METHOD AND DEVICE FOR PRODUCING A SUBSTRATE COMPOSITE

Description

[0001] The invention relates to a method for producing a substrate composite. It also relates to an apparatus suitable for carrying out the method according to the invention.

[0002] Flexible base materials, such as films, with structured surfaces are known from the state of the art. Structured surfaces are advantageous for numerous applications. They are a prerequisite for implementing functions on the base materials. Such functions can be used to achieve optical effects, decorations, security functions, fluid technology functions, LAB-on-chip functions, medical functions, sensor functions, and other functions on the base material.

[0003] To create a structured surface on a base material, current technology involves forming structures on one or both sides of the base substrate. This can be achieved by deforming the surface of the base material under mechanical and / or thermal influences, or by applying liquid substances such as uncrosslinked polymers, which are mechanically structured by tools and subsequently cured or crosslinked.

[0004] Using the methods known from the state of the art, multi-layer structuring cannot be achieved or can only be achieved with great effort. A single-layer structuring is usually sufficient for decorative purposes. However, functions that require multiple structured layers are difficult to produce in this way. For example, structures can be produced that enable fluidic structures on a flexible base material. According to the state of the art, it is possible to build fluidic structures on a base material separately in individual steps one after the other. However, the procedure is only scalable to a limited extent, i.e. the process for manufacturing a product with a fluidic structure hardly allows for any changes, so that changing the product involves a high level of effort to adapt the production facility required to manufacture the product.In addition, the final products are usually no longer flexible.

[0005] EP 2 990 201 A1 discloses a device and a method for producing a substrate composite comprising at least a first strip-shaped substrate and a second strip-shaped substrate. WO 2018 / 114505 A1 discloses a method for producing a fuel or electrolyte cell which, however, does not have a functional layer. US 2002 / 0098124 A1 discloses a microfluidic article which, however, does not have a material layer on which a macrostructure is first formed and on which micro- and nanostructures are subsequently formed. US 2011 / 0309716 A1 discloses a composite consisting of several layers and a method for producing the same. A base substrate and a cover substrate, between which a structured functional layer is arranged, are not described. US 2015 / 0173964 A1 discloses a method for producing absorbent articles such as diapers.

[0006] Furthermore, there are currently no known solutions that combine the advantages of printed electronics with the properties of structured surfaces.

[0007] The object of the invention is to eliminate the disadvantages of the prior art. In particular, it is intended to provide a scalable method for producing a flexible substrate composite comprising multiple structured functional layers.

[0008] This object is achieved by the features of claims 1 and 13. Useful embodiments of the inventions emerge from the features of the subclaims.

[0009] The invention is set out in the appended claims. According to the invention, a method for producing a multilayer substrate composite with the features of claim 1 is provided. The substrate composite has at least a base substrate having at least one layer, a cover substrate having at least one layer, and a structural-functional layer located between the base substrate and the cover substrate. To produce the multilayer substrate composite, at least one of the layers of the base substrate is provided on a roll; at least one of the layers of the cover substrate is provided on a roll; to form a structural-functional layer, a material layer is applied to the base substrate, and the applied material layer is subjected to structuring.

[0010] The method according to the invention can be implemented as a roll-to-roll method. The term "roll-to-roll method" refers to a method in which at least the base substrate is unwound from a roll. It can additionally be provided that the substrate composite produced by the method according to the invention is wound onto a roll. The substrate composite is preferably flexible.

[0011] The method according to the invention is a scalable method. The method according to the invention can be modified without great effort, so that a product manufactured from the substrate composite can be easily modified. A device for producing the substrate composite according to the invention can be easily adapted to a change in the method according to the invention. This is particularly due to the fact that the substrate composite is manufactured by its components passing through stations of the device. These stations can be modified with little effort, both with regard to the sequence of the stations and the process steps carried out in the individual stations.

[0012] The base substrate is preferably a flexible and rollable substrate. The base substrate is provided as a strip material. The base substrate can have a base layer and / or a base carrier layer. The base layer can be provided on a roll and unwound from this roll. The base layer can consist, for example, of plastic, metal, glass, ceramic, a textile, a fiber structure, and a combination of one or more thereof. The base layer can itself be a laminate. The base layer can thus be a prefabricated substrate composite. The base carrier layer can also be provided on a roll and unwound from this roll.

[0013] The base carrier layer can be removed after the production of the substrate composite or after the application of a cover substrate to the outer structural functional layer. This distinguishes it from the base layer, which remains a component of the substrate composite after its production.

[0014] It can be provided that one or more base functional layer(s) are formed on the base layer. A base functional layer is a functional layer which, in contrast to the structural functional layers, is not introduced into the substrate composite as a material layer to be structured, but is already part of the base substrate. For example, the base functional layer(s) can already be located on the base layer—or, as explained below, on the base carrier layer—which is provided as a roll. If the base layer is provided as a laminate, the base functional layer(s) can be part of the laminate. The base functional layer(s) are thus part of the base substrate. A base functional layer can, for example, be a contact layer that enables electrical and / or optical contacts between one or more functional layers. Conductor track structures can be formed using the contact layer.Such contact layers are known from flexible electronics.

[0015] It can be provided that one or more openings are formed in the base layer and / or in the base functional layer(s). The openings can be hole- or channel-like. However, the openings can be introduced into the base layer and / or the base functional layer(s) in a later process step. Openings can be formed in the base layer and / or in the base functional layer(s), for example by means of a laser. The openings can provide access for media, for example fluids, so that these can be guided to the structural functional layer(s). One or more through-openings can be formed in the base functional layer(s), which are aligned with through-openings formed in the base layer. This enables passage through the base layer and the base functional layer(s).However, one or more through-openings can also be formed in the base layer, which are closed by a base functional layer that lies adjacent to the base layer. These openings can be used to contact this base functional layer through the base layer. One or more openings can be formed in a base functional layer that are aligned with openings in an adjacent base functional layer.

[0016] In one embodiment, only one base functional layer is provided. This base functional layer is preferably a contact layer.

[0017] A base carrier layer can be formed on the second surface side of the base layer. The base functional layer(s) are preferably arranged on the first surface side of the base layer. This can mean that a base functional layer rests on the first surface side of the base layer and, if present, one or more further base functional layers are arranged to form a stack on the base functional layer, which rests on the first surface side of the base layer. The base carrier layer covers the second surface side of the base layer, preferably completely. The base carrier layer serves to protect the surface of the base layer and / or to assist the transport of the base layer in a device for producing the substrate composite according to the invention. This is particularly expedient when the base layer consists of a fragile or stretch-sensitive material.The base carrier layer can be a film, for example a film made of plastic, metal, or textile. The base carrier layer preferably has no openings.

[0018] It is not mandatory for the base substrate to have a base layer. Rather, one or more base functional layers can be formed on the base carrier layer.

[0019] A base substrate can thus be (i) a base layer on which neither a base functional layer nor a base carrier layer is arranged; (ii) a base layer on which one or more base functional layers are arranged, but no base carrier layer; (iii) a base layer on which no base functional layer is arranged, but a base carrier layer is arranged; (iv) a base layer on which one or more base functional layers and a base carrier layer are arranged; or (v) a base carrier layer on which one or more base functional layers are arranged without a base layer being present.

[0020] The base layer and the base carrier layer are each a layer of the base substrate.

[0021] The method according to the invention provides for the formation of one or more structural functional layers on the base substrate. The structural functional layer(s) are not formed from the base layer or base substrate by deforming the base layer or base substrate, but are applied as additional layer(s). The applied structural functional layer(s) have a pattern.

[0022] The term "structural-functional layer" in the present invention refers to a functional layer that has one or two structured surface sides. A structured surface side is a surface side that has elevations and / or depressions. A structural-functional layer can have a nominal thickness. The nominal thickness can correspond to the thickness of the applied material layer from which the structural-functional layer is formed by structuring. An elevation is a structural element whose thickness is greater than the nominal thickness. A depression is a structural element whose thickness is less than the nominal thickness. If several structural elements are formed in one surface side of a structural-functional layer, i.e. (i) several elevations, (ii) several depressions, or (iii) at least one elevation and at least one depression, this surface side has a profiling. An elevation can be a raised, i.e.A positive structural element, a depression can be considered a countersunk, i.e., negative, structural element. The structural elements can have any arrangement and / or size. They can merge into one another. The elevations and depressions can form a macrostructure.

[0023] It can be provided that the negative structural elements have a residual thickness of zero. For example, the structural-functional layer adjacent to the base substrate can have one or more negative structural elements that have a residual thickness of zero. In other words, this means that a negative structural element extends to the base substrate, for example the base layer or the outermost base functional layer. Such a negative structural element can be used as a connection to an opening formed in the base substrate, for example an opening (i) in the base functional layer(s) or (ii) an opening in the base functional layer(s) and an opening formed in alignment therewith in the base layer.In this way, a channel is created that extends through the structural-functional layer to the base functional layer(s) or to the surface side of the base layer facing away from the structural-functional layer(s). If the base substrate does not have a base carrier layer, the channel extends to the area surrounding the substrate composite. If multiple structural-functional layers are provided, negative structures can be formed in two or more structural-functional layers in alignment with one another, so that a channel is formed between two or more of the structural-functional layers.

[0024] It is not necessary for a structural functional layer to cover the entire surface of the base substrate. Rather, it may be sufficient for a structural functional layer to cover only one or more sections of the base substrate. This results in other sections of the base substrate, for example the base layer or, if the base layer has a base functional layer, parts of the outer base functional layer, being exposed. These other sections are then accessible. If, for example, the base substrate has a contact layer and the structural functional layer covers only one or more sections of the contact layer, the structures of the contact layer are exposed in the other sections of the contact layer. The exposed structures can be used to enable later contacting.Alternatively, openings or cutouts can be formed in the base layer and / or at least in the structural-functional layer adjacent to the base functional layer(s) to achieve accessibility of the base functional layer(s) through the base layer or through the structural-functional layer. Openings aligned with the opening or cutout in the structural-functional layer adjacent to the base functional layer(s) can be provided in further structural-functional layer(s).

