, the side of the decorative support 321 facing away from the ear hook housing 31 can be substantially flush with the groove bottom of the third partial groove segment 3153, thus enabling the decorative strip 322 to lie flat against the headphone mounting section 311, the decorative support 321 and the receiving compartment 313; furthermore, the decorative support 321 can form a projection at a location of the second partial groove segment 3152 corresponding to the button counter hole 317.

[0063] As in Fig. As shown in Figure 6, the decorative support 321 can comprise a fastening section 3212 corresponding to the first partial groove segment 3151 and a pressure section 3213 corresponding to the second partial groove segment 3152. In some embodiments, the thickness of the fastening section 3212 is greater than the thickness of the pressure section 3213, so that the fastening section 3212 mainly serves to mount the decorative support 321 and the ear hook housing 31 to one another, while the pressure section 3213 mainly serves to trigger the button 36. In some embodiments, if the decorative support 321 is provided with the second groove 3211 on its side facing the ear hook housing 31, the second groove 3211 can be formed on the fastening section 3212.

[0064] As in Fig. 6 and Fig. As shown in Figure 7, the decorative support 321 can further comprise a connecting section 3214, which is connected between the mounting section 3212 and the pressure section 3213. In some embodiments, the connecting section 3214 extends away from the earpiece housing 31 in a curve relative to the mounting section 3212, while the pressure section 3213 extends in a curve relative to the connecting section 3214 toward the earpiece housing 31. In this case, the connecting section 3214 causes the pressure section 3213 to be cantilevered relative to the mounting section 3212, and a certain distance exists between the pressure section 3213 and the mounting section 3212. In some embodiments, the distance can be greater than or equal to the release stroke of the button 36.This can effectively improve the solution to the problem that the other end of the decorative support 321 lifts up when the user presses on one end of the decorative support 321 (specifically the end where the pressure section 3213 is located).

[0065] In some embodiments, a button projection 3215 may be provided on the side of the pressure section 3213 closest to the ear hook housing 31, so that when the pressure section 3213 is pressed by an external force, the button projection 3215 can trigger the button 36. In some embodiments, the projections of the button projection 3215 and the button 36 on the headphone mounting section 311 overlap at least partially, and the effective contact area between the button projection 3215 and the button 36 is smaller than the effective contact area between the pressure section 3213 and the button 36. This can facilitate the triggering of the button 36, especially if a sealing element 37 is provided between the button 36 and the headphone mounting section 311, since the sealing element 37 must first deform in order to trigger the button 36.Based on the relational expression F ∝ ε · S, the following applies: For the same external force F applied by the user, a smaller effective area S of the deformation zone of the sealing element 37 leads to a larger deformation ε of the sealing element 37, which in turn facilitates the release of the button 36. Obviously, the button projection 3215 can reduce the aforementioned effective area compared to the pressure section 3213.

[0066] In some embodiments, the decorative support 321 can be further provided with a stop section 3216 at an end located near the headphone mounting section 311. In some embodiments, the stop section 3216 serves to abut an inner surface of the headphone mounting section 311 facing away from the decorative support 321, in order to prevent the end of the decorative support 321 from lifting out of the first groove 315, particularly under the influence of external forces. As in Fig. As shown in Figure 7, the stop section 3216 can be specifically arranged at an end of the pressure section 3213 that is far removed from the mounting section 3212. In this case, the stop action between the stop section 3216 and the headphone mounting section 311 prevents the decorative support 321 from lifting due to excessive elastic rebound after deformation of the decorative support 321 by external pressure to trigger the button 36.

[0067] It will be reopened Fig. 2 or Fig. 6. The decorative support 321 can also be provided with an overlapping section 3217 at an end located near the receiving compartment 313 (that is, at the other end, which is far from the pressure section 3213). In some embodiments, the thickness of the overlapping section 3217 is less than the thickness of the fastening section 3212 in order to structurally avoid a stiffening structure of the ear-hook housing 21 (specifically between the bending transition section 312 and the receiving compartment 313).

[0068] As in Fig. As shown in Figure 8, the core module 20 can comprise a core housing 21 and a core 22. In some embodiments, one end of the core housing 21 is open, and the earhook housing 31 (specifically, the headphone attachment section 311) covers the open end of the core housing 21 to form a chamber structure for receiving the core 22. In this case, the earhook housing 31 acts as a lid for the core housing 21. Compared to the plug-in assembly method between an earhook structure and a core structure in related techniques, this assembly method, in which the earhook housing 31 covers the core housing 21, can improve the solution to the stress problem at the plug-in interface between the earhook structure and the core structure in related techniques, thereby increasing the reliability of the bone conduction headphone 10.

[0069] It should be noted that in Fig. 8 the ear hook housing is shown schematically, mainly to describe the relative positional relationship between the ear hook housing and the core housing and thereby implicitly to illustrate a possible assembly method between the ear hook housing and the core housing.

[0070] In some embodiments, the core 22 can be directly or indirectly fixed in the core housing 21, such that the core 22 generates vibrations when excited by electrical signals, thereby causing the core housing 21 to vibrate as well. When the user wears the bone conduction headphones 10, the skin contact area of ​​the core housing 21 (namely, the bottom wall 211 described below) can come into contact with the user's skin, allowing the aforementioned vibrations to be transmitted via the human skull bone to the auditory nerve, enabling the user to hear the sound played by the bone conduction headphones 10. In the embodiments of the present application, the core module 20 can further comprise a core support 23, the core support 23 serving to fix the core 22 in the core housing 21.

[0071] Generally, low frequency refers to sound with a frequency of less than 500 Hz, medium frequency to sound in the frequency range of 500 to 4000 Hz, and high frequency to sound with a frequency of more than 4000 Hz. In some embodiments, such as in Fig. As shown in Figure 9, the horizontal axis represents the frequency of the vibration (unit: Hz) and the vertical axis represents the intensity of the vibration (unit: dB). The high-frequency range (range with frequencies above 4000 Hz) has a first high-frequency valley V, a first high-frequency peak P1, and a second high-frequency peak P2. In some embodiments, the first high-frequency valley V and the first high-frequency peak P1 can be generated at high frequencies by deforming a non-skin-contacting area of ​​the core housing 21 (namely, the annular circumferential wall 212 described below), and the second high-frequency peak P2 can be generated at high frequencies by deforming the skin-contacting area of ​​the core housing 21. The frequency response curve in the frequency range of 500 to 6000 Hz is generally particularly critical for bone conduction headphones. In some embodiments, sharp peaks and valleys are undesirable in this frequency range.The flatter the frequency response curve, the better the sound quality of the bone conduction headphones. Generally speaking, the greater the stiffness, the less the structure deforms under stress, which also promotes the generation of higher-frequency resonances. Therefore, in most cases, product manufacturers increase the stiffness of the core housing 21 to shift the first high-frequency valley V, the first high-frequency peak P1, and the second high-frequency peak P2 toward a higher frequency range. In other words, the stiffness of the core housing 21 can be as high as possible to achieve better sound quality. To this end, the material of the core housing 21 in the embodiments of the present application can be, but is not limited to, a mixture of a material such as polycarbonate, polyamide, acrylonitrile butadiene styrene copolymer, etc., with glass fibers or carbon fibers.In some embodiments, the core housing material 21 can be made from a mixture of carbon fibers with polycarbonate in a specific ratio, or from a mixture of glass fibers with polycarbonate in a specific ratio, or from a mixture of glass fibers with polyamide in a specific ratio. In some other embodiments, the core housing material 21 can be made from a mixture of carbon fibers, glass fibers, and polycarbonate in a specific ratio. In some embodiments, the addition of different proportions of carbon fibers and / or glass fibers leads to different moduli of elasticity of the material, and the stiffness of the resulting core housing 21 also varies. For example, the modulus of elasticity of the material can reach 6 to 8 GPa when 20% to 50% glass fibers are added to the polycarbonate.

[0072] Based on the detailed description above, on the one hand, the earhook housing 31 (in particular the headphone attachment section 311) functions as part of the structure of the core module 20 to form the chamber structure for receiving the core 22; on the other hand, in some embodiments of the present application, the earhook housing 31 is generally made of a material with a soft texture to improve the wearing comfort of the bone conduction headphones, which results in a lower stiffness of the earhook housing 31.This means that when the earhook housing 31 covers the core housing 21 to form the chamber structure for receiving the core 22, the bone conduction headphones are susceptible to undesirable circumstances such as sound loss due to the lower stiffness of the earhook housing 31 (especially the headphone attachment section 311) compared to the stiffness of the core housing 21, which in turn affects user satisfaction.

[0073] The resonant frequency of a structure is generally related to its stiffness. For a given mass, the following applies: the greater the stiffness of the structure, the higher its resonant frequency. In some embodiments, the stiffness K of the structure depends on factors such as its material (specifically, its modulus of elasticity), the specific shape of the structure, and so on. Generally speaking, the following holds true: the greater the modulus of elasticity E of the material, the greater the stiffness K of the structure; the greater the thickness t of the structure, the greater the stiffness K of the structure; the smaller the area S of the structure, the greater the stiffness K of the structure. In this case, the above relationship can be simply described by the expression K ∝ (E · t) / S.Therefore, one of the methods—increasing the elastic modulus E of the material, increasing the thickness t of the structure, and decreasing the area S of the structure, or a combination thereof—can increase the stiffness K of the structure and thereby increase the resonance frequency of the structure.

[0074] In the embodiments of the present application, the earpiece housing 31 is generally made of a soft material (i.e., a material with a lower modulus of elasticity, such as polycarbonate, polyamide, etc., whose modulus of elasticity is usually 2 to 3 GPa), while the core housing 21 is generally made of a hard material (i.e., a material with a higher modulus of elasticity, such as polycarbonate with 20% to 50% glass fibers, whose modulus of elasticity can reach 6 to 8 GPa). Obviously, the difference in modulus of elasticity means that the stiffness of the earpiece housing 31 and the stiffness of the core housing 21 do not match, which in turn causes the susceptibility to the aforementioned sound losses.Additionally, after the earhook housing 31 is connected to the core housing 21, the difference in stiffness between the two components can easily cause the structure to resonate at relatively low frequencies. Therefore, in some embodiments, if the elastic modulus of the core housing 21 is greater than the elastic modulus of the earhook housing 31, the headphone attachment section 311 is provided with a reinforcing structure 318. In some embodiments, the reinforcing structure 318 can increase the stiffness of the headphone attachment section 311. In some embodiments, the reinforcing structure 318 can reduce the difference between the stiffness K1 of the skin contact area of ​​the core housing 21 and the stiffness K2 of the headphone attachment section 311.In some embodiments, the reinforcing structure 318 can cause the ratio of the difference between the stiffness K1 of the skin contact area of ​​the core housing 21 and the stiffness K2 of the headphone attachment section 311 to the stiffness K1 of the skin contact area of ​​the core housing 21 to be less than or equal to 30%. For example, the reinforcing structure 318 can cause the ratio of the difference between the stiffness K1 of the skin contact area of ​​the core housing 21 and the stiffness K2 of the headphone attachment section 311 to the stiffness K1 of the skin contact area of ​​the core housing 21 to be less than or equal to 20%. In another example, the reinforcement structure 318 can cause the ratio of the difference between the stiffness K1 of the skin contact area of ​​the core housing 21 and the stiffness K2 of the headphone attachment section 311 to the stiffness K1 of the skin contact area of ​​the core housing 21 to be less than or equal to 10%.In other words, (K1 - K2) / K1 ≤ 10% or K2 / K1 ≥ 90%. This not only ensures that the core housing 21 has sufficient stiffness so that its resonant frequency is in the highest possible frequency range, but also reduces the stiffness difference between the headphone mounting section 311 and the core housing 21, thus increasing the resonant frequency of the structure and improving the solution to the problem of the aforementioned sound losses.

