Camera module and electronic device
Patent Information
- Application Number
- DE202024105214
- Authority / Receiving Office
- DE · DE
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-02-20
- Estimated Expiration
- 2034-09-30
Smart Images

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Abstract
Description
BACKGROUNDField of expertise
[0001] The present disclosure relates to a camera module. More particularly, the present disclosure relates to a camera module used in portable electronic devices. Description of the previously known technology
[0002] In recent years, wearable electronic devices have developed rapidly. For example, smart electronic devices and tablets have been introduced into modern people's lives, and camera modules built into wearable electronic devices have also become widespread. However, with technological advancements, the quality requirements for camera modules are also becoming increasingly stringent. Therefore, a camera module that can improve image quality must be developed. SUMMARY
[0003] In one aspect of the present disclosure, a camera module includes an imaging lens assembly, an image sensor, and a magnetic mounting mechanism. The image sensor is for receiving an image signal from the imaging lens assembly. The magnetic mounting mechanism is for determining a state of the image signal of the imaging lens assembly according to the image sensor. The magnetic mounting mechanism includes a magnet holder, a magnet, and an opaque layer, wherein the magnet is disposed on the magnet holder and the opaque layer is attached to an outer surface of the magnet.
[0004] In the camera module of the preceding aspect, the opaque layer may have a part facing a direction toward the image sensor.
[0005] In the camera module of the preceding aspect, the magnet mounting mechanism may further comprise a coil, wherein the magnet and the coil are arranged relative to each other.
[0006] In the camera module of the preceding aspect, the magnet mounting mechanism may further comprise a magnetic sensor member, wherein the magnet and the magnetic sensor member are arranged relative to each other.
[0007] In the camera module of the preceding aspect, the magnetic mounting mechanism may be used to adjust a relative position of the imaging lens assembly and the image sensor to each other.
[0008] In the camera module of the preceding aspect, the magnet mounting mechanism may serve to generate a preload force for supporting the imaging lens assembly.
[0009] In the camera module of the preceding aspect, the magnetic mounting mechanism may be used to adjust the aperture size of an aperture stop.
[0010] In the camera module of the preceding aspect, the magnetic mounting mechanism may further comprise a nanolayer coated on the opaque layer.
[0011] In the camera module of the preceding aspect, the nanolayer may comprise a plurality of nanoparticles irregularly arranged on a surface of the nanolayer.
[0012] In the camera module of the preceding aspect, the nanosheet may include a plurality of nano-protrusions irregularly arranged on a surface of the nanosheet.
[0013] In the camera module of the preceding aspect, the nanolayer may include a plurality of nanoholes irregularly arranged on a surface of the nanolayer.
[0014] In the camera module of the preceding aspect, the opaque layer may comprise a plurality of micron particles to create an irregularly projecting structure on a surface of the opaque layer.
[0015] When the surface of the opaque layer in the camera module of the previous aspect is measured according to ISO 25178, the following condition is met with Y pd for the number of peaks per square millimeter of the microstructure layer: 19000 1 / mm 2 ≤ Y pd ≤ 210000 1 / mm 2 . In addition, the following condition can be met: 25000 1 / mm 2 ≤ Y pd ≤ 120000 1 / mm 2 become.
[0016] When the surface of the opaque layer in the camera module of the preceding aspect is measured according to the ISO 25178 standard, an equivalence line and an area-material ratio curve are obtained. A core surface of the profile elements is defined by 0% to 100% of the equivalence line corresponding to the area-material ratio curve. A reduced peak is a section of the area-material ratio curve that is higher than the core surface and is denoted by Y mr1 for the area-material ratio separating the core surface from the reduced peak, satisfying the following condition: 7% ≤ Y mr1 ≤ 53%. In addition, the following condition can be satisfied: 15% ≤ Y mr1 ≤ 45%.
[0017] When the surface of the opaque layer in the camera module of the preceding aspect is measured according to the ISO 25178 standard, an equivalence line and an area-material ratio curve are obtained. A core surface of the profile elements is defined by 0% to 100% of the equivalence line corresponding to the area-material ratio curve. A reduced peak is a section of the area-material ratio curve that is higher than the core surface. With Aph for the average height of the reduced peak, the following condition is satisfied: 0.5 µm ≤ Aph ≤ 42.5 µm. In addition, the following condition can be satisfied: 4.5 µm ≤ Aph ≤ 35.5 µm.
[0018] When the surface area of the opaque layer in the camera module of the preceding aspect is measured according to ISO 25178, with Hpq for the number of peaks of a microstructure layer larger than the core surface and larger than 4 µm, the following condition is met: 0 ≤ Hpq ≤ 430. In addition, the following condition can be met: 15 ≤ Hpq ≤ 300.
[0019] In the camera module of the previous aspect, the opaque layer can completely cover the magnet.