[0025] In the present invention, the term "structuring" refers to the processing of a material layer to form elevations and / or depressions. In this case, each structural-functional layer may be subjected to structuring immediately after its application. Structuring of a material layer may be performed using a tool, for example, a stamp or a roller. The material layer may then be cured and / or crosslinked to obtain the structural-functional layer.

[0026] The structural elements formed by structuring can be macrostructures, microstructures and / or nanostructures. A macrostructure can be understood as a structural element that has an extension of 1000 µm or more; a microstructure can be understood as a structural element that has an extension that is 1 µm or larger, but smaller than 1000 µm; and a nanostructure can be understood as a structural element that has an extension of less than 1 µm, for example, smaller than 100 nm. The formation of micro- and / or nanostructures is advantageous for imparting certain functions to the substrate composite. These functions include, for example, light refraction or fluidic functions such as hydrophobic or hydrophilic surface properties. Light refraction is of particular interest for optical applications and applications in the security sector.

[0027] Using the tool, macrostructures are formed during structuring. Microstructures and / or nanostructures are formed simultaneously with the formation of the macrostructures or subsequently. The same tool can be used for this purpose, provided the tool has a tool design suitable for the formation of microstructures and / or nanostructures. The term "simultaneous" refers to the formation of the macrostructures and the microstructures and / or nanostructures in a single operation. However, if the formation of microstructures and / or nanostructures is planned subsequent to the formation of the macrostructures, a second operation can be provided. In the second operation, a second tool can be used to form the microstructures and / or nanostructures. A second operation is particularly advantageous when different regions are to be created on previously created macrostructures.For example, a material film can be applied to the macrostructures, which is then structured using the tool and then fixed and / or cured. The material film is preferably very thin, i.e., its thickness is 0.1 mm or less (also referred to as the tenth-of-a-millimeter range); 0.01 mm or less (hundredths of a millimeter range); 0.001 mm or less (thousandths of a millimeter range or micrometer range); or 0.0001 mm or less (nanometer range).

[0028] The method according to the invention thus enables the formation of micro- and / or nanostructured regions on a macrostructure. These regions can be used, for example, to adjust different conductivities of fluids on the structural-functional layer. This is particularly useful for the development of sensor technology.

[0029] The material layer applied to the base substrate or another structural-functional layer to form a structural-functional layer preferably consists of a monomeric and / or polymeric material that can be fixed and / or cured by a suitable treatment, for example, a chemical, optical, and / or thermal treatment. The structure imprinted on the material layer by the tool is then permanently retained. The monomeric or polymeric material is preferably a material that can be cured by crosslinking. For this purpose, the material layer can contain a crosslinking agent.

[0030] The material film, which can be provided by forming micro- and / or nanostructures on a macrostructure, preferably consists of a monomeric and / or polymeric material that can be fixed and / or cured by a suitable treatment, for example a chemical, optical and / or thermal treatment. The micro- and / or nanostructure imprinted on the material film by means of a tool, for example the second tool, is then permanently retained. The monomeric or polymeric material is preferably a material that can be cured by crosslinking. For this purpose, the material film can contain a crosslinker. The material film can consist of the same material as the material layer.

[0031] The structural functional layers are preferably formed on the side of the base substrate facing away from the base carrier layer. If multiple structural functional layers are applied to a base substrate, a first structural functional layer lies either on the surface side of the base substrate facing away from the base carrier layer or on the surface side of the outer basic functional layer of the base substrate facing away from the base substrate. The outer basic functional layer is the base functional layer that forms an outer side of the base substrate. Additional structural functional layers can subsequently be applied to the previously formed structural functional layer to form a stack of structural functional layers.

[0032] The structural-functional layer(s) should adhere to the base substrate at least temporarily. Permanent adhesion of the structural-functional layer(s) to the base substrate can be provided, but is not absolutely necessary. For example, it can be provided to remove the base substrate after the formation of the structural-functional layer(s), so that permanent adhesion is undesirable and temporary adhesion is desired. Temporary adhesion can be understood as adhesion for a period from the application of the sole or first structural-functional layer to the base substrate until the removal of the base substrate from the sole or first structural-functional layer, as provided for in the method.

[0033] To ensure sufficient adhesion of the single or first structural-functional layer to the base substrate, the chemical compositions of (i) the base substrate or its outer base functional layer and (ii) the single or first structural-functional layer can, for example, be matched to one another. This is particularly useful when the base substrate or its outer base functional layer, on the one hand, and the single or first structural-functional layer, on the other hand, consist of different starting materials. To ensure temporary or permanent adhesion of the single or first structural-functional layer to the base substrate, one or more adhesive films can alternatively be provided. Alternatively, the structural-functional layer(s) can have an adhesive property. Such an adhesive property can result from the material from which the material layer is formed.The adhesive property may be subject to activation. Such activation can be achieved, for example, by irradiation or thermally.

[0034] The substrate composite may comprise a cover substrate. The cover substrate is applied to the outer structural-functional layer. The outer structural-functional layer is the structural-functional layer furthest from the base substrate. If only one structural-functional layer is present, the cover substrate is applied to the surface side of the structural-functional layer facing away from the base substrate. If multiple structural-functional layers are provided, the cover substrate is applied to the surface side of the outer structural-functional layer facing away from the underlying structural-functional layer.

[0035] The cover substrate is preferably a flexible and rollable substrate. The cover substrate is provided as a strip material. The cover substrate may have a cover layer. The cover layer may be provided on a roll and unwound from this roll. The cover layer may consist, for example, of plastic, metal, glass, ceramic, a textile, a fiber structure, or a combination of one or more thereof. The cover layer may itself be a laminate. The cover layer may thus be a prefabricated substrate composite.

[0036] It can be provided that one or more functional cover layers are formed on the cover layer. A functional cover layer is a functional layer which, in contrast to the structural functional layer(s), is not introduced into the substrate composite as a material layer to be structured, but is already part of the cover substrate. For example, the cover functional layer(s) can already be located on the cover layer, which is provided as a roll. If the cover layer is provided as a laminate, the cover functional layer(s) can be part of the laminate. The cover functional layer(s) are thus part of the cover substrate. A cover functional layer can, for example, be a contact layer that enables electrical and / or optical contacts between one or more functional layers. Conductor track structures can be formed using the contact layer. Such contact layers are known from flexible electronics.

[0037] It can be provided that one or more openings are formed in the cover layer and / or in one or more cover functional layers. The openings can be hole- or channel-like. However, the openings can be introduced into the cover layer and / or the cover functional layer(s) in a later process step. Openings can be formed in the cover layer and / or the cover functional layer(s), for example, using a laser. The openings can provide access for media, for example fluids, so that these can be guided to the structural functional layer(s). One or more through-openings can be formed in the cover functional layer(s), which are aligned with through-openings formed in the cover layer. This enables passage through the cover layer and the cover functional layer(s).However, one or more through-openings can also be formed in the cover layer, which are closed by the cover functional layer that lies against the cover layer. These openings can be used to contact this cover functional layer through the cover layer. One or more openings can be formed in a cover functional layer that are aligned with openings in an adjacent cover functional layer.

[0038] In one embodiment, only one cover functional layer is provided. This cover functional layer is preferably a contact layer. In one embodiment, only one base functional layer, preferably a contact layer, and only one cover functional layer, preferably a contact layer, are provided.

[0039] A cover carrier layer can be formed on the second surface side of the cover layer. The cover functional layer(s) are preferably arranged on the first surface side of the cover layer. This can mean that a cover functional layer rests on the first surface side of the cover layer and, if present, one or more further cover functional layer(s) are arranged to form a stack on the cover functional layer, which rests on the first surface side of the base layer. The cover carrier layer covers the second surface side of the cover layer, preferably completely. The cover carrier layer serves to protect the surface of the cover layer and / or to assist the transport of the cover layer in a device for producing the substrate composite according to the invention. This is particularly expedient when the cover layer consists of a fragile or stretch-sensitive material.The cover carrier layer can be a film, for example a film made of plastic, metal, or textile. The cover carrier layer preferably has no openings.

[0040] A cover substrate can thus be (i) a cover layer on which neither a cover functional layer nor a cover carrier layer is arranged; (ii) a cover layer on which one or more cover functional layers but no cover carrier layer are arranged; (iii) a cover layer on which no cover functional layer but a cover carrier layer is arranged; or (iv) a cover layer on which one or more cover functional layers and a cover carrier layer are arranged.

[0041] If the cover substrate has one or more cover functional layers, the cover substrate is preferably applied to the outermost structural functional layer such that the first surface side of the cover substrate—that is, the surface side on which the cover functional layer(s) are located—faces the structural functional layer. If the cover substrate has a cover carrier layer, the cover substrate is preferably applied to the outermost structural functional layer such that the cover carrier layer faces away from the structural functional layer.

[0042] The cover substrate is preferably applied to the outermost structural-functional layer such that its cover functional layer(s) faces the outer structural-functional layer. The cover substrate can completely cover the outer surface side of the outer structural-functional layer. Alternatively, however, the cover substrate can be applied such that it only bears against first regions of the outer surface side of the outer structural-functional layer, while it does not bear against second regions of the outer surface side. In this way, one or more gaps can be formed that are delimited by the outer surface side of the outer structural-functional layer and the cover substrate. The first regions can be positive structural elements, the second regions can be negative structural elements.

[0043] The cover layer and the cover carrier layer are each a layer of the cover substrate.

[0044] The connection between the outer structural-functional layer and the cover substrate can be established using various technologies, for example thermal and / or chemical. Preferably, a connection is provided by an adhesive bond. An adhesive bond can be realized, for example, by activating the adhesive properties of the outer structural-functional layer or by an adhesive film. For this purpose, an adhesive film can be applied to the surface side of the cover substrate that is to face the outer structural-functional layer and / or to the outer surface side of the structural-functional layer. The outer surface side of the structural-functional layer is the surface side of the outer structural-functional layer that faces the cover substrate. The adhesive film should be as thin as possible.

