TEMPERATURE CONTROL ARRANGEMENT FOR A MICROELECTRIC SYSTEM

Description

[0001] The invention relates to a temperature control arrangement for a microelectric system. The present invention also relates to a microelectric system with such a temperature control arrangement.

[0002] Magnetohydrodynamics (MHD) is a subfield of physics. It describes the behavior of electrically conductive fluids permeated by magnetic and electric fields. Magnetohydrodynamics in the narrower sense deals with liquids, especially plasmas, which are described as fluids within the framework of MHD. Typical applications of magnetohydrodynamics include flow control and flow measurement in metallurgy and semiconductor single-crystal growth. In metallurgy, for example, magnetic fields can be used to influence the flow of liquid metals, such as steel or aluminum. A distinction is made between static and time-dependent magnetic fields. Static, i.e., time-independent, magnetic fields dampen turbulence and are therefore used, for example, in the form of magnetic brakes in the continuous casting of steel.Time-dependent magnetic fields are used, for example, for electromagnetic support during the casting of aluminum.

[0003] From DE 10 2017 214 173 A1, a hydraulic actuator device for a hydraulic system filled with an electrically conductive medium is known. The hydraulic actuator device can be arranged on and / or in the hydraulic system and comprises at least one actuator module, each configured such that at least a subset of the electrically conductive medium can be accelerated into at least a partial volume of the hydraulic system due to its interaction with an electric current flow generated by the respective actuator module and / or with a magnetic field generated by the respective actuator module, thereby causing a pressure build-up in the at least partial volume of the hydraulic system. Furthermore, a temperature control device, a sensor device, and a hydraulic system with such a hydraulic actuator device are disclosed.Furthermore, a method for generating pressure in at least a partial volume of a hydraulic system filled with an electrically conductive medium, a method for temperature-controlling an electrically conductive medium in a hydraulic system, and a method for determining information regarding the flow velocity of an electrically conductive medium in a hydraulic system are disclosed. The temperature-control device comprises at least one electrode through which a heating current can be introduced into the electrically conductive medium of the hydraulic system, thereby generating heat in the electrically conductive medium and preventing it from solidifying.

[0004] US Patent 6,658,861 B1 discloses a cooling system for a high-performance system that extracts heat from a high-power-density device and dissipates this heat at a remote location via a heat sink. In the cooling system, liquid metal circulates in a closed duct, utilizing one or more electromagnetic pumps to remove heat from the high-power-density device and transfer it to the remotely located heat sink. The system can utilize a thermoelectric generator to drive the electromagnetic pumps by exploiting the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed ducts with series and parallel arrangements of electromagnetic pumps for heat dissipation from multiple devices to a remotely located heat sink.Such an electromagnetic pump consists of a pair of electrode plates arranged vertically opposite each other. A direct current (DC) voltage is applied to the electrode plates. This DC voltage generates an electric field across the electrode plates. A pair of permanent magnets is positioned facing each other above and below the plane containing the electrode plates. A pipe carries liquid metal. The direction of the magnetic field generated by the permanent magnets is perpendicular to the direction of the electric field provided by the electrode plates. An electromagnetic force acts on the liquid metal, causing it to flow in a direction perpendicular to the plane of the electric and magnetic fields. Disclosure of the invention

[0005] The temperature control arrangement for a microelectronic system with the features of independent claim 1 and the microelectronic system with the features of independent claim 12 each have the advantage that scalable temperature control (cooling or heating) for objects to be temperature-controlled by microelectronic systems is made possible without disturbing the objects to be temperature-controlled by unwanted electrical or electromagnetic effects.

[0006] The core of the invention is a magnetohydrodynamic pump with two pump modules, which are electrically connected in series to pump suitable electrically and thermally conductive media for temperature control, i.e., for cooling or heating the objects to be temperature controlled, such as electronic components, semiconductor devices, control units, etc. By connecting several pump modules in series, the required electrical current can be significantly reduced compared to a single pump module at the same voltage, corresponding to the number of pump modules connected in series. This reduces electrical and electromagnetic interference with the objects to be temperature controlled and allows the pump modules to be made smaller.Compared to known systems with a single pump module, connecting at least two pump modules in series also reduces electrical losses in the electrically and thermally conductive medium and in the electrical supply line of the magnetohydrodynamic pump, thereby increasing efficiency. Furthermore, depending on the structure of an associated closed channel system, corresponding channels of the system or areas of the object to be cooled can be individually controlled as needed, enabling uniform cooling or heating and a uniform temperature distribution across the object. This results in less mechanical stress and heat flow.Since the individual pump modules can be made very small, any channel structure, for example down to the silicon level, can be individually controlled with respect to the temperature in the at least one channel by means of associated pump modules, so that corresponding semiconductor structures can be optimally temperature-controlled. The temperature control or cooling of other electronic components, such as electrolytic capacitors, can also be optimally achieved with embodiments of the temperature control arrangement according to the invention. This can significantly improve the service life of the electrolytic capacitors and thus reduce capacitance requirements, thereby reducing installation space and vibration resistance problems in the corresponding microelectronic system.

