Method for producing a laminated body with an integrated exposure hologram

Description

[0001] The invention relates to the production of lamination bodies, also referred to as data cards, with an integrated exposure hologram, such as those used for valuables and security documents.

[0002] It is known from the prior art to form security documents as lamination bodies or to integrate a lamination body, for example in the form of a data page as a passport card, into a security document. Flat lamination bodies in card form, particularly when they store information or are intended for storing information, are also referred to as data cards. A data card within the meaning of the invention consists of at least two substrate layers formed as films, with at least one of the substrate layers being designed as a transparent layer.

[0003] Documents are referred to as security documents if they have one or more features that make imitation, falsification, and / or unauthorized production difficult or impossible. Security features also include features that secure information to make its falsification and / or replacement in a document more difficult and / or detectable. Security documents include, for example, ID cards, passports, driver's licenses, and similar documents.

[0004] Objects incorporating a security feature are also referred to as security elements. Security documents are also considered security elements within this definition.

[0005] It is known in the art to use holograms as a security feature or security element in security documents. Holograms are divided into different classes. Firstly, holograms can be differentiated according to whether they are so-called thin or thick holograms. Thin holograms are those holograms in which the holographic information is stored in a layer whose layer thickness is on the order of the wavelength of the light diffracted by the hologram structures. Thick holograms, on the other hand, are holograms in which the hologram information is stored in a volume whose layer thickness corresponds to a multiple of the wavelength of the light, for example, approximately ten times the wavelength of the light diffracted by the corresponding hologram structures.Furthermore, a distinction can be made based on whether the holographic structures are formed as a relief on a surface or are exposed into a material layer by means of a photographic process. Exposure holograms are defined here as holograms in which the holographic information is exposed into a photosensitive layer and the holographic information is stored within the layer and not in the surface structure.

[0006] EP 2 344 342 B1 describes a card, in particular a credit card, identity card, bank card or other value card, which has a plurality of layers laminated to one another, wherein a security element is embedded between a first card layer and a second card layer, said security element having a plastic or lacquer layer with a relief structure, in particular a diffraction structure, wherein the relief structure has first relief regions with first image elements and second relief regions with second image elements, wherein the image elements of the first relief regions produce a first representation that is visually recognizable under ambient conditions, and the security element is glued with its two main surfaces to the first card layer by means of a first adhesive layer and to the second card layer by means of a second adhesive layer, characterized in thatthat the image elements of the second relief areas produce a second representation that is not visually recognizable under ambient conditions, and that the first and second adhesive layers consist of an adhesive that is the same or different and is selected from the group consisting of physically drying adhesives and heat-crosslinkable adhesives, and that, if at least one of the adhesives is a heat-crosslinkable adhesive, the crosslinking temperature of the adhesive is lower than the softening temperature of the plastic or lacquer layer of the security element in which the relief structure is present.

[0007] US Pat. No. 7,997,496 B2 also shows a laminated multilayer card that can be printed with personal information, wherein the card contains an enclosed security element; the security element contains a pressure-sensitive adhesive layer. The security element has an embossed structure.

[0008] US 2015 / 220056 A1 describes poly- or copolycarbonate-based security and / or value documents which contain at least one hologram integrated into the card body, as well as a method for producing such security and / or value documents.

[0009] EP 0 896 260 A2 discloses a device for producing holograms from a master hologram of a ground glass screen. A hologram master containing the master hologram is brought into contact with a hologram layer in the form of a film. The film is arranged in front of the hologram master containing the master hologram. The master hologram is a reflection hologram, so that when light is shone through the film, part of the light from the hologram master, i.e. the master hologram, is reflectively diffracted and thus interferes with the light in the film that shines through this film. This copies the master hologram of the hologram master in a contact copy. To individualize such a copied hologram, the coherent light used for illumination is passed over a modulator before being shone through the film, which modulates the coherent radiation spatially. Such modulators are also referred to as spatial light modulators (SLMs).They can, for example, be formed from liquid crystal cells, like those found in liquid crystal displays (LCDs). Holograms produced in this manner are used, for example, under the Identigram brand and incorporated as security elements into passport cards and identity cards of the Federal Republic of Germany.

[0010] These known holograms are exposure holograms and are applied over the entire surface of the data cards, in particular to lamination bodies thermally bonded under pressure, using an adhesive and protected against environmental influences by an outer protective layer.

