Electrical equipment comprising a device for a mounting plate for conduction

Description

TECHNICAL FIELD AND SUBJECT OF THE INVENTION

[0001] The present invention relates to electrical equipment comprising a heat dissipation support plate, said dissipation support plate being intended to receive a mezzanine electronic card.

[0002] The invention relates, for example, to the field of electrical equipment, in particular high voltage and intended for electric and hybrid vehicles. STATE OF THE ART

[0003] In electrical equipment, such as an inverter, as is known, a housing houses one or more electronic cards. For example, electrical equipment may include an electronic card, for example an electronic control card, which can be installed in a mezzanine on a support plate, opposite a power electronic module.

[0004] It is known that such electronic cards emit heat. In particular, an electronic control card produces heat during operation, requiring the dissipation of a heat output of around 5 W.

[0005] For comparison, a power electronic module must dissipate heat with a power of around 2 kW. To this end, the power electronic module can be placed in contact with a heat sink receiving a cooling fluid.

[0006] One problem is the dissipation of heat produced by the electronic card, especially in the context where said heat is located on an electronic card installed in a mezzanine, on a support plate. It is indeed necessary to find a path for heat dissipation to the cooling fluid.

[0007] Document WO 2014 / 057622 A1 describes an electronic module with an electronic card arranged in a mezzanine on curved support elements allowing part of the heat emitted by the electronic card to be drained in the mezzanine.

[0008] It should be noted that the present invention is described in particular for implementation in electrical equipment, in particular in an inverter, in particular in an electric or hybrid vehicle, without this having to be interpreted as a limitation.

[0009] In the latter case, the electric or hybrid motor vehicle comprises an electric drive system powered by a high-voltage power supply battery via a high-voltage on-board electrical network and a plurality of auxiliary electrical equipment powered by a low-voltage power supply battery via a low-voltage on-board electrical network.

[0010] The high-voltage power supply battery provides a power supply function for the electric drive system that propels the vehicle. In order to control the electric machine driving the vehicle's wheels, it is known to use an inverter to convert the direct current supplied by the high-voltage power supply battery into one or more alternating control currents.

[0011] The inverter includes electronic components through which the energy passes to power the electric drive system. Typically, the electronic components are arranged in the form of a power electronic module. The inverter also includes a control unit containing electronic components for controlling the inverter's electronic components.

[0012] The power electronics module comprises a housing containing the electronic components. The power electronics module thus comprises power electronics components through which energy passes to power an electrical machine. These power electronics components may comprise electronic switches, such as for example semiconductor transistors, and are arranged in an electrical circuit to allow a controlled passage of electrical energy between a power supply battery and the electrical machine. In particular, the power electronics components are bare semiconductor chips for which the housing provides encapsulation. In other words, a single housing provides packaging for all the bare semiconductor chips of the power electronics module.

[0013] The housing of the power electronic module may include electrical conductors for powering the electronic components of the power electronic module. In addition, the power electronic module may be associated with an electronic control unit, in other words a “driver” card, for delivering voltage levels adapted to the control of the electronic components of the power electronic module, from signals delivered by the control unit.

[0014] In general, the present invention applies to electrical equipment comprising an electronic power module, an electronic card arranged in a mezzanine on a support plate, with a need to dissipate the heat produced by said electronic card arranged in a mezzanine.

[0015] For this purpose, the present invention relates to a dissipation support plate intended to receive an electronic card, in mezzanine relative to an electronic power module, said plate comprising at least one pad configured to drain the heat produced by components integrated into said electronic card, in order to allow the dissipation of said heat, in particular by diffusion in the support plate and by means of bringing said pad into contact with the heat dissipation plate of the electronic power module. GENERAL PRESENTATION OF THE INVENTION

[0016] To this end, more specifically, the invention firstly relates to electrical equipment as described in claim 1.

[0017] Advantageously, in addition to said at least one pad, the dissipation support plate comprises at least one other means of dissipating the heat produced by the electronic card, among the material constituting the reception zone, and the organization of a surface contact between the electronic card and said reception zone of the dissipation support plate.

[0018] The diameter of the barrel can be configured to improve heat dissipation. According to one embodiment, said dissipation support plate provides an electromagnetic shield function between the power electronic module and the electronic card. According to one embodiment, a first face of the heat dissipation plate of the power electronic module forms an external heat dissipation face of the power electronic module and in which the electronic components are mounted on a second face of the dissipation plate of the power electronic module opposite the first face.

[0019] According to one embodiment, the second face of the heat dissipation plate of the electronic power module comprises at least one portion forming an external surface of the electronic power module, one end of said at least one pad bearing against said portion.