[0045] Alternatively or in addition to activating the adhesive properties or applying an adhesive film, the material film described in connection with the structural-functional layers can also be used to create an adhesive bond between the outer structural-functional layer and the cover substrate. To do this, the cover substrate is brought into contact with the outer surface of the outer structural-functional layer in areas where the material film was previously applied, before it is fixed and / or cured. After the cover substrate is applied to the material film, it is then fixed or cured, creating a firm bond between the outer structural-functional layer and the cover substrate.

[0046] The cover substrate preferably covers the entire outer surface of the outer structural-functional layer, whereby it is not necessary for the cover substrate to be completely flush with the outer structural-functional layer to form gaps. Openings or cutouts can be formed in the cover substrate, preferably in the cover layer, to achieve accessibility to the cover functional layer(s) through the cover layer.

[0047] Applying the cover substrate creates a substrate composite in which the structural-functional layer(s) are arranged between the base substrate and the cover substrate. The structural-functional layer(s) are enclosed between the base substrate and the cover substrate. This protects, encapsulates, seals, and separates them from the environment. The openings in the structural-functional layer(s) can form channels that can be specifically used for fluids. The channels can form channel structures.

[0048] The materials and / or structure of the cover substrate can be the same as the materials or structure of the base substrate.

[0049] The substrate composite can have one or more contact layers. For example, the base functional layer can be a contact layer. The cover functional layer can also be a contact layer. The substrate composite can have at least one further contact layer. For example, it can have a contact layer formed between two adjacent structural functional layers. A contact layer can be formed on the intermediate layer, which contacts the electronic component(s) and / or electronic structures located in the spaces between the intermediate layer. A contact layer is a layer that enables electrical and / or optical contacts between one or more functional layers. Conductor track structures can be formed using the contact layer. Such contact layers are known from flexible electronics.

[0050] It can be provided that one or more electronic components are integrated into the substrate composite. For example, one or more electronic components can be integrated into one or more of the following layers or applied to this layer(s): the base functional layer, the structural functional layer, the cover functional layer, the base layer, and the cover layer. In a preferred embodiment, one or more electronic components are integrated into the base layer and / or the cover layer and / or a contact layer located between two structural functional layers. In the following, the term "functional layer" refers to one of the following layers: base functional layer, structural functional layer, and cover functional layer. A contact layer arranged between two structural functional layers is preferably not itself a structural functional layer, although this is possible.

[0051] At least one of the electronic components, preferably two or more of the electronic components, and preferably all of the electronic components can be active electronic components. The term "electronic components" also encompasses electronic circuits. Examples of electronic components are integrated circuits; processors such as central processing units (CPUs); logic modules; electronic memories such as random-access memory (RAM); light-emitting diodes (LEDs); organic light-emitting diodes (OLEDs); antennas; heaters; and sensors; although this list is not exhaustive. An electronic structure is created in the multilayer substrate assembly by means of the electronic component(s). In other words, this means that the multilayer substrate assembly has an electronic structure. The electronic structure can consist of or comprise the electronic component(s).The electronic structure can have at least one active electronic component, so it can be regarded as an active electronic structure. The electronic structure can further have connecting elements for connecting electronic components to one another or for contacting one or more of the electronic components from outside the multilayer substrate composite. The connecting elements can be, for example, conductors for conducting electronic current or fiber optic cables. It can be provided that the contacting of the electronic component(s) and / or electronic structure(s) is established via a conductive adhesive. The conductive adhesive can be applied in a structured manner to a layer, preferably to a functional layer and / or to contact points of the electronic component(s) and / or electronic structure(s).For example, for the electrical connection of the electronic component(s) and / or electronic structure(s) to a functional layer to which the electronic component(s) and / or electronic structure(s) are applied, it can be provided that a conductive adhesive is applied in a structured manner to the functional layer and / or to contact points of the electronic component(s) and / or electronic structure(s). The application of the conductive adhesive to a layer, for example a functional layer, is preferably carried out before the electronic component(s) and / or electronic structure(s) are applied to the layer. In addition, it can be provided that conductive adhesive is applied to the contact points of the electronic component(s) and / or electronic structure(s) before these are applied to the layer.

[0052] The electronic structure can be used, for example, to analyze processes, such as chemical processes. The analysis can be a standalone analysis. The term "standalone analysis" refers to an automated analysis. Such an analysis can comprise a complete analysis of a substance, in particular a liquid. Using the electronic component(s), a lab-on-a-chip can be formed in the multilayer substrate assembly according to the invention, for example. The method according to the invention thus enables the integration of lab-on-a-chip technology into a multilayer substrate assembly.

[0053] The electronic component(s) may be silicon-based electronic components. Silicon-based electronic components are available in thinned form for such encapsulated applications. In one example, an electronic component has a thinned form if its thickness is 0.3 mm or less, preferably 0.2 mm or less. For example, wafers are available that are thinned from 0.6 mm to 0.3 mm or 0.2 mm. These wafers can be used as base wafers. Electronic components in thinned form can be advantageously integrated into thin layer structures. The electronic component(s), for example microcomputers and / or microcontrollers, can be completely self-contained units. They can be prefabricated as completely self-contained units. They can then be embedded in the layer(s).The electronic components can thus form small, completely self-contained, functional units within the substrate assembly. In this way, microchips, electronic assemblies, individual electronic components, or electronic devices can be formed using the substrate assembly.

[0054] It is not absolutely necessary for the electronic component(s) to already be embedded in a layer if this layer is provided as a roll. Instead, it is possible to embed one, several or all electronic components or one, several or all electronic structures formed from one or more electronic components in the layer after the layer in which the electronic component(s) and / or the electronic structure(s) are to be embedded has been unwound. The electronic component(s) and / or electronic structure(s) can be embedded using a pick-and-place process. The electronic component(s) and / or electronic structure(s) can be fed to the unwound layer, placed on the layer, fastened there and, if provided, contacted. For embedding components placed, fastened and, if provided, contacted on a layer.contacted electronic component(s) and / or electronic structure(s), a further layer can then be applied to this layer in such a way that the electronic component(s) and / or electronic structure(s) are arranged between these layers. The further layer can be, for example, the cover carrier layer. Embedding the electronic component(s) and / or electronic structure(s) between the two layers encloses the electronic component(s) and / or electronic structure(s). This process can also be referred to as encapsulation. Some or all of the electronic component(s) and / or electronic structure(s) encapsulated in this way are flexible within certain limits. This applies in particular to thinned electronic component(s).

[0055] When embedding electronic components and / or electronic structures between two flat layers, gaps can arise. These gaps can be filled with a compensating material. The compensating material can be a polymeric material, for example. The polymeric material can be introduced into the gaps in a liquid state and then cured and / or fixed there. In a second embodiment, the use of an intermediate layer can be provided. The intermediate layer fills the gaps. It has recesses for the electronic components and / or electronic structures. The intermediate layer can be a flat, flexible substrate. The intermediate layer can be provided on a roll and unwound from this roll.The intermediate layer can be applied to a layer before or after the electronic component(s) and / or electronic structure(s) are applied to this layer. The further layer, for example the base carrier layer or the cover carrier layer, can then be applied to the intermediate layer, thereby embedding the electronic component(s) and / or electronic structure(s). The use of an intermediate layer has the advantage of achieving a uniform and predetermined height extension between the two layers between which the electronic component(s) and / or electronic structure(s) are arranged. It can be provided that any gaps that arise when using an intermediate layer between this and the electronic component(s) and / or electronic structure(s) are sealed or locked by means of a sealing material, for example a polymeric material.For this purpose, the polymeric material can be applied in liquid form to the intermediate layer to form polymer layers, preferably thin polymer layers, and can be cured and / or fixed, preferably after the application of the further layer, for example the base carrier layer or the cover carrier layer. In a third variant, a vacuum is created in the intermediate spaces, wherein a seal or locking device, as described above, can also be provided. In a fourth variant, the intermediate spaces are filled with a medium, for example a gas or a liquid, wherein a seal or locking device, as described above, can also be provided. Combinations of several or all of these variants can also be provided. The medium can be under excess pressure. This is particularly possible when the medium is a gas.

[0056] The intermediate layer is preferably a flexible and rollable substrate. The intermediate layer can be provided as a strip material. The intermediate layer can be provided on a roll and unwound from that roll. The intermediate layer can be made of, for example, plastic, metal, glass, ceramic, a textile, a fibrous structure, or a combination of one or more of these. The intermediate layer can itself be a laminate.

[0057] The use of an intermediate layer is advantageous because it allows for the formation of gaps around the embedded components. These gaps, especially when filled with media, vacuum, or pressurized gases, enable the creation of a substrate composite suitable for specific applications: For example, it is possible to construct an overall structure intended for use in the atmosphere but with gaps filled with vacuum. Such a substrate composite structure can also be advantageous for the implementation of pressure sensors.

[0058] It can be provided that openings and vias are formed in one or more layers, which are led to and / or through the electronic component(s) and / or electronic structure(s).

[0059] In a preferred embodiment, the electronic component(s) and / or electronic structure(s) are embedded in the cover layer. The cover layer can be arranged between a cover functional layer and a cover carrier layer. Openings and vias can be formed in the cover layer and / or the cover functional layer, which extend to and / or through the electronic component(s) and / or electronic structure(s).

[0060] According to the invention, a device for producing a multilayer substrate composite is further provided with the features of claim 13. The substrate composite comprises at least one base substrate having at least one layer, a cover substrate having at least one layer, and a structural functional layer located between the base substrate and the cover substrate. The device has: at least one roller for providing a layer of the base substrate; at least one roller for providing one of the layers of the cover substrate; and a device for forming a structural-functional layer on the base substrate, wherein the device comprises at least one application device for applying a material layer to the base substrate or to a structural-functional layer and at least one tool for structuring the applied material layer.