[0075] In some embodiments, the core housing 21 can be spherical, ellipsoidal, or polyhedral. A portion of the core housing 21 can be used for contact with the user's skin. For example, if the core housing 21 is a polyhedron, one of its faces can be used for contact with the user's skin. In some embodiments, the core housing 21 can also have other irregular shapes. In some embodiments, the core housing 21 can be a one-piece molded structure. For example, the core housing 21 can be a one-piece structure manufactured by 3D printing. In some embodiments, the core housing 21 can be formed by separately molding several components and then snapping, welding, or bonding the several components together.

[0076] In some embodiments, such as in Fig. As shown in Figure 10, the core housing 21 can comprise a bottom wall 211 and an annular circumferential wall 212. In some embodiments, the bottom wall 211 is the skin contact area of ​​the core housing 21, and one end of the annular circumferential wall 212 is integrally connected to the bottom wall 211. In other words, the bottom wall 211 serves for contact with the user's skin. In some embodiments, the annular circumferential wall 212 can also come into contact with the user's skin. In some embodiments, the bottom wall 211 and the annular circumferential wall 212 can be connected to each other by, among other things, snapping, welding, or bonding. In some embodiments, the headphone mounting section 311 can comprise a mounting main body 3111 connected to the bending transition section 312 and an annular flange 3112 integrally connected to the mounting main body 3111 and extending toward the core housing 21.In some embodiments, the annular flange 3112 and the other end of the annular circumferential wall 212, which is far from the bottom wall 211, are connected to each other and can be joined together by gluing or a combination of gluing and snapping together.

[0077] It should be noted that in some embodiments the base wall 211 is one of the shapes such as triangle, trapezoid, rectangle, square, circle, ellipse, ellipse-like shape (similar to the one in Fig. The headphone mounting section 311 shown in Figure 11 may have a shape, etc. In some embodiments, the annular circumferential wall 212 may be perpendicular to the base wall 211, that is, the area of ​​the open end of the core housing 21 is equal to the area of ​​the base wall 211; the annular circumferential wall 212 may also be inclined outwards at an angle (e.g., an angle of inclination of less than or equal to 30°) relative to the base wall 211, that is, the area of ​​the open end of the core housing 21 is larger than the area of ​​the base wall 211. In some embodiments, it is assumed by way of example that the base wall 211 is ellipsoidal and that the annular circumferential wall 212 is inclined outwards at 10° relative to the base wall 211.This reduces the area of ​​the bottom wall 211, provided that a certain level of wearing comfort is ensured (since the bottom wall 211, as the skin contact area of ​​the core housing 21, comes into contact with the user's skin and its area should not be too small), which can increase the resonance frequency of the core housing 21.

[0078] As in Fig. As shown in Figure 10(a), the reinforcement structure 318 can comprise an arcuate structure arranged between the main mounting body 3111 and the annular flange 3112; that is, it is chamfered. In some embodiments, the dimension of the annular flange 3112 in the thickness direction of the headphone mounting section 311 is generally small, so that the annular flange 3112 and the aforementioned arcuate structure can be formed as a single piece. In this case, the structure of the headphone mounting section 311 can comprise only the main mounting body 3111 and the reinforcement structure 318 with the arcuate structure.This causes the aforementioned arc-shaped structure to reduce the effective area of ​​the headphone mounting section 311, which can increase the stiffness of the headphone mounting section 311 and thereby reduce the stiffness difference between the headphone mounting section 311 and the core housing 21. It should be noted that the dimensions of the aforementioned arc-shaped structure can be appropriately designed according to the stiffness requirements of the headphone mounting section 311, and there are no restrictions on this here.

[0079] In some embodiments, the materials of the main mounting body 3111 and the annular flange 3112 can be the same or different. In some embodiments, the material of the arc-shaped structure can be identical to the material of the main mounting body 3111 or the annular flange 3112. In some other embodiments, the material of the arc-shaped structure can be different from the materials of the main mounting body 3111 and the annular flange 3112. By way of example only, the arc-shaped structure can also be made of one of the materials polycarbonate, polyamide, acrylonitrile butadiene styrene copolymer and metal, or a combination thereof.

[0080] As in Fig. As shown in Figure 10(b), the reinforcing structure 318 can be a thickening layer formed integrally with the main mounting body 3111, i.e., a thickening occurs. In some embodiments, the material of the thickening layer can be identical to the material of the ear hook housing 31. For example, the thickening layer is also made of one of the materials polycarbonate, polyamide, and acrylonitrile butadiene styrene copolymer, or a combination thereof. It should be noted that the reinforcing structure 318 can be located on one side of the main mounting body 3111 that is close to the core housing 21, on the other side of the main mounting body 3111 that is away from the core housing 21, or, of course, on both sides of the main mounting body 3111.In some embodiments, the dimension of the annular flange 3112 in the thickness direction of the headphone mounting section 311 is generally small, so that the annular flange 3112 and the aforementioned thickening layer can be formed as a single piece. In this case, the structure of the headphone mounting section 311 can comprise only the main mounting body 3111 and the reinforcing structure 318 designed as a thickening layer. This causes the aforementioned thickening layer to increase the effective thickness of the headphone mounting section 311, which can increase the stiffness of the headphone mounting section 311 and thereby reduce the stiffness difference between the headphone mounting section 311 and the core housing 21.It should be noted that the dimensions of the above-mentioned thickening layer can be appropriately designed according to the stiffness requirements of the headphone mounting section 311, to which there are no restrictions here.

[0081] In some other embodiments, the reinforcing structure 318 can be a metal component. In some embodiments, the material of the metal component can be, but is not limited to, aluminum alloy, magnesium alloy, titanium alloy, nickel alloy, chromium-molybdenum steel, stainless steel, etc., or a combination thereof. In this case, the reinforcing structure 318 and the headphone mounting section 311 can be formed as a single component by injection molding with metal inserts. This allows the metal component to effectively increase the stiffness of the headphone mounting section 311 and thereby reduce the stiffness difference between the headphone mounting section 311 and the core housing 21. It should be noted that parameters such as material, dimensions, etc.the above-mentioned metal component can be appropriately designed in accordance with the stiffness requirements of the headphone mounting section 311, to which there are no restrictions here.

[0082] In some embodiments, the reinforcement structure 318 can comprise one or more reinforcement beams. The two ends of the reinforcement beam can each be connected to the main mounting body 3111 and the annular flange 3112, respectively. In some embodiments, one end of the reinforcement beam can be connected to a lateral surface of the main mounting body 3111. For example, the lateral surface of the main mounting body 3111 can be the lower surface of the main mounting body 3111, which is located in Fig. 10 (a) or (b) is shown; one end of the reinforcement beam can be connected to a lateral surface of the annular flange 3112. For example, the lateral surface of the annular flange 3112 can be the inner surface of the annular flange 3112, which is shown in Fig. 10 (a) or (b) is shown. In some embodiments, the angle between the reinforcing beam and the lower surface of the main mounting body 3111 or between the reinforcing beam and the inner surface of the annular flange 3112 can be between 30° and 60°. The reinforcing beam can be straight, serrated, corrugated, etc. The cross-section of the reinforcing beam can be rectangular, circular, triangular, irregularly shaped, etc.

[0083] In some other embodiments, such as in Fig. As shown in Figure 11, the reinforcement structure 318 can be configured as a reinforcing rib provided on the headphone mounting section 311. In some embodiments, the aforementioned reinforcing rib is distributed mainly on a side of the headphone mounting section 311 that is close to the core housing 21. In some embodiments, the reinforcing rib can be present multiple times, with the multiple reinforcing ribs arranged side by side, as shown in Figure 11. Fig. 11 (a) and (b) shown, or may be arranged in a grid pattern, as in Fig. 11 (c) shown; the multiple reinforcing ribs can also be arranged radially centered around a predefined reference point on the headphone mounting section 311, as shown in Fig. Figure 11(d) shows that in some embodiments, the material of the reinforcing ribs can be identical to the material of the ear hook housing 31. For example, the reinforcing ribs are made of one of the materials polycarbonate, polyamide, and acrylonitrile butadiene styrene copolymer, or a combination thereof. This means that, compared to the embodiment in which a metal component is provided on the headphone mounting section 311 by injection molding or the headphone mounting section 311 is directly thickened, providing the reinforcing ribs on the headphone mounting section 311 not only increases the stiffness of the headphone mounting section 311, but also allows the weight of the headphone mounting section 311 to be taken into account.

[0084] In some embodiments, such as in Fig. As shown in 11, the headphone mounting section 311 can have a direction of the long axis (that is, the one shown by the dashed line X in Fig. 11 (indicated direction) and a direction of the short axis (depicted by the dashed line Y in Fig. 11 (indicated direction). In some embodiments, the dimension of the headphone mounting section 311 in the direction of the long axis may be larger than its dimension in the direction of the short axis. The distribution of the reinforcing ribs is explained below by way of example:

[0085] As in Fig. As shown in Figure 11(a), the multiple reinforcing ribs can extend in a strip-like fashion along the long axis and be arranged side by side along the short axis. In this case, the reinforcing structure 318 can simply be considered as reinforcing ribs along the long side of the headphone mounting section 311.

[0086] As in Fig. As shown in Figure 11(b), the multiple reinforcing ribs can extend in a strip-like fashion along the short axis and be arranged side by side along the long axis. In this case, the reinforcing structure 318 can simply be considered as the short-side reinforcing ribs of the headphone mounting section 311.

[0087] As in Fig. As shown in Figure 11(c), the multiple reinforcing ribs can extend along the long axis and the short axis to form a lattice shape. In this case, the reinforcing structure 318 can simply be considered as cross-shaped reinforcing ribs of the headphone mounting section 311.

[0088] As in Fig. As shown in Figure 11(d), the closely spaced ends of the multiple reinforcing ribs can be spaced apart from each other, with the extension lines of the multiple reinforcing ribs aligning with the predefined reference point (shown as a filled point O in Figure 11(d)). Fig. 11) can be cut. In this case, the reinforcement structure 318 can simply be considered as radial reinforcement ribs of the headphone mounting section 311.

[0089] In some embodiments, the lattice shape, when the multiple reinforcing ribs form the lattice shape, can be triangular, parallelogram-shaped, trapezoidal, regularly polygonal, spindle-shaped, or irregular, etc. In some embodiments, the reinforcing ribs can have different shapes. For example, the reinforcing ribs can be strip-shaped, plate-shaped, arc-plate-shaped, corrugated plate-shaped, cylindrical, ring-shaped, etc. The reinforcing structure 318 can comprise reinforcing ribs of a single shape or reinforcing ribs of different shapes.

[0090] In some embodiments, the reinforcement structure 318 can comprise an annular reinforcement rib and several strip-shaped reinforcement ribs. In some embodiments, the annular reinforcement rib can be arranged at a predefined position of the headphone mounting section 311, and the axis of the annular reinforcement rib can be perpendicular to the plane in which the reinforcement structure 318 is arranged on the headphone mounting section 311. The strip-shaped reinforcement ribs can be radially connected to the annular outer wall of the annular reinforcement rib. In some embodiments, the reinforcement structure 318 can comprise several annular reinforcement ribs and several strip-shaped reinforcement ribs.The multiple ring-shaped reinforcing ribs can be spaced apart from each other, and one or more plate-shaped reinforcing ribs can be arranged between each pair of ring-shaped reinforcing ribs, with the two ends of the plate-shaped reinforcing ribs each being connected to the ring-shaped outer wall of the ring-shaped reinforcing ribs.