[0020] According to one embodiment, said housing comprises a wall, in particular made of electrically insulating material, extending from the second face of the heat dissipation plate, said wall being closed so as to define a housing receiving the electronic components of the electronic power module.

[0021] In particular, the wall is reported along the contour of said heat dissipation plate.

[0022] In particular, the wall is overmolded onto the heat dissipation plate.

[0023] The present invention also relates to electrical equipment, in which said external portion of the second face of the heat dissipation plate is a surface delimited by an edge of the heat dissipation plate and an external face of said plate.

[0024] According to one embodiment, the electrical equipment comprises a chassis comprising: first retaining members configured to fix said dissipation support plate with said chassis and second retaining members, configured to fix said power electronic module with said chassis, so that the dissipation support plate and the electronic power module are secured to each other via said chassis independently of any other means of fixing.

[0025] According to one embodiment, said dissipation support plate comprises first complementary retaining members for clipping said dissipation support plate with said chassis and said electronic power module comprises second complementary retaining members for clipping said electronic power module with said chassis.

[0026] Advantageously, the first retaining members are lugs and the complementary retaining members are depressions provided in said dissipation support plate.

[0027] The present invention also covers an electrical assembly comprising electrical equipment as briefly described above, and a heat sink against which the electrical equipment is attached, the heat sink plate, in particular its external face, coming against a face of the heat sink and the assembly being fixed to the heat sink by means of the pad resting on the heat sink plate and the heat sink.

[0028] In particular by means of a rod, in particular a fixing screw, received in the pad, the heat dissipation plate of the electronic power module and the heat sink. In particular, said at least one pad comprises a through-barrel to allow the passage of a fixing screw.

[0029] The invention also relates to an inverter comprising an electrical assembly as briefly described above. PRESENTATION OF FIGURES

[0030] The invention will be better understood on reading the following description, given solely by way of example, and referring to the appended drawings given as non-limiting examples, in which identical references are given to similar objects and in which: there figure 1 shows a dissipation support plate according to the invention, in partially represented electrical equipment, the figure 2represents a sectional view showing the dissipation support plate according to the invention, the figure 3 shows the heat drainage by a dissipation support plate according to the invention, the figure 4 shows the electromagnetic shield function provided by a dissipation support plate according to the invention, the Figure 5 shows the passage of fixing screws in barrels arranged in the studs of a dissipation support plate according to the invention, the figure 6 represents a partial view of the electrical equipment housing, showing means for retaining the dissipation support plate.

[0031] It should be noted that the figures set out the invention in detail for implementing the invention, said figures can of course be used to better define the invention where appropriate. DETAILED DESCRIPTION OF THE INVENTION

[0032] In the description below, the invention is mainly described in its application to electrical equipment for an electric or hybrid motor vehicle, without this being limiting of the scope of the present invention.

[0033] Furthermore, as explained previously, the present invention is mainly described with a view to implementation in an inverter but is applicable to any electrical equipment comprising in particular an electronic card arranged in a mezzanine on a support plate, with a need to dissipate the heat produced by said electronic card arranged in a mezzanine.

[0034] A support plate allowing the installation of an electronic card in a mezzanine, in particular above another electronic card, in an electrical equipment box, is commonly referred to as a "bracket" in English.

[0035] As shown in the Figure 1 to 5, the support plate 30 is intended to be fixed on a heat dissipation plate 2 of an electronic power module. The support plate 30 firstly provides an interface function for mechanically holding the electronic card 20 arranged in a mezzanine. In other words, the support plate 30 - or "bracket" - allows the electronic card 20 to be superimposed opposite the electronic power module.

[0036] According to the invention, such a support plate 30 is configured to drain calories from the electronic card 20 that it supports, and, where appropriate, to provide an electromagnetic shield function - also referred to as an OEM shield for Electromagnetic Waves - and / or, in a complementary manner, to provide a ground recovery function for the benefit of said electronic card 20 in the mezzanine.

[0037] In particular, it is planned to implement the dissipation support plate 30 in electrical equipment comprising an electronic power module 200. The electronic power module comprises a housing 208 comprising a wall 210, and a heat dissipation plate 2.

[0038] In particular, the wall 210 of the housing 208 may comprise first retaining means, said dissipation support plate 30 comprising complementary retaining means for clipping said dissipation support plate 30 into said belt.

[0039] For example, the first retaining means are lugs and the additional retaining means are depressions arranged in said dissipation support plate 30. At the figure 6, a perspective view through the housing of the electrical equipment is shown. According to this embodiment, lugs 9 retain the dissipation support plate 30 by clipping to the peripheral edge of said dissipation support plate.