[0007] Embodiments of the present invention provide a temperature control arrangement for a microelectronic system, comprising a closed channel system which includes at least one channel for guiding an electrically and thermally conductive medium and is thermally coupled to at least one object of the microelectronic system to be temperature controlled, and a magnetohydrodynamic pump with several magnetohydrodynamic modules, each of which has an electrode assembly with two electrodes and a magnet assembly which generates a magnetic field. At least two magnetohydrodynamic modules are configured as pump modules and are electrically connected in series.In the pump modules, a first electrode of the electrode device introduces an electric current flow with a predetermined current density into the electrically and thermally conductive medium at at least one channel section, and a second electrode of the electrode device conducts the electric current flow out of the electrically and thermally conductive medium at the at least one channel section, so that an interaction of the electrically and thermally conductive medium guided in the closed channel system with the introduced electric current flow and with the generated magnetic field produces a Lorentz force, which selectively accelerates the electrically and thermally conductive medium in the at least one channel section, and a resulting pressure build-up causes a desired volume flow of the electrically and thermally conductive medium through the at least one channel of the closed channel system.

[0008] The volume flow of the electrically and thermally conductive medium causes the temperature of the at least one object to be temperature controlled, wherein the electrically and thermally conductive medium transfers heat to the at least one object to be temperature controlled during a heating process or absorbs heat from the at least one object to be temperature controlled during a cooling process.

[0009] The at least two pump modules are arranged fluidically in series within a common channel. This electrical and fluidic series connection increases electrical efficiency and reduces EMC problems. The series connection of the at least two pump modules generates a pressure in the electrically and thermally conductive medium of the corresponding channel, which increases with each pump module and drives the volumetric flow through the at least one channel of the closed channel system. The at least two pump modules arranged fluidically in series can, for example, be positioned one after the other before or after the at least one object to be heated or cooled. Due to the adjacent arrangement of the at least two pump modules, a partial flow can pass through the electrically and thermally conductive medium.This partial flow can be used to heat the electrically and thermally conductive medium in the channel system at temperatures below the lowest specified temperature. According to the invention, the at least two pump modules arranged fluidically in series are separated from one another. At least one first pump module is located upstream and at least one second pump module is located downstream of the at least one object to be heated. This arrangement allows the at least one first pump module upstream of the object to be heated to be designed such that the pressure is sufficient to drive a sufficient volume flow through the channel system in the area of ​​the object to be heated. The at least one second pump module downstream of the object to be heated can then be designed to drive a sufficient volume flow through the remaining channel system. The at least one second pump module can also perform suction, to a limited extent.An advantage of this arrangement is that it avoids unnecessary pressure on the closed channel system in the area of ​​the object being cooled, and thus also avoids mechanical stress on the object. This allows for thinner walls in the closed channel system. A pendulum cooling system is also conceivable, meaning that the electrically and thermally conductive medium can be moved in one direction and then the other by reversing the current direction in the magnetohydrodynamic pump.

[0010] Furthermore, a microelectric system with at least one object to be tempered and at least one such tempering arrangement for tempering the at least one object to be tempered is proposed.

[0011] Embodiments of the temperature control arrangement according to the invention enable, for example, significantly more powerful and efficient microelectronic systems compared to the prior art, through individual and / or dynamic and / or stepless and / or targeted and / or uniform cooling of individual electronic or electrical components of the microelectronic system. If required, individual and / or dynamic and / or stepless and / or targeted and / or uniform heating of the individual electronic or electrical components of the microelectronic system is also possible.

[0012] Furthermore, the use of multiple pump modules in the magnetohydrodynamic pump allows for a smaller design of each individual pump module. This compact design, combined with the use of multiple pump modules, enables more flexible and efficient use of the available installation space compared to using a single large pump module. Additionally, the absence of mechanically moving parts results in low mechanical wear and quiet operation of the magnetohydrodynamic pump.

