Flexible stamped conductor board

Abstract

Flexible die-cut printed circuit board (100), including: a support material (110) made of a flexible material, wherein the support material (110) has a first surface (110a) and a second surface (110b) opposite the first surface (110a); at least one conductor track (121) formed on the first surface (110a) of the substrate material (110); a profile fuse (122) configured as a section of the conductor track (121), wherein the profile fuse (122) has a smaller thickness than other sections of the conductor track (121) and is configured to break when excessive current flows; and a protective layer (130) configured to cover the conductor track (121) and the profile protection (122).

Description

BACKGROUND 1. Technical field

[0001] The embodiments of the present disclosure generally relate to an improved printed circuit board. 2. Description of the related technology

[0002] Printed circuit boards (PCBs) can connect various electronic components, including semiconductor chips, sensors, and connectors. Such PCBs have been used in a variety of electronic devices. Flexible PCBs, made from flexible materials, can be used in electronic devices with different structures due to their flexibility. For example, a flexible PCB can be used to connect a sensor and a connector in a battery module.

[0003] To protect various electronic components connected to a printed circuit board (PCB) from excessive current, a fuse can be attached to the PCB. Such a fuse can blow when excessive current flows, thus blocking the current flow. For example, a flexible PCB used in a battery module might be connected to a fuse. SUMMARY

[0004] According to one embodiment of the present disclosure, a flexible stamped printed circuit board is provided which includes a profile locking mechanism designed with a thin conductor track thickness.

[0005] According to one embodiment of the present disclosure, a flexible stamped printed circuit board is provided which includes a profile locking mechanism in which a profile curvature is formed in the thickness direction.

[0006] A flexible stamped printed circuit board according to an embodiment of the present disclosure can be widely used in the field of green technology, including electric vehicles, battery charging infrastructures and other battery-based solar and wind energy generation systems.

[0007] A flexible stamped printed circuit board according to an embodiment of the present disclosure can be used in environmentally friendly electric vehicles, hybrid vehicles and the like to prevent climate change by suppressing air pollution and greenhouse gas emissions.

[0008] According to one embodiment of the present disclosure, a flexible die-cut printed circuit board may comprise: a substrate material made of a flexible material, wherein the substrate material has a first surface and a second surface opposite the first surface; at least one conductor formed on the first surface of the substrate material; a profile fuse formed as a section of the conductor, wherein the profile fuse has a lesser thickness than other sections of the conductor and is configured to break through when excessive current flows; and a protective layer configured to cover the conductor and the profile fuse.

[0009] According to one embodiment, the profile locking mechanism can be designed in a pattern that has a curved shape in a direction perpendicular to the first surface of the support material.

[0010] According to one embodiment, the conductor track and the profile locking mechanism can have the same width in at least one section.

[0011] According to one embodiment, the profile locking mechanism can be formed in a pattern in which a convex section and a concave section are repeatedly formed in a direction perpendicular to the first surface of the support material.

[0012] According to one embodiment, the convex section and the concave section of the profile locking mechanism can be positioned within the thickness of the conductor track.

[0013] A method for manufacturing a flexible stamped printed circuit board may include the following steps: pressing a metal foil in an area where a profile locking feature is to be formed in the metal foil using stamping dies; forming a conductor track and the profile locking feature by performing a stamping operation on the metal foil such that the pressed area of ​​the metal foil is contained in the conductor track; and manufacturing a printed circuit board by aligning the conductor track and the profile locking feature on a first face of a substrate material made of a flexible material, and then forming a protective layer configured to cover the conductor track and the profile locking feature on the substrate material.

[0014] According to one embodiment, the profile locking mechanism can be designed in a pattern that has a curved shape in a direction perpendicular to the first surface of the support material.

[0015] According to one embodiment, the press dies may include: a lower die configured to support a lower surface of the metal foil in the area where the profile locking is to be formed; and an upper die configured to press an upper surface of the metal foil in the area where the profile locking is to be formed.

[0016] According to one embodiment, a first curved pattern having a convex shape on an upper surface of the lower punch can be formed in the lower punch, wherein the upper surface is in contact with the area in which the profile locking is to be formed, and a second curved pattern having a convex shape on a lower surface of the upper punch can be formed in the upper punch, wherein the lower surface is in contact with the area in which the profile locking is to be formed to correspond to a concave section of the first curved pattern.

