Core module and electronic device

Abstract

Core module for earphones, characterized in that it comprises a core housing, a loudspeaker and a carrier, wherein the loudspeaker and the carrier are arranged in the core housing, wherein the carrier and the loudspeaker enclose an acoustic chamber and an acoustic opening is provided in the core housing, wherein the carrier is provided with an acoustic channel, wherein the acoustic channel connects the acoustic opening to the acoustic chamber, wherein a first recording chamber is provided inside the loudspeaker, which is connected to the acoustic chamber, wherein the loudspeaker, the support and the core housing together further form a second receiving chamber which is located outside the loudspeaker and is not connected to the acoustic chamber, wherein the loudspeaker comprises a coil, a basket and metal elements arranged on the basket, wherein the number of metal elements is two, one of which serves as the positive terminal of the loudspeaker and the other as the negative terminal of the loudspeaker, wherein each of the metal elements comprises a first solder pad, a second solder pad and a transition section connecting the first solder pad to the second solder pad, wherein the first solder pad and the second solder pad are exposed from the basket, wherein the first solder pad is located in the first receiving chamber and is connected to the coil, wherein the second solder pad is located in the second receiving chamber, and where the distance between the first solder pads of the two metal elements is greater than the distance between the second solder pads of the two metal elements.

Description

Technical field

[0001] The present application relates to the technical field of electronic devices, in particular a core module and an electronic device. State of the art

[0002] With the increasing popularity of electronic devices, they have become indispensable tools for communication and entertainment in everyday life. People's demands on electronic devices have also steadily risen. As electronic devices, earphones, smart glasses, and similar products are widely used in daily life. They can work together with devices such as mobile phones and computers to provide users with a fantastic audio experience. Disclosure of the invention

[0003] The present application provides a core module comprising a core housing, a loudspeaker, and a support, wherein the loudspeaker and the support are arranged in the core housing, wherein the support and the loudspeaker enclose an acoustic chamber, and an acoustic opening is provided in the core housing, wherein the support is provided with an acoustic channel through which the acoustic opening is connected to the acoustic chamber, wherein a first receiving space is provided inside the loudspeaker, which is connected to the acoustic chamber, wherein the loudspeaker, the support, and the core housing together further form a second receiving space, which is located outside the loudspeaker and is not connected to the acoustic chamber, wherein the loudspeaker comprises a coil, a basket, and metal elements arranged on the basket, wherein the number of metal elements is two.wherein one of these serves as the positive terminal of the loudspeaker and the other as the negative terminal of the loudspeaker, wherein each of the metal elements comprises a first solder pad, a second solder pad and a transition section connecting the first solder pad to the second solder pad, wherein the first solder pad and the second solder pad are exposed from the basket, wherein the first solder pad is located in the first receiving space and is connected to the coil, wherein the second solder pad is located in the second receiving space, and wherein the distance between the first solder pads of the two metal elements is greater than the distance between the second solder pads of the two metal elements.

[0004] In some embodiments, the transition section is provided to be embedded in the basket or sealed watertight against the basket.

[0005] In some embodiments, the second solder pads of the two metal elements are arranged side by side and spaced apart from each other, with one end of each transition section being connected to the corresponding second solder pad, the two transition sections extending away from each other, and the respective first solder pad being connected to the other end of the corresponding transition section.

[0006] In some embodiments, the loudspeaker comprises a magnetically conductive cover and a magnet arranged within the magnetically conductive cover, wherein the magnet and the magnetically conductive cover form a magnetic gap into which the coil projects, wherein the basket comprises an annular circumferential wall and an annular flange connected to the inner wall surface of the annular circumferential wall, as well as a shoulder provided at the junction between the annular flange and the annular circumferential wall, wherein the magnetically conductive cover is attached to the annular flange, wherein the shoulder serves to support the metal element, and wherein the second solder pad is exposed from the shoulder.

[0007] In some embodiments, it is provided that two steps are spaced apart from each other in the circumferential direction of the annular circumferential wall, with each step supporting one of the metal elements.

[0008] In some embodiments, the basket is provided to have a long axis direction and a short axis direction that are perpendicular to the direction of vibration of the loudspeaker and orthogonal to each other, wherein the dimension of the basket in the long axis direction is larger than the dimension of the basket in the short axis direction, and wherein the two metal elements are located at the same end of the long axis direction.

[0009] In some embodiments, the carrier together with the core housing forms a first adhesive slot that at least partially surrounds the acoustic opening, wherein a first adhesive for sealing a mounting gap between the carrier and the core housing is included in the first adhesive slot.

[0010] In some embodiments, the basket comprises a first annular support surface and a second annular support surface, which are formed in the form of a step, wherein the second annular support surface is provided peripherally around the first annular support surface, wherein a part of the lower end of the carrier is supported on the first annular support surface and another part of the lower end of the carrier forms a gap with the second annular support surface, so that the carrier together with the annular support platform and the core housing forms a second adhesive slot, wherein a second adhesive is received in the second adhesive slot, which is used to seal the assembly gaps between any two of the carrier, the basket and the core housing.

[0011] In some embodiments, the carrier comprises a ring body and a docking part connected to the ring body, wherein the ring body is peripherally mounted on the loudspeaker to form the acoustic chamber, wherein the acoustic channel passes through the docking part and the ring body, wherein the docking part is located between the ring body and the core housing and at least partially surrounds the acoustic opening, and wherein the docking part together with the core housing forms the first adhesive slot.

[0012] In some embodiments, the docking part is used to form a bottom wall and a side slotted wall of the first adhesive slot, and the core housing is used to form another side slotted wall of the first adhesive slot.

[0013] In some embodiments, a recess is provided on the inside of the core housing, wherein the acoustic opening is provided at the bottom of the recess, wherein the core module comprises a sound-absorbing mesh arranged in the recess, and wherein the docking part presses the sound-absorbing mesh against the bottom of the recess.

[0014] In some embodiments, the first adhesive is further used to seal a mounting gap between the carrier and the sound-absorbing mesh and / or a mounting gap between the sound-absorbing mesh and the core housing.

[0015] The present application provides an electronic device comprising a support arrangement and the aforementioned core module, wherein the support arrangement is connected to the core housing to support the core module in the carrying position when carried.

[0016] The present application has the following advantageous effects: Compared to the prior art, the core module according to the present application has a first receiving chamber connected to the acoustic chamber and a second receiving chamber not connected to the acoustic chamber. Although the first solder pad is located in the first receiving chamber with a lower water resistance class, a greater distance between the first solder pads of the two metal elements prevents perspiration, rainwater, and other liquid droplets entering the first receiving chamber through the acoustic opening and acoustic channel from easily causing a short circuit between the first solder pads of the two metal elements, thus preventing the core module from burning out.Because the second solder pad is located in the second mounting chamber with a higher waterproof rating, even a smaller distance between the second solder pads of the two metal elements prevents a short circuit, thus avoiding burnout of the core module. Furthermore, the smaller distance between the second solder pads of the two metal elements allows for a shorter lead wire or flexible circuit board connecting the two metal elements to other electronic components. This simplifies the speaker's wiring structure and reduces costs. Brief description of the characters

[0017] To clarify the technical solutions in the embodiments of the application, the drawings required for describing these embodiments are briefly presented below. Obviously, the drawings in the following description represent only some embodiments of the application. A person skilled in the art can derive further drawings from these drawings without inventive step. Fig. Figure 1 shows a schematic representation of a user's anterior ear contour according to the present application; Fig. Figure 2 shows a schematic structural representation of an earphone in an embodiment of the present application; Fig. Figure 3 shows a schematic representation of the earphone made of Fig. 2 according to an embodiment in a worn state; Fig. Figure 4 shows a schematic structural representation of the earphone. Fig. 2 from one perspective; Fig. Figure 5 shows a schematic structural representation of the earphone. Fig. 2 from a different perspective; Fig. Figure 6 shows a schematic structural representation of the earphone. Fig. 2 from a different perspective; Fig. Figure 7 shows a schematic structural representation of an auxiliary structure in an embodiment of the present application; Fig. Figure 8 shows a schematic structural representation of the earphone in an embodiment of the present application; Fig. Figure 9 shows a schematic structural representation of the earphone. Fig. 8 from one viewing angle; Fig. Figure 10 shows a schematic structural representation of the earphone. Fig. 8 from a different perspective; Fig. Figure 11 shows a schematic structural representation of the earphone in an embodiment of the present application; Fig. Figure 12 shows a comparison diagram of the frequency response curves measured at the same listening position when the core module in the earphone is located at different positions on the ear according to an embodiment of the present application; Fig. Figure 13 shows a schematic cutaway structural representation of the earphone made of Fig. 10 in the cutting direction B1-B1 according to an exemplary embodiment; Fig. Figure 14 shows a schematic structural representation of a core housing in an embodiment of the present application; Fig. Figure 15 shows a schematic structural representation of the core housing in an embodiment of the present application; Fig. Figure 16 shows a schematic structural representation of a support in an embodiment of the present application; Fig. Figure 17 shows a schematic enlarged structural representation of the earphone made of Fig. 13 in area C1 according to an exemplary embodiment; Fig. Figure 18 shows a schematic enlarged structural representation of the earphone made of Fig. 13 in area C2 according to an exemplary embodiment; Fig. Figure 19 shows a schematic exploded structural representation of a loudspeaker in an embodiment of the present application; Fig. Figure 20 shows a schematic cutaway structural representation of the loudspeaker. Fig. 19 in the cutting direction B2-B2 according to an exemplary embodiment; Fig. Figure 21 shows a schematic cutaway structural representation of the loudspeaker. Fig. 19 in the cutting direction B3-B3 according to an exemplary embodiment; Fig. Figure 22 shows a schematic enlarged structural representation of the loudspeaker. Fig. 21 in area C3 according to an exemplary embodiment; Fig. Figure 23 shows a schematic representation of a substructure of the loudspeaker. Fig. 19 according to an exemplary embodiment; Fig. Figure 24 shows a schematic cutaway structural representation of a basket made of Fig. 19 in the cutting direction B2-B2 according to an exemplary embodiment; and Fig. Figure 25 shows a schematic exploded structural representation of the basket made of Fig. 19 according to an exemplary embodiment. Detailed descriptions

[0018] The present application is described in further detail in connection with the drawings and the embodiments. It should be noted in particular that the following embodiments are intended only to illustrate the present application and do not, however, limit its scope. Furthermore, the following embodiments represent only some, not all, embodiments of the present application. All other embodiments that are accessible to a person skilled in the art without inventive step are within the scope of protection of the application.

