ADHESIVE JOINING DEVICE AND ADHESIVE JOINING METHOD FOR A METALLIC SURFACE

Description

[0001] The invention relates to an adhesive joining device for preparing and / or producing an adhesive connection in an adhesive point and / or adhesive section on a metallic surface with a body and / or component to be glued thereon and an adhesive by means of an electrochemical etching device.

[0002] Furthermore, the invention relates to an adhesive joining method for a metallic surface with an adhesive joining device designed accordingly according to the invention for preparing and / or producing an adhesive connection in an adhesive point and / or adhesive section on a metallic surface with a body and / or component to be glued thereon and an adhesive.

[0003] The technical field of the invention relates to joining by means of adhesive techniques and the preparation and / or production of corresponding adhesive joints, in particular, but not exclusively, in the field of manufacturing ships, aircraft, vehicles, as well as special machines or supporting structures.

[0004] From the State of the artVarious joining techniques are known for joining two components or structures in general. Welding, soldering, screwing, and / or riveting are widely used and extremely sophisticated methods for this purpose. However, these joining techniques cannot be optimally utilized in certain applications. For example, the heat input during welding or soldering can be too high for structural elements or coatings or components, thus damaging the material or the surrounding area, as well as previously applied paints and the like. Screws and rivets require holes that are not permitted in many metallic exterior walls, for example.

[0005] In particular, in addition to the classic joining methods, there is the possibility of adhesive bonding to join two components or sections or workpieces together, whereby the adhesive techniques known in the state of the art are often not strong enough or not predictable enough due to their adhesive failure to be able to use them sufficiently in component or entire object planning, for example in vehicle or aircraft construction, as well as in shipbuilding and structural engineering.

[0006] However, the problem identified above has already been successfully solved by so-called "nanoscale sculpturing" on various metal surfaces, such as zinc according to EP 3 140 438 A1 (see below) and Al / Al alloys according to DE 10 2016 113 641 A1 (see further below). This involves electrochemically imparting a mechanical barb structure to the metal surface, allowing polymers to be bonded to the structured metal surface with high mechanical strength. Failure is only possible cohesively, i.e., either in the polymer or the metal, depending on the mechanical strength. Failure is thus clearly determined by the size of the bonding surface, the thickness of the adhesive layer, and the mechanical tensile and shear strength of the polymer or ceramic adhesive. Such structural bonds are therefore very easy to calculate and can therefore also be used for relevant structural connections, for example, in vehicle construction.Express reference is made to the aforementioned publications and their contents are included.

[0007] EP 3 140 438 A1 discloses a galvanized workpiece comprising polycrystalline zinc with grain sizes greater than 20 micrometers at least on parts of the workpiece surface. This workpiece is characterized by irregularly distributed, conical pores of various diameters penetrating the zinc grain walls. Furthermore, a method for producing a corresponding galvanized workpiece is disclosed, characterized in that the galvanized workpiece surface is electrochemically etched in an aqueous electrolyte containing potassium chloride at a predetermined temperature while applying a periodic rectangular voltage.

[0008] From the publication DE 10 2016 113 641 A1, a heterostructure is known, comprising at least a first partial surface comprising copper alone and at least a second partial surface, opposite the first partial surface, comprising aluminum or an aluminum alloy alone. An anchoring layer is arranged between the first and second partial surfaces, each cut surface extending perpendicular to the anchoring layer comprising at least one island of aluminum or aluminum alloy surrounded by copper, and at most the previously known mixed crystals of the aluminum alloy appearing in the anchoring layer. Furthermore, the invention relates to an aluminum-copper connector and a heterostructure manufacturing method.

[0009] Furthermore, various arrangements are known in the prior art by means of which corresponding etchings can be performed to prepare a surface. In these cases, the piece to be processed, or rather the processing and subsequent bonding point, is often referred to as a spot.

[0010] US Pat. No. 3,546,088 A addresses the problem of etching very large surfaces, where these large surfaces do not fit into an electrolyte tank, which is particularly difficult for aluminum aircraft or spacecraft components that are to be anodized for corrosion protection. For this purpose, it is proposed to use a device that can be moved freely over large surfaces, allowing the corresponding electrolyte to escape laterally during processing.

[0011] The document US 4,810,343 A discloses a device for carrying out a localized electrolytic surface treatment, which device comprises an electrolyte container with an electrolyte reservoir and a pumping device which can supply the electrolyte to an anodic device which can be brought into contact with the surface of the workpiece to be treated, wherein in the device between the surface of the anode and the surface to be treated, the anode and the workpiece are connected to the terminals of a DC voltage source, which has suction devices connected to the device for returning the electrolyte to the container after it has passed through the flow space.

[0012] US Pat. No. 4,986,889 A discloses an electrolytic treatment suction device connected to a surface to be treated. This device has a cavity divided by an electrode into an electrolyte flow chamber, an inlet chamber, and a suction chamber. The inlet and suction chambers can be divided into a distribution chamber connected by a pipe connection and a flow compensation chamber with a channel. A single tool can be removed from the device, which cannot be reused after the inventive use, namely the electrochemical processing of a treatment point, also called a spot.