[0011] Liquid adhesive systems are typically used for this purpose. However, bonding these holograms to pre-printed data cards using liquid adhesive is technically difficult. During the bonding process, air pockets can form between the pre-laminated base body and the hologram layer, which represents a quality defect that leads to rejection of the resulting security document body.

[0012] The data cards are usually laminated from several individual thermoplastic films into a compact body by applying pressure and temperature, after which the individual layers can no longer be separated without destruction.

[0013] However, if the individual layers of a data card are bonded together with adhesive, there is a potential risk that a counterfeiter could find a way to separate the individual layers. A counterfeiter could exploit, for example, the thermal, mechanical, or chemical differences between the adhesive and the foil layers for their own purposes. For this reason, an adhesive layer is generally more vulnerable to delamination for the purpose of replacing the entire hologram layer than a bond between similar material layers that have been thermally laminated together, especially under pressure.

[0014] The invention is therefore based on the object of providing an improved method for producing a lamination body with an integrated exposure hologram, which improves the insertion of the exposure hologram and improves the security against forgery, in particular with regard to a possible replacement of the exposure hologram, and has greater flexibility with regard to the arrangement and placement of the exposure hologram in a document body.

[0015] The invention is achieved by a method having the features of patent claim 1. Advantageous embodiments of the invention emerge from the subclaims.

[0016] The invention is based on the idea of ​​designing the exposure hologram in such a way that its area does not fill the entire surface of a thin document or laminated body composed of several layers, and of arranging the exposure hologram layer between two of several substrate layers whose surfaces are directly laminated to one another. The exposure hologram layer, in which the exposure hologram is stored, is arranged in such a way that the two directly connected substrate layers, between which the exposure hologram substrate is arranged, are laminated to one another circumferentially, and in fact completely circumferentially.The exposure hologram layer is thus completely covered on both its top and bottom sides by one of the two substrate layers, and is also surrounded circumferentially by an area in which the two substrate layers are directly bonded to one another. Thus, the exposure hologram layer cannot be attacked from the sides or from the top or bottom. To prevent a tendency to delamination in the surface area in which the exposure hologram layer is integrated into the lamination body, the exposure hologram layer is bonded with an adhesive to at least one of the two substrate layers, between which the exposure hologram layer is arranged and which are directly laminated to one another in a circumferential manner.This provides a high degree of flexibility regarding the arrangement of the exposure hologram in the exposure hologram layer and, at the same time, improved protection against tampering with the exposure hologram. Furthermore, handling and production are made more flexible and the occurrence of errors that lead to production rejects is reduced. Definitions

[0017] An exposure hologram is a hologram that is exposed onto a photosensitive material and stored within the photosensitive material. Holograms in which a surface layer is exposed and then, in subsequent processing steps, the surface of the exposed material is modified to store the hologram in the surface structure of the exposed material are not considered exposure holograms.

[0018] A thin hologram is a hologram in which the hologram information is stored in a layer of material whose thickness is on the order of the wavelength of the light diffracted by the hologram structures.

[0019] A volume hologram is a hologram in which the holographic information is stored in a volume area whose layer thickness corresponds to a multiple of the wavelength of the light that is diffracted by the hologram structures.

[0020] A volume reflection hologram is a hologram in which, during exposure, the reference light enters the recording material from one side and the object light from a diametrically opposite side. The object light can also be generated by diffraction at a layer illuminated by the reference light through the photographic recording material, and the object light is generated by reflective diffraction at the hologram layer.

[0021] A transmission hologram is a hologram in which the object light and the reference light enter the photographic material in which the transmission hologram is stored via the same surface.

[0022] A substrate layer is a self-supporting physical layer that is combined with other self-supporting layers to form a laminated body. Films, for example, are substrate layers.

[0023] A material layer is a layer of a solid body that is uniform in at least one respect. In a laminated body, each substrate layer that is joined to form the laminated body in the lamination step corresponds to at least one material layer in the laminated body. If a substrate layer itself consists of multiple material layers, then that substrate layer corresponds to multiple material layers in the laminated body.