[0013] An electrically and thermally conductive medium is defined below as a medium with an electrical conductivity greater than 1 S / m (Siemens per meter). Preferably, the electrically and thermally conductive medium has a significantly higher electrical conductivity (100 to 1000 S / m). Examples of electrically and thermally conductive media include an electrically and thermally conductive liquid, an electrically and thermally conductive gas, an ionic liquid, at least one electrolyte, at least one plasma, at least one liquid metal such as gallium, lithium, sodium, or mercury, and / or at least one liquid metal alloy such as a sodium-potassium alloy. Preferably, a non-toxic liquid metal alloy of gallium, indium, and tin can be used as the electrically and thermally conductive medium.This substance is liquid at atmospheric pressure even at temperatures as low as -20°C and can easily be heated from a lower temperature to -20°C or higher. However, the examples described here for this electrically and thermally conductive medium are not exhaustive.

[0014] The measures and further developments listed in the dependent claims enable advantageous improvements to the temperature control arrangement for a microelectric system specified in independent claim 1 and to the microelectric system specified in independent claim 12.

[0015] A particular advantage is that the closed duct system can be thermally coupled to at least one heat exchanger, which can function as a heating element for heating or as a cooling element for cooling. This means that the heat exchanger thermally coupled to the duct system transfers heat to the electrically and thermally conductive medium during heating and absorbs heat from the electrically and thermally conductive medium during cooling.

[0016] In a further advantageous embodiment of the temperature control arrangement, the closed channel system can be at least partially arranged within a thermally conductive base body, which is thermally coupled to the at least one object to be temperature controlled. This means that, during cooling operation, the base body can act as a cooling element, transferring heat from the object to be temperature controlled into the electrically and thermally conductive medium, and during heating operation, it can act as a heating element, extracting heat from the electrically and thermally conductive medium and transferring it to the object to be temperature controlled. Furthermore, the base body can completely house the closed channel system and the magnetohydrodynamic pump. This enables a particularly compact design of the temperature control arrangement.The base body can, for example, be thermally coupled directly or via a thermally conductive interface material to a top or bottom surface of the at least one object to be temperature-controlled. Alternatively, a circuit board or a circuit carrier can be arranged between the base body and the object to be temperature-controlled, so that the base body can be thermally coupled to a top or bottom surface of the at least one object to be temperature-controlled via at least one thermally conductive via.

[0017] In a further advantageous embodiment of the temperature control arrangement, the at least one channel can be surrounded by electrical insulation, at least within the base body. This prevents an unintentional short circuit between the electrically and thermally conductive medium and the base body, since a partial current can flow through the electrically and thermally conductive medium if the pump modules of the magnetohydrodynamic pump are connected in series.

[0018] In a further advantageous embodiment of the temperature control arrangement, at least one magnetohydrodynamic module can be designed as a sensor module. In this module, the electrodes of the electrode device can detect an induced voltage on the at least one channel section. This voltage results from the volume flow rate of the electrically and thermally conductive medium in conjunction with the generated magnetic field of the magnet device. From this voltage, the flow velocity of the electrically and thermally conductive medium can be determined. Since the induced voltage is proportional to the flow rate, flow rate control is also possible to optimally cool or heat the object being temperature-controlled. By measuring the temperature of the electrically and thermally conductive medium and utilizing the temperature dependence of its electrical conductivity, dynamic and targeted temperature control is possible.For temperature measurement, the magnetohydrodynamic pump can be briefly switched off to determine the conductivity of the electrically and thermally conductive medium, for example, using a measuring bridge. In addition to the at least two pump modules, a magnetohydrodynamic module can be used as a sensor module. Alternatively, at least one magnetohydrodynamic module can be switchable, operating in a pump mode and a sensor mode. The first mode can correspond to pump operation, and the second to measurement operation. This eliminates the need for one magnetohydrodynamic module. By measuring the flow velocity, it can be determined whether the magnetohydrodynamic pump is switched off and the electrically and thermally conductive medium is no longer moving.Instead of conductivity measurement, explicit temperature sensors can also be used at the inlets or outlets of the channels, or distributed across the surface of the base unit, to control the pump modules individually or according to demand. Furthermore, temperature sensors can also be used within the object being cooled. By measuring the flow velocity and / or the temperature of the electrically and thermally conductive medium, precise control of individual channels is achieved through a direct operating principle. Moreover, efficient pumping of the electrically and thermally conductive medium through the channel structure of the closed channel system is possible.