[0091] In some embodiments, under the same conditions, the stiffness of the headphone mounting section 311 can be effectively increased while simultaneously taking its weight into account, provided the following dimensional relationships between the reinforcing ribs and the headphone mounting section 311 are satisfied. In some embodiments, the ratio of the thickness of the reinforcing rib to the thickness of the headphone mounting section 311 can lie within a closed interval of [0,6, 1,4]. For example, the ratio of the thickness of the reinforcing rib to the thickness of the headphone mounting section 311 can lie within a closed interval of [0,8, 1,2]. In another example, the thickness of the reinforcing rib can be equal to the thickness of the headphone mounting section 311.In some embodiments, the ratio of the width of the reinforcing rib to the thickness of the headphone mounting section 311 can lie within a closed interval of [0,3, 0,7]. For example, the ratio of the width of the reinforcing rib to the thickness of the headphone mounting section 311 can lie within a closed interval of [0,4, 0,6]. In another example, the width of the reinforcing rib can be half the thickness of the headphone mounting section 311. In some embodiments, the ratio of the spacing of the reinforcing ribs to the thickness of the headphone mounting section 311 can lie within the closed interval [1,2, 2,8]. For example, the ratio of the spacing of the reinforcing ribs to the thickness of the headphone mounting section 311 can lie within the closed interval [1,6, 2,4].In another example, the distance between the reinforcing ribs can be twice the thickness of the headphone mounting section 311. In some embodiments, it is assumed by way of example that the thickness of the headphone mounting section 311 is 0.8 mm and that the thickness, width, and distance between the reinforcing ribs are 0.8 mm, 0.4 mm, and 1.6 mm, respectively.

[0092] It should be noted that the in Fig. 10 and Fig. The 11 different reinforcement structures shown can be appropriately combined with one another according to the stiffness requirements of the headphone mounting section 311, to which there are no restrictions here.

[0093] As in Fig. As shown in Figure 12, curve (A+B) can represent that the material of the headphone mounting section 311 and the material of the core housing 21 are not identical (for example, the modulus of elasticity of the former is smaller than that of the latter) and the headphone mounting section 311 is not structurally improved; curve (B+B) can represent that the material of the headphone mounting section 311 and the material of the core housing 21 are identical (for example, their modulus of elasticity is the same) and the headphone mounting section 311 is structurally similar to the core housing 21 (for example, their thickness is the same and the area of ​​the headphone mounting section 311 is also equal to the area of ​​the bottom wall 211).In some embodiments, A can correspond to the headphone attachment section 311 and B can correspond to the bottom wall 211 (i.e., the skin contact area of ​​the core housing 21); (A+B) and (B+B) can structurally correspond to the embodiment in which the ear hook housing 31 (specifically the headphone attachment section 311) covers the core housing 21.

[0094] Out of Fig. From point 12, the following can be clearly concluded: For structure (A+B), its resonance valley (which can correspond to the first high-frequency valley V mentioned above) occurs at a frequency of approximately 5500 Hz; while for structure (B+B), its resonance valley (which can correspond to the first high-frequency valley V mentioned above) occurs at a frequency of approximately 8400 Hz. Obviously, the resonance frequency of the structure can be effectively increased if structure (A+B) is improved to structure (B+B).

[0095] In some embodiments, the reinforcement structure 318, such as the chamfer (fillet), is provided in the structure (A+B). Fig. 10 (a), the thickening in Fig. 10 (b), the reinforcing ribs long side (long-side) in Fig. 11 (a), the short-side reinforcing ribs in Fig. 11 (b), the cross-shaped reinforcing ribs (Cross) in Fig. 11 (c), the radial reinforcing ribs in Fig. 11 (d) etc. at the headphone mounting section 311, the resonance valley of (A+B + reinforcement structure) in the frequency range of 5500 to 8400 Hz. In other words, the provision of the reinforcement structure 318 at the headphone mounting section 311 actually contributes to increasing the resonance frequency of the structure, that is, reducing the stiffness difference between the headphone mounting section 311 and the core housing 21, and thereby improving the aforementioned sound losses. It should be noted that depending on the design of the reinforcement structure 318, the effect of increasing the resonance frequency varies, that is, the extent of the improvement in sound losses differs.In some embodiments, when the effectiveness of the reinforcement structure 318 in increasing the resonance frequency is ranked from extremely good to relatively good, the sequence is as follows: Cross-shaped reinforcement ribs > Short-side reinforcement ribs > Radial reinforcement ribs > Thickening > Long-side reinforcement rib > Chamfer.

[0096] Based on the detailed description above, the core 22, when stimulated by electrical signals, generates vibrations, causing the core housing 21 to vibrate in sympathetic motion. Thus, when the user wears the bone conduction headphones 10, the bottom wall 211 of the core housing 21 (i.e., the skin contact area) can come into contact with the user's skin. This allows the aforementioned vibrations to be transmitted via the skull bone to the auditory nerve, enabling the user to hear the sound played through the bone conduction headphones 10. In order to ensure the reliability of the vibration transmission process, at least the core housing 21 must be able to resonate in sympathetic motion with the core 22. Therefore, it is necessary to secure the core 22 within the core housing 21.

[0097] As in Fig. 13 and Fig. As shown in Figure 8, one end of the core housing 21 is open, and the core support 23 and the core 22 are housed within the core housing 21. In some embodiments, the core support 23 serves to secure the core 22 within the core housing 21. In some embodiments, as in Figure 8, the core support 23 serves to secure the core 22 within the core housing 21. Fig. As shown in Figure 14, the core support 23 can comprise an annular support body 231 and a boundary structure arranged on the support body 231. The core 22 is suspended from the support body 231 to establish a rigid connection with the core housing 21. As shown in Fig. As shown in Figure 13, the boundary structure can form an interference fit with the core housing 21, such that the core support 23 extends in the circumferential direction of the support body 231 (indicated by arrow C in Figure 13). Fig. 14 (indicated direction) relative to the core housing 21 remains fixed. In some embodiments, the plane in which the support body 231 lies can be parallel to the plane of the bottom wall 211 to increase the fit of the two components and thereby improve the vibration transmission effect mentioned above. In this case, an adhesive such as structural adhesive, hot melt adhesive, cyanoacrylate adhesive, etc. (in Fig. (13 not shown) is provided. This allows the core support 23 and the core housing 21 to be mounted together by a combination of snap-fit ​​and adhesive bonding, effectively restricting the degrees of freedom between the core support 23 and the core housing 21. Of course, in some other embodiments, the core support 23 and the core housing 21 can also be directly bonded together. For example, the following applies: The provision of an adhesive such as structural adhesive, hot melt adhesive, cyanoacrylate adhesive, etc. (in Fig. 13 (not shown) between the support body 231 and the bottom wall 211 can also effectively restrict the degrees of freedom between the core support 23 and the core housing 21; this can additionally simplify the structure of the core housing 21.

[0098] As in Fig. As shown in Figure 13, the core housing 21 can further comprise a positioning pin 213 connected to the bottom wall 211 or the annular circumferential wall 212. As shown in Fig. As shown in Figure 14, the boundary structure can comprise a first boundary structure 232. In some embodiments, the first boundary structure 232 is provided with an insertion hole 233. In some embodiments, the positioning pin 213 is inserted into the insertion hole 233. This can effectively increase the precision of the assembly between the core support 23 and the core housing 21. In this case, the aforementioned adhesive can still be provided between the support body 231 and the bottom wall 211.

[0099] In some embodiments, such as in Fig. As shown in Figure 14, the boundary structure can further comprise a second boundary structure 234. The second boundary structure 234 is located in the circumferential direction of the support body 231 (indicated by arrow C in Figure 14). Fig. The second boundary structure 234 (in the direction shown in Figure 14) is arranged at a distance from the first boundary structure 232. In some embodiments, the second boundary structure 234 can abut the annular circumferential wall 212, which is described in detail in the following sections. This allows the second boundary structure 234 and the first boundary structure 232 to each interact with the corresponding structure of the core housing 21 to hold the core support 23 relative to the core housing 21, that is, to effectively restrict the degrees of freedom between the core support 23 and the core housing 21.

[0100] As in Fig. As shown in Figure 8, the open end of the annular circumferential wall 212 has a direction of the long axis (shown by the dashed line X in Figure 8). Fig. 8 (indicated direction) and a direction of the short axis (depicted by the dashed line Y in Fig. 8 (indicated direction). In some embodiments, the dimension of the open end of the annular circumferential wall 212 can be larger in the direction of the long axis than in the direction of the short axis. In some embodiments, as in Fig. As shown in Figure 15, the first boundary structure 232 and the second boundary structure 234 are spaced apart from each other in the direction of the long axis and arranged on two opposite sides of the support body 231, and the projections of the first boundary structure 232 and the second boundary structure 234 onto the reference plane in which the open end of the annular perimeter wall 212 is located (defined by the dashed rectangular frame in Figure 15) are shown. Fig. The elements shown in Figure 15 lie at least partially outside the projection of the support body 231 onto the reference plane. This facilitates the interaction of the first boundary structure 232 with the positioning pin 213 and the second boundary structure 234 with the annular circumferential wall 212.

[0101] As in Fig. As shown in Figure 14, the first boundary structure 232 can comprise a first axial extension section 2321 and a first radial extension section 2322. In some embodiments, the first axial extension section 2321 is connected to the support body 231 and extends in the axial direction of the support body 231 (indicated by the dashed line Z in Figure 14). Fig. 14 (indicated direction) towards the core 22; the first radial extension section 2322 is connected to the first axial extension section 2321 and extends in the radial direction of the support body 231 (namely, the direction of the diameter of the support body 231) towards the outside of the support body 231. In this case, the insertion hole 233 is formed in the first radial extension section 2322 as shown in Fig. Figures 13 to 15 are shown to facilitate the interaction of the first boundary structure 232 with the positioning pin 213. In some embodiments, as in Fig. As shown in Figure 14, the second boundary structure 234 can comprise a second axial extension section 2341 and a second radial extension section 2342. In some embodiments, the second axial extension section 2341 is connected to the support body 231 and extends in the axial direction of the support body 231 toward the core 22; the second radial extension section 2342 is connected to the second axial extension section 2341 and extends in the radial direction of the support body 231 toward the outside of the support body 231. In this case, the second radial extension section 2342 abuts the annular circumferential wall 212, as shown in Figure 14. Fig. 13 and Fig. Figure 15 shows, for example, that the two components can be snapped together to create a connection between the second boundary structure 234 and the annular circumferential wall 212. This results, as shown in Fig. Figure 13 shows that the core 22 is positioned between the first axial extension section 2321 and the second axial extension section 2341.

[0102] It should be noted that, as in Fig. Figures 13 to 15 show, with reference to the core 22, where the area between the first axial extension section 2321 and the second axial extension section 2341 is considered the inside of the support body 231, and the area outside this inside can be considered the outside of the support body 231.

[0103] It will be revisited Fig. 13. The annular circumferential wall 212 can further comprise an inclined region 214 corresponding to the first boundary structure 232 and inclined relative to the base wall 211. In some embodiments, the positioning pin 213 can be located on the inclined region 214. This can reduce the effective distance between the first radial extension section 2322 and the base wall 211, that is, reduce the height of the positioning pin 213, and thereby increase the structural strength of the positioning pin 213 (in particular its base connected to the inclined region 214) on the core housing 21, in order to prevent the positioning pin 213 from exhibiting undesirable conditions such as breakage and detachment in extreme situations such as drops or collisions of the bone conduction headphones 10.

