LASER PROCESSING DEVICE FOR SHIELDED CABLES AND METHOD FOR OPERATING A LASER PROCESSING DEVICE FOR SHIELDED CABLES

Description

[0001] The invention relates to embodiments of a laser processing device for shielded cables and embodiments of a method for operating such a laser processing device.

[0002] It is known to process shielded cables, such as electrical cables, using laser radiation, for example, to cut around the cable sheath or to automatically cut the shielding braid of the shielded cable to size. In this process, an end section of the shielded cable to be processed is inserted through an opening into the process chamber of a laser processing device, such as a laser cutting device. The laser processing then takes place in the process chamber. For safety reasons, it is important that the operator's area is isolated from the laser process, meaning that no laser radiation hazardous to humans can escape from the process chamber into the operator's area.

[0003] Typically, a protective hood designed for the respective laser class is placed over the laser processing device during operation, or the laser processing device is enclosed within the protective hood, which surrounds it on all sides. The protective hood must be sufficiently large to accommodate the internal mechanics, which may include a gripping device for centering the shielded cable in the process chamber. Due to the resulting relatively large design, the installation space required for such a solution is relatively high. Furthermore, this approach has disadvantages regarding the dynamics and thus the cycle time of the (repeatedly executed) laser processing process.

[0004] EP 3 404 786 A1 describes, with reference to the one there Fig. 6 A laser cutting device with a protective housing. The protective housing includes an opening that is closed by a mounting housing. The mounting housing includes an opening through which a cable end is accessible to the laser processing the cable end via a cable entry opening in the laser cutting device. The cable entry opening is designed as a through-hole, within which the cable sheath has a small clearance to the inner wall of the through-hole, so that the cable must be positioned very precisely with respect to the through-hole. A sealing device may be incorporated between the protective housing and the mounting housing to prevent the escape of gases or particles through the opening of the protective housing.

[0005] US Patent 9,876,338 B2 describes a device for stripping an electrical cable. The device includes a gripper for the cable, which is positioned in front of the opening of a process chamber for a laser cutting process. An elastic cuff surrounding the cable seals an inlet opening of the process chamber, so that the cable and the elastic cuff together prevent laser radiation from escaping the device.

[0006] EP 3 404 786 A1 describes, with reference to Fig. 4B and Fig. 6 , a laser processing device according to the preamble of claim 1.

[0007] The previously known solutions for the safety shielding of a laser processing device have the disadvantage that they make it difficult to repeatedly execute the laser processing process at a high cycle rate, since the speed at which the cable can be inserted into the process chamber is limited by the respective mechanical sealing mechanisms of the process chamber.

[0008] The object of the present invention is to propose a laser processing device for a shielded cable in which the escape of dangerous laser radiation is reliably prevented and which at the same time enables a dynamic repeated execution of the laser processing process.

[0009] Based on this, the subject matter of independent claim 1 is proposed. Features of some embodiments are specified in the dependent claims. The features of the dependent claims can be combined with one another to form further embodiments, unless expressly stated otherwise.

[0010] According to a first aspect, a laser processing device for shielded cables comprises: a process chamber for processing an end section of a shielded cable arranged therein by means of laser radiation, wherein a housing of the process chamber defines an opening for inserting the end section along an insertion axis; and a gripping device for fixing the shielded cable in the opening in a processing position of the laser processing device, wherein the end section extends into the process chamber in the processing position. The gripping device is positioned without contact with the housing in the processing position.The gripping device comprises a first projecting section which, in the processing position of the laser processing device, extends at least section by section into the opening along the insertion axis, wherein in the processing position the first projecting section fills the opening to such an extent that a continuous sealing gap remains between the gripping device and the housing, and wherein, according to the invention, the gripping device further completely covers the opening in one direction along the insertion axis in the processing position.

[0011] The invention is based on the idea that, in a laser processing device for shielded cables, a gripping device can simultaneously perform the functions of fixing or positioning a cable section to be processed in an opening of a process chamber and sealing the process chamber to prevent the escape of laser scatter radiation. Thus, the gripping device can perform both a process function, which can include, in particular, centering the cable end in the process chamber, and a protective function (protecting the operator's environment from laser radiation). The combination of these two functions in a single component allows for savings in installation space, material, and therefore costs compared to solutions where a separate system is provided for each of these functions. In particular, the mechanical effort required for a large enclosure with a protective hood can be eliminated.