[0019] The mention of "exemplarities" in this application means that the specific features, structures, or properties described in connection with these exemplary embodiments may be included in at least one exemplary embodiment of this application. What the person skilled in the art understands explicitly and implicitly is that the exemplary embodiments described in this application can be combined with further exemplary embodiments.

[0020] Combined with Fig. It is evident from Figure 1 that a user's ear 100 may comprise an external auditory canal 101, a cavum conchae 102, a cymba conchae 103, a fossa triangularis 104, an antihelix 105, a scapha 106, a helix 107, an antitragus 108, and other physiological body parts. Although the external auditory canal 101 has a certain depth and extends to the eardrum, for the sake of simplicity of description and in conjunction with Fig. 1. Unless otherwise specified in the present application, the external auditory canal 101 is specifically designated as the entrance furthest from the tympanic membrane (i.e., the ear opening). Furthermore, it is provided that the physiological body parts such as the cavum conchae 102, the cymba conchae 103, and the fossa triangularis 104 have a certain volume and depth, and that the cavum conchae 102 and the external auditory canal 101 are connected to each other; that is, it can simply be considered that the aforementioned ear opening lies below the cavum conchae 102.

[0021] Furthermore, it is anticipated that different users may exhibit individual variations, leading to different shapes, sizes, and other dimensions of the ears. To simplify the description and reduce (or even eliminate) individual variations between different users, a simulator with the head and (left and right) ear, such as the GRAS 45BC KEMAR, can be manufactured based on the standards ANSI: S3.36, S3.25 and IEC: 60318-7. Therefore, expressions such as "the user wears the earphone," "the earphone is in the worn state," and "in the worn state" in this application can refer to the earphone described in this application being worn on the ear of the aforementioned simulator.Naturally, due to individual variations among different users, there may be some differences between the wearing of the earphone by different users and the wearing of the earphone on the ear of the aforementioned simulator; however, these differences should be accepted.

[0022] It should be noted that in medicine and anatomy, three fundamental planes of section can be defined for the human body: the sagittal plane, the coronal plane, and the horizontal plane. Three fundamental axes can also be defined: the sagittal axis, the coronal axis, and the vertical axis. The sagittal plane is a plane of section perpendicular to the ground, running in the front-to-back direction of the body, dividing the human body into a left and a right part. The coronal plane is a plane of section perpendicular to the ground, running in the left-to-right direction of the body, dividing the human body into an anterior and a posterior part.The horizontal plane refers to a cross-sectional plane parallel to the ground in the top-bottom direction of the body, dividing the human body into an upper and a lower part. Accordingly, the sagittal axis refers to an axis running in the front-back direction of the body and perpendicular to the coronal plane, the coronal axis to an axis running in the left-right direction of the body and perpendicular to the sagittal plane, and the vertical axis to an axis running in the top-bottom direction of the body and perpendicular to the horizontal plane. Furthermore, the expression "in front of the ear" as described in this application refers to the expression "behind the ear," the former referring to a side of the ear facing away from the head and the latter to a side of the ear facing the head. Both refer to the user's ear.When viewing the ear of the aforementioned simulator in the direction of the coronal axis of the human body, the following results: Fig. 1. Schematic representation of the anterior contour of the ear.

[0023] Combined with Fig. 2 and Fig. Figure 3 shows, for example, that an earphone 10 can comprise a core module 11 and a hook structure 12 connected to the core module 11, wherein the core module 11 is located at the front of the ear when worn and the hook structure 12 is located at least partially at the back of the ear when worn, so that the earphone 10 is suspended on the ear when worn. The core module 11 can be positioned so that it does not block the external ear canal when worn. Therefore, the earphone 10 functions as an "open-ear headphone." It should be noted that due to individual variations among different users, the core module 11 could partially cover the external ear canal when the earphone 10 is worn by different users. Nevertheless, the external ear canal remains unobstructed.

[0024] To improve the stability of the earphone 10 when worn, one of the following options, or a combination thereof, can be used for the earphone 10. First: The hook structure 12 is designed, at least partially, as a profiled structure that adapts to at least one of the backs of the ear and the head in order to increase the contact area of ​​the hook structure 12 with the ear and / or the head, thereby increasing the resistance to the earphone 10 falling out of the ear. Second: The hook structure 12 is designed, at least partially, as an elastic structure so that it exhibits a certain degree of deformability when worn, in order to increase the positive pressure exerted by the hook structure 12 on the ear and / or the head, thereby increasing the resistance to the earphone 10 falling out of the ear.Third: The hook structure 12 is at least partially arranged so that, when worn, it presses against the head, thereby generating a counterforce that presses the ear. This presses the core module 11 against the front of the ear to increase resistance to the earphone 10 falling out of the ear. Fourth: The core module 11 and the hook structure 12 are arranged so that, when worn, they clamp physiological body parts such as the antihelix and the conchae on the front and back of the ear to increase resistance to the earphone 10 falling out of the ear. Fifth: The core module 11 or an associated auxiliary structure is arranged such that it / they protrude at least partially into physiological body parts such as the cavum conchae, the cymba conchae, the fossa triangularis or the scapha in order to increase the resistance against the earphone 10 falling out of the ear.

[0025] Combined with Fig. Figures 1 to 3 show, for example, that the earpiece 10 can include an auxiliary structure 15 connected to the core module 11. In the worn state, the auxiliary structure 15 is located at least partially on the front of the ear; that is, in the worn state, the auxiliary structure 15 is located at least partially on the same side of the ear as the core module 11 in order to support the core module 11. In this way, the core module 11 is pressed against a first ear region corresponding to the cymba conchae in the worn state, while the auxiliary structure 15 is pressed against a second ear region corresponding to the antihelix. That is to say, the core module 11 and the auxiliary structure 15 are pressed against different ear regions.Because the earphone 10 is further equipped with the auxiliary structure 15, which interacts with the core module 11, a larger contact area is achieved between the earphone 10 and the front of the ear than would be the case with an earphone 10 equipped solely with the core module 11. Furthermore, this prevents the forces exerted by the earphone 10 on the front of the ear from concentrating in a small area. This contributes to improving the stability and comfort of the earphone 10 when worn. Additionally, when viewed along the thickness of the core module 11, it can be seen that the offset distance between the auxiliary structure 15 and the hook structure 12 is smaller than the offset distance between the core module 11 and the hook structure 12. This reduces the shear stress generated by the clamping force of the earphone 10 on the ear and even converts it into compressive stress.This contributes to improving the stability and comfort of the earphone 10 when worn. The thickness direction X can be defined as the direction in which the core module 11 extends towards or away from the ear when worn.

[0026] Furthermore, it is provided that the auxiliary structure 15 can be detachably connected to the core module 11 by any of the following options: snap connection, double-sided adhesive tape, threaded connection, etc. Several auxiliary structures 15 with identical or different specifications can be prepared for the earphone 10 to allow for exchange or to make them available to different users.

[0027] Combined with Fig. 3 shows, for example, that in the supported state and when viewed in the thickness direction X, the extension direction of the auxiliary structure 15 (e.g., by the dashed arrow A1 in Fig. 3) points towards the back of the head and with a positive direction towards the top of the head of the vertical axis of the human body (e.g. by the dashed arrow A2 in Fig. 3) includes an acute angle. This helps to press the auxiliary structure 15 against the ear region corresponding to the antihelix. Furthermore, the auxiliary structure 15 can be pressed against the larger central area of ​​the antihelix. This contributes to improving the stability and comfort of the earphone 10 when worn.

[0028] Combined with Fig. Figures 2 to 6 show, for example, that the core module 11, in its worn state, can have a first inner surface IS1 facing the ear in the thickness direction X, and a first outer surface OS1 facing away from the ear, as well as a connecting surface that links the first inner surface IS1 to the first outer surface OS1. The auxiliary structure 15 can be connected to at least the aforementioned connecting surface. For example, the auxiliary structure 15 is connected exclusively to the aforementioned connecting surface. Alternatively, the auxiliary structure 15 is connected not only to the aforementioned connecting surface but also additionally to the first outer surface OS1.This helps to ensure that the distance between the auxiliary structure 15 and the hook structure 12 in the thickness direction X is within a reasonable range, thereby avoiding excessive pressure on the auxiliary structure 15 due to an excessively small distance or insufficient pressure on the auxiliary structure 15 due to an excessively large distance.

[0029] It should be noted that when viewed in the thickness direction X, the core module 11 can be circular, elliptical, rounded square, rounded rectangular, or otherwise shaped. If the core module 11 is circular, elliptical, or otherwise shaped, the above connecting surface can refer to a curved side of the core module 11. If, however, the core module 11 is rounded square, rounded rectangular, or otherwise shaped, the above connecting surface can comprise a bottom surface LS, a top surface US, a front surface FS, and a back surface RS, which are described below. Furthermore, it is provided that the core module 11 can have a longitudinal direction Y and a lateral direction Z, which are perpendicular to the thickness direction X and orthogonal to each other.The longitudinal direction Y can be defined as the direction in which the core module 11, when worn, extends towards or away from the back of the user's head. The lateral direction Z can be defined as the direction in which the core module 11, when worn, extends towards or away from the top of the user's head. To simplify the description, the present application is therefore described by way of example, in which the core module 11 has a rounded rectangular shape. In this case, the length of the core module 11 in the longitudinal direction Y can be greater than the width of the core module 11 in the lateral direction Z.Based on this, the aforementioned connecting surface can comprise an upper surface (US) facing away from the external auditory canal in the lateral direction Z when worn, an underside (LS) facing the external auditory canal, a posterior surface (RS) facing the back of the head in the longitudinal direction Y, and an anterior surface (FS) facing away from the back of the head when worn. The auxiliary structure 15 can be connected to at least the posterior surface (RS). For example, the auxiliary structure 15 is connected exclusively to the posterior surface (RS). Alternatively, the auxiliary structure 15 is connected not only to the posterior surface (RS) but also to the upper surface (US). This contributes to the auxiliary structure 15 being pressed primarily against the larger central region of the antihelix.