[0040] In reference to the Figure 1 to 5 , a first electronic card 10 is arranged directly on the electronic power module 200. The dissipation support plate 30 is fixed to the heat dissipation plate 2 by means of screws 3 engaged in barrels 32 arranged in the corresponding pads 31, as shown in Figure 5 . On said dissipation support plate 30 is arranged a second electronic card 20 so as to be located in the mezzanine opposite the electronic power module 200. With reference to the figure 3in particular, the dissipation support plate 30 has the function of dissipating part of the heat emitted by the second electronic card 20 in the dissipation support plate 30, up to the heat dissipation plate 2 where said heat dissipates, in particular, for example, using a cooling circuit (not shown) arranged in contact or near said heat dissipation plate 2.

[0041] In reference to the figures 2 And 3, the present invention thus aims to promote the cooling of the electronic card 20 arranged in a mezzanine opposite the electronic power module 200, by dissipating heat in the dissipation support plate 30, receiving said electronic card 20 and by draining the heat towards said heat dissipation plate 2 by means of pads 31. The pads 31 also allow the dissipation support plate 30 to be fixed to said heat dissipation plate 2. Said heat dissipation plate can then come into contact with a cooling circuit (not shown). On the figure 3 , the arrows 4 show the heat flows drained from the electronic card 20 to the heat dissipation plate 2.

[0042] In an exemplary implementation of the present invention, the vehicle is located in a vehicle, in particular a motor vehicle. Said vehicle comprises in particular an electrical machine, an inverter and a high-voltage power supply battery.

[0043] The inverter then comprises electrical equipment 1 comprising the two electronic cards 10, 20, the first, arranged directly on the casing of the electronic power module 200, being a control unit, in other words a “driver” card, and the second being a control unit arranged in a mezzanine on a dissipation support plate 30 according to the invention.

[0044] In particular, according to this embodiment, the power electronic module 200 comprises power electronic components through which the energy supplying the electrical machine passes via electrical conductors 6, said electronic components being in particular intended to transform a direct current delivered by the power battery into alternating currents, or vice versa. These power electronic components may comprise electronic switches, such as for example semiconductor transistors, arranged in an electrical circuit to allow a controlled passage of electrical energy between the power battery and the electrical machine. In particular, the electronic components 7 comprise bare semiconductor chips for which the housing 208 of the power electronic module 200 provides encapsulation.In other words, a single package 208 carries out the packaging of all the bare semiconductor chips of the power electronic module.

[0045] The electrical equipment 1 is for example cooled by means of a cooling circuit (not shown) connected to the heat dissipation plate 2 of the housing 208 of said electronic power module 200.

[0046] As shown in the embodiments of the Figure 1 to 5 , the second electronic card, for example a control unit 20, is arranged in a mezzanine on a receiving area of ​​the dissipation support plate 30. The heat emitted by the electronic components 7 which it comprises is drained and dissipated thanks to the dissipation support plate 30.

[0047] For this purpose, the dissipation support plate 30 comprises the pads 31.

[0048] The pads 31 mechanically and thermally connect the dissipation support plate 30, and in particular the receiving area of ​​the electronic card arranged in a mezzanine, to a wall of a power electronic module housing 200. In particular, the pads 31 connect the receiving area of ​​the dissipation support plate 30 to the heat dissipation plate 2 of the power electronic module housing 200. In particular, the pads 31 comprise shafts 32 intended to allow the passage of the fixing screws 3 of the dissipation support plate 30 to the heat dissipation plate 2 of the housing 208.

[0049] The pads 31 are configured to drain heat from the electronic card 20 arranged in the mezzanine. In particular, the diameter of the pads 31 and any shafts 32 that they comprise are configured to maximize the drainage of heat from the receiving area of ​​the electronic card 20 arranged in the mezzanine.

[0050] The heat emitted by said electronic card 20 arranged in the mezzanine, in particular by the electronic components, is thus captured by the dissipation support plate 30 and drained by the pads 31 to be brought to the heat dissipation plate 2 of the electronic power module 200 then to a heat sink against which the heat dissipation plate 2 of the electronic power module is mounted.

[0051] Still with this aim of dissipating the heat emitted by the electronic card 20 arranged in a mezzanine against the dissipation support plate 30, according to one embodiment, said dissipation support plate 30 is made of a thermally conductive material and a contact, in particular surface contact, is organized between said electronic card 20 arranged in a mezzanine and the upper face of the dissipation support plate 30, comprising the reception zone of said electronic card 20, in order to promote the dissipation of heat in the mass of the dissipation support plate 30.