[0017] According to one embodiment, in the step of forming the conductor track and the profile locking mechanism, the punching can be carried out in such a way that the conductor track and the profile locking mechanism have the same width in at least one section.

[0018] According to one embodiment, the profile locking mechanism can be formed in a pattern in which a convex section and a concave section are repeatedly formed in a direction perpendicular to the first surface of the support material.

[0019] According to one embodiment, the convex section and the concave section of the profile locking mechanism can be positioned within the thickness of the conductor track.

[0020] The features and advantages of the present disclosure will become clearer from the following detailed description based on the accompanying drawings.

[0021] Before discussing the description, it should be noted that all terms or words used herein and in the attached claims should not be interpreted as having general and literal meanings, but rather should be interpreted on the basis of the meanings and concepts corresponding to the technical ideas of the present disclosure, following the principle that every inventor is allowed to define the concepts of terms in such a way as is appropriate to describe their disclosure in the best possible way.

[0022] According to one embodiment of the present disclosure, a conductor track can be produced in which a profile locking mechanism of small thickness is formed.

[0023] According to one embodiment of the present disclosure, a profile fuse can be formed on a flexible stamped printed circuit board to replace a chip fuse. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a view representing a battery module to which a flexible stamped printed circuit board is applied according to an embodiment of the present disclosure; Fig. 2 is a view showing a flexible stamped printed circuit board according to an embodiment of the present disclosure; Fig. Figure 3 is a cross-sectional view along line AA' of Fig. 2; Fig. Figure 4 is a flowchart that illustrates each step that constitutes a process for manufacturing a flexible stamped printed circuit board; and Fig. 5, Fig. 6 and Fig. The 7 are views that represent each step that forms a process for manufacturing a flexible stamped printed circuit board. DETAILED DESCRIPTION

[0024] The embodiments of the present disclosure are described in detail below (with reference to the accompanying drawings). However, this serves only as an illustration, and the embodiments may not be limited to the specific embodiments shown below.

[0025] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0026] Fig. Figure 1 is a view showing a battery module 1 to which a flexible stamped printed circuit board 100 is applied according to an embodiment of the present disclosure. Fig. Figure 2 is a view showing the flexible stamped printed circuit board 100 according to an embodiment of the present disclosure. Fig. Figure 3 is a cross-sectional view along line AA' of Fig. 2.

[0027] The battery module 1 can be used for electric vehicles, energy storage systems (ESSs), and various other purposes. The battery module 1 can include: a plurality of battery cells 10; a busbar assembly 20 configured to supply power from the plurality of battery cells 10 by connecting a plurality of tabs; a printed circuit board 30 configured to perform data transmission and reception or module status monitoring; and a housing 40 configured to contain the plurality of battery cells 10. The battery module 1 can additionally include other elements not shown in the drawing.

[0028] The battery cell 10 can be configured in a pouch shape, a prismatic shape, a cylindrical shape, and the like. The housing 40 can be configured with, but is not limited to, a front section 40a, a rear section 40b, a lower section 40c, and an upper section 40d. The shape of the housing 40 and the configurations contained within the battery module 1 can vary depending on the types of battery cells 10.

[0029] The printed circuit board 30 contained in the battery module 1 can include the flexible die-cut printed circuit board 100 according to one embodiment. The flexible die-cut printed circuit board 100 can be connected to various electronic components, including sensors such as temperature sensors, current sensors, and voltage sensors, fuses, battery management system (BMS) chips, and connectors. The flexible die-cut printed circuit board 100 can be used for the battery module 1 or for a battery pack containing multiple battery modules 1.

[0030] The flexible die-cut printed circuit board 100 according to one embodiment may include: a substrate material 110 made of a flexible material, wherein the substrate material 110 has a first surface 110a and a second surface 110b opposite the first surface 110a; at least one conductor track 121 formed on the first surface 110a of the substrate material 110; a profiled fuse 122 formed as a section of the conductor track 121, wherein the profiled fuse has a lesser thickness than other sections of the conductor track 121 and is configured to break when excessive current flows; and a protective layer 130 configured to cover the conductor track 121 and the profiled fuse 122. In this case, the profiled fuse 122 may be formed in a pattern having a curved shape in a direction perpendicular to the first surface 110a of the substrate material 110.A layer in which the conductor track 121 and the profile locking device 122 are positioned can be referred to as a circuit layer 120. The circuit layer 120 can contain at least one conductor track 121 and one profile locking device 122 and can further contain an adhesive 123. The adhesive 123 can bond the substrate material 110, the conductor track 121, and the protective layer 130.

