METHOD FOR REMOVING A WORKPIECE FROM A MACHINING MACHINE, DATA PROCESSING PROGRAM AND MACHINING MACHINE

Description

[0001] The invention relates to a method for removing a workpiece from a remaining workpiece formed by machining a plate-shaped workpiece resting on a workpiece support of a machine tool. The invention further relates to a data processing program for a machine control system of a machine tool for removing such a workpiece part. The invention also relates to a sensor device for detecting the separation of the workpiece part to be removed from a remaining workpiece produced by machining a plate-shaped workpiece. Furthermore, the invention relates to a machine tool for carrying out the method.

[0002] From DE 10 2012 204 282 A1, a device for testing pressed workpieces is known. These pressed and finished workpieces are tested using a vibration mechanism. The finished workpiece is inspected by means of reflected laser light from a vibration sensor that emits an infrared laser beam directed at the workpiece. This allows cracks in the finished workpiece to be detected.

[0003] From WO 2004 / 028939 A2, a gripping device for a machine tool for producing workpieces from a sheet-like material is known, which includes a detection device. A striking plunger is provided on the gripping device, which acts on the sheet held by the gripping device. A vibration sensor is provided adjacent to and on the same outer surface of the sheet. A vibration analysis detects whether the sheet, which serves as the raw material, is gripped by the gripping device as a single sheet or whether, possibly due to the adhesive forces of an oil film, another sheet is attached to the gripped sheet.

[0004] From DE 10 2017 205 095 B1, on which the preamble of parent claims 1 and 12 is based, a device and a method are known which enable increased process reliability when removing a workpiece part produced by machining from a plate-shaped workpiece from a remaining workpiece. This device comprises a sensor device which includes at least one first electrically conductive contact element that can be contacted with a workpiece part and at least one second electrically conductive workpiece part that can be positioned on the workpiece part at a distance from the first contact element. These contact elements are provided on a holding device which engages the workpiece part for removal of the workpiece part. The contact elements are connected to a sensor device.The workpiece is held at a reference potential, for example, by electrically conductive clamping jaws or by a workpiece support on which both the workpiece and the rest of the workpiece rest. Before the workpiece is removed, it is checked whether the workpiece has been completely separated from the rest of the workpiece. If the workpiece has been completely separated from the rest of the workpiece, the sensor detects a high resistance between the two electrically conductive contact elements that are in contact with the workpiece to be removed. If, on the other hand, the workpiece is still in contact with the rest of the workpiece, a closed circuit is created when a voltage is applied between the contact elements on one side and the ground potential on the other, and a very low resistance is measured between the contact elements and the ground potential.

[0005] For plate-shaped workpieces that have an oil film as a protective coating, or especially for foil-covered workpieces, such a resistance measurement can be difficult or impossible to perform.

[0006] The invention is based on the objective of providing a method that further improves process reliability when removing a workpiece part from a remaining workpiece. Furthermore, the invention is based on the objective of proposing a data processing program and a sensor device for carrying out the method. Finally, the invention is based on the objective of providing a processing machine that enables high process reliability when removing a workpiece part from a remaining workpiece.

[0007] This task is solved by a method in which, prior to the removal of the workpiece part from the rest of the workpiece by a gripping device, specifically by a lifting movement of the gripping device perpendicular to the workpiece support, a sensor device is activated. This sensor detects the separation of the workpiece part from the rest of the workpiece using structure-borne sound signals. This detection of the separation of the workpiece part from the rest of the workpiece via structure-borne sound enables non-destructive detection. Furthermore, this method can also be used for unoiled, oiled, foil-wrapped, or coated plate-shaped workpieces. It can also enable the detection of complete separation in non-conductive materials.