[0030] Furthermore, it is provided that the thickness of the auxiliary structure 15 can be less than the dimension of the core module 11 in the thickness direction, thus simultaneously taking into account both the weight and the size of the earphone 10. When viewed in the longitudinal direction Y or the lateral direction Z, it can be seen that the connection point between the auxiliary structure 15 and the core module 11 can be located between one-third of the thickness of the core module 11 in the thickness direction X and two-thirds of the aforementioned thickness. For example, the connection point between the auxiliary structure 15 and the core module 11 can be located at half the thickness of the core module 11 in the thickness direction X.This helps to ensure that the distance between the auxiliary structure 15 and the hook structure 12 in the thickness direction X is within a reasonable range, thereby avoiding excessive pressure on the auxiliary structure 15 due to an excessively small distance or insufficient pressure on the auxiliary structure 15 due to an excessively large distance.

[0031] For example, the hook structure 12 and the auxiliary structure 15 are offset in the thickness direction X, as shown in Fig. 5 and Fig. 6 and as another example in Fig. 9 and Fig. 10 is shown. This allows the earphone 10 to be better adapted to the thickness of the ear. This helps to avoid discomfort due to excessive pressure of the auxiliary structure 15 on the antihelix. Furthermore, this helps to prevent unstable wear caused by the auxiliary structure 15 lifting the core module 11.

[0032] Combined with Fig. As shown in Figure 7, for example, the auxiliary structure 15 can comprise a connecting part 151 linked to the core module 11 and an extension part 152 linked to the connecting part 151, whereby the auxiliary structure 15 can come into contact with the antihelix via the extension part 152. The hardness of the extension part 152 can be lower than that of the core module 11. For example, the extension part 152 can be made of plastic, rubber, or similar materials. If the earphone 10 is worn by different users, the extension part 152 can therefore deform elastically to varying degrees, so that the auxiliary structure 15 exerts an appropriate compressive force on the antihelix. Naturally, the hardness of the connecting part 151 can also be lower than that of the core module 11 (in particular, the core housing 111 mentioned below). For example, the connecting part 151 is made of the same material as the extension part 152.Accordingly, the connection between the connecting part 151 and the core module 11 can be designed to be either detachable or non-detachable, depending on requirements.

[0033] Furthermore, the auxiliary structure 15 is provided to include a flexible insert block 153 connected to the extension part 152, wherein the flexible insert block 153 can be located within the extension part 152 or on a side of the extension part 152 facing the antihelix. The rigidity of the flexible insert block 153 can be lower than that of the extension part 152, so that the part of the auxiliary structure 15 in contact with the antihelix is ​​more flexible. This contributes to improving the stability and comfort of the earphone 10 when worn.

[0034] Combined with Fig. 5 and Fig. Figure 6 shows, for example, that a mounting groove can be provided on the aforementioned connection surface, extending in the circumferential direction of the core module 11, in which the connecting part 151 is fastened. The aforementioned mounting groove can be annular, and the connecting part 151 can also be a corresponding annular structure (e.g., as in Figure 6). Fig. (as shown in Figure 7) such that the connecting part 151 is embedded in the aforementioned mounting groove. Of course, the aforementioned mounting groove can also be C-shaped or U-shaped. For example, the aforementioned mounting groove is formed on the rear side RS and extends to the underside LS and the top side US. The connecting part 151 can also be designed as a corresponding C-shaped or U-shaped structure, so that the connecting part 151 is embedded in the aforementioned mounting groove.

[0035] Combined with Fig. As can be seen in figures 8 to 10, for example, the connecting part 151 can cover at least part of the first outer surface OS1. For example, the first outer surface OS1 can be completely covered by the connecting part 151, which means that the Fig. 2 to 6 shown first outer side OS1 in Fig. 8 to 10 is not visible. This helps to increase the contact area between the connecting part 151 and the core module 11, the two of which can be joined by methods such as gluing or injection molding. The extension part 152 can comprise a second inner surface IS2 facing the antihelix in the worn state and a second outer surface OS2 facing away from the antihelix, wherein at least one of the second inner surface IS2 and the second outer surface OS2 is inclined towards the antihelix in the extension direction of the auxiliary structure 15. For example, it is provided that the second inner surface IS2 and the second outer surface OS2 are both inclined towards the antihelix in the extension direction of the auxiliary structure 15, which means that the extension part 152 is bent towards the first inner surface IS1 with respect to the connecting part 151.This helps to ensure that, when considering the thickness of the extension part 152, the extension part 152 is in better contact with the antihelix. Furthermore, it is intended that in conjunction with... Fig. 14 and Fig. The connecting part 151 can cover not only at least a portion of the first outer surface OS1, but also at least a portion of the aforementioned connecting surface (e.g., the rear surface RS). This helps to increase the contact area between the connecting part 151 and the core module 11. Furthermore, it also helps to improve the comfort of contact between the core module 11 and the ear on the rear surface RS.

[0036] Combined with Fig. 4 and Fig. As can be seen, for example, in Figure 13, the core module 11 can comprise a core housing 111 connected to the hook structure 12 and a loudspeaker 112 arranged within the core housing 111. A sound outlet opening 111a is provided on an inner surface of the core housing 111 facing the ear when worn (e.g., on the first inner surface IS1 mentioned above), and sound waves generated by the loudspeaker 112 are emitted through the sound outlet opening 111a to facilitate transmission into the external auditory canal. It should be noted that the sound outlet opening 111a can also be located either on a side of the core housing 111 corresponding to the bottom surface LS or at a corner between the aforementioned inner surface and the bottom surface LS.

[0037] Furthermore, it is planned that in connection with Fig. The earphones 10, comprising a main control circuit board 13 arranged in the core housing 111 and a battery 14 located at an end of the hook structure 12 facing away from the core module 11, include the battery 14 and the loudspeaker 112 each being coupled to the main control circuit board 13, enabling the battery 14 to power the loudspeaker 112 under the control of the main control circuit board 13. Naturally, both the battery 14 and the loudspeaker 112 can be arranged in the core housing 111.

[0038] Combined with Fig. 4 or Fig. For example, it can be seen in Figure 11 that electrode clamps 16 can be provided on an inner side of the core housing 111 or the auxiliary structure 15 (in particular the extension part 152) facing the ear when worn, wherein the electrode clamps 16 can be coupled to the main control circuit board 13. The number of electrode clamps 16 can be two, each functioning as a positive and a negative charging clamp of the earphone 10 to facilitate the charging function of the earphone 10. Alternatively, the number of electrode clamps 16 can be three, with two of them functioning as a positive and a negative charging clamp of the earphone 10 and the remaining one functioning as a test clamp of the earphone 10, thereby contributing to the charging detection of the earphone 10, the detection of whether the earphone 10 has been inserted into or removed from the charging case, and other detection functions.

[0039] Combined with Fig. 3 and Fig. As can be seen, for example, in Figure 1, both the cymba conchae and the associated cavum conchae have a specific volume and depth. This allows the inner surface of the core housing 111 (such as the first inner surface IS1 mentioned above) to maintain a specific distance from the cymba conchae and the cavum conchae after the core module 11 is pressed against the ear region corresponding to the antihelix. In other words, when worn, the core module 11, together with the cymba conchae and the cavum conchae, can form an auxiliary chamber connected to the external auditory canal, with the sound outlet 111a being located at least partially within this auxiliary chamber. Thus, when worn, the sound waves generated by the loudspeaker 112 and emitted through the sound outlet 111a are limited by this auxiliary chamber.The aforementioned auxiliary chamber can focus the sound waves. This allows more sound waves to be transmitted into the external auditory canal, thus improving the volume and sound quality of the sound heard by the user in the near field, which contributes to improving the acoustic performance of the earphone 10. Furthermore, the aforementioned auxiliary chamber can be partially open because the core module 11 can be positioned so that it does not block the external auditory canal when worn. This allows a large portion of the sound waves generated by the loudspeaker 112 and emitted through the sound outlet 111a to be transmitted into the external auditory canal, while a small portion of the sound waves is transmitted through a gap between the core module 11 and the ear (e.g., a portion of the cavum conchae not covered by the core module 11) to the earphone 10 and the outside of the ear, resulting in an initial loss of sound in the far field.Furthermore, the core module 11 is usually provided with an acoustic opening (e.g., a pressure relief opening 111c mentioned later), wherein the sound waves emitted through this acoustic opening usually form a second sound loss in the far field, and wherein the phases of the aforementioned first sound loss and the aforementioned second sound loss are (almost) out of phase, so that the two can cancel each other out of phase in the far field, which contributes to reducing the sound loss of the earphone 10 in the far field.

[0040] Furthermore, the earphone 10 is provided to include an adjustment mechanism connected to the core module 11 and the hook structure 12. Different users can adjust the relative position of the core module 11 to the ear using this adjustment mechanism while the earphone is being worn. This ensures that the core module 11 is positioned appropriately, thus forming the aforementioned auxiliary chamber with the cymba conchae and the cavum conchae. Moreover, the adjustment mechanism allows the user to position the earphone 10 for a more stable and comfortable fit.

