EVAPORATOR DEVICE FOR AN INHALATOR, CONSUMPTION UNIT, INHALATOR AND MANUFACTURING METHOD

DE502020009936D1Active Publication Date: 2025-01-02NICOVENTURES TRADING LTD
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Patent Information

Application Number
DE502020009936
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-02-18
Filing Date
2020-02-14
Publication Date
2025-01-02
Estimated Expiration
2040-02-14

AI Technical Summary

Technical Problem

Conventional inhaler evaporator devices using wick-coil technology face issues such as local overheating leading to pollutant production and leakage due to inadequate liquid supply, and lack a reliable electrical connection method.

Method used

The evaporator device employs a planar contact area for the electrical connection, utilizing a ceramic substrate and gold contact area for a stable and conductive link between the evaporator and electrical line, with a metallization layer and sintered materials for precise and efficient assembly, ensuring a low electrical resistance and thermal stability.

Benefits of technology

This configuration provides a reliable and efficient electrical connection, preventing overheating and leakage while maintaining thermal stability and mechanical integrity, enhancing the performance and lifespan of the evaporator device.

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Description

[0001] The present invention relates to a vaporizer device for an inhaler, comprising at least one electric vaporizer for vaporizing liquid supplied to the vaporizer, wherein the liquid is transported by capillary forces from an inlet side through at least one liquid channel to an outlet side, where vaporized liquid can be added to an air stream, a support that holds the vaporizer, and at least one electrical line that electrically contacts the vaporizer. The invention also relates to a consumption unit, an inhaler, and a manufacturing method.

[0002] Conventional inhalers and electronic cigarette products are based on wick-coil technology. Capillary forces transport the liquid from a reservoir along a wick until it is heated by an electrically heated coil and thus vaporized. The wick serves as a fluid-conducting connection between the reservoir and the heating coil, which serves as the vaporizer.

[0003] In conventional inhalers, the electrical connection to the vaporizer is simple thanks to the wick-coil technology. The coil simply needs to be subjected to an electric current. This heats the coil and allows the liquid to vaporize.

[0004] A disadvantage of wick coil technology is that a lack of liquid leads to localized overheating, which can produce harmful substances. This so-called "dry puff" phenomenon must be avoided. Furthermore, such vaporizer units are often leaky due to manufacturing, which can cause liquid to escape in undesirable ways, for example, through the air intake and / or vapor exhaust.

[0005] To avoid the problems of wick-coil technology, generic evaporators are used that utilize the technology disclosed in DE 10 2017 111 119 A1. The liquid is transported by capillary forces from an inlet side through a liquid channel to an outlet side, where the evaporated liquid can be added to an air stream as vapor and / or aerosol. The evaporator is electrically connected to a power source via an electrical line. However, the connection of the evaporator to the electrical line is not described in the cited prior art.

[0006] US 2016 / 345629 A1 discloses an evaporator device according to the preamble of claim 1.

[0007] WO 2015 / 117701 A1, EP 2 316 286 A1, US 2018 / 064170 A1, US 8,833,364 B2 and CN 207 926 944 U disclose further vaporizer devices for an inhaler.

[0008] It is the object of the invention to provide an evaporator device with a reliable and effective electrical connection to the evaporator.

[0009] The problem is solved by the features of the independent claims.

[0010] According to the invention, it is proposed that the electrical line have a planar contact region. The contact regions are regions of the electrical line provided for electrically conductive and materially bonded connections. The planar contact region of the electrical line improves the geometry of the connection provided between the electrical line and the evaporator. In particular, the contact region is therefore not point-shaped or curved, as is the case with an electrical line with a curved and in particular round cross-section. Therefore, a reliable electrical connection between the electrical line and the evaporator can be established in the contact region. Furthermore, the planar design of the contact region makes it possible to achieve an enlarged contact surface for establishing a connection and for power transmission.This can, for example, prevent high contact resistances and the associated localized temperature peaks.

[0011] According to the invention, the evaporator and the planar contact area of ​​the electrical line are connected to each other in a materially bonded and electrically conductive manner to provide a reliable connection between the electrical line and the evaporator. Furthermore, the materially bonded connection can hold the evaporator to the support and / or support the mounting of the evaporator on the support. The materially bonded connection consisting of the electrical line and the evaporator allows for precise electrical contacting, arrangement, and mounting of the components of the evaporator device during manufacture or assembly of the evaporator device.

[0012] Preferably, the outer shape of the evaporator is block-shaped, and one side of the evaporator is connected to the electrical line over a large area in order to be able to effectively design the electrical connection between the electrical line and the evaporator and to effectively utilize the contact area. The evaporator is advantageously connected to the electrical line on exactly one of its sides, for example the inlet side or the outlet side, in order to achieve the simplest possible geometry of the evaporator device. However, it is also possible for two, in particular opposite, sides of the evaporator to be each connected to at least one electrical line, for example each perpendicular to the outlet side or the inlet side.

[0013] Preferably, the carrier holds the electrical line and / or is integrally connected to the electrical line to promote an effective and compact design and efficient production of the evaporator device. A material-to-material connection of the electrical line to the carrier results in a material-to-material composite comprising the carrier, the electrical line, and the evaporator.

[0014] Advantageously, the evaporator has a particularly rectangular base area with two opposite edge sections, and each of the opposite edge sections is connected to an electrical line in order to be able to use the base area of ​​the evaporator effectively and to be able to cause an electrical resistance between the edge sections and thus a heating and evaporation of the liquid.

[0015] In a preferred embodiment, at least two electrical lines are provided, and the support has a through-opening between the electrical lines. The evaporator can, for example, be arranged such that the through-opening is located on the inlet side of the evaporator on the support. The through-opening allows a wick structure to make full contact with the inlet side of the evaporator for supplying liquid. However, the through-opening can also be arranged on the outlet side of the evaporator on the support so that the liquid evaporated by the evaporator can be added to the air flow flowing over the outlet side.