[0104] It will be revisited Fig. 15. The second boundary structure 234 can be provided in a quantity of two, and the two second boundary structures are spaced apart from each other in the direction of the short axis. In some embodiments, the projection of the first boundary structure 232 onto the reference plane and the projections of the two second boundary structures 234 onto the reference plane, when joined together, form an acute-angled triangle (as shown by the dashed triangle in Figure 1). Fig. (15 shown). In this case, the acute-angled triangle can specifically be an acute-angled isosceles triangle or an equilateral triangle. This ensures that the interaction points between the core support 23 and the core housing 21 are arranged as symmetrically as possible, thereby increasing the reliability of the assembly of the core support 23 and the core housing 21.

[0105] In some embodiments, the outer contour of the support body 231 can be circular, and the annular circumferential wall 212 can be provided with two opposing arcuate recesses 2121 along the short axis. In some embodiments, the outer contour of the support body 231 is recessed into the two arcuate recesses 2121. This can further restrict the degrees of freedom between the core support 23 and the core housing 21.

[0106] Based on the detailed description above, if the elastic modulus of the core housing 21 is greater than the elastic modulus of the ear hook housing 31, the structure (A+B) mentioned above is formed after the connection of the ear hook housing 31 with the core housing 21. Due to the stiffness difference, the resonant frequency of the structure (A+B) can be relatively low (as shown by the curve (A+B) in Fig. (shown in Figure 16) and the aforementioned sound losses can easily occur; whereas after improving structure (A+B) to structure (B+B), the resonance frequency of the structure can be effectively increased (as shown by the curve (B+B) in Figure 16). Fig. 12). Based on this, the relevant structures of the core module 20 are improved in the present embodiment.

[0107] As in Fig. As shown in Figure 16, the core module 20 can further comprise a cover plate 24. In some embodiments, one end of the core housing 21 is open, and the cover plate 24 covers the open end of the core housing 21 to form a chamber structure for receiving the core 22. In some embodiments, the cover plate 24 can cover the other end of the annular circumferential wall 212, which is farther from the bottom wall 211 and is opposite the bottom wall 211. In this case, the cover plate 24 and the core housing 21 can be connected to each other by gluing or a combination of snap-fit ​​and gluing. In some embodiments, the ear hook housing 31 is connected to the cover plate 24. For example, the headphone attachment section 311 completely or partially covers one side of the cover plate 24 facing away from the core housing 21.In some embodiments of the present application, it is assumed by way of example that the headphone attachment section 311 completely covers the cover plate 24. In this case, the ear hook housing 31 and the core housing 21 can still be joined to each other by gluing or a combination of snap-fit ​​and gluing.

[0108] In some embodiments, the shape of the cover plate 24 can match the shape of the opening of the open end of the core housing 21, so that the cover plate 24 can completely cover the opening of the open end of the core housing 21. In some embodiments, the cover plate 24 can cover only part of the opening of the open end of the core housing 21, while the other part of the opening can be covered by the ear hook housing 31 (such as the headphone attachment section 311). In some embodiments, the cover plate 24 and the core housing 21 can also be connected to each other by threaded connection or welding, etc. In some embodiments, the ear hook housing 31 and the core housing 21 can also be connected to each other by threaded connection or welding, etc.

[0109] It should be noted that in Fig. 16 the ear hook housing is shown schematically, mainly to describe the relative positional relationship between the ear hook housing and the cover plate and thereby implicitly to illustrate a possible mounting method between the ear hook housing and the cover plate.

[0110] In some embodiments, the elastic modulus of the core housing 21 is greater than the elastic modulus of the ear hook housing 31, and the elastic modulus of the cover plate 24 is greater than the elastic modulus of the ear hook housing 31. In this case, using the cover plate 24 instead of the headphone attachment section 311 to connect to the core housing 21 helps to increase the stiffness of the structure at the open end of the core housing 21 (specifically the cover plate 24 and the headphone attachment section 311) and thereby reduces the difference between the stiffness of the bottom wall 211 of the core housing 21 and the stiffness of the structure at its open end.This not only ensures that the core housing 21 has sufficient rigidity so that its resonant frequency is in the highest possible frequency range, but also contributes to increasing the resonant frequency of the structure (core housing 21 + cover plate 24 + headphone mounting section 311) and helps to improve the aforementioned sound losses.

[0111] In some embodiments, the ratio of the difference between the stiffness K4 of the core housing 21 and the stiffness K3 of the cover plate 24 to the stiffness K4 of the core housing 21 can be less than or equal to 30%. That is, (K4 - K3) / K4 ≤ 30% or K3 / K4 ≥ 70%. For example, the ratio of the difference between the stiffness K4 of the core housing 21 and the stiffness K3 of the cover plate 24 to the stiffness K4 of the core housing 21 can be less than or equal to 20%. That is, (K4 - K3) / K4 ≤ 20% or K3 / K4 ≥ 80%. In another example, the ratio of the difference between the stiffness K4 of the core housing 21 and the stiffness K3 of the cover plate 24 to the stiffness K4 of the core housing 21 can be less than or equal to 10%. That is, (K4 - K3) / K4 ≤ 10% or K3 / K4 ≥ 90%.In some embodiments, the stiffness of a specific part of the core housing 21 can be used to represent the stiffness K4 of the core housing 21. For example, the stiffness of the part of the core housing 21 in contact with the skin can be used to represent the stiffness K4 of the core housing 21. By way of example only, if the core housing 21 comprises a bottom wall 211 and an annular circumferential wall 212, the stiffness K1 of the bottom wall 211 can be used to represent the stiffness K4 of the core housing 21. In the embodiments described below, the stiffness K1 of the bottom wall 211 is mainly used as an example to represent the stiffness of the core housing 21 for illustrative purposes.

[0112] In some embodiments, the modulus of elasticity of the cover plate 24 can be less than or equal to the modulus of elasticity of the core housing 21. For example, the modulus of elasticity of the cover plate 24 can be equal to the modulus of elasticity of the core housing 21. In this case, after the cover plate 24 is joined to the core housing 21, a structure similar to the structure (B+B) mentioned above can be formed. This can result in the ratio of the difference between the stiffness K1 of the bottom wall 211 and the stiffness K3 of the cover plate 24 to the stiffness K1 of the bottom wall 211 being less than or equal to 10%. That is, (K1 - K3) / K1 ≤ 10% or K3 / K1 ≥ 90%.

[0113] In some embodiments, the area of ​​the base wall 211 can be greater than, less than, or equal to the area of ​​the cover plate 24. In some embodiments, the thickness of the base wall 211 can be greater than, less than, or equal to the area of ​​the cover plate 24. The specific relationships between the area and thickness of the base wall 211 and the cover plate 24 can be determined based on the design of the stiffness of the base wall 211 and the stiffness of the cover plate 24.

[0114] In some embodiments, the area of ​​the bottom wall 211 is less than or equal to the area of ​​the cover plate 24, and the thickness of the bottom wall 211 is less than or equal to the thickness of the cover plate 24. Based on the detailed description above, and provided that a certain level of wearing comfort is ensured, reducing the area of ​​the bottom wall 211 can increase the resonant frequency of the core housing 21. Therefore, in some embodiments, to ensure that the core housing 21 has sufficient stiffness so that its resonant frequency lies in the highest possible frequency range, the area of ​​the bottom wall 211 can be less than or equal to the area of ​​the cover plate 24; that is, the area of ​​the open end of the core housing 21 is larger than the area of ​​the bottom wall 211.In some embodiments, according to the above-mentioned relation expression K ∝ (E · t) / S, the thickness of the bottom wall 211 must be less than or equal to the thickness of the cover plate 24 in order to satisfy the above-mentioned relation expression (K1 - K3) / K1 ≤ 10% if the elastic modulus of the cover plate 24 is less than or equal to the elastic modulus of the core casing 21 and the area of ​​the bottom wall 211 is less than or equal to the area of ​​the cover plate 24.

[0115] In some embodiments, the cover plate can consist of a mixture of one or more of the materials polycarbonate, polyamide and acrylonitrile butadiene styrene with glass fibers and / or carbon fibers.

[0116] In some embodiments, the material of the cover plate 24 can be identical to the material of the core housing 21. For example, both the material of the cover plate 24 and the material of the core housing 21 can be a mixture of polycarbonate with glass fibers and / or carbon fibers. In some embodiments, in order to ensure that the stiffness K1 of the core housing 21 is greater than the stiffness K3 of the cover plate 24, the glass fiber and / or carbon fiber content of the core housing 21 (e.g., the bottom wall 211) can be higher than the glass fiber and / or carbon fiber content of the cover plate 24. In some embodiments, according to the above-mentioned relation expression K ∝ (E · t) / S, in order to satisfy the above-mentioned relation expression K3 / K1 ≥ 90%, the ratio of the thickness-to-area ratio of the cover plate 24 to the thickness-to-area ratio of the bottom wall 211 must be greater than or equal to 90%.For example, the ratio of the thickness to the area of ​​the bottom wall 211 is equal to the ratio of the thickness to the area of ​​the cover plate 24.

[0117] It should be noted that, according to the above-mentioned relationship expression K ∝ (E · t) / S, in order to satisfy the above-mentioned relationship expression (K1 - K3) / K1 ≤ 10%, the structural parameters (e.g., thickness, area, and their ratio) of the cover plate 24 and the core housing 21 can be designed based on the materials of the cover plate 24 and the core housing 21, or the materials of the cover plate 24 and the core housing 21 can be selected based on the structural parameters of the cover plate 24 and the core housing 21. Therefore, the above-mentioned embodiments only provide two possible design approaches by way of example.

[0118] Based on the preceding detailed description, after the cover plate 24 has been connected to the core housing 21 in place of the headphone mounting section 311, the headphone mounting section 311 must still be connected to the side of the cover plate 24 facing away from the core housing 21. For example, the headphone mounting section 311 can completely cover the cover plate 24. In another example, the headphone mounting section 311 can partially cover the cover plate 24 (that is, the headphone mounting section 311 covers only part of the cover plate 24).

[0119] In some embodiments, if both the earpiece housing 31 and the cover plate 24 are plastic parts and the elastic modulus of the former is smaller than that of the latter, the two components can be molded as a single piece by two-component injection molding. If the earpiece housing 31 is a plastic part while the cover plate 24 is a metal part and the elastic modulus of the former is smaller than that of the latter, the two components can be molded as a single piece by injection molding with metal inserts. In this case, the earpiece housing 31 and the cover plate 24 are joined as a whole to the core housing 21. This can ensure good vibration consistency between the earpiece housing 31 and the cover plate 24; however, it will also be difficult to provide the aforementioned button or a second sound transmitter described below between the earpiece housing 31 and the cover plate 24.