[0041] Combined with Fig. Figure 12 shows, for example, that the earphone 10 is initially worn on the aforementioned simulator. The position of the core module 11 is then adjusted on the ear of the aforementioned simulator. Subsequently, the frequency response curve of the earphone 10 is measured by a detector (e.g., a microphone) positioned in the outer ear canal of the aforementioned simulator (e.g., at the point on the eardrum corresponding to the listening position). This simulates the effect of hearing on a user wearing the earphone 10. The aforementioned frequency response curve can be used to characterize the relationship between the amplitude of the oscillation and the frequency. The abscissa of the aforementioned frequency response curve can represent the frequency in Hz. The ordinate of the aforementioned frequency response curve can represent the amplitude of the oscillation in dB. Fig. 12. Curve 12_1 can represent the frequency response curve in the case where the core module 11, in its supported state, does not form the aforementioned auxiliary chamber with the caveum conchae, while curve 12_2 can represent the frequency response curve in the case where the core module 11, in its supported state, forms the aforementioned auxiliary chamber together with the caveum conchae. Based on this, the following can be deduced from the in Fig. The comparison diagram shown in Figure 12 immediately and unambiguously shows that curve 12_2 lies above curve 12_1 overall. This means that, compared to the case where the core module 11 does not form the aforementioned auxiliary chamber with the cavum conchae when worn, the case where the core module 11 does form the aforementioned auxiliary chamber with the cavum conchae when worn is more advantageous for an improved acoustic performance of the earphone 10.

[0042] Combined with Fig. 14 and Fig. As can be seen, for example, in Figure 15, the core housing 111 can comprise an inner core housing 1111 and an outer core housing 1112, which interlock in the thickness direction X, with the inner core housing 1111 being closer to the ear than the outer core housing 1112 when worn. The parting line 111b between the outer core housing 1112 and the inner core housing 1111 is oriented away from an end connected to the hook structure 12 (hereinafter referred to as the "connecting end") of the core module 11, for example, in the direction indicated by arrow Y in Fig. The connecting part 151 is inclined in the direction specified in 14, towards the side of the inner core housing 1111. This allows the connecting part 151 to be connected primarily to the outer core housing 1112. This increases the connection area between the auxiliary structure 15 and the core module 11 without increasing the dimension of the core module 11 in the longitudinal direction Y. Furthermore, it helps to simplify the connection structure between the auxiliary structure 15 and the core module 11.

[0043] Combined with Fig. 14 and Fig. For example, it can be seen in Figure 15 that the inner core housing 1111 can comprise a bottom wall 1113 and a first side wall 1114 connected to the bottom wall 1113, and the outer core housing 1112 can comprise a top wall 1115 and a second side wall 1116 connected to the top wall 1115, wherein the second side wall 1116 and the first side wall 1114 interlock and support each other along the mold parting line 111b. This is evident when considering the width direction Z and the length direction Y (especially in the direction indicated by arrow Y in Figure 15). Fig. 14 and Fig. (in the positive direction specified in Figure 15) it can be seen that a portion of the first side wall 1114 furthest from the aforementioned connection end gradually approaches the bottom wall 1113 in the thickness direction X, and a portion of the second side wall 1116 furthest from the aforementioned connection end gradually moves away from the top wall 1115 in the thickness direction X. This allows the mold parting surface 111b to be inclined away from the aforementioned connection end towards the side of the inner core housing 1111. Accordingly, the sound outlet opening 111a can be located on the bottom wall 1113. Of course, the sound outlet opening 111a can also be located either on a side of the first side wall 1114 corresponding to the bottom LS, or at a corner between the first side wall 1114 and the bottom wall 1113.

[0044] Furthermore, it is provided that the outer core housing 1112 can be provided with an insert slot 1117, which is located at least partially on the second side wall 1116, wherein the auxiliary structure 15 is partially embedded in the slot 1117, so that a continuous transition is enabled between the outer surface of an area of ​​the inner core housing 1111 not covered by the auxiliary structure 15 and the outer surface of the auxiliary structure 15, which contributes to improved continuity in the appearance of the earphone 10.

[0045] Combined with Fig. As can be seen, for example, in Figure 14, the core housing 111 can be provided with a pressure relief vent 111c, wherein the space on the side of the loudspeaker 112 facing the main control circuit board 13 is connected to the outside environment via the pressure relief vent 111c. This means that air can freely flow in and out of the aforementioned space. This is therefore advantageous for reducing the resistance of the loudspeaker diaphragm 112 during the vibration process. Furthermore, the pressure relief vent 111c can be oriented towards the top of the head when worn, thus advantageously preventing sound waves transmitted via the pressure relief vent 111c from being audible as sound loss (i.e., the second sound loss mentioned above).Based on the Helmholtz resonator, the opening diameter of the pressure relief opening 111c can be as large as possible, so that the resonance frequency of the second sound loss is shifted as far as possible into a higher frequency band (e.g. a frequency range greater than 4 kHz), which helps to further avoid hearing the second sound loss.

[0046] Furthermore, it is provided that the core housing 111 can be equipped with an opening for sound regulation 111d, wherein the opening for sound regulation 111d causes the resonance frequency of the second sound loss to be shifted as far as possible into a higher frequency band (e.g., a frequency range greater than 4 kHz), which further contributes to preventing the second sound loss from being heard. The area of ​​the opening for sound regulation 111d can be smaller than the area of ​​the pressure relief opening 111c, so that the space on the side of the loudspeaker 112 facing the main control circuit board 13 is more extensively connected to the outside environment via the pressure relief opening 111c.Furthermore, the distance between the sound outlet opening 111a and the pressure relief opening 111c in the lateral direction Z is greater than the distance between the sound outlet opening 111a and the sound regulation opening 111d in the lateral direction Z. This prevents the sound waves emitted by the sound outlet opening 111a and the pressure relief opening 111c from canceling each other out of phase in the near field. This helps to increase the volume of the sound emitted by the sound outlet opening 111a that the user hears. Accordingly, the distance between the sound regulation opening 111d and the sound outlet opening 111a in the longitudinal direction Y can be adjusted as needed, depending on practical requirements.

[0047] Combined with Fig. As shown in Figure 14, for example, the sound outlet opening 111a, the pressure relief opening 111c, and the sound regulation opening 111d can be provided on the inner core housing 1111. For example, the sound outlet opening 111a can be provided on the bottom wall 1113, while the pressure relief opening 111c and the sound regulation opening 111d can each be provided on the first side wall 1114. The pressure relief opening 111c and the sound regulation opening 111d can each be arranged on opposite sides of the first side wall 1114 in the width direction Z. Because the sound outlet opening 111a, the pressure relief opening 111c and the sound regulation opening 111d are all located on the inner core housing 1111, the outer core housing 1112 has a simpler structure, which contributes to reducing machining costs.By arranging the pressure relief opening 111c and the sound regulation opening 111d on the two opposite sides of the first side wall 1114 in the width direction Z, the above-mentioned mold parting surface 111b can also be arranged symmetrically with respect to a reference plane perpendicular to the width direction Z, which contributes to improving the optical quality of the core module 11.

[0048] Combined with Fig. For example, it can be seen from Figure 15 that the core module 11 can comprise a metallic functional pattern, such as an antenna pattern 1141 and / or a touch pattern 1142, which is provided between the outer core housing 1112 and the auxiliary structure 15 (for example, the connecting part 151). The antenna pattern 1141 can be formed on the outside of the outer core housing 1112 using laser direct structuring (LDS) technology. The touch pattern 1142 can either be formed on the outside of the outer core housing 1112 using laser direct structuring technology or be bonded to the outside of the outer core housing 1112 as a flexible touch circuit board. Furthermore, it is provided that the outer core housing 1112 is provided with metallized holes, each connected to the antenna pattern 1141 or the touch pattern 1142, respectively.Since the main control board 13 is located in the core housing 111, for example by connecting the main control board 13 to the outer core housing 1112, the main control board 13 can come into contact with the inner walls of the respective metallized holes via elastic metal parts such as pogo pins or metal snap discs. For example, the antenna pattern 1141 is connected to pogo pin 131 and the touch pattern 1142 to pogo pin 132, which are soldered onto the main control board 13. Accordingly, the loudspeaker 112 is located on a side of the main control board 13 facing away from the outer core housing 1112.Compared to the arrangement of the antenna pattern 1141 and the touch pattern 1142, each on the inner side of the outer core housing 1112 facing the loudspeaker 112, the distance between the antenna pattern and the main control circuit board 13 can be increased by arranging the antenna pattern 1141 on the outer side of the outer core housing 1112. This increases the antenna's clear area, thus improving the interference immunity of the antenna pattern 1141. Conversely, arranging the touch pattern 1142 on the outer side of the outer core housing 1112 reduces the distance between the touch pattern and an external signal-triggering source (e.g., a user's finger). This reduces the touch distance, thus increasing the sensitivity of the touch pattern 1142 to user touches.

[0049] Furthermore, it is provided that the antenna pattern 1141 can be arranged peripherally around the touch pattern 1142 in order to utilize the space on the outside of the outer core housing 1112. The antenna pattern 1141 can be U-shaped and the touch pattern 1142 square. Accordingly, the antenna pattern 1141 and the touch pattern 1142, together with their respective metallized holes, can be provided on the top wall 1115.

[0050] Combined with Fig. Figure 13 shows, for example, that the core module 11 can include a support 115 arranged within the core housing 111. The support 115 and the loudspeaker 112 can enclose an acoustic chamber 116, thus separating the acoustic chamber 116 from other structures within the core housing 111 (such as the main control circuit board 13, etc.). This contributes to improved acoustic performance of the core module 11. The core housing 111 is provided with at least one acoustic opening, for example, at least one pressure relief opening 111c and one sound regulation opening 111d. The support 115 is provided with an acoustic channel 1151, which establishes a connection between the acoustic openings and the acoustic chamber 116, to facilitate communication between the acoustic chamber 116 and the external environment; that is, air can freely flow into and out of the acoustic chamber 116.This is advantageous in reducing the resistance of the diaphragm of the loudspeaker 112 during the vibration process.