[0016] According to the invention, the support for holding the evaporator comprises a ceramic substrate in order to make the support for holding the evaporator thermally stable and / or, if necessary, to thermally decouple the evaporator from the support. The ceramic substrate is chemically and mechanically stable against the temperatures occurring during operation of the evaporator, for example up to 300°C, and thermal load changes, which occur, for example, approximately 200 to 2000 times during the life cycle of the evaporator. The support is in contact with the liquid and / or the aerosol or vapor and must therefore be food-safe and biocompatible, particularly at the temperatures occurring during evaporation, which is facilitated by the ceramic substrate.

[0017] The gold contact area is advantageous because it provides a highly electrically conductive contact area suitable for a material-to-material and electrically conductive connection to the vaporizer. The gold contact area is chemically stable to the liquid, aerosol, or vapor to be vaporized and can be reliably manufactured and processed using conventional methods.

[0018] According to the invention, the evaporator has a metallization layer to enable it to be prepared with electrical contact surfaces that can be connected to the electrical line in the contact area. The evaporator can, for example, essentially comprise a silicon block, particularly a doped silicon block, which has the metallization layer on its surface. The metallization layer simplifies the electrical and material-to-material contacting of the electrical line with the evaporator.

[0019] In an advantageous embodiment, the metallization layer comprises nickel, gold and / or palladium in order to be able to prepare an electrically conductive surface of the evaporator for the material connection and to be effectively processed using known methods.

[0020] According to the invention, a primer is arranged between the evaporator and the metallization layer, for example a seed layer made of aluminum, on which the advantageously electrolessly deposited metallization layer is applied.

[0021] Advantageously, the electrical connection between the evaporator and the electrical line has an electrical resistance of 5 mΩ to 20 mΩ in order to keep the undesirable conversion of electrical energy into heat low compared to the heat generated for evaporation and at the same time to be able to supply the evaporator with sufficient electrical energy.

[0022] According to the invention, the integral connection is formed at least partially by a first sintered material to enable precise and effective connection. Sintering the integral connection results in significant time savings when placing the evaporators on the carrier. In this embodiment, each contact of the evaporator does not need to be electrically connected (bonded) individually. A mechanically stable and electrically conductive connection can be created for a plurality of evaporators simultaneously by sintering in the furnace.

[0023] According to the invention, the electrical line is at least partially formed by a second sintered material in order to be able to arrange the electrical line precisely and to produce it effectively.

[0024] In an advantageous embodiment, the integral connection between the evaporator and the electrical line comprises an adhesive, in particular an electrically non-conductive adhesive, in order to establish an integral connection between the evaporator and the electrical line. The electrical connection between the electrical line and the evaporator can be formed and / or arranged independently of the integral connection. In particular, the electrical connection can be arranged in a smaller area than the integral connection in order to be able to specifically heat and / or electrically contact the evaporator. At the same time, the evaporator can be connected to the carrier over a large area.

[0025] Preferably, the evaporator and / or the contact area have solder bumps to enable a precisely located and effective electrical connection between the evaporator and the electrical line. In particular, the solder bumps can be gold bumps for advantageous electrical contacting and processing.

[0026] Advantageously, the electrical cable has a thermal expansion coefficient that differs by less than 10% from the thermal expansion coefficient of the evaporator to improve the service life of the evaporator device. This is because the evaporator reaches temperatures of up to 300°C during operation and experiences approximately 200 to 2000 thermal load cycles between ambient temperature and the operating temperature of the evaporator during its service life. The small difference of less than 10% in the thermal expansion coefficients leads to only low mechanical stress in the area of ​​the material connection between the electrical cable and the evaporator, thus not subjecting it to critical mechanical stress.

[0027] According to the invention, a consumption unit for an inhaler comprises the previously described vaporizer device and a liquid reservoir, wherein the vaporizer device is fluidly connected to the liquid reservoir. The inlet side of the vaporizer is fluidly connected to the liquid reservoir, for example, via a wick structure. An inhaler according to the invention comprises the consumption unit and a base unit. The integral and electrically conductive connection between the electrical line and the vaporizer allows for efficient assembly of the consumption unit or inhaler.

[0028] A method for producing the evaporator device described above comprises the following steps: providing the evaporator, the carrier, and the at least one electrical line, and bonding the evaporator and the electrical line in a planar contact area of ​​the evaporator in a cohesive and electrically conductive manner. In preparation for the electrically conductive and cohesive connection, a corresponding metallization can optionally be applied to the evaporator, particularly on a wafer basis. The contact area of ​​the electrical line is provided as a counterpart for the evaporator.

[0029] Preferably, the bonding process involves a thermocompression process. Advantageously, prior to bonding, the contact area, the carrier, and / or the evaporator are coated with a sintering paste suitable for thermocompression in designated bonding areas. The coating of the contact areas with a sintering paste can be achieved, for example, using stencils, screen printing, and / or pad printing.

[0030] Advantageously, the joining comprises the application of ultrasound to promote friction welding heat for thermomechanical joining by thermocompression between the electrical line and the evaporator.

[0031] The bonding preferably comprises sintering in order to provide simple preparation for the material-to-material bond. In preparation for the bonding by sintering, a suitable metallization can be applied to the contact surfaces of the evaporators on a wafer basis. The electrical lines themselves can also be produced by sintering. The material-to-material bond can consist of a first sintered material and / or the electrical line of a second sintered material. It is also possible to produce the bond and the electrical line in a single work step and / or from the same sintered material. Before bonding, the contact area, the carrier and / or the evaporator are advantageously coated in designated sintering areas with a sintering paste suitable for sintering.To ensure a stable connection between the electrical contact area and the evaporator, the composite is sintered in a furnace according to the requirements of the sintering paste. Sintering is advantageously carried out without pressure, in particular to avoid mechanical stress on the evaporator.

[0032] Preferably, prior to joining, a plurality of simultaneously processed evaporators are separated in order to produce a plurality of evaporator devices as effectively as possible. The plurality of evaporators can be present in a wafer assembly, wherein the wafer assembly can form several thousand evaporators. The wafer assembly can be separated, for example, using a wafer saw, and provide the plurality of separate evaporators. For this purpose, one evaporator can be removed from a plurality of wafers forming the evaporators, for example, using a picking process, and can be electrically and firmly connected to the electrical lines of the carrier, for example using flip-chip assembly.