[0120] In some embodiments, the headphone mounting section 311 and the cover plate 24 can also be manufactured as a single piece by 3D printing, etc. In some embodiments, the headphone mounting section 311 and the cover plate 24 can be connected to each other by threaded connection or welding, etc. In some embodiments, the headphone mounting section 311 and the cover plate 24 are connected to each other by adhesive bonding or a combination of snap-fit ​​and adhesive bonding. In this case, the previously mentioned button or a second sound transmitter described below can still be provided between the ear hook housing 31 and the cover plate 24, the specific structure being described in detail below. In some embodiments, the fill level of the adhesive provided between the headphone mounting section 311 and the cover plate 24 (in Fig. (16 not shown) should be as large as possible in relation to the gap between them, for example, greater than or equal to 90%. If the fill level of the adhesive provided between the headphone mounting section 311 and the cover plate 24 is low in relation to the gap between them, not only is the bond strength between the headphone mounting section 311 and the cover plate 24 difficult to guarantee, but the vibrations of the two components may also be significantly delayed, and air may be trapped between the two components, negatively affecting the resonant frequency of the structure. That is, the beneficial effect of the improvement of structure (A+B) to structure (B+B) described above is difficult to guarantee, and additionally, unwanted noise may occur during the vibration process of the structure.

[0121] In some embodiments, the fill level of the aforementioned adhesive between the headphone mounting section 311 and the cover plate 24 can be defined as the ratio of the volume occupied by the adhesive to the volume of the space between the headphone mounting section 311 and the cover plate 24. In some embodiments, the fill level of the adhesive provided between the headphone mounting section 311 and the cover plate 24 is greater than or equal to 80% with respect to the space between them. In some other embodiments, the fill level of the adhesive provided between the headphone mounting section 311 and the cover plate 24 is greater than or equal to 90% with respect to the space between them.

[0122] Furthermore, under identical conditions in some embodiments, such as in Fig. Figure 17 shows that the use of different types of adhesives (e.g., structural adhesive, hot melt adhesive, superglue, silicone, etc.) between the headphone mounting section 311 and the cover plate 24 has a significant effect on the resonant frequency of the structure. In some embodiments, this can result in Fig. 17. The following can be clearly concluded: Different types of adhesives do indeed influence the resonant frequency of the structure; if the beneficial effects of the aforementioned adhesives on the resonant frequency are sorted in descending order, the order is as follows: structural adhesive > hot melt adhesive > cyanoacrylate adhesive > silicone. It should be noted that since silicone is generally soft, its beneficial effect on the resonant frequency of the structure is the weakest. Therefore, when considering the resonant frequency of the structure, an adhesive of higher hardness may be used between the headphone mounting section 311 and the cover plate 24.

[0123] Based on the detailed description above, the core support 23 can serve, on the one hand, to secure the core 22 in the core housing 21 in order to increase the reliability of the sympathetic vibration of the core housing 21 driven by the core 22; on the other hand, the cover plate 24 can serve to increase the stiffness of the structure at the open end of the core housing 21 (specifically the cover plate 24 and the headphone mounting section 311) in order to reduce the difference between the stiffness of the bottom wall 211 of the core housing 21 and the stiffness of the structure at its open end. In some embodiments, the fit between the core support 23 and the core housing 21 (particularly in the Z-direction mentioned above) can be achieved by bonding the support body 231 and the bottom wall 211 together; and / or by snapping the boundary structure and the annular circumferential wall 212 together.In some embodiments, a further inventive concept for the fit between the core support 23 and the core housing 21 (particularly in the Z direction mentioned above) is provided based on the cover plate 24.

[0124] As in Fig. 18 and Fig. As shown in Figure 19, the cover plate 24 covers the open end of the core housing 21, and a clamping structure is also provided on one side of the cover plate 24 facing the core housing 21. In some embodiments, the clamping structure serves to clamp the core support 23 firmly into the core housing 21. This means that the cover plate 24 not only increases the rigidity of the structure at the open end of the core housing 21 (specifically the cover plate 24 and the headphone mounting section 311), but can also clamp the core support 23 firmly into the core housing 21, thus enabling the cover plate 24 to fulfill two functions.

[0125] As in Fig. As shown in Figure 19, the cover plate 24 can comprise a cover plate main body 241 and a pressure structure integrally connected to the cover plate main body 241. In some embodiments, the pressure structure can comprise a first pressure column 242 and a second pressure column 243, wherein the first pressure column 242 and the second pressure column 243 are spaced apart from each other in the circumferential direction of the cover plate main body 241 and bear against the core support 23.In some embodiments, the plane in which the main body of the cover plate 214 lies can be parallel to the plane of the base wall 211, so that the plane of the main body of the cover plate 214 can be parallel to the plane of the support body 231, and thus the directions of extension of both the first pressure column 242 and the second pressure column 243 can be perpendicular to the plane of the support body 231, that is, the directions of extension of both the first pressure column 242 and the second pressure column 243 can be parallel to the aforementioned Z-direction. This can effectively restrict the degrees of freedom between the core support 23 and the core housing 21, particularly in the aforementioned Z-direction.

[0126] As in Fig. As shown in Figure 20, the cover plate 24 can indicate a direction of the long axis (defined by the dashed line X in Figure 24). Fig. 20 (indicated direction) and a direction of the short axis (depicted by the dashed line Y in Fig. 20 (indicated direction). In some embodiments, the dimension of the cover plate 24 in the direction of the long axis can be larger than its dimension in the direction of the short axis. In this case, the first pressure column 242 and the second pressure column 243 are spaced apart from each other in the direction of the long axis. This increases the reliability with which the cover plate 24 presses the core support 23 into the core housing 21.

[0127] In some embodiments, two second pressure columns 243 may be present, spaced apart from each other in the direction of the short axis. In some embodiments, the projection of the first pressure column 242 onto the cover plate main body 241 and the projections of the two second pressure columns 243 onto the cover plate main body 241, when joined together, form an acute-angled triangle (as shown by the dashed triangle in Figure 1). Fig. (20 shown). In this case, the acute-angled triangle can specifically be an acute-angled isosceles triangle or an equilateral triangle. This ensures that the interaction points between the cover plate 24 and the core support 23 are arranged as symmetrically as possible, thereby increasing the reliability with which the cover plate 24 presses the core support 23 into the core housing 21.

[0128] It will be reopened Fig. 18. The first pressure column 242 is in contact with and abuts the first boundary structure 232, and the second pressure column 243 is in contact with and abuts the second boundary structure 234. In this case, the second boundary structure 232 and the annular circumferential wall 212 do not need to interact in abutting position, as shown in Fig. 13 shows how this reduces the machining accuracy of the second boundary structure 232 and thereby lowers the manufacturing costs of the core support 23.

[0129] Similarly, as in Fig. As shown in Figure 14, the first boundary structure 232 can comprise the first axial extension section 2321 and the first radial extension section 2322. In some embodiments, the first axial extension section 2321 is connected to the support body 231 and extends in the axial direction of the support body 231 (indicated by the dashed line Z in Figure 14). Fig. 14 (indicated direction) towards the core 22; the first radial extension section 2322 is connected to the first axial extension section 2321 and extends in the radial direction of the support body 231 (namely, the direction of the diameter of the support body 231) towards the outside of the support body 231. In this case, the insertion hole 233 is formed in the first radial extension section 2321, and the first pressure column 242 rests against the first radial extension section 2321, that is, the first radial extension section 2321 is pressed against it by the first pressure column 242. In some embodiments, as in Fig. As shown in Figure 14, the second boundary structure 234 can comprise the second axial extension section 2341 and the second radial extension section 2342. In some embodiments, the second axial extension section 2341 is connected to the support body 231 and extends in the axial direction of the support body 231 towards the core 22; the second radial extension section 2342 is connected to the second axial extension section 2341 and extends in the radial direction of the support body 231 towards the outside of the support body 231. In this case, the second pressure column 243 rests against the second radial extension section 2342, meaning that the two components are in contact with each other and are pressed against each other.

[0130] It should be noted that if two second pressure columns 243 are present, spaced apart from each other in the direction of the short axis, and the projection of the first pressure column 242 onto the cover plate main body 241 and the projections of the two second pressure columns 243 onto the cover plate main body 241, when connected together, form an acute-angled triangle, then two second boundary structures 234 may also be present, spaced apart from each other in the direction of the short axis and assigned to the respective second pressure columns 243.This ensures that when the first pressure column 242 rests against the first boundary structure 232 (specifically against the first radial extension section 2322), the two second pressure columns 243 can rest against the respective second boundary structures 234 (specifically against the second radial extension sections 2342), thereby increasing the reliability with which the cover plate 24 presses the core support 23 in the core housing 21.

[0131] It should be noted that, as in Fig. As shown in Figure 18, the first axial extension section 2321 and the second axial extension section 2341 extend towards the cover plate 24, while the first pressure column 242 and the second pressure column 243 extend towards the core housing 21. This allows the height of the first boundary structure 232 and the second boundary structure 234 relative to the support body 231, as well as the height of the first pressure column 242 and the second pressure column 243 relative to the cover plate main body 241, to each correspond to half the distance between the cover plate main body 241 and the support body 231.This prevents the first limiting structure 232 and the second limiting structure 234 from exhibiting undesirable conditions such as breakage and detachment in extreme situations such as falls or collisions of the bone conduction headphones 10 due to excessive height relative to the support body 231; or it prevents the first pressure column 242 and the second pressure column 243 from exhibiting undesirable conditions such as breakage and detachment in extreme situations such as falls or collisions of the bone conduction headphones 10 due to excessive height relative to the cover plate main body 241. This simultaneously takes into account the structural strength of the first limiting structure 232 and the second limiting structure 234 on the support body 231, as well as the structural strength of the first pressure column 242 and the second pressure column 243 on the cover plate main body 241.

[0132] It will be reopened Fig. 19. The first pressure column 242 is tubular in shape. In this case, as in Fig. As shown in Figure 18, the positioning pin 213 is not only inserted into the insertion hole 233 to increase the assembly accuracy between the core support 23 and the core housing 21; but is also inserted into the first pressure column 242 to increase the assembly accuracy between the cover plate 24 and the core housing 21.

[0133] As in Fig. As shown in Figure 21, the core module 20 can further comprise a first sound transducer 25 and a second sound transducer 26. In some embodiments, a chamber structure for receiving the core 22 is formed by the two components after the open end of the core housing 21 is covered by the cover plate 24. In this case, the first sound transducer 25 can be housed within the core housing 21, and the second sound transducer 26 can be arranged outside the core housing 21, so that the cover plate 24 separates the first sound transducer 25 from the second sound transducer 26, thereby preventing mutual interference between the two components (especially their rear sound chamber).This means that the cover plate 24 not only increases the rigidity of the structure at the open end of the core housing 21 (specifically, the cover plate 24 and the headphone mounting section 311) and presses the core support 23 into the core housing 21, but can also separate the first sound transducer 25 and the second sound transducer 26 from each other, thus enabling the cover plate 24 to perform three functions. In some embodiments, when the ear hook housing 31 covers the cover plate 24, that is, when the headphone mounting section 311 covers the side of the cover plate 24 facing away from the core housing 21, the second sound transducer 26 can be arranged between the cover plate 24 and the headphone mounting section 311.

[0134] In some embodiments, both the first sound transducer 25 and the second sound transducer 26 can be connected to the main control circuit board 50 to enable the transmission of the processed sound through the two components to the main control circuit board 50. In some embodiments, the first sound transducer 25 and the second sound transducer 26 can be designed as electrical, capacitive, piezoelectric, carbon, or semiconductor sound transducers, or as a combination thereof. Specifically, they can be electret or silicon sound transducers, the specific structure of which is understandable to those skilled in the art and is not described in detail here.In this case, the first transducer 25 and the second transducer 26 can be used to capture ambient noise from the wearer, enabling noise reduction for the bone conduction headphones 10 and thereby improving user satisfaction with the bone conduction headphones 10; they can also be used to capture the wearer's voice, allowing the bone conduction headphones 10 to simultaneously function as a loudspeaker and microphone, thus expanding the range of applications for the bone conduction headphones 10. Naturally, the first transducer 25 and the second transducer 26 can simultaneously capture the wearer's voice and ambient noise, enabling noise reduction in addition to the microphone function of the bone conduction headphones 10 and thereby improving user satisfaction with the bone conduction headphones 10.