[0012] Furthermore, the solution proposed here can enable a shorter cycle time for a repeatedly executed laser processing process; because with conventional solutions, where two different systems are needed for the process and protection functions described above, these systems cannot always be run in parallel for mechanical reasons, which leads to an increase in cycle time.

[0013] The fact that the gripping device is positioned without contact with the housing in the processing position according to the invention further contributes to a potentially shorter cycle time of the laser processing process. This is because the laser processing device is not "moved to a stop," meaning that when the processing position is established, during which a relative movement takes place between the process chamber and the gripping device with the end section of the shielded cable, there is no direct contact between the gripping device and the housing of the process chamber. The relative movement, in which the gripping device and housing approach each other, can therefore be executed dynamically and potentially faster overall than in solutions where contact is provided between the gripping device and the process chamber housing (which requires very precise position control during the approach to prevent damaging collisions).

[0014] Because the gripping device comprises a first projecting section which, for example, extends (compared to other sections of the gripping device) along the insertion axis towards the opening and which, in the processing position of the laser processing device, extends at least sectionally along the insertion axis into the opening, the emission of harmful laser radiation can be reliably prevented even with non-contact positioning of the gripping device on the housing of the process chamber, if, according to the invention, the gripping device completely covers the opening in one direction along the insertion axis in the processing position.In particular, a radial sealing gap remaining between the first projection section and the housing can form a gap seal, wherein the gap seal forms part of a "labyrinth seal" in which the laser radiation is dissipated, so that at most a greatly reduced and therefore harmless laser intensity escapes to the outside. For example, it can be provided that the sealing gap changes its direction by at least 90° at least once, preferably several times. This is explained in more detail below with reference to an exemplary embodiment.

[0015] Some embodiments are described below:

[0016] The laser processing device can be, in particular, a laser cutting device. For example, the laser cutting device can be configured to cut a shield wire braid to size in the area of ​​the end section of the shielded cable. For this purpose, the laser processing device can, for example, include a laser device, such as a fiber laser, for providing (generating) suitable laser radiation. The laser radiation can, for example, selectively act on metal and thus selectively cut (only) metallic sections of the shielded cable. A laser beam provided by the laser processing device is deflected within the process chamber by deflecting mirrors so that the deflected laser beam cuts the material to be processed, possibly with a fiber optic cable.The laser beam cuts concentrically around the cable axis, thus circumscribing the stripped end of the cable's end section; this applies both when the laser beam is intended to cut the cable sheath surrounding the cable and when the laser beam is intended to cut a metallic braided shield, the braid being accessible after removing the cable sheath.

[0017] The gripping device can, for example, comprise two or more sections that can be joined together to assume a gripping position in which the gripping device grasps the shielded cable. These sections of the gripping device are subsequently also referred to as (gripper) jaws. For example, in the gripping position of the device, the shielded cable can be clamped by the joined jaws in a guide formed, for instance, by corresponding recesses in the jaws. This allows the gripping device to simultaneously perform a positioning / centering function and—together with the shielded cable—a sealing function (with respect to laser radiation).

[0018] The gripping device can be specifically designed to prevent laser radiation from escaping the laser processing device when it is in the processing position. By designing the gripping device in relation to the opening of the process chamber housing, it can be ensured that no laser radiation, neither directed (reflected) beam-shaped laser radiation nor laser scatter radiation, can escape from the process chamber, thus easily complying with the safety regulations for operating the process chamber.

[0019] If, according to the invention, the gripping device in the processing position completely covers the opening in one direction along the insertion axis, the gripping device can, for example, completely overlap both the opening and an edge region of the housing surrounding the opening. This prevents direct escape of laser radiation from the process chamber. It should be noted that the shielded cable held by the gripping device can itself also contribute to completely covering the opening. For example, in a gripping position of the gripping device, the shielded cable is clamped in a feedthrough at a central position by at least two jaws of the gripping device; at this position, the shielded cable itself can thus contribute to sealing the laser processing device against the escape of laser radiation.The foregoing formulation, according to which the gripping device in the processing position completely covers the opening in one direction along the insertion axis, is also intended to include such an arrangement.

[0020] In a suitable embodiment of the laser processing device according to the invention, a sealing gap remaining between the housing and the gripping device in the processing position forms a labyrinth seal for the laser radiation. This means that the laser radiation from the process chamber could only escape from the laser processing device via a scattering path through the sealing gap, where it is lost through repeated reflection or scattering.