[0020] In one aspect of the present disclosure, an electronic device includes the camera module of the preceding aspect. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The present disclosure will be better understood upon reading the following detailed description of the embodiment with reference to the accompanying drawings, in which: Fig. 1A is a schematic exploded view of a camera module in the first embodiment of the present disclosure, Fig. 1B is a schematic view of a first magnetic holder and an opaque layer of the camera module of Fig. 1A, Fig. 1C is a schematic view of the first magnet holder, the first magnets and the opaque layer of the 1st example of the 1st embodiment of Fig. 1A, Fig. 1D is an enlarged schematic view of part 1D in Fig. 1C, Fig. 1E is a schematic view of the first magnet holder, the first magnets and the opaque layer of the second example of the first embodiment of Fig. 1A, Fig. 1F is an enlarged schematic view of part 1F in Fig. 1E, Fig. 1G is an enlarged schematic view of the opaque layer, the micron particles and nano-protrusions on the first magnet of the 3rd example of the 1st embodiment of Fig. 1A is, Fig. 1H is an enlarged schematic view of the opaque layer, the micron particles and nanoholes on the first magnet of the 4th example of the 1st embodiment of Fig. 1A, Fig. 2A is a schematic view of a camera module in the second embodiment of the present disclosure, Fig. 2B a three-dimensional schematic view of the magnet holder, the magnets and the opaque layers of the 1st example of the 2nd embodiment of Fig. 2A is, Fig. 2C a schematic view of the magnets, the opaque layers and an adhesive of the 1st example of the 2nd embodiment of Fig. 2B, Fig. 2D a three-dimensional schematic view of the magnet holder and the opaque layers of the 2nd example of the 2nd embodiment of Fig. 2A, Fig. 2E a schematic view of the magnets, the opaque layers and an adhesive of the 2nd example of the 2nd embodiment of Fig. 2D, Fig. 3A is a schematic exploded view of a camera module in the 3rd embodiment of the present disclosure, Fig. 3B is a schematic view of the magnet holder, the magnets and the opaque layers of the camera module of the Fig. 3A, Fig. 4A is a schematic view of an electronic device of the 4th embodiment of the present disclosure, Fig. 4B is another schematic view of the electronic device of the 4th embodiment of the Fig. 4A, Fig. 4C is a schematic view of an electronic device of the 4th embodiment of the Fig. 4A captured image, Fig. 4D is another schematic view of the electronic device of the 4th embodiment of the Fig. 4A captured image, Fig. 4E is the other schematic view of the electronic device of the 4th embodiment of the Fig. 4A captured image, Fig. 5 is a schematic view of an electronic device of the 5th embodiment of the present disclosure, Fig. 6A is a schematic view of a vehicle instrument of the 6th embodiment of the present disclosure, Fig. 6B is another schematic view of the vehicle instrument of the 6th embodiment of the Fig. 6A, Fig. 6C is another schematic view of the vehicle instrument of the 6th embodiment of the Fig. 6A. DETAILED DESCRIPTION
[0022] The present disclosure provides a camera module including an imaging lens array, an image sensor, and a magnet mounting mechanism. The image sensor is for receiving an image signal from the imaging lens array. The magnet mounting mechanism is for determining a state of the image signal of the imaging lens array according to the image sensor. The magnet mounting mechanism includes a magnet holder, a magnet, and an opaque layer. The magnet is disposed on the magnet holder. The opaque layer is attached to an outer surface of the magnet. Thus, the present disclosure provides the camera module with the magnet and the surface of the magnet with the opaque layer, which is beneficial for reducing the possibility of generating stray light by providing the matte magnet to prevent the surface of the magnet from having a metallic luster.Furthermore, since the state of the image signal of the imaging lens assembly would be changed by movement between mechanisms such as the magnetic mounting mechanism, some of the light in the camera module would result in a situation that is unexpected for light simulation. Therefore, the design of the present disclosure is advantageous for ensuring the quality of the image signal by reducing the possibility of the above situation.
[0023] In particular, the magnet mounting mechanism may be a dynamic moving coil drive mechanism or a rotating magnet drive mechanism. The dynamic moving coil drive mechanism may have a fixed magnet holder or both a movable magnet holder and a fixed magnet holder. The rotating magnet drive mechanism may have a movable magnet holder or both a movable magnet holder and a fixed magnet holder. The present disclosure is not limited thereto.
[0024] The state determined by the magnetic mounting mechanism is that the magnetic mounting mechanism can be configured to ensure the autofocus function of the camera module, the image stabilization of the camera module, the aperture adjustment function of the camera module, and the circuit control function of the camera module: that is, the above-mentioned functions are particular embodiments for determining the state of the image signal of the imaging lens assembly relative to the image sensor, and the present disclosure is not limited thereto.
[0025] In addition, the magnet may be attached to the magnet holder by adhesive or may be directly magnetically attached to the magnet holder, but the present disclosure is not limited to this.
[0026] The opaque layer may have a portion facing toward the image sensor. Since high-intensity non-imaging light is easily generated at the location where the magnetic mounting mechanism is close to the image sensor, it is advantageous for effectively preventing non-imaging light from falling onto the image sensor.
[0027] The magnet mounting mechanism may further comprise a coil, wherein the magnet and the coil are arranged relative to each other. Therefore, a driving force for the magnet mounting mechanism can be generated by appropriately arranging the magnet and the coil, ensuring the dynamic change of the image signal.
[0028] The magnet mounting mechanism may further comprise a magnetic sensor element, wherein the magnet and the magnetic sensor element are arranged relative to each other. This is advantageous for controlling the sensitivity of the magnet mounting mechanism.
[0029] The magnetic mounting mechanism is used to adjust the relative position of the imaging lens assembly and the image sensor. This is advantageous for implementing the autofocus function or image stabilization. If the imaging lens assembly and the image sensor can be moved relative to each other in a vertical and parallel direction, this can lead to the implementation of the autofocus function or image stabilization.
[0030] The magnetic mounting mechanism serves to generate a biasing force to support the imaging lens assembly. Specifically, the relative position of the imaging lens assembly and the image sensor can be maintained in a state of equilibrium by the biasing force. This is beneficial for achieving assembly stability.
[0031] The magnetic mounting mechanism is used to adjust the aperture size of an aperture diaphragm. This is advantageous for achieving the aperture adjustment function through the adjustable aperture diaphragm.
[0032] Additionally, the magnetic mounting mechanism may include a nanolayer deposited on the opaque layer. This is advantageous for maintaining low surface reflectivity by also placing the nanolayer on top of the opaque layer.
[0033] The nanolayer can comprise a plurality of nanoparticles irregularly arranged on a surface of the opaque layer. The gradual refractive index can thus be created by stacking the nanoparticles in such a way that the reflectivity is reduced.