[0031] The substrate material 110 can be made of a flexible material. The conductive track 121 formed on the substrate material 110 is made of a thin metal foil 200, and the protective layer 130 is also made of a flexible material. Accordingly, the flexible die-cut printed circuit board 100 is bendable. The substrate material 110 can have the first surface 110a and the second surface 110b facing the first surface 110a. Electronic components, including sensors, semiconductor chips, fuses, and connectors, can be mounted on the substrate material 110. Electronic components mounted on the substrate material 110 can be connected to the conductive track 121.

[0032] The conductor track 121 can be formed from an electrically conductive metal foil 200. The metal foil 200 can be in the form of a thin foil with a small thickness. The metal foil 200 can be made of copper (Cu), aluminum (Al), and other electrically conductive metals or alloys. The conductor track 121 can be formed on the first surface 110a or the second surface 110b of the substrate material 110. The conductor track 121 formed on the first surface 110a of the substrate material 110 and the conductor track 121 formed on the second surface 110b of the substrate material 110 can be connected by a deflection hole that penetrates the substrate material 110. The conductor track 121 is formed on the substrate material 110 and can thus serve as a circuit conductor that connects electronic components.

[0033] The conductor track 121 can be formed by punching. Punching is a process for cutting out a section of the metal foil 200 by pressing the metal foil 200 using dies 300. Such dies 300 used for punching can be of a roller type, a press type, and the like. Due to technical limitations in punching, it is difficult to form the width 121w of the conductor track 121 smaller than the predetermined limit. This difficulty is due to factors including the precision required in the manufacture of the dies 300 used for punching, tolerances introduced during the process of moving the dies 300, and other causes. For example, if the conductor track 121 is formed by punching, it may be difficult to form the width 121w of the conductor track 121 smaller than 0.3 mm.

[0034] To use a section of the conductor track 121 as a fuse, it is necessary that the width of this section be formed within a range of approximately 0.15 mm to 0.17 mm. However, machining the metal foil 200 to such a width by punching can be difficult to achieve. Accordingly, the profile fuse 122, which has a shape in which the width 122w is reduced, can be difficult to manufacture. In one embodiment, however, a section of the conductor track 121, whose thickness 121t is formed to be small, can serve as the profile fuse 122.

[0035] The profile fuse 122 is a section of the conductor track 121. The flexible die-cut printed circuit board 100 can contain a plurality of conductor tracks 121, and the profile fuse 122 can be formed in only some sections of the plurality of conductor tracks 121. The profile fuse 122 can be formed in the conductor track 121, which is configured to perform a detection of voltage, current, and the like.

[0036] The profile fuse 122 is a section of the conductor track 121, designed to be thin 121t. The profile fuse 122 can rupture when a high current flows, thus blocking the current flow. Therefore, the profile fuse 122 can perform the same function as a fuse component. Since the profile fuse 122 is formed in the conductor track 121, the flexible die-cut printed circuit board 100, according to one embodiment, does not require the use of a chip-shaped fuse. Thus, costs associated with a chip fuse can be reduced.

[0037] The profile locking element 122 can include a pattern in which the length of the section whose thickness is designed to be small is increased. This pattern can include at least one curve CV formed in the direction perpendicular to the first surface 110a of the support material 110. In other words, the profile locking element 122 can be formed in a serpentine shape in the direction perpendicular to the first surface 110a of the support material 110. Alternatively, the profile locking element 122 can be formed in a pattern in which a convex section CV1 and a concave section CV2 are repeatedly formed in the direction perpendicular to the first surface 110a of the support material 110. The direction perpendicular to the first surface 110a of the carrier material 110 is the same as the direction of the thickness 121t of the conductor track 121. Thus, the pattern of the profile locking 122 can also be described as having a serpentine shape in the direction of the thickness 121t of the conductor track 121.Since this pattern (the curve CV, the snake, the convex section CV1 and the concave section CV2) can relatively increase the length through which the current flows within the same area, the resistance of the profile fuse 122 can be increased.

