Shock-absorbing portable ring structures

A manufacturing process for wearable devices with a gap between outer and inner shells absorbs external forces, protecting internal components and improving durability and communication, addressing the issues of inflexible and flexible materials in wearable devices.

DE202025101616U1Active Publication Date: 2025-08-07OURA HEALTH OY
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Patent Information

Application Number
DE202025101616
Authority / Receiving Office
DE · DE
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2025-03-25
Publication Date
2025-08-07
Estimated Expiration
2035-03-31

AI Technical Summary

Technical Problem

Wearable devices, such as rings, are prone to damage from external forces due to inflexible outer shells like ceramic materials transmitting forces to internal components, and flexible metallic shells are susceptible to scratches, affecting both durability and aesthetic appearance.

Method used

Implementing a manufacturing process that creates a gap between the outer and inner shells, filled with a compressible material or foam, to absorb external forces and prevent transmission to internal components, using inflexible materials like ceramics for the outer shell.

Benefits of technology

Protects internal components from damage while maintaining durability and aesthetic integrity by dissipating external forces through the gap and side covers, enhancing shock absorption and wireless communication capabilities.

✦ Generated by Eureka AI based on patent content.

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Abstract

A portable ring device comprising: an inner annular housing having an inner curved surface of the wearable ring device, wherein the inner curved surface is configured to at least partially contact a user's tissue; one or more sensors configured to collect physiological data from the user through the inner curved surface, wherein the one or more sensors are at least partially encapsulated in a moldable material and coupled to the inner annular housing via the moldable material; an outer annular housing having an outer curved surface of the wearable ring device, wherein the outer annular housing at least partially surrounds the inner annular housing, wherein an inner surface of the outer annular housing and an outer surface of the moldable material are separated by a gap extending at least a portion of a width of the wearable ring device between a first lateral side and a second lateral side of the wearable ring device; and a first side cover and a second side cover disposed at least partially between the outer annular housing and the inner annular housing on a first lateral side or a second lateral side of the portable ring device, wherein the first side cover, the second side cover, or both are configured to undergo mechanical deformation in response to an external force applied to the outer annular housing, wherein a depth of the gap between the inner surface of the outer annular housing and the outer surface of the moldable material changes based at least in part on the mechanical deformation of the first side cover, the second side cover, or both.
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Description

FIELD OF TECHNOLOGY

[0001] The following refers to portable devices and data processing, including shock-absorbing portable ring structures. BACKGROUND

[0002] Some wearable devices may be configured to collect data from users to help users understand their overall physiological health and well-being. However, wearable devices may be subjected to external forces while worn by the user, which may cause one or more components of the wearable device to become loose or move unintentionally, thereby shortening the wearable device's lifespan. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows an example of a manufacturing process for shock-absorbing wearable ring structures according to aspects of the present disclosure. Fig. 2 shows exemplary wearable ring devices having shock-absorbing wearable ring structures according to aspects of the present disclosure. Fig. 3 shows an example of a wearable ring device having a shock-absorbing wearable ring structure according to aspects of the present disclosure. Fig. 4 and Fig. 5 illustrate examples of systems supporting shock-absorbing wearable ring structures in accordance with aspects of the present disclosure. Fig. 6 shows a flowchart illustrating methods for supporting shock-absorbing wearable ring structures according to aspects of the present disclosure. DETAILED DESCRIPTION

[0003] Wearable devices (e.g., rings, watches, etc.) can be used to measure a user's biometric data and report the data to the user. Wearable devices can be made from various materials for both functional and aesthetic purposes. For example, some wearable ring devices are manufactured with metallic outer shells that are coupled to inner shells of the ring to seal the electronic components of the wearable ring device between the inner and outer shells. The electronic components may be encapsulated in an epoxy material (or other moldable material) that is sealed by the inner / outer shells. The metallic outer shells can flex when the ring is subjected to an external force (e.g.,when the ring is dropped), thereby dissipating the force and preventing the force from being transferred to the epoxy and electronic components, making the ring more durable and preventing the electronic components from being damaged. However, such metallic materials can be prone to scratches, which can affect the aesthetic appearance of the ring. In comparison, other scratch-resistant materials, such as ceramic materials, may not flex when the ring is dropped or subjected to other external forces. Without a certain degree of flexion, these ceramic outer shells may not be able to dissipate the external force and instead transfer the force to the inner epoxy of the ring, increasing the likelihood of damaging the electronic components.

[0004] Accordingly, aspects of the present disclosure are directed to shock-absorbing wearable ring devices capable of protecting the internal components and sensors from damage caused by external forces. In particular, aspects of the present disclosure are directed to manufacturing methods for wearable ring devices that utilize air gaps between the outer shell and the internal components of the ring to prevent damage to the electronic components. Such techniques may enable wearable ring devices to be manufactured with outer shells made of inflexible materials (e.g., ceramic outer shells), while simultaneously preventing such inflexible outer shells from transmitting external forces to the inner epoxy (and / or other internal components, such as the sensors / electronic components) that could damage the ring.

[0005] For example, electronic components (e.g., sensors) of the wearable device can be attached to an inner annular housing (e.g., inner shell) of the wearable ring device using an epoxy molding process, forming a "ring assembly." An outer annular housing (e.g., outer shell) of the wearable ring device can then be coupled to the ring assembly (e.g., inner annular housing / epoxy) such that an air gap exists between the molded epoxy (encapsulating the electronic components) and the outer annular housing. The air gap can prevent external forces applied to the outer annular housing (such as forces resulting from the user dropping the ring) from being transmitted to the molded epoxy / electronic components.For example, the outer annular housing can be secured to the lateral sides of the ring using "side covers," with external forces applied to the outer annular housing being transferred through the side covers rather than to the epoxy and electronic components. In such cases, the side covers can comprise annular shims, a cured adhesive material, or both. In some cases, the air gap can extend 360° around the circumference of the ring. In additional or alternative cases, the air gap can be filled with a foam or other compressible material for additional shock absorption.

[0006] Aspects of the present disclosure are first described in the context of an exemplary manufacturing process and exemplary wearable ring devices. Additional aspects of the disclosure are first described in the context of systems that support the collection of physiological data from users via wearable devices. Aspects of the disclosure are further illustrated and described by device diagrams, system diagrams, and flowcharts related to shock-absorbing wearable ring structures.

[0007] Fig. 1 illustrates an example of a manufacturing process 100 for shock-absorbing wearable ring structures according to aspects of the present disclosure. In particular, the manufacturing process 100 may include an example of manufacturing shock-absorbing wearable ring devices 104 as described herein.

[0008] In some aspects, the electrical components of the wearable ring device 104 (e.g., circuit board, sensors, battery) may be attached to an inner annular housing 105 (e.g., inner shell, inner cover) of the wearable ring device 104. Subsequently, the inner annular housing 105 (e.g., and the electrical components attached thereto) may be placed in a mold so that a moldable material 115, such as a clear epoxy, may be injected into the mold to attach the electrical components to the inner annular housing 105. In this regard, as in Fig. 2, the circuit board, the sensors, and / or the battery may be at least partially (e.g., completely) encapsulated or covered by the moldable material 115. Additionally, the molding process (e.g., injection molding process) may result in the moldable material 115 filling one or more openings 110 of the inner annular housing 105 so that the one or more optical sensors may be secured with respect to the openings 110 to enable data collection. For example, the moldable material 115 may be configured to form domes or projections that fill / cover the openings and extend from the inner curved surface of the inner annular housing 105, with the sensors configured to collect data through the openings and domes / projections.That is, the sensors and other optical components of the wearable ring device 104 may be configured to collect physiological data from the user through the one or more openings 110.

[0009] In this regard, the molding process may be used to attach the electrical components (e.g., circuit board, sensors, battery) of the wearable ring device 104 to the inner annular housing 105. The structure resulting from the molding process may be referred to as a ring assembly 102 (e.g., ring drive assembly), which includes the inner annular housing 105, the circuit board / sensors, and the cured moldable material 115 (with the circuit board, sensors, and battery encapsulated within the moldable material 115). In this regard, the inner annular housing 105 may comprise or define an inner curved surface (e.g., inner peripheral surface) of the ring assembly 102 and the wearable ring device 104, with the moldable material 115 comprising or defining an outer surface of the ring assembly 102.The ring assembly 102 may be essentially an operational portable ring device 104 without an outer annular housing 125 (e.g., outer shell, outer cover).

[0010] Subsequently, the outer annular housing 125 can be placed around the ring assembly 102 such that the outer annular housing 125 at least partially surrounds the inner annular housing 105 / the ring assembly 102. For example, the outer annular housing 125 can extend around a full circumference of the portable ring device 104, as shown in Fig. 1. In this regard, the outer annular housing 125 may comprise or define an outer curved surface (e.g., outer peripheral surface) of the wearable ring device 104.

[0011] In some aspects, the outer annular housing 125 may be attached to the ring assembly 102 (e.g., attached to the inner annular housing 105) using one or more side covers 130 (e.g., side cover 130-a, side cover 130-b) on the lateral sides of the portable ring device 104. In some cases, the side covers 130 may include annular fittings that are inserted into the slots formed between the inner annular housing 105 and the outer annular housing 125. In such cases, the annular fittings (e.g., side covers 130) may be slightly wider than the slots between the outer annular housing 125 and the inner annular housing 105 such that the annular fittings mechanically deform when inserted or pushed into the slots due to an applied force.In such cases, mechanical deformation of the annular fittings may cause the annular fittings (e.g., side covers) to engage one or more mechanical locking features on the outer annular housing 125, the inner annular housing 105, or both. Additionally or alternatively, each of the annular fittings (e.g., side covers 130) may include one or more flanges or locking wings to enable the annular fittings to engage the one or more mechanical locking features on the outer annular housing 125, the inner annular housing 105, or both.

[0012] In other cases, the side covers 130 may be formed by pouring an adhesive (e.g., UV adhesive) into the slots formed between the inner annular housing 105 and the outer annular housing 125. That is, in some cases, heat- or light-sensitive adhesive may be used to form the side covers 130. For example, UV adhesive may be applied to the slots (e.g., and any gaps) between the outer annular housing 125 and the inner annular housing 105 so that the UV adhesive fills the entire slots. In such cases, UV light may be applied directly to the UV adhesive to cure the UV adhesive, causing the UV adhesive to harden within the slots, thereby forming the side covers 130 and locking the outer annular housing 125 to the inner annular housing 105.In additional or alternative implementations, a self-curing adhesive or composite material may also be used. Such self-curing materials may be cured by mixing components that enable polymerization or by exposure to air. In other cases, the side covers 130 may be formed using a thermosetting material.