[0021] According to an advantageous embodiment, the first projecting section, viewed in the processing position of the laser processing device, has a basic shape that is radially symmetrical with respect to the insertion axis, such as a circular disk. For example, the first projecting section can be designed in the form of one or more (suspended) circular disks that project along the insertion axis relative to other sections of the gripping device in the direction of the process chamber. The second projecting section can be composed of several parts, such as two semicircular disks, each belonging, for example, to a gripper jaw of the gripping device.

[0022] In a further development, the gripping device is provided with a second projecting section that surrounds the first projecting section. Specifically, the second projecting section can radially surround the first projecting section – in the machining position – with respect to the insertion axis. The second projecting section, like the first projecting section, extends axially in the direction of the process chamber relative to other sections of the gripping device.

[0023] Preferably, the second projection section – in the processing position of the laser processing device – also has a basic shape that is radially symmetrical with respect to the insertion axis. For example, the second projection section can be designed in the form of a circular ring. The second projection section can be composed of several parts, such as two half-rings, each belonging to a gripper jaw of the gripping device.

[0024] In this further development, it is advantageous if the housing has a receiving groove surrounding the opening, in which, in the processing position, at least one section of the gripping device is received without contact with the surfaces of the receiving groove. In this case, it can be provided, in particular, that the second projecting section is received, at least partially, in the receiving groove in the processing position, without any contact occurring between a surface section of the second projecting section and the surface of the receiving groove. In particular, a sealing gap remaining between the second projecting section and a groove base of the receiving groove and / or a radial sealing gap between the second projecting section and at least one side wall of the groove can form part of a labyrinth seal for the laser radiation and thus contribute to the sealing protective function of the gripping device.

[0025] According to a second aspect, a method for operating a laser processing device according to the first aspect of the invention is proposed. The laser processing device is brought into the processing position by positioning the gripping device contactlessly on the housing, such that in the processing position a first projecting section extends into the opening of the housing and a continuous sealing gap remains between the gripping device and the housing. According to the invention, the gripping device completely covers the opening in one direction along the insertion axis in the processing position. In particular, at least one sealing gap can remain between the gripping device and the housing throughout.

[0026] The above and below descriptions with regard to the laser processing device according to the first aspect apply analogously to the method according to the first aspect and vice versa.

[0027] Further details and advantages of the invention will become clear in the following description of some exemplary embodiments with reference to the figures.

[0028] They show: Fig. 1 shows an exemplary and schematic cross-sectional view of a section of a laser processing device according to one or more embodiments; Fig. 2 shows an exemplary and schematic perspective view of a section of a laser processing device according to one or more embodiments; Fig. 3 shows an exemplary and schematic perspective view of a section of a laser processing device according to one or more embodiments; Fig. 4 shows an exemplary and schematic cross-sectional view of a section of a laser processing device according to one or more embodiments; Fig. 5 shows an enlarged detail from the cross-sectional view according to Fig. 4 ; Figs. 6-10 show, by way of example and schematic representation, a gripping device of a laser processing device according to one or more embodiments in different perspective views; and Fig. 11 shows, by way of example and schematic representation, a gripping device of a laser processing device according to one or more embodiments in a cross-sectional view.

[0029] Fig. 1 or Fig. 4 Figure 1 schematically and exemplarily shows a section of a laser processing device 1 according to one or more embodiments in a cross-sectional view.

[0030] The laser processing device 1 is, for example, a laser cutting device for automatically cutting a shield wire braid of the shielded cable 4 to size. The shielded cable 4 can therefore be a cable with a shield wire braid.

[0031] What is special about this is Fig. 1 A so-called laser head of a laser processing device 1 is shown. The laser head comprises, in particular, a process chamber 2 for processing an end section 40 of the shielded cable 4 arranged therein by means of a laser radiation L. The laser processing device 1 further comprises a laser device (not shown) for generating the laser radiation L. For example, such a laser device can be, with reference to Fig. 1 The laser device is located to the right of the depicted section, i.e., the laser head. The laser device can, for example, comprise a fiber laser whose laser radiation is introduced into the laser head and deflected into the process chamber 2 via suitable optics. Various embodiments of such laser devices and associated optics are known to those skilled in the art. Therefore, these will not be described in greater detail here.