[0038] The protective layer 130 can be formed on the first surface 110a of the substrate material 110 to cover the conductor track 121. The upper surface 130a of the protective layer 130 can be exposed to the outside. The lower surface 130b of the protective layer 130 can be in contact with the conductor track 121 and the profile fuse 122. The protective layer 130 can be made of an electrically insulating material. The conductor track 121 and the profile fuse 122 can be covered by the protective layer 130 and insulated from the outside. The protective layer 130 can be made of a flexible material. The substrate material 110 and the protective layer 130 can also be formed from multiple layers.

[0039] With reference to Fig. 2 and Fig. 3. The conductor track 121 and the profile locking element 122 can have the same width 121w, 122w in at least one section. The width 121w of at least one section of the conductor track 121 and the width 122w of at least one section of the profile locking element 122 can be the same. If a punching operation is performed, a section can be formed in which the width 122w of the profile locking element 122 and the width 121w of the conductor track 121 are the same.

[0040] Even if the width 122w of the profile fuse 122 is the same as the width 121w of the conductor track 121, the thickness 122t of the profile fuse 122 is smaller than the thickness 121t of the conductor track 121. For this reason, the cross-sectional area of ​​the profile fuse 122 can be smaller than that of the conductor track 121. Therefore, the profile fuse 122 has a relatively high resistance and can break down due to heat generation when a high current flows.

[0041] If necessary, the width 122w of the profile fuse 122 can be made smaller than the width 121w of the conductor track 121. Such a deformation can be achieved by different spacing between the blades BL configured to cut the conductor track 121 and the blades BL configured to cut the profile fuse 122. If the width 122w and thickness 122t of the profile fuse 122 are smaller than the width 121w and thickness 121t of the conductor track 121, the profile fuse 122 is more likely to break when excessive current flows.

[0042] The width 122w, 121w and the thickness 122t, 121t of the profile fuse 122 and the conductor track 121 can be designed taking into account the magnitudes of the continuous current flowing through the conductor track 121 and the expected critical current (greater than the continuous current).

[0043] With reference to Fig. 3. The convex section CV1 and the concave section CV2 of the profile locking element 122 can be positioned within the thickness 121t of the conductor track 121. If the highest point of the convex section CV1 and the lowest point of the concave section CV2 are positioned within the thickness 121t of the conductor track 121, the substrate material 110 and the protective layer 130 cannot be processed separately. Additionally, the thickness of the substrate material 110 and the protective layer 130 in the sections corresponding to where the profile locking element 122 is positioned can be the same as in other sections, thus avoiding a structural weakness.

[0044] If the convex section CV1 of the profile protection 122 is higher than the conductor track 121, the lower surface 130b of the protective layer 130 must be concave. Additionally, if the concave section CV2 is lower than the first surface 110a of the substrate material 110, the first surface 110a of the substrate material 110 must be concave. However, the process of forming concave sections of the protective layer 130 and the substrate material 110 is complex, which can lead to structural weaknesses in these sections.

[0045] Fig. Figure 4 is a flowchart that depicts each step that forms a process for manufacturing the flexible stamped printed circuit board 100. Fig. 5, Fig. 6 and Fig. Figure 7 shows each step that forms the process for manufacturing the flexible stamped printed circuit board 100.

[0046] The method for manufacturing the flexible stamped printed circuit board 100 can include the following steps: S10 for pressing a metal foil 200 in an area where a profile locking 122 is to be formed in the metal foil 200, using press dies 300; S20 for forming a conductor track 121 and the profile locking 122 by performing a stamping on the metal foil 200, such that the pressed area 210 of the metal foil 200 is contained in the conductor track 121;and S30 for producing a printed circuit board 30 by aligning the conductor track 121 and the profile locking 122 on a first surface 110a of a substrate material 110 made of a flexible material, and then forming a protective layer 130 configured to cover the conductor track 121 and the profile locking 122 on the substrate material 110, wherein the profile locking 122 may be formed in a pattern having a curved shape in a direction perpendicular to the first surface 110a of the substrate material 110.;

[0047] Step S10 for pressing the metal foil 200 involves using the punches 300 to press the area where the profile locking 122 is to be formed. Step S10 for pressing the metal foil 200 may include the following steps: S11 for preparing the metal foil 200; S12 for positioning the metal foil 200 between the pressing punches 300; S13 for pressing the metal foil 200 using the pressing punches 300; and S14 for removing the pressing punches 300.