[0013] Furthermore, an etching device is known from DE 600 32 425 T2, in which a wafer is fed from a wafer cassette to an etching part by a wafer transport robot for etching. After the etching process, a wafer frame is fed from a wafer frame feed part to a mounting part. The mounting part, to which the wafer frame is fed, moves to the upper part of a processing vessel of the etching part and mounts the wafer in this position. The mounting part then returns to its original position. A wafer frame collection robot collects the wafer frame from the mounting part, which has returned to its original position, and stores the wafer frame in a wafer frame cassette.

[0014] The document DE 694 02 952 T2 discloses a device for a particularly selective electrochemical treatment of a conductive substrate, comprising a shell provided with an opening and defining a space, and an electrode arranged in this space, which is intended to be connected to one of the terminals of an electrical power source, the conductive substrate being intended to be connected to the other terminal of this source, as well as an electrolyte inlet and an electrolyte outlet, both of which are in communication with the space, and further comprising a body made of absorbent material, flexible, electrically non-conductive and permeable to gases and liquids, this body being in contact with the electrode and closing the opening by protruding therefrom, a first pump attached to the electrolyte inlet, and a second pump attached to the electrolyte outlet.wherein the flow rate of the second pump is greater than that of the first pump and is fixed with respect to that of the second pump, so that a negative pressure is necessarily created in this, Space.Problematic with the state of the art is that there are no compact adhesive joining devices that enable or permit joining in the manner according to the invention in any orientation, i.e., even on inclined surfaces and, for example, overhead bonding. In particular, a corresponding surface treatment, namely etching a metallic surface and precisely applying a substrate to this location, in particular an adhesive, is not possible, especially in hard-to-reach places, for example, in a vehicle, ship, or aircraft during its production or repair or maintenance.

[0015] The present invention is based on the TaskThe aim is to produce high-strength adhesive bonds on metallic surfaces that replace previous joining options for structural, structural and / or spatial reasons, as well as aesthetic and / or mechanical reasons.

[0016] In particular, it should further be possible to electrochemically structure a locally limited section, processing adhesive point, hereinafter also referred to as spot, of the metal surface according to the "nanoscale sculpturing" process outlined above and known in the prior art, and subsequently the positioning of an adhesive body should be precisely definable, whereby this positioning can be seen laterally, i.e. in the tilt and the distance to the metal surface, or alternatively, to subsequently carry out an electrochemical deposition of metals, such as copper or similar, on the previously etched surface, whereby necessary intermediate steps such as cleaning and drying should also be able to be carried out in a location-specific manner.

[0017] In particular, preparatory measures should be possible in any location and in any position so that bonding can be carried out in any component position.

[0018] For this purpose, appropriate devices and procedures will be demonstrated.

[0019] Solved This task or tasks is / are achieved with an adhesive joining device according to the main claim and an adhesive joining method according to the independent claim and partly also by means of the further advantageous optional embodiments according to the subclaims.

[0020] The adhesive joining device for producing an adhesive connection in an adhesive point and / or adhesive section on a metallic surface with a body and / or component to be bonded thereto and an adhesive by means of an electrochemical etching device comprises a vacuum holder with a vacuum connection, wherein the vacuum can be formed between the adhesive joining device and the surface around the adhesive point and / or adhesive section to be produced, and further comprises a tool holder which accommodates at least two different tools at a time offset and in a defined position in the middle of the vacuum holder or in the interior of the vacuum holder or on the vacuum holder, wherein a first tool which can be inserted and used at a time offset in the tool holder, namely an electrochemical etching cell for an electrolyte with an etching chamber directed towards the metallic surface, a supply for an electrolyte into the etching chamber,an outflow from the etching chamber, two electrodes with associated electrical contacts are provided, wherein one electrode is mechanically and electrically connected to the metallic surface to be structured and the second electrode only makes contact with the electrolyte, quasi as a corresponding counter electrode, and further comprises a second tool that can be inserted and used in the tool holder at a time delay for holding and positioning the body and / or component to be bonded to the etched metallic surface with a defined position within the tool holder, wherein the distance, position, alignment and / or parallelism of the body to be bonded can be ensured and aligned in a defined manner for the bonding.

[0021] This design allows electrochemical preparation of a metallic surface in any position, namely the orientation of the metallic surface to be prepared, since the vacuum holder is suctioned to the surface by means of a vacuum pump, creating a temporary holder for the at least two tools. The at least two tools can then be inserted into the tool holder of the device one after the other according to the invention, thus carrying out the bonding process according to the invention regardless of the orientation of the surface.

[0022] The vacuum holder is positioned and firmly pressed into place for etching and subsequent cleaning as well as for positioning the adhesive or adhesive body by means of negative pressure, whereby the negative pressure ensures quick and safe assembly and disassembly of the vacuum holder.