[0034] The nanolayer may comprise a plurality of nanoprotrusions irregularly arranged on a surface of the opaque layer. This is advantageous for ensuring a coating process with good suitability for mass production.
[0035] The nanolayer can comprise a multitude of nanoholes irregularly arranged on a surface of the opaque layer. The gradual refractive index can thus be created by stacking the nanoparticles in such a way that the reflectivity decreases.
[0036] The opaque layer may comprise a plurality of micron particles to create an irregularly protruding structure on a surface of the opaque layer. This is advantageous for providing a surface of the magnet with lower reflectivity by applying a coating form with better matting ability. Specifically, the micron particles for absorbing incident light may be made of black carbon material, acrylic material, silicon dioxide, siliceous alumina, or metal material. The micron particles may create an irregularly protruding structure on the opaque layer, which is beneficial for reducing the possibility of generating stray light by effectively diffracting the high-intensity incident light. The opaque layer may further comprise an opaque coating material, which is beneficial for increasing its adhesion to attach the micron particles to the magnet.The opaque coating material may consist of, but is not limited to, black pigments, organic solvents, or resins.
[0037] When the surface of the opaque layer is measured according to ISO 25178, Y pd is defined as the number of peaks per square millimeter of the microstructure layer that meets the following condition: 19000 1 / mm 2 ≤ Y pd ≤ 210000 1 / mm 2 . In addition, the following condition can be met: 25000 1 / mm 2 ≤ Y pd ≤ 120000 1 / mm 2 .
[0038] When the surface of the opaque layer is measured according to ISO 25178, an equivalence line and an area-material ratio curve are obtained. A core surface of the profile elements is defined by 0% to 100% of the equivalence line corresponding to the area-material ratio curve. A reduced peak is a section of the area-material ratio curve that is higher than the core surface. Y mr1 is the area-material ratio separating the core surface from the reduced peak, satisfying the following condition: 7% ≤ Y mr1 ≤ 53%. In addition, the following condition can be satisfied: 15% ≤ Y mr1 ≤ 45%.
[0039] When the surface of the opaque layer is measured according to ISO 25178, the equivalence line and the area-material ratio curve are obtained. A core surface of the profile elements is defined by 0% to 100% of the equivalence line corresponding to the area-material ratio curve. The reduced peak is the section of the area-material ratio curve that is higher than the core surface. With Aph for the mean height of the reduced peak, the following condition is satisfied: 0.5 µm ≤ Aph ≤ 42.5 µm. In addition, the following condition can be satisfied: 4.5 µm ≤ Aph ≤ 35.5 µm.
[0040] When the surface area of the opaque layer is measured according to ISO 25178, with Hpq for the number of peaks of the microstructure layer larger than the core surface and larger than 4 µm, the following condition is met: 0 ≤ Hpq ≤ 430. In addition, the following condition can be met: 15 ≤ Hpq ≤ 300.
[0041] The above-mentioned conditions define the measurement according to the ISO 25178 standard of the various partial areas of the opaque layer of the present disclosure, which can exhibit different measurement data. The opaque layer of the present disclosure has at least one part that can satisfy one of the above-mentioned conditions. That is, if the surface roughness parameters can satisfy any of the above-mentioned conditions, the reflection of visible light can be effectively prevented, resulting in a suitable coated surface for use in the camera module.
[0042] In addition, the opaque layer can completely cover the magnet. This is beneficial for the manufacturability of a blackened magnet.
[0043] The present disclosure provides an electronic device including the above-mentioned camera module. <1. Embodiment>
[0044] Fig. 1A is a schematic exploded view of a camera module 100 in the first embodiment of the present disclosure. Fig. 1B is a schematic view of a first magnet holder 131 and an opaque layer 133 of the camera module 100 of the Fig. 1A. In Fig. 1A and Fig. 1B, the camera module 100 includes an imaging lens array 110, an image sensor 120, and a magnetic mounting mechanism (the reference numeral of which has been omitted). The image sensor 120 is for receiving an image signal from the imaging lens array 110, and the magnetic mounting mechanism is for determining a state of the image signal of the imaging lens array 110 corresponding to the image sensor 120. In particular, in the first embodiment, the magnetic mounting mechanism serves to ensure the autofocus function and the circuit control function of the camera module 100.
[0045] Specifically, the imaging lens assembly 110 may include at least one lens element (the reference numeral of which has been omitted), and the image sensor 120 may be disposed on the image side of the imaging lens assembly 110. The camera module 100 may further include a base 150, and the image sensor 120 may be disposed on the image side of the imaging lens assembly 110 by being disposed on the base 150.
[0046] The magnet mounting mechanism comprises a magnet holder, a magnet and an opaque layer 133, wherein in the first embodiment the Fig. 1A, the magnet holder comprises the first magnet holder 131 and a second magnet holder 141, the magnet comprises at least one first magnet 132 and at least one second magnet 142, wherein the number of each of the at least one first magnet 132 and at least one second magnet 142 is two. The first magnets 132 are arranged on the first magnet holder 131, the second magnets 142 are arranged on the second magnet holder 141. In Fig. 1B, the number of opaque layers 133 is four, arranged on outer surfaces of the first magnets 132 and the second magnets 142, respectively. All opaque layers 133 face the image sensor 120.
[0047] The magnet mounting mechanism may further include two coils 134 and a magnetic sensor element 135. The two coils 134 are arranged on two outer sides of the first magnet holder 131 and are respectively arranged relative to the two coils 142 of the second magnet holder 141, with the two outer sides of the first magnet holder 131 being relative to each other. The first magnets 132 and the magnetic sensor element 135 are arranged relative to each other.