[0032] The process chamber 2, located in a front part of the reader head, comprises a housing 20 with an opening 200 for inserting the end section 40 of the shielded cable 4 to be processed. The insertion of the end section 40 into the process chamber 2 is effected by a relative movement between the process chamber 20 (i.e., the laser head) on the one hand and a gripping device 3 that holds the shielded cable 4 on the other.

[0033] For example, the laser head can be moved along an insertion axis Z towards the gripping device 3 of the shielded cable 4 (and / or vice versa) until a processing position of the laser processing device 1 is reached, in which the end section 40 of the shielded cable 4 extends into the process chamber 2 in a desired position. This processing position is in Fig. 1 Illustrated. As shown, the gripping device 3 fixes the shielded cable 4 in the opening 200 and simultaneously centers the end section 40 in the process chamber 2 in a suitable, defined processing position.

[0034] For example, the gripping device 3 comprises two (or more) separate sections in the form of gripper jaws 3-A, 3-B, which can be pneumatically moved into a gripping position in which they clamp the shielded cable between them. Further details regarding the gripping device 3 are explained below with reference to the following figures. The gripping device 3 is supported by a support device (not shown in the figures), the support device comprising a slide arrangement movable along a Z-axis, so that the gripping device 3 can move the end section 40 in the process chamber 2 towards or away from the processing position by means of the slide arrangement.

[0035] In addition to the fixing and centering function described above, which the gripping device 3 performs with respect to the shielded cable 4, the gripping device 3 has a safety function by covering the process chamber 2 to prevent the escape of dangerous laser radiation from the laser processing device 1. Thus, in Fig. 1 It is evident that the gripping device 3, in the illustrated machining position, completely covers the opening 200 in one direction along the insertion axis Z. This coverage is partially (in the center) provided by the shielded cable 4 itself. The shielded cable 4 to be machined extends through a feedthrough 33 in the gripping device 3 in a central position and is tightly clamped in this area between gripper jaws 3-A and 3-B of the gripping device 3. In particular, a rear section of the gripping device 3 overlaps a section of the housing 20 surrounding the opening 200, thereby ensuring complete coverage in the direction of the insertion axis Z.

[0036] The gripping device 3 also includes a first projecting section 31, which projects axially (i.e., along the insertion axis Z) towards the process chamber 2 relative to the rear section 3. In the illustrated machining position, the first projecting section 31 extends into the opening 200 and largely fills it. However, the gripping device 3 is positioned without contact with the housing 20, so that a continuous sealing gap S (in the area of ​​the opening 200) exists. Fig. 1 not specified, cf. e.g. Fig. 5 ) between gripping device 3 and housing 20. The sealing gap S is designed as an annular gap between the radially outer surface of the first projection section 31 and the radially opposite inner surface of the opening 200. The thickness of the sealing gap S is significantly less than the extent of the first projection section 31 within the opening 200. In particular, the thickness of the sealing gap S, i.e., the distance between the radially outer surface of the first projection section 31 and the opposite inner surface of the opening 200, is chosen to be as small as the manufacturing tolerance of the opening 200 and the outer diameter of the first projection section 31, as well as the reproducibility of the dynamic insertion and retraction movement of the first projection section 31 into and out of the opening 200, allow. The thickness of the sealing gap S is less than approximately 5%, in particular approximately 5%.3% of the diameter of the opening 200. The first projecting section 31 penetrates the opening 200 by more than 10 times the thickness of the sealing gap S. The sealing gap S is a (first) part of a labyrinth seal, which will be described in more detail below and whose function is to seal the interior of the process chamber 2 against the escape of laser radiation to the outside in a radiation-tight manner.

[0037] The following figures will be used to explain in more detail how the sealing of the laser processing device 1 is achieved, in particular including the first projection section 31 of the gripping device 3 and the sealing gap S between the gripping device and the housing 20, and which optional further structural properties of the gripping device 3 and / or the housing 20 can support the protective function.

[0038] Fig. 2 shows an exemplary and schematic perspective view of the laser safety head. Fig. 1 from a slightly oblique angle from the front. The gripping device 3 is in Fig. 2 The laser processing device 1 is not shown, i.e., no shielded cable 4 is inserted into the process chamber 2. Accordingly, the laser processing device 1 is not in the processing position. Instead, the process chamber 2 is shown in an open state. The opening 200 of the housing 20, pointing in the direction of the insertion axis Z, is clearly visible.