[0023] Another special feature of the vacuum holder's design is, in a particularly preferred embodiment, that the means for vacuum suction are completely embodied in a sleeve located outside, i.e., not in the metallic surface to be processed for bonding, so that the area of ​​the metallic surface to be processed is framed. The tool holder is also located in the center of the vacuum holder, i.e., virtually in the sleeve.

[0024] The etching cell, i.e. the first tool, can be quickly and safely mounted and dismounted on the tool holder with the vacuum holder, whereby the tool holder of the vacuum holder guides the etching cell and always positions it in the same way so that the etching cell is positioned over the surface to be etched and the etching cell is pressed against it in a way that is electrolyte-tight.

[0025] In a particularly preferred embodiment, a corresponding locking device is provided for the tools so that they are always equally spaced or positioned and thus there are no tolerances to be taken into account, for example for the adhesive gap.

[0026] The tool holder then guides the body to be bonded together with the vacuum holder and can thus position it over the etched surface, whereby a second tool presses the adhesive body and does not press the adhesive away completely, but rather positions the adhesive body to be bonded at a defined distance, i.e. with a predetermined adhesive gap, until the adhesive has cured.

[0027] Possible adhesives, although this list is only exemplary and not limiting, are acrylate, PU, ​​epoxy adhesives and adhesives based on ethylene, vinyl, acetate, silicone, as well as ceramic-based adhesives for temperature-critical applications.

[0028] In automobile manufacturing, for example, such adhesive joining devices can be designed with a special surface-adapted geometry, so that although each adhesive joining device must be individually kept in stock, it quickly pays for itself with high volumes, so that defined bondings can be carried out on the same vehicle models, whereby these can be precisely calculated and thus also be statically calculated.

[0029] Large-area bonding can also be performed using appropriately designed tools, allowing, for example, longer CFRP and GRP components to be bonded to aluminum components in the aircraft industry. For this purpose, appropriate etching cells can be placed and positioned on the aluminum using the vacuum holder. Furthermore, using a second tool, which is also guided in a corresponding tool holder on the vacuum holder, a corresponding CFRP or GRP component can be positioned with an adhesive after the structured metallic surface treatment and fixed for curing. This allows defined bonding gaps to be realized here as well, making these bonds predictable and structurally usable.

[0030] The holding force of the vacuum makes it possible for the electrolyte to be introduced into the etching chamber even with overpressure, thus realizing an active flow of the electrolyte onto the surface.

[0031] Furthermore, horizontal surfaces can of course also be treated with negative pressure using the electrolyte, simply through the effect of gravity, so that good contact of the electrolyte with the surface to be treated is guaranteed.

[0032] In a preferred embodiment, the at least first tool is fluidically adapted to the metallic surface to be etched in terms of curvature and / or extent. This makes it possible to treat complex surfaces, both in their geometry and their extent, with only one first tool, namely a correspondingly adapted etching cell, ensuring that the electrolyte reaches the entire surface to be treated and comes into contact with it. For this purpose, channels can be provided in the etching cell, for example, which guide the electrolyte over the surface in such a way that it is etched homogeneously.

[0033] The first tool, which can be inserted and used in the tool holder at a later time, can be used to additionally clean the etched metallic surface. For this purpose, appropriate supply and discharge lines for cleaning and / or rinsing fluids and / or rinsing media are provided, and / or the existing supply and discharge lines are switchable for a cleaning and / or rinsing fluid and / or rinsing media. This makes it possible to perform cleaning or rinsing with the same tool head immediately after the etching process, since the same connections can be used for a rinsing medium, allowing the corresponding electrolyte and etching residues to be removed.

[0034] Alternatively, a third tool can be provided that can be inserted and used in the tool holder at a later time to clean the etched metallic surface after the etching process.

[0035] Furthermore, a fourth tool can be provided, which can be inserted and used in the tool holder at a time interval, for the local deposition of copper on structured aluminum surfaces to produce at least one electrical contact point. It should be noted that, according to the invention, the design of a further invention can also be such that the corresponding vacuum holder is configured with two tool holders, which are designed to accommodate two different tools that can be used one after the other at a time interval, the first tool being the described etching cell and the second tool being, in effect, the fourth tool of the invention actually described here, namely a deposition device for depositing copper on the correspondingly surface-treated aluminum.This makes it possible to place defined electrical contact points made of copper on an aluminum surface in such a way that, with appropriate surface treatment, particularly using the nanoscale sculpting process, a corresponding bond is formed between the copper and the aluminum. It is expressly emphasized at this point that such a surface treatment with subsequent copper deposition is considered a separate invention, whereby the material features are the same, but the creation of an adhesive bond is not necessary. This will be further discussed below.

[0036] In a preferred embodiment, at least one vacuum pump, which is connected to the vacuum chamber via the vacuum connection, and / or at least one electrolyte reservoir for storing an electrolyte and / or at least one electrolyte collection container for receiving the used electrolyte and / or at least one pump for supplying the first tool with an electrolyte and / or at least one pump for supplying the first and / or third tool with rinsing medium and / or at least one control unit for device control and / or process control can be provided. In particular, in a particularly preferred embodiment, all of the aforementioned features are combined.