[0013] As previously mentioned herein, some wearable devices may use metallic materials for the outer ring-shaped housing 125. Such metallic outer shells may flex when the wearable ring device 104 is subjected to an external force (e.g., when the wearable ring device 104 is dropped), thereby dissipating the force and preventing the force from being transmitted to the moldable material 115 and the electronic components encapsulated in the moldable material 115 (e.g., circuit board, battery, sensors), thereby making the wearable ring device 104 more durable and preventing the electronic components from being damaged. However, such metallic materials may be susceptible to scratches, which may impair the aesthetic appearance of the wearable ring device 104. In comparison, other scratch-resistant materials, such asCeramic materials may not flex if the ring is dropped or subjected to other external forces. Without some degree of flexion, these ceramic outer shells (e.g., an outer annular housing 125 made of ceramic) may not be able to dissipate the external force and instead transfer the force to the malleable material 115 (and the electronic components encapsulated therein), increasing the likelihood of damage to the electronic components.

[0014] Accordingly, aspects of the present disclosure are directed to shock-absorbing wearable ring devices 104 capable of protecting the internal components and sensors from damage caused by external forces. In particular, the Fig. 1 may be used to manufacture the wearable ring device 104 with a gap between the outer annular housing 125 and the ring assembly 102 / moldable material 115 to prevent damage to the electronic components. Such techniques may allow the wearable ring device 104 to be manufactured with an outer annular housing 125 made of inflexible materials (e.g., ceramic), while simultaneously preventing such inflexible outer shells from transmitting external forces to the moldable material 115 (and the electronic components encapsulated therein), thereby preventing damage to the wearable ring device 104.

[0015] In some cases, the gap between the outer annular housing 125 and the moldable material 115 / ring assembly 102 may extend 360° around the circumference of the wearable ring device 104. In additional or alternative cases, the gap may be filled with a foam or other compressible material for additional shock absorption. By implementing a gap between the outer annular housing 125 and the moldable material 115 / ring assembly 102, external forces applied to the outer annular housing 125 (e.g., external forces caused by dropping the ring) may be transmitted through the side covers 130 rather than to the moldable material 115 and the electronic components. In some aspects, the side covers 130 may deform in response to external forces applied to the outer annular housing 125, thereby dissipating the force.In such cases, the gap between the annular housing 125 and the moldable material 115 may change based on the deformation of the side covers 130 (e.g., compress or otherwise reduce the size of the gap), thereby preventing the external force from being transmitted to the moldable material 115 and the electronic components. For example, when an external force is applied to the outer annular housing 125 (such as a force from dropping the ring), the outer annular housing 125 may transmit the external force to the side covers 130, causing the side covers to compress (e.g., undergo mechanical deformation).The compression of the side covers 130 may cause the outer annular housing 125 to move toward the inner annular housing 105, thereby reducing the depth of the gap between the outer annular housing 125 and the moldable material 115 / electronic components.

[0016] Accompanying advantages of the manufacturing techniques and shock-absorbing ring designs described herein are further discussed in relation to Fig. 2 and Fig. 3 shown and described.

[0017] Fig. Figure 2 shows examples of wearable ring devices 200-a, 200-b having shock-absorbing wearable ring structures according to aspects of the present disclosure. Aspects of the wearable ring devices 200-a, 200-b may incorporate the manufacturing process 100 in Fig. 1 or be implemented by it. In particular, Fig. 2 exemplary cross-sectional views of the Fig. 1.

[0018] As previously described herein, the wearable ring devices 200-a, 200-b may include an inner annular housing 105 and an outer annular housing 125. Electronic components (e.g., circuit board 205, battery, sensors) of the wearable ring devices 200 may be disposed between the inner annular housing 105 and the outer annular housing 125. For example, as shown in Fig. 1, the electronic components (e.g., circuit board 205, battery, sensors) may be coupled to the inner annular housing 105 using a moldable material 115. In such cases, the electronic components may be at least partially (e.g., completely) encapsulated in the moldable material 115, as shown in Fig. 2 shown.

[0019] Furthermore, as in Fig. 2, the structure resulting from the molding process may be referred to as a ring assembly 102 (e.g., ring drive assembly), which includes the inner annular housing 105, the circuit board 205 / sensors, and the cured moldable material 115 (with the circuit board 205, sensors, and battery encapsulated within the moldable material 115). In this regard, the inner annular housing 105 may comprise or define an inner curved surface (e.g., inner circumferential surface) of the ring assembly 102 and the wearable ring device 104, with the moldable material 115 comprising or defining an outer surface of the ring assembly 102.

[0020] The outer annular housing 125 may at least partially surround the inner annular housing 105 / the ring assembly 102. For example, the outer annular housing 125 may extend around a full circumference of the wearable ring device 200. The outer annular housing 125 may be made of one or more materials, such as metallic materials, ceramic materials, and the like.

[0021] In some aspects, the outer annular housing 125 may be attached to the ring assembly 102 (e.g., attached to the inner annular housing 105) using one or more side covers 130 (e.g., side cover 130-a, side cover 130-b) on the lateral sides of the portable ring device 104. In some cases, the side covers 130 may comprise annular fittings that are inserted into the slots formed between the inner annular housing 105 and the outer annular housing 125. In other cases, the side covers 130 may be formed by pouring an adhesive (e.g., UV adhesive) into the slots formed between the inner annular housing 105 and the outer annular housing 125. That is, in some cases, heat- or light-sensitive adhesive may be used to form the side covers 130.

[0022] In some aspects, the outer annular housing 125 may be separated from the ring assembly 102 / moldable material by a gap 210. For example, as in Fig. 2, an inner surface of the outer annular housing 125 and an outer surface of the moldable material 115 may be separated by a gap 210. In some aspects, the gap 210 may extend at least partially around a circumference of the wearable ring device 200. For example, in some cases, the gap 210 may extend 360° around the circumference of the wearable ring device 200.

[0023] In some aspects, the gap 210 between the outer annular housing 125 and the moldable material 115 / ring assembly 102 may span at least a portion of a width of the wearable ring device 200 between a first lateral side and a second lateral side of the wearable ring device 200. For example, as illustrated in the first wearable ring device 200-a shown in the upper diagram of Fig. 2, the outer annular housing 125 may be coupled to the wearable ring device 200-a via a first contact point 215-a with the first side cover 130-a and a second contact point 215-b with the second side cover 130-b, wherein the gap 210 spans the portion of the width of the wearable ring device 200-a between the first contact point 215-a and the second contact point 215-b. In this regard, in the context of the first wearable ring device 200-a shown in the upper diagram of Fig. 2, the gap 210 may completely separate the moldable material 115 and the outer annular housing 125 such that there is no direct contact between the outer annular housing 125 and the moldable material 115. In this example, the inner surface of the outer annular housing 125 (e.g., the inner surface facing the gap 210 and the moldable material 115) may be substantially flat, with the outer annular housing 125 having flanges or projections that contact the side covers 130-a, 130-b on the lateral sides.

[0024] As another example, as shown in the second portable ring device 200-b shown in the lower diagram of Fig. 2, the outer annular housing 125 may be coupled to the wearable ring device 200-a via a first contact point 215-c with the first side cover 130-a and a first portion of the moldable material 115, and a second contact point 215-d with the second side cover 130-b and a second portion of the moldable material 115. That is, compared to the first wearable ring device 200-a, in which the outer annular housing 125 is completely separated from the moldable material 115, the outer annular housing 125 of the second wearable ring device 200-b may partially contact the outer portions of the moldable material 115.

[0025] As previously mentioned herein, the gap 210 can be used to provide shock absorption for the wearable ring device 200. That is, the gap 210 can prevent external forces applied to the outer annular housing 125 from being transmitted to the moldable material 115 and the electronic components (e.g., circuit board 205, battery, sensors). In other words, by implementing a gap between the outer annular housing 125 and the moldable material 115 / ring assembly 102, external forces applied to the outer annular housing 125 (e.g., external forces caused by dropping the ring) can be transmitted through the side covers 130 (e.g., adhesive, adhesive material, annular fittings) rather than directly to the moldable material 115 and the electronic components.In some implementations, the gap 210 may be filled with a foam or other compressible material for additional shock absorption.

[0026] In some aspects, the side covers 130 may deform in response to external forces applied to the outer annular housing 125, thereby dissipating the external force applied to the outer annular housing 125. In other words, kinetic energy may be absorbed by the side covers through the deformation of the side covers 130. In particular, due to the presence of the gap 210, an external force applied to the outer annular housing 125 may be transferred to the side covers 130 and / or the inner annular housing 105 rather than directly to the moldable material 115. In other words, the gap 210 and / or the side covers 130 may enable the wearable ring devices 200 to absorb the impact of shocks / external forces, thereby making the electronic components of the wearable ring devices 200 more resilient (e.g., less vulnerable) to the external forces.

[0027] The ability of the side covers 130 to deform may allow the wearable ring device 104 to dissipate external forces and protect the internal electronic components even in cases where the outer annular housing 125 is formed from an inflexible material, such as ceramic. The side covers 130 may be made of a material that is elastically deformable, such that the side covers 130 can be deformed (e.g., compressed) in response to an external force applied to the outer annular housing 125 and subsequently return to their original shape and size (e.g., expand back to the original shape / size).

[0028] In some aspects, a width of the gap 210 between the annular housing 125 and the moldable material 115 may change (e.g., compress) based on the deformation of the side covers 130, thereby preventing the external force from being transmitted to the moldable material 115 and the electronic components. For example, when an external force is applied to the outer annular housing 125 (such as a force from dropping the ring), the outer annular housing 125 may transmit the external force to the side covers 130, causing the side covers 130 to compress (e.g., undergo mechanical deformation).The compression of the side covers 130 may cause the outer annular housing 125 to move toward the inner annular housing 105, thereby reducing the depth of the gap 210 between the outer annular housing 125 and the moldable material 115 / electronic components.

[0029] In some aspects, the amount of deformation of the side covers 130 can be configured (e.g., by selecting the size and / or material of the side covers 130) such that the corresponding deformation of the gap 210 does not allow the inner surface of the outer annular housing 125 to contact the outer surface of the moldable material 115. The dimensions of the gap 210 (both without an applied external force and after the application of external forces) can be determined through simulations.

[0030] With reference to the first wearable ring device 200-a, the gap 210 can completely separate the outer annular housing 125 and the moldable material 115. Therefore, an entire external force exerted on the outer annular housing 125 can be transmitted / dissipated through the side covers 130 via the contact points 215-a, 215-b.

[0031] In comparison, in the context of the second wearable ring device 200-b, the outer annular housing 125 may partially contact portions of the moldable material 115 toward the lateral sides of the ring at contact points 215-c, 215-d. However, the presence of the gap 210 in the second wearable ring device 200-b may still protect the electronic components of the wearable ring device 200-b compared to some conventional devices. In particular, the gap 210 of the second wearable ring device 200-b may prevent direct contact between the outer annular housing 125 and the innermost portion of the moldable material 115, which may contain the most fragile and sensitive components / sensors of the device. That is, the portions of the moldable material 115 toward the lateral sides and contact points 215-c, 215-d may be more durable than the innermost portions of the moldable material 115.Furthermore, the second wearable ring device 200-b can be manufactured such that no sensitive electrical components are located in the portions of the moldable material 115 near the contact points 215-c, 215-d. Thus, compared to some conventional devices, the presence of the gap 210 in both the first wearable ring device 200-a and the second wearable ring device 200-b can protect the electrical components of the respective devices from damage.