[0008] Advantageously, the sensor device includes at least one pulse generator for generating structure-borne sound, which excites the workpiece part or the remaining workpiece, and at least one vibration sensor for detecting the structure-borne sound, which determines the proportion of the structure-borne sound transmitted across the cutting gap to the remaining workpiece or workpiece. Thus, the vibrations introduced by the pulse generator are detected and evaluated by the vibration sensor to detect complete separation, partial separation, or no separation. If the workpiece part is completely separated from the remaining workpiece and a fully circumferential cutting gap exists between the workpiece part and the remaining workpiece, no structure-borne sound can be transmitted.This allows it to be determined that there is neither an entanglement of the workpiece part with the remaining workpiece, nor a miscut or a positive or non-positive connection between the workpiece part and the remaining workpiece, which could disrupt the removal process.

[0009] If only a portion of the coupled structure-borne sound is transmitted, it can be determined whether, for example, the workpiece part has only shifted partially beneath the rest of the workpiece and a removal process using a gripping device is still possible. If a larger proportion of the structure-borne sound is detected by the vibration sensor, it can then be determined whether the workpiece part is jammed against the rest of the workpiece, whether there has been a cut error, or whether another malfunction has occurred. In such cases, either a release strategy is initiated, or the machine is stopped and a signal is sent to the operator.

[0010] An advantageous embodiment of the method involves first performing at least one reference measurement on a completely separated workpiece from the remaining workpiece while it is operating on a machine tool. A reference value is then derived from the data obtained during this measurement. This method of establishing the reference value while considering the machine tool in operation has the advantage of capturing and taking into account sources of interference at the machine tool or in the production hall that affect the machine tool. This allows these interferences to be eliminated during the evaluation. For example, the system's natural frequency can be determined during the reference measurement and used for verification purposes.

[0011] Furthermore, it is preferably provided that the removal of the workpiece part from the remaining workpiece, preferably by a lifting movement of the gripping device perpendicular to the workpiece support upwards, is initiated as soon as a measured value detected by the sensor device is equal to or below the reference value or a threshold value relative to the reference value. This ensures that the removal process can be carried out without hindrance. By considering a threshold value relative to the reference value, it can be taken into account that the workpiece part, although loosely located within the remaining workpiece, has individual points of contact. Therefore, a portion of the structure-borne sound signals may be transmitted, but – provided these remain below the threshold value relative to the reference value – safe removal is still possible.Advantageously, the testing procedure for individual contact points between the workpiece part and the remaining workpiece can also be carried out in the slightly raised state of the workpiece part relative to the remaining workpiece during lifting out of the remaining grid.

[0012] The situation is different in the case of jams or a miscut. In such cases, a structure-borne sound signal that is higher than the threshold value for the reference value would be transmitted.

[0013] Furthermore, it is preferably provided that, instead of removing the workpiece part by a lifting movement of the gripping device, a traversing movement of the gripping device is initiated for a release strategy to detach the workpiece part from the remaining workpiece as soon as the detected measured value is above the reference value or the threshold value relative to the reference value. Such release strategies for releasing a force-fit and / or form-fit connection or an entanglement between the workpiece part and the remaining workpiece are known, for example, from WO 2014 / 023 323 A1, to which full reference is made.

[0014] To detect the separation of the workpiece segment from the rest of the workpiece, it is preferably provided that the frequency and amplitude excited by the pulse generator are recorded and evaluated by at least one vibration sensor. This enables a simple determination of the measured value for evaluating the condition of the workpiece segment within the rest of the workpiece.

[0015] Preferably, a frequency- and / or pulse-modulated vibration in the range of 1 to 3 kHz is coupled into the workpiece or the remaining workpiece by the pulse generator. This coupled modulated vibration has the advantage that individual sources of interference can be eliminated to enable reliable detection of the separation or entanglement of the workpiece segment from the remaining workpiece. Furthermore, the efficiency of the detection can be increased by excitation in the range of, for example, the determined natural frequency of the system.