[0024] An exposure hologram layer is a layer in which a hologram is stored or can be stored. This can, for example, comprise a photosensitive layer and a carrier layer. For example, the photosensitive layer is formed as a photopolymer and the carrier layer is made of polyurethane (PIT). However, the exposure hologram layer can comprise further material layers, such as a protective layer or multiple protective layers. Preferably, an exposure hologram layer is a layer in which an exposure hologram is stored in a developed and fixed photosensitive layer. Although an exposure hologram layer is a self-supporting layer that is combined with other layers to form a lamination body, it is not included here under the term substrate layer. For the purposes of this description, the term substrate layer does not refer to the exposure hologram layer.

[0025] A photosensitive layer is the layer into which interference structures forming a hologram can be and / or have been inscribed by means of an exposure process. Thus, a layer into which a hologram has been exposed, developed, and fixed is still referred to as a photosensitive layer, even though it can no longer be altered by light.

[0026] Lamination is the process in which several substrate layers made of thermoplastics are pressed together at elevated temperature and under pressure, whereby a strong bond is created between the layers through mutual diffusion of the polymers in the boundary layer. This is how the lamination body or the data card is formed. If the substrate layers that are laminated to form the data card are made of polycarbonate, for example, temperatures in the range of 165°C to 185°C and pressures in the range of 20 N / cm 2< to 120 N / cm 2< are required for lamination. Lamination in the manner described is also referred to here as pressure-temperature lamination. Analogously, lamination is referred to as pressure-temperature lamination, a lamination step is referred to as a pressure-temperature lamination step, and the lamination process is referred to as a pressure-temperature lamination process.

[0027] Lamination bodies that are laminated in the specified manner using increased pressure and temperature at the same time are also referred to here as pressure-temperature lamination bodies.

[0028] An adhesive is a process material used for bonding. An adhesive is a non-metallic material that can bond parts together through surface adhesion, known as adhesion, and internal strength, known as cohesion.

[0029] A curable adhesive is an adhesive in which internal crosslinking is initiated to develop strength. This crosslinking can occur in various ways, including polymerization, polyaddition, and polycondensation.

[0030] Tack is the initial stickiness of an adhesive, which describes its ability to immediately adhere to a substrate. The higher the tack of an adhesive, the greater its tendency to adhere to the substrate upon contact.

[0031] A material is considered transparent if an image can be formed through it according to geometric optics. A material is considered translucent if it allows light transmission but diffuses the light that passes through it. A layer is considered opaque if it does not allow light transmission or has a transmission of less than 5%, preferably less than 1%.

[0032] A substrate layer is transparent if it corresponds to a transparent material layer in the finished laminated lamination body.

[0033] An adhesive is considered transparent if it is transparent in the finished laminated body.

[0034] The same applies analogously to adhesives and adhesive layers. These are considered transparent if they are transparent in the assembled and, if applicable, cured state, i.e., in the finished laminated body. Preferred embodiments

[0035] A method for producing a lamination body with an integrated exposure hologram is provided, which comprises the steps of: providing a plurality of substrate layers; stacking the plurality of substrate layers one above the other to form a substrate layer stack; providing an exposure hologram layer; and carrying out a pressure-temperature lamination step for joining the plurality of substrate layers to form the lamination body, also referred to as a data body; wherein the exposure hologram layer is arranged between two of the plurality of substrate layers before the lamination step such that the two of the plurality of substrate layers are joined to one another in a planar manner completely circumferentially around the exposure hologram layer during the lamination step, wherein the exposure hologram layer is connected to at least one of the two of the plurality of substrate layers by means of an adhesive.

[0036] According to the invention, the exposure hologram layer is applied to one of the two substrate layers by means of a rolling and / or rolling process. This prevents air pockets between the adhesive and one of the two substrate layers or between the adhesive and the exposure hologram layer. Furthermore, sufficient pressure can be exerted to achieve a fixation of the exposure hologram layer to one of the two or more substrate layers by means of a tack of the adhesive.

[0037] In particular, according to the claimed method, a lamination body with an integrated exposure hologram is created, which comprises: a plurality of material layers which are joined together to form the lamination body from substrate layers corresponding to the material layers in a pressure-temperature lamination process, wherein an exposure hologram layer is integrated between two of the material layers and is connected to one of the two material layers at least on an outer surface by means of an adhesive, wherein the two material layers are joined together directly in a planar manner by means of the lamination all the way around the exposure hologram layer.