[0032] As previously mentioned herein, the use of a ceramic material for the outer annular housing 125 may make the outer annular housing 125 more scratch-resistant compared to other materials such as metal. Additionally, the use of a non-conductive material such as ceramic for the outer annular housing 125 may prevent the wearable ring devices 200 from exhibiting a "capacitive effect" that can occur with metallic materials. For example, in cases where both the inner annular housing 105 and the outer annular housing 125 are formed from conductive materials (e.g., metallic materials), the respective housings may develop electrical charges, resulting in an electrostatic potential difference between the inner annular housing 105 and the outer annular housing 125.Such differences in electrostatic potential can lead to electrostatic discharge, which can damage internal components (e.g., circuit board 205). In comparison, using a non-conductive material such as ceramic for the outer annular housing 125 can prevent the outer annular housing 125 from carrying / developing an electrical charge, thereby preventing or otherwise minimizing electrostatic discharge.

[0033] In addition, the use of a non-conductive material such as ceramic for the outer annular housing 125 may improve the wireless communication capabilities of the wearable ring devices 200, as further described with respect to Fig. 3 is shown and described.

[0034] Fig. 3 shows an example of a wearable ring device 300 having a shock-absorbing wearable ring structure according to aspects of the present disclosure. Aspects of the wearable ring device 300 may incorporate the manufacturing process 100 in Fig. 1, the portable ring devices 200-a, 200-b in Fig. 2 or both. In particular, Fig. 3 an exemplary perspective interior view of the Fig. 1-2 illustrate the portable ring devices 104, 200-a, 200-b shown and described.

[0035] As previously described herein, the wearable ring device 300 may include an inner annular housing 105 and an outer annular housing 125 (not shown). Fig. 3), wherein the inner annular housing 105 and the outer annular housing 125 are coupled together using one or more side covers 130-a, 130-b. The side covers 130-a, 130-b may comprise annular fittings, molded / cured adhesive material (e.g., UV adhesive), or both.

[0036] As in Fig. 3, the wearable ring device 300 may include an antenna 305. In some aspects, the antenna 305 may be encapsulated within the moldable material 115, as described herein. The wearable ring device 300 may use the antenna 305 to conduct wireless communications with other devices, such as a user device (e.g., a smartphone). For example, the wearable device 300 may use the antenna 305 to exchange information, such as physiological data collected by the wearable device 300, with the user device.

[0037] In some portable devices, the antenna may be a printed circuit board antenna formed by conductive traces on a circuit board arranged along a peripheral portion of the portable device. Together with an antenna ground plane (which may be the ground plane of the circuit board and / or a metal housing of the portable device), the printed circuit board antenna may generate an electromagnetic field that the portable device uses for wireless communications.

[0038] The antenna 305 may include an antenna ground plane 310 and a radiator 315. The antenna ground plane 310 may include a conductive material (e.g., a metallic material). For example, the antenna ground plane 310 may include the ground plane of a circuit board (e.g., circuit board 205) within the portable ring device 300, may include an internal metal surface (e.g., a metal casing) within the portable device 300 (or may be functionally considered both). In some aspects, the antenna ground plane 310 may be positioned adjacent to (e.g., in contact with) the inner annular housing 105. For example, the antenna ground plane 310 may be curved and extend along the curvature of the inner sidewall of the inner annular housing 105.The antenna ground plane 325 may be configured to reflect an electromagnetic field generated by the antenna 305 / radiator 315 when the antenna 305 is energized.

[0039] In some aspects, the radiator 315 of the antenna 305 can be configured to generate an electromagnetic field used to facilitate wireless communications. The radiator 315 can be positioned to overlap the antenna ground plane 310, thereby allowing an electromagnetic field to be generated between the radiator 315 and the antenna ground plane 310.

[0040] In some conventional wearable ring devices with metallic outer shells / covers (e.g., metallic outer ring-shaped housing 125), the metallic outer shells may prevent, inhibit, or otherwise interfere with wireless communications. In such cases with metallic outer shells, the antenna 305 may be configured to transmit / receive wireless signals through the side covers 130 (as opposed to transmitting / receiving wireless signals through the metallic outer cover). In comparison, by using a non-conductive outer ring-shaped housing 125, the antenna 305 may transmit and receive wireless signals through the ceramic outer ring-shaped housing 125. Therefore, techniques described herein that enable the outer cover to be fabricated with non-metallic materials may also increase the strength and reliability of the wireless communications performed by the wearable ring device 300.

[0041] Fig. Figure 4 illustrates an example of a system 400 supporting shock-absorbing wearable ring structures according to aspects of the present disclosure. System 400 includes a plurality of electronic devices (e.g., wearable devices 404, user devices 406) that can be worn and / or operated by one or more users 402. System 400 further includes a network 408 and one or more servers 410.

[0042] The electronic devices may comprise any known electronic devices, including wearable devices 404 (e.g., ring wearables, watch wearables, etc.), user devices 406 (e.g., smartphones, laptops, tablets). The electronic devices associated with the respective users 402 may comprise one or more of the following functionalities: 1) measuring physiological data, 2) storing the measured data, 3) processing the data, 4) providing outputs (e.g., via GUls) to a user 402 based on the processed data, and 5) communicating data with each other and / or with other computing devices. Different electronic devices may perform one or more of the functionalities.

[0043] Example wearable devices 404 may include wearable computing devices, such as a ring computing device (hereinafter, a "ring") configured to be worn on a user's 402 finger, a wrist computing device (e.g., a smartwatch, fitness band, or bracelet) configured to be worn on a user's 402 wrist, and / or a head-worn computing device (e.g., glasses / goggles). Wearable devices 404 may also include bands, straps (e.g., flexible or inflexible bands or straps), adhesive-on sensors, and the like that can be positioned in other locations, such as bands around the head (e.g., a headband), the arm (e.g., a forearm band and / or bicep band), and / or the leg (e.g., a thigh or calf band), behind the ear, under the armpit, and the like. Wearable devices 404 may also be attached to or contained within clothing.For example, wearable devices 404 may be contained in pockets and / or pouches on clothing. As another example, a wearable device 404 may be clipped and / or plugged into clothing or otherwise held near the user 402. Example clothing items may include, but are not limited to, hats, shirts, gloves, pants, socks, outerwear (e.g., jackets), and underwear. In some implementations, wearable devices 404 may be integrated with other types of equipment, such as exercise / sports equipment used during physical activity. For example, wearable devices 404 may be attached to or contained within a bicycle, skis, a tennis racket, a golf club, and / or training weights.

[0044] Much of the present disclosure may be described in the context of a wearable device 404, which may include finger-worn wearable devices, wrist-worn wearable devices, and the like. Accordingly, the terms "wearable device 404," "wearable ring device," "ring," and similar terms may be used interchangeably unless otherwise indicated herein. However, the use of the terms "wearable ring device" and / or "ring" is not intended to be limiting, as it is contemplated herein that aspects of the present disclosure may be performed using other wearable devices (e.g., watch wearables, necklace wearables, bracelet wearables, earring wearables, anklet wearables, and the like).

[0045] In some aspects, user devices 406 may include portable mobile computing devices such as smartphones and tablet computing devices. User devices 406 may also include personal computers such as laptop and desktop computing devices. Other example user devices 406 may include server computing devices that can communicate with other electronic devices (e.g., over the Internet). In some implementations, computing devices may include medical devices, such as external portable computing devices (e.g., Holter monitors). Medical devices may also include implantable medical devices such as pacemakers and cardioverter defibrillators. Other example user devices 406 may include home computing devices such as Internet of Things (IoT) devices (e.g., IoT devices), smart TVs, smart speakers, smart displays (e.g., video call displays), hubs (e.g., wireless communication hubs), security systems, smart home appliances (e.g.,thermostats and refrigerators) and fitness equipment.

[0046] Some electronic devices (e.g., wearable devices 404, user devices 406) may measure physiological parameters of the respective users 402, such as photoplethysmography waveforms, continuous skin temperature, a pulse waveform, respiration rate, heart rate, heart rate variability (HRV), actigraphy, galvanic skin response, pulse oximetry, blood oxygen saturation (SpO2), blood glucose levels (e.g., glucose metrics), and / or other physiological parameters. Some electronic devices that measure physiological parameters may also perform some / all of the calculations described herein. Some electronic devices may not measure physiological parameters but may perform some / all of the calculations described herein. For example, a ring (e.g., wearable device 404), a mobile device application, or a server computing device may process received physiological data measured by other devices.

[0047] In some implementations, a user 402 may operate or be connected to multiple electronic devices, some of which measure physiological parameters and others of which process the measured physiological parameters. In some implementations, a user 402 may have a ring (e.g., wearable device 404) that measures physiological parameters. The user 402 may also have or be connected to a user device 406 (e.g., mobile device, smartphone), where the wearable device 404 and the user device 406 are communicatively coupled. In some cases, the user device 406 may receive data from the wearable device 404 and perform some / all of the calculations described herein. In some implementations, the user device 406 may also measure physiological parameters described herein, such as movement / activity parameters.

[0048] For example, as in Fig. 4, a first user 402-a (User 1) may operate or be connected to a wearable device 404-a (e.g., a wearable ring device) and a user device 406-a, which may operate as described herein. In this example, the user device 406-a associated with user 402-a may process / store physiological parameters measured by the wearable device 404-a. In comparison, a second user 402-b (User 2) may be connected to wearable devices 404-b and 404-c (e.g., a wearable ring device and a wrist-worn wearable device, such as a watch) and a user device 406-b, where the user device 406-b associated with user 402-b may process / store physiological parameters measured by the wearable devices 404-b and 404-c. In addition, an n-th user 402-n (User N) having an arrangement of electronic devices described herein (e.g.wearable device 404-n, user device 406-n). In some aspects, wearable devices 404 (e.g., wearable ring devices, wrist-worn wearable devices) and other electronic devices may be communicatively coupled to the user devices 406 of the respective users 402 via Bluetooth, Wi-Fi, and other wireless protocols. Furthermore, in some cases, the wearable device 404 and the user device 406 may be included in (or constitute) the same device. For example, in some cases, the wearable device 404 may be configured to execute an application associated with the wearable device 404 and to display data via a GUI.

[0049] In some implementations, the wearable devices 404 (e.g., wearable ring devices) of the system 400 may be configured to collect physiological data from the respective users 402 based on the arterial blood flow in the user's finger. In particular, a wearable ring device may utilize one or more light-emitting components, such as LEDs (e.g., red LEDs, green LEDs), that emit light toward the palm side of a user's finger to collect physiological data based on the arterial blood flow in the user's finger. In general, the terms light-emitting components, light-emitting elements, and similar terms may include, but are not limited to, LEDs, micro-LEDs, mini-LEDs, laser diodes (LDs) (e.g., vertical cavity surface-emitting lasers (VCSELs)), and the like.