[0033] Preferably, a plurality of solder bumps can be applied before connecting in order to be able to effectively establish the electrical connection.

[0034] Advantageously, the bonding process involves bonding with an adhesive, particularly one that is electrically non-conductive, to effectively establish the bonded connection. The adhesive bond can be applied to selected local areas, while other areas are deliberately not wetted with the electrically non-conductive adhesive, i.e., not bonded, and serve as the electrical connection.

[0035] The invention will be explained below using preferred embodiments with reference to the attached figures. Fig. 1 shows an exploded view of a vaporizer device and a support device; Fig. 2 shows a perspective view of a vaporizer device in the assembled state; Fig. 3 shows an exploded view of a vaporizer device and a support device; Fig. 4 shows a perspective view of a vaporizer device in the assembled state; Fig. 5 shows a schematic view of an inhaler; and Fig. 6 shows a perspective section through a vaporizer device.

[0036] Figure 1 shows an exploded view of a vaporizer device 1 and a carrier device 400 for an inhaler 10. The vaporizer device 1 comprises an electric vaporizer 60 for vaporizing liquid 50 supplied to the vaporizer 60 (see Figures 5 and 6 ). When assembled (see Figure 2), the evaporator 60 is held by a support 4. The evaporator 60 has an outlet side 64 and an inlet side 61 as well as liquid channels 62 located therebetween and is with reference to Figure 6 explained in more detail.

[0037] The carrier 4 comprises a ceramic substrate 103, see Figure 1 In this embodiment, the ceramic substrate 103 is essentially plate-shaped. For example, the ceramic substrate 103 can consist of a zirconium oxide plate or a plate made of ceramic, in particular a low-temperature single-fired ceramic. The carrier 4 has at least one planar section in which a planar contact area 131 is formed. In this embodiment, the carrier 4 is ceramic. Alternatively, the carrier 4 can consist of a heat-resistant plastic and comprise a ceramic evaporator holder.

[0038] The substrate 103 advantageously has a thermal expansion coefficient similar to the material from which the evaporator 60 is primarily made, for example, silicon, and differs by a maximum of 10%. This keeps mechanical stresses between the carrier 4 and the evaporator 60 low during operation of the evaporator 60.

[0039] Advantageously, the substrate 103 has a low thermal conductivity and / or a low heat capacity so that the heat intended for evaporation is not dissipated from the evaporator 60 and / or stored in the carrier 4. Thus, the evaporator 60 is thermally decoupled from the carrier 4 and / or from external components. A low thermal conductivity and / or heat capacity of the carrier 4 does not impair the advantageously low thermal inertia of the evaporator 60. As a result, the evaporator 60 can be heated and / or cooled down precisely and, in particular, quickly, in order to promote high aerosol quality and precise adjustment of the aerosol quantity.

[0040] The evaporator 60 and the carrier 4 are arranged such that the carrier 4, in the assembled state, is electrically and materially connected to the evaporator 60 at the outlet side 64. To enable the evaporator 60 to add the evaporated liquid to the air stream 34, the carrier 4 has a through-opening 104 (not shown). The through-opening 104 is arranged at the outlet side 64 of the evaporator 60. Advantageously, the through-opening 104 is at least as large as the surface area of ​​the evaporator 60, which is provided with liquid channels 62 (see Figure 6 ).

[0041] On the support 4, two electrical lines 105a, 105b are provided, which are connected to the evaporator 60 in a materially bonded and electrically conductive manner, see Figure 1 The electrical lines 105a, 105b are integrally connected to the carrier 4 or are applied from the carrier 4. The electrical lines 105a, 105b can comprise copper, for example.

[0042] The electrical lines 105a, 105b have a contact area 131 suitable for an electrically conductive and materially bonded connection. The contact area 131 can be made of gold, for example, advantageously a gold layer of preferably 5-50 µm, more preferably 8-20 µm, for example 10 µm.

[0043] The composite of carrier 4 and evaporator 60 is placed, for example, between the two half-shells 108a, 108b, which, as a carrier device 400, for example, fulfill the task of holding the evaporator device 1 and a wick structure 19 relative to the evaporator device 1, so that there is a good liquid connection of the evaporator 60 to an external part, for example a liquid reservoir 18.

[0044] The half-shells 108a, 108b are advantageously made of a high-temperature plastic, for example PEEK, which remains mechanically and chemically stable at the temperatures occurring during evaporation.

[0045] A recess 180 is provided in the upper shell 108a, so that an air channel 130 is formed between the carrier 4 and the upper shell 108a. An air stream 34 flows through the air channel 130 during operation of the inhaler 10. The air stream 34 flows over the outlet side 64 of the vaporizer 60, which adds vaporized liquid 50 to the air stream 34 as vapor and / or aerosol.

[0046] In the lower shell 108b, an opening (not shown) is provided through which the wick structure 19 extends. The wick structure 19 is connected in a fluid-conducting manner on the one hand to the inlet side 61 of the evaporator 60 and on the other hand to a liquid reservoir 18. The wick structure 19 is described with reference to Figures 5 and 6 explained in more detail.

[0047] It is also possible to provide only one electrical line 105a and to conduct the electrical current, for example, via the half-shells 108a, 108b or a housing part (not shown). It is also possible to provide further electrical contact between the lines 105a, 105b and / or a secondary air duct 101 in one of the shells 108a, 108b. The support device 400 can also consist of a single-piece shell or more than two shell parts.

[0048] As in Figure 1 As can be seen, the evaporator 60 is advantageously a chip-like flat heater. The evaporator 60 is block-shaped, and the outlet side 64, in the assembled state, is connected flatly to the electrical lines 105a, 105b in the planar contact area 131.

[0049] Figure 2shows a perspective view of an evaporator device 1 in the assembled state. In this embodiment, the inlet side 61 of the evaporator 60 is connected to the electrical lines 105a, 105b in a planar, electrically conductive, and materially bonded manner in the contact area 131. Thus, the evaporator 60 is electrically and mechanically connected and held to the carrier 4 via the contact area 131.