[0051] Furthermore, it is provided that the carrier 115, together with the core housing 111, forms a first adhesive slot 1171, which at least partially surrounds the aforementioned acoustic opening, wherein a first adhesive for sealing a mounting gap between the carrier 115 and the core housing 111 is contained in the first adhesive slot 1171. That is, the first adhesive achieves a watertight seal, thereby advantageously preventing sweat, rainwater, and other liquid droplets from penetrating from the outside into a space in which the main control circuit board 13 is located in the core housing 111. In the prior art, a silicone sleeve is pressed against the core housing 111 by the carrier 115 to achieve a watertight seal.In comparison, the present technical solution based on the Helmholtz resonator achieves a watertight seal through the first adhesive, thereby eliminating the need for the previously mentioned silicone sleeve from the prior art. This contributes to shortening the length of the part of the acoustic chamber 116 connected to the external environment (including the acoustic channel 1151, the aforementioned acoustic opening). As a result, the resonance frequency of the sound loss generated by the sound emitted through the pressure relief opening 111c (i.e., the aforementioned second sound loss) is shifted as far as possible into a higher frequency band (e.g., a frequency range greater than 4 kHz), further preventing the second sound loss from being audible.

[0052] It should be noted that the first adhesive slot 1171 at least partially surrounds the pressure relief opening 111c if the acoustic opening mentioned above is the pressure relief opening 111c; that the first adhesive slot 1171 at least partially surrounds the sound regulation opening 111d if the acoustic opening mentioned above is the sound regulation opening 111d; and that the first adhesive slot 1171 at least partially surrounds the pressure relief opening 111c or the sound regulation opening 111d if the acoustic openings mentioned above are the pressure relief opening 111c or the sound regulation opening 111d. For the sake of simplicity, and in conjunction with Fig. In paragraph 14, the present application is described by way of example, in which the aforementioned acoustic opening is a pressure relief opening 111c or a sound regulation opening 111d, and the first adhesive slot 1171 at least partially surrounds the pressure relief opening 111c or the sound regulation opening 111d. Furthermore, it is provided that the first adhesive slot 1171 can completely surround the acoustic opening, i.e., the first adhesive slot 1171 forms a complete annular structure, if the distance between the support 115 and the core housing 111 (e.g., its bottom wall 1113) is sufficiently large, or if the bottom wall 1113 and the first side wall 1114 of the core housing 111 are formed as components not formed in one piece (i.e., as two separate components).

[0053] Combined with Fig. 16 and Fig. As can be seen, for example, in Figure 13, the carrier 115 can comprise a ring body 1152 and a docking part 1153 connected to the ring body 1152. The ring body 1152 is mounted peripherally on the loudspeaker 112 to form the acoustic chamber 116. The acoustic channel 1151 runs through the docking part 1153 and the ring body 1152. Furthermore, the docking part 1153 is located between the ring body 1152 and the core housing 111 and at least partially surrounds the aforementioned acoustic opening, with the docking part 1153 together with the core housing 111 forming the first adhesive slot 1171. Since the acoustic openings can be the pressure relief opening 111c and the opening for sound regulation 111d, two docking parts 1153 and two first adhesive slots 1171 are provided accordingly.Accordingly, the docking part 1153 together with the first side wall 1114 forms the first adhesive slot 1171. Because the carrier 115 is arranged in a ring shape, one side of the loudspeaker 112 facing the main control circuit board 13 is exposed, which contributes to reducing the thickness of the core module 11 in the thickness direction X.

[0054] Combined with Fig. 17 and Fig. Figure 14 shows, for example, that a recess 1119 can be formed on the inner side of the core housing 111, wherein the aforementioned acoustic opening can be provided at the bottom of the recess 1119, wherein the core module 11 can comprise a sound-absorbing mesh 118 arranged in the recess 1119, and wherein the docking part 1153 presses the sound-absorbing mesh 118 against the bottom of the recess 1119. This is advantageous not only for preventing the sound-absorbing mesh 118 from being scratched by the support 115 during assembly, but also for reducing the assembly gap between the support 115, the sound-absorbing mesh 118, and the inner core housing 1111, and for preventing the sound-absorbing mesh 118 from wobbling. The sound-absorbing mesh 118 can be attached to the bottom of the depression 1119 beforehand using double-sided adhesive tape or adhesive.The sound-absorbing mesh 118 can also be pre-attached to a steel protective grille 119. In this case, the steel protective grille 119 is pre-attached to the bottom of the recess 1119 using double-sided adhesive tape or adhesive. Since the aforementioned acoustic openings can be the pressure relief opening 111c and the opening for sound regulation 111d, two recesses 1119 and two sound-absorbing meshes 118 are provided accordingly.

[0055] Furthermore, it is provided that the aforementioned first adhesive can also be used to seal the mounting gap between the support 115 and the sound-absorbing mesh 118 and / or the mounting gap between the sound-absorbing mesh 118 and the core housing 111 (e.g. side walls of the recess 1119), which contributes to further watertight sealing.

[0056] Combined with Fig. 13, Fig. 14 and Fig. Figure 16 shows, for example, that the docking part 1153 can be used to form the bottom wall and one lateral slotted wall of the first adhesive slot 1171, and the core housing 111 can be used to form another lateral slotted wall of the first adhesive slot 1171. The slotted wall on the core housing 111 and the slotted wall on the docking part 1153 are arranged opposite each other, so that the first adhesive slot 1171 has a certain width and depth. Of course, the docking part 1153 can be used to form one lateral slotted wall of the first adhesive slot 1171, and the core housing 111 can be used to form the bottom wall and another lateral slotted wall of the first adhesive slot 1171.Alternatively, the docking part 1153 can be used to form a lateral slotted wall and part of the bottom wall of the first adhesive slot 1171, and the core housing 111 can be used to form another lateral slotted wall and the other part of the bottom wall of the first adhesive slot 1171.

[0057] Combined with Fig. For example, as shown in Figures 17 to 25, the loudspeaker 112 can comprise a basket 1121 and a magnetically conductive cover 1122 connected to the basket 1121, wherein the lower end of the support 115 can be supported on the basket 1121, wherein one side of the acoustic channel 1151 facing the basket 1121 can be open, and wherein the basket 1121 further blocks the open section of the acoustic channel 1151. It can simply be assumed that the first adhesive slot 1171 partially surrounds the aforementioned acoustic opening in order to subsequently facilitate the filling of the first adhesive slot 1171 with adhesive, for example by a dispensing process, etc.

[0058] Furthermore, it is provided that the loudspeaker 112 can comprise a diaphragm 1123 and a surround 1124, the surround 1124 connecting the diaphragm 1123 to the basket 1121. In the loudspeaker 112 mounted in the core housing 111, the diaphragm 1123, the surround 1124, the surrounding basket 1121, and the core housing 111 can prevent sweat, rainwater, and other liquid droplets from penetrating through the sound outlet opening 111a into a space in which the main control circuit board 13 is located within the core housing 111. On this basis, the loudspeaker 112 can comprise a magnet 1125 arranged within the magnetically conductive cover 1122 and a coil 1126 connected to the diaphragm 1123, wherein the magnet 1125 and the magnetically conductive cover 1122 form a magnetic gap, and wherein the coil 1126 projects into the aforementioned magnetic gap.The loudspeaker 112 can include a magnetically conductive plate 1127, which is arranged on one side of the magnet 1125 facing the diaphragm 1123. The magnetically conductive plate 1127, the magnetically conductive cover 1122, and the coil 1126 overlap in the direction of vibration of the loudspeaker 112 (e.g., in the thickness direction X, not repeated hereafter), so that more magnetic flux lines of the magnetic field generated by the magnet 1125 pass through the coil 1126.

[0059] In some embodiments, the basket 1121 can comprise a first annular support surface 11211 and a second annular support surface 11212, which are designed in the form of a step, wherein the second annular support surface 11212 is arranged peripherally around the first annular support surface 11211. Part of the lower end of the carrier 115 can be supported on the first annular support surface 11211, while another part of the lower end of the carrier 115 can form a gap with the second annular support surface 11212, so that the carrier 115 together with the basket 1121 and the core housing 111 forms a second adhesive slot 1172, wherein a second adhesive is received in the second adhesive slot 1172, which is used to seal the assembly gaps between any two of the carrier 115, the basket 1121 and the core housing 111 in order to achieve a watertight seal.

[0060] In some embodiments, the upper end of the support 115 can be placed on the basket 1121 and together with the basket 1121 and the magnetically conductive cover 1122 form a third adhesive slot 1173, wherein a third adhesive is received in the third adhesive slot 1173, which is used to seal the mounting gap between the support 115, the basket 1121 and the magnetically conductive cover 1122 in order to achieve a watertight seal.

[0061] It should be noted that a specific assembly process of the core module 11 can comprise the following process steps, whereby the sequence of all process steps can be adapted as required: 1) Pre-attaching the sound-absorbing mesh 118 and the steel protective grille 119 to the bottom of the recess 1119 using double-sided adhesive tape. 2) Attaching the loudspeaker 112 to the bottom wall 1113 and dispensing the adhesive into the mounting gap between the two, whereby the corresponding adhesive partially accumulates on the second annular contact surface 11212 of the loudspeaker 112.3) Attaching the carrier 115 to the loudspeaker 112 before the adhesive from step 2) cures, wherein the lower end of the carrier 115 is supported on the first annular support surface 11211 of the loudspeaker 112, so that the space between the lower end of the carrier 115 and the second annular support surface 11212 is also filled with the adhesive, wherein the docking part 1153 of the carrier 115 is pressed against the sound-absorbing mesh 118 and together with the first side wall 1114 forms the first adhesive slot 1171, and wherein the upper end of the carrier 115 is placed on the basket 1121 and together with the basket 1121 and the magnetically conductive cover 1122 forms the third adhesive slot 1173. 4) Dispensing the adhesive into the mounting gaps between the first adhesive slot 1171, the third adhesive slot 1173 and the lower end of the carrier 115 on the one hand and the loudspeaker 112 on the other.on the other hand, the inner core housing 1111. Since the mounting gaps between the lower end of the carrier 115 and the loudspeaker 112 or the inner core housing 1111 are very close to the first adhesive slot 1171, the mounting gaps between the lower end of the carrier 115 and the loudspeaker 112 or the inner core housing 1111 can simply be considered a continuation of the first adhesive slot 1171. That is, the first adhesive slot 1171 and the second adhesive slot 1172 can be connected to each other.