[0038] In order to form a particularly compact lamination body which is stable even when bent and does not tend to delaminate, a preferred embodiment provides that the adhesive completely covers at least one outer surface of the exposure hologram layer.

[0039] The adhesive is preferably transparent so as not to obstruct a view through the exposure hologram layer and the one of the two material layers located underneath, or to prevent markings on this or in this one of the two material layers from being obstructed by the adhesive. If the adhesive is arranged between the exposure hologram layer and an outer side of the lamination body, through which the reconstruction of the stored hologram takes place, the adhesive is transparent to at least the wavelength whose light reconstructs the hologram.

[0040] To further reduce compactness and the tendency to delaminate in the area of ​​the exposure hologram layer, a particularly preferred embodiment provides for the adhesive to be a cured adhesive. This means that the adhesive undergoes a crosslinking process after or during the bonding step.

[0041] In some embodiments, the adhesive is cured.

[0042] In one embodiment of the method, the adhesive is applied over the entire surface of one of the outer surfaces of the exposure hologram layer, in particular as an adhesive layer, and is then applied to one of the two or more substrate layers before or during the stacking of the substrate layers, such that a flat area of ​​one of the two or more substrate layers surrounding the applied exposure hologram layer is not covered by the exposure hologram layer and the adhesive is arranged between one outer surface of the exposure hologram layer and one of the two or more substrate layers. The application of the exposure hologram layer, which is smaller in area than the area of ​​a finished lamination body, can thus be applied to one of the substrate layers before the substrate layers are assembled to form the substrate layer stack.

[0043] In some embodiments, the adhesive preferably has a tack, and the exposure hologram layer is fixed to one of the two or more substrate layers by means of the tack during application. This fixation is sufficient for the exposure hologram layer to retain its position relative to one of the two or more substrate layers even when assembled with the other of the multiple substrate layers to form the substrate layer stack.

[0044] The adhesive is preferably designed in such a way that it is additionally cured, which is particularly preferably triggered simultaneously by the heat introduced into the substrate layer stack during the pressure-temperature lamination step.

[0045] In other embodiments, it may be provided that the crosslinking of the adhesive between the exposure hologram layer and one of the two or more substrate layers is carried out before the assembly or at least before the lamination step.

[0046] In one variant, it is provided that the adhesive in the lamination body or the data card is fully cured after application to the exposure hologram layer or during lamination.

[0047] In an alternative variant, it is provided that the adhesive in the lamination body or the data card is physically bonded in an already cross-linked form when applied to the exposure hologram layer.

[0048] Particularly preferably, the exposure hologram layer is bonded on both sides via one or two adhesives to both one and the other of the two substrate layers or material layers laminated directly to one another around the exposure hologram layer. Therefore, in one embodiment, in addition to the one outer surface of the exposure hologram layer, an opposite outer surface of the exposure hologram layer is provided with the same adhesive or a further adhesive, so that one outer surface of the exposure hologram layer is bonded to one of the two or more substrate layers by means of the adhesive, and the opposite outer surface of the exposure hologram layer is bonded to the other of the two hologram layers by means of the adhesive or the further adhesive.Thus, it is particularly preferred for one outer surface and the opposite outer surface to each be provided with an adhesive layer, which are each designed, for example, as adhesive films and can be bonded to the exposure hologram layer to form a film composite. The adhesive applied to one outer surface of the exposure hologram layer can have a tack in order to fix the exposure hologram thereto by means of the tack before the substrate layers are assembled to form the substrate layer stack. The adhesive layer formed on the opposite outer surface or the adhesive applied there or the further adhesive is preferably designed such that it has no tack, so that assembly of the substrate layers and relative alignment of the substrate layers in the substrate layer stack is not hindered.However, the adhesive on one outer surface and the adhesive on the opposite outer surface are preferably designed as curable adhesives. Particularly preferably, both are cured during lamination at the required temperature.