[0050] The evaporator 60 has a rectangular base area with two opposite edge sections 132a, 132b. The evaporator 60 is connected to one of the electrical lines 105a, 105b in each of the edge sections 132a, 132b. The electrical lines 105a, 105b each extend from the contact region 131 to an end section 205a, 205b. At the end sections 205a, 205b, the evaporator device 1 can be contacted by an external part, for example, a heating voltage source 71, to supply the evaporator 60 with electrical energy. The end sections 205a, 205b are advantageously designed for soldering to a contact of the external part or together with the carrier 4 as a plug-in connector.

[0051] The end sections 205a, 205b are advantageously arranged at an end 122 of the support 4 located upstream of the vaporizer 60 for supplying the vaporizer 60 with electrical energy. The end 122 located upstream of the vaporizer 60 is the end that is configured for mechanical and / or electrical connection to an external part, for example, a base part 16 of the inhaler 10, by means of the electrical contact. The electrical lines 105a, 105b preferably run parallel to the air channel 130.

[0052] Between the electrical lines 105a, 105b, the carrier has a through-opening 104. The through-opening 104 is arranged on the inlet side 61 of the evaporator 60. The through-opening 104 is advantageously arranged between the contact areas 131 of the electrical lines 105a, 105b. A wick structure 19 can extend through the through-opening 104 to make fluid-conducting contact with the inlet side 61 of the evaporator. The through-opening 104 advantageously has a shape that corresponds to the shape of the wick structure 19.

[0053] In the contact area 131, a plurality of solder bumps 150 are optionally provided on the electrical lines 105a, 105b. The solder bumps 150 are advantageously made of gold and can, for example, establish an electrically conductive connection between the evaporator 60 and the electrical lines 105a, 105b by means of thermocompression.

[0054] To mechanically and / or thermally improve the connection between the electrical lines 105a, 105b and the evaporator 60, the connection may comprise an adhesive. The adhesive may, in particular, be electrically non-conductive so as not to impair the electrically conductive connection. The adhesive advantageously has low thermal conductivity to reduce the heat input from the evaporator 60 into the carrier 4.

[0055] For the production of Figures 1 and 2 In the evaporator devices 1 shown, the carrier 4 with the electrical lines 105a, 105b and the evaporator 60 are provided.

[0056] The evaporator 60 can be present in a wafer assembly from which a plurality of evaporators 60 are manufactured. The plurality of evaporators 60 is manufactured, for example, by various etching and coating processes, in particular by structuring the wafer assembly by producing the liquid channels 62.

[0057] The evaporator 60 can be provided with a metallization layer 133 in preparation for connection to the electrical lines 105a, 105b. The metallization layer 133 can be applied directly to the evaporator 60 or to a primer, for example, a seed layer made of aluminum. The metallization layer 133 can consist of electrolessly deposited nickel, gold, and / or palladium, or a material structure thereof. This can occur simultaneously for a plurality of evaporators 60, for example, a wafer assembly, in order to parallelize the process.

[0058] Optionally, the solder bumps 150 can be applied to the surface of the evaporator 60 or to its metallization layer 133 and / or to the electrical lines 105a, 105b or the surface of the advantageously ceramic carrier 4 in the contact area 131. For this purpose, a layer of gold is advantageously applied to each of the electrical lines 105a, 105b in the contact area 131. The solder bumps 150 can be arranged thereon.

[0059] Alternatively, a sintering paste suitable for the material-locking connection is printed and / or applied either onto the electrical lines 105a, 105b of the advantageously ceramic carrier 4 or onto a designated contact surface of the evaporator 60.

[0060] The wafer assembly is then singulated, providing a plurality of evaporators 60. The singulated evaporators 60 are removed from the wafer assembly, for example, using a picking process. Using flip-chip assembly, the evaporators 60 are bonded to the electrical leads 105a, 105b of the advantageously ceramic carrier 4 using a thermocompression process. The thermocompression process can be improved by applying ultrasonics by introducing friction welding heat. Optionally, the composite of evaporator 60 and carrier 4 can be mechanically stabilized using an electrically non-conductive adhesive.

[0061] The carriers 4 can be present in a carrier assembly, onto which the plurality of evaporators 60 are arranged and applied. After the evaporators 60 are fitted and connected to the carriers 4 present in the carrier assembly, the resulting evaporator devices 1 can be separated.

[0062] The vaporizer devices 1, or the assemblies comprising vaporizer 60 and carrier 4, are then placed between the two half-shells 108a, 108b. The carrier structure 400 can then be installed in a vaporizer insert 100, a consumption unit 17, and / or an inhaler 10.

[0063] In Figures 1 and 2 The electrically conductive and material-locking composite of evaporator 60 and carrier 4 is produced by a thermocompression process using solder bumps 150.

[0064] Figures 3 and 4 show an alternative to the Figures 1 and 2shown connection by means of the solder bumps 150 using sintered material 151, 152. The Figures 3 and 4 are discussed in terms of differences to the Figures 1 and 2 explained.

[0065] Figure 3 shows an exploded view of the evaporator device 1 and the support device 400, wherein a first sintered material 151 is provided on the evaporator 60 in order to establish an electrically conductive and materially bonded connection with the electrical lines 105a, 105b. Figure 4 shows a perspective view of the evaporator device 1.

[0066] The contact region 131 of the electrical lines 105a, 105b on the carrier 4 and / or the contact surface on the surface of the evaporator 60 is designed for pressureless sintering, for example by a layer of gold.

[0067] The electrical lines 105a, 105b consist of a second sintered material 152. The second sintered material 152 is applied to the ceramic substrate 103 or the carrier 4 and, after sintering, forms the electrical lines 105a, 105b. Sintering bonded the second sintered material 152 and thus the electrical lines 105a, 105b to the carrier 4.

[0068] It is also possible for the first sintered material 151 to be made of the same material as the second sintered material 152. In this case, the electrical lines 105a, 105b connected to the carrier 4 in a material-to-material manner and, at the same time, the connection between the evaporator 60 and the electrical lines 105a, 105b can be produced in only one sintering process.