[0062] Based on the detailed description above, the water resistance of the earphone 10 can be improved at the assembly point between the carrier 115 and the core housing 111, regardless of whether this is achieved by the first adhesive (and the second adhesive) or by the silicone sleeve. This allows the space within the core housing 111, which contains the main control circuit board 13, to have a high water resistance rating. Based on this, a first recording chamber can be provided inside the loudspeaker 112, which is connected to the acoustic chamber 116. Additionally, the loudspeaker 112, the carrier 115, and the core housing 111 together can form a second recording chamber located outside the loudspeaker 112 and not connected to the acoustic chamber 116.The aforementioned first receiving chamber can be formed by the basket 1121, the magnetically conductive cover 1122, the diaphragm 1123, and the surround 1124. Consequently, structures such as the magnet 1125, the coil 1126, and the magnetically conductive plate 1127 can be arranged in the aforementioned first receiving chamber. Structures such as the main control circuit board 13 can be arranged in the aforementioned second receiving chamber. In other words, for the loudspeaker 112, the aforementioned first receiving chamber and the aforementioned second receiving chamber can denote two spaces with a specific volume, one located inside and the other outside the loudspeaker 112. It should be noted that the aforementioned first receiving chamber can be connected to the acoustic chamber 116 via through-holes 11213 in the basket 1121.In an embodiment where the aforementioned acoustic opening is the pressure relief opening 111c (or the sound regulation opening 111d), the through-holes 11213 can be provided in the basket 1121 on a side located near the pressure relief opening 111c (or the sound regulation opening 111d). In an embodiment where the aforementioned acoustic openings are the pressure relief opening 111c and the sound regulation opening 111d, two groups of through-holes 11213 can be provided, with one group of through-holes 11213 being provided in the basket 1121 on a side located near the pressure relief opening 111c and the other group of through-holes 11213 being provided in the basket 1121 on a side located near the sound regulation opening 111d.

[0063] Combined with Fig. 23 and Fig. For example, it can be seen in Figure 25 that the loudspeaker 112 can comprise metal elements 1128 arranged on the basket 1121. The number of metal elements 1128 can be two, with one metal element 1128 serving as the positive terminal of the loudspeaker 112 and the other metal element 1128 serving as the negative terminal of the loudspeaker 112. Each metal element 1128 can comprise a first solder pad 11281 and a second solder pad 11282, as well as a transition section 11283 connecting the first solder pad 11281 to the second solder pad 11282, with the first solder pad 11281 and the second solder pad 11282 being exposed from the basket 1121. In this case, the first solder pad 11281 can be located in the aforementioned first receiving space and connected to the coil 1126, while the second solder pad 11282 can be located in the aforementioned second receiving space to facilitate a connection of the coil 1126 to the main control circuit board 13 via the metal elements 1128.The distance between the first solder pads 11281 of the two metal elements 1128 can be greater than the distance between the second solder pads 11282 of the two metal elements 1128. Although the first solder pad 11281 is located in the aforementioned first receiving chamber with a lower waterproof rating, a greater distance between the first solder pads 11281 of the two metal elements 1128 prevents sweat, rainwater, and other liquid droplets entering the aforementioned first receiving chamber through the aforementioned acoustic opening (e.g., the pressure relief opening 111c or the sound regulation opening 111d) and the acoustic channel 1151 from easily causing a short circuit between the first solder pads 11281 of the two metal elements 1128, thus preventing the earphone 10 from burning out.Since the second solder pad 11282 is located in the aforementioned second mounting chamber with a higher waterproof rating, it does not cause a short circuit even with a smaller distance between the second solder pads 11282 of the two metal elements 1128, thus preventing the earpiece 10 from burning out. Furthermore, the smaller distance between the second solder pads 11282 of the two metal elements 1128 allows for a shorter conductor wire or a shorter flexible circuit board connecting the two metal elements 1128 to the main control circuit board 13. This simplifies the wiring structure of the loudspeaker 112 and reduces costs.

[0064] Combined with Fig. Figure 23 shows, for example, that the basket 1121 can have a long-axis direction (e.g., the longitudinal direction Y) and a short-axis direction (e.g., the lateral direction Z) that are perpendicular to the direction of vibration of the loudspeaker 112 and orthogonal to each other. The dimension of the basket 1121 in the long-axis direction can be larger than the dimension of the basket 1121 in the short-axis direction. For example, the length-to-width ratio of the basket 1121 corresponds to that of the core module 11. In this case, the two metal elements 1128 can be located at the same end of the long-axis direction to simplify the wiring of the earphone 10. Similarly, the two metal elements 1128 can be located in the lateral direction between the two groups of through holes 11213.

[0065] In some embodiments, the transition section 11283 can be embedded in the basket 1121. For example, the metal elements 1128 and the basket 1121 are formed by injection molding with metal inserts. Since the transition section 11283 is not exposed from the basket 1121, even a small distance between the transition sections 11283 of the two metal elements 1128 does not result in a short circuit, thus preventing the earphone 10 from burning out.

[0066] In some embodiments, the transition section 11283 can be sealed watertight on the basket 1121, for example, by first attaching the metal elements 1128 to the basket 1121 and then covering the transition section 11283 with adhesive. Because the transition section 11283 is sealed watertight on the basket 1121, even a small distance between the transition sections 11283 of the two metal elements 1128 prevents a short circuit between them, thus preventing the earphone 10 from burning out.

[0067] Combined with Fig. For example, it can be seen from Figure 25 that the second solder pads 11282 of the two metal elements 1128 can be arranged side by side and spaced apart from each other, wherein one end of the respective transition section 11283 can be connected to the corresponding second solder pad 11282, the two transition sections 11283 extending away from each other, and wherein the respective first solder pad 11281 can be connected to the other end of the corresponding transition section 11283, such that the distance between the first solder pads 11281 of the two metal elements 1128 is greater than the distance between the second solder pads 11282 of the two metal elements 1128. The degree of curvature of the transition section 11283 can correspond to the change tendency of a region on the basket 1121 in which the metal element 1128 is arranged.

[0068] Combined with Fig. For example, as shown in Figure 25, the basket 1121 can comprise an annular circumferential wall 11214 and an annular flange 11215, which is connected to an inner wall surface of the annular circumferential wall 11214, as well as a shoulder 11216, which is provided at the connection point between the annular flange 11215 and the annular circumferential wall 11214. The magnetically conductive cover 1122 can be attached to the annular flange 11215 to facilitate a connection between the magnetically conductive cover 1122 and the basket 1121. The shoulder 11216 serves to support the metal elements 1128, so that the transition sections 11283 can be concealed within the shoulder 11216 and the second solder pads 11282 can be exposed from the shoulder 11216. This facilitates the connection of the coil 1126 with the metal elements 1128 and prevents a short circuit between the transition sections 11283 of the two metal elements 1128.

[0069] Combined with Fig. 23 and Fig. For example, as shown in Figure 25, two steps 11216 can be spaced apart from each other in the circumferential direction of the annular circumferential wall 11214, for example by dividing an original step 11216 into two parts at its center. In this case, each step 11216 can support a metal element 1128. This means that the transition sections 11283 of the two metal elements 1128 can each be concealed within a step 11216. Therefore, even if liquid droplets such as sweat or rainwater accumulate on one of the steps 11216 and the exposed second solder pad 11282, it is difficult for these liquid droplets to flow to the other step 11216 and the exposed second solder pad 11282. This helps to prevent a short circuit between the second solder pads 11282 of the two metal elements 1128.

[0070] Combined with Fig. 19 and Fig. For example, as shown in Figure 23, the coil 1126 can comprise a ring body 11261 and connecting wires 11262 connected to the ring body 11261. The ring body 11261 and the connecting wires 11262 can be a single conductor wire. Based on this, the ring body 11261 can be formed, as required, by winding the aforementioned conductor wire in a predetermined number of turns, and the ring body 11261 can be connected to the diaphragm 1123. The connecting wires 11262 can be both ends of the aforementioned conductor wire; that is, the number of connecting wires 11262 can be two, with each of the two connecting wires 11262 being connected one-to-one to the second solder pads 11282 of the two metal elements 1128.Furthermore, it is provided that the ring body 11261 can be located on the inner side of the basket 1121, for example projecting into the magnetic gap formed between the magnet 1125 and the magnetically conductive cover 1122. The connecting wires 11262 follow the movement of the ring body 11261 relative to the basket 1121 when an excitation signal is applied to the loudspeaker 112, whereby the ring body 11261 drives the diaphragm 1123 to generate sound waves.

[0071] Combined with Fig. Figure 23 shows, for example, that a deflection groove 11217 can be provided on the basket 1121, whereby the orthogonal projection of the connecting wire 11262 in the direction of vibration of the loudspeaker 112 can fall at least partially into the deflection groove 11217. The depth of the deflection groove 11217 can be greater than 0 and less than or equal to 0.2 mm. This allows the deflection groove 11217 to increase the distance between the connecting wire 11262 and the basket 1121 to a certain extent. If the connecting wire 11262 follows the movement of the ring body 11261 relative to the basket 1121, it is therefore made possible that, particularly when operating the loudspeaker 112 with low amplitude, the risk of the connecting wire 11262 impacting the basket 1121 is reduced, and, particularly when operating the loudspeaker 112 with high amplitude, the distance of movement of the connecting wire 11262 after impacting the basket 1121 is shortened.This helps to improve the reliability of the 112 loudspeaker.