[0048] In particular, in the first embodiment the Fig. 1A, the first magnet holder 131 is a movable magnet holder, the first magnets 132 are sensor magnets, and the second magnets 142 are drive magnets, but the present disclosure is not limited to this. Thus, the magnet mounting mechanism is advantageous for adjusting the relative position between the imaging lens assembly 110 and the image sensor 120. Furthermore, the camera module 100 may include holding members 151, 152, each connected to the first magnet holder 131, so that this is favorable for the movement and resetting of the first magnet holder 131 and for providing a biasing force for holding the imaging lens assembly 110.
[0049] Fig. Fig. 1C is a schematic view of the first magnet holder 131, the first magnets 132 and the opaque layer 133 of the 1st example of the 1st embodiment of Fig. 1A. In Fig. 1C, each of the first magnets 132 may be disposed on the first magnet holder 131 with the adhesive 1321. The adhesive 1321 may also be applied between the opaque layer 133 and each of the first magnets 132. In other embodiments, the opaque layer may be applied directly to the first magnet, and the present disclosure is not limited thereto.
[0050] Fig. Figure 1D is an enlarged schematic view of part 1D in Fig. 1C. In Fig. 1D, the opaque layer 133 may comprise a plurality of micron particles 1331 to create an irregularly protruding structure on a surface of the opaque layer 133. Furthermore, the magnet mounting mechanism may comprise a nanolayer (the reference numeral of which has been omitted) deposited on the opaque layer, the nanolayer comprising a plurality of nanoparticles 1361 irregularly arranged on a surface of the opaque layer 133. Furthermore, an opaque coating material 137 may be deposited on the micron particles 1331, which is advantageous for securing the micron particles 1331 to each of the first magnets 132 and also advantageous for securing the nanolayer to the opaque layer 133 by arranging the nanoparticles 1361 of the nanolayer on the opaque coating material 137.In addition, the opaque layer 133 associated with each of the second magnets 142 may have the same or similar structures and features as the opaque layer 133 associated with each of the first magnets 132 and will not be described again here.
[0051] When the surface area of the opaque layer in Example 1 of Embodiment 1 is measured according to ISO 25178, Y pd is the number of peaks per square millimeter of a microstructured layer, an equivalence line and an area-material ratio curve are obtained, a core surface of the profile elements is defined by 0% to 100% of the equivalence line corresponding to the area-material ratio curve, a reduced peak is a section of the area-material ratio curve that is higher than the core surface, Y mr1 is the area-material ratio separating the core surface from the reduced peak, Aph is the mean height of the reduced peak, Hpq is the number of peaks of a microstructured layer larger than the core surface and larger than 4 µm, and the values of the opaque layer 133 of 63 samples (TEST1 to TEST63) are given in Table 1 below.It should be noted that the following embodiments and examples can also meet the parameters given in Table 1. Tabelle 1 Parameter Ypd (1 / mm2) Ymr1 (%) Aph (µm) Hpq Vergrößerung 480x 480x 2400x 2400x analysierter Bereich 500µm×500µm 500µm×500µm 100µm×100µm 100µm×100µm gemessene Größe 1024×768 1024×768 1024×768 1024×768 gemessener Abstand 0,5 µm 0,5 µm 0,2 µm 0,2 µm TEST1 81449 10.52 2.12 3 TEST2 105688 15.87 6.65 32 TEST3 66182 16.80 5.02 34 TEST4 29425 15.00 7.14 95 TEST5 54561 16.18 7.95 120 TEST6 59599 14.00 7.98 50 TEST7 89945 38.18 9.56 111 TEST8 74526 16.33 2.41 0 TEST9 101130 15.76 8.06 48 TEST10 57714 7.32 4.06 14 TEST11 49319 17.65 5.65 110 TEST12 69232 21.65 18.41 202 TEST13 35452 20.30 9.74 0 TEST14 44524 26.72 6.69 41 TEST15 54933 9.95 9.30 45 TEST16 54865 13.92 10.55 51 TEST17 65826 21.40 12.86 60 TEST18 59339 21.81 12.23 65 TEST19 42491 24.66 11.34 0 TEST20 37109 27.26 17.17 64 TEST21 38562 18.77 8.87 58 TEST22 26416 23.71 11.74 126 TEST23 90693 23.30 11.10 14 TEST24 19245 52.17 41.12 288 TEST25 84375 44.88 34.79 395 TEST26 145955 13.95 1.04 0 TEST27 27845 5.46 0.48 0 TEST28 56246 9.99 1.95 0 TEST29 48750 22.63 2.63 15 TEST30 16788 3.18 1.79 0 TEST31 140944 12.73 1.11 0 TEST32 146147 12.29 1.19 0 TEST33 155187 12.49 0.98 0 TEST34 159981 13.87 1.65 1 TEST35 142904 11.92 0.63 1 TEST36 152850 12.62 0.86 0 TEST37 152642 14.82 1.02 0 TEST38 162486 12.65 0.86 0 TEST39 164971 12.42 1.08 0 TEST40 132809 11.93 1.33 0 TEST41 156760 11.20 0.60 0 TEST42 151033 11.58 0.97 0 TEST43 158969 15.10 1.43 1 TEST44 115561 11.13 1.47 0 TEST45 47862 32.46 7.93 0 TEST46 61292 27.20 12.33 15 TEST47 146159 15.94 2.13 2 TEST48 127454 15.26 1.75 0 TEST49 122904 15.03 1.88 0 TEST50 132192 14.93 1.35 0 TEST51 138519 25.20 2.58 0 TEST52 155695 10.71 0.96 0 TEST53 130792 12.57 1.59 1 TEST54 128907 10.09 2.19 1 TEST55 141349 12.63 1.58 1 TEST56 143538 11.85 1.45 1 TEST57 149008 13.69 1.36 1 TEST58 134673 18.95 2.47 1 TEST59 131276 11.18 1.73 0 TEST60 130187 10.84 1.65 0 TEST61 129535 11.08 2.24 1 TEST62 151609 12.76 1.44 1 TEST63 150401 12.68 1.09 0
[0052] Fig. Fig. 1E is a schematic view of the first magnet holder 131, the first magnets 132 and the opaque layer 133 of the 2nd example of the 1st embodiment of Fig. 1A. In Fig. 1E, each of the first magnets 132 may be arranged on the first magnet holder 131 by adhesive 1321, and the opaque layer 133 may be applied directly to each of the first magnets 132.