[0061] The device according to the invention is particularly suitable for carrying out the method according to the invention. The tool can be a tool roller for imprinting a structure on the material layer. The device according to the invention can further be provided with a radiation source for fixing and / or curing the material layer using optical radiation. The radiation source can be arranged inside or outside the tool roller.

[0062] Further details of the device according to the invention have been described above in connection with the method according to the invention. Reference is made to these details to avoid repetition.

[0063] The device according to the invention can have the following for the production and / or provision of the base substrate: a first roll for providing the base carrier layer and an unwinder for unwinding the base carrier layer from the first roll; optionally, if the substrate composite to be produced is to have a base layer, a second roll for providing the base layer and an unwinder for unwinding the base layer from the second roll; optionally, if a base layer is provided, a first roller for bringing the base carrier layer together with the base layer, preferably in such a way that the base carrier layer rests on the second surface side of the base layer and / or that only the base carrier layer rests on the first roller, while the base layer does not rest on the first roller;optionally, if the base layer does not already carry a base functional layer or if a further base functional layer is to be applied to an already existing base functional layer, a first contact layer application device; and optionally, if a base functional layer is to be structured, a first contact layer structuring device.;

[0064] The device according to the invention can have a first process station for applying a structural functional layer. The first process station can have the following: a first application device for applying a material layer to the base substrate; a first tool roller for imprinting a macrostructure and, if provided, a microstructure and / or nanostructure onto the surface side of the material layer facing the first tool roller; at least one radiation source for curing and / or fixing the structured material layer by means of optical radiation; and, optionally, if the cured and structured material layer is to be subjected to further structuring, a structuring device for further structuring the cured and structured material layer.

[0065] The device according to the invention can have the following for producing the cover substrate: a third roll for providing the cover carrier layer and an unwinder for unwinding the cover carrier layer from the third roll; a fourth roll for providing the cover layer and an unwinder for unwinding the cover layer from the fourth roll; a second roller for bringing the cover carrier layer together with the cover layer, preferably in such a way that the cover carrier layer rests against the second surface side of the cover layer and / or that only the cover carrier layer rests against the second roller, while the cover layer does not rest against the second roller; optionally, if the cover layer does not already carry a cover functional layer or if a further cover functional layer is to be applied to an already existing cover functional layer, a second contact layer application device;and optionally, if a cover functional layer is to be structured, a second contact layer structuring device.;

[0066] The device according to the invention can have a first pair of rollers for combining the cover substrate with a substrate composite that has or consists of the base substrate and the structural-functional layer. The rollers of the first pair of rollers can be spaced apart from one another to form a gap. The substrate composite obtained in the first process station and the cover substrate can be brought together in the gap. Preferably, the substrate composite rests with its base carrier layer against one roller of the first pair of rollers, while the cover carrier layer faces the other roller of the first pair of rollers. The first pair of rollers can be used to produce a substrate composite that consists of a base substrate, a structural-functional layer, and a cover substrate. The device according to the invention can have a pair of calibration rollers for adjusting the thickness of this substrate composite.The device according to the invention can comprise a cover substrate structuring device for structuring the cover carrier layer. The cover substrate structuring device is preferably arranged after the first pair of rollers. It can be arranged after the pair of calibration rollers.

[0067] The device according to the invention can comprise the following for removing the base substrate from a previously produced substrate assembly: optionally a third roller and / or a fourth roller for guiding the substrate assembly to a second pair of rollers; the second pair of rollers for separating the base substrate from the substrate assembly; a winder for winding the base substrate onto a fifth roller; and the fifth roller.

[0068] The device according to the invention can comprise a third contact layer application device for applying a further functional layer to the surface side of a structural functional layer exposed after separation of the base substrate. If structuring of the applied contact layer is to take place, the device according to the invention can comprise a third contact layer structuring device for structuring the applied contact layer.

[0069] The device according to the invention can have a second process station for applying a further, second structural-functional layer. The second process station can have the following: a second application device for applying a material layer, preferably to the exposed surface side of the first structural-functional layer or, if this layer bears a contact layer, to the contact layer; a second tool roller for imprinting a macrostructure and, if provided, a microstructure and / or nanostructure onto the surface side of the material layer facing the second tool roller; at least one radiation source for curing and / or fixing the structured material layer by means of optical radiation; and, optionally, if the cured and structured material layer is to be subjected to further structuring, a structuring device for further structuring the cured and structured material layer.

[0070] The device according to the invention can have the following for the production and / or provision of a second base substrate: a sixth roll for providing a base carrier layer and an unwinder for unwinding the second base carrier layer from the sixth roll; optionally, if the second base substrate to be produced is to have a base layer, a second roll for providing a base layer and an unwinder for unwinding the base layer from the seventh roll; optionally, if a base layer is provided, a fifth roller for bringing the base carrier layer together with the base layer, preferably in such a way that the base carrier layer rests against the second surface side of the base layer and / or that only the base carrier layer rests against the fifth roller, while the base layer does not rest against the fifth roller;optionally, if the base layer does not already carry a base functional layer or if a further base functional layer is to be applied to an already existing base functional layer, a fourth contact layer application device; and optionally, if a base functional layer is to be structured, a fourth contact layer structuring device.;

[0071] The device according to the invention can have a third pair of rollers for combining the second base substrate with a substrate composite that has or consists of the cover substrate and the structural-functional layer. The rollers of the third pair of rollers can be spaced apart from one another to form a gap. The substrate composite obtained in the second process station and the second base substrate can be brought together in the gap. Preferably, the substrate composite rests with its cover carrier layer against one roller of the third pair of rollers, while the base carrier layer of the second base substrate faces the other roller of the third pair of rollers. The third pair of rollers can be used to produce a substrate composite that consists of the second base substrate, a structural-functional layer, and a cover substrate.The device according to the invention can comprise a further pair of calibration rollers for adjusting the thickness of this substrate composite. The device according to the invention can comprise a base substrate structuring device for structuring the base carrier layer of the second base substrate. The base substrate structuring device is preferably arranged after the third pair of rollers. It can be arranged after the further pair of calibration rollers.

[0072] The device according to the invention can have a finishing device for finishing the substrate composite and / or a dicing device for dicing the substrate composite.

[0073] The device according to the invention can have additional processing stations if the substrate composite is to have additional structural-functional layers. A further processing station differs from the first and second processing stations in that the material layer is applied to a different layer, for example, a different structural-functional layer.

[0074] The device according to the invention can have one or more devices for applying one or more electronic components or one or more electronic structures to a layer of the substrate composite during its production. Such a device can be an assembly device, such as a device for pick-and-place assembly. The device can be part of a contact layer application device. The device according to the invention can have a roll for providing an intermediate layer and an unwinder for unwinding the intermediate layer from the roll. It can also have rollers and / or rollers for guiding the intermediate layer and / or for applying it to another layer. The device according to the invention can have one or more devices for applying a polymeric material for sealing or locking gaps.The device according to the invention may comprise one or more devices for forming a vacuum in the gaps. The device according to the invention may further comprise one or more devices for introducing a medium into the gaps.

[0075] The device according to the invention preferably has insertions for the synchronous control of rollers and / or rolls of the device.

[0076] Furthermore, a multilayer substrate composite is provided. The substrate composite comprises at least one base substrate having at least one layer, a cover substrate having at least one layer, and a structural-functional layer located between the base substrate and the cover substrate. The substrate composite is preferably flexible. It is preferably multifunctional. For this purpose, it can have one or more structured functional layers. Further details of the substrate composite have been described above in connection with the method according to the invention. Reference is made to these details to avoid repetition.

[0077] The substrate composite is advantageously produced using the method according to the invention. The substrate composite is preferably produced using a roll-to-roll process.

[0078] The substrate composite can be a precursor or a finished product. A precursor is a substrate composite to which at least one further ply and / or at least one further layer is applied. To apply a further ply and / or a further layer, it can be provided that the base substrate is removed from a substrate composite. After the base substrate has been removed, at least one further ply and / or at least one further layer can be applied to the then exposed surface side of the remaining substrate composite. It can be provided that after the at least one further ply and / or the at least one further layer has been applied, a base substrate is again applied to the substrate composite. A base substrate that is to be removed during the production of a substrate composite advantageously consists only of a base carrier ply.A finished product is a substrate composite to which no further layer and / or ply is applied. The device according to the invention can have more devices for applying layers and / or plies than are required to produce a specific finished product. These devices are then out of function, i.e., inactive. For example, they can be disengaged or pivoted out. The finished product can be guided to a finishing device and / or into a separating device. It is not necessary for it to pass through this device and / or for the feeding to be active.

[0079] The invention enables the production of substrate composites that can fulfill a variety of functions. The invention provides a scalable, continuous roll-to-roll process. Using the method and device according to the invention, significant savings in raw materials, energy, and time can be achieved. Furthermore, the invention enables the production of substrate composites with novel functions that, thanks to their high integration density, can contribute to widespread use.

[0080] The invention enables the production of flexible, multifunctional substrate composites that can have structured multilayer functional layers. The invention provides a method for producing multifunctional substrate composites with structured functional layers using roll-to-roll technology. In particular, the structured multilayer functional layers enable the use of the substrate composites, for example, in fluidics and / or fluid technology, in sensor technology, and in LAB-on-chip solutions. Furthermore, the structured multilayer functional layers can be used to implement functions such as optical effects, decorations, security features, etc.

[0081] The substrate composites can be flexible. However, this is not absolutely necessary. The substrate composite can have the layers and plies explained above in almost any arrangement. The substrate composite can have multiple layers and plies, for example the structural-functional layer. However, with a high number of layers and plies, a substrate composite is created whose thickness is so great that the substrate composite is no longer flexible and thus can no longer be rolled up. Such a substrate composite can, however, be separated from the web and stacked by means of finishing, i.e. cutting to size. It can be provided that the bending loads are gradually reduced as the method according to the invention progresses.