[0072] In some embodiments, it is provided that, if no excitation signal is fed into the loudspeaker 112, the distance between the connecting wire 11262 and the bottom of the escape groove 11217 in the direction of vibration of the loudspeaker 1122 can be greater than the maximum movement amplitude of the connecting wire 11262 relative to the basket 1121, thereby further reducing the risk of the connecting wire 11262 impacting the basket 1121 and shortening the movement distance of the connecting wire 11262 after impacting the basket 1121.

[0073] In some embodiments, the deflection groove 11217 can be located near an end of the connecting wire 11262 that is connected to the ring body 11261. That is, the deflection groove 11217 can be provided at a location where the connecting wire 11262 moves relatively more when following the movement of the ring body 11261. This location also corresponds to a point where the risk of the connecting wire 11262 striking the cage 1121 is relatively high. This further reduces the risk of the connecting wire 11262 striking the cage 1121 and shortens the distance the connecting wire 11262 travels after striking the cage 1121.

[0074] Combined with Fig. 23, for example, shows that the connecting wire 11262 can comprise a first extension section 11263, which is connected to the ring body 11261, and a second extension section 11264, which is bent relative to the first extension section 11263, wherein the orthogonal projection of the first extension section 11263 in the direction of vibration of the loudspeaker 112 can fall at least partially into the deflection groove 11217, thereby reducing the risk of the connecting wire 11262 impacting the basket 1121 and shortening the movement distance of the connecting wire 11262 after impacting the basket 1121.In this arrangement, at least a portion of the orthogonal projection of the second extension section 11264, located near the first extension section 11263, can fall into the deflection groove 11217 in the direction of vibration of the loudspeaker 112. This further reduces the risk of the connecting wire 11262 impacting the basket 1121 and shortens the path of travel of the connecting wire 11262 after impact with the basket 1121. Accordingly, the end of the second extension section 11264 furthest from the first extension section 11263 can be connected to the second solder pad 11282. Of course, in some other embodiments, the connecting wire 11262 can be configured as a straight line or as an arc.

[0075] In some embodiments, the ratio of the length of the second extension section 11264 to the length of the first extension section 11263 can be between 2 and 15. If the aforementioned ratio is too small, the amplitude at the end of the second extension section 11264 furthest from the first extension section 11263 can easily remain significant. This can easily lead to the second extension section 11264 breaking or detaching from the second solder pad 11282. If the aforementioned ratio is too large, the second extension section 11264 can easily become too heavy, resulting in excessive tensile stress on the first extension section 11263. Furthermore, this can also easily lead to larger overall dimensions of the loudspeaker 112, which hinders the miniaturization of the product.Furthermore, the distance between the second extension section 11264 and the ring body 11261, in a direction perpendicular to the direction of vibration of the loudspeaker 112 (e.g., in the lateral direction Z), can be between 1.1 mm and 2.1 mm. If the aforementioned distance is too small, the amplitude of the second extension section 11264 can easily remain significant. This can easily lead to the second extension section 11264 colliding with the basket 1121 and breaking or detaching from the second solder pad 11282. If the aforementioned ratio is too large, it easily leads to an excessive weight of the first extension section 11263 and thus to excessive deformation of the first extension section in the direction of the basket 1121, which in turn easily leads to a collision of the first extension section against the basket 1121.Furthermore, this also easily leads to a larger overall dimension of the 112 loudspeaker, which is detrimental to the miniaturization of the product.

[0076] In some embodiments, the angle between the second extension section 11264 and the first extension section 11263 can be an obtuse angle, as in Fig. 23. This contributes to a reduction in the voltage between the second extension section 11264 and the first extension section 11263, thereby improving the reliability of the connecting wire 11262.

[0077] In some embodiments, the distance between at least a part of the second extension section 11264 and the basket 1121 in the direction of vibration of the loudspeaker 112, as in Fig. As shown in Figure 24, the extensions of the second extension section 11264, located near the first extension section 11263 (e.g., in the direction opposite to arrow Y), gradually decrease in the direction of extension away from the first extension section 11263, so that the part of the second extension section 11264 located near the first extension section 11263 and the first extension section 11263 are as far away from the basket 1121 as possible in the direction of vibration of the loudspeaker 112. This reduces the risk of the connecting wire 11262 striking the basket 1121 and shortens the distance the connecting wire 11262 travels after striking the basket 1121.

[0078] In some embodiments, the basket 1121 may have several through-holes 11213 spaced apart around the ring body 11261, with the escape groove 11217 being connected to the through-holes 11213 to simplify the structure of the basket 1121. The orthogonal projection of the second extension section 11264 in the direction of vibration of the loudspeaker 112 may fall at least partially into the through-holes 11213, thereby reducing the area of ​​a potential impact of the second extension section 11264 against the basket 1121 and thus improving the reliability of the loudspeaker 112. The multiple through-holes 11213 can be divided into two groups, whereby the orthogonal projections of the second extension sections 11264 of the two connecting wires 11262 in the direction of vibration of the loudspeaker 112 can fall at least partially into the respective through-holes 11213.Based on this, each group of through holes 11213 can in turn comprise several spaced-apart through holes 11213, as for example in . Fig. 23 four through holes are shown. Naturally, each group of through holes 11213 can only contain a single relatively large through hole 11213.

[0079] Combined with Fig. 23 and Fig. For example, it can be seen from Figure 25 that the basket 1121 may be provided with solder pads which are connected to the connecting wire 11262. The number of these solder pads can be two, with one solder pad serving as the positive terminal of the loudspeaker 112 and the other solder pad as the negative terminal of the loudspeaker 112. These solder pads may be the metal elements 1128 mentioned above, or they may have other configurations known to those skilled in the art and which will not be explained further below. Furthermore, it is provided that the connecting wire 11262 has a first end 1126a, which is located near the ring body 11261, and a second end 1126b, which is located away from the ring body 11261, wherein the second end 1126b can be attached to a corresponding solder pad, for example by soldering the end of the connecting wire 11262 located away from the ring body 11261 to the first solder pad 11281.The ratio of the length of the connecting wire 11262 to the maximum movement amplitude of the coil 1126 relative to the basket 1121 can be between 8 and 75. If the aforementioned ratio is too small, it easily leads to a larger amplitude at the second end 1126b. This can easily cause the connecting wire 11262 to break or detach from the solder pad. If the aforementioned ratio is too large, it easily leads to excessive weight of the connecting wire 11262 and thus to excessive deformation of the connecting wire towards the basket 1121, which in turn can easily cause the connecting wire to collide with the basket 1121. Furthermore, this also easily leads to larger overall dimensions of the loudspeaker 112, which is detrimental to the miniaturization of the product. In conclusion, the present technical solution effectively resolves the technical problem of stress concentration in the connecting wire 11262.

[0080] In some embodiments, the ratio of the diameter of the connecting wire 11262 to its length can be between 50 and 1000. If the aforementioned ratio is too small, the connecting wire 11262 can easily break due to insufficient stiffness. If the aforementioned ratio is too large, the connecting wire 11262 can easily become too heavy, leading to excessive deformation of the connecting wire towards the basket 1121, which in turn can easily cause the connecting wire to collide with the basket 1121.

[0081] In some embodiments, the connecting wire 11262 can be further secured at a mounting position 1126c between the first end 1126a and the second end 1126b on the basket 1121, making it difficult to transmit vibrations of the connecting wire 11262, resulting from its movement following the ring body 11261, to the aforementioned solder pad. This helps to avoid resonance at an end of the connecting wire 11262 located near the aforementioned solder pad, or to shift the peak frequency of the resonance to a higher frequency band (e.g., above 10 kHz), thereby reducing the risk of the connecting wire 11262 breaking or detaching from the aforementioned solder pad. A portion of the connecting wire 11262 located between the first end 1126a and the mounting position 1126c can be suspended relative to the basket 1121.A portion of the connecting wire 11262 located between the second end 1126b and the fastening position 1126c can also be suspended relative to the basket 1121. This reduces the risk of the connecting wire 11262 striking the basket 1121.

[0082] Combined with Fig. 19 and Fig. For example, as shown in Figure 23, a support block 11218 can be provided on the basket 1121, with the support block 11218 being located between the first end 1126a and the second end 1126b and corresponding to the attachment position 1126c. In this case, the connecting wire 11262 can be attached to the support block 11218 at the attachment position 1126c, so that the connecting wire 11262 is at least partially suspended relative to the basket 1121. Since the support block 11218 is part of the structure of the basket 1121, the attachment position 1126c becomes more precise. This helps to avoid the need for a worker to attach the connecting wire 11262 at just any point on the basket 1121, thereby improving product consistency in the mass production of the loudspeaker 112 and consequently increasing the yield.

[0083] It should be noted that in an embodiment where the basket 1121 has several through-holes 11213 spaced apart around the ring body 11261, the support block 11218 can be positioned between two adjacent through-holes 11213, resulting in a simple and reliable structure. Furthermore, the support block 11218 can also serve as a reinforcing rib for the basket 1121 to improve its structural strength. It is also provided that for the connecting wire 11262, which corresponds to either the positive or negative terminal of the loudspeaker 112, several mounting positions 1126c and several corresponding support blocks 11218 can be provided, for example, two or three, etc.

[0084] In some embodiments, the connecting wire 11262 can be attached to the support block 11218 with adhesive 11219, which, after curing, may exhibit elastic properties, such as silicone or similar soft adhesives. This helps to absorb vibrations of the connecting wire 11262 that arise when the ring body 11261 moves, thereby reducing the stresses on the connecting wire 11262 at the attachment point 1126c and decreasing the risk of breakage. Of course, in application scenarios where the risk of breakage is lower, the adhesive 11219 can also be a hard adhesive.