[0037] In addition, the adhesive joining device can be designed to be mobile and / or transportable, thus ensuring mobile and flexible use, which allows on-site use in particular for repair teams, for example in aviation, as well as for installation teams for special machine designs.

[0038] Of course, the vacuum holder can be activated or deactivated via a dedicated control button or other triggering device, allowing a suitable vacuum pump to provide the necessary hold through suction. This pressure also allows the electrochemical etching cell to be pressed onto the metallic surface for etching, preventing electrolyte or rinsing agent from leaking out and thus damaging adjacent or back-coated surfaces.

[0039] After the first bonding operation, the vacuum holder can be easily removed and repositioned, allowing for a second bonding operation. In this regard, a configuration with a central control unit and multiple bonding and joining devices is also possible, allowing multiple locations to be processed simultaneously. The central control unit can then supply and control the bonding and joining devices connected to them accordingly.

[0040] The vacuum holder can also be designed in such a way that the vacuum holder heats the adhesive body to be bonded and / or the base material or the adhesive for faster / defined bonding.

[0041] In a further embodiment, the vacuum holder can serve as a guide for grinding or sandblasting tools to clean the metallic surface to be structured of dirt or paint residues that could impair the electrochemical etching.

[0042] In particular, it has been found that the etched metallic surface is more noble in its electrochemical potential than the untreated base material.

[0043] It is also possible to create adhesive joints according to the invention which have or even exceed the strength of welds on metals which are not actually weldable or should not be welded due to strong effects on the mechanical strength.

[0044] The device also enables spatially limited, etched metallic surfaces on which high-strength adhesive bonds are possible, the strength of which is comparable to welded joints.

[0045] In contrast to welding, the new adhesive joining technology does not generate heat, which virtually eliminates changes in the structure in the area of ​​the adhesive surfaces.

[0046] In contrast to other adhesive bonds, a high-strength adhesive bond is created, which is ultimately determined only by the mechanical properties of the adhesive and no longer by the adhesion properties on the adhesive / metal base surface.

[0047] Adhesive joints are possible in very narrow and difficult-to-access installation positions, since the small size of the electrochemical cell in a preferred embodiment allows free positioning, which has considerably more degrees of freedom than with comparable welded parts.

[0048] To ensure the practicality of this device, the process can be implemented in a system that is compact, mobile, and easy to assemble and disassemble. Furthermore, positioning, etching, cleaning, and subsequent bonding can be performed in similar times to those normally required for the joining techniques it replaces.

[0049] According to the invention, the adhesive joining method for a metallic surface with an adhesive joining device comprises the following steps: selecting the adhesive location and positioning and securing the adhesive joining device by means of the vacuum holder by generating and maintaining a vacuum, parallel or subsequent insertion of the first tool into the tool holder, generating a structuring on the metallic surface at the defined position and area by electrochemical etching using the first tool, cleaning and drying the structured metallic surface with the aid of the first tool or a third tool, wherein a tool change occurs when the third tool is used, removing the tool from the tool holder,Creating an adhesive bond by inserting the second tool into the tool holder and positioning the body and / or component to be bonded in the second tool and applying the adhesive to the structured metallic surface and / or the body and / or component and then applying the body and / or component to be bonded using the second tool to create a defined gap width, aligning it with the structured metallic surface in a fixed position directly above the previously structured metallic surface, wherein the tool holder remains stationary with the vacuum holder, or positioning the body and / or component to be bonded and the adhesive on the structured metallic surface and then inserting the second tool into the tool holder and applying the second tool to create a defined gap width,Alignment to the structured metallic surface in a fixed position directly above the previously structured metallic surface, with the tool holder and the vacuum holder remaining stationary, curing and / or allowing the adhesive to harden, removal of the adhesive joining device,

[0050] The described method makes it possible to electrochemically etch structures in a locally limited section of a metallic surface and subsequently to position a body or component to be bonded in a defined orientation and at a predetermined distance from the metallic surface, so that the body or component to be bonded can be bonded in a predetermined manner to a metallic surface, thus achieving an optimal bond that is also predictable.

[0051] A special feature of this process is that it allows for stationary work at a defined location, ensuring that exactly as much surface is structured / electrochemically etched as is actually required for the bonding area. Furthermore, repositioning or relocating any tools is no longer necessary, as the precisely positioned tool holder and / or vacuum holder and / or tool holder only requires tools to be exchanged, which can be easily and precisely positioned in the corresponding tool holders.

[0052] In a preferred embodiment of the adhesive joining device, etching can be performed using nanoscale sculpturing. The nanoscale sculpting process was briefly explained at the beginning, with reference again to the state of the art. However, tests have already shown that appropriate surface configurations, in combination with the process claimed here, lead to extremely durable adhesive bonds. The nanoscale sculpting process is also applicable to various metals.