[0135] As in Fig. As shown in Figure 21, an annular flange 215 is provided on the inside of the annular circumferential wall 212, and the first sound transducer 25 can be recessed into and attached to the annular flange 215. A sound transducer receiving recess 244 is formed on the side of the cover plate 24 (specifically, the main body of the cover plate 241) facing away from the core housing 21. The second sound transducer 26 can be arranged in the sound transducer receiving recess 244 and covered by the headphone mounting section 311 to reduce the overall thickness after the arrangement of the second sound transducer 26 between the cover plate 24 and the headphone mounting section 311, thereby increasing the structural feasibility and reliability of all three components. In other words, the first sound transducer 25 is attached to the annular circumferential wall 212, and the second sound transducer 26 is attached to the cover plate 24.In this case, a sound receiving hole (not marked in the figure) is typically formed in the annular circumferential wall 212 at a position corresponding to the first sound transducer 25, and a sound receiving hole (not marked in the figure) is also typically formed in the headphone mounting section 311 at a position corresponding to the second sound transducer 26, in order to facilitate the detection of the wearer's voice and / or ambient noise by the first sound transducer 25 and the second sound transducer 26. In some embodiments, the sound entry direction of the first sound transducer 25 can be parallel to the cover plate 24 or inclined relative to the cover plate 24, while the sound entry direction of the second sound transducer 26 can be perpendicular to the cover plate 24.This allows the first sound transducer 25 and the second sound transducer 26 to detect sound from different directions in order to improve the noise reduction and / or microphone effect of the bone conduction headphones 10 and thereby increase the user satisfaction of the bone conduction headphones 10.

[0136] In some embodiments, the first sound transducer 25 can be arranged on the annular circumferential wall by gluing, snapping, or threading, etc. In some embodiments, the second sound transducer 26 can be arranged between the cover plate 24 and the headphone mounting section 311. In some embodiments, the sound transducer receiving recess can be provided on the core housing 21. In some embodiments, a bore for routing a power cable can be provided in the cover plate 24. The power cable can be used for the second sound transducer 26 and the core 21.

[0137] It should be noted that, as a rule, the sound direction of the first sound transmitter 25 is perpendicular to the annular circumferential wall 212; and, based on the detailed description above, the plane of the cover plate 24 (specifically, the main body of the cover plate 214) can be parallel to the plane of the bottom wall 211, while the annular circumferential wall 212 can be perpendicular to the bottom wall 211 or inclined outwards relative to the bottom wall 211 at an angle (for example, an angle of inclination of less than or equal to 30°).Therefore, the sound entrance direction of the first sound transmitter 25 runs parallel to the cover plate 24 if the annular circumferential wall 212 is perpendicular to the bottom wall 211; if the annular circumferential wall 212 is inclined outwards at an angle relative to the bottom wall 211, the sound entrance direction of the first sound transmitter 25 is inclined relative to the cover plate 24 and both angles of inclination can be essentially the same.

[0138] In some embodiments, the projection of the second transducer 26 onto the cover plate 24 and the projection of the first transducer 25 onto the cover plate 24 can be offset from each other. This allows the first transducer 25 and the second transducer 26 to detect sound from different directions, thereby improving the noise reduction and / or microphone effect of the bone conduction headphones 10 and increasing user satisfaction with the bone conduction headphones 10. In some embodiments, the projection of the second transducer 26 onto the cover plate 24 can be positioned closer to the bending transition section 312 compared to the projection of the first transducer 25 onto the cover plate 24. This increases the relative distance between the first transducer 25 and the second transducer 26 and further enables the first transducer 25 and the second transducer 26 to detect sound from different directions.It should be noted that the greater the relative distance, the better.

[0139] It should be noted that under the in Fig. In the viewing angle shown in Figure 21, the first sound transducer 25 and the second sound transducer 26 are located on opposite sides of the cover plate 24, with the first sound transducer 25 at the rear of the cover plate 24, so that the projection of the first sound transducer 25 onto the cover plate 24 is not actually visible. Therefore, for the sake of simplicity, it is assumed here that the first sound transducer 25 and the second sound transducer 26 are located on the same side of the cover plate 24, and the projection of the first sound transducer 25 onto the cover plate 24 is shown by a dashed frame.

[0140] As in Fig. As shown in Figure 22, the cover plate 24 can indicate a direction of the long axis (defined by the dashed line X in Figure 22). Fig. 22 (indicated direction) and a direction of the short axis (depicted by the dashed line Y in Fig. 22 (indicated direction). In some embodiments, the dimension of the cover plate 24 in the direction of the long axis may be larger than its dimension in the direction of the short axis. In this case, the angle between the line connecting the projection of the second sound transmitter 26 on the cover plate 24 with the projection of the first sound transmitter 25 on the cover plate 24 (as indicated by the dashed line in Fig. (22 shown) and the direction of the long axis is less than 45°; for example, this angle can be less than or equal to 10°. In another example, the line connecting the projection of the second sound transducer 26 on the cover plate 24 with the projection of the first sound transducer 25 on the cover plate 24 can coincide with the direction of the long axis. This not only allows the projection of the second sound transducer 26 on the cover plate 24 and the projection of the first sound transducer 25 on the cover plate 24 to be offset from each other, but also increases the relative distance between the two components, thus enabling the first sound transducer 25 and the second sound transducer 26 to detect sound from different directions.In some embodiments, the projection of the second sound transmitter 26 onto the cover plate 24 can be arranged closer to the bending transition section 312 compared to the projection of the first sound transmitter 25 onto the cover plate 24.

[0141] Based on the detailed description above, the core 22 and the first sound transducer 25 can be arranged in the core housing 21, and the cover plate 24 can in turn cover the open end of the core housing 21. To facilitate wire routing, corresponding through-holes and grooves can be provided in the cover plate 24. As shown in Fig. 21 and Fig. As shown in Figure 16, the cover plate 24 is further provided with a cable entry hole 245. In some embodiments, since the projection of the second sound transmitter 26 on the cover plate 24 may be located closer to the bending transition section 312 compared to the projection of the first sound transmitter 25 on the cover plate 24, the cable entry hole 245 can be formed near the first sound transmitter 25. This allows the conductor wire (in Fig. 21 and Fig. (16 not shown), which connects the first sound transducer 25 to the main control circuit board 50, can run from the interior of the core housing 21 through the cable entry hole 245 to the side of the cover plate 24 facing away from the core housing 21 and can extend further through the cable channel in the bend transition section 312 into the receiving compartment 313. In this case, at least a portion of the conductor wire lies between the cover plate 24 and the headphone mounting section 311 at the cover plate 24 covered by the headphone mounting section 311 (the length of this portion can be at least equal to the straight-line distance of the cable entry hole 245 relative to the second sound transducer 26).

[0142] In some embodiments, such as in Fig. 21 and Fig. As shown in Figure 16, a wiring groove 246 can also be recessed on the side of the cover plate 24 facing away from the core housing 21. In some embodiments, one end of the wiring groove 246 can communicate with the cable entry hole 245, and the aforementioned conductor wire can still extend within the wiring groove 146. This reduces the overall thickness after the arrangement of part of the conductor wire between the cover plate 24 and the headphone mounting section 311, thereby increasing the structural feasibility and reliability of all three components.

[0143] It should be noted that after the conductor wire has been routed from inside the core housing 21 through the cable entry hole 245 and the wiring groove 246, adhesive can still be applied at least to both ends of the wiring groove 246 to fix the conductor wire relative to the cover plate 24 and thereby increase the structural compactness of the cover plate 24, the headphone mounting section 311, and the conductor wire. In some embodiments, in particular, applying adhesive to the cable entry hole 245 can further improve the gas tightness of the core module 20.

[0144] In some embodiments, such as in Fig. As shown in Figure 21, two adjacent routing grooves 216 can also be provided on the inside of the annular circumferential wall 212. The two routing grooves 216 can be located near the annular flange 215. In some embodiments, two solder points can be provided between a positive and a negative external conductor wire (in Fig. 21 not shown) and a positive or a negative terminal of the nucleus 22 (in Fig. 21 (not shown) are formed and housed in the two routing grooves 216. This prevents short circuits or other faults when soldering the positive or negative terminal of the core 22 to the positive or negative pole of the aforementioned conductor wire and thus increases the reliability of the wiring of the core 22.

[0145] In some other embodiments, if the bone conduction headphone 10 is further equipped with the button 36, as in Fig. As shown in Figure 4, a key receptacle can also be provided on the side of the cover plate 24 facing away from the core housing 21 (in Fig. (1 visible, but not marked) may be provided. In some embodiments, the button 36 is arranged in the button receptacle recess and is covered by the headphone mounting section 311. This reduces the overall thickness after the button 36 is positioned between the cover plate 24 and the headphone mounting section 311, thereby increasing the structural feasibility and reliability of all three components. In this case, the button receptacle recess resembles the sound transducer receptacle recess 244 mentioned above. In some embodiments, the button receptacle recess may be formed on the core housing 21. In some embodiments, a bore for routing a power cable may be provided in the cover plate 24. The power cable can be used to connect the button 36 to the core 21.

[0146] It should be noted that the in Fig. The mounting compartment 313 shown in section 2 can mainly serve to accommodate the main control circuit board 50, while the one in Fig. The mounting compartment 313 shown in Figure 4 can primarily serve to hold the battery 60. Therefore, both the first sound transmitter 25 and the second sound transmitter 26 can specifically be used in the Fig. The ear hook assembly 30 shown in Figure 2 can be assigned to facilitate the connection of the two components to the main control circuit board 50 and thereby shorten the wiring length. Additionally, due to the limited volume of the core module 20 and the ear hook assembly 30, arranging the button 36 together with the first sounder 25 and the second sounder 26 can lead to structural interference between all three components. Therefore, the button 36 can specifically be assigned to the ear hook assembly shown in Figure 2. Fig. 4 ear hook assembly 30 shown. In other words, the first sound transmitter 25 and the second sound transmitter 26 can be assigned to the right ear hook of the bone conduction headphones 10 if the button 36 is assigned to the left ear hook of the bone conduction headphones 10; conversely, if the button 36 is assigned to the right ear hook of the bone conduction headphones 10, the first sound transmitter 25 and the second sound transmitter 26 can be assigned to the left ear hook of the bone conduction headphones 10. In some embodiments, the following could be considered in the Fig. 8 shown core module 20, which does not have the in Fig. The cover plate 24 of the core module 20 shown in Figure 16 requires corresponding adjustments for the relevant structures, such as the first transducer 25, the second transducer 26, and the button 36. For example, the bone conduction headphone 10 may have only one first transducer 25 or one second transducer 26; alternatively, the bone conduction headphone 10 may still have both the first transducer 25 and the second transducer 26, with one transducer being assigned to the left earpiece of the bone conduction headphone 10 and the other to the right earpiece. In another example, the button 36 is specifically attached to the side of the headphone mounting section 311 closest to the housing 21.