[0069] Alternatively, the carrier 4 can also be provided with already existing electrical lines 105a, 105b and only the material connection between the evaporator 60 and the electrical lines 105a, 105b can be formed from the second sintered material 152.

[0070] To establish the connection to the first sintered material 151, the application of solder bumps is unnecessary. For this purpose, a sintering paste suitable for sintering is advantageously printed or applied to the electrical lines 105a, 105b of the advantageously ceramic carrier 4. After separating the evaporators 60, the evaporators 60 are placed on the first sintered material 151 on the electrical lines 105a, 105b.

[0071] Alternatively, the first sintering material 151 can be printed and / or applied to the intended contact surface of the evaporator 60. After separating the evaporators 60, the evaporators 60 are placed on the electrical lines 105a, 105b.

[0072] For a stable connection between the electrical contact area 131 and the evaporator 60, the composite of carrier 4 and evaporator 60 is sintered in the furnace with the first sintered material 151 and optionally with the second sintered material 152 for the electrical lines 105a, 105b.

[0073] Both the Figures 1 and 2 as well as in Figures 3 and 4The exemplary embodiments shown allow electrical contacting of the evaporator 60 with simultaneous low heat conduction from the evaporator 60 to the carrier 4. The electrical connection between the evaporator 60 and the electrical line 105a, 105b has an electrical resistance of 5 mΩ to 20 mΩ. By adapting the cross-section and / or length or thickness of the electrical connection, i.e., the solder bumps 150 and / or the first sintered material 151, the heat generated from the heat conduction from the evaporator 60 and the electrical resistance between the electrical line 105a, 105b and the evaporator 60, which is introduced into the carrier 4, is minimal.

[0074] Figure 5schematically shows an inhaler 10 or an electronic cigarette product. The inhaler 10 comprises a housing 11 in which an airflow channel 30 is provided between at least one air inlet opening 231 and an air outlet opening 24 at a mouth end 32 of the inhaler 10. The mouth end 32 of the inhaler 10 denotes the end at which the consumer draws for inhalation, thereby subjecting the inhaler 10 to a negative pressure and generating an airflow 34 in the airflow channel 30.

[0075] The inhaler 10 advantageously consists of a base part 16 and a consumption unit 17 or vaporizer-tank unit, which comprises the vaporizer device 1 and the liquid reservoir 18 and is designed, in particular, in the form of a replaceable cartridge. The air drawn in through the air inlet opening 231 is guided in the air flow channel 30 to or through the at least one vaporizer device 1. The vaporizer device 1 is connected or connectable to the liquid reservoir 18, in which at least one liquid 50 is stored.

[0076] The evaporator device 1 evaporates liquid 50, which is advantageously supplied to the evaporator device 1 from the liquid reservoir 18 by a wick or a wick structure 19 by means of capillary forces, and releases the evaporated liquid as an aerosol / vapor into the air stream 34 at an outlet side 64.

[0077] The porous and / or capillary, liquid-conducting wick structure 19 is advantageously arranged on an inlet side 61 of the evaporator 60, as shown schematically in Figure 5shown. A liquid interface and / or multiple liquid lines can be provided between the liquid reservoir 18 and the wick structure 19. The liquid reservoir 18 can therefore also be arranged at a distance from the wick structure 19. The wick structure 19 advantageously contacts the inlet side 61 of the evaporator 60 over a large area and covers all liquid channels 62 of the evaporator 60 on the inlet side. On the side opposite the evaporator 60, the wick structure is connected to the liquid reservoir 18 in a liquid-conducting manner. The liquid reservoir 18 can be larger in its dimensions than the wick structure 19. The wick structure 19 can, for example, be inserted into an opening in a housing of the liquid reservoir 18. A plurality of evaporator devices 1 can also be assigned to a liquid reservoir 18. The wick structure 19 can generally be one-piece or multi-piece.

[0078] The wick structure 19 consists of porous and / or capillary material which, due to capillary forces, is capable of passively conveying liquid evaporated by the evaporator 60 in sufficient quantity from the liquid reservoir 18 to the evaporator 60 in order to prevent the liquid channels 62 from running dry and the problems resulting therefrom.

[0079] The wick structure 19 is advantageously made of an electrically non-conductive material to prevent undesired heating of liquid in the wick structure 19 due to current flow. The wick structure 19 advantageously has low thermal conductivity. The wick structure 19 is advantageously made of one or more of the following materials: cotton, cellulose, acetate, glass fiber fabric, glass fiber ceramic, sintered ceramic, ceramic paper, aluminosilicate paper, metal foam, metal sponge, another heat-resistant, porous and / or capillary material with a suitable flow rate, or a composite of two or more of the aforementioned materials. In an advantageous practical embodiment, the wick structure 19 can comprise at least one ceramic fiber paper and / or a porous ceramic.The volume of the wick structure 19 is preferably in the range between 1 mm^3 and 10 mm^3, more preferably in the range between 2 mm^3 and 8 mm^3, even more preferably in the range between 3 mm^3 and 7 mm^3 and is, for example, 5 mm^3.

[0080] If the wick structure 19 consists of an electrically and / or thermally conductive material, an insulating layer made of an electrically and / or thermally insulating material, for example glass, ceramic or plastic, with openings extending through the insulating layer and corresponding to the liquid channels 62 is advantageously provided between the wick structure 19 and the evaporator 60.

[0081] An advantageous volume of the liquid reservoir 18 is in the range between 0.1 ml and 5 ml, preferably between 0.5 ml and 3 ml, more preferably between 0.7 ml and 2 ml or 1.5 ml.

[0082] The electronic cigarette 10 further comprises an electrical energy storage device 14 and an electronic control device 15. The energy storage device 14 is generally arranged in the base part 16 and can in particular be a disposable electrochemical battery or a rechargeable electrochemical battery, for example a lithium-ion battery. The consumption unit 17 is arranged between the energy storage device 14 and the mouth end 32. The electronic control device 15 comprises at least one digital data processing device, in particular a microprocessor and / or microcontroller, in the base part 16 (as in Figure 5 shown) and / or in the consumption unit 17 or an evaporator insert 100.