[0082] The invention will be explained in more detail below using exemplary embodiments, which are not intended to limit the invention, with reference to the drawings. Fig. 1 shows a schematic sectional view of a first embodiment of a base substrate having a base carrier layer on which a base functional layer is arranged; Fig. 2 shows a schematic sectional view of a second embodiment of a base substrate having a base layer on which a base functional layer and a base carrier layer are arranged; Fig. 3 shows a schematic sectional view of a first embodiment of a substrate composite having a base substrate and a structural functional layer (Fig. 3A: partial top view; Fig. 3B: partial bottom view); Fig. 4 shows a schematic view of a second embodiment of a substrate composite having a base substrate, a structural functional layer and a cover substrate;4A shows a schematic representation of a third embodiment of a substrate composite having a base substrate, a structural functional layer and a cover substrate, wherein the base substrate has neither a base layer nor a base functional layer; Fig. 5 shows a schematic representation of a fourth embodiment of a substrate composite having a structural functional layer and a cover substrate, but no base substrate; Fig. 6 shows a schematic representation of a fifth embodiment of a substrate composite having a first structural functional layer, a second structural functional layer and a cover substrate; Fig. 7 shows a schematic representation of a sixth embodiment of a substrate composite having a base substrate, a first structural functional layer, a second structural functional layer and a cover substrate; Fig. 8 shows a schematic representation of an embodiment of an apparatus according to the invention for producing the device shown in . Fig. 4 or Fig. 7 shown substrate composite; Fig. 9 a detailed view of a process station of Fig. 8 ; and Fig. 10 a schematic representation of a seventh embodiment of a substrate composite comprising a base substrate, a structural functional layer and a cover substrate in which electronic structures are embedded.

[0083] In the drawings, like reference symbols have the same meaning unless otherwise stated.

[0084] A first embodiment of a base substrate 4 is shown in Fig. 1 shown as a sectional view, with the cutting plane lying transverse to the main extension direction of the base substrate 4. In Fig. 1 The main direction of extension of the base substrate 4 is the surface normal to the paper plane. The base substrate consists of a base carrier layer 3, which has a base functional layer 2, which is a contact layer, on one of its two surface sides. The second surface side of the base carrier layer 3 is exposed.

[0085] In Fig. 2 A second embodiment of a base substrate 4 is shown, which has a base layer 1. The base layer 1 has longitudinal edges 1a, 1b. It also has a first surface side 1c, which in Fig. 2 whose top side is, and a second surface side 1d, which is Fig. 2 its underside. A base functional layer 2, which is a contact layer, is arranged on the first surface side 1c. A base carrier layer 3 is arranged on the second surface side 1d of the base layer 1. The base carrier layer 3 completely covers the second surface side 1d.

[0086] The base substrate 4 can be provided on a roll. To apply a material layer intended for forming a structural-functional layer 9 to the base substrate 4, the base substrate 4 is unwound from the roll. After unwinding the base substrate 4 from the roll, openings can be introduced into the base layer 1 and / or the contact layer 2. Fig. 3 a base substrate 4 is shown, which corresponds to the Fig. 2 corresponds to the embodiment of a base substrate shown, except that additional openings are introduced into the base layer 1 and the contact layer 2.

[0087] The base layer 1 has first through openings 5 ​​and second through openings 6. The contact layer 2 has through openings 7. It is in Fig. 3 It can be seen that the first through openings 5 ​​of the base layer 1 extend from its second surface side 1d to its first surface side 1c, but are closed by the contact layer 2. It is shown in Fig. 3 It can also be seen that the second through-openings 6 of the base layer 1 extend from its second surface side 1d to its first surface side 1c, and through-openings 7 in the contact layer 2 are formed in alignment with the second through-openings 6 of the base layer 1, so that a second through-opening 6 of the base layer 1 and the through-opening 7 in the contact layer 2 aligned therewith form a channel which extends from the second surface side 1d of the base layer 1 to the surface side of the contact layer 2 which faces the structural-functional layer 9. The channel can be used for the supply or removal of media. The first through-opening 5 enables contacting of the contact layer 2 through the base layer 1.

[0088] In Fig. 3 A first embodiment of a substrate composite 8 is shown, which is obtained by applying a material layer to a base substrate 1 unwound from a roll and subsequently structuring the material layer. The first embodiment of the substrate composite 8 is shown in Fig. 3 shown as a sectional view, with the cutting plane lying transverse to the main extension direction of the substrate composite 8. In Fig. 3 the main extension direction of the substrate composite 8 is the surface normal to the paper plane.

[0089] By structuring the applied material layer, the Fig. 3 shown structural-functional layer 9. The material layer has a nominal thickness dn . Positive and negative structural elements were embossed into the material layer using a tool. The material layer was then cured. The cured material layer represents the structural-functional layer 9, which has the embossed positive and negative structural elements 10, 11. The positive and negative structural elements 10, 11 are formed on the first surface side 9a of the structural-functional layer 9, which faces away from the base substrate. The negative structural elements 11a, 11b extend as far as the base substrate 4. The negative structural elements 11a, 11b thus have a residual thickness of zero. The negative structural element 11a is closed by the contact layer 2, while the negative structural element 11b is formed flush with the through opening 7 formed in the contact layer 2.This forms a channel that extends from the first surface side 9a to the second surface side 1d of the base layer 1. The channel can serve as a media opening. The negative structural element 11a thus enables contacting of the contact layer 2.

[0090] It is in Fig. 3 It can be seen that the positive and negative structural elements 10, 11 are macrostructures. A micro- and / or nanostructure 12 is formed in a region of the surface side 9d.

[0091] It is in Fig. 3 It can be seen that the structural-functional layer 9 does not extend over the entire width of the base substrate 4. The base substrate 4 is exposed at its longitudinal edge 1a, which enables contacting of the contact layer 2. On the longitudinal edge 1b of the base substrate 4, however, in a region A that borders the longitudinal edge 1b, openings 13 are formed, which enable contacting of the contact layer 2. Fig. 3a shows a plan view of a section of the substrate composite 8 in the region of openings 13, which enable contacting of the contact layer 2 at the longitudinal edge 1b of the base substrate 4. It can be seen that the openings 13 extend from the first surface side of the structural-functional layer 9 to the contact layer 2, so that regions of the contact layer 2 are accessible from the first surface side of the structural-functional layer 9.

[0092] Openings 14 are formed in the base layer 1 and extend from the second surface side 1d of the base layer 1 to its first surface side 1c. The openings 14 are opposite the openings 13 in the structural-functional layer 9. Fig. 3b shows a view of a section of the substrate composite 8 in the region of openings 14 from below. In the region of the openings 14, the contact layer 2 is exposed, so that contacting is possible. The openings 13, 14 thus enable contacting of both surface sides of the contact layer 2 at the longitudinal edge 1b. No opening is formed in the base carrier layer 3 because the base carrier layer 3 is removed after the substrate composite 8 has been produced or after the cover substrate 15 has been applied.

[0093] The Fig. 4 The second embodiment of a substrate composite shown corresponds to the one in Fig. 3 shown first embodiment, except that a cover substrate 15 is applied to the first surface side 9a of the structural-functional layer 9. In Fig. 4 The structural-functional layer 9 is shown in a simplified manner to facilitate understanding. In particular, the micro- and / or nanostructures 12 and the positive structural elements 10 are not shown.

[0094] The cover substrate 15 has a cover layer 16. The cover layer 16 has longitudinal edges 16a, 16b. It also has a first surface side 16c, which Fig. 4 whose underside is, and a second surface side 16d, which is Fig. 4 its upper side. A cover functional layer 17, which is a contact layer, is arranged on the first surface side 16c. A cover carrier layer 18 is arranged on the second surface side 16d of the cover layer 16. The cover carrier layer 18 completely covers the second surface side 16d.

[0095] The cover substrate 15 can be provided on a roll. To apply the cover substrate 15 to the first surface side 9a of the structural-functional layer 9, the cover substrate 15 is unwound from the roll. After unwinding the cover substrate 15 from the roll, openings can be introduced into the cover layer 16 and / or the contact layer 17. Fig. 4 a cover substrate 15 is shown, in which openings are made in the cover layer 16 and the contact layer 17.

[0096] The cover layer 16 has first through openings 19 and second through openings 20. The contact layer 17 has through openings 21. It is in Fig. 4 It can be seen that the first through openings 19 of the cover layer 16 extend from its second surface side 16d to its first surface side 16c, but are closed by the contact layer 17. It is shown in Fig. 4 It can also be seen that the second through-openings 20 of the cover layer 16 extend from its second surface side 16d to its first surface side 16c, and through-openings 21 are formed in the contact layer 17 in alignment with the second through-openings 20 of the cover layer 16, so that the second through-opening 20 of the cover layer 16 and the through-opening 21 in the contact layer 17 aligned therewith form a channel that extends from the second surface side 16d of the cover layer 16 to the surface side of the contact layer 17 that faces the structural-functional layer 9. The channel can be used to supply or remove media. The first through-opening 19 enables contacting of the contact layer 17 through the cover layer 16.

[0097] The cover substrate 15 is applied to the structure-functional layer 9 in such a way that its cover-functional layer 17 faces the outer structure-functional layer. Fig. 4 Contact layer 17 of the first surface side 9a faces the structural-functional layer 9. The cover substrate 15 is applied in such a way that it only contacts first regions 22 of the first surface side 9a, while it does not contact second regions 23 of the first surface side 9a. As a result, gaps 24 are formed between the second regions 23 of the first surface side 9a and the contact layer 17 of the cover substrate 15. The first regions 22 correspond to positive structural elements 10, and the second regions 23 correspond to negative structural elements 11.

[0098] Fig. 4a illustrates a third embodiment of a substrate composite, which is similar to that shown in Fig. 4 corresponds to the second embodiment shown, except that the base substrate 4 consists only of the base carrier layer 3. The base carrier layer 3 can be removed after completion of the substrate composite 8 or the application of the cover substrate 15. The structural functional layer 9 has thus been formed directly on the base carrier layer 3 by applying the material layer, structuring the material layer, and fixing or curing the structured material layer.