[0048] See page 11 of Fig. Step S11 for preparing the metal foil 200 may involve an operation of unwinding the metal foil 200 wound onto a roll (not shown) to transport the metal foil 200 to a predetermined position. The metal foil 200 can be fed in while it is wound onto the roll. The roll onto which the metal foil 200 is wound may be attached to an unwinding device (not shown), which allows the metal foil 200 to move in one direction as the unwinding device unwinds the roll. The metal foil 200 may move to the predetermined position using a guide roller (not shown) or similar device.

[0049] See page 12 of Fig. Step S12 for positioning the metal foil 200 between the press dies 300 may include an operation of aligning the press dies 300, which are to be positioned in the area where the profile locking feature 122 is to be formed in the metal foil 200. The press dies 300 may include: a lower die 310, configured to support the lower surface of the metal foil 200 in the area where the profile locking feature 122 is to be formed; and an upper die 320, configured to press the upper surface of the metal foil 200 in the area where the profile locking feature 122 is to be formed. The metal foil 200 may be positioned between the lower die 310 and the upper die 320. The lower die 310 and the upper die 320 may be aligned in a predetermined position to press the area where the profile locking feature 122 is to be formed.

[0050] See page 13 of Fig. Step 5 S13 for pressing the metal foil 200 using the pressing dies 300 involves moving the lower die 310 and / or the upper die 320 to press the metal foil 200. When the lower die 310 and the upper die 320 are pressing the metal foil 200, the pressed metal foil 200 can be deformed to have a small thickness.

[0051] A first curved pattern 330, having a convex shape on the upper surface 310a of the lower punch 310, can be formed in the lower punch 310, with the upper surface 310a in contact with the area where the profile locking 122 is to be formed. A second curved pattern 340, having a convex shape on the lower surface 320b of the upper punch 320, with the lower surface 320b in contact with the area where the profile locking 122 is to be formed, can be formed in the upper punch 320 to correspond to a concave section of the first curved pattern 330. A section where the lower punch 310 and the upper punch 320 press the metal foil 200 is where the curved pattern is formed.A plurality of spaced-apart first curved patterns 330 can be formed in the upper die 320, and a plurality of spaced-apart second curved patterns 340 can be formed in the lower die 310. The first curved pattern 330 and the second curved pattern 340 can be formed at positions facing each other.

[0052] The first curved pattern 330 and the second curved pattern 340 can press the metal foil 200 while facing each other, forming the thickness of the pressed area 210 smaller than that of other unpressed areas, and forming a pattern that has a curved shape in a direction perpendicular to the surface of the metal foil 200.

[0053] While the lower die 310 and the upper die 320 press the metal foil 200, the distance between the first curved pattern 330 and the second curved pattern 340 can correspond to the thickness 122t of the profile fuse 122. To ensure that the convex section CV1 and the concave section CV2 of the profile fuse 122 are contained within the thickness 121t of the conductor track 121, the height of the first curved pattern 330 and the height of the second curved pattern 340 can be determined to be less than the thickness 121t of the conductor track 121.

[0054] See page 14 of Fig. Step 5 S14, for removing the press punches 300, involves moving the lower punch 310 and / or the upper punch 320 to separate the press punches 300 from the metal foil 200. When the press punches 300 are removed, the pressed area 210 of the metal foil 200 has a thickness that is small in accordance with the first curved pattern 330 and the second curved pattern 340, and curved patterns (see CV1 and CV2 in Fig. 3) can be formed in the direction perpendicular to the surface of the metal foil 200.

[0055] See page 14 of Fig. 6. The width 210w of the pressed area 210 formed by the first curved pattern 330 and the second curved pattern 340 can be greater than the width 122w of the profile locking 122. In other words, the width 330w of the first curved pattern 330 and the width 340w of the second curved pattern 340 can be determined to be greater than the width 121w of the conductor track 121. In the punching process, it can be difficult for a cutter to precisely cut the boundary of the pressed area 210. Thus, the profile locking 122 can be formed by making the width 210w of the pressed area 210 sufficiently large and cutting the inside of the pressed area 210 using the cutter.