[0049] Preferably, the adhesive is applied to the exposure hologram layer, which is then applied together with the adhesive or adhesive layer to one of the two or more substrate layers. However, embodiments are also possible in which the adhesive is first applied to one of the two or more substrate layers in the area in which the exposure hologram layer is applied. In any case, however, the areas of one substrate layer and the other substrate layer of the multiple substrate layers remain adhesive-free surrounding the exposure hologram layer applied between the two or more substrate layers, so that the material from which one and the other of the substrate layers are formed are directly bonded to one another during the pressure-temperature lamination process.Particularly preferably, the two material layers between which the exposure hologram layer is or will be arranged are made of the same plastic material. Particularly preferably, the substrate layers are made of polycarbonate. However, it is also possible to use other plastic materials such as those used in lamination bodies for security documents. These include, for example, PET, PET-G, ABS, PVC and composite materials. Particularly preferably, however, all substrate layers that are joined together to form the lamination body are made of the same plastic, preferably all polycarbonate substrate layers. This results in a particularly stable and durable lamination body in which no phase transitions can be detected in the plastic structure between the individual material layers that correspond to the substrate layers from which the lamination body is joined together in the joining process.The individual material layers can only be distinguished by security elements arranged between them, such as the exposure hologram layer or other security elements and / or markings, and, where appropriate, by fillers in the various original substrate layers in the lamination body.

[0050] The invention is explained in more detail below with reference to a drawing. Herein: Fig. 1 a schematic exploded view of a lamination body; Fig. 2 a sectional view of the lamination body according to Fig. 1 ; Fig. 3 a schematic plan view of a lamination body according to Fig. 1 and Fig. 2 ; Fig. 4 a further schematic exploded view of a lamination body; Fig. 5 a schematic sectional view of the lamination body according to Fig. 4 ; Fig. 6 a schematic plan view of the lamination body according to Fig. 4 and Fig. 5; Fig. 7-9 schematic representations for the application of the exposure hologram layer to one of the substrate layers by means of a rolling process.

[0051] In Fig. 1 is shown schematically an exploded view of a substrate layer stack from which a lamination body 10 for a security document 1, as shown in Fig. 2 is shown schematically in the sectional drawing and in Fig. 3 shown as a top view.

[0052] In the substrate layer stack 300, a plurality of substrate layers 20 are layered one above the other. In the illustrated embodiment, an exposure hologram layer 80 is arranged between two of the substrate layers 25. In the illustrated embodiment, the exposure hologram layer 80 is arranged on a substrate layer 50 of the two substrate layers 25, of the plurality of substrate layers 20, which are joined together directly in a planar manner around the exposure hologram layer 80. This means that the exposure hologram layer 80 is fixed to the one substrate layer 50 of the two substrate layers 25 by means of an adhesive 91. Here, the exposure hologram layer 80 is arranged on the one substrate layer 50 of the two substrate layers 25 such that a planar free region 55, which is shown hatched here, is free around the exposure hologram layer 80, i.e.is covered neither by the exposure hologram layer 80 nor by the adhesive 91. Accordingly, another substrate layer 40 of the two substrate layers 25 also has, on its underside 42, an uncovered region 45 circumferentially surrounding a contact surface 49 with the exposure hologram layer 80, which uncovered region 45 comes into contact with the uncovered free region 55 on the top side 51 of one substrate layer 50 during a lamination step. As a result, in the lamination step, material of one substrate layer 50 is joined with material of the other substrate layer 40, between which the exposure hologram layer 80 is arranged, circumferentially around the exposure hologram layer 80.

[0053] In the substrate layer stack 300, a further substrate layer 30, which serves as a cover and protective layer in the finished lamination body 10, is arranged above the other substrate layer 40. At least the other substrate layer 40 and the further substrate layer 30 are transparent to the wavelength that corresponds to the wavelength of the reconstruction light with which the stored hologram in the exposure hologram layer 80 can be reconstructed, provided that the hologram stored in the exposure hologram layer 80 is a volume reflection hologram. An additional substrate layer 60 and yet another substrate layer 70, which also serves as a cover and protective layer in the finished lamination body 70, are arranged below the one substrate layer 50.

[0054] If the hologram stored in the exposure hologram layer 80 is a transmission hologram, the one substrate layer 50, the additional substrate layer 60, and the yet another substrate layer 70, like the other substrate layer 40 and the further substrate layer 30, are transparent at least to the wavelength of light with which the stored hologram of the exposure hologram layer 80 can be reconstructed. The adhesive 91, which is arranged between the exposure hologram layer 80 and the one substrate layer 50 of the two substrate layers 25, is preferably applied over the entire surface 81, which in the illustration is the lower surface 83 of the exposure hologram layer 80. The adhesive is preferably formed as an adhesive layer 92.