[0053] Furthermore, in one embodiment of the method, the adhesive can be applied by means of an adhesive application aid and / or the adhesive can be cured under defined conditions in such a way that a defined amount of heat and / or at a defined temperature and / or UV radiation or other typical processes are applied, so that curing takes place more quickly.

[0054] At this point it should be noted that the drying of the rinsed surface, which can be done with water, for example, can be achieved by blowing or drying.

[0055] Another option is to replace the normally harmless electrolytes used in electrochemical etching processes with chemically aggressive liquids, possibly eliminating the need for electrical current. This would require neutralization after the etching process, allowing the tools to be replaced accordingly.

[0056] It should be mentioned at this point that the vacuum holder requires sufficient holding force to hold itself, the tools and in particular the etching cell, namely the first tool, in any chosen position when subjected to fluid pressure, so that falling off the surface is prevented even on vertical walls or when used overhead.

[0057] In one embodiment, the vacuum holder could be designed to be particularly flat, whereby multi-zone vacuum areas are also possible, so that additional backup zones could also be realized.

[0058] The advantages are summarized below: Small design, mobile, easy and safe to assemble and disassemble; the time required for the adhesive joining process according to the invention is similar to the joining process known in the prior art and which is to be replaced; the adhesive bond created is calculable and also has similar or greater strength values ​​than a welded joint; adhesive bonds of this type can often be carried out in inaccessible places, where a welded joint would otherwise not allow the use of a welding device due to a lack of space; there is no heat input, in particular no heat input that could change the base material or an existing paint coating; there are no unsightly weld seams visible, and no holes need to be made in the base material; moreover, joints are possible on thin sheet metal, although these have considerably higher strengths.Already completed components such as a ship's hull, pipelines or beams can subsequently accommodate corresponding bodies and / or components to be glued on in a very simple manner using the high-strength adhesive joining method according to the invention; almost any installation position is possible; the adhesive to be applied, a material that is initially flowable and then hardens, is produced in an adjustable and definable uniform thickness; metallic bodies with introduced threads, for example, can be used as bodies and / or components to be glued, so that these metallic bodies with the introduced threads are glued onto the existing metallic surface; in particular, the device and / or method can be used particularly preferably on solid metallic components which are generally difficult to move.

[0059] In the following, embodiments of the invention are described with reference to the accompanying drawings in the Character description described in detail, which are intended to explain the invention and are not to be considered limiting: They show: Fig. 1 is a schematic representation of an embodiment of a mobile etching system 6; Fig. 2 is a schematic representation of an embodiment of the vacuum holder 1 with a first tool 31 not yet inserted; Fig. 3 is a schematic representation of the Fig. 2 shown embodiment of the vacuum holder 1 with the inserted first tool 31, which is only positioned but not yet fixed; Fig. 4 a schematic representation of the in Fig. 2 and 3shown embodiment of the vacuum holder 1 with the inserted and fixed first tool 31; Fig. 5 a schematic representation of an embodiment of the vacuum holder 1 with a not yet inserted second tool 32 and an exemplary body 4 to be glued; Fig. 6 a schematic representation of the in Fig. 5 shown embodiment of the vacuum holder 1 with the second tool 32 not yet inserted and the exemplary body 4 to be glued, which has already been positioned; Fig. 7 a schematic representation of the in Figs. 5 and 6shown embodiment of the vacuum holder 1 with the inserted and locked second tool 32 and the exemplary positioned body 4 to be glued; Fig. 8 a schematic representation of the vacuum holder 1 according to the invention from the underside, which can be placed on the metallic surface 5 according to the invention; Fig. 9 a schematic representation of the vacuum holder 1 according to the invention from the underside, corresponding Fig. 8, wherein the first tool 31 is also shown here; Fig. 10 is a schematic representation of a first application example of the adhesive joining device on a first metallic surface structure 5, wherein for reasons of illustration only the first tool 31 is shown; Fig. 11 is a schematic representation of a second application example of the adhesive joining device on a second metallic surface structure 5, wherein for reasons of illustration only the first tool 31 is shown and Fig. 12 is a schematic representation of a third application example of the adhesive joining device on a third metallic surface structure 5, wherein for reasons of illustration only the first tool 31 is shown.

[0060] Furthermore, Figures 1 to 5 show the device according to the invention using an aluminum surface to which a workpiece is to be bonded. They show: Fig. 13: Vacuum-supported tool holder before attaching the etching cell (first tool) for the electrochemical processing of an exemplary aluminum surface; Fig. 14: Vacuum-supported tool holder with attached and fixed etching cell (first tool) during the electrochemical processing of the aluminum surface; Fig. 15: Vacuum-supported tool holder with removed etching cell (first tool) after electrochemical processing of the aluminum surface (circular, dark area within the tool holder); Fig. 16: Electron microscopy image of the structured aluminum surface, i.e. after the treatment process, in this case the nanoscale sculpturing process with the system; Fig. 17: Glued workpiece before removal of the vacuum-supported tool holder, but after removal of the positioning aid (second tool) and Fig.18: Glued workpiece after removal of the positioning aid (second tool) and the vacuum-supported tool holder.