[0099] The third embodiment can be a precursor product that corresponds to the Fig. 5 can be subjected to the further processing described. In contrast, the second embodiment is a final product that, due to its internal structural-functional layer 9, can be used, for example, for sensor and / or fluidic applications.

[0100] The Fig. 5 The fourth embodiment of a substrate composite shown corresponds to the Fig. 4a shown third embodiment, except that the base substrate has been removed. This exposes the second surface side 9b of the structural-functional layer 9. It is thus accessible for further processing, the result of which is Fig. 6 shown. The Fig. 6 The embodiment of the substrate composite shown is a multi-layer multifunctional substrate composite.

[0101] The Fig. 6 The fifth embodiment of a substrate composite shown corresponds to the Fig. 5 shown fourth embodiment, except that the substrate composite 8 has a second structural-functional layer 9' in addition to the first structural-functional layer 9. In Fig. 6 Reference symbols having an overline denote features of the second structural-functional layer 9', the meaning of which corresponds to that of the reference symbols of the same number used in connection with the first structural-functional layer 9.

[0102] To form the second functional layer 9', a further material layer is applied to the exposed, second surface side 9b of the first structural functional layer 9. This material layer is then subjected to structuring, as already described in connection with the first structural functional layer 9. The structured material layer is then subjected to fixing and / or curing. Just like the first structural functional layer 9, the second structural functional layer 9 can have micro- and / or nanostructures.

[0103] It is in Fig. 6 It can be seen that the second structural-functional layer 9' rests with its second surface side 9b' against the second surface side 9b of the first structural-functional layer 9. The first surface side 9a' of the second structural-functional layer 9' is exposed. Fig. 6 It can also be seen that negative structural elements 11a, which are formed in the first structural-functional layer 9, are formed in alignment with the negative structural elements 11a' in the second structural-functional layer 9'. This allows, for example, media to be guided through the first and second structural-functional layers. A base substrate 4" can now be applied again to the second surface side 9a' of the second structural-functional layer 9', as shown in Fig. 7 is shown.

[0104] The Fig. 7 The sixth embodiment of a substrate composite shown corresponds to the one shown in Fig. 6 shown fifth embodiment, except that the substrate composite 8 additionally has a base substrate 4". In Fig. 7 Reference symbols having two upper bars indicate features of the base substrate 4", the meaning of which corresponds to the reference symbols of the same number used in connection with the Fig. 3 base substrate 4 shown in Figure 1. The Fig. 7 The base substrate 4" shown has the same structure as the one in Fig. 3 shown base substrate 4. The base substrate 4" is provided on a roll and unwound from this roll in order to apply it to the first surface side 9a' of the second structural-functional layer 9'. The Fig. 7 The substrate composite shown is a multi-layer, multifunctional substrate composite and a finished product. It can offer a variety of application-specific functions that are integrated into the smallest space and are fully encapsulated. The substrate composite is ready for immediate use. Fig. 7 The embodiment shown can be obtained, for example, from the Fig. 4a shown precursor product.

[0105] The base substrate 4" is applied to the second structural-functional layer 9' such that its contact layer 2" faces the first surface side 9a' of the second structural-functional layer 9'. The base substrate 4" is applied such that it only contacts first regions 22' of the first surface side 9a', while it does not contact second regions 23' of the first surface side 9a'. As a result, gaps 24' are formed between the second regions 23' of the first surface side 9a' and the contact layer 2" of the base substrate 4". The first regions 22' correspond to positive structural elements 10', and the second regions 23' correspond to negative structural elements 11'.

[0106] The Fig. 8 Device 51 shown can be used to produce the Fig. 7 shown embodiment of a substrate composite 8. However, the device can easily be adapted to the production of another embodiment of a substrate composite. The Fig. 8 The arrows shown indicate the direction of movement of the substrate tracks.

[0107] For the production of the Fig. 7 In the substrate composite 8 shown, the base carrier layer 3 is provided on a first roll 52. A base layer 1 is provided on a second roll 53. The base layer 1 can already carry a contact layer 2 when it is wound onto the second roll 53. The base carrier layer 3 and the base layer 1 are unwound from the rolls 52 and 53 by means of an unwinder for the roll 52 and by means of an unwinder for the roll 53 and brought together at the first roller 54 such that the base carrier layer 3 rests against the second surface side 1d of the base layer 1. In this case, only the base carrier layer 3 rests against the first roller 54, while the base layer 1 does not rest against the first roller 54.If the base layer 1 does not already bear the contact layer 2, or if a further contact layer is to be applied to the contact layer 2, a contact layer can be applied by means of a first contact layer application device 55 following the first roller 54 and structured by means of a first contact layer structuring device 56. Otherwise, the second contact layer application device 65 and the second contact layer structuring device 66 are inoperative. The base substrate 4 is thus formed. The base substrate 4 now enters a first process station. In . Fig. 8 The entry to the first process station is marked with the designation "P1".

[0108] In addition to or alternatively to the first contact layer application device 55 and / or the first contact layer structuring device 56, a device for pick-and-place assembly of one or more electronic components and / or one or more electronic structures can be provided. The pick-and-place assembly device is preferably arranged upstream of the process station. By means of the pick-and-place assembly device, one or more electronic components and / or one or more electronic structures can be embedded in the base layer. The pick-and-place assembly device can be followed by a device for applying a polymeric material for sealing or locking gaps, a device for forming a vacuum in gaps, or a device for introducing a medium into the gaps, which are also arranged upstream of the process station.

[0109] In the first process station, the structural functional layer 9 is formed. For this purpose, a material layer is applied to the base substrate 4 by means of a first application device 57. The structuring of the material layer is then carried out using a first tool roller 58, with the aid of which a macrostructure and, if provided, a microstructure and / or nanostructure are imprinted on the surface side of the material layer facing the tool roller 58. The structured material layer can then be fixed and / or hardened by means of optical radiation. For this purpose, a first radiation source, referred to as the internal radiation source 59, and / or a second radiation source, referred to as the external radiation source 60, can be arranged outside the tool roller 58 (see also Fig. 9 If a first radiation source 59 is provided, the first tool roller 58 has a portion against which the material layer rests and which is permeable to the optical radiation. If a second radiation source 60 is provided, the base substrate 4 should be permeable to the optical radiation.

[0110] The substrate composite now consists of the base substrate 4 and a cured and structured material layer, which represents the first structural-functional layer 9. It can now be provided that this substrate composite is then guided to a first structuring device 61, in which the cured and structured material layer undergoes further structuring. However, this is not absolutely necessary. The first structuring device 61 is then deactivated. The substrate composite now leaves the first process station. Fig. 8 the exit from the first process station is marked with the designation "P1'".

[0111] Following the first process station, the cover substrate 15 is applied to the first structural-functional layer 9 in such a way that the cover substrate 15 faces the first structural-functional layer 9.

[0112] To produce the cover substrate 15, the cover carrier layer 18 is provided on a third roll 62. The cover layer 16 is provided on a fourth roll 63. The cover layer 16 can already carry a contact layer 17 when it is wound onto the fourth roll 63. The cover carrier layer 18 and the cover layer 16 are unwound from the rolls 62 and 63 by means of an unwinder for the roll 62 and by means of an unwinder for the roll 63 and brought together at the second roller 64 such that the cover carrier layer 18 rests against the second surface side 16d of the cover layer 16. In this case, only the cover carrier layer 18 rests against the second roller 64, while the cover layer 16 does not rest against the second roller 64.If the cover layer 16 does not already bear the contact layer 17, or if another contact layer is to be applied to the contact layer, a contact layer can be applied by means of a second contact layer application device 65 following the second roller 64 and structured by means of a second contact layer structuring device 66. Otherwise, the second contact layer application device 65 and the second contact layer structuring device 66 are deactivated. The cover substrate 15 is thus formed. The cover substrate 15 now passes to a first pair of rollers 67.

[0113] In addition to or alternatively to the second contact layer application device 65 and / or the second contact layer structuring device 66, a device for pick-and-place assembly of one or more electronic components and / or one or more electronic structures can be provided. The pick-and-place assembly device is preferably arranged upstream of the first roller pair 67. By means of the pick-and-place assembly device, one or more electronic components and / or one or more electronic structures can be embedded in the cover layer. The pick-and-place assembly device can be followed by a device for applying a polymeric material for sealing or locking gaps, a device for forming a vacuum in gaps, or a device for introducing a medium into the gaps, which are also arranged upstream of the first roller pair.

[0114] The rollers of the first roller pair 67 are spaced apart from one another, forming a gap. The substrate assembly obtained in the first process station and the cover substrate 15 are brought together in the gap. The substrate assembly rests with its base carrier layer 3 against one roller of the roller pair 67, while the cover carrier layer 18 faces the other roller of the roller pair 67. The first roller pair 67 produces a substrate assembly consisting of a base substrate 4, a first structural-functional layer 9, and a cover substrate 15. This substrate assembly can then pass through a pair 68 of calibration rollers, although this is not absolutely necessary. In the latter case, the pair 68 of calibration rollers is inoperative. The thickness of the substrate assembly can be adjusted using the calibration rollers.Following the pair 68 of calibration rollers, the substrate assembly can pass through a cover substrate structuring device 69, in which the cover carrier layer 18 can be subjected to structuring. If no structuring of the cover carrier layer 18 is planned, the cover substrate structuring device 69 is deactivated.