[0019] In a further advantageous embodiment of the temperature control arrangement, the at least two pump modules can be arranged fluidically in parallel within at least two parallel channels. This enables targeted control of individual channels within the closed channel system. In at least one of the at least two parallel channels, at least two magnetohydrodynamic modules can be arranged fluidically in series. This fluidic parallel connection of the at least two pump modules allows the total volume flow in the closed channel system to be increased without further increasing the pressure. In conjunction with the temperature measurement described above, individual volume flow can be achieved in the individual parallel channels to, for example, avoid hotspots on the object being temperature controlled.The aim is to selectively cool areas of the object being cooled, to ensure a uniform temperature, or to achieve a specific temperature distribution. A higher spatial resolution of the temperature measurement is also conceivable through local temperature measurements, for example, using two consecutive electrodes on one side of each channel section. These electrodes can either be integrated into the pump modules or mounted separately along the channel section. Furthermore, the temperature can also be measured using two opposing electrodes of an electrode pair. To avoid any potential influence of the moving, electrically and thermally conductive medium on the measurement, it may be advisable to stop the pump modules during the measurement.

[0020] In a further advantageous embodiment of the temperature control arrangement, the at least one magnetic device can comprise at least two permanent magnets or at least one electrical coil device. A static magnetic field can be easily provided by using at least two permanent magnets. A time-varying magnetic field can be provided by using the at least one coil device.

[0021] In an advantageous embodiment of the microelectric system, the at least one temperature control arrangement and the at least one object to be temperature-controlled can be enclosed in a common casing. This enables a particularly compact design.

[0022] Exemplary embodiments of the invention are shown in the drawings and are explained in more detail in the following description. In the drawings, identical reference numerals denote components or elements that perform the same or analogous functions. Brief description of the drawings

[0023] Fig. 1 shows a schematic representation of a first embodiment of a temperature control arrangement according to the invention for a microelectric system. Fig. 2 shows a schematic representation of an embodiment of a magnetohydrodynamic pump 7 of the temperature control arrangement according to the invention. Fig. 1 . Fig. 3 shows a schematic sectional view along section line III - III in Fig. 2 . Fig. 4 shows a schematic representation of a first embodiment of a microelectrical system with the temperature control arrangement according to the invention. Figs. 1 to 3 . Fig. 5shows a schematic representation of a second embodiment of a microelectrical system with the temperature control arrangement according to the invention. Figs. 1 to 3 . Fig. 6 shows a schematic representation of a third embodiment of a microelectrical system with the temperature control arrangement according to the invention. Figs. 1 to 3 . Fig. 7 shows a schematic representation of a second embodiment of a temperature control arrangement for a microelectric system. Fig. 8 shows a schematic representation of a third embodiment of a temperature control arrangement according to the invention for a microelectric system. Fig. 9 shows a schematic representation of a fourth embodiment of a temperature control arrangement according to the invention for a microelectric system. Embodiments of the invention

[0024] As from Figs. 1 to 9As can be seen, the illustrated embodiments of a temperature control arrangement 1, 1A, 1B, 1C, 1D according to the invention for a microelectrical system 20, 20A, 20B, 20C, 20D each comprise a closed channel system 3, 3A, 3B, 3C, 3D, which includes at least one channel 4 for guiding an electrically and thermally conductive medium 5 and is thermally coupled to at least one object 9 of the microelectrical system 20, 20A, 20B, 20C, 20D to be temperature controlled, and a magnetohydrodynamic pump 7, 7A, 7B, 7C with several magnetohydrodynamic modules 10, each of which has an electrode device 12 with two electrodes 12A, 12B and a magnet device 14 which generates a magnetic field B. Here, at least two magnetohydrodynamic modules 10 are configured as pump modules 10A and 10B and are electrically connected in series. In the pump modules 10A,10B introduces a first electrode 12A of the electrode device 12 an electric current I with a predetermined current density j into the electrically and thermally conductive medium 5 at at least one channel section 4A, 4B, and a second electrode 12B of the electrode device 12 introduces the electric current I out of the electrically and thermally conductive medium 5 at the at least one channel section 4A, 4B, so that an interaction of the electrically and thermally conductive medium 5 guided in the closed channel system 3, 3A, 3B, 3C, 3D with the introduced electric current I and with the generated magnetic field B produces a Lorentz force FL which selectively accelerates the electrically and thermally conductive medium 5 in the at least one channel section 4A, 4B.and a resulting pressure build-up causes a desired volume flow of the electrically and thermally conductive medium 5 through the at least one channel 4 of the closed channel system 3, 3A, 3B, 3C, 3D. The volume flow of the electrically and thermally conductive medium 5 causes the temperature of the at least one object 9 to be temperature controlled, wherein the electrically and thermally conductive medium 5 transfers heat to the at least one object 9 to be temperature controlled during a heating process or absorbs heat from the at least one object 9 to be temperature controlled during a cooling process.