[0050] In some cases, system 400 may be configured to collect physiological data from respective users 402 based on blood flow diffused into a skin microvascular bed of capillaries and arterioles. For example, system 400 may collect PPG data based on a measured amount of blood diffused into the microvascular system of capillaries and arterioles. In some implementations, wearable device 404 may collect the physiological data using a combination of green and red LEDs. The physiological data may include any known physiological data, including, but not limited to, temperature data, accelerometer data (e.g., motion data), heart rate data, HRV data, blood oxygen level data, or any combination thereof.

[0051] The use of both green and red LEDs can offer several advantages over other solutions, as red and green LEDs have been found to have their own distinct advantages in collecting physiological data under different conditions (e.g., light / dark, active / inactive) and across different body parts, and the like. For example, green LEDs have been found to perform better during exercise. Furthermore, the use of multiple LEDs (e.g., green and red LEDs) distributed around the wearable device 404 (e.g., around an inner surface of the wearable ring device) has been found to have superior performance compared to wearable devices that use LEDs positioned close together, such as in a wearable watch device. Furthermore, the blood vessels in the finger (e.g., arteries, capillaries) are more accessible via LEDs than blood vessels in the wrist.Specifically, arteries in the wrist are located on the underside of the wrist (e.g., palmar side of the wrist), meaning that only capillaries on the top of the wrist (e.g., dorsal side of the wrist) are accessible, where wearable watch devices and similar devices are typically worn. Therefore, the use of LEDs and other sensors in a wearable ring device has been found to have superior performance compared to wrist-worn wearable devices because the wearable ring device can have better access to arteries (compared to capillaries), resulting in stronger signals and more valuable physiological data.

[0052] The electronic devices of the system 400 (e.g., user devices 406, portable devices 404) may be communicatively coupled to one or more servers 410 via wired or wireless communication protocols. For example, as in Fig. 4, the electronic devices (e.g., user devices 406) may be communicatively coupled to one or more servers 410 via a network 408. The network 408 may implement the Transfer Control Protocol and the Internet Protocol (TCP / IP), such as the Internet, or implement other network protocols 408. Network connections between the network 408 and the respective electronic devices may enable data transport via email, web, text messages, mail, or any other suitable form of interaction within a computer network 408. For example, in some implementations, the portable device 404-a associated with the first user 402-a may be communicatively coupled to the user device 406-a, wherein the user device 406-a is communicatively coupled to the servers 410 via the network 408. In additional or alternative cases, portable devices 404 (e.g.,wearable ring devices, wrist-worn wearable devices such as watches) may be communicatively coupled directly to the network 408.

[0053] System 400 may provide an on-demand database service between user devices 406 and one or more servers 410. In some cases, servers 410 may receive data from user devices 406 over network 408 and store and analyze the data. Similarly, servers 410 may provide data to user devices 406 over network 408. In some cases, servers 410 may be located in one or more data centers. Servers 410 may be used for data storage, management, and processing. In some implementations, servers 410 may provide a web-based interface to user device 106 via web browsers.

[0054] In some aspects, the system 400 may detect periods in which a user 402 is sleeping and classify periods in which the user 402 is sleeping into one or more sleep stages (e.g., sleep stage classification). For example, as in Fig. 4, user 402-a may be connected to a wearable device 404-a (e.g., a wearable ring device) and a user device 406-a. In this example, wearable device 404-a may collect physiological data associated with user 402-a, including temperature, heart rate, HRV, respiratory rate, and the like. In some aspects, data collected from wearable device 404-a may be input to a machine learning classifier, where the machine learning classifier is configured to determine periods of time when user 402-a is (or has been) asleep. Furthermore, the machine learning classifier may be configured to classify periods of time into different sleep stages, including an awake sleep stage, a rapid eye movement (REM) sleep stage, a light sleep stage (non-REM (NREM)), and a deep sleep stage (NREM).In some aspects, the classified sleep stages may be displayed to the user 402-a via a GUI of the user device 406-a. The sleep stage classification may be used to provide a user 402-a with feedback regarding their sleep habits, such as recommended bedtimes, recommended wake-up times, and the like. Furthermore, in some implementations, sleep stage classification techniques described herein may be used to calculate scores for the respective user, such as sleep scores, readiness scores, and the like.

[0055] In some aspects, system 400 may utilize circadian rhythm-derived features to further enhance physiological data collection, data processing methods, and other techniques described herein. The term circadian rhythm may refer to a natural, internal process that regulates a person's sleep-wake cycle and repeats approximately every 24 hours. In this regard, techniques described herein may utilize circadian rhythm adaptation models to enhance the collection, analysis, and processing of physiological data. For example, a circadian rhythm adaptation model may be input into a machine learning classifier along with physiological data collected from user 402-a via wearable device 404-a.In this example, the circadian rhythm adaptation model may be configured to "weight" or adjust physiological data collected during a user's natural, approximately 24-hour circadian rhythm. In some implementations, the system may initially start with a "baseline" circadian rhythm adaptation model and modify the baseline model using physiological data collected from each user 402 to generate customized, individualized circadian rhythm adaptation models specific to each respective user 402.

[0056] In some aspects, the system 400 may utilize other biological rhythms to further enhance the collection, analysis, and processing of physiological data according to phases of those other rhythms. For example, if a weekly rhythm is detected in a person's baseline data, the model may be configured to adjust the "weights" of the data by day of the week. Biological rhythms that may require model adjustment using this method include: 1) ultradian rhythms (faster than daily rhythms, including sleep cycles in the sleep state and oscillations of less than one hour to several hours of periodicity in the measured physiological variables in the waking state); 2) circadian rhythms; 3) non-endogenous daily rhythms that are demonstrably superimposed on circadian rhythms, such as in work schedules; 4) weekly rhythms or other artificial time periodicities imposed exogenously (e.g.,12-day rhythms could be used in a hypothetical culture with 12-day "weeks"); 5) multiday ovarian rhythms in women and spermatogenesis rhythms in men; 6) lunar rhythms (relevant for individuals living with little or no artificial light); and 7) seasonal rhythms.

[0057] Biological rhythms are not always stationary. For example, many women experience variability in ovarian cycle length across cycles, and ultradian rhythms are not expected to occur at exactly the same time or with the same periodicity across days, even within a user. Therefore, signal processing techniques sufficient to quantify the frequency composition while preserving the temporal resolution of these rhythms in physiological data can be used to improve the detection of these rhythms, assign the phase of each rhythm to each measured time point, and thereby modify adaptation models and time-interval comparisons. The biological rhythm adaptation models and parameters can be added in linear or nonlinear combinations, as needed, to more accurately capture the dynamic physiological baselines of an individual or group of individuals.

[0058] A person of ordinary skill in the art should recognize that one or more aspects of the disclosure may be implemented in a system 400 to additionally or alternatively solve problems other than those described above. Furthermore, aspects of the disclosure may provide technical improvements over "conventional" systems or processes as described herein. However, the description and accompanying drawings contain only exemplary technical improvements resulting from the implementation of aspects of the disclosure and, accordingly, do not represent all of the technical improvements provided within the scope of the claims.

[0059] Fig. 5 illustrates an example of a system 500 that supports shock-absorbing wearable ring structures according to aspects of the present disclosure. System 500 may implement or be implemented by system 400. In particular, system 500 illustrates a wearable device 504 (e.g., a wearable ring device), a user device 506, and a server 510, as described with respect to FIG. Fig. 4 described.

[0060] In some aspects, wearable device 504 (e.g., a wearable ring device) may be configured to be worn around a user's finger and may determine one or more physiological parameters of the user when worn around the user's finger. Example measurements and determinations may include, but are not limited to, the user's skin temperature, pulse waveforms, respiratory rate, heart rate, HRV, blood oxygen levels (SpO2), blood glucose levels (e.g., glucose metrics), and the like.

[0061] The system 500 further includes a user device 506 (e.g., a smartphone) in communication with the wearable device 504. For example, the wearable device 504 may be in wireless and / or wired communication with the user device 506. In some implementations, the wearable device 504 may send measured and processed data (e.g., temperature data, photoplethysmogram (PPG) data, motion / accelerometer data, ring input data, and the like) to the user device 506. The user device 506 may also send data to the wearable device 504, such as firmware / configuration updates. The user device 506 may process data. In some implementations, the user device 506 may transmit data to the server 510 for processing and / or storage.

[0062] The portable device 504 may include a housing 505, which may include an inner housing 505-a and an outer housing 505-b. In some aspects, the inner housing 505-a, the outer housing 505-b, or both may have a curved profile / surface. In particular, the housing 505 may have any curved or "circumferential" profile, including a circular profile, an elliptical profile, and the like. Furthermore, in some cases, the inner housing 505-a, the outer housing 505-b, or both may include both curved (e.g., "circumferential") and flat / planar portions. For the purposes of the present disclosure, the term "circumferential" may be used interchangeably with the term "curved" to refer to a circular, elliptical, or otherwise curved profile.

[0063] In some aspects, the housing 505 of the wearable device 504 may store or otherwise contain various components of the ring, including, but not limited to, device electronics, a power source (e.g., battery 511 and / or capacitor), one or more substrates (e.g., circuit boards) interconnecting the device electronics and / or the power source, and the like. The device electronics may include device modules (e.g., hardware / software) such as: a processing module 530-a, a memory 515, a communications module 520-a, a power module 525, and the like. The device electronics may also include one or more sensors. Example sensors may include one or more temperature sensors 540, a PPG sensor array (e.g., PPG system 535), and one or more motion sensors 545.

[0064] The sensors may include associated modules (not shown) configured to communicate with the respective components / modules of the wearable device 504 and generate signals associated with the respective sensors. In some aspects, each of the components / modules of the wearable device 504 may be communicatively coupled to one another via wired or wireless connections. Furthermore, the wearable device 504 may include additional and / or alternative sensors or other components configured to collect physiological data from the user, including light sensors (e.g., LEDs), oximeters, and the like.

[0065] This in relation to Fig. The portable device 504 shown and described in Figure 5 is for illustrative purposes only. Therefore, the portable device 504 may include additional or alternative components to those shown in Fig. 5. Additional or alternative wearable devices 504 that provide the functionality described herein may be manufactured. For example, wearable devices 504 may be manufactured with fewer components (e.g., sensors). In one specific example, a wearable device 504 may be manufactured with a single temperature sensor 540 (or other sensor), a power source, and device electronics configured to read the single temperature sensor 540 (or other sensor). In another specific example, a temperature sensor 540 (or other sensor) may be attached to a user's finger (e.g., with adhesives, wraps, clips, spring-loaded clamps, etc.). In this case, the sensor may be wired to another computing device, such as a wrist-worn computing device, that reads the temperature sensor 540 (or other sensor).In other examples, a wearable device 504 may be manufactured that includes additional sensors and processing functionality.