[0115] For the production of the Fig. 7 After the substrate assembly 8 shown, the base substrate 4 is subsequently removed from the substrate assembly, which has passed the first pair of rollers 67 and, if provided, the pair 68 of calibration rollers (arrow A). If the base substrate 4 is removed, it may be sufficient for the base substrate to consist only of the base carrier layer 3. To remove the base substrate 4, the substrate assembly is guided over a third roller 70 and a fourth roller 71 to a second pair of rollers 72, where the base substrate 4 is separated from the substrate assembly. The base substrate 4 is wound onto a fifth roll 73 by means of a winder. The remaining substrate assembly consists only of the first structural-functional layer 9 and the cover substrate 15. Following the second pair of rollers 72, a contact layer can optionally be applied to the remaining substrate assembly by means of a third contact layer application device 74.This optional contact layer is applied to the second surface side 9b of the first structural-functional layer 9, so that it will later be arranged between the first and second structural-functional layers 9, 9'. The optional contact layer can be structured using a third contact layer structuring device 75. If no optional contact layer is applied, the third contact layer application device 74 and the second contact layer structuring device 66 are inoperative.

[0116] The second structural-functional layer 9' is now formed on the second surface side 9b of the first structural-functional layer 9 or, if it bears a contact layer, on the contact layer. For this purpose, a material layer is applied to the second surface side 9b of the first structural-functional layer 9 or, if it bears a contact layer, to the contact layer using a second application device 76. The material layer is structured using a second tool roller 77, with the aid of which a macrostructure and, if provided, a microstructure and / or nanostructure are impressed on the surface side of the material layer facing the second tool roller 77. The structured material layer can then be fixed and / or hardened using optical radiation.For this purpose, a first radiation source, referred to as the inner radiation source 78, can be arranged inside the second tool roller 77 and / or a second radiation source, referred to as the outer radiation source 79, can be arranged outside the tool roller (see also . Fig. 9 If an internal radiation source 78 is provided, the second tool roller has a section against which the material layer rests and which is permeable to the optical radiation. If an external radiation source 79 is provided, the cover substrate 15 should be permeable to the optical radiation.

[0117] The substrate composite, which now consists of the cover substrate 15, the first structural-functional layer 9 and the second structural-functional layer 9', now leaves the second process station. In Fig. 8 The exit of the second process station is marked "P2'". The base substrate 4" is now applied to this substrate composite.

[0118] To produce the second base substrate 4", the base carrier layer 3" is provided on a sixth roll 80. A base layer 1" is provided on a seventh roll 81. The base layer 1" can already carry a contact layer 2" when wound onto the seventh roll 81. The base carrier layer 3" and the base layer 1" are each unwound from the rolls 80 and 81 by means of an unwinder for the roll 80 and an unwinder for the roll 81 and brought together at the fifth roll 82 such that the base carrier layer 3" rests against the second surface side 1d" of the base layer 1". Only the base carrier layer 3" rests against the fifth roll 82, while the base layer 1" does not rest against the fifth roll 82.If the base layer 1" does not already bear the contact layer 2" or if a further contact layer is to be applied to the contact layer 2", a contact layer can be applied by means of a fourth contact layer application device 83 following the fifth roller 82 and structured by means of a fourth contact layer structuring device 84. Otherwise, the fourth contact layer application device 83 and the fourth contact layer structuring device 84 are deactivated. The second base substrate 4" is thus formed. The base substrate 4" passes to a third pair of rollers 85.

[0119] In addition to or alternatively to the fourth contact layer application device 83 and / or the fourth contact layer structuring device 84, a device for pick-and-place assembly of one or more electronic components and / or one or more electronic structures can be provided. The pick-and-place assembly device is preferably arranged in front of the third roller pair 85. By means of the pick-and-place assembly device, one or more electronic components and / or one or more electronic structures can be embedded in the base layer 1". The pick-and-place assembly device can be followed by a device for applying a polymeric material for sealing or locking gaps, a device for forming a vacuum in gaps, or a device for introducing a medium into the gaps, which are also arranged in front of the third roller pair 85.

[0120] The rollers of the third roller pair 85 are spaced apart from one another to form a gap. In the gap, the substrate composite obtained in the second process station and the second base substrate 4" are brought together. The substrate composite rests with its cover carrier layer 18 against one roller of the roller pair 85, while the base carrier layer 3" faces the other roller of the roller pair 85. By means of the third roller pair 85, a substrate composite is obtained which consists of the second base substrate 4", the second structural-functional layer 9", the first structural-functional layer 9 and the cover substrate 15. The substrate composite produced in this way is the Fig. 7 The substrate composite 8 shown in FIG. The substrate composite can now pass through a pair 86 of calibration rollers, although this is not absolutely necessary. The thickness of the substrate composite can be adjusted using the calibration rollers. Subsequently, the substrate composite 8 can be subjected to finishing in a finishing device and / or dicing in a separating device 87.

[0121] If, however, the first base substrate 4 is not to be removed from the substrate composite obtained in the first process station after leaving the first process station (see arrow B in Fig. 8 ), the substrate composite obtained in the first process station, which is in Fig. 4 shown, directly to the assembly device to be subjected to assembly there, and / or to the separating device 87 to be subjected to dicing there. A second base substrate 4" is then not applied in the third pair of rollers. The third pair of rollers 85 and the pair 86 of calibration rollers are without function in this case.

[0122] Fig. 9 illustrates one of the Fig. 8 The structure and operation of both process stations are explained below using the first process station as an example. The second process station has the same structure and operates the same way. It differs from the first process station only in that the material layer is applied to a different substrate web.

[0123] In the first process station P1, the structural functional layer 9 is formed. For this purpose, a substrate web, which is the base substrate, is guided into the first process station (arrow E). The substrate web is guided past the first application device 57 via a roller 88, against which it rests with the base carrier layer 3. A material layer is applied to the substrate web by means of the first application device 57. The structuring of the material layer is then carried out using a first tool roller 58, with the aid of which a macrostructure and, if provided, a micro- and / or nanostructure is imprinted on the surface side of the material layer facing the tool roller 58. The direction of rotation of the tool roller 58 is Fig. 9 indicated by arrow D. Rollers 89 and 90 are provided to guide the substrate web along the tool roller 58, which only contact the substrate web at its base carrier layer 3. The structured material layer on the substrate web is then fixed and / or hardened by means of optical radiation. For this purpose, a first radiation source, referred to as the inner radiation source 59, is arranged inside the tool roller 58, and / or a second radiation source, referred to as the outer radiation source 60, is arranged outside the tool roller 58. If a first radiation source 59 is provided, the first tool roller 58 has a section against which the material layer rests and which is permeable to the optical radiation. If a second radiation source 60 is provided, the substrate web should be permeable to the optical radiation.Optical radiation can be ultraviolet radiation (UV), visible light (VIS), infrared radiation (IR) and combinations of these radiations.

[0124] The first radiation source 59 offers the advantage that all rays impinge on the material layer at right angles. For this purpose, the first radiation source 59 is preferably arranged on the rotational axis of the tool roller 58. Fig. 9 The radiation cone of the first radiation source 59 is marked with the letter "F". The second radiation source 60 offers the advantage of being technically easier to implement because it is not located in the tool roller 58, but outside it. Fig. 9 the radiation cone of the second radiation source 60 is marked with the letter "G".

[0125] After passing the tool roller 58, the substrate web, which now contains the structural-functional layer 9 obtained by means of the tool roller 58 and one or both radiation sources 59, 60, can be guided to an optional structuring device 61 and / or an optional post-processing device. Using the optional structuring device 61, the structural-functional layer 9 can be subjected to further structuring. Using the post-processing device, the structural-functional layer 9 or the entire substrate web, including the structural-functional layer, can be subjected to heat treatment (annealing). The substrate web finally exits the first process station (arrow E).

[0126] In connection with Fig. 8 is the production of Fig. 7 sixth embodiment shown in Figure 1. The Fig. 8 However, the device shown can also be used to produce other embodiments of the substrate composite. Elements, units, and / or stations not required for the production of the respective substrate composite are either inoperative or may be completely missing.

[0127] The Fig. 8 Device 51 shown can thus be used to produce the Fig. 4a The third embodiment of the substrate composite 8 shown can be used. The third embodiment has no base layer 1 and no base functional layer 2, so that the base substrate 4 consists only of the base carrier layer 3. The second roll 53 is thus inoperative. The base carrier layer 3 is provided on the first roll 52. The base carrier layer 3 is unwound from the roll 52 by means of the unwinder for the roll 52. It can be guided over the first roller 54. However, the first roller 54 is not required for joining layers of the base substrate 4. It can therefore also be inoperative. A contact layer 2 is not applied. The first contact layer application device 55 and the first contact layer structuring device 56 are thus inoperative. The base substrate 4, which consists only of the base carrier layer 3, now enters the first process station. In Fig. 8 The entry to the first process station is marked with the designation "P1".

[0128] In the first process station, the structural functional layer 9 is formed. For this purpose, a material layer is applied to the base substrate 4 by means of the first application device 57. The structuring of the material layer is then carried out using the first tool roller 58, with the aid of which a macrostructure and, if provided, a microstructure and / or nanostructure are imprinted on the surface side of the material layer facing the tool roller 58. The structured material layer can then be fixed and / or hardened by means of optical radiation. For this purpose, a first radiation source, referred to as the internal radiation source 59, and / or a second radiation source, referred to as the external radiation source 60, can be arranged outside the tool roller 58 (see also Fig. 9 If a first radiation source 59 is provided, the first tool roller 58 has a portion against which the material layer rests and which is permeable to the optical radiation. If a second radiation source 60 is provided, the base substrate 4 should be permeable to the optical radiation.

[0129] The substrate composite now consists of the base substrate 4 and a cured and structured material layer, which represents the first structural-functional layer 9. It can now be provided that this substrate composite is guided to the first structuring device 61, in which the cured and structured material layer undergoes further structuring. However, this is not absolutely necessary. The first structuring device 61 is then deactivated. The substrate composite now leaves the first process station. Fig. 8 the exit from the first process station is marked with the designation "P1'".

[0130] Following the first process station, the cover substrate 15 is applied to the first structural-functional layer 9 in such a way that the cover substrate 15 faces the first structural-functional layer 9.