[0147] As in Fig. As shown in Figure 23, the core 22 can comprise a magnetically conductive cover 221, a magnet 222, a magnetically conductive plate 223, and a coil 224. In some embodiments, the magnetically conductive cover 221 can comprise a base plate 2211 and an annular side plate 2212 integrally connected to the base plate 2211. In some embodiments, the magnet 222 can be arranged within the annular side plate 2212 and attached to the base plate 2211, and the magnetically conductive plate 223 can be attached to a side of the magnet 222 facing away from the base plate 2211. The coil 224 can be arranged in a magnetic gap 225 between the magnet 222 and the annular side plate 2212 and attached to the core support 23.In some embodiments, the magnetic gap between the magnet 222 and the annular side plate 2212 can be designated as m, where 1.0 mm ≤ m ≤ 1.5 mm applies in order to take into account both the movement requirements of the coil 224 and the compactness of the core 22.

[0148] It should be noted that the in Fig. 23 shown core both in Fig. 8 shown core module as well as the one in Fig. The core module shown in 16 can be assigned to it. In some embodiments, the core support is in Fig. 23 schematically represented, mainly to describe the relative positional relationship between the core support and the core, and thereby implicitly to illustrate a possible method for assembling the core support and the core together.

[0149] In some embodiments, the magnet 222 can be a metal alloy magnet, ferrite, etc. Specifically, the metal alloy magnet can consist of one of the following materials: neodymium-iron-boron, samarium-cobalt, aluminum-nickel-cobalt, iron-chromium-cobalt, aluminum-iron-boron, iron-carbon-aluminum, etc., or a combination thereof. The ferrite can be one of the following materials: barium ferrite, ferrite steel, magnesium-manganese ferrite, lithium-manganese ferrite, etc., or a combination thereof, but is not limited to these. In some embodiments, the magnet 222 has a magnetization direction to generate a relatively stable magnetic field.

[0150] The magnetically conductive cover 221 and the magnetically conductive plate 223 interact to primarily adapt the magnetic field generated by the magnet 222 and thereby increase the utilization rate of the magnetic field. In some embodiments, the magnetically conductive cover 221 and the magnetically conductive plate 223 can be made of paramagnetic materials such as metallic materials, metal alloys, metal oxide materials, amorphous metal materials, etc. Specifically, the aforementioned paramagnetic materials can be, but are not limited to, iron, iron-silicon alloys, iron-aluminum alloys, nickel-iron alloys, iron-cobalt alloys, low-carbon steel, silicon steel sheets, ferrites, etc.

[0151] This causes the coil 224 to be located in a magnetic field generated by the magnet 222, the magnetically conductive cover 221, and the magnetically conductive plate 223, and to be subjected to excitation by an electrical signal of ampere force. The coil 224 is driven by the ampere force, causing the core 22 to generate mechanical vibrations, and since the core 22 is fixed in the core housing 21 by the core support 23, the core housing 21 can vibrate along with it. In some embodiments, the resistance of the coil 224 can be 8 Ω to accommodate both the requirements for generating the ampere force and the circuit structure of the core 22.

[0152] Based on the detailed description above, the volume of the core housing 21 is generally limited and must accommodate at least components such as the core 22, the core support 23, and the first sound transducer 25. Although a greater amperage force can be achieved by increasing the size of the core 22 (for example, by increasing the volume of the magnet 222 and / or the number of turns of the coil 224) to better drive the core housing 21, this would also increase the weight and volume of the core module 20, which is detrimental to the lightweight design of the core module 20. For this reason, some embodiments of the present application have undergone extensive studies and optimized designs of the core 22 based on the amperage force formula F = BILsinθ.For example, parameter B can represent the strength of the magnetic field generated by the magnet 222, the magnetically conductive cover 221, and the magnetically conductive plate 223, and parameter L can represent the effective length of the coil 224 in this magnetic field; while parameter θ can represent the angle between the two (here, θ = 90° is assumed). In some embodiments, parameter I can represent the current in the coil 224 at a given time. Obviously, for a fully designed, manufactured, and assembled core 22, parameters B and L are usually relatively fixed values; while parameter I varies depending on the electrical signal input into the core 22. Therefore, the optimized design of the core 22 can be considered simply as an optimization of the force coefficient BL; and parameters B and L depend primarily on structural parameters such as shape, dimensions, etc.of the magnet 222, the magnetically conductive cover 221 and the magnetically conductive plate 223.

[0153] The following section explains in detail the influence of the structural parameters such as shape, dimensions, etc. of the magnet 222, the magnetically conductive cover 221 and the magnetically conductive plate 223 on the force coefficient BL:

[0154] In the embodiments described in the present application, the magnet 222 can be cylindrical. As in Fig. As shown in Figure 24, the abscissa represents the diameter φ of the magnet 222 and the ordinate represents the thickness t1 of the magnet 222. From this, the following can be clearly concluded: The larger the diameter φ of the magnet 222, the greater the value of the force coefficient BL; the greater the thickness t1 of the magnet 222, the greater the value of the force coefficient BL. In some embodiments, the value of the force coefficient BL must generally be greater than 1.3 so that the bone conduction headphones 10 can produce sufficient volume, that is, a sufficiently large amperage force to drive the coil 224 and thereby cause the core housing 21 to vibrate. However, taking into full consideration the weight and volume of the core module 20 (specifically the core 22), the diameter φ and the thickness t1 of the magnet 222 can satisfy the following relation expression: 10.5 mm ≤ φ ≤ 11.5 mm and 3.0 mm ≤ t1 ≤ 4.0 mm.In another example, the diameter φ of the magnet 222 can be 10.8 mm and the thickness t1 can be 3.5 mm.

[0155] In the embodiments of the present application, the diameter of the magnetically conductive plate 223 can be equal to the diameter of the magnet 222. The thickness of the magnetically conductive plate 223 can be equal to the thickness of the magnetically conductive cover 221. The magnetically conductive plate 223 and the magnetically conductive cover 221 can also be made of the same material. As in Fig. As shown in Figure 25, the abscissa represents the thickness t2 of the magnetically conductive cover 221, and the ordinate represents the force coefficient BL. From this, the following can be clearly concluded: Within a certain range, the value of the force coefficient BL increases with increasing thickness t2; however, for t2 > 0.8 mm, the changes in the value of the force coefficient BL are not significant, meaning that a further increase in the thickness t2 beyond t2 > 0.8 mm provides little benefit and instead increases the weight of the core 22. Therefore, taking into full consideration the value of the force coefficient BL (at least greater than 1.3) as well as the weight and volume of the core module 20 (specifically, the core 22), the thickness t2 of the magnetically conductive plate 223 and the magnetically conductive cover 221 can satisfy the following relationship: 0.4 mm ≤ t2 ≤ 0.8 mm. For example, the thickness t2 can be 0.5 mm.

[0156] In the embodiments of the present application, the annular side plate 2212 can also be cylindrical, and its diameter D can correspond to the sum of the diameter φ of the magnet 222 and twice the magnetic gap m, that is, D = φ + 2m. As in Fig. As shown in Figure 26, the abscissa represents the height h of the magnetically conductive cover 221 (specifically, the annular side plate 2212), and the ordinate represents the force coefficient BL. From this, the following can be clearly concluded: Within a certain range, the value of the force coefficient BL increases with increasing height h of the magnetically conductive cover 221; however, for h > 4.2 mm, the value of the force coefficient BL decreases progressively. Therefore, taking into account the value of the force coefficient BL (at least greater than 1.3) as well as the weight and volume of the core module 20 (specifically, the core 22), the height h of the magnetically conductive cover 221 can satisfy the following relation: 3.4 mm ≤ h ≤ 4.0 mm. For example, the height h of the magnetically conductive cover 221 can be 3.7 mm.

[0157] It will be reopened Fig. 1. The bone conduction headphone 10 can comprise two core modules 20. In some embodiments, one of the two core modules 20 can be assigned to the one described in Fig. 8 correspond to the core module shown, while the other corresponds to the one in Fig. The core module shown in Figure 16 may correspond to the core module shown. It should be noted that the specific structure of each of the core modules 20 may be identical or similar to that of one of the embodiments described above. Reference can be made to the detailed description of one of the embodiments mentioned above, which will not be discussed again here.

[0158] As in Fig. As shown in Figure 27, the polarities of the magnets 222 of the two core modules 20 are opposite on each side located near the bottom wall 211 of the respective core housing 21, so that the two core modules 20 can attract each other when the bone conduction headphones 10 are not being worn. This makes it easier for the user to store the bone conduction headphones 10. It should be noted that in some embodiments, the magnet 222 also serves to generate a magnetic field so that the coil 224 can produce vibrations when excited by an electrical signal. In this case, the magnet 222 can fulfill two functions.

[0159] In some embodiments, it is conceivable that the magnet 222 is not premagnetized before the assembly of the core module 20; instead, the core module 20 is placed as a whole in a magnetizing device after assembly to be magnetized, thereby acquiring magnetic properties to the magnet 222. In some embodiments, after the aforementioned magnetization treatment, the magnetic field directions of the magnets 222 of the two core modules 20 can be as shown in Fig. The magnet 222 is aligned as shown in Figure 27. This ensures that the magnet 222 is non-magnetic before assembly, so that the assembly of the core module 20 is not disrupted by magnetic forces. This increases the assembly efficiency and yield of the core module 20, thereby increasing the production capacity and cost-effectiveness of the bone conduction headphone 10.

[0160] As in Fig. As shown in Figure 28, the headband assembly 40 can comprise an elastic metal wire 41, a conductor wire 42, and an elastic sheathing body 43 that encloses the elastic metal wire 41 and the conductor wire 42. In some embodiments, the elastic sheathing body 43 and the conductor wire 42 are an extruded, one-piece structural component; the sheathing body 43 further forms a feedthrough channel (in Figure 28). Fig. 28 (not marked), in which the elastic metal wire 41 is inserted. For example, the feedthrough channel is formed during this extrusion process. In some embodiments, the material of the elastic metal wire 41 can be spring steel, titanium alloy, titanium-nickel alloy, chromium-molybdenum steel, etc., without limitation, and the material of the elastic sheathing body 43 can be polycarbonate, polyamide, silicone, rubber, etc., without limitation, to take into account both the wearing comfort and the structural rigidity of the headband assembly 40.

[0161] It should be noted that since the elastic metal wire 41 is inserted through the feedthrough channel in the sheathing body 43, the area in which the elastic metal wire 41 is located in Fig. 28 can simply be considered as the passage channel within the casing body 43.

[0162] In some embodiments, the diameter of the feedthrough channel in its natural state can be smaller than the diameter of the elastic metal wire 41, so that the elastic metal wire 41 can remain fixed relative to the elastic sheathing body 43 after insertion into the feedthrough channel. This prevents undesirable "pressing in" of the headband assembly 40 due to an excessively large gap between the elastic sheathing body 43 and the elastic metal wire 41, especially when the user presses on the headband assembly 40, and thereby increases the structural compactness of the headband assembly 40.

[0163] In some embodiments, the number of conductor wires 42 can be at least two. In some embodiments, each conductor wire 42 can comprise a metal wire and an insulating layer surrounding the metal wire (both in Fig. 28 not shown), whereby the insulating layer primarily serves for electrical insulation between the metal wires.