[0066] The housing 505 may include one or more housing components. The housing 505 may include an outer housing component 505-b (e.g., a shell) and an inner housing component 505-a (e.g., a molded part). The housing 505 may include additional components (e.g., additional layers) that may be incorporated into Fig. 5 are not explicitly shown. For example, in some implementations, the portable device 504 may include one or more insulating layers that electrically isolate the device electronics and other conductive materials (e.g., electrical traces) from the outer housing 505-b. The housing 505 may provide structural support for the device electronics, the battery 511, the substrate(s), and other components. For example, the housing 505 may protect the device electronics, the battery 511, and the substrate(s) from mechanical forces such as pressure and shock. The housing 505 may also protect the device electronics, the battery 511, and the substrate(s) from water and / or other chemicals.

[0067] The inner housing 505-a may be configured to contact the user's finger. The inner housing 505-a may be formed from a polymer (e.g., a medical-grade polymer) or another material. In some implementations, the inner housing 505-a may be transparent. For example, the inner housing 505-a may be transparent to light emitted by the PPG LEDs. In some implementations, the inner housing component 505-a may be overmolded onto the outer housing component 505-b. For example, the inner housing 505-a may comprise a polymer shaped (e.g., injection-molded) to fit within a metal outer housing shell 505-b.

[0068] The inner housing 505-a and the outer housing 505-b may be made of one or more materials. In some implementations, the inner housing 505-a, the outer housing 505-b, or both may comprise a metal such as titanium, which can provide strength and abrasion resistance while being relatively lightweight. Additionally or alternatively, the inner housing 505-a and / or the outer housing 505-b may also be made of other materials such as polymers, plastics, epoxies, ceramics, and the like. In some implementations, the outer housing 505-b may be both protective and decorative.

[0069] The portable device 504 may include one or more substrates (not shown). The device electronics and the battery 511 may be included on the one or more substrates. For example, the device electronics and the battery 511 may be mounted on one or more substrates. Example substrates may include one or more printed circuit boards (PCBs), such as flexible PCBs (e.g., polyimide). In some implementations, the electronics / battery 511 may include surface-mounted devices (e.g., surface-mount technology (SMT) devices) on a flexible circuit board. In some implementations, the one or more substrates (e.g., one or more flexible circuit boards) may include electrical traces that enable electrical communication between the device electronics components. The electrical traces may also connect the battery 511 to the device electronics.

[0070] The device electronics, battery 511, and substrates can be arranged in a variety of ways within the wearable device 504. In some implementations, a substrate including device electronics can be mounted along the bottom of the wearable device 504 (e.g., the lower half) so that the sensors (e.g., PPG system 535, temperature sensors 540, motion sensors 545, and other sensors) contact the bottom of the user's finger. In these implementations, the battery 511 can be contained along the top portion of the wearable device 504 (e.g., on a different substrate).

[0071] The various components / modules of the portable device 504 represent functionality (e.g., circuits and other components) that may be included in the portable device 504. Modules may include any discrete and / or integrated electronic circuit components that implement analog and / or digital circuits capable of producing the functions attributed to the modules herein. For example, the modules may include analog circuits (e.g., amplifier circuits, filter circuits, analog-to-digital converter circuits, and / or other signal conditioning circuits). The modules may also include digital circuits (e.g., combinational or sequential logic circuits, memory circuits, etc.).

[0072] The memory 515 (memory module) of the portable device 504 may comprise any volatile, non-volatile, magnetic, or electrical media, such as random access memory (RAM), read-only memory (ROM), non-volatile RAM (NVRAM), electrically erasable programmable read-only memory (EEPROM), flash memory, or any other storage device. The memory 515 may store any of the data described herein. For example, the memory 515 may be configured to store data collected by the respective sensors and the PPG system 535 (e.g., motion data, temperature data, PPG data). In addition, the memory 515 may include instructions that, when executed by one or more processing circuits, cause the modules to perform various functions attributed to the modules herein. The device electronics of the portable device 504 described herein are merely exemplary device electronics.Therefore, the types of electronic components used to implement device electronics may vary depending on design considerations.

[0073] The functions attributed to the modules of the wearable device 504 (e.g., wearable ring device) described herein may be implemented as one or more processors, hardware, firmware, software, or any combination thereof. The representation of various features as modules is intended to emphasize different functional aspects and does not necessarily imply that such modules must be implemented by separate hardware / software components. Rather, the functionality associated with one or more modules may be performed by separate hardware / software components or integrated into common hardware / software components.

[0074] The processing module 530-a of the portable device 504 may include one or more processors (e.g., processing units), microcontrollers, digital signal processors, systems-on-a-chip (SOCs), and / or other processing devices. The processing module 530-a communicates with the modules included in the portable device 504. For example, the processing module 530-a may send / receive data to / from the modules and other components of the portable device 504, such as the sensors. As described herein, the modules may be implemented by various circuit components. Accordingly, the modules may also be referred to as circuits (e.g., a communication circuit and a power circuit).

[0075] Processing module 530-a may communicate with memory 515. Memory 515 may include computer-readable instructions that, when executed by processing module 530-a, cause processing module 530-a to perform the various functions attributed herein to processing module 530-a. In some implementations, processing module 530-a (e.g., a microcontroller) may include additional features associated with other modules, such as communication functionality provided by communication module 520-a (e.g., an integrated Bluetooth Low Energy transceiver) and / or additional onboard memory 515.

[0076] The communication module 520-a may include circuitry enabling wireless and / or wired communication with the user device 506 (e.g., communication module 520-b of the user device 506). In some implementations, the communication modules 520-a, 520-b may include wireless communication circuitry such as Bluetooth circuitry and / or Wi-Fi circuitry. In some implementations, the communication modules 520-a, 520-b may include wired communication circuitry such as Universal Serial Bus (USB) communication circuitry. Using the communication module 520-a, the portable device 504 and the user device 506 may be configured to communicate with each other. The processing module 530-a of the ring may be configured to send / receive data to / from the user device 506 via the communication module 520-a.Example data may include, but is not limited to, motion data, temperature data, pulse waveforms, heart rate data, HRV data, PPG data, and status updates (e.g., charging status, battery level, and / or configuration settings of wearable device 504). The ring's processing module 530-a may also be configured to receive updates (e.g., software / firmware updates) and data from the user device 506.

[0077] The wearable device 504 may include a battery 511 (e.g., a rechargeable battery 511). An example battery 511 may include a lithium-ion or lithium polymer battery 511, although a variety of battery options 511 are possible. The battery 511 may be wirelessly charged. In some implementations, the wearable device 504 may include a power source other than the battery 511, such as a capacitor. The power source (e.g., battery 511 or capacitor) may have a curved geometry that conforms to the curvature of the wearable device 504. In some aspects, a charger or other power source may include additional sensors that may be used to collect data in addition to, or supplemental to, the data collected by the wearable device 504 itself.Additionally, a charger or other power source for the portable device 504 may function as the user device 506, in which case the charger or other power source for the portable device 504 may be configured to receive data from the portable device 504, store and / or process data received from the portable device 504, and communicate data between the portable device 504 and the servers 510.

[0078] In some aspects, the portable device 504 includes a power module 525 that can control the charging of the battery 511. For example, the power module 525 can be connected to an external wireless charger that charges the battery 511 when connected to the portable device 504. The charger can include a reference structure that mates with a reference structure of the portable device 504 to create a specific alignment with the portable device 504 during the charging process. The power module 525 can also regulate the voltage(s) of the device electronics, regulate the power output to the device electronics, and monitor the state of charge of the battery 511. In some implementations, the battery 511 can include a protection circuit module (PCM) that protects the battery 511 from high-current discharge, overvoltage during charging, and undervoltage during discharging.The power module 525 may also include electrostatic discharge (ESD) protection.

[0079] The one or more temperature sensors 540 may be electrically coupled to the processing module 530-a. The temperature sensor 540 may be configured to generate a temperature signal (e.g., temperature data) indicative of a temperature read or sensed by the temperature sensor 540. The processing module 530-a may determine a temperature of the user at the location of the temperature sensor 540. For example, in the wearable device 504, temperature data generated by the temperature sensor 540 may indicate a temperature of a user at the user's finger (e.g., skin temperature). In some implementations, the temperature sensor 540 may contact the user's skin. In other implementations, a portion of the housing 505 (e.g., the inner housing 505-a) may form a barrier (e.g., a thin, thermally conductive barrier) between the temperature sensor 540 and the user's skin.In some implementations, portions of the wearable device 504 configured to contact the user's finger may include thermally conductive portions and thermally insulating portions. The thermally conductive portions may conduct heat from the user's finger to the temperature sensors 540. The thermally insulating portions may isolate portions of the wearable device 504 (e.g., the temperature sensor 540) from the ambient temperature.

[0080] In some implementations, temperature sensor 540 may generate a digital signal (e.g., temperature data) that processing module 530-a may use to determine the temperature. As another example, in cases where temperature sensor 540 comprises a passive sensor, processing module 530-a (or a temperature sensor module 540) may measure a current / voltage generated by temperature sensor 540 and determine the temperature based on the measured current / voltage. Example temperature sensors 540 may include a thermistor, such as a negative temperature coefficient (NTC) thermistor, or other types of sensors, including resistors, transistors, diodes, and / or other electrical / electronic components.

[0081] Processing module 530-a may sample the user's temperature over time. For example, processing module 530-a may sample the user's temperature according to a sampling rate. An example sampling rate may include one sample per second, although processing module 530-a may be configured to sample the temperature signal at other sampling rates higher or lower than one sample per second. In some implementations, processing module 530-a may sample the user's temperature continuously throughout the day and night. Sampling at a sufficient rate (e.g., one sample per second) during the day may provide sufficient temperature data for the analysis described herein.

[0082] The processing module 530-a may store the sampled temperature data in the memory 515. In some implementations, the processing module 530-a may process the sampled temperature data. For example, the processing module 530-a may determine average temperature values over a specific period of time. In one example, the processing module 530-a may determine an average temperature value every minute by summing all temperature values collected over the minute and dividing by the number of samples over the minute. In a specific example where the temperature is sampled at one sample per second, the average temperature may be a sum of all sampled temperatures for one minute divided by sixty seconds. The memory 515 may store the average temperature values over time. In some implementations, the memory 515 may store average temperatures (e.g.,one per minute) instead of sampled temperatures to save memory 515.

[0083] The sampling rate that may be stored in memory 515 may be configurable. In some implementations, the sampling rate may be the same during the day and night. In other implementations, the sampling rate may change during the day / night. In some implementations, the wearable device 504 may filter / discard temperature readings, such as large temperature spikes that are not indicative of physiological changes (e.g., a temperature spike from a hot shower). In some implementations, the wearable device 504 may filter / discard temperature readings that may not be reliable due to other factors, such as excessive movement during exercise (e.g., as indicated by a motion sensor 545).