[0016] Furthermore, it is preferably provided that, after the structure-borne sound is coupled into the workpiece part or remaining workpiece by the pulse generator, the vibration sensor filters out the vibrations in the range of 1 to 3 kHz via a filter, preferably a bandpass filter, and processes them using a Fourier transform, preferably from 256 values, and determines a maximum. The ratio between the maximum and the reference value is checked, and a signal is then output to indicate whether complete separation has occurred. This enables not only automatic but also permissible evaluation of the structure-borne sound signals in order to start the removal process, provided that the conditions are met for separation of the workpiece part from the remaining workpiece.

[0017] Preferably, when positioning the gripping device on the workpiece part, at least one pulse generator or at least one vibration sensor is contacted with the workpiece part. This allows the removal process to continue to be automated.

[0018] The additional component of the sensor system, which is not positioned on the gripping device, is positioned on the remaining workpiece or on a machine component that is coupled and connected to the remaining workpiece for structure-borne sound transmission. For example, this additional machine component could be the clamping device, the handling device, the workpiece support, or other machine components. This has the advantage that existing machine components or machine axes can be used to accommodate the pulse generator or the vibration sensor. In the case of the clamping device, for example, the pulse generator or the vibration sensor could be located on the movable component of the handling device or on at least one clamping jaw or the clamping device itself.This allows the components of the sensor system to be permanently installed in the processing machine, so that the existing automation process for processing the plate-shaped workpiece can continue to be maintained and carried out.

[0019] The problem underlying the invention is further solved by a data processing program for a machine control of a processing machine, in particular a laser cutting machine or a laser punching machine, which controls the processing machine to carry out the aforementioned method. This allows the detection of the workpiece part to be removed from the remaining workpiece by means of structure-borne sound to be directly integrated into the automation process.

[0020] The object underlying the invention is further solved by a processing machine for producing workpiece parts from a plate-shaped workpiece, which comprises a workpiece support on which the plate-shaped workpiece can be positioned, and a processing head by which at least one workpiece part is formed from the plate-shaped workpiece by separating processing, and with a clamping device for gripping the plate-shaped workpiece positioned on the workpiece support and with a gripping device for removing the workpiece part from a workpiece part formed after the separating processing, wherein, before the workpiece part is removed from the remaining workpiece, the separation can be detected by a method according to one of the previously described embodiments with a sensor device according to one of the previously described embodiments.This allows potential malfunctions to be detected in the automation process in a timely manner, which may be caused by incorrect cuts, welding, tilting, jamming or the like.

[0021] The invention, as well as further advantageous embodiments and developments thereof, are described and explained in more detail below with reference to the examples shown in the drawings. The features that can be derived from the description and the drawings can be applied individually or in any combination according to the invention. The drawings show: Figure 1 a perspective view of a first embodiment of a processing machine, Figure 2 a perspective view of an alternative embodiment of the processing machine Figure 1 , Figure 3 a perspective view of a handling device with a gripping device, at least for removing workpiece parts, Figure 4a schematic view from below of a suction plate of a gripping device having a vacuum suction cup, Figure 5 a schematic side view of a gripping device with a sensor device that engages the workpiece part, Figure 6 a schematic side view of the gripping device engaging the workpiece part with the sensor device in case of a fault detection, Figure 7 a schematic view of an alternative embodiment of Figure 5 , and Figure 8 a schematic side view of an alternative embodiment to Figure 5 .

[0022] In Figure 1An example of a processing machine 11 for manufacturing workpiece parts 14 from a plate-shaped workpiece 12 is shown. The workpiece parts 14 are manufactured from the plate-shaped workpiece 12 by a cutting process, in particular by means of a process beam 13. The processing machine 11 can be configured as a laser processing machine for laser cutting of workpiece parts 14 with a laser beam as the process beam 13. For the cutting processing of the workpiece parts 14, the process beam 13 can also be a plasma beam.