[0025] As from Figs. 1 and 2As can be further seen, the illustrated first embodiment of the magnetohydrodynamic pump 7A comprises two pump modules 10A and 10B connected electrically and fluidically in series. A first electrical contact K1 of the magnetohydrodynamic pump 7A is electrically connected via a first connecting line 17 to the first electrode 12A of a first electrode assembly 12 of a first pump module 10A. The second electrode 12B of the first electrode assembly 12 of the first pump module 10A is connected via a connecting line 16 to the first electrode 12A of a second electrode assembly 12 of a second pump module 10B. The second electrode 12B of the second electrode assembly 12 of the second pump module 10B is connected via a second connecting line 18 to a second electrical contact K2 of the magnetohydrodynamic pump 7A. The two magnetic devices 14 of the two pump modules 10A, 10B each comprise two permanent magnets 14A, 14B.In an alternative embodiment not shown, the at least one magnetic device 14 comprises at least one electrical coil device. Naturally, more than two pump modules 10A, 10B can also be connected in series. In this case, the series connection of pump modules 10A, 10B generates a pressure in the electrically and thermally conductive medium 5 that increases with each additional pump module 10A, 10B. This pressure drives the volumetric flow rate of the electrically and thermally conductive medium 5 through the closed channel system 3, 3A, 3B, 3C, 3D.

[0026] As from Figs. 4 to 9As can be further seen, the illustrated embodiments of the microelectronic system 20, 20A, 20B, 20C, 20D each comprise at least one object 9 to be temperature controlled and at least one temperature control arrangement 1, 1A, 1B, 1C, 1D for temperature controlling the at least one object 9 to be temperature controlled. In the illustrated embodiments, only one object 9 to be temperature controlled, designed as a semiconductor chip 9A, is shown in each case. Of course, the microelectronic system 20, 20A, 20B, 20C, 20D can also comprise several and / or other objects 9 to be temperature controlled, such as electronic and / or electrical components, semiconductor devices, control units, etc.

[0027] In the illustrated embodiments, the closed channel system 3, 3A, 3B, 3C, 3D is thermally coupled to at least one heat exchanger 8, which is configured as a heating element for the heating process or as a cooling element 8A for the cooling process. This means that during a heating process, the at least one heat exchanger 8 configured as a heating element transfers heat into the electrically and thermally conductive medium 5 in the closed channel system 3, 3A, 3B, 3C, 3D, which is then transferred from the electrically and thermally conductive medium 5 to the at least one object 9 to be cooled. During a cooling process, the at least one heat exchanger 8 configured as a cooling element 8A absorbs heat from the electrically and thermally conductive medium 5, which is then transferred from the at least one object 9 to be cooled to the electrically and thermally conductive medium 5.In the illustrated embodiments, a non-toxic liquid metal alloy of gallium, indium, and tin is used as the electrically and thermally conductive medium 5. Of course, other suitable fluids can also be used as the electrically and thermally conductive medium 5.

[0028] As from Figs. 1 to 9As can be further seen, the closed channel system 3, 3A, 3B, 3C, 3D is at least partially arranged in a thermally conductive base body 2, 2A, 2B, 2C, 2D, which is thermally coupled to the at least one object 9 to be tempered. The at least one channel 4 of the closed channel system 3, 3A, 3B, 3C, 3D is surrounded, at least within the base body 2, 2A, 2B, 2C, 2D, by electrical insulation 6, so that the at least one channel 4 is electrically insulated from the base body 2, 2A, 2B, 2C, 2D. Alternatively, the base body 2, 2A, 2B, 2C, 2D can consist of a thermally conductive but electrically insulating material, such as ceramic, and form the electrical insulation 6. Solutions with a composite of electrically insulating materials and metal are also possible.This may be particularly necessary where a high temperature differential is required for a thermal interface to a "hot spot" of the at least one object 9 to be cooled. This means that the electrical insulation can then also be achieved via a circuit carrier 24 or other insulation mechanisms.

[0029] At the in Figs. 1 to 6In the illustrated first embodiment of the temperature control arrangement 1A, the base body 2A completely accommodates the closed channel system 3A and the magnetohydrodynamic pump 7. The two electrical contacts K1, K2 of the magnetohydrodynamic pump 7A extend from the base body 2A to supply the pump with current I. The two electrical contacts K1, K2 are adapted to the existing contact elements of the corresponding microelectronic system 20A, 20B, 20C, and various suitable contacting techniques can be employed. Furthermore, in the illustrated first embodiment of the temperature control arrangement 1A, the closed channel system 3A comprises only a single channel 4, which is embedded in the base body 2A in a meandering pattern. Naturally, the magnetohydrodynamic pump 7 can have more than the two electrical contacts K1, K2 shown.