[0053] Fig. Figure 1F is an enlarged schematic view of area 1F in Fig. 1E. In Fig. 1F, the opaque layer 133 may comprise a plurality of micron particles 1331 to create an irregularly protruding structure on a surface of the opaque layer 133. Furthermore, the magnet mounting mechanism may further comprise a nanolayer (the reference numeral of which has been omitted) deposited on the opaque layer 133, wherein the nanolayer comprises a plurality of nanoparticles 1361 irregularly arranged on a surface of the opaque layer 133. Furthermore, an opaque coating material 137 may be deposited on the micron particles 1331, which is advantageous for securing the micron particles 1331 to each of the first magnets 132 and also advantageous for securing the nanolayer to the opaque layer 133 by arranging the nanoparticles 1361 of the nanolayer on the opaque coating material 137.
[0054] Fig. Figure 1G is an enlarged schematic view of the opaque layer 133, the micron particles 1331 and the nanoprotrusions 1362 on the first magnet 132 of the 3rd example of the 1st embodiment of Fig. 1A. In Fig. 1G, the opaque layer 133 may comprise a plurality of micron particles 1331 to create an irregularly protruding structure on the surface of the opaque layer 133. Furthermore, the magnet mounting mechanism may further comprise a nanolayer coated on the opaque layer, wherein the nanolayer comprises a plurality of nanoprotrusions 1362 arranged irregularly on a surface of the opaque layer 133. Furthermore, an opaque coating material 137 may be coated on the micron particles 1331, which is advantageous for securing the micron particles 1331 to each of the first magnets 132 and also advantageous for securing the nanolayer to the opaque layer 133 by arranging the nanoprotrusions 1362 of the nanolayer on the opaque coating material 137.
[0055] Fig. Figure 1H is an enlarged schematic view of the opaque layer 133, the micron particles 1331 and the nanoholes 1363 on the first magnet 132 of the 4th example of the 1st embodiment of Fig. 1A. In Fig. 1H, the adhesive 1321 can also be applied between the opaque layer 133 and the first magnet 132. The opaque layer 133 can comprise a plurality of micron particles 1331 to create an irregularly protruding structure on a surface of the opaque layer 133. Furthermore, the magnet mounting mechanism can further comprise a nanolayer (the reference numeral of which has been omitted) deposited on the opaque layer 133, wherein the nanolayer comprises a plurality of nanoholes 1363 irregularly arranged on a surface of the opaque layer 133. In addition, an opaque coating material 137 may be applied to the micron particles 1331, which is advantageous for attaching the micron particles 1331 to each of the first magnets 132, and is also advantageous for attaching the nanolayer to the opaque layer 133 by arranging the nanoholes 1363 of the nanolayer on the opaque coating material 137. <2nd embodiment>
[0056] Fig. 2A is a schematic view of a camera module 200 in the second embodiment of the present disclosure. In Fig. 2A, the camera module 200 includes an imaging lens assembly 210, an image sensor 220, and a magnetic mounting mechanism (the reference numeral of which has been omitted). The image sensor 220 is for receiving an image signal from the imaging lens assembly 210, and the magnetic mounting mechanism is for determining a state of the image signal of the imaging lens assembly 210 corresponding to the image sensor 220. Specifically, in the second embodiment, the magnetic mounting mechanism serves to ensure the aperture adjustment function of the camera module 200.
[0057] In detail, the imaging lens arrangement 210 may include at least one lens element (the reference numeral of which has been omitted) and the image sensor 220 is arranged on the image side of the imaging lens arrangement 210.
[0058] The magnet mounting mechanism comprises in the 2nd embodiment of the Fig. 2A, a magnet holder 231, magnets 232, and opaque layers 233, wherein the number of magnets 232 is two, arranged on the side of the magnet holder 231 and relative to each other. The number of opaque layers 233 is also two, each arranged on the outer surfaces of the magnets 232.
[0059] The magnet mounting mechanism may further include two coils 234, each arranged relative to the magnets 232. Specifically, the coils are arranged on the inner wall of the base 250 by the coil positioning part 2341. The base 250 covers the magnet holder 231 so that the coils 234 and the magnets 232 can be located relative to each other. Furthermore, an object-side end surface of the base 250 includes an adjustable aperture 261 and a fixing part 262 for positioning the adjustable aperture 261 on the base 250. In the second embodiment, the magnets 232 of the magnet mounting mechanism may be drive magnets for adjusting the size of the adjustable aperture 261 to control the aperture of the camera module 200.
[0060] Fig. Fig. 2B is a three-dimensional schematic view of the magnet holder 231, the magnets 232, and the opaque layers 233 of the 1st example of the 2nd embodiment of Fig. 2A. Fig. Figure 2C is a schematic view of the magnets 232, the opaque layers 233 and an adhesive 2321 of the 1st example of the 2nd embodiment of Fig. 2B. In Fig. 2B and Fig. 2C, the magnets 232 are attached to the magnet holder 231 by the adhesive 2321. A portion of the opaque layers 233 is attached to the outer surface of each of the magnets 232. Another portion of the opaque layers 233 is bonded to the adhesive 2321 and the magnet holder 231, respectively.