[0131] To produce the cover substrate 15, the cover carrier layer 18 is provided on the third roll 62. The cover layer 16 is provided on the fourth roll 63. The cover layer 16 can already carry a contact layer 17 when it is wound onto the fourth roll 63. The cover carrier layer 18 and the cover layer 16 are unwound from the rolls 62 and 63 by means of an unwinder for the roll 62 and by means of an unwinder for the roll 63 and brought together at the second roller 64 such that the cover carrier layer 18 rests against the second surface side 16d of the cover layer 16. In this case, only the cover carrier layer 18 rests against the second roller 64, while the cover layer 16 does not rest against the second roller 64.If the cover layer 16 does not already bear the contact layer 17, or if another contact layer is to be applied to the contact layer 17, a contact layer can be applied by means of the second contact layer application device 65 following the second roller 64 and structured by means of the second contact layer structuring device 66. Otherwise, the second contact layer application device 65 and the second contact layer structuring device 66 are deactivated. The cover substrate 15 is thus formed. The cover substrate 15 now passes to the first pair of rollers 67.

[0132] In the nip of the first roller pair 67, the substrate assembly obtained in the first process station and the cover substrate 15 are brought together. The substrate assembly rests with its base carrier layer 3 against one roller of the roller pair 67, while the cover carrier layer 18 faces the other roller of the roller pair 67. The first roller pair 67 produces a substrate assembly consisting of a base substrate 4, a first structural-functional layer 9, and a cover substrate 15. This substrate assembly can now pass the pair 68 of calibration rollers, although this is not absolutely necessary. In the latter case, the pair 68 of calibration rollers is inoperative. The thickness of the substrate assembly can be adjusted using the calibration rollers.Following the pair 68 of calibration rollers, the substrate assembly can pass through a cover substrate structuring device 69, in which the cover carrier layer 18 can be subjected to structuring. If no structuring of the cover carrier layer 18 is intended, the cover substrate structuring device 69 is deactivated. Thus, the process shown in . Fig. 4a The substrate assembly can be guided along arrow B directly to the finishing device for finishing there, and / or to the dicing device 87 for dicing there. The pair of rollers 85 and the pair 86 of calibration rollers are without function. Likewise, the elements of the device located at arrow A are without function.

[0133] However, it can alternatively be provided that the base substrate 4 is removed from the third embodiment of the substrate composite 8. For this purpose, the substrate composite is guided over the third roller 70 and over the fourth roller 71 to the second pair of rollers 72, where the base substrate 4, which consists only of the base carrier layer 3, is separated from the substrate composite. The base carrier layer 3 is wound onto the fifth roller 73 by means of the winder. The remaining substrate composite consists only of the first structural-functional layer 9 and the cover substrate 15. After the base substrate has been removed, the remaining substrate composite can then be subjected to assembly in the assembly device and / or dicing in the singulating device 87. The second process station is then without function.

[0134] However, it can also be provided that after the removal of the base substrate 4, a second structural-functional layer 9' and a second base substrate 4" are applied to the remaining substrate composite. In this case, the Fig. 7 The sixth embodiment shown can be obtained. This can be done as described above in connection with the production of the seventh embodiment starting with the second pair of rollers 72.

[0135] The Fig. 10 The seventh embodiment shown corresponds to the one in Fig. 4 shown second embodiment, except that electronic component(s) and / or electronic structure(s) are arranged in the cover layer 16. In the example shown, the electronic components are a base board (English: electronic board) which is equipped with further, preferably active electronic components. The base board and the further electronic components arranged on it each form an electronic structure 27. It is in Fig. 10 It can be seen that the electronic structures 27 are embedded in the cover substrate 15. The electronic structures 27 lie between the cover functional layer 17 and the cover carrier layer 18.

[0136] An intermediate layer 28 is provided between the cover functional layer 17 and the cover carrier layer 18. Recesses in the intermediate layer 28 are formed, in which the electronic structures 27 are arranged. The intermediate layer 28 forms a lock or seal. It seals off the recesses at the longitudinal edges of the cover layer 16. It also seals off the recesses from the openings 19, 20. The gaps 29 formed in the cover layer 16 between the electronic structures 27 and the cover functional layer 17, as well as between the electronic structures 27 and the cover carrier layer 18, can be filled, for example, with a medium, with a vacuum, or with a polymeric material. List of reference symbols

[0137] 1Base layer 1aLongitudinal edge 1bLongitudinal edge 1cFirst surface side 1dSecond surface side 2Base functional layer (contact layer) 3Base carrier layer 4Base substrate 5First through-opening 6Second through-opening 7Through-opening 8Substrate composite 9Structural-functional layer 9aFirst surface side of the structural-functional layer 9bSecond surface side of the structural-functional layer 10Positive structural element 11Negative structural element 11aNegative structural element with zero residual thickness 11bNegative structural element with zero residual thickness 12Micro- and / or nanostructure 13Opening 14Opening 15Cover substrate 16Cover layer 16aLongitudinal edge 16bLongitudinal edge 16cFirst surface side 16dSecond surface side 17Cover functional layer (contact layer) 18Cover carrier layer 19First through-opening 20Second through-opening 21Through-opening 22First area 23Second area 24Gap 25Baseboard 26Electronic component 27Electronic structure 28Intermediate layer 29Gap 51Device 52First roller 53Second roller 54First roller 55 Contact layer application device 56 Contact layer structuring device 57 Application device 58 First tool roller 59 Internal radiation source 60 External radiation source 61 First structuring device 62 Third roller 63 Fourth roller 64 Second roller 65 Contact layer application device 66 Contact layer structuring device 67 First pair of rollers 68 Pair of calibration rollers 69 Cover substrate structuring device 70 Third roller 71 Fourth roller 72 Second pair of rollers 73 Fifth roller 74 Contact layer application device 75 Contact layer structuring device 76 Second application device 77 Second tool roller 78 Internal radiation source 79 External radiation source 80 Sixth roller 81 Seventh roller 82 Fifth roller 83 Contact layer application device 84Contact layer structuring device 85Third roller pair 86Pair of calibration rollers 87Separating device 88Roller 89Roller 90Roller

Claims

1. A method for the preparation of a multi-ply substrate composite (8) which has at least one base substrate (4) having at least one ply (1, 3), one top substrate (15) having at least one ply (16, 18), one structure functional layer (9) lying in between the base substrate (4) and the top substrate (15) and one electronic structure (27), wherein for the preparation of the multi-ply substrate composite (8) at least one of the plies (1, 3) of the base substrate (4) is provided on a roller; at least one of the plies (16, 18) of the top substrate (15) is provided on a roller; a material layer is applied to the base substrate (4) to form a structure functional layer (9) and the applied material layer is subjected to a structuring; characterized in that the material layer is structured by means of a first tool (58) to form a macrostructure (10, 11) and that micro and / or nanostructures (12) are formed on the macrostructures (10, 11) by means of structuring.

2. The method according to claim 1, characterized in that micro and / or nanostructures (12) are formed on the macrostructures (10, 11) by means of the structuring.

3. The method according to claim 1 or claim 2, characterized in that the base substrate (4) has a base ply (1) which bears one or more base functional layers (2) on a first surface side and / or bears a base carrier ply (3) on a second surface side.

4. The method according to claim 1 or claim 2, characterized in that the base substrate (4) has a base carrier ply (3) which bears one or more base functional layers (2) on a first surface side.

5. The method according to claim 3 or claim 4, characterized in that the material layer is applied onto the surface side of the base substrate (4) facing away from the base carrier ply (3).

6. The method according to any of the preceding claims, characterized in that macrostructures (10, 11) are formed on both surface sides (9a, 9b) of the structure functional layer (9) by means of the structuring.

7. The method according to any of the preceding claims, characterized in that to form the micro and / or nanostructures (12) a material film is applied onto one or more of the macrostructures (10, 11) which is structured by means of a second tool to form the micro and / or nanostructures (12).

8. The method according to any of the preceding claims, characterized in that the top substrate (15) is applied onto the structure functional layer (9).

9. The method according to claim 8, characterized in that subsequent to the formation of the structure functional layer (9) the base substrate (4) is removed from the structure functional layer (9) thereby exposing a surface side (9b) of the structure functional layer (9).

10. The method according to claim 9, characterized in that a further material layer is applied to the exposed surface side of the structure functional layer (9) to form a further structure functional layer (9') and the further material layer is subjected to a structuring.

11. The method according to claim 10, characterized in that the further material layer is structured by means of a second tool (77) to form at least one positive structural element (10') and / or at least one negative structural element (11').

12. The method according to claim 10 or claim 11, characterized in that a base substrate (4") is applied to a surface side of the further structure functional layer (9').

13. A device (51) for the preparation of a multi-ply substrate composite (8) which has at least one base substrate (4) having at least one ply (1, 3), one top substrate (15) having at least one ply (16, 18), one structure functional layer (9, 9') lying in between the base substrate (4) and the top substrate (15), and one electronic structure (27), wherein the device (51) has: - at least one roller (52, 53) for providing a ply (1, 3) of the base substrate (4); - at least one roller (62, 63) for providing one of the plies of the top substrate (15); and - a means for forming a structure functional layer (9, 9') on the base substrate (4), wherein the means has at least one application means (57, 76) for applying a material layer to the base substrate (4) or to a structure function layer (9) and at least one tool (58, 77) for structuring the applied material layer, wherein the tool is a toll for forming macrostructures and thereafter micro and / or nanostructures on the macrostructures or the tool is a tool for forming macrostructures and the device (51) has a further tool for forming micro and / or nanostructures on the macrostructures.

14. The device according to claim 13, characterized in that the tool (58, 77) is a tool roll for embossing a structure of the material layer.

15. The device according to claim 13 or claim 14, characterized in that it has a radiation source (59, 60, 78, 79) for fixing and / or curing the material layer by means of an optical radiation, wherein the radiation source is arranged inside (59, 78) or outside (60, 79) of the tool roll.