RESIN MOLDED BODY

DE602019069693T2Active Publication Date: 2025-05-07PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
DE602019069693
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2019-03-28
Publication Date
2025-05-07
Estimated Expiration
2039-03-28

AI Technical Summary

Technical Problem

The adhesive strength between the thermal sprayed ceramic coating and the resin structure in conventional resin molded bodies is insufficient, leading to potential detachment and reduced durability.

Method used

A resin molded body is designed with a specific configuration, including a resin structure, an intermediate layer containing an amorphous inorganic filler with a central particle diameter of 20 µm to 100 µm, and a thermal sprayed ceramic coating. The intermediate layer has a thickness of 50 µm to 250 µm, with the inorganic filler content between 40% to 60% by volume, and features irregularities to enhance the anchor effect of the ceramic coating.

Benefits of technology

The described configuration significantly enhances the adhesive strength between the thermal sprayed ceramic coating and the resin structure, improving the durability and longevity of the resin molded body.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader
Need to check novelty before this filing date? Find Prior Art
No text content released.