[0084] The portable device 504 (e.g., communications module) may transmit the sampled and / or average temperature data to the user device 506 for storage and / or further processing. The user device 506 may transmit the sampled and / or average temperature data to the server 510 for storage and / or further processing.

[0085] Although the wearable device 504 is illustrated as being equipped with a single temperature sensor 540, the wearable device 504 may include multiple temperature sensors 540 at one or more locations, e.g., arranged along the inner housing 505-a near the user's finger. In some implementations, the temperature sensors 540 may be standalone temperature sensors 540. Additionally or alternatively, one or more temperature sensors 540 may be included with other components (e.g., packaged with other components), such as the accelerometer and / or processor.

[0086] The processing module 530-a may collect and process data from multiple temperature sensors 540 in a similar manner as described with respect to a single temperature sensor 540. For example, the processing module 530 may individually sample, average, and store temperature data from each of the multiple temperature sensors 540. In other examples, the processing module 530-a may sample the sensors at different rates and average / store different values for the different sensors. In some implementations, the processing module 530-a may be configured to determine a single temperature based on the average of two or more temperatures determined by two or more temperature sensors 540 at different locations on the finger.

[0087] The temperature sensors 540 on the wearable device 504 (e.g., wearable ring device) can sense distal temperatures on the user's finger (e.g., on each finger). For example, one or more temperature sensors 540 on the wearable device 504 can sense a user's temperature from the underside of a finger or at another location on the finger. In some implementations, the wearable device 504 can continuously sense the distal temperature (e.g., at a sampling rate). Although the distal temperature measured by a wearable device 504 on the finger is described herein, other devices can measure the temperature at the same / different locations. In some cases, the distal temperature measured on a user's finger may be different from the temperature measured on a user's wrist or other external body location. Additionally, the distal temperature measured on a user's finger (e.g.,A continuous finger temperature (e.g., a "shell temperature") may differ from the user's core temperature. Therefore, the wearable device 504 may provide a useful temperature signal that may not be detected at other internal / external body locations. In some cases, a continuous finger temperature measurement may capture temperature fluctuations (e.g., small or large fluctuations) that may not be evident in the core temperature. For example, a continuous finger temperature measurement may capture minute-by-minute or hourly temperature fluctuations, providing additional insight that may not be provided by other temperature measurements elsewhere on the body.

[0088] The wearable device 504 may include a PPG system 535. The PPG system 535 may include one or more optical transmitters that emit light. The PPG system 535 may also include one or more optical receivers that receive light emitted by the one or more optical transmitters. An optical receiver may generate a signal (hereinafter, a "PPG" signal) indicative of an amount of light received by the optical receiver. The optical transmitters may illuminate an area of the user's finger. The PPG signal generated by the PPG system 535 may indicate blood flow to the illuminated area. For example, the PPG signal may indicate blood volume changes in the illuminated area caused by a user's pulse pressure. The processing module 530-a may sample the PPG signal and determine a user's pulse waveform based on the PPG signal.The processing module 530-a may determine a variety of physiological parameters based on the user's pulse waveform, such as a user's respiratory rate, heart rate, HRV, oxygen saturation, and other circulatory parameters.

[0089] In some implementations, the PPG system 535 may be configured as a reflective PPG system 535, where the optical receiver(s) receive emitted light reflected by the portion of the user's finger. In some implementations, the PPG system 535 may be configured as a transmissive PPG system 535, where the optical transmitter(s) and optical receiver(s) are positioned opposite each other, such that light is transmitted directly through a portion of the user's finger to the optical receiver(s).

[0090] The number and ratio of transmitters and receivers included in the PPG system 535 can vary. Example optical transmitters can include LEDs. The optical transmitters can emit light in the infrared spectrum and / or other spectra. Example optical receivers can include, among others, photosensors, phototransistors, and photodiodes. The optical receivers can be configured to generate PPG signals in response to the wavelengths received by the optical transmitters. The position of the transmitters and receivers can vary. Additionally, a single device can include reflective and / or transmissive PPG systems 535.

[0091] The Fig. The PPG system 535 illustrated in Figure 5 may, in some implementations, include a reflective PPG system 535. In these implementations, the PPG system 535 may include a centrally located optical receiver (e.g., on the bottom of the portable device 504) and two optical transmitters located on either side of the optical receiver. In this implementation, the PPG system 535 (e.g., the optical receiver) may generate the PPG signal based on light received from one or both optical transmitters. In other implementations, other placements, combinations, and / or configurations of one or more optical transmitters and / or optical receivers are contemplated.

[0092] Processing module 530-a may control one or both optical transmitters to emit light while sampling the PPG signal generated by the optical receiver. In some implementations, processing module 530-a may cause the optical transmitter with the stronger received signal to emit light while sampling the PPG signal generated by the optical receiver. For example, the selected optical transmitter may continuously emit light while sampling the PPG signal at a sampling rate (e.g., 250 Hz).

[0093] Sampling the PPG signal generated by PPG system 535 may result in a pulse waveform, which may be referred to as a "PPG." The pulse waveform may indicate blood pressure over time for multiple cardiac cycles. The pulse waveform may include spikes indicative of cardiac cycles. Additionally, the pulse waveform may include respiration-induced variations that may be used to determine respiratory rate. Processing module 530-a may, in some implementations, store the pulse waveform in memory 515. Processing module 530-a may process the pulse waveform during its generation and / or from memory 515 to determine user physiological parameters described herein.

[0094] Processing module 530-a may determine the user's heart rate based on the pulse waveform. For example, processing module 530-a may determine the heart rate (e.g., in beats per minute) based on the time between peaks in the pulse waveform. The time between peaks may be referred to as the interbeat interval (IBI). Processing module 530-a may store the determined heart rate values and IBI values in memory 515.

[0095] The processing module 530-a may determine the HRV over time. For example, the processing module 530-a may determine the HRV based on the variation in the IBIs. The processing module 530-a may store the HRV values over time in the memory 515. In addition, the processing module 530-a may determine the user's respiratory rate over time. For example, the processing module 530-a may determine the respiratory rate based on frequency modulation, amplitude modulation, or baseline modulation of the user's IBI values over a certain period of time. The respiratory rate may be calculated in breaths per minute or as another respiratory rate (e.g., breaths per 30 seconds). The processing module 530-a may store the user's respiratory rate values over time in the memory 515.

[0096] The wearable device 504 may include one or more motion sensors 545, such as one or more accelerometers (e.g., 6-D accelerometers) and / or one or more gyroscopes (gyros). The motion sensors 545 may generate motion signals indicative of motion of the sensors. For example, the wearable device 504 may include one or more accelerometers that generate acceleration signals indicative of acceleration of the accelerometers. As another example, the wearable device 504 may include one or more gyro sensors that generate gyro signals indicative of angular motion (e.g., angular velocity) and / or changes in orientation. The motion sensors 545 may be included in one or more sensor packages.An example acceleration / gyro sensor is a Bosch BMI160 inertial MEMS (Micro Electro-Mechanical System) sensor, which can measure angular velocities and accelerations in three perpendicular axes.

[0097] Processing module 530-a may sample the motion signals at a sampling rate (e.g., 50 Hz) and determine the motion of portable device 504 based on the sampled motion signals. For example, processing module 530-a may sample acceleration signals to determine the acceleration of portable device 504. As another example, processing module 530-a may sample a gyro signal to determine angular motion. In some implementations, processing module 530-a may store motion data in memory 515. Motion data may include sampled motion data as well as motion data calculated based on the sampled motion signals (e.g., acceleration and angle values).

[0098] Wearable device 504 may store a variety of data described herein. For example, wearable device 504 may store temperature data, such as raw sampled temperature data and calculated temperature data (e.g., average temperatures). As another example, wearable device 504 may store PPG signal data, such as pulse waveforms and data calculated based on the pulse waveforms (e.g., heart rate values, IBI values, HRV values, and respiratory rate values). Wearable device 504 may also store motion data, such as sampled motion data indicating linear and angular motion.

[0099] The wearable device 504 or other computing device may calculate and store additional values based on the sampled / calculated physiological data. For example, the processing module 530 may calculate and store various metrics, such as sleep metrics (e.g., a sleep score), activity metrics, and readiness metrics. In some implementations, additional values / metrics may be referred to as "derived values." The wearable device 504 or other computing / wearable device may calculate a variety of values / metrics related to movement. Example derived values for movement data may include, but are not limited to, movement amount counts, regularity scores, intensity scores, task metabolic equivalence values (METs), and orientation scores. Movement amounts, regularity scores, intensity scores, and METs may indicate a measure of the user's movement (e.g., speed / acceleration) over time.Orientation values may indicate how the wearable device 504 is oriented on the user's finger and whether the wearable device 504 is worn on the left or right hand.

[0100] In some implementations, movement amounts and regularity values can be determined by counting a number of acceleration spikes within one or more time periods (e.g., one or more 30-second to 1-minute periods). Intensity values can indicate a number of movements and the associated intensity (e.g., acceleration values) of the movements. The intensity values can be categorized as low, moderate, and high depending on their associated threshold acceleration values. METs can be determined based on the intensity of the movements during a time period (e.g., 30 seconds), the regularity / irregularity of the movements, and the number of movements associated with the different intensities.

[0101] In some implementations, processing module 530-a may compress the data stored in memory 515. For example, processing module 530-a may delete sampled data after performing calculations based on the sampled data. As another example, processing module 530-a may average data over longer periods of time to reduce the number of stored values. In a specific example, if average temperatures for a user over one minute are stored in memory 515, processing module 530-a may calculate average temperatures over a five-minute period for storage and then delete the one-minute average temperature data. Processing module 530-a may compress data based on a variety of factors, such asthe total amount of used / available memory 515 and / or an elapsed time since the portable device 504 last transmitted the data to the user device 506.

[0102] Although a user's physiological parameters may be measured by sensors included in a wearable device 504, other devices may measure a user's physiological parameters. For example, although a user's temperature may be measured by a temperature sensor 540 included in a wearable device 504, other devices may measure a user's temperature. In some examples, other wearable devices (e.g., wrist devices) may include sensors that measure physiological parameters of the user. Additionally, medical devices, such as external medical devices (e.g., wearable medical devices) and / or implantable medical devices, may measure a user's physiological parameters. One or more sensors on any type of computing device may be used to implement the techniques described herein.

[0103] The physiological measurements may be taken continuously throughout the day and / or night. In some implementations, the physiological measurements may be taken during parts of the day and / or parts of the night. In some implementations, the physiological measurements may be taken in response to determining that the user is in a particular state, such as an active state, a resting state, and / or a sleeping state. For example, the wearable device 504 may take physiological measurements in a resting / sleeping state to capture cleaner physiological signals. In one example, the wearable device 504 or another device / system may detect when a user is resting and / or sleeping and capture physiological parameters (e.g., temperature) for that detected state.The devices / systems may use the resting / sleep physiological data and / or other data when the user is in other states to implement the techniques of the present disclosure.