[0055] The adhesive 91 is preferably a curable adhesive, which, however, has sufficient tack on the side facing the one substrate layer 50 when the exposure hologram layer 80 is applied to the one substrate layer 50, which preferably occurs before the substrate layers 20 are assembled to form the substrate layer stack 300, so that the exposure hologram layer 80 can be fixed to the one substrate layer 50. The curing of the adhesive 91 of the adhesive layer 92 preferably occurs during the pressure-temperature lamination process via the thermal energy introduced into the substrate layer stack 300.

[0056] Other embodiments may provide for the crosslinking and curing of the adhesive 91 in the adhesive layer 92 to be triggered or effected by UV radiation. This can also occur during lamination or even beforehand. Heat-triggered curing of the adhesive 91 can also occur before the one substrate layer 50 is assembled with the remaining substrate layers 20 to form the substrate layer stack 300.

[0057] In Fig. 2 is a schematic sectional view through the lamination body 10 of a security document 1, along a section line AA, as in Fig. 3shown. In the lamination body 10, material layers 120 correspond to the multiple substrate layers 20 of the substrate layer stack 300. The exposure hologram layer 80 is thus enclosed between two material layers 125, i.e., between one material layer 150 and another of the two material layers 125, namely the material layer 140, in the lamination body 10. The exposure hologram layer 80 is thus circumferentially surrounded by a joint at which the one material layer 150 is immediately and directly connected to the other material layer 140 of the two material layers 125 in the lamination body 10. In addition, the exposure hologram layer 80 is firmly bonded to the one material layer 150 via the adhesive 91 of the adhesive layer 92. Even when the lamination body 10 bends, there is therefore no tendency for delamination in the region of the exposure hologram layer 80.The remaining material layers 120 also correspond accordingly with one of the substrate layers 20. Thus, the further material layer 130, which serves as a cover layer, corresponds to the further substrate layer 30. The additional material layer 160 corresponds accordingly with the additional substrate layer 60, and the yet another material layer 170 corresponds accordingly with the yet another substrate layer 70.

[0058] Fig. 2 shows a sectional view of the Fig. 3 lamination body 10 of the security document 1 shown in plan view along a section line AA, which in Fig. 3 In the sectional view of the Fig. 2Individualization prints 200, which comprise a printed portrait image 210 and a serial number 220, are schematically indicated. These are preferably printed on an underside 52 of one substrate layer 50. This enables precise alignment and placement of the exposure hologram layer 80 relative to these individualization prints 200 when applying the exposure hologram layer 80 to the one substrate layer 50.

[0059] In other embodiments, the individualization prints can be printed on other substrate layer surfaces, even on different substrate layer surfaces. Preferably, the individualization prints are applied only to those substrate layer surfaces that are internal to the security document, i.e., those that face another substrate layer surface during lamination. This provides better protection against tampering.

[0060] As can be seen from the top view of the lamination body 10 of the security document 1, which is Fig. 3 As can be seen schematically, the exposure hologram layer 80 overlaps the individualization print 200 of the serial number 220. Thus, it is possible, for example, to form a part of the serial number 220 in the holographically stored information 400 as a partially duplicated serial number 420 aligned relative to the printed serial number 220 such that, upon reconstruction, the serial number 420 reproduces a part of this serial number aligned with the printed serial number. In other embodiments, the partially duplicated serial number 420 can be arranged above the printed serial number 220 such that, upon reconstruction, the partially duplicated serial number 420 can be detected as congruent with the printed serial number 220.

[0061] In addition to the partially duplicated serial number 420, the holographic information in the illustrated embodiment also contains a holographic portrait image 410, which replicates the printed portrait image 320 as holographic information.

[0062] The security document 1 can also contain further security elements in the lamination body 10, such as a chip or the like. In the illustrated embodiment, the one material layer 150, the other material layer 140, and the further material layer 30, as well as the exposure hologram layer 80 and the adhesive 91 in the adhesive layer 92, are all transparent, so that the individualization prints 200 arranged between the additional material layer 160 and the one material layer 150 can be detected. The additional material layer 160 can be transparent, translucent, or opaque. If the stored hologram is a transmission hologram, all material layers 120 and the adhesive layer 92 are transparent, at least in the region of the hologram or holograms. The yet further material layer 170 is generally also transparent.