[0039] In this embodiment, the opening 200 has a circular circumferential contour. A ring-shaped receiving groove 201 is formed in the housing 20 around the opening 200. The receiving groove 201 serves to receive a section of the gripping device 3 in the machining position, namely preferably a second annular projection section 32 of the gripping device 3. This will be explained further below with reference to Fig. 5 explained in more detail.

[0040] In Fig. 3 is the laser head off Fig. 2 The device is shown in a position corresponding to the processing position of the laser processing device 1. The gripping device 3, with the shielded cable 4 fixed therein, is positioned without contact in the area of ​​the opening 200 on the housing 20, so that the (in Fig. 3 (not shown) end section 40 of the shielded line 4 extends along the insertion axis Z into the process chamber 2.

[0041] The gripping device 3 comprises two separate sections in the form of gripper jaws 3-A and 3-B. In the gripping position shown, the gripper jaws 3-A and 3-B are pressed together with such force (e.g., by pneumatics, not shown) that they clamp the shielded cable 4 between them. In this way, the gripping device 3 fixes and centers the shielded cable 4 in the opening 200 in the processing position, so that the end section 40 to be processed is located precisely at a position suitable for laser processing within the process chamber 2.

[0042] Fig. 4 Figure 1 shows another cross-sectional view of a laser processing device 1 in the processing position according to one or more embodiments. The basic structure corresponds to the cross-sectional view shown in Figure 2. Fig. 1 In this respect, reference is made to the above description.

[0043] In Fig. 5 is an enlarged section of the cross-sectional view according to Fig. 4 The diagram shows, in particular, the area of ​​the opening 200 of the housing 2 and the gripping device 3 positioned there. In the enlarged cross-sectional view, it is clearly visible that the first projecting section 31 of the gripping device 3 extends into the opening 200 in the machining position shown, leaving a radial sealing gap S between the housing 20 and the first projecting section 31.

[0044] Furthermore, the cross-sectional view shows in Fig. 5 The annular second projection element 32 radially surrounds the first projection element 31 with respect to the insertion axis Z. The second projection element 32 extends into the annular receiving groove 201 surrounding the opening 200. This leaves a further, second sealing gap S' between the second projection element 32 and the housing 20. A section of the second sealing gap S' between the second projection element 32 and the housing 20 extends along a groove base of the receiving groove 201. Further sections of the second sealing gap S' extend along an inner and an outer side wall of the receiving groove 201, respectively. The second sealing gap S' has, as shown in Fig. 5 The second sealing gap S' is recognizably divided into a short, radial section extending away from the insertion axis Z, followed by a second section defined between a side surface of the second projection element 32 and a side surface of the receiving groove 201, then a third radially directed section defined between the end face of the second projection element 32 and the bottom surface of the receiving groove 201, and finally a fourth section extending parallel to the insertion axis Z and defined between the other side surface of the second projection element 32 and the other side surface of the receiving groove 201, which opens into the vicinity of the housing 20. The first section of the second sealing gap S' opens into the first sealing gap S and forms an angle of approximately 90° with it. Any two adjacent sections of the second sealing gap S' form an angle of approximately 90°.90° so that the second sealing gap S' in the processing position of the gripping device 3 has the effect of a labyrinth seal.

[0045] Overall, a continuous sealing gap S" extends from the inside to the outside, the two sections of which, namely the first sealing gap S, which is essentially parallel to the insertion axis Z, and the second sealing gap S', are in Fig. 5 The diagram shows the area between the gripping device 3 and the housing 20. The overall sealing gap S" changes direction significantly several times on its path from the inside to the outside (i.e., from the interior of the process chamber 2 to the surrounding area outside the laser processing device 1), and in particular includes several changes of direction of 90°. For example, the radial gap between the first projection section 31 and the housing has an axial direction (i.e., parallel to the insertion axis Z), and the axial gap between the second projection section 32 and the base of the receiving groove 201 has a radial direction (i.e., perpendicular to the insertion axis Z). As a result, the second sealing gap S' forms a labyrinth seal within which the laser scattering radiation from the process chamber 2 effectively propagates.

[0046] Since the total sealing gap S" between the gripping device 3 and the housing 20 remains in the processing position, the gripping device 3 is not moved "to the block" (i.e., flush, so that a section of the gripping device 3 touches the housing 20) when the processing position of the laser processing device 1 is established. Rather, the laser processing device 1 is brought into the processing position by positioning the gripping device 3 against the housing 20 without contact. The invention thus also encompasses a method for operating the described laser processing device 1, wherein the laser processing device 1 is brought into the processing position by positioning the gripping device 3 against the housing 20 without contact. This offers the advantage that the laser processing device 1 can be operated dynamically, which enables a faster cycle time.