[0104] In some implementations, as previously described herein, the portable device 504 may be configured to collect, store, and / or process data and transmit any of the data described herein to the user device 506 for storage and / or processing. In some aspects, the user device 506 includes a portable application 550, an operating system 585 (OS), a web browser application (e.g., web browser 580), one or more additional applications, and a GUI 575. The user device 506 may further include other modules and components, including sensors, audio devices, haptic feedback devices, and the like. The portable application 550 may be an example of an application (e.g., "app") that may be installed on the user device 506. The portable application 550 may be configured to collect data from the portable device 504, store the collected data, and process the collected data as described herein.For example, the portable application 550 may include a user interface (UI) module 555, a capture module 560, a processing module 530-b, a communication module 520-b, and a storage module (e.g., database 565) configured to store application data.

[0105] In some cases, portable device 504 and user device 506 may be included in (or constitute) the same device. For example, in some cases, portable device 504 may be configured to execute portable application 550 and display data via GUI 575.

[0106] The various data processing operations described herein may be performed by the portable device 504, the user device 506, the servers 510, or any combination thereof. For example, in some cases, data collected by the portable device 504 may be preprocessed and transmitted to the user device 506. In this example, the user device 506 may perform some data processing operations on the received data, transmit the data to the servers 510 for data processing, or both. For example, in some cases, the user device 506 may perform processing operations that require relatively low computing power and / or operations that require relatively low latency, while the user device 506 may transmit the data to the servers 510 for processing operations that require relatively high computing power and / or operations that may allow relatively higher latency.

[0107] In some aspects, wearable device 504 (e.g., wearable ring device), user device 506, and server 510 of system 500 may be configured to evaluate sleep patterns for a user. In particular, the respective components of system 500 may be used to collect data from a user via wearable device 504 and generate one or more scores (e.g., sleep score, readiness score) for the user based on the collected data. For example, as previously mentioned herein, wearable device 504 of system 500 may be worn by a user to collect data from the user, including temperature, heart rate, HRV, and the like. Data collected by wearable device 504 may be used to determine when the user is sleeping in order to evaluate the user's sleep for a particular "sleep day."In some aspects, scores may be calculated for the user for each respective sleep day, such that a first sleep day is associated with a first set of scores and a second sleep day is associated with a second set of scores. Scores may be calculated for each respective sleep day based on data collected by wearable device 504 during the respective sleep day. Scores may include, but are not limited to, sleep scores, readiness scores, and the like.

[0108] In some cases, "sleep days" may correspond to traditional calendar days, so that a given sleep day lasts from midnight to midnight of that calendar day. In other cases, sleep days may be offset relative to calendar days. For example, sleep days may last from 6:00 PM (18:00) one calendar day to 6:00 PM (18:00) the following calendar day. In this example, 6:00 PM may serve as the "cutoff date," with data collected by the user before 6:00 PM counting toward the current sleep day and data collected by the user after 6:00 PM counting toward the following sleep day. Due to the fact that most people sleep the most at night, offsetting sleep days relative to calendar days may allow the system 500 to evaluate sleep patterns for users to align with their sleep schedules.In some cases, users can selectively adjust the timing of sleep days relative to calendar days (e.g., via the GUI) so that the sleep days correspond to the amount of time that the respective users typically sleep.

[0109] In some implementations, each overall score for a user for each respective day (e.g., sleep score, readiness score) may be determined / calculated based on one or more "contributors," "factors," or "contributing factors." For example, a user's overall sleep score may be calculated based on a number of contributors, including: total sleep, efficiency, restfulness, REM sleep, deep sleep, latency, timing, or any combination thereof. The sleep score may include any number of contributors. The "total sleep" contributor may refer to the sum of all sleep periods of the sleep day. The "efficiency" contributor may reflect the percentage of time spent in bed asleep compared to time awake and may be calculated using the efficiency average of long sleep periods (e.g., primary sleep period) of the sleep day, weighted by the duration of each sleep period.The "Restlessness" contributor can indicate how restful the user's sleep is and can be calculated using the average of all sleep periods of the sleep day, weighted by the duration of each period. The restlessness contributor can be based on a "wake-up count" (e.g., the sum of all wake-ups (when the user wakes up) detected during different sleep periods), excessive movement, and a "get-up count" (e.g., the sum of all get-up events (when the user gets out of bed) detected during different sleep periods).

[0110] The "REM sleep" contributor may refer to the total sum of REM sleep durations across all sleep periods of the sleep day, including REM sleep. Similarly, the "deep sleep" contributor may refer to the total sum of deep sleep durations across all sleep periods of the sleep day, including deep sleep. The "latency" contributor may indicate how long (e.g., average, median, longest) it takes the user to fall asleep and may be calculated using the average of long sleep periods throughout the sleep day, weighted by the duration of each period and the number of such periods (e.g., the consolidation of a particular sleep stage or stages may be its own contributor or may weight other contributors).Finally, the contributor “timing” may refer to the relative timing of sleep periods within the sleep day and / or calendar day and may be calculated using the average of all sleep periods of the sleep day, weighted by the duration of each period.

[0111] As another example, a user's overall readiness score may be calculated based on a number of contributors, including: sleep, sleep balance, heart rate, HRV balance, recovery index, temperature, activity, activity balance, or any combination thereof. The readiness score may include any number of contributors. The "sleep" contributor may refer to the combined sleep score of all sleep periods within the sleep day. The "sleep balance" contributor may refer to the cumulative duration of all sleep periods within the sleep day. In particular, the sleep balance may indicate to a user whether the sleep the user has obtained over a given period of time (e.g., the past two weeks) is in balance with the user's needs.Typically, adults need 7-9 hours of sleep per night to stay healthy, alert, and perform at their best both mentally and physically. However, it's normal to have the occasional bad night, so the Sleep Balance contributor considers long-term sleep patterns to determine if each user's sleep needs are being met. The Resting Heart Rate contributor can display the lowest heart rate from the longest sleep period of the sleep day (e.g., primary sleep period) and / or the lowest heart rate from naps that occur after the primary sleep period.

[0112] Further referring to the "contributors" (e.g., factors, contributing factors) of the readiness score, the "HRV Balance" contributor can show the highest HRV average from the primary sleep period and the naps occurring after the primary sleep period. The "HRV Balance" contributor can help users track their recovery status by comparing their HRV trend over an initial period (e.g., two weeks) with an average HRV over a second, longer period (e.g., three months). The "Recovery Index" contributor can be calculated based on the longest sleep period. The Recovery Index measures how long it takes for a user's resting heart rate to stabilize during the night.A sign of very good recovery is that the user's resting heart rate stabilizes during the first half of the night, at least six hours before the user wakes up, so that the body has time to recover for the next day. The "body temperature" contributor can be calculated based on the longest sleep period (e.g., primary sleep period) or based on a nap that occurs after the longest sleep period, if the user's highest temperature during the nap is at least 0.5°C higher than the highest temperature during the longest period. In some aspects, the ring can measure a user's body temperature while the user is sleeping, and the system 500 can display the user's average temperature relative to the user's baseline temperature. If a user's body temperature is outside their normal range (e.g.,significantly above or below 0.0), the contributor's body temperature may be highlighted (e.g., enter an "attention" state) or otherwise generate a warning for the user.

[0113] Fig. 6 shows a flowchart illustrating a method 600 that supports shock-absorbing wearable ring structures according to aspects of the present disclosure. For example, the operations of method 600 may be performed to manufacture a wearable device, as described with respect to Fig. 1-5 described.

[0114] At 605, the method may include coupling a circuit board to an inner annular housing using a moldable material, wherein the inner annular housing has an inner curved surface of the wearable ring device configured to contact tissue of a user, the circuit board including one or more sensors configured to collect physiological data from a user through an inner curved surface of the inner annular housing, wherein the circuit board, the one or more sensors, or both are at least partially encapsulated in the moldable material. The operations of 605 may be performed according to the examples disclosed herein.

[0115] At 610, the method may include disposing an outer annular housing around the inner annular housing, the circuit board, and the moldable material such that the outer annular housing at least partially surrounds the inner annular housing, wherein an inner surface of the outer annular housing and an outer surface of the moldable material are separated by a gap that extends at least a portion of a width of the wearable ring device between a first lateral side and a second lateral side of the wearable ring device. The operations of 610 may be performed according to the examples disclosed herein.

[0116] At 615, the method may include forming or inserting a first side cover into a first slot between the outer annular housing and the inner annular housing on a first lateral side of the wearable ring device. The operations of 615 may be performed according to the examples disclosed herein.

[0117] At 620, the method may include forming or inserting a second side cover into a second slot between the outer annular housing and the inner annular housing on a second lateral side of the wearable ring device opposite the first lateral side, wherein the first side cover, the second side cover, or both are configured to undergo mechanical deformation in response to an external force applied to the outer annular housing, wherein a depth of the gap between the inner surface of the outer annular housing and the outer surface of the moldable material changes based at least in part on the mechanical deformation of the first side cover, the second side cover, or both. The operations of 620 may be performed according to the examples disclosed herein.

[0118] It should be noted that the methods described above describe possible implementations, and that the operations and steps may be rearranged or otherwise modified, and other implementations are possible. Furthermore, aspects of two or more of the methods may be combined.