[0056] See S21 of Fig. Step 6 S20 for forming the conductor track 121 and the profile locking 122 involves cutting the metal foil 200 to a predetermined width using dies. The die-cutting operation can utilize a press-type cutter in which a plurality of blades BL are formed to press and cut the metal foil 200. Alternatively, the die-cutting operation can utilize a roll-type cutter in which a plurality of blades BL are formed on the surface of a roll to press and cut the metal foil 200 by rotating the roll.

[0057] Step S20 for forming the conductor track 121 and the profile locking 122 can include performing punches so that the conductor track 121 and the profile locking 122 have the same width 121w, 122w in at least one section. The dotted line in Fig. Figure 6 specifies a cutting line CL along which cutting is performed by punching. The distance between the cutting lines CL for forming a conductor track 121 is the same as the distance between the blades BL of the cutter and can be the same as the width 121w of a section of the conductor track 121. The conductor track 121 and the profile locking element 122 are cut simultaneously using a pair of blades BL, so that the width 121w of the conductor track 121 and the width 122w of the profile locking element 122 can be the same. The distance between the blades BL in a region can be determined such that the width 121w of at least one section of the conductor track 121 and the width 122w of at least one section of the profile locking element 122 are the same or different.If the distance between a pair of blades BL is different in some areas, the width 121w, 122w of the conductor track 121 and the profile fuse 122, which correspond to some areas and the remaining areas, can be formed differently.

[0058] See S22 of Fig. 6. When cutting the metal foil 200 using punches, the conductor track 121, in which the profile locking element 122 is formed, can be produced. A large number of conductor tracks 121 can be formed by cutting a metal foil 200.

[0059] See Fig. Step 7 S30 for manufacturing the printed circuit board 30 involves aligning the conductor track 121 and profile locking 122 produced by performing punching on the substrate material 110 and then forming the protective layer 130 which is configured to cover the conductor track 121 and the profile locking 122.

[0060] The substrate material 110 or the protective layer 130 can be formed from multiple layers. For example, the conductor track 121, in which the profile locking feature 122 is formed, can be aligned on the substrate material 110, followed by the formation of the protective layer 130. Then, the conductor track 121, in which the profile locking feature 122 is formed, can be aligned on the protective layer 130, followed by the formation of an additional protective layer 130. In other words, a multilayer structure can be formed in which the substrate material 110, the conductor track 121, and the protective layer 130 are arranged repeatedly. Step S30 for manufacturing the printed circuit board 30 can additionally include mounting a sensor connected to the conductor track 121, a connector, a deflection hole penetrating the substrate material 110, a semiconductor chip, and the like.

[0061] The method for manufacturing the flexible stamped printed circuit board 100 can produce the conductor track 121 in which the profile fuse 122 is formed with a small thickness. Additionally, the flexible stamped printed circuit board 100 can be formed which contains the profile fuse 122 instead of a chip fuse.

[0062] The present revelation also concerns the following aspect: Aspect 1. Flexible die-cut printed circuit board, including: a support material made of a flexible material, wherein the support material has a first surface and a second surface opposite the first surface; at least one conductor track formed on the first surface of the substrate material; a profile fuse formed as a section of the conductor track, wherein the profile fuse has a lesser thickness than other sections of the conductor track and is configured to break when excessive current flows; and a protective layer configured to cover the conductor track and profile protection. Aspect 2. Flexible stamped printed circuit board according to Aspect 1, wherein the profile locking is formed in a pattern having a curved shape in one direction perpendicular to the first surface of the substrate material. Aspect 3. Flexible die-cut printed circuit board according to aspects 1 or 2, wherein the conductor track and the profile locking have the same width in at least one section. Aspect 4. Flexible stamped printed circuit board according to one of the preceding aspects 1 to 3, wherein the profile locking is formed in a pattern in which a convex section and a concave section are repeatedly formed in a direction perpendicular to the first surface of the substrate material. Aspect 5. Flexible die-cut printed circuit board according to Aspect 4, wherein the convex section and the concave section of the profile locking are positioned within one thickness of the conductor track. Aspect 6. Flexible die-cut printed circuit board according to one of the preceding aspects 1 to 5, wherein the conductor track is connected to electronic components mounted on the substrate. Aspect 7. Flexible stamped printed circuit board according to one of the preceding aspects 1 to 6, wherein the conductor track is formed from a metal foil in the form of a thin layer. Aspect 8. Flexible stamped printed circuit board according to one of the preceding aspects 1 to 7, further comprising: at least one conductor track formed on the second surface of the substrate material, wherein the conductor track formed on the first surface of the substrate material and the conductor track formed on the second surface of the substrate material are connected by a deflection hole that penetrates the substrate material. Aspect 9. Flexible die-cut printed circuit board according to Aspect 1, wherein the profile locking includes a pattern in which the length of the section with a reduced thickness is increased. Aspect 10. Flexible die-cut printed circuit board according to Aspect 1, wherein the width and thickness of the profile locking are smaller than the width and thickness of the conductor track.