[0047] The Fig. 6 bis 10 show different perspective views of a gripping device 3 of a laser processing device 1 according to one or more embodiments. Fig. 11 Figure 3 shows an axial cross-sectional view of such a gripping device. The respective parts are located in the Fig. 1 and 3-5 The gripping devices 3 shown can, for example, be gripping devices 3 of the type described in the Fig. 6 bis 11 of the type shown and explained in more detail below. The following generally refers to all Fig. 6 bis 11 Reference is made at the same time, with some of the characters also being specifically mentioned.

[0048] In Fig. 6 Figure 1 shows a gripping device 3 in an open position. This clearly shows that the gripping device 3 comprises two separate sections 3-A, 3-B in the form of gripper jaws. For example, the gripper jaws 3-A, 3-B can comprise a metallic material and, in particular, be made of a metal.

[0049] Fig. 7 illustrates the gripping position of gripping device 3. Fig. 6 To assume the gripping position, the gripper jaws 3-A and 3-B are placed against each other. The gripping device 3 has a central opening 33 for the shielded cable 4, into which the (in Fig. 7 The shielded cable 4 (not shown) can be inserted into the gripping device 3 in its open position. To establish the gripping position of the gripping device 3, the gripper jaws 3-A and 3-B can, for example, be moved towards each other pneumatically in such a way that the shielded cable 4 is firmly clamped between the gripper jaws 3-A and 3-B. One sheath of the cable 4 is in contact with the surface of the feedthrough 33.

[0050] It can be provided that the position of the respective gripper jaws 3-A, 3-B is automatically monitored in a safety-oriented manner, e.g., to prevent collisions. To detect the positions of the gripper jaws 3-A, 3-B, one or more sensors, such as laser-based or inductive sensors, can be arranged on the gripping device 3.

[0051] Furthermore, the two gripper jaws 3-A, 3-B can, for example, be designed such that an overstroke can be performed when the gripping device 3 is closed (i.e., when assuming the gripping position) if there is no line 4 between the gripper jaws 3-A, 3-B. This means that the different sections of the gripper jaws 3-A, 3-B, which, as in Fig. 6 As illustrated, the components can interlock in a lamellar fashion and be pushed into one another beyond a certain point, which corresponds to the intended gripping position with the shielded cable 4 inserted. The overtravel can be detected by sensors, if necessary, so that an improper (faulty) gripping position can be automatically identified.

[0052] The Fig. 8 shows the gripping position according to Fig. 7 in a frontal view of the gripping device 3. The Fig. 9 shows the open position according to Fig. 6 in a frontal view. Fig. 10 shows a side view of the gripping device 3 in the gripping position. Fig. 11 illustrates a corresponding axial cross-section in the gripping position.

[0053] For example, based on the Fig. 6 and 7It becomes clear that in this embodiment, both the first projecting section 31 and the second projecting section 32 protrude axially relative to other sections of the gripping device 3. Both projecting sections 31 and 32 each have a radially symmetrical basic shape.

[0054] The first projection section 31, in the gripping position of the gripping device 3, has a cylindrical or disc-shaped basic form, which is composed of two semicircular discs, each belonging to one of the gripper jaws 3-A, 3-B. The cylindrical or disc-shaped basic form for the outline of the first projection section 31 ensures that the annular gap S forming towards the inside of the opening 200 has a substantially constant gap thickness in the direction of rotation around the insertion axis Z.

[0055] The second projection section 32 is designed – in the gripping position – as a circular ring that completely radially surrounds the first projection section 31. The second projection section 32 consists of two semi-rings, each formed on one of the gripper jaws 3-A, 3-B. The dimensions of the second projection section 32 are similar to those of, for example, Fig. 2 The illustrated receiving groove 201 of the housing 20 is adapted so that the second projection section 32 is received in the receiving groove 201 in the machining position (forming the second sealing gap S') without, however, coming into contact with the receiving groove 201.

[0056] In the embodiment described above, the second projection section 32 was formed by a single circular ring, which formed a single labyrinth seal in the region of the second sealing gap S'. It is understood that the second projection section 32 can comprise two or more circular rings, each of which can form a second or additional labyrinth seal in the region of the substantially radially extending second sealing gap S'. In particular, the sealing effect against the escape of laser radiation can be easily improved by providing additional circular rings.