[0023] The plate-shaped workpiece 12 rests on a workpiece support 15 during machining. This support 15 is formed, for example, by two adjacent workpiece support surfaces 16 spaced apart by a gap 18. The workpiece support 15 comprises a support plane E, which corresponds to an XY plane of the Figure 1 corresponds to the XYZ coordinate system shown.

[0024] A handling device 19, which includes a drive (not shown in detail), controls several clamping devices 20, 21, 22, 23. The clamping devices 20, 21, 22, 23 allow the plate-shaped workpiece 12 to be moved on the workpiece support 15 in a direction X and to be moved to a predetermined machining position. The clamping devices 20, 21, 22, 23 are preferably designed as clamping jaws or clamping jaws that engage along a side edge 24 of the plate-shaped workpiece 12. Alternatively, the workpiece support 15 itself can be designed as a moving device for moving or assisting the movement of the plate-shaped workpiece 12 in the X direction, for example, in the form of one or more circulating conveyor belts, as described in DE 10 2011 051 170 A1 of the applicant.

[0025] The gap 18 between the workpiece support surfaces 16 of the workpiece support 15 extends in the Y direction preferably over the entire travel path of a machining head 25, which aligns and focuses the process beam 13 onto the plate-shaped workpiece 12. The machining head 25 is guided on a stationary portal 27 by means of a driven slide 26, which serves as a motion device. The machining head 25 is controlled to move in the Y direction above the gap 18. In the illustrated example, the machining head 25 can also be controlled to move in the X direction within the gap 18. For this purpose, the slide 26 can be moved in the X direction by an additional motion device 28, for example in the form of a linear drive.With the aid of the successive motion devices 28, 30, the machining head 25 can be positioned in a desired cutting position within the gap 18 in both the X and Y directions. If necessary, the machining head 25 can also be moved along a third direction of movement (Z direction) to adjust the distance between a machining nozzle 29 of the machining head 25 and the workpiece surface.

[0026] Within the gap 18, two support slides 31, 32 are arranged, each extending across the width of the gap 18 and being controlled in the Y-direction within the gap and movable independently of each other. At the respective end of the support slides 31, 32 furthest from the process beam 13, a cover element 33, 34 is provided, which closes the gap 18. The process beam 13 is generated by a beam source 36, in particular a laser source, and is fed to the processing head 25 by means of a beam guide (not shown in detail) and output via the processing head 25.

[0027] In Figure 2An alternative embodiment of a processing machine 11 is shown. This processing machine 11 is, for example, designed as a laser punching machine. For the selective processing of a plate-shaped workpiece 12, a punching head 40 with a punch (not shown) and a processing head 25 are provided. The workpiece 12 to be processed also rests on a workpiece support 15 during processing. The workpiece 12 is held during processing by the handling device 19, which has clamping devices 20, 21, and can be moved relative to the punching head 40 and the processing head 25 in the X-direction of the workpiece plane (X / Y plane) by means of a conventional linear drive 37 arranged by an arrow.In the Y direction of the workpiece plane, the workpiece 12 can be moved additionally by moving the workpiece support 15 together with the handling device 19 relative to a base 38, on which the workpiece support 15 is mounted, by means of a further linear drive 39 indicated by an arrow.

[0028] In this way, the plate-shaped workpiece 12 can be moved in the X and Y directions relative to a stationary machining area of ​​the punching head 40 and a stationary machining area on the machining head 25.

[0029] In Figure 3 A handling device 51 is shown in perspective, which includes a gripping device 52 that is movable along at least one linear axis 53. This handling device 51 can be attached to the processing machine 11 according to Figure 1 as well as the one in Figure 2This enables the gripping device 52 to position an unmachined, plate-shaped workpiece 12 from a magazine onto the workpiece support 15 for machining. This machining process produces workpiece parts 14. A residual workpiece 17, or a residual grid, remains. To remove the workpiece parts 14, the gripping device 52 can again be activated to extract the individual workpiece parts 14 from the residual workpiece 17 and place them in another magazine. The residual workpiece 17 can also be removed by the gripping device 52 and fed to a waste station.