[0164] It should be noted that, as in Fig. 1, Fig. 2, Fig. 4, Fig. 8 and Fig. Figure 16 shows that the main control circuit board 50 and the battery 60 can each be arranged in two ear-hook assemblies 30 and that in Fig. 2 and Fig. The four ear hook assemblies 30 shown can each be assigned to the left or right ear hook of the bone conduction headphones 10. This means that not only must the main control circuit board 50 be connected to the battery 60 via the conductor wires 42 built into the rear cover assembly 40, but also the core module 20 (specifically its core 22) and the button 36, which is assigned to the (left) ear hook assembly 30 in Fig. 1 are also assigned to the main control circuit board 50 via the conductor wires 42 installed in the rear cover assembly 40, which are connected to the (right) ear hook assembly 30 in Fig. 1 is assigned, must be connected. Likewise, the core module 20 (specifically its core 22, the first sound transducer 25 and the second sound transducer 26), which is assigned to the (right) ear hook assembly 30 in Fig. 1 is assigned, furthermore via the conductor wires 42 installed in the rear cover assembly 40 with the battery 60, which is connected to the (left) ear hook assembly 30 in Fig. 1 is assigned, and must be connected. Therefore, the conductor wires must make 42 connections for at least the three circuits mentioned above.

[0165] Based on the detailed description above, the headband assembly 40 can be machined and manufactured according to the embodiments of the present application in accordance with the following procedure:

[0166] 1) Providing an extrusion device and a conductor wire.

[0167] On the one hand, raw materials for forming the elastic casing body 43 can be added to the extrusion device. In some embodiments, the raw materials of the elastic casing body 43 undergo at least the following phases during the extrusion process: melting and plasticizing, extrusion from a die of a machine head, shaping, cooling, and drawing.

[0168] On the other hand, the number of conducting wires 42 can be at least two to enable the connection between different electronic elements of the bone conduction headphone 10. In some embodiments, each conducting wire 42 can comprise a metal wire and an insulating layer surrounding the metal wire to provide electrical insulation between the metal wires.

[0169] 2) Arranging the conductor wires in the extrusion device so that the raw materials of the elastic sheathing body and the conductor wires form a corresponding first semi-finished product during the extrusion process.

[0170] In some embodiments, the extrusion device can draw the conductor wires 42 to allow the elastic sheathing body 43 to enclose the conductor wires 42 during the extrusion process. In some embodiments, the machine head of the extrusion device can be equipped with a mold core so that the aforementioned feedthrough channel can still be formed inside the elastic sheathing body 43 during the extrusion process. Therefore, the aforementioned first semi-finished product can specifically be a one-piece component consisting of the elastic sheathing body 43 and the conductor wires 42, wherein the sheathing body 43 has a feedthrough channel extending substantially in its axial direction.

[0171] 3) Cutting the aforementioned first semi-finished product according to the usage requirements of the headband assembly to form a second semi-finished product of the appropriate length.

[0172] In some embodiments, the actual length of the second semi-finished product may be slightly greater than its usable length for the headband assembly, meaning that the second semi-finished product still has a certain allowance at this point to allow for subsequent processing steps.

[0173] 4) Threading the single elastic metal wire into the feedthrough channel of the second semi-finished product to manufacture the back headband assembly.

[0174] In some embodiments, after step 4), not only must the headband assembly be formed into a curved structure with a specific shape to fit the back of the user's head, but the two ends of the headband assembly must also be treated accordingly to allow a structurally sound connection with the earpiece assemblies and to establish the circuit connection between the main control board, the battery, the button, the core, and the first and second sound transducers. Therefore, the headband assembly produced in step 4) is also essentially just a semi-finished product.

[0175] The process described above allows not only the production of a very long semi-finished product (specifically, a one-piece component consisting of the elastic sheathing body 43 and the conductor wires 42) in a single extrusion operation, but also the simultaneous formation of a feedthrough channel extending essentially in its axial direction within the sheathing body 43. This semi-finished product is then cut into small segments of appropriate length for subsequent processing steps, which can effectively increase the manufacturing efficiency of the headband assembly.

[0176] So far, only some embodiments of the present application have been explained, without limiting the scope of protection of the present application. Any equivalent device or process modifications made on the basis of the description and the accompanying drawing of the present application, or direct or indirect applications in other affected fields, should also be covered by the scope of protection of the present application.

[0177] The basic concepts have already been described above. Obviously, the detailed disclosure given above is merely an example for those skilled in the field and does not constitute a limitation of the present application. Although not expressly stated here, those skilled in the field may make various modifications, improvements, and changes to the present application. These modifications, improvements, and changes are proposed in the present application so that they still belong to the spirit and scope of the embodiments shown in the present application.

[0178] The present application also uses specific terms to describe embodiments of the present application. The terms "an embodiment" and / or "some embodiments" refer to a feature, structure, or special characteristic associated with at least one embodiment of the present application. It should therefore be emphasized and noted that the terms "an embodiment" or "an alternative embodiment," which appear two or more times in different places in the present description, do not necessarily refer to the same embodiment. Furthermore, some features, structures, or properties of one or more embodiments of the present application can be appropriately combined with one another.

[0179] Furthermore, a person skilled in the art in this field can understand that the aspects of the present utility model application can be explained and described by several patentable categories or situations, including any new and meaningful combinations of operations, machines, products, or substances, as well as any new and meaningful improvements thereto. Accordingly, the various aspects of the present application can be implemented entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. Both hardware and software can be referred to as a "data block," "module," "engine," "unit," "component," or "system." Furthermore, the aspects of the present application can manifest themselves as a computer product on one or more computer-readable media, the product comprising computer-readable program code.

[0180] Furthermore, unless expressly stated otherwise in the claims, neither the order of the processing elements and sequences nor the use of numbers, letters, or other designations in the present application shall be intended to restrict the order of the processes and methods of the present application. Although the above disclosure has discussed some embodiments of the invention currently considered useful by way of various examples, it should be understood that such details are for illustrative purposes only and that the attached claims are not limited to the disclosed embodiments. Rather, the claims are intended to cover all modifications and equivalent combinations that are consistent with the nature and scope of the embodiments of the present application.For example, although the system components described above can be implemented by hardware devices, they can also be implemented by purely software solutions, such as installing the described system on existing processing equipment or mobile devices.

[0181] It should also be noted that in the preceding description of the embodiments of the present application, various features are sometimes grouped together in one embodiment, one figure, or its description(s) in order to simplify the description of the disclosure of the present application and to facilitate the understanding of one or more embodiments of the invention. However, this method of disclosure does not mean that the subject matter of the present application requires more features than those specified in the claims. In fact, the embodiments have fewer features than the totality of features of the individual embodiments disclosed above.

[0182] In some embodiments, numbers are used to describe the number of components and properties. It should be understood that in some cases, the numbers used to describe the embodiments are further specified by "approximately," "about," or "essentially." Unless otherwise stated, "approximately," "about," or "essentially" indicate that the stated number allows for a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the description and claims are approximate values ​​that may vary depending on the requirements of the individual embodiment. In some embodiments, the required number of significant decimal places for the numerical parameters is to be taken into account using a general rounding procedure.Although the numerical ranges and parameters in some embodiments of the present application for determining the width of the associated perimeter are approximate values, such values ​​have been determined as precisely as possible within the practical scope in the specific embodiments.

[0183] Every patent specification, every patent application, every publication of patent applications, and every other material cited in the present application, such as articles, books, descriptions, publications, documents, etc., is hereby incorporated in its entirety into the present application as a reference. Excluded are application history documents that are inconsistent with or conflict with the content of the present application, as well as documents (currently or subsequently attached to the present application) that limit the broadest scope of the claims of the present application. It should be noted that in the event of any discrepancies or conflicts between the description, definition, and / or use of terms in the application and those in accompanying materials, the description, definition, and / or use of terms in the present application shall prevail.

[0184] In conclusion, it should be understood that the embodiments described in this application serve only to illustrate the principle of the embodiments described therein. Other variants could also fall within the scope of this application. Therefore, alternative configurations of the embodiments described in this application may be considered exemplary and not as limiting, as being consistent with the teachings of this application. Accordingly, the embodiments described in this application are not limited to those expressly presented and described herein. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] CN 202020720127.1

[0001] WO 202020720129.0

[0001] WO 202010367107.5

[0001]

Claims

[1] Ear hook assembly for a bone conduction earphone, characterized by , that the earhook assembly comprises an earhook housing and a decorative element, wherein the earhook housing comprises a receiving compartment, a bend transition section and an earphone attachment section, wherein the receiving compartment is for receiving a battery or a main control board, wherein the earphone attachment section is for attaching a core module, wherein the bend transition section connects the receiving compartment to the earphone attachment section and is bent to be suspended on the outside of a human ear, wherein the earhook housing is provided with a first groove at least at the bend transition section, and wherein the first groove is for wiring. [2] Ear hook assembly according to claim 1, characterized by, that the decorative element comprises a decorative support, wherein the first groove is formed on a side of the ear hook housing close to the decorative support, the decorative support being inserted into and secured in the first groove corresponding to the bend transition section to form a wiring channel, thereby enabling the conductor wire to run from the core module through the wiring channel into the receiving compartment. [3] Ear hook assembly according to claim 2, characterized by , that the decorative support on the side facing the earpiece housing is further provided with a second groove, wherein the decorative support is inserted into and secured in the first groove, and wherein the second groove and the first groove fit together to form the wiring channel. [4] Ear hook assembly according to one of claims 2 and 3, characterized by, that the decorative element includes a decorative strip, wherein the decorative strip is inserted into the first groove and attached flush against the decorative support. [5] Ear hook assembly according to any one of claims 1 to 4, characterized by that the ear hook assembly includes a button and the earphone attachment section is provided with a button counter hole. [6] Ear hook assembly according to claim 5, characterized by , that the decorative support is mounted and attached to one side of the earpiece housing, with the button being located on the other side of the earpiece housing, away from the decorative support, and exposed to the outside through the button counter hole. [7] Ear hook assembly according to claim 6, characterized by , that the ear hook assembly includes a sealing element, wherein the sealing element is arranged between the button and the earphone attachment section. [8] Ear hook assembly according to any one of claims 1 to 7, characterized by, that the first groove is divided into a first partial groove segment located at the bend transition section and a second partial groove segment located at the earphone attachment section, wherein the depth of the first partial groove segment is greater than the depth of the second partial groove segment. [9] Ear hook assembly according to claim 8, characterized by , that the first groove is subdivided in such a way that it continues to have a third partial groove segment located at the receiving compartment, the depth of the second partial groove segment being greater than the depth of the third partial groove segment. [10] Ear hook assembly according to claim 9, characterized by that a recess is provided in the third partial groove segment. [11] Ear hook assembly according to one of claims 8 to 10, characterized by, that the decorative support comprises a fastening section corresponding to the first partial groove segment and a pressure section corresponding to the second partial groove segment, wherein the thickness of the fastening section is greater than the thickness of the pressure section. [12] Ear hook assembly according to any one of claims 3 to 11, characterized by that the second groove is located on the fastening section. [13] Ear hook assembly according to claim 11, characterized by that the decorative support further comprises a connecting section that is joined between the attachment section and the pressure section, the connecting section extending curved away from the earpiece housing relative to the attachment section, and the pressure section extending curved towards the earpiece housing relative to the connecting section. [14] Ear hook assembly according to claim 11, characterized by, that a button protrusion is provided on the side of the pressure section closest to the ear hook housing, so that the button protrusion can trigger the button when the pressure section is pressed by an external force. [15] Bone conduction earphones, characterized by , that the bone conduction earphone comprises core modules, a back-of-headband assembly and ear-band assemblies according to any one of claims 1 to 14, wherein there are two core modules, two ear-band assemblies and a single back-of-headband assembly, wherein the two ear-band assemblies are each connected at one end to a corresponding core module and two ends of the back-of-headband assembly are connected to the two ear-band assemblies at the other ends of the ear-band assemblies, which are further away from the respective core modules.

Images