[0061] Fig. Figure 2D is a three-dimensional schematic view of the magnet holder 231 and the opaque layers 233 of the 2nd example of the 2nd embodiment of Fig. 2A. Fig. Figure 2E is a schematic view of the magnets 232, the opaque layers 233 and an adhesive 2321 of the 2nd example of the 2nd embodiment of Fig. 2D, In Fig. 2D and Fig. 2E, each of the opaque layers 233 completely covers each of the magnets 232, the magnets 232 covered by the opaque layers 233 are attached to the magnet holder 231 by the adhesive 2321.
[0062] It should be noted that the opaque layers 233 of the 1st example and the 2nd example of the 2nd embodiment may be similar to the opaque layer 133 of each of the 1st, 2nd and 3rd examples of the 1st embodiment, with micron particles 1331 and nanolayer, etc., and will not be described again here. <3rd embodiment>
[0063] Fig. 3A is a schematic exploded view of a camera module 300 in the 3rd embodiment of the present disclosure. Fig. Figure 3B is a schematic view of a magnet holder 331, the magnets 332 and the opaque layers 333 of the camera module 300 of the Fig. 3A. In Fig. 3A and Fig. 3B, the camera module 300 includes an imaging lens array 310, an image sensor 320, and a magnetic mounting mechanism (the reference numeral of which has been omitted). The image sensor 320 is for receiving an image signal from the imaging lens array 310, and the magnetic mounting mechanism is for determining a state of the image signal of the imaging lens array 310 corresponding to the image sensor 320. In particular, in the third embodiment, the magnetic mounting mechanism is for ensuring the autofocus function and the circuit control function of the camera module 300.
[0064] Specifically, the imaging lens array 310 may include at least one lens element (the reference numeral of which has been omitted) and the image sensor 320 is arranged on the image side of the imaging lens array 310.
[0065] The magnet mounting mechanism comprises a magnet holder 331, the magnets 332 and the opaque layers 333, wherein in the 3rd embodiment the Fig. 3A and Fig. 3B, both the number of magnets 332 and the number of opaque layers 333 are four, with the four magnets 332 each arranged at one of the four corners of the magnet holder 331. A portion of each of the opaque layers 333 faces the image sensor 320.
[0066] The magnet mounting mechanism may further include coils 3341, 3342 and magnetic sensor members 335. Specifically, the coil 3341 is arranged around the outside of the imaging lens assembly 310, and relative to the four magnets 332 of the magnet holder 331. In addition, the number of coils 3342 is also four, which are arranged at four corners of a support member 3343. The support member 3343 is arranged on the image side of the magnet holder 331, and the four coils 3342 are arranged relative to the four magnets 332. The number of magnetic sensor members 335 is two, wherein the magnetic sensor members 335 are arranged on the support member 3343 and are adjacent to two of the coils 3342 and relative to two of the magnets 332. In addition, the camera module 300 can also comprise a filter 360, which is arranged on the support member 3343 and relative to the image sensor 320.In addition, the camera module 300 can also include support members 351, 352, 353, wherein the support member 351 is mounted between the imaging lens assembly 310 and the magnet holder 331, the support members 352 are mounted between the support member 3343 and the base 350, wherein the support member 353 serves to receive and support the image sensor 320 and is mounted to the base 350 via a mounting member 3201. Thus, through the interaction of the magnet mounting mechanism and the support members 351, 352, and 353, a relative position of the imaging lens assembly 310 and the image sensor 320 can be adjusted to one another, and a preload force for supporting the imaging lens assembly 310 can be created.
[0067] It should be noted that the opaque layers 333 of the 3rd embodiment may be similar to the opaque layer 133 of each of the 1st, 2nd and 3rd examples of the 1st embodiment, with micron particles 1331 and nanolayer, etc., and will not be described again here. <4th Embodiment>
[0068] Fig. 4A is a schematic view of an electronic device 10 of the 4th embodiment of the present disclosure. Fig. Fig. 4B is another schematic view of the electronic device 10 of the 4th embodiment of the Fig. 4A. As in Fig. 4A and Fig. 4B, the electronic device 10 is a smartphone. The electronic device 10 includes camera modules and a user interface 10a. Specifically, the camera modules are a high-resolution camera module 11, an ultra-wide-angle camera module 12, and two telephoto camera modules 13, 14, and the user interface 10a is a touchscreen, but the present disclosure is not limited to this. In particular, each of the camera modules may be any of the examples of the above-mentioned first to third embodiments, and is not limited thereto.
[0069] A user enters a capture mode via the user interface 10a. The user interface 10a is used to display the subject, and the capture angle can be manually adjusted to switch between different camera modules. At this time, the camera modules capture image-forming light on the respective image sensor (not shown in the figures), and electronic signals relating to images are output to an image signal processor (ISP) 15.
[0070] As in Fig. 4A, the electronic device 10 may further include an optical anti-shake mechanism (not shown in the figures) according to the camera characteristics of the electronic device 10. Furthermore, the electronic device 10 may include at least one focus assist module (not shown in the figures) and at least one sensor component (not shown in the figures). The focus assist module may be a flash module 16, an infrared ranging component, a laser focusing module, etc. The flash module serves to compensate for color temperature. The sensor component may include torque and kinetic energy sensing functions, such as an accelerometer, gyroscope, and Hall effect element, to detect shaking or jitter that may be exerted by the user's hands or external influences.Accordingly, the autofocus function and the optical anti-shake mechanism of the imaging lens array provided to the electronic device 10 can contribute to achieving high image quality and allow the electronic device 10 of the present disclosure to have a shooting function with multiple shooting modes, such as taking optimized selfies, high depth of field (HDR) under low light sources, 4K resolution recording, etc. Furthermore, the user can view the image captured by the camera through the user interface 10a and manually adjust the subject detection area on the user interface 10a to achieve an autofocus function based on the principle of "what you see is what you get."