[0030] As from Fig. 4As can be further seen, in the illustrated first embodiment of the microelectronic system 20A, the base body 2A is thermally coupled directly to a top surface of the at least one object 9 to be temperature-controlled. To compensate for unevenness, a thermally conductive interface material can be introduced between the base body 2A and the top surface of the at least one object 9 to be temperature-controlled in an embodiment not shown. In the illustrated embodiment, the object 9 to be temperature-controlled, which is designed as a semiconductor chip 9A, is contacted on its underside with a circuit board 26, which in turn is contacted with a multilayer circuit carrier 24. Furthermore, the temperature control arrangement 1A and the at least one object 9 to be temperature-controlled are enclosed by a common housing 22.The base body 2A can be arranged completely within the enclosure 22 as shown, or at least project laterally on one side to provide more surface area for interaction with the environment. Naturally, the base body 2A can also project beyond the enclosure 22 on several sides.

[0031] As from Fig. 5As can be further seen, in the illustrated second embodiment of the microelectronic system 20B, the base body 2A is thermally coupled directly to a bottom surface of the at least one object 9 to be temperature-controlled. To compensate for unevenness, a thermally conductive interface material can be introduced between the base body 2A and the bottom surface of the at least one object 9 to be temperature-controlled in an embodiment not shown. In the illustrated embodiment, the illustrated base body 2A of the temperature control arrangement 1A is arranged on a multilayer circuit carrier 24 and thermally coupled to a top surface of a heat exchanger 8, designed as a cooling element 8A, via thermally conductive vias. Furthermore, the temperature control arrangement 1A and the at least one object 9 to be temperature-controlled are enclosed by a common casing 22.The base body 2A can be arranged completely within the enclosure 22 as shown, or at least project laterally on one side to provide more surface area for interaction with the environment. Naturally, the base body 2A can also project beyond the enclosure 22 on several sides.

[0032] As from Fig. 6 As can be further seen, in the illustrated third embodiment of the microelectronic system 20C, the base body 2A is arranged on a bottom side of a multilayer circuit carrier 24. The object 9 to be tempered is arranged on a top side of the multilayer circuit carrier 24 and surrounded by a casing 22. The base body 2A is thermally coupled to a bottom side of the at least one object 9 to be tempered via thermally conductive vias.

[0033] In an embodiment not shown, the base body 2 can be integrated as an inner layer into a multi-layered circuit carrier 24. In this case, the heat can be quickly conducted to the outer layers and dissipated there, for example, into a clamping edge of a housing, thus eliminating the need to arrange the objects 9 to be tempered near the clamping edge.

[0034] In another embodiment not shown, the base body 2 is shaped like a "heat pipe," allowing for longer distances between a heat source and a heat sink compared to a conventional "heat pipe." Here, the base body can be made of a material that makes it flexible or deformable in certain sections. The outer shape can, for example, be rectangular, so that flat surfaces of the "active" heat pipe can be thermally contacted with flat cooling surfaces of the at least one object 9 to be heated.

[0035] As from Fig. 7 As can be further seen, the illustrated second embodiment of the temperature control arrangement 1B, analogous to the first embodiment, comprises a magnetohydrodynamic pump 7A with two pump modules 10A, 10B, which are arranged fluidically in series in a common channel 4 of the closed channel system 3B. Fig. 7As can be further seen, the illustrated temperature control arrangement 1B comprises a base body 2B in which only a section of the at least one cooling channel 4 is arranged. The section of the cooling channel 4 arranged in the base body 2B is designed as a significantly wider cavity. The electrically and thermally conductive medium 5 is guided through this cavity in the base body 2B to enable area cooling of an object 9, designed as a semiconductor chip 9A, which is arranged on the base body 2B and is to be temperature controlled. The two pump modules 10A, 10B, arranged fluidically in series, are positioned one behind the other in front of the object 9 to be temperature controlled and the base body 2B, respectively. A heat exchanger 8, arranged as a cooling element 8A, is located between the object 9 to be temperature controlled and the base body 2B, respectively, and the magnetohydrodynamic pump 7A. The electrically and thermally conductive medium 5 flows through this heat exchanger.