[0030] The gripping device 52 can be designed, for example, as a magnetic suction cup, vacuum suction cup, electro-adhesion suction cup, or as a mechanical gripper. In the exemplary embodiment according to Figure 4A vacuum suction cup 65 is schematically depicted, arranged on a suction frame 54 which comprises one or more suction plates 63. Several suction elements 61 are provided on each suction plate 63. Each of these suction elements 61 serves as a suction cup. Such a suction element 61 can be formed from a bellows or bellows made of an elastic plastic. The suction plate 63 of the vacuum suction cup 65 is preferably connected to a vacuum pump via a hose. Valves 69 are used for the individual control of the suction elements 61 ( Figure 5 ) controlled. The number of vacuum suction cups 65, the size of the suction elements 61, and their arrangement in rows and columns or any other grid are arbitrary and can be adapted to the respective handling task.

[0031] In Figure 5Figure 1 shows a schematic side view of the gripping device 52, which is positioned in a gripping position relative to the workpiece part 14. The suction elements 61 can either simply rest on the workpiece or already be pressurized with vacuum, so that the workpiece part 14 is firmly connected to the suction elements 61 of the gripping device 52.

[0032] A sensor device 71 is provided for detecting a separation of the workpiece part 14 from the remaining workpiece 17 by means of a cutting gap 76 using structure-borne sound. This sensor device 71 comprises at least one pulse generator 72 and at least one vibration sensor 73, which are connected to a control and evaluation unit 74. According to this first embodiment in Figure 5It is provided that the pulse generator 72 is arranged on the gripping device 52. This pulse generator 72 can be located adjacent to the suction elements 61 on the housing 68 of the gripping device 52. The pulse generator 72 is fixed to the housing 68 in such a way that, when the gripping device 52 is positioned in a gripping position relative to the workpiece part 14, the pulse generator 72 rests on or is in contact with the surface of the workpiece part 14.

[0033] At least one vibration sensor 73 is provided on a machine component of the processing machine 11. For example, it can be attached directly to a clamping device 20 or to the handling device 19. The clamping device 20 holds the remaining workpiece 17.

[0034] The workpiece part 14 is, according to the exemplary embodiment, in Figure 5 completely separated from the remaining workpiece 17 by the cutting gap 76.

[0035] To detect any potential malfunctions during the removal of the workpiece part 14 from the remaining workpiece 17, for example due to miscuts, welding, tilting, snagging, or the like, detection is performed by the sensor device 71. The control and evaluation unit 74 outputs signals to the pulse generator 72, so that structure-borne sound vibrations are coupled into the workpiece part 14 by the pulse generator 72. The coupled structure-borne sound vibrations are detected by the at least one vibration sensor 73 and forwarded back to the control and evaluation unit 74.

[0036] Due to the complete separation of the workpiece part 14 from the remaining workpiece 17 by the cutting gap 76, no structure-borne sound vibration or only a very small proportion of structure-borne sound vibration is transmitted via the workpiece support 15. As a result, the control and evaluation unit 74 detects a signal indicating that there is no contact between the workpiece part 14 and the remaining workpiece 17, and the removal process can be started by the gripping device 52. Preferably, the gripping device 52 is first moved vertically upwards along the Z-axis until the raised workpiece part 14 is free from the remaining workpiece 17, and then a further traverse movement is initiated.