[0083] A sensor, for example a pressure sensor or a pressure or flow switch, is advantageously arranged in the housing 11. Based on a sensor signal output by the sensor, the control device 15 can determine that a consumer is pulling on the mouth end 32 of the inhaler 10 to inhale. In this case, the control device 15 controls the vaporizer device 1 to add liquid 50 from the liquid reservoir 18 as an aerosol / vapor into the air stream 34.

[0084] The evaporator device 1, or at least one evaporator 60, is arranged in a part of the consumption unit 17 facing away from the mouth end 32. This enables effective electrical coupling and control of the evaporator device 1. The air flow 34 advantageously leads to the air outlet opening 24 through an air flow channel 30 running axially through the liquid reservoir 18.

[0085] The liquid 50 to be dosed, stored in the liquid reservoir 18, is, for example, a mixture of 1,2-propylene glycol, glycerin, water, at least one flavor, and / or at least one active ingredient, in particular nicotine. However, the specified components of the liquid 50 are not mandatory. In particular, flavors and / or active ingredients, in particular nicotine, can be omitted.

[0086] The consumption unit or cartridge 17 or the base part 16 advantageously comprises a non-volatile data memory for storing information or parameters relating to the consumption unit or cartridge 17. The data memory can be part of the electronic control device 15. The data memory advantageously stores information on the composition of the liquid stored in the liquid reservoir 18, information on the process profile, in particular power / temperature control; data for condition monitoring or system testing, for example, leak testing; data relating to copy protection and forgery security, an ID for uniquely identifying the consumption unit or cartridge 17, serial number, date of manufacture and / or expiration date, and / or puff count (number of inhalations by the consumer) or the usage time. The data memory is advantageously electrically connected or connectable to the control device 15.

[0087] In the inhaler 10 and / or in an external memory, which can be connected to the inhaler 10 in a suitable and known manner, at least temporarily, for communication purposes, user-related data, in particular about smoking behavior, could also be stored and preferably also used to control and regulate the inhaler.

[0088] An evaporator insert 100 is provided for insertion into the liquid reservoir 18. The liquid reservoir has at least one insertion opening into which the evaporator insert 100 can be inserted, in particular pushed in. The evaporator insert 100 comprises a base part 83 for receiving the support device 400, the support 4, and the evaporator 60. The base part 83 has a shell side 31 that encloses the air flow channel 30 through which the air flow 34 can flow.

[0089] The base part 83 is liquid-tight and prevents any liquid 50 from penetrating the interior of the evaporator insert 100, preventing any unwanted escape of liquid 50 from the air flow channel 30 and / or the consumption unit 17. The seal of the evaporator insert 100 is designed such that liquid 50 can only pass through the wick structure 19 and then through the evaporator 60, and is added to the air flow 34 in the vaporized state.

[0090] The air channel 130 formed by the support device 400 in the region of the evaporator 60 merges into the air flow channel 30 downstream of the evaporator 60. The air channel 130 can be understood as the flow section of the air flow channel 130 formed by the support device 400.

[0091] Additional channels, in particular at least one secondary air channel 101, which meet the air channel 130 and / or the air flow channel 130 downstream of the evaporator 60, can ensure mixing of the gas / aerosol mixture with fresh air from a secondary air flow 102 and / or regulate post-treatment and / or recondensation processes.

[0092] The evaporator device 1 according to Figure 6 comprises a block-shaped, preferably monolithic heating element or evaporator 60, preferably made of an electrically conductive material, in particular a semiconductor material, preferably silicon, and a carrier 4 with a through-opening 104 for the liquid-conducting connection of the evaporator 60 and a liquid reservoir 18. For this purpose, a wick structure 19 is advantageously arranged in the through-opening 104.

[0093] It is not necessary for the entire evaporator 60 to be made of an electrically conductive material. For example, it may be sufficient for the surface of the evaporator 60 to be electrically conductive, for example, metallic, coated, or preferably suitably doped. In this case, the entire surface does not have to be coated; for example, metallic or preferably non-metallic or non-metallically coated metallic conductor tracks can be provided on a non-conductive or semiconductive base body. It is also not absolutely necessary for the entire evaporator 60 to heat; it may be sufficient, for example, if a section or a heating layer of the evaporator 60 heats in the region of the outlet side 64.

[0094] Advantageously, the evaporator 60 has a metallization layer 133 at least on one contact surface which is provided for electrical contacting.

[0095] The evaporator 60 is provided with a plurality of microchannels or liquid channels 62, which connect an inlet side 61 of the evaporator 60 with an outlet side 64 of the evaporator 60 in a liquid-conducting manner. The inlet side 61 is connected to the Figure 6 The wick structure 19 shown is connected to the liquid reservoir 18 in a fluid-conducting manner. The wick structure 19 serves to passively convey liquid from the liquid reservoir 18 to the evaporator 60 by means of capillary forces.

[0096] The average diameter of the liquid channels 62 is preferably in the range between 5 µm and 200 µm, more preferably in the range between 30 µm and 150 µm, even more preferably in the range between 50 µm and 100 µm. Due to these dimensions, a capillary effect is advantageously generated, so that liquid penetrating into a liquid channel 62 at the inlet side 61 rises upward through the liquid channel 62 until the liquid channel 62 is filled with liquid. The volume ratio of liquid channels 62 to evaporator 60, which can be referred to as the porosity of the evaporator 60, is, for example, in the range between 10% and 50%, advantageously in the range between 15% and 40%, even more advantageously in the range between 20% and 30%, and is, for example, 25%.

[0097] The edge lengths of the surfaces of the evaporator 60 provided with liquid channels 62 are, for example, in the range between 0.5 mm and 3 mm, preferably between 0.5 mm and 1 mm. The dimensions of the surfaces of the evaporator 60 provided with liquid channels 62 can be, for example: 0.95 mm × 1.75 mm or 1.9 mm × 1.75 mm or 1.9 mm × 0.75 mm. The edge lengths of the evaporator 60 can, for example, be in the range between 0.5 mm and 5 mm, preferably in the range between 0.75 mm and 4 mm, more preferably in the range between 1 mm and 3 mm. The surface of the evaporator 60 (chip size) can, for example, be 1 mm × 3 mm, 2 mm × 2 mm or 2 mm × 3 mm.