[0061] At this point, it should be noted that these figures merely illustrate the invention and are not intended to limit it. In particular, curved geometric metallic surfaces are possible, which can be processed accordingly using etching tools optimized for fluid technology, whereby geometrically adapted vacuum holders are of course also used. Furthermore, four further adhesively bonded bodies or components can be used, which differ significantly from the example shown here. It should be noted at this point that the side of the body or component to be bonded should have a corresponding contour that corresponds to the contour of the metallic surface. Bonding between metals and non-metals is also possible, whereby reference is naturally made to the corresponding adhesives of the prior art.

[0062] In Fig. 1a schematic representation of an embodiment of a mobile etching system 6 is shown.

[0063] Here, three storage vessels are initially arranged on a trolley 62, namely an electrolyte tank 67, a collection container for used electrolyte 68 and a storage tank for a rinsing medium 69.

[0064] Above this, a central box 61 is arranged, which contains a vacuum pump, a control unit, a valve terminal, an electrolyte pump, and, if required, a rinsing pump (all in 61). This control unit and the units arranged therein are connected to the vacuum holder 1, the electrodes 12, 313, and the first tool 31 via hose and cable connections, namely the electrolyte hose supply 63, the electrolyte hose outlet 64, the electrolyte electrode power cable 65, and the vacuum hose 66. The electrolyte is transported there, the used electrolyte is transported back, and the corresponding currents required to implement the electrochemical etching process are transmitted via these connections. With appropriate valve control within 61, a corresponding rinsing medium 69 can be supplied after etching via the electrolyte lines 63, 64, with which the structured metallic surface 5 is rinsed according to the invention.

[0065] Fig. 2shows a schematic representation of an embodiment of the vacuum holder 1 with a first tool 31 not yet inserted.

[0066] The vacuum holder 1 has a tool holder 2 in its interior. Corresponding O-rings are provided on the underside of the vacuum holder 1, which seal the vacuum holder 1 on the metallic surface 5 so that a vacuum can be created by means of a vacuum pump 61 via the vacuum connection 11, so that the vacuum holder 1 adheres to the metallic surface 5.

[0067] Also associated with the tool holder 2 is a tool securing bracket 21 and a tool securing closure 22, which can be positioned in a predetermined manner for defined tool dimensions, namely of at least the first 31 and second 32 tools.

[0068] Also associated with the vacuum holder 1 is a first power connection as electrode 12, which can be placed as a spring contact on the underside of the vacuum holder 1 on the metallic surface 5.

[0069] In addition, the first tool 31, namely the etching cell with the electrolyte supply 311 and the drain 312 as well as the power connection for the electrolyte, namely the second electrode 313 and a corresponding sealing ring 314, is shown.

[0070] In Fig. 3 is a schematic representation of the Fig. 2 shown embodiment of the vacuum holder 1 with the inserted first tool 31, which is only positioned but not yet fixed.

[0071] Fig. 4 shows a schematic representation of the Fig. 2 and 3shown embodiment of the vacuum holder 1 with the inserted and fixed first tool 31, wherein the corresponding tool securing bracket 21 interacts with the tool securing closure 22 and secures the first tool 31 in the tool holder 2 in a defined manner.

[0072] In Fig. 5 a schematic representation of an embodiment of the vacuum holder 1 with a second tool 32 not yet inserted and an exemplary body 4 to be glued on is shown.

[0073] The body 4 to be glued on has mounting holes which can be formed with threads, for example, whereby the body 4 to be glued on is ultimately glued onto the corresponding metallic surface 5 and thus corresponding further components can be connected via screw connections.

[0074] Fig. 6 shows a schematic representation of the Fig. 5shown embodiment of the vacuum holder 1 with the second tool 32 not yet inserted and the exemplary body 4 to be glued, which has already been positioned.

[0075] First, the adhesive was applied, either on the body 4 to be glued and / or on the structured metallic surface 5, and then the body 4 to be glued was pre-positioned accordingly.

[0076] Fig. 7 shows a schematic representation of the Figs. 5 and 6 shown embodiment of the vacuum holder 1 with the inserted and locked second tool 32 and the exemplary positioned body 4 to be glued on.

[0077] After pre-positioning the body 4 to be bonded, the second tool, namely the holding and positioning aid 32, was positioned on the body 4 to be bonded such that the holding and positioning aid 32 is aligned within the tool holder 2. The holding and positioning aid 32 is held by the tool securing bracket 21 in combination with the tool securing lock 22 such that the adhesive is at a defined height, thus also the body 4 to be bonded with an adhesive gap. This position is maintained until the adhesive has sufficiently cured. Following this, the entire adhesive joining device can be removed, and the adhesive can continue to cure.

[0078] Fig. 8 shows a schematic representation of the vacuum holder 1 according to the invention from the underside, which can be placed on the metallic surface 5 according to the invention.