[0037] In Figure 6Figure 1 shows a schematic side view of a workpiece part 14 in relation to a remaining workpiece 17, in which the workpiece part 14 is in contact with the remaining workpiece 17 at least in one area. During the detection process, structure-borne sound is again coupled into the workpiece part 14 via the pulse generator 72. Due to the at least partial contact between the workpiece part 14 and the remaining workpiece 17, a larger proportion of structure-borne sound vibrations is transmitted to the remaining workpiece 17, which transmits these vibrations via the clamping device 20 to the handling device 19, so that the vibration sensor 73 can detect the structure-borne sound vibrations. From the proportion of detected structure-borne sound vibrations, it can initially be determined that the workpiece part 14 is not completely free of contact with the remaining workpiece 17.If the detected proportion of structure-borne sound vibrations is below a predetermined threshold or reference value, it can be detected that only contact has occurred and the removal process can be initiated by the gripping device 52. If the proportion of structure-borne sound vibrations detected by the at least one vibration sensor 73 is higher than a reference value or a threshold value, a fault is detected. A release strategy can then be initiated using the gripping device 52, or the machine can be shut down, requiring manual intervention by an operator.

[0038] Before detecting the separation of workpiece part 14 from the remaining workpiece 17, a reference value can be stored in the control and evaluation unit 74. This reference value is acquired by measurements on a machine tool 11 that is in operation, ensuring that there is a complete separation of workpiece part 14 from the remaining workpiece 17. A fully circumferential cutting gap 76 is formed between workpiece part 14 and the remaining workpiece 17. Based on this reference value, further positions of workpiece part 14 relative to the remaining workpiece 17 can be simulated and reference values ​​acquired. This allows a decision to be made later as to whether the removal process should be started or whether malfunctions may occur during the removal process.

[0039] In Figure 7An alternative embodiment for carrying out the method for detecting the arrangement of the workpiece part 14 relative to the remaining workpiece 17 is shown. In this embodiment, for example, the at least one vibration sensor 73 is positioned directly on the remaining workpiece 17. The at least one pulse generator 72 can be positioned on the gripping device 52, analogous to the embodiment described above.

[0040] In Figure 8 Another alternative arrangement of the sensor device 71 is provided. In this embodiment, for example, the pulse generator 72 is integrated into a suction element 61, i.e., positioned within the suction element 61. The vibration sensor 73 can, for example, be provided on the handling device 19.

[0041] Furthermore, it can be provided that at least one pulse generator 72 is located inside the at least one suction element 61 and at least one pulse generator 72 is located outside a vacuum suction cup 65 on the housing 63. The position of the at least one vibration sensor 73 can also be variably designed and optionally located on the remaining workpiece 17 at the clamping device(s) 20, 21, 22, 23 and / or the handling device 19.

[0042] The embodiments described above for the arrangement of the sensor device 71 can also include a reversed arrangement of the at least one pulse generator 72 and the at least one vibration sensor 73.

Claims

1. Method for removing a workpiece part (14) from a residual workpiece (17), which is formed by separating machining from a plate-shaped workpiece (12) resting on a workpiece support (15), - in which the plate-shaped workpiece (12) is fixed for machining by means of a clamping device (20, 21, 22, 23) and can be moved along at least one X or Y direction in a support plane of the workpiece support (15), - in which, before or after separating the workpiece part (14) from the plate-shaped workpiece (12), a gripping device (52) is positioned relative to the workpiece part (14) in a removal position, - in which at least one gripping element or suction element (61) of the gripping device (52) engages the workpiece part (14), characterized in that - before the gripping device (52) is actuated to remove the workpiece part (14) from the residual workpiece (17), a sensor device (71) is activated, by means of which the separation of the at least one workpiece part (14) from the residual workpiece (17) is detected by means of structure-borne sound vibrations.

2. Method according to claim 1, characterized in that the sensor device (71) comprises at least one pulse generator (72) for generating a structure-borne sound, by means of which the workpiece part (14) or the residual workpiece (17) is excited, and comprises at least one vibration sensor (73) for detecting the structure-borne sound vibrations, by means of which a proportion of the structure-borne sound vibrations transmitted via a cutting gap (76) to the residual workpiece (17) or workpiece part (14) is determined.