[0063] In Fig. 4 to Fig. 6are a substrate layer stack 300, a cross section along a line AA through a further lamination body 10 of a security document 1 and a security document in plan view correspondingly analogous to Fig. 1 to Fig. 3shown. Identical technical features have the same reference numerals in all figures. This embodiment differs in that a further adhesive layer 93 is also applied over the entire surface of an outer surface 82 opposite the one outer surface 81 of the exposure hologram layer 80, which in this case is the top side 84, so that the exposure hologram layer 80 is bonded over its entire surface both to the one material layer 150 via the adhesive layer 92 and to the other material layer 140 via the further adhesive layer 93. This further increases the stability of the lamination body 10, in particular with regard to tendencies towards delamination when the document body 1 is bent. Both the adhesive layer 92 and the further adhesive layer 93 are transparent in the fully laminated state and do not hinder reconstruction of the holographic information 400 in the exposure hologram layer 80.The adhesive layer 92 and the further adhesive layer 93 can comprise the same adhesive material or different adhesive materials. Preferably, the same adhesive material is used. In any case, the adhesive materials used are preferably curable.

[0064] Curing particularly preferably occurs during lamination due to the elevated temperature required during this process. During this process, the substrate layers 20 of the substrate layer stack 300 are laminated to form the lamination body 10.

[0065] In Fig. 7 to Fig. 9The application of the exposure hologram layer 80 to the one substrate layer 50 prior to assembly into the substrate layer stack 300 is schematically illustrated by way of example using a roller process. The exposure hologram layer 80 is applied to a roller 600. This is fully coated with an adhesive layer 92 at least on one outer surface 81. This one outer surface 81 faces away from a roller 600. The exposure hologram layer 80 adheres to the roller 600, for example, by the roller 600 itself having a surface with a tack that is sufficient for the exposure hologram layer 80 to adhere to the roller 600. The adhesive layer 92 on the one outer surface 81 of the exposure hologram layer 80 preferably has a greater tack, so that when the roller 600 rolls over the one substrate layer 50, the exposure hologram layer 80 is applied and fixed to the one substrate layer 50.Since the tack of the adhesive layer 92 is greater than the tack of the roller 600, the exposure hologram layer 80 remains adhered to the one substrate layer 50 while the roller 600 is rolled over the one substrate layer 50.

[0066] In other embodiments (not shown), the exposure hologram layer can also be adhered to the roller via the further adhesive layer, which is applied over the entire surface of the outer surface opposite the one outer surface, which faces the roller. In these embodiments, the tack of the further adhesive layer is preferably lower than the tack of the one adhesive layer, which comes into contact with the one substrate layer when the roller rolls. This can be achieved, for example, by heat, for example in the form of infrared radiation, being introduced into the one adhesive layer immediately before it comes into contact with the one substrate layer, to heat the exposure hologram layer orone adhesive layer is irradiated and thereby the tack of the adhesive layer is increased compared to the other adhesive layer, so that when the roller rolls off, the exposure hologram layer adheres to one substrate layer and the other adhesive layer detaches from the roller.

[0067] Application by roller is advantageous in order to avoid air inclusions and to achieve correct positioning, for example, relative to customization prints or other prints which are printed on the upper side 51 of the substrate layer to which the exposure hologram layer 80 is applied, or also on the underside 52 of the substrate layer 50.

[0068] There are also many other possibilities for placing the exposure hologram layer between one substrate layer 30 and the other substrate layer 40. It is advantageous if the exposure hologram layer has as little or no tack as possible on the outer surface 82 opposite the one outer surface 81 after the exposure hologram layer has been placed on the one substrate layer. As a result, when the substrate layers 20 are assembled, alignment of the substrate layers is not hindered by the additional adhesive layer 93, which then faces the other substrate layer 40.