[0079] Here, the underside of the vacuum holder 1 can be seen, along with the corresponding tool holder 2. Also visible are the vacuum connection 11 and the first electrode 12, which extends from the top side and serves as the power connection to the metallic surface 5. On the underside of the vacuum holder 1, the different suction areas can be seen. These serve to distribute the corresponding negative pressure / vacuum over the entire surface, thus ensuring that the vacuum holder 1 is sucked onto the metallic surface 5.

[0080] The vacuum holder 1 is defined by two O-rings, which define the area on which the vacuum acts. The total area subjected to vacuum, multiplied by the negative pressure, defines the force with which the vacuum holder 1 is pressed against the metal surface 5. This force should be at least a factor of 3 larger than the etching area to sufficiently prevent the entire apparatus from being etched. The diameters and selection of the sealing rings are selected to ensure a secure vacuum seal even on slightly textured surfaces. The spring-loaded electrical contact / first electrode 12 contacts the metallic surface 5 to be etched.

[0081] In Fig. 9 is a schematic representation of the vacuum holder 1 according to the invention from the underside, corresponding Fig. 8 shown, whereby the first tool 31 is also shown here.

[0082] The first tool 31 is the etching cell, which is inserted into the tool holder 2, wherein a sealing ring 314 is additionally introduced, wherein this sealing ring 314 ensures that no electrolyte or rinsing liquid penetrates out of the etching cell and the area is limited.

[0083] The structure, with its internal chambers and channels, is optimized for homogeneous flow around the surface to be etched, the removal of hydrogen bubbles that form, and turbulent flow to avoid spots on surface 5 with reduced static flow. The electrolyte drain is deliberately located on top of the etching cell 31 to also remove hydrogen bubbles through gravity. The counter electrode 313 was positioned over a large area, parallel to the surface to be etched, and at a sufficient distance from it to ensure a homogeneous electrical potential distribution on the etching surface.

[0084] Fig. 10shows a schematic representation of a first application example of the adhesive joining device on a first metallic surface structure 5, wherein for illustration reasons only the first tool 31 is shown.

[0085] The metallic surface structure 5 is an inner corner to which a corresponding tool is adapted.

[0086] It should be noted here that the simplest application is a flat metallic surface. However, curved surfaces or angled areas can also be processed accordingly.

[0087] In Fig. 11 is a schematic representation of a second application example of the adhesive joining device on a second metallic surface structure 5, wherein for illustration reasons only the first tool 31 is shown.

[0088] This is an outer corner of two meeting surface sections, onto which a body 4 is ultimately glued.

[0089] Fig. 12 represents a schematic representation of a third application example of the adhesive joining device on a third metallic surface structure 5, wherein for illustration reasons only the first tool 31 is shown.

[0090] This is an outer corner of three meeting surface sections, onto which a body 4 to be glued is ultimately glued, whereby this already represents a very complex shape and the etching cell, namely the first tool 31, has corresponding internal channels which ensure optimal liquid distribution on the metallic surface 5. Further example:

[0091] The following is a description of the further embodiment, namely the possibility of depositing copper on aluminum using the fourth tool (or actually the second tool if this is assumed to be a single embodiment variant) (this should in no way be limiting for the adhesive joining device and the associated method!), based on an alternative embodiment with reference to the previously explained figures and the further Fig. 19 to Fig. 29 This requires a variant of an embodiment in which an etching cell 31 is used as the first tool, by means of which the metallic surface 5, which in this case is aluminum, is structured accordingly. Subsequently, a second tool 32 is used to apply copper to the prepared aluminum surface. Corresponding micrographs of this are shown in the following figures. Fig. 19 to Fig. 23, from which it can be seen that, in addition to undercuts, there are also completely enclosed island areas. The same applies to adhesives, which would be represented by the copper shown in the figures (corresponding to the adhesive-joining device and the method). The further embodiment of the invention would then, of course, be a corresponding device for applying a metal, such as copper, to a previously prepared metallic surface, analogous to the invention described above (first tool in combination with the fourth tool). List of reference symbols

[0092] 1 Vacuum holder 11 Vacuum connection 12 Power connection on metallic surface / first electrode 2 Tool holder 21 Tool retaining clip 22 Tool retaining lock 31 First tool / etching cell 311 Electrolyte supply 312 Drain 313 Power connection electrolyte / second electrode 314 Sealing ring / vacuum ring 32 Second tool / holding and positioning aid 4 Body to be bonded / component 5 Metallic surface 6 Mobile etching system 61 Vacuum pump, control unit, valve terminal, electrolyte pump, rinsing pump 62 Trolley 63 Electrolyte hose supply 64 Electrolyte hose drain 65 Power cable electrolyte electrode 66 Vacuum hose 67 Electrolyte tank 68 Electrolyte tank (used) 69 Rinsing medium