[0071] Furthermore, the camera modules, the optical anti-shake mechanism, the sensor component, and the focus assist module may be arranged on a flexible printed circuit board (FPC) (not shown in the figures) and electrically connected to the image signal processor 15, etc., via a connector (not shown in the figures) to perform a shooting operation. Current electronic devices such as smartphones strive for thinness and light weight. The camera modules and related parts are arranged on an FPC (flexible printed circuit board), and circuits are assembled into a main board of the electronic device through a connector.This can therefore meet the mechanical design constraints of limited space in the electronic device and the circuit design requirements, achieving greater flexibility. It is also advantageous for making the autofocus function of the camera modules more flexibly adjustable via a touchscreen of the electronic device. In the fourth embodiment, the electronic device 10 may include a plurality of sensor parts and a plurality of focus assist modules, and the sensor parts and the focus assist modules are arranged on a flexible printed circuit board (FPC) and at least one other FPC (not shown in the figures) and electrically connected to the image signal processor 15, etc., via a corresponding connector to perform the capturing operation.In other embodiments (not shown in the figures), the sensor parts and the auxiliary optical elements may also be arranged on a main board of an electronic device or boards of other types depending on the mechanical design and the requirements of the circuit design.
[0072] In addition, the electronic device 10 may also include, but is not limited to, a display, a control unit, a storage unit, a volatile memory (RAM), a read-only memory (ROM), or combinations thereof.
[0073] Fig. Fig. 4C is a schematic view of a signal generated by the electronic device 10 in the 4th embodiment of the Fig. 4A. As shown in Fig. As shown in Fig. 4C, a wider range image can be captured by the ultra-wide angle lens camera module 12 having a multi-view function.
[0074] Fig. Fig. 40 is another schematic view of the signal generated by the electronic device 10 in the 4th embodiment of the Fig. 4A. As shown in Fig. As shown in Fig. 4D, a high-resolution image of a specific area can be captured by the high-resolution camera module 11, which has a function of high resolution and low distortion.
[0075] Fig. Fig. 4E is another schematic view of a circuit connected to the electronic device 10 in the 4th embodiment of the Fig. 4A. As shown in Fig. As shown in Figure 4E, a distant image can be captured and magnified by the telephoto lens camera modules 13, 14, which have a high magnification function.
[0076] As in the Fig. 4C to Fig. As shown in Figure 4E, a zoom function can be obtained with the electronic device 10 when an image is captured by different camera modules with different focal lengths and processed by an image processing function. <5th Embodiment>
[0077] Fig. 5 is a schematic view of an electronic device 20 in the 5th embodiment of the present disclosure. As shown in Fig. As shown in FIG. 5, the electronic device 20 is a smartphone that includes multiple camera modules. Specifically, the camera modules are two ultra-wide-angle lens camera modules 21, 22, two wide-angle lens camera modules 23, 24, and four telephoto lens camera modules 25, 26, 27, 28. The camera module 29 is a time-of-flight (TOF) module and may be a camera module of other types, and is not limited to the present arrangement. Specifically, each of the camera modules may be any of the examples according to the above-mentioned first to third embodiments, and is not limited thereto.
[0078] In addition, the camera modules 27, 28 may have optical path folding, but the present disclosure is not limited to this.
[0079] According to the camera characteristics of the electronic device 20, the electronic device 20 may further include an optical anti-shake mechanism (not shown in the figures). Furthermore, the electronic device 20 may include at least one focusing assist module (not shown in the figures) and at least one sensor component (not shown in the figures). The focusing assist module may be a flash module 20a, an infrared ranging component, a laser focusing module, etc. The flash module 20a serves to compensate for color temperature. The sensor component may include torque and kinetic energy sensing functions, such as an accelerometer, gyroscope, and Hall effect element, to detect shaking or trembling caused by the user's hands or external influences.Accordingly, the autofocus function and the optical anti-shake mechanism of the camera modules with which the electronic device 20 is provided can contribute to achieving high image quality and allow the electronic device 6 of the present disclosure to have a recording function with multiple recording modes, such as taking optimized selfies, high depth of field (HDR) under low light sources, 4K resolution recording, etc.
[0080] Furthermore, all other elements and arrangements in the 5th embodiment are the same as the elements and arrangements in the 4th embodiment and will not be described again here. <6th Embodiment>
[0081] Fig. 6A is a schematic view of a vehicle instrument 30 according to the 6th embodiment of the present disclosure. Fig. Fig. 6B is another schematic view of the vehicle instrument 30 according to the 6th embodiment of the Fig. 6A. Fig. Fig. 6C is another schematic view of the vehicle instrument 30 according to the 6th embodiment of the Fig. 6A. In the Fig. 6A to 6C, the vehicle instrument 30 includes a plurality of camera modules 31. In the 6th Embodiment, the number of camera modules 31 is six, and the camera modules 31 may be camera modules according to any example of the above-mentioned 1st Embodiment to 3rd Embodiment, but the present disclosure is not limited thereto.
[0082] In Fig. 6A and Fig. 6B, the camera modules 31 are motor vehicle camera modules, with two of the camera modules 31 being located on the left and right sides below the rearview mirrors, respectively. The aforementioned camera modules 31 are configured to record image information within a viewing angle θ. In particular, the viewing angle θ can satisfy the following condition: 40° < θ < 90°. Thus, image information in the area of two lanes on the left and right sides can be recorded.
[0083] In Fig.6B, two additional camera modules 31 can be arranged in the interior of the vehicle instrument 30. In particular, the two mentioned camera modules 31 are arranged at a location near the rearview mirror inside the vehicle instrument 30 and at a location near the rear window of the vehicle, respectively. Furthermore, the camera modules 31 can also be located on the rearview mirrors of the vehicle instrument 30 on the left and right sides, respectively, with the exception of the respective mirror surfaces, but the present disclosure is not limited to this.