[0098] The width b of the evaporator 60 (see Figure 6 ) is preferably in the range between 1 mm and 5 mm, more preferably in the range between 2 mm and 4 mm, and is for example 3 mm.

[0099] The height h of the evaporator 60 (see Figure 6) is preferably in the range between 0.05 mm and 1 mm, more preferably in the range between 0.1 mm and 0.75 mm, even more preferably in the range between 0.2 mm and 0.5 mm, and is, for example, 0.3 mm. Even smaller evaporators 60 can be manufactured, provided, and operated functionally.

[0100] The number of liquid channels 62 is preferably in the range between four and 1000. In this way, the heat input into the liquid channels 62 can be optimized and a guaranteed high evaporation performance as well as a sufficiently large vapor outlet area can be realized.

[0101] The liquid channels 62 are arranged in the form of a square, rectangular, polygonal, round, oval, or other-shaped array. The array can be designed in the form of a matrix with s columns and z rows, where s is advantageously in the range between 2 and 50 and more advantageously in the range between 3 and 30 and / or z is advantageously in the range between 2 and 50 and more advantageously in the range between 3 and 30. In this way, an effective and easily producible arrangement of the liquid channels 62 with assured high evaporation performance can be realized.

[0102] The cross-section of the liquid channels 62 can be square, rectangular, polygonal, round, oval or otherwise shaped, and / or can change in sections in the longitudinal direction, in particular enlarge, reduce or remain constant.

[0103] The length of one or each liquid channel 62 is preferably in the range between 100 µm and 1000 µm, more preferably in the range between 150 µm and 750 µm, even more preferably in the range between 180 µm and 500 µm, and is, for example, 300 µm. In this way, optimal liquid absorption and portion formation can be achieved with sufficiently good heat input from the evaporator 60 into the liquid channels 62.

[0104] The distance between two liquid channels 62 is preferably at least 1.3 times the inside diameter of one liquid channel 62, wherein the distance is relative to the center axes of the two liquid channels 62. The distance can preferably be 1.5 to 5 times, more preferably 2 to 4 times, the inside diameter of one liquid channel 62. In this way, an optimal heat input into the evaporator 60 and a sufficiently stable arrangement and wall thickness of the liquid channels 62 can be realized.

[0105] Due to the features described above, the evaporator 60 can also be referred to as a volume heater.

[0106] The evaporator device 1 has a heating voltage source 71, which can preferably be controlled by the control device 15 and which is connected via electrical lines 105a, 105b in a contact area 131 (not shown). Figure 6shown) is connected to the evaporator 60 at opposite edge sections 132a, 132b thereof, so that an electrical voltage Uh generated by the heating voltage source 71 leads to a current flow through the evaporator 60. Due to the ohmic resistance of the electrically conductive evaporator 60, the current flow leads to heating of the evaporator 60 and therefore to evaporation of the liquid contained in the liquid channels 62. Vapor / aerosol 6 generated in this way escapes from the liquid channels 62 to the outlet side 64 and is mixed with the air stream 34. More specifically, upon detection of an air flow 34 through the air flow channel 30 caused by the consumer pulling, the control device 15 controls the heating voltage source 71, whereby the liquid located in the liquid channels 62 is driven out of the liquid channels 62 in the form of vapor / aerosol by spontaneous heating.

[0107] An electronic or electrical connection of the evaporator 60 to the electrical lines 105a, 105b is with reference to Figures 1 to 4 explained.

[0108] Preferably, a voltage curve Uh(t) adapted to the liquid mixture used is stored in the data memory of the inhaler 10. This makes it possible to specify the voltage curve Uh(t) adapted to the liquid used, so that the heating temperature of the vaporizer 60, and thus also the temperature of the capillary liquid channels 62, can be controlled over time during the vaporization process according to the known vaporization kinetics of the respective liquid, thereby achieving optimal vaporization results. The vaporization temperature is preferably in the range between 100°C and 400°C, more preferably between 150°C and 350°C, and even more preferably between 190°C and 290°C.

[0109] The evaporator 60 can advantageously be manufactured from sections of a wafer using thin-film technology, which has a layer thickness of preferably less than or equal to 1000 µm, more preferably 750 µm, and even more preferably less than or equal to 500 µm. Surfaces of the evaporator 60 can advantageously be hydrophilic. The outlet side 64 of the evaporator 60 can advantageously be microstructured or have microgrooves.

[0110] The vaporizer device 1 is configured such that a quantity of liquid is metered in, preferably in the range between 1 µl and 20 µl, more preferably between 2 µl and 10 µl, even more preferably between 3 µl and 5 µl, typically 4 µl, per puff taken by the consumer. Preferably, the vaporizer device 1 can be adjustable with respect to the quantity of liquid / vapor per puff, i.e., per puff duration from 1 s to 3 s.

[0111] The following is an example of the evaporation process.

[0112] In an initial state, the voltage source 71 or the energy storage 14 for the heating process is switched off.

[0113] To evaporate liquid 50, the voltage source 14, 71 for the evaporator 60 is activated. The voltage Uh is adjusted so that the evaporation temperature in the evaporator 60, and thus in the liquid channels 62, is adapted to the individual evaporation behavior of the liquid mixture used. This prevents the risk of local overheating and the resulting formation of pollutants.

[0114] As soon as a quantity of liquid has evaporated that corresponds to or is related to the volume of the liquid channels 62, the heating voltage source 71 is deactivated. Since the liquid properties and quantity are advantageously known precisely and the evaporator 60 has a measurable temperature-dependent resistance, this point in time can be determined or controlled very precisely.

[0115] After the heating process is complete, the fluid channels 62 are largely or completely empty. The heating voltage 71 is then kept off until the fluid channels 62 are refilled by further pumping fluid through the wick structure 19. Once this occurs, the next heating cycle can be started by switching on the heating voltage 71.

[0116] The control frequency of the evaporator 60 generated by the heating voltage source 71 is generally advantageously in the range from 1 Hz to 50 kHz, preferably in the range from 30 Hz to 30 kHz, even more advantageously in the range from 100 Hz to 25 kHz.