Claims

1. Adhesive joining device for preparing and / or producing an adhesive connection in an adhesive point and / or adhesive section on a metallic surface (5) to which a body and / or component (4) is to be adhered, and an adhesive by means of an electrochemical etching device, comprising: - a vacuum holder (1) with a vacuum connection (11), wherein the vacuum can be formed between the adhesive joining device and the surface (5) around the adhesive point and / or adhesive section to be produced; characterised in that the device further comprises: - a tool-changing holder (2) in the centre of the vacuum holder (1) or in the interior of the vacuum holder (1) or on the vacuum holder (1), which receives at least two different tools (31, 32) in a timely offset manner and in a defined position; - a first tool (31) which can be inserted and used in the tool holder (2) in a time-delayed manner, namely an electrochemical etching cell for an electrolyte, with: - an etching chamber which is directed towards the metallic surface (5); - a feed (311) for supplying an electrolyte to the etching chamber, an outlet (312) for discharging the electrolyte from the etching chamber;; - two electrodes (313, 12) with corresponding electrical contacts, one electrode (12) being mechanically and electrically connected to the metallic surface (5) to be structured and the second electrode (313) coming into contact with the electrolytes, - a second tool (32) that can be inserted and used with a time offset in the tool holder (2) for holding and positioning the body and / or component to be adhered (4) on the etched metallic surface (5) with a defined position within the tool holder (2), wherein the distance and / or position and / or alignment and / or parallelism of the body (4) to be adhered can be secured and aligned in a defined manner for the adhesion.

2. Adhesive joining device according to claim 1, characterised in that at least the first tool (31) is adapted in fluidic terms to the metallic surface (5) to be etched with respect to curvature and / or expansion.

3. Adhesive joining device according to one of claims 1 or 2, characterised in that the first tool (31) that can be inserted and used with a time offset in the tool holder (2) can be used to additionally clean the etched metallic surface (5), wherein correspondingly additional supply and discharge lines for cleaning and / or rinsing fluids and / or the existing feed (311) and the discharge (312) can be switched over for a cleaning and / or rinsing liquid and / or rinsing medium (69).

4. Adhesive joining device according to one of the preceding claims, characterised in that a third tool is provided for cleaning the etched metallic surface (5) after the etching process, which tool can be inserted and used in the tool holder (2) with a time offset.

5. Adhesive joining device according to one of the preceding claims, characterised in that a fourth tool is provided for the local deposition of copper on structured aluminium surfaces for the production of at least one electrical contact point, which fourth tool can be inserted and used in the tool holder (2) with a time delay.

6. Adhesive joining device according to one of the preceding claims, characterised in that - at least one vacuum pump (61), which is connected by a line to the vacuum chamber (1) via the vacuum connection (11, 66) and / or - at least one electrolyte reservoir (67) for storing an electrolyte and / or at least one electrolyte collecting container (68) for receiving the used electrolyte and / or - at least one pump (61) for supplying electrolyte to the first tool (31) and / or - at least one pump (61) for supplying flushing medium to the first and / or third tool and / or - at least one control unit (61) for controlling the device and / or the process is / are provided.

7. Adhesive joining device according to one of the preceding claims, characterised in that the adhesive joining device is designed to be mobile and / or transportable.

8. Adhesive joining process for a metallic surface using an adhesive joining device according to one of the preceding claims" comprising the steps of: - selecting the bonding point and positioning and securing the adhesive joining device by means of the vacuum holder (1) by creating and maintaining a vacuum; - inserting the first tool (31) into the tool holder (2) in parallel or in a downstream manner; - producing a structuring on the metallic surface (5) at the defined position and area by electrochemical etching by means of the first tool (31); - cleaning and drying the structured metallic surface (5) with the aid of the first tool (31) or a third tool, a tool change being carried out when the third tool is used; - removal of the tool (31) from the tool holder (2) - production of an adhesive bond by: - insertion of the second tool (32) into the tool holder (2) and positioning of the body and / or component (4) to be bonded in the second tool (32) and application of the adhesive to the structured metallic surface (5) and / or the body and / or component (4) and subsequent application of the body and / or component (4) to be bonded by means of the second tool (32) to produce a defined gap width, alignment with the structured metallic surface (5) in a fixed position directly above the previously structured metallic surface (5), wherein the tool holder (2) with the vacuum holder (1) remaining stationary; or - positioning the body and / or component (4) to be adhesively bonded and the adhesive on the structured metallic surface (5) and then inserting the second tool (32) into the tool holder (2) and applying the second tool (32) ) for producing a defined gap width, alignment with the structured metallic surface (5) in a fixed position directly above the previously structured metallic surface (5), the tool holder (2) with the vacuum holder (1) remaining fixed; - curing and / or allowing the adhesive to cure; - removing the adhesive joining device.

9. A method according to the preceding claim, characterised in that the etching is carried out by means of nanoscale sculpturing.

10. A method according to one of the two preceding claims, characterised in that the adhesive is applied by means of an adhesive application aid and / or the adhesive is cured under defined conditions, wherein a defined amount of heat and / or at a defined temperature and / or UV illumination is supplied for this purpose.