[0036] As from Fig. 8As can be further seen, the illustrated third embodiment of the temperature control arrangement 1C comprises a magnetohydrodynamic pump 7B with at least two pump modules 10A, 10B arranged fluidically in series and separately from one another. Here, at least one first pump module 10A is arranged upstream and at least one second pump module 10B is arranged downstream of the at least one object 9 to be temperature controlled. As can be seen from Fig. 8As can be further seen, the illustrated temperature control arrangement 1C comprises a base body 2C in which only a section of the at least one cooling channel 4 is arranged. The section of the cooling channel 4 arranged in the base body 2C is designed as a significantly wider cavity in which additional pins are inserted perpendicular to the flow direction of the electrically and thermally conductive medium 5. The electrically and thermally conductive medium 5 is guided through this cavity in the base body 2C to enable area-wide cooling of an object 9, designed as a semiconductor chip 9A and arranged on the base body 2C, to be temperature controlled. The additional pins in the cavity improve the area distribution of the electrically and thermally conductive medium 5 in the cavity.Between the at least one second pump module 10B and the at least one first pump module 10A, a heat exchanger 8 arranged as a cooling element 8A is arranged, which is through which the electrically and thermally conductive medium 5 flows.

[0037] As from Fig. 9 As can be further seen, the illustrated fourth embodiment of the temperature control arrangement 1D comprises a channel system 3D with several fluidically parallel channels 4 with a common inlet and a common outlet, and a magnetohydrodynamic pump 7C with at least two pump modules 10A, 10B, which are fluidically parallel in at least two parallel channels 4. In the illustrated embodiment, four parallel channels 4 are arranged in a common base body 2D. As can be seen from Fig. 9As can be seen further, in each of the fluidically parallel channels 4, at least two pump modules 10A, 10B arranged in series are separately arranged from one another. In each of the individual channels 4, at least one first pump module 10A is arranged upstream and at least one second pump module 10B is arranged downstream of the at least one object 9 to be temperature controlled. Fig. 9As can be further seen, the illustrated temperature control arrangement 1D includes an additional magnetohydrodynamic module 10, designed as a sensor module 10C, in each of the four parallel channels. In such a sensor module 10C, the electrodes 12A, 12B of the electrode device 12 detect an induced voltage on the at least one channel section 4A, 4B. This voltage results from the volume flow rate of the electrically and thermally conductive medium 5 in conjunction with the generated magnetic field B of the magnet device 14, from which a flow velocity of the electrically and thermally conductive medium 5 can be determined. The sensor module also includes a temperature sensor (not shown) to determine the temperature of the electrically and thermally conductive medium 5 in the corresponding channel 4.The illustrated temperature control arrangement 1D, through the fluidic parallel connection of at least two pump modules 10A, 10B in conjunction with the temperature measurement described above, enables the realization of individual volume flow in the individual parallel channels 4. This allows, for example, the avoidance of hotspots on the object 9 to be cooled, the targeted cooling of loss-prone areas of the object 9, or the provision of a uniform temperature or a targeted temperature distribution. A heat exchanger 8, arranged as a cooling element 8A, is positioned between the common outlet and the common inlet of the fluidic parallel channels 4. The electrically and thermally conductive medium 5 flows through this heat exchanger.In the fourth embodiment of the temperature control arrangement 1D shown, several first pump modules 10A can be arranged in front of the object 9 to be temperature controlled and several second pump modules 10B can be arranged after the object 9 to be temperature controlled.

[0038] In another embodiment of the temperature control arrangement 1 (not shown), the magnetohydrodynamic modules 10 arranged downstream of the object 9 to be temperature controlled are switchable. The switchable magnetohydrodynamic modules 10 are operated in a first operating mode as a second pump module 10B and in a second operating mode as a sensor module 10C.

[0039] Embodiments of the temperature control arrangement according to the invention can be scaled as desired. This means that structural sizes smaller than 1 mm are possible. This applies in particular to the thickness of the base body and also to the channel diameters, which can be as small as a few micrometers. There are also no technical limitations to the size of the temperature control arrangement. This applies in particular to the area to be cooled, which can be connected to embodiments of the temperature control arrangement according to the invention. Due to the excellent scalability, embodiments of the temperature control arrangement according to the invention can dissipate heat energy ranging from a few milliwatts to megawatts. With embodiments of the temperature control arrangement according to the invention, it is possible to cool objects to slightly below the boiling point of the electrically and thermally conductive medium used.When using the liquid metal alloy of gallium, indium, and tin, the boiling point is 1300°C. This is significantly higher than the permissible temperature of pure water, water-glycol mixtures, or typical cooling media in known air conditioning compressors.