[0117] The frequency and duty cycle of the heating voltage Uh for the evaporator 60 are advantageously adapted to the natural oscillation or natural frequency of the bubble oscillations during nucleate boiling. The period 1 / f of the heating voltage can therefore advantageously be in the range between 5 ms and 50 ms, more advantageously between 10 ms and 40 ms, even more advantageously between 15 ms and 30 ms, and even more advantageously be 20 ms. Depending on the composition of the evaporated liquid 50, frequencies other than those mentioned can be optimally adapted to the natural oscillation or natural frequency of the bubble oscillations.

[0118] Furthermore, it has been shown that the maximum heating current generated by the heating voltage Uh should preferably not exceed 7 A, more preferably not exceed 6.5 A, even more preferably not exceed 6 A and optimally should be in the range between 4 A and 6 A in order to ensure concentrated steam while avoiding overheating.

[0119] The delivery rate of the wick structure 19 is in turn optimally adapted to the evaporation rate of the evaporator 60, so that sufficient liquid 50 can be supplied at any time and the area in front of the evaporator 60 is prevented from running dry.

[0120] The evaporator device 1 is preferably manufactured on the basis of MEMS technology, in particular from silicon, and is therefore advantageously a micro-electro-mechanical system.

[0121] According to the above, a layered structure is advantageously proposed, consisting of a Si-based evaporator 60, which is advantageously planar at least on the inlet side 61, and one or more underlying capillary structures 19 with advantageously different pore sizes. The wick structure 19, arranged directly on the inlet side 61 of the evaporator 60, prevents the formation of bubbles on the inlet side 61 of the evaporator 60, since gas bubbles prevent further conveying action and simultaneously lead to (local) overheating of the evaporator 60 due to a lack of cooling by incoming liquid.

Claims

1. Vaporizer device (1) for an inhaler (10), comprising - at least one electric vaporizer (60) for vaporizing liquid (50) fed to the vaporizer (60), wherein the liquid (50) is transported by capillary forces from an inlet side (61) through at least one liquid channel (62) to an outlet side (64), where vaporized liquid (50) can be added to an air flow (34), - a carrier (4) retaining the vaporizer (60), and - at least one electrical line (105a, 105b) electrically contacting the vaporizer (60), wherein - the electrical line (105a, 105b) comprises a planar contact area (131), and - the vaporizer (60) and the planar contact area (131) of the electrical line (105a, 105b) are bonded materially and electrically conductively to each other, characterized in that - the material bond is at least partially formed by a first sintered material (151), - the carrier (4) comprises a ceramic substrate (103), - the vaporizer (60) comprises a metallization layer (133), - a primer is arranged between the vaporizer (60) and the metallization layer (133), and - the electrical line (105) is at least partially formed by a second sintered material (152).

2. Vaporizer device (1) according to claim 1, characterized in that - the outer shape of the vaporizer (60) is block-shaped, and - one side (61, 64) of the vaporizer (60) is bonded in a planar manner to the electrical line (105a, 105b).

3. Vaporizer device (1) according to one of the preceding claims, characterized in that - the vaporizer (60) comprises a base surface, in particular a rectangular base surface, with two opposing edge sections (132a, 132b), and each of the opposing edge sections (132a, 132b) is bonded to an electrical line (105a, 105b).

4. Vaporizer device (1) according to one of the preceding claims, characterized in that - the carrier (4) retains the electrical line (105a, 105b) and / or is materially bonded to the electrical line (105a, 105b).

5. Vaporizer device (1) according to one of the preceding claims, characterized in that - at least two electrical lines (105a, 105b) are provided, and - the carrier (4) comprises a passage opening (104) between the electrical lines (105a, 105b).

6. Vaporizer device (1) according to one of the preceding claims, characterized in that - the contact area (131) is made of gold.

7. Vaporizer device (1) according to claim 8, characterized in that - the metallization layer (133) comprises nickel, gold and / or palladium.

8. Vaporizer device (1) according to one of the preceding claims, characterized in that - the electrical bond between the vaporizer (60) and the electrical line (105) comprises an electrical resistance of 5 mΩ to 20 mΩ.

9. Vaporizer device (1) according to one of the preceding claims, characterized in that - the material bond between the vaporizer (60) and the electrical line (105) comprises an adhesive, in particular an electrically non-conductive adhesive.

10. Vaporizer device (1) according to one of the preceding claims, characterized in that - the vaporizer (60) and / or the contact area (131) comprises solder bumps (150).

11. Vaporizer device (1) according to one of the preceding claims, characterized in that - the electrical line (105a, 105b) comprises a coefficient of thermal expansion that differs by less than 10% from the coefficient of thermal expansion of the vaporizer (60).

12. Consumption unit (17) for an inhaler (10), comprising - a vaporizer device (1) according to any of the preceding claims, and - a liquid reservoir (18), wherein - the vaporizer device (1) is connected to the liquid reservoir (18) in a liquid-conducting manner.

13. Inhaler (10), comprising - a consumption unit (17) according to claim 12, and - a base unit (16).

14. Method for manufacturing a vaporizer device (1) according to any of the preceding claims 1 to 11, comprising the following steps: - Providing the vaporizer (60), the carrier (4), and the at least one electrical line (105a, 105b), and - materially and electrically conductively bonding the vaporizer (60) and the electrical line (105a, 105b) in a planar contact area of the vaporizer (60).

15. Method according to claim 14, characterized in that - the bonding comprises a thermocompression process.

16. Method according to claim 14 or 15, characterized in that - the bonding comprises an application of ultrasound.

17. Method according to any of the preceding claims 14 to 16, characterized in that - the bonding comprises sintering in particular without pressure.

18. Method according to any one of the preceding claims 14 to 17, characterized in that - a plurality of simultaneously processed vaporizers (60) are separated prior to bonding.

19. Method according to any one of the preceding claims 14 to 18, characterized in that - a plurality of solder bumps (150) are applied prior to bonding.

20. Method according to one of the preceding claims 14 to 19, characterized in that - the bonding comprises an adhesive bonding with an in particular non-conductive adhesive.