[0069] The adhesion of the exposure hologram layer 80 to the roller 600 via the further adhesive layer 93 can be achieved, for example, by slightly preheating the roller. As a result, the tack of the adhesive of the further adhesive layer is slightly increased due to the heating. After the exposure hologram layer has been applied to the one substrate layer 50 and the further adhesive layer 93 has cooled down again, it preferably has no or very little tack. During the lamination step, the connection between the exposure hologram layer and the other of the substrate layers is then established, on the one hand, by the tack being formed again during heating, but in particular by the further adhesive layer being cured during the lamination process, i.e., crosslinking takes place in the adhesive.

[0070] It will be understood by those skilled in the art that merely exemplary embodiments are described here. In particular, the number of material layers in the lamination body or the number of substrate layers in the substrate layer stack may differ from the number shown here. All that is necessary is that the exposure hologram layer is arranged between two material layers, preferably made of the same plastic material, such that these two material layers are directly joined together circumferentially around the exposure hologram layer during the lamination step. List of reference symbols

[0071] 1Security document 10Lamination body 20Substrate layers 25Two substrate layers 30Further substrate layer 40Other of the two substrate layers 42Bottom side 45(circumferential) uncovered area 49Contact surface 50One of the two substrate layers 51Top side 52Bottom side 55(circumferential) free area 60Additional substrate layer 70Yet another substrate layer 80Exposure hologram layer 81An outer surface 82Opposite outer surface 83Lower surface 84Upper surface 91Adhesive 92Adhesive layer 93Further adhesive layer 120Material layers 125Two material layers 130Further material layer 140Another material layer 150One material layer 160Additional material layer 170Yet another material layer 185Joint connection 200Customization prints 210Printed material Portrait image 220Serial number 250Further security element 300Substrate layer stack 400Holographic information 410Holographic portrait image 420Partially duplicated serial number 450FurtherSafety elements 600 roller

Claims

1. A method of manufacturing a lamination body (10) having an integrated exposure hologram comprising the steps of (20): providing a plurality of substrate layers; superposing the plurality of substrate layers (20) to form a substrate layer stack (300); providing an exposure hologram layer (80); and performing a pressure-temperature lamination step to join the plurality of substrate layers (20) together to form the lamination body (10); wherein the exposure hologram layer (80) is disposed between two substrate layers (25) of the plurality of substrate layers (20) prior to the laminating step such that the two substrate layers (25) of the plurality of substrate layers (20) are directly bonded to each other in a completely circumferential manner around the exposure hologram layer (80) in the laminating step, wherein the exposure hologram layer (80) is bonded to at least one substrate layer (20) of the two substrate layers (25) of the plurality of substrate layers (20) by means of an adhesive (91), wherein the exposure hologram layer (80) comprises the integrated exposure hologram which is exposed into a photosensitive material of the exposure hologram layer (80) and stored inside the photosensitive material, characterized in that the exposure hologram layer (80) is applied to the one substrate layer (50) of the two substrate layers (25) by means of a winding and / or rolling process.

2. Method according to claim 1, characterized in that the adhesive (91) is applied over the entire surface of an outer surface (81) of the exposure hologram layer (80) and is then applied to the one substrate layer (50) of the two substrate layers (25) of the plurality of substrate layers (20) before or during the superposition of the substrate layers (20), so that a planar region (55) of one of the two substrate layers (25) of the plurality of substrate layers (20) around the applied exposure hologram layer (80) is not covered by the exposure hologram layer (80) and the adhesive (91) is arranged between the one outer surface (81) of the exposure hologram layer (80) and the one substrate layer (50) of the two substrate layers (25) of the plurality of substrate layers.

3. Process according to claim 1 or 2, characterized in that the adhesive (91) is cured.

4. Method according to any one of claims 1 to 3, characterized in that the adhesive (91) comprises a tack and the exposure hologram layer (80) is fixed on the one substrate layer (50) of the two substrate layers (25) of the plurality of substrate layers (20) by means of the tack during application.

5. Method according to one of claims 1 to 4, characterized in that in addition to the one outer surface (81) of the exposure hologram layer (80), an opposite outer surface (82) of the exposure hologram layer (80) is provided with the same adhesive (91) or a further adhesive, so that the one outer surface (81) of the exposure hologram layer (80) is bonded by means of the adhesive (91) to the one substrate layer (50) of the two substrate layers (25) and the opposite outer surface (82) of the exposure hologram layer (80) is bonded to the other substrate layer (40) of the two hologram layers (20) by means of the adhesive (91) or the further adhesive.