Claims

1. Temperature-control assembly (1) for a microelectric system (20), with a closed channel system (3), which comprises at least one channel (4) for guiding an electrically and thermally conductive medium (5) and can be thermally coupled to at least one object (9) to be temperature-controlled of the microelectric system (20), and a magneto hydrodynamic pump (7) with a plurality of magnetohydrodynamic modules (10), which each have an electrode device (12) with two electrodes (12A, 12B) and a magnet device (14) which generates a magnetic field (B), wherein at least two magnetohydrodynamic modules (10) are designed as pump modules (10A, 10B) and are electrically connected in series and arranged fluidically separate from one another in series in a common channel (4), wherein at least one first pump module (10A) is arranged upstream and at least one second pump module (10B) is arranged downstream of the at least one object (9) to be temperature-controlled, wherein in each of the pump modules (10A, 10B) a first electrode (12A) of the electrode device (12) conducts an electric current flow (I) with a predefined current density (j) into the electrically and thermally conductive medium (5) at at least one channel portion (4A, 4B) and a second electrode (12B) of the electrode device (12) conducts the electric current flow (I) out of the electrically and thermally conductive medium (5) at the at least one channel portion (4A, 4B), so that an interaction of the electrically and thermally conductive medium (5) guided in the closed channel system (3) with the conducted-in electric current flow (I) and with the generated magnetic field (B) produces a Lorentz force (FL), which specifically accelerates the electrically and thermally conductive medium (5) in the at least one channel portion (4A, 4B), and a resultant pressure build-up causes a desired volume flow of the electrically and thermally conductive medium (5) through the at least one channel (4) of the closed channel system (3), wherein the volume flow of the electrically and thermally conductive medium (5) has the effect of controlling the temperature of the at least one object (9) to be temperature-controlled, wherein the electrically and thermally conductive medium (5) is suitable for transferring heat to the at least one object (9) to be temperature-controlled during a heating process or absorbing heat from the at least one object (9) to be temperature-controlled during a cooling process.

2. Temperature-control assembly (1) according to Claim 1, characterized in that the closed channel system (3) is thermally coupled to at least one heat exchanger (8), which is designed as a heating element for the heating process or as a cooling element (8A) for the cooling process.

3. Temperature-control assembly (1) according to Claim 1 or 2, characterized in that the closed channel system (3) is at least partially arranged in a thermally conducting main body (2), which is part of the temperature-control assembly (1) and can be thermally coupled to the at least one object (9) to be temperature-controlled.

4. Temperature-control assembly (1) according to Claim 3, characterized in that the main body (2) completely accommodates the closed channel system (3) and the magnetohydrodynamic pump (7).

5. Temperature-control assembly (1) according to Claim 3 or 4, characterized in that the main body (2) can be thermally coupled directly or by way of a thermally conductive interface material to an upper side or an underside of the at least one object (9) to be temperature-controlled.

6. Temperature-control assembly (1) according to Claim 3 or 4, characterized in that the main body (2) can be thermally coupled by way of at least one thermally conductive via to an upper side or an underside of the at least one object (9) to be temperature-controlled.

7. Temperature-control assembly (1) according to one of Claims 3 to 6, characterized in that the at least one channel (4) is surrounded at least within the main body (2) by an electrical insulation (6).

8. Temperature-control assembly (1) according to one of Claims 1 to 7, characterized in that at least one magnetohydrodynamic module (10) is designed as a sensor module (10C) for which the electrodes (12A, 12B) of the electrode device (12) tap at the at least one channel portion (4A, 4B) an induction voltage which results from the volume flow of the electrically and thermally conductive medium (5) in interaction with the generated magnetic field (B) of the magnet device (14) and from which a flow velocity of the electrically and thermally conductive medium (5) can be ascertained.

9. Temperature-control assembly (1) according to one of Claims 1 to 8, characterized in that at least one magnetohydrodynamic module (10) is designed to be switchable and can be operated in a first operating mode as a pump module (10A, 10B) and in a second operating mode as a sensor module (10C).

10. Temperature-control assembly (1) according to one of Claims 1 to 9, characterized in that the at least two pump modules (10A, 10B) are arranged fluidically in parallel in at least two parallel-running channels (4), wherein at least two magnetohydrodynamic modules (10) arranged fluidically in series one behind the other are arranged in at least one of the at least two parallel-running channels (4).

11. Temperature-control assembly (1) according to one of Claims 1 to 10, characterized in that the at least one magnet device (14) comprises at least two permanent magnets (14A, 14B) or at least one electrical coil device.

12. Microelectric system (20) with at least one object (9) to be temperature-controlled and at least one temperature-control assembly (1), which is designed for controlling the temperature of the at least one object (9) to be temperature-controlled according to one of Claims 1 to 11.

13. Microelectric system (20) according to Claim 12, characterized in that the at least one temperature-control assembly (1) and the at least one object (9) to be temperature-controlled are surrounded by a common casing (22).