3. Method according to claim 1 or 2, characterized in that at least one reference measurement is first carried out with a completely separated workpiece part (14) to the residual workpiece (17) during operation of a processing machine (11) and a reference value is formed from the data determined from the reference measurement.

4. Method according to claim 3, characterized in that the removal of the workpiece part (14) from the residual workpiece (17) is started, preferably by an upward lifting movement of the gripping device (52) perpendicular to the workpiece support (15), as soon as the measured value detected by the sensor device (71) is equal to or below the reference value.

5. Method according to claim 4, characterized in that a measured value acquisition takes place during the workpiece removal.

6. Method according to claim 5, characterized in that, instead of the lifting movement of the gripping device (52) for removing the workpiece part (14), a traversing movement of the gripping device (52) for a release strategy of the workpiece part (14) to the residual workpiece (17) is initiated as soon as the detected measured value is above the reference value.

7. Method according to one of the preceding claims, characterized in that the frequency and amplitude excited by the pulse generator (72) are detected by the at least one vibration sensor (73), and preferably a frequency-modulated and / or pulse-modulated vibration in a range from 1 to 3 kHz is coupled into the workpiece part (14) or the residual workpiece (17) by the pulse generator (72).

8. Method according to claim 7, characterized in that vibrations in the range from 1 to 3 kHz are filtered out by the at least one vibration sensor (73) via a filter, in particular a bandpass filter, which vibrations are processed by means of a Fourier transformation and a maximum is determined and the ratio between the maximum and a reference value is checked and then a signal is output by the control and evaluation device (74), by means of which signal the gripping device (52) is actuated to carry out the removal operation or the release strategy or a standstill of the processing machine (11) is actuated.

9. Method according to one of the preceding claims, characterized in that, when the gripping device (52) is positioned on the workpiece part (14), the at least one pulse generator (72) or the at least one vibration sensor (73) is contacted with the workpiece part (14).

10. Method according to one of the preceding claims, characterized in that the at least one vibration sensor (73) or the at least one pulse generator (72) is positioned or fixed on component parts of the processing machine (11), in particular the clamping devices (20, 21, 22, 23), the handling device (19) or on a workpiece support (15), or is placed directly on the residual workpiece (17).

11. Data processing program for a machine control of a processing machine (11), in particular a laser cutting machine or a punch laser cutting machine, with a workpiece support (15), with clamping devices (20, 21, 22, 23) for gripping a plate-shaped workpiece (12) positioned on the workpiece support (15) and with a beam source (36) for generating a process beam (13), which is directed onto the plate-shaped workpiece (12) via a processing head (25), characterized in that the processing machine (11) can be controlled by the data processing program to carry out the method according to one of claims 1 to 10.

12. Processing machine for producing workpiece parts (14) from a plate-shaped workpiece (12) - with a workpiece support (15) on which the plate-shaped workpiece (12) can be positioned, - with a processing head (25), by means of which the at least one workpiece part (14) is formed from the plate-shaped workpiece (12) for separating processing, - with at least one clamping device (20, 21, 22, 23) for gripping the plate-shaped workpiece (12) positioned on the workpiece support (15), - with a gripping device (52) for removing the at least one workpiece part (14) from the residual workpiece (17) formed after the separating machining of the plate-shaped workpiece (12), characterized in that - in that the processing machine has a sensor device (71), - with at least one pulse generator (72), which is positioned on a component to be excited, and with at least one vibration sensor (73), which is positioned on a component adjacent through a cutting gap (76), - with a control and evaluation device (74), by means of which the vibration for the at least one pulse generator (72) for generating a structure-borne sound is controlled and output by the pulse generator (72) and by means of which the structure-borne sound vibration detected by the at least one vibration sensor (73) is evaluated and outputs a signal about the process state, and - in that the processing machine is configured to perform the removal of the at least one workpiece part (14) from the residual workpiece (17) in accordance with a method according to one of claims 1 to 10.