[0057] In the embodiment described above, the first projection section 31 is designed to have a basic shape that is radially symmetrical with respect to the insertion axis Z. Generally, the basic shape of the first projection section 31 is selected with respect to the cross-sectional contour of the opening 200 such that the sealing gap S (which need not necessarily be an annular gap) forming between the circumference of the first projection section 31 and the inside of the opening 200 has a substantially constant thickness in the circumferential direction around the insertion axis Z. For example, the gripping device 3 may be designed to guide two parallel cables 4 and accordingly has an oval, rather than a circular, outline in the direction of the insertion axis Z; in this case, the opening 200 has an oval inner contour.In this case, the first projection section 31 is provided to have an outer contour adapted to the cross-sectional contour of the inside of the opening 200, i.e. also an oval outer contour, so that the sealing gap S, which has a substantially oval shape, can have a substantially constant thickness in the direction of rotation around the insertion axis Z. Bezugszeichenliste

[0058] 1 laser processing device 2 Process chamber 20 Housing 200 Opening 201 Receipt groove 3 Gripping device 31 First projection section 32 Second projection section 33 Feedthrough 3-A First section 3-B Second section 4-shielded cable, 40 end section Laser radiation S(first) sealing gap S'second sealing gap S"Total sealing gap ZIntroduction axis

Claims

1. Laser machining device (1) for shielded lines (4), comprising: - a process chamber (2) for machining an end portion (40) of a shielded line (4) disposed therein by means of laser radiation (L), wherein a housing (20) of the process chamber (2) defines an opening (200) for introducing the end portion (40) along an introduction axis (Z); - furthermore having a laser unit for generating the laser radiation (L), and - a gripping device (3) for fixing the shielded line (4) in the opening (200) in a machining position of the laser machining device (1), wherein in the machining position the end portion (40) extends into the process chamber (2); wherein in the machining position the gripping device (3) is positioned in a non-contacting manner on the housing (20), wherein the gripping device (3) comprises a first protrusion portion (31), which in the machining position of the laser machining device (1) extends at least in portions along the introduction axis (Z) into the opening (200), wherein in the machining position the first protrusion portion (31) fills the opening (200) to the extent that a continuous sealing gap (S) remains between the gripping device (3) and the housing (20), characterized in that the gripping device (3) in the machining position completely covers the opening (200) in a direction along the introduction axis (Z).

2. Laser machining device (1) according to Claim 1, wherein the thickness of the sealing gap (S) is less than approx. 5% of the diameter of the opening (200).

3. Laser machining device (1) according to Claim 2, wherein the thickness of the sealing gap (S) is approx. 3% of the diameter of the opening (200).

4. Laser machining device (1) according to one of the preceding claims, wherein in the machining position a sealing gap (S, S', S") remaining between the housing (20) and the gripping device (3) forms a labyrinth seal for the laser radiation (L).

5. Laser machining device (1) according to one of the preceding claims, wherein the first protrusion portion (31) has a radially symmetrical basic shape with respect to the introduction axis (Z).

6. Laser machining device (1) according to one of the preceding claims, wherein the gripping device (3) has a second protrusion portion (32) which surrounds the first protrusion portion (31).

7. Laser machining device (1) according to one of the preceding claims, wherein the housing (20) has a receptacle groove (201) which surrounds the opening (200) and in which at least one portion (32) of the gripping device (3) is received in the machining position.

8. Laser machining device (1) according to Claim 7, if referring back to Claim 6, wherein the second protrusion portion (32) in the machining position is at least partially received in the receptacle groove (201).

9. Laser machining device (1) according to one of the preceding claims, wherein the gripping device (3) comprises at least two parts (3-A, 3-B) which are able to be attached to one another for assuming a gripping position in which the gripping device (3) grips the shielded line (4).

10. Method for operating a laser machining device (1) according to one of the preceding claims, wherein the laser machining device (1) is moved to the machining position by positioning the gripping device (3) in non-contacting manner on the housing (20) in such a way that, in the machining position, a first protrusion portion (31) extends into the opening (200) of the housing (20) and a continuous sealing gap (S) remains between the gripping device (3) and the housing (20), wherein in the machining position the gripping device (3) completely covers the opening (200) in a direction along the introduction axis (Z).