[0084] In Fig.6C, two additional camera modules 31 can be arranged at the front end of the vehicle instrument 30 and at the rear end of the vehicle instrument 30, respectively. Arranging the camera modules 31 at the front end of the vehicle instrument 30 and at the rear end of the vehicle instrument 30, respectively, and on the left side of the vehicle instrument 30 and the right side of the vehicle instrument 30 below the rearview mirrors is advantageous for the driver to obtain exterior information in addition to that from the driver's seat, such as the exterior information I1, I2, I3, I4, to which the present disclosure is not limited. Thus, more viewing angles can be offered to reduce the blind spot, thus increasing driving safety.In addition, the traffic information can be detected outside the vehicle instrument 30 by arranging the camera modules 30 on the peripheral surface of the vehicle instrument 30, so that the automatic driver assistance function can be achieved.
Claims
[1] Camera module (100), comprising: an imaging lens arrangement (110), an image sensor (120) for receiving an image signal from the imaging lens arrangement (110) and a magnetic mounting mechanism for determining a state of the image signal of the imaging lens arrangement (110) corresponding to the image sensor (120), wherein the magnetic mounting mechanism comprises: a magnetic holder (131, 141), a magnet (132, 142) arranged on the magnet holder (131, 141), and an opaque layer (133) applied to an outer surface of the magnet (132, 142). [2] The camera module (100) according to claim 1, wherein the opaque layer (133) has a part facing a direction toward the image sensor (120). [3] The camera module (100) of claim 1, wherein the magnetic mounting mechanism further comprises: a coil (134), wherein the magnet (132, 142) and the coil (134) are arranged relative to each other. [4] The camera module (100) of claim 1, wherein the magnetic mounting mechanism further comprises: a magnetic sensor element (135), wherein the magnet (132) and the magnetic sensor element (135) are arranged relative to one another. [5] The camera module (300) of claim 1, wherein the magnetic mounting mechanism is for adjusting a relative position of the imaging lens assembly (310) and the image sensor (320) to each other. [6] The camera module (300) of claim 1, wherein the magnet mounting mechanism is for providing a preload force for supporting the imaging lens assembly (310). [7] The camera module (100) of claim 1, wherein the magnet mounting mechanism is for adjusting the aperture size of an aperture stop. [8] The camera module (100) of claim 1, wherein the magnetic mounting mechanism further comprises: a nanolayer deposited on the opaque layer (133). [9] The camera module (100) according to claim 8, wherein the nanolayer comprises a plurality of nanoparticles (1361) irregularly arranged on a surface of the opaque layer. [10] The camera module (100) of claim 8, wherein the nanolayer comprises a plurality of nano-protrusions (1362) irregularly arranged on a surface of the opaque layer (133). [11] The camera module (100) according to claim 8, wherein the nanolayer comprises a plurality of nanoholes (1363) irregularly arranged on a surface of the opaque layer (133). [12] Camera module (100) according to claim 1, in which the opaque layer (133) comprises: a plurality of micron particles (1331) to create an irregularly projecting structure on a surface of the opaque layer (133). [13] Camera module (100) according to claim 2, in which, when the surface of the opaque layer (133) is measured according to the ISO 25178 standard, with Y pd for the number of peaks per square millimeter of a microstructure layer, the following condition is met: 19000 1 / mm2≤ Ypd ≤ 210000 1 / mm2 [14] Camera module (100) according to claim 13, in which, when the surface of the opaque layer (133) is measured according to the ISO 25178 standard, with Y pd for the number of peaks per square millimeter of the microstructure layer, the following condition is met: 25000 1 / mm2≤ Ypd ≤ 120000 1 / mm2 [15] Camera module (100) according to claim 2, in which, when the surface of the opaque layer (133) is measured according to the ISO 25178 standard, an equivalence line and an area-material ratio curve are obtained, a core surface of the profile elements is defined by 0% to 100% of the equivalence line corresponding to the area-material ratio curve, a reduced peak is a portion of the area-material ratio curve that is higher than the core surface, and Y mr1 represents the area-material ratio separating the core surface from the reduced peak, the following condition is met: 7% ≤ Ymr1 ≤53%. [16] Camera module (100) according to claim 15, in which, when the surface of the opaque layer (133) is measured according to the ISO 25178 standard and Y mr1 represents the area-to-material ratio separating the core surface from the reduced tip, the following condition is met: 15% ≤Ymr1 ≤45%. [17] Camera module (100) according to claim 2, in which, when the surface of the opaque layer (133) is measured according to the ISO 25178 standard, an equivalence line and an area-material ratio curve are obtained, a core surface of the profile elements is defined by 0% to 100% of the equivalence line corresponding to the area-material ratio curve, a reduced peak is a section of the area-material ratio curve that is higher than the core surface and Aph stands for the average height of the reduced peak, the following condition is met: 0.5 μm ≤ Aph ≤ 42.5 μm. [18] Camera module (100) according to claim 17, in which, when the surface of the opaque layer (133) is measured according to the ISO 25178 standard, with Aph for the mean height of the reduced peak, the following condition is met: 4.5 μm ≤ Aph ≤ 35.5 μm. [19] Camera module (100) according to claim 2, in which, when the surface of the opaque layer (133) is measured according to the ISO 25178 standard, with Hpq for the number of peaks of a microstructure layer greater than the core surface and greater than 4 µm, the following condition is met: 0 ≤ Hpq ≤ 430. [20] Camera module (100) according to claim 19, in which, when the surface of the opaque layer (133) is measured according to the ISO 25178 standard, with Hpq for the number of peaks of the microstructure layer greater than the core surface and greater than 4 µm, the following condition is met: 15 ≤ Hpq ≤ 300. [21] Camera module (200) according to claim 1, in which the opaque layer (233) completely covers the magnet (232). [22] Electronic device (10) comprising: the camera module (100) according to claim 1.