[0052] According to one embodiment, it is furthermore provided to arrange openings in the heat dissipation plate 2, said openings being opposite through passages of the dissipation support plate 30, in particular the barrels 31. Screws are intended to come into these through passages and these openings to fix the assembly comprising the electronic power module 200, the dissipation support plate 30 supporting the electronic card 20 arranged in a mezzanine with a support. Such a support comprises in particular a heat sink against which the heat dissipation plate 2 comes to bear.

[0053] The receiving area of ​​the dissipation support plate 30, just like the housing 208, may also comprise lugs or secondary pads providing a pilot function to support each electronic card 10, 20 respectively. In particular, the housing 208 and / or the receiving area of ​​the dissipation support plate 30 may comprise pinching means sandwiching the electronic card 10, 20 that they support respectively, in order to prevent their vibration and, in particular with regard to the electronic card 20 arranged in a mezzanine, in order to properly drain the heat emitted.

[0054] The heat sink 50 is then, for example, integrated into an electrical assembly, for example an inverter, in which the electronic power module 200 and the dissipation support plate 30 are intended to be mounted.

[0055] Furthermore, the dissipation support plate 30 preferably also provides an electromagnetic shield function. In particular, for this purpose, the dissipation support plate 30 is made of metal.

[0056] There figure 4 represents said electromagnetic shield function by showing electromagnetic fluxes 5 coming from the electronic card 20 arranged in the mezzanine or from the first electronic card 10 received directly by the housing 208 of the electronic power module 2, according to this embodiment in which, in particular, said dissipation support plate 30 is made of metal, prevents the electromagnetic fluxes emitted by an electronic card 10, 20 from disturbing the other electronic card 20, 10.

[0057] It is specified that, according to one embodiment, the dissipation support plate 30 is obtained by molding, without requiring subsequent machining.

Claims

1. Electrical apparatus (1) comprising: - a power electronics module (200) comprising a package (208) and electronic components present in said package, and - an electronic board (20), in particular configured to control the electronic components of the power electronics module (200); - a dissipating baseplate device (30), said dissipating baseplate (30) comprising: - a face, referred to as the receiving face, against which the electronic board (20) is received such that it is disposed on a mezzanine level with respect to the power electronics module (200), and the electrical apparatus being characterized in that said dissipating baseplate also comprises: - on the opposite side to said receiving face, at least one stud (31) for supporting the dissipating baseplate (30) in a receiving zone of the electronic board (20), said at least one stud (31) further comprising a passage bushing (32) for the passage of a fastening screw (3) such that the dissipating baseplate (30) is fastened to a heat-sink plate (2) which is part of the package of the power electronics module (200), and said at least one stud (31) being configured to drain the heat from the electronic board (20) in order to allow the heat to be dissipated via the heat-sink plate (2) of the power electronics module (200).

2. Electrical apparatus (1) according to Claim 1, wherein a first face of the heat-sink plate of the power electronics module (200) forms an outer heat-sink face of the power electronics module (200) and wherein the electronic components are mounted on an opposite second face of the heat-sink plate of the power electronics module (200) to the first face.

3. Electrical apparatus (1) according to Claim 2, wherein the second face of the heat-sink plate (2) of the power electronics module (200) comprises at least one portion forming an outer surface of the power electronics module (200), one end of said stud (31) bearing against said portion.

4. Electrical apparatus (1) according to one of the preceding claims, wherein said package comprises a wall, in particular made of an electrically insulating material, extending from the second face of the heat-sink plate, said wall being closed such that it defines a recess receiving the electronic components of the power electronics module (200).

5. Electrical apparatus according to Claims 3 and 4, wherein said outer portion of the second face of the heat-sink plate is a surface delimited by an edge of the heat-sink plate and an outer face of said wall.

6. Electrical apparatus (1) according to one of the preceding claims, comprising a frame which has: - first retaining members configured to fasten said dissipating baseplate (30) to said frame and - second retaining members configured to fasten said power electronics module (200) to said frame, such that the dissipating baseplate (30) and the power electronics module (200) are secured to one another via said frame independently of any other fastening means.

7. Electrical apparatus (1) according to the preceding claim, wherein: - said dissipating baseplate (30) comprises additional first retaining members for clipping said dissipating baseplate (30) to said frame and - said power electronics module (200) comprises additional second retaining members for clipping said power electronics module (200) to said frame.

8. Electrical assembly (1) comprising an electrical apparatus (1) according to one of the preceding claims, and a heat sink against which the electrical apparatus is fitted, the heat-sink plate, in particular its outer face, coming against a face of the heat sink and the assembly being fastened to the heat sink via the stud (31) bearing against the heat-sink plate and the heat sink.

9. Inverter comprising an electrical assembly according to the preceding claim.