[0119] The following provides an overview of aspects of the present disclosure: Aspect 1: A wearable ring device comprising: an inner annular housing having an inner curved surface of the wearable ring device, the inner curved surface configured to at least partially contact tissue of a user; one or more sensors configured to collect physiological data from the user through the inner curved surface, the one or more sensors at least partially encapsulated in a moldable material and coupled to the inner annular housing via the moldable material;an outer annular housing having an outer curved surface of the wearable ring device, the outer annular housing at least partially surrounding the inner annular housing, an inner surface of the outer annular housing and an outer surface of the moldable material being separated by a gap extending at least a portion of a width of the wearable ring device between a first lateral side and a second lateral side of the wearable ring device;and a first side cover and a second side cover at least partially disposed between the outer annular housing and the inner annular housing on a first lateral side and a second lateral side, respectively, of the wearable ring device, wherein the first side cover, the second side cover, or both are configured to undergo mechanical deformation in response to an external force applied to the outer annular housing, wherein a depth of the gap between the inner surface of the outer annular housing and the outer surface of the moldable material changes based at least in part on the mechanical deformation of the first side cover, the second side cover, or both.; Aspect 2: The wearable ring device of aspect 1, wherein the gap extends over a full circumference of the wearable ring device between the inner surface of the outer annular housing and the outer surface of the moldable material. Aspect 3: The wearable ring device according to any one of aspects 1 to 2, wherein the first side cover, the second side cover, or both are configured to undergo the mechanical deformation to dissipate at least a portion of the external force exerted on the outer annular housing. Aspect 4: The wearable ring device according to any one of aspects 1 to 3, wherein the first side cover, the second side cover, or both are configured to undergo the mechanical deformation to distribute at least a portion of the external force from the outer annular housing to the inner annular housing. Aspect 5: The wearable ring device according to any one of aspects 1 to 4, wherein the first side cover, the second side cover, or both comprise annular fittings inserted between the inner annular housing and the outer annular housing, an adhesive material molded or cured between the inner annular housing and the outer annular housing, or both. Aspect 6: The wearable ring device according to any one of aspects 1 to 5, wherein the outer annular housing is coupled to the wearable ring device via a first contact point with the first side cover and a second contact point with the second side cover, wherein the gap extends over the portion of the width of the wearable ring device between the first contact point and the second contact point. Aspect 7: The wearable ring device of aspect 6, wherein the outer annular housing contacts a first portion of the moldable material proximate the first lateral side via the first contact point and a second portion of the moldable material proximate the second lateral side via the second contact point. Aspect 8: The wearable ring device of any one of aspects 1 to 7, wherein the outer annular housing comprises a non-conductive material, the wearable ring device further comprising: an antenna configured to transmit and receive wireless communications through the outer annular housing of the wearable ring device, the antenna being at least partially encapsulated in the moldable material, the antenna comprising: an antenna ground plane coupled to the inner annular housing; and a radiator communicatively coupled to the antenna ground plane, the radiator positioned between the antenna ground plane and the outer surface of the moldable material. Aspect 9: The wearable ring device of any one of aspects 1 to 8, further comprising: a curved battery at least partially encapsulated in the moldable material such that the gap separates an outer surface of the curved battery and the outer surface of the moldable material from the inner surface of the outer annular housing. Aspect 10: The wearable ring device according to any one of aspects 1 to 9, wherein the outer annular housing comprises a non-deformable material. Aspect 11: The wearable ring device of aspect 10, wherein the non-deformable material comprises a ceramic material. Aspect 12: The wearable ring device of any one of aspects 1 to 11, further comprising: a compressible material, an insulating material, or both filling at least a portion of the gap. Aspect 13: A method of manufacturing a wearable ring device, comprising: coupling a circuit board to an inner annular housing using a moldable material, wherein the inner annular housing has an inner curved surface of the wearable ring device configured to contact tissue of a user, the circuit board including one or more sensors configured to collect physiological data from a user through an inner curved surface of the inner annular housing, wherein the circuit board, the one or more sensors, or both are at least partially encapsulated in the moldable material;Arranging an outer annular housing around the inner annular housing, the circuit board, and the moldable material such that the outer annular housing at least partially surrounds the inner annular housing, wherein an inner surface of the outer annular housing and an outer surface of the moldable material are separated by a gap extending at least a portion of a width of the wearable ring device between a first lateral side and a second lateral side of the wearable ring device; Forming or inserting a first side cover into a first slot between the outer annular housing and the inner annular housing on a first lateral side of the wearable ring device;and forming or inserting a second side cover into a second slot between the outer annular housing and the inner annular housing on a second lateral side of the wearable ring device opposite the first lateral side, wherein the first side cover, the second side cover, or both are configured to undergo mechanical deformation in response to an external force applied to the outer annular housing, wherein a depth of the gap between the inner surface of the outer annular housing and the outer surface of the moldable material changes based at least in part on the mechanical deformation of the first side cover, the second side cover, or both.; Aspect 14: The method of aspect 13, wherein the gap extends over a full circumference of the wearable ring device between the inner surface of the outer annular housing and the outer surface of the moldable material. Aspect 15: The method of any one of aspects 13 to 14, further comprising: filling at least a portion of the gap with a compressible material, an insulating material, or both. Aspect 16: The method of any one of aspects 13 to 15, further comprising: coupling a curved battery to the circuit board, wherein the circuit board and the curved battery are coupled to the inner annular housing by at least partially encapsulating the circuit board and the curved battery in the moldable material. Aspect 17: The method of any one of aspects 13 to 16, wherein forming or inserting the first side cover and the second side cover comprises: inserting a first annular fitting into the first slot between the inner annular housing and the outer annular housing, the first side cover comprising the first annular fitting; and inserting a second annular fitting into the second slot between the inner annular housing and the outer annular housing, the second side cover comprising the second annular fitting, the first annular fitting and the second annular fitting extending over a full circumference of the wearable ring device on the first lateral side and the second lateral side of the wearable ring device, respectively. Aspect 18: The method of any one of aspects 13 to 17, wherein forming or inserting the first side cover and the second side cover comprises: curing an adhesive material within the first slot and the second slot, wherein the first side cover and the second side cover comprise the adhesive material.

[0120] The description presented herein, in conjunction with the accompanying drawings, describes example configurations and does not represent all examples that may be implemented or that fall within the scope of the claims. As used herein, the term "exemplary" means "serving as an example, instance, or illustration" rather than "preferred" or "advantageous over other examples." The detailed description includes specific details for the purpose of understanding the described techniques. However, these techniques may be practiced without these specific details. In some cases, well-known structures and devices are shown in block diagram form so as not to obscure the concepts of the described examples.

[0121] In the accompanying figures, similar components or features may have the same reference numeral. Furthermore, different components of the same type may be distinguished by following the reference numeral with a hyphen and a second character that distinguishes between the similar components. If only the first reference numeral is used in the description, the description applies to each of the similar components with the same first reference numeral, regardless of the second reference numeral.

[0122] Information and signals described herein may be represented using any of a variety of technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips referred to in the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0123] The various illustrative blocks and modules described in connection with the invention disclosed herein may be implemented or executed using a general-purpose processor, a DSP, an ASIC, an FPGA or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof configured to perform the functions described herein. A general-purpose processor may be a microprocessor, but alternatively, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration).

[0124] The functions described herein may be implemented in hardware, software executed by a processor, firmware, or any combination thereof. When implemented in software executed by a processor, the functions may be stored or transmitted as one or more instructions or code on a computer-readable medium. Other examples and implementations are within the scope of the disclosure and the appended claims. For example, due to the nature of software, functions described above may be implemented using software executed by a processor, hardware, firmware, hardwiring, or combinations thereof. Features that implement functions may also be physically located in different locations, including being distributed such that portions of functions are implemented in different physical locations.Also, as used herein, including in the claims, "or," as used in a list of items (for example, a list of items preceded by a phrase such as "at least one of" or "one or more of"), indicates an inclusive list, such as, for example, a list of at least one of A, B, or CA, or B, or C, or AB, or AC, or BC, or ABC (i.e., A, B, and C). Also, as used herein, the phrase "based on" is not to be construed as indicating a closed set of conditions. For example, an exemplary step described as "based on Condition A" may be based on both a Condition A and a Condition B without departing from the scope of the present disclosure. In other words, as used herein, the phrase "based on" is to be construed in the same manner as the phrase "based at least in part on."

[0125] Computer-readable media includes both non-transitory computer storage media and communications media, including any medium that facilitates the transfer of a computer program from one location to another. A non-transitory storage medium can be any available medium that can be accessed by a general-purpose or special-purpose computer. By way of example, and not limitation, non-transitory computer-readable media can include RAM, ROM, electrically erasable programmable ROM (EEPROM), compact disc (CD) ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other non-transitory medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a general-purpose or special-purpose computer or a general-purpose or special-purpose processor.Also, any connection is properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair cable, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair cable, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, include CD, laser disc, optical disc, digital versatile disc (DVD), floppy disk, and Blu-ray Disc, where disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of the above are also included within the scope of computer-readable media.

[0126] The description provided herein is intended to enable a person skilled in the art to make or use the disclosure. Various modifications of the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the scope of the disclosure. Thus, the disclosure is not limited to the examples and designs described herein, but is intended to be accorded the broadest scope consistent with the principles and novel features disclosed herein.

Claims

[1] A portable ring device comprising: an inner annular housing having an inner curved surface of the wearable ring device, wherein the inner curved surface is configured to at least partially contact a user's tissue; one or more sensors configured to collect physiological data from the user through the inner curved surface, wherein the one or more sensors are at least partially encapsulated in a moldable material and coupled to the inner annular housing via the moldable material; an outer annular housing having an outer curved surface of the wearable ring device, wherein the outer annular housing at least partially surrounds the inner annular housing, wherein an inner surface of the outer annular housing and an outer surface of the moldable material are separated by a gap extending at least a portion of a width of the wearable ring device between a first lateral side and a second lateral side of the wearable ring device; and a first side cover and a second side cover disposed at least partially between the outer annular housing and the inner annular housing on a first lateral side or a second lateral side of the portable ring device, wherein the first side cover, the second side cover, or both are configured to undergo mechanical deformation in response to an external force applied to the outer annular housing, wherein a depth of the gap between the inner surface of the outer annular housing and the outer surface of the moldable material changes based at least in part on the mechanical deformation of the first side cover, the second side cover, or both. [2] The wearable ring device of claim 1, wherein the gap extends over a full circumference of the wearable ring device between the inner surface of the outer annular housing and the outer surface of the moldable material. [3] The wearable ring device of claim 1, wherein the first side cover, the second side cover, or both are configured to undergo the mechanical deformation to dissipate at least a portion of the external force applied to the outer annular housing. [4] The wearable ring device of claim 1, wherein the first side cover, the second side cover, or both are configured to undergo the mechanical deformation to distribute at least a portion of the external force from the outer annular housing to the inner annular housing. [5] The wearable ring device according to claim 1, wherein the first side cover, the second side cover, or both comprise annular fittings inserted between the inner annular housing and the outer annular housing, an adhesive material molded or cured between the inner annular housing and the outer annular housing, or both. [6] A portable ring device according to claim 1, wherein the outer annular housing is coupled to the portable ring device via a first contact point with the first side cover and a second contact point with the second side cover, wherein the gap extends over the part of the width of the wearable ring device between the first contact point and the second contact point. [7] The wearable ring device of claim 6, wherein the outer annular housing contacts a first portion of the moldable material proximate the first lateral side via the first contact point and a second portion of the moldable material proximate the second lateral side via the second contact point. [8] The wearable ring device of claim 1, wherein the outer annular housing comprises a non-conductive material, the wearable ring device further comprising: an antenna configured to transmit and receive wireless communications through the outer ring-shaped housing of the portable ring device, wherein the antenna is at least partially encapsulated in the moldable material, wherein the antenna includes: an antenna ground plane coupled to the inner annular housing; and a radiator communicatively coupled to the antenna ground plane, wherein the radiator is positioned between the antenna ground plane and the outer surface of the moldable material. [9] A portable ring device according to claim 1, further comprising: a curved battery at least partially encapsulated in the moldable material such that the gap separates an outer surface of the curved battery and the outer surface of the moldable material from the inner surface of the outer annular housing. [10] A wearable ring device according to claim 1, wherein the outer annular housing comprises a non-deformable material. [11] A wearable ring device according to claim 10, wherein the non-deformable material comprises a ceramic material. [12] A portable ring device according to claim 1, further comprising: a compressible material, an insulating material, or both, that fills at least part of the gap.

Citation Information

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