[0085] In some embodiments, the surface of the support block 11218 that contacts the connecting wire 11262 can be provided with a limiting groove. This facilitates greater consistency in the relative positions of the support block 11218 to the connecting wire 11262 during mass production, thereby increasing the product yield. It should be noted that in an embodiment where the connecting wire 11262 is attached to the support block 11218 with the adhesive 11219, the aforementioned guide groove can also serve as an adhesive slot. This facilitates the accumulation of sufficient adhesive 11219 on the support block 11218 to secure the connecting wire 11262.

[0086] In some embodiments, the first length of the connecting wire 11262 between the first end 1126a and the support block 11218 can be greater than the second length of the connecting wire 11262 between the second end 1126b and the support block 11218. This reduces the risk of breakage of the connecting wire 11262 due to an excessively short first length, while the overall length of the connecting wire 11262 remains unchanged. For example, the ratio between the first and second lengths can be between 1 and 12. If this ratio is too small, it can easily lead to a larger amplitude of the connecting wire 11262 at the support block 11218, which can easily cause the connecting wire 11262 to break.

[0087] In some embodiments, when no excitation signal is input to the loudspeaker 112, the first end 1126a and the mounting position 1126c, where the connecting wire 11262 is supported by the support block 11218, are located in a reference plane perpendicular to the direction of vibration of the loudspeaker 112. This helps to reduce the stresses in the connecting wire 11262 and thus reduces the risk of breakage of the connecting wire 11262.

[0088] Combined with Fig. Figure 23 shows, for example, that the second extension section 11264 can be attached to the support block 11218 and the solder pad mentioned above. For example, the second extension section 11264 is soldered to the solder pad mentioned above at its second end 1126b and attached to the support block 11218 at the attachment position 1126c using the adhesive 11219. The end of the second extension section 11264 connected to the first extension section 11263 is considered the starting point of the second extension section 11264, while the second end 1126b is considered the end point of the second extension section 11264, with the position at which the second extension section 11264 is attached to the support block 11218 (e.g. the attachment position 1126c) being located between half the length of the second extension section 11264 and three-quarters of the length of the second extension section 11264.

[0089] Combined with Fig. 19, Fig. 21 and Fig. For example, as shown in Figure 22, the membrane 1123 can comprise a body section 11231, a first annular connecting section 11232, and a second annular connecting section 11233, which are integrally joined, wherein the first annular connecting section 11232 is connected to the coil 1126 and the second annular connecting section 11233 is connected to the surround 1124. The body section 11231 can be configured as a dome-shaped structure projecting away from the coil 1126.Furthermore, it is provided that the orthogonal projection of the second annular connecting section 11233 in the direction of vibration of the loudspeaker 112 can cover the connecting wire 11262, and that the second annular connecting section 11233 is bent relative to the first annular connecting section 11232 towards the side furthest from the coil 1126, so that the second annular connecting section has a distance from the connecting wire 11262 in the direction of vibration of the loudspeaker 1122. This helps to avoid unnecessary contact between the connecting wire 11262 and the surround 1124 or the diaphragm 1123 connected to it.

[0090] Combined with Fig.Figures 19 to 22 show, for example, that the bead 1124 can comprise a third annular connecting section 11241, a folded section 11242, and a fourth annular connecting section 11243, which are integrally joined. The third annular connecting section 11241 can be connected to a side of the second annular connecting section 11233 facing away from the coil 1126, and the fourth annular connecting section 11243 can be connected to the basket 1121 (e.g., the annular circumferential wall 11214) via a reinforcing element 11244. Furthermore, it is provided that the folded section 11242 can protrude away from the connecting wire 11262. This helps to avoid unnecessary impact between the two.

[0091] Based on the foregoing description, the present application provides an electronic device that may include a support arrangement and a core module 11, wherein the aforementioned support arrangement may be connected to the core housing 111 to support the core module 11 at the point of wear when worn. The aforementioned support arrangement may be configured as an ear hook structure (e.g., a hook structure 12) that is suspended from the ear when worn, or as a headband structure that surrounds the top of the head when worn. Furthermore, the aforementioned point of wear may be a position on the user's cheek near the ear, a specific position on the front of the ear, or other physiological body parts of the user. On this basis, the aforementioned electronic device may, in addition to the earphone 10, also be an end device such as smart glasses comprising the core module 11.The core module 11 can include not only the loudspeaker 112 but also a transducer device based on the principle of bone conduction. For example, the electronic device can include a loudspeaker 112, which serves to generate air-conducted sound. Electronic devices that include the loudspeaker 112 can also be end devices such as mobile phones or smartwatches.

[0092] The above-mentioned examples are only some of the embodiments of the present application and do not limit the scope of protection of the present application. Any equivalent transformation with respect to the device or process carried out using the content of the description and drawings of the present application, as well as any direct or indirect application of such content to other related technical fields, also falls within the scope of patent protection of the present application.

Claims

[1] Core module for earphones, characterized by , comprising a core housing, a loudspeaker and a support, wherein the loudspeaker and the support are arranged in the core housing, wherein the carrier and the loudspeaker enclose an acoustic chamber and an acoustic opening is provided in the core housing, wherein the carrier is provided with an acoustic channel, wherein the acoustic channel connects the acoustic opening to the acoustic chamber, wherein a first recording chamber is provided inside the loudspeaker, which is connected to the acoustic chamber, wherein the loudspeaker, the support and the core housing together further form a second receiving chamber which is located outside the loudspeaker and is not connected to the acoustic chamber, wherein the loudspeaker comprises a coil, a basket and metal elements arranged on the basket, wherein the number of metal elements is two, one of which serves as the positive terminal of the loudspeaker and the other as the negative terminal of the loudspeaker, wherein each of the metal elements comprises a first solder pad, a second solder pad and a transition section connecting the first solder pad to the second solder pad, wherein the first solder pad and the second solder pad are exposed from the basket, wherein the first solder pad is located in the first receiving chamber and is connected to the coil, wherein the second solder pad is located in the second receiving chamber, and where the distance between the first solder pads of the two metal elements is greater than the distance between the second solder pads of the two metal elements. [2] Core module according to claim 1, characterized by that the transition section is embedded in the basket or that the transition section is sealed watertight against the basket. [3] Core module according to claim 1 or 2, characterized by, that the second solder pads of the two metal elements are arranged side by side and spaced apart from each other, with one end of each transition section being connected to the corresponding second solder pad, the two transition sections extending away from each other, and the respective first solder pad being connected to the other end of the corresponding transition section. [4] Core module according to any one of claims 1 to 3, characterized by that the second recording room is an enclosed space. [5] Core module according to any one of claims 1 to 4, characterized by that the second recording room has a higher waterproof rating than the first recording room. [6] Core module according to any one of claims 1 to 5, characterized by that the loudspeaker includes a magnetically conductive cover and a magnet, wherein the magnet is arranged within the magnetically conductive cover, the magnet and the magnetically conductive cover form a magnetic gap into which the coil protrudes. [7] Core module according to claim 6, characterized by , that the basket comprises an annular circumferential wall and an annular flange connected to the inner wall surface of the annular circumferential wall, as well as a shoulder provided at the connection point between the annular flange and the annular circumferential wall, the magnetically conductive cover is attached to the ring-shaped flange, the heel serves to support the metal element, and with the second solder pad exposed from the step. [8] Core module according to claim 7, characterized by , that two steps are provided spaced apart from each other in the circumferential direction of the annular circumferential wall, with each step supporting one of the metal elements. [9] Core module according to any one of claims 1 to 8, characterized by, that the basket has a long axis direction and a short axis direction that are perpendicular to the direction of vibration of the loudspeaker and orthogonal to each other, wherein the dimension of the basket in the long axis direction is larger than the dimension of the basket in the short axis direction, and wherein the two metal elements are located at the same end of the long axis direction. [10] Core module according to any one of claims 1 to 9, characterized by that the carrier together with the core housing forms a first adhesive slot, wherein the first adhesive slot at least partially surrounds the acoustic opening, and wherein a first adhesive for sealing a mounting gap between the carrier and the core housing is contained in the first adhesive slot. [11] Core module according to claim 10, characterized by, that the carrier comprises a ring body and a docking part connected to the ring body, wherein the ring body is peripherally mounted on the loudspeaker to form the acoustic chamber, wherein the acoustic channel passes through the docking part and the ring body, wherein the docking part is located between the ring body and the core housing and at least partially surrounds the acoustic opening, and wherein the docking part together with the core housing forms the first adhesive slot. [12] Core module according to claim 11, characterized by , that the docking part is used to form a bottom wall and a side slotted wall of the first adhesive slot, and that the core housing is used to form another side slotted wall of the first adhesive slot. [13] Core module according to any one of claims 1 to 12, characterized by, that the basket comprises a first annular support surface and a second annular support surface, which are formed in the form of a step, wherein the second annular support surface is provided peripherally around the first annular support surface, wherein a part of the lower end of the carrier is supported on the first annular support surface and another part of the lower end of the carrier forms a gap with the second annular support surface, so that the carrier together with the basket and the core housing forms a second adhesive slot, wherein a second adhesive is received in the second adhesive slot, which serves to seal the assembly gaps between any two of the carrier, the basket and the core housing. [14] Core module according to any one of claims 6 to 8, characterized by, that the upper end of the carrier rests on the basket and together with the basket and the magnetically conductive cover forms a third adhesive slot, wherein a third adhesive is received in the third adhesive slot, which serves to seal the mounting gap between the carrier, the basket and the magnetically conductive cover. [15] Core module according to claim 11 or 12, characterized by , that a depression is formed on the inside of the core casing, wherein the acoustic opening is provided at the bottom of the depression, wherein the core module comprises a sound-absorbing mesh arranged in the depression, and the docking part presses the sound-absorbing mesh against the bottom of the depression. [16] Core module according to claim 15, characterized by, that the first adhesive further serves to seal a mounting gap between the carrier and the sound-absorbing mesh and / or a mounting gap between the sound-absorbing mesh and the core housing. [17] Headphones, characterized by , that it comprises a support arrangement and a core module according to one of claims 1 to 16, wherein the support arrangement is connected to the core housing to support the core module in the carrying position when carried.

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