[0063] The present disclosure has been described in detail by means of specific embodiments. The above description is merely an example to which the principles of the present disclosure are applied, and other configurations may also be included without deviating from the scope of the present disclosure.

[0064] A flexible die-cut printed circuit board is proposed, comprising a substrate material made of a flexible material, wherein the substrate material has a first surface and a second surface opposite the first surface, at least one conductor formed on the first surface of the substrate material, a profile fuse formed as a section of the conductor, wherein the profile fuse has a lesser thickness than other sections of the conductor and is configured to break through when excessive current flows, and a protective layer configured to cover the conductor and the profile fuse, wherein the profile fuse is formed in a pattern having a curved shape in a direction perpendicular to the first surface of the substrate material.

Claims

[1] Flexible die-cut printed circuit board (100), comprising: a support material (110) made of a flexible material, wherein the support material (110) has a first surface (110a) and a second surface (110b) opposite the first surface (110a); at least one conductor track (121) formed on the first surface (110a) of the substrate material (110); a profile fuse (122) configured as a section of the conductor track (121), wherein the profile fuse (122) has a smaller thickness than other sections of the conductor track (121) and is configured to break when excessive current flows; and a protective layer (130) configured to cover the conductor track (121) and the profile protection (122). [2] Flexible die-cut printed circuit board (100) according to claim 1, wherein the profile locking (122) is formed in a pattern having a curved shape in a direction perpendicular to the first surface (110a) of the carrier material (110). [3] Flexible die-cut printed circuit board (100) according to claims 1 or 2, wherein the conductor track (121) and the profile locking (122) have the same width (121w, 122w) in at least one section. [4] Flexible die-cut printed circuit board (100) according to any one of the preceding claims 1 to 3, wherein the profile locking (122) is formed in a pattern in which a convex section and a concave section are repeatedly formed in a direction perpendicular to the first surface (110a) of the carrier material (110). [5] Flexible die-cut printed circuit board (100) according to claim 4, wherein the convex section and the concave section of the profile locking (122) are positioned within a thickness (121t) of the conductor track (121). [6] Flexible die-cut printed circuit board (100) according to any one of the preceding claims 1 to 5, wherein the conductor track (121) is connected to electronic components mounted on the substrate material (110). [7] Flexible die-cut printed circuit board (100) according to any one of the preceding claims 1 to 6, wherein the conductor track (121) is formed from a metal foil (200) in the form of a thin layer. [8] Flexible stamped printed circuit board (100) according to any one of the preceding claims 1 to 7, further comprising: at least one conductor track (121) formed on the second surface (110b) of the carrier material (110), wherein the conductor track (121) formed on the first surface (110a) of the substrate material (110) and the conductor track formed on the second surface (110b) of the substrate material (110) (121) are connected by a deflection hole that penetrates the support material (110). [9] Flexible die-cut printed circuit board (100) according to any one of the preceding claims 1 to 8, wherein the profile locking (122) includes a pattern in which the length of the section with a reduced thickness is increased. [10] Flexible die-cut printed circuit board (100) according to any one of the preceding claims 1 to 9, wherein a width (122w) and thickness (122t) of the profile locking (122) are smaller than a width (121w) and thickness (121t) of the conductor track (121).

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